TW202203498A - Transmission cable structure - Google Patents

Abstract

A transmission cable structure includes a dielectric layer structure, a first outer ground layer, a first pad, a transmission line and a conductive via. The dielectric layer structure has a top surface, the first outer ground layer is disposed on the top surface, and an edge of the first outer ground layer has a first notch. The first pad is disposed on the top surface and adapted to be connected to an electrical connector. The first pad is partially located in the first notch, and an inner edge of the first notch and the first pad have an interval therebetween. The transmission line is disposed in the dielectric layer structure. The conductive via is disposed in the dielectric layer structure and connected to the first pad and the transmission line.

Description

Transmission line structure

The present invention relates to an electronic assembly, and in particular to a transmission line structure.

In order to make the notebook computer have a good communication effect, the antenna is mostly disposed in the frame area around the screen, and the antenna is generally connected with the communication module by a mini cable. Mini-cables have a small wire diameter (about 0.8 mm) and are easy to configure in limited wiring space. However, with the thin design trend of notebook computers, the gap between the screen and the case back is very small, and even the mini-cable is not easy to configure directly through the gap between the screen and the case back. Instead, run the traces along the border area around the screen. This configuration makes the transmission path too long and greatly increases the transmission loss and the degree of signal interference. In addition, considering the wiring space of the pivot structure of the current notebook computer, it is difficult for a large number of mini-cables to pass from the screen end through the pivot structure to the host end because the total diameter is too large.

The invention provides a transmission line structure, which has the characteristics of thinning and high transmission quality.

The transmission line structure of the present invention includes a dielectric layer structure, a first external ground layer, a first pad, a transmission line and a conductive through hole. The dielectric layer structure has a top surface, the first external ground layer is disposed on the top surface, and an edge of the first external ground layer has a first notch. The first pad is disposed on the top surface and is suitable for connecting to an electrical connector. The first pad is partially located in the first recess, and there is a gap between an inner edge of the first recess and the first pad. The transmission line is configured in the dielectric layer structure. The conductive through hole is disposed in the dielectric layer structure and connected to the first pad and the transmission line.

In an embodiment of the present invention, the above-mentioned transmission line structure has a first section, a second section and a third section, and the second section is located between the first section and the third section During the period, the first pad is located in the first section and extends to the second section, the transmission line is located in the third section and extends to the second section, and the conductive via is located in the second section .

In an embodiment of the present invention, the inner edge of the first recess is arc-shaped, and part of the outer edge of the first pad is arc-shaped and corresponds to the inner edge of the first recess.

In an embodiment of the present invention, the above-mentioned dielectric layer structure has at least one side surface adjacent to the top surface, the transmission line structure further includes at least one conductive layer, and the at least one conductive layer is disposed on the at least one side surface and connected to the the first external ground plane.

In an embodiment of the present invention, the at least one conductive layer has an extension portion, the extension portion extends from the at least one side surface into the dielectric layer structure, and there is a gap between the extension portion and the transmission line.

In an embodiment of the present invention, the above-mentioned dielectric layer structure includes two dielectric layers stacked on each other, and the transmission line and the extension portion are disposed between the two dielectric layers.

In an embodiment of the present invention, the at least one side surface includes two opposite side surfaces, the at least one conductive layer includes two conductive layers, and the two conductive layers are respectively disposed on the two side surfaces and are respectively connected to the first external ground layer. opposite ends.

In an embodiment of the present invention, the above-mentioned transmission line structure further includes an internal ground layer, wherein the internal ground layer is disposed in the dielectric layer structure and connected to the at least one conductive layer, and an edge of the internal ground layer has A second notch, an end of the transmission line is partially located in the second notch, and a gap is formed between an inner edge of the second notch and the end of the transmission line.

In an embodiment of the present invention, the inner edge of the second recess is arc-shaped, and the outer edge of the end of the transmission line is arc-shaped and corresponds to the inner edge of the second recess.

In an embodiment of the present invention, the above-mentioned dielectric layer structure has a bottom surface opposite to the top surface, the transmission line structure further includes a second external ground layer, the second external ground layer is disposed on the bottom surface, the at least one The conductive layer is connected to the second external ground layer.

The transmission line structure of the present invention includes a dielectric layer structure, a first external ground layer, a second external ground layer, a first pad, a second pad, a transmission line and a conductive via. The dielectric layer structure has a top surface and a bottom surface opposite to each other. The first external ground layer is disposed on the top surface. An edge of the first external ground layer has a first notch. The second external ground layer is disposed on the bottom surface and has an opening. The first pad is disposed on the top surface and is suitable for connecting to an electrical connector, the first pad is partially located in the first recess, and there is a gap between the inner edge of the first recess and the first pad. The second pad is disposed on the bottom surface and located in the opening, and there is a gap between an inner edge of the opening and the second pad. The transmission line is configured in the dielectric layer structure. The conductive through hole is arranged in the dielectric layer structure and connected to the first pad, the transmission line and the second pad.

In an embodiment of the present invention, the above-mentioned transmission line structure has a first section, a second section and a third section, the second section is located between the first section and the third section, and the first section is located between the first section and the third section. A pad is located in the first section and extends to the second section, the transmission line is located in the third section and extends to the second section, and the conductive via and the second pad are located in the second section.

In an embodiment of the present invention, the inner edge of the first recess is arc-shaped, and part of the outer edge of the first pad is arc-shaped and corresponds to the inner edge of the first recess.

In an embodiment of the present invention, the inner edge of the opening is arc-shaped, and the outer edge of the second pad is arc-shaped and corresponds to the inner edge of the opening.

In an embodiment of the present invention, the above-mentioned dielectric layer structure has at least one side surface adjacent to the top surface and the bottom surface, the transmission line structure further includes at least one conductive layer, and the at least one conductive layer is disposed on at least one side surface and connected to the first external surface ground plane and a second external ground plane.

In an embodiment of the present invention, the at least one conductive layer has an extension portion, the extension portion extends from at least one side surface into the dielectric layer structure, and there is a gap between the extension portion and the transmission line.

In an embodiment of the present invention, the above-mentioned dielectric layer structure includes two dielectric layers stacked on each other, and the transmission line and the extension portion are disposed between the two dielectric layers.

In an embodiment of the present invention, the at least one side surface includes two opposite sides, the at least one conductive layer includes two conductive layers, the two conductive layers are respectively disposed on the two sides, and the two conductive layers are respectively connected to the opposite sides of the first external ground layer. The two ends are respectively connected to opposite ends of the second external ground layer.

In an embodiment of the present invention, the above-mentioned transmission line structure further includes an inner ground layer, wherein the inner ground layer is disposed in the dielectric layer structure and connected to at least one conductive layer, and an edge of the inner ground layer has a second concave One end of the transmission line is partially located in the second notch, and an inner edge of the second notch and the end of the transmission line have a gap.

In an embodiment of the present invention, the inner edge of the second recess is arc-shaped, and the outer edge of the end of the transmission line is arc-shaped and corresponds to the inner edge of the second recess.

Based on the above, in the transmission line structure of the present invention, the first pad for connecting the electrical contacts is disposed on the top surface of the dielectric layer structure, and is connected to the transmission line inside the dielectric layer structure through the conductive via. Compared with the coaxial arrangement of a common coaxial cable (such as a mini-cable), the first pad and the corresponding electrical connector are arranged on the top surface of the dielectric layer structure as described above, so that the transmission line structure can be structurally It is not axisymmetric and becomes a flat structure, which is beneficial to the thinning of the transmission line structure. On the other hand, the first external ground layer and the second external ground layer respectively disposed on the top surface and the bottom surface of the dielectric layer structure can play a role in isolating signal interference for the transmission lines in the dielectric layer structure. In addition, the edge of the first external ground layer disposed on the top surface of the dielectric layer structure has a first notch corresponding to the first pad, and there is a gap between the first pad and the first notch. Similarly, the second external ground layer disposed on the bottom surface of the dielectric layer structure has an opening corresponding to the second pad, and there is a gap between the second pad and the opening. Accordingly, the equivalent capacitance value between the first pad and the first external ground layer and the equivalent capacitance value between the second pad and the second external ground layer can be changed by adjusting the size of the gap, so as to optimize the Impedance matching between the joint structure (the section where the first pads and electrical joints are located) and the sandwich stripline structure (the section where the transmission line is located) reduces the generation of the joint structure and the sandwich stripline structure due to the asymmetrical arrangement of each other degree of transmission loss. In addition, the equivalent inductance value of the conductive through hole can be changed by adjusting the outer diameter of the conductive through hole, so as to optimize the impedance matching between the joint section and the sandwich strip line section, and further reduce the degree of transmission loss. Therefore, the transmission line structure of the present invention can have the characteristics of thinning and high transmission quality.

FIG. 1 is a schematic diagram of a transmission line structure according to an embodiment of the present invention. FIG. 2 is an enlarged view of the transmission line structure in area A of FIG. 1 . FIG. 3 is an enlarged view of the transmission line structure in area B of FIG. 1 . FIG. 4 is an exploded view of the transmission line structure of FIG. 2 . Referring to FIGS. 1 to 4 , the transmission line structure 100 of this embodiment includes a dielectric layer structure 110 , a first external ground layer 120 , a second external ground layer 130 , a first pad 140 , and a second pad 150 , a transmission line 160 and a conductive via 170 .

The dielectric layer structure 110 has a top surface 110a (indicated in FIG. 4 ) and a bottom surface 110b (indicated in FIG. 4 ) opposite to each other. The first external ground layer 120 and the second external ground layer 130 are respectively disposed on the top surface 110 a and the bottom surface 110 b of the dielectric layer structure 110 . The edge of the first external ground layer 120 has a first notch 120a. The first pad 140 is disposed on the top surface 110 a of the dielectric layer structure 110 and is partially located in the first recess 120 a of the first outer ground layer 120 , between the inner edge of the first recess 120 a and the first pad 140 with gaps. The second external ground layer 130 has an opening 130a. The second pad 150 is disposed on the bottom surface 110 b of the dielectric layer structure 110 and located in the opening 130 a of the second outer ground layer 130 , with a gap between the inner edge of the opening 130 a and the second pad 150 . The transmission line 160 is disposed in the dielectric layer structure 110 , and the conductive via 170 is disposed in the dielectric layer structure 110 and connected to the first pad 140 , the transmission line 160 and the second pad 150 .

FIG. 5 is a schematic side view of the transmission line structure in FIG. 2 . For the sake of clarity, FIG. 5 only shows part of the conductive structures in the transmission line structure 100 , namely the first pads 140 , the second pads 150 , and the conductive vias 170 and transmission line 160. As shown in FIG. 5 , according to the above configuration, the transmission line structure 100 of this embodiment can be divided into a first section S1 (connector structure), a second section S2 (mode conversion coupling structure), and a third section Section S3 (sandwich strip line structure), the second section S2 is located between the first section S1 and the third section S3.

Specifically, the first pad 140 located in the first section S1 is suitable for being connected to an electrical connector 50 to form the above-mentioned connector structure. The electrical connector 50 is, for example, an I-PEX connector or other types of connectors, which are not limited in the present invention. The conductive vias 170 and the second pads 150 are located in the second section S2. The first pads 140 extend from the first section S1 to the second section S2 to be connected to the conductive vias 170 . The transmission line 160 is located in the third section S3 to form the above-mentioned sandwich stripline structure together with the dielectric structure layer 110 , and the transmission line 160 extends to the second section S2 to be connected to the conductive via 170 .

The first pads 140 for connecting the electrical contacts 50 are disposed on the top surface 110 a of the dielectric layer structure 110 , and are connected to the transmission lines 160 inside the dielectric layer structure 110 through the conductive vias 170 . Compared with the coaxial arrangement of a common coaxial cable (such as a mini-cable), the first pad 140 and the corresponding electrical connector 50 are arranged on the top surface 110a of the dielectric layer structure 110 as described above, so that the transmission line The structure 100 is not axisymmetric in structure but becomes a flat structure, which is beneficial to the thinning of the transmission line structure 100 . Specifically, the maximum outer diameter of a general mini-cable is about 0.81 mm, while the maximum outer diameter of the transmission line 160 in this embodiment can be reduced to less than or equal to 0.4 mm. On the other hand, the first external ground layer 120 and the second external ground layer 130 respectively disposed on the top surface 110 a and the bottom surface 110 b of the dielectric layer structure 110 can shield the transmission lines 160 in the dielectric layer structure 110 from signal interference. .

And, as described above, the first external ground layer 120 disposed on the top surface 110a of the dielectric layer structure 110 has a first notch 120a corresponding to the first pad 140 at its edge, and the first pad 140 and the first There are gaps between the notches 120a. Similarly, the second external ground layer 130 disposed on the bottom surface 110b of the dielectric layer structure 110 has an opening 130a corresponding to the second pad 150 , and there is a gap between the second pad 150 and the opening 130a. Accordingly, the equivalent capacitance between the first pad 140 and the first external ground layer 120 and the equivalent capacitance between the second pad 150 and the second external ground layer 130 can be changed by adjusting the size of the gap value to optimize the impedance matching between the first segment S1 and the third segment S3 and reduce the degree of transmission loss caused by the asymmetrical arrangement of the first segment S1 and the third segment S3. In addition, the equivalent inductance value of the conductive via 170 can be changed by adjusting the outer diameter of the conductive via 170 to optimize the impedance matching between the first pad 140 and the transmission line 160 and further reduce the degree of transmission loss. This is the mode conversion coupling effect provided by the above-mentioned mode conversion coupling structure, which is used to achieve the unbalanced mode (Quasi-TEM Mode) of the transmission line of the above-mentioned joint structure and the balanced mode (TEM Mode) of the above-mentioned sandwich stripline structure. ) between the impedance transformation and transmission mode matching.

As shown in FIG. 2 and FIG. 4 , the inner edge of the first recess 120a of the first external ground layer 120 is, for example, a circular arc shape, and a part of the outer edge of the first pad 140 is also, for example, circular arc shape and corresponds to the first recess. The arc-shaped inner edge of the opening 120a and the gap between the first pad 140 and the inner edge of the first recess 120a are, for example, uniform and equidistant. Similarly, the inner edge of the opening 130a of the second outer ground layer 130 is, for example, a circular arc shape, and the outer edge of the second pad 150 is also, for example, a circular arc shape corresponding to the circular arc inner edge of the opening 130a, and the second contact pad 150 is also, for example, a circular arc shape. The gap between the pad 150 and the inner edge of the opening 130a is, for example, uniform and equidistant. However, the present invention is not limited to this, in other embodiments, the inner edge of the first recess 120a and the corresponding outer edge of the first pad 140 may be square or other non-arc shapes, and the first contact The gap between the pad 140 and the inner edge of the first recess 120a may not be equidistant, and the flexibility of impedance matching may be improved according to requirements. Similarly, the inner edge of the opening 130a and the corresponding outer edge of the second pad 150 may be square or other non-arc shapes, and the gap between the second pad 150 and the inner edge of the opening 130a may be unequal distance, and the flexibility of impedance matching can be improved according to requirements.

Referring to FIGS. 2 to 4 , the dielectric layer structure 110 of this embodiment has two side surfaces 110c (marked in FIG. 4 ) adjacent to the top surface 110a and the bottom surface 110b , and the dielectric layer structure 110 includes two dielectric layers stacked on each other 112 , 114 , the two dielectric layers 112 , 114 can be glued to each other by the adhesive layer 113 (shown in FIG. 4 ). The dielectric constant (Dk) of the two dielectric layers 112, 114 may be 2.5, and the loss tangent (Df) of the two dielectric layers 112, 114 may be 0.003. The transmission line structure 100 further includes two conductive layers 180 , the two conductive layers 180 are respectively disposed on the two side surfaces 110 c , and the two conductive layers 180 are respectively connected to opposite ends of the first external ground layer 120 and respectively connected to opposite ends of the second external ground layer 130 . , together with the first external ground layer 120 and the second external ground layer 130 , play a shielding role for isolating signal interference on the transmission line 160 in the dielectric layer structure 110 . The two conductive layers 180 may extend to the front end 110d of the dielectric layer structure 110 as shown in FIG. 2 to be connected to the conductive layer 125 (shown in FIG. 2) Connect. The electrical connector 50 shown in FIG. 5 is not only connected to the transmission line 160 through the first pad 140 , but also connected to the first external ground layer 120 and the second external ground layer 130 through the conductive layer 125 and the conductive layer 180 . Each conductive layer 180 is plated on the corresponding side surface 110c by, for example, a laser induced metallization process. Compared with the conventional shielding structure with a plurality of conductive vias arranged in sequence on both sides of the wire, the present embodiment uses the continuous and complete conductive layer 180 as the shielding structure as described above, which can have a better shielding effect.

Further, each conductive layer 180 in this embodiment has an extension portion 182 , and each extension portion 182 extends from the corresponding side surface 110 c into the dielectric layer structure 110 and is located between the two dielectric layers 112 and 114 , and can be reinforced The adhesion of each conductive layer 180 to the dielectric layer structure 110 . Moreover, there is a gap between each extension 182 and the transmission line 160. By adjusting the size of the gap, the equivalent distance between each conductive layer 180 and the transmission line 160 can be optimized to reduce the transmission loss.

In addition, the transmission line structure 100 of this embodiment may further include an inner ground layer 190 as shown in FIG. 2 and FIG. 4 . The inner ground layer 190 is disposed in the dielectric layer structure 110 between the two dielectric layers 112 and 114 and is connected to the two conductive layers 180 so as to be connected to the first external ground layer 120 and the second external ground layer through the two conductive layers 180 130. The edge of the inner ground layer 190 has a second notch 190a, an end 162 of the transmission line 160 is partially located in the second notch 190a, and there is a gap between the inner edge of the second notch 190a and the end 162 of the transmission line 160 gap. Accordingly, the equivalent capacitance value between the end 162 of the transmission line 160 and the inner ground layer 190 can be changed by adjusting the size of the gap, so as to optimize the impedance between the first section S1 and the third section S3 Matching reduces the degree of transmission loss caused by the asymmetrical arrangement of the first segment S1 and the third segment S3.

As shown in FIG. 2 and FIG. 4 , the inner edge of the second recess 190a of the inner ground layer 190 is, for example, a circular arc shape, and a part of the outer edge of the end 162 of the transmission line 160 is also, for example, circular arc shape and corresponds to the second recess. The arc-shaped inner edge of the opening 190a and the gap between the end 162 of the transmission line 160 and the inner edge of the second recess 190a are, for example, uniform and equidistant. However, the present invention is not limited to this, in other embodiments, the inner edge of the second recess 190a and the corresponding outer edge of the end 162 of the transmission line 160 may be square or other non-circular arc shapes, and the transmission line The gap between the end 162 of the 160 and the inner edge of the second recess 190a can be non-equidistant, and the flexibility of impedance matching can be improved according to requirements.

According to the above configuration of this embodiment, the voltage standing wave ratio (VSWR) of the transmission line structure 100 in the operating frequency range of 1 GHz to 6 GHz can be less than 1.3. And, the transmission loss at the operating frequency of 1 GHz and the transmission length of 1 meter can be less than or equal to 3.1 dB/m, and the transmission loss at the operating frequency of 6 GHz and the transmission length of 1 meter can be less than or equal to 8.0 dB/m.

FIG. 6 illustrates that the transmission line structure of FIG. 1 is applied to a notebook computer. As shown in FIG. 6 , the antenna 66 at the frame 62a of the display 62 of the notebook computer can be connected to the signal processing module in the host 64 through the transmission line structure 100 of the above-mentioned embodiment. Since the transmission line structure 100 is a flat structure and has a small thickness as described above, it can be directly connected to the host 64 across the back of the screen 62b of the display 62 as shown in FIG. 6 . This configuration has a shorter wiring distance and can reduce transmission loss and signal interference. Moreover, since the transmission line structure 100 has a relatively small thickness, even if the number of the transmission line structure 100 is multiple, it can reach the end of the host computer 64 through the pivot structure between the host computer 64 and the display 62 . Therefore, it can conform to the design of a multi-input multi-output (Multi-input Multi-output, MIMO) antenna system.

The following example illustrates the specific dimension design of the transmission line structure 100 of this embodiment. FIG. 7 is a cross-sectional view of the transmission line structure of FIG. 2 taken along line I-I. FIG. 8 is a cross-sectional view of the transmission line structure of FIG. 3 taken along line II-II. Referring to FIGS. 7 and 8 , in this embodiment, the total width W1 of the transmission line structure 100 may be 3.02 mm, and the total thickness H1 of the transmission line structure 100 may be 0.4 mm. The thicknesses H2, H3 of each of the dielectric layers 112, 114 may be 0.18 mm. The outer diameter d1 of the conductive via 170 may be 0.2 mm. The width W2 of the extension portion 182 of the conductive layer 180 may be 0.4 mm. The width W3 of the transmission line 160 may be 0.27 mm. The outer diameter of the first pad 140 , the outer diameter of the end 162 of the transmission line 160 and the outer diameter of the second pad 150 are, for example, the same (indicated as outer diameter d2 in FIG. 7 ), and the outer diameter d2 may be 0.4-0.6 mm. The gap between the inner edge of the first recess 120 a and the first pad 140 , the gap between the inner edge of the opening 130 a and the second pad 150 , and the inner edge of the second recess 190 a and the end 162 of the transmission line 160 The gaps therebetween are, for example, the same (indicated as gap G in FIG. 7 ), and the gap G may be 0.1 mm. In addition, the overall length L (labeled in FIG. 1 ) of the transmission line structure 100 may be 100 mm. In other embodiments, the above dimensions can be changed according to requirements, and the present invention does not limit their actual values.

To sum up, in the transmission line structure of the present invention, the first pad for connecting the electrical connector is disposed on the top surface of the dielectric layer structure, and is connected to the transmission line inside the dielectric layer structure through the conductive through hole road. Compared with the coaxial arrangement of a common coaxial cable (such as a mini-cable), the first pad and the corresponding electrical connector are arranged on the top surface of the dielectric layer structure as described above, so that the transmission line structure can be structurally It is not axisymmetric and becomes a flat structure, which is beneficial to the thinning of the transmission line structure. On the other hand, the first external ground layer and the second external ground layer respectively disposed on the top surface and the bottom surface of the dielectric layer structure can play a role in isolating signal interference for the transmission lines in the dielectric layer structure. In addition, the edge of the first external ground layer disposed on the top surface of the dielectric layer structure has a first notch corresponding to the first pad, and there is a gap between the first pad and the first notch. Similarly, the second external ground layer disposed on the bottom surface of the dielectric layer structure has an opening corresponding to the second pad, and there is a gap between the second pad and the opening. Accordingly, the equivalent capacitance value between the first pad and the first external ground layer and the equivalent capacitance value between the second pad and the second external ground layer can be changed by adjusting the size of the gap, so as to optimize the The impedance matching between the joint structure (the first pad and the section where the joint is located) and the sandwich stripline structure (the section where the transmission line is located) reduces the transmission caused by the asymmetrical arrangement of the joint structure and the sandwich stripline structure. degree of loss. In addition, the equivalent inductance value of the conductive through hole can be changed by adjusting the outer diameter of the conductive through hole, so as to optimize the impedance matching between the joint section and the sandwich strip line section, and further reduce the degree of transmission loss. Therefore, the transmission line structure of the present invention can have the characteristics of thinning and high transmission quality.

50: Electrical connector 62: Display 62a: Border 62b: Screen 64: host 66: Antenna 100: Transmission Line Structure 110: Dielectric layer structure 110a: Top surface 110b: Bottom surface 110c: Side 110d: Front end 112, 114: Dielectric layer 113: Adhesive layer 120: The first external ground plane 120a: first notch 125, 180: Conductive layer 130: Second external ground plane 130a: Opening 140: first pad 150: Second pad 160: Transmission Line 162: end 170: Conductive Vias 182: Extensions 190: Inner ground plane 190a: Second notch d1, d2 outer diameter G: Gap H1, H2, H3: Thickness L: length S1: first segment S2: Second segment S3: The third section W1, W2, W3: Width

FIG. 1 is a schematic diagram of a transmission line structure according to an embodiment of the present invention. FIG. 2 is an enlarged view of the transmission line structure in area A of FIG. 1 . FIG. 3 is an enlarged view of the transmission line structure in area B of FIG. 1 . FIG. 4 is an exploded view of the transmission line structure of FIG. 2 . FIG. 5 is a schematic side view of the transmission line structure of FIG. 2 . FIG. 6 illustrates that the transmission line structure of FIG. 1 is applied to a notebook computer. FIG. 7 is a cross-sectional view of the transmission line structure of FIG. 2 taken along line I-I. FIG. 8 is a cross-sectional view of the transmission line structure of FIG. 3 taken along line II-II.

100: Transmission Line Structure

110: Dielectric layer structure

110a: Top surface

110b: Bottom surface

110c: Side

112, 114: Dielectric layer

113: Adhesive layer

120: The first external ground plane

120a: first notch

180: Conductive layer

130: Second external ground plane

130a: Opening

140: first pad

150: Second pad

160: Transmission Line

162: end

170: Conductive Vias

182: Extensions

190: Inner ground plane

190a: Second notch

Claims (20)

A transmission line structure comprising: a dielectric layer structure having a top surface; a first external ground layer disposed on the top surface, wherein an edge of the first external ground layer has a first notch; a first pad disposed on the top surface and suitable for connecting to an electrical connector, wherein the first pad is partially located in the first recess, and an inner edge of the first recess is connected to the first There is a gap between the pads; a transmission line disposed in the dielectric layer structure; and A conductive through hole is disposed in the dielectric layer structure and connected to the first pad and the transmission line. The transmission line structure of claim 1, wherein the transmission line structure has a first section, a second section and a third section, and the second section is located between the first section and the third section The first pad is located in the first section and extends toward the second section, the transmission line is located in the third section and extends toward the second section, and the conductive via is located in the second section part. The transmission line structure of claim 1, wherein the inner edge of the first notch is arc-shaped, and part of the outer edge of the first pad is arc-shaped and corresponds to the inner edge of the first notch . The transmission line structure of claim 1, wherein the dielectric layer structure has at least one side surface adjacent to the top surface, the transmission line structure further comprises at least one conductive layer, and the at least one conductive layer is disposed on the at least one side surface and connected to on the first external ground plane. The transmission line structure of claim 4, wherein the at least one conductive layer has an extension portion, the extension portion extends from the at least one side surface into the dielectric layer structure, and there is a gap between the extension portion and the transmission line. The transmission line structure of claim 5, wherein the dielectric layer structure comprises two dielectric layers stacked on each other, and the transmission line and the extension portion are disposed between the two dielectric layers. The transmission line structure of claim 4, wherein the at least one side surface includes two opposite side surfaces, the at least one conductive layer includes two conductive layers, and the two conductive layers are respectively disposed on the two side surfaces and are respectively connected to the first external ground layer the opposite ends. The transmission line structure of claim 4, further comprising an inner ground layer, wherein the inner ground layer is disposed in the dielectric layer structure and connected to the at least one conductive layer, and an edge of the inner ground layer has a second A notch, an end of the transmission line is partially located in the second notch, and there is a gap between an inner edge of the second notch and the end of the transmission line. The transmission line structure of claim 8, wherein the inner edge of the second notch is arc-shaped, and the outer edge of the end of the transmission line is arc-shaped and corresponds to the inner edge of the second notch . The transmission line structure of claim 4, wherein the dielectric layer structure has a bottom surface opposite to the top surface, the transmission line structure further includes a second external ground layer, the second external ground layer is disposed on the bottom surface, the at least A conductive layer is connected to the second external ground layer. A transmission line structure comprising: a dielectric layer structure with a top surface and a bottom surface opposite; a first external ground layer disposed on the top surface, wherein an edge of the first external ground layer has a first notch; a second external ground layer disposed on the bottom surface and having an opening; a first pad disposed on the top surface and adapted to be connected to an electrical connector, wherein the first pad is partially located in the first recess, and the inner edge of the first recess is connected to the first There is a gap between the pads; a second pad disposed on the bottom surface and located in the opening, wherein there is a gap between an inner edge of the opening and the second pad; a transmission line disposed in the dielectric layer structure; and A conductive through hole is disposed in the dielectric layer structure and connected to the first pad, the transmission line and the second pad. The transmission line structure of claim 11, wherein the transmission line structure has a first section, a second section and a third section, and the second section is located between the first section and the third section between, the first pad is located in the first section and extends to the second section, the transmission line is located in the third section and extends to the second section, the conductive via and the second contact A pad is located in this second section. The transmission line structure as claimed in claim 11, wherein the inner edge of the first notch is arc-shaped, and part of the outer edge of the first pad is arc-shaped and corresponds to the inner edge of the first notch . The transmission line structure according to claim 11, wherein the inner edge of the opening is arc-shaped, and the outer edge of the second pad is arc-shaped and corresponds to the inner edge of the opening. The transmission line structure of claim 11, wherein the dielectric layer structure has at least one side surface adjacent to the top surface and the bottom surface, the transmission line structure further comprises at least one conductive layer, and the at least one conductive layer is disposed on the at least one side surface and is connected to the first external ground layer and the second external ground layer. The transmission line structure of claim 15, wherein the at least one conductive layer has an extension portion, the extension portion extends from the at least one side surface into the dielectric layer structure, and there is a gap between the extension portion and the transmission line. The transmission line structure of claim 16, wherein the dielectric layer structure comprises two dielectric layers stacked on each other, and the transmission line and the extension portion are disposed between the two dielectric layers. The transmission line structure of claim 15, wherein the at least one side surface includes two opposite side surfaces, the at least one conductive layer includes two conductive layers, the two conductive layers are respectively disposed on the two side surfaces, and the two conductive layers are respectively connected to the two conductive layers. The opposite ends of the first external ground layer are respectively connected to opposite ends of the second external ground layer. The transmission line structure of claim 15, further comprising an inner ground layer, wherein the inner ground layer is disposed in the dielectric layer structure and connected to the at least one conductive layer, and an edge of the inner ground layer has a second A notch, an end of the transmission line is partially located in the second notch, and there is a gap between an inner edge of the second notch and the end of the transmission line. The transmission line structure of claim 19, wherein the inner edge of the second notch is arc-shaped, and the outer edge of the end of the transmission line is arc-shaped and corresponds to the inner edge of the second notch .

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