TW202146533A - Polymerization inhibitor for a polyarylene sulfide resin - Google Patents

Polymerization inhibitor for a polyarylene sulfide resin Download PDF

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TW202146533A
TW202146533A TW110101495A TW110101495A TW202146533A TW 202146533 A TW202146533 A TW 202146533A TW 110101495 A TW110101495 A TW 110101495A TW 110101495 A TW110101495 A TW 110101495A TW 202146533 A TW202146533 A TW 202146533A
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polyarylene sulfide
carbon atoms
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sulfide resin
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TW110101495A
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金芝勳
姜淍植
金珉錫
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南韓商Sk化學公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/0204Polyarylenethioethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/0204Polyarylenethioethers
    • C08G75/025Preparatory processes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • C08K5/375Thiols containing six-membered aromatic rings

Abstract

The present invention provides a polymerization inhibitor for a polyarylene sulfide resin, which comprises a compound having a specific structure, a polyarylene sulfide resin composition comprising the same, a process for preparing a polyarylene sulfide resin using the same, and a polyarylene sulfide resin prepared using the same. According to the present invention, it is possible to reduce the formation of a side-chain structure in the polyarylene sulfide resin, thereby improving the linearity, and to enhance the mechanical properties and processing stability.

Description

用於聚芳硫醚樹脂之聚合抑制劑Polymerization inhibitor for polyarylene sulfide resin

本發明係關於一種包含具有特定結構之化合物的用於聚芳硫醚樹脂之聚合抑制劑;一種包含該聚合抑制劑之聚芳硫醚樹脂組成物;一種使用該聚合抑制劑製備聚芳硫醚樹脂之方法;及一種使用該聚合抑制劑製備之聚芳硫醚樹脂。The present invention relates to a polymerization inhibitor for polyarylene sulfide resin containing a compound having a specific structure; a polyarylene sulfide resin composition containing the polymerization inhibitor; a preparation of polyarylene sulfide using the polymerization inhibitor A method of resin; and a polyarylene sulfide resin prepared using the polymerization inhibitor.

發明背景Background of the Invention

聚芳硫醚為重要的工程塑膠。其諸如高耐熱性、高耐化學性、非可燃性及高強度之特性,對其之需求不斷增加,以用於諸如高耐用性塑膠模製產品及電氣產品之各種用途。Polyarylene sulfide is an important engineering plastic. Its properties, such as high heat resistance, high chemical resistance, non-flammability, and high strength, have continuously increased its demand for various uses such as high-durability plastic molded products and electrical products.

聚苯硫醚為當前以商業規模出售之唯一聚芳硫醚。用於製造其之代表性方法為溶液聚合法,其中對二氯苯及硫化鈉作為原料在N-甲基吡咯啶酮溶劑中聚合;及熔融聚合法,其中二碘芳族化合物及硫化合物作為原料在高溫下聚合而無需使用溶劑。Polyphenylene sulfide is the only polyarylene sulfide currently sold on a commercial scale. Representative methods for producing it are a solution polymerization method in which p-dichlorobenzene and sodium sulfide are polymerized as raw materials in an N-methylpyrrolidone solvent; and a melt polymerization method in which a diiodoaromatic compound and a sulfur compound are used as raw materials. The raw materials are polymerized at high temperature without the use of solvents.

然而,已知由溶液聚合法產生之聚苯硫醚樹脂之耐熱性、耐燃性及耐用性由於溶劑之使用及原料中所含之氯而受大量除氣之不利影響。However, it is known that the heat resistance, flame resistance and durability of polyphenylene sulfide resins produced by solution polymerization are adversely affected by a large amount of outgassing due to the use of solvents and chlorine contained in the raw materials.

相比之下,由熔融聚合法產生之聚苯硫醚樹脂則產生改良效應,因為其不使用溶劑,所以該聚苯硫醚樹脂具有極佳的生產率及成本結構,具有少量除氣,且因為其不使用氯基原料而具有極佳的耐腐蝕性。In contrast, the polyphenylene sulfide resin produced by the melt polymerization method produces an improvement effect, because it does not use a solvent, the polyphenylene sulfide resin has an excellent productivity and cost structure, has a small amount of outgassing, and because It has excellent corrosion resistance without using chlorine-based raw materials.

同時,在製造及/或加工聚芳硫醚之過程中,可能出於藉由控制聚芳硫醚之聚合反應或增強與其他材料之反應性來達成改良機械特性之目的使用聚合抑制劑,諸如二苯二硫醚及巰基苯并噻唑(參見韓國專利第1,944,898號)。At the same time, in the process of manufacturing and/or processing polyarylene sulfide, polymerization inhibitors, such as Diphenyl disulfide and mercaptobenzothiazole (see Korean Patent No. 1,944,898).

本發明人已發現,儘管如上文所描述,與由溶液聚合法製備之聚芳硫醚樹脂相比,由熔融聚合法製備之聚芳硫醚樹脂產生改良效應,但存在其線性由於通用製程之差異而較低之問題,該問題在拉伸強度及衝擊強度方面導致機械強度較差,且當作為纖維及膜用於應用時其伸長率可能並不夠。The present inventors have found that although the polyarylene sulfide resin prepared by the melt polymerization method produces an improvement effect compared to the polyarylene sulfide resin prepared by the solution polymerization method as described above, there is a linearity due to the general process. This problem results in poor mechanical strength in terms of tensile strength and impact strength, and may not have sufficient elongation when used in applications as fibers and films.

作為在此背景下進行之充分研究之結果,本發明人已發現上述問題可藉由改變聚芳硫醚樹脂之聚合抑制劑來解決,藉此完成本發明。 [先前技術文獻] [專利文獻] (專利文獻1)韓國專利第1,944,898號As a result of extensive research conducted under this background, the present inventors have found that the above-mentioned problems can be solved by changing the polymerization inhibitor of the polyarylene sulfide resin, thereby completing the present invention. [Prior Art Literature] [Patent Literature] (Patent Document 1) Korean Patent No. 1,944,898

技術問題technical problem

本發明旨在提供一種新穎的用於聚芳硫醚樹脂之聚合抑制劑;一種使用該聚合抑制劑製備聚芳硫醚樹脂之方法;及一種使用該聚合抑制劑製備之聚芳硫醚樹脂。問題解決方案 The present invention aims to provide a novel polymerization inhibitor for polyarylene sulfide resin; a method for preparing polyarylene sulfide resin using the polymerization inhibitor; and a polyarylene sulfide resin prepared using the polymerization inhibitor. problem solution

根據本發明之一實施例,提供一種用於聚芳硫醚樹脂之聚合抑制劑,該聚合抑制劑包含具有特定結構之化合物。According to an embodiment of the present invention, a polymerization inhibitor for polyarylene sulfide resin is provided, wherein the polymerization inhibitor includes a compound having a specific structure.

根據本發明之另一實施例,提供一種聚芳硫醚樹脂組成物,該聚芳硫醚樹脂組成物包含二碘芳族化合物、硫化合物及以上聚合抑制劑。According to another embodiment of the present invention, a polyarylene sulfide resin composition is provided, and the polyarylene sulfide resin composition includes a diiodo aromatic compound, a sulfur compound and the above polymerization inhibitors.

根據本發明之另一實施例,提供一種製備聚芳硫醚樹脂之方法,該方法包含使包含二碘芳族化合物、硫化合物及以上聚合抑制劑之組成物熔融聚合。According to another embodiment of the present invention, there is provided a method for preparing a polyarylene sulfide resin, the method comprising melt polymerizing a composition comprising a diiodo aromatic compound, a sulfur compound and the above polymerization inhibitor.

根據本發明之另一實施例,提供一種聚芳硫醚樹脂,其係藉由使包含二碘芳族化合物、硫化合物及以上聚合抑制劑之組成物熔融聚合來製備。本發明之有利效應 According to another embodiment of the present invention, there is provided a polyarylene sulfide resin prepared by melt-polymerizing a composition comprising a diiodo aromatic compound, a sulfur compound and the above polymerization inhibitor. Advantageous Effects of the Invention

當用於實施例之聚芳硫醚樹脂之聚合抑制劑用於製備聚芳硫醚樹脂時,其線性可藉由減少聚芳硫醚樹脂中之側鏈結構之形成來增強,藉此可改良最終獲得之聚芳硫醚樹脂之機械特性,諸如強度及伸長率。When the polymerization inhibitor used in the polyarylene sulfide resin of the examples is used to prepare the polyarylene sulfide resin, its linearity can be enhanced by reducing the formation of side chain structures in the polyarylene sulfide resin, thereby improving the Mechanical properties of the finally obtained polyarylene sulfide resin, such as strength and elongation.

用於實施本發明之最佳模式Best Mode for Carrying out the Invention

在下文中,詳細描述本發明。Hereinafter, the present invention is described in detail.

實施例不限於下文所描述之彼等實施例。確切而言,只要不變更本發明之要旨,其可修改成各種形式。[ 用於聚芳硫醚樹脂之聚合抑制劑 ] The embodiments are not limited to those described below. Specifically, it can be modified into various forms as long as the gist of the present invention is not changed. [ Polymerization inhibitor for polyarylene sulfide resin ]

一實施例係關於一種用於聚芳硫醚樹脂之聚合抑制劑,其包含具有特定結構之化合物。One embodiment relates to a polymerization inhibitor for polyarylene sulfide resin, which includes a compound having a specific structure.

聚芳硫醚樹脂可藉由對二氯苯及硫化鈉之溶液聚合來製備。或者,其可藉由二碘芳族化合物及硫化合物之熔融聚合來製備。The polyarylene sulfide resin can be prepared by solution polymerization of p-dichlorobenzene and sodium sulfide. Alternatively, it can be prepared by melt polymerization of a diiodoaromatic compound and a sulfur compound.

用於聚芳硫醚樹脂之聚合抑制劑係指能夠終止/抑制聚芳硫醚樹脂之聚合反應之化合物。特定言之,聚合抑制劑可為藉由移除待聚合之聚芳硫醚樹脂中所含之鹵基來終止/抑制聚合之化合物。The polymerization inhibitor used for the polyarylene sulfide resin refers to a compound capable of terminating/inhibiting the polymerization reaction of the polyarylene sulfide resin. Specifically, the polymerization inhibitor may be a compound that terminates/inhibits polymerization by removing halogen groups contained in the polyarylene sulfide resin to be polymerized.

用於實施例之聚芳硫醚樹脂之聚合抑制劑可包含具有特定結構之化合物。此類聚合抑制劑可具有碘基或硫醚鍵以便與聚芳硫醚樹脂反應。因為碘基及硫醚鍵為用於聚芳硫醚樹脂之聚合中之反應性基團,所以可藉由反應器中之類似量之反應熱進行反應,且所形成之副產物之種類將為相同的,以使得在製程方面具有極佳優點。The polymerization inhibitor used in the polyarylene sulfide resin of the examples may contain a compound having a specific structure. Such a polymerization inhibitor may have an iodine group or a thioether bond in order to react with the polyarylene sulfide resin. Since the iodine group and the sulfide bond are reactive groups used in the polymerization of the polyarylene sulfide resin, the reaction can be carried out with a similar amount of reaction heat in the reactor, and the kind of by-products formed will be The same, so that it has excellent advantages in terms of process.

用於實施例之聚芳硫醚樹脂之聚合抑制劑可包含由下式1表示之化合物。 [式1]

Figure 02_image001
The polymerization inhibitor used for the polyarylene sulfide resin of the examples may contain a compound represented by the following formula 1. [Formula 1]
Figure 02_image001

X1 及X2 各自獨立地選自由以下組成之群:氫基、鹵基、具有1至3個碳原子之烷基、-OA1 、-SA2 、-COOA3 、-NA4 A5 、-SO3 A6 及-NHCOA7 ,Z1 至Z4 各自獨立地選自由以下組成之群:氫基、具有1或2個碳原子之經取代或未經取代烷基及具有1或2個碳原子之經取代或未經取代烯基,且p1 及p2 各自獨立地為1或2,其中當Z1 及Z2 為具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其等能夠彼此連接以形成苯環,當Z3 及Z4 為具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其等能夠彼此連接以形成苯環,且A1 至A7 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子、具有1至3個碳原子之經取代或未經取代烷基、經取代或未經取代苯基及經取代或未經取代萘基,其中A1 至A7 之該具有1至3個碳原子之經取代烷基、該經取代苯基及該經取代萘基各自獨立地具有選自由硫醇基及苯基硫醚基組成之群的取代基,Z1 至Z4 之該具有1或2個碳原子之經取代烷基及該具有1或2個碳原子之經取代烯基各自獨立地具有選自由以下組成之群的取代基:鹵基、羥基、硫醇基、羧基、胺基及磺酸基,且當X1 及X2 均為氫原子時,Z1 及Z2 以及Z3 及Z4 中之至少一者形成經取代或未經取代苯環。X 1 and X 2 are each independently selected from the group consisting of hydrogen, halo, alkyl having 1 to 3 carbon atoms, -OA 1 , -SA 2 , -COOA 3 , -NA 4 A 5 , -SO 3 A 6 and -NHCOA 7 , Z 1 to Z 4 are each independently selected from the group consisting of hydrogen, substituted or unsubstituted alkyl having 1 or 2 carbon atoms and having 1 or 2 carbon atoms A substituted or unsubstituted alkenyl group of carbon atoms, and p 1 and p 2 are each independently 1 or 2, wherein when Z 1 and Z 2 are alkenyl groups having 2 carbon atoms and are bonded to two adjacent when carbon atoms, which can be connected to each other to form a benzene ring, when Z 3 and Z 4 is an alkenyl group having 2 carbon atoms and is bonded to two adjacent carbon atoms, which can be connected to each other to form a benzene ring , and A 1 to A 7 are each independently selected from the group consisting of hydrogen radicals, sodium cations, lithium cations, substituted or unsubstituted alkyl groups having 1 to 3 carbon atoms, substituted or unsubstituted benzene and substituted or unsubstituted naphthyl, wherein the substituted alkyl group having 1 to 3 carbon atoms of A 1 to A 7 , the substituted phenyl group and the substituted naphthyl group each independently have a group selected from sulfur Substituents of the group consisting of alcohol group and phenyl sulfide group, the substituted alkyl group with 1 or 2 carbon atoms and the substituted alkenyl group with 1 or 2 carbon atoms of Z 1 to Z 4 are each independently has a substituent selected from the group consisting of halogen, hydroxyl, thiol, carboxyl, amine and sulfonic acid, and when X 1 and X 2 are both hydrogen atoms, Z 1 and Z 2 and Z 3 and Z 4 in the form of at least one substituted or unsubstituted benzene ring.

特定言之,在由式1表示之化合物中,Z1 及Z2 以及Z3 及Z4 中之至少一者可形成經取代或未經取代苯環,及/或X1 及X2 中之至少一者可選自由以下組成之群:-OA1 、-SA2 、-COOA3 、-NA4 A5 、-SO3 A6 及-NHCOA7 ,而A1 至A7 可各自獨立地選自由經取代或未經取代苯基及經取代或未經取代萘基組成之群。In particular, in the compound represented by Formula 1 , at least one of Z 1 and Z 2 and Z 3 and Z 4 can form a substituted or unsubstituted benzene ring, and/or one of X 1 and X 2 At least one can be selected from the group consisting of -OA 1 , -SA 2 , -COOA 3 , -NA 4 A 5 , -SO 3 A 6 and -NHCOA 7 , and A 1 to A 7 can be independently selected from each other The group consisting of substituted or unsubstituted phenyl and substituted or unsubstituted naphthyl.

另外,在由式1表示之化合物中,Z1 及Z2 以及Z3 及Z4 可形成經取代或未經取代苯環,及/或X1 及X2 可選自由以下組成之群:-OA1 、-SA2 、-COOA3 、-NA4 A5 、-SO3 A6 及-NHCOA7 ,而A1 至A7 可各自獨立地選自由經取代或未經取代苯基及經取代或未經取代萘基組成之群。In addition, in the compound represented by formula 1, Z 1 and Z 2 and Z 3 and Z 4 may form a substituted or unsubstituted benzene ring, and/or X 1 and X 2 may be selected from the group consisting of:- OA 1 , -SA 2 , -COOA 3 , -NA 4 A 5 , -SO 3 A 6 and -NHCOA 7 , and A 1 to A 7 may each be independently selected from substituted or unsubstituted phenyl and substituted or unsubstituted naphthyl group.

另外,由式1表示之化合物可為如下化合物:其中X1 及X2 中之至少一者為-OA1 、-SA2 、-COOA3 、-NA4 A5 、-SO3 A6 或-NHCOA7 ,及/或Z1 至Z4 中之至少一者為具有1或2個碳原子之烷基或烯基,而該烷基或烯基具有選自由以下組成之群的取代基:鹵基、羥基(-OH)、硫醇基(-SH)、羧基(-COOH)、胺基(-NH2 )及磺酸基(-SO3 H)。在該情況下,由式1表示之化合物具有極性官能基,且使用該化合物製備之聚芳硫醚樹脂具有相應極性官能基,以使得其將具有與其他樹脂或添加劑增強的相容性,從而在與該等其他樹脂或添加劑摻合時產生極佳機械特性。In addition, the compound represented by Formula 1 may be a compound in which at least one of X 1 and X 2 is -OA 1 , -SA 2 , -COOA 3 , -NA 4 A 5 , -SO 3 A 6 or - NHCOA 7 , and/or at least one of Z 1 to Z 4 is an alkyl or alkenyl group having 1 or 2 carbon atoms, and the alkyl or alkenyl group has a substituent selected from the group consisting of: halogen group, hydroxyl group (-OH), thiol group (-SH), carboxyl group (-COOH), amine group (-NH 2 ) and sulfonic acid group (-SO 3 H). In this case, the compound represented by Formula 1 has a polar functional group, and the polyarylene sulfide resin prepared using the compound has a corresponding polar functional group, so that it will have enhanced compatibility with other resins or additives, thereby Produces excellent mechanical properties when blended with these other resins or additives.

由式1表示之化合物通常具有雙硫鍵,該雙硫鍵為能夠與聚芳硫醚樹脂反應之反應性基團,以使得該化合物可用作聚合抑制劑。另外,因為該化合物具有與聚芳硫醚樹脂之重複單元類似之核心結構,所以可維持聚芳硫醚樹脂之鏈之規則性,藉此使可由聚合抑制劑引起之結晶度降低降至最低。The compound represented by Formula 1 generally has a disulfide bond, which is a reactive group capable of reacting with a polyarylene sulfide resin, so that the compound can be used as a polymerization inhibitor. In addition, since the compound has a core structure similar to the repeating unit of the polyarylene sulfide resin, the regularity of the chain of the polyarylene sulfide resin can be maintained, thereby minimizing the decrease in crystallinity that may be caused by the polymerization inhibitor.

另外,儘管不受任何特定理論束縛,但因為由式1表示之化合物具有大分子量,所以可防止發生在聚芳硫醚樹脂之製備及/或加工中之減壓步驟期間將該化合物排放至反應器外部之問題,藉此增強最後獲得之聚芳硫醚樹脂之線性。In addition, while not being bound by any particular theory, because the compound represented by Formula 1 has a large molecular weight, it can be prevented from discharging the compound to the reaction during the decompression step in the preparation and/or processing of the polyarylene sulfide resin. The problem of the outside of the device is eliminated, thereby enhancing the linearity of the finally obtained polyarylene sulfide resin.

特定言之,當藉由熔融聚合來製備聚芳硫醚樹脂時,由用作原材料之二碘芳族化合物及其類似物形成呈副產物之碘。因為碘可產生自由基且具有高反應性,所以除非適當地將其移除,否則其可能引起副反應,諸如在聚芳硫醚中形成側鏈結構,藉此降低該聚芳硫醚之線性。製備製程係以減壓製程進行,以便減少此類副反應。聚合抑制劑可能在減壓製程期間排放至反應器外部,此可能對聚芳硫醚之物理特性及加工性產生不利影響。Specifically, when the polyarylene sulfide resin is prepared by melt polymerization, iodine is formed as a by-product from the diiodo aromatic compound and the like used as a raw material. Because iodine can generate free radicals and is highly reactive, unless it is properly removed, it may cause side reactions, such as the formation of side chain structures in polyarylene sulfide, thereby reducing the linearity of the polyarylene sulfide . The preparation process is carried out in a reduced pressure process in order to reduce such side reactions. The polymerization inhibitor may be discharged to the outside of the reactor during the decompression process, which may adversely affect the physical properties and processability of the polyarylene sulfide.

然而,若將具有大分子量之由化學式1表示之化合物用作聚合抑制劑,則抑制該聚合抑制劑之排放,此提高碘移除之效率且抑制在聚芳硫醚中形成側鏈結構,藉此可增強聚芳硫醚之機械特性。另外,可解決在後續聚芳硫醚加工期間由聚芳硫醚中殘留之碘引起之機械腐蝕及由於樹脂黏度增加而引起之加工穩定性劣化問題。However, if the compound represented by Chemical Formula 1 having a large molecular weight is used as a polymerization inhibitor, the emission of the polymerization inhibitor is suppressed, which improves the efficiency of iodine removal and suppresses the formation of a side chain structure in polyarylene sulfide, by This can enhance the mechanical properties of polyarylene sulfide. In addition, the problems of mechanical corrosion caused by iodine remaining in the polyarylene sulfide during subsequent processing of the polyarylene sulfide and deterioration of processing stability due to an increase in the resin viscosity can be solved.

自此視角出發,在由式1表示之化合物中,具有鍵結至二硫醚官能基之萘結構之化合物或其中鍵結至二硫醚官能基之苯基具有-OA1 、-SA2 、-COOA3 、-NA4 A5 、-SO3 A6 或-NHCOA7 作為取代基(其限制條件為A1 至A7 為苯基或萘基)之彼等化合物為特別較佳的。From this point of view, in the compound represented by Formula 1, the compound having a naphthalene structure bonded to a disulfide functional group or a phenyl group wherein the phenyl bonded to a disulfide functional group has -OA 1 , -SA 2 , Those compounds in which -COOA 3 , -NA 4 A 5 , -SO 3 A 6 or -NHCOA 7 are used as substituents (with the limitation that A 1 to A 7 are phenyl or naphthyl) are particularly preferred.

因此,若由式1表示之化合物用於製備及/或加工聚芳硫醚樹脂,則可減少聚芳硫醚樹脂中之側鏈結構之形成且減少聚芳硫醚樹脂中殘留之碘的量,以使得可在增強最終聚芳硫醚樹脂之機械特性的同時改良加工穩定性。Therefore, if the compound represented by Formula 1 is used to prepare and/or process a polyarylene sulfide resin, the formation of side chain structures in the polyarylene sulfide resin can be reduced and the amount of iodine remaining in the polyarylene sulfide resin can be reduced , so that processing stability can be improved while enhancing the mechanical properties of the final polyarylene sulfide resin.

同時,由化學式1表示之化合物可視使用該化合物製備之聚芳硫醚樹脂之用途而具有各種官能基。聚芳硫醚樹脂由於其極佳耐熱性而用於各種目的。特定言之,其可用於需要極佳耐熱性及剛性之電動車輛部件、工業管道、塗佈樹脂、各種膜、纖維及其類似物。此處,聚芳硫醚樹脂通常視預期用途而與具有適當物理特性之其他樹脂或添加劑組合使用。由式1表示之化合物之較佳官能基可視此等其他樹脂或添加劑之組成而變化。Meanwhile, the compound represented by Chemical Formula 1 may have various functional groups depending on the application of the polyarylene sulfide resin prepared using the compound. Polyarylene sulfide resins are used for various purposes due to their excellent heat resistance. In particular, it can be used for electric vehicle parts, industrial pipes, coating resins, various films, fibers, and the like that require excellent heat resistance and rigidity. Here, the polyarylene sulfide resin is generally used in combination with other resins or additives having appropriate physical properties depending on the intended use. The preferred functional groups of the compound represented by Formula 1 may vary depending on the composition of these other resins or additives.

例如,當其用於具有低鹵素含量之電子產品時,諸如苯基及萘基之非極性端基可為較佳的。當其與包含環氧環之其他樹脂混合時,諸如羧基、羥基、胺基及硫醇基之極性端基可為較佳的。For example, non-polar end groups such as phenyl and naphthyl may be preferred when they are used in electronics with low halogen content. Polar end groups such as carboxyl, hydroxyl, amine and thiol groups may be preferred when mixed with other resins containing epoxy rings.

用於實施例之聚芳硫醚樹脂之聚合抑制劑可包含由下式2表示之化合物。 [式2]

Figure 02_image003
The polymerization inhibitor used for the polyarylene sulfide resin of the examples may contain a compound represented by the following formula 2. [Formula 2]
Figure 02_image003

R1 至R4 各自獨立地選自由以下組成之群:氫基、鹵基、具有1至5個碳原子之經取代或未經取代烷基、-OA8 、-SA9 、-COOA10 、-NA11 A12 、-SO3 A13 及-NHCOA14 ,其中A8 至A14 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子及具有1至3個碳原子之經取代或未經取代烷基,且R1 至R4 中之該具有1至5個碳原子之經取代烷基及A8 至A14 中之該具有1至3個碳原子之經取代烷基各自獨立地具有硫醇基作為取代基。R 1 to R 4 are each independently selected from the group consisting of hydrogen, halo, substituted or unsubstituted alkyl having 1 to 5 carbon atoms, -OA 8 , -SA 9 , -COOA 10 , -NA 11 A 12 , -SO 3 A 13 and -NHCOA 14 , wherein A 8 to A 14 are each independently selected from the group consisting of hydrogen radicals, sodium cations, lithium cations, and hydroxyl radicals having 1 to 3 carbon atoms A substituted or unsubstituted alkyl group, and the substituted alkyl group with 1 to 5 carbon atoms in R 1 to R 4 and the substituted alkyl group with 1 to 3 carbon atoms in A 8 to A 14 Each independently has a thiol group as a substituent.

另外,R1 至R4 中之至少一者可為具有1至5個碳原子之經取代烷基,或R1 至R4 中之至少一者可選自由以下組成之群:-OA8 、-SA9 、-COOA10 、-NA11 A12 、-SO3 A13 及-NHCOA14 ,而A8 至A14 可為具有1至3個碳原子之經取代烷基。Additionally, at least one of R 1 to R 4 may be a substituted alkyl group having 1 to 5 carbon atoms, or at least one of R 1 to R 4 may be selected from the group consisting of -OA 8 , -SA 9 , -COOA 10 , -NA 11 A 12 , -SO 3 A 13 and -NHCOA 14 , and A 8 to A 14 may be substituted alkyl groups having 1 to 3 carbon atoms.

另外,在由式2表示之化合物中,R1 至R4 可各自獨立地選自由以下組成之群:氫基、具有1至5個碳原子之經取代或未經取代烷基及-OA8 ,A8 可各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子及具有1至3個碳原子之烷基,且R1 至R4 中之具有1至5個碳原子之經取代烷基可各自獨立地具有硫醇基作為取代基。In addition, in the compound represented by Formula 2, R 1 to R 4 may each be independently selected from the group consisting of a hydrogen group, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, and -OA 8 , A 8 can each be independently selected from the group consisting of: hydrogen group, sodium cation, lithium cation and alkyl group with 1 to 3 carbon atoms, and R 1 to R 4 have 1 to 5 carbon atoms in the group The substituted alkyl groups may each independently have a thiol group as a substituent.

另外,在由式2表示之化合物中,R1 至R4 中之至少一者可為-OA8 、-SA9 、-COOA10 、-NA11 A12 、-SO3 A13 或-NHCOA14 。在該情況下,因為由式2表示之化合物具有極性官能基,所以當摻合時使用該化合物製備之聚芳硫醚可在機械特性方面得到增強。In addition, in the compound represented by Formula 2, at least one of R 1 to R 4 may be -OA 8 , -SA 9 , -COOA 10 , -NA 11 A 12 , -SO 3 A 13 or -NHCOA 14 . In this case, since the compound represented by Formula 2 has a polar functional group, the polyarylene sulfide prepared using the compound can be enhanced in mechanical properties when blended.

因為由式2表示之化合物具有大量官能基,所以其可具有大分子量。因此,可防止發生在聚芳硫醚樹脂之製備及/或加工中之減壓製程期間排放至反應器外部之問題,藉此提高碘移除之效率,且降低最終聚芳硫醚樹脂中之碘含量。另外,因為可視聚芳硫醚之用途而適當地選擇多個官能基,所以當需要極佳相容性時其可能為較佳的。舉例而言,當需要與無機填充劑黏結之較強黏結強度時,由式2表示之化合物可能為尤其較佳的。Since the compound represented by Formula 2 has a large number of functional groups, it can have a large molecular weight. Therefore, the problem of discharge to the outside of the reactor during the decompression process in the preparation and/or processing of the polyarylene sulfide resin can be prevented, thereby improving the efficiency of iodine removal and reducing the amount of iodine in the final polyarylene sulfide resin. iodine content. In addition, since a plurality of functional groups are appropriately selected depending on the use of the polyarylene sulfide, it may be preferable when excellent compatibility is required. For example, the compound represented by Formula 2 may be particularly preferred when stronger bond strength with inorganic fillers is required.

另外,當由式2表示之化合物具有脂族官能基時,其通常以液態存在。因此,其具有很大優點:其可比固體芳族化合物更容易引入。In addition, when the compound represented by Formula 2 has an aliphatic functional group, it usually exists in a liquid state. Therefore, it has the great advantage that it can be introduced more easily than solid aromatic compounds.

用於實施例之聚芳硫醚樹脂之聚合抑制劑可包含由下式3表示之化合物。 [式3]

Figure 02_image005
The polymerization inhibitor used for the polyarylene sulfide resin of the Examples may contain a compound represented by the following formula 3. [Formula 3]
Figure 02_image005

X7 至X12 各自獨立地選自由以下組成之群:氫基、鹵基、具有1至5個碳原子之烷基、-OA15 、-SA16 、-COOA17 、-NA18 A19 、-SO3 A20 及-NHCOA21 ,且R5 及R6 各自獨立地為具有1至5個碳原子之伸烷基,其中A15 至A21 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子及具有1至5個碳原子之經取代或未經取代烷基,其中A15 至A21 中之該具有1至5個碳原子之經取代烷基各自獨立地具有硫醇基作為取代基。X 7 to X 12 are each independently selected from the group consisting of hydrogen, halogen, alkyl having 1 to 5 carbon atoms, -OA 15 , -SA 16 , -COOA 17 , -NA 18 A 19 , -SO 3 A 20 and -NHCOA 21 , and R 5 and R 6 are each independently an alkylene group having 1 to 5 carbon atoms, wherein A 15 to A 21 are each independently selected from the group consisting of: hydrogen , sodium cations, lithium cations, and substituted or unsubstituted alkyl groups having 1 to 5 carbon atoms, wherein the substituted alkyl groups having 1 to 5 carbon atoms in A 15 to A 21 each independently have sulfur Alcohol group as a substituent.

特定言之,在由式3表示之化合物中,X7 至X12 可為-OA15 ,而A15 可各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子及具有1至5個碳原子之經取代或未經取代烷基。Specifically, in the compound represented by Formula 3, X 7 to X 12 may be -OA 15 , and A 15 may each be independently selected from the group consisting of a hydrogen group, a sodium cation, a lithium cation, and a group having 1 to Substituted or unsubstituted alkyl of 5 carbon atoms.

另外,在由式3表示之化合物中,X7 至X12 中之至少一者可為-OA15 、-SA16 、-COOA17 、-NA18 A19 、-SO3 A20 或-NHCOA21 。在該情況下,因為由式3表示之化合物具有極性官能基,所以當摻合時使用該化合物製備之聚芳硫醚可在機械特性方面得到增強。In addition, in the compound represented by Formula 3, at least one of X 7 to X 12 may be -OA 15 , -SA 16 , -COOA 17 , -NA 18 A 19 , -SO 3 A 20 or -NHCOA 21 . In this case, since the compound represented by Formula 3 has a polar functional group, the polyarylene sulfide prepared using the compound can be enhanced in mechanical properties when blended.

儘管其不受任何特定理論束縛,但因為由式3表示之化合物具有大量官能基,所以其可具有大分子量,如式2表示之化合物。因此,可防止發生在聚芳硫醚樹脂之製備及/或加工中之減壓製程期間排放至反應器外部之問題,藉此提高碘移除之效率,且降低最終聚芳硫醚樹脂中之碘含量。另外,因為可視聚芳硫醚之用途而適當地選擇多個官能基,所以當需要極佳相容性時其可能為較佳的。Although not bound by any particular theory, because the compound represented by Formula 3 has a large number of functional groups, it can have a large molecular weight, like the compound represented by Formula 2. Therefore, the problem of discharge to the outside of the reactor during the decompression process in the preparation and/or processing of the polyarylene sulfide resin can be prevented, thereby improving the efficiency of iodine removal and reducing the amount of iodine in the final polyarylene sulfide resin. iodine content. In addition, since a plurality of functional groups are appropriately selected depending on the use of the polyarylene sulfide, it may be preferable when excellent compatibility is required.

另外,當由式3表示之化合物具有脂族官能基時,其通常以液態存在。因此,其具有很大優點:其可比固體芳族化合物更容易引入。In addition, when the compound represented by Formula 3 has an aliphatic functional group, it usually exists in a liquid state. Therefore, it has the great advantage that it can be introduced more easily than solid aromatic compounds.

用於實施例之聚芳硫醚樹脂之聚合抑制劑可包含由下式4表示之化合物。 [式4]

Figure 02_image007
The polymerization inhibitor used for the polyarylene sulfide resin of the examples may contain a compound represented by the following formula 4. [Formula 4]
Figure 02_image007

X13 各自獨立地選自由以下組成之群:氫基、鹵基、具有1至5個碳原子之烷基、OA22 、-SA23 、-COOA24 、-NA25 A26 、-SO3 A27 及-NHCOA28 ,Z5 及Z6 各自獨立地選自由以下組成之群:氫基、具有1或2個碳原子之經取代或未經取代烷基及具有1或2個碳原子之經取代或未經取代烯基,w為鹵基,且q各自獨立地為1至3之整數,其中當Z5 及Z6 為具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其等能夠彼此連接以形成苯環,A22 、A24 及A25 各自獨立地選自由以下組成之群:鈉陽離子、鋰陽離子、具有1至5個碳原子之經取代或未經取代烷基、經取代或未經取代苯基及經取代或未經取代萘基,且A23 及A26 至A28 各自獨立地選自由以下組成之群:氫基、鈉陽離子、鋰陽離子、具有1至5個碳原子之經取代或未經取代烷基、經取代或未經取代苯基及經取代或未經取代萘基,其中A22 至A28 之該具有1至5個碳原子之經取代烷基、該經取代苯基及該經取代萘基各自獨立地具有選自由硫醇基及苯基硫醚基組成之群的取代基,Z5 及Z6 之該具有1或2個碳原子之經取代烷基及該具有1或2個碳原子之經取代烯基各自獨立地具有選自由以下組成之群的取代基:鹵基、羥基、硫醇基、羧基、胺基及磺酸基。X 13 is each independently selected from the group consisting of hydrogen, halo, alkyl having 1 to 5 carbon atoms, OA 22 , -SA 23 , -COOA 24 , -NA 25 A 26 , -SO 3 A 27 and -NHCOA 28 , Z 5 and Z 6 are each independently selected from the group consisting of hydrogen, substituted or unsubstituted alkyl having 1 or 2 carbon atoms, and substituted or unsubstituted alkyl having 1 or 2 carbon atoms substituted or unsubstituted alkenyl, w is halo, and q is each independently an integer from 1 to 3, wherein when Z 5 and Z 6 are alkenyl groups having 2 carbon atoms and are bonded to two adjacent carbons atoms, which can be attached to each other to form a benzene ring, A 22 , A 24 and A 25 are each independently selected from the group consisting of sodium cations, lithium cations, substituted or unsubstituted cations having 1 to 5 carbon atoms substituted alkyl, substituted or unsubstituted phenyl, and substituted or unsubstituted naphthyl, and A 23 and A 26 to A 28 are each independently selected from the group consisting of hydrogen, sodium cation, lithium cation, Substituted or unsubstituted alkyl, substituted or unsubstituted phenyl, and substituted or unsubstituted naphthyl having 1 to 5 carbon atoms , wherein A 22 to A 28 have 1 to 5 carbon atoms The substituted alkyl group, the substituted phenyl group and the substituted naphthyl group each independently have a substituent selected from the group consisting of thiol and phenyl thioether groups, and the substituted groups of Z 5 and Z 6 have 1 or 2 The substituted alkyl of 1 or 2 carbon atoms and the substituted alkenyl of 1 or 2 carbon atoms each independently have a substituent selected from the group consisting of halo, hydroxy, thiol, carboxyl, amine, and sulfonic acid group.

特定言之,在由式4表示之化合物中,當q為2或更大時,X13 中之至少一者可選自由以下組成之群:具有1至5個碳原子之烷基、-OA22 、-SA23 、-COOA24 、-NA25 A26 、-SO3 A27 及-NHCOA28 。由式4表示之化合物為基本上具有鹵基之化合物。儘管其不受任何特定理論束縛,但衍生自聚芳硫醚樹脂之雙硫鍵之硫基團在反應期間與由式4表示之化合物中所含之鹵基反應,藉此降低最終聚芳硫醚樹脂中之雙硫鍵之分率。同時,聚芳硫醚樹脂中之雙硫鍵可經裂解以產生硫基團,且由此產生之硫基團可能引起副反應,諸如與聚芳硫醚樹脂之側鏈結合。因此,由式4表示之化合物可減少此類副反應以抑制在聚芳硫醚樹脂中形成側鏈結構,藉此增強最終樹脂之機械特性且改良加工穩定性。Specifically, in the compound represented by Formula 4, when q is 2 or more, at least one of X 13 can be selected from the group consisting of: an alkyl group having 1 to 5 carbon atoms, -OA 22 , -SA 23 , -COOA 24 , -NA 25 A 26 , -SO 3 A 27 and -NHCOA 28 . The compound represented by Formula 4 is a compound having substantially a halogen group. Although it is not bound by any particular theory, the sulfur groups derived from the disulfide bonds of the polyarylene sulfide resin react with the halogen groups contained in the compound represented by Formula 4 during the reaction, thereby reducing the final polyarylene sulfide The fraction of disulfide bonds in ether resins. Meanwhile, disulfide bonds in the polyarylene sulfide resin may be cleaved to generate sulfur groups, and the thus generated sulfur groups may cause side reactions, such as bonding with side chains of the polyarylene sulfide resin. Therefore, the compound represented by Formula 4 can reduce such side reactions to suppress the formation of side chain structures in the polyarylene sulfide resin, thereby enhancing the mechanical properties of the final resin and improving processing stability.

另外,在由式4表示之化合物中,X13 可選自由以下組成之群:鹵基、-OA22 、-SA23 、-COOA24 、-NA25 A26 、-SO3 A27 及-NHCOA28 。在該情況下,因為由式4表示之化合物具有極性官能基,所以使用該化合物製備之聚芳硫醚可在其相容性方面得到增強,藉此當摻合時具有改良機械特性。In addition, in the compound represented by Formula 4, X 13 may be selected from the group consisting of halo, -OA 22 , -SA 23 , -COOA 24 , -NA 25 A 26 , -SO 3 A 27 and -NHCOA 28 . In this case, since the compound represented by Formula 4 has a polar functional group, the polyarylene sulfide prepared using the compound can be enhanced in its compatibility, thereby having improved mechanical properties when blended.

特定言之,當由式4表示之化合物具有-SA23 作為X13 時,可達成與聚芳硫醚之單體結構類似之結構。因此,具有使最終樹脂之結晶度之抑制降至最低之優點為尤其較佳的。Specifically, when the compound represented by Formula 4 has -SA 23 as X 13 , a structure similar to the monomer structure of polyarylene sulfide can be achieved. Therefore, it is especially preferred to have the advantage of minimizing the inhibition of crystallinity of the final resin.

由式1至4中之任一者表示之化合物為可商購的,或熟習此項技術者可基於技術常識來合成該化合物。The compound represented by any one of formulae 1 to 4 is commercially available, or one skilled in the art can synthesize the compound based on technical common sense.

更特定言之,用於實施例之聚芳硫醚樹脂之聚合抑制劑可包含以下化合物(1)至(31)。 (1) 1-(萘-2-基)-2-(萘-2-基)二硫烷 (2) 1-(萘-1-基)-2-(萘-1-基)二硫烷 (3) 1-(萘-1-基)-2-(萘-2-基)二硫烷 (4) 1-(萘-1-基)-2-苯二硫烷 (5) 1,2-雙(2-碘萘-6-基)二硫烷 (6) 1,2-雙(1-碘萘-5-基)二硫烷 (7) 1-(1-碘萘-5-基)-2-(2-碘萘-6-基)二硫烷 (8) 1-(1-碘萘-5-基)-2-(4-碘苯基)二硫烷 (9) 1,2-雙(2-羧基萘-6-基)二硫烷 (10) 1,2-雙(2-羥基萘-6-基)二硫烷 (11) 1,2-雙(2-胺基萘-6-基)二硫烷 (12) 1,2-雙(2-巰基萘-6-基)二硫烷 (13) 1,2-雙(1-羧基萘-4-基)二硫烷 (14) 4-(2-(1-羥基萘-4-基)二硫烷基)萘-1-甲酸 (15) 4-(2-(1-羥基萘-2-基)二硫烷基)萘-1-醇 (16) 5-(2-(2-羥基萘-6-基)二硫烷基)萘-1-醇 (17) 3-(三乙氧基矽基)丙烷-1-硫醇 (18) 3-(三甲氧基矽基)丙烷-1-硫醇 (19) 3-(羥二甲氧基矽基)丙烷-1-硫醇 (20) 3-(三羥基矽基)丙烷-1-硫醇 (21) 3-(二羥基矽基)丙烷-1-硫醇 (22) 1,2-雙(3-(三乙氧基矽基)丙基)二硫烷 (23) 1,2-雙(3-(三羥基矽基)丙基)二硫烷 (24) 1,2-雙(3-(三甲氧基矽基)丙基)二硫烷 (25) 1-(3-(三乙氧基矽基)丙基)-2-(3-(三羥基矽基)丙基)二硫烷 (26) 4-碘苯硫酚 (27) 1-乙氧基-4-碘苯 (28) 乙基(4-碘苯基)硫烷 (29) 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷 (30) 1,2-雙(2-萘醯胺苯-1-基)二硫烷 (31) 1,2-雙(2-(4-(苯硫基)苯甲醯胺基)苯基-1-基)二硫烷More specifically, the polymerization inhibitor used for the polyarylene sulfide resin of the examples may contain the following compounds (1) to (31). (1) 1-(Naphthalene-2-yl)-2-(naphthalene-2-yl)disulfane (2) 1-(Naphthalene-1-yl)-2-(naphthalene-1-yl)disulfane (3) 1-(Naphthalene-1-yl)-2-(naphthalene-2-yl)disulfane (4) 1-(Naphthalene-1-yl)-2-benzenedisulfane (5) 1,2-bis(2-iodonaphthalen-6-yl)disulfane (6) 1,2-bis(1-iodonaphthalen-5-yl)disulfane (7) 1-(1-iodonaphthalen-5-yl)-2-(2-iodonaphthalene-6-yl)disulfane (8) 1-(1-iodonaphthalen-5-yl)-2-(4-iodophenyl)disulfane (9) 1,2-bis(2-carboxynaphthalen-6-yl)disulfane (10) 1,2-bis(2-hydroxynaphthalen-6-yl)disulfane (11) 1,2-bis(2-aminonaphthalen-6-yl)disulfane (12) 1,2-bis(2-mercaptonaphthalen-6-yl)disulfane (13) 1,2-bis(1-carboxynaphthalen-4-yl)disulfane (14) 4-(2-(1-Hydroxynaphthalen-4-yl)disulfanyl)naphthalene-1-carboxylic acid (15) 4-(2-(1-Hydroxynaphthalen-2-yl)disulfanyl)naphthalene-1-ol (16) 5-(2-(2-Hydroxynaphthalen-6-yl)disulfanyl)naphthalene-1-ol (17) 3-(Triethoxysilyl)propane-1-thiol (18) 3-(Trimethoxysilyl)propane-1-thiol (19) 3-(Hydroxydimethoxysilyl)propane-1-thiol (20) 3-(Trihydroxysilyl)propane-1-thiol (21) 3-(Dihydroxysilyl)propane-1-thiol (22) 1,2-bis(3-(triethoxysilyl)propyl)disulfane (23) 1,2-Bis(3-(trihydroxysilyl)propyl)disulfane (24) 1,2-Bis(3-(trimethoxysilyl)propyl)disulfane (25) 1-(3-(Triethoxysilyl)propyl)-2-(3-(trihydroxysilyl)propyl)disulfane (26) 4-Iodothiophenol (27) 1-ethoxy-4-iodobenzene (28) Ethyl(4-iodophenyl)sulfane (29) 1,2-bis(2-benzylaminophenyl-1-yl)disulfane (30) 1,2-Bis(2-naphtholin-1-yl)disulfane (31) 1,2-bis(2-(4-(phenylthio)benzylamino)phenyl-1-yl)disulfane

化合物(1)至(31)之結構展示於下表1中。 [表1] 編號 化合物結構 編號 化合物結構 (1)

Figure 02_image009
(17)
Figure 02_image011
(2)
Figure 02_image013
(18)
Figure 02_image015
(3)
Figure 02_image017
(19)
Figure 02_image019
(4)
Figure 02_image021
(20)
Figure 02_image023
(5)
Figure 02_image025
(21)
Figure 02_image027
(6)
Figure 02_image029
(22)
Figure 02_image031
(7)
Figure 02_image033
(23)
Figure 02_image035
(8)
Figure 02_image037
(24)
Figure 02_image039
(9)
Figure 02_image041
(25)
Figure 02_image043
(10)
Figure 02_image045
(26)
Figure 02_image047
(11)
Figure 02_image049
(27)
Figure 02_image051
(12)
Figure 02_image053
(28)
Figure 02_image055
(13)
Figure 02_image057
(29)
Figure 02_image059
(14)
Figure 02_image061
(30)
Figure 02_image063
(15)
Figure 02_image065
(31)
Figure 02_image067
(16)
Figure 02_image069
 
[ 包含聚合抑制劑之聚芳硫醚樹脂組成物 ] The structures of compounds (1) to (31) are shown in Table 1 below. [Table 1] Numbering Compound structure Numbering Compound structure (1)
Figure 02_image009
(17)
Figure 02_image011
(2)
Figure 02_image013
(18)
Figure 02_image015
(3)
Figure 02_image017
(19)
Figure 02_image019
(4)
Figure 02_image021
(20)
Figure 02_image023
(5)
Figure 02_image025
(twenty one)
Figure 02_image027
(6)
Figure 02_image029
(twenty two)
Figure 02_image031
(7)
Figure 02_image033
(twenty three)
Figure 02_image035
(8)
Figure 02_image037
(twenty four)
Figure 02_image039
(9)
Figure 02_image041
(25)
Figure 02_image043
(10)
Figure 02_image045
(26)
Figure 02_image047
(11)
Figure 02_image049
(27)
Figure 02_image051
(12)
Figure 02_image053
(28)
Figure 02_image055
(13)
Figure 02_image057
(29)
Figure 02_image059
(14)
Figure 02_image061
(30)
Figure 02_image063
(15)
Figure 02_image065
(31)
Figure 02_image067
(16)
Figure 02_image069
[ Polyarylene sulfide resin composition containing polymerization inhibitor ]

另一實施例係關於一種聚芳硫醚樹脂組成物,該聚芳硫醚樹脂組成物包含二碘芳族化合物、硫化合物及用於聚芳硫醚樹脂之聚合抑制劑。Another embodiment relates to a polyarylene sulfide resin composition comprising a diiodo aromatic compound, a sulfur compound and a polymerization inhibitor for the polyarylene sulfide resin.

用於聚芳硫醚樹脂之聚合抑制劑係如上文所描述。Polymerization inhibitors for polyarylene sulfide resins are as described above.

二碘芳族化合物可為選自由以下組成之群的至少一者:二碘苯、二碘萘、二碘聯苯、二碘雙酚以及二碘二苯甲酮,但其不限於此。另外,在以上提及之化合物中,二碘芳族化合物可具有諸如烷基或碸基之取代基,或亦可使用其中芳族基團中含有諸如氧或氮之原子之二碘芳族化合物。此外,二碘芳族化合物具有各種異構體,此視碘原子所連接之位置而定。在此等異構體中其中碘連接至對位之化合物,諸如對二碘苯、2,6-二碘萘或p,p'-二碘聯苯可為較適合的。The diiodo aromatic compound may be at least one selected from the group consisting of diiodobenzene, diiodonaphthalene, diiodobiphenyl, diiodobisphenol, and diiodobenzophenone, but is not limited thereto. In addition, among the above-mentioned compounds, the diiodoaromatic compound may have a substituent such as an alkyl group or a thiol group, or a diiodoaromatic compound in which an atom such as oxygen or nitrogen is contained in the aromatic group may also be used . In addition, diiodoaromatic compounds have various isomers, depending on where the iodine atom is attached. Among these isomers compounds in which the iodine is attached to the para position, such as p-diiodobenzene, 2,6-diiodonaphthalene or p,p'-diiodobiphenyl, may be more suitable.

與二碘芳族化合物反應之硫化合物不受特定限制。硫化合物可為元素硫。通常,元素硫在室溫下以環八硫(S8 )形式存在,其中八個原子係經連接的。若硫可以除以上形式以外之任何固態或液態商購,則其可不受限制地使用。The sulfur compound reacted with the diiodo aromatic compound is not particularly limited. The sulfur compound may be elemental sulfur. Typically, elemental sulfur exists at room temperature in the form of cyclooctasulfide (S 8 ), in which eight atoms are linked. If sulfur is commercially available in any solid or liquid form other than the above, it can be used without limitation.

按組成物之總重量計,可含有0.00001至5重量%之量的聚合抑制劑。特定言之,按組成物之總重量計,可含有0.0001至4重量%、0.001至3重量%、0.01至2重量%或0.1至1重量%之量的該聚合抑制劑。[ 使用聚合抑制劑製備聚芳硫醚樹脂之方法 ] The polymerization inhibitor may be contained in an amount of 0.00001 to 5% by weight based on the total weight of the composition. Specifically, the polymerization inhibitor may be contained in an amount of 0.0001 to 4 wt %, 0.001 to 3 wt %, 0.01 to 2 wt %, or 0.1 to 1 wt % based on the total weight of the composition. [ Method for producing polyarylene sulfide resin using polymerization inhibitor ]

另一實施例係關於一種用於製備聚芳硫醚樹脂之方法,該方法包含使包含二碘芳族化合物、硫化合物及用於聚芳硫醚樹脂之聚合抑制劑的組成物熔融聚合。Another embodiment relates to a method for preparing a polyarylene sulfide resin, the method comprising melt polymerizing a composition comprising a diiodo aromatic compound, a sulfur compound, and a polymerization inhibitor for the polyarylene sulfide resin.

二碘芳族化合物、硫化合物及用於聚芳硫醚樹脂之聚合抑制劑係如上文所描述。Diiodo aromatic compounds, sulfur compounds, and polymerization inhibitors for polyarylene sulfide resins are as described above.

用於熔融聚合步驟之條件不受限制,只要溫度足夠高以使得二碘芳族化合物及硫化合物可聚合即可。然而,熔融聚合步驟較佳在減壓條件下進行以便移除作為副產物形成之碘。亦即,熔融聚合步驟可在高溫及減壓條件下進行。特定言之,熔融聚合步驟可在180至400℃之溫度下進行。更特定言之,熔融聚合步驟之溫度可自初始反應條件逐漸升高至最終反應條件。例如,初始反應條件可為180至260℃、190至250℃或200至240℃,且最終反應條件可為270至350℃、280至340℃、290至330℃或300至320℃。在此情況下,溫度升高速率可為0.16至0.93℃/分鐘,較佳0.26至0.33℃/分鐘。The conditions used for the melt polymerization step are not limited as long as the temperature is high enough to allow the diiodo aromatic compound and the sulfur compound to polymerize. However, the melt polymerization step is preferably carried out under reduced pressure in order to remove iodine formed as a by-product. That is, the melt polymerization step can be performed under conditions of high temperature and reduced pressure. In particular, the melt polymerization step can be carried out at a temperature of 180 to 400°C. More specifically, the temperature of the melt polymerization step can be gradually increased from the initial reaction conditions to the final reaction conditions. For example, the initial reaction conditions may be 180 to 260°C, 190 to 250°C, or 200 to 240°C, and the final reaction conditions may be 270 to 350°C, 280 to 340°C, 290 to 330°C, or 300 to 320°C. In this case, the temperature increase rate may be 0.16 to 0.93°C/min, preferably 0.26 to 0.33°C/min.

另外,熔融聚合步驟可在0.001至500托之壓力下進行。更特定言之,熔融聚合步驟之壓力可自初始反應條件逐漸減小至最終反應條件。例如,初始反應條件可為10至500托、50至400托或100至300托,且最終反應條件可為0.1至50托、0.3至30托或0.1至10托,特定言之0.1至5托。在此情況下,壓力減小速率可為0.93至4.65托/分鐘,較佳1.33托/分鐘至2.67托/分鐘。Additionally, the melt polymerization step can be carried out at a pressure of 0.001 to 500 Torr. More specifically, the pressure of the melt polymerization step can be gradually reduced from initial reaction conditions to final reaction conditions. For example, the initial reaction conditions may be 10 to 500 Torr, 50 to 400 Torr, or 100 to 300 Torr, and the final reaction conditions may be 0.1 to 50 Torr, 0.3 to 30 Torr, or 0.1 to 10 Torr, specifically 0.1 to 5 Torr . In this case, the pressure reduction rate may be 0.93 to 4.65 Torr/min, preferably 1.33 Torr/min to 2.67 Torr/min.

按組成物之總重量計,熔融聚合步驟中可含有0.00001至5重量%之量的聚合抑制劑。特定言之,按組成物之總重量計,可含有0.0001至4重量%、0.001至3重量%、0.01至2重量%或0.1至1重量%之量的該聚合抑制劑。The polymerization inhibitor may be included in the melt polymerization step in an amount of 0.00001 to 5% by weight, based on the total weight of the composition. Specifically, the polymerization inhibitor may be contained in an amount of 0.0001 to 4 wt %, 0.001 to 3 wt %, 0.01 to 2 wt %, or 0.1 to 1 wt % based on the total weight of the composition.

若聚合抑制劑包含具有極性官能基之由式1至式4中之一者表示之化合物,則聚合抑制劑可同時充當聚合抑制劑及增容劑。因此,優點在於:因為不需要將單獨增容劑施加於聚芳硫醚樹脂之步驟,所以使該方法得以簡化。同時,因為施加增容劑之步驟通常在比聚合步驟更高的溫度及更強的剪應力下進行,所以聚芳硫醚之主鏈可得到熱分解。然而,使用具有極性官能基之聚合抑制劑具有另一優點:可克服在施加增容劑之步驟中出現之問題。If the polymerization inhibitor includes a compound represented by one of Formula 1 to Formula 4 having a polar functional group, the polymerization inhibitor can act as both a polymerization inhibitor and a compatibilizer. Therefore, there is an advantage in that the process is simplified since the step of applying a separate compatibilizer to the polyarylene sulfide resin is not required. Meanwhile, because the step of applying a compatibilizer is usually performed at a higher temperature and a stronger shear stress than the polymerization step, the main chain of the polyarylene sulfide can be thermally decomposed. However, the use of a polymerization inhibitor with polar functional groups has another advantage in that it can overcome the problems that arise during the step of applying the compatibilizer.

在熔融聚合步驟中,聚合抑制劑可與二碘芳族化合物及硫化合物在反應之初始階段一起添加。或者,其可在一些包含二碘芳族化合物及硫化合物之組成物已熔融聚合之後添加。特定言之,當包含二碘芳族化合物及硫化合物之組成物中之殘餘碘含量為0.01至80重量%、5至80重量%、10至80重量%、50至80重量%、0.01至71重量%、5至71重量%、10至71重量%、50至71重量%、1至50重量%、1至20重量%、1至10重量%或5至10重量%時,可添加聚合抑制劑。In the melt polymerization step, the polymerization inhibitor may be added together with the diiodo aromatic compound and the sulfur compound in the initial stage of the reaction. Alternatively, it may be added after some of the compositions comprising the diiodo aromatic compound and the sulfur compound have been melt polymerized. Specifically, when the residual iodine content in the composition comprising the diiodo aromatic compound and the sulfur compound is 0.01 to 80% by weight, 5 to 80% by weight, 10 to 80% by weight, 50 to 80% by weight, 0.01 to 71% by weight % by weight, 5 to 71% by weight, 10 to 71% by weight, 50 to 71% by weight, 1 to 50% by weight, 1 to 20% by weight, 1 to 10% by weight, or 5 to 10% by weight, polymerization inhibition may be added agent.

若當包含二碘芳族化合物及硫化合物之組成物中之殘餘碘含量在上述含量範圍內時添加聚合抑制劑,則可顯著降低最終聚芳硫醚樹脂中之雙硫鍵分率及碘含量,以使得可改良機械特性及加工穩定性,或可顯著增強線性。[ 使用聚合抑制劑製備之聚芳基硫醚樹脂 ] If a polymerization inhibitor is added when the residual iodine content in the composition containing the diiodoaromatic compound and the sulfur compound is within the above content range, the disulfide bond ratio and the iodine content in the final polyarylene sulfide resin can be significantly reduced , so that mechanical properties and processing stability can be improved, or linearity can be significantly enhanced. [ Polyarylene sulfide resin prepared using polymerization inhibitor ]

另一實施例係關於一種藉由使組成物熔融聚合而製備之聚芳硫醚樹脂,該組成物包含二碘芳族化合物、硫化合物及用於聚芳硫醚樹脂之聚合抑制劑。Another embodiment relates to a polyarylene sulfide resin prepared by melt polymerizing a composition comprising a diiodo aromatic compound, a sulfur compound, and a polymerization inhibitor for the polyarylene sulfide resin.

聚芳硫醚樹脂中之雙硫鍵之分率可小於0.27重量%。特定言之,其可為0.26重量%或更小、0.25重量%或更小、0.001至0.25重量%、0.01至0.25重量%、0.01至0.24重量%、0.01至0.23重量%、0.01至0.22重量%、0.01至0.21重量%或0.01至0.20重量%。The fraction of disulfide bonds in the polyarylene sulfide resin may be less than 0.27% by weight. Specifically, it may be 0.26 wt% or less, 0.25 wt% or less, 0.001 to 0.25 wt%, 0.01 to 0.25 wt%, 0.01 to 0.24 wt%, 0.01 to 0.23 wt%, 0.01 to 0.22 wt% , 0.01 to 0.21 wt % or 0.01 to 0.20 wt %.

使用聚合抑制劑製備之聚芳硫醚具有較低分率之雙硫鍵,以使得可抑制在聚芳硫醚樹脂中形成側鏈結構。另外,因為雙硫鍵在樹脂中充當脆性結構,所以具有減少分率之雙硫鍵之聚芳硫醚可在耐熱性及機械特性方面得到改良。The polyarylene sulfide prepared using the polymerization inhibitor has a lower fraction of disulfide bonds, so that the formation of a side chain structure in the polyarylene sulfide resin can be suppressed. In addition, since the disulfide bonds act as a brittle structure in the resin, the polyarylene sulfide having a reduced fraction of the disulfide bonds can be improved in heat resistance and mechanical properties.

另外,聚芳硫醚樹脂可具有大於0.58之分枝比。分枝比為藉由馬克-霍溫克方程式(Mark Howink equation)計算之α值。值愈接近1,聚合物線性程度愈高。值愈接近0,聚合物分枝程度愈高。特定言之,聚芳硫醚樹脂可具有0.59至1.0、0.6至1.0、0.6至0.9、0.6至0.8、0.6至0.75或0.6至0.7之分枝比。In addition, the polyarylene sulfide resin may have a branch ratio greater than 0.58. The branching ratio is the alpha value calculated by the Mark Howink equation. The closer the value is to 1, the more linear the polymer is. The closer the value is to 0, the higher the degree of polymer branching. Specifically, the polyarylene sulfide resin may have a branching ratio of 0.59 to 1.0, 0.6 to 1.0, 0.6 to 0.9, 0.6 to 0.8, 0.6 to 0.75, or 0.6 to 0.7.

在使用聚合抑制劑製備聚芳硫醚樹脂時,在製造聚芳硫醚樹脂期間的減壓步驟中抑制聚合抑制劑之排放,藉此在反應期間提高碘之移除效率或減少聚芳硫醚樹脂中之雙硫鍵之分率。因此,可抑制在聚芳硫醚樹脂中形成側鏈結構,藉此增加分枝比。When the polyarylene sulfide resin is prepared using the polymerization inhibitor, the emission of the polymerization inhibitor is suppressed in the decompression step during the production of the polyarylene sulfide resin, thereby improving the removal efficiency of iodine or reducing the polyarylene sulfide during the reaction The fraction of disulfide bonds in the resin. Therefore, the formation of a side chain structure in the polyarylene sulfide resin can be suppressed, thereby increasing the branching ratio.

另外,聚芳硫醚樹脂可具有小於7,000 ppm之碘含量。特定言之,其可為50至7,000 ppm、100至5,000 ppm、100至2,000 ppm或200至1,000 ppm。Additionally, the polyarylene sulfide resin may have an iodine content of less than 7,000 ppm. Specifically, it may be 50 to 7,000 ppm, 100 to 5,000 ppm, 100 to 2,000 ppm, or 200 to 1,000 ppm.

在使用聚合抑制劑製備聚芳硫醚樹脂時,聚合抑制劑之排放減少,藉此提高碘之移除效率。因此,可減少最終聚芳硫醚樹脂中之碘含量。When the polymerization inhibitor is used to prepare the polyarylene sulfide resin, the emission of the polymerization inhibitor is reduced, thereby improving the removal efficiency of iodine. Therefore, the iodine content in the final polyarylene sulfide resin can be reduced.

另外,當藉由高溫凝膠滲透層析法在1-氯萘之溶劑中來量測,聚芳硫醚樹脂可具有2,000至50,000 g/mol之數目平均分子量。特定言之,其可為3,000至40,000 g/mol、4,000至30,000 g/mol或5,000至20,000 g/mol。In addition, the polyarylene sulfide resin may have a number average molecular weight of 2,000 to 50,000 g/mol when measured by high temperature gel permeation chromatography in a solvent of 1-chloronaphthalene. In particular, it may be 3,000 to 40,000 g/mol, 4,000 to 30,000 g/mol, or 5,000 to 20,000 g/mol.

當藉由高溫凝膠滲透層析法在1-氯萘之溶劑中來量測,聚芳硫醚樹脂可具有5,000至200,000 g/mol之重量平均分子量。特定言之,其可為10,000至150,000 g/mol或20,000至100,000 g/mol。The polyarylene sulfide resin may have a weight average molecular weight of 5,000 to 200,000 g/mol when measured by high temperature gel permeation chromatography in a solvent of 1-chloronaphthalene. In particular, it may be 10,000 to 150,000 g/mol or 20,000 to 100,000 g/mol.

當藉由高溫凝膠滲透層析法在1-氯萘之溶劑中來量測,聚芳硫醚樹脂可具有3,500至125,000 g/mol之峰值分子量。特定言之,其可為8,000至95,000 g/mol或12,500至60,000 g/mol。The polyarylene sulfide resin may have a peak molecular weight of 3,500 to 125,000 g/mol when measured by high temperature gel permeation chromatography in a solvent of 1-chloronaphthalene. In particular, it may be 8,000 to 95,000 g/mol or 12,500 to 60,000 g/mol.

當在300℃下用處於1.84 rad/s之角頻率條件下之旋轉圓盤黏度計來量測,聚芳硫醚樹脂可具有100至50,000泊之熔融黏度。特定言之,其可為500至10,000泊或1,000至5,000泊。The polyarylene sulfide resin can have a melt viscosity of 100 to 50,000 poise when measured with a rotating disk viscometer at an angular frequency of 1.84 rad/s at 300°C. In particular, it may be 500 to 10,000 poise or 1,000 to 5,000 poise.

當藉由以下方程式1在300℃下用旋轉圓盤黏度計量測時來計算,聚芳硫醚樹脂可具有0.001至0.5之非線性指數。特定言之,其可為0.001至0.4、0.001至0.3或0.003至0.2。 [方程式1] 非線性指數= 1 - (17.3 s-1 之剪切速率下之熔融黏度) / (3.22 s-1 之剪切速率下之熔融黏度)The polyarylene sulfide resin may have a nonlinear index of 0.001 to 0.5 when calculated by the following equation 1 measured with a rotating disk viscometer at 300°C. In particular, it may be 0.001 to 0.4, 0.001 to 0.3, or 0.003 to 0.2. [Equation 1] Nonlinear exponent = 1 - (melt viscosity at shear rate of 17.3 s -1 ) / (melt viscosity at shear rate of 3.22 s -1 )

在使用聚合抑制劑製備聚芳硫醚樹脂時,在製造聚芳硫醚樹脂期間的減壓步驟中抑制聚合抑制劑之排放,或在反應期間減少聚芳硫醚樹脂中之雙硫鍵之分率。因此,可抑制在聚芳硫醚樹脂中形成側鏈結構,增強最終聚芳硫醚樹脂之線性。When a polymerization inhibitor is used to prepare a polyarylene sulfide resin, the emission of the polymerization inhibitor is suppressed in the decompression step during the production of the polyarylene sulfide resin, or the disulfide bond in the polyarylene sulfide resin is reduced during the reaction Rate. Therefore, the formation of a side chain structure in the polyarylene sulfide resin can be suppressed, and the linearity of the final polyarylene sulfide resin can be enhanced.

因為使用聚合抑制劑製備之聚芳硫醚樹脂具有比不使用聚合抑制劑製備之聚芳硫醚樹脂之雙硫鍵分率或碘含量更低的雙硫鍵分率或更低的碘含量,從而產生極佳線性。因此,其可具有極佳物理特性,諸如強度及伸長率。因此,使用聚合抑制劑製備之聚芳硫醚樹脂可尤其宜用於纖維及膜。用於 進行本發明之 實施例 Since the polyarylene sulfide resin prepared with the polymerization inhibitor has a lower disulfide bond fraction or iodine content than the polyarylene sulfide resin prepared without the polymerization inhibitor, the disulfide bond fraction or the iodine content is lower, This results in excellent linearity. Therefore, it can have excellent physical properties such as strength and elongation. Therefore, polyarylene sulfide resins prepared using polymerization inhibitors can be particularly suitable for fibers and films. Example embodiments for carrying out the present invention

在下文中,將參考實例詳細描述本發明。以下實例僅為本發明之說明,且本發明之範疇不限於此。實例1 聚芳硫醚 樹脂1 (PAS 1 ) 之合成 Hereinafter, the present invention will be described in detail with reference to examples. The following examples are merely illustrative of the present invention, and the scope of the present invention is not limited thereto. Example 1 : Synthesis of polyarylene sulfide resin 1 (PAS 1 )

向配備有能夠量測反應器內部溫度之熱電偶及能夠進行氮氣吹掃及真空施加之真空管線的5公升反應器中裝入5,240 g對二碘苯及450 g元素硫。將反應器中包含對二碘苯及元素硫之組成物加熱至180℃以使其完全熔融且混合。其後,進行聚合反應,同時將溫度及壓力自220℃及200托之初始反應條件逐漸升高及降低至300至320℃及0.5托之最終反應條件。A 5 liter reactor equipped with a thermocouple capable of measuring the internal temperature of the reactor and a vacuum line capable of nitrogen purging and vacuum application was charged with 5,240 g of p-diiodobenzene and 450 g of elemental sulfur. The composition containing p-diiodobenzene and elemental sulfur in the reactor was heated to 180°C to fully melt and mix. Thereafter, the polymerization reaction was performed while gradually increasing and decreasing the temperature and pressure from the initial reaction conditions of 220° C. and 200 Torr to the final reaction conditions of 300 to 320° C. and 0.5 Torr.

以規定間隔收集聚合反應物之樣品,且藉由離子層析法量測樣品中之碘含量。當按聚合反應物之總重量計,殘餘碘含量達到約5重量%之位準時,添加50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷(化合物(29);TCI產品編號D1102;純度大於98%)。Samples of the polymerized reactants were collected at regular intervals, and the iodine content in the samples was measured by ion chromatography. When the residual iodine content reached a level of about 5% by weight based on the total weight of the polymerization, 50 g of 1,2-bis(2-benzamidephenyl-1-yl)disulfane (compound ( 29); TCI product number D1102; purity greater than 98%).

在相同溫度及壓力下進一步進行反應。當按聚合反應物之總重量計,殘餘碘含量達到約0.5至1重量%時,在氮氣氛圍中在300℃及0.7托下進行反應持續10分鐘。其後,將壓力降至0.5托或更小,且進一步進行反應持續1小時。隨後,終止反應,且使用線料切粒機(small strand cutter)將由此製備之樹脂加工成丸粒,得到約1,540 g聚芳硫醚樹脂。實例2 聚芳硫醚 樹脂2 (PAS 2 ) 之合成 The reaction was further carried out at the same temperature and pressure. When the residual iodine content reached about 0.5 to 1 wt % based on the total weight of the polymerization reactants, the reaction was carried out for 10 minutes at 300° C. and 0.7 Torr in a nitrogen atmosphere. After that, the pressure was reduced to 0.5 Torr or less, and the reaction was further carried out for 1 hour. Subsequently, the reaction was terminated, and the resin thus prepared was processed into pellets using a small strand cutter to obtain about 1,540 g of a polyarylene sulfide resin. Example 2 : Synthesis of Polyarylene Sulfide Resin 2 (PAS 2 )

以與實例1中相同之方式獲得約1,550 g聚芳硫醚樹脂,不同之處在於:當按聚合反應物之總重量計,殘餘碘含量達到約10重量%時,將50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷添加至反應器中。實例3 聚芳硫醚 樹脂3 (PAS 3 ) 之合成 About 1,550 g of polyarylene sulfide resin was obtained in the same manner as in Example 1, except that when the residual iodine content reached about 10% by weight based on the total weight of the polymerized reactants, 50 g of 1,2- Bis(2-benzamidephenyl-1-yl)disulfane was added to the reactor. Example 3 : Synthesis of polyarylene sulfide resin 3 (PAS 3 )

以與實例1中相同之方式獲得約1,490 g聚芳硫醚樹脂,不同之處在於:在初始階段將50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷與二碘苯及元素硫一起添加至反應器中。實例4 聚芳硫醚 樹脂4 (PAS 4 ) 之合成 About 1,490 g of polyarylene sulfide resin were obtained in the same manner as in Example 1, except that 50 g of 1,2-bis(2-benzamidephenyl-1-yl)disulfide were added in the initial stage Alkane is added to the reactor along with diiodobenzene and elemental sulfur. Example 4 : Synthesis of polyarylene sulfide resin 4 (PAS 4 )

以與實例1中相同之方式獲得約1,600 g聚芳硫醚樹脂,不同之處在於:使用52 g 1,2-雙(3-(三乙氧基矽基)丙基)二硫烷(化合物(22);Power Chemical(中國公司)之SiSiB-PC2200)代替50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷。實例5 聚芳硫醚 樹脂5 (PAS 5 ) 之合成 About 1,600 g of polyarylene sulfide resin was obtained in the same manner as in Example 1, except that 52 g of 1,2-bis(3-(triethoxysilyl)propyl)disulfane (compound (22); SiSiB-PC2200 of Power Chemical (China Company) in place of 50 g of 1,2-bis(2-benzamidephenyl-1-yl)disulfane. Example 5 : Synthesis of polyarylene sulfide resin 5 (PAS 5 )

以與實例2中相同之方式獲得約1,600 g聚芳硫醚樹脂,不同之處在於:使用52 g 1,2-雙(3-(三乙氧基矽基)丙基)二硫烷(化合物(22))代替50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷。實例6 聚芳硫醚 樹脂6 (PAS 6 ) 之合成 About 1,600 g of polyarylene sulfide resin was obtained in the same manner as in Example 2, except that 52 g of 1,2-bis(3-(triethoxysilyl)propyl)disulfane (compound (22)) in place of 50 g of 1,2-bis(2-benzamidephenyl-1-yl)disulfane. Example 6 : Synthesis of polyarylene sulfide resin 6 (PAS 6 )

以與實例1中相同之方式獲得約1,580 g聚芳硫醚樹脂,不同之處在於:使用35 g 1-(萘-2-基)-2-(萘-2-基)二硫烷(化合物(1);Sigma-Aldrich產品編號S838594)代替50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷。實例7 聚芳硫醚 樹脂7 (PAS 7 ) 之合成 About 1,580 g of polyarylene sulfide resin were obtained in the same manner as in Example 1, except that 35 g of 1-(naphthalen-2-yl)-2-(naphthalen-2-yl)disulfane (compound (1); Sigma-Aldrich Prod. No. S838594) instead of 50 g of 1,2-bis(2-benzamidephenyl-1-yl)disulfane. Example 7 : Synthesis of polyarylene sulfide resin 7 (PAS 7 )

以與實例1中相同之方式獲得約1,540 g聚芳硫醚樹脂,不同之處在於:使用52 g 3-(三乙氧基矽基)丙烷-1-硫醇(化合物(17);Power Chemical(中國公司)之SiSiB-PC2310)代替50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷。實例8 聚芳硫醚 樹脂8 (PAS 8 ) 之合成 About 1,540 g of polyarylene sulfide resin were obtained in the same manner as in Example 1, except that 52 g of 3-(triethoxysilyl)propane-1-thiol (compound (17); Power Chemical (Chinese company) SiSiB-PC2310) instead of 50 g of 1,2-bis(2-benzylaminophenyl-1-yl)disulfane. Example 8 : Synthesis of polyarylene sulfide resin 8 (PAS 8 )

以與實例1中相同之方式獲得約1,510 g聚芳硫醚樹脂,不同之處在於:使用52 g 4-碘苯硫酚(化合物(26);根據Hiremath, R.等人,Chem . Mater . 2004 ,16 , 4948-4954中所描述之方法合成)代替50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷。比較實例1 聚芳硫醚 樹脂9 (PAS 9 ) 之合成 About 1,510 g of polyarylene sulfide resin were obtained in the same manner as in Example 1, except that 52 g of 4-iodothiophenol (compound (26); according to Hiremath, R. et al., Chem . Mater . 2004 , 16 , 4948-4954 described in the synthesis) instead of 50 g of 1,2-bis(2-benzamidephenyl-1-yl)disulfane. Comparative Example 1 : Synthesis of Polyarylene Sulfide Resin 9 (PAS 9 )

以與實例1中相同之方式獲得約1,420 g聚芳硫醚樹脂,不同之處在於:使用24 g二苯二硫醚(Sigma-Aldrich產品編號169021)代替50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷。比較實例2 聚芳硫醚 樹脂10 (PAS 10 ) 之合成 About 1,420 g of polyarylene sulfide resin were obtained in the same manner as in Example 1, except that 24 g of diphenyl disulfide (Sigma-Aldrich product number 169021) was used instead of 50 g of 1,2-bis(2- benzamidophenyl-1-yl)disulfane. Comparative Example 2 : Synthesis of Polyarylene Sulfide Resin 10 (PAS 10 )

以與實例2中相同之方式獲得約1,430 g聚芳硫醚樹脂,不同之處在於:使用24 g二苯二硫醚代替50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷。比較實例3 聚芳硫醚 樹脂11 (PAS 11 ) 之合成 About 1,430 g of polyarylene sulfide resin was obtained in the same manner as in Example 2, except that 24 g of diphenyl disulfide was used instead of 50 g of 1,2-bis(2-benzylaminophenyl-1) - base) disulfane. Comparative Example 3 : Synthesis of Polyarylene Sulfide Resin 11 (PAS 11 )

以與實例3中相同之方式獲得約1,430 g聚芳硫醚樹脂,不同之處在於:使用24 g二苯二硫醚代替50 g 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷。[ 測試實例 ] About 1,430 g of polyarylene sulfide resin were obtained in the same manner as in Example 3, except that 24 g of diphenyl disulfide was used instead of 50 g of 1,2-bis(2-benzylaminophenyl-1) - base) disulfane. [ Test example ]

根據實例1至8及比較實例1至3製備之聚芳硫醚樹脂1至11係藉由以下方法針對熔點、熔融黏度、非線性指數、分子量、分枝比、雙硫鍵分率及碘含量進行量測。結果展示於下表2中。( 1 ) 熔點 (Tm ) The polyarylene sulfide resins 1 to 11 prepared according to Examples 1 to 8 and Comparative Examples 1 to 3 were measured for melting point, melt viscosity, nonlinear index, molecular weight, branch ratio, disulfide bond fraction, and iodine content by the following methods Take measurements. The results are shown in Table 2 below. ( 1 ) Melting point (Tm )

在差示掃描量熱計(DSC,TA Instrument之Q20型號)中,以10℃/分鐘之速率將溫度自30℃升高至320℃,且隨後將溫度冷卻至30℃,接著以10℃/分鐘之速率將溫度自30℃再次升高至320℃,以量測熔點。( 2 ) 熔融黏度 ( MV ) 及非線性指數 In a differential scanning calorimeter (DSC, model Q20 from TA Instrument), the temperature was increased from 30°C to 320°C at a rate of 10°C/min, and then the temperature was cooled to 30°C, followed by 10°C/min The temperature was raised again from 30°C to 320°C at a rate of minutes to measure the melting point. ( 2 ) melt viscosity ( MV ) and nonlinear index

當藉由頻率掃描法在300℃下用旋轉圓盤黏度計在0.6至500 rad/s之角頻率範圍內量測黏度時,熔融黏度定義為1.84 rad/s之角頻率條件下之黏度。The melt viscosity is defined as the viscosity at an angular frequency of 1.84 rad/s when the viscosity is measured by the frequency sweep method at 300°C with a rotating disk viscometer in the angular frequency range of 0.6 to 500 rad/s.

非線性指數係藉由以下方程式1計算。 [方程式1] 非線性指數= 1 - (17.3 s-1 之剪切速率下之熔融黏度) / (3.22 s-1 之剪切速率下之熔融黏度)(3 ) 數目平均分子量 (Mn ) 、重量平均分子量 (Mw ) 及峰值分子量 (Mp ) The nonlinear index is calculated by Equation 1 below. [Equation 1] Nonlinear index = 1 - (melt viscosity at shear rate of 17.3 s -1 ) / (melt viscosity at shear rate of 3.22 s -1 ) (3 ) number average molecular weight (Mn ) , weight Average Molecular Weight (Mw ) and Peak Molecular Weight (Mp )

藉由凝膠滲透層析法在以下量測條件下量測聚芳硫醚樹脂之數目平均分子量、重量平均分子量及峰值分子量。在分子量之所有量測中,使用六種類型之單分散聚苯乙烯校準。 [凝膠滲透層析法之量測條件] 儀器:Agilent PL-220 管柱:Agilent,PLgel孔徑105Å + 104Å + 500Å + 50Å (4種管柱) 管柱溫度:210℃ 溶劑:1-氯萘 量測方法:三重系統偵測器(RI、黏度計、光散射器15°及90°)(4 ) 分枝比 ( α ) The number average molecular weight, weight average molecular weight and peak molecular weight of the polyarylene sulfide resin were measured by gel permeation chromatography under the following measurement conditions. In all measurements of molecular weight, six types of monodisperse polystyrene were used for calibration. [Measurement conditions for gel permeation chromatography] Instrument: Agilent PL-220 Column: Agilent, PLgel pore size 105Å + 104Å + 500Å + 50Å (4 types of columns) Column temperature: 210°C Solvent: 1-chloronaphthalene Measurement method: triple system detector (RI, viscometer, light scatterer 15° and 90°) (4 ) Branch ratio ( α )

分枝比定義為藉由將根據三重系統偵測器量測之黏度應用於以下方程式2之馬克-霍溫克方程式而計算之α值。馬克-霍溫克方程式為聚合物之分子量與固有黏度之間的關係式,且分枝比(α)表示聚合物之分枝程度。亦即,值愈接近1,聚合物線性程度愈高。值愈接近0,聚合物分枝程度愈高。 [方程式2] [η] = KХMαThe branching ratio is defined as the value of alpha calculated by applying the viscosity measured according to the triple system detector to the Mark-Houwink equation of Equation 2 below. The Mark-Houwink equation is the relationship between the molecular weight of the polymer and the intrinsic viscosity, and the branching ratio (α) represents the degree of branching of the polymer. That is, the closer the value is to 1, the more linear the polymer is. The closer the value is to 0, the higher the degree of polymer branching. [Equation 2] [η] = KХMα

在以上方程式中,η為固有黏度,M為重量平均分子量,且K為常數。( 5 ) 雙硫鍵 ( -S -S - ) 分率 In the above equation, η is the intrinsic viscosity, M is the weight average molecular weight, and K is a constant. (5) disulfide bonds (-S -S -) fraction

雙硫鍵分率係藉由以下方程式3計算。 [方程式3] 雙硫鍵分率(重量%) = {(由元素分析偵測之硫之總重量) - (聚芳硫醚中之硫之理論重量)} / (聚芳硫醚中之硫之理論重量)(6 ) 碘含量 The disulfide bond fraction is calculated by Equation 3 below. [Equation 3] Disulfide bond fraction (wt%) = {(total weight of sulfur detected by elemental analysis) - (theoretical weight of sulfur in polyarylene sulfide)} / (sulfur in polyarylene sulfide The theoretical weight) (6 ) iodine content

聚芳硫醚樹脂中之碘含量係藉由離子層析法(IC)使用Thermo Scientific之IC (AQF)及ICS-2500 (Mitsubishi AQF-100)來量測。 [表2]   Tm (℃) MV (poise) -S-S-之分率 (重量%) 碘含量(ppm) Mn (g/mol) Mw (g/mol) Mp (g/mol) α 非線性指數 實例1 280.2 2,010 0.18 800 10,068 42,156 26,588 0.67 0.09 實例2 279.5 1,980 0.13 560 8,866 41,752 27,163 0.63 0.11 實例3 279.3 2,200 0.05 249 8,373 43,834 26,305 0.61 0.13 實例4 281.4 1,910 0.19 990 10,116 38,165 28,051 0.68 0.07 實例5 280.9 1,898 0.12 610 9,611 40,637 28,354 0.66 0.08 實例6 282.0 2,090 0.16 700 8,608 39,965 26,874 0.67 0.09 實例7 282.5 1,965 0.12 1,300 9,890 44,899 29,798 0.63 0.11 實例8 282.3 1,890 0.02 2,500 11,090 46,020 29,087 0.60 0.09 比較實例1 281.5 2,190 0.29 2,300 10,800 43,029 27,200 0.58 0.12 比較實例2 281.2 2,200 0.28 1,800 9,800 42,390 26,884 0.55 0.14 比較實例3 280.8 1,990 0.27 1,400 8,990 39,020 27,790 0.51 0.17 The iodine content in the polyarylene sulfide resin was measured by ion chromatography (IC) using Thermo Scientific IC (AQF) and ICS-2500 (Mitsubishi AQF-100). [Table 2] Tm (°C) MV (poise) -SS- fraction (wt%) Iodine content (ppm) Mn (g/mol) Mw (g/mol) Mp (g/mol) alpha nonlinear index Example 1 280.2 2,010 0.18 800 10,068 42,156 26,588 0.67 0.09 Example 2 279.5 1,980 0.13 560 8,866 41,752 27,163 0.63 0.11 Example 3 279.3 2,200 0.05 249 8,373 43,834 26,305 0.61 0.13 Example 4 281.4 1,910 0.19 990 10,116 38,165 28,051 0.68 0.07 Example 5 280.9 1,898 0.12 610 9,611 40,637 28,354 0.66 0.08 Example 6 282.0 2,090 0.16 700 8,608 39,965 26,874 0.67 0.09 Example 7 282.5 1,965 0.12 1,300 9,890 44,899 29,798 0.63 0.11 Example 8 282.3 1,890 0.02 2,500 11,090 46,020 29,087 0.60 0.09 Comparative Example 1 281.5 2,190 0.29 2,300 10,800 43,029 27,200 0.58 0.12 Comparative Example 2 281.2 2,200 0.28 1,800 9,800 42,390 26,884 0.55 0.14 Comparative Example 3 280.8 1,990 0.27 1,400 8,990 39,020 27,790 0.51 0.17

在除聚合抑制劑種類以外之相同條件下製備之實例1、4及6至8以及比較實例1之聚芳硫醚樹脂中,使用由式1至4中之一者表示之化合物製備之實例1、4及6至8之聚芳硫醚樹脂具有極佳線性,此係因為其具有比比較實例1之聚芳硫醚樹脂更低的非線性指數及顯著更高的分枝比。Among the polyarylene sulfide resins of Examples 1, 4, and 6 to 8 and Comparative Example 1 prepared under the same conditions except for the kind of polymerization inhibitor, Example 1 prepared using a compound represented by one of Formulae 1 to 4 The polyarylene sulfide resins of , 4, and 6 to 8 have excellent linearity because they have a lower nonlinear index and a significantly higher branching ratio than the polyarylene sulfide resin of Comparative Example 1.

特定言之,使用由式1至3中之一者表示之化合物製備之實例1、4、6及7之聚芳硫醚樹脂具有比比較實例1之聚芳硫醚樹脂顯著更低的碘含量。同時,使用由式4表示之化合物製備之實例8之聚芳硫醚樹脂具有比比較實例1之聚芳硫醚樹脂顯著更低的雙硫鍵分率。In particular, the polyarylene sulfide resins of Examples 1, 4, 6 and 7 prepared using compounds represented by one of formulae 1 to 3 had significantly lower iodine content than the polyarylene sulfide resin of Comparative Example 1 . Meanwhile, the polyarylene sulfide resin of Example 8 prepared using the compound represented by Formula 4 had a significantly lower disulfide bond ratio than the polyarylene sulfide resin of Comparative Example 1.

在除聚合抑制劑種類以外之相同條件下製備之實例2及5以及比較實例2之聚芳硫醚樹脂中,或在除聚合抑制劑種類以外之相同條件下製備之實例2及比較實例3之聚芳硫醚樹脂中,其展示出相同趨勢。In the polyarylene sulfide resins of Examples 2 and 5 and Comparative Example 2 prepared under the same conditions except for the kind of polymerization inhibitor, or in Example 2 and Comparative Example 3 prepared under the same conditions except for the kind of polymerization inhibitor In the polyarylene sulfide resin, it exhibits the same trend.

同時,在除添加聚合抑制劑之時序以外之相同條件下製備之實例1至3之聚芳硫醚樹脂中,添加聚合抑制劑愈晚,非線性指數愈低,且分子量及分枝比愈高,從而產生較佳線性;且添加聚合抑制劑愈早,雙硫鍵分率及碘含量顯著愈低。Meanwhile, in the polyarylene sulfide resins of Examples 1 to 3 prepared under the same conditions except for the timing of adding the polymerization inhibitor, the later the polymerization inhibitor was added, the lower the nonlinear index and the higher the molecular weight and branching ratio. , resulting in better linearity; and the earlier the polymerization inhibitor is added, the lower the disulfide bond fraction and the iodine content.

在實例4及5之結果以及比較實例1至3之結果中證實了相同趨勢。The same trend is confirmed in the results of Examples 4 and 5 and the results of Comparative Examples 1-3.

Claims (14)

一種用於一聚芳硫醚樹脂之聚合抑制劑,其包含一由式1至4中之一者表示之化合物: [式1]
Figure 03_image001
其中X1 及X2 各自獨立地選自由以下組成之群:一氫基、一鹵基、一具有1至3個碳原子之烷基、-OA1 、-SA2 、-COOA3 、-NA4 A5 、-SO3 A6 及-NHCOA7 , Z1 至Z4 各自獨立地選自由以下組成之群:一氫基、一具有1或2個碳原子之經取代或未經取代烷基及一具有1或2個碳原子之經取代或未經取代烯基,及 p1 及p2 各自獨立地為1或2, 其中當Z1 及Z2 為一具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其等能夠彼此連接以形成一苯環, 當Z3 及Z4 為一具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其等能夠彼此連接以形成一苯環,及 A1 至A7 各自獨立地選自由以下組成之群:一氫基、一鈉陽離子、一鋰陽離子、一具有1至3個碳原子之經取代或未經取代烷基、一經取代或未經取代苯基及一經取代或未經取代萘基, 其中A1 至A7 之該具有1至3個碳原子之經取代烷基、該經取代苯基及該經取代萘基各自獨立地具有選自由一硫醇基及一苯基硫醚基組成之群的一取代基,及 Z1 至Z4 之該具有1或2個碳原子之經取代烷基及該具有1或2個碳原子之經取代烯基各自獨立地具有選自由以下組成之群的一取代基:一鹵基、一羥基、一硫醇基、一羧基、一胺基及一磺酸基, 其限制條件為當X1 及X2 均為氫原子時,Z1 及Z2 以及Z3 及Z4 中之至少一者形成一經取代或未經取代苯環; [式2]
Figure 03_image003
其中R1 至R4 各自獨立地選自由以下組成之群:一氫基、一鹵基、一具有1至5個碳原子之經取代或未經取代烷基、-OA8 、-SA9 、-COOA10 、-NA11 A12 、-SO3 A13 及-NHCOA14 , 其中A8 至A14 各自獨立地選自由以下組成之群:一氫基、一鈉陽離子、一鋰陽離子及一具有1至3個碳原子之經取代或未經取代烷基,及 R1 至R4 中之該具有1至5個碳原子之經取代烷基及A8 至A14 中之該具有1至3個碳原子之經取代烷基各自獨立地具有一硫醇基作為一取代基, 其限制條件為R1 至R4 中之至少一者為一具有1至5個碳原子之經取代烷基,或R1 至R4 中之至少一者係選自由以下組成之群:-OA8 、-SA9 、-COOA10 、-NA11 A12 、-SO3 A13 及-NHCOA14 ,而A8 至A14 為一具有1至3個碳原子之經取代烷基; [式3]
Figure 03_image005
其中X7 至X12 各自獨立地選自由以下組成之群:一氫基、一鹵基、一具有1至5個碳原子之烷基、-OA15 、-SA16 、-COOA17 、-NA18 A19 、-SO3 A20 及-NHCOA21 ,及 R5 及R6 各自獨立地為一具有1至5個碳原子之伸烷基, 其中A15 至A21 各自獨立地選自由以下組成之群:一氫基、一鈉陽離子、一鋰陽離子及一具有1至5個碳原子之經取代或未經取代烷基,及 A15 至A21 中之該具有1至5個碳原子之經取代烷基各自獨立地具有一硫醇基作為一取代基;及 [式4]
Figure 03_image007
其中X13 各自獨立地選自由以下組成之群:一氫基、一鹵基、一具有1至5個碳原子之烷基、OA22 、-SA23 、-COOA24 、-NA25 A26 、-SO3 A27 及-NHCOA28 , Z5 及Z6 各自獨立地選自由以下組成之群:一氫基、一具有1或2個碳原子之經取代或未經取代烷基及一具有1或2個碳原子之經取代或未經取代烯基, w為一鹵基,及 q各自獨立地為1至3之一整數, 其中當Z5 及Z6 為一具有2個碳原子之烯基且鍵結至二個相鄰碳原子時,其等能夠彼此連接以形成一苯環, A22 、A24 及A25 各自獨立地選自由以下組成之群:一鈉陽離子、一鋰陽離子、一具有1至5個碳原子之經取代或未經取代烷基、一經取代或未經取代苯基及一經取代或未經取代萘基,及 A23 及A26 至A28 各自獨立地選自由以下組成之群:一氫基、一鈉陽離子、一鋰陽離子、一具有1至5個碳原子之經取代或未經取代烷基、一經取代或未經取代苯基及一經取代或未經取代萘基, 其中A22 至A28 之該具有1至5個碳原子之經取代烷基、該經取代苯基及該經取代萘基各自獨立地具有選自由一硫醇基及一苯基硫醚基組成之群的一取代基,及 Z5 至Z6 之該具有1或2個碳原子之經取代烷基及該具有1或2個碳原子之經取代烯基各自獨立地具有選自由以下組成之群的一取代基:一鹵基、一羥基、一硫醇基、一羧基、一胺基及一磺酸基。
A polymerization inhibitor for a polyarylene sulfide resin, comprising a compound represented by one of formulae 1 to 4: [Formula 1]
Figure 03_image001
wherein X 1 and X 2 are each independently selected from the group consisting of: a hydrogen group, a halogen group, an alkyl group having 1 to 3 carbon atoms, -OA 1 , -SA 2 , -COOA 3 , -NA 4 A 5 , -SO 3 A 6 and -NHCOA 7 , Z 1 to Z 4 are each independently selected from the group consisting of a hydrogen group, a substituted or unsubstituted alkyl group having 1 or 2 carbon atoms and a substituted or unsubstituted alkenyl group having 1 or 2 carbon atoms, and p 1 and p 2 are each independently 1 or 2, wherein when Z 1 and Z 2 are an alkenyl group having 2 carbon atoms and when bonded to two adjacent carbon atoms, they can be connected to each other to form a benzene ring, when Z 3 and Z 4 are an alkenyl group having 2 carbon atoms and are bonded to two adjacent carbon atoms , which can be attached to each other to form a benzene ring, and A 1 to A 7 are each independently selected from the group consisting of: a hydrogen group, a sodium cation, a lithium cation, a meridian having 1 to 3 carbon atoms Substituted or unsubstituted alkyl, one substituted or unsubstituted phenyl and one substituted or unsubstituted naphthyl, wherein A 1 to A 7 the substituted alkyl group having 1 to 3 carbon atoms, the substituted or unsubstituted The phenyl group and the substituted naphthyl group each independently have a substituent selected from the group consisting of a thiol group and a phenyl sulfide group, and the substituents of Z 1 to Z 4 having 1 or 2 carbon atoms The substituted alkyl and the substituted alkenyl having 1 or 2 carbon atoms each independently have a substituent selected from the group consisting of: a halogen, a hydroxyl, a thiol, a carboxyl, a amine and a sulfonic acid group, with the limitation that when X 1 and X 2 are both hydrogen atoms, at least one of Z 1 and Z 2 and Z 3 and Z 4 forms a substituted or unsubstituted benzene ring; [Formula 2]
Figure 03_image003
wherein R 1 to R 4 are each independently selected from the group consisting of a hydrogen group, a halogen group, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, -OA 8 , -SA 9 , -COOA 10 , -NA 11 A 12 , -SO 3 A 13 and -NHCOA 14 , wherein A 8 to A 14 are each independently selected from the group consisting of: a hydrogen group, a sodium cation, a lithium cation, and a group having A substituted or unsubstituted alkyl group of 1 to 3 carbon atoms, and the substituted alkyl group of R 1 to R 4 with 1 to 5 carbon atoms and the substituted alkyl group of A 8 to A 14 with 1 to 3 carbon atoms The substituted alkyl groups of 1 carbon atoms each independently have a thiol group as a substituent, provided that at least one of R 1 to R 4 is a substituted alkyl group having 1 to 5 carbon atoms, or at least one of R 1 to R 4 is selected from the group consisting of -OA 8 , -SA 9 , -COOA 10 , -NA 11 A 12 , -SO 3 A 13 and -NHCOA 14 , and A 8 to A 14 is a substituted alkyl group having 1 to 3 carbon atoms; [Formula 3]
Figure 03_image005
wherein X 7 to X 12 are each independently selected from the group consisting of: a hydrogen group, a halogen group, an alkyl group having 1 to 5 carbon atoms, -OA 15 , -SA 16 , -COOA 17 , -NA 18 A 19 , -SO 3 A 20 and -NHCOA 21 , and R 5 and R 6 are each independently an alkylene group having 1 to 5 carbon atoms, wherein A 15 to A 21 are each independently selected from the following composition The group: a hydrogen group, a sodium cation, a lithium cation and a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, and the one having 1 to 5 carbon atoms in A 15 to A 21 The substituted alkyl groups each independently have a thiol group as a substituent; and [Formula 4]
Figure 03_image007
wherein X 13 is each independently selected from the group consisting of: a hydrogen group, a halogen group, an alkyl group having 1 to 5 carbon atoms, OA 22 , -SA 23 , -COOA 24 , -NA 25 A 26 , -SO 3 A 27 and -NHCOA 28 , Z 5 and Z 6 are each independently selected from the group consisting of a hydrogen group, a substituted or unsubstituted alkyl group having 1 or 2 carbon atoms, and a group having 1 or substituted or unsubstituted alkenyl of 2 carbon atoms, w is a halogen group, and q is each independently an integer from 1 to 3, wherein when Z 5 and Z 6 are an alkene having 2 carbon atoms When bonded to two adjacent carbon atoms, which can be linked to each other to form a benzene ring, A 22 , A 24 and A 25 are each independently selected from the group consisting of: a sodium cation, a lithium cation, A substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, a substituted or unsubstituted phenyl group, and a substituted or unsubstituted naphthyl group, and A 23 and A 26 to A 28 are each independently selected from The group consisting of: a hydrogen group, a sodium cation, a lithium cation, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, a substituted or unsubstituted phenyl group, and a substituted or unsubstituted phenyl group Naphthyl, wherein A 22 to A 28 of the substituted alkyl group having 1 to 5 carbon atoms, the substituted phenyl group and the substituted naphthyl group each independently have a thiol group and a phenylthio group selected from A substituent of the group consisting of ether groups, and the substituted alkyl group with 1 or 2 carbon atoms of Z 5 to Z 6 and the substituted alkenyl group with 1 or 2 carbon atoms each independently have a group selected from A monosubstituent of the group consisting of a halogen group, a hydroxyl group, a thiol group, a carboxyl group, an amine group and a sulfonic acid group.
如請求項1之用於一聚芳硫醚樹脂之聚合抑制劑,其中該由式1至4中之一者表示之化合物為選自以下化合物(1)至(31)中之至少一者: (1) 1-(萘-2-基)-2-(萘-2-基)二硫烷 (2) 1-(萘-1-基)-2-(萘-1-基)二硫烷 (3) 1-(萘-1-基)-2-(萘-2-基)二硫烷 (4) 1-(萘-1-基)-2-苯二硫烷 (5) 1,2-雙(2-碘萘-6-基)二硫烷 (6) 1,2-雙(1-碘萘-5-基)二硫烷 (7) 1-(1-碘萘-5-基)-2-(2-碘萘-6-基)二硫烷 (8) 1-(1-碘萘-5-基)-2-(4-碘苯基)二硫烷 (9) 1,2-雙(2-羧基萘-6-基)二硫烷 (10) 1,2-雙(2-羥基萘-6-基)二硫烷 (11) 1,2-雙(2-胺基萘-6-基)二硫烷 (12) 1,2-雙(2-巰基萘-6-基)二硫烷 (13) 1,2-雙(1-羧基萘-4-基)二硫烷 (14) 4-(2-(1-羥基萘-4-基)二硫烷基)萘-1-甲酸 (15) 4-(2-(1-羥基萘-2-基)二硫烷基)萘-1-醇 (16) 5-(2-(2-羥基萘-6-基)二硫烷基)萘-1-醇 (17) 3-(三乙氧基矽基)丙烷-1-硫醇 (18) 3-(三甲氧基矽基)丙烷-1-硫醇 (19) 3-(羥二甲氧基矽基)丙烷-1-硫醇 (20) 3-(三羥基矽基)丙烷-1-硫醇 (21) 3-(二羥基矽基)丙烷-1-硫醇 (22) 1,2-雙(3-(三乙氧基矽基)丙基)二硫烷 (23) 1,2-雙(3-(三羥基矽基)丙基)二硫烷 (24) 1,2-雙(3-(三甲氧基矽基)丙基)二硫烷 (25) 1-(3-(三乙氧基矽基)丙基)-2-(3-(三羥基矽基)丙基)二硫烷 (26) 4-碘苯硫酚 (27) 1-乙氧基-4-碘苯 (28) 乙基(4-碘苯基)硫烷 (29) 1,2-雙(2-苯甲醯胺苯基-1-基)二硫烷 (30) 1,2-雙(2-萘醯胺苯-1-基)二硫烷 (31) 1,2-雙(2-(4-(苯硫基)苯甲醯胺基)苯基-1-基)二硫烷The polymerization inhibitor for a polyarylene sulfide resin according to claim 1, wherein the compound represented by one of formulae 1 to 4 is at least one selected from the following compounds (1) to (31): (1) 1-(Naphthalene-2-yl)-2-(naphthalene-2-yl)disulfane (2) 1-(Naphthalene-1-yl)-2-(naphthalene-1-yl)disulfane (3) 1-(Naphthalene-1-yl)-2-(naphthalene-2-yl)disulfane (4) 1-(Naphthalene-1-yl)-2-benzenedisulfane (5) 1,2-bis(2-iodonaphthalen-6-yl)disulfane (6) 1,2-bis(1-iodonaphthalen-5-yl)disulfane (7) 1-(1-iodonaphthalen-5-yl)-2-(2-iodonaphthalene-6-yl)disulfane (8) 1-(1-iodonaphthalen-5-yl)-2-(4-iodophenyl)disulfane (9) 1,2-bis(2-carboxynaphthalen-6-yl)disulfane (10) 1,2-bis(2-hydroxynaphthalen-6-yl)disulfane (11) 1,2-bis(2-aminonaphthalen-6-yl)disulfane (12) 1,2-bis(2-mercaptonaphthalen-6-yl)disulfane (13) 1,2-bis(1-carboxynaphthalen-4-yl)disulfane (14) 4-(2-(1-Hydroxynaphthalen-4-yl)disulfanyl)naphthalene-1-carboxylic acid (15) 4-(2-(1-Hydroxynaphthalen-2-yl)disulfanyl)naphthalene-1-ol (16) 5-(2-(2-Hydroxynaphthalen-6-yl)disulfanyl)naphthalene-1-ol (17) 3-(Triethoxysilyl)propane-1-thiol (18) 3-(Trimethoxysilyl)propane-1-thiol (19) 3-(Hydroxydimethoxysilyl)propane-1-thiol (20) 3-(Trihydroxysilyl)propane-1-thiol (21) 3-(Dihydroxysilyl)propane-1-thiol (22) 1,2-bis(3-(triethoxysilyl)propyl)disulfane (23) 1,2-Bis(3-(trihydroxysilyl)propyl)disulfane (24) 1,2-Bis(3-(trimethoxysilyl)propyl)disulfane (25) 1-(3-(Triethoxysilyl)propyl)-2-(3-(trihydroxysilyl)propyl)disulfane (26) 4-Iodothiophenol (27) 1-ethoxy-4-iodobenzene (28) Ethyl(4-iodophenyl)sulfane (29) 1,2-Bis(2-benzylaminophenyl-1-yl)disulfane (30) 1,2-Bis(2-naphtholin-1-yl)disulfane (31) 1,2-bis(2-(4-(phenylthio)benzylamino)phenyl-1-yl)disulfane 一種聚芳硫醚樹脂組成物,其包含一二碘芳族化合物、一硫化合物及如請求項1之用於一聚芳硫醚樹脂之聚合抑制劑。A polyarylene sulfide resin composition comprising a diiodo aromatic compound, a monosulfur compound and the polymerization inhibitor for a polyarylene sulfide resin as claimed in claim 1. 如請求項3之聚芳硫醚樹脂組成物,其中按該組成物之總重量計,含有0.00001至5重量%之一量的該聚合抑制劑。The polyarylene sulfide resin composition of claim 3, wherein the polymerization inhibitor is contained in an amount of 0.00001 to 5% by weight based on the total weight of the composition. 一種用於製備一聚芳硫醚樹脂之方法,其包含使包含一二碘芳族化合物、一硫化合物及如請求項1之用於一聚芳硫醚樹脂之聚合抑制劑的一組成物熔融聚合。A method for preparing a polyarylene sulfide resin, comprising melting a composition comprising a diiodo aromatic compound, a monosulfur compound and a polymerization inhibitor for a polyarylene sulfide resin as claimed in claim 1 polymerization. 如請求項5之用於製備一聚芳硫醚樹脂之方法,其中該熔融聚合步驟係在180至400℃之一溫度及0.001至500托之一壓力下的高溫及減壓條件下進行。The method for preparing a polyarylene sulfide resin according to claim 5, wherein the melt polymerization step is carried out under high temperature and reduced pressure conditions at a temperature of 180 to 400° C. and a pressure of 0.001 to 500 Torr. 一種聚芳硫醚樹脂,其係藉由使包含一二碘芳族化合物、一硫化合物及如請求項1之用於一聚芳硫醚樹脂之聚合抑制劑的一組成物熔融聚合來製備。A polyarylene sulfide resin prepared by melt-polymerizing a composition comprising a diiodo aromatic compound, a monosulfur compound, and the polymerization inhibitor for a polyarylene sulfide resin as claimed in claim 1. 如請求項7之聚芳硫醚樹脂,其中該聚芳硫醚樹脂中之一雙硫鍵之分率為0.001至0.25重量%。The polyarylene sulfide resin of claim 7, wherein the content of a disulfide bond in the polyarylene sulfide resin is 0.001 to 0.25% by weight. 如請求項7之聚芳硫醚樹脂,其中該聚芳硫醚樹脂之分枝比為0.6至1.0。The polyarylene sulfide resin of claim 7, wherein the branching ratio of the polyarylene sulfide resin is 0.6 to 1.0. 如請求項7之聚芳硫醚樹脂,其中該聚芳硫醚樹脂中之碘含量為50至7,000 ppm。The polyarylene sulfide resin of claim 7, wherein the iodine content in the polyarylene sulfide resin is 50 to 7,000 ppm. 如請求項7之聚芳硫醚樹脂,當藉由高溫凝膠滲透層析法在1-氯萘之一溶劑中來量測,其具有5,000至20,000 g/mol之一數目平均分子量。The polyarylene sulfide resin of claim 7, when measured by high temperature gel permeation chromatography in 1-chloronaphthalene as a solvent, has a number average molecular weight of 5,000 to 20,000 g/mol. 如請求項7之聚芳硫醚樹脂,當藉由高溫凝膠滲透層析法在1-氯萘之一溶劑中來量測,其具有20,000至100,000 g/mol之一重量平均分子量。The polyarylene sulfide resin of claim 7, when measured by high temperature gel permeation chromatography in 1-chloronaphthalene as a solvent, has a weight average molecular weight of 20,000 to 100,000 g/mol. 如請求項7之聚芳硫醚樹脂,當在300℃下用處於1.84 rad/s之一角頻率條件下之一旋轉圓盤黏度計來量測,其具有100至50,000泊之一熔融黏度。The polyarylene sulfide resin of claim 7 has a melt viscosity of 100 to 50,000 poise when measured with a rotating disk viscometer at an angular frequency of 1.84 rad/s at 300°C. 如請求項7之聚芳硫醚樹脂,當藉由以下方程式1在300℃下用一旋轉圓盤黏度計量測時來計算,其具有0.001至0.4之一非線性指數: [方程式1] 非線性指數= 1 - (17.3 s-1 之一剪切速率下之熔融黏度) / (3.22 s-1 之一剪切速率下之熔融黏度)。The polyarylene sulfide resin of claim 7, having a non-linearity index of one of 0.001 to 0.4 when measured by the following equation 1 at 300°C with a rotating disk viscometer: [Equation 1] Non- Linearity Index = 1 - ( melt viscosity at a shear rate of 17.3 s -1 ) / (melt viscosity at a shear rate of 3.22 s -1 ).
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