TW202139814A - Shell, electronic device and shell manufacturing method - Google Patents
Shell, electronic device and shell manufacturing method Download PDFInfo
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- TW202139814A TW202139814A TW109114240A TW109114240A TW202139814A TW 202139814 A TW202139814 A TW 202139814A TW 109114240 A TW109114240 A TW 109114240A TW 109114240 A TW109114240 A TW 109114240A TW 202139814 A TW202139814 A TW 202139814A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
本發明涉及一種殼體、電子設備及殼體製造方法。The invention relates to a casing, an electronic device and a casing manufacturing method.
電子設備的殼體表面通常會增加高光C角等倒角。目前高光倒角只有在鋁合金、不銹鋼等材料上才能實現,而無法在鎂合金上實現。這是因為鎂合金成型結構緻密性不夠,容易出現空洞,且鑽切C角後,抗氧化能力弱。但鋁合金、不銹鋼等加工工時長,成本高,且重量比較大,不適合輕量化要求。The surface of the housing of the electronic device is usually chamfered such as the highlight C angle. At present, highlight chamfering can only be realized on aluminum alloy, stainless steel and other materials, but cannot be realized on magnesium alloy. This is because the compactness of the magnesium alloy forming structure is not enough, voids are prone to appear, and after the C angle is drilled, the oxidation resistance is weak. However, aluminum alloy and stainless steel have long working hours, high cost, and relatively large weight, which is not suitable for lightweight requirements.
有鑑於此,有必要提供一種殼體、電子設備及殼體製造方法以解決上述問題。In view of this, it is necessary to provide a housing, an electronic device, and a housing manufacturing method to solve the above-mentioned problems.
一種殼體,包括第一金屬,所述第一金屬設有收容孔,所述殼體還包括鑲件,所述鑲件固定於所述收容孔中,所述鑲件為第二金屬,所述鑲件設有高光區。A housing includes a first metal, the first metal is provided with a receiving hole, the housing further includes an insert, the insert is fixed in the receiving hole, the insert is a second metal, and the The insert is provided with a high light area.
進一步地,所述第一金屬為鎂合金,所述第二金屬為鋁合金。Further, the first metal is a magnesium alloy, and the second metal is an aluminum alloy.
進一步地,所述第一金屬還設有多個固定孔,多個所述固定孔圍繞所述收容孔設置,所述鑲件包括本體及連接於所述本體四周的多個固定塊,所述本體收容於所述收容孔中,每個所述固定塊固定於相應一個所述固定孔中。Further, the first metal is further provided with a plurality of fixing holes, the plurality of fixing holes are arranged around the receiving hole, the insert includes a main body and a plurality of fixing blocks connected around the main body, the The main body is received in the receiving hole, and each of the fixing blocks is fixed in a corresponding one of the fixing holes.
進一步地,所述鑲件包括結合面,所述結合面與第一金屬通過膠體固定,所述結合面還設有容膠槽以容納膠體。Further, the insert includes a bonding surface, the bonding surface and the first metal are fixed by a glue, and the bonding surface is also provided with a glue containing groove to accommodate the glue.
一種電子設備,包括殼體,所述殼體為上述任意一項所述的殼體。An electronic device includes a housing, and the housing is any one of the above-mentioned housings.
一種殼體製造方法,包括:在第一金屬上加工形成收容孔;加工第二金屬以形成與所述收容孔相適配的鑲件;將所述鑲件固定於所述收容孔;加工所述鑲件形成高光區。A method for manufacturing a casing includes: processing a first metal to form a receiving hole; processing a second metal to form an insert that fits the receiving hole; fixing the insert to the receiving hole; processing the insert The pieces form a highlight area.
進一步地,在將所述鑲件固定於所述收容孔後,還包括對所述第一金屬及鑲件進行塗裝。Further, after fixing the insert to the receiving hole, it further includes painting the first metal and the insert.
進一步地,在將所述鑲件固定於所述收容孔後,還包括對所述鑲件與所述第一金屬之間的縫隙進行補土。Further, after the insert is fixed to the receiving hole, the method further includes filling the gap between the insert and the first metal.
進一步地,所述鑲件與所述收容孔側壁之間的距離大於等於4毫米。Further, the distance between the insert and the side wall of the receiving hole is greater than or equal to 4 mm.
進一步地,通過衝壓模具形成所述收容孔,所述模具內設有加熱件以加熱所述第一金屬。Further, the receiving hole is formed by a stamping die, and a heating element is provided in the die to heat the first metal.
本發明將第二金屬做成鑲件固定於第一金屬中。以充分發揮不同金屬的功能。例如,第一金屬為鎂合金時,較同尺寸的鋁合金產品輕。第二金屬為鋁合金能夠實現高光等功能,提高殼體的美觀度。In the present invention, the second metal is made into an insert and fixed in the first metal. In order to give full play to the functions of different metals. For example, when the first metal is magnesium alloy, it is lighter than aluminum alloy products of the same size. The second metal is aluminum alloy, which can realize functions such as highlight and improve the appearance of the shell.
下面將結合本發明實施方式中的附圖,對本發明實施方式中的技術方案進行清楚、完整地描述,顯然,所描述的實施方式僅僅是本發明一部分實施方式,而不是全部的實施方式。The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of them.
基於本發明中的實施方式,本領域普通技術人員在沒有做出創造性勞動前提下所獲得的所有其他實施方式,都屬於本發明保護的範圍。Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
本文所使用的所有的技術和科學術語與屬於本發明的技術領域的技術人員通常理解的含義相同。本文中在本發明的說明書中所使用的術語只是為了描述具體的實施方式的目的,不是旨在于限制本發明。All technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the technical field of the present invention. The terminology used in the specification of the present invention herein is only for the purpose of describing specific embodiments, and is not intended to limit the present invention.
請參見圖1至圖4,本發明的實施方式提供一種殼體100製造方法,包括:Referring to FIGS. 1 to 4, an embodiment of the present invention provides a method for manufacturing a
S1:在第一金屬10上加工形成收容孔11;S1: processing a
S2:加工第二金屬以形成與所述收容孔11相適配的鑲件21;S2: processing a second metal to form an
S3:將所述鑲件21固定於所述收容孔11;S3: Fix the
S4:加工所述鑲件21形成高光區。S4: processing the
在步驟S1中,所述第一金屬10為鎂合金。所述收容孔11通過衝壓及切割加工形成。In step S1, the
衝壓具體包括:Stamping specifically includes:
S101:預熱模具;S101: Preheat the mold;
在至少一實施例中,所述模具預熱至240℃至260℃。In at least one embodiment, the mold is preheated to 240°C to 260°C.
S102:將第一金屬10裝入模具中並通過衝床對所述第一金屬10進行衝壓。S102: Put the
在衝壓過程中,所述第一金屬10的部分區域被衝壓凹陷形成收容槽。During the stamping process, a partial area of the
在至少一實施例中,衝壓力為1100KN。In at least one embodiment, the punching force is 1100 KN.
在至少一實施例中,衝壓後保持下壓一定時間。具體地,當衝床的衝壓角度為145°時,保壓12秒;當衝床的衝壓角度為180°時,保壓2秒。In at least one embodiment, the pressing is maintained for a certain period of time after punching. Specifically, when the punching angle of the punch is 145°, the pressure is maintained for 12 seconds; when the punching angle of the punch is 180°, the pressure is maintained for 2 seconds.
在至少一實施例中,所述模具內設有加熱件,即衝壓時採用模具內加熱的方法加熱所述第一金屬10,以使所述第一金屬10各處溫度均勻。In at least one embodiment, a heating element is provided in the mold, that is, the
在切割過程中,通過數控機床(CNC)對所述第一金屬10進行切割以形成所述收容孔11。During the cutting process, the
在切割時,切割所述收容槽的底壁從而形成貫穿的收容孔11。When cutting, the bottom wall of the receiving groove is cut to form a through receiving
在至少一實施例中,所述收容孔11大致為方形孔。所述收容孔11包括相連通的第一收容部112及第二收容部114。所述第一收容部112及第二收容部114分別形成於所述第一金屬10的相對兩端。In at least one embodiment, the
所述第一收容部112的截面面積大於所述第二收容部114的截面面積。所述收容孔11的孔壁大致呈臺階狀,其包括底壁116與側壁118。所述底壁116與所述側壁118相連通。The cross-sectional area of the first receiving
在至少一實施例中,形成所述收容孔11後,還在所述底壁116加工形成多個通孔1161。所述通孔1161用於在後續點膠時方便膠體通過。In at least one embodiment, after the
在至少一實施例中,形成所述收容孔11後,還沿著所述收容孔11加工形成多個固定孔13。每個所述固定孔13還貫穿所述側壁118與所述收容孔11連通。In at least one embodiment, after the
在至少一實施例中,在切割形成收容孔11後還對孔壁進行研磨。In at least one embodiment, after the
在至少一實施例中,形成所述收容孔11後還對所述第一金屬10進行表面處理以提高其耐腐蝕性。In at least one embodiment, after the
在步驟S2中,通過數控機床切割第二金屬以形成鑲件21。In step S2, the second metal is cut by a CNC machine tool to form the
所述第二金屬為鋁合金。The second metal is aluminum alloy.
在至少一實施例中,在切割第二金屬時,一併在鑲件21上加工形成電源孔或指紋孔等。In at least one embodiment, when cutting the second metal, a power supply hole, a fingerprint hole, etc. are formed on the
在至少一實施例中,所述鑲件21包括本體212及設於所述本體212四邊的多個固定塊214。所述本體212收容於所述收容孔11中並承載於所述底壁116上。每個所述固定塊214固定於相應一個固定孔13中。In at least one embodiment, the
請參見圖5,圖5為另一實施例中鑲件421的示意圖。在所述鑲件421上加工形成結合面4201。所述結合面4201用於與第一金屬10通過點膠固定結合。所述結合面4201的寬度C大於等於5毫米,過小的寬度會使膠體固定力下降。Please refer to FIG. 5, which is a schematic diagram of an
在圖5所示實施例中,還在所述結合面4201上加工形成容膠槽42011。所述容膠槽42011用於容納膠體。所述容膠槽42011的深度D為0.1毫米。所述容膠槽42011至所述結合面4201的邊緣的距離E為1.0毫米。In the embodiment shown in FIG. 5, a
請繼續參見圖1至圖4,在步驟S3中,通過點膠及壓合的方式將鑲件21固定於所述收容孔11中。Please continue to refer to FIGS. 1 to 4. In step S3, the
在至少一實施例中,在將鑲件21固定于收容孔11後,還對所述鑲件21與第一金屬10進行打磨以保證平整度。可以理解,在打磨後,可以進行拋光。In at least one embodiment, after the
在至少一實施例中,還對所述鑲件21進行表面處理以提高其耐腐蝕性。In at least one embodiment, the
在至少一實施例中,將所述鑲件21固定於所述收容孔11後,還對所述第一金屬10及鑲件21進行塗裝。In at least one embodiment, after the
所述塗裝可以為噴漆等方式,使所述第一金屬10及鑲件21在外觀上呈一體。The painting may be spray paint or the like, so that the
在需要時也可以進行對所述鑲件21與所述第一金屬10之間的縫隙進行補土作業,以使所述第一金屬10及鑲件21實現無縫連接。When necessary, the gap between the
在至少一實施例中,所述收容孔11略大於所述鑲件21的體積。優選地,所述鑲件21距所述側壁118之間的距離大於4毫米。In at least one embodiment, the receiving
若鑲件21距所述側壁118之間的距離過小,不利於打磨拋光作業,尤其是在補土時容易積土。If the distance between the
請參見圖2至圖4,本發明的實施方式還提供一種殼體100。所述殼體100包括第一金屬10及鑲件21。所述鑲件21為第二金屬。在至少一實施例中,所述第一金屬10為鎂合金。所述第二金屬為鋁合金。Referring to FIGS. 2 to 4, the embodiment of the present invention also provides a
所述第一金屬10設有收容孔11以收容所述鑲件21。所述鑲件21設有高光區。所述鑲件21與所述第一金屬10通過膠體固定。所述鑲件21距離所述收容孔11的側壁大於等於4毫米。The
在至少一實施例中,所述收容孔11大致為方形孔。所述收容孔11包括相連通的第一收容部112及第二收容部114。所述第一收容部112及第二收容部114分別形成於所述第一金屬10的相對兩端。In at least one embodiment, the receiving
所述第一收容孔112的截面面積大於所述第二收容部114的截面面積。所述收容孔11的孔壁大致呈臺階狀,其包括底壁116與側壁118。所述底壁116與所述側壁118相連。The cross-sectional area of the
所述鑲件21承載於所述底壁116上。The
在至少一實施例中,所述底壁116上設有多個通孔1161。In at least one embodiment, the
在至少一實施例中,所述第一金屬10還設有多個固定孔13。多個所述固定孔13圍繞所述收容孔11設置。每個所述固定孔13分別與所述收容孔11連通。In at least one embodiment, the
所述鑲件21包括本體212及連接於所述本體212四周的多個固定塊214。所述本體212收容於所述收容孔11中。每個所述固定塊214固定於相應一個固定孔13中。The
請參見圖5,圖5為另一實施例中鑲件421的示意圖。所述鑲件421包括結合面4201。所述結合面4201用於與第一金屬10通過點膠固定結合。所述結合面4201的寬度大於等於5毫米,過小的寬度會使膠體固定力下降。Please refer to FIG. 5, which is a schematic diagram of an
在圖5所示實施例中,所述結合面4201還設有容膠槽42011。所述容膠槽42011用於容納膠體。所述容膠槽42011的深度為0.1毫米。所述容膠槽42011至所述結合面4201的邊緣的距離為1.0毫米。In the embodiment shown in FIG. 5, the
本發明實施例還提供一種電子設備。所述電子設備採用上述實施例中的殼體100。The embodiment of the present invention also provides an electronic device. The electronic device adopts the
本發明將第二金屬做成鑲件21固定於第一金屬10中。以充分發揮不同金屬的功能。例如,第一金屬10為鎂合金時,較同尺寸的鋁合金產品輕。第二金屬為鋁合金能夠實現高光等功能,提高殼體100的美觀度。In the present invention, the second metal is made into an
可以理解,所述第一金屬10不限於為鎂合金,所述第二金屬也不限於為鋁合金。It can be understood that the
另外,以上所述,僅是本發明的較佳實施方式而已,並非對本發明任何形式上的限制,雖然本發明已將較佳實施方式揭露如上,但並非用以限定本發明,任何熟悉本專業的技術人員,在不脫離本發明技術方案範圍內,當可利用上述揭示的技術內容做出些許更動或修飾為等同變化的等效實施方式,但凡是未脫離本發明技術方案內容,依據本發明的技術實質對以上實施方式所做的任何簡單修改、等同變化與修飾,均仍屬於本發明技術方案的範圍內。In addition, the above are only the preferred embodiments of the present invention and do not limit the present invention in any form. Although the present invention has disclosed the preferred embodiments as above, it is not intended to limit the present invention. Those skilled in the art, without departing from the scope of the technical solution of the present invention, can make use of the technical content disclosed above to make slight changes or modifications into equivalent implementations with equivalent changes, but those who do not depart from the technical solution content of the present invention, according to the present invention The technical essence of any simple modification, equivalent change and modification made to the above embodiments still belong to the scope of the technical solution of the present invention.
100:殼體
10:第一金屬
11:收容孔
112:第一收容部
114:第二收容部
116:底壁
1161:通孔
118:側壁
13:固定孔
21、421:鑲件
212:本體
214:固定塊
4201:結合面
42011:容膠槽
C:寬度
D:深度
E:距離100: shell
10: The first metal
11: Containment hole
112: First Containment Department
114: Second Containment Department
116: bottom wall
1161: Through hole
118: Sidewall
13: Fixing
圖1係本發明一實施方式的殼體製造方法的流程圖Figure 1 is a flowchart of a housing manufacturing method according to an embodiment of the present invention
圖2係本發明一實施方式的殼體的立體示意圖。Fig. 2 is a three-dimensional schematic diagram of a housing according to an embodiment of the present invention.
圖3係圖2所示殼體的另一角度的立體示意圖。FIG. 3 is a perspective schematic view of the housing shown in FIG. 2 from another angle.
圖4係圖2所示殼體的分解示意圖。Fig. 4 is an exploded schematic view of the housing shown in Fig. 2.
圖5係本發明另一實施方式的鑲件的局部剖視圖。Fig. 5 is a partial cross-sectional view of an insert according to another embodiment of the present invention.
無without
100:殼體100: shell
10:第一金屬10: The first metal
21:鑲件21: Insert
Claims (10)
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CN202010264182.9A CN112165800A (en) | 2020-04-07 | 2020-04-07 | Housing, electronic device, and housing manufacturing method |
CN202010264182.9 | 2020-04-07 |
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CN102615269B (en) * | 2011-02-01 | 2015-08-19 | 昶联金属材料应用制品(广州)有限公司 | Manufacture the method and the device that comprise the housing of plurality of metal |
CN107598137B (en) * | 2017-09-05 | 2023-07-21 | 联想(北京)有限公司 | Die casting method of metal shell and electronic equipment |
CN110831361A (en) * | 2018-08-14 | 2020-02-21 | 富智康精密电子(廊坊)有限公司 | Shell, manufacturing method of shell and electronic device |
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2020
- 2020-04-07 CN CN202010264182.9A patent/CN112165800A/en active Pending
- 2020-04-28 TW TW109114240A patent/TWI765256B/en active
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CN112165800A (en) | 2021-01-01 |
TWI765256B (en) | 2022-05-21 |
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