TW202136729A - Substrate support temperature probe diagnostics and management - Google Patents

Abstract

A substrate processing system includes: a substrate support within a processing chamber to vertically support a substrate; a temperature probe including: a first temperature sensor to measure a first temperature of the substrate support; a second temperature sensor to measure a second temperature of the substrate support; a third temperature sensor to measure a third temperature of the substrate support; and a fourth temperature sensor to measure a fourth temperature of the substrate support; a temperature module to: in a first state, determine a substrate support temperature of the substrate support based on the first, second, third, and fourth temperatures; in a second state, determine the substrate support temperature based on only three of the first, second, third, and fourth temperatures; and a temperature control module configured to control at least one of heating and cooling of the substrate support based on the substrate support temperature.

Description

Debugging and management of substrate support temperature probe

The content of this disclosure relates to the temperature probe of the bottom plate of the substrate support of the substrate processing system, and more particularly to the detection and utilization of the temperature sensor of the temperature probe.

The background description provided here is for the purpose of presenting the background of this disclosure in general. The scope of the works of the currently listed inventors described in this chapter of the prior art, and the implementation mode that may not be qualified as the description of the prior art in other ways at the time of application, are not expressly or impliedly recognized as relevant to this disclosure. The prior art.

The substrate processing system can be used to process substrates, such as semiconductor wafers. Exemplary processes that can be performed on the substrate include, but are not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), conductor etching, and/or other etching, deposition, or cleaning processes. In a processing chamber of the substrate processing system, a substrate can be arranged on a substrate support, such as a pedestal, an electrostatic chuck (ESC), and so on. During etching, the gas mixture can be introduced into the processing chamber, and the plasma can be used to initiate chemical reactions.

In one feature, a substrate processing system includes: a substrate support in a processing chamber for vertically supporting a substrate; a temperature probe including: a first temperature sensor for measuring To measure the first temperature of the substrate support; a second temperature sensor to measure the second temperature of the substrate support; a third temperature sensor to measure the third temperature of the substrate support Temperature; and a fourth temperature sensor for measuring the fourth temperature of the substrate support; a temperature module for: a first state, based on the first, second, third, and All of the fourth temperature determines the temperature of a substrate support of the substrate support; in a second state, the temperature of the substrate support is determined based on only three of the first, second, third, and fourth temperatures The substrate support temperature; and a temperature control module configured to control at least one of heating and cooling of the substrate support based on the substrate support temperature.

In a further feature, the temperature module sets the substrate support temperature based on an average value of at least three of the first, second, third, and fourth temperatures.

In a further feature, the substrate support includes: an upper part for vertically supporting the substrate; and a bottom plate for vertically supporting the upper part; the first temperature sensor is used for measuring the bottom plate The first temperature; the second temperature sensor is used to measure the second temperature of the substrate support; the third temperature sensor is used to measure the third temperature of the substrate support; and The fourth temperature sensor is used to measure the fourth temperature of the substrate support.

In a further feature, the substrate support includes: an upper part to vertically support the substrate; and a bottom plate to vertically support the upper part; the first temperature sensor is used to measure the upper part The first temperature; the second temperature sensor is used to measure the second temperature of the upper part; the third temperature sensor is used to measure the third temperature of the upper part; and the fourth temperature The sensor is used to measure the fourth temperature of the upper part.

In a further feature, the temperature module is used to determine the substrate support temperature based on at least three of the following: X first average values of the first temperature, where X is an integer greater than one; X The second average value of the second temperature; X third average values of the third temperature; and X fourth average values of the fourth temperature.

In a further feature, the temperature module is used to determine the substrate based on an average value of at least three of the first average value, the second average value, the third average value, and the fourth average value Support temperature.

In a further feature, when between the first average value, the second average value, the third average value, and the fourth average value, the largest of which is the same as the first average value, the second average value, When the first difference between the minimum of the third average value and the fourth average value is less than a temperature, the temperature module is based on the first average value, the second average value, and the first average value. All of the three average values and the fourth average value determine the substrate support temperature.

In a further feature, when the first difference is greater than the substrate support temperature, the temperature module is based on three of the first, second, third, and fourth average values to selectively determine the The temperature of the substrate support.

In a further feature, when a second maximum value is between the first average value, the second average value, and the third average value and the first average value, the second average value, and the third average value When the second difference between the second minimum of the three average values is less than the substrate support temperature, the temperature module is based on the first, second, and third average values and not based on the first Four average values are used to determine the substrate support temperature.

In a further feature, when a third maximum value is between the first average value, the second average value, and the fourth average value and the first average value, the second average value, and the fourth average value When the third difference between the third minimum of the four average values is less than the substrate support temperature, the temperature module is based on the first, second, and fourth average values and not based on the first Three average values are used to determine the substrate support temperature.

In a further feature, when a fourth maximum value is between the first average value, the third average value, and the fourth average value and the first average value, the third average value, and the fourth average value When the fourth difference between the fourth minimum of the four average values is less than the substrate support temperature, the temperature module is based on the first, third, and fourth average values and not based on the first, third, and fourth average values. Two average values are used to determine the substrate support temperature.

In a further feature, when between the second average value, the third average value, and the fourth average value one of the fifth maximum value and the second average value, the third average value, and the fourth average value When the fifth difference between the fifth minimum of the four average values is less than the substrate support temperature, the temperature module is based on the second, third, and fourth average values and not based on the first An average value is used to determine the substrate support temperature.

In a further feature, when the first, second, third, fourth, and fifth differences are greater than the temperature of the substrate support, a debugging module indicates that a fault exists in the temperature probe .

In a further feature, when the fault exists in the temperature probe, the error detection module displays an alarm on a display.

In a further feature, the first, second, third, and fourth temperature sensors are solid state temperature sensors.

In a further feature, a thermally conductive material is sandwiched between the substrate support and the first, second, third, and fourth temperature sensors.

In a further feature, a statistical module is used to: determine a first average value of multiple values of the first temperature; determine a second average value of multiple values of the first average value; determine the first average value A first standard deviation of the plurality of values of an average value; determine a second standard deviation of the plurality of timestamps associated with the plurality of values of the first average; based on the plurality of timestamps and the first standard deviation The multiple values of an average value are used to determine a correlation coefficient; based on the correlation coefficient, the first standard deviation, and the second standard deviation, a slope is determined; and an error detection module is used to diagnose whether the slope is at Within a slope range.

In a further feature, the statistical module is based on (a) the total variance of the plurality of values of the first average value and the plurality of timestamps, (b) the first standard deviation, and (c) the The second standard deviation determines the correlation coefficient.

In a further feature, the statistical module sets the slope based on the correlation coefficient multiplied by the first standard deviation divided by the second standard deviation.

In a further feature, the temperature control module is used to perform at least one of: selectively applying power to a thermal control element (TCE) based on the substrate support temperature; and selectively based on the substrate support temperature Adjust the coolant flow rate through the coolant channel in the substrate support.

In one feature, a substrate processing system includes: a substrate support in a processing chamber for vertically supporting a substrate; a temperature probe including: N temperature sensors for measuring N temperatures of the substrate support, where N is an integer greater than 3; a temperature module used to: in a first state, determine a substrate support of the substrate support based on all of the N temperatures Temperature; in a second state, the substrate support temperature of the substrate support is determined based on a subset of the N temperatures; and a temperature control module that controls the substrate support temperature based on the substrate support temperature At least one of heating and cooling. In various embodiments, the subset is only N-1 of the N temperatures.

In one feature, a method includes: measuring a first temperature of a substrate support that vertically supports a substrate during substrate processing by a first temperature sensor of a temperature probe; by the temperature A second temperature sensor of the probe measures a second temperature of the substrate support; a third temperature sensor of the temperature probe measures a third temperature of the substrate support; A fourth temperature sensor of the temperature probe is used to measure a fourth temperature of the substrate support; in a first state, based on all of the first, second, third, and fourth temperatures And determine a substrate support temperature of the substrate support; in a second state, determine the substrate support temperature of the substrate support based on only three of the first, second, third, and fourth temperatures And controlling at least one of heating and cooling of the substrate support based on the temperature of the substrate support.

In a further feature, the step of determining the temperature of the substrate support includes: setting the temperature of the substrate support based on an average value of at least three of the first, second, third, and fourth temperatures.

In a further feature, the substrate support includes: an upper portion to vertically support the substrate; and a bottom plate to vertically support the upper portion; the step of measuring the first temperature includes measuring the bottom plate The first temperature; the step of measuring the second temperature includes measuring the second temperature of the substrate support; the step of measuring the third temperature includes measuring the third temperature of the substrate support; and The step of measuring the fourth temperature includes measuring the fourth temperature of the substrate support.

In a further feature, the substrate support includes: an upper part for vertically supporting the substrate; and a bottom plate for vertically supporting the upper part; the step of measuring the first temperature includes measuring the upper part The first temperature; the step of measuring the second temperature includes measuring the second temperature of the upper part; the step of measuring the third temperature includes measuring the third temperature of the upper part; and measuring the first temperature The step of four temperatures includes measuring the fourth temperature of the upper part.

In a further feature, the step of determining the substrate support temperature includes determining the substrate support temperature based on at least three of the following: X first average values of the first temperatures, where X is an integer greater than one; X X second average values of the second temperature; X third average values of the third temperature; and X fourth average values of the fourth temperature.

In a further feature, the step of determining the temperature of the substrate support includes: an average value based on at least three of the first average value, the second average value, the third average value, and the fourth average value, Determine the substrate support temperature.

In a further feature, the step of determining the temperature of the substrate support includes: when the maximum value is between the first, second, third, and fourth average values and the first, second, third, and When the first difference between the minimum value of the fourth average value is less than a temperature, the substrate support temperature is determined based on all of the first, second, third, and fourth average values.

In a further feature, the step of determining the temperature of the substrate support includes: when the first difference is greater than the temperature of the substrate support, determining based on three of the first, second, third, and fourth average values Determine the substrate support temperature.

In a further feature, the step of determining the temperature of the substrate support includes: when a second maximum value is between the first, second, and third average values and the first, second, and third average values When the second difference between one of the second minimum values is less than the substrate support temperature, the substrate is determined based on the first, second, and third average values and not based on the fourth average value Support temperature.

In a further feature, the step of determining the temperature of the substrate support includes: when a third maximum value is between the first, second, and fourth average values and the first, second, and fourth average values When the third difference between one of the third minimum values is less than the substrate support temperature, the substrate is determined based on the first, second, and fourth average values and not based on the third average value Support temperature.

In a further feature, the step of determining the temperature of the substrate support includes: when a fourth maximum value is between the first, third, and fourth average values and the first, third, and fourth average values When the fourth difference between one of the fourth minimum values is less than the substrate support temperature, the substrate is determined based on the first, third, and fourth average values and not based on the second average value Support temperature.

In a further feature, the step of determining the temperature of the substrate support includes: when the second, third, and fourth average value is between a fifth maximum value and the second, third, and fourth average value When the fifth difference between one of the fifth minimum values is less than the substrate support temperature, the substrate is determined based on the second, third, and fourth average values and not based on the first average value Support temperature.

In a further feature, the method further includes: when the first, second, third, fourth, and fifth differences are greater than the temperature of the substrate support, indicating that a fault exists in the temperature probe .

In a further feature, the method further includes: displaying an alarm on a display when the fault exists in the temperature probe.

In a further feature, the first, second, third, and fourth temperature sensors are solid state temperature sensors.

In a further feature, a thermally conductive material is sandwiched between the substrate support and the first, second, third, and fourth temperature sensors.

In a further feature, the method further includes: determining a first average value of the multiple values of the first temperature; determining a second average value of the multiple values of the first average value; determining the first average value A first standard deviation of the plurality of values of the; determining a second standard deviation of the plurality of timestamps associated with the plurality of values of the first average; based on the plurality of timestamps and the first average Determining a correlation coefficient based on the correlation coefficient, the first standard deviation, and the second standard deviation; and diagnosing whether the slope is within a slope range.

In a further feature, the step of determining the correlation coefficient includes: based on (a) the total variance of the plurality of values of the first average value and the plurality of timestamps, (b) the first standard deviation, and ( c) The second standard deviation is used to determine the correlation coefficient.

In a further feature, the step of determining the slope includes: setting the slope based on the correlation coefficient multiplied by the first standard deviation divided by the second standard deviation.

In a further feature, the step of controlling at least one of heating and cooling of the substrate support includes at least one of the following: selectively applying power to a thermal control element (TCE) based on the temperature of the substrate support; and The temperature of the substrate support selectively adjusts the coolant flow rate through the coolant channels in the substrate support.

According to the implementation section, the scope of patent application, and the drawings, other application fields of the present disclosure will become obvious. The implementation section and specific examples are only intended for illustrative purposes, and are not intended to limit the scope of the present disclosure.

A substrate support, such as an electrostatic chuck, supports a substrate in a substrate processing chamber. During processing, a substrate is disposed on a ceramic portion of the substrate support. A plurality of thermal control elements can be embedded in the substrate support. These thermal control elements can be controlled to perform at least one of heating and cooling of the substrate support. The substrate support includes a bottom plate. The bottom plate can be used as a heat sink for thermal control elements. Coolant can be pumped through coolant channels in the bottom plate to cool the substrate support.

A single temperature sensor can measure the temperature of the substrate support, such as the temperature of the bottom plate. However, if that single temperature sensor fails, substrate processing may be interrupted, and the single temperature sensor (possibly and one or more other components integrated with the single temperature sensor) is replaced or the failure is caused by Remedy in other ways.

This application relates to a temperature probe, which includes N different temperature sensors for measuring N temperatures at a position of the substrate support. N is an integer greater than 3. The use of N temperature sensors provides redundancy and enables substrate processing to continue in the event that one of the N temperature sensors fails or loses connection, for example.

When the N temperatures are within the first range of each other, the N temperatures can be used to determine the temperature of the substrate support. The N temperature sensors may not be calibrated after installation. The measurement accuracy of the temperature sensor can be confirmed by N temperatures within the first range of each other.

When at least one of the N temperatures is outside the first range, N-1 of the temperatures in the range between each other are used to determine the temperature of the substrate support. The measurement accuracy of those temperature sensors can be confirmed by the N-1 temperatures within the range of each other.

If there is no combination of N-1 temperatures within each other's range, a fault is detected in the temperature probe. When the temperature change of the substrate support is less than the maximum change, the transition from using N temperatures to using N-1 temperatures can be performed. Since these temperatures are used to control the temperature of the substrate support, the above operation prevents the temperature of the substrate support from changing beyond the allowable amount.

Referring now to FIG. 1, an exemplary substrate processing system 100 is shown. For example only, the substrate processing system 100 may be used to perform etching using radio frequency (RF) plasma.

The substrate processing system 100 includes a processing chamber 102 that encloses other components of the substrate processing system 100 and contains RF plasma. The processing chamber 102 includes an upper electrode 104 and a substrate support 106, such as an electrostatic chuck (ESC).

During operation, the substrate 108 is arranged on the substrate support 106. Examples of the substrate processing system 100 and the processing chamber 102 are shown. However, this application is also applicable to other types of substrate processing systems and processing chambers, such as substrate processing systems that generate plasma in situ, and substrates that realize remote plasma generation and transportation (for example, using plasma tubes, microwave tubes) Processing system and so on.

The upper electrode 104 may include a gas distribution device, such as a shower head 109, which introduces and distributes process gas in the processing chamber 102. The shower head 109 may include a rod having one end connected to the top surface of the processing chamber 102. The base of the shower head 109 is substantially cylindrical, and extends radially outward from an opposite end of the rod at a position spaced apart from the top surface of the processing chamber 102. A surface (or panel) of the base of the shower head 109 facing the substrate includes a plurality of holes through which process gas or purging gas flows. Alternatively, the upper electrode 104 may include a guide plate and the process gas may be introduced in another way.

The substrate support 106 includes a conductive bottom plate 110 serving as a lower electrode. The bottom plate 110 supports a ceramic layer 112. One or more other layers 114 may be arranged between the ceramic layer 112 and the bottom plate 110.

The bottom plate 110 may include one or more coolant channels 116 for flowing coolant through the bottom plate 110. In some examples, a protective seal 176 may be provided.

An RF generation system 120 generates an RF voltage and outputs the RF voltage to one of the upper electrode 104 and the lower electrode (for example, the bottom plate 110 of the substrate support 106) to ignite and maintain plasma in the processing chamber 102. The other of the upper electrode 104 and the bottom plate 110 may be direct current (DC) grounded, alternating current (AC) grounded, or floating. For example only, the RF generation system 120 may include an RF voltage generator 122 that generates the RF voltage that is fed to the upper electrode 104 or the bottom plate 110 by the matching and distribution network 124.

A gas delivery system 130 includes one or more gas sources 132-1, 132-2, ... and 132-N (collectively referred to as gas sources 132), where N is an integer greater than zero. The gas source 132 supplies one or more etching gases, carrier gases, inert gases, precursor gases, and mixtures thereof. The gas source 132 can also supply purging gas and other types of gas.

The gas source 132 is controlled by valves 134-1, 134-2, ... and 134-N (collectively referred to as valve 134) and mass flow controllers 136-1, 136-2, ... and 136-N (collectively referred to as mass flow control器) is connected to a manifold 140. The output of the manifold 140 is fed to the processing chamber 102. For example only, the output of the manifold 140 is fed to the shower head 109 and output from the shower head 109 to the processing chamber 102.

The temperature control module 142 is connected to the heating element array in the substrate support 106, such as a thermal control element (TCE) 144 arranged in the ceramic layer 112. For example, TCE 144 may include, but is not limited to: macro heating elements corresponding to each area of a multi-zone heating plate, and/or an array of micro heating elements arranged across multiple areas of a multi-zone heating plate . The TCE 144 may be, for example, a resistance heater, which generates heat when power is applied to the heaters, respectively, or may be another suitable type of heating element.

The temperature control module 142 controls the power supply to the TCE 144 to control the temperature of various positions on the substrate support 106 and the substrate 108. For example, the temperature control module 142 can control a corresponding switch to connect and disconnect the TCE 144 from power.

The temperature control module 142 may communicate with the coolant assembly 146 to control the flow of coolant through the coolant channel 116 in the bottom plate 110. For example, the coolant assembly 146 may include a coolant pump, a sump, and one or more heat exchangers. The temperature control module 142 operates the coolant assembly 146 (for example, a coolant pump) to selectively flow the coolant through the coolant channel 116 to cool the substrate support 106. The temperature control module 142 can also control the rate of the coolant pump to control the flow rate of the coolant through the coolant channel 116. The temperature control module 142 can control the TCE 144 together with the coolant assembly 146, for example, to achieve one or more target temperatures.

The valve 150 and the pump 152 may be used to discharge the reactants from the processing chamber 102. The system control module 160 can control the components of the substrate processing system 100. Although shown as an independent controller, the temperature control module 142 can be implemented in the system control module 160.

The robot 170 can transfer the substrate to the substrate support 106 and remove the substrate from the substrate support 106. For example, the robot 170 can transfer the substrate between the substrate support 106 and the load lock chamber 172.

In some examples, the substrate support 106 includes an edge ring 180. The edge ring 180 may be movable relative to the substrate 108 (eg, movable upward and downward in the vertical direction). For example, the movement of the edge ring 180 may be controlled by one or more actuators in response to input from the system control module 160. In some examples, a user may input control parameters to the system control module 160 via one or more user interface devices 184. The user interface device 184 may include one or more input and/or output devices (such as keyboards). , Mouse, touch screen), monitor, etc.

FIG. 2 includes a cross-sectional view of a portion of an example embodiment of the substrate support 106. The TCE 144 may be embedded in the ceramic layer 112. A plurality of temperature sensors (or temperature probes) 204 may also be embedded in the ceramic layer 112. These temperature sensors 204 may be spaced apart from each of the other temperature sensors 204, or may be grouped into one or more others adjacent to the temperature sensor 204. In various embodiments, the ceramic layer 112 may include one or more temperature sensors per TCE. The temperature sensors 204 may be respectively located in the vicinity of the TCE 144 (for example, within a predetermined distance thereof). For example, the temperature sensor 204 may be positioned between each TCE 144 and the bottom plate 110, respectively. The temperature sensor 204 measures the temperature at their respective positions.

The TCE 144 is controlled by the temperature control module 142. The temperature control module 142 can individually control the power application to the TCE 144. For example, the switches may be connected in series with the TCE 144, and the temperature control module 142 may control the switches to control the power supply to the TCE 144, respectively. In various embodiments, the temperature control module 142 may control the application of power to the TCE 144 for a group of two or more of them. For example, the switch may be connected in series with a group of two or more of the TCE 144, and the temperature control module 142 may control the switch to control power supply to these groups, respectively. The bottom plate 110 may be a single piece or include multiple pieces.

The temperature control module 142 may be implemented on the circuit board 208, and the circuit board 208 is fixed in the groove 212 in the lower surface of the bottom plate 110. A temperature probe 216 can also be implemented on the circuit board 406, as shown in FIG. 4, for example. The temperature probe 216 includes temperature sensors that measure the temperature of the bottom plate 110 respectively.

The temperature control module 142 receives the temperature measured by the temperature sensor 204 and the temperature measured by the temperature probe 216. The temperature control module 142 controls at least one of the coolant assembly 146 and the TCE 144 based on at least one of (i) the temperature measured by the temperature sensor 204 and (ii) the temperature measured by the temperature probe 216. For example, the temperature control module 142 can control one or more of the TCEs 144 to adjust the temperature measured by one of the temperature sensors 204 associated with the corresponding TCE 144 toward the target temperature. As another example, the temperature control module 142 may control the coolant assembly 146 based on one or more temperatures measured by the temperature probe 216 to control the flow rate of the coolant through the coolant channel 116.

3 is a cross-sectional view including a part of the substrate support 106 (for example, the base plate 110), the temperature probe 216, and the thermal conductor 304. The thermal conductor 304 may be made of a thermally conductive material (for example, a slurry), and may be sandwiched between the temperature probe 216 and the bottom surface 306 of the bottom plate 110. An example temperature sensor 308 of the temperature probe 216 is shown. The temperature sensor 308 of the temperature probe 216 may contact the thermal conductor 304. The thermal conductor 304 may be configured to transfer heat equally, so that each temperature sensor 308 should measure the same temperature within a predetermined tolerance. The temperature sensor 308 may be, for example, a solid-state temperature sensor. The accuracy of the temperature sensor 308 may be, for example, +/- 0.5 degrees Celsius or less. In various embodiments, the thermal conductor 304 may be omitted, and the temperature sensor 308 may directly contact the bottom surface 306 of the bottom plate 110.

4 is a perspective view of an example embodiment of the circuit board 406 and the temperature probe 216 taken from the side of the circuit board 406 facing the bottom surface 306 of the bottom plate 110. FIG. 4 also includes a close-up view 404 of a portion of the circuit board 406 and the temperature probe 216.

In various embodiments, the temperature sensors 308 may be arranged in two rows and two columns, where each temperature sensor 308 is located in one row and one column. However, the temperature sensor 308 may be positioned and arranged differently. As shown, the temperature probe 216 may include four temperature sensors 308. More generally, the temperature probe 216 includes N temperature sensors, where N is an integer greater than three.

The temperature probe 216 may be fixed to the circuit board 208, for example, using one or more fasteners 408 or in another suitable manner. The temperature probe 216 includes conductors 412 electrically connected to the temperature sensors 308, respectively. Electrical conductors (eg, traces and/or leads) electrically connect the conductor 412 and the temperature control module 142 to transmit the temperature measured by the temperature sensor 308 to the temperature control module 142.

Figure 5 is a functional block diagram of an example error detection and control system. The clock 504 selectively generates a time stamp during substrate processing. The clock 504 may generate a time stamp at a clock frequency such as 20 Hz or another suitable frequency. In this way, the clock 504 generates a time stamp in each cycle, which is equal to 1 divided by the clock frequency.

A buffer module 508 is electrically connected to each temperature sensor 308 of the temperature probe 216. The buffer module 508 receives the first temperature (TA) measured by the first one of the temperature sensors 308, the second temperature (TB) measured by the second one of the temperature sensors 308, and the second temperature (TB) measured by the temperature sensor 308. The third temperature (TC) measured by the third person of the temperature sensor 308, and the fourth temperature (TD) measured by the fourth person of the temperature sensor 308. The buffer module 508 stores the first, second, third, and fourth temperatures each time the time stamp is generated. The buffer module 508 also stores the time stamp.

The buffer module 508 stores at least one (X) number of temperature and time stamps. The quantity (X) can be calibrated and can be set to, for example, 20 or another suitable integer. The stored values are used to generate statistical values, as discussed further below. For those temperature sensors 308 that are out of connection or are determined to provide invalid temperatures, the buffer module 508 can store a temperature value of zero (0) Kelvin. Although an example of temperature measured in Kelvin is provided, other suitable temperature units can be used.

During substrate processing, the bottom plate temperature module 512 determines the temperature of the bottom plate 110 based on three or more of the first, second, third, and fourth temperatures. The temperature of the bottom plate 110 will be referred to as the bottom plate temperature. For example, the bottom plate temperature module 512 can set the bottom plate temperature based on or equal to the average value of three or more temperatures. The bottom plate temperature module 512 can determine which three or more temperatures are used to determine the bottom plate temperature, as discussed further below.

During substrate processing, the substrate temperature module 516 determines the temperature of the substrate 108 on the substrate support 106 based on the temperature of the bottom plate. The substrate temperature module 516 may further determine the temperature of the substrate 108 based on one or more other operating parameters, such as one or more temperatures measured by the one or more temperature sensors 204. The substrate temperature module 516 may determine the temperature of the substrate 108, for example, using one or more equations and/or look-up tables that correlate the substrate temperature and other operating parameters with the substrate temperature.

During substrate processing, the temperature control module 142 controls at least one of heating and cooling of the substrate support 106 based on the substrate temperature. For example, the temperature control module 142 may adjust the flow rate of the coolant through the coolant channel 116 via the coolant assembly 146 based on the substrate temperature. The temperature control module 142 can adjust the flow rate, for example, adjust the substrate temperature toward or to a target temperature. Additionally or alternatively, the temperature control module 142 may control one or more of the TCEs 144 based on the substrate temperature. For example, the temperature control module 142 may control one or more of the TCEs 144 to adjust the substrate temperature toward or to the target temperature.

The statistical module 524 determines various statistical values during substrate processing based on the temperature and other parameters stored by the buffer module 508, as discussed further below. As discussed further below, the debugging module 528 diagnoses whether there is a fault in the temperature probe 216 based on one or more statistical values.

When there is a fault in the temperature probe 216, the debugging module 528 may take one or more actions. For example, the debugging module 528 may display a predetermined message associated with the fault in the temperature probe 216 on the display 526. Additionally or alternatively, when a fault occurs in the temperature probe 216, the debugging module 528 can prompt the system control module 160 to stop substrate processing. For example, the debug module 528 may cause the system control module 160 to actuate the gas delivery system 130 (for example, close the valve 134) and stop the flow of one or more gases to the processing chamber 102. Additionally or alternatively, the debug module 528 may cause the system control module 160 to adjust the RF generation system 120 to stop applying power to one, more than one, or all components within the processing chamber 102. In response to receiving the user input of receiving the existence of the fault and clearing the fault, the debug module 528 can clear the fault and allow substrate processing.

The error detection module 528 also sets the first signal and the second signal based on statistical values during substrate processing. The first signal may be, for example, a first flag (eg, flag A) or another suitable type of signal. The second signal may be, for example, a second flag (eg, flag B) or another suitable type of signal. The state of the first signal indicates how many temperature sensors 308 are used to determine the bottom plate temperature. The state of the second signal indicates to the bottom plate temperature module 512 to use the stored temperature to determine which of the temperature sensors 308 the bottom plate temperature comes from. The setting of the state of the first and second signals is further discussed below.

Generally speaking, when all four temperature sensors 308 are within the first temperature range, the bottom plate temperature module 512 determines the bottom plate temperature based on the stored first, second, third, and fourth temperatures. The first temperature range can be calibrated and can be, for example, about 1 degree Celsius or another suitable range. When not all the four temperature sensors 308 are within the first temperature range, the error detection module 528 determines which three of the four temperature sensors 308 are within the temperature range. If three of the four temperature sensors 308 are within the temperature range, the debugging module 528 determines whether these three of the four temperature sensors 308 are the second of the previous (for example, last) bottom plate temperature. Within the temperature. The bottom plate temperature module 512 determines the bottom plate temperature based on those three of the four temperature sensors 308. When switching to using three of the four temperature sensors 308 will not result in a change in the bottom plate temperature measurement exceeding the second temperature and the three of the four temperature sensors 308 are within the first temperature range This allows three of the four temperature sensors 308 to be used to determine the bottom plate temperature. This can achieve the required accuracy. The second temperature can be calibrated or input to a certain standard, and can be, for example, about 0.5 degrees Celsius, 0.25 degrees Celsius, or another suitable temperature.

When there is no combination of three of the four temperature sensors 308 within the second temperature of the previous base plate temperature, the debug module 528 disables the base plate temperature module 512, diagnoses the fault in the temperature probe 216, and One or more actions can be taken. The operation of disabling the substrate temperature module 512 disables the determination of the substrate temperature. When the fault in the temperature probe 216 is cleared, the debugging module 528 re-enables the bottom plate temperature module 512.

FIGS. 6-9 include flowcharts that describe an exemplary method that determines the bottom plate temperature and manages the use of the first, second, third, and fourth temperatures from the temperature sensor 308. When the time pulse 504 generates a time stamp, control starts at 604. The buffer module 508 stores the time stamp at 604. At 608, the buffer module 508 stores samples of the first temperature (TA), and the statistics module 524 determines the first average value of the number (for example, 20) of the most recently stored values of the first temperature (TA). The statistics module 524 may set the first average value based on or equal to the sum of the number (for example, 20) of the most recently stored values of the first temperature divided by the number (for example, 20). The buffer module 508 stores the first average value.

At 612, the buffer module 508 stores the samples of the second temperature (TB), and the statistics module 524 determines the second average value of the latest stored value of the second temperature (TB) of the number (for example, 20). The statistics module 524 can set the second average value based on or equal to the sum of the number (for example, 20) of the latest stored values of the second temperature divided by the number (for example, 20). The buffer module 508 stores the second average value.

At 616, the buffer module 508 stores samples of the third temperature (TC), and the statistics module 524 determines the third average value of the latest stored value of the third temperature (TC) of the number (for example, 20). The statistics module 524 may set the third average value based on or equal to the sum of the last stored values of the third temperature of the number (for example, 20) divided by the number (for example, 20). The buffer module 508 stores the third average value.

At 620, the buffer module 508 stores the samples of the fourth temperature (TD), and the statistics module 524 determines the fourth average value of the latest stored value of the fourth temperature (TD) of the number (for example, 20). The statistics module 524 may set the fourth average value based on or equal to the sum of the number (for example, 20) of the most recent stored values of the fourth temperature divided by the number (for example, 20). The buffer module 508 stores the fourth average value.

其中CorrA是第一相關係數，Cov(x, y)是第一平均值（y）的最近儲存數值與最近儲存的時間戳記（x）的共變異數，σ_y 是第一平均值（y）的最近儲存數值的標準差，而σ_x 是最近儲存的時間戳記（x）的標準差。At 624, the statistics module 524 determines the first correlation coefficient (CorrA) based on the most recently stored time stamp of the number (eg, 20) and the most recently stored value of the first average value of the number (eg, 20). The first correlation coefficient may be, for example, a Pearson correlation coefficient. The statistics module 524 can use the following equation to determine the first correlation coefficient:

CorrA is the first correlation coefficient, Cov(x, y) is the covariance between the most recently stored value of the first average (y) and the most recently stored time stamp (x), and σ _y is the first average (y) The standard deviation of the most recently stored value, and σ _x is the standard deviation of the most recently stored timestamp (x).

_{At 628, the statistics module 524 determines the standard deviation σ y} of the latest stored value of the number of the first average value (y). _{At 632, the statistics module 524 determines the standard deviation σ x} of the most recently stored value of the number of timestamps (x).

其中SlopeA是第一斜率，CorrA是第一相關係數，σ_x 是最近儲存的時間戳（x）的標準差，而σ_y 是第一平均值（y）的最近儲存數值的標準差。In 636, the statistics module 524 determines the first slope based on the first correlation coefficient, the standard deviation σ _{x of the latest stored time stamp (x), and the standard deviation σ y} of the latest stored value of the first average value (y). For example, the statistics module 524 can use the following equation to set the first slope:

Among them, SlopeA is the first slope, CorrA is the first correlation coefficient, σ _x is the standard deviation of the most recently stored timestamp (x), and σ _y is the standard deviation of the most recently stored value of the first average (y).

At 640, the error detection module 528 determines whether the first slope is outside a slope range. This slope range can be calibrated and can be, for example, about -1.0 to about +1.0 or another suitable range. If 640 is true, then control continues with 700, which will be discussed further below. If 640 is no, then control transfers to 644.

其中CorrB是第二相關係數，Cov(x, y)是最近儲存的時間戳記（x）和第二平均值（y）的最近儲存數值的共變異數，σ_x 是最近儲存的時間戳記（x）的標準差，而σ_y 是第二平均值(y)的最新儲存數值的標準差。At 644, the statistics module 524 determines the second correlation coefficient (CorrB) based on the number (eg, 20) of the most recently stored time stamp and the most recently stored value of the number (eg, 20) of the second average value. The second correlation coefficient may be, for example, the Pearson correlation coefficient. The statistics module 524 can use the equation to determine the second correlation coefficient:

CorrB is the second correlation coefficient, Cov(x, y) is the covariance of the most recently stored time stamp (x) and the second average (y), and σ _x is the most recently stored time stamp (x ), and σ _y is the standard deviation of the latest stored value of the second average (y).

_{At 648, the statistical module 524 determines the standard deviation σ y} of the latest stored value of the second average value (y) of the quantity. At 652, the statistics module 524 determines the standard deviation σ _{x of} the number of most recently stored timestamps (x).

其中SlopeB是第二斜率，CorrB是第二相關係數，σ_x 是最近儲存的時間戳記（x）的標準差，而σ_y 是第二平均值（y）的最新儲存數值的標準差。At 656, the statistics module 524 determines the second slope based on the second correlation coefficient, the standard deviation σ _{x of the most recently stored time stamp (x), and the standard deviation σ y} of the latest stored value of the second average (y). For example, the statistics module 524 can use an equation to set the second slope:

Where SlopeB is the second slope, CorrB is the second correlation coefficient, σ _x is the standard deviation of the most recently stored time stamp (x), and σ _y is the standard deviation of the latest stored value of the second average (y).

At 660, the debug module 528 determines whether the second slope is outside the slope range (for example, about -1.0 to about +1.0). If 660 is true, then control continues with 700, which will be discussed further below. If 660 is no, then control transfers to 664.

其中CorrC是第三相關係數，Cov(x, y)是最近儲存的時間戳記（x）與第三平均值（y）的最近儲存數值的共變異數，σ_x 是最近儲存的時間戳記（x）的標準差，而σ_y 是第三平均值（y）的最新儲存值的標準差。At 664, the statistics module 524 determines the third correlation coefficient (CorrC) based on the most recently stored time stamp of the number (eg, 20) and the most recently stored value of the third average value of the number (eg, 20). The third correlation coefficient may be, for example, the Pearson correlation coefficient. The statistics module 524 can use the equation to determine the third correlation coefficient:

Where CorrC is the third correlation coefficient, Cov(x, y) is the covariance of the most recently stored time stamp (x) and the third average (y), and σ _x is the most recently stored time stamp (x ), and σ _y is the standard deviation of the latest stored value of the third average (y).

_{At 668, the statistical module 524 determines the standard deviation σ y} of the latest stored value of the third average (y) of the quantity. _{At 672, the statistics module 524 determines the standard deviation σ x} of the most recently stored time stamp (x) of the number.

其中SlopeC是第三斜率，CorrC是第三相關係數，σ_x 是最近儲存的時間戳記（x）的標準差，而σ_y 是第三平均值（y）的最近儲存數值的標準差。At 676, the statistical module 524 determines the third slope based on the third correlation coefficient, the standard deviation σ _{x of the most recently stored time stamp (x), and the standard deviation σ y} of the most recently stored value of the third average (y). For example, the statistics module 524 can use the equation to set the third slope:

Among them, SlopeC is the third slope, CorrC is the third correlation coefficient, σ _x is the standard deviation of the most recently stored time stamp (x), and σ _y is the standard deviation of the most recently stored value of the third average (y).

At 680, the debug module 528 determines whether the third slope is outside the slope range (eg, about -1.0 to about +1.0). If 680 is true, then control continues with 700, which will be discussed further below. If 680 is false, then control transfers to 684.

其中CorrD是第四相關係數，Cov(x, y)是最近儲存的時間戳記（x）與第四平均值（y）的最近儲存數值的共變異數，σ_x 是最近儲存的時間戳記（x）的標準差，而σ_y 是第四平均值（y）的最新儲存數值的標準差。At 684, the statistics module 524 determines the fourth correlation coefficient (CorrD) based on the most recently stored time stamp of the number (eg, 20) and the latest stored value of the fourth average value of the number (eg, 20). The fourth correlation coefficient may be, for example, the Pearson correlation coefficient. The statistics module 524 can use the equation to determine the fourth correlation coefficient:

CorrD is the fourth correlation coefficient, Cov(x, y) is the covariance between the most recently stored time stamp (x) and the fourth average (y), and σ _x is the most recently stored time stamp (x ), and σ _y is the standard deviation of the latest stored value of the fourth average (y).

_{At 688, the statistics module 524 determines the standard deviation σ y} of the latest stored value of the fourth average (y) of the quantity. At 692, the statistics module 524 determines the standard deviation σ _{x of} the number of most recently stored time stamps (x).

其中SlopeD是第四斜率，CorrD是第四相關係數，σ_x 是該數量之最近儲存的時間戳記（x）的標準差，而σ_y 是該數量之第四平均值（y）的最新儲存數值的標準差。At 694, the statistical module 524 is based on the fourth correlation coefficient, the standard deviation σ _{x of the number of the most recently stored timestamps (x), and the standard deviation σ y} of the fourth average value (y) of the number. , Determine the fourth slope. For example, the statistics module 524 can use the following equation to set the fourth slope:

Where SlopeD is the fourth slope, CorrD is the fourth correlation coefficient, σ _x is the standard deviation of the most recently stored timestamp (x) of _{the quantity, and σ y} is the latest stored value of the fourth average (y) of the quantity The standard deviation.

At 696, the debug module 528 determines whether the fourth slope is outside the slope range (eg, about -1.0 to about +1.0). If 696 is yes, then control continues to 700. If 696 is no, the temperature of the bottom plate will not change quickly, and control continues to 740 (via P) in FIG. 7.

At 700, the bottom plate temperature module 512 determines whether the second signal (flag B) is set to the first state, for example, the number 0. The second signal set to the first state instructs the bottom plate temperature module 512 to determine the bottom plate temperature based on the measurements from all four temperature sensors 308. . If 700 is no, then control goes to 708. If 700 is true, at 704 the bottom plate temperature module 512 determines the bottom plate temperature according to the first, second, third, and fourth average values. This can bypass the verification of the accuracy of the temperature sensor 308, and can avoid a possible misrecognition when the temperature of the bottom plate changes rapidly. The bottom plate temperature module 512 may, for example, set the bottom plate temperature based on or equal to the average value of the first, second, third, and fourth average values (determined at 608-620). For example, the bottom plate temperature module 512 outputs the bottom plate temperature at 736 for determining the substrate temperature.

At 708, the bottom plate temperature module 512 determines whether the second signal (flag B) is set to the second state, such as number 1. The second signal set to the second state instructs the bottom plate temperature module 512 to determine the bottom plate temperature based on the first, second, and third measurements from the temperature sensor 308. If 708 is no, then control transfers to 716. If 708 is true, the bottom plate temperature module 512 determines the bottom plate temperature at 712 based on the first, second, and third average values. For example, the bottom plate temperature module 512 can set the bottom plate temperature based on or equal to the average value of the first, second, and third average values (determined at 608-616). Control continues to 736.

At 716, the bottom plate temperature module 512 determines whether the second signal (flag B) is set to the third state, such as number 2. The second signal set to the third state instructs the bottom plate temperature module 512 to determine the bottom plate temperature based on the measurements from the first, second, and fourth temperature sensors 308. If 716 is no, then control transfers to 724. If 716 is true, the bottom plate temperature module 512 determines the bottom plate temperature at 720 based on the first, second, and fourth average values. For example, the bottom plate temperature module 512 can set the bottom plate temperature based on or equal to the average value of the first, second, and fourth average values (determined at 608, 612, and 620). Control continues to 736.

At 724, the bottom plate temperature module 512 determines whether the second signal (flag B) is set to the fourth state, such as number 3. The second signal set to the fourth state instructs the bottom plate temperature module 512 to determine the bottom plate temperature based on the measurements from the first, third, and fourth temperature sensors 308. If 724 is true, the bottom plate temperature module 512 determines the bottom plate temperature at 728 based on the first, third, and fourth average values. For example, the bottom plate temperature module 512 can set the bottom plate temperature based on or equal to the average value of the first, third, and fourth average values (determined in 608, 616, and 620). Control continues to 736. If 724 is no, the bottom plate temperature module 512 determines the bottom plate temperature at 732 based on the second, third, and fourth average values. For example, the bottom plate temperature module 512 can set the bottom plate temperature based on or equal to the average value of the second, third, and fourth average values (determined in 612-620). Control continues to 736.

Referring now to FIG. 7, at 740, the statistics module 524 determines the first range of the first, second, third, and fourth average values. The statistics module 524 determines the smallest (smallest) of the first, second, third, and fourth averages, and the largest (largest) of the first, second, third, and fourth averages By. The statistics module 524 sets the first range as the difference between the minimum value and the maximum value of the first, second, third, and fourth average values.

At 744, the debug module 528 determines whether the first range is less than the first temperature range (for example, approximately 1 degree Celsius). If 744 is no, then control continues with 748. If 744 is true, then control continues with 756, which will be discussed further below. At 748, the debug module 528 determines whether the first signal (flag A) is set to the first state, for example, the number 0. The first signal set to the first state may indicate that the measurements from all four temperature sensors 308 are used to determine the bottom plate temperature. If 748 is no, then control transfers to 784, which will be discussed further below. If 748 is true, the debug module 528 sets the first signal (flag A) to the second state, such as the number 1 at 752, and control continues to 784. The first signal set to the second state may indicate that the determination of the bottom plate temperature is shifted from using all four temperature sensors 308 to using less than all four temperature sensors 308.

At 756 (when 744 is true), the baseplate temperature module 512 determines the average temperature based on the first, second, third, and fourth averages. For example, the bottom plate temperature module 512 may set the average temperature based on or equal to the average value of the first, second, third, and fourth average values (determined at 608-620).

At 760, the error detection module 528 determines whether the first signal (flag A) is set to the third state, such as number 2. If 760 is true, at 764, the debug module 528 determines whether the average temperature determined at 756 is within the second temperature of the stored temperature (for example, approximately 0.5 degrees Celsius or 0.25 degrees Celsius). The stored temperature is the last value of the bottom plate temperature output by the bottom plate temperature module 512. If 764 is no, then control transfers to 784, which is discussed further below. If 764 is true, then at 768, the bottom plate temperature module 512 sets the stored temperature to the average temperature determined at 756. The bottom plate temperature module 512 outputs the average temperature determined at 756 as the bottom plate temperature at 772. 764 ensures that the change in the output bottom plate temperature is restricted to be lower than the second temperature. This ensures that the measurement of the temperature probe will not cause a numerical change depending on the determined bottom plate temperature.

In 776, the debug module 528 sets the first signal (flag A) to the first state, such as the number 0. At 780, the debug module 528 sets the second signal (flag B) to the first state, such as the number 0. Control then returns via U to 604 for the next time stamp.

At 784, the statistics module 524 determines the second range of the first, second, and third averages. The statistics module 524 determines the smallest (smallest) of the first, second, and third averages, and the largest (largest) of the first, second, and third averages. The statistics module 524 sets the second range as the difference between the minimum value and the maximum value among the first average value, the second average value, and the third average value.

At 788, the debug module 528 determines whether the second range is less than the first temperature range (for example, approximately 1 degree Celsius). If 788 is no, then control continues at 820 (via R) in Figure 8, which will be discussed further below. If 788 is true, then control continues with 792.

At 792, the bottom plate temperature module 512 determines an average temperature based on the first, second, and third average values. For example, the bottom plate temperature module 512 can set the average temperature based on or equal to the average value of the first, second, and third average values (determined at 608-616).

At 796, the debug module 528 determines whether the first signal (flag A) is set to the second state, for example, the number 1. If 796 is no, then control continues to 804. If 796 is true, then at 800, the debug module 528 determines whether the average temperature determined at 792 is within the second temperature of the stored temperature (for example, approximately 0.5 degrees Celsius or 0.25 degrees Celsius). If 800 is no, then control transfers to 820, which will be discussed further below. If 800 is true, control continues to 804. At 804, the bottom plate temperature module 512 sets the stored temperature to the average temperature determined at 792. At 808, the bottom plate temperature module 512 outputs the average temperature determined at 792 as the bottom plate temperature. 800 ensures that the change in the output bottom plate temperature is restricted to be less than the second temperature.

At 812, the debug module 528 sets the first signal (flag A) to the third state, such as number 2. At 816, the debug module 528 sets the second signal (flag B) to the second state, such as number 1. Control then returns via U to 604 for the next time stamp.

Referring to 820 in FIG. 8, the statistics module 524 determines the third range of the first, second, and fourth average values. The statistics module 524 determines the smallest (smallest) of the first, second, and fourth averages, and the largest (largest) of the first, second, and fourth averages. The statistics module 524 sets the third range as the difference between the minimum value and the maximum value among the first average value, the second average value, and the fourth average value.

At 824, the debug module 528 determines whether the third range is less than the first temperature range (for example, approximately 1 degree Celsius). If 824 is no, then control continues at 852, which will be discussed further below. If 824 is yes, then control continues at 828.

At 828, the bottom plate temperature module 512 determines an average temperature based on the first, second, and fourth average values. The bottom plate temperature module 512 may, for example, set the average temperature based on or equal to the average value of the first, second, and fourth average values (determined in 608, 612, and 620).

At 832, the debug module 528 determines whether the first signal (flag A) is set to the second state, for example, number 1. If 832 is no, then control continues to 836. If 832 is true, then at 834, the debug module 528 determines whether the average temperature determined at 828 is within the second temperature of the stored temperature (for example, approximately 0.5 degrees Celsius or 0.25 degrees Celsius). If 834 is no, then control transfers to 852, which will be discussed further below. If 834 is true, then control continues to 836. At 836, the bottom plate temperature module 512 sets the stored temperature to the average temperature determined at 828. At 840, the bottom plate temperature module 512 outputs the average temperature determined at 828 as the bottom plate temperature. 834 ensures that the change in the output bottom plate temperature is limited to less than the second temperature.

At 844, the debug module 528 sets the first signal (flag A) to the third state, such as number 2. At 848, the debug module 528 sets the second signal (flag B) to the third state, such as number 2. Control then returns to 604 of the next time stamp via U.

At 852, the statistics module 524 determines the fourth range of the first, third, and fourth averages. The statistics module 524 determines the smallest (smallest) of the first, third, and fourth averages, and the largest (largest) of the first, third, and fourth averages. The statistics module 524 sets the fourth range as the difference between the minimum value and the maximum value among the first average value, the third average value, and the fourth average value.

At 856, the debug module 528 determines whether the fourth range is less than the first temperature range (for example, approximately 1 degree Celsius). If 856 is no, then control continues at 888 (via Q) in Figure 9, which will be discussed further below. If 856 is true, then control continues to 860.

At 860, the bottom plate temperature module 512 determines an average temperature based on the first, third, and fourth average values. The bottom plate temperature module 512 may, for example, set the average temperature based on or equal to the average value of the first, third, and fourth average values (determined in 608, 616, and 620).

In 864, the debug module 528 determines whether the first signal (flag A) is set to the second state, for example, the number 1. If 864 is no, then control continues to 872. If 864 is true, then at 868, the debug module 528 determines whether the average temperature determined at 860 is within the second temperature (for example, approximately 0.5 degrees Celsius or 0.25 degrees Celsius) of the stored temperature. If 868 is no, then control transfers to 888 of Figure 9, which will be discussed further below. If 868 is yes, then control continues to 872. At 872, the bottom plate temperature module 512 sets the stored temperature to the average temperature determined at 860. At 876, the bottom plate temperature module 512 outputs the average temperature determined at 860 as the bottom plate temperature. 868 ensures that the change in the output bottom plate temperature is limited to less than the second temperature.

At 880, the debug module 528 sets the first signal (flag A) to the third state, such as number 2. In 884, the debug module 528 sets the second signal (flag B) to the fourth state, such as number 3. Control then returns to 604 of the next time stamp via U.

Referring now to 888 in FIG. 9, the statistics module 524 determines the fifth range of the second, third, and fourth averages. The statistics module 524 determines the smallest (smallest) of the second, third, and fourth averages, and the largest (largest) of the second, third, and fourth averages. The statistics module 524 sets the fifth range as the difference between the minimum value and the maximum value among the second, third, and fourth average values.

At 892, the debug module 528 determines whether the fifth range is less than the first temperature range (for example, approximately 1 degree Celsius). If 892 is no, then any combination of three of the temperature sensors 308 is not within the first temperature range, and control continues 924, which will be discussed further below. If 892 is yes, then control continues to 896.

At 896, the bottom plate temperature module 512 determines an average temperature based on the second, third, and fourth averages. The bottom plate temperature module 512 may, for example, set the average temperature based on or equal to the average value of the second, third, and fourth average values (determined at 612-620).

At 900, the debug module 528 determines whether the first signal (flag A) is set to the second state, such as the number 1. If 900 is no, then control continues to 908. If 900 is true, then at 904, the debugging module 528 determines whether the average temperature determined at 896 is within the second temperature (for example, approximately 0.5 degrees Celsius or 0.25 degrees Celsius) of the stored temperature. If 904 is no, then control transfers to 924, which will be discussed further below. If 904 is true, then control continues with 908.

At 908, the bottom plate temperature module 512 sets the stored temperature to the average temperature determined at 896. At 912, the bottom plate temperature module 512 outputs the average temperature determined at 896 as the bottom plate temperature. 904 ensures that the change in the output bottom plate temperature is limited to be less than the second temperature.

At 916, the debug module 528 sets the first signal (flag A) to the third state, such as number 2. At 920, the debug module 528 sets the second signal (flag B) to the fifth state, for example, number 4. Control then returns to 604 of the next time stamp via T and U.

At 924, the debugging module 528 diagnoses the fault in the temperature probe 216. The debugging module 528 may also take one or more other actions. For example, the debugging module 528 can display a predetermined message related to the fault in the temperature probe 216 on the display 526. Additionally or alternatively, the debug module 528 can cause the system control module 160 to stop substrate processing. For example, the debug module 528 can cause the system control module 160 to activate the gas delivery system 130 and stop the flow of one or more gases to the processing chamber 102. Additionally or alternatively, the debug module 528 may prompt the system control module 160 to adjust the RF generation system 120 to stop powering one, more than one, or all components in the processing chamber 102. The debugging module 528 can disable the bottom plate temperature module 512 at 928. Control can be returned to 604 via T and U, or it can wait until the fault is cleared or repaired.

Although an example of the temperature probe 216 associated with the base plate 110 is provided, the above-mentioned debugging and management is also applicable to the temperature sensor 204 as a temperature probe. In addition, although an example of the temperature probe 216 having four temperature sensors is provided, the temperature probe 216 may include more than four temperature sensors.

The foregoing description is merely illustrative in nature, and is in no way intended to limit the content of the disclosure, its application, or usage. The extensive teachings of the present disclosure can be implemented in a variety of forms. Therefore, although the content of this disclosure includes specific examples, the true scope of the content of this disclosure should not be so limited, because other modifications will become apparent after studying the drawings, the specification, and the scope of the following patent applications. It should be understood that without changing the principle of the disclosure, one or more steps in the method can be executed in a different order (or at the same time). In addition, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure can be implemented in the features of any other embodiment And/or in combination with it, even if the combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and replacement of one or more embodiments with each other is still within the scope of the present disclosure.

Use a variety of terms to describe the spatial and functional relationships between components (for example, between modules, circuit components, semiconductor layers, etc.), including "connection", "bonding", "coupling", "adjacent", and "besides" ", "Top on", "Above", "Below", and "Layout". Unless explicitly described as "direct", when the relationship between the first element and the second element is described in the above disclosure, the relationship may be that there are no other intermediate elements between the first element and the second element. A direct relationship, but it can also be an indirect relationship in which one or more intermediate elements exist (spatially or functionally) between the first and second elements. As used herein, at least one of the terms A, B, and C should be interpreted as expressing logic (A OR B OR C) using non-exclusive logical OR, and should not be interpreted as expressing "at least one A, at least one B , And at least one C".

In some embodiments, the controller is part of the system, which may be part of the above examples. Such systems may include semiconductor processing equipment, including one or more processing stations, one or more chambers, one or more processing platforms, and/or specific processing components (wafer pedestals, airflow systems, etc.) ). These systems can be integrated with electronic devices to control their operations before, during, and after the processing of semiconductor wafers or substrates. Electronic devices can be called "controllers", which can control various components or sub-components of one or more systems. Depending on the processing requirements and/or the type of system, the controller can be programmed to control any of the processes disclosed herein, including processing gas delivery, temperature settings (for example, heating and/or cooling), pressure settings, vacuum settings, power Setting, radio frequency (RF) generator setting, RF matching circuit setting, frequency setting, flow rate setting, fluid delivery setting, position and operation setting, entering and exiting machines and other conveying machines and/or connecting or interfacing with specific systems Wafer transfer in load lock chamber.

Broadly speaking, a controller can be defined as an electronic device with various integrated circuits, logic, memory, and/or software, which receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, and so on. The integrated circuit may include a chip in the form of firmware storing program instructions, a digital signal processor (DSP), a chip defined as an application-specific integrated circuit (ASIC), and/or one or more microprocessors, or an execution program Command microcontroller (for example, software). Program instructions can be instructions, which are sent to the controller in the form of various individual settings (or program files) to define operating parameters used to perform specific processing on or on semiconductor wafers or systems. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer to be used in one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and/or wafers. One or more processing steps are completed during manufacturing.

In some embodiments, the controller may be part of a computer or coupled to the computer, the computer is integrated with the system, coupled to the system, connected to the system in other ways, or a combination thereof. For example, the controller can be in the "cloud" or in all or part of the fab host computer system, which can allow remote access to wafer processing. The computer can allow remote access to the system to monitor the current progress of manufacturing operations, check the history of past manufacturing operations, check trends or performance indicators from multiple manufacturing operations, to change the parameters of the current process, and to set the current process after Processing steps, or start a new process. In some examples, a remote computer (for example, a server) can provide process recipes to the system via a network, and the network can include a local area network or the Internet. The remote computer may include a user interface that allows the input or programming of parameters and/or settings, and then transmits the parameters and/or settings from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be executed and the type of machine that the controller is configured to interface with or control. Therefore, as described above, the controller may be decentralized, for example by including one or more discrete controllers connected together by a network and working toward a common purpose (for example, the process and control described herein) . An example of a decentralized controller used for this purpose would be one or more integrated circuits in the chamber, which are remotely configured with one or more integrated circuits (for example, at the platform level or as part of a remote computer) For communication, these integrated circuits are combined to control the process on the chamber.

Without limitation, exemplary systems may include plasma etching chambers or modules, deposition chambers or modules, spin flush chambers or modules, metal plating chambers or modules, cleaning chambers or modules, Bevel etching chamber or module, physical vapor deposition (PVD) chamber or module, chemical vapor deposition (CVD) chamber or module, atomic layer deposition (ALD) chamber or module, atomic layer etching (ALE) chamber or module, ion implantation chamber or module, orbital chamber or module, and any other semiconductor processing system that can be associated or used in the manufacturing and/or production of semiconductor wafers.

As mentioned above, according to one or more process steps to be executed by the machine, the controller can interact with other machine circuits or modules, other machine components, cluster machines, other machine interfaces, adjacent machines, and nearby machines. A machine, a machine located throughout the factory, a main computer, another controller, or a machine used for material transportation (these machines can transport wafer containers in and out of the machine location and/or load port of the semiconductor manufacturing plant ).

100: Substrate processing system 102: processing chamber 104: Upper electrode 106: base plate support 108: substrate 109: Sprinkler head 110: bottom plate 112: ceramic layer 114: layer 116: coolant channel 120: RF generation system 122: RF voltage generator 124: Matching and Distribution Network 130: Gas delivery system 132-1, 132-2, 132-N: gas source 134-1, 134-2, 134-N: Valve 136-1, 136-2, 136-N: Mass flow controller 140: Manifold 142: Temperature Control Module 144: Thermal Control Element (TCE) 146: coolant assembly 150: Valve 152: Pump 160: System Control Module 170: Robot 172: Load Lock Room 176: Seal 180: edge ring 184: User Interface Device 204: Temperature sensor (temperature probe) 208: circuit board 212: Groove 216: Temperature Probe 304: Thermal Conductor 306: bottom surface 308: temperature sensor 404: Close-up view 406: Circuit Board 408: Fastener 412: Conductor 504: clock 508: Buffer Module 512: Base plate temperature module 516: substrate temperature module 524: Statistics Module 526: display 528: Debugging Module

From the implementation section and accompanying drawings, the content of this disclosure will be more fully understood.

Figure 1 is a functional block diagram of an exemplary substrate processing chamber.

Figure 2 is a cross-sectional view of a portion of an example substrate support.

Figure 3 is a cross-sectional view of a part of the substrate support, temperature probes, and thermal conductors.

Figure 4 includes a perspective view of an example embodiment of a circuit board and a temperature probe, and a close-up view of a portion of the circuit board and the temperature probe.

Figure 5 is a functional block diagram of an example error detection and control system.

Figures 6-9 include flowcharts that describe an exemplary method of determining the bottom plate temperature and managing the use of the first, second, third, and fourth temperature from the temperature sensor of the temperature probe.

In the drawings, reference symbols may be used repeatedly to identify similar and/or identical elements.

110: bottom plate

216: Temperature Probe

304: Thermal Conductor

306: bottom surface

308: temperature sensor

Claims (41)

A substrate processing system, including: A substrate support in a processing chamber for vertically supporting a substrate; A temperature probe, including: A first temperature sensor for measuring the first temperature of the substrate support; A second temperature sensor for measuring the second temperature of the substrate support; A third temperature sensor for measuring the third temperature of the substrate support; and A fourth temperature sensor for measuring the fourth temperature of the substrate support; A temperature module for: In a first state, determining a substrate support temperature of the substrate support based on all of the first, second, third, and fourth temperatures; In a second state, determining the substrate support temperature of the substrate support based on only three of the first, second, third, and fourth temperatures; and A temperature control module is constructed to control at least one of heating and cooling of the substrate support based on the temperature of the substrate support. According to the substrate processing system of claim 1, wherein the temperature module sets the substrate support temperature based on an average value of at least three of the first, second, third, and fourth temperatures. Such as the substrate processing system of claim 1, in which: The base plate support includes: An upper part for vertically supporting the substrate; and A bottom plate to vertically support the upper part; The first temperature sensor is used to measure the first temperature of the bottom plate; The second temperature sensor is used to measure the second temperature of the substrate support; The third temperature sensor is used to measure the third temperature of the substrate support; and The fourth temperature sensor is used to measure the fourth temperature of the substrate support. Such as the substrate processing system of claim 1, in which: The base plate support includes: An upper part for vertically supporting the substrate; and A bottom plate to vertically support the upper part; The first temperature sensor is used to measure the first temperature of the upper part; The second temperature sensor is used to measure the second temperature of the upper part; The third temperature sensor is used to measure the third temperature of the upper part; and The fourth temperature sensor is used to measure the fourth temperature of the upper part. Such as the substrate processing system of claim 1, wherein the temperature module is used to determine the substrate support temperature based on at least three of the following: X first average values of the first temperature, where X is an integer greater than one; X second average values of the second temperature; X third average values of the third temperature; and X fourth average of the fourth temperature. Such as the substrate processing system of claim 5, wherein the temperature module is used for an average value based on at least three of the first average value, the second average value, the third average value, and the fourth average value , To determine the temperature of the substrate support. Such as the substrate processing system of claim 5, wherein when the maximum value is between the first average value, the second average value, the third average value, and the fourth average value, and the first average value, the second average value When the first difference between the minimum of the two average values, the third average value, and the fourth average value is less than a temperature, the temperature module is based on the first average value and the second average value. Value, the third average value, and all of the fourth average value to determine the substrate support temperature. Such as the substrate processing system of claim 7, wherein when the first difference is greater than the substrate support temperature, the temperature module is selected based on three of the first, second, third, and fourth average values Determine the substrate support temperature sexually. Such as the substrate processing system of claim 8, wherein when between the first average value, the second average value, and the third average value one of the second maximum value and the first average value and the second average value When the second difference between a second minimum of, and the third average value is less than the substrate support temperature, the temperature module is based on the first, second, and third average values and The substrate support temperature is not determined based on the fourth average value. Such as the substrate processing system of claim 9, wherein when between the first average value, the second average value, and the third maximum value of the fourth average value and the first average value and the second average value , And a third minimum of the fourth average value when the third difference is less than the substrate support temperature, the temperature module is based on the first, second, and fourth average values and The substrate support temperature is not determined based on the third average value. Such as the substrate processing system of claim 10, wherein when between the first average value, the third average value, and the fourth average value one of the fourth maximum value and the first average value and the third average value When the fourth difference between, and a fourth minimum of the fourth average value is less than the substrate support temperature, the temperature module is based on the first, third, and fourth average values and The substrate support temperature is not determined based on the second average value. Such as the substrate processing system of claim 11, wherein when between the second average value, the third average value, and the fourth average value one of the fifth maximum value and the second average value and the third average value , And a fifth minimum of the fourth average value when the fifth difference is less than the substrate support temperature, the temperature module is based on the second, third, and fourth average values and The substrate support temperature is not determined based on the first average value. For example, the substrate processing system of claim 12 further includes a debugging module. When the first, second, third, fourth, and fifth differences are greater than the substrate support temperature, it indicates that a fault exists In the temperature probe. Such as the substrate processing system of claim 13, wherein when the fault exists in the temperature probe, the error detection module displays an alarm on a display. The substrate processing system of claim 1, wherein the first, second, third, and fourth temperature sensors are solid state temperature sensors. For example, the substrate processing system of claim 1, further comprising a thermally conductive material sandwiched between the substrate support and the first, second, third, and fourth temperature sensors. Such as the substrate processing system of claim 1, which further includes: A statistics module for: Determining a first average value of multiple values of the first temperature; Determining a second average value of the multiple values of the first average value; Determine a first standard deviation of the plurality of values of the first average; Determining a second standard deviation of the multiple time stamps associated with the multiple values of the first average; Determining a correlation coefficient based on the plurality of time stamps and the plurality of values of the first average value; Determine a slope based on the correlation coefficient, the first standard deviation, and the second standard deviation; and An error detection module is used to diagnose whether the slope is within a slope range. For example, the substrate processing system of claim 17, wherein the statistical module is based on (a) the total variance of the plurality of values of the first average value and the plurality of timestamps, (b) the first standard deviation, and (C) The second standard deviation is used to determine the correlation coefficient. For example, the substrate processing system of claim 17, wherein the statistical module sets the slope based on the correlation coefficient multiplied by the first standard deviation divided by the second standard deviation. Such as the substrate processing system of claim 1, wherein the temperature control module is used to perform at least one of the following: Selectively applying power to a thermal control element (TCE) based on the temperature of the substrate support; and The coolant flow rate through the coolant channel in the substrate support is selectively adjusted based on the temperature of the substrate support. A substrate processing system, including: A substrate support in a processing chamber for vertically supporting a substrate; A temperature probe, including: N temperature sensors are used to measure the N temperatures of the substrate support, Among them, N is an integer greater than 3; A temperature module for: In a first state, determining a substrate support temperature of the substrate support based on all of the N temperatures; In a second state, determining the substrate support temperature of the substrate support based on a subset of the N temperatures; and A temperature control module controls at least one of heating and cooling of the substrate support based on the temperature of the substrate support. A method that includes: Using a first temperature sensor of a temperature probe to measure a first temperature of a substrate support that vertically supports a substrate during substrate processing; Measuring a second temperature of the substrate support by a second temperature sensor of the temperature probe; Measuring a third temperature of the substrate support by a third temperature sensor of the temperature probe; Measuring a fourth temperature of the substrate support by a fourth temperature sensor of the temperature probe; In a first state, determining a substrate support temperature of the substrate support based on all of the first, second, third, and fourth temperatures; In a second state, determining the substrate support temperature of the substrate support based on only three of the first, second, third, and fourth temperatures; and At least one of heating and cooling of the substrate support is controlled based on the temperature of the substrate support. The method of claim 22, wherein the step of determining the temperature of the substrate support comprises: setting the temperature of the substrate support based on an average value of at least three of the first, second, third, and fourth temperatures. Such as the method of claim 22, where: The base plate support includes: An upper part for vertically supporting the substrate; and A bottom plate to vertically support the upper part; The step of measuring the first temperature includes measuring the first temperature of the bottom plate; The step of measuring the second temperature includes measuring the second temperature of the substrate support; The step of measuring the third temperature includes measuring the third temperature of the substrate support; and The step of measuring the fourth temperature includes measuring the fourth temperature of the substrate support. Such as the method of claim 22, where: The base plate support includes: An upper part for vertically supporting the substrate; and A bottom plate to vertically support the upper part; The step of measuring the first temperature includes measuring the first temperature of the upper part; The step of measuring the second temperature includes measuring the second temperature of the upper part; The step of measuring the third temperature includes measuring the third temperature of the upper part; and The step of measuring the fourth temperature includes measuring the fourth temperature of the upper portion. The method of claim 22, wherein the step of determining the temperature of the substrate support includes determining the temperature of the substrate support based on at least three of the following: X first average values of the first temperature, where X is an integer greater than one; X second average values of the second temperature; X third average values of the third temperature; and X fourth average of the fourth temperature. The method of claim 26, wherein the step of determining the temperature of the substrate support comprises: an average based on at least three of the first average value, the second average value, the third average value, and the fourth average value Value to determine the substrate support temperature. For example, the method of claim 26, wherein the step of determining the temperature of the substrate support includes: when the maximum value of the first, second, third, and fourth averages is between the first, second, and third When the first difference between the minimum of, and the fourth average value is less than a temperature, the substrate support temperature is determined based on all of the first, second, third, and fourth average values. The method of claim 28, wherein the step of determining the temperature of the substrate support comprises: when the first difference is greater than the temperature of the substrate support, based on three of the first, second, third, and fourth average values Which determines the temperature of the substrate support. The method of claim 29, wherein the step of determining the temperature of the substrate support includes: when a second maximum value is between the first, second, and third average values and the first, second, and third average values When the second difference between the second minimum of the three average values is less than the substrate support temperature, it is determined based on the first, second, and third average values and not based on the fourth average value The substrate support temperature. The method of claim 30, wherein the step of determining the temperature of the substrate support includes: when a third maximum value is between the first, second, and fourth average values and the first, second, and fourth average values When the third difference between the third minimum of the four average values is less than the substrate support temperature, it is determined based on the first, second, and fourth average values and not based on the third average value The substrate support temperature. For example, the method of claim 31, wherein the step of determining the temperature of the substrate support includes: when a fourth maximum value is between the first, third, and fourth average values and the first, third, and fourth average values When the fourth difference between a fourth minimum of the four average values is less than the substrate support temperature, it is determined based on the first, third, and fourth average values and not based on the second average value The substrate support temperature. For example, the method of claim 32, wherein the step of determining the temperature of the substrate support includes: when a fifth maximum value is between the second, third, and fourth average values and the second, third, and fourth average values When the fifth difference between the fifth minimum of the four average values is less than the substrate support temperature, it is determined based on the second, third, and fourth average values and not based on the first average value The substrate support temperature. Such as the method of claim 33, further comprising: when the first, second, third, fourth, and fifth differences are greater than the temperature of the substrate support, indicating that a fault exists in the temperature probe. Such as the method of claim 34, further comprising: displaying an alarm on a display when the fault exists in the temperature probe. The method of claim 22, wherein the first, second, third, and fourth temperature sensors are solid state temperature sensors. Such as the method of claim 22, wherein a thermally conductive material is sandwiched between the substrate support and the first, second, third, and fourth temperature sensors. Such as the method of claim 22, which further includes: Determining a first average value of multiple values of the first temperature; Determining a second average value of the multiple values of the first average value; Determine a first standard deviation of the plurality of values of the first average; Determining a second standard deviation of the multiple time stamps associated with the multiple values of the first average; Determining a correlation coefficient based on the plurality of time stamps and the plurality of values of the first average value; Determine a slope based on the correlation coefficient, the first standard deviation, and the second standard deviation; and Diagnose whether the slope is within a slope range. For example, the method of claim 38, wherein the step of determining the correlation coefficient includes: based on (a) the total variance of the plurality of values of the first average value and the plurality of timestamps, (b) the first standard deviation, And (c) the second standard deviation to determine the correlation coefficient. The method of claim 38, wherein the step of determining the slope includes: setting the slope based on the correlation coefficient multiplied by the first standard deviation divided by the second standard deviation. The method of claim 22, wherein the step of controlling at least one of heating and cooling of the substrate support includes at least one of the following: Selectively applying power to a thermal control element (TCE) based on the temperature of the substrate support; and The coolant flow rate through the coolant channel in the substrate support is selectively adjusted based on the temperature of the substrate support.

Images