TW202136705A - Article penetrating electrode - Google Patents

Article penetrating electrode Download PDF

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TW202136705A
TW202136705A TW109127751A TW109127751A TW202136705A TW 202136705 A TW202136705 A TW 202136705A TW 109127751 A TW109127751 A TW 109127751A TW 109127751 A TW109127751 A TW 109127751A TW 202136705 A TW202136705 A TW 202136705A
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Taiwan
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electrode
deployment
tether
unit
processing circuit
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TW109127751A
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Chinese (zh)
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派崔克 史密斯
史帝芬 布朗杜
路克 賽利斯柏
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美商愛克勝企業公司
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Publication of TW202136705A publication Critical patent/TW202136705A/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F41WEAPONS
    • F41HARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
    • F41H13/00Means of attack or defence not otherwise provided for
    • F41H13/0012Electrical discharge weapons, e.g. for stunning
    • F41H13/0025Electrical discharge weapons, e.g. for stunning for remote electrical discharge via conducting wires, e.g. via wire-tethered electrodes shot at a target
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F41WEAPONS
    • F41AFUNCTIONAL FEATURES OR DETAILS COMMON TO BOTH SMALLARMS AND ORDNANCE, e.g. CANNONS; MOUNTINGS FOR SMALLARMS OR ORDNANCE
    • F41A19/00Firing or trigger mechanisms; Cocking mechanisms
    • F41A19/58Electric firing mechanisms
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42AMMUNITION; BLASTING
    • F42BEXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B12/00Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material
    • F42B12/02Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the warhead or the intended effect
    • F42B12/36Projectiles, missiles or mines characterised by the warhead, the intended effect, or the material characterised by the warhead or the intended effect for dispensing materials; for producing chemical or physical reaction; for signalling ; for transmitting information
    • F42B12/362Arrows or darts

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • User Interface Of Digital Computer (AREA)
  • Electrotherapy Devices (AREA)

Abstract

An article penetrating electrode may be used in a conducted electrical weapon (“CEW”). The article penetrating electrode may be configured to penetrate through articles worn by a target, such as clothing and body armor. The article penetrating electrode may have an elongated body or needle shape configured to aid the article penetrating electrode in penetrating articles. The elongated body may have a contact end opposite a tether end. The article penetrating electrode may include a tether coupled directly to the tether end and configured to provide an electrical current to the article penetrating electrode.

Description

物件穿透式電極Object penetration electrode

本發明的實施例有關供使用於傳導式電武器(「CEW」)之電極。The embodiment of the present invention relates to electrodes for use in conductive electric weapons ("CEW").

系統、方法、和設備可使用於干擾目標的自主運動(例如,步行、跑步、移動等)。例如,可使用傳導式電武器(例如,「CEW」傳導式能量武器、導電武器等)來將電流(例如,刺激信號、電流脈衝、充電脈衝等)傳輸經過人或動物目標之組織。刺激信號將電荷帶入目標組織。刺激信號可干擾目標的自主運動。刺激信號可造成疼痛。疼痛亦可作用來促使目標停止移動。刺激信號可造成目標之骨骼肌肉變僵硬(例如鎖定、凍結等)。回應於刺激信號的肌肉之僵硬可稱為神經肌肉喪失行為能力(「NMI」)。NMI破壞對目標肌肉的自主控制。目標無法控制其肌肉會干擾目標之運動。The system, method, and device can be used to interfere with the autonomous movement of the target (eg, walking, running, moving, etc.). For example, conductive electric weapons (eg, "CEW" conductive energy weapons, conductive weapons, etc.) can be used to transmit current (eg, stimulation signals, current pulses, charging pulses, etc.) through the tissues of human or animal targets. The stimulus signal brings the charge into the target tissue. The stimulus signal can interfere with the voluntary movement of the target. Stimulus signals can cause pain. Pain can also act to cause the target to stop moving. The stimulus signal can cause the target's skeletal muscles to become rigid (such as locking, freezing, etc.). The stiffness of muscles in response to stimulus signals can be referred to as neuromuscular incapacity ("NMI"). NMI disrupts autonomous control of target muscles. The target’s inability to control its muscles will interfere with the target’s movement.

刺激信號可經由耦接至CEW的端子通過目標傳輸。經由端子之傳輸可稱為局部傳輸(例如,局部眩暈)。在局部傳輸期間,藉由將CEW定位於目標附近,使端子帶至接近目標。刺激信號經由端子傳輸通過目標的組織。為了提供局部傳輸,CEW之使用者通常在目標的伸手可及之範圍內,並將CEW的端子帶入與目標接觸或接近目標。The stimulation signal can be transmitted through the target via a terminal coupled to the CEW. Transmission via the terminal may be referred to as local transmission (for example, local vertigo). During the partial transmission, the terminal is brought close to the target by positioning the CEW near the target. The stimulus signal is transmitted through the target tissue via the terminal. In order to provide local transmission, the user of CEW is usually within reach of the target and brings the terminal of the CEW into contact with or close to the target.

刺激信號可經由一或更多(典型至少二個)電線-繫繩式電極傳輸通過目標。經由電線-繫繩式電極之傳輸可稱為遠程傳輸(例如,遠程眩暈)。於遠程傳輸期間,CEW可為與目標分開,直至電線繫繩的長度(例如15英尺、20英尺、30英尺等)為止。CEW向目標發射電極。當電極向目標行進時,它們各自之電線繫繩會在電極後面展開。電線繫繩將CEW電耦接至電極。電極可電耦接至目標,從而將CEW耦接至目標。回應於與目標組織連接、撞擊於目標組織上、或定位接近目標組織的電極,可經由電極通過目標提供電流(例如,通過第一繫繩和第一電極、目標組織、及第二繫繩和第二電極形成電路)。The stimulus signal can be transmitted through the target via one or more (typically at least two) wire-tether electrodes. Transmission via wire-tethered electrodes can be referred to as remote transmission (for example, remote vertigo). During long-distance transmission, the CEW can be separated from the target until the length of the wire tether (for example, 15 feet, 20 feet, 30 feet, etc.). CEW emits the electrode to the target. As the electrodes travel towards the target, their respective wire tethers will unfold behind the electrodes. The wire tether electrically couples the CEW to the electrode. The electrode can be electrically coupled to the target, thereby coupling the CEW to the target. In response to electrodes connected to the target tissue, impacting on the target tissue, or positioned close to the target tissue, current can be supplied through the target through the electrodes (for example, through the first tether and the first electrode, the target tissue, and the second tether and The second electrode forms a circuit).

接觸或接近目標組織之端子或電極傳輸通過目標之刺激信號。端子或電極與目標組織的接觸與目標組織建立電耦接(例如「電路」)。電極可包括能刺穿目標組織以接觸目標之矛。近接目標組織的端子或電極可使用電離以與目標組織建立電耦接。電離亦可稱為電弧。Terminals or electrodes touching or close to the target tissue transmit stimulus signals through the target. The contact of the terminal or electrode with the target tissue establishes an electrical coupling with the target tissue (for example, a "circuit"). The electrode may include a spear that can pierce the target tissue to contact the target. Terminals or electrodes that are close to the target tissue can use ionization to establish electrical coupling with the target tissue. Ionization can also be referred to as an arc.

在使用中(例如,於展開期間),端子或電極可藉由目標之衣服或空氣間隙而與目標的組織分開。在諸多實施例中,CEW之信號產生器可於高電壓(例如在40,000至100,000伏特的範圍中)下提供刺激信號(例如電流、電流脈衝等),以使衣服中之空氣或間隙中的空氣電離,所述空氣將端子或電極與目標組織分開。對空氣進行電離建立從端子或電極至目標組織之低電阻電離路徑,其可使用來經由電離路徑將刺激信號傳輸進入目標組織。只要經由電離路徑提供刺激信號的脈衝電流,電離路徑就持續存在(例如,保持存在、持續等)。當電流停止或減小至閾值(例如,安培數、電壓)以下時,電離路徑崩潰(例如,不再存在),且端子或電極不再電耦接至目標組織。缺少電離路徑,端子或電極與目標組織之間的電阻很高。約50,000伏特範圍中之高電壓可使高達約1英寸的間隙中之空氣電離。In use (for example, during deployment), the terminal or electrode can be separated from the target tissue by the target's clothing or air gap. In many embodiments, the signal generator of CEW can provide stimulation signals (such as current, current pulse, etc.) under high voltage (such as in the range of 40,000 to 100,000 volts) to make the air in the clothes or the air in the gap Ionization, the air separates the terminal or electrode from the target tissue. Ionization of air establishes a low-resistance ionization path from the terminal or electrode to the target tissue, which can be used to transmit stimulation signals into the target tissue via the ionization path. As long as the pulsed current of the stimulation signal is provided via the ionization path, the ionization path continues to exist (for example, remains alive, continues, etc.). When the current stops or decreases below a threshold (e.g., amperage, voltage), the ionization path collapses (e.g., no longer exists), and the terminal or electrode is no longer electrically coupled to the target tissue. Without an ionization path, the resistance between the terminal or electrode and the target tissue is high. High voltages in the range of about 50,000 volts can ionize air in gaps up to about 1 inch.

CEW可提供刺激信號作為一系列電流脈衝。每一電流脈衝可包括高電壓部分(例如40,000-100,000伏特)和低電壓部分(例如500-6,000伏特)。刺激信號的脈衝之高電壓部分可使電極或端子與目標之間的間隙中之空氣電離,以將電極或端子電耦接至目標。回應於電極或端子電耦接至目標,脈衝的低電壓部分經由電離路徑將一定量之電荷傳輸進入目標的組織。回應於電極或端子藉由接觸(例如,觸摸、嵌入組織之矛等)電耦接至目標,脈衝的高部分和脈衝之低部分都將電荷輸送至目標的組織。通常,脈衝之低電壓部分將脈衝的大部分電荷傳輸進入目標組織。在諸多實施例中,刺激信號之脈衝的高電壓部分可稱為火花或電離部分。脈衝之低電壓部分可稱為肌肉部分。CEW can provide stimulation signals as a series of current pulses. Each current pulse may include a high voltage portion (e.g., 40,000-100,000 volts) and a low voltage portion (e.g., 500-6,000 volts). The high-voltage part of the pulse of the stimulation signal can ionize the air in the gap between the electrode or terminal and the target to electrically couple the electrode or terminal to the target. In response to the electrode or terminal being electrically coupled to the target, the low voltage portion of the pulse transfers a certain amount of charge into the tissue of the target via the ionization path. In response to the electrodes or terminals being electrically coupled to the target by contact (for example, touch, spear embedded in tissue, etc.), both the high part of the pulse and the low part of the pulse deliver charge to the target tissue. Generally, the low voltage portion of the pulse transfers most of the charge of the pulse into the target tissue. In many embodiments, the high-voltage part of the pulse of the stimulation signal may be referred to as the spark or ionization part. The low-voltage part of the pulse can be called the muscle part.

於諸多實施例中,CEW的信號產生器可僅在低電壓(例如,小於2,000伏特)下提供刺激信號(例如,電流、電流脈衝等)。低電壓刺激信號可能不會使衣服中之空氣或將端子或電極與目標組織分開的間隙中之空氣電離。具有僅在低電按下提供刺激信號的信號產生器(例如,低電壓信號產生器)之CEW可需要藉由接觸(例如,觸摸、嵌入組織的矛等)將展開之電極電耦接至目標。In many embodiments, the signal generator of the CEW can only provide stimulation signals (for example, current, current pulses, etc.) at a low voltage (for example, less than 2,000 volts). The low-voltage stimulus signal may not ionize the air in the clothing or the air in the gap separating the terminal or electrode from the target tissue. CEWs with signal generators that provide stimulation signals only at low voltage presses (for example, low voltage signal generators) may need to electrically couple the deployed electrodes to the target by contact (for example, touch, spear embedded in tissue, etc.) .

CEW可在CEW的一面處包括至少二端子。CEW可為用於接納展開單元(例如匣體)之每一機架而包括二端子。端子係彼此隔開。回應於尚未展開的機架中之展開單元的電極,在端子上施加之高電壓將導致端子之間的空氣之電離。端子之間的電弧可為肉眼可見的。回應於不電耦接至目標之發射的電極,已經由電極提供之電流可經由端子在CEW的該面上電弧放電。The CEW may include at least two terminals on one side of the CEW. The CEW may include two terminals for each rack for receiving the unfolding unit (such as the box). The terminals are separated from each other. In response to the electrodes of the unfolding unit in the unfolded frame, the high voltage applied to the terminals will cause the ionization of the air between the terminals. The arc between the terminals can be visible to the naked eye. In response to the emitting electrode that is not electrically coupled to the target, the current that has been provided by the electrode can arc on the face of the CEW via the terminal.

當傳輸刺激信號之電極隔開至少6英寸(15.24公分)時,刺激信號將造成NMI的可能性增加,致使來自刺激信號之電流流經目標組織的6英寸或更多英寸。於諸多實施例中,電極較佳地係應在目標上隔開至少12英寸(30.48公分)。因為CEW上的端子典型隔開小於6英寸,經由端子傳輸通過目標組織之刺激信號將可能不會造成NMI,而只會造成疼痛。When the electrodes transmitting the stimulation signal are separated by at least 6 inches (15.24 cm), the possibility that the stimulation signal will cause NMI increases, causing the current from the stimulation signal to flow 6 inches or more of the target tissue. In many embodiments, the electrodes should preferably be at least 12 inches (30.48 cm) apart on the target. Because the terminals on the CEW are typically separated by less than 6 inches, the stimulus signal transmitted through the target tissue through the terminals may not cause NMI, but will only cause pain.

一系列脈衝可包括及時分開的二或更多脈衝。每一脈衝將一定量之電荷傳輸進入目標組織。回應於電極被適當地隔開(如上所討論),隨著在每脈衝55微庫侖至71微庫侖的範圍中使每一脈衝傳輸一定量之電荷,誘發NMI的可能性增加。當脈衝輸送之速率(例如,速率、脈衝率、重複率等)係於每秒11個脈衝(「pps」)與50 pps之間時,誘發NMI的可能性增加。在較高速率傳輸之脈衝可於每脈衝提供較少的電荷以誘發NMI。每脈衝傳輸更多電荷之脈衝能以較低的速率傳輸以誘發NMI。在諸多實施例中,CEW可為手持式並使用電池來提供刺激信號之脈衝。回應於每脈衝的電荷量高且脈衝率高,CEW可使用比所需者更多之能量來誘發NMI。使用比所需者更多的能量來使電池更快地耗盡。A series of pulses may include two or more pulses separated in time. Each pulse transfers a certain amount of charge into the target tissue. In response to the electrodes being properly spaced (as discussed above), as each pulse transfers a certain amount of charge in the range of 55 microcoulombs to 71 microcoulombs per pulse, the probability of inducing NMI increases. When the rate of pulse delivery (for example, rate, pulse rate, repetition rate, etc.) is between 11 pulses per second ("pps") and 50 pps, the possibility of inducing NMI increases. Pulses transmitted at a higher rate can provide less charge per pulse to induce NMI. Pulses that transfer more charge per pulse can be transferred at a lower rate to induce NMI. In many embodiments, the CEW can be handheld and use batteries to provide pulses of stimulation signals. In response to the high amount of charge per pulse and the high pulse rate, CEW can use more energy than needed to induce NMI. Use more energy than needed to drain the battery faster.

經驗測試已顯示,回應於小於44 pps之脈衝率且每脈衝的電荷約為63微庫侖,電池之功率可被保存且有造成NMI的高可能性。經驗測試已顯示,當電極間距約為12英寸(30.48公分)時,經由一對電極產生之22 pps的脈衝率和每脈衝63微庫侖將誘發NMI。Empirical tests have shown that in response to a pulse rate of less than 44 pps and the charge per pulse is about 63 microcoulombs, the power of the battery can be preserved and there is a high possibility of causing NMI. Empirical tests have shown that when the electrode spacing is about 12 inches (30.48 cm), a pulse rate of 22 pps generated by a pair of electrodes and 63 microcoulombs per pulse will induce NMI.

在諸多實施例中,CEW可包括握把和一或更多展開單元。握把可包括用於承納展開單元的一或更多機架。每一展開單元能可移除地定位在(例如,插入、耦接至等)機架中。每一展開單元能可釋放地用電力、電子、及/或機械地耦接至機架。於諸多實施例中,CEW可包括建構為承納包含一或更多電極之彈匣的機架。CEW之展開(例如,發射)可朝目標發射一或更多電極,以將刺激信號遠程傳輸通過目標。In many embodiments, the CEW may include a grip and one or more deployment units. The grip may include one or more racks for accommodating the deployment unit. Each deployment unit can be removably positioned (eg, inserted into, coupled to, etc.) in the rack. Each deployment unit can be releasably electrically, electronically, and/or mechanically coupled to the rack. In many embodiments, the CEW may include a frame configured to receive a magazine containing one or more electrodes. The deployment (e.g., launch) of the CEW can launch one or more electrodes towards the target to transmit the stimulation signal remotely through the target.

在諸多實施例中,展開單元可包括同時發射的二或更多電極。於諸多實施例中,展開單元可包括能在分開之時間發射的二或更多電極。發射電極可稱為啟動(例如,擊發)展開單元。於使用(例如,啟動、擊發)之後,可將展開單元從機架中移除,並用未使用(例如,未擊發、未啟動)展開單元替換,以允許發射額外的電極。In many embodiments, the deployment unit may include two or more electrodes that emit at the same time. In many embodiments, the deployment unit may include two or more electrodes that can emit at separate times. The transmitting electrode may be referred to as an initiating (e.g., firing) deployment unit. After use (e.g., priming, firing), the deployment unit can be removed from the rack and replaced with an unused (e.g., unfired, unprimed) deployment unit to allow additional electrodes to be fired.

本文中之示範性實施例的詳細敘述參考附圖,其藉由說明顯示示範性實施例。儘管充分詳細地敘述這些實施例以使熟諳本技術領域之人員能夠實踐本揭示內容,但是應當理解,可實現其他實施例,並可按照本揭示內容和本文中的教導作成設計和組構中之邏輯變化和修正。因此,僅出於說明而非限制之目的來呈現本文之詳細敘述。The detailed description of the exemplary embodiments herein refers to the accompanying drawings, which show the exemplary embodiments by way of description. Although these embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure, it should be understood that other embodiments can be implemented and can be designed and constructed in accordance with the present disclosure and the teachings herein. Logic changes and corrections. Therefore, the detailed description in this article is presented only for the purpose of illustration and not limitation.

本揭示內容的範圍藉由所附請求項及其合法同等項而不是僅藉由所述範例來定義。例如,在任何方法或製程敘述中所列舉之步驟能以任何順序執行,且不必受限於所呈現的順序。再者,對單數之任何引用包括複數實施例,且對不止一部件或步驟的任何引用可包括單一實施例或步驟。而且,對附接、固定、耦接、連接等之任何引用可包括永久性、可移除、臨時、部份、完全及/或任何其他可能的附接選項。另外,對無接觸(或類似片語)之任何引用亦可包括減少接觸或最小接觸。遍及附圖可使用表面陰影線來表示不同的零件,而不必表示相同或不同之材料。The scope of the present disclosure is defined by the appended claims and their legal equivalents rather than only by the examples. For example, the steps listed in any method or process description can be performed in any order, and are not necessarily limited to the order presented. Furthermore, any reference to the singular includes plural embodiments, and any reference to more than one component or step may include a single embodiment or step. Moreover, any reference to attachment, fixation, coupling, connection, etc. may include permanent, removable, temporary, partial, complete, and/or any other possible attachment options. In addition, any reference to no contact (or similar phrases) can also include reduced contact or minimal contact. Surface hatching can be used throughout the drawings to indicate different parts, and not necessarily the same or different materials.

在諸多實施例中,並參考圖1,揭示CEW 1。CEW 1可為類似於具有本文先前討論之CEW的部件、或具有類似之態樣及/或部件。應藉由熟諳本技術領域者所理解的是,圖1係CEW 1之示意圖,且CEW 1的一或更多部件可為坐落在外殼10內、或外殼10外側之任何合適位置中。CEW1可包含外殼10和一或更多展開單元20(例如匣體)。In many embodiments, and referring to FIG. 1, CEW 1 is disclosed. The CEW 1 may be similar to the components of the CEW previously discussed herein, or have similar aspects and/or components. It should be understood by those skilled in the art that FIG. 1 is a schematic diagram of CEW 1, and one or more components of CEW 1 may be located in any suitable position inside or outside the housing 10. The CEW1 may include a housing 10 and one or more deployment units 20 (e.g., cassettes).

外殼10可建構為容納CEW 1的諸多部件,所述部件建構為能夠使展開單元20展開,將電流提供至展開單元20,及以別的方式輔助CEW 1之操作,如本文中所進一步討論的。儘管於圖1中描繪為槍支,外殼10可包含任何合適之形狀及/或尺寸。外殼10可包含與展開端部14相反的握把端部12。展開端部14可被建構、設計尺寸和塑形,以承納一或更多展開單元20。可設計握把端部12之尺寸和形狀,以固持在使用者的手中。例如,握把端部12可塑形為握把,以能夠讓使用者手動操作CEW。於諸多實施例中,握把端部12亦可包含塑形為適合使用者之手的輪廓、例如符合人體工程學之握把。握把端部12可包括表面塗層、例如防滑表面、抓握墊片、橡膠質地等。作為另一範例,根據需要,握把端部12可包裹在皮革、彩色印刷、及/或任何其他合適的材料中。The housing 10 may be constructed to accommodate many components of the CEW 1, which are constructed to enable the deployment unit 20 to be deployed, provide current to the deployment unit 20, and assist the operation of the CEW 1 in other ways, as discussed further herein . Although depicted as a gun in FIG. 1, the housing 10 may include any suitable shape and/or size. The housing 10 may include a grip end 12 opposite to the deployed end 14. The deployment end 14 can be constructed, sized and shaped to accommodate one or more deployment units 20. The size and shape of the grip end 12 can be designed to be held in the user's hand. For example, the grip end 12 may be shaped as a grip to enable the user to manually operate the CEW. In many embodiments, the grip end 12 may also include a contour shaped to fit the user's hand, such as an ergonomic grip. The grip end 12 may include a surface coating, such as a non-slip surface, a grip pad, a rubber texture, and the like. As another example, the grip end 12 can be wrapped in leather, color printing, and/or any other suitable material as needed.

於諸多實施例中,外殼10可包含諸多機械、電子和電氣部件,其建構來輔助施行CEW 1之功能。例如,外殼10可包含一或更多扳機40、控制界面45、處理電路50、電源60、及/或信號產生器70。外殼10可包括防護件30。防護件30可界定在外殼10中所形成的開口。防護件30可坐落於外殼10之中心區域上(例如,如圖1中所描繪)、及/或在外殼10上的任何其他合適位置中。扳機40可為設置於防護件30內。防護件30可建構為保護扳機40免受無意之物理接觸(例如,扳機40的無意啟動)。防護件30可將扳機40圍繞在外殼10內。In many embodiments, the housing 10 may include many mechanical, electronic, and electrical components, which are constructed to assist in performing the functions of the CEW 1. For example, the housing 10 may include one or more triggers 40, a control interface 45, a processing circuit 50, a power supply 60, and/or a signal generator 70. The housing 10 may include a guard 30. The guard 30 may define an opening formed in the housing 10. The guard 30 may be located on the central area of the housing 10 (for example, as depicted in FIG. 1 ), and/or in any other suitable position on the housing 10. The trigger 40 may be arranged in the guard 30. The guard 30 may be configured to protect the trigger 40 from unintentional physical contact (for example, unintentional activation of the trigger 40). The guard 30 can surround the trigger 40 in the housing 10.

在諸多實施例中,扳機40耦接至外殼10之外表面,並可建構為於施加物理接觸時移動、滑動、旋轉、或以別的方式變得物理地按下。例如,扳機40可藉由從防護件30內施加至扳機40之物理接觸來致動。扳機40可包含機械或機電開關、按鈕、觸發件等。例如,扳機40可包含開關、按鈕、及/或任何其他合適類型的扳機。扳機40可機械地及/或電子地耦接至處理電路50。回應於扳機40之啟動(例如,使用者按下、推動等),處理電路50可能夠使一或更多展開單元20由CEW 1展開,如本文中所進一步討論者。In many embodiments, the trigger 40 is coupled to the outer surface of the housing 10 and can be configured to move, slide, rotate, or otherwise become physically pressed when a physical contact is applied. For example, the trigger 40 can be actuated by physical contact applied to the trigger 40 from within the guard 30. The trigger 40 may include mechanical or electromechanical switches, buttons, triggers, and the like. For example, the trigger 40 may include a switch, a button, and/or any other suitable type of trigger. The trigger 40 may be mechanically and/or electronically coupled to the processing circuit 50. In response to the activation of the trigger 40 (eg, the user presses, pushes, etc.), the processing circuit 50 may be able to cause one or more deployment units 20 to be deployed by the CEW 1, as discussed further herein.

在諸多實施例中,電源60可建構為向CEW 1的諸多部件提供功率。例如,電源60可提供用於操作CEW 1及/或一或更多展開單元20之電子及/或電氣部件(例如,零件、子系統、電路)的能量。電源60可提供電力。提供電力可包括以電壓提供電流。電源60可電耦接至處理電路50及/或信號產生器70。在諸多實施例中,回應於包含電子物品及/或部件之控制界面45,電源60可電耦接至控制界面45。在一些實施例中,回應於包含電子物品或部件的扳機40,電源60可電耦接至扳機40。電源60可提供在電按下之電流。來自電源60的電力可提供為直流電(「DC」)。來自電源60之電力可提供為交流電(「AC」)。電源60可包括電池。電源60的能量可為能再生或可耗盡的、及/或可替換的。例如,電源60可包含一或更多可再充電或一次性電池。於諸多實施例中,來自電源60之能量可從一形式(例如電、磁、熱)轉換成另一形式以施行系統的功能。In many embodiments, the power supply 60 may be configured to provide power to many components of the CEW 1. For example, the power supply 60 may provide energy for operating the CEW 1 and/or one or more electronic and/or electrical components (eg, parts, subsystems, circuits) of the deployment unit 20. The power supply 60 can provide power. Supplying power may include supplying current at voltage. The power supply 60 can be electrically coupled to the processing circuit 50 and/or the signal generator 70. In many embodiments, in response to the control interface 45 including electronic items and/or components, the power supply 60 may be electrically coupled to the control interface 45. In some embodiments, in response to the trigger 40 including an electronic article or component, the power source 60 may be electrically coupled to the trigger 40. The power supply 60 can provide the current when the power is pressed. The power from the power source 60 may be provided as direct current ("DC"). The power from the power source 60 may be provided as alternating current ("AC"). The power source 60 may include a battery. The energy of the power source 60 may be renewable or exhaustable, and/or replaceable. For example, the power source 60 may include one or more rechargeable or disposable batteries. In many embodiments, the energy from the power source 60 can be converted from one form (such as electricity, magnetism, and heat) to another form to perform the function of the system.

電源60可提供用來施行CEW 1之功能的能量。例如,電源60可將電信號提供至信號產生器70,所述信號產生器70係提供經過目標,以阻止目標之運動(例如,經由展開單元20)。電源60可提供用於刺激信號的能量。如本文所進一步討論的,電源60可提供用於包括點火射擊信號及/或整合信號之其他信號的能量。The power supply 60 can provide energy for performing the functions of the CEW 1. For example, the power supply 60 may provide an electrical signal to the signal generator 70, which provides a passing target to prevent the target from moving (for example, via the deployment unit 20). The power supply 60 can provide energy for the stimulation signal. As discussed further herein, the power supply 60 may provide energy for other signals including the firing signal and/or the integrated signal.

在諸多實施例中,處理電路50可包含建構為施行本文所討論之諸多操作和功能的任何電路系統、電氣部件、電子部件、軟體、及/或類似者。例如,處理電路50可包含處理電路、處理器、數位信號處理器、微控制器、微處理器、特定應用積體電路(ASIC)、可程式化邏輯裝置、邏輯電路系統、狀態機、MEMS裝置、信號調節電路系統、通訊電路系統、電腦、基於電腦之系統、無線電、網路設備、資料匯流排、位址匯流排、及/或其任何組合。在諸多實施例中,處理電路50可包括被動電子裝置(例如,電阻器、電容器、電感器等)及/或主動電子裝置(例如運算放大器、比較器、類比-數位轉換器、數位-類比轉換器、可程式化邏輯、SRCs、電晶體等)。於諸多實施例中,處理電路50可包括資料匯流排、輸出埠、輸入埠、計時器、記憶體、算術單元及/或類似者。In many embodiments, the processing circuit 50 may include any circuit system, electrical components, electronic components, software, and/or the like configured to perform many operations and functions discussed herein. For example, the processing circuit 50 may include processing circuits, processors, digital signal processors, microcontrollers, microprocessors, application-specific integrated circuits (ASICs), programmable logic devices, logic circuit systems, state machines, MEMS devices , Signal conditioning circuit systems, communication circuit systems, computers, computer-based systems, radios, network equipment, data buses, address buses, and/or any combination thereof. In many embodiments, the processing circuit 50 may include passive electronic devices (for example, resistors, capacitors, inductors, etc.) and/or active electronic devices (for example, operational amplifiers, comparators, analog-to-digital converters, digital-to-analog converters). Devices, programmable logic, SRCs, transistors, etc.). In many embodiments, the processing circuit 50 may include a data bus, an output port, an input port, a timer, a memory, an arithmetic unit, and/or the like.

在諸多實施例中,CEW可包含建構為儲存資料、指令、程序等之記憶體。記憶體可包含實體的非暫態電腦可讀記憶體。處理電路50可包含記憶體或與記憶體通訊。處理電路50可與記憶體通訊以存取、檢索及/或發送資料、指令、及/或程式至記憶體。如本文所述,儲存於實體非暫態記憶體上之指令可允許處理電路50以施行諸多操作、功能、及/或步驟。例如,回應於在實體非暫態記憶體上執行指令的處理電路50,處理電路50可與信號產生器70及/或展開單元20通訊,以展開許多發射體、發射體類型等,如本文所進一步討論。於諸多實施例中,處理電路50可回應於控制界面45、第二控制界面245、及/或扳機40之操作來執行指令,如本文中所進一步討論的。In many embodiments, the CEW may include memory configured to store data, instructions, programs, etc. The memory may include physical non-transitory computer readable memory. The processing circuit 50 may include a memory or communicate with the memory. The processing circuit 50 can communicate with the memory to access, retrieve and/or send data, commands, and/or programs to the memory. As described herein, the instructions stored on the physical non-transitory memory may allow the processing circuit 50 to perform many operations, functions, and/or steps. For example, in response to the processing circuit 50 executing instructions on the physical non-transitory memory, the processing circuit 50 can communicate with the signal generator 70 and/or the expansion unit 20 to expand many emitters, emitter types, etc., as described herein further discussion. In many embodiments, the processing circuit 50 can execute commands in response to the operation of the control interface 45, the second control interface 245, and/or the trigger 40, as discussed further herein.

處理電路50可建構為提供及/或接收形式是否為數位及/或類比之電信號。處理電路50可使用任何協定經由資料匯流排來提供及/或接收數位資訊。處理電路50可接收資訊、操縱所接收的資訊、並提供所操縱之資訊。處理電路50可儲存資訊並取回所儲存的資訊。藉由處理電路50所接收、儲存、及/或操縱之資訊可使用於施行功能、控制功能、及/或施行操作或執行所儲存的程式。The processing circuit 50 can be configured to provide and/or receive electrical signals in the form of digital and/or analog. The processing circuit 50 can use any protocol to provide and/or receive digital information via the data bus. The processing circuit 50 can receive information, manipulate the received information, and provide the manipulated information. The processing circuit 50 can store information and retrieve the stored information. The information received, stored, and/or manipulated by the processing circuit 50 can be used to perform functions, control functions, and/or perform operations or execute stored programs.

處理電路50可控制CEW 1之其他電路及/或部件的操作及/或功能。處理電路50可接收關於其他部件之操作的狀態資訊,相對於狀態資訊施行計算,並將命令(例如,指令)提供至一或更多其他部件。處理電路50可命令另一部件以開始操作、繼續操作、變更操作、暫停操作、停止操作等。可經由包括任何類型之資料/位址匯流排的任何類型之匯流排(例如,SPI匯流排)在處理電路50與其他電路及/或部件之間傳遞命令及/或狀態。The processing circuit 50 can control the operations and/or functions of other circuits and/or components of the CEW 1. The processing circuit 50 can receive status information about the operation of other components, perform calculations relative to the status information, and provide commands (for example, instructions) to one or more other components. The processing circuit 50 may command another component to start operation, continue operation, change operation, pause operation, stop operation, and so on. Commands and/or states can be transferred between the processing circuit 50 and other circuits and/or components via any type of bus including any type of data/address bus (for example, an SPI bus).

處理電路50可電氣及/或電子地耦接至展開單元20。處理電路50可建構為從展開單元20決定一或更多展開單元特徵。展開單元特徵可包括指示展開單元的諸多特徵之資料。展開單元特徵可包括展開單元類型、發射體類型、發射體位置、展開指令、及/或與展開單元、發射體、CEW有關的任何其他合適或所期望之資訊、或來自展開單元的發射體之展開。The processing circuit 50 may be electrically and/or electronically coupled to the unfolding unit 20. The processing circuit 50 may be configured to determine one or more characteristics of the unfolding unit from the unfolding unit 20. The features of the unfolded unit may include data indicating many features of the unfolded unit. Unfolding unit characteristics may include unfolding unit type, projectile type, projectile position, unfolding instructions, and/or any other suitable or desired information related to the unfolding unit, projectile, CEW, or information about the projectile from the unfolding unit Unfold.

展開單元類型可包含關於展開單元類型的資料、例如訓練展開單元、混合式發射體展開單元(例如,展開單元具有複數發射體類型、例如低穿透式發射體和物件穿透式發射體)、相同之發射體展開單元、低穿透式發射體展開單元(例如,僅包含低穿透式發射體的展開單元)、物件穿透式發射體展開單元(例如,僅包含物件穿透式發射體之展開單元)、及/或類似物。The expansion unit type may include information about the expansion unit type, such as training expansion unit, hybrid projectile deployment unit (for example, the deployment unit has multiple projectile types, such as low-penetration projectiles and object-penetrating projectiles), The same projectile deployment unit, low-penetration projectile deployment unit (for example, only a low-penetration projectile deployment unit), object-penetrating projectile deployment unit (for example, only an object-penetrating projectile The unfolding unit), and/or the like.

發射體類型可包含關於展開單元中的每一發射體、例如低穿透式發射體、物件穿透式發射體、其他致命性較低之發射體等類型的資料。發射體類型亦可包含關於展開單元中之發射體數目及/或展開單元中的每一發射體類型之數目(例如6個低穿透式發射體、3個物件穿透式發射體等)的資料。The projectile type may include information about each projectile in the expansion unit, such as low-penetration projectiles, object-penetrating projectiles, and other less lethal projectiles. The emitter type can also include information about the number of emitters in the unfolding unit and/or the number of each emitter type in the unfolding unit (for example, 6 low-penetration emitters, 3 object-penetrating emitters, etc.) material.

發射體位置可包含指示展開單元中之一或更多發射體的位置之資料。展開單元可建構為承納任何合適數目的發射體(例如,2、3、6、9個等),使每一發射體在發射之前定位於槍膛中。發射體位置可包含指示一或更多發射體承納在哪個槍膛中的資料。例如,低穿透式發射體1位於槍膛1中,低穿透式發射體2位於槍膛2中等等。作為另一範例,物件穿透式發射體1位於槍膛1中,物件穿透式發射體2位於槍膛2中等等。作為另一範例,低穿透式發射體1位於槍膛1中,物件穿透式發射體1位於槍膛2中等等。The projectile position may include data indicating the position of one or more projectiles in the unfolding unit. The deployment unit can be constructed to accommodate any suitable number of projectiles (for example, 2, 3, 6, 9, etc.) so that each projectile is positioned in the barrel before launching. The projectile position may include data indicating in which barrel the one or more projectiles are received. For example, the low-penetration projectile 1 is located in the barrel 1, the low-penetration projectile 2 is located in the barrel 2, and so on. As another example, the object penetrating projectile 1 is located in the barrel 1, the object penetrating projectile 2 is located in the barrel 2, and so on. As another example, the low-penetration projectile 1 is located in the barrel 1, the object-penetrating projectile 1 is located in the barrel 2, and so on.

展開指令可包含指示用於從展開單元展開一或更多發射體之指令的資料。展開指令可包含發射體展開之順序、用於每一啟動所展開的發射體之數目等。例如,展開指令可包含:第一次扳機啟動:展開發射體1和發射體2;第二次扳機啟動:展開發射體3;第三次扳機啟動:展開發射體4等。作為另一範例,展開指令可包含:第一次扳機啟動:展開發射體1;第二次扳機啟動:展開發射體2;第三次扳機啟動:展開發射體3等。作為另一範例,展開指令可包含:第一扳機啟動:展開三個發射體;第二次扳機啟動:展開一個發射體;第三次扳機啟動:展開一個發射體等。The unfolding instruction may include data indicating an instruction for unfolding one or more projectiles from the unfolding unit. The deployment instruction may include the sequence of projectile deployment, the number of projectiles to be deployed for each activation, and so on. For example, the deployment instruction may include: the first trigger activation: deploy projectile 1 and projectile 2; the second trigger activation: deploy projectile 3; the third trigger activation: deploy projectile 4, etc. As another example, the deployment instruction may include: first trigger activation: deploy projectile 1; second trigger activation: deploy projectile 2; third trigger activation: deploy projectile 3, and so on. As another example, the deployment instruction may include: first trigger activation: deploy three projectiles; second trigger activation: deploy one projectile; third trigger activation: deploy one projectile, etc.

在諸多實施例中,展開單元特徵可儲存於展開單元20的記憶體中。記憶體可包含任何合適類型之記憶體,並可建構使用任何合適製程來儲存和維護資料。在該方面中,處理電路50可與記憶體通訊以從記憶體發送和檢索資料。In many embodiments, the features of the unfolding unit may be stored in the memory of the unfolding unit 20. The memory can include any suitable type of memory, and can be configured to use any suitable process to store and maintain data. In this aspect, the processing circuit 50 can communicate with the memory to send and retrieve data from the memory.

於諸多實施例中,展開單元20的記憶體可儲存唯一識別符(例如展開單元識別符等)。唯一識別符可唯一地識別展開單元20,及/或與展開單元20之特徵唯一地關聯。處理電路50可包含記憶體或與記憶體通訊,所述記憶體建構為儲存唯一識別符和相關聯的展開單元特徵之列表、表格等。在那方面,處理電路50可與展開單元20的記憶體通訊以檢索唯一識別符。處理電路50可與處理電路50之記憶體通訊,以基於唯一識別符來決定展開單元特徵。In many embodiments, the memory of the expansion unit 20 can store a unique identifier (for example, the expansion unit identifier, etc.). The unique identifier can uniquely identify the expansion unit 20 and/or be uniquely associated with the characteristics of the expansion unit 20. The processing circuit 50 may include or communicate with a memory that is configured to store lists, tables, etc., of unique identifiers and associated expanded unit features. In that regard, the processing circuit 50 can communicate with the memory of the expansion unit 20 to retrieve the unique identifier. The processing circuit 50 can communicate with the memory of the processing circuit 50 to determine the characteristics of the expanded unit based on the unique identifier.

在諸多實施例中,處理電路50可為機械地及/或電子地耦接至扳機40。處理電路50可建構為偵測扳機40的啟動、致動、按下、輸入等(統稱為「啟動事件」)。回應於偵測到啟動事件,處理電路50可建構為施行諸多操作及/或功能,如本文中所進一步討論的。處理電路50亦可包括附接至扳機40並建構為偵測扳機40之啟動事件的感測器(例如,扳機感測器)。感測器可包含任何合適之機械及/或電子感測器,其能夠偵測扳機40中的啟動事件並將啟動事件報告給處理電路50。In many embodiments, the processing circuit 50 may be mechanically and/or electronically coupled to the trigger 40. The processing circuit 50 can be configured to detect the activation, actuation, pressing, input, etc. of the trigger 40 (collectively referred to as “activation events”). In response to detecting the activation event, the processing circuit 50 can be configured to perform many operations and/or functions, as discussed further herein. The processing circuit 50 may also include a sensor (for example, a trigger sensor) attached to the trigger 40 and configured to detect the activation event of the trigger 40. The sensor may include any suitable mechanical and/or electronic sensor, which can detect the activation event in the trigger 40 and report the activation event to the processing circuit 50.

在諸多實施例中,處理電路50可為機械地及/或電子地耦接至控制界面45。處理電路50可建構為偵測控制界面45之啟動、致動、按下、輸入等(統稱為「控制事件」)。回應於偵測到控制事件,處理電路50可建構為施行諸多操作及/或功能,如本文中所進一步討論的。處理電路50亦可包括附接至控制界面45並建構為偵測控制界面45之控制事件的感測器(例如,控制感測器)。感測器可包含任何合適之機械及/或電子感測器,其能夠偵測控制界面45中的控制事件並將控制事件報告給處理電路50。In many embodiments, the processing circuit 50 may be mechanically and/or electronically coupled to the control interface 45. The processing circuit 50 can be configured to detect the activation, actuation, pressing, input, etc. of the control interface 45 (collectively referred to as "control events"). In response to detecting a control event, the processing circuit 50 can be configured to perform many operations and/or functions, as discussed further herein. The processing circuit 50 may also include a sensor (for example, a control sensor) attached to the control interface 45 and configured to detect control events of the control interface 45. The sensor may include any suitable mechanical and/or electronic sensor, which can detect control events in the control interface 45 and report the control events to the processing circuit 50.

在諸多實施例中,處理電路50可為電氣及/或電子地耦接至電源60。處理電路50可承接來自電源60之電力。從電源60所承接的電力可藉由處理電路50所使用,以承接信號、處理信號、及將信號發送至CEW 1中之諸多其他部件。處理電路50可使用來自電源60的電力來偵測扳機40之啟動事件、控制界面45的控制事件等,並回應於所偵測到之事件產生一個或更多控制信號。控制信號可為基於控制事件和啟動事件。控制信號可為電信號。In many embodiments, the processing circuit 50 may be electrically and/or electronically coupled to the power source 60. The processing circuit 50 can receive power from the power source 60. The power received from the power source 60 can be used by the processing circuit 50 to receive signals, process the signals, and send the signals to many other components in the CEW 1. The processing circuit 50 can use the power from the power supply 60 to detect activation events of the trigger 40, control events of the control interface 45, etc., and generate one or more control signals in response to the detected events. The control signal can be based on a control event and a start event. The control signal may be an electrical signal.

在諸多實施例中,處理電路50可為電氣及/或電子地耦接至信號產生器70。處理電路50可建構為回應於偵測到扳機40的啟動事件而將控制信號發送或提供至信號產生器70。多數控制信號可從微處理器50串聯地提供至信號產生器70。回應於接收到控制信號,信號產生器70可建構為施行諸多功能及/或操作,如本文中所進一步討論的。In many embodiments, the processing circuit 50 may be electrically and/or electronically coupled to the signal generator 70. The processing circuit 50 may be configured to send or provide a control signal to the signal generator 70 in response to detecting the activation event of the trigger 40. Most control signals can be provided from the microprocessor 50 to the signal generator 70 in series. In response to receiving the control signal, the signal generator 70 may be configured to perform many functions and/or operations, as discussed further herein.

在諸多實施例中,控制界面45可建構為控制CEW 1中之射擊模式的選擇。控制CEW 1中之射擊模式的選擇可包括禁止CEW 1之射擊(例如,安全模式)、控制展開單元20的展開、及/或類似操作,如本文中所進一步討論的。控制界面45可坐落於外殼10上或外殼10中之任何合適位置中。例如,控制界面45可為耦接至外殼10的外表面。控制界面45可為耦接至最接近扳機40及/或防護件30之外殼10的外表面。控制界面45可為電氣、機械、及/或電子地耦接至處理電路50。在諸多實施例中,回應於包含電子物品或部件之控制界面45,控制界面45可為電耦接至電源60。控制界面45可承接來自電源60的電力(例如,電流),以為電子物品或部件供電。In many embodiments, the control interface 45 can be configured to control the selection of the shooting mode in CEW 1. The options for controlling the shooting mode in CEW 1 may include prohibiting the shooting of CEW 1 (eg, safe mode), controlling the deployment of the deployment unit 20, and/or similar operations, as discussed further herein. The control interface 45 can be located on the housing 10 or in any suitable position in the housing 10. For example, the control interface 45 may be coupled to the outer surface of the housing 10. The control interface 45 may be coupled to the outer surface of the housing 10 closest to the trigger 40 and/or the guard 30. The control interface 45 can be electrically, mechanically, and/or electronically coupled to the processing circuit 50. In many embodiments, in response to the control interface 45 including electronic items or components, the control interface 45 may be electrically coupled to the power supply 60. The control interface 45 can receive power (for example, current) from the power source 60 to power electronic items or components.

控制界面45可為電子地或機械地耦接至扳機40。例如,且如本文所進一步討論的,控制界面45可用作安全裝置。回應於設定為「安全模式」之控制界面45,CEW 1可為無法使展開單元20展開。例如,控制界面45可將信號(例如,控制信號)提供至處理電路50,而指示處理電路50禁止展開單元20的展開。作為另一範例,控制界面45能以電子或機械方式阻止扳機40啟動(例如,防止或禁止使用者按下扳機40)。The control interface 45 may be electronically or mechanically coupled to the trigger 40. For example, and as discussed further herein, the control interface 45 can be used as a safety device. In response to the control interface 45 set to the "safe mode", the CEW 1 may be unable to unfold the unfolding unit 20. For example, the control interface 45 may provide a signal (for example, a control signal) to the processing circuit 50 and instruct the processing circuit 50 to prohibit the expansion of the expansion unit 20. As another example, the control interface 45 can electronically or mechanically prevent the trigger 40 from being activated (for example, prevent or prohibit the user from pressing the trigger 40).

控制界面45可包含能夠在CEW 1中選擇射擊模式之任何合適的電子或機械部件。例如,控制界面45可包含射擊模式選擇器開關、安全開關、保險栓、旋轉開關、選擇開關、選擇性射擊機構、及/或任何其他合適之機械控制開關。作為另一範例,控制界面45可包含觸控螢幕或類似的電子部件。作為另一範例,控制界面45可包含滑塊、手槍滑塊、往復式滑塊等。The control interface 45 may include any suitable electronic or mechanical components capable of selecting the shooting mode in the CEW 1. For example, the control interface 45 may include a shooting mode selector switch, a safety switch, a fuse, a rotary switch, a selection switch, a selective shooting mechanism, and/or any other suitable mechanical control switches. As another example, the control interface 45 may include a touch screen or similar electronic components. As another example, the control interface 45 may include a slider, a pistol slider, a reciprocating slider, and so on.

於諸多實施例中,並參考圖2A,控制界面45可為能夠選擇安全模式47、射擊模式48及/或穿透模式49。雖然圖2A和本說明書將每一模式敘述為「安全模式」、「射擊模式」和「穿透模式」,類似之字詞和片語、符號等可使用於賦予類似的功能性。在諸多實施例中,控制界面45亦可能夠選擇任何其他合適或期望之模式,包括例如非致命性或較少致命性模式的選擇。In many embodiments, and referring to FIG. 2A, the control interface 45 may be capable of selecting a safe mode 47, a shooting mode 48, and/or a penetration mode 49. Although Figure 2A and this manual describe each mode as "safe mode", "shooting mode" and "penetration mode", similar words, phrases, symbols, etc. can be used to impart similar functionality. In many embodiments, the control interface 45 may also be able to select any other suitable or desired modes, including, for example, the selection of non-lethal or less lethal modes.

回應於使用者選擇控制模式之其中一者,控制界面45可基於選擇將指令發送至處理電路50。In response to the user selecting one of the control modes, the control interface 45 may send commands to the processing circuit 50 based on the selection.

安全模式47可建構為阻止展開單元20從CEW 1展開。例如,回應於使用者選擇安全模式47,控制界面45可將安全模式指令發送至處理電路50。回應於接收到安全模式指令,處理電路50可阻止展開單元20從CEW 1展開。處理電路50可阻止展開,直至從控制界面45接收另一指令。如先前所討論,控制界面45可與扳機40交互作用。以防止扳機40的啟動。The safe mode 47 can be configured to prevent the deployment unit 20 from being deployed from the CEW 1. For example, in response to the user selecting the safe mode 47, the control interface 45 may send a safe mode command to the processing circuit 50. In response to receiving the safe mode command, the processing circuit 50 can prevent the deployment unit 20 from being deployed from the CEW 1. The processing circuit 50 can prevent deployment until another instruction is received from the control interface 45. As previously discussed, the control interface 45 can interact with the trigger 40. To prevent the trigger 40 from starting.

射擊模式48可建構為啟用一或更多展開單元20、或一或更多發射體90、95從CEW 1及從展開單元20之展開。在那方面中,射擊模式48可用作選擇性射擊控制,而能夠射擊具有某些特徵的展開單元20或發射體90、95。於諸多實施例中,展開單元20可包含具有相同特徵之發射體90、95。例如,展開單元20可僅包含低穿透式電極(例如,除了本文所進一步討論的物件穿透式電極以外之電極、非物件穿透式電極、建構為以比物件穿透式電極小的深度穿透之電極等)。作為另一範例,展開單元20可僅包含物件穿透式電極。在諸多實施例中,展開單元20可包含具有不同特徵的發射體90、95。例如,展開單元20可包含一或更多個低穿透式電極和一或更多個物件穿透式電極。The shooting mode 48 can be configured to enable the deployment of one or more deployment units 20, or one or more projectiles 90, 95 from the CEW 1 and from the deployment unit 20. In that regard, the firing mode 48 can be used as selective firing control, while being able to fire the deployment unit 20 or projectiles 90, 95 with certain characteristics. In many embodiments, the deployment unit 20 may include emitters 90 and 95 with the same characteristics. For example, the deployment unit 20 may only include low-penetration electrodes (e.g., electrodes other than the object-penetrating electrodes discussed further herein, non-object-penetrating electrodes, and configured to have a smaller depth than the object-penetrating electrodes. Penetrating electrodes, etc.). As another example, the unfolding unit 20 may only include an object penetrating electrode. In many embodiments, the deployment unit 20 may include emitters 90 and 95 with different characteristics. For example, the deployment unit 20 may include one or more low-penetration electrodes and one or more object-penetrating electrodes.

於諸多實施例中,射擊模式48可建構為能夠射擊低穿透式電極,但是防止或阻止從CEW 1射擊物件穿透式電極。當CEW 1包括低穿透式電極和穿透式電極兩者時,下一射擊電極可為在射擊模式48中之低穿透式電極。例如,回應於使用者選擇射擊模式48,控制界面45可將射擊模式指令發送至處理電路50。回應於接收到射擊模式指令,處理電路50可能夠使僅具有低穿透式電極的展開單元20展開。處理電路50亦可選擇性地能夠使具有低穿透式電極和物件穿透式電極兩者之展開單元20展開。在僅包括穿透式電極或一或更多個穿透式電極的另一展開單元20之前,處理電路50可能夠使僅具有低穿透式電極或至少一個低穿透式電極的展開單元20選擇性展開。處理電路50可禁止物件穿透式電極之展開。例如,回應於啟動扳機40,處理電路50可造成一或更多個低穿透式電極的展開。回應於扳機40之多次啟動,在來自展開單元20之一或更多個穿透式電極的展開(如果有的話)之前(例如,第一,於順序中較早),處理電路50可造成來自展開單元20的一或更多個低穿透式電極展開。一或更多個低穿透式電極可包括在展開單元20中之所有低穿透式電極及/或一或更多個低穿透式電極可包括於展開單元20中的所有穿透式電極。一或更多個低穿透式電極可為回應於扳機40之一或更多次第一啟動而展開,且一或更多個穿透式電極可為回應於扳機40的一或更多次第二啟動而展開,而在扳機40的一或更多次第一啟動之後接收一或更多次第二啟動。In many embodiments, the shooting mode 48 can be configured to be able to shoot the low-penetration electrode, but prevent or prevent the object from shooting from the CEW 1 to the penetrating electrode. When CEW 1 includes both a low penetration electrode and a penetration electrode, the next shooting electrode may be the low penetration electrode in the shooting mode 48. For example, in response to the user selecting the shooting mode 48, the control interface 45 may send a shooting mode command to the processing circuit 50. In response to receiving the shooting mode command, the processing circuit 50 may be able to deploy the deployment unit 20 having only low penetration electrodes. The processing circuit 50 can also selectively expand the unfolding unit 20 having both the low-penetration electrode and the object-penetrating electrode. Before another deployment unit 20 that includes only a penetration electrode or one or more penetration electrodes, the processing circuit 50 may be able to enable the deployment unit 20 that only has a low penetration electrode or at least one low penetration electrode. Selectively expand. The processing circuit 50 can prohibit the development of the penetrating electrode of the object. For example, in response to activating the trigger 40, the processing circuit 50 may cause the deployment of one or more low-penetration electrodes. In response to multiple activations of the trigger 40, before the deployment (if any) of one or more penetration electrodes from the deployment unit 20 (for example, first, earlier in the sequence), the processing circuit 50 may This causes one or more low-penetration electrodes from the deployment unit 20 to be deployed. One or more low-penetration electrodes may include all low-penetration electrodes in the deployment unit 20 and/or one or more low-penetration electrodes may include all the penetration electrodes in the deployment unit 20 . One or more low penetration electrodes may be deployed in response to one or more first activations of trigger 40, and one or more penetration electrodes may be deployed in response to one or more first activations of trigger 40 The second activation is deployed, and one or more second activations are received after one or more first activations of the trigger 40.

穿透模式49可建構為能夠從CEW 1展開任何展開單元20、或來自展開單元20的任何發射體90、95。於那方面中,無論展開單元20是否包含低穿透式電極、物件穿透式電極、或其組合,所有電極均可從CEW 1展開。The penetration mode 49 can be configured to be able to deploy any deployment unit 20 from the CEW 1 or any projectiles 90, 95 from the deployment unit 20. In that regard, regardless of whether the deployment unit 20 includes a low-penetration electrode, an object-penetrating electrode, or a combination thereof, all electrodes can be deployed from the CEW 1.

例如,回應於使用者選擇穿透模式49,控制界面45可將穿透模式指令發送至處理電路50。回應於接收到穿透模式指令,處理電路50可能夠使任何展開單元20展開。回應於啟動扳機40,處理電路50可造成包括低穿透式電極及/或物件穿透式電極之一或更多個電極展開。處理電路50亦可選擇性地能夠使具有低穿透式電極和物件穿透式電極兩者的展開單元20展開。處理電路50可交替地禁止低穿透式電極之展開,使得僅物件穿透式電極能夠於穿透模式49中展開。當CEW 1包括穿透式電極及另一類型的電極、例如低穿透式電極兩者時,下一個已射擊之電極可為在穿透模式49中的穿透式電極。例如,回應於啟動扳機40,處理電路50可造成一或更多個穿透式電極之展開。回應於扳機40的多次啟動,在來自展開單元20之一或更多個穿透式電極的展開(如果有的話)之前(例如,第一,於順序中較早),處理電路50可造成來自展開單元20的一或更多個穿透式電極展開。一或更多個穿透式電極可包括在展開單元20中之所有穿透式電極,及/或一或更多個低穿透式電極可包括於展開單元20中的所有低穿透式電極。一或更多個穿透式電極可回應於扳機40之一或更多次第一啟動而展開,且一或更多個低穿透式電極可回應於扳機40的一或更多次第二啟動而展開,而在扳機40之多次啟動的順序中,一或更多次第一啟動於一或更多次第二啟動之前。處理電路50可含有邏輯,或邏輯可藉由CEW 1中的展開單元20上之類似處理器或韌體所供給,並建構為選擇性控制來自展開單元20的電極之展開(例如,電極展開邏輯)。For example, in response to the user selecting the penetration mode 49, the control interface 45 may send a penetration mode command to the processing circuit 50. In response to receiving the penetration mode command, the processing circuit 50 may be able to deploy any unfolding unit 20. In response to activating the trigger 40, the processing circuit 50 may cause one or more electrodes including low-penetration electrodes and/or object-penetrating electrodes to expand. The processing circuit 50 can also selectively expand the unfolding unit 20 having both the low-penetration electrode and the object-penetrating electrode. The processing circuit 50 can alternately prohibit the deployment of the low-penetration electrode, so that only the object-penetrating electrode can be deployed in the penetration mode 49. When the CEW 1 includes both a penetration electrode and another type of electrode, such as a low penetration electrode, the next shot electrode can be the penetration electrode in the penetration mode 49. For example, in response to activating the trigger 40, the processing circuit 50 may cause the deployment of one or more penetrating electrodes. In response to multiple activations of the trigger 40, before the deployment (if any) of one or more penetration electrodes from the deployment unit 20 (for example, first, earlier in the sequence), the processing circuit 50 may This causes one or more penetration electrodes from the deployment unit 20 to be deployed. One or more penetration electrodes may include all penetration electrodes in the deployment unit 20, and/or one or more low penetration electrodes may include all low penetration electrodes in the deployment unit 20 . One or more penetration electrodes can be deployed in response to one or more first activations of the trigger 40, and one or more low penetration electrodes can be deployed in response to one or more second activations of the trigger 40 In the sequence of multiple activations of the trigger 40, one or more first activations precede one or more second activations. The processing circuit 50 may contain logic, or the logic may be provided by a similar processor or firmware on the deployment unit 20 in CEW 1, and configured to selectively control the deployment of electrodes from the deployment unit 20 (for example, electrode deployment logic ).

例如,及參考圖3,展開單元20可包含複數個發射體、例如第一發射體92-1、第二發射體92-2、第三發射體92-3、第四發射體92-4、第五發射體92-5、第六發射體92-6、第七發射體92-7、第八發射體92-8、及/或第九發射體92-9。每一發射體92可包含低穿透式電極或物件穿透式電極。一或更多個發射體92可包含類似或不同的展開角(例如,用於短距離展開之廣角、用於長距離展開的小角度等等)。當作範例,第一發射體92-1、第二發射體92-2、第三發射體92-3、及/或第五發射體92-5可包含低穿透式電極,且第四發射體92-4、第六發射體92-6、第七發射體92-7、第八發射體92-8、及/或第九發射體92-9可包含物件穿透式電極。回應於啟動扳機40,處理電路50可選擇性地造成發射體92之展開。例如,回應於接收到第一扳機啟動,處理電路50可造成第二發射體92-2和第五發射體92-5的展開;回應於接收到第二扳機啟動,處理電路50可造成第八發射體92-5之展開;回應於接收到第三扳機啟動,處理電路50可造成第一發射體92-1、第三發射體92-3、第四發射體92-4、第六發射體92-6、第七發射體92-7、及/或第九發射體92-9的一或更多個之展開;等等。For example, and referring to FIG. 3, the expansion unit 20 may include a plurality of emitters, such as a first emitter 92-1, a second emitter 92-2, a third emitter 92-3, a fourth emitter 92-4, Fifth emitter 92-5, sixth emitter 92-6, seventh emitter 92-7, eighth emitter 92-8, and/or ninth emitter 92-9. Each emitter 92 may include a low-penetration electrode or an object-penetrating electrode. One or more emitters 92 may include similar or different deployment angles (eg, wide angle for short-distance deployment, small angle for long-distance deployment, etc.). As an example, the first emitter 92-1, the second emitter 92-2, the third emitter 92-3, and/or the fifth emitter 92-5 may include low penetration electrodes, and the fourth emitter The body 92-4, the sixth emitter 92-6, the seventh emitter 92-7, the eighth emitter 92-8, and/or the ninth emitter 92-9 may include object penetration electrodes. In response to activating the trigger 40, the processing circuit 50 can selectively cause the projectile 92 to deploy. For example, in response to receiving the first trigger activation, the processing circuit 50 may cause the deployment of the second emitter 92-2 and the fifth emitter 92-5; in response to receiving the second trigger activation, the processing circuit 50 may cause the eighth emitter The deployment of the emitter 92-5; in response to receiving the third trigger activation, the processing circuit 50 can cause the first emitter 92-1, the third emitter 92-3, the fourth emitter 92-4, and the sixth emitter Expansion of one or more of 92-6, seventh projectile 92-7, and/or ninth projectile 92-9; etc.

在諸多實施例中,並參考圖2B,CEW 1可包含控制界面245(例如,第二控制界面)。第二控制界面245可為類似於控制界面45(例如,第一控制界面)或與設有控制界面45具有類似的特徵或部件。第二控制界面245可為與處理電路45、扳機40、控制界面45、及/或電源60電氣、電子、及/或機械通訊。第二控制界面245可包含與控制界面45分開之控制界面。例如,且按照諸多實施例,控制界面45可包含安全開關、或機械界面。第二控制界面245可包含分開的使用者界面。第二控制界面245可包含控制界面45之子部件或可選的子設備。例如,且按照諸多實施例,控制界面45可包含觸控螢幕使用者界面。第二控制界面245可在控制界面45內選擇。例如,於接收到輸入以選擇射擊模式48或穿透模式49時,控制界面45可顯示第二控制界面245,而能夠選擇和輸入第二控制界面245上可用之模式(例如,射擊一模式248-1、射擊二模式248-2、射擊三模式248-3、射擊「N」模式等)。In many embodiments, and referring to FIG. 2B, CEW 1 may include a control interface 245 (eg, a second control interface). The second control interface 245 may be similar to the control interface 45 (for example, the first control interface) or have similar features or components with the control interface 45 provided. The second control interface 245 may be in electrical, electronic, and/or mechanical communication with the processing circuit 45, the trigger 40, the control interface 45, and/or the power supply 60. The second control interface 245 may include a control interface separate from the control interface 45. For example, and according to many embodiments, the control interface 45 may include a safety switch, or a mechanical interface. The second control interface 245 may include a separate user interface. The second control interface 245 may include sub-components of the control interface 45 or optional sub-devices. For example, and according to many embodiments, the control interface 45 may include a touch screen user interface. The second control interface 245 can be selected in the control interface 45. For example, when an input is received to select the shooting mode 48 or the penetration mode 49, the control interface 45 can display the second control interface 245, and can select and input the modes available on the second control interface 245 (for example, the shooting mode 248 -1, shooting two mode 248-2, shooting three mode 248-3, shooting "N" mode, etc.).

回應於使用者選擇控制模式的其中一者,第二控制界面245可基於選擇將指令發送至處理電路50。In response to the user selecting one of the control modes, the second control interface 245 may send a command to the processing circuit 50 based on the selection.

射擊一模式248-1可建構為回應於扳機之啟動而能夠使單一發射體展開。例如,回應於使用者選擇射擊一模式248-1,第二控制界面245可將射擊一選擇(例如,射擊一指令、射擊一模式等)發送至處理電路50。回應於接收到射擊一選擇,處理電路50可選擇性地啟用發射體的展開,而一個發射體針對每次扳機啟動。例如,回應於啟動扳機40,處理電路50可造成一發射體之展開。回應於扳機40的多次致動,處理電路50可造成用於每次啟動之單一發射體的後續展開。The shooting mode 248-1 can be constructed to deploy a single projectile in response to activation of the trigger. For example, in response to the user selecting the shooting mode 248-1, the second control interface 245 may send a shooting selection (eg, shooting command, shooting mode, etc.) to the processing circuit 50. In response to receiving a firing selection, the processing circuit 50 can selectively enable the deployment of the projectile, and one projectile is activated for each trigger. For example, in response to activating the trigger 40, the processing circuit 50 can cause the deployment of a projectile. In response to multiple activations of the trigger 40, the processing circuit 50 can cause the subsequent deployment of a single projectile for each activation.

射擊二模式248-2可建構為回應於扳機之啟動而能夠使二個發射體展開。例如,回應於使用者選擇射擊二模式248-2,第二控制界面245可將射擊二選擇(例如,射擊二指令、射擊二模式等)發送至處理電路50。回應於接收到射擊二選擇,處理電路50可選擇性地能夠使發射體的展開,而二個發射體針對每次扳機啟動。例如,回應於啟動扳機40,處理電路50可造成二發射體之展開。回應於扳機40的多次啟動,處理電路50可造成用於每次啟動之二發射體的後續展開。回應於具有僅準備用於展開之一發射體的展開單元,處理電路50可造成用於最後啟動之一發射體的展開。The second shooting mode 248-2 can be constructed to deploy two projectiles in response to the activation of the trigger. For example, in response to the user selecting the second shooting mode 248-2, the second control interface 245 may send the second shooting selection (for example, the second shooting command, the second shooting mode, etc.) to the processing circuit 50. In response to receiving the second choice of shooting, the processing circuit 50 can selectively enable the deployment of the projectile, and the two projectiles are activated for each trigger. For example, in response to activating the trigger 40, the processing circuit 50 may cause the deployment of the two projectiles. In response to multiple activations of the trigger 40, the processing circuit 50 can cause the subsequent deployment of the two projectiles for each activation. In response to having a deployment unit that is only ready to deploy one of the emitters, the processing circuit 50 can cause the deployment of one of the emitters to be activated last.

射擊三模式248-3可建構為能夠回應於扳機之啟動而展開三個發射體。例如,回應於使用者選擇射擊三模式248-3,第二控制界面245可將射擊三選擇(例如,射擊三指令、射擊三模式等)發送至處理電路50。回應於接收到射擊三選擇,處理電路50可選擇性地能夠使發射體展開,而三個發射體針對每次扳機啟動。例如,回應於啟動扳機40,處理電路50可造成三個發射體的展開。The three shooting mode 248-3 can be constructed to deploy three projectiles in response to the activation of the trigger. For example, in response to the user selecting the three shooting mode 248-3, the second control interface 245 may send three shooting options (for example, shooting three commands, shooting three modes, etc.) to the processing circuit 50. In response to receiving the three shooting options, the processing circuit 50 can selectively deploy the projectiles, and the three projectiles are activated for each trigger. For example, in response to activating the trigger 40, the processing circuit 50 may cause the deployment of three projectiles.

在諸多實施例中,回應於扳機40之多次啟動,處理電路50可造成針對每次啟動的三個發射體之後續展開。在諸多實施例中,回應於扳機40的多次啟動,處理電路50可造成一或二個發射體每次基於啟動之後續展開(例如在第一次啟動之後,隨後的每次啟動造成一個或二個發射體之展開)。回應於準備用於展開的僅具有一或二個發射體之展開單元,處理電路50可造成用於最後一次啟動的一或二個發射體之展開。In many embodiments, in response to multiple activations of the trigger 40, the processing circuit 50 may cause the subsequent deployment of the three projectiles for each activation. In many embodiments, in response to multiple activations of the trigger 40, the processing circuit 50 may cause one or two projectiles to be deployed each time based on activation (for example, after the first activation, each subsequent activation causes one or Expansion of the two projectiles). In response to the deployment unit with only one or two emitters being prepared for deployment, the processing circuit 50 can cause the deployment of one or two emitters for the last activation.

在諸多實施例中,並再次參考圖1,信號產生器70可建構為從處理電路50接收一或更多控制信號。信號產生器70可基於控制信號將點火信號提供至展開單元20。信號產生器70可電氣及/或電子地耦接至處理電路50及/或展開單元20。信號產生器70可電氣地耦接至電源60。信號產生器70可使用從電源60承接的電力來產生點火信號。例如,信號產生器70可從電源60接收具有第一電流和電壓值之電信號。信號產生器70可將電信號轉換為具有第二電流和電壓值的點火信號。轉換後之第二電流值及/或轉換後的第二電壓值可為與第一電流及/或電壓值不同。轉換後之第二電流及/或轉換後的第二電壓值可為與第一電流及/或電壓值相同。信號產生器70可暫時地儲存來自電源60之電力,並完全或部分地依賴所儲存的電力來提供點火信號。信號產生器70亦可完全或部分地依賴從電源60所承接之電力來提供點火信號,而無需暫時儲存電力。In many embodiments, and referring again to FIG. 1, the signal generator 70 may be configured to receive one or more control signals from the processing circuit 50. The signal generator 70 may provide an ignition signal to the expansion unit 20 based on the control signal. The signal generator 70 can be electrically and/or electronically coupled to the processing circuit 50 and/or the expansion unit 20. The signal generator 70 may be electrically coupled to the power source 60. The signal generator 70 may use the power received from the power source 60 to generate an ignition signal. For example, the signal generator 70 may receive an electrical signal having a first current and voltage value from the power supply 60. The signal generator 70 can convert the electrical signal into an ignition signal having the second current and voltage values. The converted second current value and/or the converted second voltage value may be different from the first current and/or voltage value. The converted second current and/or the converted second voltage value may be the same as the first current and/or voltage value. The signal generator 70 can temporarily store the power from the power source 60, and rely wholly or partly on the stored power to provide an ignition signal. The signal generator 70 can also completely or partially rely on the power received from the power source 60 to provide an ignition signal without temporarily storing power.

信號產生器70可全部或部分地藉由處理電路50所控制。於諸多實施例中,信號產生器70和處理電路50可為分開的部件(例如,物理上不同及/或邏輯上離散)。信號產生器70和處理電路50可為單一部件。例如,外殼10內之控制電路可至少包括信號產生器70和處理電路50。控制電路亦可包括其他部件及/或配置,包括那些將這些元件的對應功能進一步整合成單一部件或電路者、以及那些將某些功能進一步分成分開之部件或電路者。The signal generator 70 can be controlled by the processing circuit 50 in whole or in part. In many embodiments, the signal generator 70 and the processing circuit 50 may be separate components (for example, physically different and/or logically discrete). The signal generator 70 and the processing circuit 50 may be a single component. For example, the control circuit in the housing 10 may include at least a signal generator 70 and a processing circuit 50. The control circuit may also include other components and/or configurations, including those that further integrate the corresponding functions of these components into a single component or circuit, and those that further divide certain functions into separate components or circuits.

信號產生器70可藉由控制信號所控制,以產生具有預定電流值或多數電流值的點火信號。例如,信號產生器70可包括電流源。控制信號可藉由信號產生器70所接收,以在電流源之電流值啟動電流源。可接收附加的控制信號以減小電流源之電流。例如,信號產生器70可包括耦接於電流源和控制電路的輸出之間的脈衝寬度調變電路。可藉由信號產生器70接收第二控制信號以啟動脈衝寬度調變電路,從而減小藉由電流源所產生之信號的非零週期及隨後藉由控制電路所輸出之點火信號的總電流。脈衝寬度調變電路可與電流源之電路分開,或另一選擇係整合在電流源的電路內。信號產生器70之諸多其他形式可替代地或附加地採用,包括那些於一或更多不同電阻上施加電壓以產生具有不同電流的信號者。在諸多實施例中,信號產生器70可包括建構為輸送具有高電壓之電流的高電壓模組。於諸多實施例中,信號產生器70可包括建構為輸送具有較低電壓(例如,2,000伏特)之電流的低電壓模組。The signal generator 70 can be controlled by a control signal to generate an ignition signal with a predetermined current value or multiple current values. For example, the signal generator 70 may include a current source. The control signal can be received by the signal generator 70 to activate the current source at the current value of the current source. It can receive additional control signals to reduce the current of the current source. For example, the signal generator 70 may include a pulse width modulation circuit coupled between the current source and the output of the control circuit. The signal generator 70 can receive the second control signal to activate the pulse width modulation circuit, thereby reducing the non-zero period of the signal generated by the current source and the total current of the ignition signal output by the control circuit subsequently . The pulse width modulation circuit can be separated from the circuit of the current source, or alternatively it can be integrated in the circuit of the current source. Many other forms of signal generator 70 can be used alternatively or additionally, including those that apply voltages to one or more different resistors to generate signals with different currents. In many embodiments, the signal generator 70 may include a high-voltage module configured to deliver a high-voltage current. In many embodiments, the signal generator 70 may include a low-voltage module configured to deliver a current having a relatively low voltage (for example, 2,000 volts).

回應於接收到指示扳機40之啟動的信號(例如,啟動事件),控制電路將點火信號提供至展開單元20。例如,信號產生器70可回應於從處理電路50接收到控制信號而將電信號作為點火信號提供至展開單元20。在諸多實施例中,點火信號可與刺激信號分開且不同。例如,相對將點火信號提供至電路,CEW 1中之刺激信號可提供至展開單元20內的不同電路。信號產生器70可建構為產生刺激信號。於諸多實施例中,外殼10內之第二、分開之信號產生器、部件、或電路(未示出)可建構為產生刺激信號。信號產生器70亦可為展開單元20提供接地信號路徑,從而完成用於藉由信號產生器70提供至展開單元20的電信號之電路。接地信號路徑亦可藉由外殼10中的其他包括電源60之元件提供至展開單元20。In response to receiving a signal indicating activation of the trigger 40 (for example, an activation event), the control circuit provides an ignition signal to the deployment unit 20. For example, the signal generator 70 may provide an electrical signal as an ignition signal to the deployment unit 20 in response to receiving a control signal from the processing circuit 50. In many embodiments, the ignition signal can be separate and different from the stimulation signal. For example, instead of providing the ignition signal to the circuit, the stimulation signal in CEW 1 can be provided to different circuits in the deployment unit 20. The signal generator 70 may be configured to generate stimulation signals. In many embodiments, the second, separate signal generator, component, or circuit (not shown) in the housing 10 can be configured to generate stimulation signals. The signal generator 70 can also provide a ground signal path for the unfolding unit 20 to complete a circuit for the electrical signal provided by the signal generator 70 to the unfolding unit 20. The ground signal path can also be provided to the unfolding unit 20 by other components in the housing 10 including the power supply 60.

在諸多實施例中,展開單元20可包含推進系統80和複數個發射體、例如第一發射體90和第二發射體95。展開單元20可包含任何合適或期望數目之發射體、例如二個發射體、三個發射體、九個發射體(例如,如圖3中所描繪,而使展開單元20包含發射體92-1、92-2、92-3、92-4、92-5、92-6、92-7、92-8、92-9)、十二個發射體、十八個發射體、及/或任何其他所期望數目之發射體。再者,外殼10可建構為承接任何合適或期望數目之展開單元20、例如一個展開單元、二個展開單元、三個展開單元等。In many embodiments, the deployment unit 20 may include a propulsion system 80 and a plurality of projectiles, such as a first projectile 90 and a second projectile 95. The unfolding unit 20 may include any suitable or desired number of emitters, such as two emitters, three emitters, nine emitters (for example, as depicted in FIG. 3, and the unfolding unit 20 includes emitter 92-1 , 92-2, 92-3, 92-4, 92-5, 92-6, 92-7, 92-8, 92-9), twelve emitters, eighteen emitters, and/or any Other desired number of emitters. Furthermore, the housing 10 can be configured to accept any suitable or desired number of unfolding units 20, such as one unfolding unit, two unfolding units, three unfolding units, and so on.

於諸多實施例中,推進系統80可耦接至展開單元20中的每一發射體或與之通訊。在諸多實施例中,展開單元20可包含複數個推進系統80,使每一推進系統80耦接至一或更多個發射體或與之通訊。推進系統80可包含能夠在展開單元20中提供推進力的任何裝置、推進劑(例如,空氣、氣體等)、底火等。推進力可包括藉由在一區域或彈膛內之快速膨脹氣體所造成的壓力中之增加。推進力可施加至展開單元20中的發射體90、95,以造成發射體90、95展開。推進系統80可回應於展開單元20接收到點火信號而提供推進力。In many embodiments, the propulsion system 80 may be coupled to or communicate with each projectile in the deployment unit 20. In many embodiments, the deployment unit 20 may include a plurality of propulsion systems 80 such that each propulsion system 80 is coupled to or communicates with one or more projectiles. The propulsion system 80 may include any device capable of providing propulsion in the deployment unit 20, propellant (for example, air, gas, etc.), primer, etc. Propulsion can include an increase in pressure caused by rapidly expanding gas in an area or chamber. Propulsion force may be applied to the projectiles 90, 95 in the deployment unit 20 to cause the projectiles 90, 95 to be deployed. The propulsion system 80 can provide propulsion in response to the ignition signal being received by the deployment unit 20.

在諸多實施例中,推進力可直接地施加至一或更多個發射體90、95。例如,推進力可直接提供至第一發射體90或第二發射體95。推進系統80可為與發射體90、95流體連通以提供推力。例如,來自推進系統80之推進力可於展開單元20的外殼或通道內行進至一或更多個發射體90、95。推進力可經由展開單元20中之歧管行進。In many embodiments, the propulsion force may be directly applied to one or more projectiles 90, 95. For example, the propulsion force may be directly provided to the first projectile 90 or the second projectile 95. The propulsion system 80 may be in fluid communication with the projectiles 90, 95 to provide thrust. For example, the propulsion force from the propulsion system 80 can travel to one or more projectiles 90, 95 within the housing or channel of the deployment unit 20. The propulsion force can travel through the manifold in the deployment unit 20.

在諸多實施例中,可將推進力間接地提供至第一發射體90及/或第二發射體95。例如,可將推進力提供至推進系統80內的推進劑之第二來源。推進力可發射推進系統80內的推進劑之第二來源,造成推進劑的第二來源釋放推進劑。與釋放之推進劑相關聯的力量可依序向一或更多個發射體90、95提供力量。藉由推進劑之第二來源所產生的力量可造成發射體90、95從展開單元20和CEW 1展開。In many embodiments, the propulsion force may be provided to the first projectile 90 and/or the second projectile 95 indirectly. For example, the propulsion force can be provided to the second source of propellant in the propulsion system 80. The propulsion force can launch the second source of propellant in the propulsion system 80, causing the second source of propellant to release the propellant. The force associated with the released propellant may sequentially provide force to one or more projectiles 90, 95. The force generated by the second source of propellant can cause the projectiles 90, 95 to deploy from the deployment unit 20 and the CEW 1.

於諸多實施例中,每一發射體90、95可包含任何合適類型之發射體。例如,一或更多個發射體90、95可為或包括電極(例如,電極飛鏢)。電極可包括矛部分,其設計成刺穿或附接靠近目標的組織,以便在電極和組織之間提供導電路徑,如本文先前所討論的。例如,發射體90、95之每一者可包括各自的電極。發射體90、95可同時或實質上同時從展開單元20展開。發射體90、95可藉由相同之推進力從共同的推進系統80發射。發射體90、95亦可藉由從一或更多個推進系統80所承接之一或更多推進力來發射。展開單元20可包括建構為將推進力從推進系統80傳送至一或更多個發射體90、95的內部歧管。In many embodiments, each emitter 90, 95 may include any suitable type of emitter. For example, one or more emitters 90, 95 may be or include electrodes (e.g., electrode darts). The electrode may include a spear portion designed to pierce or attach tissue close to the target in order to provide a conductive path between the electrode and the tissue, as previously discussed herein. For example, each of the emitters 90, 95 may include a respective electrode. The projectiles 90 and 95 may be deployed from the deployment unit 20 at the same time or substantially at the same time. The projectiles 90, 95 can be launched from a common propulsion system 80 with the same propulsion force. The projectiles 90 and 95 can also be launched by one or more propulsion forces received from one or more propulsion systems 80. The deployment unit 20 may include an internal manifold configured to transmit propulsion force from the propulsion system 80 to one or more projectiles 90, 95.

於諸多實施例中,每一發射體90、95可包含任何合適類型之電極。例如,可將低穿透式電極電線-繫繩式連接至展開單元20,以能夠使電流(例如,刺激信號)從信號產生器70傳遞至展開單元20、至每一各自的繫繩電線、並穿過每一各自之電極。當電極行進朝目標時,它們各自的繫繩電線在電極後面展開。In many embodiments, each emitter 90, 95 may include any suitable type of electrode. For example, a low-penetration electrode wire-tether can be connected to the deployment unit 20 to enable current (for example, a stimulus signal) to be transmitted from the signal generator 70 to the deployment unit 20, to each respective tether wire, And pass through each respective electrode. As the electrodes travel towards the target, their respective tether wires are deployed behind the electrodes.

低穿透式電極可建構為於13毫米(0.039英寸)或更小之最大穿透深度穿透目標的組織。可基於醫療或安全性研究來決定最大穿透深度,以至少部分地減少藉由將電極穿透進入目標組織所造成之目標中的傷害。低穿透式電極可包含能刺穿目標之組織以將目標與電極連接的矛。矛可具有13毫米或更短之長度,以確保電極不會以大於最大穿透深度的深度穿透目標之組織。低穿透式電極亦可包括電極本體,其建構為在第一端部耦接至矛且於第二端部耦接至各自的電線繫繩。電極本體之寬度可為大於矛的寬度。電極本體之寬度或直徑可為大於或實質上大於矛的寬度或直徑(例如,矛之寬度的兩倍、矛之寬度的三倍、矛之寬度的四倍或更多倍等)。在展開電極之前,電極本體可容納電線-繫繩。電極本體亦可建構為防止矛在大於最大穿透深度的深度處穿透目標之組織。例如,電極本體的較大寬度可接觸目標之組織,並降低電極的速度及矛進一步穿透目標之組織的能力。The low-penetration electrode can be constructed to penetrate the target tissue at a maximum penetration depth of 13 mm (0.039 inch) or less. The maximum penetration depth can be determined based on medical or safety research to at least partially reduce the damage to the target caused by penetrating the electrode into the target tissue. The low-penetration electrode may include a spear that can pierce the tissue of the target to connect the target to the electrode. The spear can have a length of 13 mm or less to ensure that the electrode will not penetrate the target tissue at a depth greater than the maximum penetration depth. The low-penetration electrode may also include an electrode body, which is configured to be coupled to the lance at the first end and to the respective wire tether at the second end. The width of the electrode body can be greater than the width of the spear. The width or diameter of the electrode body can be larger or substantially larger than the width or diameter of the spear (for example, twice the width of the spear, three times the width of the spear, four or more times the width of the spear, etc.). Before the electrode is deployed, the electrode body can accommodate the wire-tether. The electrode body can also be constructed to prevent the spear from penetrating the target tissue at a depth greater than the maximum penetration depth. For example, the larger width of the electrode body can contact the target tissue and reduce the speed of the electrode and the ability of the spear to further penetrate the target tissue.

至少部分地由於維持最大穿透深度所需之物理限制,回應於穿著一或更多物件(例如衣服、冬裝、防彈衣等)的目標,低穿透式電極可為無法與目標之組織建立連接。Due at least in part to the physical limitations required to maintain the maximum penetration depth, in response to a target wearing one or more objects (such as clothes, winter clothing, body armor, etc.), low-penetration electrodes can establish a connection to the target tissue .

現在參考圖4A-4C,所描繪的製程流程僅是實施例且不意欲限制本揭示內容之範圍。例如,於方法或製程敘述的任何一者中所列舉之步驟能以任何順序執行,且不限於所呈現的順序。作為另一範例,可省略方法或製程敘述之任何一者中所列舉的一或更多步驟。Referring now to FIGS. 4A-4C, the depicted process flow is only an example and is not intended to limit the scope of the present disclosure. For example, the steps listed in any one of the method or process descriptions can be performed in any order and are not limited to the order presented. As another example, one or more steps listed in any one of the method or process description can be omitted.

在諸多實施例中,並具體參考圖4A,揭示用於使用(第一)控制界面來控制傳導式電武器(CEW)之方法401。方法401可允許從展開單元選擇性展開一或更多個發射體。方法401亦可允許不同類型的發射體從單一展開單元選擇性展開。In many embodiments, and specifically referring to FIG. 4A, a method 401 for controlling a conductive electric weapon (CEW) using a (first) control interface is disclosed. The method 401 may allow one or more emitters to be selectively deployed from the deployment unit. The method 401 may also allow different types of emitters to be selectively deployed from a single deployment unit.

在諸多實施例中,CEW可決定展開單元特徵(步驟402)。展開單元特徵可包括指示展開單元之諸多特徵的資料。展開單元特徵可包括展開單元類型、發射體類型、發射體位置、展開指令、及/或與展開單元、發射體、CEW有關之任何其他合適或期望的資訊、或發射體從展開單元之展開。In many embodiments, the CEW may determine the unfolding unit characteristics (step 402). The features of the unfolded unit may include data indicating many features of the unfolded unit. The unfolding unit characteristics may include unfolding unit type, projectile type, projectile position, unfolding instructions, and/or any other suitable or desired information related to the unfolding unit, projectile, CEW, or the deployment of the projectile from the unfolding unit.

展開單元類型可包含關於展開單元類型、例如訓練展開單元、混合式發射體展開單元(例如,展開單元具有複數發射體類型、例如低穿透式發射體和物件穿透式發射體兩者)、相同的發射體展開單元、低穿透式發射體展開單元(例如,僅包含低穿透式發射體之展開單元)、物件穿透式發射體展開單元(例如,僅包含物件穿透式發射體的展開單元)、及/或類似物之資料。The expansion unit type may include information about the expansion unit type, such as training expansion unit, hybrid projectile deployment unit (for example, the deployment unit has a plurality of projectile types, such as both low-penetration projectiles and object-penetrating projectiles), The same projectile deployment unit, low-penetration projectile deployment unit (for example, only a low-penetration projectile deployment unit), object-penetrating projectile deployment unit (for example, only an object-penetrating projectile The expansion unit), and/or the information of the similar.

發射體類型可包含關於展開單元中的每一發射體之類型、例如低穿透式發射體、物件穿透式發射體、其他低致命性發射體等的資料。發射體類型亦可包含關於展開單元中之發射體數目及/或展開單元中的每一發射體類型的數目(例如6個低穿透式發射體、3個物件穿透式發射體等)之資料。The projectile type may include information about the type of each projectile in the expansion unit, such as a low-penetration projectile, an object-penetrating projectile, and other low-lethal projectiles. The emitter type can also include information about the number of emitters in the unfolding unit and/or the number of each emitter type in the unfolding unit (for example, 6 low-penetration emitters, 3 object-penetrating emitters, etc.) material.

發射體位置可包含指示展開單元中的一或更多個發射體之位置的資料。展開單元可建構為容納任何合適數目之發射體(例如,2、3、6、9個等),使每一發射體在發射之前定位於槍膛中。發射體位置可包含指示一或更多個發射體容納在哪個槍膛中的資料。例如,低穿透式發射體1位於槍膛1中、低穿透式發射體2位於槍膛2中等等。作為另一範例,物件穿透式發射體1位於槍膛1中、物件穿透式發射體2位於槍膛2中等等。作為另一範例,低穿透式發射體1位於槍膛1中、物件穿透式發射體1位於槍膛2中等等。The projectile position may include data indicating the position of one or more projectiles in the unfolding unit. The deployment unit can be constructed to accommodate any suitable number of projectiles (for example, 2, 3, 6, 9, etc.) so that each projectile is positioned in the barrel before launching. The projectile location may include data indicating in which barrel the one or more projectiles are contained. For example, the low-penetration projectile 1 is located in the barrel 1, the low-penetration projectile 2 is located in the barrel 2, and so on. As another example, the object penetrating projectile 1 is located in the barrel 1, the object penetrating projectile 2 is located in the barrel 2, and so on. As another example, the low-penetration projectile 1 is located in the barrel 1, the object-penetrating projectile 1 is located in the barrel 2, and so on.

展開指令可包含指示用於從展開單元展開一或更多個發射體之指令的資料。展開指令可包含發射體展開之順序、針對每次啟動所展開的發射體之數目等。例如,展開指令可包含:第一次扳機啟動:展開發射體1和發射體2;第二次扳機啟動:展開發射體3;第三次扳機啟動:展開發射體4;等等。作為另一範例,展開指令可包含:第一扳機啟動:展開發射體1;第二次扳機啟動:展開發射體2;第三次扳機啟動:展開發射體3;等等。作為另一範例,展開指令可包含:第一扳機啟動:展開三個發射體;第二次扳機啟動:展開一個發射體;第三次扳機啟動:展開一個發射體;等等。The unfolding instruction may include data indicating an instruction for unfolding one or more projectiles from the unfolding unit. The deployment instruction may include the sequence of projectile deployment, the number of projectiles to be deployed for each activation, and so on. For example, the deployment instruction may include: first trigger activation: deploy projectile 1 and projectile 2; second trigger activation: deploy projectile 3; third trigger activation: deploy projectile 4; and so on. As another example, the deployment instruction may include: first trigger activation: deploy projectile 1; second trigger activation: deploy projectile 2; third trigger activation: deploy projectile 3; and so on. As another example, the deployment instruction may include: first trigger activation: deploy three projectiles; second trigger activation: deploy one projectile; third trigger activation: deploy one projectile; and so on.

CEW可使用任何合適的製程來決定展開單元特徵。例如,並按照諸多實施例,展開單元之記憶體(例如,展開單元記憶體、第一記憶體等)可儲存展開單元特徵。CEW的處理電路可與展開單元之記憶體通訊以檢索並決定展開單元特徵。作為另一範例,並按照諸多實施例,展開單元的記憶體可儲存唯一識別符(例如,展開單元識別符等)。CEW之記憶體(例如,CEW記憶體、第二記憶體等)可儲存唯一識別符和相關聯的展開單元特徵之列表、表格等。CEW的處理電路可與展開單元之記憶體通訊以檢索唯一識別符。處理電路可與CEW的記憶體通訊,以基於唯一識別符來決定展開單元特徵。CEW can use any suitable process to determine the characteristics of the unfolded unit. For example, and according to many embodiments, the memory of the expansion unit (for example, the expansion unit memory, the first memory, etc.) can store the characteristics of the expansion unit. The processing circuit of CEW can communicate with the memory of the expansion unit to retrieve and determine the characteristics of the expansion unit. As another example, and according to many embodiments, the memory of the expansion unit may store a unique identifier (for example, the expansion unit identifier, etc.). The CEW memory (for example, the CEW memory, the second memory, etc.) can store lists, tables, etc., of unique identifiers and associated expanded unit features. The processing circuit of CEW can communicate with the memory of the expansion unit to retrieve the unique identifier. The processing circuit can communicate with the CEW's memory to determine the characteristics of the unfolding unit based on the unique identifier.

在諸多實施例中,CEW可接收控制模式選擇(步驟404)。控制模式選擇可包含安全模式選擇(步驟404-1)、射擊模式選擇(步驟404-2)、或穿透模式選擇(步驟404-3)。於諸多實施例中,控制模式選擇亦可包含任何其他合適或期望之控制模式。可在決定展開單元特徵之前接收控制模式選擇。可於決定展開單元特徵之後接收控制模式選擇。可回應於控制模式選擇來決定展開單元特徵。安全模式選擇可建構為阻止從CEW的展開單元展開發射體。射擊模式選擇可建構為能夠使展開單元或發射體從CEW之展開。射擊模式選擇亦可使選定發射體、例如低穿透式發射體、而不是物件穿透式發射體能夠展開。穿透模式選擇可建構為能夠使所有展開單元或發射體從CEW展開,而與發射體類型無關。In many embodiments, the CEW may receive the control mode selection (step 404). The control mode selection may include safety mode selection (step 404-1), shooting mode selection (step 404-2), or penetration mode selection (step 404-3). In many embodiments, the control mode selection can also include any other suitable or desired control modes. The control mode selection can be received before deciding on the characteristics of the unfolding unit. The control mode selection can be received after determining the characteristics of the unfolding unit. The characteristics of the unfolded unit can be determined in response to the control mode selection. The safe mode selection can be constructed to prevent the launching of the projectile from the deployment unit of the CEW. The shooting mode selection can be constructed to enable the deployment unit or projectile to be deployed from the CEW. Shooting mode selection can also enable selected projectiles, such as low-penetration projectiles, rather than object-penetrating projectiles to be deployed. The penetration mode selection can be constructed to enable all deployment units or emitters to be deployed from the CEW, regardless of the type of the emitter.

CEW可使用任何合適的製程來接收控制模式選擇。例如,且按照諸多實施例,CEW之控制界面可接收控制模式選擇。回應於接收控制模式選擇,控制界面可將控制模式選擇發送至CEW的處理電路。作為另一範例,處理電路可建構為偵測控制界面上之控制模式選擇。例如,回應於控制界面接收到控制模式指令,處理電路可偵測並從控制界面接收控制模式指令。CEW can use any suitable process to receive the control mode selection. For example, and according to many embodiments, the control interface of the CEW can receive control mode selection. In response to receiving the control mode selection, the control interface may send the control mode selection to the processing circuit of the CEW. As another example, the processing circuit can be configured to detect the control mode selection on the control interface. For example, in response to the control interface receiving the control mode command, the processing circuit can detect and receive the control mode command from the control interface.

在諸多實施例中,CEW可接收扳機啟動(步驟406)。扳機啟動可藉由CEW的扳機來接收。例如,CEW之處理電路可建構為偵測藉由扳機所接收的扳機啟動。作為另一範例,回應於接收扳機啟動,扳機可將扳機啟動發送至處理電路。In many embodiments, the CEW may receive trigger activation (step 406). Trigger activation can be received by the CEW trigger. For example, the processing circuit of the CEW can be configured to detect activation by the trigger received by the trigger. As another example, in response to receiving the trigger activation, the trigger may send the trigger activation to the processing circuit.

在諸多實施例中,CEW可基於控制模式選擇和展開單元特徵之至少一者來指示、或造成指令至信號產生器(步驟408)。CEW可回應於接收到扳機啟動而指示信號產生器。例如,CEW的處理電路可回應於接收到扳機啟動來指示信號產生器。回應於接收到指令(例如控制信號),信號產生器可建構為將一或更多個點火信號提供至展開單元,以造成一或更多個發射體的展開。在那方面,發送至信號之指令可為基於控制模式選擇和展開單元特徵的至少一者,以造成一或更多個發射體之選擇性展開。In many embodiments, the CEW may indicate or cause a command to the signal generator based on at least one of control mode selection and unfolding unit characteristics (step 408). The CEW can instruct the signal generator in response to receiving the trigger activation. For example, the processing circuit of the CEW can instruct the signal generator in response to receiving the trigger activation. In response to receiving a command (such as a control signal), the signal generator may be configured to provide one or more ignition signals to the deployment unit to cause the deployment of one or more emitters. In that regard, the instruction sent to the signal may be based on at least one of the control mode selection and the characteristics of the deployment unit to cause the selective deployment of one or more projectiles.

例如,且按照諸多實施例,回應於控制模式選擇係安全模式選擇(步驟404-1),CEW可未指示信號產生器提供點火信號。在那方面,扳機的啟動可不造成隨後從展開單元啟動發射體。For example, and according to many embodiments, in response to the control mode selection being the safety mode selection (step 404-1), the CEW may not instruct the signal generator to provide an ignition signal. In that regard, activation of the trigger may not cause subsequent activation of the projectile from the deployment unit.

例如,並按照諸多實施例,回應於控制模式選擇係射擊模式選擇(步驟404-2),CEW可指示信號產生器選擇性提供點火信號至一或更多個展開單元或發射體,以造成一或更多個發射體展開。回應於射擊模式選擇,可能夠使低穿透式發射體展開,而可禁止物件穿透式發射體展開。在那方面中,CEW可指示信號產生器選擇性提供點火信號,以造成一或更多個低穿透式發射體展開。For example, and according to many embodiments, in response to the control mode selection being the shooting mode selection (step 404-2), the CEW may instruct the signal generator to selectively provide ignition signals to one or more deployment units or emitters to cause a Or more projectiles unfold. In response to the shooting mode selection, the low-penetration projectile can be expanded, and the object-penetrating projectile can be prohibited from expanding. In that regard, the CEW can instruct the signal generator to selectively provide an ignition signal to cause one or more low-penetration projectiles to deploy.

要展開之一或更多個發射體的選擇亦可為基於展開單元特徵。例如,CEW (經由處理電路)可基於展開單元類型、發射體類型、發射體位置、展開指令等,指示信號產生器將點火信號提供至一或更多個發射體。例如,回應於展開指令,所述展開指令包含回應於扳機啟動而展開發射體1、發射體2、和發射體3的指令,CEW可指示信號產生器提供點火信號以造成發射體1、發射體2、和發射體3之展開。回應於包含物件穿透式發射體的發射體1、發射體2、及/或發射體3的一或更多個,CEW可指示信號產生器僅提供點火信號以造成不是物件穿透式發射體之發射體1、發射體2、及/或發射體3的展開,及/或可指示信號產生器提供點火信號以造成額外發射體之展開,使得總共三個非物件穿透式發射體展開。The selection of one or more emitters to be deployed may also be based on the characteristics of the deployed unit. For example, the CEW (via the processing circuit) may instruct the signal generator to provide an ignition signal to one or more projectiles based on the type of deployment unit, the type of projectile, the position of the projectile, deployment instructions, etc. For example, in response to an unfolding instruction, the unfolding instruction includes an instruction to unfold the projectile 1, the projectile 2, and the projectile 3 in response to the trigger activation, the CEW can instruct the signal generator to provide an ignition signal to cause the projectile 1, the projectile 2. Unfolding with projectile 3. In response to one or more of the projectile 1, projectile 2, and/or projectile 3 including the object penetrating projectile, the CEW can instruct the signal generator to only provide the ignition signal to make it not an object penetrating projectile The deployment of the projectile 1, projectile 2, and/or projectile 3, and/or can instruct the signal generator to provide an ignition signal to cause the deployment of additional projectiles, so that a total of three non-object penetrating projectiles can be deployed.

作為另一範例,回應於指示僅物件穿透式發射體可用於展開單元中的展開單元類型及/或發射體類型,CEW可不指示信號產生器提供點火信號。在那方面,扳機之啟動可不會造成發射體隨後從展開單元啟動。於諸多實施例中,回應於展開單元不能基於控制模式選擇及/或展開單元特徵來展開發射體,CEW可通知操作者(例如,經由聲音、警告、使用者顯示器等)。As another example, in response to indicating that only the object penetrating emitter can be used in the unfolding unit type and/or emitter type in the unfolding unit, the CEW may not instruct the signal generator to provide an ignition signal. In that regard, activation of the trigger may not cause the projectile to be subsequently activated from the deployment unit. In many embodiments, in response to the unfolding unit being unable to unfold the emitter based on control mode selection and/or unfolding unit features, the CEW can notify the operator (for example, via sound, warning, user display, etc.).

例如,並按照諸多實施例,回應於控制模式選擇係穿透模式選擇(步驟404-3),CEW可指示信號產生器將點火信號選擇性提供至一或更多個展開單元或發射體,以造成一或更多個發射體之展開。回應於穿透模式選擇,可能夠使低穿透式發射體和物件穿透式發射體展開。在那方面,CEW可指示信號產生器選擇性提供點火信號,以造成一或更多個低穿透式發射體及/或物件穿透式發射體的展開。For example, and according to many embodiments, in response to the control mode selection being the penetration mode selection (step 404-3), the CEW may instruct the signal generator to selectively provide the ignition signal to one or more deployment units or emitters to Causes the deployment of one or more projectiles. In response to the selection of the penetration mode, the low-penetration emitter and the object-piercing emitter can be deployed. In that regard, the CEW can instruct the signal generator to selectively provide an ignition signal to cause the deployment of one or more low-penetration projectiles and/or object-penetrating projectiles.

要展開之一或更多個發射體的選擇亦可為基於展開單元特徵。例如,CEW (經由處理電路)可基於展開單元類型、發射體類型、發射體位置、展開指令等,指示信號產生器將點火信號提供至一或更多個發射體。例如,回應於展開指令,所述展開指令包含回應於扳機啟動而展開發射體1、發射體2、和發射體3的指令,CEW可指示信號產生器提供點火信號以造成發射體1、發射體2、和發射體3之展開。回應於展開單元特徵,所述展開單元特徵包含回應於第一次扳機啟動而展開二個物件穿透式電極的指令,CEW可指示信號產生器提供點火信號以造成二個物件穿透式電極之展開。回應於展開單元特徵,所述展開單元特徵包含回應於第一次扳機啟動而展開一個物件穿透式電極和二個低穿透式電極的指令,CEW可指示信號產生器提供點火信號以造成一個物件穿透式電極和二個低穿透式電極之展開。The selection of one or more emitters to be deployed may also be based on the characteristics of the deployed unit. For example, the CEW (via the processing circuit) may instruct the signal generator to provide an ignition signal to one or more projectiles based on the type of deployment unit, the type of projectile, the position of the projectile, deployment instructions, etc. For example, in response to an unfolding instruction, the unfolding instruction includes an instruction to unfold the projectile 1, the projectile 2, and the projectile 3 in response to the trigger activation, the CEW can instruct the signal generator to provide an ignition signal to cause the projectile 1, the projectile 2. Unfolding with projectile 3. In response to the unfolding unit feature, the unfolding unit feature includes an instruction to unfold the two object penetrating electrodes in response to the first trigger activation. The CEW can instruct the signal generator to provide an ignition signal to cause the two object penetrating electrodes Unfold. In response to the unfolding unit feature, the unfolding unit feature includes an instruction to unfold an object penetrating electrode and two low-penetrating electrodes in response to the first trigger activation. CEW can instruct the signal generator to provide an ignition signal to cause a The development of the object penetrating electrode and two low penetrating electrodes.

在諸多實施例中,並具體參考圖4B,揭示用於使用(第二)控制界面來控制CEW的方法421。方法421可允許從展開單元選擇性展開一或更多個發射體。例如,方法421可能夠選擇一個、二個、三個、或任何其他合適數目之發射體供展開。In many embodiments, and specifically referring to FIG. 4B, a method 421 for controlling CEW using a (second) control interface is disclosed. The method 421 may allow one or more emitters to be selectively deployed from the deployment unit. For example, the method 421 may be able to select one, two, three, or any other suitable number of emitters for deployment.

在諸多實施例中,CEW可決定展開單元特徵(步驟422)。展開單元特徵可包括指示展開單元的諸多特徵之資料。展開單元特徵可包括展開單元類型、發射體類型、發射體位置、展開指令、及/或與展開單元、發射體、CEW有關的任何其他合適或期望之資訊、或發射體從展開單元的展開。參考圖4A,於方法401中更詳細地討論展開單元特徵。In many embodiments, the CEW may determine the unfolding unit characteristics (step 422). The features of the unfolded unit may include data indicating many features of the unfolded unit. The unfolding unit characteristics may include unfolding unit type, projectile type, projectile location, unfolding instructions, and/or any other suitable or desired information related to the unfolding unit, projectile, CEW, or the deployment of the projectile from the unfolding unit. Referring to FIG. 4A, the expanded cell feature is discussed in more detail in method 401.

CEW可使用任何合適之製程來決定展開單元特徵。簡要地參考圖4A,CEW可類似於在步驟404中決定展開單元特徵來決定展開單元特徵。例如,並按照諸多實施例,展開單元的記憶體(例如,展開單元記憶體、第一記憶體等)可儲存展開單元特徵。CEW之處理電路可與展開單元的記憶體通訊以檢索並決定展開單元特徵。作為另一範例,並按照諸多實施例,展開單元之記憶體可儲存唯一識別符(例如,展開單元識別符等)。CEW的記憶體(例如,CEW記憶體、第二記憶體等)可儲存唯一識別符和相關聯之展開單元特徵的列表、表格等。CEW之處理電路可與展開單元的記憶體通訊以檢索唯一識別符。處理電路可與CEW之記憶體通訊以基於唯一識別符來決定展開單元特徵。CEW can use any suitable process to determine the characteristics of the unfolded unit. Referring briefly to FIG. 4A, the CEW may determine the unfolded cell features similar to the unfolded cell features in step 404. For example, and according to many embodiments, the memory of the expansion unit (for example, the expansion unit memory, the first memory, etc.) can store the characteristics of the expansion unit. The processing circuit of CEW can communicate with the memory of the expansion unit to retrieve and determine the characteristics of the expansion unit. As another example, and according to many embodiments, the memory of the expansion unit may store a unique identifier (for example, the expansion unit identifier, etc.). The CEW memory (for example, the CEW memory, the second memory, etc.) can store a list, table, etc., of unique identifiers and associated expanded unit features. The processing circuit of CEW can communicate with the memory of the expansion unit to retrieve the unique identifier. The processing circuit can communicate with the memory of the CEW to determine the characteristics of the expanded unit based on the unique identifier.

在諸多實施例中,CEW可接收控制模式選擇(步驟424)。控制模式選擇可包含射擊一選擇(步驟424-1)、射擊二選擇(步驟424-2)、或射擊三選擇(步驟424-3)。於諸多實施例中,控制模式選擇亦可包含任何其他合適或期望的控制模式。可在決定展開單元特徵之前接收控制模式選擇。於決定展開單元特徵之後可接收控制模式選擇。可回應於控制模式選擇來決定展開單元特徵。在諸多實施例中,控制模式選擇亦可為來自展開單元特徵的資料。In many embodiments, the CEW may receive the control mode selection (step 424). The control mode selection may include shooting one selection (step 424-1), shooting two selection (step 424-2), or shooting three selection (step 424-3). In many embodiments, the control mode selection can also include any other suitable or desired control modes. The control mode selection can be received before deciding on the characteristics of the unfolding unit. After determining the characteristics of the unfolding unit, the control mode selection can be received. The characteristics of the unfolded unit can be determined in response to the control mode selection. In many embodiments, the control mode selection can also be data from the characteristics of the expanded unit.

射擊一選擇可建構為能夠回應於扳機啟動而使發射體從展開單元之單一展開。射擊二選擇可建構為回應於扳機啟動而能夠使二個發射體從展開單元展開。射擊三選擇可建構為回應於扳機啟動而能夠使三個發射體從展開單元展開。The firing option can be constructed to enable the single deployment of the projectile from the deployment unit in response to trigger activation. The second shooting option can be constructed to enable the two projectiles to be deployed from the deployment unit in response to trigger activation. The three shooting options can be constructed to enable the three projectiles to be deployed from the deployment unit in response to trigger activation.

CEW可使用任何合適的製程來接收控制模式選擇。例如,並按照諸多實施例,CEW之控制界面可接收控制模式選擇。回應於接收控制模式選擇,控制界面可將控制模式選擇發送至CEW的處理電路。作為另一範例,處理電路可建構為偵測控制界面上之控制模式選擇。例如,回應於接收控制模式指令的控制界面,處理電路可偵測並接收來自控制界面之控制模式指令。CEW can use any suitable process to receive the control mode selection. For example, and in accordance with many embodiments, the control interface of CEW can receive control mode selection. In response to receiving the control mode selection, the control interface may send the control mode selection to the processing circuit of the CEW. As another example, the processing circuit can be configured to detect the control mode selection on the control interface. For example, in response to the control interface receiving the control mode command, the processing circuit can detect and receive the control mode command from the control interface.

在諸多實施例中,CEW可接收扳機啟動(步驟426)。簡要地參考圖4A,CEW可類似於在步驟406中接收扳機啟動來接收扳機啟動。扳機啟動可藉由CEW的扳機來接收。例如,CEW之處理電路可建構為偵測藉由扳機所接收之扳機啟動。作為另一範例,回應於接收扳機啟動,扳機可將扳機啟動發送至處理電路。In many embodiments, the CEW may receive a trigger activation (step 426). Referring briefly to FIG. 4A, the CEW may receive trigger activation similar to receiving trigger activation in step 406. Trigger activation can be received by the CEW trigger. For example, the processing circuit of the CEW can be configured to detect activation by the trigger received by the trigger. As another example, in response to receiving the trigger activation, the trigger may send the trigger activation to the processing circuit.

在諸多實施例中,CEW可基於控制模式選擇和展開單元特徵的至少一者來指示或造成指令給信號產生器(步驟428)。CEW可回應於接收扳機啟動來指示信號產生器。例如,CEW之處理電路可回應於接收到扳機啟動來指示信號產生器。回應於接收到指令(例如,控制信號),信號產生器可建構為將一或更多個點火信號提供至展開單元以造成一或更多個發射體的展開。在那方面,發送至信號之指令可為基於控制模式選擇和展開單元特徵的至少一者,以造成一或更多個發射體之選擇性展開。In many embodiments, the CEW may indicate or cause instructions to the signal generator based on at least one of control mode selection and unfolding unit features (step 428). The CEW can indicate the signal generator in response to receiving the trigger activation. For example, the processing circuit of the CEW can instruct the signal generator in response to receiving the trigger activation. In response to receiving an instruction (for example, a control signal), the signal generator may be configured to provide one or more ignition signals to the deployment unit to cause the deployment of the one or more projectiles. In that regard, the instruction sent to the signal may be based on at least one of the control mode selection and the characteristics of the deployment unit to cause the selective deployment of one or more projectiles.

例如,且按照諸多實施例,回應於控制模式選擇係射擊一選擇(步驟424-1),CEW可指示信號產生器將點火信號選擇性提供至一個展開單元或發射體,以造成單一發射體的展開。例如,並按照諸多實施例,回應於控制模式選擇係射擊二選擇(步驟424-2),CEW可指示信號產生器將點火信號選擇性提供至一或二個展開單元或發射體,以造成二個發射體之展開。例如,並按照諸多實施例,回應於控制模式選擇係射擊三選擇(步驟424-3),CEW可指示信號產生器將點火信號選擇性提供至一個、二個、或三個展開單元或發射體,以造成三個發射體的展開。For example, and according to many embodiments, in response to the control mode selection system firing-selection (step 424-1), the CEW can instruct the signal generator to selectively provide the firing signal to an unfolding unit or projectile to cause a single projectile Unfold. For example, and according to many embodiments, in response to the control mode selection being the firing two selection (step 424-2), the CEW can instruct the signal generator to selectively provide the ignition signal to one or two deployment units or emitters to cause two The development of a projectile. For example, and according to many embodiments, in response to the control mode selection being the firing three selection (step 424-3), the CEW can instruct the signal generator to selectively provide the ignition signal to one, two, or three deployment units or projectiles , In order to cause the expansion of the three projectiles.

待展開之一或更多個發射體的選擇亦可為基於展開單元特徵。例如,CEW(經由處理電路)可基於展開單元類型、發射體類型、發射體位置、展開指令等,指示信號產生器將點火信號提供至一或更多個發射體。例如,回應於展開單元特徵,所述展開單元特徵包含指令以回應於扳機啟動展開某些發射體、或一順序之發射體,CEW可基於指令指示信號產生器提供點火信號以造成發射體的展開,以展開某些發射體或發射體順序。The selection of one or more emitters to be deployed may also be based on the characteristics of the deployed unit. For example, the CEW (via the processing circuit) may instruct the signal generator to provide ignition signals to one or more projectiles based on the type of deployment unit, type of projectile, position of the projectile, deployment instructions, etc. For example, in response to the unfolding unit feature, the unfolding unit feature includes a command in response to the trigger to activate certain projectiles, or a sequence of projectiles, CEW can provide an ignition signal based on the command instructing the signal generator to cause the projectiles to expand , To expand certain emitters or emitter sequences.

作為範例,回應於控制模式選擇係射擊三選擇,展開單元特徵可定義要展開之三個發射體。例如,並參考圖4,展開單元特徵可回應於第一扳機啟動來定義發射體92-2、92-5、和92-8的展開(例如,直線展開)。展開單元特徵可回應於第一扳機啟動來定義發射體92-2、92-7、和92-9之展開(例如,三角形展開)。展開單元特徵亦可獨立地或基於每一控制模式選擇來定義發射體的任何其他配置、數目或展開順序。As an example, in response to the control mode selection being the shooting three options, the deployment unit feature can define the three projectiles to be deployed. For example, and referring to FIG. 4, the deployment unit feature may define the deployment (eg, linear deployment) of the projectiles 92-2, 92-5, and 92-8 in response to the first trigger activation. The deployment unit feature can define the deployment of the projectiles 92-2, 92-7, and 92-9 (e.g., triangular deployment) in response to activation of the first trigger. The unfolding unit features can also define any other configuration, number or unfolding order of the emitter independently or based on each control mode selection.

在諸多實施例中,回應於定義要展開之發射體數目的控制模式選擇,所述發射體數目係大於可用於展開單元中之展開的發射體數目,處理電路可指示信號產生器提供點火信號,以造成展開單元中之所有剩餘發射體的展開。在諸多實施例中,處理電路亦可(例如,經由聲音、警告、使用者顯示器等)通知操作者。In many embodiments, in response to the selection of a control mode that defines the number of projectiles to be deployed, the number of projectiles is greater than the number of projectiles that can be used for deployment in the deployment unit, and the processing circuit can instruct the signal generator to provide an ignition signal, In order to cause the expansion of all remaining projectiles in the expansion unit. In many embodiments, the processing circuit may also notify the operator (for example, via sound, warning, user display, etc.).

於諸多實施例中,並具體參考圖4C,揭示用於使用第一控制界面和第二控制界面來控制CEW之方法441。方法441可允許從展開單元選擇性展開一或更多個發射體。方法401亦可允許從單一展開單元選擇性展開不同類型的發射體。In many embodiments, and specifically referring to FIG. 4C, a method 441 for controlling the CEW using the first control interface and the second control interface is disclosed. Method 441 may allow one or more emitters to be selectively deployed from the deployment unit. The method 401 may also allow selective deployment of different types of emitters from a single deployment unit.

在諸多實施例中,CEW可決定展開單元特徵(步驟442)。展開單元特徵可包括指示展開單元之諸多特徵的資料。展開單元特徵可包括展開單元類型、發射體類型、發射體位置、展開指令、及/或與展開單元、發射體、CEW有關之任何其他合適或期望的資訊、或發射體從展開單元之展開。參考圖4A的方法401、及參考圖4B之方法421更詳細地討論展開單元特徵。In many embodiments, the CEW may determine the unfolding unit characteristics (step 442). The features of the unfolded unit may include data indicating many features of the unfolded unit. The unfolding unit characteristics may include unfolding unit type, projectile type, projectile position, unfolding instructions, and/or any other suitable or desired information related to the unfolding unit, projectile, CEW, or the deployment of the projectile from the unfolding unit. The expanded unit features are discussed in more detail with reference to the method 401 of FIG. 4A and the method 421 of FIG. 4B.

CEW可使用任何合適的製程來決定展開單元特徵。例如,並按照諸多實施例,展開單元之記憶體(例如,展開單元記憶體、第一記憶體等)可儲存展開單元特徵。CEW的處理電路可與展開單元之記憶體通訊以檢索並決定展開單元特徵。作為另一範例,並按照諸多實施例,展開單元的記憶體可儲存唯一識別符(例如,展開單元識別符等)。CEW之記憶體(例如,CEW記憶體、第二記憶體等)可儲存唯一識別符和相關聯的展開單元特徵之列表、表格等。CEW的處理電路可與展開單元之記憶體通訊以檢索唯一識別符。處理電路可與CEW的記憶體通訊,以基於唯一識別符來決定展開單元特徵。CEW can use any suitable process to determine the characteristics of the unfolded unit. For example, and according to many embodiments, the memory of the expansion unit (for example, the expansion unit memory, the first memory, etc.) can store the characteristics of the expansion unit. The processing circuit of CEW can communicate with the memory of the expansion unit to retrieve and determine the characteristics of the expansion unit. As another example, and according to many embodiments, the memory of the expansion unit may store a unique identifier (for example, the expansion unit identifier, etc.). The CEW memory (for example, the CEW memory, the second memory, etc.) can store lists, tables, etc., of unique identifiers and associated expanded unit features. The processing circuit of CEW can communicate with the memory of the expansion unit to retrieve the unique identifier. The processing circuit can communicate with the CEW's memory to determine the characteristics of the unfolding unit based on the unique identifier.

在諸多實施例中,CEW可接收第一控制模式選擇(步驟444)。控制模式選擇可包含安全模式選擇(步驟444-1)、射擊模式選擇(步驟444-2)、或穿透模式選擇(步驟444-3)。簡要地參考圖4A,CEW可接收類似於在方法401中接收控制模式選擇之第一控制模式選擇。In many embodiments, the CEW may receive the first control mode selection (step 444). The control mode selection may include safety mode selection (step 444-1), shooting mode selection (step 444-2), or penetration mode selection (step 444-3). Referring briefly to FIG. 4A, the CEW may receive a first control mode selection similar to the control mode selection received in method 401.

CEW可使用任何合適的製程來接收第一控制模式選擇。例如,並按照諸多實施例,CEW之第一控制界面可接收第一控制模式選擇。回應於接收到第一控制模式選擇,第一控制界面可將第一控制模式選擇發送至CEW的處理電路。作為另一範例,處理電路可建構為偵測第一控制界面上之第一控制模式選擇。例如,回應於第一控制界面接收到第一控制模式指令,處理電路可從第一控制界面偵測並接收第一控制模式指令。The CEW can use any suitable process to receive the first control mode selection. For example, and according to many embodiments, the first control interface of the CEW can receive the first control mode selection. In response to receiving the first control mode selection, the first control interface may send the first control mode selection to the processing circuit of the CEW. As another example, the processing circuit can be configured to detect the first control mode selection on the first control interface. For example, in response to the first control interface receiving the first control mode command, the processing circuit can detect and receive the first control mode command from the first control interface.

在諸多實施例中,CEW可接收第二控制模式選擇(步驟446)。控制模式選擇可包含射擊一選擇(步驟446-1)、射擊二選擇(步驟446-2)、或射擊三選擇(步驟446-3)。簡要地參考圖4B,CEW可類似於在方法421中接收控制模式選擇來接收第二控制模式選擇。In many embodiments, the CEW may receive the second control mode selection (step 446). The control mode selection may include shooting one selection (step 446-1), shooting two selection (step 446-2), or shooting three selection (step 446-3). Briefly referring to FIG. 4B, the CEW may receive the second control mode selection similar to receiving the control mode selection in method 421.

CEW可使用任何合適的製程來接收第二控制模式選擇。例如,並按照諸多實施例,CEW之第二控制界面可接收第二控制模式選擇。回應於接收到第二控制模式選擇,第二控制界面可將第二控制模式選擇發送至CEW的處理電路。作為另一範例,處理電路可建構為偵測第二控制界面上之第二控制模式選擇。例如,回應於第二控制界面接收到第二控制模式指令,處理電路可從第二控制界面偵測並接收第二控制模式指令。The CEW can use any suitable process to receive the second control mode selection. For example, and according to many embodiments, the second control interface of the CEW can receive the second control mode selection. In response to receiving the second control mode selection, the second control interface may send the second control mode selection to the processing circuit of the CEW. As another example, the processing circuit can be configured to detect the second control mode selection on the second control interface. For example, in response to the second control interface receiving the second control mode command, the processing circuit can detect and receive the second control mode command from the second control interface.

在諸多實施例中,能以任何合適或期望的順序來接收和決定第一控制模式選擇、第二控制模式選擇、和展開單元特徵。例如,可於決定展開單元特徵之前接收第一控制模式選擇及/或第二控制模式選擇。可在決定展開單元特徵之後接收第一控制模式選擇及/或第二控制選擇。可回應於第一控制模式選擇及/或第二控制模式選擇來決定展開單元特徵。In many embodiments, the first control mode selection, the second control mode selection, and the unfolding unit feature can be received and determined in any suitable or desired order. For example, the first control mode selection and/or the second control mode selection may be received before determining the characteristics of the unfolding unit. The first control mode selection and/or the second control selection can be received after determining the characteristics of the unfolding unit. The unfolding unit characteristics can be determined in response to the first control mode selection and/or the second control mode selection.

在諸多實施例中,CEW可接收扳機啟動(步驟448)。簡要地參考圖4A,CEW可類似於在步驟406中接收扳機啟動來接收扳機啟動。可藉由CEW的扳機來接收扳機啟動。例如,CEW之處理電路可建構為偵測藉由扳機所接收的扳機啟動。作為另一範例,回應於接收到扳機啟動,扳機可將扳機啟動發送至處理電路。In many embodiments, the CEW may receive a trigger activation (step 448). Referring briefly to FIG. 4A, the CEW may receive trigger activation similar to receiving trigger activation in step 406. The trigger of CEW can be used to receive trigger activation. For example, the processing circuit of the CEW can be configured to detect activation by the trigger received by the trigger. As another example, in response to receiving the trigger activation, the trigger may send the trigger activation to the processing circuit.

在諸多實施例中,CEW可基於第一控制模式選擇、第二控制模式選擇、和展開單元特徵之至少一者來指示、或造成指令至信號產生器(步驟450)。In many embodiments, the CEW may indicate or cause a command to the signal generator based on at least one of the first control mode selection, the second control mode selection, and the characteristics of the unfolding unit (step 450).

CEW可回應於接收到扳機啟動來指示信號產生器。例如,CEW的處理電路可回應於接收到扳機啟動而指示信號產生器。回應於接收到指令(例如,控制信號),信號產生器可建構為將一或更多個點火信號提供至展開單元,以造成一或更多個發射體之展開。在那方面,發送至信號的指令可為基於第一控制模式選擇、第二控制模式選擇、和展開單元特徵之至少一者,以造成一或更多個發射體的選擇性展開。簡要地參考圖4A,在方法401中更詳細地討論基於第一控制模式選擇之展開的範例。簡要地參考圖4B,在方法421中更詳細地討論基於第二控制模式選擇之展開的範例。參考圖4A和圖4B,在方法401和方法421兩者中更詳細地討論基於展開單元特徵之展開的範例。下面提供基於第一控制模式選擇、第二控制模式選擇、和展開單元特徵之一或更多個的展開之其他範例。The CEW may indicate the signal generator in response to receiving the trigger activation. For example, the processing circuit of the CEW can instruct the signal generator in response to receiving the trigger activation. In response to receiving a command (eg, a control signal), the signal generator may be configured to provide one or more ignition signals to the deployment unit to cause the deployment of one or more projectiles. In that regard, the instruction sent to the signal may be based on at least one of the first control mode selection, the second control mode selection, and the characteristics of the deployment unit to cause selective deployment of one or more projectiles. Referring briefly to FIG. 4A, an example of deployment based on the first control mode selection is discussed in more detail in method 401. Referring briefly to FIG. 4B, an example of deployment based on the second control mode selection is discussed in more detail in method 421. With reference to FIGS. 4A and 4B, examples of unfolding based on unfolding unit features are discussed in more detail in both the method 401 and the method 421. Other examples of deployment based on one or more of the first control mode selection, the second control mode selection, and the characteristics of the deployment unit are provided below.

例如,回應於第一控制模式選擇係射擊模式選擇且第二控制模式選擇係射擊一選擇,CEW可用每次扳機啟動來使單一低穿透式發射體能夠選擇性地展開。For example, in response to the first control mode selection being a shooting mode selection and the second control mode selection being a shooting selection, the CEW can be activated each time the trigger is activated to enable a single low-penetration projectile to be selectively deployed.

作為另一範例,回應於第一控制模式選擇係穿透模式選擇且第二控制模式選擇係射擊二選擇,CEW可針對每次扳機啟動使二個發射體能夠選擇性地展開,於此每一發射體可為低穿透式發射體或物件穿透式發射體。回應於定義發射體展開順序的展開單元特徵等,CEW可進一步按照展開單元特徵使二個發射體能夠選擇性地展開。As another example, in response to the first control mode selection being the penetration mode selection and the second control mode selection being the shooting two selections, CEW can enable the two projectiles to be selectively deployed for each trigger activation, where each The emitter can be a low-penetration emitter or an object-piercing emitter. In response to the unfolding unit features that define the sequence of the launcher's unfolding, the CEW can further enable the two emitters to be selectively unfolded according to the unfolding unit features.

在諸多實施例中,並參考圖5A,揭示電極100(例如,物件穿透式電極)。電極100可建構為穿透藉由目標所穿著之物件,以確保電極100能夠與目標的組織建立連接。於那方面,與低穿透式電極成對比,電極100可增加至目標組織之穿透性和連接性。電極100可建構為穿透藉由目標所穿著的物件、例如厚衣服、冬裝等。電極100可建構為穿透直至國家司法學會(NIJ)IIIA級分類標準(並包括低於IIIA之NIJ級別)之防彈衣(例如,防彈背心等)。除了其他變數以外,電極100的穿透能力可為電極100之尺寸、形狀、重量、和展開速度的函數。In many embodiments, and with reference to FIG. 5A, an electrode 100 (for example, an object penetrating electrode) is disclosed. The electrode 100 can be configured to penetrate an object worn by the target to ensure that the electrode 100 can establish a connection with the target tissue. In that respect, in contrast to a low-penetration electrode, the electrode 100 can increase the penetration and connectivity to the target tissue. The electrode 100 may be configured to penetrate objects worn by the target, such as thick clothes, winter clothes, and the like. The electrode 100 can be constructed as a bulletproof vest (for example, a bulletproof vest, etc.) that penetrates up to the National Institute of Justice (NIJ) IIIA classification standard (and includes the NIJ level lower than IIIA). Among other variables, the penetration capability of the electrode 100 may be a function of the size, shape, weight, and deployment speed of the electrode 100.

在諸多實施例中,與低穿透式電極相比,電極100可於較大之速度從CEW的展開單元展開。例如,能以更大之速度展開電極100,以輔助電極100穿透一或更多個物件。在諸多實施例中,與低穿透式電極相比,亦可從CEW的信號產生器向電極100提供更大之電荷(或刺激信號)。例如,可為電極100提供每一脈衝包含100微庫侖的電荷,反之可為另一電極提供每一脈衝包含70微庫侖的電荷。In many embodiments, the electrode 100 can be deployed from the deployment unit of the CEW at a higher speed than a low-penetration electrode. For example, the electrode 100 can be deployed at a greater speed to assist the electrode 100 to penetrate one or more objects. In many embodiments, compared with a low-penetration electrode, a signal generator of the CEW can also provide a larger charge (or stimulation signal) to the electrode 100. For example, the electrode 100 may be provided with a charge of 100 microcoulombs per pulse, and vice versa, the other electrode may be provided with a charge of 70 microcoulombs per pulse.

在諸多實施例中,電極100可包含本體101,所述本體101具有與繫繩端部107相反之接觸端部105。本體101可包含建構為輔助(或不防止)穿透式物件中的電極100之任何合適的尺寸和形狀。本體101可包含大於低穿透式電極及/或電極之矛的長度(例如,其中長度定義為電極101的接觸端部105和繫繩端部107之間的距離)之長度。本體101可包含大於建構為符合最大穿透深度的低穿透式電極之長度的長度。例如,本體101可包含大於13毫米(0.039英寸)之長度。本體101可包含建構為回應於電極100穿透目標組織而使目標組織中的組織損傷最小化之形狀。本體101可包含空氣動力學形狀。本體101可包含細長形狀、例如針形、銷形、圓柱形等。本體101的寬度或直徑在接觸端部105和繫繩端部107之間可不改變,或可改變小於百分之十、小於百分之二十、小於百分之三十、小於百分之四十、或小於百分之五十的本體101的長度。在諸多實施例中,本體101的寬度或直徑可不改變或可沿著接觸端部105和繫繩端部107之間的本體101之長度的至少百分之五十、至少百分之六十、至少百分之七十、至少百分之八十、或至少百分之九十改變達此等百分比,並垂直於本體101的寬度或直徑。本體101可包含具有導電特性之任何合適的材料。在諸多實施例中,與藉由低穿透式電極所使用之材料相比,本體101可包含具有重量更大的材料。配重可回應於從CEW展開而輔助電極100維持速度、穩定性、和準確性。例如,本體101可包含鎢金屬材料。In many embodiments, the electrode 100 may include a body 101 having a contact end 105 opposite to the tether end 107. The body 101 may include any suitable size and shape configured to assist (or not prevent) the electrode 100 in the penetrating object. The body 101 may include a length greater than the length of the low-penetration electrode and/or the spear of the electrode (for example, the length is defined as the distance between the contact end 105 of the electrode 101 and the tether end 107). The body 101 may include a length greater than the length of the low-penetration electrode configured to meet the maximum penetration depth. For example, the body 101 may include a length greater than 13 millimeters (0.039 inches). The body 101 may include a shape configured to minimize tissue damage in the target tissue in response to the penetration of the electrode 100 through the target tissue. The body 101 may include an aerodynamic shape. The body 101 may include an elongated shape, such as a needle shape, a pin shape, a cylindrical shape, and the like. The width or diameter of the body 101 may not change between the contact end 105 and the tether end 107, or may change less than ten percent, less than 20 percent, less than 30 percent, or less than 4 percent. Ten, or less than fifty percent of the length of the body 101. In many embodiments, the width or diameter of the body 101 may not change or may be along at least fifty percent, at least sixty percent, or at least 60 percent of the length of the body 101 between the contact end 105 and the tether end 107. At least seventy percent, at least eighty percent, or at least ninety percent change by these percentages, and are perpendicular to the width or diameter of the body 101. The body 101 may include any suitable material with conductive properties. In many embodiments, the body 101 may include a material with a heavier weight than the material used by the low-penetration electrode. The counterweight can respond to deployment from the CEW while the auxiliary electrode 100 maintains speed, stability, and accuracy. For example, the body 101 may include a tungsten metal material.

在諸多實施例中,本體101可包含近接繫繩端部107之寬廣部分。寬廣部分的尺寸和形狀可設計為至少部分地防止繫繩端部107和繫繩110進入目標組織。在那方面,寬廣部分之尺寸和形狀可設計為於電極100已接觸目標並刺穿目標組織之後至少部分地停止電極100的動量。In many embodiments, the body 101 may include a wide portion adjacent to the end 107 of the tether. The size and shape of the wide portion can be designed to at least partially prevent the tether end 107 and tether 110 from entering the target tissue. In that regard, the size and shape of the wide portion can be designed to at least partially stop the momentum of the electrode 100 after the electrode 100 has contacted the target and pierced the target tissue.

接觸端部105可建構為穿透物件並將電極100與目標組織連接。接觸端部105可包含建構為輔助電極100穿透物件並與目標組織連接之尖銳或尖端。接觸端部105可建構為回應於電極100與目標的組織連接而輔助將電極100保留在目標之組織中。例如,按照諸多實施例並參考圖5B,接觸端部105可包含或耦接至電極附件220。電極附件220亦可坐落於本體101上的任何其他位置,所述位置適合於輔助將電極100保留在目標組織中。電極附件220可包含建構為輔助電極100之保留的任何合適之部件或材料。例如,電極附件220可包含帶倒刺的鉤件、突起部、成角度之突起部等。The contact end 105 may be configured to penetrate the object and connect the electrode 100 to the target tissue. The contact end 105 may include a sharp or pointed end configured as the auxiliary electrode 100 penetrating the object and connecting with the target tissue. The contact end 105 may be configured to assist in retaining the electrode 100 in the target tissue in response to the electrode 100 being connected to the target tissue. For example, according to many embodiments and referring to FIG. 5B, the contact end 105 may include or be coupled to the electrode attachment 220. The electrode attachment 220 can also be located at any other position on the body 101, which is suitable for assisting the retention of the electrode 100 in the target tissue. The electrode attachment 220 may include any suitable components or materials that are constructed as a reserve of the auxiliary electrode 100. For example, the electrode attachment 220 may include barbed hooks, protrusions, angled protrusions, and the like.

於諸多實施例中,電極附件220可包含可溶解材料,其建構為回應於電極附件220穿透目標的組織而(完全或部分地)溶解。在那方面,當從目標之組織移除電極100時(例如,於電極附件溶解之後),可溶解材料能輔助使對目標的組織之損傷最小化。電極附件220可包含能溶解於液體溶劑中的任何材料(例如水溶性材料、可生物降解之材料等)。例如,電極附件220可包含鹽材料。溶解率可為基於例如溫度的操作因素。溶解率亦可為基於例如使用於形成電極附件220之可溶解材料的數量之因素來建構。在那方面,可調整這些因素,使得可溶解材料於溶解時間(完全或部分地)溶解。例如,溶解時間可在材料溶解之前能夠使電極100於目標的組織中保留一段時間,以允許在對目標之組織造成最小損傷的情況下移除電極。溶解時間可包含任何合適或期望之時間或時間範圍、例如一分鐘、一至二分鐘等。In many embodiments, the electrode attachment 220 may include a dissolvable material that is configured to dissolve (completely or partially) in response to the electrode attachment 220 penetrating the target tissue. In that regard, when the electrode 100 is removed from the target tissue (for example, after the electrode attachment is dissolved), the dissolvable material can assist in minimizing damage to the target tissue. The electrode attachment 220 may include any material that can be dissolved in a liquid solvent (for example, water-soluble material, biodegradable material, etc.). For example, the electrode attachment 220 may include a salt material. The dissolution rate may be based on operating factors such as temperature. The dissolution rate can also be constructed based on factors such as the amount of dissolvable material used to form the electrode attachment 220. In that regard, these factors can be adjusted so that the soluble material dissolves (completely or partially) during the dissolution time. For example, the dissolution time can allow the electrode 100 to remain in the target tissue for a period of time before the material dissolves, so as to allow the electrode to be removed with minimal damage to the target tissue. The dissolution time may include any suitable or desired time or time range, such as one minute, one to two minutes, and so on.

於諸多實施例中,電極附件220可為坐落在接觸端部105和繫繩端部107之間的電極100上之任何位置。例如,電極附件220可為坐落於本體101的中間點上。因此,電極附件220可建構為允許接觸端部105在電極附件220接觸目標或目標組織之前刺穿目標,以將電極100至少部分地保留於目標或目標組織中。在諸多實施例中,回應於電極附件220接觸目標或目標組織,電極附件220的尺寸和形狀亦可設計為至少部分地減小動量。在那方面,電極附件220可建構為允許接觸端部105於電極附件220接觸目標或目標組織之前刺穿目標,以減小電極的動量。In many embodiments, the electrode attachment 220 can be any position on the electrode 100 located between the contact end 105 and the tether end 107. For example, the electrode attachment 220 may be located on the middle point of the main body 101. Therefore, the electrode attachment 220 may be configured to allow the contact tip 105 to pierce the target before the electrode attachment 220 contacts the target or target tissue, so as to retain the electrode 100 at least partially in the target or target tissue. In many embodiments, in response to the electrode attachment 220 contacting the target or target tissue, the size and shape of the electrode attachment 220 may also be designed to at least partially reduce momentum. In that regard, the electrode attachment 220 may be configured to allow the contact end 105 to pierce the target before the electrode attachment 220 contacts the target or target tissue, so as to reduce the momentum of the electrode.

在諸多實施例中,並再次參考圖5A,繫繩端部107可建構為將本體101耦接至繫繩110。繫繩110可建構為將電極100電耦接至CEW之展開單元(例如,CEW 1的展開單元20,簡要地參考圖1)。繫繩110可包含能夠完成電耦接之任何合適的導電材料。繫繩110可使用任何合適之方法、例如雷射焊接、壓接等來耦接至本體101。在那方面,與具有耦接至本體的矛、和耦接至本體之電線-繫繩的低穿透式電極成對比,電極100可包含直接地耦接至繫繩110之單一整體結構。In many embodiments, and referring again to FIG. 5A, the tether end 107 may be configured to couple the body 101 to the tether 110. The tether 110 may be configured to electrically couple the electrode 100 to the deployment unit of the CEW (for example, the deployment unit 20 of the CEW 1, briefly refer to FIG. 1). The tether 110 may include any suitable conductive material capable of performing electrical coupling. The tether 110 can be coupled to the main body 101 using any suitable method, such as laser welding, crimping, and the like. In that regard, in contrast to a low-penetration electrode having a spear coupled to the body and a wire-tether coupled to the body, the electrode 100 may include a single unitary structure directly coupled to the tether 110.

於諸多實施例中,並參考圖5C,繫繩110亦可建構為輔助從目標的組織移除電極100。例如,繫繩110可包含第一繫繩部分315-1(例如,電極附接部分)和第二繫繩部分315-2(例如展開單元附接部分)。例如,第一繫繩部分315-1可建構為允許使用者藉由在第一繫繩部分315-1上拉動而從目標之組織取出電極100。與第二繫繩部分315-2相比,第一繫繩部分315-1可包含具有更大拉伸強度的材料。例如,第一繫繩部分315-1可包含鋼線或類似材料。第二繫繩部分315-2可包含絲線。第一繫繩部分315-1可於第一端部耦接至本體101,且在第二端部耦接至第二繫繩部分315-2。第二繫繩部分315-2可於第一端部耦接至第一繫繩部分315-1且在第二端部耦接至展開單元。於那方面,電荷可從展開單元傳遞至第二繫繩部分315-2、從第二繫繩部分315-2傳遞至第一繫繩部分315-1、並從第一繫繩部分315-1傳遞至電極100之本體101。在諸多實施例中,繫繩110亦可包含任何數目的繫繩部分,使一或更多個繫繩部分具有不同之拉伸強度。In many embodiments, and referring to FIG. 5C, the tether 110 may also be configured to assist in removing the electrode 100 from the target tissue. For example, the tether 110 may include a first tether portion 315-1 (e.g., an electrode attachment portion) and a second tether portion 315-2 (e.g., a deployment unit attachment portion). For example, the first tether portion 315-1 may be configured to allow the user to remove the electrode 100 from the target tissue by pulling on the first tether portion 315-1. Compared with the second tether portion 315-2, the first tether portion 315-1 may include a material having a greater tensile strength. For example, the first tether portion 315-1 may include steel wire or similar materials. The second tether portion 315-2 may include a wire. The first tether portion 315-1 can be coupled to the body 101 at a first end, and to the second tether portion 315-2 at a second end. The second tether portion 315-2 may be coupled to the first tether portion 315-1 at the first end and to the deployment unit at the second end. In that regard, the charge can be transferred from the deployment unit to the second tether portion 315-2, from the second tether portion 315-2 to the first tether portion 315-1, and from the first tether portion 315-1 It is transmitted to the body 101 of the electrode 100. In many embodiments, the tether 110 may also include any number of tether parts, so that one or more tether parts have different tensile strengths.

於諸多實施例中,並再次參考圖5A,本體101可包含任何合適或期望的表面塗層。表面塗層可輔助將電極100保留於目標之組織中。例如,表面塗層、例如基於聚四氟乙烯(PTFE)的材料(例如,杜邦公司所提供之TEFLON®)可被降級(例如,變形、刮擦、變粗糙等)。降級的表面可增加對目標組織之摩擦,以輔助將電極100保留在目標組織中。In many embodiments, and referring again to FIG. 5A, the body 101 may include any suitable or desired surface coating. The surface coating can help retain the electrode 100 in the target tissue. For example, surface coatings such as polytetrafluoroethylene (PTFE)-based materials (for example, TEFLON® provided by DuPont) can be degraded (for example, deformed, scratched, roughened, etc.). The degraded surface can increase friction against the target tissue to assist in retaining the electrode 100 in the target tissue.

表面塗層亦可建構為控制從電極100至目標的組織之電流放電。例如,按照諸多實施例並參考圖5D,本體101可包含電阻塗層440。電阻塗層440可包含於變動位準提供電阻的一或更多材料。電阻塗層440可包含任何合適之絕緣材料及/或包含高電阻的材料。例如,電阻塗層440可包含基於PTFE之材料。電阻塗層440可建構為控制電流從電極100的放電。例如,從繫繩110行進進入本體101之電荷可在最小電阻的路徑放電進入目標之組織。例如,坐落於本體101上的接觸端部105上或附近之電阻塗層440可包含比坐落在本體101上的繫繩端部107上或附近之電阻塗層440更大的電阻。因此,變動跨過本體101之電阻位準可允許電極100控制電流的放電,如本文所進一步討論的。The surface coating can also be configured to control the current discharge from the electrode 100 to the target tissue. For example, according to many embodiments and referring to FIG. 5D, the body 101 may include a resistive coating 440. The resistive coating 440 may include one or more materials that provide resistance at varying levels. The resistive coating 440 may include any suitable insulating material and/or include high-resistance materials. For example, the resistive coating 440 may include a PTFE-based material. The resistive coating 440 may be configured to control the discharge of current from the electrode 100. For example, the charge traveling from the tether 110 into the body 101 can be discharged into the target tissue in the path of least resistance. For example, the resistive coating 440 on or near the contact end 105 on the body 101 may include a greater resistance than the resistive coating 440 on or near the tether end 107 on the body 101. Therefore, varying the resistance level across the body 101 may allow the electrode 100 to control the discharge of current, as discussed further herein.

於諸多實施例中,電阻塗層440可在本體101上包含一或更多塗層區域,每一塗層區域具有變動之電阻位準。例如,圖5D描繪具有第一電阻塗層440-1、第二電阻塗層440-2、第三電阻塗層440-3、和「第N」電阻塗層440-n(例如,如於圖5D中用交叉陰影線所描繪者)的電阻塗層440。電阻塗層440亦可包含在本體101上之任何其他數目的不同塗層區域,或可包含從接觸端部105至繫繩端部107以任何比率減小之電阻。In many embodiments, the resistive coating 440 may include one or more coating regions on the body 101, and each coating region has a variable resistance level. For example, FIG. 5D depicts a first resistive coating 440-1, a second resistive coating 440-2, a third resistive coating 440-3, and an "Nth" resistive coating 440-n (for example, as shown in FIG. The resistive coating 440 depicted by the cross-hatched lines in 5D). The resistive coating 440 may also include any other number of different coating areas on the body 101, or may include a resistance that decreases at any rate from the contact end 105 to the tether end 107.

第一電阻塗層440-1可包含大於第二電阻塗層440-2、第三電阻塗層440-3、和第N電阻塗層440-n的電阻。第二電阻塗層440-2可包含大於第三電阻塗層440-3和第N電阻塗層440-n、但小於第一電阻塗層440-1之電阻。第三電阻塗層440-3可包含大於第N電阻塗層440-n、但小於第一電阻塗層440-1和第二電阻塗層440-2的電阻。第n電阻塗層440-n可包含小於第一電阻塗層440-1、第二電阻塗層440-2、和第三電阻塗層440-3之電阻。作為範例,第一電阻塗層440-1可在500伏特下絕緣,第二電阻塗層440-2可於400伏特下絕緣,第三電阻塗層440-3可在200伏特下絕緣,且第N電阻塗層440-n可能沒有絕緣。The first resistance coating 440-1 may include a resistance greater than that of the second resistance coating 440-2, the third resistance coating 440-3, and the Nth resistance coating 440-n. The second resistance coating 440-2 may include a resistance greater than that of the third resistance coating 440-3 and the Nth resistance coating 440-n, but less than the first resistance coating 440-1. The third resistance coating 440-3 may include a resistance greater than the Nth resistance coating 440-n but less than the first resistance coating 440-1 and the second resistance coating 440-2. The nth resistive coating 440-n may include a resistance smaller than that of the first resistive coating 440-1, the second resistive coating 440-2, and the third resistive coating 440-3. As an example, the first resistive coating 440-1 can be insulated at 500 volts, the second resistive coating 440-2 can be insulated at 400 volts, and the third resistive coating 440-3 can be insulated at 200 volts. The N resistance coating 440-n may not be insulated.

作為範例,回應於耦接至目標組織的電極100,電荷可通過電極100以完成與耦接至目標組織之第二電極的電路。電荷可通過電極100之具有最小電阻的本體101之一部分,以完成電路。例如,回應於目標組織係與第一電阻塗層440-1、第二電阻塗層440-2、第三電阻塗層440-3、和第N電阻塗層440-n電接觸,電荷可通過第N電阻塗層440-n以完成電路。作為另一範例,回應於目標組織係僅與第一電阻塗層440-1和第二電阻塗層440-2電接觸,電荷可通過第二電阻塗層440-2以完成電路。在那方面,電阻塗層440可藉由限制電荷在目標的身體中以比完成電路所需之深度更深地放電,來進一步使對目標組織(或目標器官)的損傷減至最小。As an example, in response to the electrode 100 coupled to the target tissue, a charge can pass through the electrode 100 to complete the circuit with the second electrode coupled to the target tissue. The charge can pass through a part of the body 101 of the electrode 100 with the smallest resistance to complete the circuit. For example, in response to the target tissue being in electrical contact with the first resistive coating 440-1, the second resistive coating 440-2, the third resistive coating 440-3, and the Nth resistive coating 440-n, the charge can pass through The Nth resistive coating 440-n completes the circuit. As another example, in response to the target tissue being only in electrical contact with the first resistive coating 440-1 and the second resistive coating 440-2, charges can pass through the second resistive coating 440-2 to complete the circuit. In that regard, the resistive coating 440 can further minimize damage to the target tissue (or target organ) by limiting the electric charge in the body of the target to discharge deeper than the depth required to complete the circuit.

於諸多實施例中,跨電極100之本體的電阻位準可藉由選擇性暴露電極本體之面積(例如,未藉由電阻塗層所覆蓋的電極本體之表面積)。例如,按照諸多實施例並參考圖6,電極100可包含具有電阻塗層540(例如,在圖6中以交叉陰影線所描繪者)的本體101。簡要地參考圖5D,電阻塗層540可類似於電阻塗層440。在那方面,電阻塗層540可包含一或更多個提供電阻之材料。電阻塗層540可包含任何合適的絕緣材料及/或材料、例如基於PTFE之材料。電阻塗層540亦可包含在本體101上的任何其他數目之不同塗層區域,或可包含從接觸端部105至繫繩端部107以任何比率減小的電阻。In many embodiments, the resistance level across the body of the electrode 100 can be selected by selectively exposing the area of the electrode body (for example, the surface area of the electrode body not covered by the resistive coating). For example, according to many embodiments and referring to FIG. 6, the electrode 100 may include a body 101 having a resistive coating 540 (e.g., as depicted by cross-hatching in FIG. 6). Referring briefly to FIG. 5D, the resistive coating 540 may be similar to the resistive coating 440. In that regard, the resistive coating 540 may include one or more materials that provide electrical resistance. The resistive coating 540 may include any suitable insulating materials and/or materials, such as PTFE-based materials. The resistive coating 540 may also include any other number of different coating areas on the body 101, or may include a resistance that decreases at any rate from the contact end 105 to the tether end 107.

電阻塗層540(或本體101)可包含複數個暴露表面550。暴露表面550可建構為控制來自電極100之電流的放電。例如,電阻塗層540(或本體101)可包含:第一暴露表面550-1、第二暴露表面550-2、第三暴露表面550-3、第四暴露表面550-4、第五暴露表面550-5、第六暴露表面550-6、第七暴露表面550-7、第八暴露表面550-8、第九暴露表面550-9、及/或任何其他數目之適合控制來自電極100的電流之放電的暴露表面550。The resistive coating 540 (or the body 101) may include a plurality of exposed surfaces 550. The exposed surface 550 can be configured to control the discharge of current from the electrode 100. For example, the resistive coating 540 (or the body 101) may include: a first exposed surface 550-1, a second exposed surface 550-2, a third exposed surface 550-3, a fourth exposed surface 550-4, and a fifth exposed surface 550-5, sixth exposed surface 550-6, seventh exposed surface 550-7, eighth exposed surface 550-8, ninth exposed surface 550-9, and/or any other number suitable for controlling the current from electrode 100 The exposed surface 550 of the discharge.

每一暴露表面550可包含未藉由電阻塗層540所覆蓋之本體101的一部分(例如,每一暴露表面可界定經過電阻塗層540之空隙)。於諸多實施例中,可藉由不將電阻塗層540施加至藉由暴露表面550所界定的表面積來形成一或更多個暴露表面550。在諸多實施例中,可藉由在電阻塗層540之一部分上移除電阻塗層540來形成一或更多個暴露表面550,所述電阻塗層540的部分。藉由暴露表面550所界定。每一暴露表面550可包含任何合適之長度、寬度、尺寸、形狀、表面積等。暴露表面550可變動物理性質和數目,使得暴露於本體101的接觸端部105上或附近之表面積(例如,第一表面積、高電阻表面積等)的總量小於暴露在本體101之繫繩端部107上或附近的表面積(例如,第二表面積、低電阻表面積等)之總量。Each exposed surface 550 may include a portion of the body 101 that is not covered by the resistive coating 540 (for example, each exposed surface may define a void through the resistive coating 540). In many embodiments, one or more exposed surfaces 550 can be formed by not applying the resistive coating 540 to the surface area defined by the exposed surface 550. In many embodiments, one or more exposed surfaces 550 may be formed by removing the resistive coating 540 on a portion of the resistive coating 540, the portion of the resistive coating 540. It is defined by the exposed surface 550. Each exposed surface 550 can include any suitable length, width, size, shape, surface area, etc. The physical properties and number of the exposed surface 550 can be varied, so that the total amount of surface area (eg, first surface area, high resistance surface area, etc.) exposed on or near the contact end 105 of the body 101 is smaller than that of the tether end exposed on the body 101 The total amount of surface area (eg, second surface area, low resistance surface area, etc.) on or near 107.

在諸多實施例中,暴露表面積的總量可從接觸端部105上升至繫繩端部107(例如,從繫繩端部107下降至接觸端部105)。例如,電阻塗層540可被分成一或更多個具有變動的暴露表面積之總量的部分。這些部分可重疊或可包含本體101之不同區域。例如,電阻塗層540的第一部分可包含第一暴露表面550-1,電阻塗層540之第二部分可包含第二暴露表面550-2,電阻塗層540的第三部分可包含第三暴露表面550-3和第四暴露表面表面550-4,電阻塗層540之第四部分可包含第五暴露表面550-5,電阻塗層540的第五部分可包含第六暴露表面550-6,電阻塗層540之第六部分可包含第七暴露表面550-7,電阻塗層540的第七部分可包含第八暴露表面550-8,電阻塗層540之第八部分(或本體101的不具有電阻塗層540之部分)可包含第九暴露表面550-9、及/或其任何組合。In many embodiments, the total amount of exposed surface area can rise from the contact end 105 to the tether end 107 (e.g., drop from the tether end 107 to the contact end 105). For example, the resistive coating 540 may be divided into one or more sections with varying amounts of exposed surface area. These parts may overlap or may include different areas of the body 101. For example, the first portion of the resistive coating 540 may include the first exposed surface 550-1, the second portion of the resistive coating 540 may include the second exposed surface 550-2, and the third portion of the resistive coating 540 may include the third exposed surface. The surface 550-3 and the fourth exposed surface surface 550-4, the fourth part of the resistive coating 540 may include the fifth exposed surface 550-5, and the fifth part of the resistive coating 540 may include the sixth exposed surface 550-6, The sixth portion of the resistive coating 540 may include the seventh exposed surface 550-7, the seventh portion of the resistive coating 540 may include the eighth exposed surface 550-8, and the eighth portion of the resistive coating 540 (or the non-exposed surface of the body 101) The portion with the resistive coating 540) may include the ninth exposed surface 550-9, and/or any combination thereof.

第一部分可包含小於第二部分、第三部分、第四部分、第五部分、第六部分、第七部分、和第八部分的暴露表面積。第二部分可包含大於第一部分、但小於第三部分、第四部分、第五部分、第六部分、第七部分、和第八部分之暴露表面積。第三部分可包含大於第一部分和第二部分、但小於第四部分、第五部分、第六部分、第七部分、和第八部分的暴露表面積。第四部分可包含大於第一部分、第二部分、和第三部分、但小於第五部分、第六部分、第七部分、和第八部分之暴露表面積。第五部分可包含大於第一部分、第二部分、第三部分、和第四部分、但小於第六部分、第七部分、和第八部分的暴露表面積。第六部分可包含大於第一部分、第二部分、第三部分、第四部分、和第五部分、但小於第七部分和第八部分之暴露表面積。第七部分可包含大於第一部分、第二部分、第三部分、第四部分、第五部分、和第六部分但小於第八部分的暴露表面積。第八部分可包含大於第一部分、第二部分、第三部分、第四部分、第五部分、第六部分、和第七部分之暴露表面積。The first part may comprise an exposed surface area smaller than the second part, the third part, the fourth part, the fifth part, the sixth part, the seventh part, and the eighth part. The second part may include an exposed surface area larger than the first part, but smaller than the third part, the fourth part, the fifth part, the sixth part, the seventh part, and the eighth part. The third portion may include an exposed surface area larger than the first portion and the second portion, but smaller than the fourth portion, the fifth portion, the sixth portion, the seventh portion, and the eighth portion. The fourth part may include an exposed surface area larger than the first part, the second part, and the third part, but smaller than the fifth part, the sixth part, the seventh part, and the eighth part. The fifth portion may include an exposed surface area larger than the first portion, the second portion, the third portion, and the fourth portion, but smaller than the sixth portion, the seventh portion, and the eighth portion. The sixth part may include an exposed surface area larger than the first part, the second part, the third part, the fourth part, and the fifth part, but smaller than the seventh part and the eighth part. The seventh portion may include an exposed surface area larger than the first portion, the second portion, the third portion, the fourth portion, the fifth portion, and the sixth portion but smaller than the eighth portion. The eighth part may include a larger exposed surface area than the first part, the second part, the third part, the fourth part, the fifth part, the sixth part, and the seventh part.

在操作CEW(例如,啟動、展開等)時,從繫繩110行進進入本體101的電荷可於最小電阻之路徑放電進入目標的組織。作為範例,回應於電極100耦接至目標之組織,電荷可通過電極100以完成與耦接至目標組織的第二電極之電路。電荷可通過電極100的具有最小電阻之本體101的部分,以完成電路。最小電阻之路徑可經由暴露表面550來控制。例如,從本體101行進的電荷可在與本體101之最大導電表面積接觸的位置從電極100放電進入目標之組織。作為範例,回應於目標組織係與電阻塗層540的所有部分電接觸,電荷可通過第九暴露表面550-9以完成電路(例如,與目標之組織接觸的最大導電表面積)。作為另一範例,回應於目標組織係與電阻塗層540之第一部分、第二部分、和第三部分電接觸,電荷可通過第三暴露表面550-3及/或第四暴露表面550-4以完成電路。在那方面,具有暴露表面550的電阻塗層540可藉由限制電荷於以比完成電路所需之深度更深地放電進入目標身體,來進一步使對目標組織(或目標器官)的損傷減至最小。When operating the CEW (for example, starting, unfolding, etc.), the electric charge traveling from the tether 110 into the body 101 can be discharged into the target tissue in the path of least resistance. As an example, in response to the electrode 100 being coupled to the target tissue, a charge can pass through the electrode 100 to complete the circuit with the second electrode coupled to the target tissue. The charge can pass through the portion of the body 101 of the electrode 100 that has the least resistance to complete the circuit. The path of minimum resistance can be controlled via the exposed surface 550. For example, the charge traveling from the body 101 can be discharged from the electrode 100 into the tissue of the target at a position in contact with the largest conductive surface area of the body 101. As an example, in response to the target tissue being in electrical contact with all parts of the resistive coating 540, the charge can pass through the ninth exposed surface 550-9 to complete the circuit (eg, the maximum conductive surface area in contact with the target tissue). As another example, in response to the target tissue being in electrical contact with the first part, the second part, and the third part of the resistive coating 540, the charge can pass through the third exposed surface 550-3 and/or the fourth exposed surface 550-4 To complete the circuit. In that regard, the resistive coating 540 with the exposed surface 550 can further minimize damage to the target tissue (or target organ) by limiting the charge to discharge into the target body deeper than the depth required to complete the circuit. .

在諸多實施例中,並再次參考圖5A,本體101可包含一或更多材料,其建構為控制從電極100至目標組織之電流的放電。In many embodiments, and referring again to FIG. 5A, the body 101 may include one or more materials configured to control the discharge of current from the electrode 100 to the target tissue.

例如,並按照諸多實施例,本體101可包含碳纖維複合材料、及/或任何其他包含類似特性之類似複合材料。當流經復合材料時,電力可能遇到較大的電阻。複合材料亦可設計成具有一定範圍之導電率。本體101可包含複合材料,其建構為包含比人體(例如,目標組織)的導電率小之導電率。從繫繩端部107(例如,經由繫繩110)流至包含複合材料的本體101中之接觸端部105的電流可在本體101之近接繫繩端部107的與目標組織接觸之最早部分放電。例如,回應於本體101的全部與目標組織接觸,電流可在繫繩端部107附近放電,而不在接觸端部105附近放電。作為另一範例,僅回應於接觸端部105附近之本體101的表面與目標組織接觸,電流可在接觸端部105附近放電。於那方面,包含複合材料之本體101可藉由限制電荷於以比完成電路所需之深度更深地放電進入目標身體,來進一步使對目標組織(或目標器官)的損傷減至最小。For example, and in accordance with many embodiments, the body 101 may include a carbon fiber composite material, and/or any other similar composite material with similar characteristics. When flowing through the composite material, electricity may encounter greater resistance. Composite materials can also be designed to have a certain range of conductivity. The body 101 may include a composite material, which is configured to include a conductivity that is lower than that of the human body (eg, target tissue). The current flowing from the tether end 107 (for example, via the tether 110) to the contact end 105 in the body 101 containing the composite material can be discharged at the earliest part of the body 101 that is adjacent to the tether end 107 in contact with the target tissue . For example, in response to all of the body 101 being in contact with the target tissue, the current may be discharged near the tether end 107 and not near the contact end 105. As another example, only in response to the contact of the surface of the body 101 near the contact end 105 with the target tissue, the current can be discharged near the contact end 105. In that regard, the body 101 containing the composite material can further minimize the damage to the target tissue (or target organ) by limiting the charge to discharge into the target body deeper than the depth required to complete the circuit.

作為另一範例,並按照諸多實施例,本體101可包含複數材料,使至少一材料包含與第二材料不同之電阻。可將包含不同電阻的材料散置在本體101中,以控制電流從本體101之放電。例如,包含較高電阻的材料可放置於接觸端部105附近,且包含較低電阻之材料可放置在繫繩端部107附近。例如,本體101可包含散置有電阻材料的金屬材料。電阻材料可包含導電塑膠或類似材料,或可包含具有絕緣特性之材料。電阻材料可散置於本體101中以控制電流的放電。As another example, and according to many embodiments, the body 101 may include a plurality of materials, such that at least one material includes a resistance different from the second material. Materials containing different resistances can be interspersed in the main body 101 to control the discharge of current from the main body 101. For example, a material containing a higher resistance may be placed near the contact end 105, and a material containing a lower resistance may be placed near the tether end 107. For example, the body 101 may include a metal material interspersed with resistive materials. The resistive material may include conductive plastic or similar materials, or may include materials with insulating properties. Resistive materials may be interspersed in the body 101 to control the discharge of current.

本文已關於特定實施例敘述益處、其他優點、和問題之解決方案。再者,本文所含有的諸多附圖中所示之連接線係意欲表示諸多元件之間的示範性功能關係及/或物理耦接。應注意的是可於實際系統中存在許多替代性或附加之功能關係或物理連接。然而,益處、優點、問題的解決方案、及可造成任何益處、優點、或解決方案出現或變得更加明顯之任何要素不應解釋為本揭示內容的關鍵、必需、或必要之特徵或要素。因此,本揭示內容的範圍係僅受所附請求項及其合法同等項之限制,其中,除非明確地如此聲明,否則呈單數的要素之引用並不意欲意指「一個且僅只一個」,而是「一或更多個」。再者,於請求項書中使用與「A、B、或C的至少一個」類似之片語,其係意欲將片語解釋為意指A可單獨存在於實施例中,B可單獨存在於實施例中,C可單獨存在於實施例中,或元件A、B和C的任何組合可存在於單一實施例中;例如A和B、A和C、B和C、或A和B和C。The benefits, other advantages, and solutions to problems have been described herein with respect to specific embodiments. Furthermore, the connecting lines shown in the drawings contained herein are intended to represent exemplary functional relationships and/or physical couplings between the various elements. It should be noted that there may be many alternative or additional functional relationships or physical connections in the actual system. However, benefits, advantages, solutions to problems, and any elements that can cause any benefits, advantages, or solutions to appear or become more obvious should not be construed as key, necessary, or necessary features or elements of the disclosure. Therefore, the scope of the present disclosure is limited only by the appended claims and their legal equivalents, in which, unless explicitly stated as such, the quotation of elements in the singular is not intended to mean "one and only one", and Is "one or more". Furthermore, the use of phrases similar to "at least one of A, B, or C" in the claim is intended to interpret the phrase to mean that A can exist alone in the embodiment, and B can exist alone in In an embodiment, C may exist alone in the embodiment, or any combination of elements A, B, and C may exist in a single embodiment; for example, A and B, A and C, B and C, or A and B and C .

本文提供系統、方法和設備。在本文之詳細敘述中,引用「諸多實施例」、「一實施例」、「實施例」、「示範實施例」等指示所敘述的實施例可包括特定之特徵、結構、或特徵,但是每一實施例可不必包括特定的特徵、結構、或特徵。再者,此類片語不一定意指相同之實施例。再者,當結合實施例敘述特定的特色、結構、或特徵時,可認為結合其他實施例影響此特色、結構、或特徵係在熟諳本技術領域人員之知識範圍內,不論是否明確地敘述。於閱讀此說明書之後,對於熟諳相關技術領域的人員將顯而易見的是如何在替代實施例中實現本揭示內容。再者,無論於請求項中是否明確地列舉元件、部件、或方法步驟,本揭示內容中之無任何元件、部件、或方法步驟都不意欲專用於公眾。沒有任何請求項元件係意欲援引35 U.S.C. 112(f),除非使用片語「means for」明確地列舉所述元件。如本文中所使用,“包含「comprises」”、“包含「comprising」”、或其任何其他變體等詞係意欲涵蓋非排他性「包括」,使得包含元件清單的製程、方法、物件、或設備不僅僅包括那些元件,亦可包括未明確地列出或此類製程、方法、物件、或設備所固有之其他元件。This article provides systems, methods and equipment. In the detailed description herein, the embodiments described with reference to "many embodiments", "an embodiment", "embodiment", "exemplary embodiment", etc. may include specific features, structures, or features, but each An embodiment may not necessarily include a particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily mean the same embodiment. Furthermore, when a specific feature, structure, or feature is described in conjunction with an embodiment, it can be considered that influencing the feature, structure, or feature in combination with other embodiments is within the knowledge of those skilled in the art, regardless of whether it is explicitly described. After reading this specification, it will be obvious to those skilled in the relevant technical fields how to implement the present disclosure in alternative embodiments. Furthermore, regardless of whether elements, components, or method steps are explicitly listed in the claims, none of the elements, components, or method steps in the present disclosure is intended to be exclusively used by the public. No claim element is intended to invoke 35 U.S.C. 112(f) unless the phrase "means for" is used to explicitly enumerate the element. As used herein, the terms "comprises", "comprising", or any other variants thereof are intended to cover the non-exclusive "comprising", so that a process, method, object, or equipment that includes a list of components It includes not only those elements, but also other elements that are not explicitly listed or are inherent to such processes, methods, objects, or equipment.

1:傳導式電武器 10:外殼 12:握把端部 14:展開端部 20:展開單元 30:防護件 40:扳機 45:控制界面 47:安全模式 48:射擊模式 49:穿透模式 50:處理電路 60:電源 70:信號產生器 80:推進系統 90:發射體 92:發射體 92-1:發射體 92-2:發射體 92-3:發射體 92-4:發射體 92-5:發射體 92-6:發射體 92-7:發射體 92-8:發射體 92-9:發射體 95:發射體 100:電極 101:本體 105:接觸端部 107:繫繩端部 110:繫繩 220:電極附件 245:第二控制界面 248-1:射擊一模式 248-2:射擊二模式 248-3:射擊三模式 315-1:第一繫繩部分 315-2:第二繫繩部分 440:電阻塗層 440-1:電阻塗層 440-2:電阻塗層 440-3:電阻塗層 440-n:電阻塗層 540:電阻塗層 550:暴露表面 550-1:暴露表面 550-2:暴露表面 550-3:暴露表面 550-4:暴露表面 550-5:暴露表面 550-6:暴露表面 550-7:暴露表面 550-8:暴露表面 550-9:暴露表面1: Conductive electric weapon 10: Shell 12: Grip end 14: unfold the end 20: Expand the unit 30: Protective parts 40: trigger 45: Control interface 47: Safe Mode 48: shooting mode 49: penetration mode 50: Processing circuit 60: Power 70: signal generator 80: Propulsion system 90: projectile 92: projectile 92-1: projectile 92-2: Projectile 92-3: projectile 92-4: Projectile 92-5: Projectile 92-6: Projectile 92-7: Projectile 92-8: projectile 92-9: Projectile 95: projectile 100: Electrode 101: body 105: contact end 107: Tether end 110: Tether 220: Electrode accessories 245: Second control interface 248-1: Shooting mode 248-2: Shooting two mode 248-3: Shooting three modes 315-1: The first tether part 315-2: The second tether part 440: Resistive coating 440-1: Resistive coating 440-2: Resistive coating 440-3: Resistive coating 440-n: Resistive coating 540: Resistive coating 550: exposed surface 550-1: exposed surface 550-2: exposed surface 550-3: exposed surface 550-4: exposed surface 550-5: exposed surface 550-6: exposed surface 550-7: exposed surface 550-8: exposed surface 550-9: exposed surface

本揭示內容的主題尤其在說明書之結論部分中指出並明確地主張。然而,當結合以下說明性附圖考慮時,可藉由參考詳細敘述和請求項來最佳地獲得本揭示內容的更完整理解。於以下附圖中,遍及附圖之相似的參考數字意指類似之元件和步驟。The subject of this disclosure is particularly pointed out and clearly asserted in the conclusion of the specification. However, when considered in conjunction with the following illustrative drawings, a more complete understanding of the present disclosure can be best obtained by referring to the detailed description and claims. In the following drawings, similar reference numbers throughout the drawings refer to similar elements and steps.

[圖1]說明按照諸多實施例的傳導式電武器之示意圖;[Figure 1] A schematic diagram illustrating a conductive electric weapon according to various embodiments;

[圖2A]說明按照諸多實施例的供使用於傳導式電武器之第一控制界面的示意圖;[FIG. 2A] A schematic diagram illustrating a first control interface for a conductive electric weapon according to various embodiments;

[圖2B]說明按照諸多實施例之供使用於傳導式電武器的第二控制界面之示意圖;[FIG. 2B] A schematic diagram illustrating the second control interface for conductive electric weapons according to various embodiments;

[圖3]說明按照諸多實施例的用於傳導式電武器之展開單元的正視圖;[FIG. 3] A front view illustrating a deployment unit for a conductive electric weapon according to various embodiments;

[圖4A-4C]說明按照諸多實施例之使用控制界面來控制CEW的方法之製程流程;[Figure 4A-4C] illustrates the process flow of the method of using the control interface to control the CEW according to many embodiments;

[圖5A-5D]說明按照諸多實施例的供使用於傳導式電武器之物件穿透式電極;和[FIGS. 5A-5D] illustrate object penetration electrodes for use in conductive electric weapons according to various embodiments; and

[圖6]說明按照諸多實施例的包含具有複數暴露表面之電阻塗層的物件穿透式電極。[FIG. 6] Illustrates an object penetration electrode including a resistive coating with a plurality of exposed surfaces according to various embodiments.

附圖中之元件和步驟係為了簡單和清楚而說明,且不一定根據任何特定順序來呈現。例如,在附圖中說明可同時或以不同順序施行的步驟,以幫助提高對本揭示內容之實施例的理解。The elements and steps in the drawings are described for simplicity and clarity, and are not necessarily presented in any particular order. For example, the accompanying drawings illustrate steps that can be performed at the same time or in a different order to help improve the understanding of the embodiments of the present disclosure.

100:電極 100: Electrode

101:本體 101: body

105:接觸端部 105: contact end

107:繫繩端部 107: Tether end

110:繫繩 110: Tether

Claims (20)

一種於傳導式電武器中使用的電極,該電極包含: 細長本體,具有與繫繩端部相反之接觸端部,其中該細長本體包含針形狀;及 繫繩,直接耦接至該繫繩端部,其中該繫繩係建構為將電流提供至該細長本體。An electrode used in a conductive electric weapon, the electrode includes: An elongated body having a contact end opposite to the end of the tether, wherein the elongated body includes a needle shape; and The tether is directly coupled to the end of the tether, and the tether is configured to provide current to the elongated body. 如請求項1的電極,其中該繫繩包含第一繫繩部份及第二繫繩部份,其中該第一繫繩部份係耦接至該繫繩端部,且其中該第一繫繩部份包含具有比該第二繫繩部份較高之張力強度的材料。Such as the electrode of claim 1, wherein the tether includes a first tether part and a second tether part, wherein the first tether part is coupled to the end of the tether, and wherein the first tether The rope part includes a material having a higher tensile strength than the second tether part. 如請求項2的電極,其中該第一繫繩部份包含鋼線,且該第二繫繩部份包含絲線。Such as the electrode of claim 2, wherein the first tether portion includes a steel wire, and the second tether portion includes a wire. 如請求項1的電極,更包含在該細長本體之外表面上的表面塗層。Such as the electrode of claim 1, further comprising a surface coating on the outer surface of the elongated body. 如請求項4的電極,其中該表面塗層包含退化之表面。The electrode of claim 4, wherein the surface coating includes a degraded surface. 如請求項4的電極,其中該表面塗層包含電阻塗層。The electrode of claim 4, wherein the surface coating comprises a resistive coating. 如請求項6的電極,其中該電阻塗層包含第一電阻塗層及第二電阻塗層,其中該第一電阻塗層係緊接至該接觸端部,且其中該第一電阻塗層包含大於該第二電阻塗層之電阻。The electrode of claim 6, wherein the resistance coating includes a first resistance coating and a second resistance coating, wherein the first resistance coating is connected to the contact end, and wherein the first resistance coating includes Greater than the resistance of the second resistive coating. 如請求項1的電極,其中該細長本體包含合成材料或包含不同電阻之複數材料的至少一者,且其中該合成材料或該複數材料之至少一者係建構為選擇性控制該電流由該細長本體的放電。The electrode of claim 1, wherein the elongated body includes at least one of a synthetic material or a plurality of materials with different resistances, and wherein at least one of the synthetic material or the plurality of materials is configured to selectively control the current from the elongated body Discharge of the body. 如請求項1的電極,更包含耦接至該接觸端部之電極附件。For example, the electrode of claim 1 further includes an electrode attachment coupled to the contact end. 如請求項9的電極,其中該電極附件包含建構為在溶解時間至少局部溶解之材料。The electrode of claim 9, wherein the electrode attachment comprises a material configured to dissolve at least partially during the dissolution time. 如請求項1的電極,其中該細長本體包含大於13毫米之長度。The electrode of claim 1, wherein the elongated body includes a length greater than 13 mm. 如請求項1的電極,其中該電極係建構為貫穿達到國家司法學會(NIJ)IIIA級分類標準之防彈背心。Such as the electrode of claim 1, wherein the electrode system is constructed as a bulletproof vest that passes through the National Institute of Justice (NIJ) Class IIIA classification standard. 一種用於傳導式電武器的展開單元,該展開單元包含: 推進系統;及 物件穿透式電極,建構為藉由該推進系統所展開,該物件穿透式電極包含: 細長本體,具有與繫繩端部相反之接觸端部,其中該細長本體包含針形狀;及 繫繩,直接耦接至該繫繩端部,其中該繫繩係建構為將電流提供至該細長本體。An unfolding unit for conductive electric weapons, the unfolding unit includes: Propulsion system; and The object penetrating electrode is constructed to be deployed by the propulsion system, and the object penetrating electrode includes: An elongated body having a contact end opposite to the end of the tether, wherein the elongated body includes a needle shape; and The tether is directly coupled to the end of the tether, and the tether is configured to provide current to the elongated body. 如請求項13的展開單元,更包含非物件穿透式電極,其建構為藉由該推進系統所展開。For example, the deployment unit of claim 13 further includes a non-object penetrating electrode, which is constructed to be deployed by the propulsion system. 如請求項14的展開單元,其中該物件穿透式電極係在比該非物件穿透式電極較大之速度下藉由該推進系統所展開。Such as the deployment unit of claim 14, wherein the object penetrating electrode is deployed by the propulsion system at a higher speed than the non-object penetrating electrode. 如請求項13的展開單元,其中該展開單元基於射擊模式指令或穿透模式指令選擇性展開該物件穿透式電極或該非物件穿透式電極。For example, the expansion unit of claim 13, wherein the expansion unit selectively expands the object penetrating electrode or the non-object penetrating electrode based on a shooting mode command or a penetration mode command. 一種傳導式電武器(「CEW」)包含: 展開單元,包含物件穿透式電極; 處理電路,建構為控制該展開單元之操作; 信號產生器,與該處理電路及該展開單元通訊,其中該信號產生器建構為由該處理電路接收指令,且基於該指令造成該展開單元的展開;及 控制介面,包含安全模式、射擊模式、及穿透模式,其中該控制介面係與該處理電路通訊,其中該控制介面基於該安全模式、該射擊模式、及該穿透模式控制該處理電路之指令,且其中該物件穿透式電極的展開在該穿透模式中啟動。A conductive electric weapon ("CEW") includes: Unfolding unit, including object penetrating electrode; The processing circuit is constructed to control the operation of the unfolding unit; A signal generator communicates with the processing circuit and the expansion unit, wherein the signal generator is configured to receive instructions from the processing circuit and cause the expansion unit to expand based on the instructions; and The control interface includes a safety mode, a shooting mode, and a penetration mode, wherein the control interface communicates with the processing circuit, wherein the control interface is based on the safety mode, the shooting mode, and the penetration mode to control the processing circuit's instructions , And the deployment of the penetrating electrode of the object is started in the penetrating mode. 如請求項17的傳導式電武器,其中該展開單元包含非物件穿透式電極,且其中該非物件穿透式電極之展開於該射擊模式或該穿透模式中啟動。The conductive electric weapon of claim 17, wherein the deployment unit includes a non-object penetrating electrode, and wherein the deployment of the non-object penetrating electrode is activated in the shooting mode or the penetrating mode. 如請求項18的傳導式電武器,其中該物件穿透式電極及該非物件穿透式電極之展開在該安全模式中失效。Such as the conductive electric weapon of claim 18, wherein the deployment of the object-penetrating electrode and the non-object-penetrating electrode fails in the safe mode. 如請求項18的傳導式電武器,其中該處理電路或該展開單元之至少一者包含電極展開邏輯,且其中該物件穿透式電極或該非物件穿透式電極的至少一者之展開係藉由該電極展開邏輯所控制。The conductive electric weapon of claim 18, wherein at least one of the processing circuit or the deployment unit includes electrode deployment logic, and wherein the deployment of at least one of the object-penetrating electrode or the non-object-penetrating electrode is by Controlled by the electrode deployment logic.
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