TW202127145A - Device and method for shielding components to be thermally insulated in microlithographic projection exposure apparatuses - Google Patents

Abstract

The invention relates to a microlithographic projection exposure apparatus, in particular for the DUV range (400) or for the EUV range (300), comprising a movable shield (100) and at least one component (110, 210) to be thermally insulated. The movable shield (100) is configured, in an operating pause of the microlithographic projection exposure apparatus (300, 400), for example in the case of maintenance, to lengthen the time duration in which the temperature of the component (110, 210) to be thermally insulated approaches the ambient temperature. The invention additionally relates to a method for thermally insulating at least one component (110, 210) of a microlithographic projection exposure apparatus (300, 400). Firstly, the light source (301, 406) is switched off or shaded in an operating pause of the microlithographic projection exposure apparatus (300, 400). Afterward, the movable shield (100) is moved from a rest position into a functional position in such a way that in the functional position the component (110, 210) to be thermally insulated is enclosed at least regionally by the movable shield (100).

Description

Element and method for shielding component to be thermally insulated in lithographic projection exposure device

The invention relates to a shield for components in a thermally insulated lithographic projection exposure device. The present invention also relates to a method for components in a thermally insulated lithographic projection exposure device.

Lithography is used to produce microstructured components, such as integrated circuits or LCDs. The lithography process is carried out in a so-called projection exposure device, which includes an illuminating device and a projection lens. The image of the mask (=mask) illuminated by the illuminating device is projected by the projection lens to a substrate (such as silicon crystal) coated with a photosensitive layer (=photoresist) and arranged in the image plane of the projection lens Circle) to transfer the photomask structure to the photosensitive coating on the substrate.

The terms lithography projection exposure device, projection exposure device, (EUV or DUV) system and lithography scanner are synonymous hereinafter.

In a projection lens designed for the DUV range (that is, at a wavelength of, for example, 193 nm or 248 nm), it is preferable to use a lens element as an optical element for the imaging process. In order to obtain a higher resolution of the lithography optical unit, a projection lens designed for the EUV range has been used for many years, and the projection lens operates at a wavelength of, for example, about 13.5 nm or 7 nm.

In this type of projection lens designed for the EUV range, due to the lack of suitable light-transmitting refractive materials, a mirror is used as an optical element in the imaging process. The mirror operates at almost normal incidence or grazing incidence. Due to the reflection effect of the reflector on the light rays, the reflector is much more sensitive to the position than the lens element. In this regard, the mirror tilt twice is converted into a change in the ray direction, and in the case of a lens element, what usually happens is that the change in the direction of the refracted ray between the front and rear sides is substantially compensated for.

The significant influence on the shape of the mirror comes from the thermal expansion of the mirror material. Therefore, a material with a low thermal expansion coefficient (such as Zerodur or ULE (ultra low expansion)) is used for EUV mirrors. This material responds much weaker to temperature changes than glass or quartz glass. However, within the available aberration budget, there may still be a considerable error contribution. This error contribution is composed of the influence of the uneven temperature distribution in the material volume and the so-called zero-crossing temperature (ZCT) inhomogeneity, for example due to the stoichiometric change between _{SiO 2} and TiO _{2 in the ULE material.} Relative to the expected operating temperature of the lithographic projection exposure device, both local and global temperature changes may cause aberrations, which can only be partially corrected by the manipulator.

The operating state is usually defined by the assumed maximum power of the EUV system at the operating wavelength (ie, for example, at a wavelength of 13.5 nm). If the maximum power is not reached, for example, because a mask with a low average reflectivity is used, for example, according to the prior art, infrared light heaters can achieve "additional" heating and ensure that the reflector operates at a temperature close to the average zero-crossing temperature. In this case, they are particularly insensitive due to the secondary deformation dependence of the temperature difference with respect to this temperature.

An important quality feature of a lithographic scanner is its effective time, during which semiconductor components can actually be manufactured with high output ("uptime"). However, due to various reasons, maintenance work will be required from time to time. During the process, the lithography scanner is opened, and parts are inspected, cleaned, or replaced, for example. Although high thermal stability is achieved in a closed lithography scanner in a vacuum, when the lithography scanner has been opened, components (such as mirrors) are in contact with the clean room environment. The clean room environment may have a relatively high temperature tolerance, that is, for example, inside the lithography scanner, it may be significantly lower or higher than the operating temperature, which is preferably 22°C.

During the maintenance process, the temperature of the components (especially the reflector) will adapt to the temperature of the clean room environment. The longer the lithography scanner is opened, that is, the longer the length of the maintenance window, the more the temperature of the reflector is adapted to the temperature of the clean room environment. Once the maintenance work is over, the temperature of the mirror may greatly deviate from its expected operating temperature. Correspondingly higher is its sensitivity to local temperature changes, such as a given EUV typical absorption coefficient (15% in the case of glancing incidence of EUV light to 40% in the case of normal incidence of EUV light Between), it may be established during operation at the latest due to uneven illumination. At the same time, the local difference in the coefficient of thermal expansion has a greater effect. All in all, there is a high level of aberration, which is unacceptable for high product yields.

The temperature of the clean room environment and the ambient temperature are synonymous in the following.

After the lithography scanner is turned off and restarted, the temperature of the mirror will gradually be adjusted to the expected value again, partly under the influence of the above-mentioned mirror heater. Since the mirrors constitute a huge optical component, their time constant is a few hours to a few days to adjust their temperature again. The high volume is due to the high correction concentration, the partial use of grazing incidence mirrors (the area of the oblique cross-section through the light pipe is larger than the area of the vertical cross-section), and the need to achieve a considerable thickness of the mirror for the purpose of high rigidity. This high stiffness prevents deformation when introducing forces and moments, and is used for correcting and optimizing the position of the mirror during operation. All in all, the high time constant makes the lithography scanner need a considerable waiting time before it reaches its full performance again after the maintenance window. The quality standard of effective time is "damaged".

In view of the above-mentioned problems, the established purpose is to provide components and methods to solve the above-mentioned problems, especially to shorten the waiting time of the lithographic scanner after the maintenance window.

According to the present invention, the above objective is achieved by a lithographic projection exposure device, especially for the DUV range or EUV range, which includes at least one movable shield and includes at least one component to be thermally insulated. The at least one movable shield is configured to extend the duration of the temperature of the at least one component to be thermally insulated close to the ambient temperature when the operation of the lithographic projection exposure apparatus is suspended (for example, in the case of maintenance). This is particularly advantageous because, as a result, after the lithographic projection exposure device is activated again, its effective time is prolonged.

In a specific embodiment, the component to be thermally insulated includes at least one reflector. The reflector is designed to reflect electromagnetic radiation from the EUV range. The application of the present invention to mirrors is particularly advantageous because the mirrors (as described above) are particularly "sensitive" to the response to temperature changes.

In a specific embodiment, the component to be thermally insulated includes at least one mounting technology element. For many applications, during repair or exchange, the mounting technology around the optical element and/or the actuator system in contact with the optical element must be as thermally stable as possible. The application of the invention to mounting technical components is particularly advantageous. In this application, the term "mounting technology element" includes mounting technology and/or an actuator system connected in contact with an optical element. In this case, the mounting technology element can be passive or actuatable.

In a specific embodiment, the material of the movable shield includes at least one thermal insulator. Due to its low thermal conductivity, thermal insulators are particularly suitable for thermal insulation. In the current situation, thermal insulation refers to the thermal shielding of components, especially when the temperature of the component is higher than the ambient temperature when the lithographic projection exposure device is turned on, and when the temperature of the component is lower than the ambient temperature. The choice of thermal insulator is advantageous because the result is that the temperature of the shielded member approaches the ambient temperature particularly slowly. The shield can include, for example, PTFE (polytetrafluoroethylene, with a thermal conductivity of 0.24 W/(m·K)), POM (polyoxymethylene, with a thermal conductivity of 0.31 W/(m·K)), and/or silicate ceramics ( The thermal conductivity is 2-4 W/ m·K).

In order to further improve the thermal insulation, the movable shield may be provided with at least one coating on the side facing the component to be thermally insulated, which at least partially reflects electromagnetic radiation in the infrared range. Additionally or alternatively, the movable shield may be provided with at least one coating on its side facing away from the component to be thermally insulated, which at least partially reflects electromagnetic radiation in the range of infrared light emitted from the surrounding environment. As a result, the heating of the movable shield can be advantageously slowed down.

In a specific embodiment, the movable shield at least partially and/or at least sometimes surrounds the member to be thermally insulated during the operation pause of the lithographic projection exposure apparatus. This is advantageous because in this way only less exchange takes place between the volume formed by the area between the component and the shield and the clean room environment.

In a specific embodiment, while the operation of the lithographic projection exposure apparatus is suspended, the movable shield is separated from the member to be thermally insulated by a distance of 1 mm to 20 mm, preferably a distance of 2 mm to 5 mm. The above-mentioned range of values is advantageous because, on the one hand, during operation pauses, the movable shield is intended to be configured as close as possible to the member to be thermally insulated, but on the other hand, the distance must be large enough so that during introduction and In the process of moving back again, the movable shield will not collide with the insulating member to be heated.

In a specific embodiment, the movable shield has at least one cavity, which is filled with fluid, preferably gas, especially air. This is advantageous because the result is that the thermal conductivity can be further reduced. In other words, compared with the shielding of a cavity without fluid filling, the thermal insulation is further improved.

After the lithographic projection exposure device is turned on, the temperature of the movable shield itself is slowly approaching the ambient temperature due to the absorption of the infrared radiation emitted from the insulating member to be heated and/or due to the contact with the clean room environment. The slower this method occurs, the lower the thermal conductivity. The following equation applies to the time constant associated with it: τ = (mc _p )/αA _O

In this case, m represents the quality of the shield, c _p represents its specific heat capacity, α represents its heat transfer coefficient, and A _O represents its surface area.

In various embodiments, a movable shield is developed to be able to influence its thermal insulation in an advantageous way. For this purpose, measures are proposed for adjusting the temperature of the movable shield, especially in its functional position, that is, when the lithographic scanner is already switched on. The temperature adjustment here clearly means heating and/or cooling. In this regard, if there are multiple movable shields in a single lithographic scanner, different temperature adjustments can be made to the movable shields.

In particular, the temperature of the shield can be adjusted by contact with the heat accumulator. The heat accumulator may contain substances, especially waxes, which change from solid to liquid due to the absorption of latent heat of fusion (= enthalpy of fusion). The reservoir for this substance remains available. Once the substance has completely melted, the reservoir will be replaced.

Alternatively or additionally, the temperature regulating medium may flow in the volume of the movable shield. For this purpose, a cavity, especially a pipe, must be formed inside the movable shield, and a temperature-regulating medium must flow in it.

Alternatively or additionally, the duct may be arranged on the surface of the movable shield. The pipe can have a tortuous structure and can be welded. The temperature regulating medium is guided in the pipeline.

Alternatively or additionally, it is possible to achieve electrical heating of the movable shield by means of resistance wires in and/or on the movable shield.

In a specific embodiment, the lithographic projection exposure device is implemented so that during operation pause, especially at the beginning of the operation pause, the movable shield (for example, by an actuator) can be in the direction of the member to be thermally insulated Slide and/or fold from the rest position to the functional position. In the static position of the shield, the light source (especially the EUV light source) is turned on and transferred to the wafer by the mirror system of the lithographic projection exposure device. In the shielded functional position, the light source is turned off or shielded, and the lithographic projection exposure device is at least partially turned on.

In a specific embodiment, the movable shield includes at least one flexure, especially a rotating joint, and/or a leg spring. This is advantageous because wear does not occur, especially during the movement of the flexure, and therefore no contaminants are generated in the lithographic projection exposure device.

In a specific embodiment, the movable shield moves along a guide member arranged outside the optical use area of the lithographic projection exposure device. The movement is preferably carried out along at least one guide rail. This is advantageous because the wear that may occur during movement is at least partially kept away from the optical use area.

In a specific embodiment, at least one additional temperature adjustment source is provided. Preferably, the temperature adjustment source is an infrared light radiator. The use of an additional temperature adjustment source can be advantageously combined with all the measures described above for adjusting the temperature of the movable shield.

The operating temperature of the lithographic projection exposure device in the EUV range is about 22°C. However, the operating temperature of the mirror to be thermally insulated may deviate from 22°C. The tolerance range of the reflector temperature is specified from 15°C to 29°C. Within the above tolerance range, the operating temperatures of various mirrors in the same lithographic projection exposure device may deviate from each other.

According to the present invention, the above object is also achieved by a method for thermally insulating at least one component of the lithographic projection exposure device. This method can be implemented according to two alternative specific embodiments:

First, the light source is turned off or shielded, for example, while the operation of the lithographic projection exposure device is suspended.

In the first embodiment, the at least one movable shield is then preferably moved from the rest position to the functional position by the action of an actuator, in particular so that at the functional position, the component to be thermally insulated is at least partially Surrounded by a removable shield. Afterwards, the lithographic projection exposure device can be opened at least partially, especially for maintenance purposes. After maintenance, the lithographic projection exposure device can be turned off again. Afterwards, the movable shield can preferably be moved back from the functional position to the rest position by using an actuator.

In an alternative second embodiment, immediately after the light source is turned off or shielded, the lithographic projection exposure device is at least partially opened. Only after opening, at least one movable shield is moved from the rest position to the functional position as quickly as possible. This movement of the shield can be achieved by an actuator or manually. After maintenance, the movable shield can be moved back to the rest position from the functional position by means of an actuator or manually. After that, the lithographic projection exposure device can be closed again.

Finally, in two alternative embodiments, the light source can be turned on again or the shade can be removed again.

After performing the above method steps, the lithographic projection exposure device can operate faster again after being opened, compared with the case where the movable shield is not used.

Figure 1a shows a schematic diagram of an excerpt of a lithographic projection exposure device 400, 300 according to the present invention for the DUV range or for the EUV range, which has a sliding movable shield 100 in a stationary position. In particular, the movable shield 100 and the member 110 to be thermally insulated are shown. In the current situation, the component 110 to be thermally insulated is a mirror, especially designed to reflect electromagnetic radiation from the EUV range. The mirror 110 is held and/or actuated by a mounting technology element 210 having a mechanical device and/or an actuator system. The installation technical element 210 itself is linked to the carrying structure 114 and is carried by the carrying structure 114. The at least one movable shield 100 is configured to prolong the duration of the temperature of the insulating member 110 to be heated close to the ambient temperature when the operation of the lithographic projection exposure apparatus 300, 400 is suspended (for example, in the case of maintenance). The material of the movable shield 100 includes at least one thermal insulator, preferably PTFE and/or POM and/or silicate ceramics. The movable shield 100 can be guided along a guide rail 111, and the guide rail 111 is preferably arranged outside the optical use area. The movable shield 100 is preferably moved by an actuator 122. However, it is also possible to perform manual movement of the movable shield 100 without using the actuator 122.

FIG. 1b shows a schematic diagram of an excerpt of the lithographic projection exposure apparatus 400, 300 according to the present invention for the DUV range or the EUV range, which has a shield 100 in a functional position that can be slid on a guide rail 111. In the operation suspension of the lithographic projection exposure apparatus 400, 300, especially at the beginning of the operation suspension, the movable shield 100 is moved from the stationary position along the direction of the insulating member 110 to be heated to the function by the actuator 122 in particular. Location. When the operation of the lithographic projection exposure apparatus is suspended, the movable shield 100 at least partially and/or at least sometimes surrounds the member 110 to be insulated. When the operation of the lithographic projection exposure apparatus is suspended, the distance between the movable shield 100 and the insulating member 110 to be heated is between 1 mm and 20 mm, preferably between 2 mm and 5 mm.

Fig. 2a shows a schematic diagram of an excerpt of the lithographic projection exposure apparatus 400, 300 according to the present invention, in which the foldable movable shield 100 is in a stationary position. The movable shield 100 includes a flexure 102 which is implemented as, for example, a swivel joint and/or leg spring. An actuator 122 is provided to fold the movable shield 100 from the rest position to the functional position.

Fig. 2b shows a schematic diagram of an excerpt of the lithographic projection exposure device 400, 300 according to the present invention, which has a foldable movable shield 100 in a functional position. During the operation suspension of the lithographic projection exposure apparatus, especially at the beginning of the operation suspension, the movable shield 100 is folded from the stationary position along the direction of the insulating member 110 to be heated to the functional position by the actuator 122 or manually.

FIG. 3 shows a schematic diagram of an excerpt of the lithographic projection exposure apparatus 400, 300 according to the present invention, which has a movable shield 100 that has been slid in and an additional temperature adjustment source 104. The additional temperature adjustment source 104 may be implemented as, for example, an infrared light (106) radiator, which adjusts the temperature of the area between the movable shield 100 and the member 110 to be insulated.

4 shows a schematic diagram of an excerpt of the lithographic projection exposure apparatus 400, 300 according to the present invention, which has a movable shield 100 that has been slid in, wherein the movable shield 100 has a cavity 108 in its volume. The fluid 109 can be filled into the cavity 108 by means of an auxiliary device, in order to advantageously further reduce the thermal conductivity of the movable shield 100.

5 shows a schematic diagram of an excerpt of the lithographic projection exposure apparatus 400, 300 according to the present invention, which has a movable shield 100 that has been slid in, in which a temperature adjustment medium 119 (preferably water or air) flows through the cavity 108 . The temperature of the movable shield 100 can be set by the temperature adjustment medium 119, that is, heating and cooling can be performed.

FIG. 6 shows a schematic diagram of an excerpt of the lithographic projection exposure apparatus according to the present invention, which has a movable shield 100 that has been slid in, wherein the movable shield 100 (especially in its volume) has a conductive heating wire 107. The heating wire 107 is preferably arranged regularly.

FIG. 7 shows a schematic diagram of an excerpt of the lithographic projection exposure apparatus according to the present invention, which has a movable shield 100 that has been slid in, wherein the movable shield 100 is in contact with the heat accumulator 105. The movable shield 100 can be temperature-regulated by contact with the heat accumulator 105.

FIG. 8 shows a schematic diagram of an excerpt of the lithographic projection exposure apparatus according to the present invention, which has a movable shield 100 that has been slid in, in which a temperature adjustment medium 119 (preferably air or water) flows in the pipeline 103, wherein The pipe 103 is welded to the movable shield 100.

Fig. 9 shows a schematic diagram of an excerpt of the lithographic projection exposure apparatus according to the present invention, with the shield 100 slid in in a functional position. The movable shield 100 has a coating 101 on its side facing the member 110 to be thermally insulated, and the coating 101 at least partially reflects electromagnetic radiation in the infrared light range emitted from the member 110 to be thermally insulated. Additionally or alternatively, the movable shield 100 may have a coating 113 on its side facing away from the member 110 to be thermally insulated, which at least partially reflects electromagnetic radiation in the infrared range emitted from the surrounding environment.

Fig. 10a shows a schematic cross-sectional view of an excerpt of a lithographic projection exposure apparatus according to the present invention, which has a movable shield 100 folded or pivoted (140) in a functional position. After being folded in, the movable shield 100 can be positioned 130 linearly. The linear positioning capability 130 makes it possible to set the distance between the shield 100 and the member 210 to be insulated. In the current situation, the to-be-heated insulation member 210 is an installation technical element. A removable cover 100 is shown, which surrounds the optical element 110 at the periphery and at least partially covers the mounting technology element 210. In this exemplary embodiment, the mounting technical element 210 should be understood as a mechanism or actuator system that is in contact with or adjacent to the optical element 110. As already mentioned above, the diagram shows the (linear) positioning direction 130 of the cover 100 and the pivoting direction 140 of the cover 100. Two additional temperature adjustment sources 104 are shown, the functions of which have been described in the exemplary embodiment of FIG. 3. Of course, the present invention can also be implemented without an additional temperature adjustment source 104.

Figure 10b shows a schematic plan view of a mirror 110 with an associated mounting technology element 210, without a foldable shield or with a foldable shield 100 in a resting position (not shown in Figure 10b).

Fig. 10c shows a schematic plan view of a mirror with an associated mounting technology element 210 in which the shield 100 has been pivoted into a functional position. The installation technology element 210 is almost completely covered by the movable shield 100. The movable shield 100 has a ring shape and extends completely around the optical element 110. Therefore, the mounting technology element 210 is almost completely thermally shielded.

Fig. 11a shows a schematic diagram of a lithographic projection exposure apparatus 300 according to the present invention for EUV range, which has a folding movable shield 100 in a resting position. The figure shows an illumination device including a field facet mirror 303 and a pupil facet mirror 304. The light from the light source unit including the plasma light source 301 and the concentrator mirror 302 is guided to the field facet mirror 303. A first telescope mirror 305 and a second telescope mirror 306 are arranged in the beam path downstream of the pupil facet mirror 304. A grazing incidence mirror 307 is arranged downstream of the beam path, and the grazing incidence mirror guides the radiation incident thereon to the object field in the object plane of the projection lens containing six mirrors 351-356. At the position of the object field, the photomask 321 carrying the reflective structure is disposed on the photomask stage 320. The photomask is imaged into the image plane with the assistance of the projection lens, and is coated with a photosensitive layer (photoresist). The substrate 361 is located on the wafer stage 360. The force frame 380 (which basically carries the mirror of the projection lens) and the sensor frame 370 (which basically serves as a reference for the position of the mirror of the projection lens) are shown roughly schematically. The shield 100 according to the present invention is shown by way of example, which is movably mounted by means of the flexure 102. In addition, an actuator 122 is schematically shown, which is used to drive the movable shield 100 from the rest position to the functional position and then back. Therefore, Figure 10a shows the movable shield 100 in a resting position. The EUV light source 301 is turned on. The lithographic projection exposure apparatus 300 in operation is shown here.

Fig. 11b shows a schematic diagram of a lithographic projection exposure device 300 according to the present invention for EUV range with a movable shield 100 folded in a functional position. The shield 100 only exemplarily shields only one mirror 355 in FIG. 11b. However, some or all of the mirrors 352 to 355 to be shielded may also be shielded by the movable shield 100, respectively. The EUV light source 301 is turned off. The lithographic projection exposure device 300 is at least partially turned on (not shown in FIG. 11b) for maintenance purposes.

Fig. 12a shows a schematic diagram of a lithographic projection exposure apparatus 400 according to the present invention for the DUV range, which has a foldable movable shield 100 in a resting position. The DUV projection exposure device 400 includes a beam shaping and lighting device 402 and a projection lens 404. In this case, DUV stands for "deep ultraviolet" and means that the wavelength of the working light is between 30 nm and 250 nm.

The DUV projection exposure device 400 includes a DUV light source 406. As an example, an ArF excimer laser emitting radiation 408 in the DUV range of 193 nm, for example, may be provided as the DUV light source 406.

The beam shaping and lighting device 402 shown in FIG. 12a directs the DUV radiation 408 onto the mask 420. The photomask 420 is implemented as a transmissive optical element, and can be arranged outside the beam shaping and illuminating device 402 and the projection lens 404. The mask 420 has a structure in which an image is formed on the wafer 424 or the like in a reduced manner by a projection lens 404.

The projection lens 404 has a plurality of lens elements 428 and 440 and/or a mirror 430 for imaging the mask 420 onto the wafer 424. In this case, the individual lens elements 428, 440 and/or the mirror 430 of the projection lens 404 may be symmetrically arranged with respect to the optical axis 426 of the projection lens 404. It should be noted that the number of lens elements and mirrors of the DUV projection exposure device 400 is not limited to the number shown. More or fewer lens elements and/or mirrors can also be provided. In addition, the mirror is usually bent on its front side for beam shaping.

Finally, the air gap between the lens element 440 and the wafer 424 can be replaced by a liquid medium 432 with a refractive index>1. For example, the liquid medium 432 may be high-purity water. This structure is also called immersion lithography and has an increased lithography resolution.

In FIG. 12b, the movable shield 100 according to the present invention is shown in a functional position (ie in a folded state), and it thermally shields, for example, one of the two mirrors 430. The flexure 102 and the actuator 122 are also schematically shown here. The lithographic projection exposure device 400 shown for the DUV range is in a stationary state, that is, for example, when it has been at least partially turned on and has been used for maintenance purposes.

Even though the present invention has been described based on specific specific embodiments, many changes and alternative specific embodiments will be obvious to those skilled in the art, for example, through the combination and/or exchange of the features of each specific embodiment. Therefore, there is no doubt that for those with ordinary knowledge in the technical field, the present invention also includes such changes and alternative specific embodiments, and the scope of the present invention is only limited by the appended patent claims and their equivalents. Within the meaning.

100: removable shield 101: Coating 102: flexure 103: Pipeline 104: temperature regulation source 105: heat accumulator 106: infrared light 107: Heating wire 108: Cavity 109: Fluid 110: Insulating components to be heated 111: Rail 113: Coating 114: bearing structure 119: Temperature regulating medium 122: Actuator 130: positioning direction 140: pivot direction 210: Insulating components to be heated 300: Lithography projection exposure device 301: light source 302: Concentrator mirror 303: Field facet mirror 304: pupil facet mirror 305: telescope mirror 306: telescope mirror 307: grazing incidence mirror 320: mask table 321: Mask 351: Mirror 352: mirror 353: Mirror 354: Mirror 355: mirror 356: Mirror 360: Wafer table 361: Substrate 370: sensor frame 380: Force Frame 400: Lithography projection exposure device 402: Lighting Device 404: Projection lens 406: Light Source 408: Radiation 420: Mask 424: Wafer 426: optical axis 428: lens element 430: mirror 432: Liquid medium 440: lens element

Various exemplary embodiments are explained in more detail below with reference to the accompanying drawings. The drawings and the relative sizes of the elements shown in the drawings should not be regarded as drawn to scale. Conversely, an exaggerated size or a reduced size can be used to display individual elements for better description and better understanding.

Figure 1a shows a schematic diagram of an excerpt of the lithographic projection exposure device according to the present invention, with a slidable shield in a rest position;

Figure 1b shows a schematic diagram of an excerpt of the lithographic projection exposure device according to the present invention, with a slidable shield in a functional position;

Figure 2a shows a schematic diagram of an excerpt of the lithographic projection exposure device according to the present invention, with a foldable shield in a rest position;

Figure 2b shows a schematic diagram of an excerpt of the lithographic projection exposure device according to the present invention, with a foldable shield in a functional position;

Figure 3 shows a schematic diagram of an excerpt of the lithographic projection exposure device according to the present invention, with a slid-in shield and an additional temperature adjustment source;

Figures 4, 5, 6, 7, 8, and 9 respectively show schematic diagrams of excerpts of the lithographic projection exposure device according to the present invention, which has a slid-in shield in a functional position;

Figure 10a shows a schematic cross-sectional view of an excerpt of the lithographic projection exposure device according to the present invention, which has a folded shield in a functional position;

Figure 10b shows a schematic plan view of the reflector, which has associated mounting technical elements, but does not have a foldable movable shield;

Figure 10c shows a schematic plan view of the reflector, which has related technical elements for mounting, and has a folded shield already in a functional position;

Figure 11a shows a schematic diagram of a lithographic projection exposure device for EUV range according to the present invention, which has a foldable shield in a rest position;

Figure 11b shows a schematic diagram of a lithographic projection exposure device for EUV range according to the present invention, which has a foldable shield in a functional position;

Figure 12a shows a schematic diagram of a lithographic projection exposure device for the DUV range according to the present invention, which has a foldable shield in a rest position; and

Figure 12b shows a schematic diagram of a lithographic projection exposure apparatus for the DUV range according to the present invention, which has a folded shield in a functional position.

100: removable shield

110: Insulating components to be heated

111: Rail

114: bearing structure

122: Actuator

210: Insulating components to be heated

Claims (15)

A lithographic projection exposure device, especially used in the DUV range or EUV range, includes at least one movable shield and at least one member to be thermally insulated, wherein during an operation pause of the lithographic projection exposure device, for example, during maintenance In this case, the at least one movable shield is configured to extend the duration of the temperature of the at least one component to be thermally insulated close to the ambient temperature. The lithographic projection exposure device according to claim 1, wherein the member to be thermally insulated includes at least one reflector, and the reflector is especially designed to reflect electromagnetic radiation from the EUV range. The lithographic projection exposure device according to claim 1 or 2, wherein the component to be thermally insulated includes at least one mounting technology element. The lithography projection exposure device according to any one of the foregoing claims, wherein the movable shielding material includes at least one thermal insulator, preferably:-PTFE;-POM; and-silicate ceramic The lithographic projection exposure device according to any one of the preceding claims, wherein the movable shield is provided with at least one coating on the side facing the member to be thermally insulated, and the coating is at least partially reflective Electromagnetic radiation in the infrared range. The lithographic projection exposure device according to any one of the preceding claims, wherein the movable shield is provided with at least one coating on its side facing away from the member to be thermally insulated, and the coating is at least partially reflective Electromagnetic radiation in the infrared range. The lithographic projection exposure device according to any one of the preceding claims, wherein the movable shield at least partially and/or at least sometimes surrounds the thermally insulated object during the operation pause of the lithographic projection exposure device The component. The lithographic projection exposure apparatus according to any one of the preceding claims, wherein during the suspension of the operation of the lithographic projection exposure apparatus, the movable shield is separated from the member to be thermally insulated by between 1 mm and 20 A distance between mm, preferably a distance between 2 mm and 5 mm. The lithography projection exposure device according to any one of the preceding claims, wherein the movable shield has at least one cavity, which is filled with a fluid, preferably with air. The lithographic projection exposure device according to any one of the preceding claims, wherein the movable shield is temperature-adjustable, preferably by at least one of the following measures:-contact with a heat accumulator;-temperature adjustment medium Flow in the volume of the movable shield;-the temperature adjustment medium flows in the pipeline, especially welded on the surface of the movable shield; and-by in the movable shield and/or on the movable shield The resistance wire is electrically heated. The lithographic projection exposure device according to any one of the preceding claims, wherein the movable shield can be specially used during the suspension of the operation of the lithographic projection exposure device, especially at the beginning of the suspension of the operation At least the actuator is slid and/or folded from a rest position to a functional position in the direction of the component to be thermally insulated. The lithographic projection exposure device according to any one of the preceding claims, wherein the movable shield includes at least one flexure, especially a rotary joint and/or a leg spring. The lithographic projection exposure device according to any one of the preceding claims, wherein the movable shield includes at least one guide member arranged outside an optical use area, in the form of at least one guide rail, for example. The lithographic projection exposure device according to any one of the preceding claims, comprising at least one temperature adjustment source, in particular at least one infrared light radiator, wherein the temperature adjustment source adjusts the movable shield and the thermally insulated The temperature of the area between the components. A method for thermally insulating at least one component of a lithographic projection exposure device, including at least the following steps:-turning off or shielding at least one light source during an operation pause of the lithographic projection exposure device;-turning off at least one movable shield Moving from a rest position to a functional position, so that in the functional position, the component to be thermally insulated is at least partially surrounded by the movable shield.

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