TW202126826A - Lead-free and copper-free tin alloy and tin balls for ball grid array package - Google Patents

Abstract

A lead-free and copper-free tin alloy contains 3.0 to 5.0 wt% silver, 0.01 to 3.5 wt% bismuth, 0.01 to 3.5 wt% antimony, 0.005 to 0.1 wt% nickel, 0.005~0.02 wt% germanium and the remaining amount of tin. The lead-free and copper-free tin alloy of the invention can be made into tin balls for ball grid array package. The solder bump formed by the tin ball can withstand the thermal stress caused by the temperature change of the electronic component itself or the environment, and at the same time has the ability to withstand high mechanical shock.

Description

Lead-free copper-free tin alloy and tin balls for ball grid array packaging

The invention relates to a tin alloy and a tin ball made of the tin alloy for ball grid array packaging, in particular to a lead-free copper-free tin alloy and a lead-free copper-free tin alloy made of the tin alloy for use in Solder balls for ball grid array packaging.

With the increase in the number of I/O (input/output) of semiconductor components, the packaging technology has evolved from wire bonding, which originally only used the periphery of the chip for packaging, into a ball grid array ( Ball grid array; referred to as BGA) package, its technology is to re-layout the IC solder pads (I/O distribution) of the semiconductor components, and the solder pads are distributed on the bottom of the semiconductor components to increase the I/O density.

The conduction mode of the ball grid array package can be divided into metal bumps, conductive adhesives, and conductive films. Among them, solder bumps, which belong to the metal bump technology, are the main ones. The ball grid array packaging can be divided into non-wafer-level packaging and wafer-level packaging.

Non-wafer-level packaging means that after the silicon chip is soldered to the organic substrate by wire bonding or flip chip, an underfill is poured between the silicon chip and the organic substrate, and then the other end of the organic substrate The solder balls are soldered to form solder bumps to form an electronic component. The electronic components will be welded with the circuit board in the subsequent manufacturing process to form a assembled circuit board. Because the difference in expansion coefficient between silicon chip, organic substrate and circuit board is too large, when the temperature of the assembled circuit board itself or the environment changes, the heat caused by the mismatch in coefficient of thermal expansion (mismatch in coefficient of thermal expansion) Stress can cause damage to the solder joints (solder bumps) between the electronic components and the circuit board, and the solder joints between the organic substrate and the silicon chip are usually not damaged due to underfill.

Wafer-level packaging means that most or all of the packaging and testing procedures are directly performed on the silicon wafer, and then diced into a single chip. The chip does not pass through the organic substrate, but directly performs IC pad renewal on the chip. Layout, and then solder balls to form solder bumps. Since the packaged chip size is almost the same as the bare chip, it is called a wafer level chip scale package (WLCSP for short). However, due to the large gap between the expansion coefficients of the silicon chip and the circuit board, the solder joints (solder bumps) that connect the two need to be able to withstand the thermal stress caused by the electronic component itself or when the temperature changes in the environment. In addition, Since wafer-level packaging is mostly used in light, thin and short mobile devices, solder joints (solder bumps) also need to be able to withstand high mechanical shocks.

Therefore, how to find a tin alloy that can be made into the solder balls for ball grid array (BGA) packaging, and the solder bumps made from the solder balls can withstand the temperature changes of the electronic component itself or the environment The thermal stress and the ability to withstand high mechanical shock at the same time have become the target of current research.

Therefore, the first object of the present invention is to provide a lead-free copper-free tin alloy. The lead-free copper-free tin alloy can be made into solder balls for ball grid array (BGA) packaging, and the solder bumps formed by the solder balls can withstand the thermal stress caused by the temperature changes of the electronic components themselves or the environment , And at the same time have the ability to withstand high mechanical shocks.

Therefore, the lead-free copper-free tin alloy of the present invention, based on the total weight of the lead-free copper-free tin alloy being 100 wt%, contains: 3.0~5.0 wt% silver; 0.01~3.5 wt% bismuth; 0.01~3.5 wt% antimony; 0.005~0.1 wt% nickel; 0.005~0.02 wt% germanium; and The balance of tin.

Therefore, the second objective of the present invention is to provide a solder ball for ball grid array packaging. The solder bump formed by the solder ball can withstand the thermal stress caused by the temperature change of the electronic component itself or the environment, and at the same time has the ability to withstand high mechanical shock.

Therefore, the solder balls used in the ball grid array package of the present invention are made of the aforementioned lead-free and copper-free tin alloy.

The effect of the present invention is: because the lead-free copper-free tin alloy of the present invention contains 3.0~5.0 wt% silver, 0.01~3.5 wt% bismuth, 0.01~3.5 wt% antimony, 0.005~0.1 wt% nickel, 0.005 wt% ~0.02 wt% germanium and the balance tin. Therefore, the lead-free, copper-free and tin alloy of the present invention can be made into solder balls for ball grid array (BGA) packaging, and the solder bumps formed by the solder balls can withstand the electronic components themselves or when the environment undergoes temperature changes. Thermal stress, and the ability to withstand high mechanical shocks at the same time.

The content of the present invention will be described in detail below:

The lead-free copper-free tin alloy of the present invention, based on the total weight of the lead-free copper-free tin alloy being 100 wt%, contains 3.0~5.0 wt% silver, 0.01~3.5 wt% bismuth, 0.01~3.5 wt% antimony, 0.005~0.1 wt% nickel, 0.005~0.02 wt% germanium, and the balance tin.

It should be noted that the lead-free copper-free tin alloy of the present invention does not substantially contain lead (Pb) and copper (Cu). The aforementioned substantially excluding lead and copper means that in principle, as long as lead and copper are not deliberately added to tin alloys, such as unintentional but unavoidable impurities or contact during the manufacturing process, it can be regarded as based on the spirit of the present invention. It does not substantially contain lead and copper, or can be regarded as lead-free and copper-free. wt% refers to weight percent, and weight percent in the text below also refers to weight percent. In addition, the limits of the numerical range stated in the present invention and the scope of the patent always include the end values.

In addition, in order to avoid misunderstanding, the term "surplus tin" should not be understood to exclude other unintentional but unavoidable impurities in the manufacturing process. Therefore, if it is assumed that impurities are present, the "surplus tin" should be understood to make up the lead-free copper-free tin alloy to a weight percentage of 100 wt% and is composed of tin plus unavoidable impurities.

Preferably, the lead-free copper-free tin alloy contains 3.5-4.5 wt% silver. More preferably, the lead-free copper-free tin alloy contains 3.75-4.25 wt% silver.

Preferably, the lead-free copper-free tin alloy contains 2.5-3.5 wt% bismuth. More preferably, the lead-free copper-free tin alloy contains 2.75-3.25 wt% of bismuth.

Preferably, the lead-free and copper-free tin alloy contains 0.5 to 1.5 wt% of antimony. More preferably, the lead-free, copper-free and tin alloy contains 0.75 to 1.25 wt% of antimony.

Preferably, the lead-free copper-free tin alloy contains 0.045 to 0.055 wt% nickel. More preferably, the lead-free, copper-free and tin alloy contains 0.0475 to 0.0525 wt% nickel.

Preferably, the lead-free copper-free tin alloy contains 0.005 to 0.015 wt% germanium. More preferably, the lead-free copper-free tin alloy contains 0.0075 to 0.0125 wt% germanium.

＜ Example 1~11 And comparative example 1~10 ＞

Preparation of lead-free and copper-free tin alloy

The lead-free, copper-free and tin alloys of Examples 1 to 11 and Comparative Examples 1 to 10 were prepared according to the metal composition and weight percentage (wt%) shown in Table 1 below, and the following steps:

Step (1) : Prepare the corresponding metal material according to the corresponding metal composition and weight percentage.

Step (2) : heating, melting and casting the prepared metal materials to form the lead-free, copper-free and tin alloys of Examples 1-11 and Comparative Examples 1-10. Table 1 Metal composition ratio (wt%) Property test results Sn Ag Bi Sb Ni Ge thrust hardness Stretch Hot and cold cycle Step welding Overall assessment Example 1 margin 4.0 3.0 1.0 0.05 0.01 ○ ○ ○ ○ ○ ○ Example 2 margin 3.0 3.0 1.0 0.05 0.01 ○ △ ○ ○ ○ △ Example 3 margin 5.0 3.0 1.0 0.05 0.01 △ ○ △ △ △ △ Example 4 margin 4.0 0.01 1.0 0.05 0.01 ○ △ ○ △ ○ △ Example 5 margin 4.0 3.5 1.0 0.05 0.01 ○ ○ △ ○ ○ △ Example 6 margin 4.0 3.0 0.01 0.05 0.01 ○ △ ○ △ ○ △ Example 7 margin 4.0 3.0 3.50 0.05 0.01 △ ○ △ ○ △ △ Example 8 margin 4.0 3.0 1.0 0.005 0.01 ○ ○ ○ △ ○ △ Example 9 margin 4.0 3.0 1.0 0.1 0.01 ○ ○ △ ○ ○ △ Example 10 margin 4.0 3.0 1.0 0.05 0.005 ○ ○ ○ ○ △ △ Example 11 margin 4.0 3.0 1.0 0.05 0.02 △ ○ ○ ○ ○ △ Comparative example 1 margin 2.0 3.0 1.0 0.05 0.01 ○ X ○ X ○ X Comparative example 2 margin 6.0 3.0 1.0 0.05 0.01 X ○ X X X X Comparative example 3 margin 4.0 0 1.0 0.05 0.01 ○ X ○ X ○ X Comparative example 4 margin 4.0 4.0 1.0 0.05 0.01 ○ ○ X △ ○ X Comparative example 5 margin 4.0 3.0 0 0.05 0.01 ○ X ○ X ○ X Comparative example 6 margin 4.0 3.0 4.0 0.05 0.01 X ○ X △ X X Comparative example 7 margin 4.0 3.0 1.0 0 0.01 ○ ○ ○ X ○ X Comparative example 8 margin 4.0 3.0 1.0 0.2 0.01 ○ ○ X △ ○ X Comparative example 9 margin 4.0 3.0 1.0 0.05 0 ○ ○ ○ △ X X Comparative example 10 margin 4.0 3.0 1.0 0.05 0.05 X ○ ○ △ X X The "surplus" is an example of a weight percentage that makes up the lead-free, copper-free tin alloy to 100 wt%.

＜ Alloy property test ＞

It should be noted that the lead-free copper-free tin alloy of the embodiment and the comparative example is evaluated by ball shear test for weldability; hardness test is used for evaluating alloy hardness; and tensile test (tensile test) is used to evaluate weldability. test) evaluate the ductility of the alloy; evaluate the oxidation resistance by the board level soldering test; evaluate the resistance of the solder joints and the joint structure to thermal fatigue by the thermal cycle test.

The test methods of thrust test, hardness test, tensile test, step welding test and thermal cycle test are as follows:

[ Thrust test ]

With reference to the JESD22-B117B standard test method, the thrust test of the lead-free and copper-free tin alloy of the embodiment and the comparative example was carried out. First, apply flux to the BGA component with a size of 14 mm×14 mm, and then use the tin balls made of the lead-free copper-free tin alloy of the embodiment or the comparative example with a ball diameter of 0.45 mm to implant the BGA component. Ball attach. The surface treatment of the pad of the BGA component is bare copper, and the reflow profile with a peak temperature of 240℃ is used for soldering. After completion, the solder ball will be soldered on the BGA component to form a solder bump, and then the solder will be soldered with a thrust tester The thrust test of the bump (the moving speed of the push knife is 100 μm/s).

Each combination of gold BGA samples pushes 15 solder bumps and records their thrust strength. Take the average of the 15 solder bumps’ thrust strength as the experimental result. The result judgment standard is: the average thrust strength exceeds 15 Newtons, and it is judged as ball soldering. Good performance and marked as "○". If the average thrust strength is between 12 and 15 Newtons, it is judged as acceptable and marked as "△". If the average thrust strength is less than 12 Newtons, it is judged as insufficient weldability. And mark it as "X". The thrust test results of the lead-free and copper-free tin alloys of the Examples and Comparative Examples are summarized in Table 1.

[ Hardness Testing ]

According to the ASTM-E92-17 standard test method, the hardness of the lead-free, copper-free and tin alloys of the examples and the comparative examples were measured using a Vickers hardness tester. The test method is to make each alloy into a flat plate-shaped sample with a length of 20 mm, a width of 20 mm and a height of 10 mm. The test surface of the sample needs to be ground and polished, and then the standard test indenter of the Vickers hardness tester is applied to the sample. Carry out indentation test (ballast condition is 500 g load, load duration 10 seconds), and then calculate the alloy hardness result from the indentation size left by the alloy sample.

In this test, three hardness samples are tested for each alloy, and the three hardness results obtained are averaged. The judgment standard is: the average hardness is greater than 25 Hv, the alloy is judged to have good hardness performance and marked as "○", the average hardness If the alloy hardness is between 22~25 Hv, it is judged to be acceptable and marked as "△". If the average hardness is less than 22 Hv, it is judged to be poor and marked as "X". The hardness test results of the lead-free and copper-free tin alloys of the Examples and Comparative Examples are summarized in Table 1.

[ Tensile test ]

With reference to ASTM-E8/E8M-16a, the tensile test of the lead-free and copper-free tin alloys of the examples and the comparative examples were carried out. The tensile rate is 6 mm/min, and the elongation result of the tensile test is used to compare the elongation of the alloy.

In this test, each alloy is tested on three tensile samples, and the three elongation results obtained are averaged. The result judgment standard is: if the average elongation is greater than 20%, it is judged that the alloy has good ductility and is marked as "○ If the average elongation is between 17% and 20%, the ductility of the alloy is judged to be acceptable and marked as "△". If the average elongation is less than 17%, the ductility of the alloy is judged to be poor and marked as "X". The tensile test results of the lead-free and copper-free tin alloys of the Examples and Comparative Examples are summarized in Table 1.

[ Board level welding test ]

First, solder flux is applied to the BGA component with a size of 35 mm×35 mm, and then the solder ball made of the lead-free copper-free tin alloy of the embodiment or the comparative example with a ball diameter of 0.63 mm is implanted on the BGA component Ball attach. The surface treatment of the pad of the BGA component is bare copper, and the reflow profile with a peak temperature of 240℃ is used for soldering. After completion, the solder ball will be soldered on the BGA component to form solder bumps, and then the sample is placed at a temperature of 85℃ And placed in an environment with a relative humidity of 85% for 240 hours to accelerate the oxidation of the solder bumps, and then solder the BGA components to the corresponding circuit board. The surface of the circuit board pad is treated with organic solderability preservative (OSP) ). The purpose of this test is to test the oxidation resistance of the solder balls made of the lead-free and copper-free tin alloy of the embodiment or the comparative example after forming the solder bumps on the BGA device. The oxidation resistance of the alloy will affect the solderability of the solder bumps and the circuit board. If the oxidation resistance of the alloy is insufficient, the solder bumps and the circuit board will be poorly welded, which will increase the soldering defects after the board-level process. The rate of occurrence.

In this test, X-ray analysis of the proportion of poor welding is performed on the sample after the board step. The judgment standard is that the rate of poor welding is less than 10%, and it is judged that the board step weldability is good and marked as "○". 20% is judged to be acceptable and marked as "△". If the proportion of welding defects is greater than 20%, it is judged to be a failure of plate step weldability and marked as "X". The results of the step welding test of the lead-free and copper-free tin alloys of the Examples and Comparative Examples are summarized in Table 1.

[ Hot and cold cycle test ]

With reference to JESD22-A104E, the cold and hot cycle test of the lead-free and copper-free tin alloys of the examples and the comparative examples were carried out. First, apply flux to the BGA component with a size of 14 mm×14 mm, and then use the tin balls made of the lead-free copper-free tin alloy of the embodiment or the comparative example with a ball diameter of 0.45 mm to implant the BGA component. Ball attach. The surface treatment of the pad of the BGA component is bare copper, and the reflow profile with a peak temperature of 240°C is used for soldering. After completion, the solder ball will be soldered to the BGA component to form a solder bump, and then the BGA component is soldered to the phase On the corresponding circuit board, the surface of the circuit board pad is treated with organic solder protection film (OSP), and then the soldered circuit board is subjected to a cold and heat cycle test (test condition is ‒40~125℃, and the temperature rise and fall rate is 15 ℃ /min, the temperature holding time is 10 minutes, a total of 1000 cycles). The resistance (initial resistance value) of each soldered circuit board sample is measured before the heating and cooling cycle test, and the resistance (resistance value after the test) is tested again after the heating and cooling cycle test. The purpose of this test is to test the thermal fatigue resistance of the solder bumps and the bonding structure between the solder bumps and the copper substrate formed by the lead-free copper-free tin alloy tin balls of the examples or comparative examples. Insufficient thermal fatigue resistance of the copper substrate joint structure will result in thermal fatigue failure of the solder joint or joint structure under repeated cold and heat cycle stresses, thereby affecting the reliability of the solder joint.

This test conducts resistance testing on the circuit board samples after cold and heat cycles. The resistance changes of the comparison samples after the cold and heat cycle tests are used to evaluate the thermal fatigue resistance of the solder bumps and the joint structure. The resistance change is defined as the resistance change value (after the test). The ratio of the resistance value minus the initial resistance value) to the initial resistance value. The criterion is: if the resistance change is less than 10%, it is judged that the thermal fatigue resistance of the alloy solder joint and the joint structure is good and marked as "○". If the resistance change is between 10-20%, it is judged as the alloy solder joint and the joint structure. The thermal fatigue resistance is acceptable and marked as "△". If the resistance change is greater than 20%, it is judged that the thermal fatigue resistance of the alloy solder joint and the joint structure is poor and marked as "X".

The description of Figs. 1 to 3 is as follows: the photo in Fig. 1 is a slice of the normal solder joint (solder bump) formed in Example 1, and the photo in Fig. 2 is the defective solder joint (solder bump) formed in Comparative Example 9. The section of Fig. 3 is the x-ray observation result of the bad solder joints (solder bumps) formed in Comparative Example 9.

In addition, if the same embodiment or the same comparative example is subjected to the aforementioned five tests of thrust test, hardness test, tensile test, step welding test, and cold and hot cycle test, if any "X" appears in the test result, then The "Overall Evaluation Results" column in Table 1 is marked as "X", which means that this embodiment or comparative example does not meet the requirements of the present invention; if any "△" appears in the test results, then "Overall Evaluation" in Table 1 The “assessment result” field is marked as “△”, which means that this embodiment or comparative example meets the requirements of the present invention; if “○” appears in all test results, mark it in the “overall evaluation result” column of Table 1 It is "○", which means that this embodiment not only meets the requirements of the present invention but also is the best embodiment.

＜ Alloy property test results and discussion ＞

The following discussion is based on the results of different silver content, different bismuth content, different antimony content, different nickel content, and different germanium content.

[ Different silver content ] Table 2 (Excerpt from Table 1) Metal composition ratio (wt%) Property test results Sn Ag Bi Sb Ni Ge thrust hardness Stretch Hot and cold cycle Step welding Overall assessment Example 1 margin 4.0 3.0 1.0 0.05 0.01 ○ ○ ○ ○ ○ ○ Example 2 margin 3.0 3.0 1.0 0.05 0.01 ○ △ ○ ○ ○ △ Example 3 margin 5.0 3.0 1.0 0.05 0.01 △ ○ △ △ △ △ Comparative example 1 margin 2.0 3.0 1.0 0.05 0.01 ○ X ○ X ○ X Comparative example 2 margin 6.0 3.0 1.0 0.05 0.01 X ○ X X X X The "surplus" is an example of a weight percentage that makes up the lead-free, copper-free tin alloy to 100 wt%.

It can be seen from Table 2 that the weight percentage of silver will affect the hardness of the alloy, the thermal fatigue resistance and oxidation resistance of the solder joint and the joint interface after the formation of the solder. Insufficient oxidation resistance of the solder ball will increase the occurrence of the ball implanted component during the board-level process. Probability of bad double ball. Too low the weight percentage of silver will make the lead-free copper-free tin alloy fail the hardness test and the hot and cold cycle test. Although the weight percentage of silver is too high, the alloy hardness will be higher, but it will cause the melting point of the lead-free copper-free tin alloy to increase and the ductility to decrease. The increase in the melting point will cause the solderability of the ball soldering under the same temperature conditions to change. Poor, making it unable to pass the thrust test, and the reduced ductility of the alloy will also make it unable to pass the tensile test; in addition, the excessively high weight percentage of silver will also cause the lead-free copper-free tin alloy to fail the hot and cold cycle test and the step welding test.

Comparative Example 1 uses 2.0 wt% silver, which is marked as "X" in the hardness test and thermal cycle test, indicating that too low weight percentage (less than 3.0 wt%) of silver will cause alloy hardness performance and alloy solder joints and joint interface heat Fatigue resistance is not good; Comparative Example 2 uses 6.0 wt% silver. Although it is marked as "○" in the hardness test, it is used in the thrust test, tensile test, thermal cycle test, step welding test and "overall evaluation result". ”In the field is marked as “X”, which means that excessive weight percentage (greater than 5.0 wt%) of silver will lead to poor thermal fatigue resistance and insufficient oxidation resistance of solder joints and joint interfaces of the alloy, and cannot pass thrust. Test and tensile test; Example 2 uses 3.0 wt% silver, Example 1 uses 4.0 wt% silver, and Example 3 uses 5.0 wt% silver, which are indicated in the "Overall Evaluation Results" column of Table 2 It is "△" or "○", which means that the lead-free copper-free tin alloy containing 3.0 to 5.0 wt% silver can meet the requirements of the present invention.

[ Different bismuth content ] Table 3 (Excerpt from Table 1) Metal composition ratio (wt%) Property test results Sn Ag Bi Sb Ni Ge thrust hardness Stretch Hot and cold cycle Step welding Overall assessment Example 1 margin 4.0 3.0 1.0 0.05 0.01 ○ ○ ○ ○ ○ ○ Example 4 margin 4.0 0.01 1.0 0.05 0.01 ○ △ ○ △ ○ △ Example 5 margin 4.0 3.5 1.0 0.05 0.01 ○ ○ △ ○ ○ △ Comparative example 3 margin 4.0 0 1.0 0.05 0.01 ○ X ○ X ○ X Comparative example 4 margin 4.0 4.0 1.0 0.05 0.01 ○ ○ X △ ○ X The "surplus" is an example of a weight percentage that makes up the lead-free, copper-free tin alloy to 100 wt%.

It can be seen from Table 3 that the weight percentage of bismuth will affect the hardness of the alloy and the thermal fatigue resistance of the solder joint and the joint interface after the formation of welding. Too low weight percentage of bismuth will make the lead-free copper-free tin alloy fail to pass the hardness test and cold and hot cycle test; too high weight percentage of bismuth will have higher alloy hardness, but will lead to the ductility of lead-free copper-free tin alloy Falling down and failing the tensile test.

Comparative Example 3 uses 0 wt% bismuth, which is marked as "X" in the hardness test and the cold-heat cycle test, indicating that too low weight percentage (less than 0.01 wt%) of bismuth will cause alloy hardness performance and alloy solder joints and joint interface heat Fatigue resistance is not good; Comparative Example 4 uses 4.0wt% bismuth. Although it is marked as "○" in the hardness test, it is marked as "X" in the tensile test and the "Overall Evaluation Results" column , Representing an excessive weight percentage (greater than 3.5 wt%) of bismuth will cause the alloy to fail the tensile test; Example 4 uses 0.01 wt% of bismuth, Example 1 uses 3.0 wt% of bismuth, and Example 5 uses 3.5 wt% of bismuth. For bismuth, the "Overall Evaluation Results" column in Table 3 is marked as "△" or "○", which means that 0.01~3.5 wt% of bismuth in a lead-free, copper-free tin alloy can meet the requirements of the present invention.

[ Different antimony content ] Table 4 (Excerpt from Table 1) Metal composition ratio (wt%) Property test results Sn Ag Bi Sb Ni Ge thrust hardness Stretch Hot and cold cycle Step welding Overall assessment Example 1 margin 4.0 3.0 1.0 0.05 0.01 ○ ○ ○ ○ ○ ○ Example 6 margin 4.0 3.0 0.01 0.05 0.01 ○ △ ○ △ ○ △ Example 7 margin 4.0 3.0 3.50 0.05 0.01 △ ○ △ ○ △ △ Comparative example 5 margin 4.0 3.0 0 0.05 0.01 ○ X ○ X ○ X Comparative example 6 margin 4.0 3.0 4.0 0.05 0.01 X ○ X △ X X The "surplus" is an example of a weight percentage that makes up the lead-free, copper-free tin alloy to 100 wt%.

It can be seen from Table 4 that the weight percentage of antimony will affect the hardness of the alloy, the thermal fatigue resistance and oxidation resistance of the solder joints and the joint interface after the formation of soldering. Insufficient oxidation resistance of the solder ball will increase the occurrence of ball-planting components during the board-level process. Probability of bad double ball. Too low the weight percentage of antimony will make the lead-free copper-free tin alloy fail to pass the hardness test and the hot and cold cycle test. Although the weight percentage of antimony is too high, the alloy hardness will be higher, but it will cause the melting point of the lead-free copper-free tin alloy to increase and the ductility to decrease. The increase in the melting point will cause the solderability of the ball soldering under the same temperature conditions to change. Poor, making it unable to pass the thrust test, and the reduced ductility of the alloy will also make it unable to pass the tensile test; in addition, too high a weight percentage of silver will also cause the lead-free copper-free tin alloy to fail the plate-level welding test.

Comparative Example 5 uses 0 wt% antimony, which is marked as "X" in the hardness test, which means that too low weight percentage (less than 0.01 wt%) of antimony will cause the hardness of the alloy to be different from the thermal fatigue resistance of the alloy solder joints and the joint interface. Good; Comparative Example 6 uses 4.0 wt% antimony. Although it is marked as "○" in the hardness test, it is marked in the column of thrust test, tensile test, step welding test and "overall evaluation result" It is "X", which means excessive weight percentage (greater than 3.5 wt%) of antimony will result in insufficient oxidation resistance of the alloy and fail the thrust test and tensile test; Example 6 uses 0.01 wt% of antimony, and Example 1 uses 1.0 wt% of antimony. Example 7 uses 3.5wt% of antimony. The "Overall Evaluation Results" column in Table 4 is marked as "△" or "○", which means that the lead-free, copper-free tin alloy contains 0.01~3.5 The wt% antimony can meet the requirements of the present invention.

[ Different nickel content ] Table 5 (Excerpt from Table 1) Metal composition ratio (wt%) Property test results Sn Ag Bi Sb Ni Ge thrust hardness Stretch Hot and cold cycle Step welding Overall assessment Example 1 margin 4.0 3.0 1.0 0.05 0.01 ○ ○ ○ ○ ○ ○ Example 8 margin 4.0 3.0 1.0 0.005 0.01 ○ ○ ○ △ ○ △ Example 9 margin 4.0 3.0 1.0 0.1 0.01 ○ ○ △ ○ ○ △ Comparative example 7 margin 4.0 3.0 1.0 0 0.01 ○ ○ ○ X ○ X Comparative example 8 margin 4.0 3.0 1.0 0.2 0.01 ○ ○ X △ ○ X The "surplus" is an example of a weight percentage that makes up the lead-free, copper-free tin alloy to 100 wt%.

It can be seen from Table 5 that the weight percentage of nickel will affect the thermal fatigue resistance of the solder joint and the joint interface after welding. Too low weight percentage of nickel will make lead-free copper-free tin alloys unable to pass the thermal cycle test; too high weight percentage of nickel will have better resistance to thermal fatigue of solder joints and joint interfaces, but will lead to lead-free copper-free tin alloys The reduced ductility of the alloy makes it unable to pass the tensile test.

Comparative Example 7 uses 0 wt% nickel, which is marked as "X" in the thermal cycle test, indicating that too low weight percentage (less than 0.005 wt%) of nickel will lead to poor thermal fatigue resistance of alloy solder joints and joint interfaces; Example 8 uses 0.2 wt% nickel. Although it is marked as "○" in the thermal cycle test, it is marked as "X" in the tensile test and the "overall evaluation result" column, which represents the excess weight percentage ( More than 0.1 wt%) of nickel will cause the alloy to fail the tensile test; Example 8 uses 0.005 wt% of nickel, Example 1 uses 0.05 wt% of nickel, and Example 9 uses 0.1 wt% of nickel, which are shown in Table 5. In the "overall evaluation result" column, all marked as "△" or "○", which means that the lead-free copper-free tin alloy containing 0.005 to 0.1 wt% nickel can meet the requirements of the present invention.

[ Different germanium content ] Table 6 (Excerpt from Table 1) Metal composition ratio (wt%) Property test results Sn Ag Bi Sb Ni Ge thrust hardness Stretch Hot and cold cycle Step welding Overall assessment Example 1 margin 4.0 3.0 1.0 0.05 0.01 ○ ○ ○ ○ ○ ○ Example 10 margin 4.0 3.0 1.0 0.05 0.005 ○ ○ ○ ○ △ △ Example 11 margin 4.0 3.0 1.0 0.05 0.02 △ ○ ○ ○ ○ △ Comparative example 9 margin 4.0 3.0 1.0 0.05 0 ○ ○ ○ △ X X Comparative example 10 margin 4.0 3.0 1.0 0.05 0.05 X ○ ○ △ X X The "surplus" is an example of a weight percentage that makes up the lead-free, copper-free tin alloy to 100 wt%.

It can be seen from Table 6 that the weight percentage of germanium will affect the anti-oxidation properties of the alloy, and the insufficient anti-oxidation properties of the solder balls will increase the probability of double-ball failure during the board-level process of the ball-planting component. Too low weight percentage of germanium will make the lead-free copper-free tin alloy fail the board-level soldering test; too high weight percentage of germanium will cause the solderability of the lead-free copper-free tin alloy to decrease, making it unable to pass the thrust test, and will also cause It cannot pass the board level welding test.

Comparative example 9 uses 0 wt% germanium, which is marked as "X" in the board-level welding test, which means that too low weight percentage (less than 0.005 wt%) of germanium will lead to insufficient oxidation resistance of the alloy; comparative example 10 uses 0.05 wt% Germanium is marked as "X" in the thrust test, step welding test and "overall evaluation result" column, which means that excessive weight percentage (greater than 0.02 wt%) of germanium will lead to insufficient oxidation resistance of the alloy , And failed to pass the thrust test; Example 10 uses 0.005 wt% germanium, Example 1 uses 0.01 wt% germanium, and Example 11 uses 0.02 wt% germanium. They are listed in the "Overall Evaluation Results" column in Table 6. All are marked as "△" or "○", which means that the lead-free copper-free tin alloy containing 0.005 to 0.02 wt% germanium can meet the requirements of the present invention.

[ Summarize ]

According to the aforementioned results and discussion, the "overall evaluation results" of the lead-free copper-tin alloys of Examples 1-11 are marked as "△" or "○", indicating that they can pass the thrust test, hardness test, and test at the same time. The tensile test, the board step welding test and the thermal cycle test show that if the lead-free copper-free tin alloy (Examples 1 to 11) of the present invention is used to make a solder ball for ball grid array (BGA) packaging, the solder ball is The formed solder bumps can withstand the thermal stress caused by the electronic component itself or the environment when the temperature changes, and at the same time have the ability to withstand high mechanical shocks.

In summary, because the lead-free copper-free tin alloy of the present invention also contains 3.0~5.0 wt% silver, 0.01~3.5 wt% bismuth, 0.01~3.5 wt% antimony, 0.005~0.1 wt% nickel, 0.005~ 0.02 wt% germanium and the balance tin. Therefore, the lead-free, copper-free and tin alloy of the present invention can be made into solder balls for ball grid array (BGA) packaging, and the solder bumps formed by the solder balls can withstand the electronic components themselves or when the environment undergoes temperature changes. The thermal stress and the ability to withstand high mechanical shocks at the same time can indeed achieve the purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a photograph illustrating a slice of a normal solder joint (solder bump) formed in Example 1; Figure 2 is a photograph illustrating a slice of a bad solder joint (solder bump) formed in Comparative Example 9; and FIG. 3 is a photograph illustrating the x-ray observation results of the defective solder joints (solder bumps) formed in Comparative Example 9.

Claims (6)

A lead-free copper-free tin alloy, based on the total weight of the lead-free copper-free tin alloy as 100 wt%, comprising: 3.0~5.0 wt% silver; 0.01~3.5 wt% bismuth; 0.01~3.5 wt% antimony; 0.005~0.1 wt% nickel; 0.005~0.02 wt% germanium; and The balance of tin. The lead-free copper-free tin alloy according to claim 1, wherein the lead-free copper-free tin alloy contains 2.5 to 3.5 wt% of bismuth. The lead-free copper-free tin alloy according to claim 1, wherein the lead-free copper-free tin alloy contains 0.5 to 1.5 wt% of antimony. The lead-free copper-free tin alloy according to claim 1, wherein the lead-free copper-free tin alloy contains 0.045 to 0.055 wt% nickel. The lead-free copper-free tin alloy according to claim 1, wherein the lead-free copper-free tin alloy contains 0.005 to 0.015 wt% germanium. A tin ball used for ball grid array packaging is made of the lead-free copper-free tin alloy described in claim 1.

Images