TW202120878A - Cooling device - Google Patents

Abstract

A cooling device used to cool a heat source includes a tank, a bellow and a solenoid valve. The tank contains coolant, and the system is immersed in the coolant . The solenoid valve is connected to the tank and the bellow. The solenoid valve includes a first channel, a second channel, a third channel and a piston. The first channel is connected to the bellow. The second channel is connected to the bellow. The third channel is connected to an external space. The piston isolates the second channel and the third channel. The piston is configured to connect the first channel to one of the second channel and the third channel. When the heat source is initially activated, the piston is moved to connect the first channel to the third channel, and when the heat source operates, the piston is moved to connect the first channel to the second channel.

Description

Cooling device

The present invention relates to a cooling device, in particular to a two-phase immersion cooling device.

In an open two-phase immersion cooling system, the components to be cooled are immersed in a dielectric fluid. When the element heats up, the dielectric fluid will boil to produce a phase change, and the heat of the element will be removed through the phase change.

During the cooling process, the dielectric fluid will vaporize, and the open two-phase immersion cooling system requires space to store the vaporized dielectric fluid. However, in order to avoid damage to the components and maintain the boiling point characteristics of the dielectric fluid, it is necessary to maintain the pressure in the tank at normal pressure. This makes the collection of vaporized dielectric fluid mixed with many other gases, which in turn takes up a lot of extra space.

Therefore, how to propose a solution that can solve the above-mentioned problems is one of the problems that the industry urgently wants to invest in research and development resources to solve.

In view of this, one objective of the present invention is to provide a cooling device that can improve the problem of additional space occupied by the cooling device.

An aspect of the present invention discloses a cooling device. The cooling device is suitable for cooling a heat source. The cooling device includes a tank, an air storage tank and a solenoid valve. The tank contains cooling liquid. The cooling liquid is used to immerse the heat source to be cooled. The solenoid valve connects the tank body and the gas storage tank. The solenoid valve includes a first passage, a second passage, a third passage and a piston. The first channel communicates with the tank body. The second channel communicates with the gas storage tank. The third channel communicates with an external space. The piston isolates the second channel and the third channel. The piston is configured such that the first passage communicates with one of the second passage and the third passage. When the heat source to be cooled is started, the piston is moved to make the first passage communicate with the third passage. When the heat source to be cooled is operating stably, the piston is moved to connect the first channel with the second channel.

In one or more embodiments of the present invention, the aforementioned cooling device further includes a temperature sensor. The temperature sensor is connected to the tank body. The temperature sensor is configured to sense the temperature of the cooling liquid in the tank. In some embodiments, the cooling device further includes a processor connected to the solenoid valve. The processor is configured to control the position of the piston in the solenoid valve according to the temperature of the coolant, so that when the temperature of the coolant reaches a critical temperature, the piston is moved so that the first channel is connected to the second channel.

In one or more embodiments of the present invention, the aforementioned cooling device further includes an air pressure sensor. The air pressure sensor is connected to the tank body. The air pressure sensor is configured to sense the air pressure inside the tank. In some embodiments, the cooling device further includes a processor connected to the solenoid valve. The processor is configured to control the position of the piston in the solenoid valve according to the air pressure of the tank, so that when the air pressure reaches the threshold, the piston is moved to connect the first channel to the third channel.

In one or more embodiments of the present invention, the solenoid valve of the cooling device further includes a valve body chamber. The valve body chamber communicates with the first channel, the second channel and the third channel. The second channel and the third channel are respectively arranged on two opposite sides of the valve body chamber. The piston is arranged in the valve body cavity. The piston divides the valve body chamber into a first space and a second space that are isolated from each other.

In one or more embodiments of the present invention, the solenoid valve including the valve body chamber further includes a coil and a magnet group. The coil is arranged outside the valve body cavity and connected with the piston. The magnet group is arranged outside the valve body and coupled to the coil. When the power of the solenoid valve is turned on, current flows through the coil, causing the coil to be repelled by the magnet group to drive the piston to move.

In one or more embodiments of the present invention, the piston of the solenoid valve including the valve body chamber can be moved to the first position, the second position, or the third position in the valve body chamber. The piston closes the second passage in the first position to communicate the first passage and the third passage. The piston closes the first passage in the second position. The piston closes the third passage in the third position to communicate the first passage and the second passage.

In some embodiments, the cooling device further includes a processor connected to the solenoid valve. When the power of the solenoid valve is turned on, the processor forces the piston to be in one of the first position and the third position.

In some embodiments, the cooling device further includes a processor connected to the solenoid valve. When the power of the solenoid valve is turned off, the processor controls the piston to move to close the first passage, so that the first space can communicate with the second passage, and the second space can communicate with the third passage.

In order to achieve the above objective, according to another embodiment of the present invention, a cooling device includes a tank, an air storage tank, a first solenoid valve, and a second solenoid valve. The tank contains cooling liquid. The first solenoid valve is connected between the gas storage tank and the tank body. The first solenoid valve is configured to enable the tank body to selectively communicate with the gas storage tank. The second solenoid valve is connected with the tank body. The second solenoid valve is configured so that the tank can selectively communicate with the external space.

To sum up, through the control and adjustment of the solenoid valve, the gas storage tank of the cooling device will be able to remove gases other than the vaporized coolant, saving the space required for the entire gas storage tank. When it is necessary to adjust the internal pressure of the tank body to normal pressure, the solenoid valve can connect the tank body with the external space to supplement the external gas, and most of these external gas can be eliminated by the solenoid valve.

The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

The following examples are listed in conjunction with the accompanying drawings for detailed description, but the provided examples are not used to limit the scope of the present invention, and the description of the structure and operation is not used to limit the order of its execution. Any recombination of components The structure and the devices with equal effects are all within the scope of the present invention. In addition, the drawings are for illustrative purposes only, and are not drawn in accordance with the original dimensions. To facilitate understanding, the same elements or similar elements in the following description will be described with the same symbols.

In addition, the terms used in the entire specification and the scope of the patent application, unless otherwise specified, usually have the usual meaning of each term used in this field, in the content disclosed here, and in the special content. . Certain terms used to describe the present invention will be discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance on the description of the present invention.

Regarding the "first", "second", etc. used in this article, they do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish elements or operations described in the same technical terms. That's it.

Secondly, the terms "include", "include", "have", "contain", etc. used in this article are all open terms, meaning including but not limited to.

Furthermore, in this article, unless the article is specifically limited in the context, "一" and "the" can generally refer to one or more. It will be further understood that the terms "include", "include", "have" and similar words used in this article indicate the recorded features, regions, integers, steps, operations, elements and/or components, but do not exclude The described or additional one or more other features, regions, integers, steps, operations, elements, components, and/or groups thereof.

As mentioned above, the cooling device that reduces the temperature of the heating element by changing the cooling liquid phase, the heating element will be placed in the tank. In order to maintain the air pressure inside the tank at normal pressure, the vaporized coolant stored in the gas storage tank is often mixed with other gases, thus occupying a lot of space. In order to improve the above-mentioned problems, the cooling design of the present invention can effectively reduce the space occupied by the air storage tank through the design of the solenoid valve.

Please refer to Figure 1 and Figure 2A at the same time. FIG. 1 shows a block diagram of a cooling device 100 according to an embodiment of the present invention. FIG. 2A further shows a schematic diagram of the specific structure of the cooling device 100. In FIG. 1, the cooling device 100 includes a tank body 110, an air storage tank 130 and a solenoid valve 150. The tank body 110 and the gas storage tank 130 are connected by a solenoid valve 150 between them. The solenoid valve 150 can be connected to an external space and control whether the tank body 110 is connected to the air storage tank 130 or the external space.

In Figure 2A, the specific structure of the cooling device 100 is further disclosed. The tank body 110 contains the cooling liquid 113. The solenoid valve 150 is a three-hole, three-position solenoid valve. The solenoid valve 150 includes a first passage 154, a second passage 155, a third passage 156 and a piston 160. The first channel 154 is connected to the tank body 110 but is not used to conduct the liquid cooling liquid 113. The second channel 155 is connected to the air storage tank 130, and the third channel 156 is connected to the external space. The solenoid valve 150 has a valve body chamber inside. The first passage 154, the second passage 155 and the third passage 156 are all arranged in communication with the valve body chamber, and the piston 160 is arranged in the valve body chamber to separate the valve body chambers from each other. Two spaces that are not connected to separate the second passage 155 and the third passage 156. Taking Figure 2A as an example, the piston 160 closes the second passage 155, so that the solenoid valve 150 substantially communicates with the first passage 154 and the third passage 156, so that the tank body 110 communicates with the external space. For other operating conditions of the piston 160 and the solenoid valve 150, please refer to the following discussion.

In this cooling device 100, the heat source to be cooled is arranged in the tank 110 and immersed in the cooling liquid 113. The heat source is, for example, a server system. The cooling liquid 113 is, for example, a dielectric liquid, which prevents unintended short circuits between components of the heat source. When the system component to be cooled is operating and generates heat, the heat energy is transferred to the cooling liquid 113, and the temperature of the cooling liquid 113 rises to produce a phase change and vaporize. Following the phase change of the cooling liquid 113, the components of the heat source are also cooled accordingly. For the purpose of simple description, the heat source to be cooled is not shown in the cooling device 100.

The piston 160 is movably arranged in the valve body cavity of the solenoid valve 150. In this embodiment, the piston 160 is moved by connection with the spring 164L and the spring 164R. As shown in FIG. 2A, one side of the piston 160 is connected to one end of the connecting rod 161L, and the other end of the connecting rod 161L passes through the valve body chamber of the solenoid valve 150 and is connected to the coil 163L. The magnet set 162L includes an N pole and an S pole, and the coil 163L can be arranged between the N pole and the S pole of the magnet set 162L. The spring 164L is connected to the link 161L through the coil 163L. Similar settings are also applied to the connecting rod 161R, the magnet group 162R, the coil 163R and the spring 164R.

The coil 163L and the coil 163R are, for example, a spiral coil wound with a conductive metal wire. The coil 163L and the coil 163R can be connected to the power supply of the solenoid valve 150. Taking FIG. 2A as an example, when the power of the solenoid valve 150 is turned on, current can flow through the coil 163R, causing a repulsive force between the coil 163R and the magnet assembly 162R. In this way, the generated repulsive force can move the coil 163R away from the magnet assembly 162R, so that the spring 164R is compressed, and the driven piston 160 further closes the second passage 155. When the power of the back solenoid valve 150 is turned off, the coil 163R causes the magnet assembly 162R to lose the repulsive force, and the compressed spring 164R can push the piston 160 to restore the piston 160 to its original position.

The above describes the specific manner of moving the piston 160 in the solenoid valve 150 in this embodiment. Please go back to Figure 1. In this embodiment, the cooling device 100 further includes a temperature sensor 170, an air pressure sensor 180, and a processor 190. For the purpose of simple description, these components are not shown in FIG. 2A. Through these components, the user can further design the control process to control the movement of the piston 160 according to the operation of the cooling device 100.

In Figure 1, the temperature sensor 170 and the air pressure sensor 180 are connected to the tank 110 respectively. The temperature sensor 170 is configured to sense the temperature of the cooling liquid 113 in the tank 110. For example, when the temperature of the cooling liquid 113 is close to the boiling point, the temperature sensor 170 can send a signal to the processor 190. The air pressure sensor 180 is configured to sense the air pressure in the tank 110. For example, when the air pressure rises to a threshold value deviating from the normal pressure, the air pressure sensor 180 may send a signal to the processor 190. The processor 190 is connected to the solenoid valve 150. When the solenoid valve 150 is powered on, the processor 190 can select to conduct one of the coil 163L and the coil 163R according to the received signal, so that the piston 160 closes one of the second passage 155 and the third passage 156. When the solenoid valve 150 is turned off, the spring 164L and the spring 164R will not be compressed by the repulsive force of the coil 163L and the coil 163R, so that the piston 160 is maintained in a balanced position. This balance position can be determined by the air pressure of the two spaces separated by the piston 160. For details, please refer to the subsequent discussion.

Please refer to FIGS. 2A to 2C at the same time. In addition to further depicting the structure of the cooling device 100, it also illustrates that when the cooling device 100 is in operation, the piston 160 of the solenoid valve 150 is in the first position, the second position, and the third position. Location situation.

In Figure 2A, the piston 160 is in the first position. At this time, referring to the foregoing description, when the solenoid valve 150 is turned on, the coil 163R is turned on, a repulsive force is generated between the coil 163R and the magnet group 162R, and the coil 163R moves away from the magnet group 162R, which in turn drives the piston 160 to move to the first position to close the second position. Two-channel 155. At this time, the first passage 154 will communicate with the third passage 156. In this way, the gas can flow out to the outer space as shown by the arrow.

In Figure 2B, the piston 160 is in the second position. At this time, referring to the foregoing description, when the solenoid valve 150 is turned off, the spring 164L and the spring 164R will not be compressed by the repulsive force of the coil 163L and the coil 163R, so that the piston 160 is maintained in a balanced position. As shown in the figure, the first passage 154 is closed by the piston 160 at this time, and the valve body chamber inside the solenoid valve 150 is divided by the piston 160 into two spaces that are not connected to each other. In FIG. 2B, the external space communicates with the space on the left side of the piston 160 through the third passage 156, and the air storage tank 130 communicates with the space on the right side of the piston 160 through the second passage 155. At this time, the first passage 154 is basically closed, and the space on the left side of the piston 160 connected to the external space is at normal pressure. When there is a pressure difference between the left and right sides of the piston 160, the piston 160 will move to a new equilibrium position. For example, when there is too much gas remaining in the gas storage tank 130, so that the space on the right side of the piston 160 in Figure 2B has a larger air pressure, the piston 160 is moved to the left, and the air pressure in the space on the right side of the piston 160 drops.

In Figure 2C, the piston 160 is in the first position. When the solenoid valve 150 is powered on, the coil 163L is turned on, a repulsive force is generated between the coil 163L and the magnet assembly 162L, and the coil 163L moves away from the magnet assembly 162L, which drives the piston 160 to move to the first position to close the third passage 156. At this time, the first passage 154 will communicate with the second passage 155. In this way, the gas can flow into the gas storage tank 130 as shown by the arrow.

Please refer to Figure 3 and Figures 2A to 2C at the same time. FIG. 3 shows a flowchart of a method 200 of operating the solenoid valve 150 of the cooling device 100 according to an embodiment of the present invention. Taking the operation method 200 described in FIG. 3 as an example, how the cooling device 100 can save the occupied space will be described in detail. For example, in this embodiment, the process is executed by the processor 190 connected to the solenoid valve 150 as shown in FIG. 1.

It should be noted that the heat source to be cooled is arranged to be immersed in the cooling liquid 113 of the tank 110, and is not shown in the figure for the purpose of simple description. In addition, in order to avoid damage to the components of the heat source to be cooled, or unexpected deviations in the performance of the cooling liquid 113 due to pressure changes, the air pressure of the tank body 110 is usually maintained at a normal pressure. The normal pressure is, for example, one atmosphere.

Please refer to Figure 3. In the process 210, the cooling has not yet started. At this time, as shown in FIG. 2B, the power of the solenoid valve 150 is turned off, and the piston 160 is in the second position.

The process 210 is continued, and in the process 215, it is confirmed whether the heat source to be cooled in the tank body 110 is turned on and starts to generate heat.

If so, the process flow 220 is entered, and the power of the solenoid valve 150 is turned on. As shown in FIG. 2A, the processor 190 controls the piston 160 to move to the first position. At this time, the heat source to be cooled (such as the server system) is in the initial stage of activation, and the first channel 154 is connected to the third channel 156, corresponding to the tank body 110 being connected to the external space. In the initial stage of the cooling heat source, the heat source immersed in the cooling liquid 113 has not yet released a large amount of heat energy. At this time, the temperature of the cooling liquid 113 in the tank body 110 is still close to the normal temperature. In some embodiments, it can be defined that when the temperature of the cooling liquid 113 is less than a starting temperature, the heat source to be cooled is at the initial stage of starting. For example, the starting temperature can be a first temperature close to but lower than the boiling point. In order to keep the tank body 110 at normal pressure, the gas in the tank body 110 is mainly a mixed gas containing low-concentration cooling liquid 113 volatile vapor. In the process 220, the low-concentration mixed gas is discharged out of the tank body 110 through the control of the solenoid valve 150. At this time, the used space of the gas storage tank 130 is zero.

With the heat energy generated by the operation of the heat source to be cooled, the temperature of the cooling liquid 113 in the tank body 110 increases. Into the process 225, the temperature sensor 170 connected to the tank 110 is used to confirm whether the temperature of the cooling liquid 113 in the tank 110 reaches the first temperature close to but lower than the boiling point. Since the vapor pressure of a liquid is positively correlated with temperature, when the liquid temperature is close to the boiling point, its vapor pressure is also close to one atmosphere. In other words, when the temperature of the cooling liquid 113 is close to the boiling point, the gas in the tank 110 can be regarded as a mixed gas with a high concentration of the cooling liquid 113 vapor.

In order to reduce the loss of the cooling liquid 113, after confirming that the temperature of the cooling liquid 113 reaches the first temperature close to but lower than the boiling point, the process flow 230 is entered, and the piston 160 of the solenoid valve 150 is set to the third position, as shown in FIG. 2C. In other words, the heat source to be cooled at this time leaves the initial stage of startup and enters normal operation. At this time, the temperature of the cooling liquid 113 rises above the first temperature due to the heat released by the normal operation of the heat source. In this way, the tank body 110 and the gas storage tank 130 are connected, and the mixed gas with the high vapor concentration of the coolant 113 is stored in the gas storage tank 130. Since the low-concentration mixed gas before the cooling liquid 113 boils is eliminated, the required gas storage space volume of the gas storage tank 130 is smaller than that of the original design, which can increase the heat density of the overall heat source.

When the heat source to be cooled is operating in the tank body 110, the piston 160 is maintained at the third position, and the gas storage tank 130 is maintained to continuously collect the mixed gas with the high vapor concentration of the coolant 113. When the power of the heat source to be cooled changes and the amount of gas produced by the coolant 113 changes, the pressure difference between the gas storage tank 130, the tank body 110 and the external space can be used to make the mixed gas without applying external force. When moving between the air storage tank 130 and the tank body 110, the air pressure in the tank body 110 is maintained at a normal pressure. For example, the heat source to be cooled can be a server, which includes a central processing unit, a baseboard management controller, a memory, a hard disk, an expansion card, and so on.

While the heat source to be cooled continues to operate, the process 235 is also entered to monitor whether the air pressure in the tank 110 is greater than the set threshold. For details, please refer to Figure 4 to illustrate the monitoring security mechanism 300 initiated by the process 235. As shown in FIG. 4, after entering the process 235, the safety mechanism 300 is activated, and the air pressure sensor 180 connected to the tank 110 is used in the process 310 to confirm whether the air pressure in the tank 110 is greater than a set threshold. If the air pressure in the tank 110 exceeds the set threshold, the heat source to be cooled may be destroyed. If the threshold is exceeded, the process 320 is entered to move the piston 160 in the solenoid valve 150 to the first position (see Figure 2A) to connect the tank body 110 with the external space and reduce the air pressure in the tank body 110. The safety mechanism 300 will be executed repeatedly until the process 310 confirms that the air pressure in the tank body 110 does not exceed the set threshold, and the process 330 is entered to move the piston 160 in the solenoid valve 150 to the third position (see Figure 2C).

The process 235 will continue until the heat source to be cooled is turned off. Entering the process 240, it is confirmed whether the heat source to be cooled in the tank body 110 is turned off. If yes, the process 245 is entered, and the air pressure sensor 180 is used to first confirm whether the air pressure in the tank body 110 returns to the air pressure of the external space. If not, keep the piston 160 in the third position to avoid wasting the vapor of the coolant 113. If yes, enter the process 250.

In the process 250, it is confirmed whether the temperature of the cooling liquid 113 in the tank body 110 decreases and reaches the second temperature which is connected to the room temperature. If so, the process 255 can be entered, and the processor 190 can restore the piston 160 to the second position by turning off the coil 163L and the coil 163R at the same time (as shown in Figure 2B). At this time, the first passage 154 is closed by the piston 160, and the vapor of the cooling liquid 113 in the tank body 110 will not be lost.

After undergoing the operation method 200, the cooling device 100 is controlled by the solenoid valve 150 to eliminate the low-concentration mixed gas that does not need to be stored in the gas storage tank 130, so that the space required for the gas storage tank 130 is reduced.

Please refer to Figures 5A to 5C. Figures 5A-5C further illustrate a schematic diagram of the structure of a cooling device 400 according to another embodiment of the present invention, and illustrate that when the cooling device 400 is in operation, the piston 455 of the solenoid valve 450 and the piston 475 of the solenoid valve 470 correspond to As mentioned above, there is a first position, a second position and a third position.

Please refer to FIG. 5A first to illustrate the specific structure of the cooling device 400. As shown in the figure, the cooling device 400 includes a tank body 410, an air storage tank 430, a solenoid valve 450 and a solenoid valve 470. The tank 410 contains the cooling liquid 413. Both solenoid valve 450 and solenoid valve 470 are two-hole two-position solenoid valves. The solenoid valve 450 has a piston 455, and the solenoid valve 450 is connected between the gas storage tank 430 and the tank body 410 and is configured so that the tank body 410 can selectively communicate with the gas storage tank 430. The solenoid valve 470 has a piston 475. The solenoid valve 470 is connected to the tank body 410 and is configured so that the tank body 410 can selectively communicate with an external space. The solenoid valve 450 and the solenoid valve 470 can be switched on and off by a processor.

Corresponding to the first position described in FIG. 2A, in FIG. 5A, the piston 455 of the solenoid valve 450 closes the communication between the tank body 410 and the air storage tank 430. The tank 410 communicates with the external space. In this way, the gas will flow out from the tank 410 to the outer space as shown by the arrow.

Corresponding to the second position described in FIG. 2B, in FIG. 5B, the piston 455 and the piston 475 close the communication between the tank body 410 and the external space and the air storage tank 430.

Corresponding to the first position described in Figure 2C, in Figure 5C, the piston 475 of the solenoid valve 470 closes the communication between the tank body 410 and the external space. The tank body 410 is in communication with the gas storage tank 430. In this way, the gas will flow from the tank body 410 into the gas storage tank 430 as shown by the arrow.

Therefore, the cooling device 400 can implement the operating method 200 through two solenoid valves 450 and 470 with two holes and two positions. That is to say, like the cooling device 100, the cooling device 400 can also reduce the space occupied by the air storage tank 430, and reduce the volume occupied by the entire cooling device 400.

In summary, the cooling device of the present invention is designed and controlled by the solenoid valve, and by eliminating the gas that does not need to be stored, it can effectively save the space used by the gas storage tank for storing the coolant vapor, and further reduce the overall space occupied by the cooling device. The volume. When the internal pressure of the tank needs to be adjusted to normal pressure, the solenoid valve can make the tank communicate with the external space to supplement the external gas, and most of these external gases can be removed by the solenoid valve without additional occupation of the gas storage tank . The solenoid valve can be designed through a single three-hole three-position solenoid valve, or a combination of a pair of two-hole two-position solenoid valve. In this way, the cooling device that takes up less space is more convenient to be applied to other devices that require heat dissipation.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to the scope of the attached patent application.

In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the description of the attached symbols is as follows: 100: Cooling device 110: tank 113: Coolant 130: gas storage tank 150: Solenoid valve 154: First channel 155: Second channel 156: Third Channel 160: Piston 161L, 161R: connecting rod 162L, 162R: Magnet set 163L, 163R: coil 164L, 164R: Spring 170: temperature sensor 180: air pressure sensor 190: processor 200: method 210-255: Process 300: security mechanism 310-330: Process 400: Cooling device 410: tank 413: Coolant 430: Gas Storage Tank 450: Solenoid valve 455: Piston 470: Solenoid valve 475: Piston

In order to make the above and other objectives, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: Figure 1 shows a block diagram of a cooling device according to an embodiment of the present invention; Figures 2A-2C further illustrate a schematic diagram of the structure of a cooling device according to an embodiment of the present invention, and illustrate that when the cooling device is in operation, the solenoid valve piston is in a first position, a second position, and a third position, respectively Case; Figure 3 illustrates a flowchart of a solenoid valve operation method of a cooling device according to an embodiment of the present invention; Figure 4 depicts a flow chart of monitoring the operation of the air pressure mechanism in the tank of the cooling device according to an embodiment of the present invention; and Figures 5A-5C further illustrate a schematic diagram of the structure of a cooling device according to another embodiment of the present invention, and illustrate that when the cooling device is in operation, the solenoid valve piston is in a first position, a second position, and a third position. Location situation.

100: Cooling device

110: tank

113: Coolant

130: gas storage tank

150: Solenoid valve

154: First channel

155: Second channel

156: Third Channel

160: Piston

161L, 161R: connecting rod

162L, 162R: Magnet set

163L, 163R: coil

164L, 164R: Spring

Claims (10)

A cooling device suitable for cooling a heat source, including: A tank containing a cooling liquid to immerse the heat source; A gas storage tank; and A solenoid valve, which connects the tank body and the gas storage tank, includes: A first channel communicating with the tank body; A second channel connected with the gas storage tank; A third channel, communicating with an external space; and A piston separating the second passage and the third passage, wherein the piston is configured to make the first passage communicate with one of the second passage and the third passage, When the heat source is started at the initial stage, the piston is moved to make the first channel communicate with the third channel, and when the heat source is operating, the piston is moved to make the first channel communicate with the second channel. The cooling device as described in claim 1, further comprising: A temperature sensor connected to the tank, wherein the temperature sensor is configured to sense a temperature of the cooling liquid. The cooling device according to claim 2, further comprising a processor connected to the solenoid valve, wherein the processor is configured to control the position of the piston in the solenoid valve according to the temperature of the coolant, so that the When the temperature reaches a critical temperature, the piston is moved to make the inlet communicate with the second channel. The cooling device as described in claim 1, further comprising: An air pressure sensor is connected to the tank, wherein the air pressure sensor is configured to sense an air pressure inside the tank. The cooling device as described in claim 4, further comprising: A processor connected to the solenoid valve, wherein the processor is configured to control the position of the piston in the solenoid valve according to the air pressure of the tank, so that when the air pressure reaches a threshold, the piston is moved to make the second A channel communicates with the third channel. The cooling device according to claim 1, wherein the solenoid valve further comprises: A valve body chamber communicates with the first passage, the second passage and the third passage, wherein the second passage and the third passage are respectively disposed on two opposite sides of the valve body chamber, and the piston is disposed in the valve body cavity In the room, a first space and a second space are separated from each other by separating the valve body chamber. The cooling device according to claim 6, wherein the piston can be moved to a first position, a second position, or a third position in the valve body chamber, and the piston closes the second passage in the first position to communicate The first passage and the third passage, the piston closes the first passage in the second position, and the piston closes the third passage in the third position to communicate the first passage and the second passage. The cooling device according to claim 6, further comprising a processor connected to the solenoid valve, wherein when the power of the solenoid valve is turned on, the processor is used to set the piston in one of the first position and the third position One. The cooling device according to claim 6, further comprising a processor connected to the solenoid valve, wherein when the power of the solenoid valve is turned off, the processor is used to control the piston to be in a position to close the first passage, so that the first passage is closed. A space can communicate with the second channel and the second space can communicate with the third channel. A cooling device, including: A tank, containing a cooling liquid; A gas storage tank; A first solenoid valve, connected between the gas storage tank and the tank body, and configured so that the tank body can selectively communicate with the gas storage tank; and A second solenoid valve is connected to the tank body and configured so that the tank body can selectively communicate with an external space.

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