TW202119058A - Depth sensing device and method - Google Patents
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
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- G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4817—Constructional features, e.g. arrangements of optical elements relating to scanning
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Abstract
Description
本發明係關於感測裝置及方法,特別關於物體的深度感測裝置及方法。 The present invention relates to a sensing device and method, and particularly to an object depth sensing device and method.
在例如人臉辨識、手勢辨識、物體及環境建模等應用中,會使用深度感測裝置來感測物體及環境的位置及深度資訊,以獲得對應的點雲資料,從而建立出物體及環境的三維模型。 In applications such as face recognition, gesture recognition, object and environment modeling, depth sensing devices are used to sense the position and depth information of the object and the environment to obtain the corresponding point cloud data, thereby creating the object and the environment 3D model.
該裝置所用的深度感測技術大至可分為三種:立體視覺(Stereo vision)、結構光(Structured Light)及飛行時間測距(Time of Flight,TOF),每一種技術各有優缺點。舉例而言,立體視覺的優點在於硬體成本較低,但是容易受到環境光而影響量測的深度精度;結構光的優點在於可得到較佳的深度精度,但是其受限於結構光圖案投影光強度限制工作距離較短;相反地,飛行時間測距的優點在於其工作距離較長,但是於近距離的深度精度受限於光飛行時間或相位差的計算解析度而較差。因此,業者會依據產品的特性及應用,決定適合的深度感測技術。 The depth sensing technology used by the device can be divided into three types: Stereo vision, Structured Light and Time of Flight (TOF). Each technology has its own advantages and disadvantages. For example, the advantage of stereo vision is that the hardware cost is low, but it is easily affected by ambient light to affect the depth accuracy of the measurement; the advantage of structured light is that it can obtain better depth accuracy, but it is limited by the structured light pattern projection The light intensity limits the working distance to be shorter; on the contrary, the advantage of the time-of-flight ranging is that the working distance is longer, but the depth accuracy at short distances is limited by the calculation resolution of the light flight time or the phase difference and is poor. Therefore, the industry will determine the appropriate depth sensing technology based on the characteristics and applications of the product.
此外,有業者將不同類型的技術整合於一產品中,例如當待測物體較近時,該產品使用結構光技術來做深度感測,而當待測物體較遠時,該產品使用飛行時間測距技術來做深度感測。如此,各技術之間的缺點可互補,在近距離與遠距離都可得到較佳的深度精度。 In addition, some companies integrate different types of technologies into a product. For example, when the object to be measured is close, the product uses structured light technology for depth sensing, and when the object to be measured is far away, the product uses flight time Ranging technology to do depth sensing. In this way, the shortcomings between the technologies can be complementary, and better depth accuracy can be obtained at both short and long distances.
然而,上述產品需包括兩種不同的光發射組件,以分別產生結構光圖案及飛時測距的雷射光,因此其體積與成本都會增加。此外,所產生的結構光圖案為靜態的光斑圖案時(speckle pattern),受限於產生光斑圖案元件需要以達到雷射光波長等級的奈米製程工藝製作,難以得到更佳的解析度;而所產生的雷射光則由於能量發散,工作距離亦有限。再者,該產品通常使用一繞射式光學元件(DOE)來產生靜態結構光圖案,但繞射式光學元件若製程品質不佳時,易影響到結構光圖案的光均勻性,造成解析度不佳。 However, the above-mentioned product needs to include two different light emitting components to generate structured light patterns and laser light for time-of-flight distance measurement, respectively, so the volume and cost will increase. In addition, when the generated structured light pattern is a static speckle pattern, it is limited by the nano process technology that produces the speckle pattern element to achieve the laser light wavelength level, and it is difficult to obtain a better resolution; The generated laser light has a limited working distance due to energy divergence. Furthermore, this product usually uses a diffractive optical element (DOE) to generate a static structured light pattern, but if the process quality of the diffractive optical element is not good, it will easily affect the light uniformity of the structured light pattern, resulting in resolution Bad.
有鑑於此,如何提供改善上述缺失,乃為業界待解決的問題。另說明的是,上述之技術內容係用於幫助對本發明所欲解決問題的理解,其全部或部分不必然是本領域已公開或公知者。 In view of this, how to improve the above shortcomings is a problem to be solved in the industry. It should also be noted that the above technical content is used to help the understanding of the problem to be solved by the present invention, and all or part of it is not necessarily disclosed or known in the art.
本發明之目的在於提供一深度感測裝置及一深度感測方法,其可依據物體與裝置之間的距離,選擇利用結構光模式及雷射雷達模式之其中一者來做深度感測。並且,所提供的深度感測裝置及方法可使用由一雷射光源配合一振鏡組成的單一光發射組件,即能產生結構光模式的結構光圖案及雷射雷達模式的掃描光線;與習知需個兩光源相比,裝置所需體積可較小、成本較低亦較省電。此外,深度感測裝置及方法可提供動態變化的結構光圖案來照射於物體上,以提升量測的解析度 The purpose of the present invention is to provide a depth sensing device and a depth sensing method, which can select one of the structured light mode and the laser radar mode for depth sensing according to the distance between the object and the device. Moreover, the provided depth sensing device and method can use a single light emitting component composed of a laser light source and a galvanometer, that is, a structured light pattern in a structured light mode and a scanning light in a laser radar mode can be generated; It is known that compared with two light sources, the required volume of the device can be smaller, the cost is lower, and the power is saved. In addition, the depth sensing device and method can provide a dynamically changing structured light pattern to illuminate the object to improve the resolution of measurement
於一實施態樣中,本發明所提供的深度感測裝置可包含:一光發射組件,包含相光耦合的一雷射光源、一光整形件及一振鏡,該雷射光源可被調控發射出一連續波雷射光及/或一脈衝雷射光,該雷射光源發射該雷射光穿過該光整形件後被該振鏡反射掃描,以使該些雷射光投射至 一待測物上;一光接收組件,與該光發射組件光耦合,用以接收該雷射光從該待測物反射之反射光;以及一控制單元,與該光發射組件及該光接收組件電性連接,用以依據一結構光模式及一雷射雷達模式之至少其中一者來控制該光發射組件及該光接收組件。 In one embodiment, the depth sensing device provided by the present invention may include: a light emitting component, including a laser light source, a light shaping element and a galvanometer that are optically coupled, and the laser light source can be controlled A continuous wave laser light and/or a pulsed laser light are emitted. The laser light source emits the laser light after passing through the light shaping member and then is reflected and scanned by the galvanometer, so that the laser light is projected to On an object under test; a light receiving component optically coupled with the light emitting component to receive the reflected light of the laser light reflected from the object under test; and a control unit with the light emitting component and the light receiving component The electrical connection is used to control the light emitting component and the light receiving component according to at least one of a structured light mode and a laser radar mode.
於一實施態樣中,本發明所提供的深度感測裝置亦可包含:一光發射組件,包含相光耦合的一雷射光源、一光整形件及一振鏡,該雷射光源包含複數個子光源,且該雷射光源可被調控發射出一連續波雷射光或一脈衝雷射光,該雷射光源發射該雷射光穿過該光整形件後被該振鏡反射掃描,以使該雷射光投射至一待測物上;一光接收組件,包含與該光發射組件光耦合的一圖像擷取器及/或一光感測器,用以接收該些雷射光從該待測物反射之反射光;以及一控制單元,與該光發射組件及該光接收組件電性連接,用以依據一結構光模式及一雷射雷達模式之至少其中一者來控制該光發射組件及該光接收組件。 In one embodiment, the depth sensing device provided by the present invention may also include: a light emitting component, including a laser light source, a light shaping element and a galvanometer that are optically coupled, and the laser light source includes a plurality of The laser light source can be controlled to emit a continuous wave laser light or a pulsed laser light. The laser light source emits the laser light after passing through the light shaping element and then is reflected and scanned by the galvanometer to make the laser light Projected light onto an object under test; a light receiving component, including an image capture device and/or a light sensor optically coupled with the light emitting component, for receiving the laser lights from the object under test Reflected reflected light; and a control unit electrically connected to the light emitting component and the light receiving component for controlling the light emitting component and the light emitting component according to at least one of a structured light mode and a laser radar mode Light receiving components.
於一實施態樣中,該光接收組件可包含一圖像擷取器及/或一光感測器。當該光接收組件包含該圖像擷取器及該光感測器,該光感測器可設置於該光發射組件與該圖像擷取器之間。 In an implementation aspect, the light receiving component may include an image capture device and/or a light sensor. When the light receiving component includes the image capturer and the light sensor, the light sensor can be disposed between the light emitting component and the image capturer.
於一實施態樣中,該光接收組件可包含該圖像擷取器;於該結構光模式時,該控制單元控制該圖像擷取器逐幀擷取該待測物上的結構光圖案;於該雷射雷達模式時,該控制單元控制該圖像擷取器逐行接收從該待測物反射的該反射光。 In an implementation aspect, the light receiving component may include the image capturer; in the structured light mode, the control unit controls the image capturer to capture the structured light pattern on the object under test frame by frame ; In the laser radar mode, the control unit controls the image capture device to receive the reflected light reflected from the object to be measured line by line.
於一實施態樣中,該些子光源可被各別控制其發光時間。 In an implementation aspect, the light-emitting time of the sub-light sources can be individually controlled.
於一實施態樣中,本發明所提供的深度感測方法,包含:執 行一雷射雷達模式及一結構光模式之至少其中一者;其中,執行該雷射雷達模式時,控制一光發射組件發出一脈衝雷射光及/或一連續波雷射光至一待測物上掃描,並控制一光接收組件接收該脈衝雷射光及/或該連續波雷射光從該待測物反射之反射光,以獲得該待測物的點雲資料;其中,執行該結構光模式時,控制該光發射組件發出該連續波雷射光於該待測物上構成一組結構光圖案,並控制該光接收組件擷取該結構光圖案,以獲得該待測物體的另一點雲資料;其中,該光發射組件包含一雷射光源、一光整形件及一振鏡,其中該光整形件設置於該雷射光源與該振鏡之間,該雷射光源朝向該光整形件以及該振鏡發射該些雷射光。 In one embodiment, the depth sensing method provided by the present invention includes: Perform at least one of a laser radar mode and a structured light mode; wherein, when the laser radar mode is executed, a light emitting component is controlled to emit a pulsed laser light and/or a continuous wave laser light to an object to be measured Scan upward and control a light receiving component to receive the pulsed laser light and/or the reflected light of the continuous wave laser light reflected from the object to be measured to obtain the point cloud data of the object to be measured; wherein the structured light mode is executed When, control the light emitting component to emit the continuous wave laser light to form a set of structured light patterns on the object to be measured, and control the light receiving component to capture the structured light pattern to obtain another point cloud data of the object to be measured Wherein, the light emitting assembly includes a laser light source, a light shaping element and a galvanometer, wherein the light shaping element is disposed between the laser light source and the galvanometer, and the laser light source faces the light shaping element and The galvanometer emits the laser light.
於一實施態樣中,可先執行該雷射雷達模式,並獲得該待測物與該光接收組件之間的一距離;當該距離判斷小於一預設距離時,執行該結構光模式;當該距離判斷大於該預設距離時,則使用該雷射雷達模式所獲得的該點雲資料。 In an implementation aspect, the laser radar mode can be executed first, and a distance between the object under test and the light receiving component is obtained; when the distance is judged to be less than a preset distance, the structured light mode is executed; When the distance is judged to be greater than the preset distance, the point cloud data obtained by the laser radar mode is used.
於一實施態樣中,可先執行該雷射雷達模式,並獲得該待測物與該光接收組件之間的多個距離;當該些距離之其中一者小於該預設距離、而其中另一者大於該預設距離時,執行該結構光模式,並合併該點雲資料及該另一點雲資料。 In an implementation aspect, the laser radar mode can be executed first, and multiple distances between the object to be measured and the light receiving component can be obtained; when one of the distances is less than the preset distance, and When the other is greater than the preset distance, the structured light mode is executed, and the point cloud data and the other point cloud data are merged.
於一實施態樣中,可依據一輸入訊號執行該雷射雷達模式及該結構光模式之其中一者。亦可依據另一輸入訊號執行該雷射雷達模式及該結構光模式之其中另一者。然後,可合併該點雲資料及該另一點雲資料。 In an implementation aspect, one of the laser radar mode and the structured light mode can be executed according to an input signal. The other of the laser radar mode and the structured light mode can also be executed according to another input signal. Then, the point cloud data and the other point cloud data can be merged.
於一實施態樣中,可同時執行該雷射雷達模式及該結構光 模式,且其中包含:控制該光發射組件發出該脈衝雷射光至該待測物上掃描;以及控制該光接收組件接收該脈衝雷射光從該待測物反射之該反射光,以獲得該反射光之亮度、反射光回來的時間以及該反射光的結構光圖案。 In an implementation aspect, the laser radar mode and the structured light can be executed simultaneously Mode, and including: controlling the light emitting component to emit the pulsed laser light to scan on the object to be measured; and controlling the light receiving component to receive the reflected light of the pulsed laser light from the object to be measured to obtain the reflection The brightness of the light, the time when the reflected light comes back, and the structured light pattern of the reflected light.
於一實施態樣中,該光接收組件可包含一圖像擷取器及一光感測器;其中,執行該雷射雷達模式時,控制該光感測器來接收該反射光,而執行該結構光模式時,控制該圖像擷取器來擷取該結構光圖案。 In an implementation aspect, the light receiving component may include an image capture device and a light sensor; wherein, when the laser radar mode is executed, the light sensor is controlled to receive the reflected light, and the execution In the structured light mode, the image capture device is controlled to capture the structured light pattern.
於一實施態樣中,該光接收組件可包含一圖像擷取器;其中,執行該雷射雷達模式時,控制該圖像擷取器逐行接收該反射光,而執行該結構光模式時,控制該圖像擷取器逐幀接收該結構光圖案。 In an implementation aspect, the light receiving component may include an image capture device; wherein, when the laser radar mode is executed, the image capture device is controlled to receive the reflected light line by line, and the structured light mode is executed When, control the image capture device to receive the structured light pattern frame by frame.
於一實施態樣中,該雷射光源可包含複數個子光源,且控制該等子光源各別的發光時間。 In an implementation aspect, the laser light source may include a plurality of sub-light sources, and the respective light-emitting times of the sub-light sources are controlled.
為了讓上述的目的、技術特徵和優點能夠更為本領域之人士所知悉並應用,下文係以本新型創作之數個較佳實施例以及附圖進行詳細的說明。 In order to let those skilled in the art know and apply the above-mentioned purposes, technical features and advantages, the following is a detailed description of several preferred embodiments of the invention and the accompanying drawings.
100:深度感測裝置 100: Depth sensing device
10:光發射組件 10: Light emitting components
11:雷射光源 11: Laser light source
111、111A、111B:子光源 111, 111A, 111B: sub-light source
12:振鏡 12: Galvanometer
13:光整形件 13: Light shaping parts
20:光接收組件 20: Optical receiving component
21:圖像擷取器 21: Image capture device
21S:擷取範圍 21S: Capture range
22:光感測器 22: light sensor
30:控制單元 30: control unit
200:微處理器 200: Microprocessor
300:待測物 300: DUT
L、L1、L2:雷射光 L, L1, L2: laser light
La:雷射光束 La: Laser beam
Ls:子光束 Ls: sub-beam
R:反射光 R: reflected light
D:距離 D: distance
X:跡線 X: trace
S:結構光圖案 S: structured light pattern
θ:傾斜角 θ: tilt angle
S101~S107、S201~S209:步驟 S101~S107, S201~S209: steps
第1圖為依據本發明的較佳實施例的深度感測裝置的示意圖。 Figure 1 is a schematic diagram of a depth sensing device according to a preferred embodiment of the present invention.
第2A圖為依據本發明的較佳實施例的深度感測裝置的光發射組件的示意圖(側視圖)。 FIG. 2A is a schematic diagram (side view) of the light emitting component of the depth sensing device according to the preferred embodiment of the present invention.
第2B圖為依據本發明的另一較佳實施例的深度感測裝置的光發射組件的示意圖(側視圖)。 FIG. 2B is a schematic diagram (side view) of the light emitting component of the depth sensing device according to another preferred embodiment of the present invention.
第2C圖為第2B圖所示的雷射光源的示意圖(前視圖)。 Figure 2C is a schematic diagram (front view) of the laser light source shown in Figure 2B.
第3A圖及第3B圖分別為依據本發明的較佳實施例的光發射組件的雷射光示意圖。 FIG. 3A and FIG. 3B are schematic diagrams of laser light of a light emitting device according to a preferred embodiment of the present invention, respectively.
第4A圖及4B圖皆為依據本發明的較佳實施例的深度感測裝置執行雷射雷達模式的示意圖。 4A and 4B are schematic diagrams of the laser radar mode executed by the depth sensing device according to the preferred embodiment of the present invention.
第5A圖為依據本發明的較佳實施例的深度感測裝置執行結構光模式的示意圖。 FIG. 5A is a schematic diagram of the structured light mode executed by the depth sensing device according to the preferred embodiment of the present invention.
第5B圖至第5F圖分別為不同的結構光圖案的示意圖。 5B to 5F are schematic diagrams of different structured light patterns, respectively.
第6圖及第7圖分別為依據本發明的較佳實施例的深度感測方法的二步驟流程圖。 Figures 6 and 7 are respectively a two-step flow chart of the depth sensing method according to the preferred embodiment of the present invention.
以下將具體地描述根據本發明的具體實施例;惟,在不背離本發明之精神下,本發明尚可以多種不同形式之實施例來實踐,不應將本發明保護範圍解釋為限於說明書所陳述者。另,上述發明內容中的各實施態樣的技術內容亦可作為實施例的技術內容,或是作為實施例的可能變化態樣。此外,除非上下文清楚地另外指明,否則本文所用之單數形式「一」亦包含複數形式,當本說明書中使用用語「包含」或「包括」時,係用以指出特徵、元件或組件等之存在,不排除含有一個或多個其他特徵、元件或組件等之存在或添加。另,所述方位(如前、後、上、下、兩側等)係為相對者,可依據深度感測裝置及方法的使用狀態而定義,而不是指示或暗示深度感測裝置或方法須有特定方位、以特定方位構造或操作;所述方位因此不能理解為對本發明作的限制。 The following will specifically describe specific embodiments according to the present invention; however, without departing from the spirit of the present invention, the present invention can still be practiced in many different forms of embodiments, and the protection scope of the present invention should not be construed as being limited to what is stated in the specification By. In addition, the technical content of each implementation aspect in the above-mentioned invention content can also be used as the technical content of the embodiment or as a possible variation aspect of the embodiment. In addition, unless the context clearly indicates otherwise, the singular form "a" as used herein also includes the plural form. When the term "comprising" or "including" is used in this specification, it is used to indicate the existence of features, elements or components, etc. , Does not exclude the existence or addition of one or more other features, elements or components. In addition, the orientation (such as front, back, top, bottom, sides, etc.) are relative ones, which can be defined according to the state of use of the depth sensing device and method, rather than indicating or implying that the depth sensing device or method must be used. It has a specific orientation, is constructed or operated in a specific orientation; therefore, the orientation cannot be understood as a limitation of the present invention.
請參閱第1圖所示,於本發明之較佳實施例中,一深度感測裝置100(以下簡稱裝置100)被提出,其可安裝於一電子產品(例如行動電話、監控設置等)中,作為電子產品的一部分。裝置100可執行一結構光模式及一雷射雷達模式,以獲得待測物(人臉、手部、環境等)300的各部位的深度資訊(即點雲資料)等,進而產生(建構)待測物300的三維模型(圖像)。裝置100可進一步與電子產品的其他元件相電性連接,例如與一微處理器(晶片)200電性連接,以將所獲得距離或點雲資料等傳送至微處理器200建立三維模型或做身份辨識等其他應用。
Please refer to Figure 1. In a preferred embodiment of the present invention, a depth sensing device 100 (hereinafter referred to as the device 100) is proposed, which can be installed in an electronic product (such as a mobile phone, a monitoring device, etc.) , As part of electronic products. The
裝置100可包括一光發射組件10、一光接收組件20及一控制單元30,光接收組件20鄰設於光發射組件10(例如位於光發射組件10左側及/或右側),且兩者光耦合,也就是,光發射組件10所發射的光線經反射後能由光接收組件20接收。所以,只要符合這種關係,光發射組件10及光接收組件20即屬於鄰設或光耦合;另,光發射組件10及光接收組件20不限定需位於相同水平面上,兩者之間有段差仍能達成光耦合。控制單元30則與光發射組件10及光接收組件20各別地電性連接,以控制光發射組件10如何發光、及光接收組件20如何收光;控制單元30亦可與微處理器200相電性連接,以將光接收組件20的訊號傳遞至微處理器200,或是接收微處理器200的訊號來控制光發射組件10及光接收組件20。以下將更具體說明各元件的技術內容以及如何通過這些元件來感測待測物300的深度。
The
請配合參閱第2A圖至到第2C圖所示,光發射組件10可包含一雷射光源11、一振鏡12及一光整形件13。雷射光源11可發射出雷射光L,其較佳地可為紅外光雷射(不可見光),但不以此為限。雷射光源可為一邊
射型雷射(EEL:Edge Emittine Laser)或垂直共振腔面射型雷射(VCSEL:Vertical Cavity Surface Emitting Laser)等,雷射光源11具有兩種可控制的輸出模式,分別為連續波調變(Continuous Wave Modulation)和脈衝調變(Pulse modulation),換言之,可控制雷射光源11發射出一連續波雷射光及一脈衝雷射光之其中一者,且連續波雷射光的發射頻率可調整。
Please refer to FIGS. 2A to 2C. The
請參閱第2A圖及第2B圖,其中雷射光源11可使用單一發光源,該發光源可發射出具有一特定波長的雷射光束La,或是使用包含複數個子光源111,每個子光源111可發射出子光束Ls,然後該雷射光束La與該些子光束Ls經過光整形件13構成該雷射光L;每個子光源111的發光與否、及發光時間都能由控制單元30來個別地控制,因此該些子光源111可輪流地發射光線。該些子光源111可排列成一維或二維陣列,從不同位置發出子光束Ls。雷射光源11及其子光源111的具體結構例如可參考US2019/0109436A1公開號之美國專利申請案,然不侷限於此。
Please refer to FIGS. 2A and 2B, where the
振鏡12與雷射光源11相光耦合,即設置於雷射光源11之光路上,故雷射光源11的雷射光束La或子光束Ls經光整形件13整形完的雷射光L能抵達至振鏡12。振鏡12是一種微機電系統(Microelectromechanical Systems,簡稱MEMS)掃描振鏡,且可為一軸擺動的一維振鏡或是在兩軸擺動的二維振鏡。雷射光L(雷射光束La或子光束Ls)可在振鏡12上反射而改變前進方向、然後投射出光發射組件10外,而控制振鏡12之擺動角度,可使雷射光L投射至特定位置。振鏡12之具體結構可參考US2017/0044003A1公開號之美國專利申請案、US 7,329,930公告號及US 9,219,219之美國專利等,振鏡12亦可為申請人所販售之微機電掃描晶片等,然不侷限於此。
The
於其他實施態樣中,振鏡12可相對於雷射光源11為傾斜,且傾斜角θ大於等於45°、且不大於60°,可使裝置100有較大的感測範圍、較佳的解析度以及減小最小可感測距離,同時光發射組件10整體未傾斜(僅內部之振鏡12傾斜),故可減少其所占用裝置100內的空間,使裝置100能有更小的整體體積。
In other embodiments, the
光整形件13設置於雷射光源11之光路上、且位於雷射光源11與振鏡12之間,使得雷射光源11發射出之雷射光束La或子光束Ls需通過光整形件13才能抵達振鏡12。光整形件13可包含透鏡等光學元件,用以調整雷射光源11之雷射光束La或子光束Ls之形狀或角度,例如將雷射光束La或子光束Ls準直並整束成一線形光束,或者光整形件13可為一繞射元件,用以調整雷射光源11之雷射光L形成多個點發射或是線形光束。若雷射光源11發射出之雷射光束La或子光束Ls已具備所需的形狀與角度,則光整形件13可省略設置。
The
另一方面,如第3A圖及第3B圖所示,本實施例中雷射光源11採用單一發光源發射出的雷射光束La,經由光整形件13後形成雷射光L1,其能量較集中而兩側能量相較於中心能量較低(即光束的越外側的能量越小),而另一實施例中,雷射光源11採用子發光源111所發射出的複數個子光束Ls,當經過光整形件13後構成光束L2,其雷射光L2的能量分布較均勻,可得到較佳的解析度。另外,藉由複數個子光束Ls輪流發射,其單位時間內發射數相較於習知的發射數會更多,因此可以獲得更多資料。
On the other hand, as shown in Figures 3A and 3B, the
請復參第1圖,光接收組件20可包含一圖像擷取器(image capturing device)21及一光感測器(optical sensor)22,兩者分別位於光發射
組件10的兩側,或者位於光發射組件10的同一側。較佳地,由於光發射組件10與圖像擷取器21之間有維持一基本距離的需求,而光感測器22位於光發射組件10與圖像擷取器21之間即可使兩者維持一定的距離,幫助符合上述需求,且能減少裝置100的體積。
Please refer to Figure 1 again. The
圖像擷取器21可為電荷耦合元件(CCD:Charge coupled device)或互補式金屬氧化半導體(CMOS)等元件。圖像擷取器21主要用於結構光模式下,擷取待測物300上的結構光圖案(光斑)。光感測器22可包含矽光電倍增管(Silicon photomultiplier)或光電二極體(photodiode)等,其中,光電二極體可為例如雪崩光電二極體APD(Avalanche Photodiode)、PIN光電二極體(PIN Photodiode)或單光子雪崩二極體(Single-Photon Avalanche Diode;SPAD)等。光感測器22主要用於雷射雷達模式下,接收雷射光L於待測物300上反射回之反射光R。另,上述矽光電倍增管或光電二極體可為複數個,其排列成一維或二維陣列,以增加感測解析度。
The
於另一實施態樣中,光接收組件20包含圖像擷取器21、但不包含光感測器22,而圖像擷取器21具有兩種圖像擷取方式。於結構光模式時,圖像擷取器21是採「逐幀(frame by frame)」擷取方式,利用圖像擷取器21的全部或多數的畫素單元來擷取一或多張投射至待測物300上的結構光圖案;而於雷射雷達模式時,圖像擷取器21是採「逐行(line by line)」擷取方式,利用圖像擷取器21的其中一行畫素來感測、接收從待測物300反射的反射光R。
In another embodiment, the
控制單元30可包含一微控制器及其對應的周邊元件,其能執行一掃描模式來控制光發射組件10及光接受組件20。該掃描模式可為儲
存於控制單元30內的軟體(程式)、或是可由控制單元30讀取的軟體來執行。
The
掃描模式包含一雷射雷達模式及一結構光模式。 The scanning mode includes a laser radar mode and a structured light mode.
如第2A圖、第2B圖、第4A圖及第4B圖所示,控制單元30執行雷射雷達模式時,可控制光發射組件10發出脈衝雷射光L(雷射光束La或子光束Ls形成的雷射光L)至振鏡12上,經由振鏡12反射掃描至待測物300上;所投射至待測物300上的雷射光L可為線形光束。如第4B圖所示,控制單元30可控制振鏡12沿著單一轉軸進行擺動,以使雷射光L於待測物300上進行一維掃描(沿著跡線X),讓雷射光L的光點移動到待測物300上的不同處以覆蓋待測物。於其他實施態樣中,投射至待測物300上的雷射光L可為集中的光點,而振鏡12亦可為二維振鏡時,藉由光柵掃描(raster scan)或利薩茹掃描(Lissajous scan)等方式來控制振鏡12沿著兩個互相垂直的轉軸進行擺動,讓雷射光L進行二維掃描以覆蓋待測物300。
As shown in Figures 2A, 2B, 4A and 4B, when the
接著,控制單元30控制光接收組件20以光感測器22接收雷射光L從待測物300上的不同處反射回的反射光R,並且依據反射光R的亮度和雷射光L發射與接收到反射光R回來的時間,能計算出待測物300的不同處相對於光接收組件30的距離(即TOF,Time of Flight),從而獲得待測物300的點雲及反射率資料。
Next, the
控制單元30執行雷射雷達模式時,亦可採頻率調制連續波(FMCW:Frequency Modulated Continuous Wave)的方式來獲得點雲資料。也就是,控制單元30控制的子光源111發射出調制頻率連續變化的雷射光L經振鏡12反射至待測物300上進行掃描,然後光感測器22接收雷射光L從待測物300上的不同處反射回的反射光R,並依據反射光R的強度和相位變化,
計算出待測物300的不同處相對於光接收組件30的距離、速度及反射率。
When the
相比TOF方式,FMCW能同時獲得待測物300的移動速度,且較不受環境光的干擾而影響量測準確度。而TOF是使用脈衝雷射光L,脈衝雷射光L的能量較為集中,能投射至較遠的距離。因此,能依據應用情況或需求,選擇採用TOF及FMCW之其中一者。
Compared with the TOF method, FMCW can obtain the moving speed of the
如第2A圖及第5A圖所示,控制單元30執行結構光模式時,可控制光發射組件10的雷射光源11發出連續波雷射光L至振鏡12上、經由振鏡12反射掃描至待測物300上。控制單元30控制振鏡12以一維或二維掃描方式擺動,以使雷射光L於待測物300上掃描,透過控制雷射光L的明暗或強弱變化於待測物300上構成一組結構光圖案S。如第5B圖至第5D圖所示,結構光圖案S可為二進位編碼(Binary code)、格雷碼(Gray code)、條紋碼(Fringe code)、點狀編碼(Dot code)等,而這些不同編碼的結構光圖案S可由控制振鏡12的擺動頻率及雷射光源11的發光時序來達成。
As shown in Figures 2A and 5A, when the
如第5A圖所示,結構光圖案S投射至待測物300上後,控制單元30控制光接收組件20以圖像擷取器21來擷取位於擷取範圍21S內的該結構光圖案S,並且依據結構光圖案S對應的演算法來計算待測物300的不同處的深度,從而獲得待測物300的點雲資料。控制單元30還能使光發射組件10依據編碼型態投射出一組結構光圖案S至待測物300上,即投射至待測物300上的結構光圖案S會動態地變化,藉由圖像擷取器21依序地擷取該些多組結構光圖案S,並依據這些結構光圖案S來獲得解析度更高的點雲資料。
As shown in FIG. 5A, after the structured light pattern S is projected onto the
另一方面,如第2C圖、第5E圖及第5F圖所示,當光發射組件10包含複數個子光源111時,其子光源111的發光位置經過設計為特定的排
列方式,且該些子光源111A、111B的發光時間能個別地控制,例如控制子光源111A及子光源111B交替發光的時序,可構成不同編碼的結構光圖案S。例如於點狀編碼圖案S中,子光源111A發光時可構成由點D1(白色點)排列成的結構光圖案S1,而子光源111B發光時可構成點D2(黑色點)所排列成的結構光圖案S2,子光源111A及111B同時發光時可構成由點D1、D2所排列成的結構光圖案S。
On the other hand, as shown in Figures 2C, 5E, and 5F, when the
以上說明了依據本發明的一較佳實施例的深度感測裝置100的主要技術內容,接著說明依據本發明的另一較佳實施例的深度感測方法。深度感測方法可藉由上述深度感測裝置100來實現,故深度感測方法與深度感測裝置100的技術內容可相互參考,重複的部分將省略或簡化。深度感測方法可由深度感測裝置100的控制單元30來執行、或是控制單元30配合電子產品的微處理器200來執行。深度感測方法至少包含三種步驟流程,依序說明如下
The main technical content of the
請參閱第6圖所示,第一種流程是讓控制單元30主動(自行)地判斷及執行適合的掃描模式(雷射雷達模式及/或結構光模式),無須使用者決定。
Please refer to FIG. 6, the first process is to allow the
首先,於步驟S101中,先執行雷射雷達模式,以獲得待測物300的點雲資料及待測物300與光接收組件20之間的一距離D(如第4A圖所示)。該距離D可為待測物300的某一部分與光接收組件20之間的距離,或是待測物300的多個部分與光接收組件20之間的距離的平均值。
First, in step S101, the laser radar mode is first executed to obtain the point cloud data of the
接著,於步驟S103中,判斷該距離D是否小於一預設距離。該預設距離是依據雷射雷達模式及結構光模式的量測精度與範圍來決定, 例如設定為1米(meter)時,表示1米以上由執行雷射雷達模式所獲得的點雲資料較佳,1米以下由執行結構光模式所獲得的點雲資料較佳。 Then, in step S103, it is determined whether the distance D is less than a preset distance. The preset distance is determined based on the measurement accuracy and range of the laser radar mode and structured light mode. For example, when it is set to 1 meter, it means that the point cloud data obtained by executing the laser radar mode over 1 meter is better, and the point cloud data obtained by executing the structured light mode under 1 meter is better.
若距離D大於預設距離時,則可不用執行其他步驟,直接使用步驟S101中所獲得的點雲資料來建立待測物300的三維模型或深度圖或做其他應用(步驟S107)。若距離D小於預設距離時,則執行結構光模式(步驟S105),以獲得待測物體300的另一點雲資料,並且使用該另一點雲資料來建立待測物300的三維模型等(步驟S107);此時,步驟S101中所獲得的點雲資料將不使用。 If the distance D is greater than the preset distance, no other steps can be performed, and the point cloud data obtained in step S101 can be directly used to create a three-dimensional model or depth map of the object to be measured 300 or for other applications (step S107). If the distance D is less than the preset distance, the structured light mode is executed (step S105) to obtain another point cloud data of the object to be measured 300, and the other point cloud data is used to build a three-dimensional model of the object to be measured 300, etc. (step S105) S107); At this time, the point cloud data obtained in step S101 will not be used.
由此可知,依據待測物300的遠近,該深度感測方法可主動地選擇適合的掃描模式。
It can be seen that, according to the distance of the
另一方面,若待測物300的某一部分的距離D小於預設距離,但另一部分的距離D大於預設距離,即待測物300是涵蓋預設距離內外的範圍,則可將步驟S101中所獲得的點雲資料及步驟S105中所獲得的另一點雲資料融合。也就是,於步驟S107中,透過軟體演算法將兩種點雲資料融合,於預設距離內的待測物300的點雲為結構光模式中所獲得者,而於預設距離外的待測物300的點雲為雷射雷達模式所獲得者。如此建立的三維模型可涵蓋較完整的範圍,兼顧近距離點雲精確度高、又可建立遠距離點雲資料的優點。
On the other hand, if the distance D of a certain part of the
請參閱第7圖所示,第二種流程是控制單元30需依據使用者所輸入的輸入訊號來執行,而非主動執行,因此可稱為被動式深度感測。
Please refer to FIG. 7, the second process is that the
具體而言,首先,於步驟S201中,控制單元30接收使用者所輸入的一輸入訊號。輸入訊號對應三種模式,包含遠距模式、近距模式及自
動模式,使用者可通過電子產品的輸入裝置來選擇其中一種模式,然後產生該輸入訊號至控制單元30。使用者可判斷待測物300的遠近來選擇遠距模式或近距模式,若難以判斷待測物300的遠近時,可選擇自動模式來由裝置100判斷。
Specifically, first, in step S201, the
接著,於步驟S203中,依據該輸入訊號,執行雷射雷達模式及結構光模式之其中一者。舉例而言,輸入訊號對應於遠距模式時,執行雷射雷達模式,輸入訊號對應於近距模式時,執行結構光模式。若輸入訊號對應於自動模式,則如上述第6圖所示的第一種流程,先執行雷射雷達模式,再視情況執行結構光模式。 Then, in step S203, according to the input signal, one of the laser radar mode and the structured light mode is executed. For example, when the input signal corresponds to the long-range mode, the laser radar mode is executed, and when the input signal corresponds to the short-range mode, the structured light mode is executed. If the input signal corresponds to the automatic mode, the first process shown in Figure 6 above is to execute the laser radar mode first, and then execute the structured light mode as appropriate.
當執行完雷射雷達模式及結構光模式之其中一者後,可選擇地進行步驟S205。也就是,使用者可選擇另外一種模式,然後產生另一輸入訊號由控制單元30接收。控制單元30將依據另一輸入訊號執行另外一種模式(步驟S207)。如此,將獲得兩種點雲資料(雷射雷達模式的點雲資料及結構光模式的點雲資料),然後於建立三維模型時(步驟S209),可選擇地將兩種點雲資料合併。
After executing one of the laser radar mode and the structured light mode, step S205 is optionally performed. That is, the user can select another mode, and then generate another input signal to be received by the
深度感測方法的第三種流程是讓控制單元30同時執行該雷射雷達模式及該結構光模式。具體而言,首先,控制單元30控制光發射組件10的子雷射光111發射出脈衝雷射光L(子光束Ls)於待測物300上;由於子雷射光111的發光位置及時間不同,使得該脈衝雷射光L在待測物300上形成帶有編碼資訊的結構光圖案。接著,控制單元30控制圖像擷取器21及光感測器22來接收該脈衝雷射光L從待測物300反射的反射光R;藉由圖像擷取器21能解析反射光R中的編碼資訊,而藉由光感測器22能解析反射光R的反射時
間。最後,藉由該編碼資訊及該反射時間演算出待測物300的點雲資料。
The third process of the depth sensing method is to allow the
綜上,本發明的深度感測裝置及方法至少具有以下技術效果: In summary, the depth sensing device and method of the present invention have at least the following technical effects:
1.本發明可依據待測物的遠近來選擇適合的掃描模式,兼具近距離高精度及遠距離低功耗的三維深度感測的裝置及方法,藉由單一光發射組件來產生結構光模式的結構光圖案及雷射雷達模式的掃描光線,與習知各別模式需要各別光發射組件相比,裝置所需體積可較小、亦較省電。 1. The present invention can select a suitable scanning mode according to the distance of the object to be measured, and a device and method for three-dimensional depth sensing with short-distance high-precision and long-distance low power consumption. A single light emitting component is used to generate structured light The structured light pattern of the mode and the scanning light of the laser radar mode, compared with the conventional light emitting components required for each mode, the device requires a smaller volume and saves power.
2.與習知的靜態結構光圖案相比,本發明可藉由雷射光源及振鏡來提供動態變化的結構光圖案於待測物上,以提升深度量測的解析度。 此外,本發明的結構光圖案是由振鏡反射及控制雷射來產生,振鏡可具備高反射率的反射鏡來反射雷射光,故不會造成結構光圖案的光均勻性不佳。 2. Compared with the conventional static structured light pattern, the present invention can provide a dynamically changing structured light pattern on the object to be measured through a laser light source and a galvanometer, so as to improve the resolution of depth measurement. In addition, the structured light pattern of the present invention is generated by the reflection of a galvanometer and a control laser. The galvanometer can have a high-reflectivity mirror to reflect the laser light, so the light uniformity of the structured light pattern will not be poor.
3.本發明可藉由一維振鏡來掃描雷射光覆蓋於待測物上,而相對於二維振鏡而言,一維振鏡控制較單純,且較容易產生大角度運動。相應地,動態變化的結構光圖案可有較大的投射角度,使得感測裝置有比較廣的視角。 3. In the present invention, a one-dimensional galvanometer can be used to scan the laser light to cover the object to be measured. Compared with a two-dimensional galvanometer, the one-dimensional galvanometer has simpler control and is easier to produce large-angle motion. Correspondingly, the dynamically changing structured light pattern can have a larger projection angle, so that the sensing device has a wider viewing angle.
4.本發明可藉由連續變化的雷射光強度來產生解析度較佳的結構光圖案,而藉由脈衝雷射光所產生的結構光圖案通常具有較差的解析度。 4. The present invention can generate structured light patterns with better resolution by continuously changing laser light intensity, while structured light patterns generated by pulsed laser light usually have poor resolution.
5.本發明可藉由雷射光於待測物的一次掃描,同時獲得雷射雷達模式及結構光模式的點雲資料,較有效率。 5. The present invention can obtain the point cloud data of the laser radar mode and the structured light mode at the same time through one scan of the laser light on the object to be measured, which is more efficient.
6.比起藉由單一光源的雷射光而言,本發明藉由多個雷射子光源來投 射出雷射光,在單位時間內較多光線發射數,因此可得到較佳的解析度。 6. Compared with the laser light by a single light source, the present invention uses multiple laser sub-light sources to project When laser light is emitted, more light is emitted per unit time, so better resolution can be obtained.
上述之實施例僅用來例舉本新型創作之實施態樣,以及闡釋本新型創作之技術特徵,並非用來限制本新型創作之保護範疇。任何熟悉此技術者可輕易完成之改變或均等性之安排均屬於本新型創作所主張之範圍,本新型創作之權利保護範圍應以申請專利範圍為準。 The above-mentioned embodiments are only used to exemplify the implementation of the new creation, and to explain the technical features of the new creation, and are not used to limit the protection scope of the new creation. Any changes or equivalence arrangements that can be easily completed by those familiar with this technology are within the scope of this new creation, and the scope of protection of the rights of this new creation shall be subject to the scope of the patent application.
100:深度感測裝置 100: Depth sensing device
10:光發射組件 10: Light emitting components
20:光接收組件 20: Optical receiving component
21:圖像擷取器 21: Image capture device
22:光感測器 22: light sensor
30:控制單元 30: control unit
200:微處理器 200: Microprocessor
300:待測物 300: DUT
L:雷射光 L: Laser light
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CN114332362A (en) * | 2021-12-15 | 2022-04-12 | 东南大学 | Inclinometry monitoring device and method for coupling optical positioning and real-time updating |
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