TW202118118A - Method for substrate registration and anchoring in inkjet printing - Google Patents

Abstract

A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.

Description

Method for substrate alignment and anchoring in inkjet printing

This description relates to the deposition of materials onto a substrate by inkjet printing.

Some semiconductor device and display manufacturing steps require selective deposition of material layers. Inkjet printing has been increasingly used in the semiconductor and display industries to deposit layers, especially in back-end processing (such as passivation and packaging) that requires lower resolution and positioning accuracy.

In one aspect, a method of printing on a substrate includes: printing a support structure by printing a liquid precursor material and curing the liquid precursor material; and printing a liquid precursor material on the outside of the support structure and curing the liquid precursor Materials to print one or more alignment marks; positioning the substrate in the support structure; using one or more alignment marks to align the substrate; and by printing and curing the liquid precursor material for alignment, while One or more device structures are printed on the substrate.

In another aspect, a method of printing on a substrate includes the following steps: printing a support structure by printing a liquid precursor material and curing the liquid precursor material; positioning the substrate in the support structure; by printing and curing The liquid precursor material is used to fix the substrate to the support structure to print one or more anchors on the substrate and the support structure; and while anchoring is performed by printing and curing the liquid precursor material, one is printed on the substrate Or multiple device structures.

In another aspect, a method of printing a structure on a reconstructed wafer includes: placing a plurality of semiconductor dies on a supporting substrate; by anchoring a plurality of semiconductor dies extending across the edge of the semiconductor die The parts are printed on the supporting substrate, thereby anchoring a plurality of semiconductor dies to the supporting substrate, thereby forming a reconstructed wafer; and printing one or more devices on the plurality of semiconductor dies while being anchored on the supporting substrate structure. The printing operation involves ejecting droplets of liquid precursor material and curing the liquid precursor material.

In another aspect, a method of printing on a substrate includes the following steps: printing a support structure by printing a liquid precursor material and curing the liquid precursor material; positioning the substrate in the support structure; by printing and curing The liquid precursor material is used to fix the substrate to the support structure to print one or more anchors on the substrate and the support structure; and while anchoring is performed by printing and curing the liquid precursor material, one is printed on the substrate Or multiple device structures.

In another aspect, a substrate alignment/alignment device includes: a droplet jet printer; and a controller configured to make the droplet jet printer: by printing a liquid precursor material and curing the liquid precursor Print the support structure by printing and curing the liquid precursor material; fix the substrate to the support structure by printing and curing the liquid precursor material to print one or more anchors on the substrate and the support structure; and by printing and curing the liquid precursor material While the material is anchored and aligned, one or more device structures are printed on the substrate.

In another aspect, a method of printing on a substrate includes: printing a support structure by printing a liquid precursor material and curing the liquid precursor material, wherein the support structure is a ring-shaped body with a hole, and the substrate is assembled to the hole In; positioning the substrate in the hole in the support structure; and printing one or more device structures on the substrate while anchoring and aligning by printing and curing the liquid precursor material.

The anchor may be a frame extending around the periphery of the die, or a plurality of spaced apart strips. The spaced-apart strips may be parallel stripes, and may extend substantially perpendicular to the edges of the die. The plurality of spaced apart strips may include a strip extending on each of the plurality of edges of the die. The anchor does not need to extend on the central part of the die. The substrate may be circular, and the supporting structure may include a circular hole in which the substrate is fitted. The anchor may include a strip extending along a radial section, the radial section starting from the center of the hole. The support structure may completely surround the substrate or partially surround the substrate. The support structure may be higher than the substrate, for example, the inner surface of the support structure may be higher than the substrate. The liquid precursor material may be a polymer precursor.

The possible advantages may include but are not limited to one or more of the following.

The alignment accuracy of the structure printed on the substrate can be improved. Precise alignment can improve the accuracy and repeatability of the material deposited on the substrate. In addition, anchors can be used to maintain the alignment of the substrate during the printing operation to prevent the substrate from moving during the printing process. For example, in the case of mechanical vibration of the printer or drift of the printer and its subsystems from the initial calibration, the alignment of the substrate is still maintained, which can improve the process of depositing materials on the substrate during processing and subsequent processing, thereby Improve the accuracy and repeatability of processing.

The details of one or more specific embodiments are disclosed in the attached drawings and the following description. According to the description and drawings, as well as the scope of patent application, it will be obvious to understand other aspects, features and advantages.

Droplet jet printing (also known as inkjet printing, even if the jetted material is not used as ink) has been used to selectively deposit layers in semiconductor and display device manufacturing. The advantage of using inkjet printing for selective deposition is that patterned layers can be deposited without the need for photolithography, etching, lift-off, and high-vacuum plasma deposition processes. Inkjet printing can provide excellent scalability, high yield, low cost and wide color gamut.

However, the precise alignment or alignment of the substrate on which the layer is to be printed ("printed substrate") relative to the inkjet printer is still a problem. Generally, inkjet printers are not equipped with alignment and alignment mechanisms for substrates with existing patterns, such as from previous processing steps, and therefore, precise alignment and alignment of the substrates with the printer can be challenging. In addition, due to mechanical vibration during printing, the printed substrate may slide, move, or rotate on the build platform. This movement may not be a problem in the conventional printing situation, but may be unacceptable for the precision level required for semiconductor and display device manufacturing. One solution is to use cameras and computer vision algorithms to monitor this movement and perform dynamic adjustments of the printing process. However, this solution may be expensive in terms of the cost of the physical components and the computing power required for dynamic control. A more effective, economical and reliable solution is to use a printer to print the alignment marks on the build platform to ensure that the printed substrate on the build platform is correctly aligned with respect to the print head. Alternatively or additionally, the printed substrate can be anchored on the build platform to prevent movement by adding other materials during the build-up manufacturing process.

Inkjet printing equipment

FIG. 1 shows a schematic side view of an example inkjet printing apparatus 100. The device 100 can spray droplets of the liquid precursor 105, and the droplets can be solidified to form various structures, such as a support structure for supporting a printed substrate, an alignment mark for ensuring proper substrate positioning, and a fixing of the printed substrate An anchor on the support structure or platform or the die on the reconstituted wafer, and/or the printed substrate on the reconstituted wafer or the layer on the die (such as a passivation layer).

The device 100 includes a build platform 104 and a dispenser 114 to transfer the liquid precursor 105 to the build platform 104 (that is, directly to the platform, directly to the printed substrate on the platform, or to the previously used platform or printing The cured material layer deposited by the dispenser on the substrate).

A support 107, such as a frame, holds one or more print heads 102 above the build platform 104. The printing head 102 can move in a plane above and parallel to the building platform 104, so that the printing head 102 can be selectively positioned above the usable area of the building platform 104. In particular, the support 107 is configured to traverse the build platform 104 in a first direction (for example, along the x-axis).

In some embodiments, the print head 102 extends across the width of the build area of the build platform 104. In this case, the movement of the print head 102 in a second direction (for example, along the y-axis) perpendicular to the first direction is not required. In some embodiments, the print head 102 may also move along the support 107 in a second direction perpendicular to the first direction (for example, along the y-axis). This method can be used if the print head 102 only extends over a part of the width of the build area of the build platform 104. The same print head 102 can be used to perform multiple scans over the length of the build platform, each scan covering a different part of the platform width, such as a grid scan. The movement of the print head 102 along the support 107 and the movement of the support 107 along the x-axis and the y-axis provide the print head 102 with multiple degrees of freedom.

When the support 107 moves on the build platform 104, the dispenser 114 can selectively deposit the liquid precursor onto a desired area of the build platform 104, for example, as controlled by the controller 150. The distributor 114 can deliver the liquid precursor 105 as a layer of relatively uniform thickness.

For certain construction operations, such as the manufacture of support structures, the distributor 114 can distribute successive layers of the liquid precursor 105 onto the construction platform 104. After distributing each layer or following the distribution of each layer (but before distributing the next layer), this layer can be hardened (eg cured). Each continuous layer may be supported by a lower layer of processed (eg, cured) liquid precursor 105.

The liquid precursor 105 may be discharged from the dispenser 114 in the form of droplets. For example, the dispenser 114 may use inkjet printer technology. The size of the droplets of the liquid precursor 105 ejected by the dispenser 114 may be uniform or may be variable in size. The precursor 105 may have a sufficiently high viscosity so that it does not spread significantly when sprayed onto the platform or a previously cured layer.

The material used for the liquid precursor 105 may include a polymer precursor, such as a UV curable polymer precursor. Examples include (meth)acrylate monomers, and may include one or more of mono(meth)acrylate, di(meth)acrylate, tri(meth)acrylate, tetra(meth)acrylate or its combination. Examples of suitable mono(meth)acrylates include isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, trimethylcyclohexyl (meth)acrylate, diethyl (meth)acrylamide Group, (meth)acrylamide dimethyl and tetrahydrofurfuryl (meth)acrylate. Monomers can be used as crosslinkers or other reactive compounds. Examples of suitable crosslinking agents include polyethylene glycol di(meth)acrylate (for example, diethylene glycol di(meth)acrylate or tripropylene glycol di(meth)acrylate), N,N′- Methylene bis(meth)acrylamide, pentaerythritol tri(meth)ester, acrylate and pentaerythritol tetra(meth)acrylate. Examples of suitable reactive compounds include polyethylene glycol (meth)acrylate, vinyl pyrrolidone, vinyl imidazole, styrene sulfonate, (meth)acrylamide, alkyl (meth)acrylamide, two Alkyl (meth)acrylamide), hydroxyethyl (meth)acrylate, morpholinoethyl acrylate and vinylformamide. Acrylate and acrylamide.

The distributor 114 can selectively distribute the layer of the precursor 105 on the build platform 104 such that some parts receive the precursor 105 and some parts do not receive the precursor 105. The distributor 114 may have an array of openings, for example, the flow of the liquid precursor 105 may be independently controlled by an independently controllable valve, or the liquid precursor 105 may be ejected by an array of piezoelectric ejectors.

The precursor 105 may be processed (eg, cured) to cure and form the layer of the support structure 200. The first energy source 112 may be used to process the precursor 105, such as a light source that generates light and directs the light to the liquid precursor material 105. In some embodiments, the first energy source 112 is an ultraviolet (UV) light source. In addition, the first energy source 112 may be supported on the print head 102. The first energy source 112 may generate, for example, thermal radiation, UV radiation, IR radiation, and/or visible radiation. The first energy source 112 may direct light to an area that extends across the entire width of the build area of the build platform 104. The movement of the print head 102 or the support 107 can sweep this area over the entire length of the build area. The first energy source 112 can illuminate the entire area, including areas with and without the liquid precursor 105.

The print head 102 may be configured to support the second energy source 110. The second energy source 110 may be configured to direct energy to a local area of the powder on the build platform 104. The diameter of these areas can be as small as a few millimeters (for example, using point energy) or larger (for example, using district energy). The point energy source may be, for example, a laser that emits a laser beam onto a small part of the powder. The area energy source can be, for example, a lamp that emits light, such as infrared light, visible light, or ultraviolet light.

In some embodiments, the second energy source 110 may include a scanning laser, which generates a focused energy beam, and the focused energy beam increases the temperature of a small area of the precursor. The second energy source 110 may process the precursor 105 using, for example, a light source that generates and directs light toward the precursor 105. The first energy source 112 may generate, for example, thermal radiation, UV radiation, IR radiation, and/or visible radiation. In some cases, the second energy source 110 may include an ion beam or an electron beam. The second energy source may also include, for example, a laser array, such as a laser diode, a lamp array that provides broad-spectrum radiation (such as a mercury lamp), or an array of solid-state infrared emitters.

In some embodiments, the second energy source 110 includes a plurality of light sources that can be independently activated. Each light source may be arranged in an array, such as a linear array, to provide selective illumination along the main axis of the belt. The second energy source may include, for example, a light emitting diode (LED), which is configured to emit radiation whose intensity depends on the current delivered to the LED.

In some embodiments, the second energy source 110 can move independently of the print head 102. In some examples, in addition to the second energy source 110 incorporated into the print head 102, the apparatus 100 may also include a second energy source independent of the print head 102. The device 100 may also include multiple energy sources, each of which is addressable, so that the controller 150 can accurately control the energy-receiving area of the construction platform 104.

During the building operation, the building platform 104 may move up or down with respect to the dispenser 114. For example, after each layer of precursor 105 is distributed by the distributor 114, the build platform 104 can be moved downward so that the print head 102 can remain at the same vertical height relative to the top of the layer after each successive layer is distributed.

After the construction operation for the object is completed, the construction platform 104 may be moved back to the initial position to prepare, for example, a cleaning or construction operation for the subsequent object (for example, the supporting structure 200) (see FIG. 3).

Alternatively, the build platform 104 may be maintained in a fixed vertical position, and the support 107 may be raised after each layer is deposited.

In order to perform the operations described herein, the device 100 includes a controller 150 configured to control the operation of a sub-system including a distributor 114, a first energy source 112, a second energy source 110, and a support 107. The controller 150 may include a computer-aided design (CAD) system that receives and/or generates CAD data. The CAD data indicates the object to be formed (such as the support structure 200, the alignment mark 210, and the anchor 220), and as described herein, the CAD data can be used to determine the properties of the structure formed during the build-up manufacturing process. Based on the CAD data, the controller 150 can generate instructions that can be used by each system operating with the controller 150, for example, to dispense the liquid precursor 105, solidify and harden the precursor 105, the various systems of the mobile device 100, and the sensing system Properties such as cured and uncured liquid precursor 105.

The sensor 160 (eg, a camera, scanner, or other metrology tool) may be configured to receive information about the properties of the liquid precursor 105, the support structure 200, and the substrate 230 (see FIGS. 2A-2D, FIGS. 3 and 4). As will be discussed in more detail below, the sensor 160 can help determine the correct alignment of the substrate 230 in the support structure 200, and the sensor 160 can be configured to communicate to the controller 150 about the various components and subassemblies of build-up manufacturing. Part information.

supporting structure

2A-2D, 3 and 4, the support structure 200 is formed on the build platform 104 by the inkjet printing device 100. As shown in FIG. 3, the support structure 200 may be a ring structure, such as a circular ring. The support structure 200 is formed of continuous layers 200a, 200b, 200c, 200d, and the like. After each successive layer of liquid precursor 105 is dispensed, it can be cured to support another layer of liquid precursor 105 until support structure 200 is formed.

The support structure 200 has a hole 212 into which the substrate will fit (see Figures 2A-2D). Although FIG. 3 shows a circular hole, in other embodiments, other shapes of the hole may be suitable according to the shape of the substrate, such as a triangle, a square, or other geometric shapes or complex shapes.

In some embodiments, the support structure 200 does not need to completely surround this area to be suitable for assembling the substrate. A partial surrounding area (for example, many unconnected arcs) instead of a full circle support structure as shown in FIG. 3 is sufficient to support the substrate 230.

The support structure 200 is generally configured to closely surround the substrate 230 (discussed below). The height of the support structure 200 (for example, the height of the inner surface 204 in contact with the substrate 230) should be greater than the thickness of the substrate 230 to ensure that the substrate 230 is completely contained in the support structure 230. The bottom surface 206 of the support structure 200 contacts and is supported by the build platform 104.

After the support structure 200 is formed (or at the same time as the support structure 200 is formed), one or more alignment marks 210 are formed by the inkjet printing apparatus 100. The alignment mark 210 is formed of one or more layers, such as continuous layers 210a, 210b, 210c, 210d, and so on. After distributing each successive layer of the liquid precursor 105, the layer may be processed by the first energy source 112 or the second energy source to cure to support subsequent layers of the liquid precursor 105. The alignment mark 210 may be printed on the build platform 104.

In some embodiments, the alignment mark 210 may be connected to the outer surface 202 of the support structure 200. In some embodiments, the alignment mark may be attached to the top surface 208 of the support structure. The alignment mark 210 is used to assist the positioning and orientation of the substrate 230 to ensure a desired positioning or orientation (discussed below) within the support structure 200 during subsequent processing (eg, subsequent inkjet printing processing in the semiconductor and display industry). The alignment mark 210 can provide a positioning accuracy of ±50 μm or less. This level of accuracy may enable the substrate 230 to be effectively anchored to the support structure 200 (discussed below).

The alignment marks 210 may be dots, stripes, rings, crosses, or other physical marks or indicators to help determine the positioning on the substrate 230 during the loading of the substrate 230 (discussed below). In some embodiments, the alignment mark 210 is a radially extending strip; and the center of the hole 212 may provide a common origin for the radially extending strip.

After the alignment mark 210 is formed, the substrate 230 is loaded into the support structure 200. The substrate can be a semiconductor wafer for integrated circuit manufacturing; the semiconductor wafer can complete front-end processing and is ready to start back-end processing, or has already undergone some back-end processing.

The substrate 230 may be loaded to rest on the build platform 104 and surrounded by the support structure 200 (eg, placed in the hole 212). Alternatively, the substrate 230 may rest on a ledge, edge, slope 205, top surface 208, or other part of the support structure 200. The support structure 200 may include a chamfered surface 205. The beveled surface 205 from the top surface 208 to the inner surface 204 can guide the positioning of the substrate 230. For example, the substrate 230 can slide along the beveled surface 205 to an appropriate position.

The alignment mark 210 may be used as a visual mark of the position of the substrate 230 in the support structure 200. The sensor 160, such as a camera at a fixed position relative to the build platform 104, can be used to calculate the offset of the substrate 230. For example, the camera may be used to determine the position of the alignment mark 210 in the camera image. In particular, the controller 150 may execute an image recognition algorithm to determine the position of the alignment mark 210 in the camera image. The determined position may be compared with a preset or predetermined position of the alignment mark 210, and the first offset may be calculated. The first offset can be a simple translation, or a more complex transformation, such as skew or rotation. The printing performed by the print head 102 may accommodate a first offset of the alignment mark 210 relative to a preset or predetermined position of the alignment mark 210 (as measured by the camera and the controller).

A camera (such as the sensor 160) may be used to further determine the position of the substrate 230 within the support structure 200. In particular, the controller 150 may execute an image recognition algorithm to determine the position of the substrate 230 in the camera image. The position of the substrate 230 in the camera image may be compared with a preset or predetermined position of the substrate 230, and the second offset may be calculated. The second offset can be a simple translation or a more complex transformation, such as skew or rotation. Then, printing by the print head 102 can adapt to the second offset of the substrate 230.

Then a control signal from the controller 150 may be generated to take into account the offset of the alignment mark 210 and the offset of the substrate 230. In particular, an appropriate transformation can be applied to the image data of the layer to be printed, so that the printing of features on the substrate 230 takes into account the offset of the alignment mark 210 and the offset of the substrate 230.

Once the substrate 230 is placed in the support structure 200, the substrate 230 is fixed in the support structure 200 to prevent movement during subsequent processing. In some embodiments, an adhesive is used to secure the substrate 230 to the build platform 104 to provide additional adhesion between the substrate 230 and the underlying build platform 104 to help secure the substrate 230 to the underlying build platform 104 to reduce Movement during subsequent processing. In some embodiments, an adhesive is used to secure the substrate 230 to the support structure to provide additional bonding and reduce movement during subsequent processing. In addition, the support structure 200 can be fixed to the construction platform 104 by an adhesive to reduce the movement of the support structure 200 in the subsequent process. The adhesive may be a polyacrylate-based, polydimethylsiloxane or polyurethane-based adhesive.

In addition or as an alternative to adhesives, referring to FIGS. 2C-2D, 3 and 4, one or more anchors 220 are formed by the inkjet printing device 100. The anchor 220 is formed of one or more layers (for example, continuous layers 220a, 220b, etc.). After distributing each successive layer of the liquid precursor 105, it can be solidified by the first energy source 112 or the second energy source 110 to support subsequent layers of the liquid precursor 105.

The anchor 220 is formed on the base plate 230 and on the support structure 200 and/or the build platform 104. Specifically, the anchor 220 extends on the edge of the substrate 230 and is bonded to the surrounding undercover surface, for example, the top surface or the inclined surface of the support structure 200. The anchor 220 may be, for example, a point, a strip, or a frame along the edge of the base plate 230, and the anchor 220 connects the base plate 230 to the support structure 200. The anchor 220 may further reduce or prevent the substrate 230 from being displaced within the support structure 200 during subsequent processing (eg, subsequent inkjet printing processing).

The contact area and thickness of the anchor 220 on the substrate 230 should be small enough so that after the printing process is completed, the anchor can be peeled from the substrate without the risk of damage. For example, the width of the contact area may be between 0.5 and 2 mm, and the thickness of the anchor 220 may be 0.2 to 1 mm. The total contact area of the anchor may be less than 1% of the surface area of the substrate 230, such as less than 0.5%, such as less than 0.1%.

After the substrate 230 is anchored to the support structure 200, one or more printing layers 250 are formed by the inkjet printing apparatus 100. The printing layer 250 is formed of one or more layers (for example, continuous layers 250a, 250b, 250c, 250d, etc.). After distributing each successive layer of the liquid precursor 105, it can be solidified by the first energy source 112 or the second energy source 110 to support subsequent layers of the liquid precursor 105. The printing layer 250 may be, for example, a layer for passivation or encapsulation.

In some embodiments, the printing layer 250 used to form the device on the substrate 230 is formed of the same liquid precursor 105 used to form the support structure 200 and/or the anchor 220. In particular, the liquid precursor forming the printing layer 250 may be ejected from the same nozzle used for the support structure 200 and/or the anchor 220. This ensures that the previously performed alignment or alignment is maintained for the device on the substrate 230.

However, in some embodiments, the liquid precursor that is sprayed to form the printing layer 250 to form the device has a different composition than the liquid precursor that is sprayed to form the support structure 200 and/or the anchor 220. However, the danger here is that the different material properties of the liquid precursor will result in different ejection characteristics, such as speed, flight time, and angle. Therefore, using the same material for the printing layer 250 and the supporting structure 200 and/or the anchor 220 has higher reliability for alignment and alignment.

In some methods, the nozzles can be cleaned and then the same nozzles used for the support structure 200 and/or anchor 220 are cleaned. Alternatively, the liquid precursor for forming the printing layer 250 can be sprayed from different nozzle groups on the same print head 102 or different print heads on the same support 107, so that alignment or alignment-based alignment can be applied to different nozzle groups. The position of the support 107 is adjusted. However, the danger here is that different nozzles will have slightly different configurations, which in turn will affect the spray characteristics, such as speed, flight time, and angle. Therefore, the same nozzle is used for the printing layer 250 and the supporting structure 200 and/or the anchor 220, which has higher reliability for alignment and alignment.

The controller 150 and other computing device parts of the system described herein can be implemented by a digital electronic circuit system, or implemented by computer software, firmware, or hardware. For example, the controller may include a processor to execute a computer program such as stored in a computer program product (eg, in a non-transitory machine-readable storage medium). Computer programs (also called programs, software, software applications, or codes) can be written in any form of programming language, including compiled or interpreted languages, and can be deployed in any form, including as a stand-alone program or as a module, component, or subroutine , Or other units suitable for use in a computing environment.

The controller 150 and other computing device parts of the illustrated system may include non-transitory computer-readable media to store data objects, such as computer-aided design (CAD) compatible files. Which pattern should be used for identification of such files Deposit feed for each layer. For example, the data object may be an STL format file, a 3D manufacturing format (3MF) file, or a multilayer manufacturing file format (AMF) file. For example, the controller can receive data objects from a remote computer. The processor in the controller 150 (for example, controlled by firmware or software) can interpret the data objects received from the computer to generate the signal groups necessary for the components of the control device 100 to integrate the specified patterns of each layer.

4, the anchor 220 can be used to bond an array of individual dies 260 to a base substrate (eg, substrate 230) to form a reconstituted wafer 240, which has attached to its surface for subsequent processing Array of individual dies. Figures 5A-5H show various patterns and configurations for the anchor 220 (assumed to be a square die 260). The anchors can take various forms, such as continuous frames (see Figures 5A and 5B), points (see Figures 5C and 5D), strips (see Figures 5E-5H), or a combination of the above. The anchor 220 fixes the die 260 (for example, the substrate 230) to the underlying reconstituted wafer 240.

The size of the anchor 220 can be selected as needed to provide a desired degree of anchoring. For example, the anchor 220 may have a thin profile (as shown in FIG. 5E) to reduce the area on the substrate 230 occupied by the anchor 220 to promote peeling. Alternatively, when processing requires stronger anchoring, a configuration such as FIG. 5B or 5F may be used to anchor the substrate 230 to the support structure 200.

Although this document contains many specific implementation details, these details should not be construed as limitations on the scope of any specific embodiments of the present disclosure or the content that can be requested, but as features specific to specific embodiments of the specific invention. description of. Certain features described in the background content of individual specific embodiments in this document can also be combined and implemented in a single specific embodiment. In contrast, various features described in the background content of a single specific embodiment can also be implemented in multiple specific embodiments individually or in any suitable sub-combination. Furthermore, although the features above may be described as functioning in certain combinations and even initially claimed as such, one or more features from the claimed combination may in some cases be deleted from the combination and the claimed The combination of can be for sub-combination or sub-combination changes.

The shower head of Figure 1 includes several systems that allow the device 100 to construct objects. In some cases, the AM device includes a stand-alone operating system instead of a spray head, and the stand-alone operating system includes independently operating energy sources, distributors, and sensors. Each of these systems can be moved independently, and may or may not be part of the modular nozzle. In some examples, the print head includes only a dispenser, and the device includes a separate energy source to perform a fusing operation. Therefore, in these examples, the print head will cooperate with the controller to perform the dispensing operation.

Several specific embodiments have been described. Nevertheless, it will be understood that various modifications can be made. The various components of the sprinkler head described above, such as distributors, spreaders, sensing systems, heat sources and/or energy sources, can be installed on the overhead instead of in the nozzle, or installed on the supporting overhead Frame. Therefore, there are other specific embodiments within the scope of the patent application.

100: Inkjet printing equipment 102: print head 104: Build a platform 105: Liquid precursor 107: Support 110: second energy source 112: First Energy Source 114: Distributor 150: Controller 160: Sensor 200: supporting structure 200a: layer 200b: layer 200c: layer 200d: layer 202: Outer surface 204: inner surface 205: Bevel 206: bottom surface 208: top surface 210: Alignment mark 210a: layer 210b: layer 210c: layer 210d: layer 212: hole 220: anchor 220a: layer 220b: layer 230: substrate 240: Reconstruct the wafer 250: printing layer 250a: layer 250b: layer 250c: layer 250d: layer 260: Die

Fig. 1 is a schematic side view of an example of a build-up manufacturing process.

Figures 2A-2D are schematic side views of exemplary support structures.

Figure 3 is a perspective view of an exemplary support structure.

Figure 4 is a schematic top view of an example anchor die on a reconstituted wafer.

Figures 5A-5H are schematic top views of example anchoring patterns.

Domestic deposit information (please note in the order of deposit institution, date and number) no Foreign hosting information (please note in the order of hosting country, institution, date, and number) no

100: Inkjet printing equipment

102: print head

104: Build a platform

105: Liquid precursor

107: Support

110: second energy source

112: First Energy Source

114: Distributor

150: Controller

160: Sensor

Claims (30)

A method of printing on a substrate, including the following steps: Printing a support structure by printing the liquid precursor material and curing the liquid precursor material; Printing one or more alignment marks by printing the liquid precursor material outside the support structure and curing the liquid precursor material; Positioning a substrate in the supporting structure; Use the one or more alignment marks to align the substrate; and By printing and curing the liquid precursor material for alignment, one or more device structures are printed on the substrate. The method according to claim 1, wherein the substrate is circular, the support structure includes a circular hole, the substrate is fitted into the circular hole, and the alignment mark includes an alignment mark along the hole The center is a strip extending from radial segments that point together. According to the method of claim 1, the method further includes the steps of: capturing an image of the substrate and the alignment marks; determining a measurement position of the alignment marks according to the image; and The measurement position of the alignment marks is compared with a preset position of the alignment marks. According to the method of claim 3, the method further includes the steps of: determining a measurement position of the substrate according to the image, and comparing the measurement position of the substrate with a preset position of the substrate marks. According to the method of claim 4, the method includes the steps of: determining a transformation to be applied to the data of the structure to be printed on the substrate based on the comparisons, and applying the transformation to the data, and using the The converted data prints the device structures on the substrate. The method of claim 1, wherein the substrate includes a semiconductor wafer, and the device structures include passivation or packaging. A substrate alignment/alignment device, including: A droplet jet printer; and A controller configured to make the droplet jet printer: Printing a support structure by printing a liquid precursor material and curing the liquid precursor material, By printing the liquid precursor material outside the support structure and curing the liquid precursor material to print one or more alignment marks, After loading a substrate on the support structure, use the one or more alignment marks to align the substrate, and While anchoring and positioning the liquid precursor material by printing and curing, one or more device structures are printed on the substrate. The device according to claim 7, the device further comprising an optical sensor for capturing an image of the substrate, the support structure and the alignment mark, and wherein the controller is configured according to The image determines a measurement position of the alignment marks, and compares the measurement position of the alignment marks with a preset position of the alignment marks. The device according to claim 8, wherein the controller is configured to determine a measurement position of the substrate according to the image, and compare the measurement position of the substrate with a preset position of the substrate marks. The apparatus according to claim 9, wherein the controller includes the steps of: determining a transformation to be applied to the data of the structure to be printed on the substrate based on the comparisons, and applying the transformation to the data, and The droplet jet printer uses the converted data to print the device structures on the substrate. A method of printing on a substrate, including the following steps: Printing a support structure by printing a liquid precursor material and curing the liquid precursor material; Printing one or more alignment marks by printing the liquid precursor material outside the support structure and curing the liquid precursor material; Positioning a substrate in the supporting structure; Use the one or more alignment marks to align the substrate; Fixing the substrate to the support structure by printing and curing the liquid precursor material to print one or more anchors on the substrate and the support structure; and While anchoring and positioning the liquid precursor material by printing and curing, one or more device structures are printed on the substrate. The method of claim 11, wherein the substrate includes a semiconductor wafer, and the device structures include passivation or packaging. A method of printing a structure on a reconstituted wafer, including the following steps: Positioning a plurality of semiconductor dies on a supporting substrate; By printing a plurality of anchors extending across the edges of the semiconductor dies onto the support substrate, the plurality of semiconductor dies are anchored to the support substrate to form a reconstituted wafer, Wherein printing the plurality of anchors includes spraying a droplet of a liquid precursor material and curing the liquid precursor material; and By spraying and curing the liquid droplets of the liquid precursor material, one or more device structures are printed on the plurality of semiconductor dies while being anchored on the supporting substrate. The method according to claim 13, the method comprising the steps of: printing a support structure on a printing platform by spraying and curing droplets of the liquid precursor material, and loading the support wafer on the support structure . According to the method of claim 14, the method includes the following steps: when the supporting wafer is on the supporting structure, placing the plurality of semiconductor dies on the supporting wafer. The method according to claim 14, wherein the substrate is circular, the supporting structure includes a circular hole, and the substrate is fitted in the circular hole. The method according to claim 14, the method comprising the following steps: anchor the supporting wafer by printing at least one second anchor extending across an edge of the supporting wafer onto the supporting structure Fixed to the support structure. The method according to claim 13, the method comprising the following steps: anchor the supporting wafer by printing at least one second anchor extending across an edge of the supporting wafer on the build platform Set to a build platform. The method according to claim 13, wherein for at least one of the plurality of semiconductor dies, the anchor includes a frame extending around a periphery of the die, or a plurality of spaced apart strips. The method according to claim 13, wherein the device structures include passivation or encapsulation. A system for printing a structure on a reconstructed wafer, the system including: A stand for holding the reconstructed wafer with a supporting substrate and a plurality of dies on the supporting substrate; A droplet jet printer; and A controller configured to make the droplet jet printer: By spraying a droplet of a liquid precursor material and solidifying the liquid precursor material to anchor the plurality of semiconductor dies to the supporting wafer, the plurality of semiconductor dies extending across the edges of the semiconductor dies The anchor is printed on the support substrate, and By spraying and curing the liquid droplets of the liquid precursor material, one or more device structures are printed on the plurality of semiconductor dies while being anchored on the supporting substrate. A method of printing on a substrate, including the following steps: Printing a support structure by printing a liquid precursor material and curing the liquid precursor material; Positioning a substrate in the supporting structure; Fixing the substrate to the support structure by printing and curing the liquid precursor material to print one or more anchors on the substrate and the support structure; and While anchoring is performed by printing and curing the liquid precursor material, one or more device structures are printed on the substrate. The method of claim 22, wherein the anchors extend across an edge of the substrate. The method according to claim 23, wherein the anchors include points, strips or frames. The method of claim 23, wherein the substrate includes a semiconductor wafer, and wherein the device structures include passivation or packaging. A substrate alignment/alignment device, including: A droplet jet printer; and A controller configured to make the droplet jet printer: Printing a support structure by printing a liquid precursor material and curing the liquid precursor material, Fixing the substrate to the support structure by printing and curing the liquid precursor material to print one or more anchors on the substrate and the support structure, and While anchoring and positioning the liquid precursor material by printing and curing, one or more device structures are printed on the substrate. The apparatus of claim 26, wherein the controller is configured to cause the droplet jet printer to print an anchor extending on an edge of the substrate. The apparatus of claim 27, wherein the controller is configured to cause the droplet jet printer to print anchors including dots, strips, or frames. A method of printing on a substrate, including the following steps: Printing a support structure by printing a liquid precursor material and curing the liquid precursor material, wherein the support structure is an annular body with a hole, and the substrate is assembled into the hole; Positioning a substrate in the hole in the support structure; and While anchoring and positioning the liquid precursor material by printing and curing, one or more device structures are printed on the substrate. The method according to claim 29, wherein the supporting structure includes a chamfered surface for loading the substrate.

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