TW202116704A - Method for molding a ceramic material and molding apparatus thereof - Google Patents

Abstract

A method for molding a ceramic material comprises the following steps: providing a ceramic slurry comprising a ceramic powder and a solvent; laying the ceramic slurry; irradiating and heating a specific region on the ceramic slurry with a first laser light to perform a first molding process on the specific region; irradiating and heating the specific region on the ceramic slurry with a second laser light to perform a second molding process on the specific region of the ceramic slurry to form a ceramic green body. Wherein, the power of the first laser light is less than or equal to the power of the second laser light. The method of the present invention improves the structural stability and surface fineness of the molded ceramic slurry, the uniformity of the layer thickness during three-dimensional printing and the bonding strength in the layer. The present invention also provides a molding apparatus for a ceramic material that implements the molding method.

Description

Ceramic material forming method and forming equipment

The invention relates to a material forming method and forming equipment, in particular to a method and equipment for forming ceramic materials using three-dimensional printing technology.

Ceramics is an inorganic material with a history of more than a thousand years. However, its hard and brittle characteristics make it difficult to process and shape ceramic materials. The traditional ceramic preparation process can only produce products with simple three-dimensional shapes, and the production cost is high and the cycle is long. However, with the rapid development of 3D printing technology, the formation of ceramic materials can also be achieved by 3D printing technology.

At present, ceramic three-dimensional printing technology can be divided into ink-jet printing (IJP), fused deposition modeling (FDM), laminated object manufacturing (LOM), and selection Selective laser sintering technology (selective laser sintering, SLS) and three-dimensional light curing technology (stereo lithography appearance, SLA). The ceramic body obtained by three-dimensional printing using the above-mentioned technologies can be finished ceramic products after high temperature degreasing and sintering.

Among them, the three-dimensional light curing technology (SLA) uses a ceramic slurry containing an ultraviolet photosensitive resin as a bonding agent to adhere ceramic powder. However, during the high-temperature sintering process, the photosensitive resin is carbonized due to the high temperature, and the carbonization temperature of the photosensitive resin is lower than the sintering temperature of the ceramic powder. Furthermore, before the sintering of the ceramic powder, the photosensitive resin is burned out, resulting in the ceramic slurry The receipt The shrinkage rate is increased, and it is easy to cause the deformation of the ceramic product. In addition, when the photosensitive resin is burned off, a gas harmful to the human body is generated.

The prior art uses high-power fiber lasers or carbon dioxide lasers to heat the ceramic slurry to cure the ceramic slurry. However, this curing method loosens the ceramic structure and causes the ceramic surface to be rough. Therefore, there are issues that must be improved.

In view of this, one of the scopes of the present invention is to provide a method for forming ceramic materials, which includes the following steps: providing a ceramic slurry, which contains ceramic powder and a solvent; laying the ceramic slurry; irradiating and heating the ceramic slurry with a first laser light The specific area on the material, so that the ceramic slurry in the specific area undergoes the first forming process; the second laser light is used to irradiate and heat the specific area on the ceramic slurry, so that the ceramic slurry in the specific area undergoes the second forming process, In turn, ceramic green embryos are formed. Wherein, the power of the first laser light is less than or equal to the power of the second laser light.

Among them, the step of laying the ceramic slurry further includes the following sub-steps: laying the ceramic slurry on the material placing part of the ceramic material molding equipment.

Wherein, after the step of irradiating and heating a specific area on the ceramic slurry with the second laser light, so that the ceramic slurry in the specific area undergoes the second forming process, and then forming the ceramic green embryo, it further includes a step: removing unformed Ceramic slurry.

Among them, the step of the first forming process further includes the following steps: irradiating a specific area of the ceramic slurry with the first laser light, so that the ceramic slurry in the specific area undergoes a chemical reaction to release water molecules; The light is applied to heat the water molecules, so that the water molecules evaporate from the ceramic slurry. In the step of the second forming process, it further includes the following steps: irradiating a specific area of the ceramic slurry with a second laser light so that the ceramic slurry in the specific area is not chemically reacted. React and release water molecules; heat the water molecules with the second laser light so that the water molecules evaporate from the ceramic slurry to form a ceramic green embryo. Wherein, the output of water molecules in the first forming process is greater than the output of water molecules in the second forming process, and the chemical reaction includes at least one of a hydrolysis reaction, a condensation reaction, and a polymerization reaction.

Among them, after heating and evaporation with the first laser light, the water content of the ceramic slurry in a specific area is less than the water content of the ceramic slurry before heating and evaporation, and the water content of the ceramic slurry after heating and evaporation with the first laser light is within 6% To 15%.

Among them, after heating and evaporation with the second laser light, the water content of the ceramic slurry in a specific area is less than the water content of the ceramic slurry before heating and evaporation with the second laser light, and the content of the ceramic slurry after heating and evaporation with the second laser light The amount of water is between 1% and 5%.

Wherein, the power range of the first laser light is between 1 to 10 watts (W). The power range of the second laser light is between 5 to 40 watts (W).

Wherein, the wavelength of the first laser light is the same as the wavelength of the second laser light, and the wavelength range is between 1500 and 20000 nm.

Among them, the particle size of the ceramic powder is between 50 and 50,000 nm.

Another category of the present invention is to provide ceramic material molding equipment for three-dimensional printing. The molding equipment includes a lifting device, a feeding device and a laser device. The lifting device has a material placing part and a lifting part. The material placement part is used to provide an area where the ceramic slurry is placed. The lifting component is coupled to the material placing component, and the lifting component is used to raise or lower the material placing component. The feeding device is arranged above the feeding part, and the feeding device is used for supplying ceramic slurry to the feeding part. The laser device is arranged above the lifting device, and the laser device is used to emit the first laser light and the second laser light of different powers to irradiate and heat the ceramic slurry. Among them, the laser device can control the first laser light and the second laser light The moving path of the light, so that the moving paths of the first laser light and the second laser light can be adjusted corresponding to the material placement part, so that the first laser light and the second laser light emitted by the laser device are directed to the ceramic paste in a specific area Irradiation and heating.

Compared with the prior art, the ceramic material molding method of the present invention utilizes at least two-stage laser light irradiation to successively remove water in the ceramic slurry, and then polymerize nano-ceramic powder. The molding method of the present invention has the following advantages: 1. The water in the ceramic slurry is removed successively, which means that the solid content of the ceramic slurry is increased successively, thereby avoiding the removal of the water in the ceramic slurry at one time and causing unpolymerized The ceramic powder spatters as the water evaporates, which in turn leads to the problem of loose structure of the solidified ceramic green embryo. 2. The water in the ceramic slurry is successively removed to gradually increase the solid content of the ceramic slurry, which can improve the surface fineness of the finished ceramic green embryo. 3. Since the fineness of the single-layer surface is improved, the thickness of the laying can be made uniform when laying the next layer of ceramic slurry, thereby improving the structural stability of the solidified ceramic green embryo. 4. Gradually increasing the power of the laser light can ensure that the ceramic slurry is heated evenly, so that the ceramic powder agglomerates and has a uniform density, thereby increasing the bonding strength within the single layer of the solidified ceramic green embryo.

E‧‧‧Material board

1‧‧‧Ceramic Paste

11‧‧‧Ceramic powder

12‧‧‧Solvent

2‧‧‧Ceramic green embryo

3‧‧‧Forming equipment

31‧‧‧Lifting device

311‧‧‧Material parts

312‧‧‧Lifting parts

32‧‧‧Feeding device

33‧‧‧Laser device

331‧‧‧First laser beam

332‧‧‧Second laser beam

34‧‧‧Scraper

S1-S63‧‧‧Step

S21-S42‧‧‧Substep

Fig. 1 is a schematic diagram of a ceramic slurry in a one-stage process combined according to the prior art.

Fig. 2 is a flow chart of the steps of a ceramic material forming method according to a specific embodiment of the present invention.

FIG. 3 is a flowchart of steps according to a further specific embodiment of FIG. 2.

FIG. 4 is a schematic diagram of the flow according to FIG. 2.

Fig. 5 is a flow chart of the steps of a method for forming a ceramic material according to another embodiment of the present invention.

Fig. 6 is a schematic diagram of a device for forming a ceramic material according to a specific embodiment of the present invention.

Fig. 7 is a schematic diagram of the action of a ceramic material molding equipment according to a specific embodiment of the present invention.

Fig. 8 is a schematic diagram of the action of a ceramic material molding equipment according to another embodiment of the present invention.

In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following embodiments will be used for detailed and discussion with reference to the accompanying drawings. It should be noted that these examples are only representative examples of the present invention. However, it can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

The terms used in the various embodiments disclosed in the present invention are only used for the purpose of describing specific embodiments, and are not intended to limit the various embodiments disclosed in the present invention. The singular form as used herein also includes the plural form, unless the upper and lower are clearly indicated otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meaning as commonly understood by those of ordinary skill in the art to which the various embodiments disclosed in the present invention belong. The above-mentioned terms (such as those defined in commonly used dictionaries) will be interpreted as having the same meaning as the contextual meaning in the same technical field, and will not be interpreted as having idealized or overly formal meanings, Unless clearly defined in the various embodiments disclosed in the present invention.

In the prior art, a method for heating ceramic slurry with laser light can be combined. The method for forming ceramic materials is to heat the ceramic slurry with high-power fiber lasers or carbon dioxide lasers to cure the ceramic slurry, but it is easy to cure the ceramic slurry. The resulting ceramic green embryo has a loose structure and rough surface. Please refer to FIG. 1. FIG. 1 is a schematic diagram of a ceramic slurry 1 of a one-stage process combined according to the prior art. As shown in Figure 1, if a one-stage process is used, the reason for these problems is that the one-stage process is to instantly raise the solvent 12 in the ceramic slurry 1 on the placement plate E to the vaporization temperature at room temperature. This will cause the solvent 12 to sputter the unpolymerized ceramic powder 11 during the process of vigorous movement to evaporation, which will cause the surface of the ceramic green body 2 to become rough. The rough surface will cause uneven laying thickness of the next layer of ceramic slurry 1, and the resulting ceramic green embryo 2 will have poor structural stability. In addition, the higher the temperature of the nano-level ceramic powder 11 is, the higher the agglomeration density of the nano-level ceramic powder 11 is, and vice versa. In practical applications, the laser light power density will be the highest at the center of the laser beam, and it will decrease as the radius from the center increases, showing a Gaussian distribution. When the high-power laser light instantly heats the surface of the ceramic slurry 1, the energy of the laser light received by the surface layer of the ceramic slurry 1 gradually decreases toward the bottom layer. Therefore, when the temperature gradient between the surface layer and the bottom layer is too large, the agglomerated density of the ceramic powder 11 will decrease from the surface layer to the bottom layer, which will cause uneven bonding strength in the layer and cause delamination problems after molding.

In view of the above-mentioned problems, the present invention proposes a ceramic material molding method, which solves the above problems through a multi-stage manufacturing process. Please refer to FIG. 2. FIG. 2 is a flow chart of the steps of a ceramic material forming method according to a specific embodiment of the present invention. As shown in FIG. 2, in the specific embodiment of FIG. 2, the method for forming ceramic materials includes the following steps: Step S1: Provide ceramic slurry, which includes ceramic powder and solvent; Step S2: Lay the ceramic slurry; Step S3 : Irradiate and heat a specific area on the ceramic slurry with the first laser light, so that the ceramic slurry in the specific area undergoes the first forming process; Step S4: irradiate and heat the specific area on the ceramic slurry with the second laser light, The ceramic slurry in the specific area is subjected to the second molding process to form a ceramic green embryo. Wherein, the power of the first laser light is less than or equal to the power of the second laser light.

3 and FIG. 4 are further combined. FIG. 3 is a flow chart of a further specific embodiment according to FIG. 2, and FIG. 4 is a schematic flow chart of the flow according to FIG. 2. The embodiment of FIG. 3 is a further description of the first forming procedure and the second forming procedure in the embodiment of FIG. 2. The first molding package It includes the following steps: irradiating a specific area of the ceramic slurry 1 placed on the plate E with a first laser light, so that the ceramic slurry 1 in the specific area undergoes a chemical reaction to release water molecules; heating with the first laser light Water molecules, so that the water molecules evaporate from the ceramic slurry 1. The second forming process includes the following steps: irradiating a specific area of the ceramic slurry 1 with a second laser light so that the ceramic slurry 1 in the specific area that has not undergone a chemical reaction undergoes a chemical reaction and releases water molecules; The laser light heats the water molecules so that the water molecules evaporate from the ceramic slurry 1 to form a ceramic green embryo 2. Among them, the output of water molecules in the first forming process is greater than the output of water molecules in the second forming process.

As shown in Figures 3 and 4, the molding method of the present invention first irradiates and heats the ceramic slurry 1 in a specific area with a lower power first laser light, so that the ceramic slurry 1 undergoes a chemical reaction and releases water molecules. . Then, the water molecules can be heated by the first laser light to evaporate, so as to further remove the water molecules in the ceramic slurry 1. The ceramic powder 11 in the ceramic slurry 1 after being heated by the first laser light still remains in a suspended state. Then, a second laser light with higher power is used to heat the ceramic slurry 1 in a specific area, so that the ceramic slurry 1 that has not undergone a chemical reaction in the ceramic slurry 1 undergoes a chemical reaction and releases water molecules. Then, the second laser light is used for heating to evaporate the water molecules in the ceramic slurry 1. In detail, in the ceramic slurry 1 used in the present invention, the solvent 12 further includes nano-metal oxide and an organic solvent, which can be irradiated by the first laser light and the second laser light to generate hydrolysis. Sol-gel method of reaction and condensation reaction. Therefore, the ceramic slurry 1 of the present invention releases water molecules through the condensation reaction. The molding method of the present invention adopts a sol-gel method to allow the ceramic powder 11 in the ceramic slurry 1 to be covered by gel and to bond the ceramic powder 11 to each other, thereby improving the mechanical strength of the ceramic green embryo 2. In addition, it should be particularly noted that the ceramic slurry 1 used in the ceramic material molding method of the present invention can undergo a sol-gel reaction by the irradiation of the first laser light and the second laser light. However, in a specific implementation In the example, when the first laser light and the second laser light are irradiated with When heated, the sol-gel reaction will accelerate the reaction due to the heating of the first laser light and the second laser light. Therefore, the chemical reaction in the ceramic material molding method of the present invention may include the irradiation of the first laser light and the second laser light, and the irradiation and heating of the first laser light and the second laser light.

Since the first forming process is to chemically react most of the ceramic slurry 1 first, the ceramic slurry 1 that has not undergone chemical reaction is then completely formed by the second forming process, so as to avoid the ceramic slurry 1 still containing unformed materials. The ceramic slurry 1 of the new type reduces the structural strength of the ceramic green embryo 2. Therefore, the molecular weight of water released by the chemical reaction of the ceramic slurry 1 in the first forming process is greater than the molecular weight of water released by the chemical reaction of the ceramic slurry 1 in the second forming process.

This method irradiates and heats the ceramic slurry 1 by increasing the laser light power successively, so that the water content of the ceramic slurry 1 is gradually reduced, that is, the solid content of the ceramic slurry 1 is gradually increased to avoid splashing of the ceramic powder 11 In order to improve the surface fineness of the ceramic green embryo 2 Increasing the power of the laser light successively to irradiate and heat can avoid the problem of uneven agglomeration density of the ceramic powder 11 on the surface and the bottom of the ceramic slurry 1 due to the high temperature difference in the layer, thereby improving the bonding within the layer. strength.

The method of the present invention can also be applied to three-dimensional printing of ceramic materials. Please refer to FIG. 5. FIG. 5 is a flow chart of the steps of a method for forming a ceramic material according to another embodiment of the present invention. As shown in FIG. 5, step S2 further includes a sub-step: sub-step S21: laying ceramic slurry on the material placing part of the ceramic material molding equipment. After step S4, there is a step S5: removing unformed ceramic slurry. As shown in FIG. 5, the specific embodiment of FIG. 5 is based on the process steps of FIG. 2 and further performs a lamination process. After step S4, the following steps are further included: Step S61: Laying ceramic slurry on a ceramic slurry molding On a specific area to form the nth layer of ceramic Slurry; Step S62: irradiate and heat the n-th specific area on the n-th layer of ceramic slurry with the first laser light so that the n-th layer of ceramic slurry in the n-th specific area undergoes the first forming procedure; Step S63: Two laser lights irradiate and heat the n-th specific area on the n-th layer of ceramic slurry 1 so that the n-th layer of ceramic slurry 1 in the n-th specific area undergoes a second molding process, thereby forming the n-th layer of ceramic green embryo 2. Wherein, n is an integer greater than or equal to 2. Furthermore, the specific embodiment of FIG. 4 is to repeat the two-stage process for three-dimensional printing, and after the three-dimensional printing is completed, step S5 is performed to remove the unformed ceramic slurry.

In addition to the specific embodiment in FIG. 5 above, there is another specific embodiment, which is roughly the same as the specific embodiment in FIG. After the slurry is first removed, the next layer of ceramic slurry can be laid to ensure that the unformed ceramic slurry will not be irradiated and heated by the first laser light and the second laser light of the next layer, and the ceramic in the non-specific area will not be affected. The slurry solidifies. Wherein, in this specific embodiment, during three-dimensional printing, the cured ceramic paste in the n-th specific area in the n-th layer can be the same as the cured ceramic paste in the n-1-th specific area in the n-1 layer. Connected, the connected area can be a part of the n-th specific area and a part of the n-1th specific area, thereby obtaining a three-dimensional ceramic green embryo. Wherein, the nth specific area can be greater than, equal to, or smaller than the n-1th specific area.

In the above specific embodiments, the solid content of the unheated ceramic slurry is between 50% and 80%, that is, the water content of the ceramic slurry is between 20% and 50%. In a specific embodiment, after the first laser light is irradiated and heated, the water content in the ceramic slurry will be less than the water content of the ceramic slurry that has not been irradiated and heated. In a preferred embodiment, after the first laser light is irradiated and heated, the water content in the ceramic slurry is between 6% and 15%. In a more preferred embodiment, after the first laser light is irradiated and heated, the water content of the ceramic slurry is between 10% and 15%.

In a specific embodiment, after the second laser light is irradiated and heated, the water content in the ceramic slurry will be less than the water content of the ceramic slurry before the second laser light is irradiated and heated. In a preferred embodiment, after the second laser light is irradiated and heated, the water content in the ceramic slurry is between 1% and 5%.

In addition, the ceramic material molding method of the present invention uses a two-stage successive irradiation and heating method. However, it should be understood that those skilled in the art can use more stages of successive irradiation and heating to achieve the same level as this case. The same effect is not limited to the second stage. For example, in one embodiment, the first laser light of 10 watts (W) is used to irradiate and heat, then the second laser light of 20 watts (W) is used to irradiate and heat the ceramic slurry, and finally 40 watts ( The third laser light of W) irradiates and heats the ceramic slurry to form a ceramic green embryo. In yet another embodiment, the ceramic slurry is irradiated and heated by the first laser light of 10 watts (W) twice, and then the ceramic slurry is irradiated and heated by the second laser light of 35 watts (W) to form Ceramic green embryo.

In addition, the reason why this method does not use a higher solid content ceramic slurry for molding is that if the water content of the ceramic slurry is too low, it is easy to agglomerate the ceramic powder in the ceramic slurry and cannot be uniformly dispersed in the solvent. In this way, the structural stability of the formed ceramic green embryo is poor. Moreover, when the ceramic slurry with a lower solid content is heated and formed in one stage, the temperature will rise instantaneously and the structure will be loose and the surface of the ceramic green body will be rough. In addition, the viscosity of ceramic slurry with higher solid content is too high, which is not conducive to flow to leveling, and it is easy to contain bubbles.

The ceramic powder of the ceramic slurry includes at least one of silicon dioxide particles, silicon carbide particles, silicon nitride particles, titanium dioxide particles, zirconium dioxide particles, and aluminum oxide particles. The ceramic powder can be of nanometer grade, with a particle size between 50 and 50,000 nm. In addition, in addition to ceramic powder and solvent, the ceramic slurry can also be added with copolymer materials to improve the The adhesion strength of the ceramic green embryo. Copolymer materials include polylactic acid (PLA), poly-L/D-lactide (PLDLA), polyvinyl alcohol (PVA), chitosan (Chitosan), sodium alginate (Alginate acid), gelatin (Gelatin) and polyethylene glycol (poly(ethylene oxide), PEG), etc.

In the above specific embodiments, the wavelength of the first laser light and the second laser light are the same, and the wavelength range is approximately between 1500 to 20000 nm, and the light source types of the first laser light and the second laser light include carbon dioxide lasers. Nd: YAG laser, He-Cd laser, argon laser, UV laser. Those skilled in the art can select the type of laser light source required according to requirements or existing equipment conditions, and it is not limited to this. In addition, the power of the first laser light is between 1 and 10 watts (W). In one embodiment, the implementation speed is between 30 and 500 mm/s. In a preferred embodiment, the implementation speed is between 30 and 500 mm/s. Between 30 and 300mm/s. The power of the second laser light is between 5 and 40 watts (W). In one embodiment, the implementation speed is between 100 and 1000 mm/s, and in a preferred embodiment, the implementation speed is between 100 To 600mm/s. It should be understood that those skilled in the art can adjust the implementation speed of the first laser light and the second laser light according to the thickness of the ceramic slurry to be heated, and it is not limited thereto.

Please refer to FIGS. 6 to 8. FIG. 6 is a schematic diagram of a ceramic material molding apparatus 3 according to a specific embodiment of the present invention, and FIG. 7 is an action of a ceramic material molding apparatus 3 according to a specific embodiment of the present invention Schematic diagram, FIG. 8 is a schematic diagram of the action of a ceramic material molding device 3 according to another embodiment of the present invention. As shown in Figs. 6 to 8, the ceramic material molding method of the present invention can be implemented by the following molding device 3, and the molding principle is the same as the foregoing molding method, and will not be repeated here. The molding equipment 3 includes a lifting device 31, a feeding device 32 and a laser device 33. The lifting device 31 has a material placing part 311 and a lifting part 312. The material placement part 311 is used to provide The area where the ceramic slurry 1 is placed. The lifting component 312 is coupled to the material placing component 311, and the lifting component 312 is used to raise or lower the material placing component 311. The feeding device 32 is arranged above the feeding part 311, and the feeding device 32 is used to provide the ceramic slurry 1 to the feeding part 311. The laser device 33 is disposed above the lifting device 31, and the laser device 33 is used to emit different powers of the first laser light 331 and the second laser light 332 to irradiate and heat the ceramic slurry 1. Wherein, the laser device 33 can control the moving paths of the first laser light 331 and the second laser light 332, so that the moving paths of the first laser light 331 and the second laser light 332 can be adjusted corresponding to the material placing part 311, so that the laser light The first laser light 331 and the second laser light 332 emitted by the radiation device 33 irradiate and heat the ceramic slurry 1 in a specific area. In practical applications, the laser device 33 uses the movement of the galvanometer to move the first laser light 331 and the second laser light 332 emitted by the laser light source of the laser device 33 to a specific area. In one embodiment, the molding equipment 3 may include more than one laser device 33 to provide the first laser light 331 and the second laser light 332 with different powers, respectively. In yet another embodiment, the laser device 33 may include more than one laser light source to provide the first laser light 331 and the second laser light 332 with different powers, respectively.

In addition, in order to ensure that the ceramic slurry 1 is laid evenly, a scraper 34 can be included to smooth the surface of the ceramic slurry 1 after laying. As shown in FIG. 7, the feeding device 32 lays the ceramic slurry 1 on the material placing part 311, and then uses the scraper 34 to scrape the surface of the ceramic slurry 1 to the same height. Then, the laser device 33 emits the first laser light 331 and the second laser light 332 to the ceramic slurry 1 in sequence to irradiate the ceramic slurry 1 and cause a chemical reaction to proceed. Among them, the first laser light 331 and the second laser light 332 are also heated during the irradiation process, and the water molecules released by the chemical reaction of the ceramic slurry 1 are evaporated, so that the ceramic slurry 1 is formed into a ceramic green embryo 2 .

As shown in FIG. 8, when three-dimensional printing of ceramic materials is to be performed, the lifting device 31 can be lowered to a specific height, so that the feeding device 32 can stack the n-th layer of ceramic on the formed ceramic green embryo 2 Slurry 1, and then repeat the steps described in the embodiment of FIG. 7 to form the n-th layer of ceramic slurry 1 into the n-th layer of ceramic green embryo 2.

Compared with the prior art, the ceramic material molding method and molding equipment of the present invention are used for more than two laser light irradiation and heating. The same or different laser light power can be used for irradiation and heating according to the design of the product. To control the strength change, fineness or surface roughness of ceramic products. Among them, the low-power first laser light can avoid the problem of surface material splashing in the prior art, and at the same time can avoid the large surface pores. However, because the low-power first laser light energy is not enough to completely shape the ceramic slurry in a single irradiation and heating stage, in order to completely shape the ceramic slurry, the low-power first laser light can be irradiated and heated multiple times. Heating, or irradiating and heating with high-power second laser light after one or more irradiations and heating of the first laser light. In summary, the molding method of the present invention can improve the structural stability and surface fineness of the cured ceramic green, as well as the uniformity of the layer thickness and the bonding strength within the layer during three-dimensional printing. In addition, the molding equipment of the present invention can perform the molding preparation of large objects.

Through the detailed description of the above specific embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the specific embodiments disclosed above. On the contrary, the purpose is to cover various changes and equivalent arrangements within the scope of the patent for which the present invention is intended.

S1-S5‧‧‧Step

Claims (10)

A method for forming ceramic materials includes the following steps: Provide a ceramic slurry, which includes a ceramic powder and a solvent; Laying the ceramic slurry; Irradiating and heating a specific area on the ceramic slurry with a first laser light, so that the ceramic slurry in the specific area undergoes a first forming process; and Irradiating and heating the specific area on the ceramic slurry with a second laser light, so that the ceramic slurry in the specific area undergoes a second molding process to form a ceramic green embryo; Wherein, the power of the first laser light is less than or equal to the power of the second laser light. According to the method for forming ceramic materials as described in item 1 of the scope of patent application, the step of laying the ceramic slurry further includes a sub-step: Laying the ceramic slurry on a material placement part of a ceramic material molding equipment. The method for forming ceramic materials as described in the first item of the scope of patent application, wherein the second laser light is used to irradiate and heat the specific area on the ceramic slurry, so that the ceramic slurry in the specific area performs the first The second forming process, and after the step of forming the ceramic green embryo, further includes a step: Remove the unformed ceramic slurry. According to the method for molding ceramic materials described in the first item of the scope of patent application, the steps of the first molding procedure further include the following steps: Irradiating the specific area of the ceramic slurry with the first laser light, so that the ceramic slurry in the specific area undergoes a chemical reaction to release water molecules; and The water molecules are heated by the first laser light, so that the water molecules evaporate from the ceramic slurry hair; In the steps of the second molding process, the following steps are further included: Irradiate the specific area of the ceramic slurry with the second laser light, so that the ceramic slurry in the specific area that has not undergone a chemical reaction chemically reacts and release water molecules; and heat the water with the second laser light Molecules, so that the water molecules evaporate from the ceramic slurry to form the ceramic green embryo; Wherein, the output of the water molecules in the first forming process is greater than the output of the water molecules in the second forming process, and the chemical reaction includes at least one of a hydrolysis reaction, a condensation reaction, and a polymerization reaction. According to the method for forming ceramic material described in item 4 of the scope of patent application, after heating and evaporating with the first laser light, the water content of the ceramic slurry in the specific area is less than the water content of the ceramic slurry before heating and evaporation, The water content of the ceramic slurry after being heated and evaporated by the first laser light is between 6% and 15%. According to the method for forming a ceramic material according to item 4 of the scope of patent application, wherein after the second laser light is heated and evaporated, the water content of the ceramic slurry in the specific area is less than that of the ceramic before the second laser light is heated and evaporated The water content of the slurry, the water content of the ceramic slurry after being heated and evaporated by the second laser light, is between 1% and 5%. The method for forming ceramic materials as described in the first item of the scope of patent application, wherein the power range of the first laser light is between 1 and 10 watts (W), and the power range of the second laser light is between 5 and 40 Between watts (W). According to the method for forming a ceramic material as described in item 1 of the scope of patent application, the wavelength of the first laser light is the same as the wavelength of the second laser light, and the wavelength range is between 1500 and 20000 nm. According to the method for molding ceramic materials described in the first item of the scope of patent application, the particle size of the ceramic powder is between 50 and 50,000 nm. A ceramic material molding equipment used in three-dimensional printing. The molding equipment includes: A lifting device having a material placing part and a lifting part, the material placing part is used to provide a ceramic slurry placement area, the lifting part is coupled to the material placing part, the lifting part is used to raise or lower The material placement part; A feeding device, which is arranged above the feeding part, and the feeding device is used to provide a ceramic slurry to the feeding part; and A laser device arranged above the lifting device, the laser device being used to emit a first laser light and a second laser light of different powers to irradiate and heat the ceramic slurry; Wherein, the laser device controls the moving paths of the first laser light and the second laser light, so that the moving paths of the first laser light and the second laser light can be adjusted corresponding to the material placement part, so that the laser The first laser light and the second laser light emitted by the radiation device irradiate and heat the ceramic slurry in the specific area.

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