TW202116204A - A bonding method for an adhesive with a substrate - Google Patents

Abstract

The present invention discloses an adhesive-covered substrate including an adhesive with polar medium and a substrate. Among this, at least one of the polar medium and the adhesive can be heated and liquefied via an activated means, so as to a substrate surface of the substrate is adhered to a colloidal surface of the adhesive. Similarly, the substrate surface can be separated from the colloidal surface in response to the activated means. Thereby, the adhesive can be repeatedly adhered to or separated from the substrate.

Description

Combination method of hot melt glue and substrate

The present invention provides a substrate with a hot melt adhesive and a method for combining the same, especially a hot melt adhesive with a polar medium, and at least one of the polar medium and the hot melt adhesive is activated by an activation means, The hot-melt glue is combined with the substrate.

With the vigorous development of the manufacturing industry, how to apply hot melt adhesives to substrates in different industries in order to simplify processes, automate production and reduce costs has become an important issue for the development of various industries.

However, in various industries, when the hot-melt adhesive is actually bonded to the substrate, it is found that different material characteristics will severely limit the application range and method of the conventional hot-melt adhesive. In detail, when the conventional hot-melt adhesive is heated by the conventional heating method, the substrate combined with the hot-melt adhesive, such as shoe material or upper, will be damaged due to high temperature. In addition, due to the structural factors of the material or the substrate as a whole, the conventional hot-melt adhesive cannot be heated smoothly. So far, it has not been possible to introduce the hot-melt adhesive in large quantities in different industries for implementation.

As far as the shoe industry is concerned, the traditional shoemaking process is very cumbersome and complicated, and the applied substrates include at least the middle fork, parts, midsole, outsole, upper or other accessories, etc. , All have to rely on a lot of manpower to apply glue and assemble. Taking sports shoes as an example, they at least include assembly accessories such as outsole, midsole and upper, and a lot of manual processing and multiple processes are required during assembly, such as roughing and cleaning. Procedures such as applying treatment agent, drying, drying after applying glue several times, and laminating can only be completed smoothly, which is extremely time-consuming, laborious and costly.

Moreover, most of the substrates used in shoe bodies are soft materials or irregular shapes. Even though the automation machinery technology has made great progress today, it is still unable to overcome the difficulty of assembling the above-mentioned various substrates with a robotic arm, and therefore fails to make shoes. The process can be automated, so that the overall production capacity cannot be increased and the cost can be effectively reduced.

Furthermore, the conventional shoemaking process mostly uses liquid glue and treatment agent, which contains Volatile Organic Compounds (VOC). The toxic compounds in volatile organic compounds seriously endanger the natural environment and human health. Therefore, they are about to face potential environmental protection issues that must be banned in the future.

In view of this, for how to apply hot melt adhesives to various industries, it is still necessary to design a novel and convenient process combination method and a substrate with hot melt adhesives to solve the problems caused by the application of the aforementioned conventional technologies. The missing.

The purpose of the present invention is to provide a substrate with hot melt adhesive and a bonding method thereof, so as to achieve automated production and increase productivity, while effectively reducing costs and considering environmental issues.

The hot melt adhesive of the present invention can be repeatedly liquefied by activation means and then be liquefied on multiple substrates, or can be disassembled and separated by activation means, that is, multiple substrates can be repeatedly liquefied by activation means Then or liquefy and separate from each other, as long as the temperature of the hot melt gel reaches the melting point temperature through activation induction, this effect can be achieved. In this way, the hot melt adhesive with polar medium of the present invention can not only be assembled on different composite substrates, but also solve the current necessary environmental protection issues, facilitate recycling and reuse, and greatly reduce the burden on the environment.

The following examples are provided for detailed description. The examples are only used as examples for description, and do not limit the scope of the present invention to be protected. In addition, the drawings in the embodiments omit unnecessary components or components that can be completed by common techniques to clearly show the technical features of the present invention. Hereinafter, the preferred embodiments of the present invention are further described in conjunction with the drawings.

Please refer to FIGS. 1A to 1F. FIG. 1A is a block diagram of the substrate, the hot melt adhesive, and the limiting means in the first preferred embodiment applying the inventive concept of the present invention. FIG. 1B to FIG. 1C are the first preferred implementation flowcharts of the method of combining the hot melt adhesive and the substrate in the concept of the present invention. Figures 1D to 1F are cross-sectional views of using Figure 1C to form different substrates with hot melt adhesives

As shown in Figures 1A to 1C, the bonding methods S11-S15 of this case are applied to the substrate 110, the hot melt adhesive 120, the limiting means 130 and the activation means 140. The substrate 110 is formed or inserted by the substrate forming mechanism 111. The substrate forming equipment 111 may include substrate manufacturing equipment, substrate molding equipment or substrate injection molding equipment; the hot melt adhesive film 120 has a polar medium 121 to repeatedly activate in response to the activation means 140 to generate heat; The limiting means 130 includes a limiting and pressing mechanism 131 and a release structure 132. In practical applications, the limiting and pressing mechanism 131 may include a limiting mechanism 1311 and a pressing mechanism 1312, or a single combination of the two Limit pressure mechanism 131. The release structure 132 is disposed on at least one of the limit pressing mechanism 131 and the hot melt adhesive 120, that is, the release structure 132 can be disposed at the place where the two 120.131 contact. For example, the release structure 132 can be provided on the limit pressing mechanism 131 and/or attached to the hot melt adhesive 120. The material of the release structure 132 can be AB glue, plastic, metal, silicon or Other soft non-stick materials, so that the hot melt adhesive film 120 does not stick to the limit pressing mechanism 131.

Furthermore, the activation means 140 is used to activate at least one of the polar medium 121 and the hot melt adhesive 120, so that the hot melt adhesive is heated to a liquefied state in response to the activation. When the activation means 140 is an electromagnetic field treatment means 140, it Radio waves 140a, microwaves 140a, or ionizing radiation 140a are generated by the electromagnetic field processing mechanism to induce the polar medium 121 and/or the hot melt colloid 120; or, when the activation means 140 is the medium processing means 140, it is caused by the medium processing mechanism The polar medium 121 and/or the hot melt adhesive 120 are activated by heating the liquid 140a or heating the gas 140a.

Among them, the hot melt adhesive 120 in this case includes thermoplastic resins, which in practical applications can be polyurethane (PU, TPU), reactive polyurethane (PUR), polycaprolactone (PCL), polycarbonate (PC), vinyl -Vinyl acetate copolymer (EVA), polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), polystyrene (SBS, SIS, SEBS), ABS, polyamide (PA), thermoplastic polyester (PET, PBT), polyether (Polyether), phenolic resin (PF), polyvinyl acetal, polyvinyl acetal (PSU), polyimide (PI), thermoplastic styrene butadiene rubber (TPR), One of thermoplastic vulcanizates (TPV), copolymers or mixtures thereof. Moreover, the hot melt adhesive 120 may be at least one of hot melt adhesive liquid, hot melt adhesive powder, hot melt adhesive particles, hot melt film, hot melt adhesive film, and hot melt adhesive block, or a combination thereof.

In particular, the definition of the polar medium 121 in the hot melt adhesive 120 is that in chemistry, polarity refers to the unevenness of the charge distribution in a covalent bond or a covalent molecule. When the charge distribution is uneven, the bond or molecule is called polar; similarly, if the distribution is uniform, it is called non-polar. That is, the polarity of the covalent bond is caused by the bond formation or the difference in electronegativity between the two atoms in the molecule. Therefore, the polar medium 121 in the hot melt adhesive 120 can be induced in response to the radio waves 140a, microwaves 140a, or ionizing radiation 140a in the activation means 140, which is equivalent to a microwave medium 121 that can be induced to heat in response to changes in the electromagnetic field.

Accordingly, the polar medium 121 of the present case can be repeatedly activated by the activation means 140, so that the hot melt adhesive 120 can be heated and liquefied, thereby producing the effect of subsequent bonding, that is, the hot melt adhesive 120 with the polar medium 121 in this case can pass through The activation means 140 can be repeatedly activated to be combined or separated from at least one substrate 110 multiple times, thereby achieving the effect of repetitive assembly, combination, or disassembly and separation. Furthermore, the resin in the hot melt adhesive 120 is based on 100 parts by weight, and may contain 0.001 to 60 parts by weight of the polar medium 121.

In practical applications, the polar medium 121 can be a polar compound, a polar polymer, carbon and its compound, ceramic powder or metal and its oxide. Among them, the polar compound may be alcohols or amines, such as water, methyl ethyl ketone, dimethylacetamide, diethylene glycol, diethanolamine, glycerol or ethylenediamine. The polar polymer can be polyurethane, polyvinyl chloride, polyamide. Carbon and its compounds can be carbon black, graphite, silicon carbide, carbonyl iron powder. The ceramic powder can be silicate or boron nitride. Metals and their oxides, such as iron, zinc, copper, aluminum, manganese, lanthanum, zinc oxide, manganese dioxide, ferroferric oxide or titanium dioxide.

In addition, the polar medium 121 can be mixed with resin to form the hot melt adhesive 120; or after the hot melt 120 is formed, the polar medium 121 is located inside or on the hot melt adhesive 120; or the polar medium 121 is applied to the hot melt adhesive 120 to bond to the substrate At 110, it can be located between the hot melt adhesive 120 and the substrate 110. Of course, in addition to the application of the polar medium to the hot melt adhesive, it can also be applied to the substrate, mainly in response to the activation means to directly or indirectly heat the liquefied hot melt adhesive, so that the hot melt adhesive can be subsequently combined with the substrate. It should be limited by the embodiment of this case.

Next, please refer to FIGS. 1A to 1F to illustrate the method of combining the hot melt adhesive 120 and the substrate 110 and the result of its formation. The combination method S11-S15 of this case is to perform step S11: place the hot melt adhesive 120 and the substrate 110 in the limiting mechanism 1311, so that the hot melt adhesive 120 is limited and contacted with the substrate surface 110a, and can also be placed to release heat At least one of the melt adhesive 120 and the substrate 110 is in the limit pressing mechanism 131, which is equivalent to the feeding process; Step S12 is performed: the pressing mechanism 1312 is used to make the hot melt adhesive 120 and the substrate surface 110a One of them is pressed tightly on the other, so that the hot melt adhesive 120 can closely contact the substrate surface 110a of the substrate 110; Step S13 is performed: the activation means 140 is used to activate the polar medium 121 The hot melt adhesive 120, so that the colloidal surface 120a of the hot melt adhesive 120 is then bonded to the substrate surface 110a, which is equivalent to inducing and heating the polar medium 121 and/or the hot melt adhesive 120 in an activation manner, so that the colloidal surface 120a is bonded to the base Material surface 110a; Step S14: Cool the hot melt adhesive 120 attached to the substrate 110 by means of cooling, wherein the cooling means is liquid cooling or gas cooling; Step S15: Use processing means to remove unbound The part of the hot melt adhesive 120 on the surface 110 a of the substrate is equivalent to removing the excess hot melt adhesive 120 by deburring to complete the substrate 110 with the hot melt adhesive 120.

In detail, in addition to the above-mentioned bonding methods S11-S15, the bonding method of this case may also include the following steps S161-S163, which further include: another substrate 112 with a substrate surface 112a and another substrate with a colloidal surface 122a Hot melt adhesive 122. Perform step S161: form the hot melt adhesive 120 with the polar medium 121 on the substrate surface 110a of the substrate 110, as the substrate with the hot melt adhesive formed in the previous steps S11-S15; perform step S162: form another hot melt The gel 122 is on the other substrate surface 110b of the substrate 110, wherein the other substrate surface 110b contacts the gel surface 122a of the other hot melt gel 122, and the hot melt gel with the polar medium 121 is activated again by the above step S13 120, so that the substrate surface 110a and the other substrate surface 110b are formed on the hot melt adhesive 120 and the other hot melt adhesive 122, respectively.

Next, perform step S163: forming another substrate 112 on the other gel surface 120b of the hot melt adhesive 120, wherein the other gel surface 120b contacts the substrate surface 112a of the other substrate 112, and by the above step S13: again The hot melt adhesive 120 with the polar medium 121 is activated, and the hot melt adhesives 120, 122 are activated and liquefied, so that the two substrate surfaces 110a, 112a are respectively bonded to the colloidal surface 120a and the other colloidal surface of the hot melt adhesive 120, respectively 120b. According to this, the substrate 110, 112 with the hot melt adhesive 120, 122 as shown in FIG. 1D is completed.

It should be particularly noted that the above steps S161-S163 can be adjusted according to actual needs. For example, when steps S161-S162 are performed, a substrate 110 with double-sided hot melt adhesives 120, 122 can be formed as shown in FIG. 1E, that is, the substrate surface 110a and the other substrate surface 110b are formed on the hot melt. On the glue 120 and another hot melt glue 122. When steps S161 and S163 are performed, the substrate 110 and the other substrate 112 can be activated and liquefied by the hot melt adhesive 120, 122, and then assembled and combined as shown in FIG. 1F. The two substrate surfaces 110a, 112a are respectively bonded to the heat The colloidal surface 120a of the melted colloid 120 and the other colloidal surface 120b.

On the other hand, in addition to the above-mentioned first preferred implementation concept, this case also includes a second preferred implementation concept. Please refer to FIG. 2A to FIG. 2E. FIG. 2A is a block diagram of the substrate, the hot melt adhesive and the limiting means in the second preferred embodiment applying the inventive concept of the present invention. 2B to 2C are the second preferred implementation flowcharts of the method of combining hot melt adhesive and substrate in the concept of the present invention. Figures 2D to 2E are side views of the substrate with hot melt adhesive applied in the method of Figure 2C.

As shown in FIGS. 2A to 2C, the combining methods S21-S24 of this case are applied to substrates 210, 212, hot melt adhesive 220, limit pressing mechanism 230 with microwave function, and activation means 240. Similarly, the substrate 210 is formed or fed by the substrate forming mechanism 211; the hot melt adhesive film 220 has a polar medium 221; the limit pressing mechanism 230 with microwave function includes a limit pressing mechanism 231 and a release structure Body 232 and activation means 240. Among them, the hot melt adhesive film 220 can be activated to generate heat repeatedly in response to the activation means 240, and the release structure 232 is disposed in the limit pressing mechanism 231 to contact the limit or contact the pressing substrate 210, 212 and the heat At least one of the melt adhesive 220 or the release structure 232 is attached to the hot melt adhesive 220. Furthermore, the activation means 240 can be an electromagnetic field processing mechanism 240 or a microwave generating mechanism 240 for generating radio waves 240a, microwaves 240a, or ionizing radiation 240a, thereby inducing the polar medium 121 and/or the hot melt gel 120, which is the activation means It is a microwave means or an organization with microwave function. Among them, the frequency of the above-mentioned radio wave is 30kHz to 300MHz, the frequency of the microwave 240a is 300MHz to 300GHz, and the frequency of the ionizing radiation 240a is 30PHz to 30EHz. In this case, the temperature range of Celsius after microwave activation is 30ºC to 300ºC, or 60ºC to 200ºC, or 80ºC to 130ºC. The power of microwave processing is 100W to 60000W, or 500W to 30000W, or 1000W to 20000W. Of course, in practical applications, the application frequency of microwaves can be 300MHz to 300GHz, or 1000MHz to 4000MHz, or 1500MHz to 3000MHz. In this way, due to the heating selectivity of microwave processing, it is suitable for processing the adhesive bonding between the hot melt adhesive film and the substrate with poor heat resistance.

Next, please refer to FIG. 2A to FIG. 2E to illustrate the bonding method of the hot melt adhesive 220 and the substrates 210 and 212. The combination method S21-S24 of the present case is to perform step S21: using the limit pressing mechanism 230 with microwave function, limit the hot melt adhesive 220 with the polar medium 221 between the two substrates 210, 212; perform step S22: By the activation means 240, at least one of the polar medium 221 and the hot melt glue 220 is activated, so that the glue surface 220a and the other glue surface 220b of the hot melt glue 220 are then respectively bonded to the substrate surfaces 210a of the two substrates 210 and 212 , 212a; Perform step S23: Cool the hot melt adhesive 220 attached to the substrates 210 and 212 by cooling means, that is, cool the hot melt adhesive 220 by air cooling or water cooling; Perform step S24: Remove unbound by processing means The part of the hot melt adhesive 220 on the surface of the substrate 210a, 212a is equivalent to the deburring means, and the substrate 210, 212 with the hot melt adhesive 220 as shown in FIG. 2D is completed, that is, the two substrates 210, 212 are made of hot melt adhesive 220 is combined to form two substrates 210, 212 on the colloid surface 220a and the other colloid surface 220b, respectively, as shown in FIG. 2D.

In addition, in addition to the above-mentioned bonding methods S21-S24, the present case may also include the following steps S251-S252 to perform step S251: by the activation means 240, a hot melt adhesive 220 with a polar medium 221 is formed between the two substrates 210, 212, The result formed by the foregoing steps S21-S24 is equivalent to that shown in FIG. 2D; and step S252: by the activation means 240, at least one of the polar medium 221 and the hot melt adhesive 220 is activated again to make the hot melt The colloid 220 is liquefied to separate the two substrates 210 and 212, that is, the hot melt colloid 220 is induced to liquefy in response to the activation means 240, thereby separating the two substrates 210, 212 on the colloid surface 220a and the other colloid surface 220b, respectively, as shown in FIG. 2E .

Next, various substrates in the footwear industry, such as outsoles, midsoles, foamed midsoles, uppers and other plastic injection molded parts, will be cited to illustrate the combination method of this case. . Please refer to FIGS. 3A to 3D, which are schematic diagrams of an embodiment shown in FIGS. 1A and 1B. Please use FIG. 1A and FIG. 1B to illustrate the process of the inventive concept in this case (steps S11-S15 in FIG. 1B).

As shown in FIGS. 3A to 3D, it includes a substrate 310, a hot melt adhesive 320 with a polar medium 321, and a limiting means 330. The hot melt adhesive 320 is a hot melt adhesive mold 320, and the limiting means 330 includes limiting and pressing The device 331 and the release structure 332, and the limiting pressing device 331 includes a limiting mechanism 3311 with a receiving space 3311a and a pressing mechanism 3312 with a contact surface 3312a, wherein the releasing structure 332 is disposed on the pressing mechanism 3312 On the contact surface, the activation means 340 used in this example includes a medium 340a and a microwave 340b. Among them, the limiting mechanism 3311 is a mold 3311, the accommodating space 3311a is a mold cavity 3311a, and the pressing mechanism 3312 is an elastic container 3312 that can contain the medium 340, so that the contact surface 3312a is also elastic due to this characteristic. The medium 340 can be a gas 340 Or liquid 340.

Perform steps S11-S12 of FIG. 1B: Place the substrate 310 in the cavity 3311a of the mold 3311, and the pressing mechanism 3312 is located on the hot melt adhesive film 320, so that the hot melt adhesive film 320 contacts the substrate 310, as shown in FIG. As shown in 3A; perform step S13: inject medium 340a into the pressure mechanism 3312, such as water, oil or air, etc.; among them, the temperature range of medium 340a is 30ºC to 300ºC, or 60ºC to 200ºC, or 80ºC to 130ºC, at the same time Pressing and heating the hot melt adhesive film 320, as shown in FIG. 3B, or injecting the medium 340a to press the hot melt adhesive film 320 so that it closely contacts the substrate 310, and then the polar medium 321 is activated by the microwave means 340b to The hot melt adhesive film 320 is heated to liquefy, so that the hot melt adhesive film 320 is attached to the substrate 310, as shown in FIG. 3C; Steps S14-S15 are performed: cooling the hot melt adhesive film attached to the substrate 310 by cooling means 320, and remove part of the hot melt adhesive 320 that is not bonded to the substrate 310 to form a substrate 310 with a hot melt adhesive film 320, in which the excess hot melt adhesive film 320 is removed by deburring.

It should be noted that in this example, the elastic container 3312 can be pressed and the medium 340a can be injected to activate the hot melt adhesive film 320, or the medium 340a in the elastic container 3312 can be pressed to limit the hot melt adhesive film 320 on the base. On the material 210, radio waves 340b, microwaves 340b or ionizing radiation 340b are activated to induce the hot melt adhesive film 320 to be heated and liquefied and then bonded to the substrate 310. The temperature of the medium 340a used for pressure is below 80ºC. .

If the substrate is plastic injection molding, other bonding methods can also be used in this case to complete the substrate with hot melt adhesive. Please refer to FIGS. 4A to 4C, which are respectively schematic diagrams of another embodiment applying some of the inventive concepts shown in FIGS. 1A and 1B. This example illustrates the combination method of plastic injection molding and its limiting and pressing mechanism. This example includes a substrate forming mechanism 411, a hot melt adhesive film 420 with a polar medium 421, a limiting pressing mechanism 431, and a release structure 432. The limiting pressing mechanism 431 includes a limiting mechanism 4311 with a receiving space 4311a, And a pressing mechanism 4312 having a contact surface 4312a. Among them, the substrate forming equipment 411 may include a substrate manufacturing equipment 411, a substrate molding equipment 411, or a substrate injection molding equipment 411.

In detail, as shown in FIGS. 4A to 4C, step S31 is performed: one of the hot melt adhesive film 420 with the polar medium 421 and the substrate 410 420/410 is accommodated in the accommodation space 4311a, in this example The hot melt adhesive film 420 is placed in the receiving space 4311a; step S32 is performed: the contact surface 4312a is used to limit or press the one 420/410 in the receiving space 4311a. In this example, the contact surface 4312a is Connected to the pressure applying mechanism 4312, the pressure applying mechanism 4312 is equivalent to the air pressure operating equipment (suction vacuum equipment) that provides negative pressure, and presses and limits the hot melt adhesive film 420 in a vacuum manner; execute step S33: activate the polar medium 421 hot melt adhesive film 420 and the other one of the substrate 410, 420/410, so that the hot melt adhesive film 420 is then combined with the substrate 410. In this example, the substrate injection molding equipment 411 injects the substrate 410. And make it contact the hot melt adhesive film 420, and the hot melt adhesive film 420 is liquefied to adhere to the substrate 410 according to the temperature during injection molding; step S34 is performed: cooling the substrate 410 attached to the substrate 410 by cooling means The hot melt adhesive film 420.

Of course, in this example, the substrate forming device 411 can also be replaced with a hot melt adhesive film forming mechanism (not shown), and adjusted to apply the hot melt adhesive film 420 to be formed on the substrate 410, that is, the substrate 410 is limited Position and press in the containment space 4311a, the reactivated hot melt adhesive film 430 is in a liquefied state, which is equivalent to the heated hot melt adhesive, and then bonded to the substrate 410. When the hot melt adhesive is cooled, it returns to normal At room temperature, a hot melt adhesive film 420 is formed on the substrate surface of the substrate 410. Furthermore, the pressure applying mechanism 4312 can be a pressure object or a pneumatic/hydraulic operating device that provides positive or negative pressure, where the pressure applied object is a mechanism fixture or another substrate; or, the pneumatic/hydraulic operating device is gas filling Pressurizing equipment, suction vacuum equipment or liquid pressurizing equipment, etc.

In addition to the above-mentioned combination method, the operation mode of the second preferred implementation concept will be explained in the footwear industry. First of all, the shoe materials in the shoe industry include at least soles (such as outsoles, midsoles), other components (plastic injection molding components), and uppers (woven uppers, etc.).

In detail, the first preferred implementation concept can be applied to outsole factories, midsole factories, and injection shoe material factories. The shoe material used in the outsole factory is non-slip outsole, wear-resistant outsole, chemical-resistant outsole and midsole factory, and the shoe material used in the midsole factory can be foamed midsole, cushioning midsole, rebound Midsole and so on all kinds of midsole. Or, it is applied to shoe material parts in injection shoe material factories, such as iron cores, injection sheets, carbon fiber sheets, etc. The upper part is mainly made by computer stitching or flying knitting method, and then assembled and combined with the above-mentioned shoe materials in the shoe factory to complete the shoe body. Among them, such as women's shoes, casual shoes, boots or canvas shoes with vulcanized side strips, etc., the structural design can be adjusted according to the material such as Melamine, raw rubber, or its appearance.

The position-limiting and pressing mechanism used in assembling and combining the above-mentioned shoe materials includes a containing space and a contact surface. The position-limiting and pressing mechanism may be a bag (vacuum bag), the containing space is the bag containing space, and the contact surface is the inner side of the bag; Or the limiting and pressing mechanism can be a box with a top cover and a bottom cover, the containing space is the box containing space, the contact surface is the inner side of the box, and a release structure can be provided on the contact surface.

Please refer to FIGS. 5A to 5C, which are schematic diagrams of an embodiment applying some of the inventive concepts shown in FIGS. 2A and 2B. The shoe material 510 assembled into a shoe body includes at least an upper 511, a midsole 512, and an outsole 513, and the midsole 512 and the outsole 513 both form a hot melt adhesive film 520 with a polar medium 521, and the upper 511 is sleeved on Last 550 on. Among them, the midsole 512 and the outsole 513 respectively include corresponding limit structures 512a, 512b, 513a, and 513b. The outsole 513 is in contact with and confined in the midsole 512 by the limit structures 512a, 512b, 513a, and 513b. , So that the two can be locked or snapped with each other. Of course, the limiting structure 512a, 512b, 513a, 513b can be a male/female structure or a concave/convex structure, such as a convex point and a concave hole, or a tenon and a groove, to limit the gap between the shoe materials 510 relative position. In this way, even if the shoe material 510 is moved or turned by the robotic arm, it can still prevent it from falling or being separated from each other.

Next, as shown in FIG. 5C, a vacuum bag 530 with a vacuum means 531 is used, after assembling the shoe material 510, it is placed in the vacuum bag 530, and the vacuum means 531 is used to limit the pressure to bring the shoe material 510 into close contact. After that, the polar medium 521 is activated by microwave means 540, so that the hot melt adhesive film 520 is heated and liquefied, so that the shoe material 510 is then combined to form a shoe body. Among them, the material of the vacuum bag 530 can be AB glue, plastic, silicon glue or other soft non-sticky materials to prevent the hot melt adhesive film 520 from sticking to it.

In addition, please refer to FIGS. 6A to 6C, which are schematic diagrams of another embodiment applying part of the inventive concept shown in FIG. 2C. This example illustrates how the shoe materials are assembled and combined and then disassembled and separated again by activation means. Wherein, the shoe material 610 assembled into the shoe body includes the upper 611, the midsole 612 and the outsole 613, and the shoe material 610 is formed with a hot melt adhesive film 620 with a polar medium 621 on it, and the shoe upper 611 sets Set on the last.

Next, as shown in FIG. 6A, the shoe material 610 is assembled and placed in a box body 630. The box body 630 includes a top cover 631a and a bottom cover 631b with release structures 632a, 632b, and the top cover 631a and the bottom The cover 631b makes the release structure 632a, 632b elastically abut the shoe material 610 by injecting the medium 631a, 631b, so that the shoe material 610 is in close contact with each other, that is, the release structure 632a, 632b is disposed on the top cover 631a and the bottom cover 631b are in contact with the contact surface of the shoe material 610. Among them, the medium 631a, 631b can be liquid or gas. After that, the box body 630 is activated by microwave means 640 to induce the polar medium 621 in the hot melt adhesive film 620, so that the shoe material 610 is heated and liquefied in response to the hot melt adhesive film 620 to form a shoe body. Afterwards, please use Figure 6B and Figure 6C. The microwave-enabled limit pressing mechanism 650 includes a containment space 651, a release structure 652 and an electromagnetic field processing module 653. The release structure 652 is set in the containment space 651 to accommodate and accommodate In contact with the contact surface of the shoe body, the microwave means 640 includes an electromagnetic field processing module 653 for generating radio waves, microwaves or ionizing radiation. In this way, the above-mentioned shoe body is placed in the limit pressing mechanism 650 with microwave function, and the hot melt adhesive film with the polar medium 621 in the shoe body is heated and liquefied by the microwave means 640, thereby making the shoe material 610 The shoe upper 611, midsole 612 and outsole 613 are disassembled and separated.

Of course, the above-mentioned limit pressing mechanism can be a single mechanism with assembly limit activation means or a continuous type (or called assembly line) mechanism. For example, the limit pressing mechanism in this example belongs to the limit applying mechanism. A single mechanism of pressure means and/or microwave means; and the means of pressure can be vacuum pressure (negative pressure) or bag body pressure (positive pressure), etc., to apply according to the shape of the substrate (shoe material) Press the limit hot melt adhesive (hot melt adhesive film) on it, which can correspond to the three-dimensional shape of the substrate to make the hot melt adhesive adhere to it, and then melt the two by microwave means. In addition, in other embodiments, the limit pressing mechanism can also be equipped with a temperature-sensing detection means to determine the heating state of the hot melt adhesive to improve the quality of the substrate, which should not be limited to the above-mentioned embodiments.

Furthermore, in addition to the above-mentioned application fields in the shoe industry, the hot melt adhesive of this case can also be used in the garment industry, toys, building materials or various professional fields with special needs, such as mountaineering equipment, medical equipment, etc. For example, the hot melt adhesive can be partially bonded to toys or building materials so that it can be bonded to another substrate.

In summary, the main technical feature of this case is that the hot-melt gel can be repeatedly liquefied and then deposited on a plurality of substrates in response to activation means, such as electromagnetic field treatment means (radio waves, microwaves, ionizing radiation) or medium treatment means ( Such as shoe materials, toys, building materials). Similarly, multiple substrates can also be disassembled and separated by activation means. In other words, multiple substrates can be liquefied and then liquefied or separated from each other repeatedly by activation means, as long as the temperature of the hot melt gel reaches the melting point temperature induced by activation, this effect can be achieved.

In this way, hot melt adhesives with polar media can be assembled and then attached to different composite substrates, and can also solve the current necessary environmental protection issues. That is, Green peace has continuously promoted the policy of plastic reduction in recent years, such as focusing on Subsequent waste disposal, and how to recycle it. Therefore, if the hot melt adhesive film of this case can be applied to any industrial product, and any industrial product can be recycled, sorted or reused by means of activation, it will definitely reduce the burden on the environment, and at the same time In response to the green circularity of the product, the image and value of the brand have been greatly enhanced.

The above descriptions are only the preferred embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all other equivalent changes or modifications made without departing from the spirit of the present invention should be included in this case. Within the scope of the patent application.

110,112: Substrate 110a, 110b, 112a: substrate surface 111: Substrate forming mechanism 120, 122: hot melt glue 120a, 120b, 122a: colloidal surface 121: Polar medium 130: limit means 131: Limit pressure mechanism 1311: limit mechanism 1312: pressure mechanism 132: Release structure 140: Activation means, electromagnetic field treatment means, medium treatment means 140a: radio waves, microwaves, ionizing radiation, liquids, gases 210,212: Substrate 211: Substrate forming mechanism 220: hot melt glue 221: Polar medium 230: Limit pressure mechanism with microwave function 231: Limit pressure mechanism 232: Release structure 240: Activation means, electromagnetic field processing mechanism, microwave generating mechanism 240a: radio waves, microwaves, ionizing radiation 310: Substrate 320: hot melt glue 321: Polar medium 330: Limiting Means 331: Limit pressure mechanism 3311: limit mechanism 3311a: containment space 3312: pressure mechanism 3312a: contact surface 332: Release structure 340a: medium, liquid, gas 340b: radio waves, microwaves, ionizing radiation 410: Substrate 411: Substrate Forming Mechanism 420: hot melt glue 421: Polar medium 431: Limit Pressure Mechanism 4311: limit mechanism 4311a: containment space 4312: Pressure Mechanism 4312a: contact surface 432: Release structure 510: shoe material 511: upper 512: Midsole 512a, 512b: limit structure 513: outsole 513a, 513b: limit structure 520: hot melt adhesive film 521: Polar medium 530: vacuum bag 531: vacuum 540: Microwave Means 550: Last 610: shoe material 611: Vamp 612: midsole 613: outsole 620: hot melt adhesive film 621: Polar medium 630: Box 631a, 631b: vacuum means 632a,632b 633a,633b 640: radio waves, microwaves, ionizing radiation 650: Limit pressure mechanism with microwave function 651: Containment Space 652: release structure 653: Electromagnetic Field Processing Module 11-S15, S161-S163, S21-S24, S251-S252, S31-S33: Process steps

Figures 1A to 1F are schematic diagrams of the first preferred implementation concept of the substrate with hot melt adhesive and its bonding method in the concept of the present invention. 2A to 2E are schematic diagrams of the second preferred implementation concept of the substrate with hot melt adhesive and its bonding method in the concept of the present invention. Figures 3A to 3D are schematic diagrams of an embodiment applying part of the inventive concept shown in Figures 1A and 1B. 4A to 4C are schematic diagrams of another embodiment applying part of the inventive concept shown in FIG. 1A and FIG. 1B. 5A to 5C are schematic diagrams of an embodiment applying part of the inventive concept shown in FIG. 2A and FIG. 2B. 6A to 6C are schematic diagrams of another embodiment applying part of the inventive concept shown in FIG. 2C.

S11-S15: Process steps

Claims (12)

A method for combining a hot melt adhesive with a substrate, which is applied to a hot melt adhesive with a polar medium and two substrates; wherein the hot melt adhesive includes 0.001 to 100 parts by weight of the polar medium, and the polar medium is a polar medium Compound, a ceramic powder, a carbon and its compound, a polar polymer or a metal and its oxide, the method includes at least the following steps: (A): By a limiting means, the hot melt adhesive is limited between the two substrates; and (B): The polar medium is activated by an activation means, so that one colloidal surface and the other colloidal surface of the hot melt adhesive are respectively bonded to the surface of one of the two substrates. According to the method described in claim 1, the activation means in step (B) is an electromagnetic field treatment means or a medium treatment means, and further includes: Step (B1): activating the at least one to heat and liquefy the hot melt colloid. According to the method of claim 2, the electromagnetic field processing means generates a radio wave, a microwave or an ionizing radiation; wherein the frequency range of the radio wave is between 30kHz and 300MHz, and the frequency range of the microwave is Between 300MHz and 300GHz. According to the method of claim 2, when the activation means is the electromagnetic field treatment means, the electromagnetic field treatment means is a microwave generating mechanism; wherein a release structure is provided where the microwave generating mechanism contacts the hot melt adhesive body. Such as the method in claim 4, wherein the microwave generating mechanism combines with the limiting means to form a limiting and pressing mechanism with microwave function. According to the method of claim 2, the medium processing means is heated and activated with a gas or a liquid; wherein the heating temperature of the gas or the liquid is between 60 degrees and 300 degrees. The method described in claim 1, further including: Step (C): cooling the hot melt adhesive attached to the substrate by a cooling means; wherein the cooling means is a gas cooling method and/or a liquid cooling method. The method described in claim 1, further including: Step (E): using a processing method to remove the part of the hot melt adhesive that is not bonded to the surface of the substrate. The method according to claim 1, wherein the substrate is a middle fork, an accessory, a midsole, an outsole, an upper, or a plastic in other application fields One of a material and a soft material or a combination thereof. According to the method of claim 1, the hot melt adhesive is a thermoplastic material; wherein, the thermoplastic material is a polyurethane (PU, TPU), a reactive polyurethane (PUR), or an ethylene-vinyl acetate copolymer (EVA) , One of a polyamide (PA) and a thermoplastic styrene butadiene rubber (TPR) or a copolymer or mixture thereof. The method according to claim 1, wherein the hot-melt adhesive system is a hot-melt adhesive liquid, a hot-melt adhesive powder, a hot-melt adhesive particle, a hot-melt film, a hot-melt adhesive film, and a hot-melt adhesive At least one of the blocks or a combination thereof. The method according to claim 1, which further includes: Step (D): by the activation means, at least one of the polar medium and the hot melt gel is activated again to liquefy the hot melt gel and separate the two substrates.

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