TW202113020A - Binder resin composition for burning use, and paste composition - Google Patents

Binder resin composition for burning use, and paste composition Download PDF

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TW202113020A
TW202113020A TW109126911A TW109126911A TW202113020A TW 202113020 A TW202113020 A TW 202113020A TW 109126911 A TW109126911 A TW 109126911A TW 109126911 A TW109126911 A TW 109126911A TW 202113020 A TW202113020 A TW 202113020A
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resin composition
cellulose
carbonate
binder resin
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西岡聖司
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日商住友精化股份有限公司
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    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632Organic additives
    • C04B35/634Polymers
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632Organic additives
    • C04B35/636Polysaccharides or derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L1/00Compositions of cellulose, modified cellulose or cellulose derivatives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00Compositions of polycarbonates; Compositions of derivatives of polycarbonates

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Abstract

Provided are: a binder resin composition for burning use, which has excellent thermal decomposition properties and also has excellent stringiness when used as a paste material; and a paste composition. The binder resin composition for burning use according to the present invention is a composition that can be used as a binder resin for burning use, and comprises a polyalkylene carbonate and a cellulose-type resin. The paste composition of according to the present invention comprises the binder resin composition for burning use, a solvent and an inorganic powder. The binder resin composition for burning use according to the present invention has excellent thermal decomposition properties and also has excellent stringiness when used as a paste material.

Description

燒成用黏結劑樹脂組成物及糊組成物Binder resin composition and paste composition for firing

發明領域 本發明是有關於燒成用黏結劑樹脂組成物及含有該組成物的糊組成物。Invention field The present invention relates to a binder resin composition for firing and a paste composition containing the composition.

背景技術 隨著產業之發展,二氧化碳的大量排出構成問題,因此,關於抑制二氧化碳排出的技術、或以物理方式或化學方式將二氧化碳固定化的技術之研究盛行。其中,利用了二氧化碳與環氧化物之共聚合反應的聚碳酸伸烷酯之製造技術,不僅是從二氧化碳之化學固定之觀點來看,從作為碳資源的二氧化碳之有效利用之觀點來看亦備受矚目。Background technique With the development of the industry, a large amount of carbon dioxide is emitted as a problem. Therefore, research on technologies for suppressing carbon dioxide emissions, or technologies for immobilizing carbon dioxide by physical or chemical methods is popular. Among them, the manufacturing technology of polyalkylene carbonate that utilizes the copolymerization reaction of carbon dioxide and epoxide is not only from the viewpoint of the chemical fixation of carbon dioxide, but also from the viewpoint of the effective use of carbon dioxide as a carbon resource. By the attention.

聚碳酸伸烷酯雖然亦依照使用於其製造的環氧化物之種類而不同,但一般而言為柔軟的橡膠狀樹脂,已知的是可與各種填料複合化而利用。近來,為了活用聚碳酸伸烷酯是以二氧化碳作為原料的環境保護材料這個特長,摻合聚碳酸伸烷酯與多醣類等來自天然的成分之研究亦盛行。舉例言之,專利文獻1中揭示,藉由摻合聚碳酸伸丙酯與熱塑性澱粉,可製得機械特性優異之生物降解樹脂。專利文獻2及3中揭示,藉由摻合聚碳酸伸丙酯與纖維素纖維,可製得抗結塊性或拉伸強度經提升的樹脂組成物。Although polyalkylene carbonate differs according to the type of epoxide used for its manufacture, it is generally a soft rubber-like resin, and it is known that it can be used in combination with various fillers. Recently, in order to make use of the speciality of polyalkylene carbonate as an environmental protection material using carbon dioxide as a raw material, researches on blending polyalkylene carbonate with polysaccharides and other natural ingredients have also been actively conducted. For example, Patent Document 1 discloses that by blending polypropylene carbonate and thermoplastic starch, a biodegradable resin with excellent mechanical properties can be obtained. Patent Documents 2 and 3 disclose that by blending polypropylene carbonate and cellulose fibers, a resin composition with improved blocking resistance or tensile strength can be obtained.

又,近年來,亦探討聚碳酸伸烷酯利用作為燒成用黏結劑樹脂。所謂燒成用黏結劑樹脂,是例如添加於糊材料的黏結劑成分,且為將糊材料燒成後實質上會消失的成分。舉例言之,專利文獻4中揭示有一種含有聚碳酸伸烷酯作為黏結劑樹脂的玻璃糊,專利文獻5中揭示有一種含有聚碳酸伸烷酯作為黏結劑樹脂的陶瓷糊。專利文獻6中揭示有一種技術,其使用由脂肪族聚碳酸酯構成的特定範圍分子量之黏結劑,藉此控制絲黏性而形成良好的印刷圖案。一般而言,燒成用黏結劑使用纖維素系樹脂、丙烯酸系樹脂、蠟系黏結劑、澱粉或明膠等時,聚碳酸伸烷酯對該等材料具有優異熱分解性,因此可期待燒成步驟之節能化。In addition, in recent years, the use of polyalkylene carbonate as a binder resin for firing has also been studied. The binder resin for firing is, for example, a binder component added to a paste material, and is a component that substantially disappears after firing the paste material. For example, Patent Document 4 discloses a glass paste containing polyalkylene carbonate as a binder resin, and Patent Document 5 discloses a ceramic paste containing polyalkylene carbonate as a binder resin. Patent Document 6 discloses a technique that uses a binder of a specific range of molecular weight composed of aliphatic polycarbonate to control silk viscosity to form a good printing pattern. Generally speaking, when cellulose resin, acrylic resin, wax-based binder, starch, gelatin, etc. are used as the binder for firing, polyalkylene carbonate has excellent thermal decomposition properties for these materials, so firing can be expected Step of energy saving.

先前技術文獻 專利文獻 專利文獻1:日本特表2013-503921號公報 專利文獻2:日本特開2014-001262號公報 專利文獻3:日本特開2014-001263號公報 專利文獻4:日本特開平1-108128號公報 專利文獻5:日本特開平6-334282號公報 專利文獻6:國際公開第2016/098423號Prior art literature Patent literature Patent Document 1: Japanese Special Form No. 2013-503921 Patent Document 2: Japanese Patent Application Publication No. 2014-001262 Patent Document 3: Japanese Patent Application Laid-Open No. 2014-001263 Patent Document 4: Japanese Patent Laid-Open No. 1-108128 Patent Document 5: Japanese Patent Laid-Open No. 6-334282 Patent Document 6: International Publication No. 2016/098423

發明概要 發明欲解決之課題 然而,使用了習知燒成用黏結劑樹脂的糊材料中,並非具有滿足絲黏性及熱分解性兩者之性能,依然留有改善之餘地。尤其是近年來元件之小型化及精密化急速地擴大,為了加以因應,期望能開發對燒成用黏結劑樹脂亦可進一步地提升絲黏性及熱分解性兩者之性能而帶來優異印刷性特性之糊材料。Summary of the invention The problem to be solved by the invention However, the paste material using the conventional binder resin for firing does not have the performance that satisfies both the silk viscosity and the thermal decomposability, and there is still room for improvement. Especially in recent years, the miniaturization and precision of components have rapidly expanded. In order to cope with this, it is expected that the development of binder resin for firing can further improve the performance of both silk viscosity and thermal decomposition, resulting in excellent printing. Paste material of sexual characteristics.

本發明是有鑑於上述而成,目的在提供一種具有優異熱分解性且使用作為糊材料時的絲黏性亦優異之燒成用黏結劑樹脂組成物及糊組成物。The present invention is made in view of the above, and its object is to provide a binder resin composition for firing and a paste composition that have excellent thermal decomposition properties and also excellent silk viscosity when used as a paste material.

用以解決課題之手段 本案發明人為了達成上述目的反覆精心研究,結果發現藉由併用聚碳酸伸烷酯與纖維素系樹脂,可達成上述目的,遂而完成本發明。Means to solve the problem The inventors of the present case have repeatedly studied to achieve the above-mentioned object, and as a result, found that the above-mentioned object can be achieved by using polyalkylene carbonate and cellulose resin in combination, and completed the present invention.

即,本發明例如包含以下項中記載之主題。 項1 一種燒成用黏結劑樹脂組成物,係使用作為燒成用黏結劑樹脂的組成物,且,含有聚碳酸伸烷酯及纖維素系樹脂。 項2 如項1之燒成用黏結劑樹脂組成物,其中前述纖維素系樹脂為選自於由烷基纖維素、羥烷基纖維素及酯化纖維素所構成群組中之1種以上。 項3 如項1或2之燒成用黏結劑樹脂組成物,其中前述聚碳酸伸烷酯含有下述通式(1)表示的結構單元:That is, the present invention includes, for example, the subjects described in the following items. Item 1 A binder resin composition for firing is a composition used as a binder resin for firing, and contains polyalkylene carbonate and cellulose resin. Item 2 The binder resin composition for firing according to item 1, wherein the cellulose resin is one or more selected from the group consisting of alkyl cellulose, hydroxyalkyl cellulose, and esterified cellulose. Item 3 The binder resin composition for firing according to item 1 or 2, wherein the aforementioned polyalkylene carbonate contains a structural unit represented by the following general formula (1):

[化學式1]

Figure 02_image001
(式中,R1 、R2 、R3 及R4 為相同或相異,表示氫原子、可經取代基取代之碳數1至10之直鏈或支鏈烷基、或可經取代基取代之碳數6至20之芳基;R1 、R2 、R3 及R4 中,2個可相互鍵結,形成可經取代基取代之3員環至10員環之脂肪族環)。 項4 如項1至3中任一項之燒成用黏結劑樹脂組成物,其中前述聚碳酸伸烷酯為選自於由聚碳酸伸乙酯、聚碳酸伸丙酯、聚碳酸伸丁酯及聚碳酸環己烯酯所構成群組中之1種以上。 項5 如項1至4中任一項之燒成用黏結劑樹脂組成物,其中相對於前述聚碳酸伸烷酯100質量份,含有前述纖維素系樹脂10質量份以上、100質量份以下。 項5-1 一種如項1至4中任一項之組成物作為燒成用黏結劑樹脂的用途。 項6 一種糊組成物,含有如項1至5中任一項之燒成用黏結劑樹脂組成物、溶劑及無機粉末。[Chemical formula 1]
Figure 02_image001
(In the formula, R 1 , R 2 , R 3 and R 4 are the same or different, and represent a hydrogen atom, a linear or branched alkyl group with 1 to 10 carbon atoms that may be substituted by a substituent, or a substituent that may be substituted Substituted aryl group with 6 to 20 carbon atoms; two of R 1 , R 2 , R 3 and R 4 may be bonded to each other to form an aliphatic ring from a 3-membered ring to a 10-membered ring which may be substituted by a substituent) . Item 4 The binder resin composition for firing according to any one of items 1 to 3, wherein the aforementioned polyalkylene carbonate is selected from the group consisting of poly(ethylene carbonate), poly(propylene carbonate), and poly(butylene carbonate). And one or more of the group consisting of polycyclohexenyl carbonate. Item 5 The binder resin composition for firing according to any one of items 1 to 4, which contains 10 parts by mass or more and 100 parts by mass of the cellulose resin with respect to 100 parts by mass of the polyalkylene carbonate. Item 5-1 A use of the composition according to any one of items 1 to 4 as a binder resin for firing. Item 6 A paste composition containing the binder resin composition for firing according to any one of items 1 to 5, a solvent, and an inorganic powder.

發明效果 本發明之燒成用黏結劑樹脂組成物具有優異熱分解性,且使用作為糊材料時的絲黏性亦優異。Invention effect The binder resin composition for firing of the present invention has excellent thermal decomposability and also excellent silk viscosity when used as a paste material.

用以實施發明之形態 以下,詳細說明本發明之實施形態。另,本說明書中,針對「含有」及「包含」之表現,是包括「含有」、「包含」、「實質上由此構成」以及「僅由此構成」這些概念。The form used to implement the invention Hereinafter, embodiments of the present invention will be described in detail. In addition, in this manual, the expressions of "contains" and "contains" include the concepts of "contains", "contains", "substantially constituted by", and "constituted only by".

1.燒成用黏結劑樹脂組成物 本發明之燒成用黏結劑樹脂組成物使用作為燒成用黏結劑,並含有聚碳酸伸烷酯及纖維素系樹脂。藉此,本發明之燒成用黏結劑樹脂組成物具有優異熱分解性,且使用作為糊材料時的絲黏性亦優異。以下,將本發明之燒成用黏結劑樹脂組成物僅簡記為「樹脂組成物」。所謂熱分解性優異,意指例如因熱分解所致之殘渣少,又,所謂絲黏性優異,意指不易引起預定濃度的樹脂組成物溶液之絲黏。1. Binder resin composition for firing The binder resin composition for firing of the present invention is used as a binder for firing, and contains polyalkylene carbonate and cellulose resin. Thereby, the binder resin composition for firing of the present invention has excellent thermal decomposability and also excellent silk viscosity when used as a paste material. Hereinafter, the binder resin composition for firing of the present invention is simply referred to as "resin composition". The term “excellent thermal decomposability” means that, for example, there are few residues due to thermal decomposition, and the term “excellent silk viscosity” means that the resin composition solution of a predetermined concentration is less likely to cause stickiness of the resin composition solution.

(聚碳酸伸烷酯) 本發明之樹脂組成物中,聚碳酸伸烷酯之種類並無特殊限制,例如可廣為採用公知聚碳酸伸烷酯。聚碳酸伸烷酯例如可列舉:環狀醚與二氧化碳之共聚物、二醇與碳酸酯或二氯化羰等碳酸衍生物之聚縮物、環狀碳酸酯之開環聚合物等。其中,從高分子量體容易製造之觀點來看,聚碳酸伸烷酯宜為屬於環狀醚之1種的環氧化物與二氧化碳之共聚物。(Polyethylene carbonate) In the resin composition of the present invention, the type of polyalkylene carbonate is not particularly limited, and for example, known polyalkylene carbonates can be widely used. Examples of polyalkylene carbonates include copolymers of cyclic ethers and carbon dioxide, polycondensates of diols and carbonates or carbonic acid derivatives such as carbonyl dichloride, and ring-opening polymers of cyclic carbonates. Among them, the polyalkylene carbonate is preferably a copolymer of epoxide and carbon dioxide, which is one of cyclic ethers, from the viewpoint of easy production of high molecular weight products.

此種聚碳酸伸烷酯宜含有下述通式(1)表示的結構單元。在此情形下,本發明之樹脂組成物具有更優異之熱分解性,使用作為糊材料時更不易引起絲黏。Such polyalkylene carbonate preferably contains a structural unit represented by the following general formula (1). In this case, the resin composition of the present invention has better thermal decomposability, and is less likely to cause stickiness when used as a paste material.

[化學式2]

Figure 02_image001
[Chemical formula 2]
Figure 02_image001

在此,式(1)中,R1 、R2 、R3 及R4 為相同或相異,表示氫原子、可經取代基取代之碳數1至10之直鏈或支鏈烷基、或可經取代基取代之碳數6至20之芳基。又,R1 、R2 、R3 及R4 中,2個可相互鍵結,形成可經取代基取代之3員環至10員環之脂肪族環。Here, in the formula (1), R 1 , R 2 , R 3 and R 4 are the same or different, and represent a hydrogen atom, a linear or branched alkyl group having 1 to 10 carbons which may be substituted by a substituent, Or an aryl group having 6 to 20 carbons which may be substituted by a substituent. In addition, two of R 1 , R 2 , R 3 and R 4 may be bonded to each other to form an aliphatic ring from a 3-membered ring to a 10-membered ring which may be substituted by a substituent.

式(1)中,所謂碳數1至10之直鏈或支鏈烷基,為碳數1、2、3、4、5、6、7、8、9或10之直鏈或支鏈狀烷基。該烷基之碳數宜為1至4,尤佳為1或2。具體而言,烷基可列舉如:甲基、乙基、正丙基、異丙基、正丁基、二級丁基、三級丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基等。In formula (1), the so-called linear or branched alkyl group with carbon number of 1 to 10 refers to linear or branched chain with carbon number of 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10 alkyl. The number of carbon atoms in the alkyl group is preferably 1 to 4, more preferably 1 or 2. Specifically, the alkyl group can be enumerated such as: methyl, ethyl, n-propyl, isopropyl, n-butyl, secondary butyl, tertiary butyl, n-pentyl, n-hexyl, n-heptyl, n- Octyl, n-nonyl, n-decyl, etc.

式(1)中,當碳數1至10之直鏈或支鏈烷基經取代基取代時,取代基數可設為1或2以上。此時的取代基例如可列舉:羥基、烷氧基、酯基、矽基、氫硫基、氰基、硝基、磺酸基、甲醯基、羧基、芳基、鹵素原子(例如氟原子、氯原子、溴原子、碘原子)等。此處的烷氧基例如可列舉:甲氧基、乙氧基、異丙氧基、三級丁氧基等。又,芳基例如可列舉:苯基、鄰甲苯基、間甲苯基、對甲苯基、萘基等。In formula (1), when a linear or branched alkyl group having 1 to 10 carbon atoms is substituted with a substituent, the number of substituents can be set to 1 or 2 or more. Examples of the substituent at this time include: a hydroxyl group, an alkoxy group, an ester group, a silyl group, a sulfhydryl group, a cyano group, a nitro group, a sulfonic acid group, a methanoyl group, a carboxyl group, an aryl group, and a halogen atom (such as a fluorine atom). , Chlorine atom, bromine atom, iodine atom) and so on. The alkoxy group here includes, for example, a methoxy group, an ethoxy group, an isopropoxy group, and a tertiary butoxy group. In addition, examples of the aryl group include phenyl, o-tolyl, m-tolyl, p-tolyl, and naphthyl.

式(1)中,所謂碳數6至20之芳基,為碳數6、7、8、9、10、11、12、13、14、15、16、17、18、19或20之芳基。該芳基之碳數宜為6至14。芳基例如可列舉:苯基、萘基、四氫萘基等。In formula (1), the so-called aryl group having 6 to 20 carbon atoms is an aryl group having 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, or 20 carbon atoms. base. The carbon number of the aryl group is preferably 6-14. Examples of the aryl group include phenyl, naphthyl, and tetrahydronaphthyl.

式(1)中,當碳數6至20之芳基經取代基取代時,取代基數可設為1或2以上。此時的取代基例如可列舉:烷基、羥基、烷氧基、酯基、矽基、氫硫基、氰基、硝基、磺酸基、甲醯基、羧基、芳基、鹵素原子(例如氟原子、氯原子、溴原子、碘原子)等。此處的烷基例如可列舉:甲基、乙基、正丙基、異丙基、正丁基、二級丁基、三級丁基等。又,芳基例如可列舉:苯基、鄰甲苯基、間甲苯基、對甲苯基、萘基等。又,烷氧基例如可列舉:甲氧基、乙氧基、異丙氧基、三級丁氧基等。In formula (1), when the aryl group having 6 to 20 carbon atoms is substituted with a substituent, the number of substituents can be set to 1 or 2 or more. Examples of the substituent at this time include: alkyl, hydroxyl, alkoxy, ester, silyl, sulfhydryl, cyano, nitro, sulfonic acid, methanoyl, carboxyl, aryl, halogen atom ( For example, fluorine atom, chlorine atom, bromine atom, iodine atom) and the like. Examples of the alkyl group here include methyl, ethyl, n-propyl, isopropyl, n-butyl, secondary butyl, tertiary butyl, and the like. In addition, examples of the aryl group include phenyl, o-tolyl, m-tolyl, p-tolyl, and naphthyl. Moreover, the alkoxy group includes, for example, a methoxy group, an ethoxy group, an isopropoxy group, and a tertiary butoxy group.

式(1)中,R1 、R2 、R3 及R4 可設為相同,或者可局部或全部相異。舉例言之,式(1)中,R1 、R2 、R3 及R4 可全部相同,亦可R1 、R2 、R3 相同而R4 相異,也可以R1 、R3 、R4 相同而R2 相異,亦可R1 、R2 、R3 及R4 全部相異。In the formula (1), R 1 , R 2 , R 3 and R 4 may be the same, or may be partially or completely different. For example, in formula (1), R 1 , R 2 , R 3 and R 4 may all be the same, or R 1 , R 2 , R 3 may be the same and R 4 may be different, or R 1 , R 3 , R 4 is the same but R 2 is different, and R 1 , R 2 , R 3 and R 4 may all be different.

式(1)中,R1 、R2 、R3 及R4 中,2個亦可相互鍵結,形成可經取代基取代之3員環至10員環之脂肪族環。具體而言,R1 、R2 、R3 、R4 中的二個亦可相互鍵結,並與該等鍵結的碳原子一同形成取代或非取代之飽和或不飽和的3員環至10員環之脂肪族環。該脂肪族環可經1個或2個以上之取代基取代。In the formula (1), two of R 1 , R 2 , R 3 and R 4 may be bonded to each other to form an aliphatic ring from a 3-membered ring to a 10-membered ring which may be substituted by a substituent. Specifically, two of R 1 , R 2 , R 3 , and R 4 can also be bonded to each other and form a substituted or unsubstituted saturated or unsaturated 3-membered ring together with the bonded carbon atoms to 10-membered aliphatic ring. The aliphatic ring may be substituted with 1 or 2 or more substituents.

此種脂肪族環例如可列舉:可經取代基取代之3至8員環之脂肪族環。更具體而言,該脂肪族環可列舉如:環戊烷環、環戊烯環、環己烷環、環己烯環、環庚烷環等。又,當該脂肪族環經取代基取代時,取代基例如可列舉:烷基、芳基、烷氧基、醯氧基、烷氧羰基、矽基、氫硫基、氰基、硝基、磺酸基、甲醯基、鹵素原子(例如氟原子、氯原子、溴原子、碘原子)等。此處的烷基例如可列舉:甲基、乙基、正丙基、異丙基、正丁基、二級丁基、三級丁基等。又,芳基例如可列舉:苯基、鄰甲苯基、間甲苯基、對甲苯基、萘基等。又,烷氧基例如可列舉:甲氧基、乙氧基、異丙氧基、三級丁氧基等。又,醯氧基例如可列舉:乙醯氧基、丙醯氧基、丁醯氧基、異丁醯氧基、三甲基乙醯氧基、苯甲醯氧基等。又,烷氧羰基可列舉如:甲氧羰基、乙氧羰基、三級丁氧羰基等。Examples of such aliphatic rings include aliphatic rings of 3- to 8-membered rings which may be substituted with substituents. More specifically, examples of the aliphatic ring include a cyclopentane ring, a cyclopentene ring, a cyclohexane ring, a cyclohexene ring, and a cycloheptane ring. In addition, when the aliphatic ring is substituted with a substituent, the substituent includes, for example, an alkyl group, an aryl group, an alkoxy group, an acyloxy group, an alkoxycarbonyl group, a silyl group, a sulfhydryl group, a cyano group, a nitro group, Sulfonic acid group, formyl group, halogen atom (for example, fluorine atom, chlorine atom, bromine atom, iodine atom) and the like. Examples of the alkyl group here include methyl, ethyl, n-propyl, isopropyl, n-butyl, secondary butyl, tertiary butyl, and the like. In addition, examples of the aryl group include phenyl, o-tolyl, m-tolyl, p-tolyl, and naphthyl. Moreover, the alkoxy group includes, for example, a methoxy group, an ethoxy group, an isopropoxy group, and a tertiary butoxy group. In addition, examples of the acyloxy group include acetoxy, propionyloxy, butyroxy, isobutyroxy, trimethylacetoxy, and benzyloxy. In addition, examples of the alkoxycarbonyl group include a methoxycarbonyl group, an ethoxycarbonyl group, and a tertiary butoxycarbonyl group.

式(1)中,R1 、R2 、R3 及R4 宜為相同或相異,且為氫原子或碳數1至4之烷基。尤其理想的是R1 、R2 及R3 為氫原子,且R4 為氫原子或碳數1至4之烷基。或者式(1)中,R1 、R2 、R3 及R4 中的2個亦宜相互鍵結而形成環己烯環。其中,更為理想的是R1 、R2 及R3 為氫原子,且R4 為氫原子、甲基或乙基,尤其理想的是R1 、R2 及R3 為氫原子,且R4 為甲基。In formula (1), R 1 , R 2 , R 3 and R 4 are preferably the same or different, and are a hydrogen atom or an alkyl group with 1 to 4 carbon atoms. It is particularly desirable that R 1 , R 2 and R 3 are hydrogen atoms, and R 4 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. Alternatively, in formula (1), two of R 1 , R 2 , R 3 and R 4 are also preferably bonded to each other to form a cyclohexene ring. Among them, it is more desirable that R 1 , R 2 and R 3 are hydrogen atoms, and R 4 is a hydrogen atom, a methyl group or an ethyl group, and it is particularly desirable that R 1 , R 2 and R 3 are hydrogen atoms, and R 4 is methyl.

本發明之樹脂組成物中,聚碳酸伸烷酯宜為選自於由聚碳酸伸乙酯、聚碳酸伸丙酯、聚碳酸伸丁酯及聚碳酸環己烯酯所構成群組中之1種以上。當聚碳酸伸烷酯含有聚碳酸伸乙酯時,式(1)表示的結構單元中,R1 、R2 、R3 及R4 為氫原子。當聚碳酸伸烷酯含有聚碳酸伸丙酯時,式(1)表示的結構單元中,R1 、R2 及R3 為氫原子,且R4 為甲基。當聚碳酸伸烷酯含有聚碳酸伸丁酯時,式(1)表示的結構單元中,R1 、R2 及R3 為氫原子,且R4 為乙基。當聚碳酸伸烷酯含有聚碳酸環己烯酯時,式(1)表示的結構單元中,R1 及R3 為氫原子,且R2 及R4 相互鍵結而形成無取代之6員環。In the resin composition of the present invention, the polyalkylene carbonate is preferably selected from the group consisting of polyethylene carbonate, polypropylene carbonate, polybutylene carbonate and polycyclohexene carbonate. More than species. When the polyalkylene carbonate contains polyethylene carbonate, in the structural unit represented by formula (1), R 1 , R 2 , R 3 and R 4 are hydrogen atoms. When the polyalkylene carbonate contains polypropylene carbonate, in the structural unit represented by formula (1), R 1 , R 2 and R 3 are hydrogen atoms, and R 4 is a methyl group. When the polyalkylene carbonate contains polybutylene carbonate, in the structural unit represented by formula (1), R 1 , R 2 and R 3 are hydrogen atoms, and R 4 is an ethyl group. When polyalkylene carbonate contains polycyclohexene carbonate, in the structural unit represented by formula (1), R 1 and R 3 are hydrogen atoms, and R 2 and R 4 are bonded to each other to form unsubstituted 6 members ring.

在提升與纖維素系樹脂之相溶性之目的下,聚碳酸伸烷酯亦可具有式(1)以外的其他結構單元,又,末端基亦可經修飾。式(1)以外的其他結構單元可列舉如:聚醚、聚酯、聚醯胺、聚丙烯酸酯等結構單元、具有羧基、羥基或胺基等反應性基的結構單元等。末端基之修飾可舉例:利用酸酐、環狀酸酐、酸鹵化物、異氰酸酯化合物等的修飾。當聚碳酸伸烷酯具有式(1)以外的其他結構單元時,其含量相對於聚碳酸伸烷酯之總結構單元宜為10莫耳%以下,較佳為5莫耳%以下,更佳為3莫耳%以下,最佳為1莫耳%以下。For the purpose of improving the compatibility with the cellulose resin, the polyalkylene carbonate may have other structural units other than formula (1), and the terminal group may also be modified. Examples of structural units other than formula (1) include structural units such as polyether, polyester, polyamide, and polyacrylate, and structural units having reactive groups such as carboxyl groups, hydroxyl groups, or amino groups. The modification of the terminal group can be exemplified: modification using acid anhydrides, cyclic acid anhydrides, acid halides, isocyanate compounds, and the like. When polyalkylene carbonate has structural units other than formula (1), its content relative to the total structural units of polyalkylene carbonate is preferably 10 mol% or less, preferably 5 mol% or less, more preferably It is 3 mol% or less, preferably 1 mol% or less.

當聚碳酸伸烷酯具有式(1)以外的其他結構單元時,該結構單元可於聚碳酸伸烷酯中以無規方式含有,亦可以嵌段聚合物之形式含有,也可以接枝聚合物之形式含有。When the polyalkylene carbonate has a structural unit other than formula (1), the structural unit may be contained in the polyalkylene carbonate in a random manner, may be contained in the form of a block polymer, or may be graft polymerized Contains in the form of things.

本發明之聚碳酸伸烷酯中,式(1)表示的結構單元可以僅設為1種,或者可設為2種以上。In the polyalkylene carbonate of the present invention, the structural unit represented by the formula (1) may be only one type, or may be two or more types.

聚碳酸伸烷酯中,式(1)表示的結構單元之含量(含有率)例如可利用核磁共振光譜分析(NMR分析)來求得。The content (content rate) of the structural unit represented by the formula (1) in the polyalkylene carbonate can be determined by, for example, nuclear magnetic resonance spectroscopy (NMR analysis).

聚碳酸伸烷酯之質量平均分子量Mw或分子量分布(Mw/Mn)並無特殊限制。舉例言之,在容易獲得適合於印刷製程之黏性之觀點下,聚碳酸伸烷酯之質量平均分子量Mw宜為5000以上,較佳為10000以上,更佳為100000以上。又,在容易獲得適合於印刷製程之黏性之觀點下,聚碳酸伸烷酯之質量平均分子量Mw宜為1000000以下,較佳為750000以下,更佳為500000以下。若聚碳酸伸烷酯之質量平均分子量在該範圍內,則可獲得適合於印刷製程之黏性。另,本說明書中所謂質量平均分子量,是利用凝膠滲透層析術(日本沃特斯(WATERS)製造Waters2695 分離模組),於5mmol/L之N,N-二甲基甲醯胺溴化鋰溶液中,在40℃下進行測定(使用標準聚苯乙烯作為基準)而算出之值。The mass average molecular weight Mw or molecular weight distribution (Mw/Mn) of polyalkylene carbonate is not particularly limited. For example, from the viewpoint of easily obtaining viscosity suitable for the printing process, the mass average molecular weight Mw of the polyalkylene carbonate is preferably 5000 or more, preferably 10000 or more, and more preferably 100,000 or more. In addition, from the viewpoint of easily obtaining viscosity suitable for the printing process, the mass average molecular weight Mw of the polyalkylene carbonate is preferably 1,000,000 or less, preferably 750,000 or less, and more preferably 500,000 or less. If the mass average molecular weight of the polyalkylene carbonate is within this range, the viscosity suitable for the printing process can be obtained. In addition, the mass average molecular weight in this specification refers to a 5mmol/L N,N-dimethylformamide lithium bromide solution using gel permeation chromatography (Waters 2695 separation module manufactured by Waters, Japan) In, the value calculated by measuring at 40°C (using standard polystyrene as a reference).

在容易獲得適合於印刷製程之黏性之觀點下,聚碳酸伸烷酯之分子量分布(Mw/Mn)宜為1.0~15.0,尤佳為1.0~10.0。From the viewpoint of easy to obtain viscosity suitable for printing process, the molecular weight distribution (Mw/Mn) of polyalkylene carbonate is preferably 1.0~15.0, and more preferably 1.0~10.0.

聚碳酸伸烷酯之製造方法並無特殊限制,例如可廣為採用公知聚碳酸伸烷酯之製造方法。舉例言之,藉由令環氧化物與二氧化碳聚合反應的方法,可製造聚碳酸伸烷酯。以下,將該方法標示為「製造方法P」。The production method of polyalkylene carbonate is not particularly limited, and for example, the production methods of known polyalkylene carbonates can be widely used. For example, by polymerizing epoxide and carbon dioxide, polyalkylene carbonate can be produced. Hereinafter, this method is referred to as "manufacturing method P".

製造方法P中,環氧化物可舉例:能形成式(1)表示的結構單元之化合物,例如可列舉:環氧乙烷、環氧丙烷、1,2-環氧丁烷、2,3-環氧丁烷、環氧異丁烷、1-環氧戊烷、2-環氧戊烷、1-環氧己烷、1-環氧辛烷、1-環氧十二烷、環氧環戊烷、環氧環己烷、苯環氧乙烷、乙烯基環氧環己烷、3-苯基環氧丙烷、3,3,3-三氟環氧丙烷、3-萘基環氧丙烷、2-苯氧基環氧丙烷、3-萘氧基環氧丙烷、環氧丁烯、3-乙烯氧基環氧丙烷及3-三甲基矽氧基環氧丙烷等。其中,從具有高反應性之觀點來看,宜為環氧乙烷、環氧丙烷、環氧環己烷及1,2-環氧丁烷,更佳為環氧乙烷、環氧丙烷、環氧環己烷。當環氧化物含有環氧乙烷時,所製得聚碳酸伸烷酯含有聚碳酸伸乙酯,當環氧化物含有環氧丙烷時,所製得聚碳酸伸烷酯含有聚碳酸伸丙酯。又,當環氧化物含有環氧環己烷時,所製得聚碳酸伸烷酯含有聚碳酸環己烯酯。In the production method P, epoxides can be exemplified: compounds capable of forming the structural unit represented by formula (1), for example: ethylene oxide, propylene oxide, 1,2-butylene oxide, 2,3- Butylene oxide, isobutane epoxy, 1-epoxypentane, 2-epoxypentane, 1-epoxyhexane, 1-epoxyoctane, 1-epoxydodecane, epoxy ring Pentane, cyclohexane oxide, phenyl ethylene oxide, vinyl cyclohexane oxide, 3-phenyl propylene oxide, 3,3,3-trifluoropropylene oxide, 3-naphthyl propylene oxide , 2-phenoxy propylene oxide, 3-naphthoxy propylene oxide, butylene oxide, 3-vinyloxy propylene oxide and 3-trimethylsiloxy propylene oxide, etc. Among them, from the viewpoint of high reactivity, ethylene oxide, propylene oxide, cyclohexane oxide, and 1,2-butylene oxide are preferable, and ethylene oxide, propylene oxide, Epoxy cyclohexane. When the epoxide contains ethylene oxide, the prepared polyalkylene carbonate contains polyethylene carbonate, and when the epoxide contains propylene oxide, the prepared polyalkylene carbonate contains polypropylene carbonate. . In addition, when the epoxide contains cyclohexane oxide, the obtained polyalkylene carbonate contains polycyclohexenyl carbonate.

製造方法P中,環氧化物與二氧化碳之聚合反應宜於金屬催化劑之存在下進行。金屬催化劑例如可列舉:鋅系催化劑、鋁系催化劑、鉻系催化劑、鈷系催化劑等。該等之中,從環氧化物與二氧化碳之聚合反應中具有高聚合活性來看,宜為鋅系催化劑或鈷系催化劑。In the production method P, the polymerization reaction of the epoxide and carbon dioxide is preferably carried out in the presence of a metal catalyst. Examples of the metal catalyst include zinc-based catalysts, aluminum-based catalysts, chromium-based catalysts, and cobalt-based catalysts. Among these, from the viewpoint of high polymerization activity in the polymerization reaction of epoxide and carbon dioxide, a zinc-based catalyst or a cobalt-based catalyst is preferable.

鋅系催化劑例如可列舉:二乙鋅-水系催化劑、二乙鋅-五倍子酚系催化劑、雙((2,6-二苯基)苯氧基)鋅、N-(2,6-二異丙基苯基)-3,5-二-三級丁基柳醛亞胺鋅、2-((2,6-二異丙基苯基)醯胺)-4-((2,6-二異丙基苯基)亞胺基)-2-戊烯乙酸鋅、己二酸鋅、戊二酸鋅等。Examples of zinc-based catalysts include: diethyl zinc-water-based catalysts, diethyl zinc-gallic phenol-based catalysts, bis((2,6-diphenyl)phenoxy)zinc, and N-(2,6-diisopropyl) Phenyl)-3,5-di-tertiary butyl salicylidene zinc, 2-((2,6-diisopropylphenyl) amide)-4-((2,6-diiso Propylphenyl)imino)-2-pentene zinc acetate, zinc adipate, zinc glutarate and the like.

鈷系催化劑可列舉如:乙酸鈷-乙酸系催化劑、N,N’-雙(3,5-二-三級丁基亞柳基)-1,2-環己烷二胺基乙酸鈷、N,N’-雙(3,5-二-三級丁基亞柳基)-1,2-環己烷二胺基五氟苯甲酸鈷、N,N’-雙(3,5-二-三級丁基亞柳基)-1,2-環己烷二胺基氯化鈷、N,N’-雙(3,5-二-三級丁基亞柳基)-1,2-環己烷二胺基硝酸鈷、N,N’-雙(3,5-二-三級丁基亞柳基)-1,2-環己烷二胺基2,4-二硝基苯氧化鈷、四苯基卟啉氯化鈷、四苯基卟啉乙酸鈷、N,N’-雙[2-(乙氧羰基)-3-側氧亞丁基]-1,2-環己烷二胺基氯化鈷、N,N’-雙[2-(乙氧羰基)-3-側氧亞丁基]-1,2-環己烷二胺基五氟苯甲酸鈷等。Examples of cobalt-based catalysts include cobalt acetate-acetic acid-based catalysts, N,N'-bis(3,5-di-tertiary butylsalicylidene)-1,2-cyclohexanediaminocobalt acetate, and N ,N'-bis(3,5-di-tertiary butylsalicylidene)-1,2-cyclohexanediaminocobalt pentafluorobenzoate, N,N'-bis(3,5-bis- Tertiary butyl ylidene)-1,2-cyclohexanediamino cobalt chloride, N,N'-bis(3,5-di-tertiary butyl ylidene)-1,2-ring Hexane diamino cobalt nitrate, N,N'-bis(3,5-di-tertiary butyl sulfarylene)-1,2-cyclohexane diamino 2,4-dinitrophenoxy cobalt oxide , Tetraphenylporphyrin cobalt chloride, tetraphenylporphyrin cobalt acetate, N,N'-bis[2-(ethoxycarbonyl)-3-oxobutylene]-1,2-cyclohexanediamine Cobalt chloride, N,N'-bis[2-(ethoxycarbonyl)-3-oxobutylene]-1,2-cyclohexanediaminocobalt pentafluorobenzoate, etc.

當使用鈷催化劑時,宜使用輔催化劑。輔催化劑可列舉如:吡啶、N,N-4-二甲胺基吡啶、N-甲基咪唑、四丁基氯化銨、四丁基乙酸銨、三苯基膦、雙(三苯基膦烯)氯化銨、雙(三苯基膦烯)乙酸銨等。When a cobalt catalyst is used, a co-catalyst is preferably used. Examples of co-catalysts include: pyridine, N,N-4-dimethylaminopyridine, N-methylimidazole, tetrabutylammonium chloride, tetrabutylammonium acetate, triphenylphosphine, bis(triphenylphosphine) En)ammonium chloride, bis(triphenylphosphene)ammonium acetate, etc.

從促進聚合反應之進行之觀點來看,使用在聚合反應的金屬催化劑(視需要之輔催化劑)之使用量相對於環氧化物1莫耳宜為0.001莫耳以上,更佳為0.005莫耳以上。又,從獲得符合使用量之效果之觀點來看,使用在聚合反應的金屬催化劑(視需要之輔催化劑)之使用量相對於環氧化物1莫耳宜為0.2莫耳以下,更佳為0.1莫耳以下。From the viewpoint of promoting the progress of the polymerization reaction, the amount of the metal catalyst used in the polymerization reaction (optional co-catalyst) is preferably 0.001 mol or more relative to 1 mol of epoxide, more preferably 0.005 mol or more . In addition, from the viewpoint of obtaining the effect in accordance with the usage amount, the usage amount of the metal catalyst (optional co-catalyst) used in the polymerization reaction is preferably 0.2 mol or less relative to 1 mol of epoxide, more preferably 0.1 Mole or less.

聚合反應中,視需要亦可使用反應溶劑。反應溶劑並無特殊限制,可使用各種有機溶劑。有機溶劑例如可列舉:戊烷、己烷、辛烷、癸烷、環己烷等脂肪族烴系溶劑;苯、甲苯、二甲苯等芳香族烴系溶劑;二氯甲烷、氯仿、1,1-二氯乙烷、1,2-二氯乙烷、氯苯、溴苯等鹵化烴系溶劑;二甲氧乙烷、四氫呋喃、2-甲基四氫呋喃、1,4-二㗁烷、1,3-二氧戊環、大茴香醚等醚系溶劑;乙酸乙酯、乙酸正丙酯、乙酸異丙酯等酯系溶劑;N,N-二甲基甲醯胺、N,N-二甲基乙醯胺等醯胺系溶劑;碳酸二甲酯、碳酸二乙酯、碳酸伸丙酯等碳酸酯系溶劑等。In the polymerization reaction, a reaction solvent may be used as needed. The reaction solvent is not particularly limited, and various organic solvents can be used. Examples of organic solvents include: aliphatic hydrocarbon solvents such as pentane, hexane, octane, decane, and cyclohexane; aromatic hydrocarbon solvents such as benzene, toluene, and xylene; dichloromethane, chloroform, 1,1 -Dichloroethane, 1,2-dichloroethane, chlorobenzene, bromobenzene and other halogenated hydrocarbon solvents; dimethoxyethane, tetrahydrofuran, 2-methyltetrahydrofuran, 1,4-dioxane, 1, Ether solvents such as 3-dioxolane and anisole; ester solvents such as ethyl acetate, n-propyl acetate and isopropyl acetate; N,N-dimethylformamide, N,N-dimethyl Amine-based solvents such as methyl acetamide; carbonate-based solvents such as dimethyl carbonate, diethyl carbonate, and propylene carbonate.

從順利地進行反應之觀點來看,反應溶劑之使用量相對於環氧化物100質量份宜為100至10000質量份。From the viewpoint of smoothly proceeding the reaction, the amount of the reaction solvent used is preferably 100 to 10,000 parts by mass relative to 100 parts by mass of the epoxide.

於金屬催化劑之存在下令環氧化物與二氧化碳聚合反應的方法並無特殊限制,例如可舉以下方法:於高壓釜中注入環氧化物、催化劑以及依需要之輔催化劑、反應溶劑等,進行混合後,壓入二氧化碳令其反應。There are no special restrictions on the method of polymerization reaction between epoxide and carbon dioxide in the presence of a metal catalyst. For example, the following method may be mentioned: injecting epoxide, catalyst, and co-catalyst, reaction solvent, etc. as needed into the autoclave, and then mixing , Press in carbon dioxide to make it react.

聚合反應中使用的二氧化碳之使用量相對於環氧化物1莫耳宜為0.5至10莫耳,較佳為0.6至5莫耳,更佳為0.7至3莫耳。The amount of carbon dioxide used in the polymerization reaction is preferably 0.5 to 10 mol, preferably 0.6 to 5 mol, and more preferably 0.7 to 3 mol relative to 1 mol of epoxide.

聚合反應中,二氧化碳之壓力並無特殊限制,從順利地進行反應之觀點來看,宜為0.1MPa以上,較佳為0.2MPa以上,更佳為0.5MPa以上,從獲得符合使用壓力之效果之觀點來看,宜為20MPa以下,較佳為10MPa以下,更佳為5MPa以下。In the polymerization reaction, the pressure of carbon dioxide is not particularly limited. From the viewpoint of smoothly proceeding the reaction, it is preferably 0.1 MPa or more, preferably 0.2 MPa or more, and more preferably 0.5 MPa or more, in order to obtain an effect in accordance with the use pressure From a viewpoint, it is preferably 20 MPa or less, preferably 10 MPa or less, and more preferably 5 MPa or less.

聚合反應中聚合反應溫度並無特殊限制,從縮短反應時間之觀點來看,宜為0℃以上,較佳為20℃以上,更佳為30℃以上,從抑制副反應並提升產率之觀點來看,宜為100℃以下,較佳為80℃以下,更佳為60℃以下。The polymerization temperature in the polymerization reaction is not particularly limited. From the viewpoint of shortening the reaction time, it is preferably 0°C or higher, preferably 20°C or higher, more preferably 30°C or higher, from the viewpoint of suppressing side reactions and improving yield From a standpoint, it is preferably 100°C or lower, preferably 80°C or lower, and more preferably 60°C or lower.

反應時間依照聚合反應條件而不同,因此無法一概決定,通常宜為1至40小時。The reaction time varies depending on the polymerization reaction conditions, so it cannot be determined uniformly, and it is usually 1 to 40 hours.

(纖維素系樹脂) 本發明之樹脂組成物中,纖維素系樹脂之種類並無特殊限制,例如可廣為應用公知纖維素系樹脂。具體而言,纖維素系樹脂可列舉如:甲基纖維素、乙基纖維素、甲基乙基纖維素、正丙基纖維素、異丙基纖維素、正丁基纖維素、三級丁基纖維素、正己基纖維素等烷基纖維素;羥甲基纖維素、羥乙基纖維素、羥丙基纖維素、羥丁基纖維素等羥烷基纖維素;乙酸纖維素、二乙酸纖維素、三乙酸纖維素、乙酸丙酸纖維素、乙酸丁酸纖維素等酯化纖維素;羧甲基纖維素、羧乙基纖維素、羧丙基纖維素等羧烷基纖維素;其他硝基纖維素、醛基纖維素、二醛基纖維素、磺酸化纖纖維素等纖維素衍生物或纖維素。其中,從熱分解性優異之觀點來看,纖維素系樹脂宜為選自於由烷基纖維素、羥烷基纖維素及酯化纖維素所構成群組中之1種以上。從絲黏性尤其優異之觀點來看,纖維素系樹脂更宜為選自於由乙基纖維素、羥丙基纖維素及乙酸丁酸纖維素所構成群組中之至少1種,且以乙基纖維素尤佳。(Cellulose resin) In the resin composition of the present invention, the type of cellulose resin is not particularly limited, and for example, known cellulose resins can be widely used. Specifically, cellulosic resins include methyl cellulose, ethyl cellulose, methyl ethyl cellulose, n-propyl cellulose, isopropyl cellulose, n-butyl cellulose, tertiary cellulose, etc. Alkyl cellulose such as cellulose and n-hexyl cellulose; Hydroxyalkyl cellulose such as hydroxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, and hydroxybutyl cellulose; cellulose acetate, diacetic acid Esterified cellulose such as cellulose, cellulose triacetate, cellulose acetate propionate, and cellulose acetate butyrate; carboxyalkyl cellulose such as carboxymethyl cellulose, carboxyethyl cellulose, carboxypropyl cellulose; others Cellulose derivatives or cellulose such as nitrocellulose, aldehyde-based cellulose, dialdehyde-based cellulose, and sulfonated cellulose. Among them, the cellulose resin is preferably one or more selected from the group consisting of alkyl cellulose, hydroxyalkyl cellulose, and esterified cellulose from the viewpoint of excellent thermal decomposability. From the viewpoint of particularly excellent silk viscosity, the cellulose resin is more preferably at least one selected from the group consisting of ethyl cellulose, hydroxypropyl cellulose and cellulose acetate butyrate, and Ethyl cellulose is particularly preferred.

纖維素系樹脂之取代度並無特殊限制,在對溶劑顯示良好溶解性之觀點下宜為0.1~3.0,較佳為1.0至2.9,更佳為1.5至2.7。另,本說明書中的取代度,在存在有複數種取代基時是表示總取代度。The degree of substitution of the cellulose resin is not particularly limited, and is preferably 0.1 to 3.0, preferably 1.0 to 2.9, more preferably 1.5 to 2.7 from the viewpoint of showing good solubility in solvents. In addition, the degree of substitution in this specification means the total degree of substitution when there are plural kinds of substituents.

纖維素系樹脂之質量平均分子量亦無特殊限制。舉例言之,在容易獲得適合於印刷製程之黏性之觀點下,纖維素系樹脂之質量平均分子量宜為5000以上,較佳為10000以上,更佳為100000以上。又,纖維素系樹脂之質量平均分子量宜為1000000以下,較佳為750000以下,更佳為500000以下。另,纖維素系樹脂之質量平均分子量可利用與聚碳酸伸烷酯相同的方法測得。The mass average molecular weight of the cellulose resin is also not particularly limited. For example, from the viewpoint of easily obtaining viscosity suitable for the printing process, the mass average molecular weight of the cellulose resin is preferably 5000 or higher, preferably 10000 or higher, and more preferably 100000 or higher. In addition, the mass average molecular weight of the cellulose resin is preferably 1,000,000 or less, preferably 750,000 or less, and more preferably 500,000 or less. In addition, the mass average molecular weight of the cellulose resin can be measured by the same method as that of polyalkylene carbonate.

本發明之組成物中所含纖維素系樹脂可以僅設為1種,或者亦可設為2種以上。The cellulose resin contained in the composition of the present invention may be only one type or two or more types.

纖維素系樹脂之製造方法並無特殊限制,例如可利用公知方法來製造。或者,本發明中使用的纖維素系樹脂亦可自市售品等取得。The manufacturing method of cellulose resin is not specifically limited, For example, it can manufacture by a well-known method. Alternatively, the cellulose resin used in the present invention may be obtained from a commercially available product or the like.

(樹脂組成物) 本發明之樹脂組成物中,聚碳酸伸烷酯與纖維素系樹脂之含有比例並無特殊限制。舉例言之,本發明之樹脂組成物中,相對於聚碳酸伸烷酯100質量份,宜含有纖維素系樹脂5質量份以上、100質量份以下,更宜含有10質量份以上、100質量份以下。在此情形下,本發明之樹脂組成物熱分解性優異,而且更不易引起絲黏,尤其是關於樹脂組成物之熱分解性方面,即便加入聚碳酸伸烷酯獨自的熱分解特性與纖維素系樹脂獨自的熱分解特性,樹脂組成物之熱分解性亦可加成提升。(Resin composition) In the resin composition of the present invention, the content ratio of polyalkylene carbonate to cellulose resin is not particularly limited. For example, in the resin composition of the present invention, relative to 100 parts by mass of polyalkylene carbonate, the cellulose resin preferably contains 5 parts by mass or more and 100 parts by mass or less, and more preferably contains 10 parts by mass or more and 100 parts by mass. the following. In this case, the resin composition of the present invention has excellent thermal decomposability and is less likely to cause stickiness, especially with regard to the thermal decomposability of the resin composition, even if the thermal decomposition characteristics of polyalkylene carbonate and cellulose are added Due to the unique thermal decomposition characteristics of the resin, the thermal decomposition properties of the resin composition can also be additively improved.

本發明之樹脂組成物中,相對於聚碳酸伸烷酯100質量份,纖維素系樹脂之含量更宜為20質量份以上,尤佳為30質量份以上,又,更宜為80質量份以下,尤佳為50質量份以下。In the resin composition of the present invention, relative to 100 parts by mass of polyalkylene carbonate, the content of cellulose resin is more preferably 20 parts by mass or more, particularly preferably 30 parts by mass or more, and more preferably 80 parts by mass or less , Particularly preferably 50 parts by mass or less.

本發明之樹脂組成物除了聚碳酸伸烷酯及纖維素系樹脂外,亦可含有各種添加劑。添加劑例如可列舉:塑化劑、抗氧化劑、紫外線吸收劑、抗靜電劑等。The resin composition of the present invention may contain various additives in addition to polyalkylene carbonate and cellulose resin. Examples of additives include plasticizers, antioxidants, ultraviolet absorbers, and antistatic agents.

當本發明之樹脂組成物含有添加劑時,其含量例如相對於聚碳酸伸烷酯組成物總量為10質量%以下,較佳為5質量%以下,更佳為1質量%以下,尤佳為0.1質量%以下。When the resin composition of the present invention contains additives, the content thereof is, for example, 10% by mass or less relative to the total amount of the polyalkylene carbonate composition, preferably 5% by mass or less, more preferably 1% by mass or less, and particularly preferably 0.1% by mass or less.

調製本發明之樹脂組成物之方法並無特殊限制。舉例言之,可利用適當方法混合聚碳酸伸烷酯與纖維素系樹脂,藉此調製出本發明之樹脂組成物。作為具體例,可使含有聚碳酸伸烷酯及纖維素系樹脂之原料溶解或分散於溶劑中並混合後,藉由去除溶劑,調製出本發明之樹脂組成物。或者可舉例以下方法:使用軋輥混練機、擠壓機、班布里(Banbury)混合機、塑磨機(Plastomill)、布拉本德(Brabender)混合機等,將含有聚碳酸伸烷酯及纖維素系樹脂之原料進行熔融混練。於任一者之原料中,皆可視需要含有前述添加劑。The method of preparing the resin composition of the present invention is not particularly limited. For example, a suitable method can be used to mix polyalkylene carbonate and cellulose resin to prepare the resin composition of the present invention. As a specific example, a raw material containing polyalkylene carbonate and a cellulose resin can be dissolved or dispersed in a solvent and mixed, and then the solvent can be removed to prepare the resin composition of the present invention. Or the following methods can be exemplified: using a roll kneader, extruder, Banbury mixer, Plastomill, Brabender mixer, etc., will contain polyalkylene carbonate and The raw materials of cellulose resin are melted and kneaded. Any of the raw materials may optionally contain the aforementioned additives.

使含有聚碳酸伸烷酯及纖維素系樹脂之原料溶解或分散於溶劑中並混合時,使用的溶劑種類並無特殊限制。舉例言之,溶劑可列舉如:苯、甲苯、二甲苯等烴系溶劑;丙酮、甲基乙基酮、異佛酮等酮系溶劑;三級丁醇、苄醇、苯氧乙醇、苯基丙二醇等醇系溶劑;二氯甲烷、氯仿等鹵化烴系溶劑;1,2-二甲氧乙烷、四氫呋喃、1,4-二㗁烷、大茴香醚等醚系溶劑;乙酸乙酯、乙酸丙酯、乙基卡必醇乙酸酯、丁基卡必醇乙酸酯等酯系溶劑;N,N-二甲基甲醯胺、N,N-二甲基乙醯胺等醯胺系溶劑;碳酸二甲酯、碳酸二乙酯、碳酸伸丙酯等碳酸酯系溶劑等。When dissolving or dispersing the raw materials containing polyalkylene carbonate and cellulose resin in a solvent and mixing, the kind of solvent used is not particularly limited. For example, the solvent may include hydrocarbon solvents such as benzene, toluene, and xylene; ketone solvents such as acetone, methyl ethyl ketone, and isophorone; tertiary butanol, benzyl alcohol, phenoxyethanol, phenyl Alcohol solvents such as propylene glycol; halogenated hydrocarbon solvents such as dichloromethane and chloroform; ether solvents such as 1,2-dimethoxyethane, tetrahydrofuran, 1,4-dioxane, and anisole; ethyl acetate, acetic acid Ester solvents such as propyl ester, ethyl carbitol acetate, and butyl carbitol acetate; N,N-dimethylformamide, N,N-dimethylacetamide and other amine-based solvents Solvents: carbonate-based solvents such as dimethyl carbonate, diethyl carbonate, and propylene carbonate.

本發明之樹脂組成物例如可設為粉末、顆粒、塊狀、小片狀、束狀、纖維狀、液狀、分散體、溶液、成形體等各種形態。The resin composition of the present invention can be in various forms such as powder, pellets, agglomerates, flakes, bundles, fibers, liquids, dispersions, solutions, and molded bodies.

本發明之樹脂組成物具有優異熱分解性,且使用作為糊材料時的絲黏性亦優異。具體而言,使用本發明之樹脂組成物製得的糊組成物顯示適合於印刷之溶液特性,亦即絲黏性小,塗佈後離版量亦佳。依此,藉由將本發明之樹脂組成物應用在糊材料(尤其是燒成用黏結劑樹脂)中,可採用例如在電子構件之製造時經濟性優異的印刷製程,尤其是網版印刷製程。The resin composition of the present invention has excellent thermal decomposition properties and also excellent silk viscosity when used as a paste material. Specifically, the paste composition prepared by using the resin composition of the present invention shows solution characteristics suitable for printing, that is, the silk viscosity is low, and the release amount after coating is also good. Accordingly, by applying the resin composition of the present invention to a paste material (especially a binder resin for firing), it is possible to use, for example, an economical printing process in the manufacture of electronic components, especially a screen printing process. .

2.糊組成物 本發明之糊組成物含有前述樹脂組成物(燒成用黏結劑樹脂組成物)、溶劑及無機粉末。2. Paste composition The paste composition of the present invention contains the aforementioned resin composition (binder resin composition for firing), a solvent, and an inorganic powder.

本發明之糊組成物中所含溶劑例如可設為與公知糊組成物相同的溶劑。具體而言,溶劑可列舉如:甲苯、乙酸乙酯、乙酸丁酯、乙醇、異丙醇、甲基異丁基酮、甲基乙基酮、N-甲基-2-吡咯啶酮、乙二醇乙基醚、乙二醇單丁基醚、乙二醇單乙基醚乙酸酯、二乙二醇單乙基醚、二乙二醇單甲基醚、二乙二醇單異丁基醚、三甲基戊二醇單異丁酸酯、乙基卡必醇、丁基卡必醇、乙基卡必醇乙酸酯、丁基卡必醇乙酸酯、萜品醇、萜品醇乙酸酯、二氫萜品醇、二氫萜品醇乙酸酯、醇酯12(TEXANOL)、異佛酮、乳酸丁酯、苄醇、苯基丙二醇、甲酚、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺及碳酸伸丙酯等。The solvent contained in the paste composition of the present invention can be, for example, the same solvent as the known paste composition. Specifically, the solvent may include: toluene, ethyl acetate, butyl acetate, ethanol, isopropanol, methyl isobutyl ketone, methyl ethyl ketone, N-methyl-2-pyrrolidone, ethyl acetate Glycol ethyl ether, ethylene glycol monobutyl ether, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoisobutyl Base ether, trimethylpentanediol monoisobutyrate, ethyl carbitol, butyl carbitol, ethyl carbitol acetate, butyl carbitol acetate, terpineol, terpene Pinitol acetate, dihydroterpineol, dihydroterpineol acetate, alcohol ester 12 (TEXANOL), isophorone, butyl lactate, benzyl alcohol, phenylpropanediol, cresol, N,N- Dimethylformamide, N,N-dimethylacetamide and propylene carbonate, etc.

本發明之糊組成物中所含無機粉末例如可設為與公知糊組成物相同的無機粉末。具體而言,無機粉末可列舉如:金、銀、銅、鐵、鎳、鈀、鉑、鋁、鎢、該等之合金等構成的金屬粒子;CaO-Al2 O3 -SiO2 系、MgO-Al2 O3 -SiO2 系、LiO2 -Al2 O3 -SiO2 系等矽氧化物;氧化鉍玻璃、矽酸鹽玻璃、鉛玻璃、鋅玻璃、硼玻璃等玻璃粉末;Sn-Pb合金、Sn-Pb合金中添加有銀、鉍、銦等的合金、Sn-Ag系合金、Sn-Cu系合金、Sn-Ag-Cu系合金等焊料合金粉末;氧化鋁、氧化鋯、氧化鈰、氧化鈦、氧化鋅、鈦酸鋇、氮化鋁、氮化矽、氮化硼、碳化矽等陶瓷粉末;碳黑、石墨碳、富勒烯類、碳奈米管類、奈米鑽石等碳材料等。The inorganic powder contained in the paste composition of the present invention can be, for example, the same inorganic powder as the known paste composition. Specifically, inorganic powders include metal particles composed of gold, silver, copper, iron, nickel, palladium, platinum, aluminum, tungsten, and alloys thereof; CaO-Al 2 O 3 -SiO 2 series, MgO -Al 2 O 3 -SiO 2 series, LiO 2 -Al 2 O 3 -SiO 2 series and other silicon oxides; bismuth oxide glass, silicate glass, lead glass, zinc glass, boron glass and other glass powders; Sn-Pb Alloys, Sn-Pb alloys with silver, bismuth, indium and other alloys added, Sn-Ag series alloys, Sn-Cu series alloys, Sn-Ag-Cu series alloys and other solder alloy powders; aluminum oxide, zirconium oxide, cerium oxide , Titanium oxide, zinc oxide, barium titanate, aluminum nitride, silicon nitride, boron nitride, silicon carbide and other ceramic powders; carbon black, graphite carbon, fullerenes, carbon nanotubes, nanodiamonds, etc. Carbon materials, etc.

本發明之糊組成物可含有其他添加劑。此種添加劑例如可列舉:有機過氧化物、有機偶氮化合物等分解促進劑;胺系矽烷耦合劑、環氧丙基系矽烷耦合劑等密著促進劑;聚氧乙烯系界面活性劑、脂肪酸酯系界面活性劑等界面活性劑;聚醚多元醇、酞酸酯、己二酸酯等塑化劑;胺化合物、羧酸化合物、磷化合物、硫化合物、三唑系化合物等儲存穩定劑;疏水性二氧化矽、聚伸烷基衍生物、聚醚衍生物等消泡劑等。The paste composition of the present invention may contain other additives. Examples of such additives include decomposition accelerators such as organic peroxides and organic azo compounds; adhesion promoters such as amine-based silane coupling agents and epoxypropyl-based silane coupling agents; polyoxyethylene-based surfactants, fats Surfactants such as acid ester surfactants; plasticizers such as polyether polyols, phthalates, and adipates; storage stabilizers such as amine compounds, carboxylic acid compounds, phosphorus compounds, sulfur compounds, and triazole compounds ; Antifoaming agents such as hydrophobic silica, polyalkylene derivatives, polyether derivatives, etc.

本發明之糊組成物中,樹脂組成物、溶劑及無機粉末之含有比例並無特殊限制。舉例言之,樹脂組成物每100質量份,可將溶劑之含量設為100~5000質量份,又以設為400~2000質量份為佳。又,樹脂組成物每100質量份,可將無機粉末之含量設為100~5000質量份,又以設為500~1000質量份為佳。當本發明之糊組成物含有前述其他添加劑時,其含量相對於無機粉末100質量份宜為50質量份以下,更佳為30質量份以下。In the paste composition of the present invention, the content ratio of the resin composition, the solvent, and the inorganic powder is not particularly limited. For example, for every 100 parts by mass of the resin composition, the content of the solvent can be set to 100 to 5000 parts by mass, preferably 400 to 2000 parts by mass. In addition, per 100 parts by mass of the resin composition, the content of the inorganic powder may be 100 to 5000 parts by mass, preferably 500 to 1000 parts by mass. When the paste composition of the present invention contains the aforementioned other additives, the content thereof is preferably 50 parts by mass or less, and more preferably 30 parts by mass or less relative to 100 parts by mass of the inorganic powder.

調製本發明之糊組成物之方法並無特殊限制,舉例言之,可藉由以適當方法混合本發明之樹脂組成物、溶劑、無機粉末及視需要之添加劑來調製。該混合方法亦無特殊限制,例如可廣為採用公知混合方法。具體的混合方法例如可列舉:使用球磨機、珠磨機、布拉本德(Brabender)磨機、三輥磨機等裝置進行混合的方法;使用研缽進行混合的方法等。The method of preparing the paste composition of the present invention is not particularly limited. For example, it can be prepared by mixing the resin composition of the present invention, solvent, inorganic powder, and additives as needed in an appropriate method. The mixing method is also not particularly limited, and for example, a well-known mixing method can be widely used. Specific mixing methods include, for example, a method of mixing using a ball mill, a bead mill, a Brabender mill, or a three-roll mill; a method of mixing using a mortar, and the like.

本發明之糊組成物含有前述燒成用黏結劑樹脂組成物,因此具有優異熱分解性,且絲黏性亦優異。故,若使用本發明之糊組成物,則可採用例如在電子構件之製造時經濟性優異的印刷製程,尤其是網版印刷製程。又,本發明之糊組成物具有優異熱分解性,因此燒成後的殘渣量少,藉此,亦容易抑制電子構件之導電性之降低及強度降低。The paste composition of the present invention contains the aforementioned binder resin composition for firing, and therefore has excellent thermal decomposability and silk viscosity. Therefore, if the paste composition of the present invention is used, for example, an economical printing process, especially a screen printing process, can be used in the manufacture of electronic components. In addition, the paste composition of the present invention has excellent thermal decomposability, so the amount of residue after firing is small, and thereby, it is easy to suppress the decrease in conductivity and strength of the electronic component.

實施例 以下,利用實施例,更具體地說明本發明,惟本發明並不限於該等實施例之態樣。Example Hereinafter, embodiments will be used to explain the present invention more specifically, but the present invention is not limited to the aspects of these embodiments.

[質量平均分子量(Mw)及分子量分布(Mw/Mn)之測定] 各製造例中製得的聚碳酸伸烷酯之質量平均分子量(Mw)是利用凝膠滲透層析術(日本沃特斯(WATERS)製造Waters 2695 分離模組)來測定。具體而言,將聚碳酸伸烷酯與5mmol/L之N,N-二甲基甲醯胺溴化鋰溶液混合而調製出試樣(聚碳酸伸烷酯之濃度為0.3質量%),並於40℃下進行測定。質量平均分子量(Mw)是以標準聚苯乙烯作為基準而算出。[Determination of mass average molecular weight (Mw) and molecular weight distribution (Mw/Mn)] The mass average molecular weight (Mw) of the polyalkylene carbonate prepared in each production example was measured by gel permeation chromatography (Waters 2695 separation module manufactured by Waters, Japan). Specifically, polyalkylene carbonate was mixed with 5 mmol/L of N,N-dimethylformamide lithium bromide solution to prepare a sample (polyalkylene carbonate concentration of 0.3% by mass), and set at 40 Measure at ℃. The mass average molecular weight (Mw) is calculated based on standard polystyrene.

[熱分解特性之評價方法] 本實施例等中製得的燒成用黏結劑樹脂組成物之熱分解特性是利用以下方法來評價。測定裝置使用SII奈米技術公司製造TG/DTA7220,於氮環境氣體下,藉由以10℃/分之升溫速度從室溫(例如20℃)升溫至500℃之條件進行測定。該測定中,熱分解開始溫度是依據JIS K7120:1987之定義。具體而言,所獲得分解曲線中,將下述線之交點溫度設為熱分解開始溫度,即:與通過開始試驗加熱前質量之橫軸平行的線,以及分解曲線中反曲點間之梯度構成最大而劃出的切線。50質量%分解溫度,是讀取試樣(樹脂組成物)質量構成開始試驗加熱前質量之一半時的溫度。殘渣量(分解殘渣率)是從開始試驗加熱前的試樣質量與到達500℃之時間點的試樣質量之比來算出。[Evaluation method of thermal decomposition characteristics] The thermal decomposition characteristics of the binder resin composition for firing prepared in this example and the like were evaluated by the following method. The measurement device uses TG/DTA7220 manufactured by SII Nanotechnology Co., Ltd., and the measurement is performed under conditions of heating from room temperature (for example, 20°C) to 500°C at a temperature increase rate of 10°C/min under nitrogen atmosphere. In this measurement, the thermal decomposition start temperature is based on the definition of JIS K7120:1987. Specifically, in the obtained decomposition curve, the temperature at the intersection of the following lines is set as the thermal decomposition start temperature, namely: the line parallel to the horizontal axis of the mass before heating through the start of the test, and the gradient between the inflection points in the decomposition curve Make up the largest tangent line drawn. The 50% by mass decomposition temperature is the temperature at which half of the mass composition of the sample (resin composition) is read before the test heating starts. The amount of residue (decomposition residue rate) is calculated from the ratio of the mass of the sample before starting the test heating to the mass of the sample at the time point when the temperature reaches 500°C.

[絲黏性之評價方法] 本實施例等中製得的燒成用黏結劑樹脂組成物之絲黏性是利用以下方法來評價。於容器內收納燒成用黏結劑樹脂組成物之溶液,於室溫(23℃)下,將聚四氟乙烯製造之直徑2.9mm之圓柱棒沉入該溶液中後,將該圓柱棒以5mm/秒之速度相對於溶液面朝垂直方向拉起。此時所產生圓柱棒與溶液表面間生成的絲黏中,利用游標尺來計測最大長度,藉此評價絲黏性。該評價中使用的溶液是使用燒成用黏結劑樹脂組成物之乙基卡必醇乙酸酯溶液,並將濃度設為20質量%。[Evaluation method of silk stickiness] The silk viscosity of the binder resin composition for firing prepared in this example and the like was evaluated by the following method. The solution of the binder resin composition for firing is placed in the container, and a cylindrical rod with a diameter of 2.9 mm made of polytetrafluoroethylene is immersed in the solution at room temperature (23°C), and the cylindrical rod is 5 mm in diameter. The speed per second is pulled up in the vertical direction with respect to the solution surface. At this time, among the silk sticks generated between the cylindrical rod and the surface of the solution, the maximum length is measured with a vernier to evaluate the silk stickiness. The solution used in this evaluation was an ethyl carbitol acetate solution using the binder resin composition for firing, and the concentration was set to 20% by mass.

(製造例1;有機鋅催化劑之製造) 將已具備攪拌機、氮氣導入管、溫度計、迪安-斯塔克(Dean-Stark)管、回流冷卻管的容量1L之四口燒瓶進行氮取代,並注入氧化鋅77.3g(0.95mol)、戊二酸122.8g(0.93mol)、乙酸1.14g(0.02mol)及甲苯760.0g。其次,升溫至60℃,於同溫度下攪拌4小時令其反應。然後,升溫至110℃,使利用反應而產生的水共沸脫水後,冷卻至室溫,製得含有有機鋅催化劑(戊二酸鋅)的漿液。(Manufacturing Example 1; Manufacturing of organic zinc catalyst) A 1L four-necked flask equipped with a stirrer, a nitrogen introduction tube, a thermometer, a Dean-Stark tube, and a reflux cooling tube was replaced with nitrogen, and 77.3g (0.95mol) of zinc oxide, Diacid 122.8g (0.93mol), acetic acid 1.14g (0.02mol) and toluene 760.0g. Next, the temperature was raised to 60°C, and the mixture was stirred at the same temperature for 4 hours to allow it to react. Then, the temperature was raised to 110°C to azeotropically dehydrate the water generated by the reaction, and then cooled to room temperature to prepare a slurry containing an organozinc catalyst (zinc glutarate).

(製造例2;聚碳酸伸丙酯之製造) 將已具備攪拌機、氣體導入管、溫度計的容量1L之高壓釜之系統內事先取代成氮環境氣體後,注入已利用製造例1製得之含有有機鋅催化劑的漿液117.3g(含有有機鋅催化劑135mmol)、甲苯530.0g、環氧丙烷78.3g(1.35mol)。其次,攪拌下,加入二氧化碳,並將二氧化碳填充至反應系統內構成1MPa為止。然後,升溫至60℃,一邊補給因反應而消耗的二氧化碳,一邊進行8小時聚合反應。反應結束後,將高壓釜冷卻而脫壓,並將反應溶液過濾後,進行減壓乾燥,製得聚碳酸伸丙酯100.3g。所製得聚碳酸伸丙酯之Mw為236000。(Manufacturing Example 2; Manufacturing of Polypropylene Carbonate) After replacing the system of a 1L autoclave equipped with a stirrer, a gas introduction tube, and a thermometer with a nitrogen atmosphere in advance, inject 117.3g of the slurry containing the organozinc catalyst prepared in Production Example 1 (containing 135mmol of the organozinc catalyst ), toluene 530.0g, propylene oxide 78.3g (1.35mol). Next, under stirring, carbon dioxide is added, and the carbon dioxide is filled until the reaction system constitutes 1 MPa. Then, the temperature was raised to 60°C, and the polymerization reaction was performed for 8 hours while replenishing the carbon dioxide consumed by the reaction. After the completion of the reaction, the autoclave was cooled and depressurized, and the reaction solution was filtered and dried under reduced pressure to obtain 100.3 g of polypropylene carbonate. The Mw of the obtained polypropylene carbonate was 236000.

(製造例3;聚碳酸伸乙酯之製造) 除了使用環氧乙烷59.0g以取代環氧丙烷外,進行與製造例2相同的操作,製得聚碳酸伸乙酯102.1。所製得聚碳酸伸乙酯之Mw為210000。(Manufacturing Example 3; Manufacturing of Polyethylene Carbonate) Except that 59.0 g of ethylene oxide was used instead of propylene oxide, the same operation as in Production Example 2 was performed to obtain polyethylene carbonate 102.1. The Mw of the obtained polyethylene carbonate was 210,000.

(製造例4;聚碳酸環己烯酯之製造) 除了使用環氧環己烷130.0g以取代環氧丙烷外,進行與製造例2相同的操作,製得聚碳酸環己烯酯75.3g。所製得聚碳酸環己烯酯之Mw為258000。(Production Example 4; Production of Polycyclohexenyl Carbonate) Except that 130.0 g of cyclohexene oxide was used instead of propylene oxide, the same operation as in Production Example 2 was performed to obtain 75.3 g of polycyclohexene carbonate. The Mw of the obtained polycyclohexenyl carbonate was 258,000.

(實施例1) 令製造例2中製得的聚碳酸伸丙酯100質量份及乙基纖維素(半井(Nacalai Tesque)製造試劑,Mw=180000,取代度2.6)11質量份溶解於氯仿1000質量份中,於室溫下均勻混合後,使該溶液乾燥,藉此製得樹脂組成物。(Example 1) 100 parts by mass of polypropylene carbonate prepared in Production Example 2 and 11 parts by mass of ethyl cellulose (Nacalai Tesque manufacturing reagent, Mw=180000, degree of substitution 2.6) were dissolved in 1000 parts by mass of chloroform, After uniformly mixing at room temperature, the solution is dried, thereby preparing a resin composition.

(實施例2~6、比較例1~2) 除了將聚碳酸伸丙酯(PPC)及乙基纖維素(EC)之摻合量變更為如後揭表1所示之外,藉由與實施例1相同的方法,製得樹脂組成物。(Examples 2 to 6, Comparative Examples 1 to 2) Except that the blending amounts of polypropylene carbonate (PPC) and ethyl cellulose (EC) were changed as shown in Table 1 to be disclosed later, the resin composition was prepared by the same method as in Example 1.

[表1]

Figure 02_image003
[Table 1]
Figure 02_image003

含有特定量之聚碳酸伸烷酯及纖維素系樹脂的樹脂組成物會構成以下結果:相較於單獨的聚碳酸伸烷酯,絲黏長度至少減半。熱分解性相較於單獨的纖維素系樹脂,分解開始溫度大幅降低,殘渣亦大幅減低,因此,實施例之樹脂組成物亦顯示優異之熱分解性。A resin composition containing a specific amount of polyalkylene carbonate and cellulose resin will have the following result: Compared with the polyalkylene carbonate alone, the length of the silk is reduced by at least half. Compared with the cellulose resin alone, the decomposition start temperature is greatly reduced, and the residue is also greatly reduced. Therefore, the resin composition of the examples also exhibits excellent thermal decomposition.

以等重量混合有聚碳酸伸烷酯及纖維素系樹脂的實施例5中,殘渣量比起纖維素系樹脂獨自的一半更為減少。認為這是因為聚碳酸伸烷酯之熱分解反應作用於纖維素系樹脂之熱分解反應,樹脂組成物全體變得更容易熱分解的緣故(即,樹脂組成物之熱分解特性加成提升的緣故)。In Example 5 in which the polyalkylene carbonate and the cellulose resin were mixed in equal weight, the amount of residue was reduced more than half of the cellulose resin alone. It is believed that this is because the thermal decomposition reaction of polyalkylene carbonate acts on the thermal decomposition reaction of the cellulose resin, and the entire resin composition becomes easier to thermally decompose (that is, the thermal decomposition characteristic of the resin composition is increased reason).

(實施例7) 除了將乙基纖維素變更為羥丙基纖維素(富士軟片和光純藥製造試劑,Mw=380000,取代度2.9)外,藉由與實施例1相同的方法,製得樹脂組成物。(Example 7) Except for changing ethyl cellulose to hydroxypropyl cellulose (Fuji Film Wako Pure Chemical Industries, Ltd. Reagent, Mw=380000, degree of substitution 2.9), a resin composition was prepared by the same method as in Example 1.

(實施例8、比較例3) 除了將聚碳酸伸丙酯(PPC)及羥丙基纖維素(HPC)之摻合量變更為如後揭表2所示之外,藉由與實施例7相同的方法,製得樹脂組成物。(Example 8, Comparative Example 3) Except that the blending amount of polypropylene carbonate (PPC) and hydroxypropyl cellulose (HPC) was changed as shown in Table 2 below, the same method as in Example 7 was used to obtain a resin composition .

(實施例9) 除了將乙基纖維素變更為乙酸丁酸纖維素(奧瑞奇(Aldrich)製造試劑,Mw=140000,取代度2.5)外,藉由與實施例1相同的方法,製得樹脂組成物。(Example 9) Except for changing ethyl cellulose to cellulose acetate butyrate (Aldrich manufacturing reagent, Mw=140000, degree of substitution 2.5), a resin composition was prepared by the same method as in Example 1.

(實施例10、比較例4) 除了將聚碳酸伸丙酯(PPC)及乙酸丁酸纖維素(CAB)之摻合量變更為如後揭表2所示之外,藉由與實施例9相同的方法,製得樹脂組成物。(Example 10, Comparative Example 4) Except that the blending amounts of polypropylene carbonate (PPC) and cellulose acetate butyrate (CAB) were changed as shown in Table 2 below, the same method as in Example 9 was used to prepare a resin composition .

[表2]

Figure 02_image005
[Table 2]
Figure 02_image005

(實施例11) 除了將製造例2中所製得聚碳酸伸丙酯變更為製造例3中所製得聚碳酸伸乙酯外,藉由與實施例1相同的方法,製得樹脂組成物。(Example 11) The resin composition was prepared by the same method as in Example 1, except that the polypropylene carbonate obtained in Production Example 2 was changed to the polypropylene carbonate obtained in Production Example 3.

(實施例12、比較例5) 除了將聚碳酸伸乙酯(PEC)及乙基纖維素(EC)之摻合量變更為如後揭表3所示之外,藉由與實施例11相同的方法,製得樹脂組成物。(Example 12, Comparative Example 5) Except that the blending amounts of polyethylene carbonate (PEC) and ethyl cellulose (EC) were changed as shown in Table 3 to be disclosed later, a resin composition was prepared by the same method as in Example 11.

(實施例13) 除了將製造例2中所製得聚碳酸伸丙酯變更為製造例4中所製得聚碳酸環己烯酯外,藉由與實施例1相同的方法,製得樹脂組成物。(Example 13) Except that the polypropylene carbonate obtained in Production Example 2 was changed to the polycyclohexenyl carbonate produced in Production Example 4, a resin composition was produced by the same method as in Example 1.

(實施例14、比較例6) 除了將聚碳酸環己烯酯(PCHC)及乙基纖維素(EC)之摻合量變更為如後揭表3所示之外,藉由與實施例13相同的方法,製得樹脂組成物。(Example 14, Comparative Example 6) Except that the blending amount of polycyclohexenyl carbonate (PCHC) and ethyl cellulose (EC) was changed as shown in Table 3 below, the resin composition was obtained by the same method as in Example 13 .

[表3]

Figure 02_image007
[table 3]
Figure 02_image007

由表2及表3可明白,無論纖維素系樹脂之種類及聚碳酸伸烷酯之種類,樹脂組成物皆不易引起絲黏,且熱分解性亦可加成提升。From Table 2 and Table 3, it can be understood that regardless of the type of cellulose resin and the type of polyalkylene carbonate, the resin composition is not easy to cause stickiness, and the thermal decomposition property can be additively improved.

產業上之可利用性 本發明之樹脂組成物具有優異熱分解性,且使用作為糊材料時的絲黏性亦優異。依此,本發明之樹脂組成物可適當地使用在糊材料中,並且可採用例如在電子構件之製造時經濟性優異的印刷製程,尤其是網版印刷製程。Industrial availability The resin composition of the present invention has excellent thermal decomposition properties and also excellent silk viscosity when used as a paste material. Accordingly, the resin composition of the present invention can be suitably used in paste materials, and, for example, a printing process with excellent economic efficiency in the manufacture of electronic components, especially a screen printing process, can be used.

(無)(no)

Claims (6)

一種燒成用黏結劑樹脂組成物,係使用作為燒成用黏結劑樹脂的組成物,且,含有聚碳酸伸烷酯及纖維素系樹脂。A binder resin composition for firing is a composition used as a binder resin for firing, and contains polyalkylene carbonate and cellulose resin. 如請求項1之燒成用黏結劑樹脂組成物,其中前述纖維素系樹脂為選自於由烷基纖維素、羥烷基纖維素及酯化纖維素所構成群組中之1種以上。The binder resin composition for firing according to claim 1, wherein the cellulose resin is one or more selected from the group consisting of alkyl cellulose, hydroxyalkyl cellulose, and esterified cellulose. 如請求項1或2之燒成用黏結劑樹脂組成物,其中前述聚碳酸伸烷酯含有下述通式(1)表示的結構單元: [化學式1]
Figure 03_image001
(式中,R1 、R2 、R3 及R4 為相同或相異,表示氫原子、可經取代基取代之碳數1至10之直鏈或支鏈烷基、或可經取代基取代之碳數6至20之芳基;R1 、R2 、R3 及R4 中,2個可相互鍵結,形成可經取代基取代之3員環至10員環之脂肪族環)。
The binder resin composition for firing according to claim 1 or 2, wherein the aforementioned polyalkylene carbonate contains a structural unit represented by the following general formula (1): [Chemical formula 1]
Figure 03_image001
(In the formula, R 1 , R 2 , R 3 and R 4 are the same or different, and represent a hydrogen atom, a linear or branched alkyl group with 1 to 10 carbon atoms that may be substituted by a substituent, or a substituent that may be substituted Substituted aryl group with 6 to 20 carbon atoms; two of R 1 , R 2 , R 3 and R 4 may be bonded to each other to form an aliphatic ring from a 3-membered ring to a 10-membered ring which may be substituted by a substituent) .
如請求項1至3中任一項之燒成用黏結劑樹脂組成物,其中前述聚碳酸伸烷酯為選自於由聚碳酸伸乙酯、聚碳酸伸丙酯、聚碳酸伸丁酯及聚碳酸環己烯酯所構成群組中之1種以上。The binder resin composition for firing according to any one of claims 1 to 3, wherein the aforementioned polyalkylene carbonate is selected from the group consisting of polyethylene carbonate, polypropylene carbonate, polybutylene carbonate and One or more of the group consisting of polycyclohexenyl carbonate. 如請求項1至4中任一項之燒成用黏結劑樹脂組成物,其中相對於前述聚碳酸伸烷酯100質量份,含有前述纖維素系樹脂10質量份以上、100質量份以下。The binder resin composition for firing according to any one of claims 1 to 4, which contains 10 parts by mass or more and 100 parts by mass or less of the cellulose resin with respect to 100 parts by mass of the polyalkylene carbonate. 一種糊組成物,含有如請求項1至5中任一項之燒成用黏結劑樹脂組成物、溶劑及無機粉末。A paste composition containing the binder resin composition for firing according to any one of claims 1 to 5, a solvent, and an inorganic powder.
TW109126911A 2019-08-09 2020-08-07 Binder resin composition for burning use, and paste composition TW202113020A (en)

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