TW202106933A - Substrate processing apparatus - Google Patents

Abstract

Provided is a substrate processing apparatus capable of reducing the outflow rate of a liquid from a processing tank during the transportation of a substrate holder. A substrate processing apparatus 100 according to the present invention comprises: a processing tank 160, a liquid supply pipe 302 for supplying liquid to the processing tank 160, a supply valve 304 for adjusting the flow rate of the liquid flowing through the liquid supply pipe 302, a liquid discharge unit 330 for discharging the liquid from the processing tank 160, a transporter 144 for extracting a substrate holder 180 accommodated in the processing tank 160 from the processing tank 160, and a control unit 400, wherein the control unit 400 controls at least one of the supply valve 304 and the liquid discharge unit 330 so that when the transporter 144 extracts the substrate holder 180 from the liquid, the lower end portion of the substrate holder 180 separates from the liquid surface while the liquid level of the liquid held in the processing tank 160 is being raised.

Description

Substrate processing device

The present invention relates to a substrate processing device.

In order to plate the surface of the substrate, a plating device is used. The plating apparatus is equipped with a plating tank which holds a plating solution, and performs plating on the substrate by immersing the substrate in the plating solution. The plating device holds the substrate in the substrate holder, and then transports the substrate together with the substrate holder to the plating tank and is immersed in the plating solution.

The substrate is transported in this way, but when the substrate holder is accommodated in the plating tank, the substrate holder may collide with the liquid surface of the plating solution, and the plating solution may be splashed. In addition, when the substrate holder is taken out from the plating tank, the plating solution may adhere to the substrate holder, and the plating solution may also be taken out from the plating tank. At this time, during transportation of the substrate holder, the plating solution may drip from the substrate holder. Therefore, when the plating solution flows out around the plating tank due to splashing and carrying out (drag out) of the plating solution, corrosion and pollution of the plating device may be caused. Furthermore, such a plating solution (dragging) from the plating tank will also cause economic losses.

In addition, in order to shorten the time required to process the substrate and increase the throughput, the plating apparatus requires a substrate holder to be transported at a high speed. However, the faster the substrate holder is transferred, the outflow of the plating solution may increase due to splashing and carrying (dragging) of the liquid, which highlights the above-mentioned problems. Therefore, there is a demand for a plating apparatus that can reduce the outflow of the plating solution even when the substrate holder is transported at a high speed. An example of such a plating apparatus is described in Patent Document 1.

Patent Document 1 discloses a plating apparatus provided with a substrate holder having a slightly sharp bottom end as shown in FIG. 9. When the plating device accommodates the substrate holder in the plating tank, it can prevent the liquid from splashing by the sharp shape of the tip. In addition, when the plating device takes out the substrate holder from the plating tank, the plating solution can quickly drop from the substrate holder through the tip of the sharp shape. That is, the plating device can allow most of the plating solution attached to the substrate holder to fall into the plating tank. In other words, the plating device can reduce the amount of plating solution carried out. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2015-131979

(The problem to be solved by the invention)

As described above, the plating device described in Patent Document 1 can reduce the amount of plating solution flowing out of the plating tank. However, although the plating device described in Patent Document 1 has a certain effect on the outflow of the plating solution, it does not completely prevent the outflow of the plating solution. In other words, the plating solution may still flow out of the plating tank.

In addition, the problem of liquid splashing and liquid carrying is not limited to the problem of the plating tank of the plating device. In addition to the plating tank, the plating device also has various treatment tanks, which is also a problem that also occurs in these treatment tanks. Furthermore, this problem is not only a plating device, but also a problem that occurs in all substrate processing devices that transport the substrate holder to the processing tank.

Therefore, the object of the present invention is to provide a method for removing a substrate holder, a method for accommodating a substrate holder, and a substrate processing apparatus that can reduce the flow of liquid from the processing tank when the substrate holder is transported in view of the above-mentioned problems. (Means to solve the problem) (Form 1)

The method for removing the substrate holder of the first form is to use a substrate holder for holding a substrate and a processing tank for processing the substrate, and at least a part of the substrate holder immersed in the liquid is taken out from the processing tank holding the liquid And has the following steps: moving the substrate holder upward to remove the substrate holder from the liquid; and raising the liquid level of the liquid held in the processing tank; the step of raising the liquid level It is performed during the process of removing the substrate holder from the liquid.

Generally speaking, when the substrate holder is removed from the liquid, the surface of the substrate holder will adhere to the liquid. In addition, when the substrate holder is taken out, when the lower end of the substrate holder is slightly higher than the liquid level of the liquid, a liquid column will be formed between the lower end of the substrate holder and the liquid surface. Then, the liquid attached to the substrate holder can pass through the liquid column and quickly return to the processing tank. However, if the lower end of the substrate holder is more than a certain distance away from the liquid surface, the liquid column disappears. When using the method of removing the substrate holder of form 1, the liquid level of the liquid rises when the substrate holder is taken out of the liquid. That is, the liquid column can be maintained for a long time than when the liquid level does not rise, and more liquid attached to the substrate holder can pass through the liquid column and quickly return to the processing tank. In other words, the method of taking out the substrate holder of the first aspect can reduce the amount of liquid outflow from the processing tank when the substrate holder is transported compared to when the liquid level is not raised. (Form 2)

The substrate processing apparatus of form 2 includes: a substrate holder for holding a substrate; a processing tank for holding a liquid; a liquid supply pipe for supplying the liquid in the processing tank; a supply valve, which It is installed in the liquid supply pipe for adjusting the flow rate of the liquid flowing through the liquid supply pipe; the liquid discharge part is used to discharge the liquid from the processing tank; the conveyor is used to hold and house The substrate holder of the processing tank is moved upward to take out the substrate holder from the processing tank; and a control part; the control part, when the conveyor takes out the substrate holder from the liquid, At least one of the supply valve and the liquid discharge part is controlled such that the liquid level of the liquid held in the processing tank is raised while the lower end of the substrate holder is separated from the liquid level of the liquid.

In the case of the substrate processing apparatus of the form 2, the liquid level rises when the substrate holder is taken out from the liquid in the same way as the method of taking out the substrate holder of the form 1. Therefore, the substrate processing apparatus can reduce the outflow amount of the liquid from the processing tank when the substrate holder is transported when the liquid level is not raised. (Form 3)

The storage method of the substrate holder of form 3 uses the substrate holder for holding the substrate and the processing tank for processing the substrate, and the processing tank holding the liquid is accommodated in such a way that at least part of it is immersed in the liquid The substrate holder has the following steps: moving the substrate holder downward to accommodate the substrate holder in the processing tank; and lowering the liquid level of the liquid held in the processing tank; when the substrate When the lower end of the holder is in contact with the liquid surface, at least the step of lowering the liquid surface is performed.

When the substrate holder storage method of form 3 is adopted, the liquid level drops when the lower end of the substrate holder contacts the liquid surface. Therefore, when the specific liquid level is not lowered, the impact when the substrate holder collides with the liquid surface is reduced, and liquid splashing is reduced. That is, the storage method of the substrate holder of form 3 can reduce the amount of liquid outflow from the processing tank when the substrate holder is transported when the liquid level is not lowered. (Form 4)

The substrate processing apparatus of form 4 includes: a substrate holder for holding a substrate; a processing tank for holding liquid; a liquid discharge portion for discharging the liquid from the processing tank; and a conveyor, which is It is used to hold the substrate holder to move downward, and accommodate the substrate holder in the processing tank; and a control part; when the lower end of the substrate holder is in contact with the liquid surface, the control part is used to make at least The manner in which the liquid level is lowered controls the liquid discharge portion.

In the case of the substrate processing apparatus of the form 4, the liquid level drops when the lower end of the substrate holder is in contact with the liquid surface in the same way as the storage method of the substrate holder of the form 3. Therefore, in the substrate processing apparatus of the fourth aspect, when the specific liquid level is not lowered, the outflow amount of the liquid from the processing tank when the substrate holder is transported can be reduced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or equivalent elements are marked with the same symbols, and repeated descriptions are omitted. [The first embodiment] ＜Constitution＞

Fig. 1 is a top view of the plating apparatus of the first embodiment. 1, the plating apparatus 100 includes a temporary storage box 124, a pre-wetting tank 126, a prepreg tank 128, a first washing tank 130a, a spray tank 132, a second washing tank 130b, and a plurality of plating tanks 220 , Overflow tank 260 and substrate conveying device 140. In addition, the pre-wetting tank 126, the prepreg tank 128, the first washing tank 130a, the blowing tank 132, the second washing tank 130b, and the plating tank 220 may be referred to as a processing tank 160. An example of the plating device 100 is a wet and vertical electrolytic plating device. The plating apparatus 100 is an apparatus that performs a plating process on the substrate W by performing a known process on the substrate W in each processing tank 160.

Hereinafter, each element of the plating apparatus 100 will be described. The temporary storage box 124 is a place for storing and temporarily placing the substrate holder 180. The pre-wetting tank 126 holds pure water. The pre-wetting tank 126 improves the hydrophilicity of the substrate W by immersing the substrate W in pure water to wet the surface. The prepreg tank 128 holds sulfuric acid. The prepreg bath 128 has a function of immersing the substrate W in sulfuric acid to etch and remove the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate W. The first washing tank 130a holds a washing liquid (pure water, etc.). The first cleaning tank 130a is used to clean the pre-soaked substrate W and the substrate holder 180 with a cleaning solution. The spray groove 132 has a function of drying the substrate W by spraying nitrogen to the substrate W accommodated in the groove. The second washing tank 130b holds a washing liquid (pure water, etc.). The second cleaning tank 130b cleans the plated substrate W and the substrate holder 180 with a cleaning solution. The plurality of plating tanks 220 are arranged adjacent to each other. The overflow tank 260 is arranged so as to surround the outer circumference of the plurality of plating tanks 220. In addition, the detailed structure of the plating tank 220 and the overflow tank 260 is mentioned later.

The substrate conveying device 140 includes a horizontal rail 142 and two conveyors 144a and 144b. In addition, the conveyor 144a and the conveyor 144b have the same structure, and therefore may be referred to as the conveyor 144 for short. One example of the substrate transfer device 140 is a linear motor method. An example of the horizontal rail 142 is adjacent to the temporary storage box 124, the pre-wetting tank 126, the prepreg tank 128, the first washing tank 130a, the blowing tank 132, the second washing tank 130b, and the plating unit arranged in a straight line. 200 while extending linearly.

The conveyors 144a and 144b can move along the horizontal rail 142 respectively. The conveyors 144a and 144b are provided with a temporary storage box 124, a pre-wetting tank 126, a prepreg tank 128, a first washing tank 130a, a blowing tank 132, a second washing tank 130b, and a plating tank by existing methods. The function of transferring the substrate holder 180 between 220. In addition, as long as the plating apparatus 100 can transport the substrate holder 180 between the processing tanks 160, it may not include the conveyor 144b and only include the conveyor 144a. In addition, the conveyors 144a and 144b not only transport the substrate holder 180 that holds the substrate W, but also transport the substrate holder 180 that does not hold the substrate W.

FIG. 2 is an enlarged cross-sectional view showing the periphery of the plating tank 220 of the plating device 100. As shown in FIG. A more detailed structure of the plating tank 220 will be described with reference to FIG. 2. In addition, FIG. 1 shows an example in which the plating apparatus 100 has a plurality of plating tanks 220. In addition, FIG. 2 shows an example in which the plating apparatus 100 has one plating tank 220 in order to simplify the illustration.

2, an example of the plating apparatus 100 further includes: a liquid supply pipe 302, a supply valve 304, a liquid discharge pipe 306, a dump valve 308, an anode holder 310, an anode 312, and a substrate holder 180 , Plating power supply 204, 2 pumps 314a, 314b, 3 pipes 316, 318, 320, discharge tank 322, and control unit 400. In addition, the liquid discharge pipe 306 and the drain valve 308 are included in the liquid discharge portion 330.

In addition, the plating tank 220 has a regulation plate 222 (Regulation Plate), a membrane (membrane) 224, an anode chamber 226, a cathode chamber 228, a high water level sensor 232, and a low water level sensor 234. An example of the plating tank 220 is constituted by a rectangular parallelepiped container with an upper opening. In the plating tank 220, an adjustment plate 222 is arranged substantially in the center so as to divide the inside thereof into two. Thereby, the inside of the plating tank 220 is divided into an anode chamber 226 and a cathode chamber 228. In addition, the adjustment plate 222 is made of a dielectric and has a circular opening 223 in the center. Then, a diaphragm 224 is attached to the opening 223. The diaphragm 224 is an ion exchange membrane that does not allow the plating solution to pass through but can exchange the ion between the plating solution in the cathode chamber 228 and the plating solution in the anode chamber 226. Therefore, the plating solution on the side of the anode chamber 226 and the plating solution on the side of the cathode chamber 228 cannot move freely in the storage room.

The high water level sensor 232 is installed near the opening of the upper end of the plating tank 220, and has the function of detecting whether the liquid level L of the plating solution is at a position higher than the height h1 by the existing method. In addition, the low water level sensor 234 is installed near the bottom surface of the plating tank 220, and has the function of detecting whether the liquid level L of the plating solution is at a position higher than the height h2 by the existing method.

The anode holder 310 is housed in the anode chamber 226 while holding the anode 312. An example of the anode 312 is the use of phosphorous copper. The substrate holder 180 is housed in the cathode chamber 228 in such a manner that the substrate W is arranged at a position opposite to the anode 312. In addition, the substrate holder 180 is transported from directly above the plating tank 220 to the position shown in the figure by the conveyor 144 (refer to FIG. 1 ). The plating power supply 204 is electrically connected to the substrate W and the anode 312 and passes current between the substrate W and the anode 312. Thereby, a plating film (copper film) is formed on the surface of the substrate W.

An example of the overflow tank 260 is constituted by a rectangular parallelepiped container with the upper part opened, and the plating tank 220 is accommodated inside. In other words, the overflow tank 260 is arranged to surround the outer circumference of the plating tank 220. Therefore, the overflow tank 260 can receive the plating solution overflowing from the plating tank 220. In more detail, the overflow tank 260 is divided into a first part 262 and a second part 264 by a partition plate (not shown). The first part 262 can accept the plating solution overflowing from the cathode chamber 228, and the second part 264 can accept the plating solution overflowing from the anode chamber 226.

The liquid supply pipe 302 communicates the pump 314 a with the cathode chamber 228. In addition, the pipe 316 connects the pump 314a with the first portion 262. Therefore, the pump 314 a can pump the plating solution remaining in the first portion 262 to the cathode chamber 228 via the pipe 316 and the liquid supply pipe 302. That is, the liquid supply pipe 302 is used to supply the plating liquid to the cathode chamber 228. In other words, the plating solution circulates between the cathode chamber 228, the first portion 262, the pipe 316, the pump 314a, and the liquid supply pipe 302. The supply valve 304 is attached to the liquid supply pipe 302. The supply valve 304 has a function of adjusting the flow rate of the plating liquid flowing through the liquid supply pipe 302. One example is that when the substrate holder 180 is not immersed in the plating tank 220 and the substrate W is being plated, the pump 314a changes the flow rate through the pipe 316 to the first circulation flow rate. Way of operation.

The pipe 318 communicates the pump 314b with the anode chamber 226. In addition, the pipe 320 communicates the pump 314b with the second portion 264. Thereby, the plating solution can circulate among the anode chamber 226, the second part 264, the pipe 320, the pump 314b, and the pipe 318.

The liquid discharge pipe 306 is installed in the plating tank 220 and communicates the discharge tank 322 with the cathode chamber 228. Thereby, the liquid discharge pipe 306 is used to discharge the plating liquid from the cathode chamber 228 of the plating tank 220. The drain valve 308 is attached to the liquid discharge pipe 306. The drain valve 308 has a function of adjusting the flow rate of the plating liquid flowing through the liquid discharge pipe 306. The drain tank 322 has a function of temporarily storing the plating solution. The plating liquid discharged from the cathode chamber 228 is supplied to the discharge tank 322 via the liquid discharge pipe 306. In addition, the plating solution temporarily stored in the discharge tank 322 is returned to the first portion 262 by pumping (not shown).

The control unit 400 has a function of moving the conveyor 144 by controlling the conveyor 144 (refer to FIG. 1 ). In addition, the control unit 400 has a function of adjusting the opening and closing of the supply valve 304 and the drain valve 308. Furthermore, by controlling the supply valve 304 and the pump 314a, it has a function of controlling the flow rate of the plating liquid supplied from the liquid supply pipe 302 to the cathode chamber 228. <How to store substrate holder>

Next, the operations, effects, and supplements will be described in order of the method of accommodating the substrate holder 180 in the plating apparatus 100. <action>

The operation of accommodating the substrate holder 180 in the plating tank 220 will be described with reference to FIGS. 3 and 4. FIG. 3 is a flowchart showing a control process step of the plating apparatus 100 when the substrate holder 180 is accommodated, and FIG. 4 is an explanatory diagram of the operation of the plating apparatus 100 when the control shown in FIG. 3 is performed. In addition, the term "accommodating the substrate holder 180 in the plating tank 220" refers to the cathode chamber 228 in the plating tank 220, and the term "removing the substrate holder 180 from the plating tank 220" means removing the substrate holder 180 from the plating tank 220. The cathode chamber 228 is taken out.

When the substrate holder 180 is accommodated, first, in step S110, the control unit 400 moves the conveyor 144 so that the conveyor 144 holding the substrate holder 180 comes directly above the plating tank 220 (refer to FIG. 4A). At this time, the supply valve 304 is opened and the drain valve 308 is closed. That is, the plating solution is supplied to the plating tank 220 through the liquid supply pipe 302, but is not discharged from the plating tank 220 through the liquid discharge pipe 306. Thereby, the plating tank 220 overflows the plating solution.

Next, the control unit 400 lowers the liquid level L of the plating solution in step S120. Specifically, the control unit 400 closes the supply valve 304 and opens the drain valve 308. Next, the control unit 400 lowers the conveyor 144 in step S130 (see FIG. 4B). Thereby, the conveyor 144 descends, and the substrate holder 180 contacts the liquid level L. (Refer to Figure 4C). In addition, when the lower end of the substrate holder 180 is in contact with the liquid surface L, the control unit 400 performs the processing of step S120 and step S130 in such a manner that the liquid surface L drops. In other words, when the lower end of the substrate holder 180 is in contact with the liquid level L, the control unit 400 controls the drain valve 308 in such a way that the liquid level L is lowered. In addition, the control unit 400 may also change the processing sequence of step S120 and step S130.

Next, the control unit 400 estimates the contact between the substrate holder 180 and the liquid surface L in step S140. An example of this contact estimation is based on the descending speed of the substrate holder 180, the descending speed of the liquid level L, the opening time point (timing) of the relief valve 308, the descending time point of the conveyor 144, and the like. Because if the descending speed of the substrate holder 180, the descending speed of the liquid level L, the opening time point of the drain valve 308, and the descending time point of the conveyor 144 are known, the contact time point of the substrate holder 180 and the liquid level L is known . In addition, the descending speed of the substrate holder 180, the descending speed of the liquid level L, the opening time of the drain valve 308, and the descending time of the conveyor 144 can also be measured and set if the plating device 100 is installed. In addition, when the conveyor 144 reaches the specified height, the control unit 400 can also infer that the substrate holder 180 is in contact with the liquid level L.

Next, after the processing of step S140 is completed, the control unit 400 raises the liquid level L of the plating solution in step S150 (see FIG. 4D). Specifically, the control unit 400 closes the drain valve 308 and opens the supply valve 304.

Then, when the substrate holder 180 reaches the designated position in the plating tank 220 (the position in FIG. 2), the substrate holder 180 is completed in the plating tank 220 in step 160 (refer to FIG. 4E). In other words, the control process of accommodating the substrate holder 180 performed by the control unit 400 is completed.

In addition, after that, the plating solution overflows from the plating tank 220 again, and the substrate W is plated inside the plating tank 220. In addition, after accommodating the substrate holder 180 is completed, the conveyor 144 releases the held substrate holder 180 and conveys other substrate holders 180. <effect>

The plating apparatus 100 is as described above. When the lower end of the substrate holder 180 contacts the liquid level L, the liquid level L drops. Therefore, when the specific liquid level L is not lowered, the impact when the substrate holder 180 collides with the liquid level L is reduced, and liquid splashing is reduced. That is, the plating apparatus 100 can reduce the amount of plating solution flowing out of the plating tank 220 when the substrate holder 180 is transported. (Supplement for the storage method of the substrate holder)

Hereinafter, the method of accommodating the substrate holder 180 in the plating apparatus 100 will be supplemented. (Supplement 1) The control unit 400 may also use the substrate holder 180 before the substrate holder 180 contacts the liquid level L of the plating solution, that is, after the substrate holder 180 is moved downward, and before the liquid level L contacts the substrate holder 180, The lowering speed of the holder 180 is decelerated to control the conveyor 144. In this way, the impact when the substrate holder 180 collides with the liquid surface L can be further reduced, and liquid splashing can be further reduced. That is, the plating device 100 can further reduce the amount of plating solution flowing out of the plating tank 220. (Supplement 2)

The control unit 400 may also control the drain valve 308 in such a way that the liquid level L is only lowered to a height where the diaphragm 224 is not exposed when the liquid level L of the plating liquid is lowered. In this way, the diaphragm 224 can be prevented from being exposed to the atmosphere and aging. (Supplement 3)

In addition, the plating tank 220 may not have the diaphragm 224 (refer to FIG. 2). At this time, the control unit 400 may also control the drain valve 308 in such a way that when the liquid level L of the plating liquid held in the plating tank 220 is lowered, only the liquid level L is lowered to a height where the anode 312 is not exposed. . In this way, the anode 312 can be prevented from being exposed to the atmosphere and aging. (Supplement 4)

In addition, when the liquid level L is lowered, the control unit 400 may discharge the substrate holder 180 with the liquid discharge pipe 306 and store the substrate holder 180 in the plating tank 220. The volume is equal to the volume of the portion of the substrate holder 180 immersed in the plating solution. The drain valve 308 is controlled by the plating solution.

When the substrate holder 180 is accommodated in the plating tank 220, the liquid level L rises in accordance with the volume of the portion where the substrate holder 180 is immersed in the plating solution. In other words, by the control unit 400 performing the above-mentioned control, when the accommodating of the substrate holder 180 is completed, the plating tank 220 is filled with plating liquid. Therefore, there is no time for the plating solution to overflow after accommodating the substrate holder 180. (Supplement 5)

After confirming that the liquid level L is lower than the height h1 using the high water level sensor 232, the control unit 400 may control the conveyor 144, the supply valve 304, and the discharge valve by contacting the lower end of the substrate holder 180 with the liquid level L. 308. Thereby, the control unit 400 can use the high water level sensor 232 to confirm that the liquid level L has dropped correctly before the lower end of the substrate holder 180 comes into contact with the liquid level L. In addition, in order for the high water level sensor 232 to confirm the drop of the liquid level L, the liquid level L needs to drop below the height h1. That is, the height h1 is a height lower than the liquid level L when the plating liquid overflows in the plating tank 220, and is a height higher than the liquid level L when the liquid level L drops and becomes the lowest. (Supplement 6)

The control unit 400 raises or lowers the liquid level L of the plating solution, but it may be raised or lowered by a method other than the above-mentioned method. For example, the control unit 400 does not close the supply valve 304 but only opens the drain valve 308 to lower the liquid level L. In addition, the control unit 400 may open the drain valve 308 with the supply valve 304 opened, and after the liquid level L drops, close the drain valve 308 to increase the liquid level L. In other words, the control unit 400 may raise the liquid level L without controlling the supply valve 304. ＜How to take out the substrate holder＞

Next, the method of taking out the substrate holder 180 from the plating apparatus 100 will be described in order of actions, effects, and supplements. <action>

First, with reference to FIGS. 5 and 6, the operation of taking out the substrate holder 180 from the plating tank 220 after the plating process on the substrate W is completed. FIG. 5 is a flowchart showing a control processing procedure when the substrate holder 180 is taken out from the plating apparatus 100, and FIG. 6 is an explanatory diagram of the operation of the plating apparatus 100 when the control shown in FIG. 5 is performed.

When the plating process on the substrate W is completed, first, in step S310, the control unit 400 moves the conveyor 144 so that the conveyor 144 comes directly above the plating tank 220 (see FIG. 6A). Next, when the conveyor 144 moves, the control unit 400 lowers the liquid level L of the plating solution in step S320 (refer to FIG. 6A). Specifically, the control unit 400 closes the supply valve 304 and opens the drain valve 308. In addition, the control unit 400 may also change the order of the processing of step S310 and step S320.

Next, the control unit 400 lowers the conveyor 144 in step S330 (refer to FIG. 6B). The conveyor 144 holds the substrate holder 180 when the lowering is completed. Next, the control unit 400 uses the high water level sensor 232 to confirm the drop of the liquid level L in step S340. In other words, the control unit 400 confirms the drop of the liquid level L by confirming that the liquid level L is lower than the height h1.

Next, when the liquid level L is sufficiently lowered, the control unit 400 raises the liquid level L of the plating solution in step S350 (refer to FIG. 6C). Specifically, the control unit 400 closes the drain valve 308 and opens the supply valve 304, and causes the pump 314a (refer to FIG. 2) to increase the supply amount of the plating solution. An example is that the pump 314a is operated to increase the supply amount (circulation flow rate) of the plating solution compared to the first circulation flow rate. Next, the control unit 400 raises the conveyor 144 in step S360 (refer to FIG. 6C). Thereby, the substrate holder 180 held by the conveyor 144 rises. In other words, when the conveyor 144 takes out the substrate holder 180 from the plating solution, the control unit 400 raises the level L of the plating solution held in the plating tank 220, and at the same time raises the lower end of the substrate holder 180 from The supply valve 304 is controlled in the manner in which the liquid level L of the plating solution leaves. In addition, an example of the time point when the control unit 400 raises the liquid level L is based on the depth at which the substrate holder 180 is immersed in the plating liquid, the height of the liquid level L when the liquid level L is lowered in step S320, and the substrate holder 180 The rising speed, the amount of plating solution supplied by the pump 314a, etc., are determined in advance and managed in time.

Next, when the lower end of the substrate holder 180 leaves the plating solution and reaches a position higher than the liquid level L, the control unit 400 controls the conveyor 144 to increase the moving speed of the substrate holder 180 in the upward direction (step S370) . Then, when the conveyor 144 is fully raised, the removal of the substrate holder 180 is completed in step S380. (Refer to Figure 6D). <effect> (First effect)

In the past plating device, when the substrate holder is taken out, the plating tank overflows the plating solution. That is, when the substrate holder is taken out, the liquid level is at a certain height. However, the plating apparatus 100 raises the liquid level L of the liquid when the substrate holder 180 is taken out of the plating liquid. Thereby, the plating apparatus 100 can reduce the amount of plating solution flowing out of the plating tank 220 when the substrate holder 180 is transported by the plating apparatus 100 in the past. The reason is explained using FIG. 7 as follows.

FIG. 7 is an enlarged view showing the liquid level L and the part of the substrate holder 180 when the substrate holder 180 is taken out from the plating solution. FIG. 7 shows that the lower end of the substrate holder 180 is located slightly above the liquid level L of the plating solution. At this time, a liquid column LC is formed between the lower end of the substrate holder 180 and the liquid surface L. Then, the plating solution attached to the substrate holder 180 can quickly return to the plating tank 220 through the liquid column LC. However, if the lower end of the substrate holder 180 is more than a certain distance away from the liquid level L of the plating solution, the liquid column LC disappears.

Here, when the method of taking out the substrate holder 180 in the plating apparatus 100 is adopted, as described above, when the substrate holder 180 is taken out of the plating liquid, the liquid level L of the liquid rises. That is, compared to when the liquid level L does not rise, the liquid column LC is maintained for a long time, and more plating liquid adhering to the substrate holder 180 can quickly return to the plating tank 220 through the liquid column LC. In other words, the plating device 100 can reduce the amount of plating solution flowing out of the plating tank 220 when the substrate holder 180 is transported compared to the conventional plating device.

In addition, the closer the rising speed of the liquid level L is to the take-out speed of the substrate holder 180, the longer the liquid column LC can be maintained, and the outflow of the plating solution from the plating tank 220 can be reduced. In other words, as the rising speed of the liquid level L is farther away from the taking-out speed of the substrate holder 180, the flow rate of the plating solution from the plating tank 220 increases. That is, when the plating apparatus 100 removes the substrate holder 180, regardless of the rising speed of the liquid level L, as long as the liquid level L can be raised slightly, it is possible to reduce the amount of plating liquid from the plating liquid compared with the conventional plating apparatus in which the liquid level does not rise. The outflow of the covering groove 220. (Second effect)

In addition, as described above, when the lower end of the substrate holder 180 leaves the plating solution and reaches a position higher than the liquid level L, the control unit 400 controls the conveyor 144 to accelerate the upward movement speed of the substrate holder 180 ( Step S370). Thereby, when the liquid column LC is formed, since the substrate holder 180 is slowly separated from the liquid surface L, the plating apparatus 100 can maintain the liquid column LC for a long time. In addition, the plating apparatus 100 can raise the substrate holder 180 at a higher speed after the liquid column LC disappears. That is, the outflow of the plating solution from the plating tank 220 can be reduced, and the conveying speed of the substrate holder 180 can be accelerated. ＜Supplement on how to take out the substrate holder＞

Hereinafter, the method of taking out the substrate holder 180 in the plating apparatus 100 will be supplemented. (Supplement 1) The control unit 400 uses the high water level sensor 232 to confirm the drop of the liquid level L in step S340. However, the plating device 100 can also replace the high water level sensor 232 and have a water level sensor dedicated to confirming the drop of the liquid level L. The control unit 400 uses a dedicated water level sensor to confirm the drop of the liquid level L, and can discharge a necessary and sufficient amount of plating solution when the liquid level L drops. Thereby, it is possible to prevent the occurrence of excessive discharge of the plating solution, and the problem of overflowing the plating solution for longer than necessary again can be prevented. (Supplement 2)

In addition, when the control unit 400 lowers the liquid level L, the control unit 400 may control the drain valve 308 only to lower the liquid level L to a height where the diaphragm 224 is not exposed. (Supplement 3)

In addition, when the plating tank 220 does not have the diaphragm 224, when the control unit 400 lowers the liquid level L, it is also possible to control the drain valve 308 so as to only lower the liquid level L to a height where the anode 312 is not exposed. (Supplement 4)

In addition, the control unit 400 may raise or lower the level L of the plating solution by a method other than the method described in the above (operation). For example, the control unit 400 may not close the supply valve 304 but only open the drain valve 308 to lower the liquid level L. In addition, the control unit 400 may open the drain valve 308 with the supply valve 304 opened, and after the liquid level L drops, close the drain valve 308 to raise the liquid level L. In other words, the control unit 400 may not control the supply valve 304 and the pump 314a to raise the liquid level L. [Second Embodiment] ＜Constitution＞

Fig. 8 is a perspective view of the plating tank of the plating device of the second embodiment. In addition, FIG. 9 is a plan view of the plating tank shown in FIG. 8, and FIG. 10 is a view of the AA arrow direction of FIG. 9. The plating apparatus of the second embodiment will be described with reference to FIGS. 8 to 10. Hereinafter, in the description of this embodiment, when the same parts and the like used in the first embodiment are used, even if there is no illustration, the symbols of the parts and the like are still used.

The plating apparatus of the second embodiment has a different structure from the plating apparatus 100 and the plating tank of the first embodiment. 8, the plating apparatus 600 includes a plating tank 620, a weir 660, an actuator 680 (see FIG. 10), and a control unit 700. In addition, the plating tank 620 has an adjustment plate 222, an anode chamber 226, a cathode chamber 228, side plates 622, 624, and 626, and notches 640, 642. Moreover, the notch 640, the weir 660, and the actuator 680 are included in the liquid discharge part 720 (refer FIG. 10).

In the plating tank 620, an adjustment plate 222 (refer to FIG. 9) is arranged substantially in the center so as to divide the inside thereof into two. Thereby, the inside of the plating tank 620 is divided into an anode chamber 226 and a cathode chamber 228. In addition, the cathode chamber 228 is surrounded by the side plate 622, the side plate 624, the side plate 626, and the adjustment plate 222 that constitute the wall surface thereof. Then, an example of the side plate 622 and the side plate 626 is adjacent to the wall surface of the overflow tank 260 to divide the boundary between the cathode chamber 228 and the first part 262 of the overflow tank 260. In addition, the side plate 626 has a cutout 642 formed so as to be lower than the side plate 624 and the adjustment plate 222 (refer to FIG. 8 ). In addition, the side plate 622 is formed with a notch 640 so as to be lower than the side plate 626. In other words, the side plate 622 and the side plate 626 are lower than the side plate 624 and the adjustment plate 222 which are other wall surfaces. Therefore, when the plating liquid overflows, the plating liquid passes over at least one of the side plate 622 and the side plate 626 and flows to the overflow tank 260. In other words, the notch 640 and the notch 642 are used to discharge the plating solution from the plating tank 620.

The weir 660 is composed of a roughly rectangular thin plate-shaped member, and is installed in such a way that the gap 640 is blocked. In addition, an actuator 680 is installed in the plating tank 620 (refer to FIG. 10 ). The actuator 680 can move the weir 660 in the vertical direction from the same height as the side plate 626 to the same height as the side plate 624. Thereby, when the weir 660 is moved downward by the actuator 680, the weir 660 moves in the direction of opening the notch 640, and the liquid level L in the cathode chamber 228 drops. In addition, when the weir 660 is moved upward by the actuator 680, the weir 660 moves in the direction of closing the notch 640, and the liquid level L in the cathode chamber 228 rises.

In addition, an example of the plating apparatus 600 does not include the liquid discharge piping 306 and the drain valve 308 that are provided in the plating apparatus 100 of the first embodiment. Then, the control unit 700 replaces the relief valve 308 controlled by the control unit 400 of the first embodiment, and controls the actuator 680. In other words, the control unit 700 can control the rise and fall of the liquid level L by controlling the actuator 680. <How to store substrate holder>

Next, regarding the method of accommodating the substrate holder 180 in the plating device 600, the actions, effects, and supplements will be described in order. <action>

First, referring to FIG. 11 and FIG. 12, the operation of accommodating the substrate holder 180 in the plating tank 620 will be described. FIG. 11 is a flowchart showing a control processing procedure when the plating device 600 accommodates the substrate holder 180, and FIG. 12 is an explanatory diagram of the operation of the plating device 600 when the control shown in FIG. 11 is performed.

When accommodating the substrate holder 180, first, in step S510, the control unit 700 moves the conveyor 144 so that the conveyor 144 holding the substrate holder 180 comes directly above the plating tank 620 (refer to FIG. 12A). At this time, the supply valve 304 is opened, and the plating tank 620 overflows with the plating solution.

Next, the control unit 700 lowers the liquid level L of the plating solution in step S520. Specifically, the control unit 700 closes the supply valve 304 and lowers the weir 660. Next, the control unit 700 lowers the conveyor 144 in step S530 (refer to FIG. 12B). Thereby, the conveyor 144 descends, and the substrate holder 180 contacts the liquid surface L (refer to FIG. 12C). In addition, when the lower end of the substrate holder 180 is in contact with the liquid surface L, the control unit 700 performs the processing of step S520 and step S530 in such a manner that the liquid surface L drops. In other words, when the lower end of the substrate holder 180 is in contact with the liquid level L, the control unit 700 controls the weir 660 in such a way that the liquid level L is lowered. In addition, the control unit 700 may also change the order of the processing of step S520 and step S530.

Next, the control unit 700 infers the contact between the substrate holder 180 and the liquid surface L in step S540. Here, the control unit 700 infers that the substrate holder 180 is in contact with the liquid surface L when the conveyor 144 reaches the specified height.

Next, the control unit 700 raises the weir 660 in step S550 after the processing of step S540 is completed (refer to FIG. 12D). In more detail, the control unit 700 raises the weir 660 after the lower end of the substrate holder 180 is in contact with the liquid surface L and before the substrate holder 180 is completely contained in the plating tank 620. Next, the control unit 700 opens the supply valve 304 in step S560.

Then, when the substrate holder 180 reaches the designated position in the plating tank 620 (the position in FIG. 2), the plating tank 220 is completed to receive the substrate holder 180 in step S570 (refer to FIG. 12E). In other words, the control process of accommodating the substrate holder 180 performed by the control unit 700 ends. <effect> (First effect)

The plating device 600 is as described above. When the lower end of the substrate holder 180 contacts the liquid level L, the liquid level L drops. Therefore, the plating apparatus 600, like the plating apparatus 100, can reduce the amount of plating solution flowing out of the plating tank 220 when the substrate holder 180 is transported. (Second effect)

In step S550, the control part 700 raises the weir 660 after the lower end of the substrate holder 180 is in contact with the liquid surface L and before the substrate holder 180 is completely housed in the plating tank 620. Thereby, the control unit 700 can shorten the time before overflowing than when the weir 660 is raised after the substrate holder 180 is completely accommodated in the plating tank 620. When the weir 660 rises before the substrate holder 180 is completely accommodated, the liquid level L rises while the substrate holder 180 is accommodated. Therefore, the amount of plating solution required for overflow after the weir 660 rises is reduced, and the time for filling the plating tank 620 with the plating solution after the weir 660 rises is shortened. <Supplement to the storage method of the substrate holder>

Hereinafter, the method of accommodating the substrate holder 180 in the plating device 600 will be supplemented. (Supplement 1) The control unit 700 raises or lowers the liquid level L of the plating solution, but it can be raised or lowered by methods other than the above-mentioned methods. For example, the control unit 700 may not close the supply valve 304 but only lower the weir 660 to lower the liquid level L. In addition, the control unit 700 may lower the weir 660 in a state where the supply valve 304 is opened, and after the liquid level L drops, the weir 660 may be raised to raise the liquid level L. In other words, the control unit 700 may raise the liquid level L without controlling the supply valve 304. (Supplement 2)

The control unit 700 moves the weir 660 in the vertical direction using the actuator 680 to raise or lower the liquid level L. However, it is preferable that the control part 700 can move the weir 660 to the direction of opening the notch 640 or the direction of closing the notch 640. When the control unit 700 moves the weir 660 to the direction of opening the gap 640, the liquid level L can be lowered, and when the weir 660 is moved to the direction of closing the gap 640, the liquid level L can be raised. For example, even if the control unit 700 does not move the weir 660 in the vertical direction, but moves the weir 660 in the left-right direction, the liquid level L can still be raised or lowered. ＜How to take out the substrate holder＞

Next, with regard to the method of taking out the substrate holder 180 in the plating device 600, the actions, effects, and supplements will be described in order. <action> First, with reference to FIGS. 13 and 14, the operation of taking out the substrate holder 180 from the plating tank 620 after the plating process on the substrate W is completed. FIG. 13 is a flowchart showing a control processing procedure when the substrate holder 180 is taken out from the plating device 600, and FIG. 14 is an explanatory diagram of the operation of the plating device 600 when the control shown in FIG. 13 is performed.

When the plating process on the substrate W is completed, first, in step S710, the control unit 700 moves the conveyor 144 so that the conveyor 144 comes directly above the plating tank 620 (see FIG. 14A). Next, when the conveyor 144 moves, the control unit 700 lowers the liquid level L of the plating solution in step S720 (see FIG. 14B). Specifically, the control unit 700 lowers the weir 660. In addition, the control unit 700 may also change the order to perform the processing of step S710 and step S720.

Next, the control unit 700 lowers the conveyor 144 in step S730. Then, when the conveyor 144 finishes descending, the substrate holder 180 is held.

Next, the control unit 700 confirms that the weir 660 has been lowered in step S740. Next, the control unit 700 raises the liquid level L of the plating solution in step S750 (see FIG. 14C). Specifically, the control unit 700 raises the weir 660 and causes the pump 314a to increase the supply amount of the plating solution. Next, the control unit 700 raises the conveyor 144 in step S760. Thereby, the substrate holder 180 held by the conveyor 144 rises. In other words, when the conveyor 144 takes out the substrate holder 180 from the plating solution, the control unit 700 raises the liquid level L of the plating solution held in the plating tank 620, and at the same time lifts the lower end of the substrate holder 180 from the plating solution. The weir 660 is controlled by the way the liquid level L leaves. In addition, an example of the time point when the control unit 700 raises the liquid level L is based on the depth of the substrate holder 180 immersed in the plating liquid, the height of the liquid level L when the liquid level L is lowered in step S720, and the difference between the substrate holder 180 The ascent speed, the ascent speed of the weir 660, the amount of the plating solution supplied by the pump 314a, etc. are determined in advance and managed in time.

Then, when the conveyor 144 is fully raised, in step S770, the removal operation of the substrate holder 180 ends (refer to FIG. 14D). <effect> (First effect)

When the method of removing the substrate holder 180 in the plating device 600 is used, when the substrate holder 180 is taken out of the plating solution, the liquid level L of the plating solution rises. Thereby, the plating apparatus 600 can reduce the amount of plating solution flowing out of the plating tank 620 when the substrate holder 180 is transported, similarly to the plating apparatus 100 of the first embodiment. <Supplement to the method of removing the substrate holder>

Hereinafter, the method of removing the substrate holder 180 in the plating device 600 will be supplemented. (Supplement 1) The control unit 700 may raise or lower the liquid level L of the plating solution in a method other than the method described in the above-mentioned <operation> in the same manner as during the accommodating operation of the substrate holder 180. [Modification example]

The above two embodiments exemplified the plating apparatuses 100 and 600, and exemplified the method of transporting the substrate holder 180 to the plating tanks 220 and 620 (the method of accommodating the substrate holder and the method of taking out the substrate holder). However, the transport method of the present invention is not limited to the method of transporting the substrate holder 180 to the plating tanks 220 and 620, and also includes the method of transporting the substrate holder 180 to other processing tanks 160. Therefore, when the substrate holder 180 is transferred to another processing tank 160 by the transfer method of the present invention, the outflow amount of the liquid from the processing tank 160 can also be reduced. Furthermore, the conveying method of the present invention is not limited to the conveying method in the plating apparatuses 100 and 600, and can also be applied to all substrate processing apparatuses that convey the substrate holder. In addition, the plating apparatuses 100 and 600 are included in the substrate processing apparatus. [Note]

Part or all of the above-mentioned embodiments may be described as the following additional notes, but it is not limited to the following. (Note 1)

The method for removing the substrate holder in Note 1 is to use a substrate holder for holding a substrate and a processing tank for processing the substrate, and at least a portion of the substrate holder immersed in the liquid is taken out from the processing tank holding the liquid , And has the following steps: moving the substrate holder upward to remove the substrate holder from the liquid; and raising the liquid level of the liquid held in the processing tank; raising the liquid level It is performed between the steps of removing the substrate holder from the liquid. (Note 2)

The method for taking out the substrate holder of Note 2 is the method for taking out the substrate holder as described in Note 1, wherein a liquid supply pipe is installed in the processing tank, which is used to supply the liquid in the processing tank so that the The step of raising the liquid level includes a step in which the liquid supply pipe supplies the liquid in the treatment tank. (Note 3)

The method of taking out the substrate holder of Note 3 is the method of taking out the substrate holder described in Note 1 or Note 2, wherein before the step of raising the liquid level, there is the liquid for making the liquid held in the processing tank The process of surface descent. (Note 4)

The method for removing the substrate holder of Note 4 is the method of removing the substrate holder described in Note 3, wherein the step of lowering the liquid level includes the step of discharging the liquid from the treatment tank, and the treatment tank is equipped with a liquid discharge The piping is used to discharge the liquid from the treatment tank, and the liquid discharge pipe is equipped with a drain valve, which is used to adjust the flow rate of the liquid flowing through the liquid discharge pipe. The process of discharging the liquid includes adjustment Process of drain valve. (Note 5)

The method for removing the substrate holder in Note 5 is the same as the method for removing the substrate holder in Note 3, wherein a notch is formed on the side of the processing tank, which is used to discharge the liquid from the processing tank. In the notch, A movable weir is installed to block the gap, the step of lowering the liquid level has a step of moving the weir in the direction of opening the gap, and the step of raising the liquid level has the step of moving the weir in the direction of closing the gap的processes. (Note 6)

The method for removing the substrate holder in Note 6 is the same as the method for removing the substrate holder described in any one of Note 1 to Note 5, wherein the lower end of the substrate holder is separated from the liquid level and is higher than the liquid level. At the time of the position, there is further a step of accelerating the upward movement speed of the substrate holder. (Note 7)

The method for removing the substrate holder in Note 7 is the same as the method for removing the substrate holder described in any one of Note 1 to Note 6, wherein the step of removing the substrate holder from the liquid is used for transporting the aforementioned substrate holder. The process of raising the substrate holder by the conveyor of the substrate holder holding the substrate holder. (Note 8)

The method for removing the substrate holder of Note 8 is the method for removing the substrate holder described in any one of Note 1 to Note 7, wherein the aforementioned treatment tank is used for the plating tank of the plating device, and the aforementioned liquid system plating Overlay. (Note 9)

The method for removing the substrate holder of Note 9 is the same as the method for removing the substrate holder described in Note 3, wherein the treatment tank is used for the plating tank of the plating device, and the liquid system plating solution is used; The coating tank contains the anode immersed in the plating solution, and the step of lowering the liquid level only lowers the liquid level to a height where the anode is not exposed to the atmosphere. (Note 10)

The method for removing the substrate holder of Note 10 is the method for removing the substrate holder as described in Note 9, wherein the plating tank has: a cathode chamber for accommodating the substrate holder; and an anode chamber for Containing the anode; and a diaphragm, which is used for ion exchange between the plating solution in the cathode chamber and the plating solution in the anode chamber; the step of lowering the liquid level is to lower the liquid level only To the height where the aforementioned diaphragm will not be exposed to the atmosphere. (Note 11)

The substrate processing apparatus of Note 11 includes: a substrate holder for holding a substrate; a processing tank for holding liquid; a liquid supply pipe for supplying the liquid in the processing tank; a supply valve, which It is installed in the liquid supply pipe for adjusting the flow rate of the liquid flowing through the liquid supply pipe; the liquid discharge part is used to discharge the liquid from the processing tank; the conveyor is used to hold and house The substrate holder of the processing tank is moved upward to take out the substrate holder from the processing tank; and a control part; the control part, when the conveyor takes out the substrate holder from the liquid, At least one of the supply valve and the liquid discharge part is controlled such that the liquid level of the liquid held in the processing tank is raised while the lower end of the substrate holder is separated from the liquid level of the liquid. (Note 12)

The substrate processing apparatus of Note 12 is the substrate processing apparatus of Note 11, wherein the control section controls the supply valve and the liquid discharge section in such a way that the liquid level of the liquid held in the processing tank rises. Before at least one of them, the control unit controls the liquid discharge unit to lower the liquid level of the liquid held in the processing tank. (Note 13)

The substrate processing apparatus of Note 13 is the substrate processing apparatus described in Note 11 or Note 12, wherein the liquid discharge part has: a liquid discharge pipe for discharging the liquid from the processing tank and is installed in the processing tank ; And a drain valve, which is used to adjust the flow rate of the liquid flowing through the liquid discharge pipe, and is installed in the liquid discharge pipe. (Note 14)

The substrate processing apparatus of Note 14, such as the substrate processing apparatus of Note 11 or Note 12, wherein the liquid discharge portion has: a notch for discharging the liquid from the processing tank and is formed on the side of the processing tank; And movable weir, which is installed in a way to block the aforementioned gap. (Note 15)

The substrate processing apparatus of Note 15 is the substrate processing apparatus described in any one of Note 11 to Note 14, wherein the control portion is separated from the liquid level at the lower end of the substrate holder and is at a position higher than the liquid level , The conveyor is controlled to accelerate the moving speed of the substrate holder in the upward direction. (Note 16)

The substrate processing apparatus of Note 16 is the substrate processing apparatus described in any one of Note 11 to Note 15, wherein the processing tank is a plating tank and the liquid system plating solution. (Note 17)

The substrate processing device of Note 17, such as the substrate processing device of Note 126, wherein the processing tank is a plating tank and the liquid system plating solution; wherein the plating tank has an anode immersed in the plating solution, and the control When controlling the liquid discharge part, the control part controls the liquid discharge so that the liquid level is only lowered to a height that does not expose the anode. unit. (Note 18)

The substrate processing apparatus of Note 18, such as the substrate processing apparatus of Note 17, wherein the plating tank has: a cathode chamber for accommodating the substrate holder; an anode chamber for accommodating the anode; and a diaphragm for Ion exchange can be performed between the plating solution in the cathode chamber and the plating solution in the anode chamber; the control section controls the liquid discharge section to lower the level of the liquid held in the treatment tank At this time, the control unit controls the liquid discharge unit in such a way that only the liquid level is lowered to a height that does not expose the diaphragm. (Note 19)

The method of accommodating the substrate holder of Note 19 is to use the substrate holder for holding the substrate and the processing tank for processing the substrate, and the processing tank holding the liquid is accommodated in such a way that at least part of it is immersed in the liquid The substrate holder has the following steps: moving the substrate holder downward to accommodate the substrate holder in the processing tank; and lowering the liquid level of the liquid held in the processing tank; and holding the substrate When the lower end of the vessel is in contact with the liquid surface, at least the step of lowering the liquid surface is performed. (Note 20)

The storage method of the substrate holder in Note 20 is the same as the storage method of the substrate holder in Note 19, wherein after the substrate holder starts to move downward, and before the liquid surface contacts the lower end of the substrate holder , And further have the step of decelerating the moving speed of the substrate holder in the downward direction. (Note 21)

The method for accommodating the substrate holder of Note 21 is the method of accommodating the substrate holder described in Note 19 or Note 20, wherein the step of lowering the liquid level includes the step of discharging the liquid from the processing tank, and the processing tank is installed There is a liquid discharge pipe for discharging the liquid from the treatment tank. The liquid discharge pipe is equipped with a discharge valve for adjusting the flow rate of the liquid flowing through the liquid discharge pipe. The process of discharging the liquid includes adjusting the discharge valve. Process. (Note 22)

The storage method of the substrate holder of Note 22 is the same as the method of storage of the substrate holder described in Note 21, wherein the process of discharging the liquid is the volume of the liquid discharged from the processing tank, and storing the substrate holder in the The volume of the portion of the substrate holder immersed in the liquid after the treatment tank is equal. (Note 23)

The method for accommodating the substrate holder of Note 23 is the method for accommodating the substrate holder described in Note 19 or Note 20, wherein a notch for draining the liquid from the processing tank is formed on the side of the processing tank, and in the notch A movable weir is installed to block the gap, and the step of lowering the liquid level includes a step of moving the weir in a direction to open the gap. (Note 24)

The method for accommodating the substrate holder of note 24 is the same as the method for accommodating the substrate holder of note 23, wherein after the lower end of the substrate holder is in contact with the liquid surface, the substrate holder is completely accommodated in the processing tank Previously, there was further a step of moving the weir in the direction to close the notch. (Note 25)

The method of storing the substrate holder in Note 25 is the method of storing the substrate holder described in any one of Note 19 to Note 24, wherein the step of storing the substrate holder in the processing tank is used to transport the substrate The process of holding the substrate holder by the conveyor of the holder and lowering the substrate holder. (Note 26)

The method for accommodating the substrate holder of Note 26 is the method for accommodating the substrate holder described in any one of Note 19 to Note 25, wherein the treatment tank is used for the plating tank of the plating device, and the liquid system is plated. Overlay. (Note 27)

The method of accommodating the substrate holder of note 27 is the method of accommodating the substrate holder of note 26, wherein the anode immersed in the plating solution is accommodated in the plating tank, and the step of lowering the liquid level is only The aforementioned liquid level drops to a height that does not expose the aforementioned anode. (Note 28)

The method for accommodating the substrate holder of note 28 is the method for accommodating the substrate holder of note 27, wherein the plating tank has: a cathode chamber for accommodating the substrate holder; an anode chamber for accommodating the anode; And a diaphragm, which is used for ion exchange between the plating solution in the cathode chamber and the plating solution in the anode chamber; the step of lowering the liquid level only lowers the liquid level to a height that does not expose the diaphragm . (Note 29)

The substrate processing apparatus of Note 29 is provided with: a substrate holder for holding a substrate; a processing tank for holding liquid; a liquid discharge portion for discharging the liquid from the processing tank; and a conveyor, which is It is used to hold the substrate holder to move downward, and accommodate the substrate holder in the processing tank; and a control part; when the lower end of the substrate holder is in contact with the liquid surface, the control part is used to make at least The manner in which the liquid level is lowered controls the liquid discharge portion. (Note 30)

The substrate processing apparatus of Note 30, such as the substrate processing apparatus of Note 29, wherein the control unit is used after the conveyor moves the substrate holder downward and before the liquid surface contacts the substrate holder The lowering speed of the substrate holder is decelerated to control the conveyor. (Note 31)

The substrate processing apparatus of Note 31, such as the substrate processing apparatus described in Note 29 or Note 30, wherein the liquid discharge portion has: a liquid discharge pipe for discharging the liquid from the processing tank; and a drain valve, which is Installed in the liquid discharge pipe to adjust the flow rate of the liquid flowing through the liquid discharge pipe; when the control unit lowers the liquid level, it is discharged through the liquid discharge pipe and the substrate holder is accommodated in the processing The said substrate holder behind the tank is immersed in the said liquid with the same volume of the said liquid, and the said drain valve is controlled. (Note 32)

The substrate processing apparatus of Note 32, such as the substrate processing apparatus described in Note 29 or Note 30, wherein the liquid discharge portion has: a notch for discharging the liquid from the processing tank and is formed on the side of the processing tank; And movable weir, which is installed in a way to block the aforementioned gap. (Note 33)

The substrate processing apparatus of Note 33, such as the substrate processing apparatus of Note 32, wherein the control portion is brought into contact with the liquid surface at the lower end of the substrate holder and before the substrate holder is completely accommodated in the processing tank. By controlling the weir, the weir is moved in the direction of closing the gap. (Note 34)

The substrate processing apparatus of Note 34 is the substrate processing apparatus described in any one of Note 29 to Note 33, wherein the processing tank is a plating tank and the liquid system plating solution. (Note 35)

The substrate processing apparatus of Note 35 is the substrate processing apparatus of Note 34, wherein the plating tank has an anode immersed in the plating solution, and the control unit lowers the level of the liquid held in the processing tank When the liquid discharge part is controlled by the method, the control part controls the liquid discharge part so that only the liquid level is lowered to a height where the anode is not exposed. (Note 36)

The substrate processing apparatus of Note 36, such as the substrate processing apparatus described in Note 35, wherein the plating tank has: a cathode chamber for accommodating the substrate holder; an anode chamber for accommodating the anode; and a diaphragm for use When ion exchange can be performed between the plating solution in the cathode chamber and the plating solution in the anode chamber; when the control section controls the liquid discharge section to lower the level of the liquid held in the treatment tank The control unit controls the liquid discharge unit in such a way that only the liquid level is lowered to a height that does not expose the diaphragm.

Above, only a few embodiments of the present invention have been described. However, those skilled in the art can easily understand that various changes or improvements can be made in the exemplified embodiments without substantially departing from the novel teachings and advantages of the present invention. Therefore, forms with such changes or improvements should also be included in the technical scope of the present invention. In addition, the above-mentioned embodiments may be combined arbitrarily.

100: Plating device 124: Temporary Storage Box 126: Pre-wet tank 128: prepreg tank 130a: The first washing tank 130b: The second washing tank 132: Blow Groove 140: substrate transfer device 142: Horizontal rail 144, 144a, 144b: conveyor 160: processing tank 180: substrate holder 200: Plating unit 220: Plating tank 222: adjustment board 223: open 224: Diaphragm 226: Anode Room 228: Cathode Chamber 232: high water level sensor 234: Low water level sensor 260: Overflow Slot 262: Part One 264: Part Two 302: Liquid supply piping 304: Supply valve 306: Liquid discharge piping 308: Drain Valve 312: Anode 314a, 314b: pump 316,318,320: Piping 322: discharge slot 400: Control Department 600: Plating device 620: Plating tank 622,624,626: side panels 640,642: gap 660: Weir 680: Actuator 700: Control Department 720: Liquid discharge part L: Liquid level LC: Liquid column W: substrate

Fig. 1 is a top view of the plating apparatus of the first embodiment. FIG. 2 is an enlarged cross-sectional view showing the periphery of the plating tank of the plating device shown in FIG. 1. FIG. FIG. 3 is a flowchart showing a control processing step when the plating device shown in FIG. 1 accommodates the substrate holder. Fig. 4 is an explanatory diagram of the operation of the plating device when the control shown in Fig. 3 is performed. FIG. 5 is a flowchart showing a control process step when the substrate holder is taken out from the plating device shown in FIG. 1. Fig. 6 is an explanatory diagram of the operation of the plating device when the control shown in Fig. 5 is performed. FIG. 7 is an enlarged view showing the liquid level and the part of the substrate holder when the substrate holder is taken out from the plating solution. Fig. 8 is a perspective view of the plating tank of the plating device of the second embodiment. FIG. 9 is a top view of the plating tank shown in FIG. 8. FIG. Figure 10 is the AA arrow direction diagram of Figure 9. FIG. 11 is a flowchart showing a control process step when the plating device of the second embodiment accommodates the substrate holder. Fig. 12 is an explanatory diagram of the operation of the plating device when the control shown in Fig. 11 is performed. FIG. 13 is a flowchart showing a control processing procedure when the substrate holder is taken out from the plating apparatus of the second embodiment. Fig. 14 is an explanatory diagram of the operation of the plating device when the control shown in Fig. 13 is performed.

144: Conveyor

180: substrate holder

220: Plating tank

304: Supply valve

308: Drain Valve

L: Liquid level

W: substrate

Claims (16)

A substrate processing device, which is provided with: A substrate holder, which is used to hold the substrate; Treatment tank, which is used to hold liquid; Liquid supply piping, which is used to supply the aforementioned liquid in the aforementioned treatment tank; A supply valve, which is installed in the liquid supply piping, is used to adjust the flow rate of the liquid flowing through the liquid supply piping; Liquid discharge part, which is used to discharge the aforementioned liquid from the aforementioned treatment tank; Conveyor, which is used to hold the substrate holder contained in the processing tank, move it upward, and take out the substrate holder from the processing tank; and Control department The control unit raises the liquid level of the liquid held in the processing tank when the conveyor removes the substrate holder from the liquid liquid, and at the same time, the lower end of the substrate holder rises from the liquid level of the liquid The way of leaving is to control at least one of the supply valve and the liquid discharge section. The substrate processing apparatus described in claim 1, Wherein, before the control section controls at least one of the supply valve and the liquid discharge section to raise the liquid level of the liquid held in the processing tank, the control section causes the control section to raise the liquid level of the liquid held in the processing tank. The manner in which the liquid level of the liquid drops controls the liquid discharge portion. The substrate processing apparatus described in claim 1 or 2, The aforementioned liquid discharge part has: A liquid discharge pipe for discharging the liquid from the processing tank, and the liquid discharge pipe is installed in the processing tank; and A dump valve is used to adjust the flow rate of the liquid flowing through the liquid discharge pipe, and the dump valve is installed in the liquid discharge pipe. The substrate processing apparatus described in claim 1 or 2, The aforementioned liquid discharge part has: A gap is used to discharge the liquid from the processing tank, and the gap is formed on the side of the processing tank; and The movable weir is installed in such a way as to block the aforementioned gap. The substrate processing apparatus described in claim 1 or 2, Wherein, when the lower end of the substrate holder is separated from the liquid level and is at a position higher than the liquid level, the control unit controls the conveyor in a manner that accelerates the upward movement speed of the substrate holder. The substrate processing apparatus described in claim 1 or 2, The aforementioned treatment tank is a plating tank, And the aforementioned liquid system plating solution. The substrate processing apparatus described in claim 2, The aforementioned treatment tank is a plating tank, And the aforementioned liquid system plating solution; Wherein the aforementioned plating tank has an anode immersed in the aforementioned plating solution, When the control unit controls the liquid discharge unit to lower the liquid level of the liquid held in the treatment tank, the control unit controls only the liquid level to drop to a height that does not expose the anode The aforementioned liquid discharge part. The substrate processing apparatus described in claim 7, The aforementioned plating tank has: a cathode chamber, which contains the aforementioned substrate holder; an anode chamber, which contains the aforementioned anode; and a diaphragm, which is used for the plating solution in the aforementioned cathode chamber and the aforementioned anode chamber. Ion exchange between liquids; When the control unit controls the liquid discharge unit to lower the liquid level of the liquid held in the processing tank, the control unit controls only the liquid level to drop to a height that does not expose the diaphragm. The aforementioned liquid discharge part. A substrate processing device, which is provided with: A substrate holder, which is used to hold the substrate; Treatment tank, which is used to hold liquid; Liquid discharge part, which is used to discharge the aforementioned liquid from the aforementioned treatment tank; Conveyor, which is used to hold the substrate holder to move it downward, and accommodate the substrate holder in the processing tank; and Control department When the lower end of the substrate holder is in contact with the liquid surface, the control unit controls the liquid discharge unit to at least lower the liquid surface. The substrate processing apparatus according to claim 9, The control unit controls the conveyor by decelerating the descending speed of the substrate holder after the conveyor moves the substrate holder downward and before the liquid surface contacts the substrate holder. The substrate processing apparatus described in claim 9 or 10, The aforementioned liquid discharge part has: Liquid discharge piping, which is used to discharge the liquid from the treatment tank; and A drain valve, which is installed in the liquid discharge pipe, is used to adjust the flow rate of the liquid flowing through the liquid discharge pipe; When the control unit lowers the liquid level, the liquid discharge pipe discharges the liquid having the same volume as that of the portion where the substrate holder is immersed in the liquid after the substrate holder is housed in the processing tank. , Control the aforementioned drain valve. The substrate processing apparatus described in claim 9 or 10, The aforementioned liquid discharge part has: A gap is used to drain the liquid from the processing tank, and the gap is formed on the side surface of the processing tank; and The movable weir is installed in such a way as to block the aforementioned gap. The substrate processing apparatus described in claim 12, The control part controls the weir to move the weir in the direction of closing the gap after the lower end of the substrate holder is in contact with the liquid surface and before the substrate holder is completely contained in the processing tank. The substrate processing apparatus described in claim 9 or 10, The aforementioned treatment tank is a plating tank, And the aforementioned liquid system plating solution. The substrate processing apparatus according to claim 14, Wherein the aforementioned plating tank has an anode immersed in the aforementioned plating solution, When the control unit controls the liquid discharge unit to lower the liquid level of the liquid held in the treatment tank, the control unit controls the liquid discharge only to lower the liquid level to a level where the anode is not exposed. unit. The substrate processing apparatus according to claim 15, The aforementioned plating tank has: a cathode chamber, which contains the aforementioned substrate holder; an anode chamber, which contains the aforementioned anode; and a diaphragm, which is used for the plating solution in the aforementioned cathode chamber and the aforementioned anode chamber. Ion exchange between liquids; When the control section controls the liquid discharge section to lower the liquid level of the liquid held in the processing tank, the control section controls the liquid only to lower the liquid level to a height that does not expose the diaphragm.出部。 Discharge section.

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