TW202044850A - Speaker - Google Patents
Speaker Download PDFInfo
- Publication number
- TW202044850A TW202044850A TW108116783A TW108116783A TW202044850A TW 202044850 A TW202044850 A TW 202044850A TW 108116783 A TW108116783 A TW 108116783A TW 108116783 A TW108116783 A TW 108116783A TW 202044850 A TW202044850 A TW 202044850A
- Authority
- TW
- Taiwan
- Prior art keywords
- holes
- sound
- partition wall
- frame
- hole
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Abstract
Description
本發明是關於一種揚聲器,特別是關於一種具有高、低音室分隔的揚聲器。 The invention relates to a loudspeaker, in particular to a loudspeaker with a high and bass room separation.
聽音樂已成為現代人生活中用以調劑緊張、單調的生活不可缺少的重要部分,所以一般消費性產品的揚聲器(如:喇叭、耳機等)所表現出音樂的音質,會影響消費者在聆聽音樂時對揚聲器的使用體驗。更隨著消費者對音質的要求也是越來越高,因此對於一般消費性產品的揚聲器的要求日趨重視,故改善音質和提高消費者的使用體驗,需要揚聲器製造商持續不斷投注心力。 Listening to music has become an indispensable and important part of modern people’s lives to adjust the stressful and monotonous life. Therefore, the sound quality of music displayed by the speakers of general consumer products (such as speakers, headphones, etc.) will affect consumers’ listening The experience of using the speaker while music. Moreover, as consumers have higher and higher requirements for sound quality, the requirements for speakers for general consumer products are becoming more and more important. Therefore, to improve sound quality and improve consumer experience, speaker manufacturers need to continue to invest their efforts.
一般來說體積較小的揚聲器,例如耳機內的揚聲器,只能設計一個發聲單體,較難同時兼顧高、低音的音效體驗。如何在體積較小的揚聲器提升高、低音的輸出品質是揚聲器製造商研發的方向之一。 Generally speaking, small speakers, such as the speakers in headphones, can only be designed with a single sounding unit, which makes it difficult to have both high and low sound experience. How to improve the output quality of high and low frequencies in small speakers is one of the directions of speaker manufacturers.
本發明提出一種創新的揚聲器,藉以提升高、低音的輸出品質。 The present invention provides an innovative loudspeaker to improve the output quality of high and low frequencies.
於本發明的一實施例中,一種揚聲器包含一框架以及一音域隔牆。框架具有肋條以定義出一中央通孔與複數個側通孔。音域隔牆連接至該框架以區隔出高音音室以及低音音室,其中音域隔牆所覆蓋該些側通孔的總面積小於音域隔牆所未覆蓋該些側通孔的總面積。 In an embodiment of the present invention, a speaker includes a frame and a sound range partition wall. The frame has ribs to define a central through hole and a plurality of side through holes. The sound range partition wall is connected to the frame to separate the tweeter room and the bass sound room, wherein the total area of the side through holes covered by the sound range partition wall is smaller than the total area of the side through holes not covered by the sound range partition wall.
於本發明的一實施例中,該些側通孔皆為長條形孔。 In an embodiment of the present invention, the side through holes are all elongated holes.
於本發明的一實施例中,該些側通孔的長度方向大致平行。 In an embodiment of the present invention, the length directions of the side through holes are substantially parallel.
於本發明的一實施例中,該些側通孔以單排配置。 In an embodiment of the present invention, the side through holes are arranged in a single row.
於本發明的一實施例中,框架為一圓形框架,且該些側通孔的長度方向皆大致平行圓形框架之徑向。 In an embodiment of the present invention, the frame is a circular frame, and the length directions of the side through holes are substantially parallel to the radial direction of the circular frame.
於本發明的一實施例中,框架為一圓形框架,且該些側通孔的長度方向皆大致垂直圓形框架之徑向。 In an embodiment of the present invention, the frame is a circular frame, and the length directions of the side through holes are substantially perpendicular to the radial direction of the circular frame.
於本發明的一實施例中,中央通孔為一圓形孔。 In an embodiment of the present invention, the central through hole is a circular hole.
於本發明的一實施例中,該些側通孔以中央通孔為中心成輻射狀配置。 In an embodiment of the present invention, the side through holes are arranged radially with the central through hole as the center.
於本發明的一實施例中,音域隔牆所覆蓋的每一側通孔小於音域隔牆所未覆蓋的每一側通孔。 In an embodiment of the present invention, the through holes on each side covered by the sound range partition wall are smaller than the through holes on each side not covered by the sound range partition wall.
於本發明的一實施例中,高音音室包含一電磁迴路元件容置區與二個不連續的音室延伸區。 In an embodiment of the present invention, the tweeter room includes an electromagnetic loop element accommodating area and two discontinuous sound room extension areas.
於本發明的一實施例中,音域隔牆所覆蓋該些 側通孔包含二群側通孔,每一群側通孔包含至少三個長條形孔。 In an embodiment of the present invention, the sound range partition wall covers these The side through holes include two groups of side through holes, and each group of side through holes includes at least three elongated holes.
於本發明的一實施例中,音域隔牆所未覆蓋該些側通孔包含二群側通孔,每一群側通孔包含至少三個長條形孔。 In an embodiment of the present invention, the side through holes that are not covered by the sound range partition wall include two groups of side through holes, and each group of side through holes includes at least three elongated holes.
綜上所述,本發明之揚聲器結構,藉其音域隔牆以區隔出高音音室以及低音音室,而使振動膜產生的高、低音具有各自獨立的音室與環繞通道以避免高、低音混合,另配合框架之側通孔的形狀設計以及於高、低音音室的總面積差異,進而減低總諧波失真比率,提升高、低音輸出的音質。 In summary, the loudspeaker structure of the present invention separates the tweeter room and the bass room by the sound range partition wall, so that the high and low frequencies generated by the diaphragm have separate sound rooms and surround channels to avoid high and low frequencies. The bass mixing is matched with the shape design of the side through holes of the frame and the difference in the total area of the high and low sound chambers, thereby reducing the total harmonic distortion ratio and improving the sound quality of the high and low output.
以下將以實施方式對上述之說明作詳細的描述,並對本發明之技術方案提供更進一步的解釋。 Hereinafter, the above description will be described in detail by way of implementation, and a further explanation will be provided for the technical solution of the present invention.
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附符號之說明如下: In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious and understandable, the description of the attached symbols is as follows:
100‧‧‧揚聲器 100‧‧‧Speaker
102‧‧‧外殼 102‧‧‧Shell
102a‧‧‧外後蓋 102a‧‧‧Outer back cover
102b‧‧‧聽筒蓋 102b‧‧‧Handset cover
102c‧‧‧中間開孔 102c‧‧‧Middle opening
H‧‧‧高音音室 H‧‧‧Tweeter
103a‧‧‧電磁迴路元件容置區 103a‧‧‧Electromagnetic circuit component housing area
103b‧‧‧音室延伸區 103b‧‧‧Sound room extension area
104‧‧‧音域隔牆 104‧‧‧Sound range partition wall
104a‧‧‧頂牆 104a‧‧‧Top wall
104b‧‧‧側牆 104b‧‧‧ side wall
104c‧‧‧側牆 104c‧‧‧side wall
104d‧‧‧音室通孔 104d‧‧‧Sound chamber through hole
104e‧‧‧氣流調節件 104e‧‧‧Air flow regulator
L‧‧‧低音音室 L‧‧‧Bass Room
106‧‧‧電磁迴路元件 106‧‧‧Electromagnetic circuit components
106a‧‧‧磁性組件 106a‧‧‧Magnetic components
106b‧‧‧音源線圈 106b‧‧‧Sound source coil
108‧‧‧驅動電路板 108‧‧‧Drive circuit board
110‧‧‧網片 110‧‧‧ Mesh
112‧‧‧框架 112‧‧‧Frame
112’‧‧‧框架 112’‧‧‧Frame
112a‧‧‧肋條 112a‧‧‧rib
112b‧‧‧中央通孔 112b‧‧‧Central through hole
112c‧‧‧側通孔 112c‧‧‧Side through hole
112d‧‧‧側通孔 112d‧‧‧Side through hole
112c’‧‧‧側通孔 112c’‧‧‧Side through hole
112d’‧‧‧側通孔 112d’‧‧‧Side through hole
114‧‧‧振動膜 114‧‧‧Vibrating membrane
116‧‧‧前蓋 116‧‧‧Front cover
116a‧‧‧聲音輸出孔 116a‧‧‧Sound output hole
D1‧‧‧方向 D1‧‧‧direction
D2‧‧‧方向 D2‧‧‧direction
R‧‧‧徑向 R‧‧‧Radial
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:第1圖繪示依照本發明一實施例的一種揚聲器的爆炸圖;第2圖繪示第1圖的揚聲器之部份元件的放大圖;第3圖繪示依照本發明一實施例的一種揚聲器內發聲單體的立體圖;第4圖繪示第2圖揚聲器之音域隔牆之另一視角的立體圖; 第5圖繪示依照本發明另一實施例的一種框架的上視圖;以及第6圖繪示本發明之不同實施例的揚聲器總諧波失真的性能比較圖。 In order to make the above and other objectives, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: Figure 1 shows an exploded view of a speaker according to an embodiment of the present invention; Figure 1 is an enlarged view of some components of the loudspeaker; Figure 3 is a perspective view of a sound-producing unit in a loudspeaker according to an embodiment of the present invention; Figure 4 is a sound field partition wall of the loudspeaker of Figure 2 Another perspective view; Fig. 5 is a top view of a frame according to another embodiment of the present invention; and Fig. 6 is a performance comparison diagram of total harmonic distortion of speakers of different embodiments of the present invention.
為了使本發明的敘述更加詳盡與完備,可參照所附的附圖及以下所述各種實施例,附圖中相同的號碼代表相同或相似的元件。另一方面,眾所周知的元件與步驟並未描述在實施例中,以避免對本發明造成不必要的限制。 In order to make the description of the present invention more detailed and complete, reference may be made to the attached drawings and various embodiments described below. The same numbers in the drawings represent the same or similar elements. On the other hand, well-known elements and steps are not described in the embodiments to avoid unnecessary limitation of the present invention.
在實施方式與申請專利範圍中,除非內文中對於冠詞有所特別限定,否則「一」與「該」可泛指單一個或大於1個。 In the implementation mode and the scope of the patent application, unless the article is specifically limited in the context, "a" and "the" can generally refer to a single or more than one.
請參照第1圖,其繪示依照本發明一實施例的一種揚聲器的爆炸圖。揚聲器100包含音域隔牆104、框架112、振動膜114、前蓋116、電磁迴路元件106以及外殼102等元件。
Please refer to FIG. 1, which shows an exploded view of a speaker according to an embodiment of the present invention. The
電磁迴路元件106包含多個零件所組成的磁性組件106a以及音源線圈106b。音源線圈106b電性連接至驅動電路板108,並藉其驅動而帶動振動膜114振動而產生聲音。
The
當揚聲器組合時,由外後蓋102a與聽筒蓋102b所組成的外殼102藉以將其餘元件皆包覆於其內。前蓋116組合於聽筒蓋102b的中間開孔102c內,且具有複數
個聲音輸出孔116a供聲音輸出。
When the speakers are combined, the
請同時參照第1~4圖,第2圖繪示揚聲器之音域隔牆104以及框架112的立體圖,第3圖繪示揚聲器內發聲單體的立體圖,第4圖繪示第2圖揚聲器之音域隔牆之另一視角的立體圖。
Please refer to Figures 1 to 4 at the same time. Figure 2 shows a perspective view of the sound
音域隔牆104用以組立於框架112上以區隔出一高音音室H以及低音音室L。音域隔牆104由一頂牆104a與複數片側牆所構成。側牆還分為平面的側牆104c與弧形的側牆104b。
The sound
框架112具有肋條112a以定義出一中央通孔112b與複數個側通孔(112c、112d)。當音域隔牆104與框架112組合時,音域隔牆104覆蓋於框架112之中央通孔112b與多個側通孔112c上。因此,被音域隔牆104所覆蓋的通孔112c位於高音音室H內,未被音域隔牆104所覆蓋的通孔112d位於低音音室L內。
The
多個網片110則覆蓋框架112的多個側通孔112c、112d上;亦或多個網片110僅覆蓋音域隔牆104所未覆蓋的多個側通孔112d上。
The
在本實施例中,音域隔牆104所覆蓋該些側通孔112c的總面積小於音域隔牆104所未覆蓋該些側通孔112d的總面積。
In this embodiment, the total area of the side through
在本實施例中,該些側通孔(112c,112d)皆為長條形孔,且該些長條形孔112c之長度方向D1大致平行;或該些長條形孔112d之長度方向大致平行,但不以此為限。
In this embodiment, the side through holes (112c, 112d) are all elongated holes, and the longitudinal direction D1 of the
在本實施例中,該些側通孔112c或該些側通孔112d皆以單排配置,但不以此為限。
In this embodiment, the side through
在本實施例中,框架112為一圓形框架,且該些側通孔(112c,112d)的長度方向皆大致平行圓形框架之徑向,但不以此為限。
In this embodiment, the
在本實施例中,框架112之中央通孔112b為一圓形孔,且該些側通孔(112c,112d)以中央通孔112b為中心成輻射狀配置,但不以此為限。
In this embodiment, the central through
在本實施例中,音域隔牆104所覆蓋的每一側通孔112c小於音域隔牆104所未覆蓋的每一側通孔112d,但不以此為限。
In this embodiment, the through
在本實施例中,音域隔牆104所包圍的高音音室H包含一電磁迴路元件容置區103a與複數個不連續的音室延伸區103b。電磁迴路元件容置區103a係用以容置前述之電磁迴路元件106,故以此功能命名之。
In this embodiment, the tweeter room H surrounded by the sound
在第3圖的實施例中,音域隔牆104所定義的高音音室H包含2個不連續的音室延伸區103b,且電磁迴路元件容置區103a為一圓形區域,2個不連續的音室延伸區103b為扇形區域,但不以此為限。
In the embodiment of Fig. 3, the tweeter room H defined by the sound
高音音室H之多個不連續的音室延伸區103b與電磁迴路元件容置區103a係彼此空間上連通,例如流體能流動經過電磁迴路元件容置區103a而流通於多個不連續的音室延伸區103b之間。
The multiple discontinuous sound
當揚聲器組合時,高音音室H之電磁迴路元件
容置區103a用以對準或覆蓋框架112之中央通孔112b,高音音室H之不連續的音室延伸區103b覆蓋部份的該些個側通孔112c,而裸露出其餘的側通孔112d。
When the speakers are combined, the electromagnetic circuit element of the tweeter H
The
每一個側通孔112d係位於電磁迴路元件容置區103a與二個緊鄰的該音室延伸區103b所構成的缺口區內,並藉網片110覆蓋於側通孔112d上。
Each side through
在此實施例中,每一網片110可覆蓋多個側通孔(112c或112d),但不以此為限。
In this embodiment, each
在此實施例中,音域隔牆104於音室延伸區103b之側牆(104b、104c)具有至少一音室通孔104d,且具有氣流調節件104e(參照第1圖)覆蓋於音室通孔104d上(例如氣流調節件104e黏貼於側牆上以覆蓋於音室通孔104d)。氣流調節件104e與前述之網片110皆為多孔通氣的元件,能使氣流平均分配於高、低音室之間,而維持高、低音室的氣壓一致。
In this embodiment, the sound
音域隔牆104用以區隔出一高音音室H以及低音音室L。高音音室H即音域隔牆104與前蓋116之間所包圍的空間,而低音音室L即音域隔牆104、網片110與揚聲器的外殼(例如第1圖之外後蓋102a與聽筒蓋102b所組成的外殼102)之間所包圍的空間。實務上,低音音室L所包圍的空間一般大於高音音室H所包圍的空間,但不以此為限。高音音室H與低音音室L之間並非藉音域隔牆104完全阻絕,如前述所討論,音域隔牆104具有音室通孔104d與氣流調節件104e等設計,藉以使氣流平均分配於高、低音室
之間。
The sound
請參照第5圖,其繪示依照本發明另一實施例的一種框架的上視圖。框架112’不同於前述的框架112在於側通孔的長度方向與框架的徑向的關係。在本實施例中,側通孔的長度方向大致垂直於圓形框架112’之徑向R,例如側通孔112c’的長度方向D2大致垂直於圓形框架112’之徑向R。側通孔112d’的長度方向亦大致垂直於圓形框架112’之徑向R。類似於框架112設計,框架112’之該些側通孔112c’的總面積小於該些側通孔112d’的總面積。
Please refer to FIG. 5, which shows a top view of a frame according to another embodiment of the present invention. The frame 112' is different from the
請參照第6圖,其繪示本發明之不同實施例的揚聲器總諧波失真的性能比較圖。在本圖中所比較的揚聲器實施例,分別包含態樣A、B、C三種框架,其圖式分別繪示於圖中。態樣A之框架的高音音室內側通孔(4x2個通孔)總面積小於低音音室內側通孔(6x2個通孔)總面積。態樣B之框架的高音音室內側通孔(3x2個較小通孔)總面積小於低音音室內側通孔(3x2個較大通孔)總面積。態樣C之框架的高音音室內側通孔總面積等於低音音室內側通孔總面積。參照態樣A、B、C所對應的揚聲器總諧波失真(Total Harmonic Distortion,THD)比率曲線可知,在頻率30Hz到200Hz之間,就揚聲器輸出音效的總諧波失真比率而言,態樣A之揚聲器小於態樣B之揚聲器,且態樣B之揚聲器小於態樣C之揚聲器。具體而言,在頻率100Hz時,態樣A的總諧波失真比率為4.17%、態樣B的總諧波失真比率為5.60%、態樣C的總諧波失真比率為6.53%。在頻 率200Hz時,態樣A的總諧波失真比率為0.66%、態樣B的總諧波失真比率為0.87%、態樣C的總諧波失真比率為1.43%。總諧波失真比率越低表示揚聲器能更真實的輸出音效。此外,態樣A、B之框架上的長條形側通孔亦有助於減低總諧波失真比率。 Please refer to Fig. 6, which shows a comparison diagram of the total harmonic distortion performance of the speakers of different embodiments of the present invention. The loudspeaker embodiments compared in this figure respectively include three types of frames A, B, and C, and the diagrams are respectively shown in the figure. The total area of the through holes (4x2 through holes) in the tweeter chamber of the frame of aspect A is smaller than the total area of the through holes (6x2 through holes) in the bass sound chamber. The total area of the through holes in the tweeter chamber (3x2 smaller through holes) of the frame of aspect B is smaller than the total area of the through holes in the bass sound chamber (3x2 larger through holes). The total area of the through holes in the tweeter chamber of the frame of aspect C is equal to the total area of the through holes in the bass chamber. Referring to the total harmonic distortion (THD) ratio curve of the speaker corresponding to the patterns A, B, and C, it can be seen that between the frequency of 30Hz and 200Hz, in terms of the total harmonic distortion ratio of the speaker output sound effect, the pattern The speaker of A is smaller than the speaker of aspect B, and the speaker of aspect B is smaller than the speaker of aspect C. Specifically, at a frequency of 100 Hz, the total harmonic distortion ratio of aspect A is 4.17%, the total harmonic distortion ratio of aspect B is 5.60%, and the total harmonic distortion ratio of aspect C is 6.53%. On frequency When the frequency is 200 Hz, the total harmonic distortion ratio of aspect A is 0.66%, the total harmonic distortion ratio of aspect B is 0.87%, and the total harmonic distortion ratio of aspect C is 1.43%. The lower the total harmonic distortion ratio means that the speaker can output more realistic sound effects. In addition, the elongated side through holes on the frames of the aspects A and B also help to reduce the total harmonic distortion ratio.
綜上所述,本發明之揚聲器結構,藉其音域隔牆以區隔出高音音室以及低音音室,而使振動膜產生的高、低音具有各自獨立的音室與環繞通道以避免高、低音混合,另配合框架之側通孔的形狀設計以及於高、低音音室的總面積差異,進而減低總諧波失真比率,提升高、低音輸出的音質。 In summary, the loudspeaker structure of the present invention separates the tweeter room and the bass room by the sound range partition wall, so that the high and low frequencies generated by the diaphragm have separate sound rooms and surround channels to avoid high and low frequencies. The bass mixing is matched with the shape design of the side through holes of the frame and the difference in the total area of the high and low sound chambers, thereby reducing the total harmonic distortion ratio and improving the sound quality of the high and low output.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,於不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to those defined in the attached patent scope.
H‧‧‧高音音室 H‧‧‧Tweeter
104‧‧‧音域隔牆 104‧‧‧Sound range partition wall
112‧‧‧框架 112‧‧‧Frame
112a‧‧‧肋條 112a‧‧‧rib
112b‧‧‧中央通孔 112b‧‧‧Central through hole
112c‧‧‧側通孔 112c‧‧‧Side through hole
112d‧‧‧側通孔 112d‧‧‧Side through hole
D1‧‧‧方向 D1‧‧‧direction
Claims (12)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108116783A TWI760612B (en) | 2019-05-15 | 2019-05-15 | Speaker |
US16/436,899 US10791392B2 (en) | 2018-06-21 | 2019-06-10 | Speaker |
CN201910636679.6A CN110460939B (en) | 2019-05-15 | 2019-07-15 | Loudspeaker |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108116783A TWI760612B (en) | 2019-05-15 | 2019-05-15 | Speaker |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202044850A true TW202044850A (en) | 2020-12-01 |
TWI760612B TWI760612B (en) | 2022-04-11 |
Family
ID=68481180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108116783A TWI760612B (en) | 2018-06-21 | 2019-05-15 | Speaker |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN110460939B (en) |
TW (1) | TWI760612B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI779304B (en) * | 2020-06-22 | 2022-10-01 | 美律實業股份有限公司 | Speaker |
CN111954136A (en) * | 2020-08-19 | 2020-11-17 | 苏州礼乐乐器股份有限公司 | Full-band high-tone bowl-shaped loudspeaker with sound beam and sound tunnel |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3984885A (en) * | 1974-03-15 | 1976-10-12 | Matsushita Electric Industrial Co., Ltd. | 4-Channel headphones |
US5729605A (en) * | 1995-06-19 | 1998-03-17 | Plantronics, Inc. | Headset with user adjustable frequency response |
CN2247917Y (en) * | 1995-12-19 | 1997-02-19 | 刘忠麟 | Honeycomb audio amplifier |
AU4358700A (en) * | 1999-05-24 | 2000-12-12 | Crossroads Systems, Inc. | Method and system for multi-initiator support to streaming devices in a fibre channel network |
CN1125576C (en) * | 1999-09-22 | 2003-10-22 | 徐巍 | Very thin loudspeaker and its manufacture |
US6574347B1 (en) * | 2000-11-17 | 2003-06-03 | Logitech Europe S.A. | Flat-panel loudspeaker with compressed dampeners |
US6487297B1 (en) * | 2000-11-22 | 2002-11-26 | Yen Chin-Fa | Structure of a loudspeaker |
DE60227487D1 (en) * | 2001-02-26 | 2008-08-21 | Uetax Corp | SPEAKER |
TWM269678U (en) * | 2004-12-21 | 2005-07-01 | Kingstate Electronics Corp | Planar speaker |
JP2006287545A (en) * | 2005-03-31 | 2006-10-19 | Inax Corp | Speaker device and kitchen equipment with speaker device |
CN101494808A (en) * | 2008-01-24 | 2009-07-29 | 深圳富泰宏精密工业有限公司 | Loudspeaker assembly |
KR101066556B1 (en) * | 2009-07-02 | 2011-09-21 | 주식회사 비에스이 | Tuner for adjusting acustic compliance and micro speaker using the same |
TWI471020B (en) * | 2011-09-26 | 2015-01-21 | Chien Chuan Pan | Multiple hooking loudspeaker device having actuated switch structure and assembling method thereof |
US20130136290A1 (en) * | 2011-11-25 | 2013-05-30 | Rextec International Ltd. | Earphone with tunable low pitch |
CN203072130U (en) * | 2012-12-21 | 2013-07-17 | 东莞泉声电子有限公司 | Treble and bass loudspeaker monomer and treble and bass headphone structure |
CN103024628B (en) * | 2013-01-06 | 2015-01-21 | 康东兴 | Mechanical frequency division voice box |
US10257607B2 (en) * | 2016-02-14 | 2019-04-09 | Transound Electronics Co., Ltd. | Headphones with frequency-based divisions |
CN107333216A (en) * | 2017-07-04 | 2017-11-07 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
JP2019041271A (en) * | 2017-08-25 | 2019-03-14 | オンキヨー株式会社 | Frame, speaker unit employing the same, headphone, and earphone |
CN207560324U (en) * | 2017-11-21 | 2018-06-29 | 无锡睿勤科技有限公司 | A kind of horn system and laptop applied to laptop |
CN207720390U (en) * | 2018-01-26 | 2018-08-10 | 广州世韵电子科技有限公司 | A kind of novel high pitch rear cover |
CN208445744U (en) * | 2018-06-04 | 2019-01-29 | 东莞泉声电子有限公司 | Fine adjustment type compound horn monomer |
TWI700936B (en) * | 2018-06-21 | 2020-08-01 | 美律實業股份有限公司 | Speaker |
TWI702856B (en) * | 2018-08-22 | 2020-08-21 | 美律實業股份有限公司 | Speaker |
CN208675483U (en) * | 2018-09-21 | 2019-03-29 | 歌尔科技有限公司 | Filter earphone |
-
2019
- 2019-05-15 TW TW108116783A patent/TWI760612B/en active
- 2019-07-15 CN CN201910636679.6A patent/CN110460939B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN110460939A (en) | 2019-11-15 |
CN110460939B (en) | 2021-07-09 |
TWI760612B (en) | 2022-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3196707U (en) | Dual frequency coaxial earphone | |
JP6102246B2 (en) | Headphone and sound emitting device | |
JP2018074341A (en) | headphone | |
TWI760612B (en) | Speaker | |
TWI700936B (en) | Speaker | |
US11647323B2 (en) | Loudspeaker | |
WO2022143209A1 (en) | Driver and headphones | |
US10791392B2 (en) | Speaker | |
TWI702856B (en) | Speaker | |
KR101539064B1 (en) | Earphone having multi-echo spaces | |
US11317194B2 (en) | Speaker | |
CN210157350U (en) | Multi-loudspeaker earphone | |
TWI725559B (en) | Speaker | |
CN114866631A (en) | Electronic device | |
JP2008167045A (en) | Speaker system | |
WO2022062003A1 (en) | Sound production unit and loudspeaker box | |
US10757502B2 (en) | Speaker | |
CN109151674B (en) | Loudspeaker system and corresponding mobile terminal | |
TW202106047A (en) | Speaker | |
TWI740220B (en) | Head phone structure | |
JP2018085670A (en) | headphone | |
TWI602439B (en) | Headphone | |
JPH11127491A (en) | Speaker unit |