TW202042986A - Transport system - Google Patents

Abstract

In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

Description

Transportation System

The embodiment of the disclosure relates to a transportation system and a transportation method.

Automated material handling systems (AMHS) have been widely used in semiconductor fabrication facilities (semiconductor fabrication facilities, FABs) to automatically transfer and transport groups of processing machines or tools used in wafer manufacturing Or a lot of wafers. A typical semiconductor manufacturing facility may include multiple process bays, which include process tools (for example, a process tool) and wafer temporary storage equipment.

Each zone may include a wafer stocker, and the wafer stocker includes multiple boxes for temporarily holding and temporarily storing multiple wafer carriers during the manufacturing process. The wafer carrier may include a standard mechanical interface (SMIF) box that can accommodate multiple wafers, or a front opening unified pods (FOUP) that can accommodate larger wafers. The stocker usually includes a single-mast-type (mast) mechanical lift or crane, which has a load-bearing capacity sufficient to lift, insert, and retrieve a single wafer carrier from the box at a time. The stocker can accommodate a plurality of standard mechanized interface boxes or front-opening wafer transfer boxes to prepare to transport the standard mechanized interface boxes or front-opening wafer transfer boxes to the loadport of the process tool.

Semiconductor manufacturing facilities can include various types of automated and manual vehicles to move and transport wafer carriers throughout the semiconductor manufacturing facility during the manufacturing process. The vehicles may include, for example, manually moving trolleys, rail guided vehicles (RGV), overhead shuttles (OHS), and overhead hoist transports (OHTs). In the automated material handling system, the aerial monorail unmanned transport vehicle system will automatically carry and transport wafer carriers (such as a standard mechanized interface box with multiple wafers or a front-opening wafer transfer box) from the aerial monorail unmanned transport vehicle. Handling or metering tools (such as process tools) or stockers are moved to other equipment or other tools in a semiconductor manufacturing facility. The aerial monorail unmanned guided vehicle system can be used to transport vehicles within each zone (intra-bay) or between zones (inter-bay). The aerial monorail unmanned transport vehicle system also moves empty vehicles (that is, vehicles without wafer carriers) to the loading ports of other equipment or tools to receive and remove empty or full standard mechanized interfaces that may contain wafers Boxes or front opening wafer transfer boxes for further transportation and/or processing in other tools.

The handling and transportation of wafers in an automated material handling system are usually built in a semiconductor manufacturing facility, and when moving or replacing processing machines or tools used in wafer manufacturing in the semiconductor manufacturing facility, it may not be easy to adapt. However, the typical manual handling and transportation of wafers also requires a large aerial truck, and is prone to human damage. Therefore, there is a need for an improved system and method for handling wafer transfer in semiconductor manufacturing facilities.

In some embodiments, a transportation system is provided, including: an automatic vehicle configured to traverse a first predetermined path; and a sensor system located on the automatic vehicle, the sensor system configured to travel along the first predetermined path Vertical obstacles are detected on one or two floors in front of the automatic vehicle, wherein the automatic vehicle is configured to traverse the second predetermined path in response to detecting the vertical obstacle.

In some embodiments, a transportation system is provided, including: an elevated floor platform configured to reduce vibration transmitted from one side of the elevated floor platform to a second side of the elevated floor platform; an automatic vehicle configured to follow a first predetermined The path traverses the elevated floor platform; and the sensor system is configured to detect vertical obstacles along the first predetermined path along the floor in front of the automatic car, wherein the automatic car is configured to follow the vertical obstacle when the vertical obstacle is detected. The second predetermined path traverses the elevated floor platform.

In some embodiments, a transportation method is provided, including: when the automatic vehicle is traveling along a first predetermined path, collecting depth sensor data along a line segment in front of the automatic vehicle; detecting a vertical obstacle in front of the automatic vehicle based on the depth sensor data; and In response to detecting the vertical obstacle, the automatic vehicle is redirected to move the automatic vehicle along the second predetermined path.

Many different implementation methods or examples are disclosed below to implement the different features of the provided subject. The following describes specific components and their arrangement embodiments to illustrate the present disclosure. Of course, these embodiments are only for illustration, and should not be used to limit the scope of the disclosure. For example, it should be understood that when an element is referred to as being "connected to" or "coupled to" another element, it can be directly connected or coupled to the other element, or one or more The middle element.

In addition, repeated reference signs or labels may be used in different embodiments. These repetitions are only used to describe the present disclosure simply and clearly, and do not represent a specific relationship between the different embodiments and/or structures discussed.

In addition, terms related to space may be used, such as "below", "below", "lower", "above", "higher" and similar terms. These space-related terms are In order to facilitate the description of the relationship between one element or feature and another element or feature in the illustration, these spatially related terms include the different orientations of the device in use or operation, as well as the description in the diagram The orientation. When the device is turned in different directions (rotated by 90 degrees or other directions), the space-related adjectives used therein will also be interpreted according to the turned position.

According to various embodiments, the present disclosure provides a system and method related to an automated guided vehicle (automated guided vehicle) with a depth sensor. The depth sensor can be configured to detect vertical obstacles (for example, inconsistencies or abnormalities relative to a nominal flat and consistent surface of the elevated floor platform) based on the automatic sensing of the depth change in front of the vehicle. The vertical obstacle may be, for example, a set of raised floor openings on which the automatic sensor car will traverse, or an object on the raised floor on which the automatic sensor car will traverse. The depth sensor can detect this vertical obstacle as the depth change along the horizontal line in front of the car.

In some embodiments, the depth sensor may be a laser sensor. More specifically, the depth sensor may be, for example, a light detection and ranging (LiDAR) sensor or other laser scanners. Such a laser scanner can be configured to emit pulsed laser light to illuminate a surface (for example, the ground or an elevated floor platform). The difference between the return time and wavelength of the returned reflected pulse and the emitted illumination pulse can be used to determine the distance to the surface. In some embodiments, the depth sensor may be configured to determine vertical obstacles along a one-dimensional line across the surface via a two-dimensional depth sensor (such as a two-dimensional optical radar or a laser scanner). This two-dimensional depth sensor can determine vertical anomalies on line segments along the entire surface (for example, a one-dimensional space with length instead of a two-dimensional space with length and width). The two-dimensional depth sensor can be in contrast to other embodiments that can use a point on the surface of the one-dimensional depth sensor (for example, a point that moves away from the relative position of the depth sensor over time) to determine vertical obstacles, or can use In contrast to other embodiments where the three-dimensional depth sensor determines the vertical obstacles on the entire surface area (for example, a two-dimensional area having a length and a width, rather than a space having only a length). Advantageously, the changes in depth along the horizontal line in front of the auto-sensing car (for example, one-dimensional space) and across the surface the auto-sensing car passes through may be more detectable (for example, producing more obvious and distinguishable sensor data) , And compared with the area in front of the auto-sensing car (such as a two-dimensional area) and across the surface of the auto-sensing car's depth changes, only less processing is required.

In some embodiments, the depth sensor may include a linear laser that is inclined at an angle of about 30 degrees to about 50 degrees with the surface of the automatic sensing vehicle. In some embodiments, the depth sensor may include a linear angle of about 30 to about 50 degrees from a line orthogonal to the surface of the elevated floor platform (for example, the surface of the elevated floor platform on which an automatic sensing vehicle is running). Laser. In some embodiments, the linear laser may be about 700 mm above the elevated floor platform, or about 100 mm to about 1000 mm. In some embodiments, the depth sensor may be configured to detect vertical obstacles on one or two floors in front of the automated vehicle. In addition, a linear laser can define a horizontal line extending along an axis that is orthogonal to the direction of movement of the automatic induction vehicle (for example, forward movement).

The automatic induction vehicle can be configured to traverse the elevated floor platform along a predetermined route. This predetermined route may be, for example, a route between two different wafer stores (e.g., between two different semiconductor processing sites or tools). Therefore, the automated induction vehicle can transport semiconductor workpieces from one wafer storage (for example, a semiconductor processing site) to another wafer storage (for example, another semiconductor processing site). In some embodiments, the robotic arm or payload area used to transport objects (for example, semiconductor workpieces (such as dies or wafers) or wafer carriers including such semiconductor workpieces) may be located on the top of the automated induction vehicle . In some embodiments, the automatic induction vehicle is configured to cross the elevated floor platform at a speed of about 0.8 meters per second, or about 0.5 meters per second to about 1 meter per second. The raised floor constituting the raised floor platform may be porous and/or at a certain distance above the floor below.

As described above, the semiconductor processing station and the automatic induction vehicle can be supported on an elevated floor platform (for example, a raised floor assembly or platform). These floors can have, for example, rectangular, triangular, octagonal or other geometric shapes. The elevated floor platform may be configured, for example, to reduce transmission from one side of the elevated floor platform (for example, the lower surface facing the ground) to the second side of the elevated floor platform (for example, the upper surface facing the automatic induction vehicle or the semiconductor processing site). Surface) vibration.

In some embodiments, one or more independent floor pieces (for example, floor pieces that make up the floor) can be removed from the elevated floor platform, so that there are deep or vertical obstacles along the elevated floor platform. By using the depth sensor, the automatic sensor car can avoid the area with these vertical obstacles (for example, with the elevated floor platform) by detecting and redefining the path (such as the route) of the automatic sensor car in front of the automatic sensor car. The standard surface is compared with the inconsistencies in the vertical direction) to avoid the inconsistencies in the vertical direction. In some embodiments, the auto-sensing car may be configured to immediately stop in response to a vertical obstacle detected in front of the auto-sensing car (for example, in front of the auto-sensing car in the direction of movement of the auto-sensing car).

Figure 1 is a conceptual diagram of an automatic induction vehicle 102 according to some embodiments. The automatic induction vehicle 102 may be an automatic guided vehicle having at least one depth sensor 104. The automatic induction vehicle 102 may be configured to traverse the elevated floor platform 106. The automatic sensor vehicle 102 can use the depth sensor 104 to detect vertical obstacles 108 such as a missing floor or other holes or openings along the elevated floor platform 106 that the automatic sensor vehicle 102 traverses. Then the automatic sensor vehicle 102 can redirect the path across the elevated floor platform 106 to avoid the vertical obstacle 108.

The autonomous vehicle 102 may be configured to move in a forward direction (shown by arrow 110A). The depth sensor 104 can detect the horizontal line 112 (for example, in front of the forward direction indicated by the arrow 110A) in front of the automatic sensor vehicle 102 and across the elevated floor platform 106 that the automatic sensor vehicle 102 traverses. The figure is a dotted line) to detect the vertical obstacle 108 by changing the depth.

In some embodiments, the depth sensor 104 may be a laser sensor. More specifically, the depth sensor may be, for example, an optical radar (LiDAR) sensor or other laser scanner, which is configured to illuminate a target or surface (such as a platform on the ground or a raised floor) with a pulsed laser and measure the reflected pulse . The difference between the return time and wavelength of the returned reflected pulse and the emitted illumination pulse can be used to determine the distance to the surface. In some embodiments, the depth sensor 104 can be configured to move along a one-dimensional cross-over elevated floor platform 106 by a two-dimensional depth sensor (such as a two-dimensional optical radar or a laser scanner) having a two-dimensional field of view 114 The horizontal line 112 defines the vertical obstacle 108. Therefore, if the elevated floor platform 106 is consistent in the vertical direction (for example, there are no missing slabs or other openings along the elevated floor platform 106), the two-dimensional view 114 will stop at the elevated floor platform 106 and form Horizontal line 112. However, if the elevated floor platform 106 has inconsistencies in the vertical direction, the two-dimensional field of view 114 will determine the inconsistencies in the vertical direction along the horizontal line 112 (for example, the elevated floor platform 106 has missing panels or has other Opening). Advantageously, it is easier to detect changes in depth along the horizontal line 112 (such as a one-dimensional area) in front of the automatic sensing vehicle 102 and on the surface (such as the elevated floor platform 106) on which the automatic sensing vehicle 102 travels (such as generating more Obvious and distinguishable sensor data), and when compared with the depth change of the area in front of the automatic sensing vehicle 102 (such as a two-dimensional area) and the surface (such as the elevated floor platform 106) that the automatic sensing vehicle 102 is passing through, only need Less processing.

In some embodiments, the field of view 114 of the depth sensor 104 may have an angle of about 30 degrees to about 50 degrees with the surface 116 of the automated vehicle 102. In some embodiments, the field of view 114 of the depth sensor 104 may have an angle of about 30 degrees to about 50 degrees with the virtual line segment 117 (the dashed line in the figure) orthogonal to the elevated floor platform 106. In some embodiments, the field of view 114 of the depth sensor 104 may be about 700 mm above the elevated floor platform 106, or between about 100 mm and about 1000 mm. In some embodiments, the depth sensor 104 may be implemented as a linear or line laser that can project outbound radiation pulses that can illuminate the elevated floor platform 106 along the horizontal line 112. In some embodiments, the depth sensor may be configured to detect vertical obstacles on one or two floors before the automated vehicle. In some embodiments, the depth sensor 104 may be implemented as a point laser configured to continuously scan the field of view 114 (eg, move or rotate in the field of view 114).

The autonomous vehicle 102 may be configured to traverse the elevated floor platform 106 along a predetermined route. The predetermined route may be, for example, a route between wafer storages (e.g., between two different semiconductor processing sites or tools). In some embodiments, the predetermined route may be an end-to-end route, so that all movements along the predetermined route are also predetermined. In some embodiments, the predetermined route may be the current direction of movement, rather than the end-to-end route, and all movements along the predetermined route are also predetermined. For example, the current movement direction can be along the forward direction (shown by arrow 110A).

Therefore, the automatic induction vehicle 102 can transport semiconductor workpieces from one wafer storage to another wafer storage (for example, from one semiconductor processing site to another semiconductor processing site). In some embodiments, the loading area 118 on the top of the automated induction vehicle may include a robotic arm or an object to be transported (for example, a wafer carrier used to carry semiconductor workpieces such as dies or wafers). In some embodiments, the autonomous vehicle is configured to traverse the elevated floor platform 106 at a speed of about 0.8 meters per second, or about 0.5 meters per second to about 1 meter per second.

In some embodiments, each floor of the elevated floor platform 106 may be porous and/or located a certain distance above the floor below. The single floor of the elevated floor platform 106 may have, for example, a rectangular, triangular, octagonal or other geometric shape. The elevated floor platform 106 can be configured, for example, to reduce vibration from one side of the elevated floor platform 106 (for example, the lower surface facing the ground) through the elevated floor platform 106 to the second side of the elevated floor platform 106 ( For example, it faces the upper surface of the automatic sensor car 102).

In some embodiments, the autonomous vehicle 102 may include a plurality of depth sensors 104. For example, the autonomous vehicle 102 may include a depth sensor 104 in the front (for example, facing the forward direction shown by the arrow 110A, or shown as being closest to the vertical obstacle 108). The front depth sensor 104 (for example, facing the direction of the arrow 110A) may be configured to detect the vertical obstacle 108 in the forward direction indicated by the arrow 110A. Similarly, the autonomous vehicle 102 may include a depth sensor 104 at the rear (for example, facing the opposite direction as shown by the arrow 110B). The depth sensor 104 at the back facing the direction of arrow 110B can be configured to detect vertical obstacles in the opposite direction shown by arrow 110B. Except for facing different directions, the features of the depth sensor at the rear can be similar or the same as those of the depth sensor at the front, and for the sake of brevity, it will not be repeated here.

In some embodiments, the autonomous vehicle 102 may include front wheels 124A, configured to guide or steer the autonomous vehicle 102 when the autonomous vehicle is moving. The auto-sensing car 102 may also include a rear wheel 124B (due to the limitation of the conceptual diagram 100 in the perspective view, only one rear wheel 124B is shown), which is configured to rotate without turning when the auto-sensing car is moving. . The front wheels 124A and the rear wheels 124B may be configured to move the auto-sensing vehicle 102 through the rotation of the front wheels 124A and the rear wheels 124B. Therefore, the automatic induction vehicle 102 may be configured to move in a forward or backward direction under the guidance of the two front wheels 124A. In some embodiments, all wheels can be configured to guide or steer when the auto-sensing vehicle moves by the rotation of the wheels.

In some embodiments, one or more individual floor panels 120 may be removed from the elevated floor platform 106, thereby presenting vertical obstacles 108 (eg, openings, holes, or depth) along the elevated floor platform 106. By using the depth sensor 104, the automatic sensor car 102 can avoid the vertical obstacle 108 by detecting these vertical obstacles 108 in front of the automatic sensor car 102 and redirecting the path of the automatic sensor car 102, thereby avoiding These vertical obstacles 108 area. In some embodiments, the automatic sensor car 102 may be configured to respond to the detection of a vertical obstacle 108 in front of the automatic sensor car 102 (for example, in front of the automatic sensor car 102 moving in the direction in which the automatic sensor car 102 is moving). Stop immediately.

FIG. 2 is a schematic diagram of the automatic induction vehicle 202 on the elevated floor platform 204 according to some embodiments. As described above, the automatic induction vehicle 202 may be an automatic guided vehicle having at least one depth sensor 206. The automatic induction vehicle 202 may be configured to traverse the elevated floor platform 204. The automatic sensor vehicle 202 can use the depth sensor 206 to detect vertical obstacles 208, such as a missing floor, other holes, or openings, along the elevated floor platform 204 that the automatic sensor vehicle 202 is crossing. The automatic sensor vehicle 202 can then redirect the path across the elevated floor platform 204 to avoid the vertical obstacle 208.

In various embodiments, the automatic induction vehicle 202 may use other sensors (not shown) for guidance, and avoid other objects 210 on the elevated floor platform 204. For example, the automatic sensor car 202 may include image sensors, optical radar sensors, magnetic sensors or other types of sensors to detect other objects 210, so as to avoid other objects when crossing the elevated floor platform 204 210. In some embodiments, the position of other objects 210 may be predetermined or communicated to the automatic sensor car 202, so that the automatic sensor car 202 can plot to cross the elevated floor platform 204 and avoid the predetermined position of other objects 210. path.

As shown in the figure, the vertical obstacle 208 may be a separate floor piece 220 that is missing or otherwise removed from the elevated floor platform 204 or does not exist. In addition, as discussed further below, the elevated floor platform 204 may include a structure in which an independent floor piece 220 rests on the structure, and the structure is physically separated from the ground 226 below the elevated floor platform 204.

In various embodiments, due to more stringent requirements for manufacturing environment and pollution control, the elevated floor platform may be implemented in a semiconductor manufacturing facility (FAB). For example, when the feature size is in the range of 2 microns (μm), a cleanliness class of 100 to 1000 (cleanliness class, for example, the number of particles with a size greater than 0.5 μm per cubic foot) is sufficient. However, when the feature size is reduced to 0.25 μm, a cleanliness level of 0.1 is required. It has been known that when the device size is further reduced, an inert micro environment may be a solution for future manufacturing technology. In order to eliminate micro-pollution and reduce the growth of natural oxides on the silicon surface, the wafer processing and loading and unloading procedures of the semiconductor manufacturing facility (FAB) can be enclosed in a very high-cleanliness micro-environment, and the Pure nitrogen continuously flushes the wafers.

Therefore, one of the designs in today's clean room facilities is to implement elevated floor platforms. Figure 3A is a side view of an elevated floor platform 302 according to some embodiments. In some embodiments, the elevated floor platform 302 is installed between about 45 centimeters (cm) and about 60 cm above the ground 304 (such as a surface-treated cement waffle slab). The elevated floor platform 302 usually covers the entire production area of the clean room. In some embodiments, the lattice 306 of the elevated floor platform 302 (for example, the area where the independent floor slab 308 or the tile is located) may be based on a 60×60 centimeter (cm) system and may be aligned with the centerline of a traditional ceiling lattice. Some independent floor panels 308 have perforations to circulate the air in the clean room. By selecting an independent floor sheet 308 with appropriate perforations, the air pressure adjustment and air flow balance in the clean room can be achieved.

In the elevated floor platform 302 shown in FIG. 3A, the independent floor sheet 308 can be static-dissipative, made of non-combustible materials, and is also resistant to chemical abrasion. For example, the independent floor sheet 308 may be made of a vinyl material (vinyl) that is impact resistant and meets the anti-static discharge insulation requirements of a clean room environment.

In various embodiments, the elevated floor slab platform 302 can be laterally stable in all directions with or without a separate floor sheet 308. This lateral stability can be achieved by anchoring the support 310 to the ground 304 (such as a concrete floor or other surface), and further using a steel brace 312. The independent floor piece 308 is supported by steel brace arms 312, and the steel brace arms 312 are supported by height-adjustable supports 310 at each corner. As shown in FIG. 3A, the anchored support 310 is fixed to the ground 304 (such as a cement floor or other surface) using bolts. An insulating plate 316 can be placed on the top of each support 310 to reduce footsteps and provide better electrical isolation. The steel brace 312 is used to further improve the rigidity of the elevated floor platform 302 and the support of the support 310.

In various embodiments, the autonomous vehicle 322 may be configured to traverse a set of elevated floor platforms 302. The automatic sensor vehicle 322 can use the depth sensor 324 to detect vertical obstacles, such as missing floors or other holes or openings along the elevated floor platform 302 traversed by the automatic sensor vehicle 322. Then, the automatic sensor vehicle 322 can redirect the path across the elevated floor platform 302 to avoid vertical obstacles.

As mentioned above, in some embodiments, the depth sensor 324 may be a laser sensor. More specifically, the depth sensor 324 may be, for example, an optical radar (LiDAR) sensor or other laser scanner, configured to illuminate a target or surface (such as the ground or an elevated floor platform) in a pulsed laser manner, and measure Reflected pulse. The difference between the return time and wavelength of the returned reflected pulse and the emitted illumination pulse can be used to determine the distance to the surface. In some embodiments, the depth sensor 324 may be configured to move along a cross-surface (such as an elevated floor platform) by a two-dimensional depth sensor (such as a two-dimensional optical radar or a laser scanner) having a two-dimensional field of view 326. The one-dimensional horizontal line of 302) determines the vertical obstacle. Therefore, if the surface (e.g., elevated floor platform 302) is vertically consistent (e.g., there are no missing panels or no other openings along the elevated floor platform 302), the two-dimensional view 326 will end at the surface (e.g., elevated floor platform 302) and form a horizontal line. However, if the surface (e.g., elevated floor platform 302) is vertically inconsistent (e.g., there are missing panels or other openings along the elevated floor platform 302), the two-dimensional view 326 will determine the vertical discontinuity along the horizontal line .

In some embodiments, the field of view 326 at the depth sensor 324 may form an angle 328 of about 30 degrees to about 50 degrees with the surface 330 of the autonomous vehicle 332. In some embodiments, the surface 330 may also be substantially orthogonal to the surface 331 of the elevated floor platform 302 facing upward. In some embodiments, the field of view 326 of the depth sensor 324 may be about 700 mm above the elevated floor platform 302, or about 100 mm to about 1000 mm. In some embodiments, the depth sensor 324 may be implemented as a linear or linear laser projecting outwardly directed irradiation pulses that can be irradiated along a horizontal line.

Figure 3B is a side view of an elevated floor platform 302 with a vertical obstacle 350 according to some embodiments. As shown in the figure, the vertical obstacle 350 may be an opening caused by the fact that the elevated floor platform 302 does not have an independent floor sheet 308 or the independent floor sheet 308 is removed in other ways. This vertical obstacle 350 can be in the grid 306 of the elevated floor platform 302 (for example, the area where the independent floor 308 or floor tiles are placed) can be based on a 60×60 centimeter (cm) system and/or aligned with traditional The center line of the filter ceiling grid. Therefore, the vertical obstacle in Figure 3B can be detected as a first depth 356 (shown in dashed lines) from the depth sensor 324 to the ground 304 (such as a concrete floor or other surface) in the field of view of the depth sensor 324 . The first depth 356 is greater than the second depth 358 (shown in solid lines) of the independent floor piece 308 from the depth sensor 324 to the elevated floor platform 302 in the field of view of the depth sensor 324.

Figure 3C is a top view of a portion of the elevated floor platform 370 traversed by the automatic induction vehicle 372 according to some embodiments. The automatic sensor vehicle 372 may include a plurality of sensors, and each sensor has its own two-dimensional field of view 374A, 374B, 374C, and 374D. One end of each two-dimensional field of view 374A, 374B, 374C, 374D terminates at each sensor of the automatic induction vehicle 372. In addition, if the surface (e.g. elevated floor platform 370) is consistent in the vertical direction (e.g., there are no missing panels or other openings on the elevated floor platform 370), the two-dimensional view 374A, 374B, 374C, 374D will follow along The corresponding horizontal lines 376A, 376B, 376C, and 376D terminate at the ground (for example, the elevated floor platform 370). In other words, in some embodiments, the sensor may include a line laser emitting laser light in the visible spectrum, and the laser light will illuminate the lines along the respective horizontal lines 376A, 376B, 376C, and 376D.

In some embodiments, the autonomous vehicle 372 may include multiple depth sensors, but only one of the multiple depth sensors is used (eg, activated) at a time. For example, only one depth sensor facing in the forward direction of motion is used or activated at a specific point in time. This forward movement may change with the movement of the auto-sensing car 372, for example, the auto-sensing car 372 can move forward in the first direction 380A and therefore only utilize the depth sensor with the first two-dimensional field of view 374A. Alternatively, the autonomous vehicle 372 may move forward in the second direction 380B and thus only utilize the depth sensor with the second two-dimensional field of view 374B. Alternatively, the auto-sensing car 372 may move forward in the third direction 380C and therefore only utilize the depth sensor with the third two-dimensional field of view 374C. Alternatively, the autonomous vehicle 372 may move forward in the fourth direction 380D and thus only utilize the depth sensor with the fourth two-dimensional field of view 374D. In some embodiments, the auto-sensing car can move in a specific direction, but more than one or even all its depth sensors are active (for example, monitoring more than one two-dimensional field of view 374A, 374B, 374C, 374D or monitoring all two-dimensional fields of view 374A, 374B, 374C, 374D).

FIG. 4A is a conceptual diagram of an automatic induction vehicle 402 with a robotic arm 404 according to some embodiments. The robotic arm 404 may be on the payload area 406 above the automatic induction vehicle 402. In some embodiments, the automatic induction car 402 with the robotic arm 404 may be referred to as the first type of automatic induction car.

FIG. 4B is a conceptual diagram of an automatic induction vehicle 412 with a wafer carrier 414 according to some embodiments. The wafer carrier 414 may be located on the payload area 406 on the top of the automatic induction vehicle 412. The wafer carrier 414 may be, for example, a standard mechanical interface (SMIF) box that can hold multiple wafers, or a front opening wafer transfer box (FOUPs) that can hold larger wafers. The wafer carrier 414 may also be a die container, such as a boat or a tray, configured to hold a plurality of die (for example, singulated wafers). In some embodiments, the automatic induction vehicle 412 with the wafer carrier 414 may be referred to as the second type of automatic induction vehicle.

FIG. 4C is a conceptual diagram of an automatic wafer handling system 450 according to some embodiments. As described above, the automatic wafer handling system 450 may be in a clean room or other type of semiconductor manufacturing facility that uses an elevated floor platform for operation. The automatic wafer handling system 450 may include two wafer handling areas 452A and 452B. Each wafer handling area may include a wafer storage 454A or 454B, respectively, and the wafer storage 454A or 454B is a rack for the wafer carriers 456A and 456B, respectively. Each wafer carrier may include one or more wafers or dies. The automatic wafer handling system 450 may include a first type of automatic induction vehicle 458A, 458B in the vicinity (eg, adjacent to) each wafer storage 454A, 454B. Each first type of automatic induction vehicle 458A, 458B may include a robot arm 459A, 459B. In addition, the automatic wafer handling system 450 may include a second type of automatic induction cart 460 that can be configured to transfer wafers between the first wafer handling area 452A and the second wafer handling area 452B. As described above, each of the first type of automatic induction vehicle 458A, 458B and the second type of automatic induction vehicle 460 may include a depth sensor.

Although the wafer storages 454A and 454B are shown as racks, according to various embodiments, any type of fixed storage or holding of wafers can be used in wafer storages for different applications. For example, the wafer storage may be a platform for passive storage of wafers, such as a shelf, a shelf, or a table where the wafer carrier can be placed. Or the wafer storage may be a platform for actively storing wafers, such as a semiconductor processing site or a tool or stocker. More specifically, when the wafer storage 454A, 454B is a semiconductor processing site or tool, the wafer storage 454A, 454B may specifically be a part of the semiconductor processing site or tool, and this part is a semiconductor processing site or The tool is configured to receive or exclude a wafer carrier processed by a semiconductor processing site or tool and a load port for the formed wafer or die.

The first type of automatic induction vehicles 458A, 458B may include the ability to manipulate and/or handle individual wafers, dies, and/or wafer carriers. For example, the robotic arms 459A and 459B can represent robotic arms with grippers, or other manipulation or handling methods for moving wafers, dies and/or wafer carriers from one platform to another. . The term “platform” can refer to any place on which wafers can be stored and/or transported, such as wafer carriers and/or second-type automatic induction vehicles 460. The robotic arms 459A and 459B can manipulate and/or transport wafers, dies and/or wafer carriers by using traditional robotic arm structures and technologies in a traditional manner. Therefore, for the sake of brevity, detailed discussion is not provided here. For example, the robotic arms 459A and 459B can pick up and move wafers, dies and/or wafer carriers from one platform and place them on another platform. In addition, the first type of automatic induction vehicles 458A, 458B can be configured to perform automatic movement independent of tracks or other physical rails. For example, the first type of automatic induction vehicles 458A, 458B may include a set of wheels, and the first type of automatic induction vehicles 458A, 458B can be moved by the degree of freedom of rolling (for example, rotating) motion.

The second type of automatic induction cart 460 may be configured or constructed to hold wafers, dies, and/or wafer carriers. In some embodiments, the second type of automatic induction vehicle 460 may include a structure for carrying multiple wafers, dies, and/or wafer carriers (for example, during transportation, wafers, dies, and/or Or the wafer carrier is fixed on the shelf or other structure of the second type of automatic induction vehicle 460). The structure for carrying multiple wafers, dies, and/or wafer carriers may include carefully identified locations so that the wafers, dies, and/or wafer carriers on the automatic cart can be compatible with the second type of automatic The position of the sensor car 460 corresponds to it, and identification is performed accordingly.

The first type of automatic induction vehicles 458A, 458B, and/or the second type of automatic induction vehicles 460 may all be configured to automatically move between positions on an elevated floor platform in a semiconductor manufacturing facility (FAB). In some embodiments, the first type of automatic induction vehicles 458A, 458B and/or the second type of automatic induction vehicle 460 may be equipped with a path module, and the path module may enable the first type of automatic induction vehicles 458A, 458B and / Or the second type of automatic induction vehicle 460, which determines different wafer handling areas (e.g. wafer handling areas 452A, 452B) automatically and without external manual guidance (for example, no need to be manually driven and/or guided by the operator in real time) Various paths between (for example, various predetermined paths are determined, or paths determined before departure). For example, the path module can be configured to receive and execute movement along a known path between different wafer handling areas. In other examples, the path module can automatically analyze semiconductor manufacturing facilities (for example, the layout of semiconductor manufacturing facilities) to determine different paths between different wafer handling areas to avoid fixed obstacles. Other examples of path modules may include modules that can execute pathing or path finding applications, such as Dijkstra algorithm or angular path planning algorithm applications.

Advantageously, in some embodiments, since the first type of automatic induction vehicles 458A, 458B and/or the second type of automatic induction vehicles 460 are movable, they can be located around a semiconductor manufacturing facility (FAB) on a raised floor Move in an expected manner without the need for rails and/or other means of transportation used by a more stable automated material handling system (for example, an automated material handling system that moves the wafer carrier to a height by a vehicle suspended on an elevated rail) To achieve the required functions automatically. In addition, the first type of automatic induction vehicle 458A, 458B and/or the second type of automatic induction vehicle 460 may include a communication interface to coordinate the transportation and handling of wafers without manual intervention, while traditional systems require Rely on manual transportation of wafers and/or wafer carriers around semiconductor manufacturing facilities. In some embodiments, each individual wafer storage, the first type of automatic induction car 458A, 458B, and/or the second type of automatic induction car 460 can be configured to operate automatically without requiring separate Instructions, and centrally control the automatic wafer handling system 450. For example, it is possible to select and execute various predetermined routines based on simply paying attention to the location and type of wafer storage in which the automatic wafer handling system 450 will transport wafers, dies, and/or wafer carriers.

FIG. 5 is a block diagram of the active module 502 of the automatic induction vehicle according to some embodiments. The active module 502 may include a processor 504. In some embodiments, the processor 504 may be one or more processors. The processor 504 may be operably connected to a computer-readable storage module 506 (such as a memory and/or a database), a network connection module 508, and a user interface module 510.

The processor 504 may be configured to control various physical devices to facilitate communication and control of the automatic induction vehicle. For example, the processor 504 can be configured to control wheels, robotic arms, network connection module 508, computer readable storage module 506, user interface module 510, controller 512, sensor 514, or other automatic The other motions or functions of the induction car have at least one of the controllable aspects of the active module. For example, the processor 504 may control a motor capable of moving at least one of a wheel and/or a robot arm.

In some embodiments, the computer-readable storage module 506 may include auto-sensing car logic that can configure the processor 504 to perform the various processes discussed herein. The computer-readable storage module can also store data, such as any other parameters or information that can be used to perform the various processes discussed in this article.

The network connection module 508 can facilitate the network connection of various devices and/or components inside or outside the automatic induction car and the automatic induction car. In some embodiments, the network connection module 508 can facilitate physical connections, such as wires or buses. In some embodiments, the network connection module 508 can facilitate wireless connection by using a transmitter, a receiver, and/or a transceiver, for example, on a wireless local area network (WLAN). For example, the network connection module 508 can facilitate wireless or wired connection with other automatic induction vehicles.

The active module 502 may also include a user interface module 510. The user interface module 510 may include any type of interface for the user to input and/or output to the auto-sensing car. The interface includes, but is not limited to, a display, a notebook computer, a tablet computer, or a mobile device.

The active module 502 may include a sensor. The sensor may be, for example, a depth sensor. In some embodiments, the depth sensor may be a laser sensor. More specifically, the depth sensor may be, for example, an optical radar (LiDAR) sensor or other laser scanner configured to illuminate a surface (such as the ground or an elevated floor platform) with a pulsed laser and measure the reflected pulse. The difference between the return time and wavelength of the returned reflected pulse and the emitted illumination pulse can be used to determine the distance to the surface. In some embodiments, the depth sensor may be configured to determine vertical obstacles along a one-dimensional line on the surface via a two-dimensional depth sensor (for example, a two-dimensional optical radar or a laser scanner). The two-dimensional depth sensor can determine vertical anomalies along a line that spans the entire surface (for example, a one-dimensional space with a length instead of an area with a length and a width). The two-dimensional depth sensor can be in contrast to other embodiments that can use a point on the surface of the one-dimensional depth sensor (for example, a point that moves away from the relative position of the depth sensor over time) to determine vertical obstacles, or can use In contrast to other embodiments where the three-dimensional depth sensor determines the vertical obstacles on the entire surface area (for example, a two-dimensional area having a length and a width, rather than a space having only a length). Advantageously, changes in depth along the horizontal line in front of the auto-sensing car (for example, one-dimensional space) and across the surface the auto-sensing car passes through may be more detectable (for example, producing more obvious and distinguishable sensor data), And compared with the area in front of the auto-sensing vehicle (for example, a two-dimensional area) and crossing the depth change of the surface that the auto-sensing vehicle passes, only less processing is required.

Figure 6 is a flowchart of a process 600 of an automatic induction car according to some embodiments. The process of automatic wafer handling can be performed by at least one automatic induction vehicle. It should be noted that the process 600 is only an example and is not intended to limit the present disclosure. It should therefore be understood that additional operations may be provided before, during, and after the process 600 in FIG. 6. Some operations can be omitted, some operations can be performed simultaneously with other operations, and only some operations can be briefly described here.

In operation 602, the automatic induction vehicle may determine the path to traverse on the elevated floor platform. For example, the automatic induction vehicle can be configured to traverse the elevated floor platform along a predetermined route. The predetermined path may be, for example, a path between two different wafer storages (eg, semiconductor processing sites or tools) for static storage, processing, or holding of wafers. For example, the wafer storage may be a platform for passive storage of wafers, such as a rack, a shelf or a table where the wafer carrier can be placed. Or the wafer storage may be a platform for actively storing wafers, such as a semiconductor processing site or a tool or stocker. When the wafer storage is a semiconductor processing site or tool, the wafer storage may specifically be a part of the semiconductor processing site or tool, and this part is the semiconductor processing site or tool configured to receive or exclude from the semiconductor processing station Point or tool handles the wafer carrier and the load port of the composed wafer or die.

Therefore, the automatic induction vehicle can transport semiconductor workpieces from one semiconductor processing site to another semiconductor processing site via a predetermined path across the elevated floor platform. In some embodiments, the automatic induction vehicle is configured to cross the elevated floor platform at a speed of about 0.8 meters per second, or about 0.5 meters per second to about 1 meter per second. The elevated floor platform may be porous and/or above a certain distance from the floor below.

In some embodiments, the automatic induction vehicle may be equipped with a path module, and the automatic induction vehicle may be configured to determine various paths between different wafer handling areas (for example, to determine various predetermined paths or positions determined before departure). The path) runs automatically without external manual guidance (e.g., without immediate manual driving and/or guidance by the operator). In some embodiments, the automatic sensor vehicle may be equipped with a routing module, and the automatic sensor vehicle may be configured with the automatic sensor vehicle to determine different wafers automatically and without external manual guidance (for example, without being manually driven and/or guided by the operator immediately). Various routes between the transfer areas (for example, various predetermined routes are determined, or routes determined before departure). For example, the path module can be configured to receive and execute movement along a known path between different wafer handling areas. In other examples, the path module can automatically analyze semiconductor manufacturing facilities (for example, the layout of semiconductor manufacturing facilities) to determine different paths between different wafer handling areas to avoid fixed obstacles. Other examples of path modules may include modules that can execute pathfinding or path searching applications, such as Dijkstra algorithm or angular path planning algorithm applications.

In operation 604, the depth sensor may be activated. As described above, the automatic induction vehicle may be an automatic guided vehicle having at least one depth sensor. For example, the auto-sensing car can be configured to move forward, so that the depth sensor can detect vertical obstacles as a depth change along the horizontal line in front of the auto-sensing car and across the elevated floor platform where the auto-sensing car is driving .

In some embodiments, the autonomous vehicle may include multiple depth sensors, but only one depth sensor is used (eg, activated) at a time. For example, when the auto-sensing car moves in the forward direction, only one depth sensor facing the forward direction is used or activated. However, when the auto-sensing car reverses (for example, moving in the reverse direction of movement), only a depth sensor facing the reverse movement is used or activated. In other words, the automatic induction car can only use one depth sensor that can collect depth sensor data representing the area in front of the automatic induction car moving. In some embodiments, the autonomous vehicle can move in a specific direction, but activate multiple depth sensors (for example, monitor all two-dimensional views from all depth sensors or multiple depth sensors).

In operation 606, the activated depth sensor may be used to collect depth sensor data. In some embodiments, the depth sensor may be a laser sensor. More specifically, the depth sensor may be, for example, an optical radar (LiDAR) sensor or other laser scanners. Such laser scanners can be configured to emit pulsed laser light to illuminate surfaces (such as the ground or elevated floor platforms). The difference between the return time and wavelength of the returned reflected pulse and the emitted illumination pulse can be used to determine the distance to the surface. These distances (and/or distance differences inferred from them) can be referred to as depth sensor data.

In some embodiments, the depth sensor data may be collected along a one-dimensional horizontal line of the entire surface (for example, an elevated floor platform). A two-dimensional depth sensor with a two-dimensional field of view (such as a two-dimensional optical radar or a laser scanner) can be used to collect the depth sensor data along the one-dimensional horizontal line. Therefore, if the surface (e.g. elevated floor platform) is vertically consistent (e.g. there are no missing panels or other openings along the elevated floor platform), the two-dimensional view will end at the surface (e.g. elevated floor platform) and form a horizontal line.

In operation 608, a vertical obstacle may be detected based on the depth sensor data. In some embodiments, the vertical obstacle may be greater than a threshold amount (for example, a threshold amount indicating that the depth sensor data on the one-dimensional horizontal line has an abnormal value or a non-nominal difference) crossing a one-dimensional level. A step change in the depth sensor data on the line. In some embodiments, when the difference in the depth sensor data across a one-dimensional horizontal line is greater than about 1 centimeter (cm), greater than about 10 cm, greater than about 20 cm, greater than about 30 cm, greater than about 40 cm, greater than about 50 cm, or greater than Vertical obstacles can be detected at about 60cm. Therefore, the depth sensor can be configured to determine vertical obstacles along a one-dimensional horizontal line that spans the entire surface (such as an elevated floor platform) based on the depth sensor data.

As described above, a two-dimensional depth sensor (such as a two-dimensional laser radar or a laser scanner) with a two-dimensional field of view can be used to detect or collect the depth sensor data along the one-dimensional horizontal line. Therefore, if the surface (e.g. elevated floor platform) is vertically consistent (e.g. there are no missing panels or other openings along the elevated floor platform), the two-dimensional view will end at the surface (e.g. elevated floor platform) and form a horizontal line.

However, if this surface (e.g. an elevated floor platform) is vertically inconsistent (e.g. lacks panels or has other openings along the elevated floor platform), the depth sensor data from the two-dimensional field of view will indicate vertical inconsistencies along the horizontal line Sex. Advantageously, the depth changes along the horizontal line (such as one-dimensional space) in front of the auto-sensing car and across the surface (e.g. raised floor) the auto-sensing car passes through may be more detectable (e.g., produce more obvious and Differentiable sensor data), and requires less processing than the depth changes in the area in front of the auto-sensing car (for example, a two-dimensional area) and across the surface (for example, the surface the auto-sensing car is crossing).

In operation 610, remediation may be performed in response to the detection of a vertical obstacle. This remedy may include allowing the automatic sensor car to redirect its path on the elevated floor platform to avoid detected vertical obstacles. In some embodiments, the redirected path may have the same start and end points as the original path, but is designed to avoid detected vertical obstacles.

In some embodiments, the remedial operation may be to immediately stop the auto-sensing car in response to a vertical obstacle detected in front of the auto-sensing car (for example, before the auto-sensing car in the direction in which the auto-sensing car is moving). This immediate stop can trigger the path module of the automatic induction vehicle to analyze the updated layout of the semiconductor manufacturing equipment (for example, there is now a newly detected vertical obstacle). After the analysis, the path module can provide a redirected (for example, new) path to the automatic induction vehicle to traverse the elevated floor platform.

In some embodiments, this immediate stop can trigger an instruction (for example, an alarm or communication via a communication interface) to an operator of a semiconductor manufacturing facility with an elevated floor platform that an automatic sensor vehicle is traversing to prevent vertical obstacles. Remedial items (such as replacing missing floor tiles and/or removing accidental items on elevated floor platforms). Once the vertical obstacle is remedied, the alert operator can instruct the automatic induction vehicle (for example, via a communication interface) to restore the automatic induction vehicle's original path across the semiconductor manufacturing equipment. In some embodiments, the instruction may be a notification that the vertical obstacle has been remedied sent to the automatic induction vehicle via a communication interface.

In some embodiments, a transportation system is provided, including: an automatic vehicle configured to traverse/pass a first predetermined path; and a sensor system located on the automatic vehicle, the sensor system configured to be located in front of the automatic vehicle along the first predetermined path Vertical obstacles are detected on one or two floors, wherein the automatic vehicle is configured to traverse the second predetermined path in response to detecting the vertical obstacle.

In some embodiments, the sensor system includes a two-dimensional optical radar sensor. In some embodiments, the two-dimensional optical radar sensor is stationary. In some embodiments, the sensor system includes a two-dimensional optical radar sensor implemented as a linear laser. In some embodiments, the sensor system includes a plurality of two-dimensional optical radar sensors configured to detect vertical inconsistencies along lines orthogonal to each other. In some embodiments, one of the various line segments extends along an axis orthogonal to the direction of movement of the automatic vehicle.

In some embodiments, a transportation system is provided, including: an elevated floor platform configured to reduce vibration transmitted from one side of the elevated floor platform to a second side of the elevated floor platform; an automatic vehicle configured to follow a first predetermined The path traverses the elevated floor platform; and the sensor system is configured to detect vertical obstacles along the first predetermined path along the floor in front of the automatic car, wherein the automatic car is configured to follow the vertical obstacle when the vertical obstacle is detected. The second predetermined path traverses the elevated floor platform

In some embodiments, the sensor system includes a linear laser that is inclined at an angle of about 30 degrees to about 50 degrees with the surface of the automobile. In some embodiments, the linear laser is located about 100 mm to about 1000 mm above the elevated floor platform. In some embodiments, the automated vehicle is configured to traverse the elevated floor platform at a speed of about 0.5 meters per second to about 1 meter per second. In some embodiments, the sensor system includes a sensor part and a processor part, wherein the sensor part is configured to generate sensor data, and the sensor data is processed by the processor part to detect vertical obstacles along a first predetermined path Things. In some embodiments, the elevated floor platform is located a certain distance above the lower floor. In some embodiments, the elevated floor platform is porous. In some embodiments, the robotic arm is located on the top of the automated vehicle.

In some embodiments, a transportation method is provided, including: when the automatic vehicle is traveling along a first predetermined path, collecting depth sensor data along a line segment in front of the automatic vehicle; detecting a vertical obstacle in front of the automatic vehicle based on the depth sensor data; and In response to detecting the vertical obstacle, the automatic vehicle is redirected to move the automatic vehicle along the second predetermined path.

In some embodiments, the transportation method further includes stopping the automated vehicle in response to detecting a vertical obstacle. In some embodiments, the first predetermined path is a path along the elevated floor platform from the first semiconductor processing site to the second semiconductor processing site. In some embodiments, the second predetermined path is a path along the elevated floor platform from the first semiconductor processing site to the second semiconductor processing site, and the second predetermined path is different from the first predetermined path. In some embodiments, the transportation method further includes moving the semiconductor workpiece between the first semiconductor processing site and the second semiconductor processing site, wherein the first predetermined path and the second predetermined path are between the first semiconductor processing site and Between the second semiconductor processing site. In some embodiments, the transportation method further includes moving the semiconductor workpiece from the automated vehicle to the second semiconductor processing station by the robotic arm of the automated vehicle.

Those skilled in the art will further understand that any of the various illustrative logical blocks, modules, processors, devices, circuits, methods, and functions described in conjunction with the aspects disclosed in this specification can be implemented by electronic hardware (such as Digitally, analogously, or a combination of the two), firmware, various forms of programs, or design code containing instructions (for convenience, this may be referred to as "software" or "software" Module") or any combination of the foregoing technologies. In order to clearly illustrate the interchangeability of hardware, firmware, and software, various illustrative elements, blocks, modules, circuits, and functions of steps have been generally described previously. Whether this function is implemented as hardware, firmware, and software or a combination of these technologies depends on the specific application and design constraints imposed on the entire system. Those skilled in the art can implement the described functions in various ways for each specific application without going beyond the scope of this disclosure.

In addition, those of ordinary skill in the art will understand that the various illustrative logic blocks, modules, devices, elements, and circuits described herein may include general purpose processors (general purpose processors) and digital signal processors (digital signal processors, DSP). , Application specific integrated circuit (application specific integrated circuit, ASIC), field programmable logic gate array (field programmable gate array, FPGA), other programmable logic device, or any combination of integrated circuit (integrated circuit, IC) implemented or executed. The logic blocks, modules, and circuits may also include antennas and/or transceivers to communicate with various components in a network or device. The general-purpose processor can be a microprocessor, or any traditional processor, controller, or state machine. The processor can also be implemented as a combination of computing devices, such as a combination of a digital signal processor and a microprocessor, multiple microprocessors, one or more microprocessors combined with a digital signal processor core, or any combination suitable for executing The configuration of the described functions.

In this specification, the term "module" used herein refers to software, firmware, hardware, and any combination of these components used to perform the related functions described in this specification. In addition, for the convenience of discussion, the various modules are described as discrete modules. However, two or more modules can be combined into a single module that performs related functions according to the embodiments of the present disclosure, and it is obvious to those skilled in the art.

The above content summarizes the features of many embodiments, so anyone with ordinary knowledge in the relevant technical field can better understand the various aspects of this disclosure. Anyone with ordinary knowledge in the relevant technical field may design or modify other processes and structures based on this disclosure without difficulty to achieve the same purpose and/or obtain the same advantages as the embodiments of the disclosure. Anyone with ordinary knowledge in the relevant technical field should also understand that various changes, substitutions and modifications are made without departing from the spirit and scope of this disclosure. Such equivalent creations do not exceed the spirit and scope of this disclosure.

Unless specifically stated otherwise, conditional language such as "may", "may", "may" and "can" are generally understood in the text to express specific features included in some embodiments but not included in other embodiments. , Components and/or steps. Therefore, this conditional language generally does not mean that one or more embodiments require certain features, elements, and/or steps, or that one or more embodiments must be included in a particular embodiment with or without users. It includes the decision logic whether the described features, elements, and/or steps will be included or performed.

In addition, after reading this disclosure, those skilled in the art will be able to configure functional entities to perform the operations described herein. The term "configuration" used here with regard to designated operations or functions refers to the physical or virtual construction, programming, and/or arrangement of systems, devices, components, circuits, structures, machines, etc., to perform designated operations or functions .

Unless explicitly stated otherwise, the disjunctive language (disjunctive language) such as "at least one of X, Y, or Z" in this article is usually used to represent items, terms, etc., can be X, Y, or Z, or any combination thereof (For example, X, Y, and/or Z). Therefore, this disjunctive language generally does not represent and should not imply that some embodiments require the presence of at least one X, at least one Y, or at least one Z.

It should be emphasized that various changes and modifications can be made to the above embodiments, and the elements therein should be understood as other acceptable examples. All modifications and changes are included in the scope of this disclosure and protected by the attached patent application.

102: Automatic induction car 104: Depth sensor 106: high floor platform 108: Vertical Obstacle 110A, 110B: Arrow 112: horizontal line 114: Vision 116: Surface 117: Virtual Line Segment 118: load zone 120: Floor Piece 124A: front wheel 124B: rear wheel 202: Automatic induction car 204: high floor platform 206: Depth Sensor 208: Vertical Obstacle 210: other objects 220: floor piece 226: Ground 302: Elevated Floor Platform 304: Ground 306: grid 308: Floor Piece 310: bearing 312: Steel brace 316: Insulation board 322: Automatic induction car 324: Depth Sensor 326: Vision 328: Angle 330, 331: Surface 350: Vertical Obstacle 356: first depth 358: second depth 370: high floor platform 372: Automatic induction car 374A: The first two-dimensional vision 374B: The second two-dimensional field of view 374C: The third two-dimensional vision 374D: The fourth two-dimensional field of view 376A, 376B, 376C, 376D: horizontal line 380A: First direction 380B: second direction 380C: Third party 380D: Fourth direction 402: Automatic induction car 404: Robotic Arm 406: payload area 412: Automatic induction car 414: Wafer Carrier 450: Automatic wafer handling system 452A, 452B: Wafer handling area 454A, 454B: wafer storage 456A, 456B: Wafer carrier 458A, 458B: the first type of automatic induction car 459A, 459B: robotic arm 460: The second type of automatic induction car 502: Active Module 504: processor 506: Computer readable storage module 508: network connection module 510: User Interface Module 512: Controller 514: Sensor 600: process 602, 604, 606, 608, 610: Operation

The embodiments of the disclosure will be described in detail below in conjunction with the accompanying drawings. It should be noted that, according to standard practices in the industry, the various features are not drawn to scale and are only used for illustration. In fact, it is possible to arbitrarily enlarge or reduce the size of the element to clearly show the features of the present disclosure. Figure 1 is a conceptual diagram of an automatic induction vehicle according to some embodiments. Figure 2 is a schematic diagram of an automatic induction vehicle on an elevated floor platform according to some embodiments. Figure 3A is a side view of an elevated floor platform according to some embodiments. Figure 3B is a side view of an elevated floor platform with vertical obstacles according to some embodiments. Figure 3C is a top view of a portion of an elevated floor platform traversed by an automatic induction vehicle according to some embodiments. Figure 4A is a conceptual diagram of an automatic induction vehicle with a robotic arm according to some embodiments. FIG. 4B is a conceptual diagram of an automatic induction vehicle with a wafer carrier according to some embodiments. FIG. 4C is a conceptual diagram of an automatic wafer handling system according to some embodiments. FIG. 5 is a block diagram of an active module of an automatic induction vehicle according to some embodiments. Fig. 6 is a flowchart of the process of an automatic induction car according to some embodiments.

102: Automatic induction car

104: Depth sensor

106: high floor platform

108: Vertical Obstacle

110A, 110B: Arrow

112: horizontal line

114: Vision

116: Surface

117: Virtual Line Segment

118: load zone

120: Floor Piece

124A: front wheel

124B: rear wheel

412: Automatic induction car

Claims (1)

A transportation system including: An automatic vehicle configured to traverse a first predetermined path; and A sensor system is located on the automatic vehicle, the sensor system is configured to detect a vertical obstacle along the first predetermined path on one or two floors in front of the automatic vehicle, wherein the automatic vehicle is configured to respond to detection The vertical obstacle is detected and a second predetermined path is traversed.

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