TW202040611A - LC composite component - Google Patents

Abstract

An LC composite component includes a non-magnetic substrate, a magnetic layer with magnetism, capacitors, inductors, and core parts with magnetism. The non-magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the non-magnetic substrate. The inductors and the capacitors are disposed between the first surface of the non-magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core parts is 1.0 or more times the thickness of the magnetic layer in a direction perpendicular to the first surface of the non-magnetic substrate, and each of the magnetic layer and the core parts contains magnetic metal particles and resin.

Description

LC composite parts

The present invention relates to an LC composite part.

In recent years, there has been a further demand for miniaturization and high performance of electronic components used in wireless communication devices such as mobile phones and wireless LAN communication devices. In Patent Document 1, an LC composite part is disclosed, which includes an inductor, a capacitor, a magnetic layer, and a substrate. The substrate, the magnetic layer, and the inductor are arranged in a specific positional relationship, and the substrate has a predetermined thickness and complex Permeability. Prior art literature Patent literature

Patent Document 1 Japanese Patent Laid-Open No. 2016-006847

[The problem to be solved by the invention]

However, the LC composite component disclosed in Patent Document 1 has room for further improvement in the insertion loss characteristics of the LC composite component.

Therefore, the object of the present invention is to provide an LC composite component with further improved insertion loss characteristics. [Technical means to solve the problem]

One aspect of the present invention relates to an LC composite component, which includes: a non-magnetic substrate, a magnetic layer with magnetism, one or more capacitors, one or more inductors, and one or more cores with magnetism, The non-magnetic substrate has a first surface and a second surface opposite to the first surface, the magnetic layer is arranged to face the first surface of the non-magnetic substrate, the one or more inductors and the second surface One or more capacitors are arranged between the first surface of the non-magnetic substrate and the magnetic layer, and the core is arranged between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. In the direction of the first surface of the non-magnetic substrate, the thickness of the core is 1.0 times or more relative to the thickness of the magnetic layer, and the magnetic layer and the core include magnetic metal particles and resin.

In one aspect, the average major axis diameter of the magnetic metal particles may be 120 nm or less.

In one aspect, the average aspect ratio of the magnetic metal particles may be 1.2-6.

In one aspect, the saturation magnetization of the magnetic layer and the core may be 90 emu/g or more.

In one aspect, the magnetic metal particles may include at least one selected from the group consisting of Fe, Co, and Ni as a main component.

In one aspect, the CV value of the aspect ratio of the magnetic metal particles may be 0.4 or less. [Effects of Invention]

According to the present invention, an LC composite component with further improved insertion loss characteristics is provided.

Hereinafter, a preferred embodiment of the present invention will be described. However, the present invention is not limited to the following embodiments.

(LC composite parts) 1 and 2, the LC composite component of the present embodiment of the present invention will be described. Fig. 1 is a perspective view showing the structure of the LC composite component 1 of this embodiment. Fig. 2 is a cross-sectional view showing the structure of the LC composite part of the present embodiment.

The LC composite component 1 includes a non-magnetic substrate 21, a magnetic layer 22 having magnetism, inductors 11, 12, and 17, capacitors 13 to 16, cores 23 and 24 having magnetism, and a dielectric laminate 37.

As shown in FIGS. 1 and 2, the non-magnetic substrate 21 is a flat plate having a first surface 21a and a second surface 21b opposite to the first surface. Examples of the material of the non-magnetic substrate 21 are resin, ceramic, glass, and non-magnetic ferrite. The thickness in the direction perpendicular to the first surface 21a of the non-magnetic substrate 21 can be set to 20-200 μm.

The magnetic layer 22 is a flat plate having a first surface 22 a and a second surface 22 b, and is arranged such that the second surface 22 b faces the first surface 21 a of the non-magnetic substrate 21. Furthermore, in this specification, magnetic refers to ferromagnetism or ferrimagnetism. The material of the magnetic layer 22 will be described below.

The dielectric laminate 37 is arranged between the first surface 21a of the non-magnetic substrate 21 and the magnetic layer 22 (second surface 22b). The dielectric laminate 37 has a plurality of dielectric layers 31 to 36 laminated as shown in FIG. 2. Each of the dielectric layers 31-36 includes a dielectric material. Examples of dielectric materials are resins and ceramics. Examples of resins are polyimide resin, benzocyclobutene resin, bismaleimide triazine resin (BT resin), epoxy resin, and acrylic resin. Examples of ceramics are silicon nitride and alumina.

The LC composite part 1 has a rectangular parallelepiped shape, and has an upper surface 1t, a bottom surface 1b, and four side surfaces 1s. In this embodiment, the upper surface 1t of the LC composite part 1 is constituted by the second surface 21b of the non-magnetic substrate 21. In addition, the bottom surface 1b of the LC composite component 1 is constituted by the first surface 22a of the magnetic layer 22. The LC composite component 1 is mounted on the mounting substrate, for example, such that the bottom surface 1b of the LC composite component 1, that is, the first surface 22a of the magnetic layer 22, and the upper surface of the mounting substrate face each other.

The inductors 11, 12, 17, capacitors 13 to 16, and cores 23, 24 are arranged between the first surface 21 a of the non-magnetic substrate 21 and the second surface 22 b of the magnetic layer 22, that is, in the dielectric laminate 37. In this embodiment, the capacitors 13 to 16 are arranged at positions that do not overlap with the other inductors 11, 12, and 17 when viewed from a direction perpendicular to the first surface 21a. Examples of materials for the conductors of inductors and capacitors are Cu, Al, and Ag. The details of inductors and capacitors will be described below.

The cores 23 and 24 each have a column shape and are respectively arranged on the shafts of the coil structures of the inductors 11 and 12. The cores 23 and 24 are connected to the magnetic layer 22. In this specification, "the cores 23, 24 are connected to the magnetic layer 22" refers to the state where the cores 23, 24 and the magnetic layer 22 are directly connected (contact), and the cores 23, 24 and the magnetic layer 22 are not directly connected. It is connected (contacted) but magnetically connected via a non-magnetic (dielectric, etc.) layer with a thickness of about 0.1-10 μm. In FIG. 2, the cores 23 and 24 are in contact with the magnetic layer 22. The material of the core will be described below. In FIG. 2, a non-magnetic (dielectric body, etc.) layer is interposed between the cores 23 and 24 and the non-magnetic substrate 21, but the cores 23, 24 and the non-magnetic substrate 21 may also be in contact.

As shown in Figure 2, when the thickness of the cores 23, 24 in the direction perpendicular to the first surface 21a of the non-magnetic substrate 21 is set to T1, and the direction perpendicular to the first surface 21a of the non-magnetic substrate 21 When the thickness of the magnetic layer 22 is set to T2, the thickness T1 of the cores 23 and 24 relative to the thickness T2 of the magnetic layer 22 is 1.0 times or more, preferably 2.0 times or more, more preferably 3.0 times or more. The thickness T1 of the cores 23 and 24 may be 10 times or less relative to the thickness T2 of the magnetic layer 22. Thereby, the insertion loss when the cut-off frequency in the LC composite component is not reached can be reduced, and the insertion loss beyond the cut-off frequency can be increased. As the reason, it is considered that the loss in the inductor is reduced by suppressing the loss of the inductor core and increasing the inductance of the inductor.

The thickness of the cores 23 and 24 is not particularly limited. For example, in order to make the shape of the obtained LC composite part practical and easy to manufacture, it can be 30-200 μm, preferably 100-150 μm. Furthermore, the thickness of the cores 23 and 24 is preferably set to be greater than the axial length of the coil structure of the inductors 11 and 12.

Since the inductors 11 and 12 of the LC composite part 1 have cores 23 and 24, respectively, the inductance of the inductor can be increased compared to the case where the inductors 11 and 12 of the LC composite part 1 do not have a core.

(Material of magnetic layer and core) The magnetic layer 22 and the cores 23 and 24 include resin and magnetic metal particles having magnetism.

In this embodiment, the particle diameter of the magnetic metal particles is not particularly limited. The average major axis diameter of the magnetic metal particles is preferably 120 nm or less.

By satisfying this condition, the insertion loss of LC composite parts when the cut-off frequency is not reached is easily suppressed, and on the other hand, it is easy to increase the insertion loss when the cut-off frequency is exceeded. As the reason, one reason is considered to be that, for example, when the average major axis diameter of the magnetic metal particles is 120 nm or less, the filling properties of the magnetic metal particles in the magnetic layer 22 and the core portion 23 and the core portion 24 are improved, and high magnetic permeability is obtained. Therefore, the inductance of the inductor can be increased while suppressing the eddy current of the inductor core. When the average major axis diameter of the magnetic metal particles exceeds 120 nm, it is believed that the multi-magnetic region of the magnetic metal particles causes the loss of magnetic wall resonance to increase, and the eddy current loss of the inductor core increases.

From the same viewpoint, the average major axis diameter of the magnetic metal particles is more preferably 100 nm or less, and still more preferably 80 nm or less. In this embodiment, the average major axis diameter of the magnetic metal particles may be 30 nm or more. From the same viewpoint, the average major axis diameter of the magnetic metal particles is preferably 40 nm or more. In addition, the average minor axis diameter of the magnetic metal particles 4 may be, for example, about 5-50 nm, and may be 7-30 nm.

The average aspect ratio of the magnetic metal particles is preferably 1.2-6. In the present embodiment, the average aspect ratio is the average value of the ratio (aspect ratio) of the major axis diameter to the minor axis diameter of the magnetic metal particles. When the average aspect ratio is less than 1.2, the shape anisotropy becomes too small and the natural resonance frequency becomes quite small, which may cause the loss in the inductor core due to natural resonance to increase. In addition, when the aspect ratio exceeds 6, the shape anisotropy becomes too large and the density decreases due to the deterioration of the filling property, which may also cause the permeability to decrease, making it difficult to increase the inductance of the inductor.

From the same viewpoint, the average aspect ratio of the magnetic metal particles is preferably 1.3 or more and 4 or less, and more preferably 1.5 or more and 3 or less. Furthermore, the aspect ratio is preferably 2 or more.

In this embodiment, the CV value of the aspect ratio of the magnetic metal particles may be 0.4 or less. CV represents the coefficient of variation and can be obtained from the following formula. Coefficient of Variation (CV) = standard deviation value/average value

Since the CV value of the aspect ratio of the magnetic metal particles is 0.4 or less, the deviation of the diamagnetic field coefficient can be suppressed. Since the natural resonance frequency is proportional to the difference (short axis-long axis) of the diamagnetic field coefficient, as a result, the deviation of the natural resonance frequency can be suppressed, and the line width of the natural resonance peak can be narrowed. Therefore, the loss in the inductor core caused by natural resonance can be reduced, and the inductance of the inductor can be increased. The insertion loss of the LC composite part before the cutoff frequency can be reduced, and the insertion loss when the cutoff frequency is exceeded can be increased. From the same viewpoint, the CV value of the aspect ratio of the magnetic metal particles is preferably 0.3 or less. The CV value of the aspect ratio of the magnetic metal particles can be 0.10 or more.

The magnetic metal particles preferably include at least one selected from the group consisting of Fe, Co, and Ni as a main component, and more preferably include at least one selected from the group consisting of Fe and Co as a main component. In this specification, the main ingredient refers to an ingredient that occupies more than 50% by mass. Since the magnetic metal particles contain at least one selected from the group consisting of Fe, Co, and Ni having high saturation magnetization as a main component, the magnetic layer 22 and the cores 23 and 24 can have high magnetic permeability. The magnetic metal particles preferably contain Fe, Fe and Co or Fe and Ni as main components, more preferably contain Fe or Fe and Co as main components, and particularly preferably contain Fe and Co as main components. Since the magnetic metal particles contain Fe, Fe and Co or Fe and Ni which have high saturation magnetization as main components, the magnetic layer 22 and the cores 23 and 24 can have high magnetic permeability. The magnetic layer 22 and the cores 23 and 24 may contain different magnetic metal particles or the same magnetic metal particles. The main component refers to the component with the largest weight ratio. With this composition, the natural resonance frequency can also be increased.

The magnetic metal particles may have a metal center and a metal oxide film covering the metal center. The metal center has conductivity, but the oxide metal film has insulation. Since the magnetic metal particles have a metal oxide film, the insulation between the magnetic metal particles can be obtained, and the magnetic loss caused by the eddy current between the particles can be reduced.

In the magnetic metal particles, the metal center part contains the above-mentioned elements contained in the magnetic metal particles as a metal (zero valence). Since the center of the metal is covered with an oxide metal film, it can exist without being oxidized even in the atmosphere. The metal center is preferably Fe, Fe-Ni alloy or Fe-Co alloy, more preferably Fe or Fe-Co alloy, and even more preferably Fe-Co alloy. When the metal center is Fe, Fe-Ni alloy, or Fe-Co alloy, the saturation magnetization of the magnetic metal particles increases, resulting in high magnetic permeability. In the magnetic metal particles, the metal oxide film contains the elements contained in the magnetic metal particles as oxides.

In this embodiment, the volume ratio of the magnetic metal particles in the magnetic layer 22 and the cores 23 and 24 can be, for example, 30-60% by volume, and preferably 40-50% by volume. When the volume ratio of the magnetic metal particles is 30% by volume or more, it is easy to obtain desired magnetic properties in the magnetic layer 22 and the cores 23 and 24. When the proportion of the magnetic metal particles is less than 60% by volume, handling during processing becomes easy. Furthermore, in this specification, the volume ratio of the magnetic layer 22 and the cores 23 and 24 is the ratio of the magnetic layer 22 and the cores 23 and 24 excluding the voids.

The resin is an electrically insulating resin (insulating resin), and it is present between the magnetic metal particles in the magnetic layer 22 and the cores 23 and 24 and combined with them, which can further improve the insulation between the magnetic metal particles的材料。 The material. Examples of insulating resins include silicone resins, phenol resins, acrylic resins, epoxy resins, and cured products thereof. These may be used individually by 1 type, and may be used in combination of 2 or more types. Furthermore, if necessary, additives such as surface treatment agents such as coupling agents and dispersants, heat stabilizers, and plasticizers, etc. may be used.

In this embodiment, the volume ratio of the resin in the magnetic layer 22 and the cores 23 and 24 may be, for example, 40 to 70% by volume, and preferably 50 to 60% by volume. When the volume ratio of the resin is more than 40% by volume, it becomes easy to obtain insulation and bonding force between the magnetic metal particles. When the volume ratio of the resin is 70% by volume or less, the characteristics based on the magnetic metal particles can be easily utilized in the magnetic layer 22 and the cores 23 and 24.

The saturation magnetization of the magnetic layer 22 and the cores 23 and 24 is not particularly limited, and may be 90 emu/g or more, for example. When the saturation magnetization is 90 emu/g or more, the permeability of the magnetic layer 22 and the cores 23 and 24 can be improved. In addition, it is possible to increase the frequency of the natural resonance frequency. From the same viewpoint, the saturation magnetization is preferably 100 emu/g or more, and more preferably 110 emu/g or more. The saturation magnetization can be less than 200 emu/g.

3A to 3C and FIGS. 4A to 4C, the detailed configuration of the dielectric laminate 37, the capacitors 13 to 16, and the inductors 11, 12, and 17 will be described. In this embodiment, the dielectric laminate 37 of the LC composite component 1 includes six dielectric layers 31, 32, 33, 34, 35, and 36. The dielectric layers 31 to 36 are arranged between the non-magnetic substrate 21 and the magnetic layer 22, and are arranged in order from the first surface 21 a side of the non-magnetic substrate 21. The dielectric layers 31 to 36 respectively have a first surface facing the same direction as the first surface 21a of the nonmagnetic substrate 21 and a second surface facing the same direction as the second surface 21b of the nonmagnetic substrate 21. In addition, in FIGS. 3A to 3C and FIGS. 4A to 4C, the core portions 23 and 24 are omitted.

FIG. 3A shows the first side of the dielectric layer 31. On the first surface of the dielectric layer 31, a conductor portion 311 for the inductor 11 and a conductor portion 312 for the inductor 12, a conductor portion 313 for the capacitors 13, 14 and a conductor portion 315 for the capacitor 15 and a capacitor 16 are formed The conductor part 316 for use, and the conductor parts 31T1, 31T2, 31T3, and 31T4 for terminals. In addition, FIG. 3A shows a state of the plurality of conductor portions as seen from the second surface side of the dielectric layer 31. The arrangement of the above-mentioned plural conductor parts in Fig. 3A is as follows. The conductor portion 311 for the inductor 11 is arranged in an area on the left side of the center in the left-right direction. The conductor portion 312 for the inductor 12 is arranged in an area on the right side of the center in the left-right direction. The conductor part 316 for the capacitor 16 is arranged between the conductor part 311 for the inductor 11 and the conductor part 312 for the inductor 12. The conductor portions 313 for the capacitors 13 and 14 are arranged below the conductor portion 311 for the inductor 11, the conductor portion 312 for the inductor 12, and the conductor portion 316 for the capacitor 16. The conductor portion 315 for the capacitor 15 is arranged at a position below the conductor portion 313 for the capacitors 13 and 14. The terminal conductor portion 31T1 is arranged near the lower left corner. The terminal conductor part 31T2 is arranged near the lower right corner part. The terminal conductor portion 31T3 is arranged near the upper left corner. The terminal conductor portion 31T4 is arranged near the upper right corner.

The conductor portion 313 for the capacitors 13 and 14 is connected to each end of the conductor portion 311 for the inductor 11, the conductor portion 312 for the inductor 12, and the conductor portion 316 for the capacitor 16. In FIG. 3A, the boundary between the two conductor parts is indicated by a broken line. The same figure as FIG. 3A used in the following description is also represented by the same representation method as FIG. 3A. The conductor portion 311 for the inductor 11 and the conductor portion 312 for the inductor 12 are both linear conductor portions extending annularly from one end to the other end.

FIG. 3B shows the first side of the dielectric layer 32. On the first surface of the dielectric layer 32, the conductor portion 323 for the capacitor 13, the conductor portion 324 for the capacitor 14, the conductor portions 325A and 325B for the capacitor 15, and the conductor portion 326 for the capacitor 16 are formed. In addition, FIG. 3B shows a state of the plurality of conductor portions as viewed from the second surface side of the dielectric layer 32. The arrangement of the above-mentioned plural conductor parts in Fig. 3B is as follows. That is, the conductor 326 for the capacitor 16 is arranged at a substantially center position in the left-right direction. The conductor portion 323 for the capacitor 13 and the conductor portion 324 for the capacitor 14 are arranged in order from the left side at a position below the conductor portion 326 for the capacitor 16. The conductor portions 325A and 325B for the capacitor 15 are arranged at positions below the conductor portion 323 for the capacitor 13 and the conductor portion 324 for the capacitor 14 in order from the left.

The conductor portion 323 for the capacitor 13 and the conductor portion 324 for the capacitor 14 are opposed to the conductor portion 313 for the capacitors 13 and 14 shown in FIG. 3A through the dielectric layer 32. The capacitor 13 in FIG. 5 is composed of a conductor portion 313 for the capacitors 13, 14 and a conductor portion 323 for the capacitor 13, and a part of the dielectric layer 32 between them. The capacitor 14 in FIG. 5 is composed of a conductor portion 313 for the capacitors 13, 14 and a conductor portion 324 for the capacitor 14, and a part of the dielectric layer 32 between them. In addition, the conductor portions 325A and 325B for the capacitor 15 are opposed to the dielectric layer 32 of the capacitor 15 shown in FIG. 3A. The capacitor 15 in FIG. 5 is composed of the conductor portions 315, 325A, and 325B for the capacitor 15 and a part of the dielectric layer 32 between them. In addition, the conductor portion 326 for the capacitor 16 intersects the dielectric layer 32 and faces the conductor portion 316 for the capacitor 16 shown in FIG. 3A. The capacitor 16 in FIG. 5 is composed of the conductor portions 316 and 326 for the capacitor 16, and a part of the dielectric layer 32 between them.

The LC composite component 1 includes conductor portions 33V1, 33V2, 33V3, 33V4, 33V5, and 33V6 penetrating through the dielectric layers 32 and 33. In Fig. 3B, the conductor portions 33V1 to 33V6 are hatched. The conductor portions 31T1 to 31T4 for the terminals, the conductor portion 311 for the inductor 11, and the conductor portion 312 for the inductor 12 shown in FIG. 3A are respectively connected to one end of the conductor portions 33V1 to 33V6.

FIG. 3C shows the first side of the dielectric layer 33. On the first surface of the dielectric layer 33, a conductor portion 331 for the inductor 11, a conductor portion 332 for the inductor 12, a conductor portion 337 for the inductor 17, and conductor portions 333, 334, 335A, and 335B for connection are formed And 336, and terminal conductor portions 33T1, 33T2, 33T3, and 33T4. FIG. 3C shows a state of the plurality of conductor portions as viewed from the second surface side of the dielectric layer 33. FIG. The arrangement of the plurality of conductor parts in Fig. 3C is as follows. The conductor portion 331 for the inductor 11 is arranged in an area on the left side of the center in the left-right direction. The connecting conductor portion 336 is arranged between the conductor portion 331 for the inductor 11 and the conductor portion 332 for the inductor 12. The connection conductor portions 333 and 334 are arranged in order from the left side at positions below the conductor portion 331 for the inductor 11, the conductor portion 332 for the inductor 12, and the connection conductor portion 336. The connection conductor portions 335A and 335B are arranged in order from the left side at positions below the connection conductor portions 333 and 334. The conductor part 337 for the inductor 17 is arranged at a position above the conductor part 331 for the inductor 11, the conductor part 332 for the inductor 12, and the conductor part 336 for connection. The terminal conductor 33T1 is arranged near the lower left corner. The terminal conductor 33T2 is arranged near the lower right corner. The terminal conductor portion 33T3 is arranged near the movable portion on the upper left. The terminal conductor 33T4 is arranged near the upper right corner.

The terminal conductor portion 33T1 is connected to each end of the connection conductor portions 333 and 335A. The terminal conductor part 33T2 is connected to each end of the connection conductor parts 334 and 335B. The conductor portion 337 for the inductor 17 is connected to one end of the connecting conductor portion 336. The conductor portion 331 for the inductor 11 and the conductor portion 332 for the inductor 12 are both linear conductor portions extending annularly from one end to multiple ends.

The conductor portion 331 for the inductor 11, the conductor portion 332 for the inductor 12, and the conductor portions 33T1 to 33T4 for the terminals shall be viewed from the direction perpendicular to the first surface 21a of the non-magnetic substrate 21 (and perpendicular to the dielectric layer 33). When viewed in the same direction on the first surface, it is arranged at a position overlapping with the conductor portion 311 for the inductor 11, the conductor portion 312 for the inductor 12, and the conductor portions 31T1 to 31T4 for terminals shown in FIG. 3A. The connecting conductor portions 333, 334, 335A, 335B, and 336 are respectively arranged in the same as the conductor portions 323, 323 and 336 for the capacitor 13 shown in FIG. 3B when viewed from a direction perpendicular to the first surface 21a of the non-magnetic substrate 21. The position where the conductor part 324 for the capacitor 14, the conductor parts 325A and 325B for the capacitor 15 and the conductor part 326 for the capacitor 16 overlap.

The LC composite component 1 includes conductor portions 33V7, 33V8, 33V9, 33V10, and 33V11 penetrating through the dielectric layer 33. In FIG. 3C, the conductor portions 33V1 to 33V11 are represented by two-dot chain lines. The other ends of the conductor portions 33V1 to 33V6 are connected to the conductor portions 33T1 to 33T4 for terminals, the conductor portion 331 for the inductor 11, and the conductor portion 332 for the inductor 11, respectively. The conductor portion 323 for the capacitor 13, the conductor portion 324 for the capacitor 14, the conductor portions 325A and 325B for the capacitor 15 and the conductor portion 326 for the capacitor 16 shown in FIG. 3B are respectively connected to the conductor portions 33V7 to 33V11 One end. The other ends of the conductor portions 33V7 to 33V11 are connected to the connection conductor portions 333, 334, 335A, 335B, and 336, respectively.

FIG. 4A shows the first side of the dielectric layer 34. On the first surface of the dielectric layer 34, there are formed a conductor portion 341 for the inductor 11, a conductor portion 342 for the inductor 12, a conductor portion 347 for the inductor 17, and conductor portions 34T1, 34T2, 34T3 and 34T4. FIG. 4A shows the state of the plurality of conductor portions as viewed from the second surface side of the dielectric layer 34. FIG. The arrangement of the plurality of conductor parts in FIG. 4A is as follows. The conductor portion 341 for the inductor 11 is arranged in an area on the left side of the center in the left-right direction. The conductor portion 342 for the inductor 12 is arranged in an area on the right side of the center in the left-right direction. The conductor portion 347 for the inductor 17 is arranged at a position above the conductor portion 341 for the inductor 11 and the conductor portion 342 for the inductor 12. The terminal conductor portion 34T1 is arranged near the lower left corner. The terminal conductor 34T2 is arranged near the lower right corner. The terminal conductor part 34T3 is arranged near the upper left corner part. The terminal conductor part 34T4 is arranged near the upper right corner part.

The conductor portion 341 for the inductor 11 and the conductor portion 342 for the inductor 12 are both linear conductor portions extending annularly from one end to the other end. The conductor portion 341 for the inductor 11, the conductor portion 342 for the inductor 12, the conductor portion 347 for the inductor 17, and the terminal conductor portions 34T1 to 34T4 are respectively from a direction perpendicular to the first surface 21a of the non-magnetic substrate 21 (The same as the direction perpendicular to the first surface of the dielectric layer 34) When viewed, it is arranged in the conductor portion 331 for the inductor 11, the conductor portion 332 for the inductor 12, and the inductor 17 shown in FIG. 3C The position where the conductor part 337 and the terminal conductor parts 33T1 to 33T4 overlap.

The LC composite component 1 includes conductor portions 34V1, 34V2, 34V3, 34V4, 34V5, 34V6, and 34V7 penetrating through the dielectric layer 34. In FIG. 4A, the conductor portions 34V1 to 34V7 are represented by two-dot chain lines. In the terminal conductor portions 33T1 to 33T4 shown in FIG. 3C, the conductor portion 331 for the inductor 11, the conductor portion 332 for the inductor 12, and the conductor portion 337 for the inductor 17 are respectively connected to the conductor portions 34V1 to 34V7 One end. The other ends of the conductor portions 34V1 to 34V7 are connected to the terminal conductor portions 34T1 to 34T4, the conductor portion 341 for the inductor 11, the conductor portion 342 for the inductor 12, and the conductor portion 347 for the inductor 17, respectively.

FIG. 4B shows the first side of the dielectric layer 35. On the first surface of the dielectric layer 35, a conductor portion 351 for the inductor 11, a conductor portion 352 for the inductor 12, conductor portions 357A and 357B for the inductor 17, and conductor portions 35T1, 35T2 for terminals are formed 35T3 and 35T4. Furthermore, FIG. 4B shows a state of the plurality of conductor portions as seen from the second surface side of the dielectric layer 35. The arrangement of the above-mentioned plural conductor parts in Fig. 4B is as follows. The conductor portion 351 for the inductor 11 is arranged in an area on the left side of the center in the left-right direction. The conductor portion 352 for the inductor 12 is arranged in an area on the right side of the center in the left-right direction. The conductor portions 357A and 357B for the inductor 17 are arranged at positions above the conductor portion 351 for the inductor 11 and the conductor portion 352 for the inductor 12 in order from the left side. The terminal conductor 35T1 is arranged near the lower left corner. The terminal conductor 35T2 is arranged near the lower right corner. The terminal conductor 35T3 is arranged near the upper left corner. The terminal conductor 35T4 is arranged near the upper right corner.

The terminal conductor portions 35T1 to 35T4 are respectively connected to one ends of the conductor portion 351 for the inductor 11, the conductor portion 352 for the inductor 12, and the conductor portions 357A and 357B for the inductor 17. The conductor portion 351 for the inductor 11 and the conductor portion 352 for the inductor 12 are both linear conductor portions extending annularly from one end to the other end.

The conductor portion 351 for the inductor 11, the conductor portion 352 for the inductor 12, and the conductor portions 35T1 to 35T4 for the terminals shall be viewed from the direction perpendicular to the first surface 21a of the non-magnetic substrate 21 (and perpendicular to the dielectric layer 35). When viewed in the same direction on the first surface, it is arranged at a position overlapping the conductor part 341 for the inductor 11, the conductor part 342 for the inductor 12, and the terminal conductor parts 34T1 to 34T4 shown in FIG. 4A. When viewed from a direction perpendicular to the first surface 21a of the non-magnetic substrate 21, the conductor portions 357A and 357B for the inductor 17 are arranged at positions overlapping the conductor portion 347 for the inductor 17 shown in FIG. 4A.

The LC composite component 1 includes conductor portions 35V1, 35V2, 35V3, 35V4, 35V5, 35V6, 35V7, and 35V8 penetrating through the dielectric layer 35. In FIG. 4B, the conductor portions 35V1 to 35V8 are represented by two-dot chain lines. The conductor portions 34T1 to 34T4 for the terminals, the conductor portion 341 for the inductor 11 and the conductor portion 342 for the inductor 12 shown in FIG. 4A are connected to one end of the conductor portions 35V1 to 35V6, respectively. The conductor portion 347 for the inductor 17 shown in FIG. 4A is connected to each end of the conductor portions 35V7 and 35V8. The other ends of the conductor portions 35V1 to 35V8 are connected to the conductor portions 35T1 to 35T4 for terminals and the conductor portions 351, 352, 357A, and 357B for inductors, respectively.

4C shows the conductor portions 41, 42, 43, and 44 for terminals penetrating through the magnetic layer 22 and the dielectric layer 36, and the magnetic layer 22 and the dielectric layer 36. The LC composite component 1 includes conductor portions 41, 42, 43, and 44 for terminals penetrating through the magnetic layer 22 and the dielectric layer 36. In FIG. 4C, the terminal conductor parts 41 to 44 are hatched. Terminal conductor parts 35T1 to 35T4 shown in FIG. 4B are connected to one end of terminal conductor parts 41 to 44, respectively.

Next, referring to the circuit diagram of FIG. 5, the circuit configuration of the LC composite component 1 of this embodiment will be described. In this embodiment, the LC composite component 1 has the function of a low-pass filter. As shown in FIG. 5, the LC composite component 1 includes an input terminal 2 for input signals, an output terminal 3 for output signals, three inductors 11, 12, and 17, and four capacitors 13, 14, 15, and 16.

One end of the inductor 11, one end of the capacitor 13 and one end of the capacitor 15 are electrically connected to the input terminal 2. One end of the inductor 12, one end of the capacitor 14 and one end of the capacitor 16 are electrically connected to the other end of the inductor 11 and the other end of the capacitor 13. The other end of the inductor 12, the other end of the capacitor 14 and the other end of the capacitor 15 are electrically connected to the output terminal 3. One end of the inductor 17 is electrically connected to the other end of the capacitor 16. The other end of the inductor 17 is grounded.

Hereinafter, the relationship between the specific configuration of the LC composite part 1 shown in FIGS. 1, 2 and 3A to 3C and FIGS. 4A to 4C and the circuit configuration shown in FIG. 5 will be further described. The input terminal 2 in FIG. 5 is constituted by the other end of the terminal conductor 41 in FIG. 4C. The output terminal 3 in FIG. 5 is constituted by the other end of the terminal conductor 42 in FIG. 4C. The other ends of the conductor portions 43 and 44 for terminals in FIG. 4C constitute the grounding terminal in FIG. 5.

The inductor 11 in FIG. 5 is composed of conductor parts 311, 331, 341, and 351, and conductor parts 33V5, 34V5, and 35V5 for the inductor 11 in FIGS. 3A to 3C and FIGS. 4A to 4C, and has a coil structure. As shown in FIG. 2, the core 23 penetrates through the dielectric layers 32 to 36 and is located at the inner periphery of the coil structure formed by the conductor portions 311, 331, 341, and 351 for the inductor 11 and the conductor portions 33V5, 34V5, and 35V5的内。 The inside. The conductor parts 311, 331, 341 and 351 for the inductor 11 are all linear conductor parts extending along the outer circumference of the core part 23.

The inductor 12 in FIG. 5 is composed of conductor parts 312, 332, 342, and 352, and conductor parts 33V6, 34V6, and 35V6 for the inductor 12 in FIGS. 3A to 3C and FIGS. 4A to 4C, and has a coil structure. As shown in FIG. 2, the core 24 penetrates through the dielectric layers 32 to 36 and is located at the inner periphery of the coil structure formed by the conductor parts 312, 332, 342, and 352 for the inductor 12, and the conductor parts 33V6, 34V6, and 35V6的内。 The inside. The conductor portions 312, 332, 342, and 352 used for the inductor 12 are all linear conductor portions extending along the outer circumference of the core portion 24.

The inductor 17 in FIG. 5 is composed of conductor portions 337, 347, 357A, and 357B, and conductor portions 34V7, 35V7, and 35V8 for the inductor 17 in FIGS. 3A to 3C and FIGS. 4A to 4C, and has a coil structure.

(Effect) According to the LC composite component of this embodiment, the insertion loss of low-frequency signals that do not reach the cutoff frequency can be reduced, and the insertion loss of high-frequency signals that exceed the cutoff frequency can be improved. Therefore, it has excellent characteristics as a low-pass filter. In particular, it is suitable for low-pass filters with a cutoff frequency of 1.1 to 1.6 GHz. The cut-off frequency can be defined as the -3dB point. In addition to being used as a low-pass filter, this LC composite part can also be used as a high-pass filter, band-pass filter, etc.

(An example of manufacturing method) Next, referring to Fig. 1, a method of manufacturing the LC composite component 1 of this embodiment will be described. In the LC composite component 1 of the present embodiment, a plurality of constituent elements of the LC composite component 1 other than the nonmagnetic substrate 21 are formed on a wafer including a portion that becomes the non-magnetic substrate 21 of the plurality of LC composite components 1. Thereby, a basic structure in which the part body 20 of the LC composite part 1 is arranged in a plurality of rows is produced. And, by cutting the basic structure, a plurality of component bodies 20 are separated from each other. In this way, a plurality of LC composite parts 1 are manufactured.

Hereinafter, referring to FIGS. 2, 3A to 3C and FIGS. 4A to 4C, focusing on one LC composite component 1, the manufacturing method of the LC composite component 1 of this embodiment will be described in more detail. Furthermore, in the following description, for convenience, the part that becomes the non-magnetic substrate 21 in the wafer is referred to as the non-magnetic substrate 21. In the manufacturing method of this embodiment, first, a plurality of dielectric layers and a plurality of conductor portions are formed on the non-magnetic substrate 21 using a thin film forming technique. Specifically, first, the dielectric layer 31 is formed on the first surface 21 a of the non-magnetic substrate 21. Next, a plurality of conductor portions 31T1 to 31T4, 311 to 316 shown in FIG. 3A are formed on the dielectric layer 31. The method of forming a plurality of conductor parts can be a method of patterning the conductor layer by etching using a mask after the unpatterned conductor layer is formed, or a method of using a mask to form a patterned conductor layer method. As a method of forming the conductor layer, various thin film forming methods such as sputtering and plating can be used. The method of forming other plural conductor parts described below is also the same.

Next, the dielectric layer 32 is formed on the dielectric layer 31 and the conductor portions 31T1 to 31T4, 311 to 316 by, for example, sputtering. Next, on the dielectric layer 32, the conductor portions 323, 324, 325A, 325B, and 326 for the capacitor shown in FIG. 3B are formed. Next, the dielectric layer 33 is formed. Next, 6 holes for the conductor portions 33V1 to 33V6 are formed in the dielectric layers 32 and 33, and 5 holes for the conductor portions 33V7 to 33V11 are formed in the dielectric layer 33. Next, a plurality of conductor portions 33V1 to 33V6, 331, 332, 337, 333, 334, 335A, 335B, 336, 33T1, 33T2, 33T3, and 33T4 shown in FIGS. 3B and C are formed.

Next, a dielectric layer 34 is formed on the dielectric layer 33 and the conductor portion. Next, 7 holes for the conductor portions 34V1 to 34V7 are formed in the dielectric layer 34. Next, a plurality of conductor portions 341, 342, 347, 34T1, 34T2, 34T3, and 34T4 shown in FIG. 4A are formed. Next, a dielectric layer 35 is formed on the dielectric layer 34. Next, 8 holes for the conductor portions 35V1 to 35V8 are formed in the dielectric layer 35. Next, a plurality of conductor portions 351, 352, 357A, 357B, 35T1, 35T2, 35T3, and 35T4 shown in FIG. 4B are formed. Next, a dielectric layer 36 is formed on the dielectric layer 35 and the conductor portion.

Next, four holes for the terminal conductor portions 41 to 44 are formed in the dielectric layer 36. Next, the terminal conductor portions 41 to 44 shown in FIG. 4C are formed by, for example, a plating method.

Next, two holes for the cores 23 and 24 are formed in the dielectric layers 32 to 36. Next, by filling the above-mentioned two holes and covering the terminal conductor portions 41 to 44, a preliminary magnetic layer that becomes the magnetic layer 22, the core portions 23 and 24 is formed. Next, the preliminary magnetic layer is polished until the terminal conductor portions 41 to 44 are exposed. Thereby, in the preliminary magnetic layer, the portions remaining in the two holes for the core portions 23 and 24 become the core portions 23 and 24, and the remaining portion becomes the magnetic layer 22. By forming the magnetic layer 22, the cores 23 and 24, the basic structure is completed. Next, the basic structure is cut by cutting out a plurality of component bodies 20. Furthermore, in order to form the cores 23 and 24 and the magnetic layer (preparatory magnetic layer) 22, it is only necessary to apply and cure a curable composition containing the above-mentioned magnetic metal particles and resin.

The present invention is not limited to the above-mentioned embodiment, and various modifications can be adopted. For example, the number of capacitors, inductors, and cores in the LC composite part may be one or more. In addition, the shapes of capacitors, inductors, and cores can also be appropriately changed according to applications. In addition, the arrangement of inductors and capacitors can also be changed arbitrarily. For example, when viewed from a direction perpendicular to the first surface 21a, the capacitor may overlap with other inductors.

In addition, when the thickness of the magnetic layer is not uniform, the average thickness may be used as the thickness of the magnetic layer. When the thickness of the core is not uniform, the average thickness may be used as the thickness of the core. When the LC composite part has a plurality of cores, the thickness of at least one core and the thickness of the magnetic layer may satisfy the above relationship.

In addition, the manufacturing method of the LC composite component 1 of this embodiment is not limited to the above-mentioned method. For example, in the LC composite component 1, at least the plurality of dielectric layers and the plurality of conductor portions between the non-magnetic substrate 21 and the magnetic layer 22 can be formed by, for example, a low-temperature simultaneous firing method. Example

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to the following examples.

(Example 1) The curable resin composition used to form the magnetic layer and the core was adjusted by the method shown below. That is, an aqueous solution of ferrous sulfate and cobalt sulfate is formulated such that the mass ratio of Fe and Co in the magnetic metal particles is 7:3, and a part of them is neutralized with an alkaline aqueous solution. The neutralized aqueous solution was bubbled and ventilated, and the aqueous solution was stirred, thereby obtaining needle-shaped goethite particles containing Co. The Co-containing goethite particles obtained by filtering the aqueous solution were washed with ion-exchanged water and dried, and then heated in the air, thereby obtaining Co-containing hematite particles.

The obtained Co-containing hematite particles are heated at a temperature of 550°C in a furnace in a hydrogen atmosphere. After that, the gas in the furnace was switched to argon and cooled to about 200°C. Furthermore, it took 24 hours to increase the oxygen partial pressure to 21% and cool to room temperature to obtain magnetic metal particles with a metal core and a metal oxide film and containing Fe and Co as the main components.

In the obtained magnetic metal particles, epoxy resin and curing agent are added in such a way that the volume ratio of the magnetic metal particles in the cured resin composition is 40% by volume, and the mixture is kneaded at room temperature using a mixing roller. The resin composition was made into a slurry form, and a curable resin composition for forming the magnetic layer and core was obtained. Next, using a known thin film forming method, the LC composite part 1 shown in FIGS. 1 to 5 was produced. Here, non-magnetic ferrite is used as the material of the non-magnetic substrate 21, the cured product of the above-mentioned resin composition is used as the material of the magnetic layer 22 and the cores 23, 24, and Cu is used as the inductor 11, 12 , 17 and capacitors 13-16 conductive materials, polyimide resin is used as the material of the dielectric layers 31 and 33-36, and silicon nitride is used as the material of the dielectric layer 32. The thickness of the core is 100 μm, the thickness of the magnetic layer is 50 μm, and the size of the LC composite part viewed from the thickness direction is 650 μm×500 μm. The cut-off frequency of LC composite parts is set to 1.2 GHz.

(Examples 2～5) Except that the thickness of the core and the thickness of the magnetic layer were changed as shown in Table 1, the LC composite parts of Examples 2 to 5 were produced in the same manner as in Example 1. Furthermore, in the second embodiment, corresponding to reducing the thickness of the core, the number of turns of the coil structure of the inductors 11 and 12 is maintained, and the conductor portions 33V5, 34V5, and 35V5, and the conductor portions 33V6, 34V6, and 35V6 are shortened The length reduces the axial length of the coil structure. In addition, in Embodiments 4 and 5, corresponding to increasing the thickness of the core, the number of turns of the coil structure of the inductors 11 and 12 is maintained, and the conductor portions 33V5, 34V5, and 35V5, and the conductor portions 33V6, 34V6, and The length of 35V6 increases the axial length of the coil structure. In any embodiment, the thickness of the cores 23 and 24 is set to be greater than the axial length of the coil structure of the inductors 11 and 12.

(Example 6) In addition to the neutralization process, the neutralization rate based on the alkaline aqueous solution was reduced, and the metal (Fe and Co) ion concentration after neutralization during the oxidation process was reduced. The magnetic metal particles were changed as shown in Table 1. Except for the average major axis diameter, aspect ratio value, and CV value, the rest was the same as in Example 1, and the LC composite part of Example 6 was obtained.

(Example 7) In addition to the neutralization process, the neutralization rate based on the alkaline aqueous solution was increased, and the metal (Fe and Co) ion concentration after the neutralization during the oxidation process was increased. The magnetic metal particles were changed as shown in Table 1. Except for the average major axis diameter, aspect ratio value, and CV value, the rest was the same as in Example 1, and the LC composite part of Example 7 was obtained.

(Example 8) In addition to the neutralization process, the neutralization rate based on the alkaline aqueous solution was increased, and the metal (Fe and Co) ion concentration after neutralization during the oxidation process was increased. The magnetic metal particles were changed as shown in Table 1. Except for the average major axis diameter, aspect ratio value, and CV value, the rest was the same as in Example 1, and the LC composite part of Example 8 was obtained.

(Example 9, 10) Except that the curable resin composition was prepared so that the volume ratio of the magnetic metal particles in the cured resin composition was 30% by volume and 50% by volume, respectively, in the same manner as in Example 1, Example 9 was obtained. , 10 LC composite parts.

(Example 11) The LC composite part of Example 11 was obtained in the same manner as Example 1, except that Co was not added in the manufacture of the magnetic metal particles.

(Example 12) Except that Ni was added to replace Co in the manufacture of magnetic metal particles, and the curable resin composition was prepared with the volume ratio of the magnetic metal particles in the cured resin composition being 50% by volume, the rest is the same as the examples 1 Similarly, the LC composite part of Example 12 was obtained.

(Comparative example 1) The LC composite part of Comparative Example 1 was obtained in the same manner as in Example 1, except that the thickness of the core was 30 μm. Furthermore, corresponding to the reduction of the thickness of the core, the number of turns of the coil structure of the inductors 11 and 12 is maintained, and the lengths of the conductor portions 33V5, 34V5, and 35V5, and the conductor portions 33V6, 34V6, and 35V6 are reduced, thereby reducing the coil The axial length of the structure. That is, the thickness of the cores 23 and 24 is greater than the axial length of the coil structure of the inductors 11 and 12.

[Evaluation method of magnetic metal particles] (Size and aspect ratio of magnetic metal) Observe the magnetic metal particles in the cross section of the magnetic layer of the LC composite parts obtained in each of the Examples and Comparative Examples with a transmission electron microscope (TEM) at a magnification of 500,000 times, and measure the long axis and short axis directions of the magnetic metal particles Dimensions (major axis diameter and minor axis diameter) (nm), and the aspect ratio was obtained. Similarly, 200 to 500 magnetic metal particles were observed, and the average values of the major axis diameter, minor axis diameter, and aspect ratio were calculated. The average value of the aspect ratio and the CV value of the magnetic metal particles, and the average value of the major axis diameter of the magnetic metal particles are shown in Table 1.

(Saturation magnetization) The cured product of the resin composition obtained in the Examples and Comparative Examples was processed into 1 mm×1 mm×3 mm, and the composite after processing was measured using a vibration sample magnetometer (VSM, manufactured by Tamagawa Manufacturing Co., Ltd.) The saturation magnetization of the magnetic body (emu/g). The results are shown in Table 1.

(Maximum and minimum insertion loss of LC composite parts) A network analyzer (N5230A, Keysight Technologies) was used to obtain the frequency characteristics of insertion loss in the LC composite parts obtained in each embodiment and comparative example. In addition, the maximum value of insertion loss in 0.824-0.960 GHz and the minimum value of insertion loss in 1.648-1.920 GHz are obtained. The results are shown in Table 1. In addition, characteristic diagrams showing the frequency characteristics of the insertion loss of Example 1, Example 5, and Comparative Example 1 are shown in FIGS. 6 to 8 respectively.

[Table 1] Metal particles The long axis diameter of the metal particles in the cured product (nm) aspect ratio Aspect ratio CV value Metal particle volume ratio (vol%) Cured material saturation magnetization (emu/g) Core thickness T1 (μm) Magnetic layer thickness T2 (μm) T1/T2 Maximum insertion loss (dB) Minimum insertion loss (dB) Example 1 FeCo 48 2.3 0.25 40 121 100 50 2.0 0.50 33.0 Example 2 FeCo 47 2.2 0.25 40 121 50 50 1.0 0.60 31.2 Example 3 FeCo 48 2.2 0.24 40 121 100 83 1.2 0.58 32.4 Example 4 FeCo 50 2.5 0.26 40 121 150 30 5.0 0.47 33.8 Example 5 FeCo 49 2.4 0.24 40 121 150 50 3.0 0.45 34.2 Example 6 FeCo 35 1.3 0.21 40 125 100 50 2.0 0.53 30.3 Example 7 FeCo 118 5.9 0.35 40 114 100 50 2.0 0.54 30.7 Example 8 FeCo 58 4.8 0.45 40 118 100 50 2.0 0.55 29.8 Example 9 FeCo 46 2.3 0.26 30 116 100 50 2.0 0.53 31.6 Example 10 FeCo 49 2.6 0.25 50 140 100 50 2.0 0.50 31.8 Example 11 Fe 36 1.5 0.20 40 102 100 50 2.0 0.56 30.9 Example 12 FeNi 37 1.4 0.22 50 91 100 50 2.0 0.56 30.6 Comparative example 1 FeCo 49 2.4 0.26 40 121 30 50 0.6 0.78 27.0 According to the results of Examples 1 to 5 and Comparative Example 1, when T1/T2 is 1.0 or more (Examples 1 to 5), compared with the case where T1/T2 is less than 1.0 (Comparative Example 1), insert The loss characteristics are further improved.

1: LC composite parts 1b: bottom surface 1s: side 1t: upper surface 2: Input terminal 3: output terminal 11: Inductor 12: Inductor 13: capacitor 14: capacitor 15: capacitor 16: capacitor 17: Inductor 20: Part body 21: Non-magnetic substrate 21a: side 1 21b: Side 2 22: Magnetic layer 22a: side 1 22b: Side 2 23: Core 24: core 31: Dielectric layer 31T1~31T4: Conductor part for terminal 32: Dielectric layer 33: Dielectric layer 33T1~33T4: Conductor part for terminal 33V1~33V11: Conductor part 34: Dielectric layer 34T1~34T4: Conductor part for terminal 34V1~34V7: Conductor part 35: Dielectric layer 35T1~35T4: Conductor part for terminal 35V1~35V8: Conductor part 36: Dielectric layer 37: Dielectric laminate 41~44: Conductor part for terminal 311: Conductor part for inductor 312: Conductor part for inductor 313: Conductor part for capacitor 315: Conductor part for capacitor 316: Conductor part for capacitor 323: Conductor part for capacitor 324: Conductor part for capacitor 325A: Conductor part for capacitor 325B: Conductor part for capacitor 326: Conductor part for capacitor 331: Conductor part for inductor 332: Conductor part for inductors 335A, 335B: connecting conductor 336: Connection conductor part 337: Conductor part for inductors 341: Conductor part for inductor 342: Conductor part for inductor 347: Conductor part for inductor 351: Conductor part for inductor 352: Conductor part for inductor 357A: Conductor part for inductor 357B: Conductor part for inductor T1: thickness T2: thickness

Fig. 1 is a perspective view showing the structure of an LC composite component in one embodiment of the present invention. Fig. 2 is a cross-sectional view showing the structure of an LC composite part according to an embodiment of the present invention. FIG. 3A is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. FIG. 3B is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. FIG. 3C is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. Fig. 4A is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. FIG. 4B is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. Fig. 4C is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. Fig. 5 is a circuit diagram showing the circuit configuration of an LC composite component according to an embodiment of the present invention. 6 is a characteristic diagram showing the frequency characteristics of insertion loss in the LC composite part of the first embodiment. Fig. 7 is a characteristic diagram showing the frequency characteristics of the insertion loss in the LC composite part of the fifth embodiment. Fig. 8 is a characteristic diagram showing the frequency characteristics of the insertion loss in the LC composite part of the first comparative example.

1: LC composite parts

1b: bottom surface

1s: side

1t: upper surface

11, 12, 17: inductor

13~16: capacitor

20: Part body

21: Non-magnetic substrate

21a: side 1

21b: Side 2

22: Magnetic layer

22a: side 1

22b: Side 2

23, 24: Core

37: Dielectric laminate

41, 42, 44: conductor part for terminal

Claims (6)

An LC composite part, have: Non-magnetic substrate, Magnetic layer with magnetism, 1 or more capacitors, 1 or more inductors, and More than one core with magnetism, The non-magnetic substrate has a first surface and a second surface opposite to the first surface, and The magnetic layer is arranged to face the first surface of the non-magnetic substrate, The one or more inductors and the one or more capacitors are arranged between the first surface of the non-magnetic substrate and the magnetic layer, The core is arranged between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer, In the direction perpendicular to the first surface of the non-magnetic substrate, the thickness of the core is 1.0 times or more relative to the thickness of the magnetic layer, The magnetic layer and the core each include magnetic metal particles and resin. Such as the LC composite part of claim 1, where The average major axis diameter of the magnetic metal particles is 120 nm or less. Such as the LC composite parts of claim 1 or 2, where The average aspect ratio of the magnetic metal particles is 1.2-6. Such as the LC composite parts of any one of claims 1 to 3, where The saturation magnetization of the magnetic layer and the core is 90 emu/g or more. Such as the LC composite parts of any one of claims 1 to 4, where The above-mentioned magnetic metal particles contain at least one selected from the group consisting of Fe, Co, and Ni as a main component. Such as the LC composite parts of any one of claims 1 to 5, where The CV value of the aspect ratio of the magnetic metal particles is 0.4 or less.

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