TW202040001A - Pneumatic dual-axle pump structure capable of effectively increasing service life and pressurization quality which is equipped with symmetrical double axles and a special sealing structure for being easily installed horizontally - Google Patents

Abstract

The present invention relates to a pneumatic dual-axle pump structure capable of effectively increasing service life and pressurization quality, wherein a piston cylinder barrel is hollow and a piston reciprocating space is defined inside the piston cylinder barrel so that a piston can reciprocate in the piston reciprocating space. Two ends of the piston cylinder barrel are respectively assembled with a cylinder seat and a plunger cylinder in sequence. Each cylinder seat is provided with a pressurization air inlet and outlet channel and a pressurization air inlet and outlet, respectively. Each pressurization air inlet and outlet can pass through the corresponding pressurization air inlet and outlet channel and communicate with the piston reciprocating space. Each cylinder seat is provided with a through hole along the axial direction. The ends of the two axles are respectively fixed to the axial positions of the two opposite sides of the piston so that each part adjacent to the other end of the two axles becomes a plunger and can be positioned hermetically but reciprocally movable in the reciprocating space of the corresponding plunger cylinder. Two solenoid valves can be opened and closed to switch the pressurization air to enter and exit the piston reciprocating space for driving the piston to perform the reciprocating motion and enabling each plunger to discharge the cleaning liquid in the piston reciprocating space to a pressurization cleaning liquid storage tank. A two-stroke sensor can be installed in the piston cylinder barrel for sensing the precise stroke position of the piston when performing the reciprocating motion so as to switch the corresponding solenoid valves to stably and accurately perform the opening and closing actions thereby enabling the piston and each plunger to perform the reciprocating motion accurately and stably and apply a pressure to the cleaning fluid correctly.

Description

Pneumatic dual-spindle pump structure that can effectively improve service life and pressurized quality

The present invention relates to a pneumatic double-spindle pump structure, in particular to a pneumatic pump that is equipped with a symmetrical double-spindle and a special shaft seal structure design, can be set horizontally, and is extremely easy to install and pipe.

According to the semiconductor industry, the manufacturing method is to manufacture electronic components on silicon semiconductors (its products include: dynamic memory, static memory, micro virtual machine... etc.), each of the electronic components is made of sophisticated and complex It is composed of integrated circuit (Integrated Circuit, referred to as IC), and in the IC production process, it must be applied to wafer oxide layer growth, lithography technology, etching, cleaning, impurity diffusion, ion implantation, film deposition, etc. Precise process technology can jointly complete the entire process and produce the desired electronic components. Generally speaking, the manufacturing process of many electronic components includes as many as two hundred to three hundred steps. In the past two decades, as electronic information products have developed rapidly in the direction of lightness, thinness, miniaturization and multi-functionality, the semiconductor manufacturing process has also moved toward The direction of high-density and automated production is advancing, and the development trend of IC manufacturing technology is generally still moving in the direction of trying to overcome the increase in wafer diameter, the reduction of component line width, the increase of manufacturing steps, and the specialization of process technology in order to provide Under the premise of better product characteristics, the difficulty of the manufacturing process is effectively controlled, thereby greatly improving the product yield rate in the manufacturing process.

Investigation, the semiconductor industry is mainly divided into material (silicon ingot) manufacturing, integrated circuit wafer There are three major categories of manufacturing and integrated circuit assembly. At present, the domestic semiconductor industry mainly focuses on the latter two. As for silicon ingot materials, they still rely on imports from abroad. There are about 11 domestic integrated circuit wafer manufacturers. Among them, Lianhua, TSMC and Winbond each have 2 factories, a total of about 14 factories. However, there are still companies that continue to expand their factories. Their factories are mainly located in the Hsinchu Science Park, with an annual output of more than 4 million. The integrated circuit assembly industry has a total of about 20 factories in Taipei County, Hsinchu County, Taichung County, Kaohsiung City and other regions. In particular, a processing export zone in this region is an early semiconductor industry manufacturer to set up factories in Taiwan. The main base of the time, with an annual output of more than 2 billion.

Generally speaking, solid materials can be divided into three categories: conductors, semiconductors, and insulators according to their conductive properties. The free electron concentration (n value) in a material element is proportional to its conductivity. The free electron concentration of a good conductor is quite large. (about 10 ²⁸ e ^- / m ^3), an insulator of the concentration of free electrons is very small (about ¹⁰⁷ e- / m3), the free electron concentration based semiconductors is interposed between the first two values; press, current semiconductor The material uses silicon as a conductor. This is because each atom in the silicon crystal contributes four valence electrons. The nucleus inside the silicon atom has four positive charges. The electron pairs between adjacent atoms form the bond between the atoms. Therefore, electrons are tightly bound near the nucleus, and its conductivity is relatively reduced. Only when the temperature rises, the thermal energy of the crystal will cause some covalent bonds to lose valence electron bonds, resulting in conduction. This incomplete covalent bond is called a hole, and it also becomes a charge carrier. According to this, in a pure semiconductor, the number of holes is equal to the number of free electrons. When a small amount of trivalent or pentavalent atoms are added to pure silicon, an extrinsic or doped semiconductor is formed. . It can be divided into donor body and acceptor. The brief description is as follows: 1. Donor body (N-type): Please refer to Figure 1. When doped with impurities with pentavalent electrons (such as: arsenic), The incoming atom will replace the silicon atom, and the fifth valence electron will become an unbound electron, that is, a current carrier, thus contributing an extra electron carrier, called a donor; 2. Acceptor; (P type): Please refer to Figure 2. When doping impurities with trivalent electrons (such as boron) into pure silicon, only three covalent bonds can be filled, and the fourth vacancy will form an electron Holes, so such impurities are called acceptors.

Various electronic products made by semiconductors are based on the above-mentioned basic principles and use different silicon wafers, photoresist, developer, acid etchant, and a variety of special gases for different industrial needs as process raw materials or Additives are used to jointly complete the sophisticated and complex integrated circuit manufacturing process. In order to highlight the importance and value of the present invention in the integrated circuit manufacturing process, I would like to briefly explain the manufacturing process of the integrated circuit as follows to understand: Press, the materials used in the semiconductor industry generally contain a single component Semiconductors (such as silicon (Si), germanium (Ge) and other semiconductors are composed of silicon (Si) or germanium (Ge), the fourth group of elements on the chemical periodic table) and multi-component semiconductors (containing two to three elements, Such as: gallium arsenide (GaAs) semiconductor system is composed of the third group of gallium element and the fifth group of arsenic element on the chemical periodic table); among them, in the early 1950s, although germanium was once regarded as the main semiconductor material, Since germanium products often have high leakage currents at low temperatures, silicon crystal products have replaced germanium products since the 1960s and have become the main semiconductor materials used in integrated circuit manufacturing.

As mentioned above, please refer to Figure 3. The semiconductor and integrated circuit industry can be divided into the processing and manufacturing of semiconductor materials (silicon wafer) (upstream) and the product of wafers according to their manufacturing content and manufacturing process. Three types: wafer fabrication (midstream), wafer dicing, and wafer package (downstream); among them, please refer to Figure 3 again. The upstream silicon wafer manufacturing process refers to Polycrystalline silicon is extracted from spar raw materials to the production of silicon wafers. After such silicon wafers are subjected to grinding and multiple epitaxial reactor treatments, they can be made into grinding Wafers are grown into epitaxial wafers, which makes their use more special and has extremely high added value; then, the integrated circuit manufacturing process of midstream wafers is for the above-mentioned wafers of various specifications. According to the demand, various complicated and precise process technologies such as various circuit design, mask design, oxidation, diffusion, ion implantation, etching and cleaning, etc. are used to produce finished wafers for various purposes; In the downstream wafer dicing and assembly process, wafer dicing is performed on the finished wafer completed in the midstream process to cut the finished wafer into dice, which is then bonded and After wire bonding, sealing, de-rib bend, pin plating, finished product testing and packaging, all kinds of semiconductor electronic components can be produced. It is checked that in the integrated circuit manufacturing process of the aforementioned midstream wafers, the finished silicon wafer is mainly used as the basic material, after surface oxide film formation and photosensitive agent coating treatment, combined with the required photomask for exposure and development And so on, that can form all kinds of circuits required on the finished silicon wafer; then, after etching, removing the photoresist liquid and adding impurities, etc., the metal evaporation process can be carried out to make the required The circuits, component contacts and electrodes... etc. can be formed on the finished silicon wafer; then, after the finished silicon wafer is inspected with a wafer probe, it can enter the downstream wafer cutting and assembly process. After cutting the finished silicon wafer into chips, the processing steps of chip bonding, wire bonding, packaging, electroplating, testing, and packaging are performed in sequence to produce various electronic products as desired. I would like to summarize the important process steps in the aforementioned process as follows: (1) Oxidation and film adhesion: Generally speaking, before the raw wafer is put into the aforementioned process, its surface will be coated with a layer of Al ₂ O _{3 A} protective film with a thickness of about 2 μm formed by a mixed solution of glycerin. The protective film and the stained areas on the surface and corners of the wafer are removed by chemical etching; then, in order to produce different components and products on the wafer For the bulk circuit, the following different thin layers must be grown on the wafer first: (1-1) Thermal oxide layer: The thermal oxide layer includes gate oxide and field oxide. The important thin layer, both of these thin layers are made by thermal oxidation process according to the following chemical reaction formula: Si (solid) + O ₂ (gas) → SiO ₂ (solid) Si (solid) + 2H2O (gas) → SiO ₂ (solid) + 2H ₂ (gas) In the modern integrated circuit manufacturing process, chlorine is used as an oxidant to improve the quality of the oxide layer, Si-SiO ₂ and the properties of the joint surface. Chlorine is contained in chlorine gas, hydrogen chloride HCl or two In ethyl chloride, it can react Si-SiO ₂ and the impurities on the junction into volatile chlorides. The excess chlorine will increase the breakdown strength of the dielectric and reduce the defect density of the junction; (1-2) Dielectric layer: Mainly by chemical vapor adhesion method (CVD), chemical vapor adhesion method (LPCVD) or plasma chemical vapor adhesion method (PCVD, or plasma adhesion method), so that the dielectric layer can be firmly attached to the wafer surface, thereby It can be used to isolate and protect different types of components and integrated circuits; among them, the silicon dioxide produced by the chemical vapor adhesion method does not replace the thermally grown oxide layer because the latter has better electronic properties; the silicon dioxide layer can Different attachment methods are used. The oxide layer attached at low temperature (300~500℃) can be formed by silane, impurities (such as phosphorus) and oxygen according to the following chemical reaction formula: SiH ₄ +O ₂ →SiO ₂ +2H ₂ 4PH _{3 + 5O 2 → 2P 2 O 5} + 6H 2 during attachment moderate temperature (500 ~ 800 ℃), the silicon dioxide may be formed via group tetraethyl silicon Si (OC ₂ H ₅₎ 4 by the following chemical formula, in LPCVD Decomposition in the reactor to form: Si (OC ₂ H ₅ ) 4 → SiO ₂ + by-products in the high temperature (900 ℃) adhesion process, silicon dioxide can be converted from dichlorosilane (SiCl ₂ H ₂ ) and laughing gas (N2O) ) According to the following reaction formula, it is formed under low pressure: SiCl2H2+2N2O→SiO+2N2+2HCI, in which the silicon nitride layer is used as a protective element and can be used as a shielding layer during silicon oxidation to cover the unoxidized In the silicon crystal part, the adhesion of silicon nitride is formed in a medium temperature (750°C) LPCVD process or a low temperature (300°C) plasma CVD process. In the LPCVD process, dichlorosilane and ammonia can react to form a silicon nitride layer at 700~800℃ under reduced pressure according to the following reaction formula: SiCl ₂ H ₂ +4NH ₃ →Si ₃ N ₄ +6HCl+ 6H ₂

(1-3) Silicon crystal polymer layer: or polysilicon, used as gate wiring material in Metal Oxide Semiconductor (MOS) components; used as conductive material in multilayer metal processing; in low-energy level junction components As a contact material, it can also be used as a source of diffusion to generate ohmic contacts between low-level junctions and silicon crystals. Other uses include the production of capacitors and high resistance. The low pressure reactor is operated at 600~650℃, and can pyrolyze silane to form silicon polymer according to the following reaction formula: SiH ₄ →Si+2H ₂

(1-4) Metal layer: Aluminum and silicide are used to form low-resistance metal contacts connecting N+, P+ and silicon polymer layers, and a metal-semiconductor barrier with rectification; the treatment of the metal layer includes internal connections The formation of metal layers such as wires, ohmic contacts, and rectifier metal-semiconductor contacts; although the metal layer can be coated by different methods, physical vapor deposition and chemical vapor deposition are still the most important, and aluminum and silicide are the most important Two important metals are often used. In the metal layer processing, chemical vapor deposition (CVD) provides a very good same-type step coverage layer, and a large number of wafers can be made at one time. The CVD metal adhesion of the latest integrated circuits can even be applied to the adhesion of refractory metals (such as tungsten), so that it can be pyrolyzed and reduced according to the following chemical reaction formula: WF ₆ →W+3F ₂

WF ₆ +3H ₂ →W+6HF

(2) Diffusion and ion implantation: Diffusion and ion implantation are the key processes used to control the amount of impurities in semiconductors; among them, the diffusion process uses implanted impurities or impurity oxides for vapor adhesion to implant impurity atoms The area adjacent to the surface of the semiconductor wafer. The impurity concentration decreases monotonously from the surface, and the solid state of the impurity distribution depends on the diffusion temperature and time; in the ion implantation process, the impurity is implanted into the semiconductor with high energy ion beam; the concentration of the implanted impurity is at a peak in the semiconductor The impurity distribution pattern depends on the quality and energy of the implanted ions; the advantages of the ion implantation procedure are the precise control of the impurity mass, the reformation of the impurity distribution and the ability to operate at low temperatures. The diffusion of impurities basically involves placing semiconductor wafers in a furnace; then, passing inert gas with impurity atoms; generally speaking, in the diffusion of silicon, the most commonly used impurities are the three elements of boron, arsenic and phosphorus. The solubility of these three elements in silicon is quite high. There are several sources of impurities, including solid sources (BN, AS ₂ O ₃ and P ₂ O ₃ ), liquid sources (BBr ₃ , AsCl ₃ and POCl ₃ ) or gas sources (B ₂ H ₆ , AsH ₃ , and PH ₃ ); Generally, gas-derived impurities can be transported by inert gas (such as nitrogen N) to the semiconductor surface, and then undergo a reduction reaction; solid-derived impurities are formed on the silicon surface by the following chemical reaction formula: 2As ₂ O ₃ +3Si→4As+3SiO ₂

(3) Imprinting and etching: Imprinting refers to the imprinting of geometric molds on a thin layer of photosensitive material (also called photoresist) covered on the surface of a semiconductor chip; in general, different photoresist molds are covered more than once It is printed on the surface of the chip to form the required circuit and component patterns; then, through the etching process, different areas to be processed are obtained, so that the aforementioned implantation, diffusion, etc. processing can be performed in each of the areas to be processed; The various IC printing methods used in the industry and the corresponding photoresist components are listed below for information:

According to its sensitivity to radiation, photoresist compounds are divided into two types: positive photoresist and negative photoresist; among them, after the positive photoresist is exposed to light, the exposed area can be made of chemical substances (de-photoresist or Developer) is dissolved and removed; negative photoresist is just the opposite. It is found that the composition of positive photoresist has three main components: one is a light-sensitive compound, the other is a resin, and the third is an organic solvent. Negative photoresist is a polymer containing light-sensitive composition. The printing process is to coat the photoresist uniformly on the surface of the wafer, and after the exposure treatment, the positive photoresist in the exposed area must be dissolved, washed, and dried with a developer; then, the insulating layer in the exposed area is removed by etching , And the photoresist in the unexposed area is not affected by the etching; finally, you can use solution (such as: in the H ₂ SO ₄ +H ₂ O ₂ tank) or plasma oxidation to remove the remaining photoresist to complete this During the manufacturing process, a required insulating layer casting image is produced, and the insulating layer casting image can then be used as a shielding and protective layer required for subsequent processes, such as: enabling ions to be implanted until the The area of the semiconductor substrate protected by the shielding protection layer is usually completed by repeatedly performing the aforementioned complicated printing and etching procedures on the wafer surface during the entire circuit system manufacturing process of the integrated circuit.

In summary, no matter what kind of IC chip product is produced, the quality of its product depends entirely on whether the cleaning process is thorough and reliable in the three important process links mentioned above. In particular, as mentioned above, the manufacturing process of integrated circuits is not only very complicated, but also varies with IC chip products, whether it is from the wet process used in the past to the gas dry process after pressure reduction, In terms of the emerging compound semiconductor manufacturing process, although these process technologies continue to innovate, the types and quantities of process materials such as acid-base solutions, organic solvents, and special gas materials used in the manufacture of semiconductors and integrated circuits are not It is increasing unabated, and most of these process materials are highly toxic. Therefore, the industry and management units should naturally pay special attention to them, and take perfect prevention and control accordingly to ensure the safety of personnel and the surrounding environment.

In addition, no matter in the aforementioned process links of silicon wafers or integrated circuits, the procedures are quite complicated and accurate, and the process materials used in each process link are also quite large, and these are in the previous process links. Generally, the chemical substances used in the semi-finished products must be completely removed before the semi-finished products enter the next process link to ensure that the chemical substances will not remain on the semi-finished products, and the product quality and characteristics of the final product And the yield has a negative impact. In view of this, the silicon wafer or integrated circuit industry will install at least one cleaning equipment in the three major process links mentioned above, so that each semi-finished product can be sure and thorough before entering the next process link. The cleaning, so that there are no chemical substances and impurities that are not needed in the next process link; its practice is mainly to use one of the high-pressure pumps on the cleaning equipment to treat various cleaning fluids (such as: Pure water, various acid-base solutions and organic solvents... etc.) are pressurized, and then the pressurized cleaning fluids are sprayed onto the semi-finished products to be cleaned one by one to ensure that each semi-finished product enters the next During the manufacturing process, there will never be any remaining chemical substances and impurities from the previous process. Quality, so as to ensure that the final IC chip products have the expected excellent characteristics and quality, and the final IC chip products can always maintain the best product yield. However, since most of the cleaning fluids pressurized and pushed by the high-pressure pumps are various acid-base solutions and organic solvents with high corrosiveness, high volatility, and high flammability, therefore, based on safety considerations, each The high-pressure pumps installed on the cleaning equipment all adopt a pneumatic piston or plunger pump powered by compressed air, which uses the reciprocating movement of the piston or plunger inside to cause volume changes, and uses the pneumatic The following advantages of piston or plunger pumps can stably pressurize and push the cleaning liquid: (1) Overheating will not occur: since the pneumatic pump uses compressed air as power, it is an expansion and heat absorption during exhaust Therefore, the temperature of the pneumatic pump itself will gradually decrease when it is operating, not only is it not easy to generate heat, there is no problem of overheating, and it will not emit harmful gases; (2) no electric sparks: pneumatic pumps are not used Electricity is used as power, therefore, not only does not produce electrical sparks at all, and only needs to be grounded when the pneumatic pump is installed, and sparks caused by static electricity can also be completely avoided; (3) The shearing force of various solvents is extremely high. Low: When the pneumatic pump is in operation, the solvent is sucked in, and the solvent is discharged. Therefore, the agitation of various solvents is minimal, and it is very suitable for pressurizing and conveying unstable solvents; (4) The flow rate of the solvent can be adjusted. Adjustment: It is only necessary to install a throttle valve at the solvent outlet of the pneumatic pump, which can easily adjust the flow rate of the solvent; (5) It has the function of self-priming: the negative pressure generated by the operation of the pneumatic pump, It has the function of self-priming the solvent, which can reduce the power consumption; (6) It can run dry: that is, the pneumatic pump will continue to operate in the solvent-free state, and will not generate (7) The range of liquids that can be pressurized and transported is extremely wide: from low-viscosity to high-viscosity solvents, or from highly corrosive to highly volatile solvents; (8) No complicated Control system: Therefore, no electrical components such as cables, fuses, etc. are needed; (9) Small size and light weight, so easy to move: (10) No lubrication is required, so maintenance is simple, and it will not pollute the working environment due to dripping; and (11) ) Pneumatic pumps can always maintain efficient operation without reducing work efficiency due to wear.

However, in order that the review committee can easily understand the defects and problems of the pneumatic pumps on the cleaning equipment used in the semiconductor industry, I would like to take the conventional pneumatic pump system 1 used in the semiconductor industry as an example. The detailed description is as follows: Please refer to Figure 4, the pneumatic pump system 1 includes a piston cylinder tube 10, two plunger cylinder tubes 11, 12, a spindle 20, a central piston 30, and at least two pressurized gas delivery pipes. Road 40, a plurality of check valves S, at least two cleaning fluid delivery pipelines 50, a pneumatic switching valve 60, and a pressurized cleaning fluid storage tank 70; wherein, the piston cylinder 10 is provided with a piston reciprocating space 100, each The plunger cylinders 11 and 12 are respectively provided with a plunger reciprocating space 110, 120, each of the plunger cylinders 11, 12 is axially connected and fixed to both ends of the piston cylinder 10, so that each The plunger reciprocating spaces 110 and 120 can respectively communicate with the piston reciprocating space 100; the spindle 20 is positioned in each of the plunger reciprocating spaces 110, 120 and the piston reciprocating space 100 so as to be axially reciprocating, The central piston 30 is sleeved and fixed to the central part of the mandrel 20 in the axial direction, so that the parts adjacent to the two ends of the mandrel 20 can become plungers 21 and 22 respectively, and each plunger 21, 22 and The central piston 30 can be air-tightly positioned in the corresponding plunger reciprocating spaces 110, 120 and the piston reciprocating space 100, and can be respectively positioned in the plunger reciprocating spaces 110, 120 and the piston reciprocating space. The reciprocating movement is performed in the room 100; the pressurized gas delivery pipeline 40 is connected to the piston reciprocating space 100 through the pneumatic switching valve 60, so that pressurized gas is input to the piston reciprocating space 100 through the pneumatic switching valve 60 (or Output from the piston reciprocating space 100), so that the pressurized gas can apply different pressures to the two opposite side walls of the central piston 30, so that the central piston 30 can perform reciprocating motion in the piston reciprocating space 100 due to the pressure difference , And then drive each of the plungers 21, 22 to perform reciprocating motions in the corresponding plunger reciprocating spaces 110, 120; the cleaning liquid delivery pipeline 50 is connected to each of the plunger valves through the check valve S The reciprocating spaces 110 and 120 are used to input cleaning liquid into each of the plunger or reciprocating spaces 110 and 120, and the reciprocating movement of each of the plungers 21 and 22 is used to input the cleaning in each of the plunger or reciprocating spaces 110, 120 After the liquid is pressurized, the pressurized cleaning liquid is transported to the pressurized cleaning liquid storage tank 70 through the check valve S, so that each cleaning device (not shown) performs cleaning processing on the wafer When used.

Although the conventional pneumatic pump system 1 has many of the aforementioned advantages, the semiconductor industry has not only many opportunities to use the cleaning equipment, but also the use of the cleaning equipment in the three important process links in the production of semiconductor integrated circuits. The number of cleaning equipment is also extremely large. Therefore, please refer to Fig. 4 again, the conventional pneumatic pump system 1 on each cleaning device is frequently used repeatedly and in large quantities, and the pneumatic switching valve 60 is often abnormal due to excessive use. Loss, unable to operate normally, and cause the failure of the cleaning equipment, and even lead to the suspension of the entire automated process of making semiconductors and integrated circuits, which causes great losses to the industry in production and business.

In view of this, how to design a pneumatic dual-spindle pumping system to make the piston and plunger perform reciprocating motion more stably and not easily shaken through the symmetrical dual-spindle and specially designed shaft seal structure The shaft seal is not easy to wear, and even after wear, it can still maintain the pump The normal operation of the pump system can effectively improve the service life and pressurization quality of the pump system. In addition, the pump system can still perform reciprocation only through the piston or plunger without the use of the pneumatic switching valve 60 at all. The stroke of movement can effectively drive the corresponding sensor set on the pumping system, and switch the opening and closing of the corresponding solenoid valve (Magnetic valve) set on the pumping system, accurately and stably Control the entry and exit of related gases and liquids in the pumping system, so that the two will not interfere with each other and interact, so that the pumping system can always maintain stable and normal operation, and will not easily fail, so as to effectively avoid the integrated circuit The problem that the automation process must be shut down due to the failure of the pump system, which effectively prevents the loss of the industry in terms of production and business, has become an important issue that major semiconductor and integrated circuit design and manufacturers are eager to improve. It is also an important subject of the present invention to be discussed and resolved in depth in the follow-up.

In order to stand out in the highly competitive semiconductor and integrated circuit design and manufacturing market, the inventor relies on years of professional experience in the design, processing and manufacturing of various pneumatic pumps, and upholds the research spirit of excellence After a long period of hard research and experimentation, finally developed a pneumatic double-spindle pump structure of the present invention that can effectively improve the service life and pressurization quality. With the advent of the present invention, it is expected to effectively improve the pneumatic double-spindle pump structure. The service life and pressurizing quality of the shaft pump can provide better experience for semiconductor and integrated circuit design and manufacturers.

One purpose of the present invention is to provide a pneumatic double-spindle pump structure that can effectively improve service life and pressurization quality. The pneumatic double-spindle pump includes a piston cylinder barrel, two cylinder seats, and two plunger cylinders. A cylinder, a piston, two spindles, at least two directional control valves, at least two pressurized gas delivery pipelines, at least two cleaning fluid delivery pipelines, and at least a two-stroke sensor; wherein, the piston The cylinder barrel is hollow with a piston reciprocating space; one side of the cylinder seats is airtightly installed and fixed to the two ends of the piston cylinder barrel, and each cylinder seat is provided with a pressurizing An air inlet and outlet channel and a pressurized air inlet and outlet hole, each of the pressurized air inlet and outlet holes can pass through the corresponding pressurized air inlet and outlet channels, respectively communicate with the piston reciprocating space, and each cylinder seat is respectively opened along the axial direction There is a through hole; each of the plunger cylinder barrels is also hollow respectively, and a plunger reciprocating space is respectively opened in it, and one end of the plunger is airtightly installed and fixed to the other side of each cylinder seat along the axial direction , So that each plunger reciprocating space can pass through the corresponding through holes, and respectively communicate with the piston reciprocating space; the piston is airtight but reciprocally movably positioned in the piston reciprocating space; each mandrel One end is fixed to the axial positions of the two opposite sides of the piston, so that the part of each mandrel adjacent to the other end can be a plunger, and each plunger can pass through the corresponding through hole. , And airtight but reciprocatingly positioned in the corresponding plunger reciprocating space, so that the piston and each plunger can perform reciprocating in the corresponding plunger reciprocating space and each plunger reciprocating space Movement; The directional control valves are respectively installed in the pressurized air inlet and outlet holes to open and close the pressurized air in and out of the reciprocating space of the piston, so that the pressurized air can be different on the two opposite sides of the piston The pressure difference, so that the piston can continuously perform reciprocating motion in the piston reciprocating space; one end of each pressurized gas delivery pipeline is connected to a pressurized gas generating device, and the other end is connected to each The directional control valve provides the pressurized gas provided by the pressurized gas generating device to the pneumatic double-spindle pump through the switching of each directional control valve to drive the piston to reciprocate The power to perform reciprocating motion in the space; each cleaning fluid delivery pipeline is used to transport the cleaning fluid to the reciprocating space of each plunger, so that each plunger can reciprocate each plunger under the driving of the piston Pressure is applied to each cleaning fluid in the space, and after the pressure is applied to each cleaning fluid, the pressurized cleaning fluid The washing liquid is output to a pressurized washing liquid storage tank for subsequent use when cleaning wafers; the stroke sensors are installed on the piston cylinder barrel to accurately sense the The precise stroke position when the piston performs reciprocating motion, and a switching signal is generated accordingly to switch the corresponding directional control valves to correctly and accurately perform the opening and closing actions, so that the piston can perform reciprocating motion accurately and stably, Correctly apply pressure to each cleaning solution.

In this way, because in the pneumatic double-spindle pump structure of the present invention, the spindles are fixed axially symmetrically at the axial positions of the two opposite sides of the piston, so that each spindle is adjacent to the other end After the parts become plungers, they can follow the piston to accurately and stably perform reciprocating motion in the corresponding piston reciprocating space and each plunger reciprocating space, without shaking and offset, so it can effectively ensure The relevant components in the pneumatic double-spindle pump will not be improperly worn, which will cause the malfunction of the pneumatic double-spindle pump; in addition, the stroke sensor of the present invention can be easily installed in The outer side of the piston cylinder barrel not only makes the maintenance of each stroke sensor faster and more convenient, but also because each stroke sensor can accurately sense without touching the piston. The precise stroke position of the piston during the reciprocating motion is generated, and a switching signal is generated accordingly to switch the corresponding directional control valves to perform opening and closing actions, so that the piston can be Each of the plungers can accurately and stably perform reciprocating motions to correctly apply pressure to the cleaning liquid, thereby specifically realizing the purpose of the invention of greatly increasing the service life and pressurization quality of the pneumatic double-spindle pump.

Another object of the present invention is to provide at least two plunger seal sets for the pneumatic dual-spindle pump, each of the plunger seal sets is sleeved on the part of each mandrel corresponding to each plunger , To form a shaft seal between the outer wall of each plunger and the inner wall of the corresponding plunger reciprocating space to ensure that each plunger performs reciprocating motion to apply pressure to the cleaning fluid in each plunger reciprocating space. clear The lotion will not leak out from the gap between the outer wall of each plunger and the inner wall of the corresponding plunger reciprocating space due to the applied pressure, and pollute or endanger the surrounding personnel and the environment. Each plunger is sealed The system includes at least one front tightening shaft seal, at least one intermediate modulation shaft seal and at least one rear tightening shaft seal; wherein, the front tightening shaft seal, the middle modulation shaft seal and the rear tightening shaft seal They are respectively sleeved on the outer edge of each spindle corresponding to each plunger along the axial direction, so that when each plunger performs reciprocating motion, the front tightening shaft seal and the rear tightening shaft The seal energy respectively abuts and presses to the front and rear ends of the intermediate modulation shaft seal, so as to apply an axial stress to the intermediate modulation shaft seal, so that the intermediate modulation shaft seal can follow the axial stress. The stroke of the reciprocating motion dynamically adjusts the deformation and tightness of the shaft seal along the radial direction, so that no matter how long or how many times the reciprocating motion is performed, each plunger seal group is not prone to wear, or even in each plunger In the state where the outer wall of the shaft seal group has been worn out, it is still possible to dynamically adjust the deformation and tightness of the shaft seal along the radial direction with the stroke of the reciprocating motion. The gap between the outer wall of the plunger and the corresponding inner wall of the reciprocating space of the plunger provides the best shaft sealing effect, which not only ensures that the piston and each plunger can always be maintained in the correct axial design position, and does not cause shaft deviation In addition to the situation of shifting or shaft shaking, it can also ensure that the piston and each plunger can always accurately perform reciprocating motion in the corresponding piston reciprocating space and each plunger reciprocating space, and make each plunger reciprocate The cleaning fluid in the space will never leak out through the gap.

In order to facilitate your reviewers to have a further understanding and understanding of the purpose, technical features and effects of the present invention, the following examples are provided in conjunction with the diagrams. The detailed description is as follows:

[Learning]

1‧‧‧Pneumatic pump system

10‧‧‧Piston cylinder barrel

11、12‧‧‧Plunger cylinder

20‧‧‧Mandrel

21, 22‧‧‧ Plunger

30‧‧‧Central Piston

40‧‧‧Pressurized gas delivery pipeline

50‧‧‧Cleaning fluid delivery pipeline

60‧‧‧Pneumatic switching valve

70‧‧‧Pressurized cleaning fluid storage tank

100‧‧‧Piston reciprocating space

110、120‧‧‧Plunger reciprocating space

S‧‧‧Check valve

〔this invention〕

8‧‧‧Pneumatic double spindle pump

50‧‧‧Cleaning fluid delivery pipeline

80‧‧‧Piston cylinder barrel

800‧‧‧Piston reciprocating space

81、82‧‧‧Cylinder seat

810, 820‧‧‧Pressurized air access channel

811, 821‧‧‧Pressurized air inlet and outlet

812, 822‧‧‧through hole

90‧‧‧Piston

91、92‧‧‧Plunger cylinder

91A, 91B, 92A, 92B‧‧‧Cylinder

910、920‧‧‧Plunger reciprocating space

93‧‧‧Plunger Seal Group

93F‧‧‧Front tightening shaft seal

93M‧‧‧Intermediate modulation shaft seal

93R‧‧‧ Rear tightening shaft seal

101、102‧‧‧Mandrel

101A、102A‧‧‧Plunger

W ₁ 、W ₂ ‧‧‧Opening

F ₁ 、F ₂ ‧‧‧Angle steel support frame

F _H ‧‧‧Horizontal plate

F _P ‧‧‧Vertical board

D‧‧‧predetermined spacing

G1, G2‧‧‧directional control valve

Figure 1 is a schematic diagram of the conventional lattice structure after being replaced by a pentavalent impurity atom; Figure 2 is a schematic diagram of the conventional lattice structure after being replaced by a trivalent impurity atom; Figure 3 is a schematic diagram of the upstream, midstream and downstream important process steps of the semiconductor and integrated circuit manufacturing industry; Figure 4 is the current semiconductor industry A schematic cross-sectional structure diagram of a conventional pneumatic pump system; Figure 5 is a perspective exploded schematic view of the pneumatic dual-spindle pump of the present invention; Figure 6 is a longitudinal cross-sectional schematic view of the pneumatic dual-spindle pump of the present invention; Figure 7 is a schematic longitudinal section view of the pneumatic dual-spindle pump of the present invention at another angle; Figure 8 is a perspective view of the assembly of the pneumatic dual-spindle pump of the present invention; Figure 9 is the plunger seal of the present invention A perspective exploded schematic view before the assembly; and Figure 10 is a longitudinal sectional view of the plunger seal assembly of the present invention.

The present invention is a pneumatic double-spindle pump structure that can effectively increase the service life and pressurization quality. Please refer to a preferred embodiment of the present invention shown in Figures 5 and 6, which is based on the existing Under the basic structure of the pneumatic pump, only adjustments are made to the related mechanism design, sensing design and shaft seal design of the piston and plunger on it, which can greatly reduce the size and specifications of the existing pneumatic pump. Increase the service life and pressurization quality of the pneumatic dual-spindle pump 8, and effectively improve its precise pressure and stable transmission characteristics of the cleaning liquid, thereby providing the relevant industry with a better experience.

In order to facilitate the description of the shape, structure, assembly relationship and operating principle of the components in the pneumatic double-spindle pump 8 of the present invention, the upper part of the pneumatic double-spindle pump 8 shown in Figures 5 and 6 is used as The top side of each element on it, the bottom of the pneumatic double-spindle pump 8 shown in Figures 5 and 6 is the bottom side of each element above it, and the pneumatic double-spindle is shown in Figures 5 and 6 The bottom left of pump 8 works It is the front side of the upper components, and the upper right side of the pneumatic dual-spindle pump 8 shown in Figures 5 and 6 is the rear side of the upper components. In addition, the configuration of the pneumatic dual-spindle pump 8 and its components of the present invention is not limited to those drawn in Figures 5 to 10 of the present invention. The industry can also adjust the pneumatic dual-shaft pump 8 according to actual needs. The configuration of the spindle pump 8 and its components, as long as the pneumatic dual spindle pump 8 has the relevant basic structure described in the subsequent embodiments and can produce the same specific effects, it should be regarded as the present invention The pneumatic dual-spindle pump 8 that I want to protect here is the first to be discussed.

Please refer to Figures 5 and 6, in this preferred embodiment, the pneumatic dual-spindle pump 8 includes a piston cylinder 80, two cylinder seats 81, 82, and two plunger cylinders 91, 92 , A piston 90, two spindles 101, 102, at least two directional control valves G1, G2 (such as: solenoid valve, pneumatic valve, manual valve... etc., in order to avoid the diagram is too complicated, the fifth figure only uses a dashed frame Means, but those skilled in the art should understand its characteristics), at least two pressurized gas delivery pipelines (not shown in the figure), at least two cleaning fluid delivery pipelines 50, and at least two stroke sensors (stroke sensor, Figure Not shown in); Among them, please refer to Figure 6, the piston cylinder tube 80 is hollow, and there is a piston reciprocating space 800 therein; please refer to Figure 6, the cylinder seats 81, One side of 82 is air-tightly installed and fixed to both ends of the piston cylinder tube 80 along the axial direction. Please refer to Figure 7. Each cylinder block 81, 82 is provided with a pressurized air inlet and outlet channel 810. , 820 and a pressurized air inlet and outlet holes 811, 821; wherein each of the pressurized air inlet and outlet holes 811, 821 can pass through the corresponding pressurized air inlet and outlet channels 810, 820, and respectively communicate with the piston reciprocating space 800 , And each cylinder seat 81, 82 is provided with a through hole 812, 822 along the axial direction; please refer to Figures 6 and 7, each of the plunger cylinders 91, 92 is also hollow, and A plunger reciprocating space 910, 920 is respectively provided therein, and one end of each plunger cylinder 91, 92 is airtightly installed and fixed to the other side of each cylinder seat 81, 82 along the axial direction, so as to make Each plunger reciprocating space 910, 920 can pass through the corresponding penetrating space The holes 812 and 822 are respectively communicated with the piston reciprocating space 800; please refer to Figures 6 and 7, the piston 90 is air-tight but reciprocally movably positioned in the piston reciprocating space 800; each center One ends of the shafts 101 and 102 are respectively fixed to the axial positions of the two opposite sides of the piston 90, so that the parts adjacent to the other end of the shafts 101 and 102 can be plungers 101A, 102A, respectively, and each The plungers 101A and 102A can respectively pass through the corresponding through holes 812 and 822, and are airtightly but reciprocally movably positioned in the corresponding plunger reciprocating spaces 910 and 920, so that the piston 90 and each column The plugs 101A and 102A can respectively perform reciprocating motion in the corresponding piston reciprocating space 800 and each of the plunger reciprocating spaces 910, 920; each of the directional control valves G1 and G2 are respectively installed to each of the pressurized air inlet and outlet holes 811 821, used to switch the opening and closing actions of pressurized air in and out of the piston reciprocating space 800, that is, the pressurized air from outside can pass through the pressurized air inlet and outlet holes 811, 821, and pass through the corresponding pressurized air inlet and outlet The passages 810, 820 enter the piston reciprocating space 800, or the pressurized air in the piston reciprocating space 800 can pass through the corresponding pressurized air inlet and outlet channels 810, 820, and pass through the pressurized air inlet and outlet holes 811 and 821 are discharged to the outside of the piston reciprocating space 800, so that the pressurized air can generate different pressures on the two opposite sides of the piston 90, and the piston 90 can move in the piston reciprocating space due to the pressure difference 800 continuously performs reciprocating motion; please refer to Figures 6 and 7, one end of each pressurized gas delivery pipeline (not shown in the figure) is connected to a pressurized gas generating device (not shown in the figure) , The other end is connected to each of the directional control valves G1 and G2 to provide the pressurized gas generated by the pressurized gas generator to the piston reciprocating The space 800 is used as the power to drive the piston 90 to continuously perform reciprocating motion in the piston reciprocating space 800; please refer to Figures 7 and 8, the cleaning fluid delivery pipes 50 are used to deliver the cleaning fluid to each The plunger reciprocating space 910, 920, so that the plunger 101A, 102A can be driven by the piston 90, respectively, the plunger Each of the cleaning fluids in the reciprocating spaces 910, 920 is pressurized, and after pressurizing each of the cleaning fluids, the pressurized cleaning fluids are transferred from the plunger reciprocating spaces through the cleaning fluid delivery pipes 50 910 and 920 are output to a pressurized cleaning fluid storage tank (not shown in the figure) for subsequent use in cleaning the wafer; please refer to Figures 7 and 8, each stroke sensor ( (Not shown in the figure) is installed on the piston cylinder 80, which can be used to accurately sense the precise stroke position of the piston 90 when performing reciprocating motion, and accordingly generate a switching signal for Switch the corresponding directional control valves G1 and G2 to correctly perform the opening and closing actions, so that the piston 90 and the plungers 101A, 102A can accurately and stably perform reciprocating motion, thereby providing the plunger reciprocating space 910, The cleaning fluid in the 920 correctly applies pressure.

In this way, please refer to Figures 7 and 8, because in the structure of the pneumatic dual-spindle pump 8 of the present invention, the spindles 101 and 102 are fixed on the two pistons 90 symmetrically along the axis. The position of the axis of the opposite side, so that the parts adjacent to the other end of each of the spindles 101 and 102 become plungers 101A and 102A respectively, and can follow the piston 90 to respectively accurately and stably be in the reciprocating space of the corresponding piston. 800 and each of the plunger reciprocating spaces 910, 920 perform reciprocating motion, which is not prone to shaking and offset. Therefore, it can effectively ensure that the relevant components in the pneumatic double spindle pump 8 will not be improperly worn, thereby effectively avoiding the The pneumatic double-spindle pump 8 fails; in addition, since each of the stroke sensors of the present invention can be easily installed on the outside of the piston cylinder tube 80, it not only allows the industry to understand the stroke sensor Repair and maintenance have become faster and easier. Moreover, each stroke sensor can accurately sense the precise stroke position of the piston 90 when it performs reciprocating motion without touching the piston 90 at all. To generate a switching signal to switch the corresponding directional control valves G1 and G2 to accurately perform opening and closing actions, so that the piston 90 can always perform reciprocating motion accurately and stably under the premise of no component wear , Thereby driving each plunger 101A, 102A is for the cleaning liquid flowing into each of the plunger reciprocating spaces 910 and 920 to correctly apply pressure, so as to achieve the purpose of effectively increasing the service life and pressurization quality of the pneumatic double-spindle pump 8.

In addition, please refer to Figures 5, 6, 7 and 8, each of the plunger cylinders 91, 92 has an opening W ₁ , W _{2 on} the top side adjacent to the cylinder seats 81, 82, respectively. hole W _1, W ₂ 8 can be pumped into the operating process of the pneumatic double the mandrel, as the mandrel 101 so that inadvertently the correspondence, ¹⁰² are driven to the position where the cleaning liquid, respectively, via the corresponding opening can be The holes W ₁ and W _{2 are} discharged to avoid contaminating other elements in the area adjacent to the cylinder block 81 and 82.

In addition, in order to make the industry more maneuverable and adaptable in the overall process of manufacturing, transporting and assembling the pneumatic double-spindle pump 8, in the foregoing preferred embodiment of the present invention, each of the plunger cylinders The cylinders 91 and 92 can also be made into a single cylinder according to actual needs, or can be made into a combination of a plurality of cylinders (as shown in Figure 5, the plunger cylinder 91 is composed of a cylinder 91A And 91B, the plunger cylinder 92 is a combination of cylinders 92A and 92B), so that the pneumatic double-spindle pump 8 has a better fit for the installation space.

Also, please refer to Figures 5 and 8, in order to enable the pneumatic dual-spindle pump 8 of the present invention to be horizontally and easily assembled to the ground, in the foregoing preferred embodiment of the present invention, the pneumatic The double-spindle pump 8 also includes at least two angle steel support frames F ₁ and F ₂ ; among them, the horizontal plate F _H on the angle steel support frames F ₁ and F ₂ is locked to the ground to make them the vertical plate _P F can be maintained between a predetermined pitch D; thus, as soon as such the cylinder block 81, 82 are vertically assembled to the support frame such angle and the vertical _{plate. 1} F F ₂ F after the _P, the assembly Personnel can easily and conveniently assemble other constituent elements and pipelines to the cylinder blocks 81 and 82 one by one, and quickly complete the overall assembly of the pneumatic dual-spindle pump 8 of the present invention; however, In other embodiments of the invention, the industry can use only one or more than three angle steel support frames according to product requirements.

According to the above, only some of the preferred embodiments of the present invention are shown. However, the present invention is not limited to this when it is actually implemented. It is also possible to appropriately adjust the constituent elements and components according to actual needs. The shape and structure of the pipeline, as well as the assembly and connection relationship between each other, as long as it has the aforementioned axially symmetrical dual spindles 101 and 102 design, and each stroke sensor can be in a state of not touching the piston 90 at all, Accurately sense the precise stroke position of the piston 90 when it performs reciprocating motion, and generate a switching signal accordingly to switch the corresponding directional control valves G1 and G2 to accurately perform the opening and closing actions, so that it can be completely free Under the premise of component wear, the piston 90 can always perform reciprocating motion accurately and stably, and drive the plungers 101A, 102A to correctly apply pressure to the cleaning fluid flowing into the plunger reciprocating spaces 910, 920. The specific realization of the purpose of the invention to effectively increase the service life and pressurizing quality of the pneumatic dual-spindle pump 8 should not depart from the protection scope of the present invention.

In addition, when the present invention is actually implemented, the industry can also meet actual needs. Please refer to Figures 5, 6 and 7 for the pneumatic dual-spindle pump 8 with at least two plunger shaft seal groups 93 , Each plunger shaft seal group 93 is sleeved on the outer edge of each mandrel 101, 102 corresponding to each plunger 101A, 102A, so that the outer wall of each plunger 101A, 102A and the corresponding plunger A shaft seal is formed between the inner walls of the reciprocating spaces 910 and 920 to ensure that the plungers 101A and 102A perform reciprocating motion. When pressure is applied to the cleaning liquid in the reciprocating spaces 910 and 920, the cleaning liquid will not Due to the applied pressure, the gap between the outer wall of each plunger 101A, 102A and the corresponding inner wall of the plunger reciprocating space 910, 920 leaks to the outside of the pneumatic double-spindle pump 8, causing contamination Or endanger the surrounding personnel and the environment, please refer to Figure 9. Each plunger seal group 93 includes a front compression shaft seal 93F, an intermediate modulation shaft seal 93M and a rear compression shaft seal 93R. ; Among them, the front compression shaft seal 93F, the intermediate modulation shaft seal 93M and the rear compression shaft seal 93R are respectively made of ultra-high molecular PE material (such as: 6 million or more molecular weight), and is sequentially sleeved on the outer edge of each mandrel 101, 102 in the axial direction corresponding to each plunger 101A, 102A, so as to perform on each plunger 101A, 102A During reciprocating motion, the front tightening shaft seal 93F and the rear tightening shaft seal 93R can be pressed against and pressed to the front and rear ends of the intermediate modulation shaft seal 93M respectively, so that the intermediate modulation shaft seal 93M Applying an axial stress, the intermediate modulation shaft seal 93M can dynamically adjust the intermediate modulation shaft seal 93M in the radial direction with the reciprocating stroke of the plungers 101A and 102A due to the axial stress The amount of deformation and the corresponding optimal shaft seal tightness are generated accordingly, so that no matter how long or how many times the reciprocating movement of each plunger seal group 93 is performed, it is not easy to wear, or even in each plunger shaft In the state where the outer wall of the seal group 93 has undergone some abrasion, the intermediate adjustment shaft seal 93M can still dynamically adjust its shaft seal deformation and tightness in the radial direction following the stroke of reciprocating motion. The gaps between the outer walls of the plugs 101A, 102A and the corresponding inner walls of the plunger reciprocating spaces 910, 920 provide the best shaft sealing effect, which not only ensures that the cleaning fluid in the plunger reciprocating spaces 910, 920 will always The gap leaks out, which can still ensure that the plungers 101A, 102A and the piston 90 will not deviate from the design position of the shaft due to the wear of the shaft seal, and can always reciprocate accurately and stably on the corresponding piston. The space 800 and each of the plunger reciprocating spaces 910, 920 perform reciprocating motion, which is not prone to shaking and offset. Therefore, it can effectively ensure that the relevant components in the pneumatic double-spindle pump 8 will not be improperly worn, thereby effectively preventing the The pneumatic double spindle pump 8 has failed.

In conclusion, in other embodiments of the present invention, the number of the front compression shaft seal 93F, the intermediate modulation shaft seal 93M, and the rear compression shaft seal 93R can be determined according to actual product requirements, and they can be more than one and mutually exclusive. The number of spaces can be the same or different. For example, a front compression shaft seal 93F is matched with two intermediate modulation shaft seals 93M and a rear compression shaft seal 93R, so that the present invention can have higher industrial applicability. According to, the above are only the preferred embodiments of the present invention, but the present invention claims The scope of rights is not limited to this. According to those skilled in the art, the equivalent changes that can be easily thought of based on the technical content disclosed in the present invention should not depart from the protection scope of the present invention.

8‧‧‧Pneumatic double spindle pump

50‧‧‧Cleaning fluid delivery pipeline

80‧‧‧Piston cylinder barrel

81、82‧‧‧Cylinder seat

810, 820‧‧‧Pressurized air access channel

811、821‧‧‧Pressurized air inlet and outlet

91、92‧‧‧Plunger cylinder

91A, 91B, 92A, 92B‧‧‧Cylinder

F ₁ 、F ₂ ‧‧‧Angle steel support frame

F _H ‧‧‧Horizontal plate

F _P ‧‧‧Vertical board

Claims (7)

A pneumatic double-spindle pump structure that can effectively increase the service life and pressurization quality. It includes: a piston cylinder barrel, which is hollow, in which a piston reciprocating space is opened; two cylinder seats, one of the cylinder seats The side system is air-tightly installed and fixed to the two ends of the piston cylinder barrel, and each cylinder seat is provided with a pressurized air inlet and outlet channel and a pressurized air inlet and outlet respectively, and each pressurized air inlet and outlet can pass through the corresponding Each of the pressurized air inlet and outlet channels is respectively communicated with the piston reciprocating space, and each of the cylinder seats is provided with a through hole along the axial direction; two plunger cylinders, each of the plunger cylinders is hollow , And a plunger reciprocating space is respectively provided therein, and one end of each plunger cylinder tube is airtightly installed and fixed to the other side of each cylinder seat in the axial direction, so that each plunger reciprocating space can The through holes respectively communicate with the reciprocating space of the piston; one piston is air-tight but reciprocally movably positioned in the piston reciprocating space; two spindles, one end of which is respectively fixed to the piston The position of the axis of the two opposite sides, so that the part adjacent to the other end of each mandrel can become a plunger, and each plunger can pass through the corresponding through hole, and is airtight but reciprocally movable. Positioned in the corresponding reciprocating space of each plunger, so that the piston and each plunger can respectively perform reciprocating motion in the corresponding reciprocating space of the piston and each plunger reciprocating space; at least two directional control valves are respectively Installed to each pressurized air inlet and outlet to switch the opening and closing of pressurized air in and out of the reciprocating space of the piston, that is, to enable external pressurized air to pass through each pressurized air inlet and outlet through the corresponding pressurized air The air inlet and outlet passages enter into the reciprocating space of the piston, or the pressurized air in the reciprocating space of the piston can pass through the pressurized air inlet and outlet channels, through the corresponding pressurized air inlet and outlet holes, and be discharged to the piston reciprocating space Outside the space, so that the pressurized air can generate different pressures on the two opposite sides of the piston, so that the piston can continuously perform reciprocating motion in the piston reciprocating space due to the pressure difference; At least two pressurized gas delivery pipelines, one end of which is connected to a pressurized gas generating device, and the other end of which is connected to each of the directional control valves, so that the pressurized The pressurized gas provided by the gas generating device is input into the reciprocating space of the piston as a power to drive the piston to continuously perform reciprocating motion in the reciprocating space of the piston; at least two cleaning fluid delivery pipelines are used to deliver the cleaning fluid to Each plunger has a reciprocating space so that each plunger can respectively pressurize the cleaning liquid in each plunger reciprocating space under the drive of the piston, and after the cleaning liquid is pressurized, Input each of the pressurized cleaning fluids into a pressurized cleaning fluid storage tank for subsequent use when cleaning the wafers; and at least two stroke sensors, each of which is installed in The piston cylinder barrel can accurately sense the precise stroke position of the piston when it performs reciprocating motion, and accordingly generate a switching signal to switch the corresponding opening and closing actions of the directional control valve, so that the piston can be accurately In addition, the reciprocating motion is performed stably, and the pressure is correctly applied to each cleaning liquid. The pneumatic dual-spindle pump structure according to claim 1, wherein each of the plunger cylinder barrels is provided with an opening on the top side adjacent to the cylinder seat. The pneumatic double-spindle pump structure according to claim 2, wherein each of the plunger cylinders can be made into a single cylinder, or can be made of a combination of multiple cylinders, so that the The pneumatic double spindle pump has better adaptability to the installation space. The pneumatic double-spindle pump structure described in claim 3 further includes at least one angle steel support frame; wherein, the horizontal plate system on each angle steel support frame is locked to the ground so that the vertical plate body on it A predetermined distance can be maintained between. The pneumatic double-spindle pump structure according to any one of claims 1 to 4 further includes at least two plunger seal groups, each of which is sleeved on the outer edge of each mandrel corresponding to The position of each plunger forms a shaft seal between the outer wall of each plunger and the inner wall of the corresponding plunger reciprocating space, so as to ensure that each plunger performs reciprocating motion in each plunger reciprocating space The cleaning fluid application When pressure is applied, the cleaning fluid will not leak out from the gap between the outer wall of each plunger and the inner wall of the corresponding plunger reciprocating space due to the applied pressure; each plunger shaft seal group includes at least one The front compression shaft seal, at least one intermediate modulation shaft seal and at least one rear compression shaft seal; wherein each of the front compression shaft seal, each of the intermediate modulation shaft seals and each of the rear compression shaft seals are along the shaft Sequentially nested on the outer edge of each mandrel corresponding to each plunger, so that when each plunger performs reciprocating motion, each of the front tightening shaft seals and each of the rear tightening shaft seals can respectively resist Close and tighten to the front and rear ends of each intermediate modulation shaft seal, so as to apply an axial stress to each intermediate modulation shaft seal, so that each intermediate modulation shaft seal can follow the axial stress. The stroke of reciprocating movement dynamically adjusts the deformation and tightness of the shaft seal along the radial direction. The pneumatic dual-spindle pump structure according to claim 5, wherein each of the front compression shaft seals, each of the intermediate modulation shaft seals, and each of the rear compression shaft seals are made of polymer materials. The pneumatic double-spindle pump structure according to claim 6, wherein each of the front compression shaft seal, each of the intermediate modulation shaft seals and each of the rear compression shaft seals is made of PE with a molecular weight of 6 million or more. Made of materials.

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