TW202035910A - Tiled light source device - Google Patents

Tiled light source device Download PDF

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Publication number
TW202035910A
TW202035910A TW108110149A TW108110149A TW202035910A TW 202035910 A TW202035910 A TW 202035910A TW 108110149 A TW108110149 A TW 108110149A TW 108110149 A TW108110149 A TW 108110149A TW 202035910 A TW202035910 A TW 202035910A
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Taiwan
Prior art keywords
light
source device
light source
module
carrier
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TW108110149A
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Chinese (zh)
Inventor
許文法
張育源
徐朝龍
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瑞鼎科技股份有限公司
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Priority to TW108110149A priority Critical patent/TW202035910A/en
Priority to CN201910420265.XA priority patent/CN111735033A/en
Publication of TW202035910A publication Critical patent/TW202035910A/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Planar Illumination Modules (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A tiled light source device of the invention includes a supporting plate module and a plurality of lighting modules. The plurality of lighting modules is distributed in an array. Each lighting module includes a substrate, a lighting unit, and a driving unit. The substrate has a first surface and a second surface located opposite to the first surface. The lighting unit is located at the first surface. The driving unit is located at the second surface and is electrically connected to the lighting unit. The supporting plate module is disposed on and partially covers the second surface. The supporting plate module is electrically connected to each lighting module.

Description

拼接式光源裝置 Spliced light source device

本發明係關於一種拼接式光源裝置;具體而言,本發明係關於顯示裝置的拼接式光源裝置。 The present invention relates to a spliced light source device; specifically, the present invention relates to a spliced light source device of a display device.

隨著顯示技術的進步,某些產品的光源會採用模組化的設計。請參照圖1,圖1為習知的光源裝置90的示意圖。 With the advancement of display technology, the light source of some products will adopt a modular design. Please refer to FIG. 1, which is a schematic diagram of a conventional light source device 90.

如圖1所示,光源裝置由不同的模組(910、910A)拼合而成。不同模組上除了放置發光單元920(如發光二極體)之外,還需設置驅動發光單元的驅動電路930。 As shown in Fig. 1, the light source device is assembled by combining different modules (910, 910A). In addition to placing the light-emitting unit 920 (such as a light-emitting diode) on different modules, a driving circuit 930 for driving the light-emitting unit is also required.

然而,如此組合後的光源裝置在不同模組之間會形成明顯的邊緣帶990,導致光源裝置無法滿足產品規格上的要求。因此,習知的光源裝置仍有待改進。 However, the light source device after such a combination will form an obvious edge band 990 between the different modules, so that the light source device cannot meet the requirements of product specifications. Therefore, the conventional light source device still needs improvement.

本發明之一目的在於提供一種拼接式光源裝置,可減少發光模組之間的邊緣面積。 One objective of the present invention is to provide a spliced light source device that can reduce the edge area between the light-emitting modules.

拼接式光源裝置包含載板模組和多個發光模組。多個發光模 組陣列分布,每一發光模組包含基板、發光單元、驅動單元。基板具有第一面及第二面。第一面和第二面位於基板的相反側。發光單元位於第一面。驅動單元位於第二面,且與發光單元電連接。載板模組設置在第二面且覆蓋部分的第二面。載板模組與每一發光模組電連接。 The spliced light source device includes a carrier module and a plurality of light emitting modules. Multiple luminous modes The groups are distributed in an array, and each light-emitting module includes a substrate, a light-emitting unit, and a driving unit. The substrate has a first surface and a second surface. The first surface and the second surface are located on opposite sides of the substrate. The light-emitting unit is located on the first side. The driving unit is located on the second surface and is electrically connected to the light-emitting unit. The carrier module is arranged on the second surface and covers part of the second surface. The carrier module is electrically connected with each light-emitting module.

1,1A,1B‧‧‧拼接式光源裝置 1,1A,1B‧‧‧Splicable light source device

10‧‧‧發光模組 10‧‧‧Lighting Module

20‧‧‧載板模組 20‧‧‧Carrier Board Module

21‧‧‧電路載板 21‧‧‧Circuit carrier board

23‧‧‧控制載板 23‧‧‧Control Carrier Board

110‧‧‧基板 110‧‧‧Substrate

111‧‧‧第一面 111‧‧‧First side

112‧‧‧第二面 112‧‧‧Second Side

114‧‧‧穿孔 114‧‧‧ Piercing

120‧‧‧發光單元 120‧‧‧Lighting Unit

130,130A‧‧‧驅動單元 130,130A‧‧‧Drive unit

140‧‧‧可撓式線路 140‧‧‧Flexible circuit

142,142A‧‧‧連接部 142,142A‧‧‧Connecting part

150‧‧‧第一卡合部 150‧‧‧The first engaging part

160‧‧‧凸塊 160‧‧‧ bump

170‧‧‧導電膠 170‧‧‧Conductive Adhesive

210‧‧‧第一卡合件 210‧‧‧The first snap

220‧‧‧第二卡合件 220‧‧‧Second clip

230‧‧‧開口 230‧‧‧Open

D1‧‧‧第一方向 D1‧‧‧First direction

D2‧‧‧第二方向 D2‧‧‧Second direction

S‧‧‧預定設置範圍 S‧‧‧Predetermined setting range

圖1為習知的光源裝置的示意圖。 Fig. 1 is a schematic diagram of a conventional light source device.

圖2A為設置發光模組的示意圖。 Fig. 2A is a schematic diagram of setting the light-emitting module.

圖2B為發光模組的一實施例示意圖。 FIG. 2B is a schematic diagram of an embodiment of the light emitting module.

圖2C為發光模組的放大剖視圖。 Figure 2C is an enlarged cross-sectional view of the light emitting module.

圖3A、圖3B及圖3C為發光模組的不同實施例背視圖。 3A, 3B and 3C are back views of different embodiments of the light emitting module.

圖4為拼接式光源裝置的一實施例背視圖。 Fig. 4 is a back view of an embodiment of a spliced light source device.

圖5A-1為拼接式光源裝置的另一實施例背視圖。 5A-1 is a back view of another embodiment of a spliced light source device.

圖5A-2為發光模組的放大剖視圖。 5A-2 is an enlarged cross-sectional view of the light-emitting module.

圖5B為拼接式光源裝置的另一實施例背視圖。 Fig. 5B is a back view of another embodiment of a spliced light source device.

圖6A-1為發光模組的另一實施例背視圖。 Fig. 6A-1 is a back view of another embodiment of the light emitting module.

圖6A-2為載板模組的另一實施示意圖。 Fig. 6A-2 is a schematic diagram of another implementation of the carrier module.

圖6A-3為拼接式光源裝置的另一實施例背視圖。 6A-3 is a back view of another embodiment of a spliced light source device.

圖6B為發光模組的放大剖視圖。 Fig. 6B is an enlarged cross-sectional view of the light emitting module.

關於本文中所使用之『第一』、『第二』、...等,並非特別指稱次序或順位的意思,亦非用以限定本發明,其僅為了區別以相同技術用語描述的元件或操作。 Regarding the "first", "second", ... etc. used in this article, they do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish elements or elements described in the same technical terms. operating.

關於本文中所使用之『包含』、『包含』、『具有』、『含有』等等,均為開放性的用語,即意指包含但不限於。下文依本發明之偵測電路,特舉實施例配合所附圖式作詳細說明,但所提供之實施例並非用以限制本發明所涵蓋的範圍。 Regarding "include", "include", "have", "include", etc. used in this article, they are all open terms, which means including but not limited to. The following is a detailed description based on the detection circuit of the present invention with specific embodiments in conjunction with the accompanying drawings, but the provided embodiments are not intended to limit the scope of the present invention.

應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件”上”或”連接到”另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為”直接在另一元件上”或”直接連接到”另一元件時,不存在中間元件。 It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements.

圖2A為設置發光模組10的示意圖。拼接式光源裝置1包含多個發光模組10。 FIG. 2A is a schematic diagram of setting the light-emitting module 10. The spliced light source device 1 includes a plurality of light emitting modules 10.

如圖2A所示,拼接式光源裝置1在預定設置範圍S內分成多個子區域,每個子區域放置一個發光模組10。發光模組10呈陣列分布,相鄰的發光模組10彼此連接。 As shown in FIG. 2A, the spliced light source device 1 is divided into a plurality of sub-regions within a predetermined setting range S, and a light-emitting module 10 is placed in each sub-region. The light emitting modules 10 are distributed in an array, and adjacent light emitting modules 10 are connected to each other.

例如,沿第一方向D1排列的發光模組10並列設置,且以垂直於第一方向D1的側邊彼此抵靠;沿第二方向D2排列的發光模組10則以垂直於第二方向D2的側邊彼此抵靠,藉此組成拼接式光源裝置1。 For example, the light emitting modules 10 arranged along the first direction D1 are arranged side by side, and the sides perpendicular to the first direction D1 abut each other; the light emitting modules 10 arranged along the second direction D2 are arranged perpendicular to the second direction D2 The sides abut against each other, thereby forming a spliced light source device 1.

圖2B為發光模組10的一實施例示意圖。每一發光模組10包含基板110、發光單元120、驅動單元。 FIG. 2B is a schematic diagram of an embodiment of the light-emitting module 10. Each light emitting module 10 includes a substrate 110, a light emitting unit 120, and a driving unit.

如圖2B所示,基板110具有第一面111,且發光單元120位於第一面111。基板110例如為玻璃基板。發光單元120例如為發光二極體或微發光二極體。 As shown in FIG. 2B, the substrate 110 has a first surface 111, and the light-emitting unit 120 is located on the first surface 111. The substrate 110 is, for example, a glass substrate. The light emitting unit 120 is, for example, a light emitting diode or a micro light emitting diode.

圖2C為發光模組10的放大剖視圖。如圖2C所示,基板110具有第一面111及第二面112。第一面111和第二面112位於基板110的相反側。驅動單元130位於第二面112,並與發光單元120電連接。 FIG. 2C is an enlarged cross-sectional view of the light-emitting module 10. As shown in FIG. 2C, the substrate 110 has a first surface 111 and a second surface 112. The first surface 111 and the second surface 112 are located on opposite sides of the substrate 110. The driving unit 130 is located on the second surface 112 and is electrically connected to the light-emitting unit 120.

舉例而言,如圖2B和圖2C所示,基板110上具有多個穿孔114,穿孔114貫穿第一面111和第二面112。驅動單元130可經由穿孔114與發光單元120電連接。 For example, as shown in FIGS. 2B and 2C, the substrate 110 has a plurality of through holes 114, and the through holes 114 penetrate the first surface 111 and the second surface 112. The driving unit 130 may be electrically connected to the light emitting unit 120 via the through hole 114.

藉此設計,如圖2B所示,基板110上最外圍的發光單元120與基板110邊緣的距離可以縮減,也就是說,發光模組10原本在第一面111上預留給驅動單元的空間可被消除,避免不同發光模組10拼合後產生邊緣帶的問題。 With this design, as shown in FIG. 2B, the distance between the outermost light-emitting unit 120 on the substrate 110 and the edge of the substrate 110 can be reduced, that is, the light-emitting module 10 originally has a space reserved for the driving unit on the first surface 111 It can be eliminated to avoid the problem of edge bands after the different light emitting modules 10 are combined.

從另一角度來看,發光單元120於基板110第一面111可利用的空間增加,可以讓發光單元120更均勻地分佈在基板110上。進一步而言,這樣的設計可提供較均勻分布的顯示亮度。 From another point of view, the space available for the light emitting unit 120 on the first surface 111 of the substrate 110 is increased, so that the light emitting unit 120 can be more evenly distributed on the substrate 110. Furthermore, such a design can provide a more evenly distributed display brightness.

圖3A、圖3B及圖3C為發光模組10的不同實施例背視圖。 3A, 3B and 3C are back views of different embodiments of the light-emitting module 10.

如圖3A所示,驅動單元130直接設置於第二面112。例如,採用玻璃覆晶封裝(Chip-On-Glass,COG)方式設置在第二面112。 As shown in FIG. 3A, the driving unit 130 is directly disposed on the second surface 112. For example, the chip-on-glass (COG) method is used to set on the second surface 112.

另外,在此實施例,每一發光模組10還包含可撓式線路140。可撓式線路140設置在第二面112,且電連接驅動單元130。可撓式線路140例如為軟性印刷電路板(flexible printed circuit,FPC)或可撓性扁平纜線(flexible flat cable,FFC)。 In addition, in this embodiment, each light-emitting module 10 further includes a flexible circuit 140. The flexible circuit 140 is disposed on the second surface 112 and is electrically connected to the driving unit 130. The flexible circuit 140 is, for example, a flexible printed circuit (FPC) or a flexible flat cable (FFC).

進一步而言,可撓式線路140用於傳送來自載板模組(圖未示)的訊號,其一端以熱壓方式固定於第二面112,另一端則與載板模組連接。 Furthermore, the flexible circuit 140 is used to transmit signals from the carrier module (not shown), one end of which is fixed to the second surface 112 by hot pressing, and the other end is connected to the carrier module.

如圖3B所示,第二面112可視需求增設驅動單元130。如前所述,發光單元120於基板110第一面111可利用的空間增加,可以增加發光單元120的數量。 As shown in FIG. 3B, a driving unit 130 may be added to the second surface 112 as required. As mentioned above, the space available for the light emitting unit 120 on the first surface 111 of the substrate 110 is increased, which can increase the number of light emitting units 120.

或例如,第一面111使用具有更小尺寸的發光單元120,此 時第二面112可因應發光單元120數量的增加而增設驅動單元130A。換言之,藉此設計,不僅發光單元120,對於驅動單元130的運用上也較具彈性。 Or, for example, the first surface 111 uses a light-emitting unit 120 with a smaller size. At this time, the second surface 112 can be provided with a driving unit 130A in response to the increase in the number of the light-emitting units 120. In other words, with this design, not only the light-emitting unit 120 but also the use of the driving unit 130 is more flexible.

如圖3C所示,可撓式線路140設置在第二面112。驅動單元130設置於可撓式線路140上並與可撓式線路140電連接。 As shown in FIG. 3C, the flexible circuit 140 is disposed on the second surface 112. The driving unit 130 is disposed on the flexible circuit 140 and is electrically connected to the flexible circuit 140.

例如,驅動單元130採用薄膜覆晶封裝(Chip-On-Film,COF)方式設置在第二面112。藉此,當可撓式線路140的一端以熱壓方式固定於第二面112時,即同時完成可撓式線路140和驅動單元130的設置,可簡化製作程序。 For example, the driving unit 130 is arranged on the second surface 112 in a Chip-On-Film (COF) manner. Thereby, when one end of the flexible circuit 140 is fixed to the second surface 112 by hot pressing, the flexible circuit 140 and the driving unit 130 are set up at the same time, which can simplify the manufacturing process.

另外,類似於圖3B的例子,驅動單元130於可撓式線路140上的數量亦可視需求而增加。 In addition, similar to the example in FIG. 3B, the number of driving units 130 on the flexible circuit 140 can also be increased according to demand.

圖4為拼接式光源裝置1的一實施例背視圖。為方便說明發光模組10和載板模組20的關係,圖4及後續類似的圖中未繪示穿孔。 FIG. 4 is a back view of an embodiment of the spliced light source device 1. In order to facilitate the description of the relationship between the light-emitting module 10 and the carrier module 20, the perforation is not shown in FIG. 4 and similar subsequent figures.

如圖4所示,拼接式光源裝置1包含載板模組20和多個發光模組10。載板模組20設置在第二面112且覆蓋部分的第二面112。載板模組20與每一發光模組10電連接, As shown in FIG. 4, the spliced light source device 1 includes a carrier module 20 and a plurality of light emitting modules 10. The carrier module 20 is disposed on the second surface 112 and covers part of the second surface 112. The carrier module 20 is electrically connected to each light-emitting module 10,

在此實施例,載板模組20包含電路載板21和控制載板23。電路載板21設置在第二面112且與發光模組10電連接。 In this embodiment, the carrier module 20 includes a circuit carrier 21 and a control carrier 23. The circuit carrier 21 is disposed on the second surface 112 and is electrically connected to the light-emitting module 10.

如圖4所示,電路載板21上有九個連接部142,其中八個經可撓式線路140與不同發光模組10上的驅動單元130電連接,另一個連接部142A則用於與控制載板23電連接。應理解連接部(142、142A)的數量和形式並不以此為限。控制載板23上例如可包含提供電力的元件和線路,可經由電路載板21傳送到不同的發光模組10。 As shown in FIG. 4, there are nine connecting portions 142 on the circuit carrier board 21, eight of which are electrically connected to the driving units 130 on different light-emitting modules 10 through flexible circuits 140, and the other connecting portion 142A is used to connect with The control carrier 23 is electrically connected. It should be understood that the number and form of the connecting portions (142, 142A) are not limited thereto. The control carrier 23 may include, for example, components and circuits for providing power, which can be transmitted to different light-emitting modules 10 via the circuit carrier 21.

由於每一發光模組10皆具有驅動單元130,當發現有一發光模組10的驅動單元130損壞時,僅需將該發光模組10自電路載板21的 連接部142卸下並更換新的發光模組,藉此拼接式光源裝置的運作較易於維護。 Since each light-emitting module 10 has a driving unit 130, when a driving unit 130 of a light-emitting module 10 is found to be damaged, only the light-emitting module 10 needs to be removed from the circuit carrier 21 The connecting portion 142 is removed and replaced with a new light-emitting module, so that the operation of the spliced light source device is easier to maintain.

需補充的是,在圖4的例子中,驅動單元130與可撓式線路140採用如圖3A所示的方式,在其他實施例亦可採用如圖3C的方式。此外,拼接式光源裝置1還可於基板110第一面的一側增設保護玻璃(圖未示),用以固定每一發光模組10的相對位置,使發光模組10之間的邊緣對齊。 It should be supplemented that in the example of FIG. 4, the driving unit 130 and the flexible circuit 140 adopt the method shown in FIG. 3A, and in other embodiments, the method shown in FIG. 3C may also be adopted. In addition, the spliced light source device 1 can be additionally provided with a protective glass (not shown) on one side of the first surface of the substrate 110 to fix the relative position of each light-emitting module 10 and align the edges between the light-emitting modules 10 .

圖5A-1為拼接式光源裝置1A的另一實施例背視圖。與圖4的拼接式光源裝置1A的差異在於,載板模組20上設有卡合組件。 5A-1 is a back view of another embodiment of the spliced light source device 1A. The difference from the spliced light source device 1A in FIG. 4 is that the carrier module 20 is provided with a clamping component.

如圖5A-1所示,電路載板21背向發光模組10的一面(背向第二面112)設有第二卡合件220。第二卡合件220例如為卡閘式的機構,用於與控制載板電連接。另一方面,請參考圖5A-2的發光模組10的放大剖視圖。 As shown in FIG. 5A-1, the circuit carrier board 21 is provided with a second engaging member 220 on the side facing away from the light emitting module 10 (back facing the second surface 112). The second engaging member 220 is, for example, a buckle-type mechanism for electrically connecting with the control carrier board. On the other hand, please refer to the enlarged cross-sectional view of the light emitting module 10 in FIG. 5A-2.

如圖5A-2所示,載板模組20更包含第一卡合件210,其設置在電路載板21朝向基板110的一面。第一卡合件210可具有多個,並設置對應每一發光模組10的位置。發光模組10更包含對應於第一卡合件210的第一卡合部150。 As shown in FIG. 5A-2, the carrier module 20 further includes a first engaging member 210 disposed on the side of the circuit carrier 21 facing the substrate 110. There may be a plurality of first engaging members 210, and the positions corresponding to each light emitting module 10 are arranged. The light emitting module 10 further includes a first engaging portion 150 corresponding to the first engaging member 210.

藉此,每一發光模組10可以第一卡合部150分別與電路載板21上的第一卡合件210結合,以固定每一發光模組10的相對位置,使發光模組10之間的邊緣對齊。 Thereby, each light-emitting module 10 can be combined with the first engaging member 210 on the circuit carrier board 21 by the first engaging portion 150 to fix the relative position of each light-emitting module 10 so that the light-emitting module 10 Align the edges between.

在其他實施例,第一卡合件210和第一卡合部150的設置位置可以互換,即第一卡合件210設置在第二面112,而第一卡合部150設置在電路載板21朝向基板110的一面。 In other embodiments, the positions of the first engaging member 210 and the first engaging portion 150 can be exchanged, that is, the first engaging member 210 is provided on the second surface 112, and the first engaging portion 150 is provided on the circuit carrier board. 21 faces the side of the substrate 110.

在圖5A-1的例子中,驅動單元130與可撓式線路140採用 如圖3A所示的方式,在其他實施例亦可採用如圖3C的方式。 In the example of FIG. 5A-1, the driving unit 130 and the flexible circuit 140 adopt As shown in FIG. 3A, in other embodiments, the method shown in FIG. 3C can also be adopted.

在又一實施例,第一卡合件210和第一卡合部150可作為電連接的接口,亦即,驅動單元130與載板模組20的電路載板21可經由第一卡合部150與第一卡合件210的結合而形成電連接,此時可省去可撓式線路。 In another embodiment, the first engaging member 210 and the first engaging portion 150 can be used as an electrical connection interface, that is, the driving unit 130 and the circuit carrier 21 of the carrier module 20 can pass through the first engaging portion The combination of 150 and the first engaging member 210 forms an electrical connection, and the flexible circuit can be omitted at this time.

圖5B為拼接式光源裝置1A的另一實施例背視圖。如圖5B所示,控制載板23設置在電路載板21相反於發光模組10的一面,控制載板23插置於如圖5A-1所示的第二卡合件220而完成拼接式光源裝置1A的組裝。由於每一發光模組10皆具有驅動單元130,當發現有一發光模組10的驅動單元130損壞時,僅需將該發光模組10自電路載板21的連接部142以及卡合組件卸下並更換新的發光模組,藉此拼接式光源裝置1A的運作較易於維護。 FIG. 5B is a back view of another embodiment of the spliced light source device 1A. As shown in FIG. 5B, the control carrier board 23 is disposed on the side of the circuit carrier board 21 opposite to the light emitting module 10, and the control carrier board 23 is inserted into the second engaging member 220 shown in FIG. 5A-1 to complete the splicing type. Assembly of light source device 1A. Since each light-emitting module 10 has a driving unit 130, when a driving unit 130 of a light-emitting module 10 is found to be damaged, only the light-emitting module 10 needs to be removed from the connecting portion 142 and the engaging components of the circuit carrier 21 And replace the new light-emitting module, so that the operation of the spliced light source device 1A is easier to maintain.

圖6A-1為發光模組10的另一實施例背視圖。如圖6A-1所示,發光模組10呈陣列分布,基板110第二面112上設有驅動單元130。 6A-1 is a back view of another embodiment of the light-emitting module 10. As shown in FIG. 6A-1, the light emitting modules 10 are arranged in an array, and the driving unit 130 is provided on the second surface 112 of the substrate 110.

圖6A-2為載板模組20的另一實施示意圖。如圖6A-2所示,在此實施例,載板模組20為控制整合載板,具有對應發光模組10上每一驅動單元130的多個開口230。 FIG. 6A-2 is a schematic diagram of another implementation of the carrier module 20. As shown in FIG. 6A-2, in this embodiment, the carrier module 20 is a control integrated carrier, and has a plurality of openings 230 corresponding to each driving unit 130 on the light-emitting module 10.

圖6A-3為拼接式光源裝置1B的另一實施例背視圖。如圖6A-3所示,載板模組20設置於發光模組10的第二面112而完成拼接式光源裝置1B的組裝。載板模組20覆蓋部分的第二面112。例如,發光模組10上對應驅動單元130的位置未被覆蓋,驅動單元130可經由開口230露出於載板模組20。藉此載板模組20與每一發光模組10電連接,並且固定每一發光模組10的相對位置,使發光模組10之間的邊緣對齊。 6A-3 is a back view of another embodiment of the spliced light source device 1B. As shown in FIGS. 6A-3, the carrier module 20 is disposed on the second surface 112 of the light-emitting module 10 to complete the assembly of the spliced light source device 1B. The carrier module 20 covers part of the second surface 112. For example, the position on the light-emitting module 10 corresponding to the driving unit 130 is not covered, and the driving unit 130 can be exposed from the carrier module 20 through the opening 230. Thereby, the carrier module 20 is electrically connected with each light-emitting module 10, and the relative position of each light-emitting module 10 is fixed, so that the edges between the light-emitting modules 10 are aligned.

圖6B為發光模組10的放大剖視圖。在圖6B的例子中是呈 現用於圖6A-1及圖6A-3的發光模組10。 FIG. 6B is an enlarged cross-sectional view of the light-emitting module 10. In the example of Figure 6B, It is now used in the light emitting module 10 of FIGS. 6A-1 and 6A-3.

與前述實施例的差異在於,如圖6B所示,在此實施例,發光模組10於第二面112的一側設有導電膠,用以與載板模組20電連接。具體而言,每一發光模組10於第二面112設有凸塊160,用於傳送訊號至驅動電路130,另外,凸塊160與載板模組20之間設有導電膠170(例如異方性導電膠),發光模組10可藉此利用壓合方式固定於載板模組20上,並且與載板模組20形成電連接。 The difference from the foregoing embodiment is that, as shown in FIG. 6B, in this embodiment, the light-emitting module 10 is provided with conductive glue on one side of the second surface 112 for electrical connection with the carrier module 20. Specifically, each light-emitting module 10 is provided with a bump 160 on the second surface 112 for transmitting a signal to the driving circuit 130. In addition, a conductive adhesive 170 (for example, a conductive adhesive 170) is provided between the bump 160 and the carrier module 20 Anisotropic conductive adhesive), the light-emitting module 10 can be fixed to the carrier module 20 by pressing, and form an electrical connection with the carrier module 20.

藉此設計,當發現有一發光模組10的驅動單元130損壞時,僅需將該發光模組10上的導電膠170移除以自載板模組20卸下並更換新的發光模組10,藉此拼接式光源裝置1B的運作較易於維護。 With this design, when the driving unit 130 of a light-emitting module 10 is found to be damaged, it is only necessary to remove the conductive glue 170 on the light-emitting module 10 to remove it from the carrier module 20 and replace it with a new light-emitting module 10 Therefore, the operation of the spliced light source device 1B is easier to maintain.

本發明已由上述相關實施例加以描述,然而上述實施例僅為實施本發明之範例。必需指出的是,已揭露之實施例並未限制本發明之範圍。相反地,包含於申請專利範圍之精神及範圍之修改及均等設置均包含於本發明之範圍內。 The present invention has been described by the above-mentioned related embodiments, but the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. On the contrary, modifications and equivalent arrangements included in the spirit and scope of the patent application are all included in the scope of the present invention.

1‧‧‧拼接式光源裝置 1‧‧‧ Spliced light source device

10‧‧‧發光模組 10‧‧‧Lighting Module

20‧‧‧載板模組 20‧‧‧Carrier Board Module

21‧‧‧電路載板 21‧‧‧Circuit carrier board

23‧‧‧控制載板 23‧‧‧Control Carrier Board

110‧‧‧基板 110‧‧‧Substrate

112‧‧‧第二面 112‧‧‧Second Side

130‧‧‧驅動單元 130‧‧‧Drive unit

140‧‧‧可撓式線路 140‧‧‧Flexible circuit

142,142A‧‧‧連接部 142,142A‧‧‧Connecting part

Claims (10)

一種拼接式光源裝置,包含:多個發光模組,係以陣列分布,每一發光模組包含:一基板,具有一第一面及一第二面,該第一面和該第二面位於該基板的相反側;一發光單元,位於該第一面;以及一驅動單元,位於該第二面,且與該發光單元電連接;以及一載板模組,設置在該第二面且覆蓋部分的該第二面,該載板模組與每一發光模組電連接。 A spliced light source device includes: a plurality of light-emitting modules distributed in an array, each light-emitting module includes: a substrate having a first surface and a second surface, the first surface and the second surface are located The opposite side of the substrate; a light emitting unit located on the first surface; and a driving unit located on the second surface and electrically connected to the light emitting unit; and a carrier module provided on the second surface and covering Part of the second surface, the carrier module is electrically connected to each light-emitting module. 如請求項1所述之拼接式光源裝置,其中該驅動單元直接設置於該第二面。 The spliced light source device according to claim 1, wherein the driving unit is directly arranged on the second surface. 如請求項1所述之拼接式光源裝置,其中每一發光模組還包含一可撓式線路,設置在該第二面,且該可撓式線路電連接該驅動單元與該載板模組。 The spliced light source device according to claim 1, wherein each light-emitting module further includes a flexible circuit disposed on the second surface, and the flexible circuit is electrically connected to the driving unit and the carrier module . 如請求項3所述之拼接式光源裝置,其中該驅動單元設置於該可撓式線路上。 The spliced light source device according to claim 3, wherein the driving unit is arranged on the flexible circuit. 如請求項1所述之拼接式光源裝置,其中該基板上具有多個穿孔,貫穿該第一面和該第二面,該驅動單元經由該穿孔與該發光單元電連接。 The spliced light source device according to claim 1, wherein the substrate has a plurality of through holes penetrating through the first surface and the second surface, and the driving unit is electrically connected to the light emitting unit through the through holes. 如請求項1所述之拼接式光源裝置,更包含一保護玻璃,固定於該第一面的一側。 The spliced light source device as described in claim 1, further comprising a protective glass fixed on one side of the first surface. 如請求項1所述之拼接式光源裝置,其中該載板模組更包含一第一卡合件,設置在該載板模組朝向該基板的一面,每一發光模組更包含對應於該第一卡合件的一第一卡合部。 The spliced light source device according to claim 1, wherein the carrier module further includes a first engaging member disposed on a side of the carrier module facing the substrate, and each light emitting module further includes a light emitting module corresponding to the A first engaging portion of the first engaging member. 如請求項7所述之拼接式光源裝置,其中該驅動單元與該載板模組經由 該第一卡合部與該第一卡合件的結合而形成電連接。 The spliced light source device according to claim 7, wherein the driving unit and the carrier module pass through The first engaging portion and the first engaging member are combined to form an electrical connection. 如請求項1所述之拼接式光源裝置,其中該載板模組包含:一電路載板,設置在該第二面且與該發光模組電連接;一控制載板,設置在該電路載板相反於該發光模組的一面,且與該電路載板電連接。 The spliced light source device according to claim 1, wherein the carrier module includes: a circuit carrier disposed on the second surface and electrically connected to the light-emitting module; and a control carrier disposed on the circuit carrier The board is opposite to the side of the light emitting module and is electrically connected to the circuit carrier board. 如請求項1所述之拼接式光源裝置,其中該載板模組為一控制整合載板,具有對應該些發光模組上每一驅動單元的多個開口。 The spliced light source device according to claim 1, wherein the carrier module is a control integrated carrier and has a plurality of openings corresponding to each driving unit on the light emitting modules.
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TWI793792B (en) * 2020-10-15 2023-02-21 聯詠科技股份有限公司 Led backlight driver and led driver of display pixels

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CN201138551Y (en) * 2008-01-02 2008-10-22 宝瓶国际有限公司 Circular built-up construction of LED display board
CN102888963B (en) * 2012-10-24 2014-09-17 褚文利 Display wall board capable of splitting
CN203721138U (en) * 2014-02-22 2014-07-16 广州彩熠灯光有限公司 LED screen convenient to splice
TWI532221B (en) * 2014-07-14 2016-05-01 新世紀光電股份有限公司 Light emitting unit and light emitting module
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TWI793792B (en) * 2020-10-15 2023-02-21 聯詠科技股份有限公司 Led backlight driver and led driver of display pixels
US11823635B2 (en) 2020-10-15 2023-11-21 Novatek Microelectronics Corp. LED backlight driver and LED driver of display pixels

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