TW202034356A - Inductor - Google Patents
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- TW202034356A TW202034356A TW109104914A TW109104914A TW202034356A TW 202034356 A TW202034356 A TW 202034356A TW 109104914 A TW109104914 A TW 109104914A TW 109104914 A TW109104914 A TW 109104914A TW 202034356 A TW202034356 A TW 202034356A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Soft Magnetic Materials (AREA)
Abstract
Description
本發明係關於一種電感器。The present invention relates to an inductor.
已知電感器搭載於電子機器等,被用作電壓轉換構件等無源元件。It is known that inductors are mounted on electronic devices and the like, and are used as passive components such as voltage conversion members.
例如提出一種電感器,其具備由磁性材料構成之長方體狀之晶片本體部、及埋設於該晶片本體部之內部之銅等內部導體,且晶片本體部之剖面形狀與內部導體之剖面形狀為相似形(參照專利文獻1)。即,於專利文獻1之電感器中,於剖視矩形狀(長方體狀)之配線(內部導體)之周圍被覆有磁性材料。
[先前技術文獻]
[專利文獻]For example, an inductor is proposed, which has a rectangular parallelepiped chip body made of a magnetic material, and an internal conductor such as copper embedded in the chip body, and the cross-sectional shape of the chip body is similar to the cross-sectional shape of the internal conductor Shape (refer to Patent Document 1). That is, in the inductor of
[專利文獻1]日本專利特開平10-144526號公報[Patent Document 1] Japanese Patent Laid-Open No. 10-144526
[發明所欲解決之問題][The problem to be solved by the invention]
然,研究了使用扁平狀磁性粒子等各向異性磁性粒子作為磁性材料,並使該各向異性磁性粒子於配線之周圍配向,而提高電感器之電感。However, it has been studied to use anisotropic magnetic particles such as flat magnetic particles as a magnetic material, and align the anisotropic magnetic particles around the wiring to increase the inductance of the inductor.
然而,就專利文獻1之電感器而言,由於配線為剖視矩形狀,故而產生如下不良情況,即,因存在角部等而導致難以使各向異性磁性粒子於該配線之周圍配向。因此,電感之提高有時不充分。However, in the inductor of
因此,進一步研究了使用剖視大致圓形狀之配線,並使各向異性磁性粒子於該配線之周圍配向。Therefore, further studies have been conducted to use wiring with a substantially circular cross-sectional shape and to align anisotropic magnetic particles around the wiring.
然而,於該方法中,直流重疊特性不充分,要求進一步之改良。However, in this method, the DC superimposition characteristics are insufficient, and further improvement is required.
此外,亦要求具備複數條配線之電感器。然而,當電感器具備複數條配線時,產生如下不良情況(串擾),即,相鄰之配線彼此之磁性相互影響而產生雜訊。In addition, inductors with multiple wires are also required. However, when the inductor is provided with a plurality of wirings, a disadvantage (crosstalk) occurs, that is, the magnetic interaction between adjacent wirings causes noise.
本發明提供一種電感器,其電感及直流重疊特性良好,且可抑制串擾。 [解決問題之技術手段]The invention provides an inductor which has good inductance and DC superimposition characteristics and can suppress crosstalk. [Technical means to solve the problem]
本發明[1]包含一種電感器,其具備剖視大致圓形狀之複數條配線、及被覆上述複數條配線之磁性層,上述複數條配線於第1方向上相互隔開間隔地配置,上述複數條配線分別具備導線及被覆上述導線之絕緣層,上述磁性層含有各向異性磁性粒子及黏合劑,上述磁性層於上述複數條配線之周邊區域中,分別具有:第1區域,其係上述各向異性磁性粒子沿著上述配線之圓周方向配向;及第2區域,其係上述各向異性磁性粒子未沿著上述配線之圓周方向配向;上述周邊區域係如下區域:於剖視時自上述配線之上述外表面向外側前進自上述配線之重心至上述配線之外表面之距離之1.5倍值,連結上述第2區域中之圓周方向一端與圓周方向另一端之假想圓弧之中心不存在於通過彼此相鄰之上述複數條配線之中心的第1假想線上。The present invention [1] includes an inductor comprising a plurality of wirings having a substantially circular shape in cross-section, and a magnetic layer covering the plurality of wirings, the plurality of wirings being arranged at intervals in a first direction, and the plurality of wirings Each wiring includes a wire and an insulating layer covering the wire, the magnetic layer contains anisotropic magnetic particles and a binder, and the magnetic layer has a first region in the peripheral area of the plurality of wires. The anisotropic magnetic particles are aligned along the circumferential direction of the wiring; and a second area where the anisotropic magnetic particles are not aligned along the circumferential direction of the wiring; the peripheral area is the following area: from the wiring when viewed in section The outer surface of the outer surface advances outward from the center of gravity of the wiring to the outer surface of the wiring 1.5 times the value, the center of the imaginary arc connecting one end in the circumferential direction and the other end in the circumferential direction in the second area does not exist in passing through each other The first imaginary line at the center of the adjacent plural wirings.
根據該電感器,於複數條配線之周邊分別存在各向異性磁性粒子沿著圓周方向配向之第1區域,故而電感良好。According to this inductor, the first regions in which the anisotropic magnetic particles are aligned in the circumferential direction are respectively present around the plurality of wires, so that the inductance is good.
又,於複數條配線之周邊分別存在各向異性磁性粒子未沿著上述配線之圓周方向配向之第2區域,故而直流重疊特性良好。In addition, there are second regions in which the anisotropic magnetic particles are not aligned along the circumferential direction of the wiring, respectively, around the plurality of wirings, so the DC superimposition characteristics are good.
又,第2區域之中心不存在於通過彼此相鄰之上述複數條配線之中心的第1假想線上。因此,可增加磁通經由第2區域自一配線到達另一配線之距離。即,可實質地增加配線間之磁通之距離。因此,可減小自一配線對另一配線之磁性之影響,且可抑制串擾。In addition, the center of the second area does not exist on the first virtual line passing through the centers of the plurality of wirings adjacent to each other. Therefore, it is possible to increase the distance of magnetic flux from one wiring to another wiring through the second area. That is, the distance of magnetic flux between wirings can be substantially increased. Therefore, the influence of one wiring on the magnetic properties of another wiring can be reduced, and crosstalk can be suppressed.
本發明[2]包含如[1]所記載之電感器,其中上述假想圓弧之中心位於上述第1假想線與第2假想線之間,上述第2假想線通過上述配線之中心且與上述第1假想線正交。The present invention [2] includes the inductor as described in [1], wherein the center of the imaginary arc is located between the first imaginary line and the second imaginary line, and the second imaginary line passes through the center of the wiring and is connected to the The first imaginary line is orthogonal.
根據該電感器,於一磁性層配置複數條配線,繼而,以埋設複數條配線之方式,於一磁性層積層另一磁性層,藉此可製造第2區域之中心位於第1假想線與第2假想線之間之電感器。因此,可容易地製造如[1]所記載之電感器。 [發明之效果]According to this inductor, a plurality of wirings are arranged on one magnetic layer, and then, a plurality of wirings are buried, and another magnetic layer is laminated on one magnetic layer, whereby the center of the second region can be manufactured between the first imaginary line and the first imaginary line. 2 Inductors between imaginary lines. Therefore, the inductor as described in [1] can be easily manufactured. [Effects of Invention]
根據本發明之電感器,電感及直流重疊特性良好,且可抑制串擾。According to the inductor of the present invention, the inductance and DC superimposition characteristics are good, and crosstalk can be suppressed.
於圖1A中,紙面左右方向為第1方向,紙面左側為第1方向一側,且紙面右側為第1方向另一側。紙面上下方向為第2方向(與第1方向正交之方向),紙面上側為第2方向一側(配線軸向之一方向),紙面下側為第2方向另一側(配線軸之另一方向)。紙面紙厚方向為上下方向(與第1方向及第2方向正交之第3方向、厚度方向),紙面近前側為上側(第3方向一側、厚度方向一側),紙面裏側為下側(第3方向另一側、厚度方向另一側)。具體而言,依據各圖之方向箭頭。In FIG. 1A, the left-right direction on the paper is the first direction, the left side of the paper is one side in the first direction, and the right side of the paper is the other side in the first direction. The up and down direction on the paper is the second direction (the direction orthogonal to the first direction), the upper side of the paper is one side of the second direction (one direction of the wiring axis), and the lower side of the paper is the other side of the second direction (the other side of the wiring axis). One direction). The paper thickness direction of the paper is the vertical direction (the third direction orthogonal to the first and second directions, the thickness direction), the near side of the paper is the upper side (the third direction side, the thickness direction side), and the back side of the paper is the lower side (The other side in the third direction, the other side in the thickness direction). Specifically, according to the direction arrows in each figure.
<一實施形態> 1.電感器 參照圖1A-圖2來說明本發明之電感器之一實施形態。<One embodiment> 1. Inductor An embodiment of the inductor of the present invention will be described with reference to FIGS. 1A-2.
如圖1A-B所示,電感器1具有於面方向(第1方向及第2方向)上延伸之俯視大致矩形狀。As shown in FIGS. 1A-B, the
如圖1A-圖2所示,電感器1具備複數條(2條)配線2、及磁性層3。As shown in FIGS. 1A-2, the
複數條配線2分別具備第1配線4及第2配線5,該第2配線5於寬度方向(第1方向)上與第1配線4隔開間隔地配置。The plurality of
如圖1A-B所示,第1配線4於第2方向上較長地延伸,且例如具有俯視大致U字形狀。如圖2所示,第1配線4具有剖視大致圓形狀。As shown in FIGS. 1A-B, the
第1配線4具備導線6、及被覆該導線6之絕緣層7。The
導線6於第2方向上較長地延伸,且例如具有俯視大致U字形狀。又,導線6具有與第1配線4共有中心軸線之剖視大致圓形狀。The
導線6之材料例如為銅、銀、金、鋁、鎳或及其等之合金等金屬導體,較佳為列舉銅。導線6可為單層構造,亦可為於芯導體(例如銅)之表面進行了鍍覆(例如鎳)等之複層構造。The material of the
導線6之半徑R1例如為25 μm以上,較佳為50 μm以上,且例如為2000 μm以下,較佳為200 μm以下。The radius R1 of the
絕緣層7係用於保護導線6不受化學品或水侵蝕,且防止導線6短路之層。絕緣層7以被覆導線6之整個外周面之方式配置。The
絕緣層7具有與第1配線4共有中心軸線(中心C1)之剖視大致圓環形狀。The
作為絕緣層7之材料,例如可列舉聚乙烯醇縮甲醛、聚酯、聚酯醯亞胺、聚醯胺(包含尼龍)、聚醯亞胺、聚醯胺醯亞胺及聚胺基甲酸酯等絕緣性樹脂。該等材料可單獨使用1種,亦可併用2種以上。As the material of the
絕緣層7可由單層構成,亦可由複數層構成。The
絕緣層7之厚度R2於圓周方向之任一位置處在配線2之徑向上大致均一,例如為1 μm以上,較佳為3 μm以上,且例如為100 μm以下,較佳為50 μm以下。The thickness R2 of the
導線6之半徑R1與絕緣層7之厚度R2之比(R1/R2)例如為1以上,較佳為10以上,且例如為200以下,較佳為100以下。The ratio (R1/R2) of the radius R1 of the
第1配線4之半徑(R1+R2)例如為25 μm以上,較佳為50 μm以上,且例如為2000 μm以下,較佳為200 μm以下。The radius (R1+R2) of the
於第1配線4為大致U字形狀之情形時,第1配線4之中心間距離D2與下述複數條配線2間之中心間距離D1為相同距離,例如為20 μm以上,較佳為50 μm以上,且例如為3000 μm以下,較佳為2000 μm以下。When the
第2配線5為與第1配線4相同之形狀,且具有相同之構成、尺寸及材料。即,第2配線5與第1配線4同樣地,具備導線6及被覆該導線6之絕緣層7。The
第1配線4與第2配線5之中心間距離D1例如為20 μm以上,較佳為50 μm以上,且例如為3000 μm以下,較佳為2000 μm以下。The distance D1 between the centers of the
磁性層3係用以提高電感之層。The
磁性層3配置為被覆複數條配線2之整個外周面。磁性層3形成電感器1之外形。具體而言,磁性層3具有於面方向(第1方向及第2方向)上延伸之俯視大致矩形狀。又,磁性層3於其第2方向之另一表面,露出複數條配線2之第2方向端緣The
磁性層3由含有各向異性磁性粒子8及黏合劑9之磁性組合物形成。The
作為構成各向異性磁性粒子(以下,亦簡稱為「粒子」)8之磁性材料,可列舉軟磁體、硬磁體。自電感之觀點來看,較佳為列舉軟磁體。Examples of the magnetic material constituting the anisotropic magnetic particles (hereinafter, also simply referred to as "particles") 8 include soft magnets and hard magnets. From the viewpoint of inductance, it is preferable to use soft magnetic materials.
作為軟磁體,例如可列舉以純物質狀態包含1種金屬元素之單一金屬體、及例如1種以上之金屬元素(第1金屬元素)與1種以上之金屬元素(第2金屬元素)及/或非金屬元素(碳、氮、矽、磷等)之共熔體(混合物)即合金體。該等可單獨使用或併用。As the soft magnetic material, for example, a single metal body containing one metal element in a pure state, and for example, one or more metal elements (first metal element) and one or more metal elements (second metal element) and/or The eutectic (mixture) of non-metallic elements (carbon, nitrogen, silicon, phosphorus, etc.) is the alloy body. These can be used alone or in combination.
作為單一金屬體,例如可列舉僅由1種金屬元素(第1金屬元素)構成之金屬單質。作為第1金屬元素,例如自鐵(Fe)、鈷(Co)、鎳(Ni)及其他作為軟磁體之第1金屬元素而含有之金屬元素中適當選擇。As the single metal body, for example, a metal element composed of only one type of metal element (first metal element) can be cited. As the first metal element, for example, iron (Fe), cobalt (Co), nickel (Ni), and other metal elements contained as the first metal element of the soft magnetic material are appropriately selected.
又,作為單一金屬體,例如可列舉包括僅包含1種金屬元素之芯、及修飾該芯之表面一部分或全部之包含無機物及/或有機物質之表面層的形態、例如包含第1金屬元素之有機金屬化合物或無機金屬化合物經分解(例如熱分解)後的形態。作為後一種形態,更具體而言,可列舉包含鐵作為第1金屬元素之有機鐵化合物(具體而言為羰基鐵)經熱分解所得之鐵粉(有時稱為羰基鐵粉)等。再者,修飾僅包含1種金屬元素之部分之包含無機物質及/或有機物質之層的位置不限於如上所述之表面。再者,作為可獲得單一金屬體之有機金屬化合物或無機金屬化合物,並無特別限定,可自能獲得軟磁體之單一金屬體之公知或常用之有機金屬化合物或無機金屬化合物中適當選擇。In addition, as a single metal body, for example, a form including a core containing only one metal element and a surface layer containing an inorganic substance and/or organic substance that modifies a part or all of the surface of the core, such as a form containing a first metal element The form of an organic metal compound or an inorganic metal compound after decomposition (for example, thermal decomposition). As the latter form, more specifically, iron powder (sometimes referred to as carbonyl iron powder) obtained by thermal decomposition of an organic iron compound (specifically, carbonyl iron) containing iron as the first metal element, and the like. Furthermore, the position of the layer containing the inorganic substance and/or the organic substance that modifies the part containing only one metal element is not limited to the surface as described above. Furthermore, the organometallic compound or inorganic metal compound that can obtain a single metal body is not particularly limited, and it can be appropriately selected from known or commonly used organometallic compounds or inorganic metal compounds that can obtain a single metal body for soft magnets.
合金體係1種以上之金屬元素(第1金屬元素)與1種以上之金屬元素(第2金屬元素)及/或非金屬元素(碳、氮、矽、磷等)之共熔體,只要為可用作軟磁體之合金體者,則並無特別限定。Alloy system The eutectic of more than one metal element (first metal element) and more than one metal element (second metal element) and/or non-metal elements (carbon, nitrogen, silicon, phosphorus, etc.), as long as it is There are no particular restrictions on what can be used as an alloy body for soft magnetic materials.
第1金屬元素係合金體中之必需元素,例如可列舉鐵(Fe)、鈷(Co)、鎳(Ni)等。再者,若第1金屬元素為Fe,則合金體係設為Fe系合金,若第1金屬元素為Co,則合金體係設為Co系合金,若第1金屬元素為Ni,則合金體係設為Ni系合金。The essential elements in the first metal element-based alloy body include, for example, iron (Fe), cobalt (Co), nickel (Ni), and the like. Furthermore, if the first metal element is Fe, the alloy system is set to Fe-based alloy; if the first metal element is Co, the alloy system is set to Co-based alloy; if the first metal element is Ni, the alloy system is set to Ni-based alloy.
第2金屬元素係合金體中次要地含有之元素(副成分),且係與第1金屬元素相容(共熔)之金屬元素,例如可列舉鐵(Fe)(第1金屬為Fe以外之元素時)、鈷(Co)(第1金屬元素為Co以外之元素時)、鎳(Ni)(第1金屬元素為Ni以外之元素時)、鉻(Cr)、鋁(Al)、矽(Si)、銅(Cu)、銀(Ag)、錳(Mn)、鈣(Ca)、鋇(Ba)、鈦(Ti)、鋯(Zr)、鉿(Hf)、釩(V)、鈮(Nb)、鉭(Ta)、鉬(Mo)、鎢(W)、釕(Ru)、銠(Rh)、鋅(Zn)、鎵(Ga)、銦(In)、鍺(Ge)、錫(Sn)、鉛(Pb)、鈧(Sc)、釔(Y)、鍶(Sr)及各種稀土元素等。該等可單獨使用或併用2種以上。The second metal element is an element (secondary component) contained in the alloy body and is compatible (eutectic) with the first metal element. For example, iron (Fe) (the first metal is other than Fe) (When the first metal element is an element other than Co), cobalt (Co) (when the first metal element is an element other than Co), nickel (Ni) (when the first metal element is an element other than Ni), chromium (Cr), aluminum (Al), silicon (Si), copper (Cu), silver (Ag), manganese (Mn), calcium (Ca), barium (Ba), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), molybdenum (Mo), tungsten (W), ruthenium (Ru), rhodium (Rh), zinc (Zn), gallium (Ga), indium (In), germanium (Ge), tin (Sn), lead (Pb), scandium (Sc), yttrium (Y), strontium (Sr) and various rare earth elements. These can be used individually or in combination of 2 or more types.
非金屬元素係合金體中次要地含有之元素(副成分),且係與第1金屬元素相容(共熔)之非金屬元素,例如可列舉硼(B)、碳(C)、氮(N)、矽(Si)、磷(P)、硫(S)等。該等可單獨使用或併用2種以上。The non-metallic element is an element (secondary component) contained in the alloy body and is compatible (eutectic) with the first metal element. For example, boron (B), carbon (C), nitrogen (N), silicon (Si), phosphorus (P), sulfur (S), etc. These can be used individually or in combination of 2 or more types.
作為合金體之一例之Fe系合金,例如可列舉磁性不鏽鋼(Fe-Cr-Al-Si合金)(包含電磁不鏽鋼)、鐵矽鋁合金(Fe-Si-Al合金)(包含超級鐵矽鋁合金)、坡莫合金(Fe-Ni合金)、Fe-Ni-Mo合金、Fe-Ni-Mo-Cu合金、Fe-Ni-Co合金、Fe-Cr合金、Fe-Cr-Al合金、Fe-Ni-Cr合金、Fe-Ni-Cr-Si合金、矽銅(Fe-Cu-Si合金)、Fe-Si合金、Fe-Si-B(-Cu-Nb)合金、Fe-B-Si-Cr合金、Fe-Si-Cr-Ni合金、Fe-Si-Cr合金、Fe-Si-Al-Ni-Cr合金、Fe-Ni-Si-Co合金、Fe-N合金、Fe-C合金、Fe-B合金、Fe-P合金、鐵氧體(包含不鏽鋼系鐵氧體、進而Mn-Mg系鐵氧體、Mn-Zn系鐵氧體、Ni-Zn系鐵氧體、Ni-Zn-Cu系鐵氧體、Cu-Zn系鐵氧體、Cu-Mg-Zn系鐵氧體等軟鐵氧體、鐵鈷合金(Fe-Co合金)、Fe-Co-V合金、Fe基非晶合金等。Fe-based alloys as an example of the alloy body include magnetic stainless steel (Fe-Cr-Al-Si alloy) (including electromagnetic stainless steel), iron-silicon aluminum alloy (Fe-Si-Al alloy) (including super iron-silicon aluminum alloy) ), Permalloy (Fe-Ni alloy), Fe-Ni-Mo alloy, Fe-Ni-Mo-Cu alloy, Fe-Ni-Co alloy, Fe-Cr alloy, Fe-Cr-Al alloy, Fe-Ni -Cr alloy, Fe-Ni-Cr-Si alloy, silicon copper (Fe-Cu-Si alloy), Fe-Si alloy, Fe-Si-B (-Cu-Nb) alloy, Fe-B-Si-Cr alloy , Fe-Si-Cr-Ni alloy, Fe-Si-Cr alloy, Fe-Si-Al-Ni-Cr alloy, Fe-Ni-Si-Co alloy, Fe-N alloy, Fe-C alloy, Fe-B Alloys, Fe-P alloys, ferrites (including stainless steel ferrites, Mn-Mg ferrites, Mn-Zn ferrites, Ni-Zn ferrites, Ni-Zn-Cu ferrites Ferrite, Cu-Zn ferrite, Cu-Mg-Zn ferrite and other soft ferrites, iron-cobalt alloy (Fe-Co alloy), Fe-Co-V alloy, Fe-based amorphous alloy, etc.
作為合金體之一例之Co系合金,例如可列舉Co-Ta-Zr及鈷(Co)基非晶合金等。Examples of Co-based alloys of alloy bodies include Co-Ta-Zr and cobalt (Co)-based amorphous alloys.
作為合金體之一例之Ni系合金,例如可列舉Ni-Cr合金等。As an example of an alloy body, Ni-based alloys include, for example, Ni-Cr alloys.
於該等軟磁體中,自磁特性之觀點來看,較佳為列舉合金體,更佳為列舉Fe系合金,進而較佳為列舉鐵矽鋁合金(Fe-Si-Al合金)。又,作為軟磁體,較佳為列舉單一金屬體,更佳為列舉以純物質狀態包含鐵元素之單一金屬體,進而較佳為列舉鐵單質或者鐵粉(羰基鐵粉)。Among these soft magnets, from the standpoint of self-magnetic properties, alloy bodies are preferably cited, Fe-based alloys are more preferably cited, and iron-silicon aluminum alloys (Fe-Si-Al alloys) are more preferably cited. In addition, as the soft magnetic material, a single metal body is preferably used, a single metal body containing an iron element in a pure state is more preferably used, and an iron element or iron powder (carbonyl iron powder) is more preferably used.
作為粒子8之形狀,自各向異性之觀點來看,例如可列舉扁平狀(板狀)、針狀等,自面方向(二維)上相對磁導率良好之觀點來看,較佳為列舉扁平狀。再者,磁性層3除含有各向異性磁性粒子8以外,亦可進而含有非各向異性磁性粒子。非各向異性磁性粒子可具有例如球狀、顆粒狀、塊狀及團狀等形狀。非各向異性磁性粒子之平均粒徑例如為0.1 μm以上,較佳為0.5 μm以上,且例如為200 μm以下,較佳為150 μm以下。As the shape of the
再者,扁平狀之粒子8之扁率(扁平度)例如為8以上,較佳為15以上,且例如為500以下,較佳為450以下。扁率係例如設為將粒子8之平均粒徑(平均長度)(下述)除以粒子8之平均厚度所得之縱橫比而算出。Furthermore, the flatness (flatness) of the
粒子8(各向異性磁性粒子)之平均粒徑(平均長度)例如為3.5 μm以上,較佳為10 μm以上,且例如為200 μm以下,較佳為150 μm以下。若粒子8為扁平狀,則其平均厚度例如為0.1 μm以上,較佳為0.2 μm以上,且例如為3.0 μm以下,較佳為2.5 μm以下。The average particle diameter (average length) of the particles 8 (anisotropic magnetic particles) is, for example, 3.5 μm or more, preferably 10 μm or more, and for example, 200 μm or less, preferably 150 μm or less. If the
作為黏合劑9,例如可列舉熱硬化性樹脂及熱塑性樹脂。Examples of the
作為熱硬化性樹脂,例如可列舉環氧樹脂、酚系樹脂、三聚氰胺樹脂、熱硬化性聚醯亞胺樹脂、不飽和聚酯樹脂、聚胺基甲酸酯樹脂及矽酮樹脂等。自接著性、耐熱性等觀點來看,較佳為列舉環氧樹脂、酚系樹脂。Examples of thermosetting resins include epoxy resins, phenol resins, melamine resins, thermosetting polyimide resins, unsaturated polyester resins, polyurethane resins, and silicone resins. From the viewpoints of adhesiveness, heat resistance, etc., preferably, epoxy resins and phenol resins are used.
作為熱塑性樹脂,例如可列舉丙烯酸系樹脂、乙烯-乙酸乙烯酯共聚物、聚碳酸酯樹脂、聚醯胺樹脂(6-尼龍、6,6-尼龍等)、熱塑性聚醯亞胺樹脂、飽和聚酯樹脂(PET(Polyethylene terephthalate,聚對苯二甲酸乙二酯)、PBT(Polybutylene terephthalate,聚對苯二甲酸丁二酯)等)等。較佳為列舉丙烯酸系樹脂。Examples of thermoplastic resins include acrylic resins, ethylene-vinyl acetate copolymers, polycarbonate resins, polyamide resins (6-nylon, 6,6-nylon, etc.), thermoplastic polyimide resins, and saturated polyamide resins. Ester resins (PET (Polyethylene terephthalate, polyethylene terephthalate), PBT (Polybutylene terephthalate, polybutylene terephthalate), etc.) and the like. Preferably, acrylic resin is used.
作為黏合劑9,較佳為列舉熱硬化性樹脂及熱塑性樹脂之併用。更佳為列舉丙烯酸系樹脂、環氧樹脂及酚系樹脂之併用。藉此,能夠將粒子8以特定之配向狀態且高填充度,更確實地固定於配線2之周圍。As the
又,磁性組合物亦可視需要含有添加劑,例如熱硬化觸媒、無機粒子、有機粒子及交聯劑等。In addition, the magnetic composition may optionally contain additives such as thermosetting catalysts, inorganic particles, organic particles, and crosslinking agents.
於磁性層3中,粒子8於黏合劑9內配向並且均勻地配置。In the
磁性層3於剖視時具有周邊區域11及外側區域12。The
周邊區域11係配線2之周邊區域,以與複數條配線2接觸之方式位於複數條配線2之周圍。周邊區域11具有與配線2共有中心軸線之剖視大致圓環狀。更具體而言,周邊區域11係磁性層3中之自配線2之外周面朝徑向外側前進配線2之半徑(自配線2之中心(重心)C1至外周面之距離;R1+R2)之1.5倍值(較佳為1.2倍值,更佳為1倍值,進而較佳為0.8倍值,特佳為0.5倍值)的區域。The
周邊區域11配置於複數條配線2各自之周圍、即、第1配線4及第2配線5之周圍。The
周邊區域11分別具備複數個(2個)第1區域13及複數個(2個)第2區域14。The
複數個第1區域13係圓周方向配向區域。即,於第1區域13中,粒子8沿著配線2(第1配線4或第2配線5)之圓周方向配向。The plurality of
複數個第1區域13隔著配線2之中心C1相互對向配置於配線2之上側(第3方向一側)及下側(第3方向另一側)。即,複數個第1區域13具備配置於配線2上側之上側第1區域15、及配置於配線2下側之下側第1區域16。又,配線2之中心C1位於上側第1區域15與下側第1區域16之上下方向中央。The plurality of
於各第1區域13中,粒子8之相對磁導率較高之方向(例如,就扁平狀各向異性磁性粒子而言為粒子之面方向)與以配線2之中心C1為中心之圓之切線大致一致。更具體而言,將粒子8之面方向與該粒子8所處之圓之切線所成的角度為15°以下之情形定義為粒子8沿圓周方向配向。In each
沿圓周方向配向之粒子8之數量相對於第1區域13中所包含之粒子8之總數的比率例如超過50%,較佳為70%以上,更佳為80%以上。即,第1區域13中可包含例如未達50%,較佳為30%以下,更佳為20%以下之未沿圓周方向配向之粒子8。The ratio of the number of
相對於整個周邊區域11,複數個第1區域13之總面積比率例如為40%以上,較佳為50%以上,更佳為60%以上,且例如為90%以下,較佳為80%以下。With respect to the entire
第1區域13之圓周方向之相對磁導率例如為5以上,較佳為10以上,更佳為30以上,且例如為500以下。徑向之相對磁導率例如為1以上,較佳為5以上,且例如為100以下,較佳為50以下,更佳為25以下。又,圓周方向相對於徑向之相對磁導率之比(圓周方向/徑向)例如為2以上,較佳為5以上,且例如為50以下。若相對磁導率處於上述範圍,則電感優異。The relative permeability in the circumferential direction of the
相對磁導率例如可藉由使用磁性材料測試夾具之阻抗分析器(Agilent公司製造,「4291B」)來測定。The relative permeability can be measured, for example, by an impedance analyzer (manufactured by Agilent, "4291B") using a magnetic material test fixture.
複數個第2區域14係圓周方向非配向區域。即,於第2區域14中,粒子8未沿著配線2之圓周方向配向。換言之,於第2區域14中,粒子8沿著配線2之圓周方向以外之方向(例如第1方向或徑向)配向或不沿著配線2之圓周方向以外之方向配向。The plurality of
複數個第2區域14隔著配線2相互對向配置於配線2之第1方向一側及另一側。即,複數個第2區域14具有配置於配線2(第1配線4或第2配線5)之第1方向一側之一側第2區域17、及配置於配線2之第1方向另一側之另一側第2區域18。一側第2區域17與另一側第2區域18以第2假想線L3為基準大致線對稱。The plurality of
再者,第2假想線L3係通過第1配線4或第2配線5之中心C1且於上下方向上延伸之直線。Furthermore, the second imaginary line L3 is a straight line passing through the center C1 of the
於各第2區域14中,粒子8之相對磁導率較高之方向(例如,就扁平狀各向異性磁性粒子而言為粒子之面方向)與以配線2之中心C1為中心之圓之切線不一致。更具體而言,將粒子8之面方向與該粒子8所處之圓之切線所成的角度超過15°之情形定義為粒子8未沿圓周方向配向。In each
未沿圓周方向配向之粒子8之數量相對於第2區域14中所包含之粒子8之總數的比率超過50%,較佳為70%以上,且例如為95%以下,較佳為90%以下。The ratio of the number of
於第2區域14中,例如可包含沿圓周方向配向之粒子8。沿圓周方向配向之粒子8之數量相對於第2區域14中所包含之粒子8之總數的比率未達50%,較佳為30%以下,且例如為5%以上,較佳為10%以上。The
再者,於包含沿圓周方向配向之粒子8之情形時,較佳為,上述沿圓周方向配向之粒子8配置於第2區域14之最內側、即配線2之表面。Furthermore, when the
複數個第2區域14之總面積比率相對於整個周邊區域11例如為10%以上,較佳為20%以上,且例如為60%以下,較佳為50%以下,更佳為40%以下。The total area ratio of the plurality of
第2區域14之中心C2不存在於第1假想線L2上。即,中心C2相對於第1假想線L2位於下方,較佳為相對於第1假想線L2以半徑R之0.1倍之距離位於下方,更佳為相對於第1假設線L2以半徑R之0.3倍之距離位於下方。更具體而言,中心C2較佳為相對於第1假想線L2位於下方10 μm處,更佳為相對於第1假想線L2位於下方30 μm處。The center C2 of the
又,第2區域14之中心C2位於第1假想線L2與第2假想線L3之間。即,第2區域14之中心C2不存在於第1假想線L2及第2假想線L3中之任一條線上。In addition, the center C2 of the
再者,第2區域14之中心C2係於第2區域14中連結圓周方向一端與圓周方向另一端之假想圓弧L1之中心。更具體而言,第2區域14之中心C2係於第2區域14中連結圓周方向一端緣之徑向中心與圓周方向另一端緣之徑向中心的假想圓弧L1之中心。Furthermore, the center C2 of the
第1假想線L2係通過彼此相鄰之複數條配線2之中心C1,且於第1方向上延伸之直線。The first imaginary line L2 is a straight line extending in the first direction through the center C1 of the plurality of
於第2區域14中,藉由配向方向不同之至少2種粒子8形成交叉部(頂部)19。即,於第2區域14內相對位於上側且隨著於配線2之圓周方向上趨向第2區域14之下端側而自圓周方向朝第1方向配向的粒子8(第1粒子)與於第2區域14內相對位於下方(較第1粒子靠下側)且隨著於圓周方向上趨向第2區域14之上端側而自圓周方向朝第1方向配向的粒子8(第2粒子)構成大致三角形之至少2邊,藉此形成交叉部19。具體而言,第1粒子與第2粒子連同於第2區域14之內側沿圓周方向配向之粒子8(第3粒子)形成大致三角形(較佳為銳角三角形)。In the
交叉部19不存在於在第1配線4及第2配線5之間通過其等之中心之第1假想線L2上。即,交叉部19於第1假想線L2之下側,配置於與第1假想線L2隔開間隔之位置。更具體而言,連結交叉部19之中心及配線2之中心C1之直線與第1假想線L2所成之角度θ例如為15°以上,較佳為45°以上,且例如為75°以下,較佳為60°以下。The
於周邊區域11(特別是第1區域13及第2區域14之各者)中,粒子8之填充率例如為40體積%以上,較佳為45體積%以上,且例如為90體積%以下,較佳為70體積%以下。若填充率為上述下限以上,則電感優異。In the peripheral region 11 (especially each of the
填充率可藉由實際比重之測定、SEM照片剖視圖之二值化等算出。The filling rate can be calculated by measuring the actual specific gravity, binarizing the cross-sectional view of the SEM photograph, etc.
於周邊區域11中,複數個第1區域13與複數個第2區域14以於圓周方向上相互鄰接之方式配置。具體而言,上側第1區域15、一側第2區域17、下側第1區域16及另一側第2區域18依序於圓周方向上連續。再者,第1區域13與第2區域14之圓周方向上之邊界(一端緣或另一端緣)係設為自配線2之中心朝徑向外側延伸之假想直線。In the
外側區域12係磁性層3中之除周邊區域11以外之區域。外側區域12配置為於周邊區域11之外側,與周邊區域11連續。The
於外側區域12中,粒子8沿著面方向(特別是第1方向)配向。In the
於外側區域12中,粒子8之相對磁導率較高之方向(例如,就扁平狀各向異性磁性粒子而言為粒子之面方向)與第1方向大致一致。更具體而言,將粒子8之面方向與第1方向所成之角度為15°以下之情形定義為粒子8於第1方向上配向。In the
於外側區域12中,於第1方向上配向之粒子8之數量相對於外側區域12中所包含之粒子8之總數的比率超過50%,較佳為70%以上,更佳為90%以上。即,於外側區域12中可包含未達50%,較佳為30%以下,更佳為10%以下之未於第1方向上配向之粒子8。In the
於外側區域12中,第1方向之相對磁導率例如為5以上,較佳為10以上,更佳為30以上,且例如為500以下。上下方向之相對磁導率例如為1以上,較佳為5以上,且例如為100以下,較佳為50以下,更佳為25以下。又,第1方向相對於上下方向之相對磁導率之比(第1方向/上下方向)例如為2以上,較佳為5以上,且例如為50以下。若相對磁導率處於上述範圍內,則電感優異。In the
於外側區域12中,粒子8之填充率例如為40體積%以上,較佳為45體積%以上,且例如為90體積%以下,較佳為70體積%以下。若填充率為上述下限以上,則電感優異。In the
磁性層3之第1方向長度T1
例如為5 mm以上,較佳為10 mm以上,且例如為5000 mm以下,較佳為2000 mm以下。The first direction length T 1 of the
磁性層3之第2方向長度T2
例如為5 mm以上,較佳為10 mm以上,且例如為5000 mm以下,較佳為2000 mm以下。The second direction length T 2 of the
磁性層3之上下方向長度(厚度)T3
例如為100 μm以上,較佳為200 μm以上,且例如為2000 μm以下,較佳為1000 μm以下。The upper and lower length (thickness) T 3 of the
2.電感器之製造方法
參照圖3A-B,對電感器1之製造方法之一實施形態進行說明。電感器1之製造方法例如依序具備準備步驟、配置步驟及積層步驟。2. Manufacturing method of inductor
3A-B, an embodiment of the manufacturing method of the
於準備步驟中,準備複數條配線2及2片各向異性磁性片材20。In the preparation step, a plurality of
2片各向異性磁性片材20分別具有於面方向上延伸之片狀,且由磁性組合物形成。於各向異性磁性片材20中,粒子8於面方向上配向。較佳為,使用2片半硬化狀態(B階段)之各向異性磁性片材20。The two anisotropic
作為此種各向異性磁性片材20,可列舉日本專利特開2014-165363號、日本專利特開2015-92544號等中所記載之軟磁性熱硬化性接著膜或軟磁性膜等。As such an anisotropic
於配置步驟中,如圖3A所示,於其中一片各向異性磁性片材20之上表面配置複數條配線2,並且於複數條配線2之上方對向配置另一片各向異性磁性片材20。In the arrangement step, as shown in FIG. 3A, a plurality of
具體而言,將下側各向異性磁性片材21載置於水平台,繼而,於下側各向異性磁性片材21之上表面在第1方向上隔開所期望之間隔配置複數條配線2。Specifically, the lower anisotropic
隨後,將上側各向異性磁性片材22以隔開間隔之方式對向配置於下側各向異性磁性片材21及複數條配線2之上側。Subsequently, the upper anisotropic
於積層步驟中,如圖3B所示,以埋設複數條配線2之方式將2片各向異性磁性片材20積層。In the layering step, as shown in FIG. 3B, two anisotropic
具體而言,將上側各向異性磁性片材22朝向下側按壓。Specifically, the upper anisotropic
此時,當2片各向異性磁性片材20處於半硬化狀態時,複數條配線2藉由按壓而略微陷入下側各向異性磁性片材21內,於陷入部分中,粒子8沿著複數條配線2配向。即,形成下側第1區域16。At this time, when the two anisotropic
又,上側各向異性磁性片材22係沿著複數條配線2被覆,該粒子8沿著複數條配線2配向,並且積層於下側各向異性磁性片材21之上表面。即,於配線2之上側,藉由上側各向異性磁性片材22形成上側第1區域15,並且於配線2之第1方向兩側(側方),在下側各向異性磁性片材21與上側各向異性磁性片材22接觸之附近,於該等片材中配向之粒子8發生碰撞,其結果,形成第2區域14及交叉部19。In addition, the upper anisotropic
再者,當各向異性磁性片材20為半硬化狀態時,將其加熱。藉此,各向異性磁性片材20成為硬化狀態(C階段)。又,2片各向異性磁性片材20之接觸界面25消失,2片各向異性磁性片材20形成一個磁性層3。Furthermore, when the anisotropic
藉此,如圖2所示,獲得電感器1,其具備剖視大致圓形狀之配線2及被覆該配線2之磁性層3。即,電感器1係將複數片(2片)各向異性磁性片材20以夾著配線2之方式積層而成者。再者,將實際之電感器1之一例之剖視圖(SEM照片)示於圖4中。Thereby, as shown in FIG. 2, an
3.用途
電感器1係電子機器之一零件、即用以製作電子機器之零件,且係不包含電子元件(晶片、電容器等)或供安裝電子元件之安裝基板,而以單個零件之形式流通,可於產業上利用之器件。3.
電感器1例如搭載(組裝)於電子機器等。雖未圖示,但電子機器具備安裝基板及安裝於安裝基板之電子元件(晶片、電容器等)。而且,電感器1經由焊料等連接構件安裝於安裝基板,且與其他電子機器電性連接,作為線圈等無源元件發揮作用。The
而且,根據電感器1,於複數條配線2之周邊區域11,分別存在粒子8沿著圓周方向配向之第1區域13,故而電感良好。Furthermore, according to the
又,於複數條配線2之周邊區域11,分別存在粒子8未沿著圓周方向配向之第2區域14,故而直流重疊特性良好。In addition, in the
又,第2區域14之中心C2不存在於第1假想線L2上。因此,可增加磁通自第1配線4經由第2區域14到達第2配線5之距離。即,可實質地增加配線2間之供磁通通過之距離。因此,可減小自第1配線4對第2配線5之磁性相關之影響,可抑制串擾。In addition, the center C2 of the
又,第2區域14之中心C2於圓周方向上位於第1假想線L2與第2假想線L3之間。因此,如圖3A-B所示,於下側各向異性磁性片材21之上表面配置複數條配線2,繼而,以埋設複數條配線2之方式,將上側各向異性磁性片材22積層於下側各向異性磁性片材21,藉此可容易地將第2區域14配置於上述位置。因此,可容易地獲得電感及直流特性疊加良好且可抑制串擾之電感器1。In addition, the center C2 of the
<變化例> 參照圖5,對圖1A-圖2所示之一實施形態之變化例進行說明。再者,於變化例中,對與上述一實施形態相同之構件附上相同之符號,並省略其說明。對該等變化例亦發揮與上述一實施形態等相同之作用效果。<Change example> Referring to Fig. 5, a modification example of the embodiment shown in Figs. 1A-2 will be described. In addition, in the modified example, the same reference numerals are attached to the same members as the above-mentioned embodiment, and the description thereof is omitted. The same effects as in the above-mentioned embodiment etc. are exerted on these modified examples.
於圖2所示之實施形態中,交叉部19之上下方向位置為配線2之中心C1與配線2之最下端之間,但例如如圖5所示,交叉部19之上下方向位置可設為與配線2之最下端相同之位置。In the embodiment shown in FIG. 2, the upper and lower position of the
圖5所示之實施形態係例如使用硬化狀態之下側各向異性磁性片材21及半硬化狀態之上側各向異性磁性片材22作為2片各向異性磁性片材20。藉此,複數條配線2不會陷入下側各向異性磁性片材21,故而可容易地製造圖5所示之電感器1。The embodiment shown in FIG. 5 uses, for example, a lower anisotropic
於圖1A-B所示之實施形態中,具備2條配線2,但其數量並無限定,亦可設為3條以上。In the embodiment shown in FIGS. 1A-B, two
於圖1A-B所示之實施形態中,各配線2具有俯視大致U字形狀,但其形狀並無限定,可適當設定。In the embodiment shown in FIGS. 1A-B, each
於圖1A-B所示之實施形態中,磁性層3亦可具有對準標記。In the embodiment shown in FIGS. 1A-B, the
於圖1A-B所示之實施形態中,磁性層3中之各向異性磁性粒子8之比率於磁性層3中可相同,又,亦可隨著遠離各配線2而變高抑或變低。In the embodiment shown in FIGS. 1A-B, the ratio of the anisotropic
<模擬結果> 實施例1 作為與圖5之實施形態相似之模型,使用了圖6及圖7A所示之模型。於該模型中,於下文所示之條件下藉由模擬算出電感器之自感(self-inductance)、互感(mutual inductance)、電感密度、直流重疊特性及耦合係數。<Simulation results> Example 1 As a model similar to the embodiment of Fig. 5, the model shown in Figs. 6 and 7A was used. In this model, the self-inductance, mutual inductance, inductance density, DC superimposition characteristics, and coupling coefficient of the inductor are calculated by simulation under the conditions shown below.
軟體:ANSYS公司製造之「Maxwell 3D」,導線6之半徑R1:110 μm,絕緣層7之厚度R2:5 μm,磁性層3之第1方向長度T1:14.5 mm,磁性層3之第2方向長度T2:12 mm,配線2之第2方向長度:10 mm,磁性層3之厚度T3:430 μm,周邊區域11之徑向長度:60 μm,圓周方向配向區域30之周向之相對磁導率μ:140,圓周方向配向區域30之徑向之相對磁導率μ:10,第1方向配向區域31之第1方向之相對磁導率μ:140,第1方向配向區域31之上下方向之相對磁導率μ:10,第1方向配向區域31之上下方向距離31:60 μm,頻率:10 MHz,配線2間之中心間距離D1:0.5 mm、1.0 mm或1.5 mm ・直流重疊特性設定了磁特性B相對於外部磁場強度H之變化。又,於面方向上設定為非線性(當外部磁場強度H變強時,B逐漸飽和之模式),於厚度方向上設定為線性(相對於外部磁場強度H,B始終固定且不飽和之模式)。Software: "Maxwell 3D" manufactured by ANSYS, radius R1 of wire 6: 110 μm, thickness R2 of insulating layer 7: 5 μm, length T1 of magnetic layer 3 in the first direction: 14.5 mm, magnetic layer 3 in the second direction Length T2: 12 mm, the length in the second direction of wiring 2: 10 mm, the thickness of the magnetic layer 3 T3: 430 μm, the radial length of the peripheral area 11: 60 μm, the relative magnetic permeability in the circumferential direction of the circumferential alignment area 30 μ : 140, the relative magnetic permeability of the circumferential direction alignment area 30 in the radial direction μ: 10, the relative magnetic permeability of the first direction alignment area 31 in the first direction: 140, the first direction alignment area 31 is opposite in the upper and lower directions Permeability μ: 10, the first direction alignment area 31 up and down distance 31: 60 μm, frequency: 10 MHz, the distance between the centers of wiring 2 D1: 0.5 mm, 1.0 mm or 1.5 mm ・The DC superimposition characteristic sets the change of the magnetic characteristic B relative to the external magnetic field intensity H. In addition, it is set to be non-linear in the surface direction (when the external magnetic field strength H becomes stronger, B is gradually saturated mode), and set to be linear in the thickness direction (relative to the external magnetic field strength H, B is always fixed and unsaturated mode ).
於對配線施加了直流電流之狀態下,算出針對直流磁場之電感值。Calculate the inductance value for the DC magnetic field with DC current applied to the wiring.
於0.1 A~100 A之範圍內對電流值進行掃描。此時,以直流電流為0.1 A時之電感值為基準(100%),將下降至70%時之直流電流之值設為直流重疊電流值而算出。Scan the current value in the range of 0.1 A to 100 A. At this time, based on the inductance value when the DC current is 0.1 A (100%), the value of the DC current when it drops to 70% is calculated as the DC superimposed current value.
將其等之結果示於表1中。The results are shown in Table 1.
比較例1
如圖6及圖7B所示,除第1方向配向區域31之中心C2變更為位於第1假想線L2上,且將其上下方向長度變更為50 μm以外,以實施例1相同之方式,算出各值。將結果示於表1中。Comparative example 1
As shown in FIGS. 6 and 7B, except that the center C2 of the first
比較例2
如圖6及圖7C所示,除未配置第1方向配向區域31,而僅將周邊區域11設為圓周方向配向區域以外,以與實施例1相同之方式算出各值。將結果示於表1中。Comparative example 2
As shown in FIGS. 6 and 7C, each value was calculated in the same manner as in Example 1, except that the first
[表1]
探討 由表1可知,實施例1之電感器與比較例1之電感器相比,於任一配線間距離D1時,耦合係數較低,故而配線間之影響較少,串擾減小。又,由於電感密度較高,故而電感良好。又,直流電流重疊時之電感之下降較少,直流重疊特性良好。Explore It can be seen from Table 1 that compared with the inductor of Comparative Example 1, the inductor of Example 1 has a lower coupling coefficient at any distance D1 between wirings, so the influence between wirings is less and the crosstalk is reduced. In addition, since the inductance density is high, the inductance is good. In addition, the drop in inductance when DC current is superimposed is small, and the DC superimposition characteristic is good.
又,實施例1之電感器與比較例2之電感器相比,直流電流重疊時之電感下降較少,直流重疊特性良好。 [產業上之可利用性]In addition, compared with the inductor of Comparative Example 2, the inductor of Example 1 has less inductance drop when DC current is superimposed, and the DC superimposition characteristic is good. [Industrial availability]
本發明之電感器例如可用作電壓轉換構件等無源元件。The inductor of the present invention can be used as a passive element such as a voltage conversion member, for example.
1:電感器 2:配線 3:磁性層 4:第1配線 5:第2配線 6:導線 7:絕緣層 8:各向異性磁性粒子 9:黏合劑 11:周邊區域 12:外側區域 13:第1區域 14:第2區域 15:上側第1區域 16:下側第1區域 17:一側第2區域 18:另一側第2區域 19:交叉部(頂部) 20:各向異性磁性片材 21:下側各向異性磁性片材 22:上側各向異性磁性片材 25:接觸界面 30:圓周方向配向區域 31:第1方向配向區域 C1:配線之中心 C2:虛擬圓弧之中心 D1:中心間距離 D2:中心間距離 L1:假想圓弧 L2:第1假想線 L3:第3假想線 R1:導線之半徑 R2:絕緣層之厚度 T1:磁性層之第1方向長度 T2:磁性層之第2方向長度 T3:磁性層之上下方向長度(厚度) θ:角度1: Inductor 2: Wiring 3: Magnetic layer 4: First wiring 5: Second wiring 6: Wire 7: Insulating layer 8: Anisotropic magnetic particles 9: Adhesive 11: Peripheral area 12: Outer area 13: No. 1 Area 14: 2nd area 15: Upper 1st area 16: Lower 1st area 17: One side 2nd area 18: The other side 2nd area 19: Intersection (top) 20: Anisotropic magnetic sheet 21: Lower anisotropic magnetic sheet 22: Upper anisotropic magnetic sheet 25: Contact interface 30: Alignment area in the circumferential direction 31: Alignment area in the first direction C1: Center of wiring C2: Center of virtual arc D1: Distance between centers D2: distance between centers L1: imaginary arc L2: first imaginary line L3: third imaginary line R1: radius of wire R2: thickness of insulating layer T 1 : length of magnetic layer in the first direction T 2 : magnetic The length of the layer in the second direction T 3 : the length (thickness) of the upper and lower directions of the magnetic layer θ: angle
圖1A-B係本發明之電感器之一實施形態,圖1A表示俯視圖,圖1B表示圖1A之A-A剖視圖。 圖2表示圖1B之虛線部之局部放大圖。 圖3A-B係圖1A-B所示之電感器之製造步驟,圖3A表示配置步驟,圖3B表示積層步驟。 圖4表示圖1A-B所示之電感器之實際之SEM照片剖視圖。 圖5表示本發明之電感器之變化例(交叉部位於配線下端之形態)之剖視圖。 圖6表示實施例及比較例之模擬中使用之電感器之模型的圖。 圖7A-C係圖6之A-A剖視圖,圖7A表示實施例1之剖視圖,圖7B表示比較例1之剖視圖,圖7C表示比較例2。1A-B are an embodiment of the inductor of the present invention, FIG. 1A is a top view, and FIG. 1B is a cross-sectional view A-A of FIG. 1A. Fig. 2 shows a partial enlarged view of the broken line in Fig. 1B. 3A-B are the manufacturing steps of the inductor shown in FIGS. 1A-B, FIG. 3A shows the arrangement step, and FIG. 3B shows the stacking step. Fig. 4 shows a cross-sectional view of the actual SEM photo of the inductor shown in Figs. 1A-B. Fig. 5 shows a cross-sectional view of a modification of the inductor of the present invention (a form in which the cross section is located at the lower end of the wiring). Fig. 6 shows a model of an inductor used in the simulation of the embodiment and the comparative example. 7A-C is a cross-sectional view of A-A in FIG. 6, FIG. 7A is a cross-sectional view of Example 1, FIG. 7B is a cross-sectional view of Comparative Example 1, and FIG. 7C is a cross-sectional view of Comparative Example 2.
1:電感器 1: Inductor
2:配線 2: Wiring
3:磁性層 3: Magnetic layer
4:第1配線 4: The first wiring
5:第2配線 5: Second wiring
6:導線 6: Wire
7:絕緣層 7: Insulation layer
8:各向異性磁性粒子 8: Anisotropic magnetic particles
9:黏合劑 9: Adhesive
11:周邊區域 11: Surrounding area
12:外側區域 12: Outer area
13:第1區域
13:
14:第2區域
14:
15:上側第1區域 15: The first area on the upper side
16:下側第1區域 16: The first area on the lower side
17:一側第2區域 17: The second area on one side
18:另一側第2區域 18: The second area on the other side
19:交叉部(頂部) 19: Intersection (top)
C1:配線之中心 C1: The center of wiring
C2:虛擬圓弧之中心 C2: Center of virtual arc
D1:中心間距離 D1: Distance between centers
L1:假想圓弧 L1: imaginary arc
L2:第1假想線 L2: The first imaginary line
L3:第3假想線 L3: 3rd imaginary line
R1:導線之半徑 R1: the radius of the wire
R2:絕緣層之厚度 R2: Thickness of insulating layer
θ:角度 θ: Angle
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