TW202032627A - Deposition apparatus for depositing a material on a substrate and method for depositing a material on a substrate with a deposition apparatus - Google Patents

Abstract

A deposition apparatus (105) for depositing a material on a substrate (106) is provided. The deposition apparatus includes a transport device (140) for transporting the substrate (106), one or more deposition units (110) for depositing the material on the substrate (106), a deposition compartment (120), the deposition compartment comprising two or more edge regions (124), and a heating unit (300) configured for heating the substrate (106). The heating unit (300) is configured for heating the substrate (106) exclusively at a first substrate segment (107) and a second substrate segment (108) with the first substrate segment and the second substrate segment facing the two or more edge regions (124) of the deposition compartment (120).

Description

Deposition equipment for depositing a material on a substrate and method for depositing a material on a substrate using a deposition equipment

The several embodiments of the present disclosure are related to several thin film processing equipments, particularly to several deposition systems, and particularly to roll-to-roll (R2R) deposition systems. The several embodiments of the present disclosure particularly relate to a radiation device, an apparatus and method for depositing a material on a substrate.

Processing flexible substrates is highly demanded in the packaging industry, semiconductor industry, and other industries. The flexible substrates are, for example, plastic films or foils. The treatment may consist of coating a flexible substrate with a material, and other treatments performed on the substrate for individual applications. Such materials are, for example, metals, semiconductors and dielectric materials, and metals are especially aluminum. The system for performing this work generally includes a processing drum such as a cylindrical roller. The processing drum is coupled to a processing system for conveying the substrate, and at least a part of the substrate on the processing drum is processed. The roll-to-roll coating system can thus provide a high-volume system.

Generally, an evaporation process, such as a thermal evaporation process, can be used to deposit a thin metal layer, which can be metalized on a flexible substrate. However, roll-to-roll deposition systems are also facing a strong increase in demand in the display industry and photovoltaic (PV) industry. For example, touch panel elements, bendable displays, and bendable PV modules have increased the demand for depositing appropriate layers in roll-to-roll coaters. However, these devices generally have several layers, and these layers are usually manufactured using a chemical vapor deposition (CVD) process and especially also a plasma assisted chemical vapor deposition (PECVD) process.

In order to optimally deposit the material on the substrate, the process parameters of different thermal evaporation processes must be adjusted accordingly. In particular, the thermal management of the process plays an important role in achieving high-quality deposition materials. Therefore, not only the overall thermal management of the process must be improved, but also the thermal regulation of several components that affect the process.

In view of the above and one aspect, a deposition device for depositing a material on a substrate is proposed. The deposition equipment includes a conveying device configured to convey the substrate; one or more deposition units configured to deposit materials on the substrate; a deposition compartment including two or more edge regions; and a heating unit, Assembled so that a first substrate section and a second substrate section face the two or more edge regions of the deposition compartment, and the substrate is specifically heated in the first substrate section and the second substrate section .

According to another aspect, a deposition device for depositing a material on a substrate is provided. The deposition equipment includes a conveyor, and the conveyor includes two edge portions of the conveyor. The deposition equipment includes one or more deposition units, including one or more deposition compartments, and the one or more deposition compartments include two or more edge regions. The deposition equipment includes a heating unit. Thus, at least one of the group consisting of the two edge portions of the conveyor and the edge regions of the two or more deposition compartments includes a heating unit.

According to another aspect, a method for depositing a material on a substrate using a deposition equipment is provided. The deposition equipment includes a deposition compartment and one or more deposition units. The method includes using a heating unit to specifically heat a first substrate section and a second substrate section conveyed by a conveying device, the first substrate section and the second substrate section facing the deposition compartment Two or more edge areas.

Several embodiments also relate to equipment used to perform the disclosed methods, and include equipment components used to perform each of the described methods. These methods can be implemented by hardware components, computers programmed by suitable software, any combination of the two, or any other means. Furthermore, several embodiments according to the present disclosure also relate to methods for operating the described equipment. It includes the methodological aspects used to perform the functions of the device. In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

Detailed reference will be made with several embodiments of the present invention. One or more examples of the several embodiments of the present invention are shown in the drawings. In the description of the drawings below, the same reference numbers refer to the same elements. Generally speaking, only the differences between individual embodiments are explained. Each example is provided by way of illustrating the present invention and is not meant to be a limitation of the present invention. Furthermore, the features described or described as part of one embodiment can be used in other embodiments or combined with other embodiments to obtain still other embodiments. This means that this description includes these adjustments and changes.

The several embodiments described herein relate to a deposition device for depositing a material on a substrate. The deposition equipment includes a conveying device configured to convey the substrate; one or more deposition units configured to deposit materials on the substrate; a deposition compartment including two or more edge regions; and a heating unit, Assembled so that a first substrate section and a second substrate section face the two or more edge regions of the deposition compartment, and the substrate is specifically heated in the first substrate section and the second substrate section .

According to several embodiments described herein, a deposition device for depositing a material on a substrate is provided. The deposition equipment may include, for example, a conveying device arranged as a coating drum. The substrate can be guided by the coating drum to pass through a deposition compartment. The material can be deposited on the substrate in the deposition compartment. The substrate may include a first substrate section, a second substrate section, and a third substrate section. The deposition compartment may further include two or more edge regions. The edge area can face the conveyor. The deposition equipment may further include a heating unit. The heating unit can heat the first substrate section and the end of the second substrate section.

According to still other embodiments, a deposition device for depositing a material on a substrate is provided. The deposition equipment may include a conveying device, and the conveying device may include two edge portions of the conveying device. The deposition apparatus may further include one or more deposition units, including one or more deposition compartments, and the one or more deposition compartments include two or more deposition compartment edge regions. The deposition apparatus may include a heating unit. Thus, at least one of the group consisting of the two edge portions of the conveying device and the edge regions of the two or more deposition compartments includes a heating unit.

Figure 1 shows a schematic diagram of a system for depositing materials on a substrate according to several embodiments described herein. The system includes deposition equipment. The deposition equipment may include a vacuum chamber 102 and a conveying device 140 for conveying the substrate. The deposition apparatus may include one or more deposition units 110. The deposition unit can be equipped for depositing materials on the substrate. The one or more deposition units can be configured such that the substrate is transported between the conveying device 140 and the one or more deposition units 110.

According to several embodiments described herein, the conveying device can convey the substrate along the one or more deposition units. In each of the one or more deposition units, a radiation device may be included. The radiation device can be equipped to allow the deposition of material on the substrate. The radiation device may include a cooling device, as described further below. The deposition apparatus may include one or more supply channels. The one or more supply channels can be equipped to provide materials to one or more deposition units.

According to several embodiments described herein, a system for depositing materials on a substrate is proposed, for example, a system for depositing a thin film on the substrate. This system includes deposition equipment. The substrate may be a flexible substrate. As shown by way of example in Figure 1, the system may include a vacuum chamber 102. The vacuum chamber has a first chamber portion 102A and a second chamber portion 102B. The third chamber part 102C can be assembled into a winding/unwinding chamber, and can be separated from the remaining part of the chamber for exchanging flexible substrates, so that the remaining chamber part (for example, the first/second chamber The chamber 102A/B) does not need to be exhausted in order to remove the processed flexible substrate and exhaust after a new substrate has been inserted. For example, the downtime of the system can be reduced. The system may include at least one deposition unit. In particular, the deposition equipment may include more than two deposition units. The system is also the deposition equipment.

It is worth noting that the flexible substrate or mesh used in the embodiments described herein can generally be characterized as being bendable. The name "web" can be used synonymously with the name "strip" or the name "flexible substrate". For example, the mesh as described in the embodiments herein can be a foil or another flexible substrate. However, as described in more detail below, the advantages of the embodiments described herein can also be provided to the non-flexible substrates or carriers of other inline-deposition systems. Furthermore, it will be understood that specific advantages can be used for flexible substrates and applications for manufacturing devices on flexible substrates.

The supply device can provide the substrate. The supply device may be a roller. The substrate can be arranged on a first roller 764 having a shaft, and this shaft is exemplified in Figure 1 for unwinding. The substrate can be received by a take-up device. The take-up device can be a roller. The supply device and/or the take-up device may be provided by the support device. The substrate can be wound on a second roller 764' having a shaft, and this shaft is exemplified in Figure 1 for winding. However, it will be understood that the substrate can also be guided through the system in the opposite direction so that the shaft can be used for winding instead of unwinding, and for unwinding instead of winding. Therefore, the unwinding shaft and the winding shaft are arranged in the third chamber portion 102C, the unwinding shaft is used to support the flexible substrate to be processed, and the winding shaft supports the flexible substrate with the processed film on it. The bendable substrate 106 may be disposed on a first roller 764 having an unwinding shaft, for example. According to several embodiments, the substrate can be guided from the first roller 764 to the coating drum via one, two or more rollers, and from the coating drum to the second roller 764 having a winding shaft, for example. '. The substrate is wound on the winding shaft after its treatment.

According to several embodiments and as shown in FIG. 1, the conveying device 140 may be provided in the equipment. The conveying device 140 is, for example, a coating drum 142 with a rotating shaft 111. The coating drum 142 may have a curved outer surface for guiding and/or conveying the substrate along the curved outer surface. The substrate may be guided through the first vacuum processing area of the deposition unit 110 at the top in Figure 1, and at least one second vacuum processing area in the deposition unit 110 at the next top in Figure 1.

The embodiment shown in Figure 1 includes five deposition units 110, such as five deposition sources. The deposition source is set in the processing area, where the substrate conveyed by the coating drum can be processed in individual areas. However, it will be understood that according to still other embodiments that can be combined with other embodiments described herein, two or more deposition units may be provided, with the deposition unit exemplified as a deposition station. For example, four, five, six, or even more deposition units can be provided, and the deposition units are, for example, deposition stations. The processing area can be separated from the adjacent processing area or other areas by a gas separation unit.

According to several embodiments described here, the first part of the coating drum can be disposed in the second chamber portion 102B, and the first part of the coating drum is a section of the coating drum perpendicular to the axis of rotation. The area and the remaining part of the coating drum can be arranged in the first chamber portion 102A. The remaining part of the coating drum is also an area of the cross section of the coating drum perpendicular to the rotation axis.

According to several embodiments described herein, the first cavity portion 102A may have a convex wall portion. Convex system is understood as having a curved surface with a wall portion, or such a surface with several planes adjacent to each other to provide a convex shape. According to several embodiments, these planes forming a convex shape together have advantages. The vacuum flange connector described below can be arranged on a plane that is easier to manufacture.

Related to two examples of the five deposition units 110 shown in Figure 1, the first deposition unit corresponds to the first vacuum processing area and the second deposition unit corresponds to the second vacuum processing area. According to several embodiments described herein, at least two deposition units are provided, and at least two of the deposition units include flange portions for providing a vacuum connection to the first chamber portion 102A. For example, the first chamber portion may have a convex wall portion as described above, and at least two openings are substantially parallel to it. For example, the at least two openings are provided in the convex wall portion or in the protrusion extending from the convex wall portion, that is, the convex wall portion that substantially projects radially outward relative to the coating drum shaft Extension.

According to several embodiments, the at least two deposition units can be assembled to be accommodated in the at least two openings of the first chamber portion. The flange portion can provide a vacuum tight connection with the convex wall portion of the first chamber portion or with the protrusion extending from the convex wall portion. However, it will be understood that the flange portion may also be provided for other deposition units as shown in Figure 1.

Therefore, the deposition unit can be inserted from the outside of the convex wall portion of the first chamber portion 102A. During insertion, the vacuum flange can be connected. The vacuum area may be provided in the first chamber part. According to several embodiments, the deposition unit can be inserted into the opening in a substantially radial direction relative to the axis of the coating drum 142.

As described above, a part of the deposition unit 110 can be placed in a vacuum, that is, in the first chamber portion and/or relative to the inner side of the flange. Another part of the deposition unit can be arranged outside this area, and the vacuum in the vacuum chamber 102 is provided in this area. The deposition unit can be easily exchanged, and the supply of consuming media such as cooling fluid, gas, and electricity can be easily provided. For example, the connection between the deposition unit and other components is arranged on the outer side of the first chamber portion 102A, and the above-mentioned other part on the outer side of the region can be formed. Other components like power supply, gas supply, pump device, vacuum pump and the like.

As described above, Figure 1 illustrates the deposition apparatus 105. The deposition apparatus 105 may include a vacuum chamber 102. The vacuum chamber 102 may be arranged so that vacuum can be generated in the chamber. Several vacuum processing techniques and especially vacuum deposition techniques can be used to treat the substrate or deposit a thin film on the substrate. As shown in FIG. 1 and with reference to this, the deposition device 105 may be a roll-to-roll deposition device, and the support, guided and processed, may be a flexible substrate 106. The bendable substrate 106 can be guided from the second chamber portion 102B to the first chamber portion 102A having the deposition unit therein as indicated by the arrow 8 in Figure 1.

As described above, according to several embodiments, the vacuum chamber 102 may further include the third chamber portion 102C. The third chamber part 102C may be assembled as a winding/unwinding chamber. The vacuum chamber 102 may include windings, such as rollers for providing substrates. The flexible substrate may be guided by a roller to a conveying device, for example, a coating drum 142 that is assembled to guide and/or convey the substrate during processing and/or deposition. The substrate can be transported in the transport direction indicated by arrow 8. It will be understood that the substrate can also be transported in the opposite direction shown by arrow 8. The substrate 106 from the coating drum 142 can be guided back to the second chamber part 102B and the third chamber part respectively.

According to several embodiments described herein, the third chamber portion may include an unwinder for supplying the substrate. The substrate can then be guided toward a conveying device via a roller. The conveying device is, for example, a coating drum 142. The substrate can be guided through the curved surface of the coating drum 142. The coating drum can transport the substrate along the processing area to deposit particles on the substrate. The substrate can be transported between the curved surface of the coating drum and the individual deposition units. For example, the substrate can be guided through the slit between the coating drum and the deposition unit. The coating drum 142 can transport the substrate back to the third chamber through the roller to the winder to receive the processed substrate. The winder and unwinder can be rollers. The winder and/or unwinder may be removably arranged in the third chamber part.

According to still other embodiments for operating and using deposition equipment as described herein, deposition layers or layer stacks for ultra high barrier stacks or flexible thin film transistor (TFT) devices can be provided. An example of an ultra-high barrier stacked or flexible TFT device includes a series of layers, for example, deposition using plasma assisted chemical vapor deposition (PECVD) or physical vapor deposition (PVD) processes or a combination thereof. Because of the high requirements for the quality of different layers, depositing a single film in a specially designed system for each single film is a commonly used method. In order to reduce the cost and allow the application to be used commercially, the deposition system of combining at least an array of several films or several combinations in a single coater is an improved method. According to the several embodiments described herein, a modular concept that allows the combination of several process modules is provided. In view of the above, according to some embodiments described herein, flexible ultra-high barriers for organic light emitting diode (OLED) displays and/or lighting, flex solar, or other electronic devices can be provided, And with the need to avoid the influence of the adjacent environment. For example, this can include etch stop, gate dielectric, channel, source and drain deposition for TFT.

As more shown in Figure 1, the second chamber portion 102B can be inclined relative to the vertical or horizontal orientation of the third chamber portion (not shown). The angle of inclination can be 20° to 70° relative to vertical. Tilting allows the coating drum to move downwards compared to the horizontal configuration of similar components without tilting. The inclination of the second chamber portion 102B allows the installation of additional deposition units so that the axis of symmetry of the deposition unit (see the line marked 1 in Figure 1) is above the axis of the coating drum 142 or The same height below. As shown in Figure 1, the five deposition units are arranged above the height of the rotating shaft of the coating drum or at or below the height of the rotating shaft of the coating drum. It can reduce or avoid the fragmentation and falling of the generated particles on the substrate.

Figure 2 shows a cross-sectional view of a deposition unit according to several embodiments described herein. The deposition unit 110 may include a housing 112. The deposition unit 110 may include an internal shield, for example a pump shield. The inner shield can be lined on the shell to restrict the deposition chamber in the shell. The deposition unit may further include a deposition opening 126. The deposition opening 126 may extend in the inner shield, for example. That is, the deposition opening 126 may have the same size as the deposition chamber. According to several embodiments, the deposition opening may be narrower than the size of the deposition chamber.

According to several embodiments described herein, the deposition unit may include a temperature regulator 118. The temperature regulator 118 may be equipped to cool the deposition unit, that is, to cool the housing 112 of the deposition unit. The temperature regulator 118 can be further equipped to cool the inner shelter. For example, the cooling channel may be included in the housing 112. The cooling fluid can be passed through the cooling channel to cause heat transfer between the deposition chamber and the cooling fluid.

The deposition unit may include one or more supply channels 130. The one or more supply channels may include one or more gas supply lines. In particular, the deposition unit may include two supply channels 130. The deposition unit may include a radiation device 200.

According to several embodiments described herein, the one or more supply channels 130 may be arranged in the upper section of the deposition unit. The one or more supply channels may be in fluid communication with the supply configuration, and the supply configuration is for example a gas tank. For example, when two gas supply lines are provided, one gas supply line can be fluidly connected to one supply configuration, and a second gas supply line can be fluidly connected to the second supply configuration. As shown in Figure 2, the one or more supply channels can be arranged in the same horizontal plane of the deposition unit.

The one or more supply channels 130 may extend in a direction perpendicular to the paper surface of FIG. 2. Along the one or more supply channels 130, several openings may be configured to allow materials to enter the deposition unit, that is, the deposition chamber. The opening can provide, for example, gas to the deposition chamber. The opening can be configured as a nozzle.

According to several embodiments described herein, the deposition unit may include a radiation device 200. The radiation device may be arranged in a central position, for example, in a section below the deposition unit 110. For example, the radiation device can be arranged between two supply channels. The radiation device may be arranged in a plane different from the plane of the supply channel. For example, the plane of the radiation device may be lower than the plane of the supply channel in the vertical direction. The radiation device can be additionally or alternatively configured so that the radiation energy can be provided in the direction of the one or more supply channels.

According to the several embodiments described here, the conveying device 140 can be arranged in a section above the deposition unit. It will be understood that the names "up" and "down" are related to the orientation of the deposition unit shown in Figure 2. The deposition unit can be arranged at different angles relative to the conveyor shown in Figure 1. The conveying device 140 can provide the substrate at the deposition opening 126. For example, the movement of the conveyor device can provide the substrate along the deposition opening 126. The movement of the conveyor can provide the substrate at a fixed speed, or the movement of the conveyor can be started and stopped several times. The conveying device may be the coating drum 142.

According to several embodiments described herein, the deposition unit may include a gas separation unit 122. The gas separation unit can be assembled to separate the first vacuum processing area and at least one second vacuum processing area, and can be adapted to form a slit. The substrate can pass between the outer surface of the substrate support and the gas separation unit through the slit. The gas separation unit can be adapted to control the fluid communication between the first vacuum processing area and the second vacuum processing area. The fluid communication can be controlled by adjusting the position of the gas separation unit, which is an example of a radial position.

According to different embodiments that can be combined with other embodiments described herein, the actuator of the gas separation unit 122 for providing a radial position can be selected from electric motors, such as pneumatic actuators such as pneumatic cylinders, linear drives, And, for example, a group consisting of hydraulic actuators such as hydraulic cylinders.

According to several embodiments described herein, the deposition openings 126 may allow material to reach the substrate. That is, the deposition openings can allow material to be deposited on the substrate conveyed by the conveying device.

According to the several embodiments described herein, several deposition processes can be performed. The name "deposition" used here can be understood as any process that provides (solid) particles transported on a substrate. For example, the deposited material can be sputtered on the substrate. The material is released from the target (for example, combined to generate plasma) and deposited on the substrate. Generally speaking, sputtering is related to the generation of ultra-high thermal energy. Furthermore, the deposited material can be evaporated by providing a high temperature to the individual material to convert the material into a gaseous state. The evaporated particles can then be placed on the (cooler) substrate. Regardless of whether the sputtering process or the evaporation process is performed or not, a large amount of heat energy is generated during the process. Those with ordinary knowledge can understand that the processes performed in the deposition equipment are not limited to sputtering and evaporation, but may also include other deposition processes for depositing materials on the substrate.

According to several embodiments described herein, the deposition unit may be a reaction chamber. Vacuum can be supplied to the deposition unit. The reaction chamber can cause a plasma assisted chemical vapor deposition (PECVD) process, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, or a combination thereof. For example, the chemical reaction can occur in the deposition unit or the deposition chamber. The supply channel can guide gas into the deposition chamber, especially reaction gas. For example, two different forms of gas can be provided. A chemical reaction can occur to produce the deposition of particles on the substrate. For example, support gas and feedstock gas can be provided.

Figure 3 shows a top view of a deposition unit according to several embodiments described herein. The deposition unit may include a deposition compartment 120. The deposition compartment may include two or more edge regions 124. The two or more edge regions 124 can be regarded as the upper limit of the deposition chamber, that is, the upper limit of the deposition chamber. The one or more edge regions may form a frame surrounding the deposition chamber. For example, the two or more edge regions 124 can be arranged on the short sides of the deposition compartment.

According to several embodiments described herein, the one or more edge regions can be defined by the size of the deposition compartment. Considering the two-dimensional shape, the deposition compartment may have a substantially rectangular shape. The deposition compartment may have two parallel long sides and two parallel short sides. Therefore, the long side can be extended compared to the short side. The two or more edge regions may be arranged on the long side and/or short side of the deposition compartment.

As exemplarily shown in FIG. 3, the deposition compartment may include one or more supply channels 130 and optionally a radiation device 200. The deposition compartment may include at least two edge regions 124, and in particular, the deposition compartment may include four edge regions 124.

According to the embodiment described here, the deposition apparatus may include a heating unit 300. The heating unit 300 may be arranged in the deposition compartment, for example, arranged at the two or more edge regions 124 shown in FIG. 3. The heating unit 300 can be assembled for use in the first substrate section and the second substrate section facing the two or more edge regions 124 of the deposition compartment. The substrate section specifically heats the substrate.

The name "special heating" used here can be understood as direct heating of a section of the substrate. In particular, this name can be understood as direct heating of the first substrate section and/or the second substrate section. The heating unit may be equipped so that heat can reach the first substrate section and/or the second substrate section, but not the third substrate section. However, part of the heat provided by the heating unit may be transferred to the third substrate section. The transferred heat is as little as 20% of the provided heat, especially as little as 10% of the provided heat, and more special It is generally less than 5% of the heat provided.

According to the several embodiments described herein, the heating unit 300 can be disposed in the two or more edge regions 124. The heating unit may be arranged at at least one of the two or more edge regions of the deposition compartment. More particularly, the heating unit may be provided at both of the two or more edge regions. The heating unit can be arranged on the short side of the deposition compartment. For example, the heating unit can be attached to the two or more edge regions.

According to several embodiments described herein, the heating unit may include one or more heating devices 325. The one or more heating devices 325 can be configured to correspond to the two or more edge regions. In particular, each of the two or more edge regions may include one of the one or more heating devices 325. More particularly, the two or more edge regions on the long sides of the deposition compartment may each include a heating device. More than one heating device may additionally or alternatively be arranged in the two or more edge regions. The one or more heating devices can be selected from the group consisting of ceramic inlays, radiant heaters, resistance heaters or combinations thereof.

According to several embodiments described herein, a heating unit can be equipped to locally heat the substrate 106. For example, the heating unit can be equipped so that a part of the substrate is heated. The heating unit is the one or more heating devices. This part can be configured to correspond to the two or more edge regions. This part of the substrate can be a substrate section.

The substrate can be regarded as including several substrate segments. In particular, the substrate 106 may include three substrate sections. The substrate may include a first substrate section 107, a second substrate section 108, and/or a third substrate section 109. This embodiment can provide the possibility of heating only a specific section of the substrate.

For example, the heating unit can be equipped to heat the substrate and/or the substrate section by thermal radiation, and the heating unit is the one or more heating devices. By adjusting the temperature of the heating unit to a specific value, the temperature of the substrate and/or the substrate section can be adjusted.

Figure 4A shows a front view of a deposition apparatus according to several embodiments described herein. The conveying device 140 may be configured to correspond to the deposition compartment 120. The conveying device may be the coating drum 142. The substrate 106 can be guided by a conveying device, which is also a coating drum. The conveying device can be configured so that the material to be deposited can reach the substrate 106, and the conveying device is the coating drum. As shown by way of example in Figure 4A, the conveying device can be arranged above the deposition compartment. It will be understood that the direction "above the deposition compartment" is related to the diagram in Figure 4A, but it can also be broken into that the conveying device and the deposition compartment are arranged adjacent to each other.

According to several embodiments described herein, the size of the conveying device 140 can exceed the size of the deposition opening 126. The conveying device can guide the substrate 106. The substrate 106 may extend along the conveying device parallel to the rotation axis 111 of the conveying device. Therefore, the size of the substrate 106 may exceed the size of the deposition opening. The deposition opening 126 of the deposition compartment can be configured so that a section of the substrate receives the material to be deposited.

According to several embodiments described herein, the substrate 106 may include one or more substrate segments. In particular, the substrate 106 may include three substrate sections. The substrate may include a first substrate section 107, a second substrate section 108, and/or a third substrate section 109. The first substrate section 107 and the second substrate section 108 may be defined as portions of the substrate away from the material to be deposited. For example, the first substrate section 107 and the second substrate section 108 may be configured to correspond to the two or more edge regions of the deposition compartment 120. That is, the first substrate section and the second substrate section may be parts of the substrate that exceed the size of the deposition opening. The third substrate section can be defined by the portion of the substrate that is configured to correspond to the deposition openings. In other words, the third substrate section is the portion of the substrate that receives the material to be deposited. The third substrate section 109 may be disposed between the first substrate section 107 and the second substrate section 108.

According to several embodiments described herein, the conveying device 140 may include two conveying device edge portions 144. The edge portion 144 of the conveying device may be disposed on the side boundary of the conveying device 140, for example, on the side boundary of the coating drum 142. For example, the edge portion of the first conveying device may be configured to correspond to the first substrate section 107. The edge portion of the second conveying device may be configured to correspond to the second substrate section 108. The edge of the first conveyor and the edge of the second conveyor may be configured to correspond to the two or more edge regions of the deposition compartment 120. In other words, the edge of the first conveyor and the edge of the second conveyor can be parts of the conveyor that exceed the size of the deposition opening.

According to several embodiments that can be combined with any other embodiments described herein, the heating unit 300 may be arranged adjacent to the first substrate section 107 and/or the second substrate section 108. For example, the heating unit 300 may be disposed in several regions of the conveying device corresponding to the first substrate section and/or the second substrate section. The heating unit 300 may include one or more heating devices. The heating unit may be equipped to heat the substrate 106. In particular, the heating unit can be equipped to heat the first substrate section 107 and/or the second substrate section 108. For example, the heating unit may include one or more heating devices, such as resistance heaters.

According to several embodiments described herein, the heating unit may be provided in the conveying device 140. For example, the heating unit may be configured in the coating drum 142. The heating device can be configured such that the first substrate section 107 and/or the second substrate section 108 exclusively receives heat from the heating unit, which is the one or more heating devices. For example, the one or more heating devices may be placed in sections of the coating drum corresponding to the first substrate section 107 and/or the second substrate section 108.

For example, the heating unit can be disposed at the edge 144 of the two conveyors, that is, the heating unit can be disposed at the edge of the first conveyor and/or the edge of the second conveyor. The edges of the two conveyors can transfer heat from the heating unit to the substrate conveyed by the conveyor. For example, the edge area of the first conveying device may convey heat from the heating unit to the first substrate section, and/or the edge area of the second conveying device may convey heat from the heating unit to the second substrate section. Therefore, with the heating unit, the first substrate section and/or the second substrate section can be specially heated via the edge of the first conveying device and/or the edge of the second conveying device.

The heating unit is advantageously equipped to compensate for the temperature difference in the substrate. The temperature difference may be caused by the higher temperature supplied to the deposition process. By configuring to correspond to the deposition openings, the third substrate section may receive the highest process temperature. The first substrate section and/or the second substrate section may receive less process temperature because the first substrate section and the second substrate section are not in direct contact with the deposition opening. That is, compared to the third substrate section, when no heat is provided to the first substrate section and/or the second substrate section, the first substrate section and the second substrate section are Keep cooler conditions during the deposition process.

The heating of the first substrate section and the second substrate section by the heating unit can more advantageously lead to a uniform temperature distribution on the substrate. The temperature difference may damage the substrate, for example, folds and/or wrinkles may occur, especially on the sides of the substrate. Heating the first substrate section and the second substrate section can prevent or avoid the formation of folds and/or wrinkles on the substrate. Therefore, it can be ensured that the deposited material is evenly distributed. Furthermore, the use of a conveyor to guide the substrate can be helpful, because the avoidance of folding and/or wrinkles prevents the substrate from jamming in the deposition equipment.

Figure 4B shows a front view of a deposition apparatus according to several embodiments described herein. As shown in Figure 4B, the conveying device may include a cooling device 450. The cooling device 450 may be arranged in the conveying device, that is, in the coating drum 142. The cooling device 450 can be equipped to cool the substrate. In particular, the cooling device can be configured so that the third substrate section 109 can be cooled. The third substrate section may be configured to correspond to the deposition opening 126.

According to several embodiments described herein, the cooling device 450 may be disposed between the edge portions 144 of the two conveying devices. For example, the cooling device may be disposed at a part of the conveying device between the edge portions 144 of the two conveying devices. The cooling device 450 can be equipped to cool the substrate section which is configured to correspond to the part of the conveying device located between the edge portions 144 of the two conveying devices. Therefore, the conveying device may include a heating unit and a cooling device, the heating unit is located at the edge of the two conveying devices, and the cooling device is located at the conveying device portion between the edge of the two conveying devices.

According to several embodiments described herein, the third substrate section 109 may be provided with a first temperature. The first substrate section 107 and the second substrate section 108 may be provided with a second temperature. That is, the first substrate section and the second substrate section may include one temperature, and the third substrate section 109 may include another temperature. By providing different temperatures to the first, second, and third substrate sections, a third temperature of the substrate can be generated. The third temperature can be understood as the uniform temperature of the substrate generated from the first temperature and the second temperature. In other words, the third temperature can be understood as a temperature uniformly dispersed on the substrate. Those skilled in the art will understand that the first temperature and the second temperature may also be equal.

According to several embodiments described herein, the cooling device can be equipped to provide a temperature to the substrate 106. In particular, the cooling device can provide the first temperature to the third substrate section 109. Cooling the third substrate section may be advantageous because the third substrate section may receive heat generated by the deposition process. For example, power is supplied to the deposition chamber used to perform the deposition process, so energy is supplied to the deposition equipment, and heat may be generated during the process. Furthermore, the deposited material may be provided at a higher temperature to ensure high-quality deposition of particles. By cooling the substrate, that is, cooling the third substrate section of the portion of the substrate receiving the material to be deposited, these high temperatures can be compensated.

According to several embodiments described herein, the cooling device 450 may include cooling channels. The cooling channel may be a cooling pipe. The cooling pipe may be provided with cooling fluid. By providing the cooling fluid to the cooling pipe, heat transfer from the conveying device and/or the substrate to the cooling pipe can be performed, that is, heat transfer from the conveying device and/or the substrate to the cooling fluid can be performed. The cooling fluid may be provided at a temperature lower than the process temperature. The deposition equipment may include a controller for controlling the temperature of the cooling equipment.

According to several embodiments described herein, the heating unit can be equipped to heat the first substrate section and the second substrate section to a temperature that is substantially equal to the temperature of the third substrate section . In particular, the cooling device can be equipped to cool the third substrate section to a first temperature, and the heating unit can be equipped to heat the first substrate section and the second substrate section to the second temperature, so that the first substrate The section and the second substrate section have the same temperature as the third substrate section. In other words, the first temperature and the second temperature can be synchronized to generate a uniform temperature distribution on the substrate.

The temperature of the substrate can be advantageously adjusted precisely. By adjusting the temperature of different parts or sections of the substrate, the overall temperature of the substrate can be adjusted more accurately and precisely. This is to provide improved adjustment of the deposition process while minimizing the negative impact.

Figure 5 is a side view of the radiation device according to several embodiments described herein. The deposition equipment may include a radiation device 200. The radiation device 200 may have a shaft 2. The radiation device 200 may include a hollow body 250. The hollow body 250 may extend along the axis 2 in the length direction of the radiation device. The radiation device may include a cylindrical shape. The length of the radiation device along the axis 2 can be adapted to the size of the deposition unit. The radiation device can be connected to the power source, for example, the hollow body can be connected to the power source. The radiating device may include a coaxial connector.

The radiation device may include an outer tube 255. The outer tube surrounds the hollow body 250. The outer tube 255 may extend along the axis 2 of the radiation device. The length of the outer tube 255 along the axis 2 can be similar to the length of the hollow body. The outer tube can be assembled into vacuum isolation. The outer tube can be a quartz tube. Quartz is selected as the material to allow radiation waves to pass through the outer tube. The radiation waves are microwaves, which are not absorbed or only a few microwaves are absorbed.

The radiation device may include a cooling device 246. The cooling device 246 may be disposed in the hollow body 250. The cooling device may extend in the length direction along the axis 2 of the radiation device. The cooling device may be lined with the inner area of the hollow body 250. The cooling device is assembled to cool the hollow body. Cooling the hollow body may include heat transfer between the hollow body and the cooling device.

According to several embodiments described herein, the cooling device 246 may include one or more cooling channels for guiding the cooling fluid therethrough. The cooling channel may include an inlet fluid port 242 and an outlet fluid port 244. The inlet fluid port 242 may be arranged on one end area of the radiation device, and the outlet fluid port 244 may be arranged on the second end area of the radiation device. The cooling fluid can enter the cooling device through the inlet fluid port. The cooling fluid can leave the cooling device through the exit fluid port. The cooling fluid can provide heat exchange between the radiation device and the cooling fluid. By flowing through the cooling channel, the cooling fluid can transfer the heat generated by the radiation device away from the radiation device.

The hollow body 250 may include a conductor. The conductor may be provided with power at the first power port and/or the second power port. The conductor can be made of copper (Cu) or any other metal suitable for the application of providing radiant energy. The power supply can provide energy to the conductor. High-frequency radiation waves can be generated in conductors. For example, microwave generation. The radiation wave can generate plasma around the radiation device.

For example, energy is provided to the conductor. The conductor heats up due to the energy provided, and the energy increases the temperature of the radiation device. This may increase the temperature of the deposition unit, that is, the temperature of the deposition chamber. The increase in temperature may not only affect the deposition process, but may also damage the components included in the deposition process, such as conductors.

Generally speaking, by providing radiation energy, the radiation device generates heat to the deposition process, and the radiation device is also a microwave antenna. The cooling device can advantageously cool the microwave antenna. Therefore, the temperature inside the deposition chamber can be adjusted. Furthermore, the cooling device cancels the heat generated by the microwave antenna. Damage and/or changes to the substrate can be avoided. For example, the folding of the substrate can be avoided and/or prevented. This provides more uniform deposition of particles on the substrate. Furthermore, damage to the reactants can be prevented and/or avoided. Furthermore, by cooling the radiation device, the uniformity of the plasma generated in the radiation device can be increased. The radiation device and/or the conductor can more advantageously avoid damage due to overheating.

According to several embodiments described herein, the cooling radiation device and the heating of the first substrate section and the second substrate section can be combined. For example, the radiation device can be cooled to adjust the process temperature in the deposition chamber, and the first substrate section and the second substrate section can be heated to further reduce the negative effects of high process temperatures. Synergistic positive effects can be provided to deposition equipment and/or deposition processes.

Coordinated thermal management of the deposition equipment can be advantageously provided. First, the process temperature, for example the temperature in the deposition compartment, can be adjusted so that the temperature is high enough for the deposition process to operate without interference, and at the same time the temperature is low enough to avoid damage to the process components. Secondly, the temperature of the substrate can be finely adjusted to further avoid damage, reduce or even avoid defective products, and thus reduce production costs. The combination of the temperature adjustment of the radiation device and the temperature adjustment of the substrate of the first substrate section and the second substrate section can provide even more precise and accurate substrate temperature which is the third temperature mentioned above The precision adjustment. The deposition process can be improved and can be manufactured more efficiently.

According to several embodiments that can be combined with any of the other embodiments described herein, the deposition apparatus may include a controller. The controller can be equipped to adjust the temperature of the deposition equipment. For example, the controller is equipped to adjust the temperature of the radiation device, adjust the temperature of the gas cooling device, and/or adjust the temperature of the heating unit. The controller can be set to different temperature values for example to provide temperature to the radiation device, gas cooling device and heating unit respectively.

FIG. 6 shows a flowchart of a method 600 for depositing materials on a substrate according to several embodiments described herein. The deposition equipment includes one or more deposition units and deposition compartments. The block 660 includes the first substrate section and the second substrate section conveyed by the special heating device by the heating unit. The first substrate section and the second substrate section face two or more of the deposition compartments. The edge area.

According to several embodiments described herein, the conveying device may include cooling equipment. In block 670, the first temperature is provided to the cooling device to cool the third substrate section. For example, the third substrate section may be arranged between the first substrate section and the second substrate section. The cooling device may be, for example, the cooling device described with reference to Fig. 4B.

In block 680, the second temperature is provided in the heating unit to specifically heat the first substrate section and the second substrate section. The second temperature can be adjusted so that the first substrate section and the second substrate section can have a temperature that is equal to the temperature of the third substrate section.

In block 690, the first temperature and the second temperature may be combined into a third temperature, and the third temperature is uniformly dispersed in the first substrate section, the second substrate section, and the third substrate section. Therefore, the substrate can avoid folding and/or wrinkles. This method may further include adjusting the first temperature and the second temperature to a value in a range between 0 and 200°C, especially a value in a range between 20 and 160°C. In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those who have ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

1,2: axis 8: Arrow 102: vacuum chamber 102A: First chamber part 102B: The second chamber part 102C: The third chamber part 105: deposition equipment 106: Substrate 107: The first substrate section 108: second substrate section 109: The third substrate section 110: deposition unit 111: Rotation axis 112: Shell 118: temperature regulator 120: deposition compartment 122: Gas separation unit 124: edge area 126: Deposition opening 130: supply channel 140: Conveyor 142: Coating drum 144: Conveyor edge 200: Radiation device 242: Enter fluid port 244: Leave the fluid port 246: cooling device 250: Hollow body 255: Outer Tube 300: heating unit 325: heating device 450: cooling equipment 600: method 660,670,680,690: block 764: first roller 764’: The second roller

In order to make the above features of the present invention be understood in detail, the more specific description of the present invention briefly excerpted above can refer to several embodiments. The attached drawings are related to several embodiments of the present invention and are described below: Figure 1 shows a top view of a roll-to-roll deposition system for depositing or coating films according to several embodiments described herein; Figure 2 shows a cross-sectional view of a deposition unit according to several embodiments described herein; Figure 3 shows a top view of a deposition unit according to several embodiments described herein; Figure 4A shows a front view of a deposition apparatus according to several embodiments described herein; Figure 4B shows a front view of the deposition apparatus according to several embodiments described herein; Figure 5 shows a side view of the radiation device according to several embodiments described herein; and Figure 6 shows a flow chart of the method according to several embodiments described herein.

120: deposition compartment

124: edge area

130: supply channel

200: Radiation device

300: heating unit

325: heating device

Claims (16)

A deposition device (105) for depositing a material on a substrate (106), the deposition device comprising: A conveying device (140) equipped to convey the substrate (106); One or more deposition units (110) equipped to deposit the material on the substrate (106); A deposition compartment (120), the deposition compartment comprising two or more edge regions (124); and A heating unit (300), equipped with a first substrate section and a second substrate section facing the two or more edge regions (124) of the deposition compartment (120), in the first The substrate section (107) and the second substrate section (108) specifically heat the substrate (106). The deposition apparatus (105) according to claim 1, wherein the conveying device (140) includes a coating drum (142), and the coating drum includes a cooling device (450) for cooling a third substrate zone Paragraph (109). The deposition device (105) according to claim 2, wherein the cooling device (450) is arranged in the coating drum (142). The deposition apparatus (105) according to claim 2, wherein the heating unit (300) is equipped to heat the first substrate section (107) and the second substrate section (108) to a temperature, substantially The above is equivalent to a temperature of the third substrate section (109). The deposition apparatus (105) according to claim 1, wherein the heating unit (300) is disposed at at least one of the two or more edge regions (124) of the deposition compartment (120). The deposition apparatus (105) according to claim 1, wherein the heating unit (300) is provided in the conveying device (140). The deposition apparatus (105) according to claim 1, wherein the heating unit (300) includes a heating device (325) selected from a plurality of ceramic inlays, a plurality of radiant heaters, a plurality of resistance heaters, or any of them A group composed of multiple combinations. The deposition device (105) according to any one of claims 1 to 7, the deposition device further comprising a radiation device (200). The deposition apparatus (105) according to claim 8, wherein the radiation device (200) further includes a cooling device (246), and the cooling device is disposed in the radiation device. The deposition apparatus (105) according to claim 8, wherein the deposition apparatus further includes a vacuum chamber (102). According to the deposition device (105) of claim 10, the deposition device further includes: One or more vacuum pumps; One or more supporting configurations to provide at least one selected from the group consisting of a supply device and a take-up device; and One or more deposition equipment (105) as described in any one of claims 1 to 10. A deposition device (105) for depositing a material on a substrate (106), the deposition device comprising: A conveying device (140), which includes two conveying device edge portions (144); One or more deposition units (110), including one or more deposition compartments (120), the one or more deposition compartments including two or more edge regions (124); and A heating unit (300), At least one of the group consisting of the two conveyor edge portions (144) and the two or more deposition compartment edge regions includes the heating unit (300). A method (600) for depositing a material on a substrate (106) using a deposition device (105). The deposition device includes one or more deposition units (110) and a deposition compartment (120). Methods include: A heating unit (300) is used to specifically heat a first substrate section (107) and a second substrate section (108) conveyed by a conveying device (140), the first substrate section and the second substrate section The two substrate sections face two or more edge regions (124) of the deposition compartment (120). According to the method (600) described in claim 13, the conveying device (140) includes a cooling device (450), and the method further includes: Providing a first temperature to the cooling device to cool a third substrate section (109); Providing a second temperature in the heating unit (300) to specifically heat the first substrate section (107) and the second substrate section (108); and Combining the first temperature and the second temperature into a third temperature, the third temperature is uniformly dispersed in the first substrate section (107), the second substrate section (108) and the third substrate Section (109). According to the method (600) described in claim 14, the method further includes: Adjust the first temperature and the second temperature to a value in a range between 0 and 200 °C. According to the method (600) described in claim 14, the method further includes: Adjust the first temperature and the second temperature to a value in a range between 20 and 160 °C.

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