TW202032230A - Flexible substrate display integrated with sensing function - Google Patents

Abstract

A flexible substrate display integrated with sensing function is disclosed. The flexible substrate display includes a display constituent area and a sensor. The display constituent area is located on a first surface of the flexible substrate display. The display composition area includes a display area and a non-display area. The display area is used to display frames and the non-display area is located outside the display area. The sensor includes a sensing area and an extension connection portion. The sensor is coupled to the non-display area through the extension connection portion. When the sensor is bent toward a second surface of the flexible substrate display, the sensor is fixed to a specific position on the second surface of the flexible substrate display and the sensing area of the sensor performs a sensing function. The second surface is opposite to the first surface.

Description

Flexible substrate display integrated with sensing function

The present invention is related to displays, and in particular to a flexible substrate display integrating sensing functions.

With the advancement of display technology, flexible displays have a wide range of applications, such as wearable devices, mobile phones, tablet computers, and notebook computers. As for the biometric sensor, it uses the biological characteristics of the human body to identify whether the user is a logged-in authenticated user, and can further enable the authenticated user to activate the electronic device.

At present, fingerprint recognition is the most widely used biometric technology. The fingerprint recognition system uses the valley or ridge features on the finger, and combines the relative position information of the feature points to form fingerprint feature point information. When the user's finger presses on the fingerprint recognition device, the fingerprint recognition device determines whether the fingerprint feature information of the finger matches the registered fingerprint feature point information, and accepts or rejects the user's login behavior. In practical applications, fingerprint recognition usually uses capacitive, optical or ultrasonic technologies. Next, the capacitive fingerprint recognition technology, the optical fingerprint recognition technology and the ultrasonic fingerprint recognition technology will be described respectively.

As shown in FIG. 1, when the finger is pressed on the fingerprint sensor, the distance between the valley FV and the protrusion FR in the fingerprint is different from the capacitance sensing unit CSU in the fingerprint sensor. The capacitance generated by the fingerprint valley FV and the capacitance sensing unit CSU is relatively small, and the capacitance generated by the fingerprint protrusion FR and the capacitance sensing unit CSU is relatively large. The outline of the fingerprint can be obtained by the capacitance sensed by the capacitance sensing unit CSU, and the fingerprint can be registered or compared.

Generally speaking, the capacitance sensing of the capacitance sensing unit CSU will be affected by the thickness of the protective layer PC disposed above it. When the protective layer PC is thicker, the difference in capacitance between the bumps of the fingerprint will be lower, resulting in the sensed The fingerprint image is less clear. In addition, since the capacitive sensing is affected by conductive materials, the capacitive sensor is not suitable to be placed under the display, but needs to be placed on the frame area or the back of the electronic device.

As shown in Figure 2, when a finger is pressed on the fingerprint sensor, the light source LS of the fingerprint sensor will emit light (visible light or invisible light) L1~L2. When the light L1 irradiates the protrusion FR in the fingerprint, the protrusion FR scatters the light L1 to a stronger degree and produces stronger scattered light L1'; when the light L2 irradiates the valley FV in the fingerprint, the valley FV The degree of scattering of light L2 is weak and weak scattered light L2' is generated. The outline of the fingerprint can be obtained by the size of the scattered light sensed by the optical sensor unit OSU, and the fingerprint can be registered or compared. It should be noted that the material above the optical sensing unit OSU needs to have a certain degree of light permeability to avoid obstructing the light source and the intensity of the reflected light. As shown in FIG. 3, the optical sensing unit OSU can be arranged behind the transparent display TD, and the display light sources L1 to L2 of the transparent display TD can be used as the sensing light source.

As shown in Figure 4, when the finger is pressed on the fingerprint sensor, the fingerprint sensor The ultrasonic transmitter USE of the tester will emit ultrasonic waves US1~US2 with a frequency higher than the human ear can perceive. When the ultrasonic waves US1~US2 are in contact with the finger, the reflection and transmission degree of the valley FV and protrusion FR in the fingerprint on the ultrasonic wave different. There is an air gap between the fingerprint valley FV and the protective layer PC, which makes the ultrasonic wave US2 produce larger reflection and smaller transmission at the interface between the protective layer PC and the air; the fingerprint protrusion FR directly contacts the protective layer PC, making the ultrasonic wave US1 The interface between the protective layer PC and the finger produces smaller reflection and larger transmission. The contour of the fingerprint can be obtained by the energy intensity of the reflected ultrasonic wave detected by the ultrasonic sensing unit USU, and the fingerprint can be registered or compared. It should be noted that since ultrasonic waves have a strong ability to penetrate solid media and are not affected by the light transmittance or conductivity of objects, the ultrasonic fingerprint sensor can be installed inside the electronic device or behind the display.

The front viewing angle of a mobile device with a fingerprint recognition sensor is shown in FIG. 5, and the front of the mobile device usually has a display area DA composed of a display and a non-display area BA without a display function. In the non-display area BA, there are usually function keys FB, front lens FC, speakers SPK, fingerprint recognition sensor FPS and other components. The fingerprint recognition sensor FPS can be used as an identity confirmation for unlocking mobile devices or performing financial payment functions. For example, when the mobile device is in the locked state, the user presses the fingerprint recognition sensor FPS with a finger that has previously registered fingerprint information. When the fingerprint recognition sensor FPS determines that the fingerprint matches the pre-registered fingerprint information, the action will be released The locked state of the device. Therefore, the user can quickly and intuitively unlock it without entering a password.

For another example, when a user wants to use a mobile device to make financial payments, For example, when making a mobile payment or purchasing an application, the mobile device may require the user to press the fingerprint recognition again to confirm that the mobile device is not used by others, so as to prevent the user from being stolen by others. When the mobile device is not in the fingerprint recognition state, the fingerprint recognition sensor can also be reused as a function button of the mobile device, such as the Home button. However, the fingerprint recognition sensor installed on the front of the mobile device needs to occupy a certain area. Under the trend of full-screen narrow bezels that are popular in recent years, the fingerprint recognition sensor installed on the front causes the difficulty of reducing the bezel.

In some mobile devices, as shown in FIG. 6A, the fingerprint recognition sensor FPS is set on the back of the mobile device, and as shown in FIG. 6B, the virtual buttons VFB are displayed through the display area DA on the front of the mobile device to present function buttons. In order to meet the needs of narrow frame design.

However, when the fingerprint recognition sensor FPS is installed on the back of the mobile device, the user needs to slide his finger to find the fingerprint recognition sensor FPS, which cannot trigger the fingerprint recognition function quickly and intuitively, and it may happen during the sliding of the finger. It may touch the rear lens BC of the mobile device and cause stains. In addition, the fingerprint recognition sensor installed on the front or back of the mobile device is usually made of silicon chip, and the module package has a certain thickness, which makes it difficult to further reduce the thickness of the overall device.

The organic light emitting diode panel includes an organic light emitting diode substrate, a driving circuit layer formed on the organic light emitting diode substrate, and an organic light emitting layer formed on the driving circuit layer. Since organic light-emitting materials are easily attenuated by the influence of water and oxygen, it is necessary to form an encapsulation layer with good water and oxygen isolation on the organic light-emitting diode display.

For example, as shown in FIG. 7, the encapsulation layer GE may be a glass substrate, and the encapsulation process uses a laser emitter LA to emit laser light L in the frame area to cure the sealant material SL to seal the organic light emitting diode layer OLED. Since glass has a good barrier effect, the use of glass encapsulation can effectively isolate water and oxygen in the environment. However, due to the poor flexibility of glass, organic light-emitting diode panels encapsulated by glass are difficult to apply to flexible or curved displays. In addition, since the thinning of glass also has its manufacturing process limitations, in today's electronic devices that are pursuing thin and light, glass packaging also makes it difficult to reduce the thickness of the overall module. In order to improve the above shortcomings, the encapsulation layer of the organic light emitting diode display can also be made by thin film encapsulation technology. As shown in FIG. 8, the organic light emitting diode panel includes an organic light emitting diode substrate SUB, an organic light emitting diode layer OLED, and a thin film encapsulation layer TFE.

As shown in FIG. 9, the thin film encapsulation layer TFE is formed by stacking at least one organic layer ORL and an inorganic layer INB on each other. The thickness of each organic layer ORL and inorganic layer INB is very thin (only um level), and they also have good water and oxygen isolation capabilities. Since the thickness of the thin film encapsulation layer TFE (5um or even lower) is much smaller than the thickness of the glass encapsulation layer GE, and it has flexibility, it can be applied to flexible displays (as shown in Figure 10A and Figure 10B), and The thickness of the module can be further reduced compared to the glass package.

As for the ambient light sensor, it can be applied to wearable devices, mobile phones, tablet computers, notebook computers and other devices. When a user views a product with a display, changes in the ambient light from the outside will cause the pupils of the eyes to dilate or shrink. If the display brightness of the display is not adjusted corresponding to the changes in the ambient light, it will cause discomfort to the human eye. Therefore, the ambient light sensor can detect changes in ambient light and change The display brightness of the display can be adjusted to make the human eyes feel more comfortable when viewing the display.

In addition, the ambient light sensor can also be used to sense the usage status of the device. For example, when the mobile phone is placed in a closed opaque container (such as a pocket or purse), the ambient light sensor detects that the ambient light is quite weak, so it can be determined that the mobile phone is in the stored state, and the mobile phone’s The touch function is turned off to avoid accidental touch. For another example, when the user removes the mobile phone from the pocket, the ambient light sensor senses that the ambient light changes from dark to bright, so it can be predicted that the user is going to use the mobile phone and switch the original closed screen of the mobile phone to display the unlock screen , So that users do not need additional operations to wake up the phone, in order to achieve a more convenient and smooth operating experience.

As for the distance sensor, it can be used in wearable devices, mobile phones, tablet computers, notebook computers and other devices as a sensor for detecting the user's status. The distance sensor usually includes an infrared transmitter and an infrared sensor. The infrared transmitter emits infrared light, and the infrared sensor receives the reflected light of the infrared light irradiated to external objects. By judging the intensity of the reflected light, it can detect whether there is an external object (such as a human face) approaching the device.

For example, when the user is ready to answer a phone call, he will move the phone closer to his face. When the distance sensor detects the change in the reflected light of infrared rays as the face moves closer, the screen display of the phone can be switched to Turn off the state and turn off the touch function of the phone at the same time to avoid accidental touch. In addition, the distance sensor and the ambient light sensor can be matched with each other to provide a more accurate device status recognition function through ambient light detection and object proximity detection.

The aforementioned sensing element is usually installed on the front of an electronic device. It is the display surface to facilitate the operation of the user. However, in recent years, as the screen-to-body ratio of electronic devices has become higher and higher, if the sensing element is installed on the display surface, it is difficult to increase the screen-to-body ratio. In addition, these sensing elements and their connectors also make it difficult to further reduce the thickness of the electronic device and reduce its manufacturing cost. Therefore, how to further increase the screen-to-body ratio and reduce the thickness of the device while maintaining the aforementioned sensing functions has become a very important issue.

In view of this, the present invention proposes a flexible substrate display with integrated sensing function to effectively solve the above-mentioned problems encountered by the prior art.

A specific embodiment according to the present invention is a flexible substrate display integrated with a sensing function. In this embodiment, the flexible substrate display includes a display component area and a sensor. The display component area is located on the first side of the flexible substrate display. The display composition area includes a display area and a non-display area, wherein the display area is used for displaying pictures and the non-display area is located outside the display area. The sensor includes a sensing area and an extension connection part, wherein the sensor is coupled to the non-display area through the extension connection part. Wherein, when the sensor is bent toward the second surface of the flexible substrate display, the sensor is fixed to a specific position on the second surface of the flexible substrate display and performs a sensing function through the sensing area, and the second surface is opposite On the first side.

In one embodiment, the sensor and the display component are coupled to each other through the flexible substrate without being separated from each other.

In one embodiment, the sensor is a fingerprint sensor and the sensing function is a fingerprint sensing function.

In one embodiment, the fingerprint sensor adopts optical sensing technology to perform fingerprint sensing function.

In one embodiment, the fingerprint sensor uses ultrasonic sensing technology to perform the fingerprint sensing function.

In one embodiment, the sensor is a light sensor and the sensing function is a light sensing function.

In one embodiment, the sensor is fixed to a specific position on the second surface of the flexible substrate display through an adhesive.

In one embodiment, the sensor is fixed to a specific position on the second surface of the flexible substrate display through optical transparent glue.

In one embodiment, the flexible substrate display further includes an infrared light filter layer, which is disposed between the sensor and the optical transparent glue to filter out light outside the infrared light band, so that the sensor only receives infrared light. Form an infrared light sensor.

In one embodiment, the flexible substrate display further includes an infrared light emitting source, which is arranged on the second surface of the flexible substrate display and is adjacent to the sensor for emitting infrared light.

In one embodiment, the non-display area includes an edge area, and the sensor is coupled to the edge area through the extending connecting portion.

In one embodiment, the non-display area further includes another edge area for coupling the display area and the display driver.

In one embodiment, the display driver is disposed on the flexible circuit board and is coupled to the other edge area through the flexible circuit board.

In one embodiment, the display driver is directly coupled to the other edge area.

In one embodiment, the non-display area further includes another edge area, and the scan driver is formed on the other edge area.

In one embodiment, the scan driver is directly formed on the other edge area by using a gate driver on array (Gate Driver on Array) technology and a thin film transistor process.

In one embodiment, the flexible substrate display further includes a multiplexer. The multiplexer is arranged in the edge area, and is used for respectively coupling the plurality of signal input lines of the flexible substrate display and the plurality of sensing signal lines of the sensor.

In one embodiment, when the flexible substrate display is driven, the multiplexer switches to the display mode and controls the signal input lines and the sensing signal lines to be disconnected from each other; when the flexible substrate display is finished driving, the multiplexer switches To the sensing mode and control at least part of the signal input lines and at least part of the sensing signal lines are coupled to each other, and at least part of the signal input lines will be multiplexed as sensing signal lines.

In one embodiment, the laminated structure of the flexible substrate display includes a flexible substrate, a thin film transistor element layer, an organic light emitting diode layer, an electrode layer, and a thin film encapsulation layer. The thin film transistor element layer is formed on the flexible substrate. The thin film transistor element layer includes a display driving area and a sensing area. The organic light emitting diode layer is formed above the display driving area. The electrode layer is formed above the organic light emitting diode layer. The thin film encapsulation layer is formed above the display driving area and the sensing area relative to the flexible substrate.

In one embodiment, the laminated structure of the sensor includes a flexible substrate, Semiconductor layer, gate insulating layer, gate layer, passivation layer, source and drain. The semiconductor layer is formed on the flexible substrate. The gate insulating layer is formed on the semiconductor layer. The gate layer is formed on the gate insulating layer. The passivation layer is formed on the gate layer. The source and drain are formed on the passivation layer. The source electrode and the drain electrode are connected to the semiconductor layer through the through holes passing through the passivation layer and the gate insulating layer. The thin film encapsulation layer is formed on the passivation layer, the source electrode and the drain electrode relative to the flexible substrate.

Compared with the prior art, the flexible substrate display with integrated sensing function of the present invention is to bend various sensors back to the back of the flexible substrate display, and will not occupy any edge area of the flexible substrate display, nor will it occupy The border area of electronic products. Therefore, the flexible substrate display with integrated sensing function of the present invention can provide the function of fingerprint sensing on the display screen while maintaining the narrow frame of the electronic product, thereby effectively improving the disadvantages of the prior art.

The advantages and spirit of the present invention can be further understood from the following detailed description of the invention and the accompanying drawings.

PC‧‧‧Protection layer

C‧‧‧Capacitor

CSU‧‧‧Capacitance sensing unit

FV‧‧‧Valley

FR‧‧‧Protrusion

LS‧‧‧Light source

L1~L2‧‧‧Light

L1’~L2’‧‧‧Scattered light

OSU‧‧‧Optical Sensing Unit

TD‧‧‧Transparent Display

USE‧‧‧Ultrasonic transmitter

USU‧‧‧Ultrasonic Sensing Unit

US1~US2‧‧‧Ultrasonic

DA‧‧‧Display area

BA‧‧‧Non-display area

SPK‧‧‧Speaker

FC‧‧‧Front lens

FB‧‧‧Function keys

FPS‧‧‧Fingerprint Recognition Sensor

BC‧‧‧ rear lens

LED‧‧‧Light Emitting Diode

VFB‧‧‧Virtual Button

LA‧‧‧Laser Launcher

L‧‧‧Laser

GE‧‧‧Packaging layer

SL‧‧‧Frame glue material

OLED‧‧‧Organic Light Emitting Diode Layer

SUB‧‧‧Organic Light Emitting Diode Substrate

TFE‧‧‧Thin Film Encapsulation Layer

ORL‧‧‧Organic layer

INB‧‧‧Inorganic layer

11‧‧‧Flexible substrate display

110‧‧‧Display area

112‧‧‧Fingerprint Sensor

112A‧‧‧Fingerprint sensing area

112B‧‧‧Extension connecting part

BA1‧‧‧Side edge area

BA2‧‧‧Top edge area

BA3‧‧‧Bottom edge area

ADH‧‧‧Binder

FG‧‧‧Finger

OCA‧‧‧Optical Clear Adhesive

DP‧‧‧Organic Light Emitting Diode Display Layer

OFS‧‧‧Optical Fingerprint Sensor

DIC‧‧‧Display drive circuit

SIC‧‧‧Fingerprint sensing drive circuit

SL, RL, DGL, SGL‧‧‧ signal line

DPX‧‧‧Display unit

SPX‧‧‧Light sensing unit

M1~M4‧‧‧Transistor

I‧‧‧Current

VDD‧‧‧Working voltage

VSS‧‧‧Ground voltage

FSUB‧‧‧Flexible substrate

DL‧‧‧Display Drive Area

CA‧‧‧Cathode layer

n+‧‧‧Semiconductor layer

p-Si‧‧‧Semiconductor layer

GI‧‧‧Gate insulation layer

G‧‧‧Gate layer

S‧‧‧Source

D‧‧‧Dip pole

PA‧‧‧Passivation layer

LT1~LT2‧‧‧Penetrating light

IR‧‧‧Infrared light

IRPF‧‧‧Infrared light filter layer

IRLED‧‧‧Infrared light emitting source

IR1~IR3‧‧‧Infrared light

SP‧‧‧Speaker

25‧‧‧Flexible substrate display

250‧‧‧Display area

252‧‧‧Fingerprint Sensor

252A‧‧‧Fingerprint sensing area

252B‧‧‧Extension connecting part

UFS‧‧‧Ultrasonic Fingerprint Sensor

PZ‧‧‧Piezoelectric material

E1~E2‧‧‧Electrode

AC‧‧‧AC voltage

US‧‧‧Ultrasound

USS‧‧‧Ultrasonic emission source

A‧‧‧Amperemeter

29‧‧‧Flexible substrate display

290‧‧‧Extension connecting part

291‧‧‧Fingerprint Sensor

292‧‧‧Fingerprint sensing drive circuit

293‧‧‧flexible circuit board

294‧‧‧Processor

DFPC‧‧‧Display flexible circuit board

30‧‧‧Display area

31‧‧‧Flexible substrate display

310‧‧‧Extension connecting part

311‧‧‧Fingerprint Sensor

312‧‧‧flexible circuit board

313‧‧‧Fingerprint sensing drive circuit

314‧‧‧Processor

32‧‧‧Display area

FSD‧‧‧Fingerprint sensing drive circuit

TR‧‧‧ signal routing

MUX‧‧‧Multiplexer

FL‧‧‧Fingerprint sensor signal line

SW1~SW3‧‧‧Switch

S _FS ‧‧‧Fingerprint sensor switching signal

OFF‧‧‧Close

ON‧‧‧Open

381~383‧‧‧Fingerprint Sensor

381A‧‧‧Fingerprint sensing area

381B‧‧‧Extension connecting part

382A‧‧‧Fingerprint sensing area

382B‧‧‧Extension connecting part

383A‧‧‧Fingerprint sensing area

383B‧‧‧Extension connecting part

R1~R3‧‧‧Fingerprint sensing area

FPR‧‧‧Finger pressing area

42‧‧‧Mobile device

ALS‧‧‧Ambient Light Sensor

PXS‧‧‧Distance Sensor

IRS‧‧‧Infrared light sensor

PK‧‧‧Pocket

FACE‧‧‧Face

46‧‧‧Flexible substrate display

460‧‧‧Display area

462‧‧‧Light Sensor

462A‧‧‧Light sensing area

462B‧‧‧Extension connecting part

L’‧‧‧Transmitted light

PS‧‧‧Light sensing area

52‧‧‧Flexible substrate display

520‧‧‧Extension connecting part

521‧‧‧Light Sensor

522‧‧‧Light sensing drive circuit

523‧‧‧Flexible circuit board

524‧‧‧Processor

53‧‧‧Display area

54‧‧‧Flexible substrate display

540‧‧‧Extension connecting part

541‧‧‧Light Sensor

542‧‧‧flexible circuit board

543‧‧‧Light sensing drive circuit

544‧‧‧Processor

55‧‧‧Display composition area

PSD‧‧‧Light sensing drive circuit

PL‧‧‧Light sensing signal line

S _PS ‧‧‧Light sensing switching signal

611~613‧‧‧Light Sensor

611A‧‧‧Light sensing area

611B‧‧‧Extension connecting part

612A‧‧‧Light sensing area

612B‧‧‧Extension connecting part

613A‧‧‧Light sensing area

613B‧‧‧Extension connecting part

OB‧‧‧Object

Figure 1 shows a schematic diagram of a conventional capacitive fingerprint recognition technology.

FIG. 2 shows a schematic diagram of a traditional optical fingerprint recognition technology.

FIG. 3 shows a schematic diagram of the optical sensing unit being arranged behind the light-permeable display and using the display light source of the light-permeable display as the sensing light source.

FIG. 4 shows a schematic diagram of a traditional ultrasonic fingerprint recognition technology.

Figure 5 shows a front view of a traditional mobile device with a fingerprint recognition sensor intention.

FIG. 6A shows a schematic diagram of the fingerprint recognition sensor disposed on the back of the mobile device.

FIG. 6B shows a schematic diagram of displaying function buttons through the display area on the front of the mobile device.

FIG. 7 is a schematic diagram showing that the encapsulation layer of the organic light emitting diode panel is a glass substrate.

FIG. 8 is a schematic diagram showing that the encapsulation layer of the organic light emitting diode panel is a thin film encapsulation layer.

FIG. 9 shows a schematic diagram of a thin film encapsulation layer formed by stacking at least one organic layer and an inorganic layer on each other.

10A and 10B are schematic diagrams illustrating the application of a thin film encapsulation layer to a flexible display.

FIG. 11 is a schematic diagram of a flexible substrate display with fingerprint sensing function in an embodiment of the present invention.

12A and 12B are schematic diagrams showing a front view and a back view of bending the fingerprint sensor toward the back of the flexible substrate display.

FIG. 13 shows a side view of the fingerprint sensor being attached to the back surface of the display component area using an adhesive when the fingerprint sensor is bent backward.

14A and 14B are schematic diagrams showing the front view and the back view of the fingerprint sensor when the fingerprint sensor is bent backward, and the fingerprint sensor is attached to the back of the display component area with an adhesive.

FIG. 15 shows a side view of the fingerprint sensor being attached to the back of the display component area using optical transparent glue when the fingerprint sensor is bent backward.

Figure 16 shows that when performing optical fingerprint sensing, since the organic light-emitting diode display layer and the optical transparent glue are both light-transmissive, the optical fingerprint sensor bent at the back of the display can receive the fingerprints The reflected light of the structure depicts a schematic diagram of the fingerprint pattern.

17A and FIG. 17B are schematic diagrams of the structure of the integration of the display unit and the light sensing unit.

FIG. 18 is a schematic diagram showing that, compared with a traditional TFT display that only includes a display unit, the present invention can use a TFT process to form a display unit and a light sensing unit at the same time.

19A to 19E illustrate the steps of simultaneously forming a display area and an optical fingerprint sensing area using a TFT process, and forming a thin film encapsulation layer thereon.

FIG. 20 is a schematic diagram of the component structure of the LTPS optical fingerprint sensor.

Figure 21 shows that when the optical fingerprint sensor is folded back to the back of the display, since the display area, optical transparent glue and substrate are all light-transmitting, light can directly irradiate the semiconductor layer and generate currents of different magnitudes according to the intensity of the light Schematic diagram.

FIG. 22 is a schematic diagram showing that the infrared light filter layer filters out light outside the infrared light band, so that the optical fingerprint sensor only receives infrared light to form an infrared light sensor.

FIG. 23 shows a schematic diagram of an infrared light emitting source attached to the rear of the display and arranged in an area adjacent to the optical fingerprint sensor, so that the optical fingerprint sensor only receives infrared light to form an infrared light sensor.

FIG. 24 is a schematic diagram showing that the light source can also be installed under the optical fingerprint sensor with infrared light detection function.

FIG. 25 illustrates a schematic diagram of a fingerprint sensor adopting ultrasonic sensing technology including a fingerprint sensing area and an extended connection part.

FIG. 26 shows a schematic diagram of the ultrasonic fingerprint sensor UFS bent at the back of the display drawing a fingerprint pattern by the received reflected ultrasonic waves.

27A and 27B show schematic diagrams of the piezoelectric material extending or contracting when two electrodes are connected to both ends of the piezoelectric material and a positive voltage or a negative voltage is applied respectively.

FIG. 27C is a schematic diagram showing that when an AC voltage is applied, the piezoelectric material will oscillate back and forth in a high frequency range to generate ultrasonic waves.

FIG. 28 is a schematic diagram showing that when external ultrasonic waves are transmitted to the piezoelectric material, the piezoelectric material expands or compresses with its oscillation frequency and converts mechanical energy into electrical energy to generate electric current.

29 and FIG. 30 are schematic diagrams showing that the fingerprint sensing driving circuit is coupled to the fingerprint sensor using COP technology, and then coupled to the processor through the flexible circuit board.

FIGS. 31 and 32 show schematic diagrams of the fingerprint sensor driving circuit coupling the fingerprint sensor and the processor through the flexible circuit board using COF technology.

33A and 33B are schematic diagrams showing that the signal trace of the fingerprint sensor is coupled to the fingerprint sensing driving circuit on the flexible circuit board of the display through the extension connecting portion and the edge area of the display.

34A and 34B show schematic diagrams of a fingerprint sensor coupling a signal trace to a fingerprint sensing/display driving circuit with a display driving function and a fingerprint sensing signal receiving function.

35A, 35B and 36 illustrate the multiplexer provided in the edge area of the display can be A schematic diagram of a signal input line (such as a source line) for coupling a display and a fingerprint sensing signal line.

FIG. 37A shows a schematic diagram of the multiplexer being switched to the display mode when the display is driven, so that the fingerprint sensing signal line and the signal input line (such as the source line) of the display are disconnected from each other.

FIG. 37B shows that after the display driving is completed, the multiplexer switches to the fingerprint sensing mode, so that at least part of the fingerprint sensing signal line and the signal input line (such as the source line) of the display are coupled to each other, and the signals of the displays The input line (such as the source line) will be multiplexed as a schematic diagram of the fingerprint sensing signal line.

38, 39A, and 39B are schematic diagrams showing that the display can have multiple fingerprint sensors and can be coupled to different edge regions respectively.

FIG. 40 is a schematic diagram showing the fingerprint sensing area in the display area.

FIG. 41 is a schematic diagram showing a finger pressing area displayed in the display area.

FIG. 42 is a schematic diagram of a front view of a mobile device with different sensing functions.

Figures 43A and 43B show that when the mobile device is taken out of the pocket, the ambient light sensor determines that the user has removed the mobile device from the pocket and is ready to use it, so the mobile device switches its display screen from the original closed state to the unlock screen , And a schematic diagram of switching the touch sensing from the original off mode to the touch sensing mode.

FIG. 44 is a schematic diagram showing that the ambient light sensor can detect the brightness of the external light and adjust the brightness of the display accordingly.

Figure 45 shows that when the distance sensor detects that the amount of reflected light it receives has changed due to the proximity of an external object, the mobile device will turn off its display screen and touch sensing function Yes, to avoid mis-touch operation and reduce power consumption.

FIG. 46 shows a schematic diagram of a display component area and a light sensor formed in a flexible substrate display.

47A and 47B are schematic diagrams showing a front view and a back view when the light sensor is bent toward the back of the flexible substrate display.

FIG. 48 shows a side view of attaching the light sensor to the back of the display component area by using an adhesive when the light sensor is bent backward.

49A and 49B are schematic diagrams showing the front view and the back view of the light sensor when the light sensor is bent backward, and the light sensor is attached to the display component area by the adhesive.

FIG. 50 shows a side view of attaching the light sensor to the back of the display component area by using an optical transparent glue when the light sensor is bent backward.

51A to 51E illustrate the steps of simultaneously forming a display area and a light sensing area by a TFT process, and forming a thin film encapsulation layer thereon.

52 and FIG. 53 show schematic diagrams of the light sensing driving circuit being coupled to the light sensor using the COP technology, and then being coupled to the processor through the flexible circuit board.

FIGS. 54 and 55 show schematic diagrams of the optical sensor driving circuit using COF technology to couple the optical sensor and the processor through a flexible circuit board.

56A and 56B are schematic diagrams showing that the signal traces of the light sensor are coupled to the light sensing driving circuit on the flexible circuit board of the display through the extension connecting portion and the edge area of the display.

57A and 57B show a schematic diagram of a light sensor coupling a signal trace to a light sensing/display driving circuit that has both a display driving function and a function of receiving light sensing signals Figure.

FIGS. 58A, 58B, and 59 are schematic diagrams of multiplexers disposed in the edge area of the display for coupling the signal input line (such as the source line) and the light sensing signal line of the display.

FIG. 60A illustrates a schematic diagram of the multiplexer being switched to the display mode when the display is driven, so that the light sensing signal line and the signal input line (such as the source line) of the display are disconnected from each other.

FIG. 60B shows a schematic diagram of the multiplexer switching to the light sensing mode after the display driving is completed, so that at least part of the light sensing signal lines and the signal input lines (such as the source lines) of the display are coupled to each other.

FIG. 61 is a schematic diagram showing that the display can have multiple light sensors and can be respectively coupled to different edge regions.

FIG. 62 is a schematic diagram showing that the infrared light filter layer filters out light outside the infrared light band, so that the light sensor will only receive infrared light to form an infrared light sensor.

FIG. 63 shows a schematic diagram of an electronic device including an infrared light source emitting infrared light to an object and determining the distance between the object and the electronic device according to the intensity of the infrared light reflected by the object received by the infrared light sensor.

Fig. 64 shows a schematic diagram of an infrared light emitting source attached to the rear of the display and arranged in an area adjacent to the light sensor, so that the light sensor only receives infrared light to form an infrared light sensor.

A preferred embodiment according to the present invention is an integrated sensing power Capable of flexible substrate display. In this embodiment, the flexible substrate display includes a flexible substrate with flexibility, such as an organic light emitting diode substrate. The display component area and the fingerprint sensor can be formed on the flexible substrate, and the fingerprint sensor is not located in the display component area. The fingerprint sensor and the display constituent area are coupled to each other through the flexible substrate, that is, during the panel cutting process, the fingerprint sensor and the display constituent area form a whole without being separated from each other, but not limited to this.

As shown in FIG. 11, in the flexible substrate display 11, a display configuration area 110 and a fingerprint sensor 112 are formed. The display composition area 110 has a display area DA approximately in the center area for displaying images. The display configuration area 110 also has a plurality of edge areas, including a side border area (Side Border Area) BA1, a top border area (Top Border Area) BA2, and a bottom border area (Bottom Border Area) BA3.

The bottom edge area BA3 is used to couple the display driver (not shown) and the display area DA. In practical applications, the COF (Chip on Film) method can be used to couple the FPC with the display driver to the flexible substrate or the COP (Chip on Plastic) method to directly couple the display driver to the flexible substrate. The scan driver can be directly formed on the side edge area BA1 by using a gate driver on array technology and a thin film transistor process of the panel. The fingerprint sensor 112 includes a fingerprint sensing area 112A and an extension connecting portion 112B, and is coupled to the fingerprint sensing area 112A and the top edge area BA2 through the extension connecting portion 112B. The fingerprint sensor 112 can be constructed using conventional fingerprint sensing technology.

As shown in FIGS. 12A and 12B, since the flexible substrate is flexible, the fingerprint sensor 112 can be bent toward the back of the flexible substrate display 11. As shown in Figure 13, when the fingerprint sensor 112 is bent backward, the adhesive ADH can be used to The sensor 112 is attached to the back of the display configuration area 110, so that the fingerprint sensor 112 can be fixed to a specific position on the back of the flexible substrate display 11, as shown in FIGS. 14A and 14B. In practical applications, the fingerprint sensor 112 can use optical sensing technology, which can use a conventional a-Si or LTPS light sensor to form a photosensitive element, and its adhesive can be an optical transparent adhesive OCA, as shown in Figure 15. Shown.

As shown in FIG. 16, when performing optical fingerprint sensing, the organic light emitting diode display layer DP located above the optical fingerprint sensor OFS can emit light. When these light rays are irradiated to the finger, the reflected light intensity of the valley FV and the protrusion FR on the fingerprint is different. Since the organic light-emitting diode display layer DP and the optically transparent adhesive OCA are both light-transmissive, the optical fingerprint sensor OFS bent at the back of the display can receive the reflected light of these fingerprint structures and draw a picture Fingerprint graphics. In practical applications, the light sensor can be formed by a thin film transistor process. Please refer to FIG. 17. FIG. 17 is a schematic diagram showing an integrated architecture of the display unit (display pixel) DPX and the light sensing unit (photo sensing pixel) SPX. On the same substrate, the display unit DPX and the light sensing unit SPX can be fabricated at the same time in different areas with an integrated process. The sensing principle of the light sensing unit SPX is to use light L to irradiate amorphous silicon (a-Si) or low temperature poly-silicon (Low Temperature Poly-Silicon, LTPS) to generate a current I. By sensing the current I The size can get the intensity of the illuminating light L.

As shown in FIG. 18, the traditional organic light emitting diode display only includes the display unit DPX, and the present invention can use the thin film transistor process to form the display unit DPX and the light sensing unit SPX at the same time, so that the organic light emitting diode display can have The light sensing function forms a display with built-in ambient light sensing function.

Please refer to FIG. 19A to FIG. 19E, the manufacturing method may include the following steps: As shown in FIG. 19A, a flexible substrate FSUB is formed; as shown in FIG. 19B, a thin film transistor element layer is formed on the flexible substrate FSUB, which includes a display driving area DL for driving the display and an optical fingerprint sensor for sensing light Area OFS; as shown in FIG. 19C, an organic light emitting diode layer OLED is formed above the display driving area DL; as shown in FIG. 19D, a cathode layer CA is formed above the organic light emitting diode layer OLED; as shown in FIG. 19E, in the display A thin-film encapsulation layer TFE is formed above the driving area DL and the optical fingerprint sensing area OFS, so as to isolate the external water and oxygen from intruding and avoid damaging the organic light emitting diode material.

As for the element structure of the low-temperature polysilicon (LTPS) optical fingerprint sensor, as shown in Figure 20, semiconductor layers p-Si and n+ are formed on a flexible flexible substrate SUB; on the semiconductor layers p-Si and n+ A gate insulating layer GI is formed; a gate layer G is formed on the gate insulating layer GI; a passivation layer PA is formed on the gate layer G; the source S and the drain D can pass through the passivation layer PA and the gate The through hole (Via) of the insulating layer GI is conducted to the semiconductor layer n+; a thin-film encapsulation layer TFE is formed on the top to prevent water and oxygen from entering.

As shown in Figure 21, when the optical fingerprint sensor is folded back to the back of the display, the positions of the semiconductor layers p-Si and n+ are close to the back of the display, and since the display driving area DL, optical transparent adhesive OCA, and substrate SUB all have light transmission Therefore, the light L can directly irradiate the semiconductor layers p-Si and n+, and the current I of different magnitudes will be generated according to the intensity of the light L. In practical applications, the fingerprint sensor can further detect infrared light IR, so as to achieve finer sensing and fingerprint anti-counterfeiting effects. As shown in Figure 22, a fingerprint sensor with infrared light detection function can add an infrared light filter layer IRPF between the optical fingerprint sensor OFS and the optical transparent adhesive OCA to filter out light outside the infrared light band. As a result, the optical fingerprint sensor OFS only receives infrared light IR, and forms an infrared light sensor.

In addition, as shown in Figure 23, in addition to adding an infrared light filter layer IRPF between the optical fingerprint sensor OFS and the optical transparent adhesive OCA, the infrared light emitting source IRLED can also be further attached to the rear of the display and arranged at The area adjacent to the optical fingerprint sensor OFS makes the optical fingerprint sensor OFS only receive the infrared light IR3 and form an infrared light sensor.

As shown in Figure 24, the light source LED can also be installed under the optical fingerprint sensor OFS with infrared light detection function. The light L emitted by the light source LED may be infrared light or non-infrared light. When the light L emitted by the light source LED is not infrared light, the infrared light filter layer IRPF located above it can filter out the non-infrared light band in the light L to form infrared light IR. When the non-infrared light is irradiated vertically upward to the finger FG, it will be reflected by the fingerprint structure of the finger FG to form infrared light IR1, which vertically downward becomes infrared light IR2, which is received by the optical fingerprint sensor OFS.

In another embodiment, the fingerprint sensor can also use ultrasonic sensing technology, which can use piezoelectric materials to form ultrasonic transmitting and receiving elements, but not limited to this. As shown in FIG. 25, a fingerprint sensor 252 using ultrasonic sensing technology includes a fingerprint sensing area 252A and an extension connecting portion 252B. When the fingerprint sensor 252 is bent backward, the adhesive ADH can be used to attach the fingerprint sensor 22 to the back of the display configuration area 250 so that the fingerprint sensor 252 can be fixed to a specific position of the flexible substrate display 25.

As shown in Figure 26, the ultrasonic waves US1 and US2 emitted by the ultrasonic fingerprint sensor UFS on the back of the display are respectively transmitted to the protrusion FR on the fingerprint Unlike the valley FV, different reflected ultrasonic waves are generated. Therefore, the ultrasonic fingerprint sensor UFS bent at the back of the display can receive the reflected ultrasonic waves and draw fingerprint patterns.

The ultrasonic fingerprint sensor UFS can be formed using piezoelectric materials. Piezoelectric material is a material that can convert electrical energy and mechanical energy into each other. As shown in FIG. 27A and FIG. 27B, when the electrodes E1 and E2 are connected to the two ends of the piezoelectric material PZ and a positive voltage or a negative voltage is applied respectively, the piezoelectric material PZ will expand or contract. Therefore, as shown in FIG. 27C, when an alternating voltage AC is applied, the piezoelectric material PZ will oscillate back and forth and oscillate the surrounding medium (for example, air). When the frequency of its vibration is in the high frequency range, ultrasonic waves US that the human ear cannot detect can be generated.

As shown in Figure 28, due to the conversion relationship between electrical energy and mechanical energy, when the ultrasonic wave US emitted by the external ultrasonic source USS is transmitted to the piezoelectric material PZ, the piezoelectric material PZ will also elongate or follow its oscillation frequency. Compress and convert the oscillating mechanical energy into electrical energy to generate a current I. In this way, the energy intensity of the external oscillation can be known according to the magnitude of the sensed current I. It should be noted that since the above-mentioned various fingerprint sensors are bent backward to the back of the display, they will not occupy any edge area of the display, nor will it occupy the border area of the electronic product. Therefore, the present invention can provide the display screen fingerprint sensing function while maintaining the narrow frame of the electronic product.

As shown in FIGS. 29 and 30, the fingerprint sensing drive circuit 292 can be coupled to the fingerprint sensor 291 using COP technology, and then coupled to the processor 294 through the flexible circuit board 293 to control the opening of the fingerprint sensor 291 Or close. The processor 294 can be based on The sensed light intensity or ultrasonic signal is used to identify the fingerprint pattern and determine whether to perform the external control function of the electronic device (such as the device unlocking function or the online payment function).

As shown in FIG. 31 and FIG. 32, the fingerprint sensor driving circuit 313 can use COF technology to couple the fingerprint sensor 311 and the processor 314 through the flexible circuit board 312 to control the fingerprint sensor 311 to turn on or off. The processor 314 can recognize the fingerprint pattern according to the sensed light intensity or ultrasonic signal and determine whether to perform an external control function of the electronic device (such as a device unlocking function or an online payment function).

As shown in FIGS. 33A and 33B, the signal trace TR of the fingerprint sensor 311 can be coupled to the fingerprint sensing driving circuit FSD on the flexible circuit board DFPC of the display through the extension connection 310 and the edge area of the display, so that the fingerprint The sensor 311 does not need to be additionally provided with a flexible circuit board to be coupled to the fingerprint sensing driving circuit FSD.

As shown in FIGS. 34A and 34B, the fingerprint sensor 311 can also couple the signal trace TR to the fingerprint sensing/display driving circuit FSD/DIC, which has a display driving function and a fingerprint sensing signal receiving function.

In addition, as shown in FIG. 35A, FIG. 35B, and FIG. 36, the multiplexer MUX disposed in the edge area BA of the display can be used to couple the signal input line (such as the source line) SL of the display and the fingerprint sensing signal line FL.

As shown in Figure 37A, when the display is driven, the multiplexer MUX can be switched to the display mode. At this time, the fingerprint sensing switching signal SFS is in the OFF state, and the switches SW1~SW3 are not turned on, making the fingerprint sensing The signal line FL and the signal input line (such as the source line) SL of the display are disconnected from each other.

As shown in Figure 37B, when the display driver is over, the multiplexer MUX Switch to the fingerprint sensing mode. At this time, the fingerprint sensing switching signal SFS is in the ON state, and the switches SW1~SW3 are at least partially turned on, so that at least part of the fingerprint sensing signal line FL and the signal input line of the display (such as source Polar lines) SL are coupled to each other. At this time, the signal input lines (such as source lines) SL of the displays will be multiplexed as fingerprint sensing signal lines FL.

With the aforementioned multiplexer MUX switching function, the fingerprint sensing signal line FL can be connected to the fingerprint sensing/display driving circuit FSD/DIC through the signal input line (such as the source line) SL passing through the display area of the display, and There is no need to route wires through the edge area of the display, so the bezel width of the display can be further reduced.

As shown in FIGS. 38, 39A, and 39B, the fingerprint sensing area 381A of the fingerprint sensor 381 can be coupled to the top edge area BA2 through the extension connecting portion 381B, but not limited to this. For example, the fingerprint sensing area 382A of the fingerprint sensor 382 can be coupled to the side edge area BA1 through the extension connection 382B; the fingerprint sensing area 383A of the fingerprint sensor 383 can be coupled to the bottom edge area through the extension connection 383B BA3. In addition, the display can have one or more fingerprint sensors, and there is no specific limitation.

Since the fingerprint sensor is bent to the rear of the display, when performing fingerprint sensing, a prompt screen corresponding to the fingerprint sensing area of the fingerprint sensor can be displayed in the display area DA, such as the fingerprint shown in Figure 40 The sensing areas R1 to R3 or the finger pressing area FPR shown in FIG. 41 can assist the user's finger FG to smoothly press to the correct fingerprint sensing area. In fact, when the device is performing fingerprint sensing, the device can also use vibration, sound effects or screen display to remind the user that the fingerprint sensing area has been pressed correctly and the fingerprint sensing function is in progress, but not limited to this .

Please refer to FIG. 42, the front of the mobile device 42 usually includes a display area DA with a display function and a non-display area BA without a display function. In the non-display area BA, components such as the button FB, the front lens FC, the speaker SP, the ambient light sensor ALS, and the distance sensor PXS are usually arranged. Among them, the distance sensor PXS includes an infrared light source IRLED and an infrared light sensor IRS. The ambient light sensor ALS is used to sense changes in external ambient light, and perform appropriate function switching of the mobile device 42 through the changes in ambient light.

For example, as shown in FIGS. 43A and 43B, when the mobile device 42 is taken out of the pocket PK, the ambient light sensor ALS senses that the light L from the outside world changes from dark to bright, and it can be estimated that the user has Move the mobile device 42 out of the pocket PK, and prepare to use the mobile device 42. Therefore, the mobile device 42 can switch its display screen from the original closed state to the unlocked screen, and switch the touch sensing from the original closed mode to the touch sensing mode in preparation for accepting user operations. For users, when they take out the mobile device, they can directly unlock it intuitively, without manually starting the unlocking mode, so an intuitive and smooth use experience can be achieved.

In fact, in addition to waking up the touch screen to input a password, the unlocking method can also wake up a biometric device, such as a fingerprint sensor or an iris sensor, but not limited to this.

For another example, as shown in FIG. 44, the ambient light sensor ALS can detect the brightness of the external light L, and thereby adjust the brightness of the display. Therefore, when the user is outdoors in a brighter environment, the brightness of the display will automatically adjust to the ambient light, so that the user can still see the display clearly outdoors; when the user is in a room or When the device is used at night, the brightness of the display will be automatically dimmed with the ambient light, so that the user will not feel glare and power consumption can be reduced.

The distance sensor PXS transmits infrared light to the object through the infrared light source IRLED and senses the intensity of the infrared light reflected by the object through the infrared light sensor IRS, so as to obtain the distance between the external object and the device.

For example, when a user operates a mobile device to answer a call, he will put the mobile device close to his face to speak or listen to voices, as shown in Figure 45. At this time, the light L originally received by the distance sensor PXS will be affected by the face. The FACE is blocked and cannot be received. Because the user does not need to watch the screen or operate the touch at this time, when the distance sensor PXS senses that the amount of reflected light it receives changes due to the proximity of external objects, the mobile device The display screen and touch sensing function will be turned off to avoid false touch operations and reduce power consumption.

In another embodiment, a display component area and a light sensor are formed in the flexible substrate display, and the light sensor is not located in the display component area. The light sensor and the display component area are connected by a flexible substrate, that is, during the panel cutting process, the light sensor and the display component area form a whole without being separated from each other, but not limit.

As shown in FIG. 46, in the flexible substrate display 46, a display configuration area 460 and a light sensor 462 are formed. The display composition area 460 has a display area DA approximately in the center area for displaying images.

The display configuration area 460 also has a plurality of edge areas, including a side edge area BA1, a top edge area BA2, and a bottom edge area BA3. The bottom edge area BA3 is used to couple the display Display driver (not shown) and display area DA. In practical applications, the COF (Chip on Film) method can be used to couple the FPC with the display driver to the flexible substrate or the COP (Chip on Plastic) method to directly couple the display driver to the flexible substrate. The scan driver can be directly formed on the side edge area BA1 by the Gate Driver on Array technology using the TFT process of the panel. The light sensor 462 includes a light sensing area 462A and an extension connecting portion 462B, and the light sensing area 462A and the top edge area BA2 are coupled through the extension connecting portion 462B. The light sensor 462 can be constructed using conventional TFT light sensor technology.

As shown in FIGS. 47A and 47B, since the flexible substrate is flexible, the light sensor 462 can be bent toward the back of the flexible substrate display 46. As shown in FIG. 48, when the light sensor 462 is bent backward, the light sensor area 462A of the light sensor 462 can be attached to the back of the display configuration area 460 by the adhesive ADH, so that the light sensor 462 It can be fixed to a specific position of the flexible substrate display 46, and the schematic diagrams of the front and back viewing angles are shown in FIGS. 49A and 49B.

As shown in FIG. 50, when the light sensor 462 is bent backward, the light sensing area 462A of the light sensor 462 can also be attached to the back of the display configuration area 460 by using an optical transparent adhesive OCA. Since the display area 47 and the optical transparent adhesive OCA are light-transmissive, the light-sensing area 462A bent at the rear of the display can receive the transmitted light L', thereby achieving the effect of sensing light.

It should be noted that since the light sensor 462 is bent backward to the back of the display, it will not occupy any edge area of the display, nor will it occupy the border area of the electronic product. Therefore, the present invention can provide the function of light sensing while maintaining the narrow frame of the electronic product.

Please refer to FIG. 51A to FIG. 51E, the process method may include the following steps: as shown in FIG. 51A, forming a flexible substrate FSUB; as shown in FIG. 51B, forming a TFT element layer on the flexible substrate FSUB, which includes Display driving area DL and light sensing area PS for sensing light; as shown in FIG. 51C, an organic light emitting diode layer OLED is formed above the display driving area DL; as shown in FIG. 51D, above the organic light emitting diode layer OLED A cathode layer CA is formed; as shown in FIG. 51E, a thin-film encapsulation layer TFE is formed on the uppermost layer of the display driving area DL and the light sensing area PS, so as to isolate water and oxygen from intruding from the outside and avoid damaging the organic light emitting diode material.

As shown in FIG. 52 and FIG. 53, the light sensing driving circuit 522 can be coupled to the light sensor 521 using COP technology, and then coupled to the processor 524 through the flexible circuit board 523 to control the opening of the light sensor 521 Or turn it off, and convert the photoelectric signal generated by the external incident into a light intensity signal. The processor 524 can determine whether to perform an external control function of the electronic device (for example, display brightness adjustment or display function off/on) according to the light intensity signal.

As shown in FIGS. 54 and 55, the light sensing driving circuit 543 can use COF technology to couple the light sensor 541 and the processor 544 through the flexible circuit board 542 to control the light sensor 541 to turn on or off. The processor 544 can determine whether to perform an external control function of the electronic device (for example, display brightness adjustment or display function off/on) according to the light intensity signal.

As shown in FIGS. 56A and 56B, the signal trace TR of the light sensor 541 can be coupled to the light sensor driving circuit PSD on the flexible circuit board DFPC of the display through the extension connection 540 and the edge area of the display, so that the light No additional sensor 541 The flexible circuit board is set to be coupled to the light sensing driving circuit PSD.

As shown in FIG. 57A and FIG. 57B, the light sensor 541 can also couple the signal trace TR to the light sensing/display driving circuit PSD/DIC which has a display driving function and a function of receiving light sensing signals.

In addition, as shown in FIGS. 58A to 58B and FIG. 59, the multiplexer MUX disposed in the edge area BA of the display can be used to couple the signal input line (such as the source line) SL and the light sensing signal line PL of the display.

As shown in Figure 60A, when the display is driven, the multiplexer MUX can be switched to the display mode. At this time, the light sensing switching signal SPS is in the OFF state, and the switches SW1 ~ SW3 are not turned on, making the light sensing The signal line PL and the signal input line (such as the source line) SL of the display are disconnected from each other.

As shown in FIG. 60B, when the display driving is finished, the multiplexer MUX can be switched to the light sensing mode. At this time, the light sensing switching signal SPS is in the ON state, and the switches SW1 ~ SW3 are at least partially turned on, so that At least part of the light sensing signal line PL and the signal input line (such as the source line) SL of the display are coupled to each other. At this time, the signal input lines (for example, source lines) SL of the displays will be multiplexed as the light sensing signal lines PL.

With the aforementioned multiplexer MUX switching function, the light sensing signal line PL can be connected to the light sensing/display driving circuit PSD/DIC through the signal input line (such as the source line SL) passing through the display area of the display, and There is no need to route wires through the edge area of the display, so the bezel width of the display can be further reduced.

As shown in FIG. 61, the light sensing area 611A of the light sensor 611 can be coupled to the top edge area BA2 through the extension connecting portion 611B, but it is not limited to this. For example, light perception The light sensing area 612A of the sensor 612 can be coupled to the side edge area BA1 through the extension connection portion 612B; the light sensing area 613A of the photo sensor 613 can be coupled to the bottom edge area BA3 through the extension connection portion 613B. In addition, the display may have one or more light sensors, and there is no specific limitation.

In practical applications, the light sensor can further detect the infrared light IR to be used as a distance sensor. As shown in Figure 62, a light sensor with infrared light detection function can add an infrared light filter layer IRPF between the light sensor PS and the optical transparent adhesive OCA, so as to filter out the light outside the infrared light band, making the light The sensor PS only receives infrared light IR, and forms an infrared light sensor.

As shown in FIG. 63, the electronic device may include an infrared light source IRS (such as an infrared light LED) to emit infrared light IR to the object OB and determine the object OB according to the intensity of the infrared light IR1 reflected by the object OB received by the infrared light sensor The distance to the electronic device.

In practical applications, the infrared light source IRS can utilize existing infrared light modules in electronic devices, such as infrared light LED light sources for facial recognition or iris recognition, but not limited to this.

In addition, as shown in Figure 64, in addition to adding an infrared light filter layer IRPF between the light sensor PS and the optical transparent adhesive OCA, the infrared light emitting source IRLED can also be attached to the rear of the display and placed adjacent The area of the light sensor PS is such that the light sensor PS only receives the infrared light IR3 and forms an infrared light sensor.

Compared with the prior art, the flexible substrate display with integrated sensing function of the present invention is to bend various sensors back to the back of the flexible substrate display. It will occupy any edge area of the flexible substrate display, and will not occupy the frame area of the electronic product. Therefore, the flexible substrate display with integrated sensing function of the present invention can provide the function of fingerprint sensing on the display screen while maintaining the narrow frame of the electronic product, thereby effectively improving the disadvantages of the prior art.

Through the detailed description of the preferred embodiments above, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, its purpose is to cover various changes and equivalent arrangements within the scope of the patent application for the present invention.

11‧‧‧Flexible substrate display

110‧‧‧Display area

112‧‧‧Fingerprint Sensor

112A‧‧‧Fingerprint sensing area

112B‧‧‧Extension connecting part

BA1‧‧‧Side edge area

BA2‧‧‧Top edge area

BA3‧‧‧Bottom edge area

DA‧‧‧Display area

Claims (20)

A flexible substrate display with integrated sensing function, comprising: a display composition area located on a first side of the flexible substrate display, the display composition area including a display area and a non-display area, wherein the display area is used for display The screen and the non-display area are located outside the display area; and a sensor including a sensing area and an extension connection portion, wherein the sensor is coupled to the non-display area through the extension connection portion; wherein, When the sensor is bent toward a second surface of the flexible substrate display, the sensor is fixed to a specific position on the second surface of the flexible substrate display and performs a sensing function through the sensing area , And the second surface is opposite to the first surface. According to the flexible substrate display described in claim 1, wherein the sensor and the display constituent area are coupled to each other through a flexible substrate without being separated from each other. In the flexible substrate display described in claim 1, wherein the sensor is a fingerprint sensor and the sensing function is a fingerprint sensing function. The flexible substrate display described in item 3 of the scope of patent application, wherein the fingerprint sensor adopts optical sensing technology to perform the fingerprint sensing function. In the flexible substrate display described in item 3 of the scope of patent application, the fingerprint sensor adopts ultrasonic sensing technology to perform the fingerprint sensing function. As for the flexible substrate display described in claim 1, wherein the sensor is a light sensor and the sensing function is a light sensing function. The flexible substrate display described in item 1 of the scope of patent application, wherein the sensor It is fixed to the specific position on the second surface of the flexible substrate display through an adhesive. The flexible substrate display according to the first item of the scope of patent application, wherein the sensor is fixed to the specific position on the second surface of the flexible substrate display through an optical transparent glue. As described in item 8 of the scope of patent application, the flexible substrate display further includes: an infrared light filter layer disposed between the sensor and the optical transparent glue to filter out light outside the infrared light band so that the The sensor only receives infrared light to form an infrared light sensor. The flexible substrate display described in item 9 of the scope of patent application further includes: an infrared light emitting source arranged on the second surface of the flexible substrate display and adjacent to the sensor for emitting an infrared light. In the flexible substrate display described in claim 1, wherein the non-display area includes an edge area, and the sensor is coupled to the edge area through the extension connecting portion. In the flexible substrate display described in claim 11, the non-display area further includes another edge area for coupling the display area and a display driver. In the flexible substrate display described in claim 12, the display driver is arranged on a flexible circuit board and is coupled to the other edge area through the flexible circuit board. In the flexible substrate display described in claim 12, the display driver is directly coupled to the other edge area. The flexible substrate display according to claim 11, wherein the non-display area further includes another edge area, and a scan driver is formed on the other edge District. In the flexible substrate display described in the 15th patent application, the scan driver is directly formed on the other edge area by using a gate driver on array technology and a thin film transistor process. The flexible substrate display described in item 11 of the scope of patent application further includes: a multiplexer disposed in the edge area for coupling the plurality of signal input lines of the flexible substrate display and the plurality of sensors respectively A sensing signal line. The flexible substrate display according to item 17 of the scope of patent application, wherein when the flexible substrate display is driven, the multiplexer switches to a display mode and controls the signal input lines and the sensing signal lines to be disconnected from each other; When the flexible substrate display finishes driving, the multiplexer switches to a sensing mode and controls at least part of the signal input lines and at least part of the sensing signal lines to be coupled to each other, and at least part of the signals The input line will be reused as a sensing signal line. The flexible substrate display according to the first item of the patent application, wherein a laminated structure of the flexible substrate display includes: a flexible substrate; a thin film transistor element layer formed on the flexible substrate, and the thin film transistor element layer It includes a display driving area and a sensing area; an organic light emitting diode layer formed above the display driving area; an electrode layer formed above the organic light emitting diode layer; and a thin film encapsulation layer relative to the flexible The substrate is formed above the display driving area and the sensing area. The flexible substrate display according to claim 1, wherein a laminated structure of the sensor includes: a flexible substrate; a semiconductor layer formed on the flexible substrate; and a gate insulating layer formed on the flexible substrate On the semiconductor layer; a gate layer formed on the gate insulating layer; a passivation layer formed on the gate layer; a source and a drain formed on the passivation layer, the source and the The drain electrode is conducted to the semiconductor layer through a through hole passing through the passivation layer and the gate insulating layer; and a thin film encapsulation layer is formed on the passivation layer, the source electrode and the drain electrode relative to the flexible substrate .

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