TW202030556A - Metrology for a body of a gas discharge stage - Google Patents
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Abstract
Description
所揭示主題係關於控制氣體放電載台之主體的定位或對準以改良氣體放電載台之效能。The disclosed subject relates to controlling the positioning or alignment of the main body of the gas discharge stage to improve the performance of the gas discharge stage.
在半導體微影(或光微影)中,製造積體電路(IC)需要對半導體(例如,矽)基板(其亦稱作晶圓)執行之多種物理及化學處理程序。微影曝光裝置(其亦稱作掃描器)為將所要圖案施加至基板之目標區上的機器。基板經固定至載台,使得基板大體上沿著由掃描器之正交XL 方向及YL 方向界定之影像平面延伸。基板係藉由光束照射,該光束具有在紫外線範圍中的在可見光與x射線之間的某處之波長,且由此具有在約10奈米(nm)至約400 nm之間的波長。因此,光束可具有在深紫外線(DUV)範圍中之波長(例如,具有可自約100 nm降至約400 nm之波長),或在極紫外線(EUV)範圍中之波長(具有在約10 nm與約100 nm之間的波長)。此等波長範圍並不準確,且可存在光被視為DUV抑或EUV之間的重疊。In semiconductor lithography (or photolithography), the manufacture of integrated circuits (ICs) requires various physical and chemical processing procedures performed on semiconductor (eg, silicon) substrates (which are also called wafers). The lithography exposure device (which is also called a scanner) is a machine that applies a desired pattern to a target area of a substrate. The substrate is fixed to the stage so that the substrate extends substantially along the image plane defined by the orthogonal X L and Y L directions of the scanner. The substrate is irradiated with a beam of light having a wavelength somewhere between visible light and x-rays in the ultraviolet range, and thus has a wavelength between about 10 nanometers (nm) and about 400 nm. Therefore, the light beam can have a wavelength in the deep ultraviolet (DUV) range (for example, a wavelength that can be reduced from about 100 nm to about 400 nm), or a wavelength in the extreme ultraviolet (EUV) range (with a wavelength in the range of about 10 nm And a wavelength between about 100 nm). These wavelength ranges are not accurate, and there may be overlaps between whether light is considered DUV or EUV.
光束沿著一軸向方向行進,該軸向方向與掃描器之ZL 方向對應。掃描器之ZL 方向正交於影像平面(XL -YL )。光束通過束遞送單元,經由倍縮光罩(或光罩)過濾,且接著投影至經製備基板上。基板與光束之間的相對定位係在影像平面中移動且處理程序係在基板之每一目標區處重複。以此方式,晶片設計被圖案化至光阻上,該光阻接著經蝕刻及清洗,且接著重複該處理程序。The light beam travels along an axial direction that corresponds to the Z L direction of the scanner. The Z L direction of the scanner is orthogonal to the image plane (X L -Y L ). The light beam passes through the beam delivery unit, is filtered by a reduction mask (or mask), and then projected onto the prepared substrate. The relative positioning between the substrate and the beam moves in the image plane and the processing procedure is repeated at each target area of the substrate. In this way, the wafer design is patterned onto the photoresist, which is then etched and cleaned, and then the process is repeated.
在一些一般態樣中,光源裝置包括:一氣體放電載台,其包括一氣體放電載台,該氣體放電載台包括界定經組態以與一能量源相互作用之一空腔的一三維主體,該主體包括可透射具有在紫外線範圍中之一波長之一光束的至少兩個埠;一感測器系統,其包含複數個感測器,每一感測器經組態以量測該氣體放電載台之該主體的一各別相異區相對於彼感測器的一實體態樣;及一控制裝置,其與該感測器系統通信。該控制裝置經組態以分析來自該等感測器之所量測實體態樣,以藉此判定該氣體放電載台之該主體在由一X軸界定之一XYZ座標系統中的一定位,其中該X軸係由該氣體放電載台之幾何結構界定。In some general aspects, the light source device includes: a gas discharge stage including a gas discharge stage including a three-dimensional body defining a cavity configured to interact with an energy source, The main body includes at least two ports that can transmit a light beam having a wavelength in the ultraviolet range; a sensor system including a plurality of sensors, each of which is configured to measure the gas discharge A physical aspect of a distinct area of the main body of the carrier relative to the sensor; and a control device that communicates with the sensor system. The control device is configured to analyze the measured physical state from the sensors to thereby determine the position of the main body of the gas discharge stage in an XYZ coordinate system defined by an X axis, The X axis is defined by the geometric structure of the gas discharge stage.
實施可包括以下特徵中之一或多者。舉例而言,光源裝置亦可包括經組態以量測由氣體放電載台產生的光束之一或多個效能參數的量測系統。控制裝置可與量測系統通信。控制裝置可經組態以:分析氣體放電載台之主體在XYZ座標系統中的定位及光束之一或多個所量測效能參數兩者;及判定對氣體放電載台之主體的定位之修改是否將改良所量測效能參數中之一或多者。光源裝置可包括實體耦接至氣體放電載台之主體且經組態以調整氣體放電載台之主體的定位的致動系統。控制裝置可與致動系統通信。控制裝置可經組態以基於關於氣體放電載台之主體的定位是否應被修改的判定而將一信號提供至致動系統。致動系統可包括複數個致動器,每一致動器經組態以與氣體放電載台之主體的區實體通信。每一致動器可包括機電器件、伺服系統、電伺服系統、液壓伺服系統及/或氣動伺服系統中之一或多者。Implementations can include one or more of the following features. For example, the light source device may also include a measurement system configured to measure one or more performance parameters of the light beam generated by the gas discharge stage. The control device can communicate with the measurement system. The control device can be configured to: analyze the position of the main body of the gas discharge stage in the XYZ coordinate system and one or more of the measured performance parameters of the beam; and determine whether the position of the main body of the gas discharge stage has been modified One or more of the measured performance parameters will be improved. The light source device may include an actuation system physically coupled to the body of the gas discharge stage and configured to adjust the positioning of the body of the gas discharge stage. The control device can communicate with the actuation system. The control device may be configured to provide a signal to the actuation system based on a determination as to whether the positioning of the main body of the gas discharge stage should be modified. The actuation system may include a plurality of actuators, each of which is configured to physically communicate with the area of the main body of the gas discharge stage. Each actuator may include one or more of electromechanical devices, servo systems, electric servo systems, hydraulic servo systems, and/or pneumatic servo systems.
控制裝置可經組態以藉由判定氣體放電載台之主體自X軸的平移或氣體放電載台之主體自X軸的旋轉而判定氣體放電載台之主體在XYZ座標系統中的定位。氣體放電載台之主體自X軸的平移可包括以下各者中的一或多者:氣體放電載台之主體沿著X軸的平移、氣體放電載台之主體沿著與X軸垂直之Y軸的平移,及/或氣體放電載台之主體沿著與X軸及Y軸垂直之Z軸的平移。氣體放電載台之主體自X軸的旋轉可包括以下各者中的一或多者:氣體放電載台之主體繞X軸的旋轉、氣體放電載台之主體繞與X軸垂直之Y軸的旋轉,及/或氣體放電載台之主體沿著與X軸及Y軸垂直之Z軸的旋轉。The control device can be configured to determine the position of the main body of the gas discharge stage in the XYZ coordinate system by determining the translation of the main body of the gas discharge stage from the X axis or the rotation of the main body of the gas discharge stage from the X axis. The translation of the main body of the gas discharge stage from the X axis may include one or more of the following: the translation of the main body of the gas discharge stage along the X axis, and the main body of the gas discharge stage along Y which is perpendicular to the X axis The translation of the axis, and/or the translation of the main body of the gas discharge stage along the Z axis perpendicular to the X axis and the Y axis. The rotation of the main body of the gas discharge stage from the X axis may include one or more of the following: the rotation of the main body of the gas discharge stage around the X axis, the main body of the gas discharge stage around the Y axis perpendicular to the X axis Rotation, and/or the rotation of the main body of the gas discharge stage along the Z axis perpendicular to the X axis and the Y axis.
每一感測器可經組態以將自感測器至氣體放電載台之主體的距離量測為氣體放電載台之主體相對於彼感測器之實體態樣。Each sensor can be configured to measure the distance from the sensor to the body of the gas discharge stage as the physical state of the body of the gas discharge stage relative to the other sensor.
氣體放電載台可包括在主體之第一末端處之束轉向器件及在主體之第二末端處之束耦合器,該束轉向器件及該束耦合器與X軸相交,使得在氣體放電載台中產生的光束與束耦合器及束轉向器件相互作用。當氣體放電載台之主體處於一系列可接受位置內時,能量源可供應能量至主體之空腔,且可對準該束轉向器件及束耦合器,產生光束。光束可為具有在紫外線範圍中之波長的經放大光束。束轉向器件可為包括用於選擇及調整光束之波長的複數個光學件的光模組,且束耦合器包括部分反射鏡。束轉向器件可包括光學件之配置,該配置經組態以接收經由第一埠射出氣體放電載台之主體的光束且改變光束之方向以使得光束經由該第一埠再進入氣體放電載台之主體。氣體放電載台亦可包括經組態以當光束行進於束耦合器與空腔之間時與光束相互作用的擴束器。The gas discharge stage may include a beam steering device at the first end of the main body and a beam coupler at the second end of the main body, the beam steering device and the beam coupler intersect the X axis so that in the gas discharge stage The generated beam interacts with the beam coupler and beam steering device. When the main body of the gas discharge stage is in a series of acceptable positions, the energy source can supply energy to the cavity of the main body, and can be aligned with the beam steering device and beam coupler to generate a light beam. The light beam may be an amplified light beam having a wavelength in the ultraviolet range. The beam steering device may be an optical module including a plurality of optical elements for selecting and adjusting the wavelength of the beam, and the beam coupler includes a partial reflector. The beam steering device may include a configuration of optical parts configured to receive the light beam emitted from the main body of the gas discharge stage through the first port and change the direction of the light beam so that the light beam enters the gas discharge stage through the first port main body. The gas discharge stage may also include a beam expander configured to interact with the beam as it travels between the beam coupler and the cavity.
每一感測器可經組態以相對於氣體放電載台之主體固定地安裝。每一感測器可經組態以當其相對於氣體放電載台之主體固定地安裝時與另一感測器相隔一定距離地固定。Each sensor can be configured to be fixedly mounted relative to the main body of the gas discharge stage. Each sensor can be configured to be fixed at a distance from the other sensor when it is fixedly installed relative to the main body of the gas discharge stage.
光源裝置亦可包括:與氣體放電載台光學串聯的第二氣體放電載台及第二複數個感測器。第二氣體放電載台包括界定經組態以與能量源相互作用的第二空腔之第二三維主體,該第二主體包括可透射具有在紫外線範圍中之波長之光束的至少兩個埠。第二複數個感測器中之每一感測器可經組態以量測第二主體之各別相異區相對於彼感測器的實體態樣。控制裝置可與第二複數個感測器通信,且可經組態以分析來自第二複數個感測器中之感測器的所量測實體態樣,以藉此判定第二主體相對於由通過第二主體之至少兩個埠的第二X軸界定之第二XYZ座標系統的定位。The light source device may also include: a second gas discharge stage and a second plurality of sensors optically connected in series with the gas discharge stage. The second gas discharge stage includes a second three-dimensional body defining a second cavity configured to interact with the energy source, the second body including at least two ports that can transmit light beams having wavelengths in the ultraviolet range. Each sensor of the second plurality of sensors can be configured to measure the physical state of the respective distinct area of the second body relative to the other sensor. The control device can communicate with the second plurality of sensors, and can be configured to analyze the measured physical state from the sensors in the second plurality of sensors, so as to determine that the second body is relative to The positioning of the second XYZ coordinate system defined by the second X axis through at least two ports of the second body.
每一感測器可包括一移位感測器。該移位感測器可為光學移位感測器、線性接近性感測器、電磁感測器及/或超聲波移位感測器。每一感測器可包括一非接觸式感測器。Each sensor may include a displacement sensor. The displacement sensor can be an optical displacement sensor, a linear proximity sensor, an electromagnetic sensor and/or an ultrasonic displacement sensor. Each sensor may include a non-contact sensor.
X軸可由在主體之第一末端處且與第一埠光學耦合的束轉向器件及在主體之第二末端處且與第二埠光學耦合的束耦合器界定。The X axis may be defined by a beam steering device at the first end of the body and optically coupled with the first port and a beam coupler at the second end of the body and optically coupled with the second port.
在其他一般態樣中,一種度量衡裝置包括:一感測器系統,其包括複數個感測器,每一感測器經組態以量測氣體放電載台之主體相對於彼感測器的實體態樣;一量測系統,其經組態以量測由氣體放電載台產生的光束之一或多個效能參數;一致動系統,其包括複數個致動器,每一致動器經組態以實體耦接至氣體放電載台之主體的相異區,該複數個致動器共同工作以調整氣體放電載台之主體的定位;及一控制裝置,其與該感測器系統、該量測系統及該致動系統通信。控制裝置經組態以:分析來自感測器之所量測實體態樣,以藉此判定氣體放電載台之主體在由氣體放電載台界定的X軸界定之XYZ座標系統中的定位;分析氣體放電載台之主體的定位;分析一或多個所量測效能參數;及基於對氣體放電載台之主體的定位及一或多個所量測效能參數的分析而將一信號提供至致動系統以修改氣體放電載台之主體的定位。In other general aspects, a measurement device includes: a sensor system, which includes a plurality of sensors, each sensor is configured to measure the main body of the gas discharge carrier relative to the other sensor Physical state; a measurement system configured to measure one or more performance parameters of the light beam generated by the gas discharge stage; an actuation system, which includes a plurality of actuators, each actuator is set The state is physically coupled to the dissimilar area of the main body of the gas discharge stage, the plurality of actuators work together to adjust the positioning of the main body of the gas discharge stage; and a control device, which is connected to the sensor system and the The measurement system communicates with the actuation system. The control device is configured to: analyze the measured physical state from the sensor to determine the position of the main body of the gas discharge stage in the XYZ coordinate system defined by the X axis defined by the gas discharge stage; analysis; Positioning of the main body of the gas discharge stage; analyzing one or more measured performance parameters; and providing a signal to the actuation system based on the positioning of the main body of the gas discharge stage and the analysis of one or more measured performance parameters To modify the positioning of the main body of the gas discharge stage.
實施可包括以下特徵中之一或多者。舉例而言,感測器可彼此遠離並相對於氣體放電載台之主體而定位。Implementations can include one or more of the following features. For example, the sensors can be located away from each other and relative to the main body of the gas discharge stage.
控制裝置可經組態以藉由判定最佳化光束之複數個效能參數的氣體放電載台之主體的定位基於對氣體放電載台之主體的定位及一或多個所量測效能參數的分析將信號提供至致動系統以修改氣體放電載台之主體的定位。The control device can be configured to optimize the positioning of the main body of the gas discharge stage by determining a plurality of performance parameters of the beam. Based on the positioning of the main body of the gas discharge stage and the analysis of one or more measured performance parameters The signal is provided to the actuation system to modify the positioning of the main body of the gas discharge stage.
X軸可由在主體之第一末端處且與第一埠光學耦合的束轉向器件及在主體之第二末端處且與第二埠光學耦合的束耦合器界定。The X axis may be defined by a beam steering device at the first end of the body and optically coupled with the first port and a beam coupler at the second end of the body and optically coupled with the second port.
在其他一般態樣中,一種方法包括:在光源之氣體放電載台之主體的複數個相異區中之每一者處量測彼區處之主體的實體態樣;量測由氣體放電載台產生的光束之一或多個效能參數;分析所量測實體態樣,以藉此判定主體在由X軸界定之XYZ座標系統中的定位,其中X軸由與氣體放電載台相關聯之複數個孔徑界定;分析氣體放電載台之主體的經判定定位;分析一或多個所量測效能參數;判定對氣體放電載台之主體的定位之修改是否將改良所量測效能參數中之一或多者;及若判定對氣體放電載台之主體的定位之修改將改良所量測效能參數中之一或多者,則修改氣體放電載台之主體的定位。In other general aspects, one method includes: measuring the physical state of the body at that region at each of the plurality of different regions of the body of the gas discharge stage of the light source; the measurement is carried by the gas discharge One or more performance parameters of the beam generated by the stage; analyze the measured physical state to determine the position of the subject in the XYZ coordinate system defined by the X axis, where the X axis is associated with the gas discharge stage Multiple aperture definitions; analyze the determined positioning of the main body of the gas discharge stage; analyze one or more measured performance parameters; determine whether the modification of the main body of the gas discharge stage will improve one of the measured performance parameters Or more; and if it is determined that the modification of the positioning of the main body of the gas discharge stage will improve one or more of the measured performance parameters, then the positioning of the main body of the gas discharge stage is modified.
實施可包括以下特徵中之一或多者。舉例而言,氣體放電載台之主體的定位可基於對氣體放電載台之主體的經判定定位之分析而修改。Implementations can include one or more of the following features. For example, the positioning of the main body of the gas discharge stage may be modified based on the analysis of the determined position of the main body of the gas discharge stage.
可藉由判定氣體放電載台之主體自X軸的平移及/或氣體放電載台之主體自X軸的旋轉中之一或多者判定氣體放電載台之主體的定位。氣體放電載台之主體可藉由以下各者中的一或多者自X軸或沿著X軸平移:氣體放電載台之主體沿著X軸的平移、氣體放電載台之主體沿著與X軸垂直之Y軸的平移,及/或氣體放電載台之主體沿著與X軸及Y軸垂直之Z軸的平移。氣體放電載台之主體可藉由以下各者中的一或多者自X軸或繞X軸旋轉:氣體放電載台之主體繞X軸旋轉、氣體放電載台之主體繞與X軸垂直之Y軸旋轉,及/或氣體放電載台之主體沿著與X軸及Y軸垂直之Z軸旋轉。The positioning of the main body of the gas discharge stage can be determined by one or more of the translation of the main body of the gas discharge stage from the X axis and/or the rotation of the main body of the gas discharge stage from the X axis. The body of the gas discharge stage can be translated from the X axis or along the X axis by one or more of the following: the translation of the body of the gas discharge stage along the X axis, the body of the gas discharge stage along and The translation of the Y axis perpendicular to the X axis, and/or the translation of the body of the gas discharge stage along the Z axis perpendicular to the X axis and the Y axis. The body of the gas discharge stage can be rotated from the X axis or around the X axis by one or more of the following: the body of the gas discharge stage rotates around the X axis, and the body of the gas discharge stage rotates perpendicular to the X axis Y axis rotation, and/or the main body of the gas discharge stage rotates along the Z axis perpendicular to the X axis and the Y axis.
主體之實體態樣可藉由量測自感測器至氣體放電載台之主體的區的距離而量測。The physical state of the main body can be measured by measuring the distance from the sensor to the area of the main body of the gas discharge stage.
判定對氣體放電載台之主體的定位之修改是否將改良所量測效能參數中之一或多者可包括判定最佳化複數個所量測效能參數的氣體放電載台之主體的定位。Determining whether the modification of the positioning of the main body of the gas discharge stage will improve one or more of the measured performance parameters may include determining the positioning of the main body of the gas discharge stage that optimizes the plurality of measured performance parameters.
方法亦可包括自氣體放電載台產生光束,包括形成由在主體之一側處之束耦合器及在主體之另一側處之束轉向器件界定的一諧振器,及在由主體界定的空腔中之增益介質內產生能量,該束耦合器及該束轉向器件界定X軸。The method may also include generating a light beam from a gas discharge stage, including forming a resonator defined by a beam coupler at one side of the main body and a beam steering device at the other side of the main body, and forming a resonator defined by the main body. Energy is generated in the gain medium in the cavity, and the beam coupler and the beam steering device define the X axis.
光束之一或多個效能參數可藉由量測複數個效能參數而量測。該複數個效能參數可藉由量測以下各者中之兩者或大於兩者而量測:藉由光源產生的脈衝光束之重複率、脈衝光束之能量、脈衝光束之工作循環,及/或脈衝光束之光譜特徵。方法亦可包括:判定提供光束之效能參數的值之最佳集合的氣體放電載台之主體的最佳定位;及將氣體放電載台之主體的定位修改為在最佳定位處。One or more performance parameters of the beam can be measured by measuring a plurality of performance parameters. The plurality of performance parameters can be measured by measuring two or more of the following: the repetition rate of the pulse beam generated by the light source, the energy of the pulse beam, the duty cycle of the pulse beam, and/or The spectral characteristics of pulsed beams. The method may also include: determining the best position of the body of the gas discharge stage that provides the best set of values of the efficiency parameters of the beam; and modifying the position of the body of the gas discharge stage to be at the best position.
在其他一般態樣中,一種度量衡套組包括:一感測器系統,其包括複數個感測器,每一感測器經組態以量測三維主體相對於彼感測器的實體態樣;一量測系統,其包括複數個量測器件,每一量測器件經組態以量測光束之效能參數;一致動系統,其包括經組態以實體地耦接至三維主體之複數個致動器;及一控制裝置,其經組態以與該感測器系統、該量測系統及該致動系統通信。控制裝置包括:一感測器處理模組,其經組態以與感測器系統介接並自感測器系統接收感測器資訊;一量測處理模組,其經組態以與量測系統介接並自量測系統接收量測資訊;一致動器處理模組,其經組態以與致動系統介接;及一光源處理模組,其經組態以與具有三維主體之氣體放電載台介接。In other general aspects, a metrology kit includes: a sensor system, which includes a plurality of sensors, each sensor is configured to measure the physical aspect of the three-dimensional body relative to the other sensor ; A measurement system, which includes a plurality of measurement devices, each measurement device is configured to measure the performance parameters of the beam; an actuation system, which includes a plurality of configuration to be physically coupled to the three-dimensional body An actuator; and a control device configured to communicate with the sensor system, the measurement system, and the actuation system. The control device includes: a sensor processing module, which is configured to interface with the sensor system and receive sensor information from the sensor system; a measurement processing module, which is configured to measure The measurement system interfaces with and receives measurement information from the measurement system; an actuator processing module, which is configured to interface with the actuation system; and a light source processing module, which is configured to interact with a three-dimensional body Gas discharge carrier interface.
實施可包括以下特徵中之一或多者。舉例而言,控制裝置可包括與感測器處理模組、量測處理模組、致動器處理模組及光源處理模組通信的一分析處理模組。該分析處理模組可經組態以在使用中指導光源處理模組以調整氣體放電載台之一或多個特性並分析感測器資訊及量測資訊並基於氣體放電載台之經調整特性判定至致動器處理模組之指令。Implementations can include one or more of the following features. For example, the control device may include an analysis processing module that communicates with the sensor processing module, the measurement processing module, the actuator processing module, and the light source processing module. The analysis processing module can be configured to guide the light source processing module in use to adjust one or more characteristics of the gas discharge stage and analyze sensor information and measurement information based on the adjusted characteristics of the gas discharge stage Determine the command to the actuator processing module.
度量衡套組可經模組化,使得其經組態以可操作地連接一或多個氣體放電載台且與一或多個氣體放電載台斷開連接,每一氣體放電載台包括界定產生各別光束之空腔的各別三維主體。The metrology kit can be modularized so that it can be configured to operably connect and disconnect from one or more gas discharge stages, each gas discharge stage includes a defined generation The respective three-dimensional body of the cavity of the respective beam.
參看圖1及圖2A,裝置100經設計以判定在XYZ座標系統104中三維主體102相對於座標系統104之X軸106的定位。主體102為經組態以產生具有在紫外線範圍中之波長之光束110的氣體放電載台108之一部分。主體102界定經組態以與能量源114相互作用的空腔112,該能量源可包括一對電極。能量源114可固定至主體102,如下文更詳細地論述。1 and 2A, the
氣體放電載台108包括主體102加其他光學組件(諸如組件140、142)以用於產生光束110。氣體放電載台108可包括圖1及圖2A中未展示之其他組件。氣體放電載台108為圖2A中之長方體的表示未必對應於實體壁且以指出其可包括圖中未示之其他組件的此方式來展示。氣體放電載台108可僅對應於上面置放所有光學組件(包括主體102)的平台。自氣體放電載台108輸出的光束110可用於諸如微影曝光裝置(如下文參看圖15所論述)之裝置以用於圖案化基板W或該光束可在用於裝置之前經受進一步處理。The
主體102可相對於氣體放電載台108之組件移動。在操作期間,主體102在XYZ座標系統104中的定位可歸因於在主體102外部之因素而變化。舉例而言,氣體放電載台108內之壓力及溫度變化可使得主體102在XYZ座標系統104中移動。未對準之另一原因為導致對準變化之主體102內部的內部變化。舉例而言,當能量源114之電極老化且在其使用過程內改變形狀時,此情況可發生。另外,電極上之損耗以及對能量源114之電極的幾何結構修改為必須用新主體交換主體102的一個原因。此外,主體102在其用新主體102替換時變得未對準。在此情況下,新主體102需要與X軸106適當地對準。The
在圖1及圖2A之實例中,主體102與X軸106對準。主體102與X軸106之間的對準可基於主體102之縱向軸線Ab與X軸106對準程度而判定。圖2B展示主體102之縱向軸線Ab。縱向軸線Ab可界定為與在主體102之末端處的兩個埠118、120相交的彼軸。埠118、120可透射具有在紫外線範圍中之波長的光束122 (其將形成光束110)。In the example of FIGS. 1 and 2A, the
參看圖3A至圖3F,氣體放電載台108之主體102可以一或多個方式相對於X軸106未對準。舉例而言,在圖3A中,主體102繞Y軸旋轉而失準且其縱向軸線Ab不與X軸106對準。在圖3B中,主體102繞Z軸旋轉而失準且其縱向軸線Ab不與X軸106對準。且在圖3C中,主體102繞X軸旋轉而失準。在此情況下,縱向軸線Ab沿著X軸106移位。若主體102經組態以擱置於平台上,則其藉由重力支撐且地球之平面為XY平面。在此情形下,常見未對準為圖3B中展示之未對準,其中主體102繞Z軸旋轉而失準。3A to 3F, the
在圖3D中,主體102沿著Y軸平移而失準且縱向軸線Ab沿著Y軸自X軸106而移位。在圖3E中,主體102沿著Z軸平移而失準且縱向軸線Ab沿著Z軸自X軸106而移位。且在圖3F中,主體102沿著X軸106平移而失準且縱向軸線Ab沿著X軸106而移位。若主體102經組態以擱置於平台上,且藉由重力支撐且地球之平面為XY平面,則對氣體放電載台108之功效有相對較大影響的常見未對準為圖3D中展示的未對準,其中主體102沿著Y軸平移。In FIG. 3D, the
有可能主體102以多於一個方式未對準,且由此主體可平移及旋轉兩者,沿著多於一個軸平移,或繞多於一個軸旋轉。It is possible that the
與主體102之某些未對準可對氣體放電載台108之功效及操作具有不同影響。此外,一些調整可能對於修改更可用或可行。舉例而言,沿著Y軸之平移(圖3D中展示)及繞Z軸之旋轉(圖3B中展示)可相對容易地執行,且由此其對氣體放電載台108之功效及操作的影響可被追蹤。因此,在此實例中,裝置100判定主體102沿著Y軸之平移且判定主體102繞Z軸的旋轉值(角度)。裝置100判定主體102沿著其他兩個軸中之任一者或兩者的平移及繞其他兩個軸中之任一者或兩者的旋轉值係有可能的。Certain misalignments with the
主體102相對於X軸106之定位或主體102相對於X軸106的未對準對氣體放電載台108操作所藉以之功效有影響。若主體102相對於X軸106未對準,則此可導致氣體放電載台108之操作無效率,且此可導致光束110之減少的品質。舉例而言,光束110之路徑與X軸106重合,且X軸106係基於與光學組件140、142相關聯之孔徑而判定。固定至主體102的能量源114 (其包括電極)供應能量至空腔112以運用放電泵浦氣體。運用能量源114泵浦氣體產生氣體之電漿狀態。此外,當此電漿狀態與X軸106對準(當主體102與X軸106適當對準時此發生)時,在諧振器空腔(其係藉由組件140、142形成並沿著X軸106界定)與電漿狀態之間存在高效耦合,且光束110參數得以改良。另一方面,當此電漿狀態與X軸106未對準(當主體102與X軸106未對準時此發生)時,在諧振器空腔與電漿狀態之間存在低效耦合,且光束110參數受損。舉例而言,氣體放電載台108之操作的功效下降。在此情況下,接著需要更多能量供應至主體102(例如,藉助於能量源114)以便維持光束110之效能參數。The positioning of the
作為另一實例,在下文參看圖12論述的雙載台設計中,第一氣體放電載台1272中之主體102的未對準導致彼第一氣體放電載台1272之較低功效,此導致接收自第一氣體放電載台1272輸出之光束1273的第二氣體放電載台1273之減少效能。隨後,除非操作第二氣體放電載台1273發生變化,否則此引起第二氣體放電載台1273之操作受損。As another example, in the dual stage design discussed below with reference to FIG. 12, the misalignment of the
裝置100提供用於此對準之可定量度量衡,以及先前未提供的主體102相對於X軸106之定位的快速及準確方向量測。此外,裝置100判定主體102相對於X軸106之定位而不必依賴於氣體放電載台108之效能的緩慢及不準確量測。The
詳言之,裝置100使用主體102之複數個方向量測值判定主體102相對於XYZ座標系統104的定位,如接下來所論述。In detail, the
在一些實施中,裝置100可在其中產生光束110的氣體放電載台108之使用期間操作以判定主體102之定位。在其他實施中,在主體102初始地安裝於系統中之後,但在其用以產生光束110以供裝置使用之前,裝置100可操作以判定主體102之定位。In some implementations, the
裝置100包括感測器系統124,其輸出用以判定主體102相對於X軸106的定位。感測器系統124包括提供用於主體102之方向量測值的至少兩個感測器124a及124b。雖然圖1中展示兩個感測器124a及124b,但有可能感測器系統124具有多於兩個感測器。每一感測器124a、124b經組態以量測氣體放電載台108之主體102之各別相異區126a、126b相對於彼感測器124a、124b的實體態樣。The
裝置100包括與感測器系統124之感測器124a、124b中之每一者通信的控制裝置128。控制裝置128經組態以分析來自感測器124a、124b之所量測實體態樣,以藉此判定氣體放電載台108之主體102相對至X軸106的定位。The
主體102可為經組態以將包括增益介質之氣體混合物容納於空腔112內的任何形狀。當藉由能量源114提供足夠能量以形成電漿狀態時光學放大出現在增益介質中。氣體混合物可為經組態以產生大約所需要波長及頻寬之經放大光束(或雷射束)的任何合適之氣體混合物。舉例而言,氣體混合物可包括在約193 nm之波長下發射光的氟化氬(ArF)或在約248 nm之波長下發射光的氟化氪(KrF)。The
此外,光學回饋機構可相對於主體102配置或組態以提供光學諧振器,如下文詳細論述。In addition, the optical feedback mechanism may be configured or configured relative to the
能量源114可包括在空腔112中延伸並固定至主體102的兩個細長電極。被供應至電極的電流使得一電磁場產生在空腔112內,該電磁場提供所需要能量至增益介質以形成其中光學放大出現的電漿狀態。主體102亦可容納使氣體混合物在電極之間循環的風扇。The
主體102由剛性且非反應性材料(諸如金屬合金(不鏽鋼))製成。主體102可具有任何合適的幾何結構,且幾何結構係藉由電極以及埠118、120的配置判定。主體102可具有長方體形狀或立方體形狀。如圖2A中所示,主體102具有一長方體形狀,該長方體形狀具有藉由X軸106相交的兩個平整平行表面130x、131x及在平整表面130x、131x之間延伸的四個平整表面132z、133z、134y、135y。表面132z、133z彼此平行並藉由Z軸相交且表面134y、135y彼此平行並藉由Y軸相交。在此實例中,區126a、126b係在134y表面上。在其他實施中,區126a、126b可在主體102之其他表面或若干不同表面上。The
主體102上之埠118、120可透射形成光束110的光束122。因此,埠118、120可透射具有在紫外線範圍中之波長的光。埠118、120可由可塗佈有抗反射材料的諸如熔融矽石或氟化鈣之剛性基板製成。埠118、120可具有與光束122相互作用的平整表面。因為主體102之空腔112固持或保持氣體混合物,因此主體102需要被封閉或密封,且其可為氣密密封式。因此,埠118、120亦氣密密封於主體102之各別開口中以確保氣體混合物不在埠與主體102之間的接縫處漏出主體102。The
在一些實施中,X軸106及XYZ座標系統104由氣體放電載台108之設計界定。詳言之,X軸106經界定為通過氣體放電載台108內之兩個孔徑的線。此等兩個孔徑可鄰近與氣體放電載台108中之主體102相互作用的各別光學組件140、142定位。以此方式,光學組件140、142及其孔徑界定X軸106 (且因此界定XYZ座標系統104)。此外,此等光學組件140、142界定用於形成光束110之光學諧振器。In some implementations, the
在一些實施中,光學組件140、142可形成光學回饋機構以提供光學諧振器且藉此自光束122輸出光束110。因此,當氣體放電載台108之主體102處於一系列可接受位置內時,能量源114供應能量至主體102之空腔112,且光學組件140、142對準,產生光束122。In some implementations, the
在一些實施中,光學組件140可為接收預先游標光束121並使得能夠藉由調整初游標光束121之光譜特徵來精細調整光束122之光譜特徵的光譜特徵裝置。可使用光譜特徵裝置調整的光譜特徵包括光束122之中心波長及頻寬。光譜特徵裝置包括經配置以與初游標光束121光學地相互作用的一組光學特徵或組件。光譜特徵裝置之光學組件包括例如色散光學元件(其可為光柵),及由一組折射光學元件(其可為稜鏡)製成的擴束器。光學組件142可為允許自腔內束提取光束122的輸出耦合器。輸出耦合器可包括部分反射鏡,允許腔內束之某一部分作為光束122透射穿過。氣體放電載台108亦可包括經組態以當光束122在輸出耦合器(光學組件142)與空腔112之間行進時與光束122相互作用的擴束器。In some implementations, the
在其他實施中,光學組件140可為束轉向器件且光學組件142可為束耦合器。束轉向器件包括光學件之配置,該配置經組態以接收經由埠118射出氣體放電載台108之主體102的初游標光束121且改變光束121之方向以使得光束121經由第一埠118再進入氣體放電載台之主體。In other implementations, the
如上文所論述,感測器系統124中之每一感測器124a、124b經組態以量測氣體放電載台108之主體102相對於彼感測器124a、124b的實體態樣。每一感測器124a、124b可將自感測器124a、124b至氣體放電載台108之主體102的距離量測為主體102之實體態樣。As discussed above, each
在各種實施中,感測器124a、124b安裝至氣體放電載台108的機械穩定結構,其中該結構將感測器124a、124b固持於相對於彼此及相對於界定X軸106,或界定XYZ座標系統104之組件的固定定位中。舉例而言,感測器124a、124b可安裝在光學工作台上或安裝至剛性地耦接至劃定X軸106之光學元件(例如光學元件140、142)的其他穩定機械安裝件上,X軸為系統之光軸。In various implementations, the
舉例而言,每一感測器124a、124b經組態以相對於XYZ座標系統104固定地安裝。因此,在量測期間,感測器124a、124b相對於XYZ座標系統104固定。另外,每一感測器124a、124b經組態以在其相對於XYZ座標系統104固定地安裝時與另一感測器124b、124a相隔一定距離地固定。因此,感測器124a、124b之間的距離d(ss)在操作及量測期間固定。感測器124a、124b之間的距離d(ss)沿著X軸106足夠大以使得控制裝置128有可能基於來自感測器124a、124b之輸出判定繞Z軸(圖3B)之旋轉。詳言之,來自感測器124a、124b中之每一者的輸出之間的相對變化可用以判定繞Z軸之旋轉(圖3B)。感測器124a、124b具有足夠快速用於實現對準的量測解析度。舉例而言,1秒(s)之時間解析度可足夠快速;或低於1 s (例如0.1 s)之時間解析度可足夠快速。For example, each
在一些實施中,每一感測器124a、124b包括移位感測器。該移位感測器可為光學移位感測器、線性接近性感測器、電磁感測器或超聲波移位感測器。In some implementations, each
每一感測器124a、124b可為非接觸式感測器,此意謂其不與主體102接觸。在其中感測器124a、124b為非接觸式的此設計中,量測值自身不顯著地(例如大於1µ)取代主體102,此係因為任一此類移位可影響氣體放電載台108之效能。Each
具有合適解析度(例如比10 µm更佳的解析度(亦即,低於10 µm))之任何非接觸式度量衡適合於本申請案。非接觸式感測器之一個實例為雷射移位感測器,其為包括雷射光源及光電二極體陣列之現成產品。每一感測器124a、124b之雷射光源使光照射於主體102之表面134y上;該光朝向各別感測器124a、124b反射回;且反射光著陸所在的二極體陣列上之位置對應於主體102之表面134y的移位。Any non-contact metrology with a suitable resolution (for example, a resolution better than 10 µm (ie, less than 10 µm)) is suitable for this application. An example of a non-contact sensor is a laser displacement sensor, which is an off-the-shelf product including a laser light source and a photodiode array. The laser light source of each
在其他實施中,感測器124a、124b為接觸感測器,其在各別區126a、126b處與主體102最小接觸。舉例而言,感測器可為用以將主體102之機械運動轉換成可變電流、電壓或電信號的機電器件。此感測器之實例為線性可變移位轉換器(LVDT),其為提供與被量測之特性(定位)相關的電壓輸出量的器件。In other implementations, the
控制裝置128包括數位電子電路、電腦硬體、韌體及軟體中之一或多者。控制裝置128包括記憶體,記憶體可為唯讀記憶體及/或隨機存取記憶體。適合於有形地體現電腦程式指令及資料之儲存器件包括所有形式之非揮發性記憶體,包括(藉助於實例)半導體記憶體器件,諸如EPROM、EEPROM及快閃記憶體器件;磁碟,諸如內部硬碟機及抽取式磁碟;磁光碟;及CD-ROM磁碟。控制裝置128亦可包括一或多個輸入器件(諸如鍵盤、觸控螢幕、麥克風、滑鼠、手持型輸入器件等)及一或多個輸出器件(諸如揚聲器或監測器)。The
控制裝置128包括一或多個可程式化處理器,及有形地體現於機器可讀儲存器件中以供可程式化處理器執行的一或多個電腦程式產品。一或多個可程式化處理器可各自執行指令程式以藉由對輸入資料進行操作且產生適當輸出來執行所要功能。一般而言,處理器自記憶體接收指令及資料。前述任一者可由經特殊設計之特殊應用積體電路(ASIC)補充或併入於其中。The
控制裝置128包括一組模組,其中每一模組包括由諸如處理器之一或多個處理器執行的一組電腦程式產品。此外,該等模組中之任一者可存取存儲於記憶體內的資料。每一模組可接收來自其他組件之資料且接著根據需要分析此資料。每一模組可與一個或多個其他模組通信。The
儘管控制裝置128表示為方框(其中其全部組件可共置),但控制裝置128有可能由彼此實體遠離的組件組成。舉例而言,特定模組可與感測器系統124實體共置或特定模組可與另一組件實體共置。Although the
參看圖4,在一些實施中,感測器124a、124b經配置以與表面134y相互作用。在此等實施中,感測器124a、124b安裝在平台144上,該平台支撐感測器124a、124b之重量並維持感測器124a、124b之穩定性。在圖4中,平台144為三腳框架或支架。圖5展示配置之側橫截面圖。在圖5中,平台144為上面置放感測器124a、124b之基礎平台基座544。平台基座544可整合至框架或固定於氣體放電載台108內的其他組件中。感測器124a、124b可係可復位的;亦即,感測器124a、124b可置放於相對於主體102之任何兩個區的任一位置處且接著移動至相對於主體102之兩個其他區的另一位置。Referring to Figure 4, in some implementations, the
如圖5中所示,能量源114為配置於空腔112中之一對電極514A、514B。電極514A、514B沿著X軸106延伸。As shown in FIG. 5, the
亦參看圖6,每一感測器124a、124b量測距主體102之表面134y之各別區126a、126b的距離或自其之移位。舉例而言,感測器124a量測自感測器124a至表面134y之區126a的移位d(a)且感測器124b量測自感測器124b至表面134y之區126b的移位d(b)。另外,藉由控制裝置128執行的計算需要一組參考位移,D(a)及D(b)。參考位移D(a)及D(b)為在主體102與X軸106及XYZ座標系統104 (此藉由標記為102_ref之虛線方框展示)適當地對準時期間藉由各別感測器124a、124b取得的量測值。在一些實施中,主體102與X軸106之間的適當對準可假定出現在氣體放電載台108正以其最高功效操作時(例如在藉助於能量源114輸入的大多數能量轉換為光束110中之能量時)。Referring also to FIG. 6, each
自各別感測器124a、124b輸出的移位d(a)及d(b)之值未必彼此線性地無關。此意謂一者的移位(諸如d(a))可依據另一者(諸如d(b))寫入。有可能使用額外資訊將此類線性相關值變換成線性無關值。在此情況下,當主體102與X軸106對準時在區126a、126b之間沿著X軸106截得的距離L可用以提供此變換。特定言之,距離L以及d(a)及d(b)可用以判定主體102之中心的相對定位(藉由R給出)及主體繞Z軸之相對角度定向θ,如接下來所論述。The values of the shifts d(a) and d(b) output from the
相對位移d'(a)及d'(b)藉由以下給出:;且。The relative displacements d'(a) and d'(b) are given by: ; And .
且主體102之相對移位R如下經界定為相對位移d'(a)及d'(b)之和的一半:。And the relative displacement R of the
相對角度定向θ可如下近似為相對位移d'(a)與d'(b)之間的差與距離L之比率:。The relative angular orientation θ can be approximated as the ratio of the difference between the relative displacements d'(a) and d'(b) to the distance L as follows: .
小角度近似值經調用,此係因為L˃˃|d'(a)−d'(b)|。舉例而言,L為約數百毫米(mm)(例如0.5至0.7米)而|d'(a)−d'(b)|為約一mm。The small-angle approximation is called because of L˃˃|d'(a)−d'(b)|. For example, L is about hundreds of millimeters (mm) (for example, 0.5 to 0.7 meters) and |d'(a)−d'(b)| is about one mm.
參看圖7,在一些實施中,裝置700經設計以不僅判定三維主體102之定位,而且移動在XYZ座標系統104中之主體102。為此目的,裝置700實質上類似於裝置100,且包括上文詳述及在圖1中展示的所有組件且在本文中不重複彼等組件之論述。Referring to FIG. 7, in some implementations, the
裝置700另外包括實體耦接至氣體放電載台108之主體102的致動系統754,該致動系統754經組態以調整XYZ座標系統104內的氣體放電載台108之主體102的定位。控制裝置128與致動系統754通信且經組態以基於來自感測器系統124之輸出將信號提供至致動系統754。詳言之,控制裝置128基於來自感測器系統124之輸出判定氣體放電載台108之主體102的定位是否經修改且控制裝置128基於此判定而判定調整至致動系統754之一或多個信號的方式。The
致動系統754包括複數個致動器754a、754b等,其中每一致動器經組態以與氣體放電載台108之主體102的各別區756a、756b等實體通信。雖然致動系統754經展示為與表面134y實體通信,但致動系統754有可能包括與主體102之一個或多個其他表面實體通信的一或多個致動器。此外,致動系統754不必與同一表面或藉由感測器系統124量測的表面實體通信。The
每一致動器754a、754b可包括機電器件、伺服系統、電伺服系統、液壓伺服系統及/或氣動伺服系統中之一或多者。賦予區756a、756b的各種運動用於沿著上文關於圖3A至圖3C詳述之旋轉方向中之任一者及沿著上文關於圖3D至圖3F詳述之平移方向中之任一者調整主體102之定位。Each
參看圖8,在一些實施中,每一各別區756a、756b係與附接至表面134y的旋轉安裝件857a、857b相關聯。旋轉安裝件857a、857b藉由旋轉而致動,且旋轉轉換為平移運動。因此,例如,安裝件857a以順時針方向之旋轉使固定至區756a之桿沿著-Y方向平移(此引起區756a沿著-Y方向平移)。且同時安裝件857a在逆時針方向中的旋轉使固定至區756a之桿沿著Y方向平移(此引起區756a沿著Y方向平移)。藉由同時及同步地(在同一方向中)旋轉安裝件857a、857b,沿著Y軸平移主體102,如圖3D中所示。同時及非同步地(在相對方向上)旋轉安裝件857a、857b引起主體102Z軸旋轉,如圖3B中所示。舉例而言,在逆時針旋轉另一安裝件857b的同時順時針旋轉一個安裝件857a引起區756a沿著-Y方向平移且引起區756b沿著Y方向平移且此引起主體102繞Z軸旋轉。有可能執行安裝件857a、857b之同步及異步旋轉兩者以將沿著Y軸平移及繞Z軸旋轉賦予至主體102。在此實例中,分別藉由致動器754a、754b控制在各別區756a、756b處之旋轉安裝件857a、857b。致動器754a、754b可為使安裝件各別安裝件857a、857b旋轉的任一器件。此外,安裝件857a、857b之旋轉可在遞增步長中。Referring to Figure 8, in some implementations, each
參看圖9,在一些實施中,裝置900經設計以不僅判定三維主體102之定位(使用感測器系統124),並調整主體102之定位(使用致動系統754),而且量測或監測氣體放電載台108之效能或效能特性。如上文所論述,主體102之對準影響或改變氣體放電載台108之效能,且由此預期主體102之未對準將減小效能。為此目的,裝置900實質上類似於裝置700,且包括上文詳述及在圖1中展示的所有組件且在本文中不重複彼等組件之論述。Referring to FIG. 9, in some implementations, the
裝置900另外包括經配置以量測光束110之效能參數的量測系統960。效能參數之實例包括光束110之能量E、諸如光束110之頻寬或波長的光譜特徵,及在裝置(諸如微影曝光裝置)處的光束110之劑量。控制裝置128與量測系統960通信。以此方式,控制裝置128可找到提供最佳或改良一或多個效能參數的主體102之最佳或改良定位或對準。因為氣體放電載台108之效能係基於許多不同參數而量測,因此包括複數個參數之參數空間可藉由控制裝置128在進行判定時考慮。舉例而言,控制裝置128可執行用於調整主體102之定位的自適應控制,其提供落在可接受範圍內的光束110之一組效能參數。The
量測系統960可包括一或多個量測器件,其中每一量測器件相對於光束110定位並量測特定效能參數。量測系統960可包括作為量測器件的用於量測光束110之能量的能量監測器。量測系統960可包括作為量測器件的經組態以量測光束110之光譜特徵(頻寬或波長)的光譜特徵分析器件。在此等情況下,量測器件可為已經包括於氣體放電載台108中或為已經呈現以量測光束110之此等態樣的分析模組之一部分的器件。舉例而言,分析模組可包括波長計及頻寬計,其包括具有成像透鏡之標準具以及束均質化光學件以及其他組件。分析模組亦可包括監測光束110之能量並出於診斷及定時目的提供快速光電二極體信號的光偵測器模組(PDM)。在一些實施中,一或多個能量感測器可置放於沿著光束110之路徑的任何位置。控制裝置128可基於此所量測能量與經由能量源114輸入的能量(其可為施加至能量源114之電極的電壓)之比率估計氣體放電載台108之功效。The
量測器件可與光譜特徵調整器(諸如圖12中展示的光譜特徵調整器1275)內之診斷相關聯。光譜特徵調整器1275接收來自氣體放電載台1272之主體102的初游標光束1276以使得能夠精細調整光譜參數(諸如在相對低輸出脈衝能量處光束1274之中心波長及頻寬)。有可能監測光譜特徵調整器1272內之擴束光學件以追蹤光束110之光譜特徵(諸如頻寬),此係因為光譜特徵調整器1275內之擴束直接與光束1274 (且因此光束110)之頻寬相關。The measurement device may be associated with the diagnosis within the spectral characteristic adjuster (such as the spectral
量測系統960可包括經組態以量測微影曝光裝置處的光束110之劑量的量測器件。量測系統960可包括經組態以量測產生光束110之脈衝所藉以的重複率之量測器件。量測系統960可包括經組態以量測光束110之工作循環的量測器件。此等量測器件可包括雷射能量偵測器(諸如光偵測器)。在此實例中,劑量可經估計為在由雷射能量偵測器偵測之固定數目個脈衝內的能量之總和;重複率可經估計為由雷射能量偵測器偵測之任何兩個脈衝(通常固定的)之間的時間之倒數;且工作循環可任意界定為在時間框(諸如最新的兩分鐘)中激發的脈衝之數目除以最大重複率乘以在時間框(例如兩分鐘)中通過的次數。量測器件亦可包括一定時器以便控制裝置128自輸出計算重複率及工作循環。The
控制裝置128可將獨立信號發送至致動器754a、754b,自感測器124a、124b中之每一者讀取獨立量測值,且自量測系統960中之量測器件中之每一者讀取獨立量測值。The
在操作中,控制裝置128分析氣體放電載台108之主體102的定位(其自感測器系統124接收)及光束110之一或多個所量測效能參數(其自量測系統960接收)兩者。控制裝置128判定對氣體放電載台108之主體102的定位之修改是否將改良該等所量測效能參數中之一或多者。控制裝置128可執行映射定位空間並判定達成該最佳效能參數(或多個參數)之最佳定位的處理程序。In operation, the
參看圖11,對準回饋控制處理程序之實例經展示於一表面形貌映射1162中,在該表面形貌映射中主體102之定位可繞Z軸旋轉(圖3B),沿著Y軸平移(圖3D),或兩者。映射1162展示相對於繞Z軸之旋轉之值(1162Z)及沿著Y軸平移之值(1162Y)的效能參數(諸如能量)的值。因為映射為表面形貌映射,因此能量之值於每一線上列舉。對應於映射1162的三維表面之形狀係藉由此等等高線描繪,且該等線之相對間隔指示三維表面之相對斜率。Referring to FIG. 11, an example of the alignment feedback control processing program is shown in a
在此實例中,控制裝置128在控制致動器754a、754b時接收藉由感測器124a、124b量測的定位以便產生光束110之能量的映射1162。能量之較高值表示更高效能量值。因此,判定主體102沿著Y軸之定位的值及主體102繞Z軸之旋轉角,其提供光束110之最高效能量值。在一些實施中,回饋控制處理程序可經組態以在不映射整個空間情況下智慧型地找到映射之峰值(及因此能量之峰值)。舉例而言,搜尋路徑1164展示用以修改主體102沿著Y軸之定位並繞Z軸旋轉主體102以獲得光束110之最高效能量值的一個特定方式。In this example, the
回饋控制處理程序可為自所有可行解決方案中找到最佳解決方案(映射之峰值或能量之峰值)的非線性最佳化問題。舉例而言,處理程序可為梯度上升,其為用於找到函數之最大值的一階迭代最佳化演算法。The feedback control processing program can be a nonlinear optimization problem that finds the best solution (the peak value of the mapping or the peak value of the energy) from all feasible solutions. For example, the processing procedure may be gradient ascent, which is a first-order iterative optimization algorithm used to find the maximum value of a function.
參看圖12,在一些實施中,氣體放電載台108可併入至雙載台光源1270中。光源1270經設計為產生光學脈衝之經放大光束1271的脈衝光源。光源1270包括第一氣體放電載台1272及第二氣體放電載台1273。第二氣體放電載台1273與第一氣體放電載台1272光學地串聯。一般而言,第一載台1272包括容納能量源且含有包括第一增益介質之氣體混合物之第一氣體放電腔室。第二氣體放電載台1273包括容納一能量源並含有包括第二增益介質之一氣體混合物的一第二氣體放電腔室。12, in some implementations, the
第一載台1272包括主控振盪器(MO)且第二載台1273包括功率放大器(PA)。MO提供種子光束1274至PA。主控振盪器通常包括增益介質(其中出現放大)及光學回饋機構(諸如光學諧振器)。功率放大器通常包括增益介質,其中放大出現在與自主控振盪器之種子光束1274接種時。若功率放大器經設計為再生環諧振器,則其描述為功率環放大器(PRA),且在此情況下,可自環設計提供足夠光學回饋。The
光譜特徵調整器1275自第一載台1272之主控振盪器接收初游標光束1276以使得能夠精細調整光譜參數(例如在相對低輸出脈衝能量處光束1274之中心波長及頻寬)。功率放大器自主控振盪器接收光束1274並放大此輸出以實現必要輸出功率以供微影曝光裝置用於光微影中。The spectral
主控振盪器包括具有兩個細長電極之放電腔室、充當增益介質之雷射氣體以及使電極之間之氣體循環的風扇。雷射諧振器形成於放電腔室之一側的光譜特徵調整器1275與放電腔室之第二側的輸出耦合器1277之間以輸出種子光束1274至功率放大器。The main control oscillator includes a discharge chamber with two elongated electrodes, laser gas acting as a gain medium, and a fan that circulates the gas between the electrodes. The laser resonator is formed between the spectral
功率放大器包括功率放大器放電腔室,且若其為再生環放大器,則功率放大器亦包括束反射器或束轉向器件,其將光束反射回至放電腔室中以形成循環路徑。功率放大器放電腔室包括一對細長電極、充當增益介質之雷射氣體及用於使電極之間的氣體循環的風扇。種子光束1274係藉由反覆地穿過功率放大器而放大。第二載台1273可包括一光束修改光學系統,其提供內耦合種子光束1274及外耦合來自功率放大器之經放大輻射之一部分以形成經放大光束1271兩者的方式(例如部分反射鏡)。The power amplifier includes a power amplifier discharge chamber, and if it is a regenerative loop amplifier, the power amplifier also includes a beam reflector or beam steering device that reflects the light beam back into the discharge chamber to form a circulation path. The discharge chamber of the power amplifier includes a pair of elongated electrodes, a laser gas serving as a gain medium, and a fan for circulating the gas between the electrodes. The
主控振盪器及功率放大器之放電腔室中所使用之雷射氣體可為用於產生約所需波長及頻寬之雷射束的任何合適氣體。舉例而言,雷射氣體可為發射約193 nm之波長之光的氟化氬(ArF),或發射約248 nm之波長之光的氟化氪(KrF)。The laser gas used in the discharge chamber of the master oscillator and the power amplifier can be any suitable gas used to generate a laser beam of approximately the required wavelength and bandwidth. For example, the laser gas can be argon fluoride (ArF) emitting light with a wavelength of about 193 nm, or krypton fluoride (KrF) emitting light with a wavelength of about 248 nm.
一般而言,光源1270亦可包括與第一載台1272及第二載台1273通信的控制系統1278。控制系統1278包括數位電子電路、電腦硬體、韌體及軟體中之一或多者。控制系統1278包括記憶體,其可為唯讀記憶體及/或隨機存取記憶體。適合於有形地體現電腦程式指令及資料之儲存器件包括所有形式之非揮發性記憶體,包括(藉助於實例)半導體記憶體器件,諸如EPROM、EEPROM及快閃記憶體器件;磁碟,諸如內部硬碟機及抽取式磁碟;磁光碟;及CD-ROM磁碟。控制系統1278亦可包括一或多個輸入器件(諸如,鍵盤、觸控螢幕、麥克風、滑鼠、手持型輸入器件等)及一或多個輸出器件(諸如,揚聲器或監測器)。Generally speaking, the
控制系統1278包括一或多個可程式化處理器,及有形地體現於機器可讀儲存器件中以供可程式化處理器執行的一或多個電腦程式產品。一或多個可程式化處理器可各自執行指令程式以藉由對輸入資料進行操作且產生適當輸出來執行所要功能。一般而言,處理器自記憶體接收指令及資料。前述任一者可由經特殊設計之特殊應用積體電路(ASIC)補充或併入於其中。The
控制系統1278包括一組模組,其中每一模組包括藉由諸如該等處理器之一或多個處理器執行的一組電腦程式產品。此外,該等模組中之任一者可存取存儲於記憶體內的資料。每一模組可接收來自其他組件之資料且接著根據需要分析此資料。每一模組可與一個或多個其他模組通信。The
儘管控制系統1278表示為方框(其中所有其組件可經共置),但控制系統1278有可能由實體上彼此遠離之組件組成。舉例而言,特定模組可與光學源1270實體共置或特定模組可與光譜特徵調整器1275實體共置。此外,控制系統1278可為併入至控制裝置128中的模組。Although the
第一氣體放電載台1272可對應於氣體放電載台108。第二氣體放電載台1273可對應於氣體放電載台108。或第一氣體放電載台1272及第二氣體放電載台1273中之每一者可對應於氣體放電載台108。因此,上文所描述的裝置100、700或900可經設計以判定第一氣體放電載台1272中之主體的定位;調整第一氣體放電載台1272中之主體的定位;及基於定位之調整監測與第一氣體放電載台1272相關聯的效能參數。另外或替代地,上文所描述的裝置100、700或900可經設計以判定第二氣體放電載台1273中之主體的定位;調整第二氣體放電載台1273中之主體的定位;及基於定位之調整監測與第二氣體放電載台1273相關聯的效能參數。第二氣體放電載台1273中之主體的定位之調整及最佳化可與第一氣體放電載台1272中之主體的定位之調整及最佳化同時執行。此外,與第一氣體放電載台1272相關聯的效能參數可藉由量測種子光束1274或經放大光束1271 (其係產生自種子光束1273)之效能參數而量測。與第二氣體放電載台1273相關聯之效能參數可藉由量測經放大光束1271之效能參數而量測。The first
若第一氣體放電載台1272及第二氣體放電載台1273兩者在裝置100、700或900的控制下,則單個控制裝置128可經組態以與兩個感測器系統124、兩個致動系統754及兩個量測系統960通信。If both the first
參看圖13,度量衡套組1380包括組成裝置(諸如裝置900)的組件。度量衡套組1380適用,此係因為其不需要固定或與單個氣體放電載台108相關聯且可自一個氣體放電載台108移動至另一個氣體放電載台。此外,由於此,可使用用於多於一個氣體放電載台108之度量衡套組1380而非設置用於每一氣體放電載台108之裝置900,此係更昂貴。Referring to FIG. 13, a
度量衡套組1380包括一感測器系統1324,其包括複數個感測器1324a、1324b…1324i (其中i為大於1的任一整數)。每一感測器1324a、1324b…1324i經組態以量測三維主體102相對於彼感測器之實體態樣。度量衡套組1380包括一量測系統1360,其包括至少一個量測器件1360a、1360b…1360j (其中j為任一整數)。每一量測器件1360a、1360b…1360j經組態以量測光束110之效能參數。度量衡套組1380包括一致動系統1354,其包括經組態以實體地耦接至主體102的複數個致動器1354a、1354b…1354k。The
度量衡套組1380包括經組態以與感測器系統1324、量測系統1360及致動系統1354通信的控制裝置1328。控制裝置1328包括經組態以與感測器系統1324介接並接收來自感測器系統1324之感測器資訊的感測器處理模組1381。控制裝置1328包括經組態以與量測系統1360介接並接收來自量測系統1360之量測資訊的量測處理模組1382。控制裝置1329包括經組態以與致動系統1354介接之致動器處理模組1383。The
控制裝置1328亦可包括經組態以與具有三維主體102之氣體放電載台108介接的光源處理模組1384。The
舉例而言,控制裝置1328亦可包括與感測器處理模組1381、量測處理模組1382、致動器處理模組1383及光源處理模組1384通信的一分析處理模組1385。分析處理模組1385經組態以在使用中指導光源處理模組1384調整氣體放電載台108之一或多個特性並分析感測器資訊(來自感測器系統1324)及量測資訊(來自量測系統1360)及基於氣體放電載台108之經調整特性判定至致動器處理模組1383之指令。For example, the
度量衡套組1380經模組化,使得其經組態以可操作地連接一或多個氣體放電載台108且與一或多個氣體放電載台108斷開連接。每一氣體放電載台108包括界定產生各別光束110之空腔112的各別三維主體102。因此,當主體102之定位需要經最佳化時,度量衡套組1380可安裝至氣體放電腔室108。舉例而言,感測器1324a、1324b…1324i可安裝在相對於主體102之其各別區的各別位置處。量測器件1360a、1360b…1360j可置放於位置處以量測光束110之效能參數。致動器1354a、1354b…1354k可實體耦接至主體102之各別區。且感測器系統1324、量測系統1360及致動系統1354可連接至控制裝置1328或與控制裝置1328通信而置放。在主體102已經最佳化之後,可執行用於斷開的反向步驟。The
在一些實施中,量測系統1360包括一或多個量測介面而不是量測器件中之一或多者。每一量測介面能夠連接至固定於氣體放電載台108內的量測器件以及連接至套組1380中之控制裝置128。In some implementations, the
參看圖14,程序1487藉由裝置900執行。可在氣體放電載台108之組件移動或替換的任何時候或氣體放電載台108之功效下降低於可接受範圍的任何時候執行程序1487。程序1487大體上在氣體放電載台108與微影曝光裝置脫機時執行。Referring to FIG. 14, the
氣體放電載台108之功效可由光束110之一或多個效能參數表示。此外,複數個效能參數之集合可視為參數空間。參數空間因此包括複數個效能參數。程序1487力求最佳化參數空間。參數空間之最佳化未必意謂特定效能參數經最佳化或每一效能參數經最佳化。實際上,判定提供氣體放電載台108之最高效操作的該組或複數個效能參數。如上文所論述,效能參數之實例包括光束110之能量E、諸如光束110之頻寬或波長的光譜特徵、在裝置(諸如微影曝光裝置)處的光束110之劑量、產生光束110之脈衝所藉以的重複率,及光束110之工作循環。The efficiency of the
程序1487包括在氣體放電載台108之主體102的複數個相異區126a、126b等中之每一者處量測在彼區處之主體102的實體態樣(1488)。舉例而言,感測器系統124 (且特定言之感測器124a、124b等)可量測在每一相異區126a、126b等處之實體態樣。The
程序1487包括量測由氣體放電載台108產生的光束110之一或多個效能參數(1489)。舉例而言,量測系統960可量測光束110之一或多個效能參數。量測系統960有可能將僅僅一個效能參數量測為氣體放電載台108之功效的表示。此外,亦有可能量測系統960量測複數個效能參數以便表示氣體放電載台108之功效。可量測的效能參數之實例包括脈衝光束110之重複率、脈衝光束110之能量、脈衝光束110之工作循環,及/或脈衝光束110之光譜特徵。The
程序1487包括分析所量測實體態樣(1490),以藉此判定主體在由藉由氣體放電載台108的光學組件140、142判定之複數個孔徑界定的X軸106界定之XYZ座標系統104中的定位(1491)。程序1487亦包括分析氣體放電載台108之主體102的經判定定位(1492)及分析一或多個所量測效能參數(1493)。控制裝置128在接收到來自量測1488及1489之輸出之後及在判定主體之定位1491之後執行分析1490、1492、1493。The
程序1487包括判定對氣體放電載台108之主體102的定位之修改是否將改良所量測效能參數中之一或多者(1494),及若判定對氣體放電載台108之主體102的定位之修改將改良所量測效能參數中之一或多者,則修改氣體放電載台108之主體102的定位(1495)。對於其中效能參數為光束110之能量E的實例,控制裝置128可使用回饋控制(諸如圖11中所展示內容),並對主體102之定位進行遞增調整,接著在1489處再量測效能參數以判定彼調整是否改良效能參數(1494)。The
若判定對主體102之定位之無修改將改良一或多個所量測效能參數(1494),則程序1487結束。詳言之,程序1487已判定最佳化複數個所量測效能參數的氣體放電載台108之主體102的定位。氣體放電載台108之主體102的最佳定位提供光束110之效能參數的值之最佳集合,且程序1487操作以將氣體放電載台108之主體102的定位修改為在此最佳定位處。If it is determined that no modification to the positioning of the
氣體放電載台108之主體102的定位可基於在1492處對氣體放電載台108之主體102的經判定定位之分析而修改(1495)。可藉由判定氣體放電載台108之主體102自X軸106的平移或氣體放電載台108之主體102自X軸106的旋轉中之一或多者判定氣體放電載台108之主體102的定位(1491)。上文參看圖6描述此判定之實例。The positioning of the
如上文所論述,可藉由量測自對應感測器至主體102之彼區的距離量測(1488)在主體102之相異區處的主體102之實體態樣。As discussed above, the physical state of the
程序1487亦可包括藉由形成由在主體102之一側處的束耦合器(諸如光學組件142)及在主體102之另一側處的束轉向器件(諸如光學組件140)界定的諧振器及在空腔112中之增益介質內產生能量自氣體放電載台108產生光束110。束耦合器及束轉向器件亦可界定X軸106。The
如上文所論述,及參看圖15,光束110可用於諸如微影曝光裝置EX之裝置以用於圖案化基板W。在此情況下,裝置100、700或900併入至提供經放大及脈衝光束LB至微影曝光裝置EX的光源LS中。光束LB可對應於自氣體放電載台108輸出的光束110。或光束LB可對應於由自氣體放電載台108輸出之光束110形成的光束。此外,如上文所論述,氣體放電載台108及裝置100、700或900可併入至雙載台光源LS中。As discussed above, and referring to FIG. 15, the
舉例而言,儘管控制裝置128與裝置100、700、900之其他組件之間的連接經展示為線,但控制裝置128與其他組件之間的連接可為有線連接或無線連接。For example, although the connections between the
可使用以下條項進一步描述實施:
1. 一種光源裝置,其包含:
一氣體放電載台,其包括界定經組態以與一能量源相互作用的一空腔之一三維主體,該主體包括可透射具有在紫外線範圍中之一波長之一光束的至少兩個埠;
一感測器系統,其包含複數個感測器,每一感測器經組態以量測該氣體放電載台之該主體的一各別相異區相對於彼感測器的一實體態樣;及
一控制裝置,其與該感測器系統通信,且經組態以分析來自該等感測器之該等所量測實體態樣,以藉此判定該氣體放電載台之該主體在由一X軸界定之一XYZ座標系統中的一定位,其中該X軸係由該氣體放電載台之幾何結構界定。
2. 如條項1之光源裝置,其進一步包含經組態以量測由該氣體放電載台產生的一光束之一或多個效能參數的一量測系統。
3. 如條項2之光源裝置,其中該控制裝置與該量測系統通信,且進一步經組態以:
分析該氣體放電載台之該主體在該XYZ座標系統中的該定位及該光束之一或多個所量測效能參數兩者;及
判定對該氣體放電載台之該主體的該定位之一修改是否將改良該等所量測效能參數中之一或多者。
4. 如條項3之光源裝置,其進一步包含實體耦接至該氣體放電載台之該主體且經組態以調整該氣體放電載台之該主體之一定位的一致動系統。
5. 如條項4之光源裝置,其中該控制裝置與該致動系統通信且經組態以基於關於該氣體放電載台之該主體的該定位是否應經修改的判定而將一信號提供至該致動系統。
6. 如條項5之光源裝置,其中該致動系統包括複數個致動器,每一致動器經組態以與該氣體放電載台之該主體的一區實體通信。
7. 如條項6之光源裝置,其中每一致動器包括一機電器件、一伺服系統、一電伺服系統、一液壓伺服系統及/或一氣動伺服系統中之一或多者。
8. 如條項1之光源裝置,其中該控制裝置經組態以藉由判定該氣體放電載台之該主體自該X軸的一平移或該氣體放電載台之該主體自該X軸的一旋轉來判定該氣體放電載台之該主體在該XYZ座標系統中的該定位。
9. 如條項8之光源裝置,其中該氣體放電載台之該主體自該X軸的該平移包括以下各者中的一或多者:該氣體放電載台之該主體沿著該X軸的一平移、該氣體放電載台之該主體沿著與該X軸垂直之一Y軸的一平移,及/或該氣體放電載台之該主體沿著與該X軸及該Y軸垂直之一Z軸的一平移。
10. 如條項8之光源裝置,其中該氣體放電載台之該主體自該X軸的該旋轉包括以下各者中的一或多者:該氣體放電載台之該主體繞X軸的一旋轉、該氣體放電載台之該主體繞與該X軸垂直之一Y軸的一旋轉,及/或該氣體放電載台之該主體沿著與該X軸及該Y軸垂直之一Z軸的一旋轉。
11. 如條項1之光源裝置,其中每一感測器經組態以將自該感測器至該氣體放電載台之該主體的一距離量測為該氣體放電載台之該主體相對於彼感測器的該實體態樣。
12. 如條項1之光源裝置,其中該氣體放電載台包括在該主體之第一末端處之一束轉向器件及在該主體之一第二末端處之一束耦合器,該束轉向器件及該束耦合器與該X軸相交,使得在該氣體放電載台中產生的一光束與該束耦合器及該束轉向器件相互作用。
13. 如條項12之光源裝置,其中當該氣體放電載台之該主體處於一系列可接受位置內時,該能量源供應能量至該主體之該空腔,且該束轉向器件及束耦合器對準,產生該光束。
14. 如條項13之光源裝置,其中該光束為具有在該紫外線範圍中之一波長的一經放大光束。
15. 如條項12之光源裝置,其中該束轉向器件為包括用於選擇及調整該光束之一波長的複數個光學件的一光模組且該束耦合器包括一部分反射鏡。
16. 如條項12之光源裝置,其中該束轉向器件包括光學件之一配置,該配置經組態以接收經由一第一埠射出該氣體放電載台之該主體的該光束且改變該光束之一方向以使得該光束經由該第一埠再進入該氣體放電載台之該主體。
17. 如條項12之光源裝置,其中該氣體放電載台亦包括經組態以當該光束在該束耦合器與該空腔之間行進時與該光束相互作用的一擴束器。
18. 如條項1之光源裝置,其中每一感測器經組態以相對於該氣體放電載台之該主體固定地安裝。
19. 如條項18之光源裝置,其中每一感測器經組態以當其相對於該氣體放電載台之該主體固定地安裝時與另一感測器相隔一定距離地固定。
20. 如條項1之光源裝置,其進一步包含:
一第二氣體放電載台,其與該氣體放電載台光學地串聯,該第二氣體放電載台具有界定經組態以與一能量源相互作用之一第二空腔的一第二三維主體,該第二主體包括可透射具有在該紫外線範圍中之一波長之一光束的至少兩個埠;及
第二複數個感測器,該第二複數個感測器中之每一感測器經組態以量測該第二主體之一各別相異區相對於彼感測器的一實體態樣;
其中該控制裝置與該第二複數個感測器通信,且經組態以分析來自該第二複數個感測器中之該等感測器之該等所量測實體態樣,以藉此判定該第二主體相對於由通過該第二主體之該至少兩個埠的一第二X軸界定之一第二XYZ座標系統的一定位。
21. 如條項1之光源裝置,其中每一感測器包括一移位感測器。
22. 如條項21之光源裝置,其中一移位感測器為一光學移位感測器、一線性接近性感測器、一電磁感測器或一超聲波移位感測器。
23. 如條項1之光源裝置,其中每一感測器包括一非接觸式感測器。
24. 如條項1之光源裝置,其中該X軸由在該主體之一第一末端處且與一第一埠光學耦合的一束轉向器件及在該主體之一第二末端處且與一第二埠光學耦合的一束耦合器界定。
25. 一種度量衡裝置,其包含:
一感測器系統,其包括複數個感測器,每一感測器經組態以量測一氣體放電載台之一主體相對於彼感測器的一實體態樣;
一量測系統,其經組態以量測由該氣體放電載台產生的一光束之一或多個效能參數;
一致動系統,其包括複數個致動器,每一致動器經組態以實體耦接至該氣體放電載台之該主體的一相異區,該複數個致動器共同工作以調整該氣體放電載台之該主體的一定位;及
一控制裝置,其與該感測器系統、該量測系統及該致動系統通信,且經組態以:
分析來自該等感測器的該等所量測實體態樣,以藉此判定該氣體放電載台之該主體在由該氣體放電載台界定的一X軸界定之一XYZ座標系統中的一定位;
分析該氣體放電載台之該主體的該定位;
分析一或多個所量測效能參數;及
基於對該氣體放電載台之該主體的該定位及該一或多個所量測效能參數之分析將一信號提供至該致動系統以修改該氣體放電載台之該主體的該定位。
26. 如條項25之度量衡裝置,其中該等感測器彼此遠離及相對於該氣體放電載台之該主體而定位。
27. 如條項25之度量衡裝置,其中該控制裝置經組態以藉由判定最佳化該光束之複數個效能參數的該氣體放電載台之該主體的一定位基於對該氣體放電載台之該主體的該定位及該一或多個所量測效能參數之該等分析將該信號提供至該致動系統以修改該氣體放電載台之該主體的該定位。
28. 如條項25之度量衡裝置,其中該X軸由在該主體之一第一末端處且與一第一埠光學耦合的一束轉向器件及在該主體之一第二末端處且與一第二埠光學耦合的一束耦合器界定。
29. 一種方法,其包含:
在一光源的一氣體放電載台之一主體的複數個相異區中之每一者處量測在彼區處之該主體的一實體態樣;
量測由該氣體放電載台產生的一光束之一或多個效能參數;
分析該等所量測實體態樣,以藉此判定該主體在由一X軸界定之一XYZ座標系統中的一定位,其中該X軸係由與該氣體放電載台相關聯之複數個孔徑界定;
分析該氣體放電載台之該主體的經判定定位;
分析一或多個所量測效能參數;
判定對該氣體放電載台之該主體的該定位之一修改是否將改良該等所量測效能參數中之一或多者;及
若判定對該氣體放電載台之該主體的該定位之一修改將改良該等所量測效能參數中之一或多者,則修改該氣體放電載台之該主體的該定位。
30. 如條項29之方法,其中修改該氣體放電載台之該主體的該定位係基於對該氣體放電載台之該主體的該經判定定位之分析。
31. 如條項29之方法,其中判定該氣體放電載台之該主體的該定位包括判定該氣體放電載台之該主體自該X軸的一平移及該氣體放電載台之該主體自該X軸的一旋轉中之一或多者。
32. 如條項31之方法,其中自該X軸平移該氣體放電載台之該主體包括以下各者中的一或多者:沿著該X軸平移該氣體放電載台之該主體、沿著與該X軸垂直之一Y軸平移該氣體放電載台之該主體,及沿著與該X軸及該Y軸垂直之一Z軸平移該氣體放電載台之該主體。
33. 如條項31之方法,其中自該X軸旋轉該氣體放電載台之該主體包括以下各者中的一或多者:繞該X軸旋轉該氣體放電載台之該主體、繞與該X軸垂直之一Y軸旋轉該氣體放電載台之該主體,及/或沿著與該X軸及該Y軸垂直之一Z軸旋轉該氣體放電載台之該主體。
34. 如條項29之方法,其中量測在彼區處的該主體之一實體態樣包含量測自該感測器至該氣體放電載台之該主體之該區的一距離。
35. 如條項29之方法,其中判定對該氣體放電載台之該主體的該定位之該修改是否將改良該等所量測效能參數中之一或多者包含判定最佳化複數個所量測效能參數的該氣體放電載台之該主體的一定位。
36. 如條項29之方法,其進一步包含自該氣體放電載台產生該光束,包括形成由在該主體之一側處之一束耦合器及在該主體之另一側處之一束轉向器件界定的一諧振器,及在由該主體界定的一空腔中之一增益介質內產生能量,該束耦合器及該束轉向器件界定該X軸。
37. 如條項29之方法,其中量測該光束之一或多個效能參數包含量測複數個效能參數。
38. 如條項37之方法,其中量測該複數個效能參數包含量測以下各者中之兩者或大於兩者:藉由該光源產生的一脈衝光束之一重複率、該脈衝光束之一能量、該脈衝光束之一工作循環及/或該脈衝光束之一光譜特徵。
39. 如條項37之方法,其進一步包含:
判定提供該光束之該等效能參數的值之一最佳集合的該氣體放電載台之該主體的一最佳定位;及
將該氣體放電載台之該主體的該定位修改為在該最佳定位處。
40. 一種度量衡套組,其包含:
一感測器系統,其包括複數個感測器,每一感測器經組態以量測一三維主體相對於彼感測器的一實體態樣;
一量測系統,其包括複數個量測器件,每一量測器件經組態以量測一光束之一效能參數;
一致動系統,其包括經組態以實體地耦接至該三維主體的複數個致動器;及
一控制裝置,其經組態以與該感測器系統、該量測系統及該致動系統通信,該控制裝置包括:
一感測器處理模組,其經組態以與該感測器系統介接並接收來自該感測器系統之感測器資訊;
一量測處理模組,其經組態以與該量測系統介接並接收來自該量測系統之量測資訊;
一致動器處理模組,其經組態以與該致動系統介接;及
一光源處理模組,其經組態以與具有一三維主體之一氣體放電載台介接。
41. 如條項40之度量衡套組,其中該控制裝置包括與該感測器處理模組、該量測處理模組、該致動器處理模組及該光源處理模組通信,且經組態以在使用中指導該光源處理模組調整該氣體放電載台之一或多個特性並分析該感測器資訊及該量測資訊並基於該氣體放電載台之該等經調整特性判定至該致動器處理模組的一指令的一分析處理模組。
42. 如條項40之度量衡套組,其中該度量衡套組經模組化,使得其經組態以可操作地連接一或多個氣體放電載台且與一或多個氣體放電載台斷開連接,每一氣體放電載台包括界定產生一各別光束之一空腔的一各別三維主體。The following items can be used to further describe the implementation:
1. A light source device, which includes:
A gas discharge stage comprising a three-dimensional body defining a cavity configured to interact with an energy source, the body comprising at least two ports that can transmit a light beam having a wavelength in the ultraviolet range;
A sensor system comprising a plurality of sensors, each sensor is configured to measure the physical state of a distinct area of the body of the gas discharge stage relative to the other sensor Kind; and
A control device that communicates with the sensor system and is configured to analyze the measured physical patterns from the sensors to determine that the main body of the gas discharge stage is moving by a The X axis defines a position in an XYZ coordinate system, wherein the X axis is defined by the geometric structure of the gas discharge stage.
2. The light source device of
其他實施係在以下申請專利範圍之範疇內。Other implementations are within the scope of the following patent applications.
100:裝置 102:三維主體 102_ref:虛線方框 104:XYZ座標系統 106:X軸 108:氣體放電載台 110:光束 112:空腔 114:能量源 118:埠 120:埠 121:初游標光束 122:光束 124:感測器系統 124a:感測器 124b:感測器 126a:區 126b:區 128:控制裝置 130x:表面 131x:表面 132z:表面 133z:表面 134y:表面 135y:表面 140:光學組件 142:光學組件 144:平台 514A:電極 514B:電極 544:基礎平台基座 700:裝置 754:致動系統 754a:致動器 754b:致動器 756a:區 756b:區 857a:安裝件 857b:安裝件 900:裝置 960:量測系統 1162:表面形貌映射 1162Y:沿著Y軸平移之值 1162Z:繞Z軸之旋轉之值 1164:搜尋路徑 1270:雙載台光源 1271:經放大光束 1272:第一氣體放電載台 1273:第二氣體放電載台 1274:光束/種子光束 1275:光譜特徵調整器 1276:初游標光束 1277:輸出耦合器 1278:控制系統 1324:感測器系統 1324a:感測器 1324b:感測器 1324i:感測器 1328:控制裝置 1354:致動系統 1354a:致動器 1354b:致動器 1354j:致動器 1360:量測系統 1360a:量測器件 1360b:量測器件 1360k:量測器件 1380:度量衡套組 1381:感測器處理模組 1382:量測處理模組 1383:致動器處理模組 1384:光源處理模組 1385:分析處理模組 1487:程序 1488:量測/步驟 1489:量測/步驟 1490:分析/步驟 1491:步驟 1492:分析/步驟 1493:分析/步驟 1494:步驟 1495:步驟 Ab:縱向軸線 d(a):移位 d(b):移位 d(ss):距離 d'(a):移位 d'(b):移位 D(a):移位 D(b):移位 EX:微影曝光裝置 L:距離 LB:脈衝光束 LS:光源 R:相對定位 W:基板 θ:相對角度定向100: device 102: Three-dimensional body 102_ref: dashed box 104: XYZ coordinate system 106: X axis 108: Gas discharge stage 110: beam 112: Cavity 114: Energy Source 118: Port 120: Port 121: Initial cursor beam 122: beam 124: Sensor System 124a: Sensor 124b: Sensor 126a: District 126b: District 128: control device 130x: surface 131x: surface 132z: surface 133z: surface 134y: surface 135y: surface 140: optical components 142: Optical components 144: Platform 514A: Electrode 514B: Electrode 544: base platform base 700: device 754: Actuation System 754a: Actuator 754b: Actuator 756a: District 756b: District 857a: Mounting parts 857b: Mounting parts 900: device 960: measurement system 1162: Surface Topography Mapping 1162Y: The value of translation along the Y axis 1162Z: The value of the rotation around the Z axis 1164: search path 1270: Dual stage light source 1271: Amplified beam 1272: The first gas discharge stage 1273: The second gas discharge stage 1274: beam/seed beam 1275: Spectral feature adjuster 1276: Initial cursor beam 1277: output coupler 1278: Control System 1324: sensor system 1324a: sensor 1324b: sensor 1324i: sensor 1328: control device 1354: Actuation System 1354a: Actuator 1354b: Actuator 1354j: actuator 1360: measurement system 1360a: measurement device 1360b: measurement device 1360k: measurement device 1380: Weights and Measures Set 1381: sensor processing module 1382: Measurement processing module 1383: Actuator Processing Module 1384: light source processing module 1385: Analysis and Processing Module 1487: program 1488: Measurement/Step 1489: measurement/step 1490: analysis/step 1491: step 1492: Analysis/Step 1493: analysis/step 1494: step 1495: step Ab: longitudinal axis d(a): shift d(b): shift d(ss): distance d'(a): shift d'(b): shift D(a): shift D(b): shift EX: Lithography exposure device L: distance LB: Pulsed beam LS: light source R: Relative positioning W: substrate θ: Relative angle orientation
圖1為經組態以判定三維主體在氣體放電載台之XYZ座標系統中之定位的裝置之方塊圖,該裝置包括一感測器系統;Figure 1 is a block diagram of a device configured to determine the positioning of a three-dimensional body in the XYZ coordinate system of a gas discharge stage, the device including a sensor system;
圖2A為圖1之裝置的透視圖;Figure 2A is a perspective view of the device of Figure 1;
圖2B為來自圖2A之裝置的主體之透視圖,其中主體之縱向軸線與XYZ座標系統之X軸對準;Figure 2B is a perspective view of the main body of the device from Figure 2A, in which the longitudinal axis of the main body is aligned with the X axis of the XYZ coordinate system;
圖3A為來自圖2A之裝置的主體之透視圖,其中主體之縱向軸線藉由主體繞XYZ座標系統之Y軸旋轉而不與XYZ座標系統之X軸對準;3A is a perspective view of the main body of the device from FIG. 2A, in which the longitudinal axis of the main body is rotated by the main body around the Y axis of the XYZ coordinate system without being aligned with the X axis of the XYZ coordinate system;
圖3B為來自圖2A之裝置的主體之透視圖,其中主體之縱向軸線藉由主體繞XYZ座標系統之Z軸旋轉而不與XYZ座標系統之X軸對準;3B is a perspective view of the main body of the device from FIG. 2A, in which the longitudinal axis of the main body is rotated by the main body around the Z axis of the XYZ coordinate system without being aligned with the X axis of the XYZ coordinate system;
圖3C為來自圖2A之裝置的主體之透視圖,其中主體之縱向軸線藉由主體繞XYZ座標系統之X軸旋轉而不與XYZ座標系統之X軸對準;3C is a perspective view of the main body of the device from FIG. 2A, in which the longitudinal axis of the main body is rotated by the main body around the X axis of the XYZ coordinate system without being aligned with the X axis of the XYZ coordinate system;
圖3D為來自圖2A之裝置的主體之透視圖,其中主體之縱向軸線藉由主體沿著XYZ座標系統之Y軸平移而不與XYZ座標系統之X軸對準;3D is a perspective view of the main body of the device from FIG. 2A, in which the longitudinal axis of the main body is not aligned with the X-axis of the XYZ coordinate system by the main body being translated along the Y axis of the XYZ coordinate system;
圖3E為來自圖2A之裝置的主體之透視圖,其中主體之縱向軸線藉由主體沿著XYZ座標系統之Z軸平移而不與XYZ座標系統之X軸對準;3E is a perspective view of the main body of the device from FIG. 2A, in which the longitudinal axis of the main body is not aligned with the X axis of the XYZ coordinate system by the main body being translated along the Z axis of the XYZ coordinate system;
圖3F為來自圖2A之裝置的主體之透視圖,其中主體之縱向軸線藉由主體沿著XYZ座標系統之X軸平移而不與XYZ座標系統之X軸對準;3F is a perspective view of the main body of the device from FIG. 2A, in which the longitudinal axis of the main body is not aligned with the X axis of the XYZ coordinate system by the main body being translated along the X axis of the XYZ coordinate system;
圖4為圖1至圖2B之主體及裝置的透視圖,展示感測器系統及控制裝置之實施;Figure 4 is a perspective view of the main body and device of Figures 1 to 2B, showing the implementation of the sensor system and control device;
圖5為圖4之主體及裝置的沿著YZ平面截得的側橫截面圖;Figure 5 is a side cross-sectional view of the main body and device of Figure 4 taken along the YZ plane;
圖6為展示主體的XY平面之平面圖及圖1至圖2A之裝置的感測器系統如何量測主體之定位的實例;6 is a plan view showing the XY plane of the main body and an example of how the sensor system of the device in FIGS. 1 to 2A measures the positioning of the main body;
圖7為經組態以量測主體之定位的一裝置之透視圖,該裝置除圖7之裝置另外包括經組態以相對於XYZ座標系統之X軸調整主體之定位(且因此亦調整主體之縱向方向)的致動系統以外類似於圖2A之設計;Figure 7 is a perspective view of a device configured to measure the positioning of the main body. In addition to the device in Figure 7, the device additionally includes a device configured to adjust the positioning of the main body relative to the X axis of the XYZ coordinate system (and therefore also adjust the main body The longitudinal direction) other than the actuation system is similar to the design of Figure 2A;
圖8為圖7之主體及裝置之透視圖,展示感測器系統、控制裝置及致動系統的實施;Figure 8 is a perspective view of the main body and device of Figure 7, showing the implementation of the sensor system, control device and actuation system;
圖9為經組態以量測主體之定位及調整主體之定位的一裝置之透視圖,該裝置除圖9之裝置另外包括經組態以量測或監測氣體放電載台之效能或效能特性的量測系統以外類似於圖7之設計;Figure 9 is a perspective view of a device configured to measure the positioning of the main body and adjust the positioning of the main body. In addition to the device in Figure 9, the device also includes a device configured to measure or monitor the performance or performance characteristics of the gas discharge stage Similar to the design shown in Figure 7 except for the measurement system;
圖10為圖9之主體及裝置之透視圖,展示感測器系統、控制裝置、致動系統及量測系統的實施;Figure 10 is a perspective view of the main body and device of Figure 9, showing the implementation of the sensor system, control device, actuation system, and measurement system;
圖11為對準回饋控制處理程序之實施的圖表,其中當主體之定位繞Z軸旋轉並沿著Y軸平移時判定自氣體放電載台輸出的光束之最佳能量;Figure 11 is a diagram of the implementation of the alignment feedback control processing program, in which the optimal energy of the beam output from the gas discharge stage is determined when the positioning of the main body rotates around the Z axis and translates along the Y axis;
圖12為包括兩個氣體放電載台的雙載台光源之方塊圖,該等載台中之任一者或兩者可包括圖2A、圖7或圖9之裝置;Fig. 12 is a block diagram of a dual-stage light source including two gas discharge stages. Either or both of these stages may include the device of Fig. 2A, Fig. 7 or Fig. 9;
圖13為包括組成圖9之裝置的組件的度量衡套組之方塊圖;FIG. 13 is a block diagram of a metrology kit including components that make up the device of FIG. 9;
圖14為藉由圖1、圖2A、圖7或圖9之裝置執行的程序之流程圖;且Fig. 14 is a flowchart of a procedure executed by the device of Fig. 1, Fig. 2A, Fig. 7 or Fig. 9; and
圖15為包括圖1、圖2A、圖7或圖9之裝置的光源之方塊圖。Fig. 15 is a block diagram of a light source including the device of Fig. 1, Fig. 2A, Fig. 7 or Fig. 9;
100:裝置 100: device
102:三維主體 102: Three-dimensional body
104:XYZ座標系統 104: XYZ coordinate system
106:X軸 106: X axis
108:氣體放電載台 108: Gas discharge stage
110:光束 110: beam
112:空腔 112: Cavity
114:能量源 114: Energy Source
118:埠 118: Port
120:埠 120: Port
121:初游標光束 121: Initial cursor beam
122:光束 122: beam
124:感測器系統 124: Sensor System
124a:感測器 124a: Sensor
124b:感測器 124b: Sensor
126a:區 126a: District
126b:區 126b: District
128:控制裝置 128: control device
130x:表面 130x: surface
131x:表面 131x: surface
132z:表面 132z: surface
133z:表面 133z: surface
134y:表面 134y: surface
135y:表面 135y: surface
140:光學組件 140: optical components
142:光學組件 142: Optical components
d(ss):距離 d(ss): distance
Claims (25)
Applications Claiming Priority (2)
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US201862730428P | 2018-09-12 | 2018-09-12 | |
US62/730,428 | 2018-09-12 |
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TW202030556A true TW202030556A (en) | 2020-08-16 |
TWI709005B TWI709005B (en) | 2020-11-01 |
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TW108131274A TWI709005B (en) | 2018-09-12 | 2019-08-30 | Light source apparatus, metrology apparatus, metorlogy method, and metrology kit |
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US (1) | US20210194202A1 (en) |
JP (1) | JP7296448B2 (en) |
KR (1) | KR102524267B1 (en) |
CN (1) | CN112703451A (en) |
TW (1) | TWI709005B (en) |
WO (1) | WO2020055540A1 (en) |
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JPH04356982A (en) * | 1991-06-03 | 1992-12-10 | Toshiba Corp | Gas-laser tube device |
US6192064B1 (en) * | 1997-07-01 | 2001-02-20 | Cymer, Inc. | Narrow band laser with fine wavelength control |
US6243406B1 (en) * | 1999-03-12 | 2001-06-05 | Peter Heist | Gas performance control system for gas discharge lasers |
DE10196136T1 (en) * | 2000-04-26 | 2003-06-12 | Ebara Corp | Excimer laser device |
US6597719B1 (en) * | 2000-08-21 | 2003-07-22 | Komatsu Ltd. | Once through fan for gas laser apparatus and gas laser apparatus therewith |
JP2003056489A (en) * | 2001-08-21 | 2003-02-26 | Ntn Corp | Gas circulation fan of excimer laser device |
US20040101018A1 (en) * | 2002-08-28 | 2004-05-27 | Syb Leijenaar | Suspension system for laser discharge unit |
WO2004095661A1 (en) * | 2003-04-22 | 2004-11-04 | Komatsu Ltd. | 2-stage laser device for exposure |
TWI402628B (en) * | 2007-08-31 | 2013-07-21 | Cymer Inc | System managing gas flow between chambers of an extreme ultraviolet (euv) photolithography apparatus |
JP5429956B2 (en) * | 2008-08-22 | 2014-02-26 | ギガフォトン株式会社 | Excimer laser equipment |
JP5844536B2 (en) * | 2011-03-28 | 2016-01-20 | ギガフォトン株式会社 | Laser system and laser generation method |
US8853657B2 (en) * | 2012-07-28 | 2014-10-07 | Cymer, Llc | Intracavity loss element for power amplifier |
JP2014116384A (en) | 2012-12-07 | 2014-06-26 | Panasonic Corp | Gas laser oscillation device |
US9065248B2 (en) * | 2013-11-20 | 2015-06-23 | Cymer, Llc | Systems and methods to more accurately estimate a fluorine concentration in a source laser |
JP6278427B1 (en) * | 2017-01-05 | 2018-02-14 | レーザーテック株式会社 | Optical device and vibration isolation method |
CN110447149B (en) * | 2017-04-18 | 2021-07-16 | 极光先进雷射株式会社 | Gas laser device and magnetic bearing control method |
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CN112703451A (en) | 2021-04-23 |
KR102524267B1 (en) | 2023-04-20 |
KR20210031522A (en) | 2021-03-19 |
US20210194202A1 (en) | 2021-06-24 |
JP2021536033A (en) | 2021-12-23 |
WO2020055540A1 (en) | 2020-03-19 |
JP7296448B2 (en) | 2023-06-22 |
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