TW202027590A - Heat dissipation in a three chamber chassis of a personal computer - Google Patents

Abstract

A computer chassis comprises a chassis frame encompassing a chassis cavity, a right side outer panel, a left side outer panel, a central solid bulkhead, and a chamber partition. The central solid bulkhead occupies an entire cross sectional area of the chassis cavity, and divides the chassis cavity into a first chassis cavity portion and a second chassis cavity portion. The chamber partition occupies an entire cross sectional area of the second chassis cavity portion and divides the second chassis cavity portion to create a third chassis cavity portion.

Description

Three-chamber heat sink case for personal computer

The present invention relates to a small size computer with high performance hardware.

Consumers have a demand for small form factor computers equipped with high-performance hardware. However, small computers often cannot cool high-power central processing units (CPU’s) and graphics processing units (GPU’s) under acceptable noise levels. Many computer systems use top-to-bottom fans, which blow heat from the CPU and/or the GPU to the motherboard components, thereby exacerbating the cooling problem of the system. Small computer casings are usually equipped with small-diameter high-speed fans (such as 40mm, 60mm, 80mm), but they produce a lot of noise when running at high speeds.

How to improve the heat dissipation effect of a small computer and reduce the noise generated by the cooling fan is an urgent goal for relevant technicians.

In view of this, one object of the present invention is to provide a computer case, which includes a case frame surrounding a case accommodating space, a right outer plate facing a first YZ plane of the computer case, and a One of the left side outer panels of the second YZ plane of the computer case, a central solid partition in the housing space of the case, and a compartment partition.

The computer case has a case top facing a first XY plane of the computer case, a case bottom facing a second XY plane of the computer case, and a first XZ surface facing the computer case The front end of the flat case and the rear end of the case facing a second XZ plane of the computer case.

The central solid partition occupies an entire cross-sectional area in the housing accommodating space, and faces a third YZ plane of the computer housing, wherein the third YZ plane is located in the middle of the computer housing in the X-axis direction , Wherein the central solid partition extends from the top of the casing to the bottom of the casing, and extends from the front end of the casing to the rear end of the casing. The central solid partition divides the housing accommodating space into a first housing space and a second housing space.

The compartment partition is located in the second housing space, occupies an entire cross-sectional area in the second housing space, faces an X-Y plane, and separates the second housing space into a third housing space. Wherein, the first housing space forms a first heat sink chamber of the computer housing, the second housing space forms a second heat bath chamber of the computer housing; and the third housing space forms the computer One of the third heat tank chambers of the casing.

Another technical means of the present invention is that the second housing space is used to enclose a motherboard and a central processing unit corresponding to the motherboard

Another technical means of the present invention is that the first housing space is used to enclose a graphics processing unit.

Another technical means of the present invention is that the third housing space is used to enclose a power supply unit.

Another technical means of the present invention is that the first housing space is used to enclose a first heat dissipation unit.

Another technical means of the present invention is that the second housing space is used to enclose a second heat dissipation unit.

Another technical means of the present invention is that the first heat dissipation unit is connected to a water pump so that the coolant liquid flows from a heat source of the computer case to the first heat dissipation unit, wherein the coolant liquid is from the heat source The heat is removed and the coolant liquid is cooled in the first heat dissipation unit.

Another technical means of the present invention is that the second heat dissipation unit is connected to a water pump, so that the coolant liquid flows from a heat source of the computer case to the second heat dissipation unit, wherein the coolant liquid is from the heat source The heat is removed and the coolant liquid is cooled in the second heat dissipation unit.

Another technical means of the present invention is that the above-mentioned computer case further includes at least one exhaust fan disposed on the top of the case, wherein the at least one exhaust fan is from the first and second heat sink chambers of the computer case Pump out the gas.

Another technical means of the present invention is that the above-mentioned computer case further includes at least one exhaust fan disposed in the third heat sink chamber for providing air flow to the power supply according to the internal temperature of the power supply.

Another technical means of the present invention is that the right outer panel allows airflow to flow from the outside of the computer case into the computer case.

Another technical means of the present invention is that the left side outer panel allows airflow to flow from the outside of the computer case into the computer case.

Another technical means of the present invention is that the bottom of the casing allows airflow to flow from the outside of the computer casing into the computer casing.

The beneficial effect of the present invention is that the central solid partition and the trough partition divide the housing accommodating space into independent first housing space, second housing space, and third housing space, which are formed separately The first heat bath room for the graphics processing unit, the second heat bath room for the motherboard with the central processing unit, and the third heat bath room for the power supply unit. And convective force, transfer heat to the outside world.

The method, system, user interface and other related aspects of the present invention are described below. Reference will be made to some embodiments of the present invention and examples in the drawings. Although the present invention will be described in conjunction with these embodiments, it should be understood that it does not attempt to limit the present invention to these specific embodiments. On the contrary, the present invention is intended to cover various alternatives, modifications and equivalent manners within the spirit and scope of the present invention. Therefore, the description and drawings of the present invention should be regarded as an explanation rather than a restrictive concept.

The method, system, user interface and other related aspects of the present invention are described below. Reference will be made to some embodiments of the present invention and examples in the drawings. Although the present invention will be described in conjunction with these embodiments, it should be understood that it does not attempt to limit the present invention to these specific embodiments. On the contrary, the present invention is intended to cover various alternatives, modifications and equivalent manners within the spirit and scope of the present invention. Therefore, the description and drawings of the present invention should be regarded as an explanation rather than a restrictive concept.

In addition, many specific details will be given in the following description to fully understand the content of the present invention. However, for those having ordinary knowledge in the technical field to which the present invention belongs, the present invention can be implemented without these specific details. In addition, in order to avoid obscuring the content of the present invention, the examples, methods, procedures, components, and networks that are well known to those with ordinary knowledge in the technical field of the present invention will not be described in detail.

FIG. 1 is a left front view of a three-compartment computer casing 100 according to some embodiments of the present invention. The casing 100 encloses the computer cooling system and other computer components. The cooling system includes several components operating simultaneously, which can effectively remove heat from the system at low noise levels. For example, in a non-limiting embodiment, the cooling system components may include: a radiator, a water pump, a cold plate, a pipeline, a casing fan, and a control system. According to some embodiments of the present invention, the casing 100 includes 3 heat bath chambers, namely: 1) a first heat bath chamber 101 (for example: a graphics processing unit "GPU" chamber), 2) a second heat bath chamber The tank chamber 102 (for example: a motherboard tank chamber and its central processing unit "CPU"), and 3) a third thermal tank chamber 103 (for example: a power supply unit tank chamber). The GPU in the first heat sink chamber 101 generates heat. Similarly, a motherboard and its CPU (not shown in FIG. 1) in the second heat sink chamber 102 will generate heat. The power supply unit (not shown in FIG. 1) in the third heat sink chamber 103 also generates heat.

According to some embodiments of the present invention, the casing 100 has a top opening 106 on which a casing exhaust fan can be erected. The casing 100 is divided longitudinally by a middle plate or central partition 104. The middle plate or central partition 104 faces the YZ plane and extends the height of the cabinet 100 along the Z axis direction. Furthermore, according to some embodiments of the present invention, a compartment partition 105 (such as a hard disk tray) divides the second thermal compartment 102 (main board compartment) from the third thermal compartment 103 (power supply unit compartment) Separate. According to some embodiments of the present invention, the compartment partition 105 is a removable baffle facing the X-Y plane and extending the depth of the casing 100 from the Y axis direction. Therefore, the heat sources of the three thermal chambers are completely isolated from each other. The embodiments are not limited to the positions of the GPU slot, the motherboard slot, and the power supply unit slot in the chassis shown in FIG. 1 relative to each other. Due to different implementations, the positions of the GPU slot, the motherboard slot, and the power supply unit slot relative to each other in the casing are different. FIG. 1 also illustrates that the rear end of the casing 100 has an opening 110. According to some embodiments of the present invention, a power supply unit is disposed in the third heat sink chamber 103 of the casing 100, and hot air can be drawn out from the opening 110, so that the heat in the third heat sink chamber 103 can be Discharge, this part can refer to the detailed description of Figure 5. Furthermore, a plurality of openings or vents may be provided on the side of the casing 100, for example, at positions 150, 151, 152, 153 (please refer to position 153 in FIG. 2 for details). The openings or vents on the side of the casing can suck cold air into the casing or discharge hot air from the casing to the outside environment. Therefore, the three-heat tank chambers 101, 102, and 103 can help to limit the heat load to the respective controlled positions.

In the drawing of the casing 100, all the outer panels of the casing are not shown to avoid hiding the inside of the casing.

According to some embodiments of the present invention, the compartment partition 105 is detachable and can be installed on a hard disk of the casing 100 more conveniently. According to some embodiments of the present invention, the detachable baffle provides more efficient heat conduction by reducing the volume of the heat sink chamber, thereby increasing laminar flow across the thermal components on the motherboard.

FIG. 2 is a right front view of the computer case 100 according to some embodiments of the present invention. All the outer panels of the casing are not shown here to avoid hiding the inside of the casing. The rear view of FIG. 2 clearly illustrates that the first heat sink chamber 101 (for example, the GPU slot) extends from the height of the casing 100. As explained before, the middle plate or central partition 104 also extends from the height of the casing 100 and separates the first heat bath chamber 101 from the other two heat bath chambers (102 and 103). Fig. 2 also illustrates that the position 153 with openings or vents can be arranged on the side of the casing to achieve air circulation. Therefore, the GPU can be located in its hot slot and set up on the other side of the motherboard, and connected to the motherboard by a flexible wire (for example, a high-speed peripheral component connection interface "PCIe" wire). Please refer to the description of Figure 6 and Figure 7. The configuration of the GPU relative to the motherboard reduces the size of the chassis along the X axis (the central partition of the motherboard extends along the Y axis). Therefore, these configurations can meet a small-sized chassis.

Figure 3 is a front view of the casing, illustrating the arrangement of multiple radiators. All the outer panels of the casing are not shown here to avoid hiding the inside of the casing. According to some embodiments of the present invention, FIG. 3 illustrates a GPU (graphics processing unit) heat sink 120 and a CPU (central processing unit) heat sink 122. The CPU radiator 122 is a part of a CPU liquid cooler, which can be erected inside the second heat sink chamber 102 (main board slot). The water barrier and water pump (not shown in FIG. 3) of the CPU liquid cooler will be erected above the CPU to cool the CPU. Similarly, the GPU heat sink 120 is a part of a GPU liquid, which can be erected inside the first thermal tank 101 (GPU tank). The water barrier and water pump (not shown in FIG. 3) of the GPU liquid cooler will be erected above the GPU to cool the GPU. Please refer to FIG. 8 to further understand the description of the cooler (GPU heat sink 120, CPU heat sink 122). The main heat source transfer area can be inside the casing (for example, heat from GPU and CPU can be transferred to the liquid coolant in their related liquid coolers, and the liquid coolant can pass through individual coolers (GPU radiator 120 , CPU radiator 122) and its accompanying fan for cooling). The coolers (GPU heat sink 120, CPU heat sink 122) sequentially transfer the heat to the surrounding air of the first heat sink chamber 101 and the second heat sink chamber 102, respectively. The heat transfer area may also appear outside the casing through the opening of the casing 100. For example, a casing exhaust fan can be erected on a top opening 106 and draw heat from the first heat sink chamber and the second heat sink chamber through the top opening 106. Even in the case of an exhaust fan without a casing, the heat of the first heat sink chamber 101 and the second heat sink chamber 102 will rise due to the convective force 302, and then leave the casing 100 through the top opening 106. In addition, cold air is sucked into the casing 100 through the vent positions 110, 150, and 153 (position 153 in FIGS. 2, 4, and 5) on the side of the casing 100. The hot air can also be exhausted from the cabinet 100 by opening the vents. In another example, the fan of the power supply unit can draw in cold air from the outside of the casing 100 through the vent located at the position 150, and can discharge heat from the opening 110 at the rear end of the third heat sink chamber 103.

Fig. 4 is a front view of the casing, illustrating in detail the first thermal bath chamber 101 according to some embodiments of the present invention. All the outer panels of the casing are not shown here to avoid hiding the inside of the casing. FIG. 4 illustrates that a GPU 403 with a liquid cooler 404 (and its accompanying water pump) is installed on the GPU 403 in the first heat sink 101. FIG. 4 also illustrates the state of the GPU heat sink 120 for removing heat from the heat generating liquid cooler leaving the GPU liquid cooler 404. After the liquid coolant is cooled by the GPU heat sink 120, the cooled liquid coolant is sent back to the water barrier (not labeled) in the GPU liquid cooler 404 to cool the GPU 403. The heat of the GPU heat sink 120 is transferred to the air surrounding the first heat sink chamber 101. The heated air in the first heat sink chamber 101 is passed through the opening 106 and or by the passive convection force or forced convection force (for example, with the help of an exhaust fan arranged in the opening, the warm air can be drawn out of the casing) Pass through the vent located at position 153 and then leave the cabinet 101. 4 also illustrates a heat sink 405 for removing heat from a GPU voltage regulator module "VRM" (and its accompanying cooling fan). The intermediate plate or central partition 104 separates the heat source of the first heat bath chamber 101 from the heat source of the second heat bath chamber 102 and the third heat bath chamber 103.

FIG. 5 illustrates the air flow in the casing 100 of a three-heat tank chamber according to some embodiments of the present invention. All the outer panels of the casing are not shown here to avoid hiding the inside of the casing. With the help of natural convection force 302 opposite to the direction of gravity 304, heat is carried to the outside of the casing through the airflow through the tank. According to some embodiments of the present invention, an exhaust fan can also be erected on the top opening 106 of the casing 100 to extract heat from the casing 100. The three thermal tank chambers 101, 102, 103 help to limit the heat load to individual control areas. In some embodiments, the exhaust fan can be turned off to allow the system to use convection to help air flow and cool. FIG. 5 illustrates that the airflow 553A of cold air enters the casing 100 through the vent position 153 located on the side of the casing. The cold air flow 553A transfers heat from the heat source (such as GPU, GPU heat sink, GPU VRM heat sink, etc.) in the first heat sink chamber 101. As the air flow 553A is heated, it will rise due to convection force and flow out through the opening 106 (air flow 553B) to the first heat sink chamber 101. FIG. 5 also illustrates that the airflow 551A of cold air enters the second heat sink chamber 102 through the vent position 151 located on the side of the casing 100. The cold airflow 551A transfers heat from the heat source (such as CPU, CPU radiator, and other heat sources on the motherboard) in the second heat sink chamber 102. As the air flow 551A is heated, it will rise due to convection and flow out through the opening 106 (air flow 551B) to the second hot bath chamber 102. In addition, FIG. 5 illustrates that the airflow 550A of cold air enters the third heat sink chamber 103 through the vent position 150 located on the side of the casing 100. The cold air flow 550A transfers heat from the heat source in the third heat sink chamber 103, such as a power supply unit. As the air flow 550A is heated, it will rise due to convection and flow out through the opening 110 (air flow 550B) to the third heat sink chamber 103.

Fig. 6 is a schematic diagram illustrating the arrangement of some main heat sources in the computer case according to some embodiments of the present invention. FIG. 6 illustrates that the middle plate or central partition 104 and the tank partition 105 together isolate the heat sources of the first heat bath chamber 101, the second heat bath chamber 102, and the third heat bath chamber 103 from each other. Figure 6 also illustrates the main heat source, the GPU403 and GPU VRM heat sink 405 in the first heat sink chamber 101, the motherboard 601 (and its accompanying CPU) in the second heat sink chamber 102, and the third The power supply unit 602 (and its built-in fan 602A) in the hot tub 103. The fan 602A can draw cold air from the outside of the casing and discharge the heated air out of the casing through the rear opening of the third heat sink chamber 103. FIG. 6 also illustrates that a casing exhaust fan 603 can be installed on the top of the casing. When the exhaust fan 603 is running, it can draw out the heated air in the first heat sink chamber 101 and the second heat sink chamber 102. According to some embodiments, when the temperature of the GPU or CPU liquid coolant reaches a predetermined threshold, the casing exhaust fan 603 will automatically operate. FIG. 6 also illustrates the PCle ribbon cables 604A, 604B, and 604C used to connect the GPU 403 and the motherboard 601.

FIG. 7 illustrates a high-speed peripheral component connection interface wire assembly 700 according to some embodiments of the present invention. The high-speed peripheral component connection interface wire assembly 700 includes a GPU connector 702 to connect to the GPU 403. The high-speed peripheral component connection interface cable assembly 700 also includes PCle ribbon cables 604A, 604B, and 604C to help the GPU 403 connect to the motherboard 601.

FIG. 8 illustrates the use of a heat sink and a liquid cooler for GPU or CPU according to some embodiments of the present invention. Figure 8 illustrates a heat sink 800. The radiator 800 includes a bottom manifold 801, a top manifold 808, a plurality of conveying tubes 806a, 806b, and a plurality of fins 807a, 807b. The bottom manifold 801 includes an inlet 802 and an outlet 803. The bottom manifold 801 includes a partition wall (not shown) in the position 810. The inner dividing wall approximately divides the bottom manifold into two halves. The conveying pipe 806a and the corresponding tabs 807a occupy about half of the area of the radiator. The conveying pipe 806b and the corresponding tabs 807b occupy about the other half of the area of the radiator.

According to some embodiments of the present invention, heat transfer can occur in the following situations. To further illustrate, the liquid coolant (through a water cooling plate) transfers the heat of the CPU, and the heat-generating liquid coolant enters the radiator 800 from the inlet 802 of the bottom manifold 801. The water stream 802A of the heat-generating liquid coolant is pressurized and delivered to the top manifold 808 (water stream 805A) through the plurality of delivery pipes 806a. When the liquid coolant reaches the top manifold 808, it (water flow 808A) will move toward the plurality of delivery pipes 806b. The liquid coolant is therefore forced to flow through the plurality of delivery pipes 806b (water flow 805B), and when the liquid coolant flow returns to the bottom manifold 801, it will be further cooled by the fins 807b. The fins 807a, 807b effectively increase the surface area of the conveying pipes 806a, 806b to better help the heat-generating liquid coolant transfer heat to the surrounding air. Therefore, when the liquid coolant flows back to the bottom manifold 801, when it (water flow 803A) flows out of the radiator 800 through the outlet 803 and returns to the CPU to cool the CPU, the liquid coolant has been quite cooled. Similarly, in the example of GPU (graphics processing unit), the operation of the GPU heat sink is the same as the operation of the above-mentioned CPU.

The CPU and GPU are each equipped with unique water-cooling plate components, which are directly attached to the main heat sources of the CPU and GPU. According to some embodiments of the present invention, each water-cooling plate (for example, one configured in the CPU and the other configured in the GPU) includes a small space surrounded by its main axis and a metal plate, for example, a thermal conductivity of not less than 50W /mK, and not more than 1500W/mK made of metal. The metal plate has a series of thin convex plates on one side, usually produced by a micro-knife process, through which liquid can flow and absorb heat in the metal. The water-cooled plate assembly is contained in a shell, which is made of a metal, is not penetrated by liquid coolant and has sufficient structural integrity to withstand the clamping force and the pressure and temperature range during operation.

According to some embodiments of the present invention, the pipeline for carrying the coolant liquid is made of an elastic rubber, plastic or a Teflon base material, which is specially designed to meet the low permeability of the coolant element (Generally a combination of water, propylene glycol, a corrosion inhibitor and an antimicrobial compound). The length of the pipeline can be super long to serve as a service network to connect other components in the casing without stopping the cooling scheme between the radiator, water pump, casing or water cooling plate.

The system is designed to make use of the convective airflow generated by the hot chimney effect in the casing, and the use of one or more cooling fans can greatly increase the heat capacity of the system (for example, please refer to Figure 1). According to some embodiments, the exhaust fan can be installed in the machine The top opening 106 of the shell.) Installing a fan can also provide cold air flow to other components. Although it generates heat, it is not connected to the coolant liquid circulation. These components include, but are not limited to, adjustment components, processing components, storage devices, memory, and data interfaces in the casing. The bottom-to-up (relative to the direction of gravity) natural airflow design promotes a high degree of laminar flow on the radiator and on the internal components installed in the casing. The CPU, GPU and PSU thermal load can be separated in different compartments.

The PSU hot slot room sucks in cold air from one side of the casing and discharges air on the rear side plate (at the rear of the casing). This allows the PSU to maintain cold air drawn from the outside instead of pre-heated air drawn into the environment inside the cabinet. Using a cold air inlet helps to reduce the need for PSU to install fans.

According to some embodiments, the display card is upside down in its slot, and heat generating components (such as voltage regulator and memory) placed on the PCB on the surface are not the GPU itself close to the top exhaust fan. The surface components are cooled by a heat sink and fan assembly, which includes aluminum and heat pipes and a fan in a casing. The fan of the heat sink allows air to circulate through the heat sink of the GPU component, and its proximity to the top exhaust port allows heat to be quickly and unimpededly removed from the case, thereby providing effective cooling for the surface components on the graphics card.

The display card in its slot is also intended to allow stable loading (for example, the PCB itself is directly set on the partition board) and future upgrade/maintainability. End users with medium technical level can replace the display card in the slot by themselves.

According to some embodiments, the automatic cooling system of the graphics card can be completely separated from the main cooling system without affecting the operation, so that the computer can be equipped with a graphics card, which has an integrated cooling system separate from the rest of the computer, which A heat sink and centrifugal fan assembly cool the graphics card.

The output of the graphics card is bridged with the modular input and output components of the front and back of the chassis to upgrade/modify/replace these port groups without affecting other parts of the computer. This enhances the expected upgradeability of the graphics card, because the generation of graphics cards usually changes the output configuration of the graphics card.

The system may also include a control system inside the case, which controls the fan speed of the case by monitoring sensors related to temperature, liquid coolant temperature, or power supply to determine the cooling demand of the system, and Adjust the fan speed accordingly to provide sufficient cooling within the minimum noise value. The control system can have an external data interface or an operating computer. The control system can be a discrete component analog system or a digital control system with a logic device or a microcontroller, and it can output different voltages to the fan motor or output digital control signals such as pulse width adjustment to adjust the speed of the fan. The control system measures the temperature of each liquid circuit independently, close to its main heat source (CPU, GPU, etc.), and considers each fluid independently when selecting the appropriate fan speed for the entire system. The main technology may include one or more pumps or one or more tanks, and can rely on remote probes to read temperature, pump speed, and other liquid loop presence detection. If the controller detects any system water pump or fan failure or any temperature sensor failure out of range temperature value through RPM, one or more LEDs will flash to indicate the error condition to the operator and flag the error in the operating system monitoring software.

According to some embodiments, a computer case includes: 1) a case frame surrounding a case accommodating space, the computer case having a case top facing a first XY plane of the computer case, and The bottom of the case facing the second XY plane of the computer case, the front end of the case facing the first XZ plane of the computer case, and the rear of the case facing the second XZ plane of the computer case End; 2) a right side outer panel, facing the first YZ plane of the computer case; 3) a left side outer panel, facing the second YZ plane of the computer case; 4) one located in the housing accommodating space The central solid partition, the central solid partition occupies an entire cross-sectional area in the housing accommodating space, and faces a third YZ plane of the computer housing, wherein the third YZ plane is located on the computer housing The middle position in the X-axis direction, where: the central solid partition extends from the top of the housing to the bottom of the housing, and extends from the front end of the housing to the rear end of the housing; and the central solid partition divides the housing accommodating space Is a first housing space and a second housing space; 5) a compartment partition in the second housing space, the trough partition occupies an entire cross-sectional area in the second housing space, and Facing an XY plane and partitioning the second housing space to divide a third housing space; 6) wherein the first housing space forms a first thermal chamber of the computer housing, and the second housing The space forms a second heat sink room of the computer casing; and the third casing space forms a third heat sink room of the computer casing.

In summary, with the central solid partition 104 and the tank partition 105 in the present invention, the air in the first heat tank 101, the second heat tank 102 and the third heat tank 103 will not Circulate each other so that the heat generated by the CPU, GPU and power supply unit will not affect each other, and then through the air vents at positions 150, 151, 152, 153 and the influence of convective force 302 and gravity 304, the air can circulate to achieve The heat dissipation effect is that the GPU heat sink 120 and the CPU heat sink 122 transfer the heat of the GPU and the CPU to the outside, further improving the operating efficiency of the GPU and the CPU, so the purpose of the invention can be achieved.

For explanatory purposes, the above description is described with reference to specific embodiments. However, the foregoing illustrative discussion is not intended to explain exhaustively or limit the present invention to the disclosed form. There are many modifications and changes with reference to the above teachings. The selected and described embodiments are used to best illustrate the principle of the invention and its practical application, so that others with ordinary knowledge in the art can make the best use of the invention and various embodiments with various modifications according to specific uses. .

100: Chassis 101: First hot tank chamber 102: Second hot tank chamber 103: Third hot tank chamber 104: Intermediate plate or central partition 105: Tank partition 106: Top opening 110: Opening 120: GPU heat dissipation Processor 122: CPU radiator 150: position 151: position 152: position 153: position 302: convective force 304: gravity 403: GPU404: liquid cooler 405: heat sink 550A: airflow 550B: airflow 551A: airflow 551B: airflow 553A: Airflow 553B: airflow 601: motherboard 602: power supply unit 602A: fan 603: chassis exhaust fan 604A: PCle ribbon cable 604B: PCle ribbon cable 604C: PCle ribbon cable 700: high-speed peripheral component connection interface cable assembly 702 : GPU connector 800: radiator 801: bottom manifold 802: inlet 802A: water flow 803: outlet 803A: water flow 805A: water flow 805B: water flow 806a: delivery pipe 806b: delivery pipe 807a: protrusion 807b: protrusion 808: top Manifold 808A: Water Flow 810: Position

Fig. 1 is a left front view of a three-compartment computer casing according to some embodiments of the present invention; Fig. 2 is a right front view of a three-compartment computer casing according to some embodiments of the present invention; Fig. 3 is the machine A front view of the casing, according to some embodiments of the present invention, illustrating the arrangement of a plurality of radiators; Fig. 4 is a front view of the casing, according to some embodiments of the present invention, illustrating in detail a first heat sink chamber; 5 is a diagram illustrating the air flow in a casing of a three-heat tank chamber according to some embodiments of the present invention; FIG. 6 is a schematic diagram illustrating the arrangement of some main heat sources in the computer casing according to some embodiments of the present invention; FIG. 7 illustrates a high-speed peripheral component connection interface wire assembly according to some embodiments of the present invention; and FIG. 8 illustrates the use of a heat sink and a liquid cooler of a GPU or CPU according to some embodiments of the present invention.

101: The first thermal chamber

102: The second thermal chamber

103: The third thermal chamber

104: Intermediate plate or central partition

105: tank partition

106: top opening

110: bottom opening

120: GPU cooler

122: CPU cooler

150: location

151: Location

152: Location

302: Convection

304: Gravity

Claims (13)

A three-chamber heat-dissipating case for a personal computer includes: a case frame surrounding a case accommodating space, the computer case has a case top facing a first XY plane of the computer case, and a side facing The bottom of the case on the second XY plane of the computer case, the front end of the case facing the first XZ plane of the computer case, and the back end of the case facing the second XZ plane of the computer case ; One facing the right outer panel of the first YZ plane of the computer case; one facing the left outer panel of the second YZ plane of the computer case; a central solid partition located in the housing space of the case, the The central solid partition occupies an entire cross-sectional area in the housing accommodating space, and faces a third YZ plane of the computer housing, wherein the third YZ plane is located in the middle of the computer housing in the X-axis direction, Wherein: the central solid partition plate extends from the top of the housing to the bottom of the housing, and extends from the front end of the housing to the rear end of the housing; and the central solid partition divides the housing space of the housing into a first housing space and A second housing space; a compartment partition located in the second housing space, the trough partition occupies an entire cross-sectional area in the second housing space and faces an XY plane, and places the second The casing space separates a third casing space; wherein, the first casing space forms a first heat sink chamber of the computer casing, and the second casing space forms a second heat bath room of the computer casing Room; and the third housing space forms a third thermal chamber of the computer housing. According to the three-chamber heat-dissipating case for a personal computer according to the first item of the patent application, the second case space is used to enclose a motherboard and a central processing unit corresponding to the motherboard. According to the three-compartment heat dissipation case for a personal computer according to the first item of the scope of patent application, the first case space is used to enclose a graphics processing unit. According to the three-compartment heat-dissipating case for a personal computer according to item 1 of the scope of patent application, the third case space is used to enclose a power supply unit. According to the three-compartment heat dissipation case for a personal computer according to item 1 of the scope of patent application, the first case space is used to enclose a first heat dissipation unit. According to the three-compartment heat dissipation case for a personal computer according to item 1 of the scope of patent application, the second case space is used to enclose a second heat dissipation unit. According to the three-chamber heat dissipating case for a personal computer according to item 5 of the scope of patent application, wherein the first heat dissipating unit is connected to a water pump so that the coolant liquid flows from a heat source of the computer case to the first heat dissipating unit , Wherein the coolant liquid removes heat from the heat source and the coolant liquid is cooled in the first heat dissipation unit. According to the three-chamber heat dissipating case for a personal computer according to the scope of patent application, the second heat dissipating unit is connected to a water pump so that the coolant liquid flows from a heat source of the computer case to the second heat dissipating unit , Wherein the coolant liquid removes heat from the heat source and the coolant liquid is cooled in the second heat dissipation unit. According to item 1 of the scope of patent application, the three-chamber heat dissipation case for a personal computer further includes at least one exhaust fan arranged on the top of the case, wherein the at least one exhaust fan is heated from the first and second heats of the computer case Gas is drawn from the tank chamber. The three-compartment heat sink case for a personal computer according to the first item of the scope of patent application further includes at least one exhaust fan arranged in the third heat sink chamber for providing air flow to the power supply according to the internal temperature of the power supply. According to the three-chamber heat-dissipating case for a personal computer according to item 1 of the scope of patent application, the right outer plate allows airflow to flow from the outside of the computer case into the computer case. According to the three-chamber heat-dissipating case for a personal computer according to item 1 of the scope of patent application, the left side outer plate allows airflow to flow from outside the computer case into the computer case. According to the three-chamber heat-dissipating case for a personal computer described in item 1 of the scope of patent application, the bottom of the case allows airflow to flow from the outside of the computer case into the computer case.

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