TW202026069A - Wafer cleaning tank convenient for air flow control - Google Patents

Abstract

The invention provides a wafer cleaning tank convenient for air flow control, which includes a cleaning tank body, movable air plates, guide rod mechanisms, fixed air plates, an air intake mechanism, an air guide pipe and a wafer mounting bracket. Air vents are respectively arranged in the upper and lower parts of the two sides of the cleaning tank body. The movable air plates are movably arranged on the upper parts of the two sides of the cleaning tank body, and the guide rod mechanisms are respectively connected with the movable air plates. The fixed air plates are fixedly arranged on the lower parts of the two sides of the cleaning tank body, and ventilation channels are reserved in the lower parts of the two sides of the cleaning tank body. The air intake mechanism is arranged on the top of the cleaning tank body. The air guide pipe is arranged at the bottom of the cleaning tank body. The wafer mounting bracket is arranged at the top of the air guide pipe. By using the wafer cleaning tank convenient for air flow control of the invention, smooth flow of air in the cleaning tank can be ensured no matter whether there is a wafer placed in the cleaning tank, gas retention in the cleaning tank is avoided, the condensation of cleaning liquid or vapor fog in the cleaning tank is avoided, and the cleaning effect of wafers is guaranteed.

Description

Wafer cleaning tank with easy airflow control

The present invention relates to the technical field of wafer cleaning appliances, in particular, to a wafer cleaning tank with easy airflow control.

Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called wafer; it can be processed into various circuit component structures on silicon wafers, and become products with specific electrical functions. Body circuit products.

The manufacture of integrated circuits is the core of the electronic information industry, and is one of the most important high and new technologies that promote the development of national economy and social informatization. With the development of wafers in the direction of large sizes and thin lines, the requirements for surface flatness of wafers are getting higher and higher. Therefore, chemical mechanical polishing equipment is getting more and more attention in the field of integrated circuits.

In the chemical mechanical polishing process, the cleaning mechanism is the last link of the entire polishing process. Every detail of the cleaning action and every structure of the cleaning mechanism must be strictly controlled to ensure the cleanliness and flatness of the cleaned wafer surface. The dry-in and dry-out of the wafer makes the wafer polishing process a higher pass rate.

With the continuous upgrading of equipment structure, the space occupied by the wafer cleaning tank is getting smaller and smaller. During the use of the existing wafer cleaning tank, when the cleaned wafer is put into or taken out of the wafer cleaning tank, the flow direction of the airflow in the tank will be disrupted, resulting in an uncontrolled gas retention area in the tank. Condensation of the cleaning liquid or vapor in the tank is caused, particles are generated, and the cleaning effect of the wafer is affected.

In view of the above-mentioned problems, the present invention provides a wafer cleaning tank with easy airflow control. The wafer cleaning tank with easy airflow control can guarantee the airflow in the cleaning tank when wafers are placed or not placed in the cleaning tank. It is unobstructed to avoid gas stagnation in the cleaning tank, thereby avoiding condensation of cleaning liquid or vapor in the cleaning tank, ensuring the cleaning effect of the wafer.

In order to achieve the above objective, the present invention adopts the following technical solutions.

To provide a wafer cleaning tank with easy airflow control, including a cleaning tank main body, a movable air plate, a guide rod mechanism, a fixed air plate, an air intake mechanism, an air duct and a wafer mounting bracket, A cleaning cavity is formed in the main body of the cleaning tank, and air vents are opened on both upper and lower sides of the main body of the cleaning tank; The movable air plate is movably arranged on the upper part of both sides of the cleaning tank body, the guide rod mechanism is connected with the movable air plate, and the movable air plate is used to close or open the upper part of the cleaning tank body on both sides Vent The fixed air plates are arranged at the lower part of both sides of the cleaning tank body, and there are ventilation channels in the lower part of both sides of the cleaning tank body; The air intake mechanism is arranged at the top of the cleaning tank body; the air duct is arranged at the bottom of the cleaning tank body, and the wafer mounting bracket is arranged at the top of the air duct.

As a further alternative to the wafer cleaning tank with easy airflow control, the guide rod mechanism includes a guide rod mechanism main body and a mounting plate, The mounting plate is arranged on the outside of both sides of the cleaning tank body, and the guide rod mechanism body is arranged on the mounting plate and connected with the movable air plate.

As a further alternative to the wafer cleaning tank with easy airflow control, the main body of the guide rod mechanism is a swing guide rod mechanism.

As a further alternative to the wafer cleaning tank with easy airflow control, the swing guide rod mechanism includes a guide rod, a rotating rod, and a swing cylinder, The movable air plate is provided with a connecting ear, one end of the guide rod is connected with the connecting ear, the other end of the guide rod is connected with one end of the rotating rod, and the other end of the rotating rod is connected with The swing cylinder is connected, and the swing cylinder is installed on the mounting plate.

As a further alternative to the above-mentioned wafer cleaning tank with easy airflow control, when the upper air vents on both sides of the cleaning tank body are in an open state, the movable air plate and the side of the cleaning tank body are formed The range of the included angle is 110°～130°.

As a further alternative to the above-mentioned wafer cleaning tank with easy airflow control, the included angle between the fixed air plate and the side of the cleaning tank body is in the range of 110° to 130°.

As a further alternative to the above-mentioned wafer cleaning tank with easy airflow control, the air intake mechanism is arranged in the middle of the top of the cleaning tank main body, and the air duct is arranged in the middle of the bottom of the cleaning tank main body.

As a further alternative to the wafer cleaning tank with easy airflow control, the air intake mechanism is an air filter.

As a further alternative to the above-mentioned wafer cleaning tank with easy airflow control, the length of the air duct is 2/5 to 3/5 of the height of the main body of the cleaning tank.

As a further alternative to the above-mentioned wafer cleaning tank with easy air flow control, the wafer cleaning tank with easy air flow control further includes a sensor which is arranged in the main body of the cleaning tank and is used for sensing State whether there is a wafer installed on the wafer mounting bracket.

The advantages or principles of the present invention will be described below.

A wafer cleaning tank with easy airflow control is provided. A cleaning chamber is formed in the main body of the cleaning tank. The upper and lower parts of both sides of the main body of the cleaning tank are provided with vents. The vents are used for the outflow of airflow in the cleaning tank; The top of the cleaning tank body, that is, the airflow flows from the top of the cleaning tank body into the cleaning tank; the air duct is arranged at the bottom of the cleaning tank body, the wafer mounting bracket is arranged on the top of the air duct, and the wafer mounting bracket is used to place wafers. When the wafer is placed in the cleaning tank, the air duct blows and conducts air on the lower surface of the wafer to increase the fluidity of the gas under the wafer, so that the wafer is cleaned more uniformly, and the wafer is better For cleaning; fixed air plates are arranged at the lower part of both sides of the main body of the cleaning tank, and ventilation channels are left at the lower parts of both sides of the main body of the cleaning tank, and the movable air plates are movably arranged on the upper part of both sides of the main body of the cleaning tank. The guide rod mechanism and the movable air The plates are connected, the fixed air plate and the movable air plate can guide the flow direction of the airflow, which better guarantees the unobstructed airflow in the cleaning tank. Specifically, when there is no wafer in the cleaning tank, the two main bodies of the cleaning tank The air vent on the upper part of the side is in an open state to ensure the unobstructed airflow in the cleaning tank in this case; when wafers are placed in the cleaning tank, the guide rod mechanism drives the movable air plate to rotate, and the upper part of the main body of the cleaning tank The air vent is closed to ensure the unobstructed air flow in the cleaning tank in this case.

The wafer cleaning tank with easy air flow control can ensure the unobstructed air flow in the cleaning tank when wafers are placed in the cleaning tank or there is no wafer placed in the cleaning tank, and avoid gas stagnation in the cleaning tank, thereby avoiding the cleaning liquid in the cleaning tank Or condensation of vapor and mist ensures the cleaning effect of the wafer.

In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are described below in detail in conjunction with the accompanying drawings.

The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The elements of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", The orientation or positional relationship indicated by "vertical", "horizontal", "horizontal", "vertical", etc. are based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated device, element, or component must have a specific orientation, or be constructed and operated in a specific orientation.

In addition, some of the aforementioned terms may be used to indicate other meanings in addition to the orientation or position relationship. For example, the term "shang" may also be used to indicate a certain dependency relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific situations.

In addition, the terms "installed", "set", "provided", "connected" and "connected" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or a point connection; it can be directly connected, or indirectly connected through an intermediary, or between two devices, components or components. Interconnection between the two. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms in the present invention can be understood according to specific circumstances.

In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the indicated device or element Or the relative importance and number of components. Unless otherwise specified, "plurality" means two or more.

Refer to FIG. 1, which is a schematic structural diagram of a wafer cleaning tank with easy air flow control according to an embodiment of the present invention.

The wafer cleaning tank with easy airflow control in the embodiment of the present invention includes a cleaning tank main body 11, a movable air plate 12, a guide rod mechanism, a fixed air plate 15, an air intake mechanism 16, an air guide tube 17 and a wafer mounting bracket 18.

A cleaning cavity is formed in the cleaning tank main body 11, and the upper and lower parts of both sides of the cleaning tank main body 11 are provided with vents 111.

The movable air plate 12 is movably arranged at the upper part of both sides of the cleaning tank body 11, the guide rod mechanism is connected with the movable air plate 12, and the movable air plate 12 is used to close or open the upper air vents 111 on both sides of the cleaning tank body 11.

The fixed air plate 15 is arranged at the lower part of both sides of the cleaning tank main body 11, and a ventilation channel is left in the lower part of both sides of the cleaning tank main body 11.

The air intake mechanism 16 is arranged at the top of the cleaning tank body 11; the air duct 17 is arranged at the bottom of the cleaning tank body 11, and the wafer mounting bracket 18 is arranged at the top of the air duct 17.

In the wafer cleaning tank with easy airflow control in the embodiment of the present invention, a cleaning chamber is formed in the cleaning tank body 11, and the upper and lower parts of both sides of the cleaning tank body 11 are provided with vents 111. The vents 111 are used for the air flow in the cleaning tank. Out; the air intake mechanism 16 is set on the top of the cleaning tank body 11, that is, the airflow flows from the top of the cleaning tank body 11 into the cleaning tank; the air duct 17 is arranged at the bottom of the cleaning tank body 11, and the wafer mounting bracket 18 is arranged on the air duct At the top of 17, the wafer mounting bracket 18 is used to place the wafer 20. When the wafer 20 is placed in the cleaning tank, the air duct 17 blows and conducts air on the lower surface of the wafer 20 to increase the gas under the wafer 20 The fluidity of the wafer 20 makes the cleaning of the wafer 20 more uniform, so as to better clean the wafer 20; the fixed gas plate 15 is arranged at the lower part of both sides of the cleaning tank body 11, and at the lower part of the both sides of the cleaning tank body 11. There is a ventilation channel, the movable air plate 12 is movably arranged on the upper part of both sides of the cleaning tank body 11, the guide rod mechanism is connected with the movable air plate 12, the fixed air plate 15 and the movable air plate 12 can guide the flow direction of the airflow, Better guarantee the unobstructed airflow in the cleaning tank.

Specifically, referring to FIG. 2, FIG. 2 is a schematic diagram of the air flow when the upper air vents 111 on both sides of the wafer cleaning tank for easy air flow control are in an open state, and there is no wafer 20 placed in the cleaning tank. In this case, the upper air vents 111 on both sides of the cleaning tank body 11 are in an open state to ensure the unobstructed air flow in the cleaning tank in this case; see FIG. 3, which is a wafer cleaning tank with easy air flow control according to an embodiment of the present invention A schematic diagram of the air flow when the upper air vents 111 on both sides are closed. When the wafer 20 is placed in the cleaning tank, the guide rod mechanism drives the movable air plate 12 to rotate, and the upper part of the cleaning tank body 11 The air vent 111 is closed to ensure the unobstructed air flow in the washing tank in this case.

The wafer cleaning tank with easy airflow control can ensure the unobstructed air flow in the cleaning tank when wafers 20 or no wafers 20 are placed in the cleaning tank, avoid gas stagnation in the cleaning tank, and thus avoid the cleaning tank The cleaning liquid or vapor is condensed, because the particles generated by the condensation will affect the morphology and surface cleanliness of the wafer 20, which guarantees the cleaning effect of the wafer 20.

Referring to FIG. 1, as an alternative embodiment, the wafer cleaning tank that is easy to control the air flow further includes a sensor. The sensor is arranged in the cleaning tank body 11 for sensing whether a wafer is installed on the wafer mounting bracket 18. Round 20.

When the sensor senses that the wafer 20 is placed on the wafer mounting bracket 18, the guide rod mechanism moves to drive the movable air plate 12 to rotate, closing the upper air vents 111 on both sides of the cleaning tank body 11 to ensure the cleaning tank When the wafer 20 is placed, the airflow in the cleaning tank is unobstructed; when the sensor detects that there is no wafer 20 placed on the wafer mounting bracket 18, the guide rod mechanism does not move, and the upper part of both sides of the cleaning tank body 11 is maintained The air vent 111 is opened, or the guide rod mechanism moves, driving the movable air plate 12 to rotate, opening the upper air vents 111 on both sides of the cleaning tank body 11 to ensure the air flow in the cleaning tank without placing wafers 20 in the cleaning tank The unobstructed.

Specifically, the movement of the guide rod mechanism can be realized by an automatic control system.

Referring to FIG. 1, in this embodiment, the guide rod mechanism includes a guide rod mechanism main body 13 and a mounting plate 14.

The mounting plate 14 is arranged on the outside of both sides of the cleaning tank body 11, and the guide rod mechanism body 13 is arranged on the mounting plate 14 and connected with the movable air plate 12.

The installation of the mounting plate 14 facilitates the installation of the main body 13 of the guide rod mechanism. When the main body 13 of the guide rod mechanism moves, the mounting plate 14 is in a stationary state, and the main body 13 of the guide rod mechanism moves by itself to drive the movable air plate 12 to rotate.

1, in this embodiment, the main body 13 of the guide rod mechanism is a swing guide rod mechanism. The main body 13 of the guide rod mechanism adopts the swing guide rod mechanism to facilitate the rotation of the movable air plate 12, and the swing guide rod mechanism is relatively stable in use and has a better use effect.

1, specifically, the swing guide rod mechanism includes a guide rod 131, a rotating rod 132 and a swing cylinder 133.

The movable air plate 12 is provided with a connecting lug 121, one end of the guide rod 131 is connected with the connecting lug 121, the other end of the guide rod 131 is connected with one end of the rotating rod 132, and the other end of the rotating rod 132 is connected with the swing cylinder 133 , The swing cylinder 133 is installed on the mounting plate 14.

When the swing guide rod mechanism moves, the swing cylinder 133 moves, drives the rotating rod 132 to rotate, drives the guide rod 131, and then drives the movable air plate 12 to rotate. The connecting ear 121 provided on the movable air plate 12 facilitates the swing guide rod mechanism and the movable air The boards 12 are connected.

Referring to FIG. 1, as an alternative embodiment, the connecting ear 121 provided on the movable air plate 12 is a connecting single ear. The connecting ear 121 adopts a connecting single ear to facilitate the connection of the guide rod 131 and also save cost.

1 and 2, in this embodiment, when the upper air vents 111 on both sides of the cleaning tank body 11 are in an open state, the range of the included angle between the movable air plate 12 and the side of the cleaning tank body 11 is 110 °～130°.

The limitation of the range of the angle formed by the movable air plate 12 and the side of the cleaning tank body 11 enables the movable air plate 12 to better guide the flow direction of the air flow, thereby better ensuring the unobstructed air flow in the cleaning tank.

Referring to Figures 1 and 2, preferably, when the upper air vents 111 on both sides of the cleaning tank body 11 are in an open state, the angle between the movable air plate 12 and the side of the cleaning tank body 11 is 120°, The air plate 12 can optimally guide the flow direction of the airflow.

1 to 3, in this embodiment, the angle between the fixed air plate 15 and the side of the cleaning tank body 11 ranges from 110° to 130°.

The limitation of the range of the included angle between the fixed air plate 15 and the side of the cleaning tank body 11 enables the fixed air plate 15 to better guide the flow direction of the air flow, thereby better ensuring the unobstructed air flow in the cleaning tank.

1 to 3, as a preference, the angle between the fixed air plate 15 and the side of the cleaning tank body 11 is 120°, and the fixed air plate 15 can optimally guide the flow direction of the airflow.

Referring to FIG. 1, the air intake mechanism 16 is arranged in the middle of the top of the cleaning tank body 11, and the air duct 17 is arranged in the middle of the bottom of the cleaning tank body 11.

The position of the air intake mechanism 16 and the air guide tube 17 is relatively scientific, which can ensure the uniformity of the air flow direction in the cleaning tank, thereby better ensuring the unobstructed air flow in the cleaning tank.

Referring to Fig. 1, as an alternative embodiment, the air intake mechanism 16 is an air filter.

The air intake mechanism 16 adopts an air filter, which can make the air flow entering the cleaning tank clean, thereby improving the cleaning effect of the wafer 20.

1, the length of the air duct 17 is 2/5 to 3/5 of the height of the main body 11 of the cleaning tank.

The length of the air duct 17 and the height of the cleaning tank body 11 are limited, so that the length of the air duct 17 is neither too long nor too short, thereby better ensuring the flow effect of the airflow in the cleaning tank, so that the wafer 20 is Better cleaning effect.

Referring to FIG. 1, preferably, the length of the air duct 17 is 1/2 of the height of the main body 11 of the cleaning tank. At this length of the air duct 17, compared with other lengths of the air duct 17, the wafer 20 has the best cleaning effect.

In all the above embodiments, "big" and "small" are relative terms, "more" and "less" are relative terms, and "upper" and "lower" are relative terms. The way of expression of terms will not be repeated in the embodiment of the present invention.

It should be understood that the “in this embodiment”, “in the embodiment of the present invention” or “as an alternative embodiment” mentioned throughout the specification means that a specific feature, structure or characteristic related to the embodiment is included in In at least one embodiment of the present invention. Therefore, the appearances of "in this embodiment", "in an embodiment of the present invention" or "as an optional implementation" in various places throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present invention.

In the various embodiments of the present invention, it should be understood that the size of the sequence numbers of the above-mentioned processes does not mean the necessary sequence of the execution order. The execution order of each process should be determined by its function and internal logic, and should not correspond to the embodiments of the present invention. The implementation process constitutes any limitation.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention. It should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the patent application.

11: Main body of cleaning tank 12: Activity air plate 13: The main body of the guide rod mechanism 14: mounting plate 15: fixed gas plate 16: intake mechanism 17: Airway 18: Wafer mounting bracket 20: Wafer 111: Vent 121: connecting ear 131: guide rod 132: Rotating Rod 133: swing cylinder

In order to explain the technical solutions of the embodiments of the present invention more clearly, the following will briefly introduce the drawings that need to be used in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope. For those of ordinary skill in the art, they can also obtain other related schemas based on these schemas without creative work.

FIG. 1 is a schematic structural diagram of a wafer cleaning tank with easy airflow control according to an embodiment of the present invention.

2 is a schematic diagram of the air flow direction when the upper air vents on both sides of the wafer cleaning tank for easy air flow control are in an open state according to an embodiment of the present invention.

3 is a schematic diagram of the air flow direction when the upper air vents on both sides of the wafer cleaning tank for easy air flow control are in a closed state according to an embodiment of the present invention.

11: Main body of cleaning tank

12: Activity air plate

13: The main body of the guide rod mechanism

14: mounting plate

15: fixed gas plate

16: intake mechanism

17: Airway

18: Wafer mounting bracket

20: Wafer

111: Vent

121: connecting ear

131: guide rod

132: Rotating Rod

133: swing cylinder

Claims (10)

A wafer cleaning tank with easy airflow control, including a cleaning tank main body, a movable air plate, a guide rod mechanism, a fixed air plate, an air intake mechanism, an air duct and a wafer mounting bracket; A cleaning cavity is formed in the main body of the cleaning tank, and air vents are opened on both upper and lower sides of the main body of the cleaning tank; The movable air plate is movably arranged at the upper part of both sides of the cleaning tank body, the guide rod mechanism is connected with the movable air plate, and the movable air plate is used to close or open the two sides of the cleaning tank body. The upper vent; The fixed air plates are arranged at the lower part of both sides of the cleaning tank body, and there are ventilation channels in the lower part of both sides of the cleaning tank body; The air intake mechanism is arranged at the top of the cleaning tank body; the air duct is arranged at the bottom of the cleaning tank body, and the wafer mounting bracket is arranged at the top of the air duct. The wafer cleaning tank with easy airflow control according to claim 1, wherein the guide rod mechanism includes a guide rod mechanism main body and a mounting plate, The mounting plate is arranged on the outside of both sides of the cleaning tank body, and the guide rod mechanism body is arranged on the mounting plate and connected with the movable air plate. The wafer cleaning tank with easy air flow control according to claim 2, wherein the main body of the guide rod mechanism is a swing guide rod mechanism. The wafer cleaning tank with easy airflow control according to claim 3, wherein the swing guide rod mechanism includes a guide rod, a rotating rod and a swing cylinder, The movable air plate is provided with a connecting ear, one end of the guide rod is connected with the connecting ear, the other end of the guide rod is connected with one end of the rotating rod, and the other end of the rotating rod is connected with The swing cylinder is connected, and the swing cylinder is installed on the mounting plate. The wafer cleaning tank with easy air flow control according to claim 1, wherein, when the upper air vents on both sides of the cleaning tank body are in an open state, the movable air plate and the side of the cleaning tank body The included angle ranges from 110° to 130°. The wafer cleaning tank with easy airflow control according to claim 1 or 5, wherein the angle between the fixed air plate and the side of the cleaning tank body is in the range of 110° to 130°. The wafer cleaning tank with easy airflow control according to claim 1, wherein the air intake mechanism is arranged in the middle of the top of the cleaning tank body, and the air duct is arranged in the middle of the bottom of the cleaning tank. The wafer cleaning tank with easy airflow control according to claim 1 or 7, wherein the air intake mechanism is an air filter. The wafer cleaning tank with easy airflow control according to claim 1 or 7, wherein the length of the air duct is 2/5 to 3/5 of the height of the main body of the cleaning tank. The wafer cleaning tank with easy air flow control according to claim 1, wherein the wafer cleaning tank with easy air flow control further includes a sensor, and the sensor is arranged in the main body of the cleaning tank for Sensing whether a wafer is installed on the wafer mounting bracket.

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