TW202023327A - 電漿處理裝置、監視方法及監視程式 - Google Patents

電漿處理裝置、監視方法及監視程式 Download PDF

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Publication number
TW202023327A
TW202023327A TW108134330A TW108134330A TW202023327A TW 202023327 A TW202023327 A TW 202023327A TW 108134330 A TW108134330 A TW 108134330A TW 108134330 A TW108134330 A TW 108134330A TW 202023327 A TW202023327 A TW 202023327A
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TW
Taiwan
Prior art keywords
heater
temperature
plasma
mounting table
wafer
Prior art date
Application number
TW108134330A
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English (en)
Chinese (zh)
Inventor
岡信介
Original Assignee
日商東京威力科創股份有限公司
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Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202023327A publication Critical patent/TW202023327A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW108134330A 2018-10-05 2019-09-24 電漿處理裝置、監視方法及監視程式 TW202023327A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-190173 2018-10-05
JP2018190173 2018-10-05
JP2019100392A JP7280113B2 (ja) 2018-10-05 2019-05-29 プラズマ処理装置、監視方法および監視プログラム
JP2019-100392 2019-05-29

Publications (1)

Publication Number Publication Date
TW202023327A true TW202023327A (zh) 2020-06-16

Family

ID=70219050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108134330A TW202023327A (zh) 2018-10-05 2019-09-24 電漿處理裝置、監視方法及監視程式

Country Status (3)

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JP (2) JP7280113B2 (ja)
KR (1) KR20200039579A (ja)
TW (1) TW202023327A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7332819B2 (ja) * 2020-09-16 2023-08-23 株式会社日立国際電気 高周波電源装置、及び故障箇所推定方法
WO2024019054A1 (ja) * 2022-07-22 2024-01-25 東京エレクトロン株式会社 監視方法及びプラズマ処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468384B1 (en) * 2000-11-09 2002-10-22 Novellus Systems, Inc. Predictive wafer temperature control system and method
JP5203612B2 (ja) * 2007-01-17 2013-06-05 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP4350766B2 (ja) 2007-03-30 2009-10-21 東京エレクトロン株式会社 プラズマ処理装置，高周波電源の校正方法，高周波電源
JP2009111301A (ja) * 2007-11-01 2009-05-21 Hitachi High-Technologies Corp プラズマ処理装置
JP5059792B2 (ja) * 2009-01-26 2012-10-31 東京エレクトロン株式会社 プラズマ処理装置
JP6525751B2 (ja) * 2015-06-11 2019-06-05 東京エレクトロン株式会社 温度制御方法及びプラズマ処理装置

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Publication number Publication date
JP7280113B2 (ja) 2023-05-23
KR20200039579A (ko) 2020-04-16
JP2023099617A (ja) 2023-07-13
JP2020061353A (ja) 2020-04-16

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