TW202023288A - Audio reception structure and electronic device - Google Patents
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Abstract
Description
本發明有關於一種收音領域,特別是關於一種的收音結構及電子裝置。The present invention relates to a radio field, in particular to a radio structure and electronic device.
現有的電子裝置(例如手機、對講機或藍芽耳機)雖能兼顧播放聲音以及收集聲音等兩項功能,然而,現有電子裝置內置的麥克風在收集發話者聲音的同時,也會收入環境噪音,而使得發話者的聲音的清晰度大受影響。Existing electronic devices (such as mobile phones, walkie-talkies, or Bluetooth headsets) can both play sound and collect sound. However, the built-in microphone of the existing electronic device collects the voice of the caller while also receiving environmental noise. The intelligibility of the speaker's voice is greatly affected.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種收音結構及電子裝置,以解決現有技術所存在的缺失。The technical problem to be solved by the present invention is to provide a radio structure and an electronic device for the shortcomings of the prior art to solve the defects of the prior art.
為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種收音結構,其包括一結構本體及一收音模組。結構本體具有容置空間。收音模組位於容置空間,收音模組包括至少一收音單元以及電性連接至少一收音單元的一處理單元。處理模組電性連接收音模組。其中,收音模組根據結構本體的振動而產生至少一音頻訊號,處理模組依據接收至少一音頻訊號而輸出一聲音訊號。In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a radio structure, which includes a structural body and a radio module. The structural body has an accommodation space. The radio module is located in the accommodating space, and the radio module includes at least one radio unit and a processing unit electrically connected to the at least one radio unit. The processing module is electrically connected to the radio module. Wherein, the radio module generates at least one audio signal according to the vibration of the structure body, and the processing module outputs an audio signal according to receiving the at least one audio signal.
為了解決上述的技術問題,本發明所採用的另一技術方案是,提供一種電子裝置,其包括一裝置本體以及一收音結構。收音結構位於裝置本體中,收音結構包括一結構本體及一收音模組。結構本體具有容置空間。收音模組位於容置空間,收音模組包括至少一收音單元以及電性連接至少一收音單元的一處理單元。處理模組電性連接收音模組。其中,至少一收音單元根據結構本體的振動而產生至少一音頻訊號,處理單元依據接收至少一音頻訊號而輸出一聲音訊號。In order to solve the above technical problem, another technical solution adopted by the present invention is to provide an electronic device, which includes a device body and a sound receiving structure. The radio structure is located in the device body, and the radio structure includes a structural body and a radio module. The structural body has an accommodation space. The radio module is located in the accommodating space, and the radio module includes at least one radio unit and a processing unit electrically connected to the at least one radio unit. The processing module is electrically connected to the radio module. Wherein, at least one radio unit generates at least one audio signal according to the vibration of the structural body, and the processing unit outputs an audio signal according to receiving at least one audio signal.
為了解決上述的技術問題,本發明所採用的再一技術方案是,提供一種收音結構,其包括一薄膜本體以及一收音模組。收音模組位於薄膜本體,收音模組包括至少一收音單元以及電性連接至少一收音單元的一處理單元。In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a sound receiving structure, which includes a film body and a sound receiving module. The radio module is located on the film body. The radio module includes at least one radio unit and a processing unit electrically connected to the at least one radio unit.
本發明的其中一有益效果在於,本發明所提供的收音結構及電子裝置,其能通過“收音模組位於容置空間”、“收音模組包括至少一收音單元以及電性連接至少一收音單元的一處理單元”以及“至少一該收音單元根據結構本體的振動而產生至少一音頻訊號,處理單元依據接收至少一音頻訊號而輸出一聲音訊號”的技術方案,以提升收音品質。One of the beneficial effects of the present invention is that the radio structure and electronic device provided by the present invention can pass through "the radio module is located in the accommodating space", "the radio module includes at least one radio unit and is electrically connected to at least one radio unit" The technical solutions of "a processing unit" and "at least one radio unit generates at least one audio signal according to the vibration of the structural body, and the processing unit outputs an audio signal according to receiving at least one audio signal" to improve radio quality.
本發明的另一有益效果在於,本發明所提供的收音結構,其能通過“一收音模組,其位於薄膜本體,收音模組包括至少一收音單元以及電性連接至少一收音單元的一處理單元”的技術方案,以提升收音品質。Another beneficial effect of the present invention is that the radio structure provided by the present invention can pass "a radio module located in the film body, the radio module includes at least one radio unit and a process of electrically connecting at least one radio unit" Unit” to improve the radio quality.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and explanation only, and are not intended to limit the present invention.
以下是通過特定的具體實施例來說明本發明所揭露有關“收音結構及電子裝置”的實施方式,本領域技術人員可由本說明書所揭露的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的圖式僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所揭露的內容並非用以限制本發明的保護範圍。The following is a specific embodiment to illustrate the implementation of the "sound-receiving structure and electronic device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" as used herein should include any combination of any one or more of the associated listed items, depending on the actual situation.
[第一實施例][First Embodiment]
請參閱圖1至圖10,其分別為本發明第一實施例的收音結構的第一結構示意圖、收音結構的第二結構示意圖、收音模組的第一結構示意圖、收音模組的第二結構示意圖、收音結構的第三結構示意圖、收音結構的第四結構示意圖、收音結構的第五結構示意圖、收音結構的第六結構示意圖、收音模組的第三結構示意圖以及收音模組的第四結構示意圖。如圖所示,本發明第一實施例提供一種收音結構1,其可包括一結構本體10及一收音模組11。結構本體10具有容置空間100。收音模組11位於容置空間100,收音模組11包括至少一收音單元111以及電性連接至少一收音單元111的一處理單元112。其中,至少一收音單元111根據結構本體10的振動而產生至少一音頻訊號,處理單元112依據至少一音頻訊號而輸出一聲音訊號。Please refer to FIGS. 1 to 10, which are respectively a first structural diagram of a radio structure, a second structure diagram of a radio structure, a first structure diagram of a radio module, and a second structure of the radio module according to the first embodiment of the present invention. Schematic diagram, the third structure diagram of the radio structure, the fourth structure diagram of the radio structure, the fifth structure diagram of the radio structure, the sixth structure diagram of the radio structure, the third structure diagram of the radio module, and the fourth structure of the radio module Schematic. As shown in the figure, the first embodiment of the present invention provides a
具體而言,本發明第一實施例所提供的收音結構1包括了結構本體10及收音模組11。結構本體10可為殼體結構,並具有容置空間100,可用於容納收音模組11。更進一步而言,結構本體10可為兩件式的殼體結構(如圖1、圖2、圖6、圖7所示),也可以是單一件式的殼體結構(如圖5所示),或者是多件式的殼體結構(如圖8所示);結構本體10的材質可以是金屬或者塑膠等材質。收音模組11可為麥克風晶片,例如MEMS微機電麥克風,但不以為限。收音模組11包括了至少一收音單元111以及一處理單元112。至少一收音單元111可為任何種類的收音元件,較佳可為可調靈敏度、感度的收音晶片。處理單元112可為具訊號處理功能的處理器,例如整合IC晶片,處理單元112與至少一收音單元111電性連接。其中,處理單元112與至少一收音單元111可結合成一個構件。Specifically, the
因此,本發明的收音結構1可應於任何的電子裝置,例如手機、對講機或無線耳機等,或者任何需收音元件的電子裝置。當使用者透過電子裝置朝收音結構1發聲時,結構本體10會受到聲波的影響而產生振動。接著,結構本體10在振動時,會透過一膜片或本體而使收音模組11連帶受到振動,進而產生至少一音頻訊號。接下來,處理單元112會接收至少一音頻訊號,並依據至少一音頻訊號而輸出一聲音訊號至電子裝置。Therefore, the
此外,收音結構1也可供使用者單獨使用。使用者可將收音結構1貼附於皮膚(例如臉頰部位或耳朵內)上。接著,當使用者在講話時,由於皮膚會產生振動,而連帶使結構本體10產生振動,進而使得收音模組11可根據結構本體10的振動,而產生至少一音頻訊號。In addition, the
藉此,通過上述本發明的收音結構1的結構設計,能通過在結構本體10設置收音模組11,以及利用收音模組11根據使用者講話時所產生的振動,而產生至少一音頻訊號,進而達到對使用者的講話內容進行收音,並能避免接收到使用者周遭的環境噪音的功效。Thereby, through the structural design of the
值得注意的是,本發明的至少一收音單元111可通過多個傳導電路電性連接處理單元112(如圖3所示),至少一收音單元111可將受聲波震動而產生的訊號經由多個傳導電路傳遞至處理單元112。處理單元112可將其中一傳導電路所傳遞的訊號進行訊號處理,另一傳導電路所傳遞的訊號則不進行處理。It is worth noting that the at least one
或者,本發明的至少一收音單元111可通過其中一傳導電路電性連接處理單元112,另一傳導電路電性連接電路板(如圖4所示)。因此,當至少一收音單元111將受聲波震動而產生的訊號經由多個傳導電路進行傳遞時,其中一訊號可透過處理單元112進行訊號處理,另一訊號則直接傳遞至電路板。Alternatively, at least one
在其中一較佳的實施態樣中,收音模組11可包括一基板單元110以及遮蔽單元113;其中,基板單元110可為電路板,但不以此為限。收音單元111可設置於遮蔽單元113,並外露而與外界接觸,收音單元111可為接觸式收音膜。處理單元112可為微機電晶片,設置於基板單元110,並與基板單元110以及收音單元111電性連接。因此,收音單元111可通過接觸人體的皮膚而感應、接收人體發聲時產生的振動,或者接收聲波,以據以產生振動訊號且傳遞至處理單元112。處理單元112將振動訊號轉成電子訊號,再透過基板單元110傳送出去。藉此,本發明的收音結構1通過接觸感應的收音的方式,使得在通話中,不會受到環境噪音的干擾。In one of the preferred embodiments, the
在另一個變化的態樣中,基板單元110或遮蔽單元113可設置至少一收音孔110a,且處理單元112進一步包括第一處理單元112a以及第二處理單元112b,第一處理單元112a與第二處理單元112b可為微機電晶片。第一處理單元112a可與收音單元111以及基板單元110電性連接,第二處理單元112b與基板單元110電性連接(如圖10的(A));或者,第一處理單元112a可以覆晶(flip-chip)方式設置於第二處理單元112b上,並且電性連結收音單元111與第二處理單元112b。In another variation, the
因此,外界的聲波可經由收音孔110a進入收音模組11內部,第二處理單元112b可接收聲波,並通過一被動元件將聲波轉換成第一電子訊號,再傳遞至基板單元110。並且,收音單元111可通過接觸人體的皮膚而感應、接收人體發聲時產生的振動,或者接收聲波,以據以產生振動訊號且傳遞至第一處理單元112a。第一處理單元112a將振動訊號轉成第二電子訊號,再傳遞至基板單元110。據此,本發明的收音結構1可通過第二處理單元112b以第一收音模式接收使用者的說話聲音,也可以利用第一處理單元112a以第二收音模式經使用者的皮膚接收使用者的說話聲音,或是同時啟用第一收音模式與第二收音模式,以強化收音的能力,進而提供使用者在通話中,可以依據通話環境的需求自行選擇所要的收音模式,以避免環境噪音的干擾。Therefore, external sound waves can enter the inside of the
另外,本實施例中,接觸式收音元件31為一收音膜,該收音膜用來接觸人體的皮膚,係經皮感應及接收人體發聲時產生的振動訊號,並將震動訊號吸收傳遞至第二微機 電晶片34。而第二微機電晶片34將振動訊號轉成第二電子訊號,再透過基板30傳送出去。In addition, in this embodiment, the contact-type radio element 31 is a radio film, which is used to contact the skin of the human body, and is used to percutaneously sense and receive the vibration signal generated by the human body when sound is produced, and the vibration signal is absorbed and transmitted to the second MEMS chip 34. The second MEMS chip 34 converts the vibration signal into a second electronic signal, and then transmits it through the substrate 30.
值得一提的是,通過上述說明內容雖能瞭解本發明的實施方式、優點與效果;然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。It is worth mentioning that although the implementation, advantages and effects of the present invention can be understood through the above description; however, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.
[第二實施例][Second Embodiment]
請參閱圖11,其為本發明第二實施例的收音結構的收音模組的剖面示意圖,並請一併參閱圖1至圖10。如圖所示,本實施例的收音結構與上述第一實施例的收音結構相同的元件的作動方式相似,在此不再贅述,值得注意的是,在本實施例中,結構本體10具有至少一收音通道101;其中,收音模組11還進一步可包括位於容置空間100的一基板單元110,至少一收音單元111包括位於基板單元110上的一第一收音單元111a以及位於基板單元110上的一第二收音單元111b,第一收音單元111a與第二收音單元111b電性連接處理單元112,第一收音單元111a或第二收音單元111b根據結構本體10的振動而產生至少一音頻訊號。Please refer to FIG. 11, which is a schematic cross-sectional view of the radio module of the radio structure according to the second embodiment of the present invention. Please also refer to FIGS. 1 to 10. As shown in the figure, the sound-receiving structure of this embodiment is similar to the sound-receiving structure of the above-mentioned first embodiment. The operation of the same elements is similar to that of the first embodiment. A
舉例而言,本發明的收音結構1的結構本體10可具有至少一收音通道101(如圖2所示)。並且,收音模組11進一步可包括基板單元110,至少一收音單元111可進一步包括第一收音單元111a及第二收音單元111b。基板單元110可為電路板;第一收音單元111a與第二收音單元111b的材質可為電容式、振動式、陶瓷式或振動式的收音晶片,或者為晶圓式的收音晶片,並且,第一收音單元111a與第二收音單元111b的材質彼此不同,或者,第一收音單元111a與第二收音單元111b的材質相同。基板單元110位於容置空間100,基板單元110上懸設有第一收音單元111a與第二收音單元111b,第一收音單元111a與第二收音單元111b之間具有一預定距離(例如0.5 mm或1 mm,但不以此為限),且第一收音單元111a與第二收音單元111b電性連接處理單元112。For example, the
因此,在使用者進行講話時,結構本體10可通過膜片或收音通道101而接收聲波或使用者皮膚所產生的振動,進而使聲波或振動傳遞到第一收音單元111a或第二收音單元111b。接著,第一收音單元111a或第二收音單元111b可根據聲波或振動而產生至少一音頻訊號,並傳輸至處理單元112。Therefore, when the user is speaking, the
在其中一較佳的實施態樣中,處理單元112包括電性連接第一收音單元111a與第二收音單元111b的至少一訊號處理元件1120以及電性連接至少一訊號處理元件1120的至少一放大元件1121,至少一訊號處理元件1120依據至少一音頻訊號而輸出一處理訊號,至少一放大元件1121接收處理訊號而輸出一聲音訊號。In one of the preferred embodiments, the
也就是說,本發明的處理單元112進一步還可包括至少一訊號處理元件1120以及至少一放大元件1121,訊號處理元件1120可為訊號處理模組,例如比較器、濾波器或訊號處理器(DSP);放大元件1121可為放大器模組,但不以此為限。因此,在第一收音單元111a、第二收音單元111b或其兩者可根據聲波或振動而產生音頻訊號時,可通過至少一訊號處理元件1120的訊號處理以及至少一放大元件1121的放大處理,進而產生聲音訊號。接著,再由至少一放大元件1121將聲音訊號傳送至電子裝置。In other words, the
值得一提的是,通過上述說明內容雖能瞭解本發明的實施方式、優點與效果;然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。It is worth mentioning that although the implementation, advantages and effects of the present invention can be understood through the above description; however, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.
[第三實施例][Third Embodiment]
請參閱圖12,其為本發明第三實施例的收音結構的收音模組的剖面示意圖,並請一併參閱圖1至圖11。如圖所示,本實施例的收音結構與上述各實施例的收音結構相同的元件的作動方式相似,在此不再贅述,值得注意的是,在本實施例中,至少一收音單元111還可進一步包括第三收音單元111c,其位於基板單元110上,並電性連接處理單元112。Please refer to FIG. 12, which is a schematic cross-sectional view of a radio module with a radio structure according to a third embodiment of the present invention. Please also refer to FIGS. 1 to 11. As shown in the figure, the sound-receiving structure of this embodiment is similar to the sound-receiving structure of each of the above-mentioned embodiments. The operation of the same elements is not repeated here. It is worth noting that in this embodiment, at least one sound-receiving
舉例而言,本發明的至少一收音單元111進一步還可包括在基板單元110上懸設第三收音單元111c,第三收音單元111c電性連接處理單元112的至少一訊號處理元件1120。其中,第三收音單元111c與第一收音單元111a以及第二收音單元111b的位置設置可根據製造商而定,並不限於圖式所揭示的態樣。並且,第一收音單元111a、第二收音單元111b及第三收音單元111c的材質可為電容式、振動式、陶瓷式或振動式的收音晶片,或者為晶圓式的收音晶片。因此,在使用者進行講話時,結構本體10可通過膜片或收音通道101而接收聲波或使用者皮膚所產生的振動,進而使聲波或振動傳遞到第一收音單元111a、第二收音單元111b及第三收音單元111c。接著,第一收音單元111a、第二收音單元111b、第三收音單元111c或其三者可根據聲波或振動而產生至少一音頻訊號,並傳輸至處理單元112。For example, the at least one
上述中,第一收音單元111a、第二收音單元111b及第三收音單元111c三者的材質彼此不同。或者,第一收音單元111a、第二收音單元111b及第三收音單元111c三者中至少二者的材質相同。In the above, the materials of the first
在其中一較佳的實施態樣中,收音模組11進一步可還包括一遮蔽單元113,其覆蓋於基板單元110上,並包覆第一收音單元111a、第二收音單元111b、第三收音單元111c、至少一訊號處理元件1120以及至少一放大元件1121。並且,基板單元110或遮蔽單元113也可設置至少一收音孔,或者基板單元110與遮蔽單元113分別設置至少一收音孔110a,以提高收音效果。In one of the preferred embodiments, the
值得一提的是,通過上述說明內容雖能瞭解本發明的實施方式、優點與效果;然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。It is worth mentioning that although the implementation, advantages and effects of the present invention can be understood through the above description; however, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.
[第四實施例][Fourth Embodiment]
請參閱圖13及圖14,其分別為本發明第四實施例的電子裝置的立體示意圖及方塊圖,並請一併參閱圖1至圖12。如圖所示,本發明第四實施例提供一種電子裝置Z,其包括一裝置本體2以及一收音結構1。收音結構1位於裝置本體2中,收音結構1包括一結構本體10及一收音模組11。結構本體10具有容置空間100。收音模組11位於容置空間100,收音模組11包括至少一收音單元111以及電性連接至少一收音單元111的一處理單元112。其中,至少一收音單元111根據結構本體10的振動而產生至少一音頻訊號,處理單元112依據至少一音頻訊號而輸出一聲音訊號。Please refer to FIGS. 13 and 14, which are respectively a three-dimensional schematic diagram and a block diagram of an electronic device according to a fourth embodiment of the present invention. Please also refer to FIGS. 1-12. As shown in the figure, the fourth embodiment of the present invention provides an electronic device Z, which includes a
具體而言,本發明的第四實施例提供一種電子裝置Z,電子裝置Z可為手機、對講機或無線耳機等,或者任何需收音元件的電子裝置,在本實施例中係以藍芽耳機作為示例,但不以此為限。電子裝置Z包括了一裝置本體2以及一收音結構1。裝置本體2可為塑膠或金屬等材質的殼體,並具有收音通口20。收音結構1位於裝置本體2中,收音結構1包括結構本體10及收音模組11。結構本體10可為殼體結構,並具有容置空間100,可用於容納收音模組11及處理單元112。更進一步而言,結構本體10可為兩件式的殼體結構(如圖1、圖2、圖6、圖7所示),也可以是單一件式的殼體結構(如圖5所示),或者是多件式的殼體結構(如圖8所示);結構本體10的材質可以是金屬或者塑膠等材質。收音模組11可為任何種類的收音元件。收音模組11包括了至少一收音單元111以及一處理單元112。至少一收音單元111可為任何種類的收音元件,較佳可為可調靈敏度、感度的收音晶片,但不以此為限。處理單元112可為具訊號處理功能的處理器,例如整合IC晶片,處理單元112與收音模組11電性連接。其中,處理單元112與收音模組11可結合成一個構件。Specifically, the fourth embodiment of the present invention provides an electronic device Z. The electronic device Z can be a mobile phone, a walkie-talkie, a wireless headset, etc., or any electronic device that requires a radio element. In this embodiment, a Bluetooth headset is used as Examples, but not limited to this. The electronic device Z includes a
因此,在使用者操作電子裝置Z進行講話時,可透過收音通口20收音結構1發聲。接著,結構本體10會受到聲波的影響而產生振動。接下來,結構本體10在振動時,會透過一膜片或本體而使收音模組11連帶受到振動,進而產生至少一音頻訊號。緊接著,處理單元112會接收至少一音頻訊號,並依據至少一音頻訊號而輸出一聲音訊號至電子裝置Z。最後,電子裝置Z可將關於使用者講話內容的聲音訊號傳送到至少一外部裝置D。Therefore, when the user operates the electronic device Z to speak, the sound can be emitted through the sound-receiving
在其中一較佳的實施態樣中,電子裝置Z,還進一步包括:一控制器3,其電性連接收音模組11的處理單元112。也就是說,本發明的電子裝置Z進一步還可包括一控制器3,其可為中央處理器或者任何具控制與處理功能的處理器。因此,在處理單元112輸出聲音訊號後,控制器3可接收並提供給至少一外部裝置D。In one of the preferred embodiments, the electronic device Z further includes: a
在另一較佳的實施態樣中,電子裝置Z還進一步包括:電性連接控制器3的一揚聲器4以及電性連接控制器3的一收發器5,收發器5可通訊連結至少一外部裝置D。也就是說,本發明的電子裝置Z進一步還可包括一揚聲器4以及一收發器5,揚聲模組4可為揚聲器,包括音圈、磁鐵等元件,並電性連接控制器3。收發器5可為藍芽或wi-fi的通訊模組。因此,在控制器3接收聲音訊號後,可通過收發器5將聲音訊號提供給至少一外部裝置D。或者,收發器5接收到至少一外部裝置D所傳送的音訊時,可通過控制器3傳遞至揚聲器4進行播放。In another preferred embodiment, the electronic device Z further includes: a
在再一較佳的實施態樣中,結構本體10具有至少一收音通道101;其中,收音模組11還進一步可包括位於容置空間100的一基板單元110,至少一收音單元111包括位於基板單元110上的一第一收音單元111a以及位於基板單元110上的一第二收音單元111b,第一收音單元111a與第二收音單元111b電性連接處理單元112,第一收音單元111a或第二收音單元111b根據結構本體10的振動而產生至少一音頻訊號。而具體實施方式類似前述第二實施例,在此不再特別說明。In yet another preferred embodiment, the
在又一較佳的實施態樣中,處理單元112包括電性連接第一收音單元111a與第二收音單元111b的至少一訊號處理元件1120以及電性連接至少一訊號處理元件1120的至少一放大元件1121,至少一訊號處理元件1120依據至少一音頻訊號而輸出一處理訊號,至少一放大元件1121接收處理訊號而輸出一聲音訊號。而具體實施方式類似前述第二實施例,在此不再特別說明。In another preferred embodiment, the
值得一提的是,通過上述說明內容雖能瞭解本發明的實施方式、優點與效果;然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。It is worth mentioning that although the implementation, advantages and effects of the present invention can be understood through the above description; however, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.
[第五實施例][Fifth Embodiment]
請參閱圖15,其為本發明第五實施例的收音結構的結構示意圖,並請一併參閱圖1至圖14。如圖所示,本發明第五實施例提供一種收音結構1,其包括一薄膜本體12以及一收音模組11。收音模組11位於薄膜本體12,收音模組11包括至少一收音單元111以及電性連接至少一收音單元111的一處理單元112。Please refer to FIG. 15, which is a schematic structural diagram of the radio structure of the fifth embodiment of the present invention. Please also refer to FIGS. 1 to 14. As shown in the figure, the fifth embodiment of the present invention provides a
具體而言,本實施例所提供的收音結構1與前述第一實施例的差異在於,收音模組11可設置於薄膜本體12上,薄膜本體12可為一般具黏性的膜體。因此,使用者可透過薄膜本體12將收音模組11貼附於人體的皮膚上,並通過收音模組11感應、接收皮膚的振動而達到收音的效果;其中,收音模組11的具體收音過程與功效類似於前述各實施例,故在此不再特別說明。Specifically, the difference between the sound-receiving
在其中一較佳的實施態樣中,結構本體10具有至少一收音通道101;其中,收音模組11還進一步可包括位於容置空間100的一基板單元110,至少一收音單元111包括位於基板單元110上的一第一收音單元111a以及位於基板單元110上的一第二收音單元111b,第一收音單元111a與第二收音單元111b電性連接處理單元112,第一收音單元111a或第二收音單元111b根據結構本體10的振動而產生至少一音頻訊號。而具體實施方式類似前述第二實施例,在此不再特別說明。In one of the preferred embodiments, the
在另外一較佳的實施態樣中,處理單元112包括電性連接第一收音單元111a與第二收音單元111b的至少一訊號處理元件1120以及電性連接至少一訊號處理元件1120的至少一放大元件1121,至少一訊號處理元件1120依據至少一音頻訊號而輸出一處理訊號,至少一放大元件1121接收處理訊號而輸出一聲音訊號。而具體實施方式類似前述第二實施例,在此不再特別說明。In another preferred embodiment, the
[實施例的有益效果][Beneficial effect of embodiment]
本發明的有益效果在於,本發明所提供的收音結構1及電子裝置Z,其能通過“收音模組11位於容置空間100”、“收音模組11包括至少一收音單元111以及電性連接至少一收音單元111的一處理單元112”以及“至少一收音單元111根據結構本體10的振動而產生至少一音頻訊號,處理單元112依據接收至少一音頻訊號而輸出一聲音訊號”的技術方案,以提升收音品質。The beneficial effect of the present invention is that the
本發明的另一有益效果在於,本發明所提供的收音結構1,其能通過“一收音模組11,其位於薄膜本體12,收音模組11包括至少一收音單元111以及電性連接至少一收音單元111的一處理單元112”的技術方案,以提升收音品質。Another beneficial effect of the present invention is that the
更進一步來說,本發明所提供的收音結構1及電子裝置Z通過“收音模組11位於結構本體10”以及“收音模組11根據結構本體10的振動而產生至少一音頻訊號,處理單元112依據至少一音頻訊號而輸出一聲音訊號”的技術方案,可達到對使用者的講話內容進行收音,也能避免接收到使用者周遭的環境噪音的功效,以解決習知技術中收音品質不佳的問題。More specifically, the
以上所公開的內容僅為本發明的較佳可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and schematic content of the present invention are included in the present invention. Within the scope of patent application.
Z:電子裝置
1:收音結構
10:結構本體
100:容置空間
101:收音通道
11:收音模組
110:基板單元
110a:收音孔
111:收音單元
111a:第一收音單元
111b:第二收音單元
111c:第三收音單元
112:處理單元
112a:第一處理單元
112b:第二處理單元
1120:訊號處理元件
1121:放大元件
113:遮蔽單元
12:薄膜本體
2:裝置本體
20:收音通口
3:控制器
4:揚聲器
5:收發器
D:外部裝置
Z: Electronic device
1: Radio structure
10: Structural body
100: accommodation space
101: Radio channel
11: Radio module
110:
圖1為本發明第一實施例的收音結構的第一結構示意圖。Fig. 1 is a first structural diagram of a radio structure according to a first embodiment of the present invention.
圖2為本發明第一實施例的收音結構的第二結構示意圖。2 is a schematic diagram of a second structure of the radio structure of the first embodiment of the present invention.
圖3為本發明第一實施例的收音模組的第一結構示意圖。3 is a schematic diagram of the first structure of the radio module according to the first embodiment of the present invention.
圖4為本發明第一實施例的收音模組的第二結構示意圖。4 is a schematic diagram of a second structure of the radio module of the first embodiment of the present invention.
圖5為本發明第一實施例的收音結構的第三結構示意圖。FIG. 5 is a third structural diagram of the radio structure of the first embodiment of the present invention.
圖6為本發明第一實施例的收音結構的第四結構示意圖。Fig. 6 is a fourth structural diagram of the radio structure of the first embodiment of the present invention.
圖7為本發明第一實施例的收音結構的第五結構示意圖。FIG. 7 is a fifth structural diagram of the sound receiving structure of the first embodiment of the present invention.
圖8為本發明第一實施例的收音結構的第六結構示意圖。FIG. 8 is a schematic diagram of a sixth structure of the radio structure of the first embodiment of the present invention.
圖9為本發明第一實施例的收音模組的第三結構示意圖。9 is a schematic diagram of a third structure of the radio module according to the first embodiment of the present invention.
圖10為本發明第一實施例的收音模組的第四結構示意圖。10 is a schematic diagram of a fourth structure of the radio module according to the first embodiment of the present invention.
圖11為本發明第二實施例的收音結構的收音模組的剖面示意圖。11 is a schematic cross-sectional view of a radio module with a radio structure according to a second embodiment of the present invention.
圖12為本發明第三實施例的收音結構的收音模組的剖面示意圖。12 is a schematic cross-sectional view of a radio module with a radio structure according to a third embodiment of the present invention.
圖13為本發明第四實施例的電子裝置的立體示意圖。FIG. 13 is a three-dimensional schematic diagram of an electronic device according to a fourth embodiment of the invention.
圖14為本發明第四實施例的電子裝置的功能方塊圖。FIG. 14 is a functional block diagram of an electronic device according to a fourth embodiment of the invention.
圖15為本發明第五實施例的收音結構的結構示意圖。FIG. 15 is a schematic structural diagram of a radio structure of the fifth embodiment of the present invention.
1:收音結構 1: Radio structure
10:結構本體 10: Structural body
100:容置空間 100: accommodation space
11:收音模組 11: Radio module
Claims (10)
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TW107143646A TWI704814B (en) | 2018-12-05 | 2018-12-05 | Audio reception structure and electronic device |
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TW107143646A TWI704814B (en) | 2018-12-05 | 2018-12-05 | Audio reception structure and electronic device |
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TW201116077A (en) * | 2009-10-21 | 2011-05-01 | Vego Technology Inc | Earphone integrated with microphone |
JP5434798B2 (en) * | 2009-12-25 | 2014-03-05 | 船井電機株式会社 | Microphone unit and voice input device including the same |
TW201132135A (en) * | 2010-03-11 | 2011-09-16 | Jung-Tang Huang | Smart microphone array |
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