TW202022541A - Decorated panels for electronic devices - Google Patents

Abstract

The present disclosure is drawn to decorated panels for electronic devices. In one example, a decorated panel for an electronic device can include a substrate, a primer layer on the substrate, an adhesive layer on the primer layer, and an overmolded layer on the adhesive layer. The substrate can include metal, metal alloy, or carbon fiber. The primer layer can include a polyurethane, polyurethane copolymer, or alkyd resin. The overmolded layer can include a non-conductive vacuum metallized pattern.

Description

Decorative panel for electronic device

The present invention relates to decorative panels used in electronic devices.

Background of the invention The use of all types of personal electronic devices continues to increase. Mobile phones including smart phones have become almost ubiquitous. Tablet computers have also been widely used in recent years. Portable laptop computers continue to be used by most people for personal, entertainment and business purposes. Especially for portable electronic devices, a lot of efforts have been spent to make these devices more useful and powerful, while making them smaller, lighter and more durable. In this highly competitive market, the aesthetic design of personal electronic devices has also received attention.

According to a specific embodiment of the present invention, a decorative panel for electronic devices is specifically proposed. The decorative panel includes: a substrate containing metal, metal alloy or carbon fiber; a primer layer on the substrate, wherein the The primer layer includes polyurethane, polyurethane copolymer, or alkyd resin; an adhesive layer on the primer layer; and an overmolding layer on the adhesive layer, wherein the overmolding layer includes a Non-conductive vacuum metallization pattern.

Detailed description of the preferred embodiment This disclosure describes decorative panels for electronic devices. In some examples, the decorative panel for electronic devices may include a substrate such as metal, metal alloy, or carbon fiber. There may be a primer layer on the substrate. The primer layer may include polyurethane, polyurethane copolymer, or alkyd resin. An adhesive layer may be provided on the primer layer, and an overmolding layer may be located on the adhesive layer. The overmolding layer may include a non-conductive vacuum metallization pattern. In another example, the substrate may include a micro-arc oxidation layer in contact with the primer layer. In yet another example, the substrate may include a passivation layer in contact with the primer layer. The passivation layer may include molybdate, vanadate, phosphate, chromate, stannate, manganese salt, or a combination thereof. In some examples, the substrate may include aluminum, magnesium, titanium, lithium, niobium, or an alloy thereof. In a particular example, the substrate may include an alloy of aluminum and magnesium. In yet another example, the substrate may also include a plastic cover layer bonded or embedded with metal, metal alloy or carbon fiber. The primer layer may extend across the interface between the metal, metal alloy or carbon fiber and the plastic cover layer. In a further example, the overmolding layer may also include an inking pattern. In still further examples, a clear coating layer may be located on the overmolding layer.

In another example, an electronic device may include a frame including a metal, metal alloy, or carbon fiber. A primer layer can be located on the frame. The primer layer may include polyurethane, polyurethane copolymer, or alkyd resin. An adhesive layer can be located on the primer layer. An overmolding layer can be located on the adhesive layer. The overmolding layer may include a non-conductive vacuum metallization pattern. In one example, the frame may include a plastic cover layer bonded or embedded with metal, metal alloy or carbon fiber. The primer layer may extend across the interface between the metal, metal alloy or carbon fiber and the plastic cover layer. In another example, the frame may include an aluminum-magnesium metal alloy part embedded with a plastic covering layer. In yet another example, the frame may include a chamfered edge.

The present disclosure also extends to methods of manufacturing decorative panels for electronic devices. In one example, a method of manufacturing a decorative panel for an electronic device may include applying a primer layer on a substrate. The primer layer may include polyurethane, polyurethane copolymer, or alkyd resin. The substrate may include metal, metal alloy, or carbon fiber. An adhesive layer can be applied on the primer layer. A decoration layer can be overmolded on the adhesive layer to form an overmolded layer with a non-conductive vacuum metallization pattern. In another example, the substrate may include a plastic cover layer bonded or embedded with metal, metal alloy or carbon fiber. The primer layer can be applied across an interface between the metal, metal alloy or carbon fiber and the plastic cover layer. In another example, the substrate can be treated with micro-arc oxidation or passivation treatment, wherein the passivation treatment includes using molybdate, vanadate, phosphate, chromate, stannate, manganese salt, or one of them The bond processes the substrate.

It should be noted that when discussing the decorative panel, the electronic device, or the method in this article, whether or not the discussion is explicitly discussed in the context of the example, it can be considered that the discussion is applicable to each other. Thus, for example, when the primer layer is discussed in the context of one of the decorative panel examples, the disclosure is also relevant and directly supported in the context of the electronic device and/or method, and vice versa. It should also be understood that, unless otherwise specified, the terms used herein will have their ordinary meanings in the relevant technical fields. In some cases, there are more specifically defined terms from beginning to end or included at the end of this disclosure, so these terms are supplemented to have the meanings described herein.

In further details, it should be noted that the spatial relationship between the layers is usually described in this article as being located "on" or applied to another layer, and it is not inferred that this layer is directly located at all. Refers to the layer in question, but can have intervening layers in between. The statement is stated that a layer located on another layer can be directly placed on the other layer. Therefore, this statement is supported here for the argument that the layer is directly placed on the reference layer.

Decorative panel

The decorative panels described herein can be used in a variety of electronic devices to provide decorative designs, such as glossy, metalized patterns, colorful inked patterns, and shiny or matte surface treatments. In some examples, electronic devices such as laptop computers, smart phones, tablet computers, televisions, and others may have a rack made of materials such as light metal, carbon fiber, and/or plastic. Light metals, such as aluminum, magnesium, titanium, lithium, niobium and their alloys, are often used in racks due to their light weight and high strength. Carbon fiber can be used for the same reason. These materials can also be selected for their specific look and feel. However, in many cases, the appearance of the electronic device can benefit from the additional decoration that can be provided by the method described herein. For example, an overmolded decorative layer can be adhered to the frame to provide a non-conductive vacuum metallized pattern, ink pattern and clear coating layer.

In some occasions, it is difficult to adhere an overmolded decorative layer to certain frame materials, including light metal and carbon fiber. However, the use of a primer as described herein can help to enhance the adhesion of the overmolded layer to the chassis substrate. The primer may include polyurethane, polyurethane copolymer, or alkyd resin. In addition, in a plurality of electronic devices, the rack may include a part made of metal, metal alloy or carbon fiber and a part made of plastic in the form of a plastic cover layer. The plastic cover layer can be bonded to metal, metal alloy or carbon fiber through thermal bonding or other bonding methods. In other examples, the plastic cover layer may be partially embedded with the metal or carbon fiber. In some cases, there may be tiny gaps or uneven surfaces at the interface between the plastic covering layer and the metal or carbon fiber part of the frame. The gap or uneven surface can also interfere with the adhesion between the frame and the overmolded layer. The primer mentioned above can also help solve this problem, because the primer can fill the gap and conceal the uneven surface.

Figure 1 shows an exemplary decorative panel 100 for an electronic device. The decorative panel includes a substrate 110, such as a metal, metal alloy, or carbon fiber substrate, and a primer layer 120 on the substrate. An adhesive layer 130 is also shown to be located on the primer layer, and an overmolding layer 140 is located on the adhesive layer. The overmolding layer may include a non-conductive vacuum metallization pattern. The primer layer may include polyurethane, polyurethane copolymer or alkyd resin. The substrate may include metal, metal alloy or carbon fiber.

In a further example, the substrate can be treated by micro-arc oxidation or passivation treatment. This is particularly useful for light metal substrates such as magnesium and magnesium alloys. The micro-arc oxidation or passivation treatment can produce a protective micro-arc oxidation layer or passivation layer on the surface of the substrate. FIG. 2 shows another exemplary decorative panel 200 according to the present disclosure. The panel includes a substrate 210, such as a metal, metal alloy, or carbon fiber substrate, and a primer layer 220 on the substrate. An adhesive layer 230 is located on the primer layer, and an overmolding layer 240 is located on the adhesive layer. However, in this example, the substrate includes a micro-arc oxide layer 215 on the surface of the substrate layer in contact with the primer layer. A second micro-arc oxidation layer 217 can also exist on the back surface or the opposite surface of the substrate relative to the micro-arc oxidation layer.

FIG. 3 shows another exemplary decorative panel 300 according to the present disclosure. In this example, the panel includes a substrate 310 as in the foregoing examples, such as a metal or metal alloy substrate, a primer layer 320 and an adhesive layer 330, and an overmolding layer 340. The substrate also includes a passivation layer 315 in contact with the primer layer, and a second passivation layer 317 on the back surface or the opposite surface of the substrate. A clear coating layer 350 and a release film 360 are arranged on the overmolding layer. In addition to the metal or metal alloy substrate, the substrate may also include a plastic cover layer 312 in this example. The plastic covering layer can be insert-molded or bonded to the substrate. The primer layer 320 extends across the interface between the plastic cover layer and the metal part relative to the micro-arc oxidation layer.

Substrate

The substrate can be a light metal such as aluminum, magnesium, titanium, lithium, niobium or one of its alloys. In some examples, the alloys of these metals may include additional metals, such as bismuth, copper, cadmium, iron, thorium, strontium, zirconium, manganese, nickel, lead, silver, chromium, silicon, tin, gamma, yttrium, calcium , 鍗, zinc, cerium, lanthanum, or others. In a particular example, the substrate may be pure magnesium or an alloy including 99% magnesium or higher. In another particular example, the substrate may be made of an alloy including magnesium and aluminum. Examples of magnesium-aluminum alloys may include alloys composed of 91% to 99% magnesium by weight and 1% to 9% aluminum by weight and 0.5% to 13% magnesium by weight and 87% to 99.5% aluminum by weight The composition of the alloy. Specific examples of magnesium-aluminum alloys may include AZ63, AZ81, AZ91, AM50, AM60, AZ31, AZ31B, AZ61, AZ80, AE44, AJ62A, ALZ391, AMCa602, LZ91, and Magnox type (Magnox) alloys. Specific examples of aluminum-magnesium alloys may include 1050, 1060, 1199, 2014, 2024, 2219, 3004, 4041, 5005, 5010, 5019, 5024, 5026, 5050, 5052, 5056, 5059, 5083, 5086, 5154, 5182 , 5252, 5254, 5356, 5454, 5456, 5457, 5557, 5652, 5657, 5754, 6005, 6005A, 6060, 6061, 6063, 6066, 6070, 6082, 6105, 6162, 6162, 6362, 6351, 6463, 7005, 7022 , 7068, 7072, 7075, 7079, 7116, 7129, 7178. In a particular example, the substrate can be made of AZ31 or AZ91.

In a further example, the substrate may include carbon fiber. In particular, the substrate may be a carbon fiber composite material. The carbon fiber composite material may include carbon fibers in a plastic such as thermosetting resin or thermoplastic polymer. Non-limiting examples of such polymers may include epoxy resins, polyesters, vinyl esters, and polyamides. Since carbon fiber is usually a more expensive material, it may sometimes be used for a part of the electronic device rack instead of the entire rack. For example, in some examples, the carbon fiber panel can be combined with a metal frame.

In different examples, the substrate may be formed by molding, casting, machining, bending, processing, or other methods. In some instances, the substrate may be a rack for electronic devices, which is rolled from a single piece of metal or metal alloy. In other examples, the electronic device rack can be made of multiple panels. For an example, a laptop computer sometimes includes four individual pieces to form the rack or cover of the laptop computer, so that the electronic components of the laptop computer are protected in the rack. The four individual pieces of the laptop rack are usually designated as cover A (the rear cover of the monitor part of the laptop), cover B (the front cover of the monitor part), and cover C (the keyboard part of the Top cover) and cover D (the bottom cover of the keyboard part). In some examples, one of the covers or more than one of the covers may include metal, metal alloy, or carbon fiber. The covers can be made by machining, casting, molding, bending or other forming methods. Other types of electronic device racks can also be the above-mentioned substrates, such as smart phones, tablet computers, or TV racks. These substrates can be made using the same forming method.

In some instances, magnesium or magnesium alloy can be used as the substrate. Due to its high strength-to-weight ratio, magnesium can be selected as the material of the electronic device rack. However, magnesium can present certain difficulties. Magnesium is easily oxidized on the surface, thereby hindering the appearance of metallic luster. In addition, magnesium may have poor color stability, hardness, and chemical resistance. Adding primer layers, adhesive layers, and overmolding layers as described herein can give magnesium or magnesium alloy frames an attractive surface treatment with good hardness, chemical resistance and durability.

The thickness of the substrate is not particularly limited. However, when used as a panel for an electronic device, such as a housing or a rack, the thickness of the selected substrate, the density of the material (for example, to control weight), the hardness of the material, the plasticity of the material, the aesthetics of the material, etc. . However, in some examples, although thicknesses outside the following ranges may be used, the thickness of the substrate may be about 0.5 mm to about 2 cm, about 1 mm to about 1.5 cm, and about 1.5 mm to about 1.5 Cm, about 2 mm to about 1 cm, about 3 mm to about 1 cm, about 4 mm to about 1 cm, or about 1 mm to about 5 mm.

Surface treatment layer

The substrate can be treated with a surface treatment layer, such as micro-arc oxidation, passivation layer or the like. For example, the micro arc oxidation (MAO) layer can also be called plasma electrolytic oxidation. Micro-arc oxidation is an electrochemical treatment, for example, in which when immersed in a chemical bath or an electrolytic bath, a micro-discharge of a compound is used on the surface of the substrate to oxidize the metal surface. The electrolytic bath may mainly include water with about 1wt% to about 5wt% electrolytic compound, for example, alkali metal silicate, alkali metal hydroxide, alkali metal fluoride, alkali metal phosphate, alkali metal aluminate and the like物, and its combination. Although the range of the electrolytic compounds is not limited by consideration, the electrolytic compounds may also be about 1.5 wt% to about 3.5 wt%, or about 2 wt% to about 3 wt%. In one example, high-voltage alternating current may be applied to the substrate to generate plasma on the surface of the substrate. In this process, the substrate can be used as an electrode immersed in the electrolyte solution, and the counter electrode can be any other electrode that is also in contact with the electrolyte. In some examples, the counter electrode may be an inert metal, such as stainless steel. In some instances, the bath holding the electrolyte solution may be conductive, and the bath itself may be used as the counter electrode. High direct current or alternating voltage can be applied to the substrate and the counter electrode. In some examples, the voltage may be 200V or higher, such as about 200V to about 600V, about 250V to about 600V, about 250V to about 500V, or about 200V to about 300V. For example, the temperature can be from about 20ºC to about 40ºC, or from about 25ºC to about 35ºC, but temperatures outside these ranges can be used. This treatment can oxidize the surface to form an oxide layer from the substrate material. Various metals or metal alloy substrates can be used, for example, including aluminum, titanium, lithium, magnesium and/or alloys thereof. The oxidation can extend below the surface to form a thick layer with a thickness of 250 microns or more. In some examples, the oxide layer may have a thickness of about 1 micrometer to about 250 micrometers, about 1 micrometer to about 200 micrometers, or about 2 micrometers to about 20 micrometers. The thickness may also be about 2 microns to about 15 microns, about 3 microns to about 10 microns, or about 4 microns to about 7 microns. In some cases, the oxide layer can improve the mechanical, abrasion, thermal, dielectric, and corrosion properties of the substrate. The electrolyte solution may include various electrolytes such as potassium hydroxide solution. In some examples, the substrate may include a micro-arc oxide layer on one side or both sides, as shown in FIG. 2.

Another example of a surface treatment layer used for the substrate may be a passivation layer. In some examples, a passivation process for generating the passivation layer may include dissolving the passivation compound in a solution and immersing the substrate in the solution to form the passivation compound layer on the substrate. Examples of passivation treatment processes that can be implemented to produce a passivation layer may include chromate conversion coating, phosphate conversion coating, molybdate conversion coating, vanadate conversion coating, stannate conversion coating, and others By. In some examples, the substrate may be passivated on one side, or on both sides, as shown in FIG. 3.

Primer layer

The primer layer can be applied on a bare (untreated) substrate or on a substrate treated with a surface treatment layer, for example, a micro-arc oxidation or a passivation layer. In some examples, the primer layer may include polyurethane or a polyurethane copolymer. In some instances, the polyurethane or polyurethane copolymer can be formed by polymerizing polyisocyanate and polyol. Non-limiting examples of polyisocyanates that can be used can include toluene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate (1,6-hexamethylene diisocyanate), isophorone diisocyanate, 4,4'- Dicyclohexylmethane diisocyanate, trimethylhexamethylene diisocyanate and others. In some examples, the polyol may be a polyether polyol or a polyester polyol having a weight average molecular weight of about 100 to about 10,000 or about 200 to about 5,000. In some instances, the polyol may be a diol including a dihydroxy group. In a further example, the primer layer may have a thickness of about 1 micrometer to about 50 micrometers, about 2 micrometers to about 25 micrometers, or about 5 micrometers to about 15 micrometers.

In some examples, the primer layer may include a moisture-curable polyurethane. The moisture-curable polyurethane may include a prepolymer that can be terminated with an isocyanate that is cured by surrounding water. In a specific example, the primer layer may include Airethane ^™ 1204 polyurethane or other Airethane ^™ 1000 series polyurethane (Fairmont Industries).

In other examples, the primer may include an alkyd resin. Alkyd resins are thermoplastic resins made of polyhydric alcohols and polybasic acids or their anhydrides. In some examples, alkyd resins can be made by polycondensation of polyols and dicarboxylic acids or their anhydrides. Non-limiting examples of other polybasic acids that can be used for alkyd resins include phthalic anhydride, phthalic anhydride, maleic anhydride, butenedioic acid, and others. Non-limiting examples of polyols that can be used for alkyd resins include glycerin, trimethylolethane, trimethylolpropane, pentaerythritol, ethylene glycol, and neopentyl glycol. In some examples, a monobasic acid can also be included in the reaction to modify the alkyd resin. In a specific example, the primer may include resins from DOMALKYD ^TM series resins, such as DOMALKYD ^TM 4161 (Helios).

Adhesive layer

An adhesive layer can be applied on the primer layer. In some examples, the adhesive layer may have a thickness of about 1 micrometer to about 100 micrometers, about 2 micrometers to about 50 micrometers, or about 5 micrometers to about 30 micrometers. Non-limiting examples of usable adhesive materials include ethylene-vinyl acetate copolymer, ethylene ethyl acrylate copolymer, ionic polymer, polyethyl acrylate, phenoxy resin, polyamide, polyester, polyvinyl acetate Ester, polyvinyl butyral, polyvinyl ether and others.

Overmolded layer

An overmolding layer can be overmolded on the adhesive layer. In some examples, the overmolding layer may include plastics, such as acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polyamide (PA), polymethylmethacrylate (PMMA), Styrene-butadiene-styrene (SEBS), polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polyphenylene ether (PPE), polyxylene oxide (PPO) or its One combination. In some examples, the thickness of the overmolding layer may be about 50 microns to about 150 microns. In a further example, the thickness may be about 65 microns to about 110 microns or about 70 microns to about 100 microns. The overmolding layer may also include a non-conductive vacuum metallization pattern.

For example, the overmolded layer can be applied by non-conductive vacuum metallization. "Non-conductive vacuum metallization" is a method for forming a thin film, which appears as a continuous, shiny metal film, but is actually a layer of isolated metal spots or islands on the surface. Because the metallization layer is not a continuous metal film, the layer is not conductive. In some instances, the use of this type of film can provide a shiny, metallic appearance, but is useful for sending and receiving wireless signals, such as radio, Wi-Fi, satellite (GPS), Bluetooth® and cellular signals. It can still be useful in electronic devices. Conversely, conductive metal films can interfere with these types of electromagnetic signals. Therefore, in an aspect of the present disclosure, a part of the surface of a decorative panel, or in some cases, the entire surface may be covered by non-conductive vacuum metallization. If partially covered, the non-conductive vacuum metallization can confine a small pattern on the panel that is decorative or otherwise covers a defined portion of the surface. For example, non-conductive vacuum metallization can be applied to the edge of a device, to a frame around a screen, to the center of a panel, to a part that includes a decorative pattern, and so on. In one example, the non-conductive vacuum metallization can also be used to form a logo or customized design on the panel. In some examples, the non-conductive metallization pattern may have a film thickness of about 5 nanometers to about 500 nanometers, about 10 nanometers to about 200 nanometers, or about 10 nanometers to about 100 nanometers. Materials that can be used for the non-conductive vacuum metallization include titanium, chromium, nickel, zinc, zirconium, manganese, copper, aluminum, tin, molybdenum, tantalum, tungsten, hafnium, gold, vanadium, silver, platinum, graphite and alloys thereof .

In a further example, the overmolding layer may also include an inking pattern. For example, a specific ink color or color group can be printed by an analog or digital printing method to form a pattern. Alternately, the ink can also be added to the entire surface by analog or digital printing or other coating methods such as spraying, roller coating, doctor blade coating, etc. In some instances, both a non-conductive vacuum metallization pattern and an inking pattern can be used on different parts of the overmolded layer. In other examples, it can be applied in a layered manner, with the same or different application coverage areas. In still other examples, the inking pattern may have a film thickness of about 1 micrometer to about 40 micrometers, about 2 micrometers to about 30 micrometers, or about 5 micrometers to about 20 micrometers.

Various inks can be used to form the inking pattern, such as pigment ink or dye ink. In some examples, the ink may include a colorant, such as a pigment or dye, a binder, and a dispersant. These ingredients can be dispersed in liquid carriers such as water or organic solvents. Non-limiting examples of the binder in the ink can include polyester acrylate copolymer, polyether polyol copolymer, polyester polyol copolymer, polyester urethane copolymer, polyurethane/urea, polyester, poly Acrylic, polyurethane, and others. Non-limiting examples of the dispersant may include sodium polyacrylate, sodium polyoxyethylene alkyl alkyl ether carboxylate, sodium lauryl sulfate, and others.

Clear coating layer and release layer

In some examples, the decorative panels may also include a clear coating layer as a protective coating layer on the overmolding layer. In some occasions, the clear coating layer can be applied on the overmolded layer. The clear coating layer can be, for example, a clear polyacrylic acid or a clear polyurethane coating. In some examples, the clear coating layer may be a polyacrylic acid layer with a thickness of about 1 micrometer to about 50 micrometers, about 2 micrometers to about 30 micrometers, or about 5 micrometers to about 15 micrometers. In other examples, the clear coating layer may be polyurethane with a thickness of about 20 microns to about 100 microns, about 30 microns to about 75 microns, or about 40 microns to about 50 microns.

In some examples, the decorative panel may include a removable release film applied on the clear coating layer. In other examples, even if a clear coating layer for protection is not included, a release film can be applied on the overmolding layer to protect the overmolding layer. Either way, the release film can be a transparent plastic film, such as a polyethylene terephthalate (PET) film or a polycarbonate (PC) film. In some examples, the release film can be silicified by coating the surface of the film with a silicone compound.

Plastic cover

In some examples, plastic may be applied on the metal (or carbon fiber) portion of a metal, metal alloy, or carbon fiber substrate to form a plastic-covered substrate, which includes metal, metal alloy, or carbon fiber with a plastic layer applied thereon . For example, plastic may be embedded or bonded to metal, metal alloy, or carbon fiber at a part of the electronic device rack, where the properties of plastic may be more useful than metal or carbon fiber. To illustrate, a plastic cover layer can be placed close to an antenna to allow radio waves to travel through the rack. In another example, a plastic cover layer can be located at the corner of the device, and a flat panel of metal or carbon fiber can form most of the flat surface of the device. In further examples, a plastic cover layer can be used where molded features are required, such as buttons, speaker and microphone openings, camera lens housings, and others. The plastic cover layer can be made of any rigid plastic material, such as ABS, PC, PA, PMMA, SEBS, PPE, PBT, PPS, PPO, or a combination thereof.

In some cases, gaps or uneven surfaces may be found at the interface between the metal, metal alloy, or carbon fiber (including the surface treatment layer in some cases, if present) and the plastic cover layer. Applying a primer layer across the interface (where the plastic cover layer is combined with the metal, metal alloy or carbon fiber substrate) can smooth the uneven surface and/or fill the gap, so the surface is smooth, even across The interface, in order to apply the overmolded layer. In some cases, this can improve the adhesion between the overmolded layer and the substrate.

In a further example, the plastic covering layer can be embedded and molded with metal, metal alloy or carbon fiber parts to form a substrate with these various types of materials connected together, such as metal or metal alloy compounded with a plastic covering layer. Or carbon fiber. Insert molding includes placing the substrate part into a mold, and then injecting the plastic around the metal, metal alloy or carbon fiber in the mold. In some cases, the metal, metal alloy, or carbon fiber substrate may include an undercut shape, and the molten plastic may flow into the undercut during injection molding. When the plastic hardens, the undercut can provide a strong connection between the metal or carbon fiber and the plastic.

In other examples, the metal, metal alloy or carbon fiber and a plastic cover layer can be bonded together, for example, by using an adhesive to connect the two structures together. Non-limiting examples of adhesives may include epoxy resins, cyanoacrylates, ultraviolet curing adhesives, ethylene-vinyl acetate copolymers, ethylene ethyl acrylate copolymers, ionic polymers, polyethyl acrylate, phenoxy Resin, polyamide, polyester, polyvinyl acetate, polyvinyl butyral, polyvinyl ether, and others. In other examples, the plastic cover layer may be thermally bonded to the metal or carbon fiber part.

The term "covering" does not infer the spatial relationship between the decorative panels or the electronic device itself, but only describes the relationship between the materials that may exist on both the substrate or the frame. For example, the plastic cover The layer system is the "covering layer" on metal, metal alloy or carbon fiber with respect to its application. Therefore, if another structure or material is to be applied to the plastic covering layer, it is still regarded as a covering layer related to metal, metal alloy or carbon fiber.

Electronic device with decorative panel

The present disclosure also extends to electronic devices including the above-mentioned decorative panel. Therefore, the details related to the above-mentioned decorative panel are directly related to the electronic device shown and described herein. More specifically, FIG. 4 shows an exemplary electronic device 400 according to the present disclosure. The electronic device includes a frame 410, which in this case may include a metal material and a plastic cover layer 412. The plastic cover layer can be embedded and molded with the substrate. A primer layer 420 is located on the outer surface of the frame. As mentioned above, the primer layer may include polyurethane, polyurethane copolymer or alkyd resin. The adhesive layer 430 is located on the primer layer. An overmolding layer including a non-conductive vacuum metallization pattern 440 is located on the adhesive layer. In this example, the overmolding layer also includes an inking pattern 442 on the corner edge 452 of the electronic device. A clear coating layer 450 is applied on the overmolded layer. The electronic component 470 can be located inside the rack. Depending on the electronic device, the electronic components may include a wide variety of components, such as screens, processors, memory, batteries, and so on.

The electronic device may include any components and features of the above-mentioned decorative panel. For example, an electronic device similar to that shown in Figure 4 can be made, but using carbon fiber as the base plate of the frame instead of metal or metal alloy. In other examples, the frame may include a metal alloy, such as an alloy of aluminum and magnesium.

Method for manufacturing decorative panel for electronic device

The present disclosure also extends to methods for manufacturing decorative panels for electronic devices. Therefore, the details related to the above-mentioned decorative panel are directly related to this method. In further details, FIG. 5 is a flowchart of an exemplary method 500 for manufacturing a decorative panel for an electronic device. The method may include applying 510 a primer layer on a substrate, wherein the primer layer includes polyurethane, polyurethane copolymer, or alkyd resin, and wherein the substrate includes metal, metal alloy, or carbon fiber. In addition, the method may include applying 520 an adhesive layer on the primer layer, and overmolding 530 a decoration on the adhesive layer to form an overmolding layer of a non-conductive vacuum metallization pattern.

In a further example, the substrate may further include a plastic cover layer bonded to or embedded with metal, metal alloy or carbon fiber, and the method may include applying a primer layer across a plastic cover layer and the metal, Between metal alloy or carbon fiber and interface. In other examples, the method may include applying a surface treatment layer to metal, metal alloy, or carbon fiber, for example, treating the substrate with micro-arc oxidation or passivation treatment to form a micro-arc oxidation layer or a passivation layer, respectively.

definition

It should be noted that, as used in this specification and these additional claims, the singular forms "一 (a,an)" and "the (the)" include plural indicators unless the content otherwise Explain clearly.

When referring to a value or range, the term "about" as used herein allows a certain degree of variability in the value or range, for example, 5% of a predetermined value or a predetermined limit range or other reasonable increase in the width of the range. When modifying the numerical range, the term "about" should also be understood to include the precise numerical value indicated, for example, a range of about 1 wt% to about 5 wt% includes 1 wt% to 5 wt% as a clearly supported sub-range.

As used herein, for convenience, a plurality of items, structural elements, composite elements, and/or materials may be presented in a common list. However, these lists should be interpreted as though each element in the list is individually identified as a distinct and unique component. Therefore, if there is no indication to the contrary, only based on their existence in a common group, individual components of the list should not be interpreted as actual equivalents of any other components in the same list.

In this article, the concentration, size, quantity, and other numerical data can be presented in a range format. It should be understood that the range format is used only for convenience and brevity, and should be flexibly interpreted to include the values explicitly listed as the limits of the range, and also include being included in the range as if each value and subrange were explicitly listed All individual values or subranges of. For example, a layer thickness of about 0.1 microns to about 0.5 microns should be interpreted as including the explicitly recited limits of 0.1 microns to 0.5 microns, and including thicknesses such as about 0.1 microns and about 0.5 microns, and such as about 0.2 microns to about 0.4 microns , About 0.2 microns to about 0.5 microns, about 0.1 microns to about 0.4 microns and so on.

An example of the present disclosure is explained below. However, it should be understood that the following illustrates the application of the principles of the present disclosure. Without departing from the spirit and scope of the present disclosure, many modified and alternate components, methods and systems can be designed. These additional requests are intended to cover such modifications and arrangements. Examples

Preparation of decorative panels for electronic devices

An exemplary decorative panel for electronic devices is prepared as follows: 1) A magnesium-aluminum-zinc alloy panel (AZ31, which is 3wt% aluminum, 1wt% zinc and 96wt% magnesium) is treated by micro-arc oxidation to form the magnesium alloy panel An oxide layer with a thickness of about 10 micrometers is formed on both sides. 2) A plastic cover layer in the form of a plastic edge made of ABS plastic is applied to the metal alloy panel. Therefore, the substrate includes the metal alloy, the micro-arc oxidation layer, and a plastic cover layer in the form of a plastic edge. 3) A primer layer with a thickness of about 10 microns is applied to the surface of the substrate, including the metal alloy (with an oxide layer) and the edge of the plastic covering layer. The primer used is Airethane ^TM 1204 from Fairmont Industries. 4) Next, an adhesive layer is applied on the primer layer with a thickness of about 20 microns. The adhesive layer includes ethylene-vinyl acetate copolymer. 5) An overmolded decorative layer is formed by overmolding ABS plastic with a non-conductive vacuum metallization pattern. The overmolded decorative layer has a thickness of about 65 microns. The non-conductive vacuum metallization pattern includes a silver metal island-shaped partial layer, which is not in contact or insufficiently in contact, so the pattern is non-conductive. 6) Apply a clear coating layer on the overmolded decorative layer with a thickness of about 30 microns. The clear coating layer includes a clear polyacrylic acid.

The finished decorative panel has a glossy appearance, has a shiny metal non-conductive vacuum metallization pattern (NCVM) pattern, and the decorative layer shows good adhesion to magnesium alloy and plastic substrates. In addition, it is non-conductive .

The description and clarification in this article is an example of this disclosure and some variations thereof. The terms, descriptions, and diagrams used in this article are presented in a clarified manner only and do not mean limitation. Many variations within the spirit and scope of this disclosure are possible, which are intended to be defined by the following claims and their equivalents, in which all terms are expressed in their broadest reasonable meanings unless otherwise indicated.

100, 200, 300: decorative panel 110,210,310: substrate 120, 220, 320, 420: primer layer 130,230,330,430: Adhesive layer 140, 240: Overmolded layer 215: Micro arc oxide layer 217: second micro-arc oxide layer 312, 412: Plastic cover 315: passivation layer 317: second passivation layer 350,450: Clear coating layer 360: release film 400: Electronic device 410: Rack 440: Non-conductive vacuum metallization pattern 442: Ink Pattern 452: leading edge 470: Electronic Components 500: Exemplary method 510,520,530: process

FIG. 1 is a cross-sectional view illustrating an exemplary decorative panel used in an electronic device according to an example of the present disclosure;

Figure 2 is a cross-sectional view illustrating another exemplary decorative panel according to an example of the present disclosure;

Fig. 3 is a cross-sectional view illustrating another exemplary decorative panel according to an example of the present disclosure;

4 is a cross-sectional view illustrating an exemplary electronic device according to an example of the present disclosure; and

FIG. 5 is a flowchart illustrating an exemplary method of manufacturing a decorative panel for an electronic device according to an example of the present disclosure.

100: decorative panel

110: substrate

120: Primer layer

130: Adhesive layer

140: Overmolded layer

Claims (15)

A decorative panel for electronic devices, the decorative panel includes: A substrate containing metal, metal alloy or carbon fiber; A primer layer on the substrate, wherein the primer layer comprises polyurethane, polyurethane copolymer or alkyd resin; An adhesive layer on the primer layer; and An overmolding layer on the adhesive layer, wherein the overmolding layer includes a non-conductive vacuum metallization pattern. The decorative panel of claim 1, wherein the substrate includes a micro-arc oxide layer in contact with the primer layer. The decorative panel of claim 1, wherein the substrate includes a passivation layer in contact with the primer layer, wherein the passivation layer includes molybdate, vanadate, phosphate, chromate, stannate, or one of them Conjugate. The decorative panel of claim 1, wherein the substrate comprises aluminum, magnesium, titanium, lithium, niobium or one of their alloys. The decorative panel of claim 1, wherein the substrate comprises an alloy of aluminum and magnesium. The decorative panel of claim 1, wherein the substrate further comprises a plastic covering layer bonded or embedded with the metal, metal alloy or carbon fiber, and wherein the primer layer extends across the metal, metal alloy or carbon fiber and the plastic An interface between the covering layers. The decorative panel of claim 1, wherein the overmolded layer further includes an inked pattern. Such as the decorative panel of claim 1, which further comprises a clear coating layer on the overmolding layer. An electronic device comprising: A frame containing metal, metal alloy or carbon fiber; A primer layer on the frame, wherein the primer layer contains polyurethane, polyurethane copolymer or alkyd resin; An adhesive layer on the primer layer; and An overmolding layer on the adhesive layer, wherein the overmolding layer includes a non-conductive vacuum metallization pattern. The electronic device of claim 9, wherein the frame further comprises a plastic cover layer bonded or embedded with the metal, metal alloy or carbon fiber, and wherein the primer layer extends across the metal, metal alloy or carbon fiber and the An interface between plastic cover layers. The electronic device of claim 10, wherein the metal, metal alloy or carbon fiber includes an aluminum and magnesium alloy embedded in the plastic cover layer. For the electronic device of claim 9, the rack includes a chamfered edge. A method of manufacturing a decorative panel for an electronic device, which comprises: Applying a primer layer on a substrate, wherein the primer layer comprises polyurethane, polyurethane copolymer or alkyd resin, and wherein the substrate comprises metal, metal alloy or carbon fiber; Applying an adhesive layer on the primer layer; and A decoration is overmolded on the adhesive layer to form an overmolded layer with a non-conductive vacuum metallization pattern. The method of claim 13, wherein the substrate further comprises a plastic cover layer bonded or embedded with metal, metal alloy or carbon fiber, and wherein the primer layer is applied across the metal, metal alloy or carbon fiber and the plastic cover An interface between layers. The method of claim 13, which further comprises applying a surface treatment layer to the metal, metal alloy or carbon fiber.

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