TW202019245A - Expansion card - Google Patents
Expansion card Download PDFInfo
- Publication number
- TW202019245A TW202019245A TW107139098A TW107139098A TW202019245A TW 202019245 A TW202019245 A TW 202019245A TW 107139098 A TW107139098 A TW 107139098A TW 107139098 A TW107139098 A TW 107139098A TW 202019245 A TW202019245 A TW 202019245A
- Authority
- TW
- Taiwan
- Prior art keywords
- expansion card
- area
- zone
- connector
- item
- Prior art date
Links
Images
Abstract
Description
本發明是有關於一種擴充卡,且特別是有關於一種可以依據消費者的需求改變尺寸的擴充卡。The present invention relates to an expansion card, and in particular to an expansion card whose size can be changed according to the needs of consumers.
隨著科技的進步與製程技術的改善,電子元件越做越小,主機板也開出不同的規格大小。從ATX、Mini-ITX、Thin Mini-ITX到Nano-ITX等,消費者能夠依自己的需求做選擇,購買自己所選擇的主機板所對應的機殼與配備。然而,由於市面上充斥著不同長度的擴充卡,讓消費者眼花撩亂,甚至出現購買了才發現尺寸不合,需要退貨的尷尬狀況。With the advancement of technology and the improvement of process technology, electronic components are getting smaller and smaller, and motherboards are also produced in different sizes. From ATX, Mini-ITX, Thin Mini-ITX to Nano-ITX, etc., consumers can choose according to their needs and purchase the chassis and equipment corresponding to the motherboard they choose. However, because the market is full of expansion cards of different lengths, consumers are dazzled and even embarrassed to find that the size is not suitable and needs to be returned.
本發明提供一種擴充卡,其可依據消費者的需求改變尺寸。The invention provides an expansion card, which can be changed in size according to the needs of consumers.
本發明的一種擴充卡,包括一板體、一連接埠及一晶片。板體具有彼此不相連的多個貫穿縫及位於這些貫穿縫之間的多個連接段,這些貫穿縫排列成一線,以將板體劃分出一第一區與一第二區,且這些連接段連接第一區與第二區。連接埠形成在第一區上。晶片配置於第一區上且電性連接於連接埠。擴充卡可選擇地以具有第一區與第二區的形式運作,或者,擴充卡可選擇地沿著此線折斷這些連接段,而使第二區完全分離於第一區,而以不具有第二區的形式運作。An expansion card of the present invention includes a board, a connection port, and a chip. The plate body has a plurality of through-slots that are not connected to each other and a plurality of connecting sections between the through-slots, these through-slots are arranged in a line to divide the plate body into a first area and a second area, and these connections The segment connects the first zone and the second zone. The connection port is formed on the first area. The chip is disposed on the first area and electrically connected to the connection port. The expansion card can optionally operate in the form of having a first zone and a second zone, or the expansion card can optionally break these connecting segments along this line, so that the second zone is completely separated from the first zone without having The operation of the second zone.
在本發明的一實施例中,上述的板體具有形成於這些連接段上的多個郵票孔,這些郵票孔與這些貫穿縫共同沿著線排列,且各郵票孔的尺寸小於各貫穿縫的尺寸。In an embodiment of the present invention, the plate body has a plurality of stamp holes formed on the connecting sections, the stamp holes and the through slits are arranged along the line together, and the size of each stamp hole is smaller than that of each through slit size.
在本發明的一實施例中,上述的線的延伸方向平行於板體的寬度方向,這些連接段的總長度與板體的寬度的比值約在0.2~0.3之間。In an embodiment of the present invention, the extending direction of the above-mentioned line is parallel to the width direction of the plate body, and the ratio of the total length of these connecting segments to the width of the plate body is about 0.2-0.3.
在本發明的一實施例中,上述的線的延伸方向平行於板體的寬度方向,各連接段的長度與板體的寬度的比值約在0.03~0.07間,且這些連接段的數量在3至6個之間。In an embodiment of the present invention, the extending direction of the above-mentioned line is parallel to the width direction of the board, the ratio of the length of each connecting segment to the width of the board is about 0.03~0.07, and the number of these connecting segments is 3 Between 6 and 6.
在本發明的一實施例中,上述的擴充卡更包括一第一連接器及一第二連接器,第一連接器配置於第一區,且電性連接至晶片。第二連接器配置於第二區,且適於透過一傳輸線電性連接至第一連接器。In an embodiment of the invention, the above expansion card further includes a first connector and a second connector. The first connector is disposed in the first area and electrically connected to the chip. The second connector is disposed in the second area and is suitable for being electrically connected to the first connector through a transmission line.
在本發明的一實施例中,上述的擴充卡更包括多個散熱墊,形成於第一區與第二區的至少一者上。In an embodiment of the invention, the expansion card further includes a plurality of heat dissipation pads formed on at least one of the first area and the second area.
在本發明的一實施例中,上述的擴充卡更包括一M.2連接器及一第一固定結構。M.2連接器配置於第一區,且電性連接至晶片。第一固定結構配置於第一區,用以固定可拆卸地插設於M.2連接器的一第一M.2擴充卡。In an embodiment of the invention, the above expansion card further includes an M.2 connector and a first fixing structure. The M.2 connector is disposed in the first area and is electrically connected to the chip. The first fixing structure is disposed in the first area and is used to fix a first M.2 expansion card detachably inserted in the M.2 connector.
在本發明的一實施例中,上述的擴充卡更包括一第二固定結構,配置於第二區,用以固定可拆卸地插設於M.2連接器的一第二M.2擴充卡,其中第二M.2擴充卡的長度大於第一M.2擴充卡的長度。In an embodiment of the present invention, the above-mentioned expansion card further includes a second fixing structure disposed in the second area for fixing a second M.2 expansion card detachably inserted in the M.2 connector , Where the length of the second M.2 expansion card is greater than the length of the first M.2 expansion card.
在本發明的一實施例中,上述的板體具有凹陷於相對的兩邊緣的兩凹陷區,兩凹陷區位於這些貫穿縫的兩側,且與這些貫穿縫共同沿著線排列。In an embodiment of the present invention, the above-mentioned plate body has two recessed areas recessed on opposite edges. The two recessed areas are located on both sides of the through-slots and are arranged along the line together with the through-slots.
在本發明的一實施例中,上述的板體上沒有導電線路橫跨連接段。In an embodiment of the invention, there is no conductive line across the connecting section on the board.
基於上述,本發明的擴充卡藉由在板體上設置排列成一線的這些貫穿縫來弱化此部分的結構強度。當使用者需要一般規格的擴充卡時,可直接採用原始的擴充卡(也就是具有第一區與第二區的擴充卡)。當使用者需要長度較小的擴充卡時,使用者只要折斷這些連接段,便能夠使第二區完全分離於第一區,而成為另一種規格(不具有第二區)的擴充卡。如此,本發明的擴充卡可符合使用者的多種需求。Based on the above, the expansion card of the present invention weakens the structural strength of this part by providing these through-slots arranged in a line on the board body. When a user needs an expansion card of a general specification, the original expansion card (that is, an expansion card with a first area and a second area) can be directly used. When the user needs an expansion card with a small length, the user can break the connection segments to completely separate the second area from the first area, and become an expansion card of another specification (without the second area). In this way, the expansion card of the present invention can meet various needs of users.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.
目前,市面上的某些擴充卡會有不同的長度規格,消費者需要依據自己的主機板尺寸或是機殼尺寸來購買對應規格的擴充卡,否則可能會發生無法安裝的狀況。下面將提供可以讓消費者視自身需求而能夠自行調整長度的擴充卡。At present, some expansion cards on the market will have different length specifications. Consumers need to purchase expansion cards of corresponding specifications according to their motherboard size or chassis size, otherwise they may not be installed. The following will provide expansion cards that allow consumers to adjust the length according to their own needs.
圖1是依照本發明的一實施例的一種擴充卡的示意圖。請參閱圖1,本實施例的擴充卡100包括一板體110、一連接埠140及一晶片150。板體110具有彼此不相連的多個貫穿縫112及位於這些貫穿縫112之間的多個連接段114,這些貫穿縫112排列成一線,以將板體110劃分出一第一區120與一第二區130,且這些連接段114連接第一區120與第二區130。FIG. 1 is a schematic diagram of an expansion card according to an embodiment of the invention. Please refer to FIG. 1. The
連接埠140形成在第一區120上。晶片150配置於第一區120上且電性連接於連接埠140。在本實施例中,連接埠140例如是PCI-E介面的連接埠,晶片150例如是處理器或其他電子元件。當然,在其他實施例中,連接埠140也可以是AGP介面的連接埠或是CNR介面的連接埠。連接埠140與晶片150的種類不以此為限制。The
在本實施例中,擴充卡100以PCI-E擴充卡為例,板體110的總長度L1例如是符合PCI-E的完整長度(full length)的規格,第一區120的長度L2例如是符合MD2的長度規格。更明確地說,板體110的總長度L1例如是312公厘,且第一區120的長度L2例如是在150公厘至170公厘之間(例如是167.64公厘)。當然,在其他實施例中,板體110的總長度L1也可以是介於180公厘至312公厘之間,板體110的總長度L1與第一區120的長度L2並不以上述為限制。In this embodiment, the
在本實施例中,消費者可以視自身需求來自行調整長度。詳細地說,當消費者目前的主機板(未繪示)與機殼(未繪示)可以配置符合PCI-E的完整長度(full length)規格的擴充卡時,可以直接插設本實施例的具有第一區120與第二區130的擴充卡100。圖2是圖1的擴充卡的連接段被折斷而不具第二區的示意圖。請見圖2,若消費者目前的主機板與機殼需要配置長度較小的擴充卡時,消費者可以沿著圖1的這些貫穿縫112的所排列成的線折斷這些連接段114,而使第二區130完全分離於第一區120,而成為長度較小的擴充卡100’。因此,本實施例的擴充卡100可提供兩種規格供消費者選擇。In this embodiment, the consumer can adjust the length according to his own needs. In detail, when the current motherboard (not shown) and the chassis (not shown) of the consumer can be configured with expansion cards that comply with the PCI-E full length specification, this embodiment can be directly inserted The
值得一提的是,在本實施例中,擴充卡100主要的線路結構是配置在第一區120上,第二區130可以是不具有線路結構的區域。因此,當第二區130分離於第一區120之後,第一區120仍可以正常運作。當然,在其他實施例中,第二區130可以具有線路結構,並不以此為限制。It is worth mentioning that, in this embodiment, the main circuit structure of the
另外,在本實施例中,這些貫穿縫112的延伸方向平行於板體110的寬度方向,第一區120與第二區130之間的這些連接段114的數量在3至6個之間,各連接段114的長度L3與板體110的寬度W的比值約在0.03~0.07間,且這些連接段114的總長度與板體110的寬度W的比值約在0.2~0.3之間。舉例來說,在本實施例中,板體110的寬度W約為97公厘,各連接段114的長度L3約為5公厘,且連接段114的數量為五個。In addition, in this embodiment, the extending direction of the
當連接段114的長度與板體110的寬度之間的尺寸關係介於上述數值之間時,連接段114具有足夠的結構強度使得第二區130在不需被移除時可以穩定地固定在第一區120上,且第二區130在需要被移除時,消費者可以徒手將第二區130扳斷而不需要使用工具。When the dimensional relationship between the length of the connecting
圖3是依照本發明的另一實施例的一種擴充卡的示意圖。請參閱圖3,本實施例的擴充卡100a與前一實施例的擴充卡100的主要差異在於,在本實施例中,板體110還具有形成於這些連接段114上的多個郵票孔165,這些郵票孔165與這些貫穿縫112共同沿著線排列,且各郵票孔165的尺寸小於各貫穿縫112的尺寸。在本實施例中,郵票孔165的直徑例如是0.4公厘至0.5公厘之間,但郵票孔165的尺寸不以此為限制。3 is a schematic diagram of an expansion card according to another embodiment of the invention. Referring to FIG. 3, the main difference between the
本實施例的擴充卡100a由於在連接段114上打上郵票孔165,連接段114的強度可在能夠支撐第二區130的前提之下稍微被弱化,實測本實施例的擴充卡100可知,消費者使用6.5公斤重的力量便可扳斷這些連接段114。當然,在第二區130在不需被移除時,本實施例的設計仍可讓第二區130穩定地固定在第一區120上。Since the
圖4是依照本發明的另一實施例的一種擴充卡的示意圖。請參閱圖4,本實施例的擴充卡100b與前一實施例的擴充卡100a的主要差異在於,在本實施例中,擴充卡100b更包括一第一連接器122及一第二連接器132,第一連接器122配置於第一區120,且電性連接至晶片150。第二連接器132配置於第二區130,且連接於位在第二區130上的電子元件134。位在第二區130的第二連接器132可透過一傳輸線10電性連接至位在第一區120上的第一連接器122。4 is a schematic diagram of an expansion card according to another embodiment of the invention. Referring to FIG. 4, the main difference between the
也就是說,在本實施例中,板體110的第二區130是配置有導電線路(未繪示)的,但導電線路並非直接從第一區120橫跨連接段114而延伸到第二區130,板體110上沒有導電線路橫跨連接段114。在本實施例中,板體110的第一區120與第二區130之間的電性連接是透過第一連接器122、傳輸線10與第二連接器來達成。That is to say, in this embodiment, the
在本實施例中,當要將擴充卡100的第二區130分離於第一區120時,只要先移除傳輸線10之後,再扳斷連接段114即可。板體110上沒有導電線路橫跨連接段114的設計是由於連接段114的材料(電路板的絕緣層材料,例如是玻璃纖維)與導電線路的材料(例如是銅)不同,若是導電線路第一區120橫跨連接段114而延伸到第二區130的話,在扳斷連接段114之後,導電線路由於較佳的延展性而不會被折斷,反而可能在扳斷的過程中將原本位於第一區120的導電線路從斷面處拉出,使得擴充卡100損壞。因此,在本實施例中,擴充卡100是透過外接的方式來使第二區130電性連接至第一區120。In this embodiment, when the
圖5是依照本發明的另一實施例的一種擴充卡的示意圖。請參閱圖5,本實施例的擴充卡100c與圖3實施例的擴充卡100a的主要差異在於,首先,相較於圖3實施例的擴充卡100a在這些貫穿縫112的上下兩側的邊緣是平整的,在本實施例中,板體110具有凹陷於相對的兩邊緣的兩凹陷區160,兩凹陷區160位於這些貫穿縫112的上下兩側的邊緣,且與這些貫穿縫112共同沿著線排列。在本實施例中,由於凹陷區160是由機器在工廠端製作,凹陷區160的邊緣為平滑,這可使得第二區130在分離於第一區120之後,第一區120在斷面與上下邊緣的交界處呈平滑,而具有好的手感。5 is a schematic diagram of an expansion card according to another embodiment of the invention. Please refer to FIG. 5. The main difference between the
此外,在本實施例中,擴充卡100c更包括M.2連接器124及對應於M.2連接器124的至少一第一固定結構126。M.2連接器124配置於第一區120,且電性連接至晶片150。由於M.2擴充卡具有多種不同的尺寸,通常會在距離M.2連接器的多個位置上設置對應的多個固定結構來固定M.2擴充卡,舉例來說,M.2擴充卡的長度例如是30公厘、42公厘、60公厘、80公厘等,則在距離M.2連接器30公厘、42公厘、60公厘、80公厘的位置會設置對應的固定結構,以將M.2擴充卡固定於板體110。In addition, in this embodiment, the
在本實施例中,至少一第一固定結構126配置於第一區120,用以固定可拆卸地插設於M.2連接器124的一第一M.2擴充卡12(以虛線表示)。此外,在本實施例中,擴充卡100更包括一第二固定結構136,配置於第二區130,用以固定可拆卸地插設於M.2連接器124的一第二M.2擴充卡14(以虛線表示)。In this embodiment, at least one
詳細地說,在本實施例中,擴充卡100包括四個M.2連接器124,以位於圖5下方的兩個M.2連接器124來說,各M.2連接器124旁設有位在第一區120且對應於三種M.2擴充卡長度的第一固定結構126及位在第二區130且對應於一種M.2擴充卡長度的第二固定結構136。第一固定結構126與第二固定結構136例如是具有螺孔的螺柱,但第一固定結構126與第二固定結構136的種類不以此為限制。In detail, in this embodiment, the
在圖5中可見,若第一M.2擴充卡12為長度是30公厘的M.2擴充卡,第一M.2擴充卡12在插置於M.2連接器124之後,可透過最靠近此M.2連接器124的第一固定結構126來固定。若第二M.2擴充卡14為長度是80公厘的M.2擴充卡,第二M.2擴充卡14在插置於M.2連接器124之後,可透過位在第二區130的第二固定結構136來固定。換句話說,若消費者所選用的M.2擴充卡不需使用到位在第二區130的第二固定結構136來固定,也可以將第二區130移除。As can be seen in FIG. 5, if the first M.2
圖6是圖5的背面的示意圖。請參閱圖6,擴充卡100c更包括多個散熱墊170,形成於第一區120與第二區130的至少一者上。在本實施例中,擴充卡100的這些散熱墊170形成於第一區120與第二區130,散熱墊170的材質為金屬,例如是焊錫,其可將擴充卡100所發出的熱量帶到背面。由於散熱墊170外露於擴充卡100的背面,熱量可較輕易地被主機板(未繪示)上的風扇(未繪示)帶離。當然,散熱墊170配置的位置不以此為限制。6 is a schematic diagram of the back of FIG. 5. Referring to FIG. 6, the
綜上所述,本發明的擴充卡可提供兩種尺寸選擇,擴充卡被分為第一區與第二區,連接埠與主要的導電線路配置於第一區上,第二區可配置固定結構、散熱墊、附屬的導電線路或是其他結構。板體上設置排列成一線的這些貫穿縫來弱化第一區與第二區之間的結構強度。當使用者需要一般規格的擴充卡時,可直接採用原始的擴充卡(也就是具有第一區與第二區的擴充卡)。當使用者需要長度較小的擴充卡時,使用者只要折斷這些連接段,便能夠使第二區完全分離於第一區,而成為另一種規格(不具有第二區)的擴充卡。如此,本發明的擴充卡可符合使用者的多種需求。In summary, the expansion card of the present invention can provide two size options, the expansion card is divided into a first area and a second area, the connection port and the main conductive circuit are arranged on the first area, and the second area can be configured and fixed Structure, heat dissipation pad, attached conductive circuit or other structure. The through holes arranged in a line on the board body are used to weaken the structural strength between the first area and the second area. When a user needs an expansion card of a general specification, the original expansion card (that is, an expansion card with a first area and a second area) can be directly used. When a user needs an expansion card with a small length, as long as the user breaks these connecting segments, the second area can be completely separated from the first area and become another type of expansion card (without the second area). In this way, the expansion card of the present invention can meet various needs of users.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.
L1、L2、L3:長度W:寬度10:傳輸線12:第一M.2擴充卡14:第二M.2擴充卡100、100’、100a、100b、100c:擴充卡110:板體112:貫穿縫114:連接段120:第一區122:第一連接器124:M.2連接器126:第一固定結構130:第二區132:第二連接器134:電子元件136:第二固定結構140:連接埠150:晶片160:凹陷區165:郵票孔170:散熱墊L1, L2, L3: length W: width 10: transmission line 12: first M.2 expansion card 14: second M.2
圖1是依照本發明的一實施例的一種擴充卡的示意圖。 圖2是圖1的擴充卡的連接段被折斷而不具第二區的示意圖。 圖3是依照本發明的另一實施例的一種擴充卡的示意圖。 圖4是依照本發明的另一實施例的一種擴充卡的示意圖。 圖5是依照本發明的另一實施例的一種擴充卡的示意圖。 圖6是圖5的背面的示意圖。FIG. 1 is a schematic diagram of an expansion card according to an embodiment of the invention. FIG. 2 is a schematic view of the connection section of the expansion card of FIG. 1 being broken without a second area. 3 is a schematic diagram of an expansion card according to another embodiment of the invention. 4 is a schematic diagram of an expansion card according to another embodiment of the invention. 5 is a schematic diagram of an expansion card according to another embodiment of the invention. FIG. 6 is a schematic diagram of the back of FIG. 5.
L1、L2、L3:長度 L1, L2, L3: length
W:寬度 W: width
100:擴充卡 100: expansion card
110:板體 110: plate body
112:貫穿縫 112: Through the seam
114:連接段 114: connection segment
120:第一區 120: District 1
130:第二區 130: District 2
140:連接埠 140: port
150:晶片 150: chip
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107139098A TWI676406B (en) | 2018-11-05 | 2018-11-05 | Expansion card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107139098A TWI676406B (en) | 2018-11-05 | 2018-11-05 | Expansion card |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI676406B TWI676406B (en) | 2019-11-01 |
TW202019245A true TW202019245A (en) | 2020-05-16 |
Family
ID=69188783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107139098A TWI676406B (en) | 2018-11-05 | 2018-11-05 | Expansion card |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI676406B (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2795194B1 (en) * | 1999-06-15 | 2002-08-23 | Gemplus Card Int | EXTENSION FOR PCMCIA TYPE ELECTRONIC MODULE |
TW201233302A (en) * | 2011-01-28 | 2012-08-01 | Hon Hai Prec Ind Co Ltd | Expansion card |
WO2013081585A1 (en) * | 2011-11-29 | 2013-06-06 | Intel Corporation | Expansion card having synergistic cooling, structural and volume reduction solutions |
TWM435024U (en) * | 2012-03-02 | 2012-08-01 | Cooler Master Co Ltd | Storage device carrier |
US9807285B2 (en) * | 2015-03-25 | 2017-10-31 | Intel Corporation | Apparatus, method and techniques for dissipating thermal energy |
-
2018
- 2018-11-05 TW TW107139098A patent/TWI676406B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI676406B (en) | 2019-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6916183B2 (en) | Array socket with a dedicated power/ground conductor bus | |
TWI389605B (en) | Electronic apparatus | |
US6711030B2 (en) | Interconnecting method of wiring in printed circuit boards and printed circuit board unit | |
CN107251670B (en) | Base board unit | |
JP2009258730A (en) | Electronic module, electric connector, and collocation method | |
JP3800937B2 (en) | Bridge board | |
TW202019245A (en) | Expansion card | |
JP5113133B2 (en) | Sink-type electrical connector and assembly of sink-type electrical connector and circuit board | |
CN111142624B (en) | Expansion card | |
US7986391B2 (en) | Liquid crystal display having branched wiring between IC bonding regions and FPC bonding regions | |
TWI742941B (en) | Setting the impedance of signal traces of a circuit board using a reference trace | |
US7542260B2 (en) | Motherboard | |
JP2002057418A (en) | Printed wiring board | |
CN207488895U (en) | Main circuit board and its electronic device with heat emission hole | |
TWI686110B (en) | Circuit board output structure and its power supply | |
TW200820843A (en) | Flexible printed circuit | |
TWI261742B (en) | Motherboard | |
CN103972215B (en) | Semiconductor device | |
TWI733171B (en) | Integrated circuit | |
US20100027223A1 (en) | Semiconductor integrated circuit having heat release pattern | |
CN113792518B (en) | PCB layout structure, server motherboard and server | |
CN201222221Y (en) | Fixed structure for radiating module | |
JP2021064738A (en) | Wiring board | |
JPH0388289A (en) | Connector for print board | |
JPH0613766A (en) | Ic chip built-in connection cable |