TW202011427A - UV laser processing method for copper coil and structure thereof - Google Patents

Abstract

The present invention relates to a UV laser processing method for copper coil and structure thereof, wherein the processing method fixedly positions the thick copper foil of more than 100 [mu]m in thickness by a mounting fixture and presses to flatten the copper foil. Next, use the UV laser in the spiral winding method to cut the copper coil from the thick copper foil. At the same time, the connecting bridges and a plurality of grooves existing on bother sides of the connecting bridges, which are not completely cut through and off by the UV laser, remain. Last, use the VU laser to cut off the connecting bridges and copper coils in a spiral shape are produced.

Description

UV laser processing method and structure of copper coil

The present invention relates to a copper coil processing method and its structure; more specifically, it relates to a UV laser processing method and structure using a UV laser to cut a copper coil on thick copper.

Generally, the RF coil with a coil diameter of less than 40 mm (mm) is made of copper wire in a spiral manner. The reason why this size of RF coil cannot be cut by a laser processing machine is that the laser In the process of cutting copper material, part of the laser energy will be absorbed by the copper material, which will cause the copper material to thermally expand and cause copper deformation, which will cause obvious deviation in the position and size of the cut copper wire, and finally lead to The RF coil is not presented in a complete spiral shape.

In view of this, the applicant in this case has conducted in-depth discussions on the aforementioned deficiencies based on his many years of research and development experience in related fields, and actively sought solutions according to the aforementioned requirements. After a long period of hard research and multiple tests, the applicant has finally completed this invention.

The main purpose of the present invention is to use a UV laser to cut a copper coil with a diameter of 40 millimeters (mm) or less on a thick copper of 100 μm or more.

In order to achieve the above purpose, the UV laser processing method of the copper coil of the present invention is made through the following steps: A. Positioning step: use a fixing jig to fix thick copper with a thickness of 100 μm or more to the position and flatten it . B. Cutting step: cut the copper wire on the thick copper through the UV laser in a spiral way, and after the cutting is completed, there is a connecting bridge that is not cut by the UV laser on the thick copper and two Multiple grooves on the side. C. Cutting step: use UV laser to cut off the connecting bridge to connect the grooves on both sides of the connecting bridge to form a complete spiral groove, and then obtain a spiral copper with a diameter of 40 mm or less Coil.

The copper coil structure of the present invention is provided with connecting bridges and grooves on thick copper with a thickness of 100 μm or more, and the diameter of the copper coil is less than or equal to 40 millimeters (mm).

The connecting bridge is located on thick copper and has a certain width.

The grooves are provided on both sides of the connecting bridge and present in an arc-shaped appearance.

The invention has the following advantages: 1. The laser is used to directly process the round copper into a copper coil. 2. During the cutting process, the round copper will not deform and cause dimensional deviation.

It is expected that the purpose, efficacy, features and structure of the present invention can be understood in more detail. The preferred embodiments are described below in conjunction with the drawings.

Please refer to FIG. 1, FIG. 2 and FIG. 3 first, FIG. 1 is a schematic flow chart of the UV laser processing method of the copper coil of the present invention, FIG. 2 is a schematic structural view of the copper coil of the present invention, and FIG. 3 is a partially enlarged schematic view of the copper coil structure of the present invention.

The UV laser processing method 1 of the copper coil of the present invention is made through the following steps: A. Positioning step 11: Use a fixing jig to fix thick copper 21 with a thickness of 100 μm or more to the positioning and flatten it. B. Cutting step 12: Cut the copper wire on the thick copper 21 through the UV laser in a spiral manner, and after the cutting is completed, the connecting bridge 211 that has not been cut by the UV laser remains on the thick copper 21 and Multiple trenches 212 on both sides of the connecting bridge. C. Cutting step 13: Use UV laser to cut off the connecting bridge 211, so that the grooves 212 on both sides of the connecting bridge are connected to each other to form a complete spiral groove 212, and then obtain a spiral copper coil.

In addition, the copper coil structure 2 of the present invention is provided with a connecting bridge 211 and a groove 212 on a thick copper 21 having a thickness of 100 μm or more.

The connecting bridge 211 is located on the thick copper 21 and has a certain width. The connecting bridge 211 refers to a specific block on the thick copper 21 that has not been cut by a UV laser.

The groove 212 is provided on both sides of the connecting bridge 211 and presents an arc-shaped appearance. The groove 212 is formed by UV laser processing.

The detailed description of the embodiments of the present invention and related reference figures is as follows:

Please refer to FIG. 4 in conjunction with FIG. 2 and FIG. 3. FIG. 4 is a schematic diagram of an implementation process of the UV laser processing method of the copper coil of the present invention.

As shown in step 31, first, the thick copper 21 to be cut is fixed with a fixing jig, and at the same time, it is flattened through the fixing jig, thereby avoiding the thick copper 21 from being uneven due to the uneven surface. The necessary error.

As shown in step 32, then place the fixture in the laser cutting machine, and let the UV laser cut multiple copper wires on the thick copper 21 in a spiral way, and in order to avoid copper during the cutting process The position of the wire is deviated and the size is deviated. Therefore, at least one connection bridge 211 that is not cut by the UV laser will be reserved on the thick copper 21, so that there are multiple The grooves 212 are interconnected.

The aforementioned forming method of the connecting bridge 211 may be to use a fixed jig to block the laser beam so that the laser beam cannot hit energy on the thick copper 21 to form an uncut connecting bridge 211, or by setting a laser cutting machine. Operate the software to control the energy of the laser beam so that the energy of the laser beam cannot pass through the thick copper 21 when passing through a specific path. In addition, the shape of the connecting bridge 211 is not limited to the radiation shown in FIG. 2 The main purpose of the reserved bridge 211 is to avoid the position deviation and size deviation of the copper wire. Therefore, as long as the long copper wire is not deformed during cutting, it can be adjusted arbitrarily by the bridge 211. The location and number of settings.

As shown in step 33, finally the UV bridge is used to cut off the connecting bridge 211, so that the grooves 212 on both sides of the connecting bridge 211 are connected to each other, and when all the grooves 212 are connected into a long groove 212, a A copper coil made of spiral copper wires.

In summary, the UV laser processing method and its structural advantages of the copper coil of the present invention are as follows: 1. Using UV laser to directly process thick copper with a thickness of 100 μm or more to form a spiral copper coil with a diameter of 40 mm or less (mm) . 2. The setting of the connecting bridge can keep the cut copper wire with a fixed line width, and can prevent the copper material from absorbing excessive laser energy and causing thermal deformation to cause the position and size of the copper wire to deviate.

Therefore, the present invention has excellent progress and practicality in similar products. At the same time, after searching the technical information literature on such structures at home and abroad, it is indeed not found that the same or similar structure exists before the application in this case, so this case It should meet the patent requirements of "Creativity", "Integration to Industry Utilization" and "Progressiveness", and file an application according to law.

However, the above are only the preferred embodiments of the present invention, and those who apply the description of the present invention and other equivalent structural changes of the scope of patent application should be included in the scope of patent application of the present invention.

1: UV laser processing method of copper coil 11: positioning step 12: cutting step 13: cutting step 2: copper coil structure 21: thick copper 211: connecting bridge 212: groove 31, 32, 33: step

Figure 1: Schematic diagram of the UV laser processing method of the copper coil of the present invention; Figure 2: Schematic diagram of the copper coil of the present invention; Figure 3: Partially enlarged schematic view of the copper coil of the present invention; Figure 4: UV laser processing of the copper coil of the present invention Schematic diagram of the method implementation process.

no.

1: UV laser processing method of copper coil

11: Positioning steps

12: Cutting steps

13: Cut off step

Claims (8)

A UV laser processing method for copper coils is made through the following steps: A. Positioning step: use a fixing jig to fix thick copper with a thickness of 100 μm or more to position and flatten it; B. Cutting step: to The spiral wire is used to cut the copper wire on the thick copper through the UV laser, and after the cutting is completed, the connection bridge that is not cut by the UV laser and the multiple grooves on both sides of the connection bridge are left on the thick copper ; C. Cutting step: Use UV laser to cut off the connecting bridge, so that the grooves on both sides of the connecting bridge are connected to each other to form a complete spiral groove, and then obtain a spiral copper coil. The UV laser processing method of a copper coil as described in claim 1, wherein the connecting bridge is formed by blocking the laser beam with a fixed jig. The UV laser processing method of the copper coil as described in claim 1, wherein the connecting bridge is formed by setting the operating software to control the power of the laser beam. The UV laser processing method of the copper coil as described in claim 1, wherein the number of the connecting bridge is more than one. The UV laser processing method of a copper coil as described in claim 1, wherein the diameter of the copper coil is 40 mm or less. A copper coil structure, which is provided with a connecting bridge and a groove on thick copper with a thickness of 100 μm or more; the connecting bridge system is located on the thick copper and has a certain width, and the connecting bridge means that the thick copper is not thundered A specific block through which the light beam cuts; the groove is provided on both sides of the connecting bridge and presents an arc-shaped appearance, and the groove is formed by laser cutting. The copper coil structure as described in claim 6, wherein the diameter of the copper coil is 40 mm or less. The copper coil structure as described in item 6 of the claim, wherein the number of the connecting bridge is more than one.

Images