TW202008368A - Memory device and programming method thereof - Google Patents
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本發明是有關於一種記憶體裝置及其編程方法。The invention relates to a memory device and its programming method.
近來,非揮發性半導體記憶體裝置(如快閃記憶體)的應用愈來愈廣。快閃記憶體能夠不需電源供應即可保留資料,故有很高的市場需求。為了增加快閃記憶體的儲存密度,目前已研發出多階儲存晶胞(multi-level cell,MLC)記憶體,單一個MLC記憶體晶胞可儲存多個位元的資料。Recently, applications of non-volatile semiconductor memory devices (such as flash memory) have become more and more widespread. Flash memory can retain data without power supply, so there is a high market demand. In order to increase the storage density of flash memory, multi-level storage cell (MLC) memory has been developed. A single MLC memory cell can store multiple bits of data.
對於MLC而言,每一實體頁面可儲存二個或更多個邏輯頁面。以單一晶胞可儲存兩個位元的MLC記憶體為例,可將邏輯頁面分為高頁面(high page)與低頁面(low page),其中,將先被寫入的頁面稱為高頁面,而後被寫入的頁面稱為低頁面。For MLC, each physical page can store two or more logical pages. Taking an MLC memory that can store two bits in a single cell as an example, the logical page can be divided into a high page and a low page, where the page written first is called the high page , And the page that is written later is called the low page.
第1圖顯示現據現有技術的編程方法。曲線110代表尚未編程之前的實體頁面的臨界電壓分布,在此情況中,實體頁面上的所有記憶體晶胞皆處於未編程狀態。之後,對該實體頁面的高頁面施加編程電壓,使得該些記憶體晶胞具有臨界電壓分布120與130,其中,具有邏輯1狀態的高頁面具有臨界電壓分布120,而具有邏輯0狀態的高頁面具有臨界電壓分布130。之後,對該實體頁面的低頁面施加編程電壓,使得具有邏輯狀態11的該些記憶體晶胞具有臨界電壓分布140,具有邏輯狀態10的該些記憶體晶胞具有臨界電壓分布150,具有邏輯狀態00的該些記憶體晶胞具有臨界電壓分布160,具有邏輯狀態01的該些記憶體晶胞具有臨界電壓分布170。Figure 1 shows the current programming method according to the prior art. The
增量步階脈衝編程(Incremental Step Pulse Programming,ISPP)是目前常用的編程方式。在ISPP中,提供至記憶體晶胞的編程電壓係逐漸升高,直到編程電壓達到足以編程記憶體晶胞至期望狀態的位準。在提供編程電壓至記憶體晶胞後,施加驗證電壓至記憶體晶胞,以驗證記憶體晶胞是否已被編程成功。當記憶體晶胞之臨界電壓高於驗證電壓時,則該記憶體晶胞已編程成功,反之則升高編程電壓,直到記憶體晶胞之臨界電壓高於驗證電壓。Incremental step pulse programming (Incremental Step Pulse Programming, ISPP) is currently a commonly used programming method. In ISPP, the programming voltage supplied to the memory cell is gradually increased until the programming voltage reaches a level sufficient to program the memory cell to a desired state. After providing the programming voltage to the memory cell, a verification voltage is applied to the memory cell to verify whether the memory cell has been successfully programmed. When the threshold voltage of the memory cell is higher than the verification voltage, the memory cell has been successfully programmed, otherwise, the programming voltage is increased until the threshold voltage of the memory cell is higher than the verification voltage.
第2圖顯示習知技術的ISPP的編程順序。如第2圖所示,P1-P5分別代表5個不同的編程電壓,其中,P1=Vpgm,P2=Vpgm+∆Vt,P3=Vpgm+2∆Vt,P4=Vpgm+3∆Vt,P5=Vpgm+4∆Vt,Vpgm代表初始的編程電壓,而∆Vt則代表電壓增加量。而L1-L5則分別代表施加編程電壓P1-P5後所得到的臨界電壓分布。L0代表尚未編程前的臨界電壓分布。Figure 2 shows the programming sequence of the ISPP of the conventional technology. As shown in Figure 2, P1-P5 respectively represent 5 different programming voltages, where P1=Vpgm, P2=Vpgm+∆Vt, P3=Vpgm+2∆Vt, P4=Vpgm+3∆Vt, P5=Vpgm +4∆Vt, Vpgm represents the initial programming voltage, and ∆Vt represents the voltage increase. L1-L5 represent the critical voltage distributions obtained after applying the programming voltages P1-P5, respectively. L0 represents the threshold voltage distribution before programming.
於施加編程電壓P1後,記憶體晶胞的臨界電壓分布為L1。接著,判斷記憶體晶胞的臨界電壓分布L1是否高於驗證電壓Vvfy,如果沒有,則施加下一編程電壓P2。直到記憶體晶胞的臨界電壓分布高於驗證電壓Vvfy為止。After the programming voltage P1 is applied, the critical voltage distribution of the memory cell is L1. Next, it is determined whether the critical voltage distribution L1 of the memory cell is higher than the verification voltage Vvfy, and if not, the next programming voltage P2 is applied. Until the critical voltage distribution of the memory cell is higher than the verification voltage Vvfy.
然而,當在編程某一記憶體晶胞時,其周邊的記憶體晶胞可能會遭受影響。原本不該被編程的記憶體晶胞,可能因為周邊記憶體晶胞的編程,而導致其臨界電壓上升,進而導致記憶體之可靠度降低。However, when programming a memory cell, the surrounding memory cells may be affected. The memory cell that should not be programmed may cause the critical voltage of the memory cell to be increased due to the programming of the peripheral memory cell, which in turn may cause the reliability of the memory to decrease.
因此,需要有新式記憶體裝置及其編程方法,可提高記憶體的可靠度。Therefore, there is a need for a new type of memory device and its programming method, which can improve the reliability of the memory.
根據本案之一實施例,提出一種記憶體裝置的編程方法,該記憶體裝置包括一記憶體陣列與一控制器,該記憶體陣列包括複數個記憶體晶胞,該編程方法包括:由該控制器控制對該記憶體陣列的一第一字元線的一第一頁面進行編程;由該控制器控制對該記憶體陣列的一第二字元線的一第一頁面進行編程,該第二字元線相鄰於該第一字元線;由該控制器控制對該記憶體陣列的該第一字元線的一第二頁面進行一第一編程;由該控制器控制對該記憶體陣列的一第三字元線的一第一頁面進行編程,該第三字元線相鄰於該第二字元線;由該控制器控制對該記憶體陣列的該第二字元線的一第二頁面進行該第一編程;以及由該控制器控制對該記憶體陣列的該第一字元線的該第二頁面進行一第二編程。According to an embodiment of the present case, a programming method for a memory device is provided. The memory device includes a memory array and a controller. The memory array includes a plurality of memory cells. The programming method includes: by the control The controller controls programming a first page of a first word line of the memory array; the controller controls programming a first page of a second word line of the memory array, the second The word line is adjacent to the first word line; the controller controls the first programming of a second page of the first word line of the memory array; the controller controls the memory Programming a first page of a third word line of the array, the third word line is adjacent to the second word line; the controller controls the second word line of the memory array A second page performs the first programming; and the controller controls the second page of the first word line of the memory array to perform a second programming.
根據本案之另一實施例,提出一種記憶體裝置,包括:一記憶體陣列,該記憶體陣列包括複數個記憶體晶胞;以及一控制器,耦接至該記憶體陣列。該控制器控制: 對該記憶體陣列的一第一字元線的一第一頁面 進行編程;對該記憶體陣列的一第二字元線的一第一頁面進行編程,該第二字元線相鄰於該第一字元線;對該記憶體陣列的該第一字元線的一第二頁面進行一第一編程;對該記憶體陣列的一第三字元線的一第一頁面進行編程,該第三字元線相鄰於該第二字元線;對該記憶體陣列的該第二字元線的一第二頁面進行該第一編程;以及對該記憶體陣列的該第一字元線的該第二頁面進行一第二編程。According to another embodiment of the present case, a memory device is provided, including: a memory array including a plurality of memory cells; and a controller coupled to the memory array. The controller controls: programming a first page of a first word line of the memory array; programming a first page of a second word line of the memory array, the second character The line is adjacent to the first word line; a first programming is performed on a second page of the first word line of the memory array; a first of a third word line of the memory array Programming pages, the third word line is adjacent to the second word line; performing the first programming on a second page of the second word line of the memory array; and A second programming is performed on the second page of the first word line.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:In order to have a better understanding of the above and other aspects of the present invention, the following examples are specifically described in conjunction with the accompanying drawings as follows:
本說明書的技術用語係參照本技術領域之習慣用語,如本說明書對部分用語有加以說明或定義,該部分用語之解釋係以本說明書之說明或定義為準。本揭露之各個實施例分別具有一或多個技術特徵。在可能實施的前提下,本技術領域具有通常知識者可選擇性地實施任一實施例中部分或全部的技術特徵,或者選擇性地將這些實施例中部分或全部的技術特徵加以組合。The technical terms of this specification refer to the idioms in the technical field. If this specification describes or defines some terms, the interpretation of these terms shall be based on the description or definition of this specification. Each embodiment of the present disclosure has one or more technical features. Under the premise of possible implementation, those skilled in the art can selectively implement some or all of the technical features in any of the embodiments, or selectively combine some or all of the technical features in these embodiments.
第3圖顯示根據本案一實施例的記憶體裝置的功能方塊圖。當然,第3圖係簡化顯示,本領域具有通常知識者當可知,記憶體裝置300可以更包括其他必要元件。記憶體裝置300包括記憶體陣列310與控制器320。FIG. 3 shows a functional block diagram of a memory device according to an embodiment of this case. Of course, FIG. 3 is a simplified display. Those of ordinary skill in the art should know that the
記憶體陣列310包括排列成陣列的複數個記憶體晶胞,複數個字元線與複數個位元線。The
控制器320耦接至記憶體陣列310,用以控制對記憶體陣列310的操作(如編程)。The
現請參照第4圖,顯示根據本案一實施例的記憶體裝置的編程方法。WL0至WL3代表記憶體陣列310的第0條字元線至第3條字元線。如第4圖所示,在進行編程時,編程順序是:先對字元線WL0的高頁面編程,接著,對字元線WL1的高頁面編程,接著,對字元線WL0的低頁面進行第一編程,接著,對字元線WL2的高頁面編程,接著,對字元線WL1的低頁面進行第一編程,接著,對字元線WL0的低頁面進行第二編程,接著,對字元線WL3的高頁面編程,其餘可依此類推。Referring now to FIG. 4, a programming method of a memory device according to an embodiment of this case is shown. WL0 to WL3 represent the 0th to 3rd character lines of the
如所知般,對前面字元線的低頁面進行編程之後,會對後面字元線進行編程,但這樣可能會影響到前面字元線的低頁面編程結果。故而,在本案實施例中,對低頁面進行多階編程的優點在於,第2次的低頁面編程可以降低編程干擾(program disturbance)。例如,對字元線WL1的高頁面編程或/及低頁面編程可能會干擾字元線WL0的低頁面的第一編程的結果。故而,在本案實施例中,對字元線WL0的低頁面進行2次編程,以降低相鄰字元線WL1編程所造成的編程干擾。As is known, after programming the lower page of the previous word line, the latter word line will be programmed, but this may affect the lower page programming result of the previous word line. Therefore, in the embodiment of the present invention, the advantage of performing multi-level programming on the low page is that the second low page programming can reduce program disturbance. For example, programming the upper page of word line WL1 or/and the lower page may interfere with the result of the first programming of the lower page of word line WL0. Therefore, in the embodiment of the present invention, the lower page of the word line WL0 is programmed twice to reduce the programming interference caused by the programming of the adjacent word line WL1.
在底下,編程以ISPP為例做說明,且在施加一次編程電壓後,施加三個驗證電壓PV1,PV2與PV3來進行驗證。為方便了解,ISPP的編程電壓以14V-23V為例做說明,且將14V-17V為一個編程電壓範圍(亦可稱為第一編程電壓範圍),17V-20V為一個編程電壓範圍(亦可稱為第二編程電壓範圍),20V-23V為一個編程電壓範圍(亦可稱為第三編程電壓範圍)。但當知本案並不受限於此。Below, the programming takes ISPP as an example to illustrate, and after applying the programming voltage once, three verification voltages PV1, PV2 and PV3 are applied for verification. To facilitate understanding, the programming voltage of ISPP is described by taking 14V-23V as an example, and 14V-17V is a programming voltage range (also called the first programming voltage range), and 17V-20V is a programming voltage range (also Called the second programming voltage range), 20V-23V is a programming voltage range (also can be referred to as the third programming voltage range). But be aware that this case is not limited to this.
請再次參考第4圖。在第4圖中,邏輯狀態S1、S2、S3與S4分別代表邏輯11、邏輯10、邏輯00、與邏輯01。Please refer to Figure 4 again. In Figure 4, the logic states S1, S2, S3, and S4 represent
曲線410代表進行抹除操作後但尚未編程之前的實體頁面的臨界電壓分布,所以,所有的記憶體晶胞具有臨界電壓分布410。The
對該實體頁面(例如字元線WL0)的高頁面進行編程,例如,施加屬於編程電壓範圍(17V-20V)內的編程電壓至該些記憶體晶胞,使得高頁面中具有邏輯1的記憶體晶胞具有臨界電壓分布420,而高頁面中具有邏輯0的記憶體晶胞具有臨界電壓分布430,其中,臨界電壓分布420低於第一驗證電壓PV1,臨界電壓分布430高於第二驗證電壓PV2但低於第三驗證電壓PV3。也就是說,先施加17V的編程電壓,接著,驗證臨界電壓分布430是否高於第二驗證電壓PV2。如果臨界電壓分布430未高於第二驗證電壓PV2,則升高編程電壓(例如但不受限於,從17V升高至17.5V),直到驗證臨界電壓分布430高於第二驗證電壓PV2為止。Program the upper page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (17V-20V) to the memory cells, so that the upper page has a memory of
之後,對該實體頁面(如字元線WL0)的低頁面進行第一編程,例如,施加屬於編程電壓範圍(20V-23V)內的編程電壓至該些記憶體晶胞,使得具有邏輯00的記憶體晶胞具有臨界電壓分布440且具有邏輯01的記憶體晶胞具有臨界電壓分布450,其中,臨界電壓分布440高於第二驗證電壓PV2但低於第三驗證電壓PV3,臨界電壓分布450高於第三驗證電壓PV3。也就是說,先施加20V的編程電壓,接著,驗證臨界電壓分布450是否高於第三驗證電壓PV3。如果否,則升高編程電壓(例如但不受限於,從20V升高至23.5V),直到臨界電壓分布450高於第三驗證電壓PV3為止。After that, perform the first programming on the lower page of the physical page (such as the word line WL0), for example, apply a programming voltage within the programming voltage range (20V-23V) to the memory cells, so as to have a
對該實體頁面(如字元線WL0)的低頁面進行第二編程,例如,施加屬於編程電壓範圍(14V-17V)內的編程電壓至該些記憶體晶胞,使得具有邏輯11的記憶體晶胞具有臨界電壓分布460且具有邏輯10的記憶體晶胞具有臨界電壓分布470,其中,臨界電壓分布460低於第一驗證電壓PV1,臨界電壓分布470高於第一驗證電壓PV1但低於第二驗證電壓PV2。此外,由於施加編程電壓的關係,臨界電壓分布440與450會變為臨界電壓分布480與490,但臨界電壓分布480高於第二驗證電壓PV2但低於第三驗證電壓PV3,臨界電壓分布490高於第三驗證電壓PV3。也就是說,施加14V的編程電壓,接著,驗證臨界電壓分布470是否高於第一驗證電壓PV1。如果否,則升高編程電壓(例如但不受限於,從14V升高至14.5V),直到驗證臨界電壓分布470高於第一驗證電壓PV1為止。Perform second programming on the lower page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (14V-17V) to the memory cells, so that the memory with
藉此,可完成對記憶體晶胞的編程,如第4圖所示,具有邏輯11(S1)的記憶體晶胞具有臨界電壓分布460(低於第一驗證電壓PV1),具有邏輯10(S2)的記憶體晶胞具有臨界電壓分布470(高於第一驗證電壓PV1但低於第二驗證電壓PV2),具有邏輯00(S3)的記憶體晶胞具有臨界電壓分布480(高於第二驗證電壓PV2但低於第三驗證電壓PV3),具有邏輯01(S4)的記憶體晶胞具有臨界電壓分布490(高於第三驗證電壓PV3)。In this way, the programming of the memory cell can be completed. As shown in FIG. 4, the memory cell with logic 11 (S1) has a critical voltage distribution 460 (lower than the first verification voltage PV1) and has logic 10( S2) the memory cell has a critical voltage distribution 470 (higher than the first verification voltage PV1 but lower than the second verification voltage PV2), and the memory cell with a logic 00 (S3) has a critical voltage distribution 480 (higher than the first The second verification voltage PV2 is lower than the third verification voltage PV3). The memory cell with logic 01 (S4) has a critical voltage distribution 490 (higher than the third verification voltage PV3).
請注意,在第4圖的右半圖是顯示,對整個記憶體陣列的所有字元線的編程順序,而第4圖的左半圖則是顯示對於一條字元線的編程順序。Please note that the right half of Figure 4 shows the programming sequence for all word lines of the entire memory array, and the left half of Figure 4 shows the programming sequence for one word line.
如上述般,在本案實施例中,由於對低頁面進行二次編程,故而可以降低因為相鄰字元線編程所造成的編程干擾。As described above, in the embodiment of the present invention, since the second page is programmed again, it is possible to reduce the programming interference caused by the adjacent word line programming.
現請參照第5圖,顯示根據本案一實施例的記憶體裝置的編程方法。第5圖中,對整個記憶體陣列的所有字元線的編程順序相同於第4圖。Referring now to FIG. 5, a programming method of a memory device according to an embodiment of this case is shown. In Figure 5, the programming sequence for all word lines of the entire memory array is the same as in Figure 4.
曲線510代表進行抹除操作後但尚未編程之前的實體頁面的臨界電壓分布,所以,所有的記憶體晶胞具有臨界電壓分布510。The
對該實體頁面(例如字元線WL0)的高頁面進行編程,例如,施加屬於編程電壓範圍(17V-20V)內的編程電壓至該些記憶體晶胞,使得高頁面中具有邏輯1的記憶體晶胞具有臨界電壓分布520,而高頁面中具有邏輯0的記憶體晶胞具有臨界電壓分布530,其中,臨界電壓分布520低於第一驗證電壓PV1,臨界電壓分布530高於第二驗證電壓PV2但低於第三驗證電壓PV3。Program the upper page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (17V-20V) to the memory cells, so that the upper page has a memory of
之後,對該實體頁面(如字元線WL0)的低頁面進行第一編程,例如,施加屬於編程電壓範圍(14V-17V)內的編程電壓至該些記憶體晶胞,使得具有邏輯11的記憶體晶胞具有臨界電壓分布540且具有邏輯10的記憶體晶胞具有臨界電壓分布550,其中,臨界電壓分布540低於第一驗證電壓PV1,臨界電壓分布550高於第一驗證電壓PV1但低於第二驗證電壓PV2。也就是說,先施加14V的編程電壓,接著,驗證臨界電壓分布550是否高於第一驗證電壓PV1。如果臨界電壓分布550未高於第一驗證電壓PV1,則升高編程電壓(例如但不受限於,從14V升高至14.5V),直到驗證臨界電壓分布550高於第一驗證電壓PV1為止。After that, perform the first programming on the lower page of the physical page (such as the word line WL0), for example, apply a programming voltage within the programming voltage range (14V-17V) to the memory cells, so as to have a
對該實體頁面(如字元線WL0)的低頁面進行第二編程,例如,施加屬於編程電壓範圍(20V-23V)內的編程電壓至該些記憶體晶胞,使得具有邏輯00的記憶體晶胞具有臨界電壓分布590且具有邏輯01的記憶體晶胞具有臨界電壓分布595,其中,臨界電壓分布590高於第二驗證電壓PV2但低於第三驗證電壓PV3,且臨界電壓分布595高於第三驗證電壓PV3。此外,由於施加編程電壓的關係,臨界電壓分布540與550會變為臨界電壓分布570與580,但臨界電壓分布570仍低於第一驗證電壓PV1,且臨界電壓分布580仍高於第一驗證電壓PV1但低於第二驗證電壓PV2。也就是說,施加20V的編程電壓,接著,驗證是否臨界電壓分布595高於第三驗證電壓PV3。如果否,則升高編程電壓(例如但不受限於,從20V升高至20.5V),直到臨界電壓分布595高於第三驗證電壓PV3為止。Perform second programming on the lower page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (20V-23V) to the memory cells, so that a memory with
藉此,可完成對記憶體晶胞的編程,如第5圖所示,具有邏輯11(S1)的記憶體晶胞具有臨界電壓分布570(低於第一驗證電壓PV1),具有邏輯10(S2)的記憶體晶胞具有臨界電壓分布580(高於第一驗證電壓PV1但低於第二驗證電壓PV2),具有邏輯00(S3)的記憶體晶胞具有臨界電壓分布590(高於第二驗證電壓PV2但低於第三驗證電壓PV3),具有邏輯01(S4)的記憶體晶胞具有臨界電壓分布595(高於第三驗證電壓PV3)。In this way, the programming of the memory cell can be completed. As shown in FIG. 5, the memory cell with logic 11 (S1) has a critical voltage distribution 570 (lower than the first verification voltage PV1) and has logic 10 ( S2) the memory cell has a critical voltage distribution 580 (higher than the first verification voltage PV1 but lower than the second verification voltage PV2), and the memory cell with a logic 00 (S3) has a critical voltage distribution 590 (higher than the first The second verification voltage PV2 is lower than the third verification voltage PV3). The memory cell with logic 01 (S4) has a critical voltage distribution 595 (higher than the third verification voltage PV3).
現請參照第6圖,顯示根據本案一實施例的記憶體裝置的編程方法。第6圖中,對整個記憶體陣列的所有字元線的編程順序相同於第4圖。Referring now to FIG. 6, a programming method of a memory device according to an embodiment of the present case is shown. In Figure 6, the programming sequence for all word lines of the entire memory array is the same as in Figure 4.
曲線610代表進行抹除操作後但尚未編程之前的實體頁面的臨界電壓分布,所以,所有的記憶體晶胞具有臨界電壓分布610。The
對該實體頁面(例如字元線WL0)的高頁面進行編程,例如,施加屬於編程電壓範圍(14V-17V)內的編程電壓至該些記憶體晶胞,使得高頁面中具有邏輯1的記憶體晶胞具有臨界電壓分布620,而高頁面中具有邏輯0的記憶體晶胞具有臨界電壓分布630,其中,臨界電壓分布620低於第一驗證電壓PV1,臨界電壓分布630高於第一驗證電壓PV1但低於第二驗證電壓PV2。Program the upper page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (14V-17V) to the memory cells, so that the upper page has a memory of
之後,對該實體頁面(如字元線WL0)的低頁面進行第一編程,例如,施加屬於編程電壓範圍(17V-20V)內的編程電壓至該些記憶體晶胞,使得具有邏輯11的記憶體晶胞具有臨界電壓分布640、具有邏輯10的記憶體晶胞具有臨界電壓分布650,具有邏輯00與01的記憶體晶胞具有臨界電壓分布660,其中,臨界電壓分布640低於第一驗證電壓PV1,臨界電壓分布650高於第一驗證電壓PV1但低於第二驗證電壓PV2,臨界電壓分布660高於第二驗證電壓PV2但低於第三驗證電壓PV3。也就是說,先施加17V的編程電壓,接著,驗證臨界電壓分布650是否高於第一驗證電壓PV1,及臨界電壓分布660是否高於第二驗證電壓PV2。如果否,則升高編程電壓(例如但不受限於,從17V升高至17.5V),直到臨界電壓分布650高於第一驗證電壓PV1且臨界電壓分布660高於第二驗證電壓PV2為止。After that, perform the first programming on the lower page of the physical page (such as the word line WL0), for example, apply a programming voltage within the programming voltage range (17V-20V) to the memory cells, so as to have a
對該實體頁面(如字元線WL0)的低頁面進行第二編程,例如,施加屬於編程電壓範圍(20V-23V)內的編程電壓至該些記憶體晶胞,使得具有邏輯00的記憶體晶胞具有臨界電壓分布690且具有邏輯01的記憶體晶胞具有臨界電壓分布695,其中,臨界電壓分布690高於第二驗證電壓PV2但低於第三驗證電壓PV3,且臨界電壓分布695高於第三驗證電壓PV3。此外,施加屬於編程電壓範圍(20V-23V)內的編程電壓後,臨界電壓分布640與650可能會變為臨界電壓分布670與680,但臨界電壓分布670仍低於第一驗證電壓PV1,且臨界電壓分布680仍高於第一驗證電壓PV1但低於第二驗證電壓PV2。也就是說,施加20V的編程電壓,接著,驗證是否臨界電壓分布695是否高於第三驗證電壓PV3。如果否,則升高編程電壓(例如但不受限於,從20V升高至20.5V),直到臨界電壓分布695高於第三驗證電壓PV3為止。Perform second programming on the lower page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (20V-23V) to the memory cells, so that a memory with
藉此,可完成對記憶體晶胞的編程,如第6圖所示,具有邏輯11(S1)的記憶體晶胞具有臨界電壓分布670(低於第一驗證電壓PV1),具有邏輯10(S2)的記憶體晶胞具有臨界電壓分布680(高於第一驗證電壓PV1但低於第二驗證電壓PV2),具有邏輯00(S3)的記憶體晶胞具有臨界電壓分布690(高於第二驗證電壓PV2但低於第三驗證電壓PV3),具有邏輯01(S4)的記憶體晶胞具有臨界電壓分布695(高於第三驗證電壓PV3)。In this way, the programming of the memory cell can be completed. As shown in FIG. 6, the memory cell with logic 11 (S1) has a critical voltage distribution 670 (lower than the first verification voltage PV1) and has logic 10( S2) the memory cell has a critical voltage distribution 680 (higher than the first verification voltage PV1 but lower than the second verification voltage PV2), and the memory cell with a logic 00 (S3) has a critical voltage distribution 690 (higher than the first The second verification voltage PV2 is lower than the third verification voltage PV3). The memory cell with logic 01 (S4) has a critical voltage distribution 695 (higher than the third verification voltage PV3).
現請參照第7圖,顯示根據本案一實施例的記憶體裝置的編程方法。第7圖中,對整個記憶體陣列的所有字元線的編程順序相同於第4圖。Referring now to FIG. 7, a programming method of a memory device according to an embodiment of the present case is shown. In Figure 7, the programming sequence for all word lines of the entire memory array is the same as in Figure 4.
曲線710代表進行抹除操作後但尚未編程之前的實體頁面的臨界電壓分布,所以,所有的記憶體晶胞具有臨界電壓分布710。The
對該實體頁面(例如字元線WL0)的高頁面進行編程,例如,施加屬於編程電壓範圍(14V-17V)內的編程電壓至該些記憶體晶胞,使得高頁面中具有邏輯1的記憶體晶胞具有臨界電壓分布715,而高頁面中具有邏輯0的記憶體晶胞具有臨界電壓分布720,其中,臨界電壓分布715低於第一驗證電壓PV1,臨界電壓分布720高於第一驗證電壓PV1但低於第二驗證電壓PV2。Program the upper page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (14V-17V) to the memory cells, so that the upper page has a memory of
之後,對該實體頁面(如字元線WL0)的低頁面進行第一編程,例如,施加屬於編程電壓範圍(17V-20V)內的編程電壓至該些記憶體晶胞,使得具有邏輯11的記憶體晶胞具有臨界電壓分布725且具有邏輯10的記憶體晶胞具有臨界電壓分布730,具有邏輯00與01的記憶體晶胞具有相同臨界電壓分布735,其中,臨界電壓分布725低於第一驗證電壓PV1,臨界電壓分布730與735皆高於第一驗證電壓PV1。另外,持續施加編程電壓使得具有邏輯00的記憶體晶胞的臨界電壓分布750可分離於具有邏輯01的記憶體晶胞的臨界電壓分布755,但皆高於第一驗證電壓PV1,另外,臨界電壓分布725與730可能變成臨界電壓分布740與745,但臨界電壓分布740仍低於第一驗證電壓PV1,而臨界電壓分布745則高於第一驗證電壓PV1但低於第二驗證電壓PV2。也就是說,先施加17V的編程電壓,接著,驗證臨界電壓分布730是否高於第一驗證電壓PV1。如果臨界電壓分布730未高於第一驗證電壓PV1,則升高編程電壓(例如但不受限於,從17V升高至17.5V),直到臨界電壓分布730高於第一驗證電壓PV1為止。此外,在低頁面的第一編程中,持續升高編程電壓,直到具有邏輯00的記憶體晶胞的臨界電壓分布750分離於具有邏輯01的記憶體晶胞的臨界電壓分布755為止。After that, perform the first programming on the lower page of the physical page (such as the word line WL0), for example, apply a programming voltage within the programming voltage range (17V-20V) to the memory cells, so as to have a
對該實體頁面(如字元線WL0)的低頁面進行第二編程,例如,施加屬於編程電壓範圍(20V-23V)內的編程電壓至該些記憶體晶胞,使得具有邏輯00的記憶體晶胞具有臨界電壓分布770且具有邏輯01的記憶體晶胞具有臨界電壓分布775,其中,臨界電壓分布770高於第二驗證電壓PV2但低於第三驗證電壓PV3,且臨界電壓分布775高於第三驗證電壓PV3。此外,由於施加編程電壓的關係,臨界電壓分布740與745會變為臨界電壓分布760與765,但臨界電壓分布760低於第一驗證電壓PV1,臨界電壓分布765高於第一驗證電壓PV1但低於第二驗證電壓PV2。也就是說,施加20V的編程電壓,接著,驗證是否臨界電壓分布770高於第二驗證電壓PV2且臨界電壓分布775高於第三驗證電壓PV3。如果否,則升高編程電壓(例如但不受限於,從20V升高至20.5V),直到臨界電壓分布770高於第二驗證電壓PV2,且臨界電壓分布775高於第三驗證電壓PV3為止。Perform second programming on the lower page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (20V-23V) to the memory cells, so that a memory with
藉此,可完成對記憶體晶胞的編程,如第7圖所示,具有邏輯11(S1)的記憶體晶胞具有臨界電壓分布760(低於第一驗證電壓PV1),具有邏輯10(S2)的記憶體晶胞具有臨界電壓分布765(高於第一驗證電壓PV1但低於第二驗證電壓PV2),具有邏輯00(S3)的記憶體晶胞具有臨界電壓分布770(高於第二驗證電壓PV2但低於第三驗證電壓PV3),具有邏輯01(S4)的記憶體晶胞具有臨界電壓分布775(高於第三驗證電壓PV3)。In this way, the programming of the memory cell can be completed. As shown in FIG. 7, the memory cell with logic 11 (S1) has a critical voltage distribution 760 (lower than the first verification voltage PV1) and has logic 10( S2) the memory cell has a critical voltage distribution 765 (higher than the first verification voltage PV1 but lower than the second verification voltage PV2), and the memory cell with a logic 00 (S3) has a critical voltage distribution 770 (higher than the first The second verification voltage PV2 is lower than the third verification voltage PV3). The memory cell with logic 01 (S4) has a critical voltage distribution 775 (higher than the third verification voltage PV3).
現請參照第8圖,顯示根據本案一實施例的記憶體裝置的編程方法。第8圖中,對整個記憶體陣列的所有字元線的編程順序相同於第4圖。Referring now to FIG. 8, a programming method of a memory device according to an embodiment of the present case is shown. In Figure 8, the programming sequence for all word lines of the entire memory array is the same as in Figure 4.
曲線810代表進行抹除操作後但尚未編程之前的實體頁面的臨界電壓分布,所以,所有的記憶體晶胞具有臨界電壓分布810。The
對該實體頁面(例如字元線WL0)的高頁面進行編程,例如,施加屬於編程電壓範圍(14V-17V)內的編程電壓至該些記憶體晶胞,使得高頁面中具有邏輯1的記憶體晶胞具有臨界電壓分布820,而高頁面中具有邏輯0的記憶體晶胞具有臨界電壓分布830,其中,臨界電壓分布820低於第一驗證電壓PV1,臨界電壓分布830高於第一驗證電壓PV1但低於第二驗證電壓PV2。Program the upper page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (14V-17V) to the memory cells, so that the upper page has a memory of
之後,對該實體頁面(如字元線WL0)的低頁面進行第一編程,例如,施加屬於編程電壓範圍(14V-17V)內的編程電壓至該些記憶體晶胞,使得具有邏輯11的記憶體晶胞具有臨界電壓分布840(低於第一驗證電壓PV1)且具有邏輯10、00與01的記憶體晶胞具有相同的臨界電壓分布850,其中,臨界電壓分布850高於第一驗證電壓PV1但低於第二驗證電壓PV2。也就是說,先施加14V的編程電壓,接著,驗證臨界電壓分布850是否高於第一驗證電壓PV1。如果臨界電壓分布850未高於第一驗證電壓PV1,則升高編程電壓(例如但不受限於,從14V升高至14.5V),直到臨界電壓分布850高於第一驗證電壓PV1為止。After that, perform the first programming on the lower page of the physical page (such as the word line WL0), for example, apply a programming voltage within the programming voltage range (14V-17V) to the memory cells, so as to have a
對該實體頁面(如字元線WL0)的低頁面進行第二編程,例如,施加屬於編程電壓範圍(17V-23V)內的編程電壓至該些記憶體晶胞,使得具有邏輯10的記憶體晶胞具有臨界電壓分布870、有邏輯00的記憶體晶胞具有臨界電壓分布880且具有邏輯01的記憶體晶胞具有臨界電壓分布890,其中,臨界電壓分布870高於第一驗證電壓PV1但低於第二驗證電壓PV2、臨界電壓分布880高於第二驗證電壓PV2但低於第三驗證電壓PV3,且臨界電壓分布890高於第三驗證電壓PV3。也就是說,施加17V的編程電壓,接著,驗證是否臨界電壓分布880高於第二驗證電壓PV2,及是否臨界電壓分布890高於第三驗證電壓PV3。如果否,則升高編程電壓(例如但不受限於,從17V升高至17.5V),直到臨界電壓分布880高於第二驗證電壓PV2,及臨界電壓分布890高於第三驗證電壓PV3為止。Perform a second programming on the lower page of the physical page (such as word line WL0), for example, apply a programming voltage within the programming voltage range (17V-23V) to the memory cells to make a memory with
藉此,可完成對記憶體晶胞的編程,如第8圖所示,具有邏輯11(S1)的記憶體晶胞具有臨界電壓分布860(低於第一驗證電壓PV1),具有邏輯10(S2)的記憶體晶胞具有臨界電壓分布870(高於第一驗證電壓PV1但低於第二驗證電壓PV2),具有邏輯00(S3)的記憶體晶胞具有臨界電壓分布880(高於第二驗證電壓PV2但低於第三驗證電壓PV3),具有邏輯01(S4)的記憶體晶胞具有臨界電壓分布890(高於第三驗證電壓PV3)。In this way, the programming of the memory cell can be completed. As shown in FIG. 8, the memory cell with logic 11 (S1) has a critical voltage distribution 860 (lower than the first verification voltage PV1) and has logic 10( S2) the memory cell has a critical voltage distribution 870 (higher than the first verification voltage PV1 but lower than the second verification voltage PV2), and the memory cell with a logic 00 (S3) has a critical voltage distribution 880 (higher than the first The second verification voltage PV2 is lower than the third verification voltage PV3). The memory cell with logic 01 (S4) has a critical voltage distribution 890 (higher than the third verification voltage PV3).
如上述般,在本案上述實施例中,由於對低頁面進行二次編程,故而可以降低因為相鄰字元線編程所造成的編程干擾。As described above, in the above embodiment of the present invention, since the second page is programmed again, it is possible to reduce the programming interference caused by the programming of adjacent word lines.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In summary, although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be deemed as defined by the scope of the attached patent application.
110-170‧‧‧臨界電壓分布P1-P5‧‧‧編程電壓L0-L5‧‧‧臨界電壓分布Vvfy‧‧‧驗證電壓Vpgm‧‧‧初始的編程電壓∆Vt‧‧‧電壓增加量300‧‧‧記憶體裝置310‧‧‧記憶體陣列310320‧‧‧控制器WL0-WL3‧‧‧字元線410-490、510-595、610-695、710-775、810-890‧‧‧臨界電壓分布S1-S4‧‧‧邏輯狀態PV1-PV3‧‧‧驗證電壓110-170‧‧‧ Critical voltage distribution P1-P5‧‧‧ Programming voltage L0-L5‧‧‧ Critical voltage distribution Vvfy‧‧‧Verification voltage Vpgm‧‧‧Initial programming voltage ΔVt‧‧‧Voltage increase 300‧ ‧‧
第1圖顯示現據現有技術的編程方法。 第2圖顯示習知技術的ISPP的編程順序。 第3圖顯示根據本案一實施例的記憶體裝置的功能方塊圖。 第4圖顯示根據本案一實施例的記憶體裝置的編程方法。 第5圖顯示根據本案一實施例的記憶體裝置的編程方法。 第6圖顯示根據本案一實施例的記憶體裝置的編程方法。 第7圖顯示根據本案一實施例的記憶體裝置的編程方法。 第8圖顯示根據本案一實施例的記憶體裝置的編程方法。Figure 1 shows the current programming method according to the prior art. Figure 2 shows the programming sequence of the ISPP of the conventional technology. FIG. 3 shows a functional block diagram of a memory device according to an embodiment of this case. FIG. 4 shows the programming method of the memory device according to an embodiment of the present case. FIG. 5 shows a programming method of a memory device according to an embodiment of the present case. FIG. 6 shows a programming method of a memory device according to an embodiment of the present case. FIG. 7 shows the programming method of the memory device according to an embodiment of the present case. FIG. 8 shows a programming method of a memory device according to an embodiment of the present case.
WL0-WL3‧‧‧字元線 WL0-WL3‧‧‧character line
410-490‧‧‧臨界電壓分布 410-490‧‧‧critical voltage distribution
S1-S4‧‧‧邏輯狀態 S1-S4‧‧‧Logic state
PV1-PV3‧‧‧驗證電壓 PV1-PV3‧‧‧Verification voltage
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