TW202007758A - CMP slurry composition for polishing copper films and method for polishing copper films using the same - Google Patents
CMP slurry composition for polishing copper films and method for polishing copper films using the same Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
Abstract
Description
本發明是有關於一種用於銅膜的CMP漿液組成物和一種使用其拋光銅膜的方法。更特定來說，本發明涉及一種用於銅膜的CMP漿液組成物，其可實現銅膜的拋光速率（polishing rate）的顯著提高和對銅膜的凹陷的抑制。相關申請的交叉引用 The invention relates to a CMP slurry composition for a copper film and a method for polishing a copper film using the same. More specifically, the present invention relates to a CMP slurry composition for a copper film, which can achieve a significant improvement in the polishing rate of the copper film and the suppression of the depression of the copper film. Cross-reference of related applications
本申請主張2018年8月8日在韓國智慧財產權局提交的韓國專利申請第10-2018-0092660號的權益，所述申請的全部公開內容以引用的方式併入本文中。This application claims the rights and interests of Korean Patent Application No. 10-2018-0092660 filed with the Korean Intellectual Property Office on August 8, 2018, and the entire disclosure content of the application is incorporated herein by reference.
隨著半導體積體電路的高度集成和高性能，化學機械拋光（chemical mechanical polishing，CMP）作為微製造技術已受到關注。CMP通常用於層間絕緣膜的平坦化、金屬塞的形成以及嵌入式導線的形成。近來，將銅和銅合金（其具有比鋁等更低的電阻值，且因此可顯著提高積體電路的性能）用作導線的導電材料。另外，將鉭（Ta）或氮化鉭（TaN）用作用於將金屬層接合到絕緣膜（SiO2 ）的黏著層。此黏著層充當防止帶電金屬與絕緣膜之間的擴散的勢壘層。With the high integration and high performance of semiconductor integrated circuits, chemical mechanical polishing (CMP) has attracted attention as a microfabrication technology. CMP is generally used for the planarization of interlayer insulating films, the formation of metal plugs, and the formation of embedded wires. Recently, copper and copper alloys (which have a lower resistance value than aluminum and the like, and thus can significantly improve the performance of integrated circuits) are used as conductive materials for wires. In addition, tantalum (Ta) or tantalum nitride (TaN) is used as an adhesive layer for bonding the metal layer to the insulating film (SiO 2 ). This adhesive layer serves as a barrier layer that prevents diffusion between the charged metal and the insulating film.
在半導體裝置的製造中，CMP工藝對於晶片表面的平坦化極有用處。一般來說，用於銅的CMP工藝分成兩個步驟進行。在CMP工藝的初級步驟中，由於必須去除塊狀銅膜，因此需要具有銅的高拋光速率的漿液組成物。In the manufacture of semiconductor devices, the CMP process is extremely useful for planarizing the wafer surface. In general, the CMP process for copper is divided into two steps. In the primary step of the CMP process, since the bulk copper film must be removed, a slurry composition having a high polishing rate of copper is required.
本發明的一個目標是提供一種可提高銅膜的拋光速率的用於銅膜的CMP漿液組成物。An object of the present invention is to provide a CMP slurry composition for a copper film that can improve the polishing rate of the copper film.
本發明的另一目標是提供一種可通過抑制銅膜的凹陷來提高拋光表面的平坦度的用於銅膜的CMP漿液組成物。Another object of the present invention is to provide a CMP slurry composition for a copper film that can improve the flatness of the polished surface by suppressing the depression of the copper film.
根據本發明的一個方面，一種用於銅膜的CMP漿液組成物包含：選自極性溶劑和非極性溶劑當中的至少一種；金屬氧化物磨料（metal oxide abrasive）；甘氨酸；組氨酸；以及咪唑化合物。According to an aspect of the present invention, a CMP slurry composition for a copper film includes: at least one selected from a polar solvent and a non-polar solvent; metal oxide abrasive; metal oxide abrasive; glycine; histidine; and imidazole Compound.
在一個實施例中，咪唑化合物可包含由式1表示的化合物：In one embodiment, the imidazole compound may include the compound represented by Formula 1:
[式1]
其中R1 是氫、C1 到C10 烷基或C6 到C20 芳基；且R2 、R3 以及R4 各自獨立地是氫、C1 到C10 烷基、C6 到C20 芳基或鹵素原子。Where R 1 is hydrogen, C 1 to C 10 alkyl or C 6 to C 20 aryl; and R 2 , R 3 and R 4 are each independently hydrogen, C 1 to C 10 alkyl, C 6 to C 20 Aryl or halogen atom.
在一個實施例中，咪唑化合物可包含選自咪唑和甲基咪唑當中的至少一種。In one embodiment, the imidazole compound may include at least one selected from imidazole and methylimidazole.
在一個實施例中，甘氨酸和組氨酸可以0.02重量%到10重量%的總量存在於CMP漿液組成物中。In one embodiment, glycine and histidine may be present in the CMP slurry composition in a total amount of 0.02% to 10% by weight.
在一個實施例中，CMP漿液組成物可更包含腐蝕抑制劑。In one embodiment, the CMP slurry composition may further include a corrosion inhibitor.
在一個實施例中，腐蝕抑制劑可以0.001重量%到5重量%的量存在於CMP漿液組成物中。In one embodiment, the corrosion inhibitor may be present in the CMP slurry composition in an amount of 0.001% to 5% by weight.
在一個實施例中，腐蝕抑制劑可包含選自三唑和四唑當中的至少一種。In one embodiment, the corrosion inhibitor may include at least one selected from triazole and tetrazole.
在一個實施例中，CMP漿液組成物可具有5到9的pH。In one embodiment, the CMP slurry composition may have a pH of 5 to 9.
根據本發明的另一方面，一種拋光銅膜的方法包含：使用根據本發明的用於銅膜的CMP漿液組成物來拋光銅膜。According to another aspect of the present invention, a method of polishing a copper film includes polishing the copper film using the CMP slurry composition for the copper film according to the present invention.
本發明提供一種可提高銅膜的拋光速率的用於銅膜的CMP漿液組成物。The present invention provides a CMP slurry composition for a copper film that can improve the polishing rate of the copper film.
本發明提供一種可通過抑制銅膜的凹陷來提高所拋光表面的平坦度的用於銅膜的CMP漿液組成物。The present invention provides a CMP slurry composition for a copper film that can improve the flatness of the polished surface by suppressing the depression of the copper film.
拋光半導體裝置的方法包含用於拋光銅膜（銅線）的初級拋光工藝，以及用於同時拋光銅膜、反擴散膜以及絕緣層的二級拋光工藝。在初級拋光工藝中，經由拋光快速去除銅膜。在本文中，銅膜可包含由純銅或銅合金構成的膜。The method of polishing a semiconductor device includes a primary polishing process for polishing a copper film (copper wire), and a secondary polishing process for simultaneously polishing a copper film, an anti-diffusion film, and an insulating layer. In the primary polishing process, the copper film is quickly removed via polishing. Here, the copper film may include a film composed of pure copper or a copper alloy.
根據本發明的一個方面，銅膜的拋光速率可通過將咪唑化合物摻入到包含甘氨酸和組氨酸的用於銅膜的CMP漿液組成物中來顯著地提高。另外，根據本發明的一個方面，銅膜的拋光速率的顯著提高和對凹陷的抑制二者可通過將咪唑化合物和腐蝕抑制劑摻入到包含甘氨酸和組氨酸的用於銅膜的CMP漿液組成物中來實現。According to one aspect of the present invention, the polishing rate of the copper film can be significantly improved by incorporating the imidazole compound into the CMP slurry composition for copper film containing glycine and histidine. In addition, according to one aspect of the present invention, both the significant improvement in the polishing rate of the copper film and the suppression of pitting can be achieved by incorporating an imidazole compound and a corrosion inhibitor into the CMP slurry for copper film containing glycine and histidine In the composition.
根據本發明的CMP漿液組成物包含：選自極性溶劑和非極性溶劑當中的至少一種；金屬氧化物磨料；甘氨酸；組氨酸；以及咪唑化合物。現將詳細地描述根據本發明的CMP漿液組成物的各個組分。The CMP slurry composition according to the present invention comprises: at least one selected from polar solvents and non-polar solvents; metal oxide abrasives; glycine; histidine; and imidazole compounds. Each component of the CMP slurry composition according to the present invention will now be described in detail.
選自極性溶劑和非極性溶劑當中的至少一種用以在用金屬氧化物磨料拋光銅膜時減小摩擦力。選自極性溶劑和非極性溶劑當中的至少一種可包含水（例如超純水或去離子水）、有機胺、有機醇、有機醇胺、有機醚、有機酮等。優選地，選自極性溶劑和非極性溶劑當中的至少一種是超純水或去離子水。選自極性溶劑和非極性溶劑當中的至少一種可以餘量存在於CMP漿液組成物中。At least one selected from polar solvents and non-polar solvents is used to reduce friction when polishing copper films with metal oxide abrasives. At least one selected from polar solvents and nonpolar solvents may include water (for example, ultrapure water or deionized water), organic amines, organic alcohols, organic alcohol amines, organic ethers, organic ketones, and the like. Preferably, at least one selected from polar solvents and non-polar solvents is ultrapure water or deionized water. At least one selected from polar solvents and non-polar solvents may be present in the CMP slurry composition in a balance.
金屬氧化物磨料可在高拋光速率下拋光銅膜。具體來說，金屬氧化物磨料可包含由下述者所組成的群組中選出的至少一種：二氧化矽、氧化鋁、二氧化鈰、二氧化鈦以及氧化鋯。優選地，金屬氧化物磨料是二氧化矽。Metal oxide abrasives can polish copper films at high polishing rates. Specifically, the metal oxide abrasive may include at least one selected from the group consisting of silica, alumina, ceria, titania, and zirconia. Preferably, the metal oxide abrasive is silicon dioxide.
金屬氧化物磨料可以是球形顆粒或非球形顆粒，且可具有10奈米到150奈米（例如20奈米到70奈米）的平均粒徑（D50）。在此範圍內，金屬氧化物磨料可提供用於銅膜（其為本文中的拋光目標）的充足拋光速率，不產生刮痕，且可提高銅膜的拋光表面的平坦度。如本文中所使用，“平均粒徑（D50）”是所屬領域中已知的典型粒徑計量，且是指在磨料顆粒的重量累積分佈中對應於50重量%的粒徑。The metal oxide abrasive may be spherical particles or non-spherical particles, and may have an average particle diameter (D50) of 10 nm to 150 nm (for example, 20 nm to 70 nm). Within this range, the metal oxide abrasive can provide a sufficient polishing rate for the copper film, which is the polishing target herein, does not generate scratches, and can improve the flatness of the polishing surface of the copper film. As used herein, “average particle size (D50)” is a typical particle size measurement known in the art, and refers to a particle size corresponding to 50% by weight in the cumulative weight distribution of abrasive particles.
金屬氧化物磨料可以0.001重量%到20重量%的量，具體地以0.01重量%到10重量%的量，更具體地以0.01重量%到5重量%的量，又更具體地以0.01重量%到1重量%的量存在於CMP漿液組成物中。在此範圍內，金屬氧化物磨料可提供用於銅膜的充足拋光速率，不產生刮痕，且可提高組成物的分散穩定性。舉例來說，金屬氧化物磨料可以0.001重量%、0.005重量%、0.01重量%、0.02重量%、0.03重量%、0.04重量%、0.05重量%、0.06重量%、0.07重量%、0.08重量%、0.09重量%、0.1重量%、0.2重量%、0.3重量%、0.4重量%、0.5重量%、0.6重量%、0.7重量%、0.8重量%、0.9重量%、1重量%、2重量%、3重量%、4重量%、5重量%、6重量%、7重量%、8重量%、9重量%、10重量%、11重量%、12重量%、13重量%、14重量%、15重量%、16重量%、17重量%、18重量%、19重量%或20重量%的量存在於CMP漿液組成物中。The metal oxide abrasive may be in an amount of 0.001% to 20% by weight, specifically 0.01% to 10% by weight, more specifically 0.01% to 5% by weight, and more specifically 0.01% by weight An amount of up to 1% by weight is present in the CMP slurry composition. Within this range, the metal oxide abrasive can provide a sufficient polishing rate for the copper film without generating scratches, and can improve the dispersion stability of the composition. For example, the metal oxide abrasive can be 0.001 wt%, 0.005 wt%, 0.01 wt%, 0.02 wt%, 0.03 wt%, 0.04 wt%, 0.05 wt%, 0.06 wt%, 0.07 wt%, 0.08 wt%, 0.09 wt% Wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 2 wt%, 3 wt% , 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, 11 wt%, 12 wt%, 13 wt%, 14 wt%, 15 wt%, 16 The amount of wt%, 17 wt%, 18 wt%, 19 wt% or 20 wt% is present in the CMP slurry composition.
甘氨酸和組氨酸用以螯合在銅膜拋光期間產生的氧化銅。甘氨酸和組氨酸可以0.02重量%到10重量%（具體地1重量%到5重量%）的總量存在於CMP漿液組成物中。在此範圍內，甘氨酸和組氨酸可根據漿液的分散穩定性和所拋光銅膜的表面特徵提供良好特性且可結合咪唑化合物來提高銅膜的拋光速率。舉例來說，甘氨酸和組氨酸可以0.02重量%、0.03重量%、0.04重量%、0.05重量%、0.06重量%、0.07重量%、0.08重量%、0.09重量%、0.1重量%、0.2重量%、0.3重量%、0.4重量%、0.5重量%、0.6重量%、0.7重量%、0.8重量%、0.9重量%、1重量%、2重量%、3重量%、4重量%、5重量%、6重量%、7重量%、8重量%、9重量%或10重量%的總量存在於CMP漿液組成物中。Glycine and histidine are used to chelate copper oxide produced during polishing of the copper film. Glycine and histidine may be present in the CMP slurry composition in a total amount of 0.02% to 10% by weight (specifically 1% to 5% by weight). Within this range, glycine and histidine can provide good characteristics according to the dispersion stability of the slurry and the surface characteristics of the polished copper film and can be combined with an imidazole compound to increase the polishing rate of the copper film. For example, glycine and histidine can be 0.02% by weight, 0.03% by weight, 0.04% by weight, 0.05% by weight, 0.06% by weight, 0.07% by weight, 0.08% by weight, 0.09% by weight, 0.1% by weight, 0.2% by weight, 0.3% by weight, 0.4% by weight, 0.5% by weight, 0.6% by weight, 0.7% by weight, 0.8% by weight, 0.9% by weight, 1% by weight, 2% by weight, 3% by weight, 4% by weight, 5% by weight, 6% by weight The total amount of %, 7% by weight, 8% by weight, 9% by weight or 10% by weight is present in the CMP slurry composition.
甘氨酸可以0.01重量%到5重量%的量，具體地以0.05重量%到5重量%的量，更具體地以0.1重量%到5重量%的量存在於CMP漿液組成物中。在此範圍內，甘氨酸可在拋光速率、漿液的分散穩定性以及所拋光銅膜的表面特徵方面提供良好特性。舉例來說，甘氨酸可以0.01重量%、0.02重量%、0.03重量%、0.04重量%、0.05重量%、0.06重量%、0.07重量%、0.08重量%、0.09重量%、0.1重量%、0.2重量%、0.3重量%、0.4重量%、0.5重量%、0.6重量%、0.7重量%、0.8重量%、0.9重量%、1重量%、2重量%、3重量%、4重量%或5重量%的量存在於CMP漿液組成物中。Glycine may be present in the CMP slurry composition in an amount of 0.01% to 5% by weight, specifically 0.05% to 5% by weight, more specifically 0.1% to 5% by weight. Within this range, glycine can provide good characteristics in terms of polishing rate, dispersion stability of the slurry, and surface characteristics of the polished copper film. For example, glycine may be 0.01% by weight, 0.02% by weight, 0.03% by weight, 0.04% by weight, 0.05% by weight, 0.06% by weight, 0.07% by weight, 0.08% by weight, 0.09% by weight, 0.1% by weight, 0.2% by weight, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 2%, 3%, 4%, or 5% by weight are present In CMP slurry composition.
組氨酸可以0.01重量%到5重量%的量，具體地以0.05重量%到5重量%的量，更具體地以0.1重量%到5重量%的量存在於CMP漿液組成物中。在此範圍內，組氨酸可在拋光速率、漿液的分散穩定性以及所拋光銅膜的表面特徵方面提供良好特性。舉例來說，組氨酸可以0.01重量%、0.02重量%、0.03重量%、0.04重量%、0.05重量%、0.06重量%、0.07重量%、0.08重量%、0.09重量%、0.1重量%、0.2重量%、0.3重量%、0.4重量%、0.5重量%、0.6重量%、0.7重量%、0.8重量%、0.9重量%、1重量%、2重量%、3重量%、4重量%或5重量%的量存在於CMP漿液組成物中。The histidine may be present in the CMP slurry composition in an amount of 0.01% to 5% by weight, specifically 0.05% to 5% by weight, more specifically 0.1% to 5% by weight. Within this range, histidine can provide good characteristics in terms of polishing rate, dispersion stability of the slurry, and surface characteristics of the polished copper film. For example, histidine can be 0.01% by weight, 0.02% by weight, 0.03% by weight, 0.04% by weight, 0.05% by weight, 0.06% by weight, 0.07% by weight, 0.08% by weight, 0.09% by weight, 0.1% by weight, 0.2% by weight %, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 2%, 3%, 4%, or 5% by weight The amount is present in the CMP slurry composition.
如上文所描述，在包含於CMP漿液組成物（其包含甘氨酸和組氨酸）中時，咪唑化合物可顯著地提高銅膜的拋光速率。咪唑化合物可以0.001重量%到5重量%的量，具體地以0.005重量%到1重量%的量，更具體地以0.01重量%到0.5重量%的量存在於根據本發明的CMP漿液組成物中。在此範圍內，咪唑化合物可顯著地提高銅膜的拋光速率。舉例來說，咪唑化合物可以0.001重量%、0.005重量%、0.01重量%、0.02重量%、0.03重量%、0.04重量%、0.05重量%、0.06重量%、0.07重量%、0.08重量%、0.09重量%、0.1重量%、0.2重量%、0.3重量%、0.4重量%、0.5重量%、0.6重量%、0.7重量%、0.8重量%、0.9重量%、1重量%、2重量%、3重量%、4重量%或5重量%的量存在於CMP漿液組成物中。As described above, when contained in the CMP slurry composition (which contains glycine and histidine), the imidazole compound can significantly increase the polishing rate of the copper film. The imidazole compound may be present in the CMP slurry composition according to the present invention in an amount of 0.001 wt% to 5 wt%, specifically in an amount of 0.005 wt% to 1 wt%, more specifically in an amount of 0.01 wt% to 0.5 wt% . Within this range, the imidazole compound can significantly improve the polishing rate of the copper film. For example, the imidazole compound may be 0.001 wt%, 0.005 wt%, 0.01 wt%, 0.02 wt%, 0.03 wt%, 0.04 wt%, 0.05 wt%, 0.06 wt%, 0.07 wt%, 0.08 wt%, 0.09 wt% , 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 2 wt%, 3 wt%, 4 The amount of 5% by weight or 5% by weight is present in the CMP slurry composition.
咪唑化合物可包含具有經取代或未經取代的咪唑基的單分子化合物。在本文中，術語“單分子化合物”可指由一個咪唑分子組成的化合物，而不是通過聚合一或多種咪唑化合物而獲得的寡聚物或聚合物。The imidazole compound may include a monomolecular compound having a substituted or unsubstituted imidazole group. Herein, the term "monomolecular compound" may refer to a compound composed of one imidazole molecule, rather than an oligomer or polymer obtained by polymerizing one or more imidazole compounds.
咪唑化合物可包含由式1表示的化合物：The imidazole compound may include the compound represented by Formula 1:
[式1]
其中R1 是氫、C1 到C10 烷基或C6 到C20 芳基，且R2 、R3 以及R4 各自獨立地是氫、C1 到C10 烷基、C6 到C20 芳基或鹵素原子。Where R 1 is hydrogen, C 1 to C 10 alkyl or C 6 to C 20 aryl, and R 2 , R 3 and R 4 are each independently hydrogen, C 1 to C 10 alkyl, C 6 to C 20 Aryl or halogen atom.
優選地，R1 是氫或甲基。優選地，R2 、R3 以及R4 各自獨立地是氫或C1 到C10 烷基。舉例來說，咪唑化合物可包含：咪唑；以及甲基咪唑，例如1-甲基咪唑、2-甲基咪唑以及4-甲基咪唑。Preferably, R 1 is hydrogen or methyl. Preferably, R 2 , R 3 and R 4 are each independently hydrogen or C 1 to C 10 alkyl. For example, the imidazole compound may include: imidazole; and methylimidazole, such as 1-methylimidazole, 2-methylimidazole, and 4-methylimidazole.
CMP漿液組成物可更包含腐蝕抑制劑。The CMP slurry composition may further contain a corrosion inhibitor.
腐蝕抑制劑用以抑制在銅膜拋光期間的凹陷。腐蝕抑制劑可包含選自三唑和四唑當中的至少一種。根據本發明的CMP漿液組成物可提高銅膜的拋光速率，且可通過包含咪唑化合物（其為二唑）和選自三唑和四唑當中的至少一種作為腐蝕抑制劑來抑制銅膜的凹陷，以提高所拋光表面的平坦度。The corrosion inhibitor is used to suppress depressions during polishing of the copper film. The corrosion inhibitor may include at least one selected from triazole and tetrazole. The CMP slurry composition according to the present invention can improve the polishing rate of the copper film, and can suppress the depression of the copper film by including an imidazole compound (which is a diazole) and at least one selected from triazole and tetrazole as a corrosion inhibitor To improve the flatness of the polished surface.
三唑可包含由式2或式3表示的化合物：The triazole may contain the compound represented by Formula 2 or Formula 3:
[式2]
其中R5 和R6 可各自獨立地是氫、未經取代的C1 到C10 烷基、未經取代的C6 到C10 芳基、氨基（-NH2）、磺酸基、羧酸基、經氨基取代的C1 到C10 烷基、經氨基取代的C6 到C10 芳基、經羧酸基取代的C6 到C10 芳基或經磺酸基取代的C6 到C10 芳基，或可彼此連接以形成未經取代的C4 到C10 芳基或經取代的C4 到C10 芳基；且R7 是氫或羥基，以及Wherein R 5 and R 6 may each independently be hydrogen, unsubstituted C 1 to C 10 alkyl, unsubstituted C 6 to C 10 aryl, amino (-NH2), sulfonic acid, carboxylic acid ,. 1 through amino to substituted C 10 C is alkyl, amino substituted C 6 to C 10 aryl group, with carboxylic acid substituted C 6 to C 10 aryl or substituted C 6 sulfonic acid groups to C 10 Aryl, or may be connected to each other to form an unsubstituted C 4 to C 10 aryl or substituted C 4 to C 10 aryl; and R 7 is hydrogen or hydroxyl, and
[式3]
其中R8 和R9 各自獨立地是氫、未經取代的C1 到C10 烷基、未經取代的C6 到C10 芳基、氨基（-NH2 ）、磺酸基、羧酸基、經氨基取代的C1 到C10 烷基、經氨基取代C6 到C10 芳基、經羧酸基取代的C6 到C10 芳基或經磺酸基取代的C6 到C10 芳基；且R10 是氫或羥基。Where R 8 and R 9 are each independently hydrogen, unsubstituted C 1 to C 10 alkyl, unsubstituted C 6 to C 10 aryl, amino (-NH 2 ), sulfonic acid, carboxylic acid , an amino group substituted by a C 1 to C 10 alkyl group, amino substituted by C 6 to the C 10 aryl, substituted C 6 carboxylic acid to C 10 aryl or a sulfonic acid group is substituted to C 6 C 10 aryl Radical; and R 10 is hydrogen or hydroxyl.
舉例來說，三唑可包含：苯並三唑化合物，所述苯並三唑化合物包含苯並三唑、甲基苯並三唑（甲苯基三唑）（例如5-甲基苯並三唑和4-甲基苯並三唑）、乙基苯並三唑、丙基苯並三唑、丁基苯並三唑、戊基苯並三唑、己基苯並三唑以及羥基苯並三唑；1,2,4-三唑；以及1,2,3-三唑。CMP漿液組成物可包含三唑本身或其鹽。For example, the triazole may include: a benzotriazole compound including benzotriazole, methylbenzotriazole (tolyltriazole) (such as 5-methylbenzotriazole And 4-methylbenzotriazole), ethylbenzotriazole, propylbenzotriazole, butylbenzotriazole, amylbenzotriazole, hexylbenzotriazole, and hydroxybenzotriazole ; 1,2,4-triazole; and 1,2,3-triazole. The CMP slurry composition may contain triazole itself or a salt thereof.
四唑可包含由式4表示的化合物：The tetrazole may contain the compound represented by Formula 4:
[式4]
其中R1 是氫、未經取代的C1 到C10 烷基、未經取代的C6 到C10 芳基、氨基（-NH2 ）；磺酸基、羧酸基、經氨基取代的C1 到C10 烷基；經氨基取代的C6 到C10 芳基；經羧酸基取代的C6 到C10 芳基或經磺酸基取代的C6 到C10 芳基。Where R 1 is hydrogen, unsubstituted C 1 to C 10 alkyl, unsubstituted C 6 to C 10 aryl, amino (-NH 2 ); sulfonic acid, carboxylic acid, amino substituted C 1 to C 10 alkyl group; amino substituted by C 6 to C 10 aryl group; a carboxylic acid group substituted by a C 6 to C 10 aryl group, or a sulfonic acid group is substituted to C 6 C 10 aryl group.
舉例來說，四唑可包含選自下述者當中的至少一種：5-氨基四唑、5-甲基四唑以及5-苯基四唑。CMP漿液組成物可包含四唑本身或其鹽。For example, the tetrazole may include at least one selected from the group consisting of 5-aminotetrazole, 5-methyltetrazole, and 5-phenyltetrazole. The CMP slurry composition may contain tetrazole itself or a salt thereof.
腐蝕抑制劑可以0.001重量%到5重量%的量，具體地以0.005重量%到1重量%的量，更具體地以0.01重量%到0.1重量%的量存在於CMP漿液組成物中。在此範圍內，腐蝕抑制劑可抑制銅膜在銅膜拋光期間的凹陷，同時提高銅膜的拋光速率。舉例來說，腐蝕抑制劑可以0.001重量%、0.005重量%、0.01重量%、0.02重量%、0.03重量%、0.04重量%、0.05重量%、0.06重量%、0.07重量%、0.08重量%、0.09重量%、0.1重量%、0.2重量%、0.3重量%、0.4重量%、0.5重量%、0.6重量%、0.7重量%、0.8重量%、0.9重量%、1重量%、2重量%、3重量%、4重量%或5重量%的量存在於CMP漿液組成物中。The corrosion inhibitor may be present in the CMP slurry composition in an amount of 0.001 wt% to 5 wt%, specifically in an amount of 0.005 wt% to 1 wt%, more specifically in an amount of 0.01 wt% to 0.1 wt%. Within this range, the corrosion inhibitor can suppress the depression of the copper film during the polishing of the copper film, while increasing the polishing rate of the copper film. For example, the corrosion inhibitor may be 0.001 wt%, 0.005 wt%, 0.01 wt%, 0.02 wt%, 0.03 wt%, 0.04 wt%, 0.05 wt%, 0.06 wt%, 0.07 wt%, 0.08 wt%, 0.09 wt% %, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 2%, 3%, An amount of 4% by weight or 5% by weight is present in the CMP slurry composition.
CMP漿液組成物可更包含氧化劑。氧化劑通過使銅膜氧化來促進銅膜的拋光，且通過使銅膜的表面平滑化來提供所拋光表面的表面粗糙度方面的所需特性。The CMP slurry composition may further contain an oxidizing agent. The oxidizing agent promotes polishing of the copper film by oxidizing the copper film, and provides desired characteristics in terms of surface roughness of the polished surface by smoothing the surface of the copper film.
氧化劑可包含由下述者所組成的群組中選出的至少一種：無機過化合物（inorganic per-compound）、有機過化合物（organic per-compound）、溴酸或其鹽、硝酸或其鹽、氯酸或其鹽、鉻酸或其鹽、碘酸或其鹽、鐵或其鹽、銅或其鹽、稀土金屬氧化物、過渡金屬氧化物以及重鉻酸鉀。在本文中，“過化合物（per-compound）”是指含有至少一個過氧化基（-O-O-）或含有處於最高氧化態的元素的化合物。優選地，氧化劑是過化合物。過化合物的實例可包含由下述者所組成的群組中選出的至少一種：過氧化氫、過碘酸鉀、過硫酸鈣以及鐵氰化鉀。優選地，氧化劑是過氧化氫。The oxidant may include at least one selected from the group consisting of: inorganic per-compound, organic per-compound, bromic acid or its salt, nitric acid or its salt, chlorine Acid or its salt, chromic acid or its salt, iodic acid or its salt, iron or its salt, copper or its salt, rare earth metal oxide, transition metal oxide, and potassium dichromate. In this context, "per-compound" refers to a compound containing at least one peroxide group (-O-O-) or containing an element in the highest oxidation state. Preferably, the oxidant is a per-compound. Examples of the over compound may include at least one selected from the group consisting of hydrogen peroxide, potassium periodate, calcium persulfate, and potassium ferricyanide. Preferably, the oxidizing agent is hydrogen peroxide.
氧化劑可以0.01重量%到5重量%的量，具體地以0.05重量%到3重量%的量，更具體地以0.1重量%到2重量%的量存在於CMP漿液組成物中。在此範圍內，氧化劑可改善對銅線的拋光選擇性。舉例來說，氧化劑可以0.01重量%、0.05重量%、0.1重量%、0.2重量%、0.3重量%、0.4重量%、0.5重量%、0.6重量%、0.7重量%、0.8重量%、0.9重量%、1重量%、2重量%、3重量%、4重量%或5重量%的量存在於CMP漿液組成物中。The oxidizing agent may be present in the CMP slurry composition in an amount of 0.01% to 5% by weight, specifically in an amount of 0.05% to 3% by weight, and more specifically in an amount of 0.1% to 2% by weight. Within this range, the oxidizing agent can improve the polishing selectivity to copper wire. For example, the oxidant may be 0.01% by weight, 0.05% by weight, 0.1% by weight, 0.2% by weight, 0.3% by weight, 0.4% by weight, 0.5% by weight, 0.6% by weight, 0.7% by weight, 0.8% by weight, 0.9% by weight, The amount of 1% by weight, 2% by weight, 3% by weight, 4% by weight or 5% by weight is present in the CMP slurry composition.
CMP漿液組成物可具有5到9（具體地6到8）的pH。在此範圍內，CMP漿液組成物可提供對銅膜的良好防腐蝕性。舉例來說，CMP漿液組成物可具有5、6、7、8或9的pH。The CMP slurry composition may have a pH of 5 to 9 (specifically, 6 to 8). Within this range, the CMP slurry composition can provide good corrosion resistance to the copper film. For example, the CMP slurry composition may have a pH of 5, 6, 7, 8 or 9.
CMP漿液組成物可更包含將CMP漿液組成物的pH值調整在上述範圍內的pH調節劑。pH調節劑可包含：無機酸，例如硝酸、磷酸、氫氯酸以及硫酸中的至少一種；以及有機酸，例如pKa為6或小於6的有機酸，例如乙酸和檸檬酸中的至少一種。或者，pH調節劑可包含鹼，例如由下述者所組成的群組中選出的至少一種：氫氧化鉀、氫氧化鈉以及氫氧化銨；碳酸鈉以及碳酸鉀。The CMP slurry composition may further include a pH adjuster for adjusting the pH of the CMP slurry composition within the above range. The pH adjusting agent may include: an inorganic acid, such as at least one of nitric acid, phosphoric acid, hydrochloric acid, and sulfuric acid; and an organic acid, such as an organic acid having a pKa of 6 or less, such as at least one of acetic acid and citric acid. Alternatively, the pH adjusting agent may contain a base, for example, at least one selected from the group consisting of potassium hydroxide, sodium hydroxide, and ammonium hydroxide; sodium carbonate, and potassium carbonate.
CMP漿液組成物可更包含所屬領域中已知的典型添加劑，例如界面活性劑（surfactant）、分散劑、改質劑以及表面活性劑（surface active agent）。The CMP slurry composition may further include typical additives known in the art, such as surfactants, dispersants, modifiers, and surface active agents.
根據本發明的拋光銅膜的方法包含：使用根據本發明的用於銅膜的CMP漿液組成物來拋光銅膜。The method of polishing a copper film according to the present invention includes: polishing the copper film using the CMP slurry composition for a copper film according to the present invention.
接下來，將參考一些實例更詳細地描述本發明。應理解，這些實例只是出於說明而提供，並且不應以任何方式解釋為限制本發明。Next, the present invention will be described in more detail with reference to some examples. It should be understood that these examples are provided for illustrative purposes only and should not be construed as limiting the invention in any way.
實例和比較例中所使用的各個組分的細節如下：The details of each component used in Examples and Comparative Examples are as follows:
金屬氧化物磨料：具有25奈米的平均粒徑（D50）的二氧化矽（DVSTS027，納爾科公司（Nalco Company））Metal oxide abrasive: silicon dioxide (DVSTS027, Nalco Company) with an average particle size (D50) of 25 nm
pH調節劑：硝酸或氫氧化鉀。 [實例1]pH regulator: nitric acid or potassium hydroxide. [Example 1]
將0.1重量%的金屬氧化物磨料、1.2重量%的甘氨酸、0.4重量%的組氨酸、0.2重量%的咪唑以及作為腐蝕抑制劑的0.02重量%的苯並三唑與餘量的超純水混合，由此製備CMP漿液組成物，其中前述組分的量是以組成物的總重量計。接著，使用硝酸或氫氧化鉀將漿液組成物的pH調整為7.0。 [實例2到實例4]0.1% by weight of metal oxide abrasive, 1.2% by weight of glycine, 0.4% by weight of histidine, 0.2% by weight of imidazole, and 0.02% by weight of benzotriazole as a corrosion inhibitor and the balance of ultrapure water Mixing, thereby preparing a CMP slurry composition in which the amount of the aforementioned components is based on the total weight of the composition. Next, the pH of the slurry composition was adjusted to 7.0 using nitric acid or potassium hydroxide. [Example 2 to Example 4]
除了將甘氨酸、組氨酸以及咪唑的量更改為如表1中所列且將腐蝕抑制劑的種類和量（單位：重量%）更改為如表1中所列之外，以與實例1中相同的方式製備漿液組成物。 [實例5]In addition to changing the amounts of glycine, histidine, and imidazole to those listed in Table 1 and changing the type and amount of corrosion inhibitors (unit: weight %) to those listed in Table 1, it is the same as in Example 1. The slurry composition was prepared in the same manner. [Example 5]
將0.1重量%的金屬氧化物磨料、0.7重量%的甘氨酸、0.4重量%的組氨酸、0.2重量%的咪唑以及作為腐蝕抑制劑的0.02重量%的苯並三唑與餘量的超純水混合，由此製備CMP漿液組成物，其中前述組分的量是以組成物的總重量計。接著，使用硝酸或氫氧化鉀將漿液組成物的pH調整為7.0。 [比較例1]0.1% by weight of metal oxide abrasive, 0.7% by weight of glycine, 0.4% by weight of histidine, 0.2% by weight of imidazole, and 0.02% by weight of benzotriazole as a corrosion inhibitor and the balance of ultrapure water Mixing, thereby preparing a CMP slurry composition in which the amount of the aforementioned components is based on the total weight of the composition. Next, the pH of the slurry composition was adjusted to 7.0 using nitric acid or potassium hydroxide. [Comparative Example 1]
除了不包括咪唑之外，以與實例1中相同的方式製備漿液組成物。 [比較例2]A slurry composition was prepared in the same manner as in Example 1 except that imidazole was not included. [Comparative Example 2]
除了使用聚乙烯基咪唑替代咪唑之外，以與實例1中相同的方式製備漿液組成物。 [比較例3]A slurry composition was prepared in the same manner as in Example 1, except that polyvinylimidazole was used instead of imidazole. [Comparative Example 3]
除了使用聚乙烯吡咯啶酮替代咪唑之外，以與實例1中相同的方式製備漿液組成物。A slurry composition was prepared in the same manner as in Example 1, except that polyvinylpyrrolidone was used instead of imidazole.
在實例和比較例中製備的每一個CMP漿液組成物均以下列特性評估：Each CMP slurry composition prepared in Examples and Comparative Examples was evaluated with the following characteristics:
（1）銅膜的拋光速率（單位：Å/20秒）：使用200毫米MIRRA拋光機（應用材料（Applied Materials，AMAT）公司），在工作臺旋轉速度（table rotation speed）為93轉/分鐘、磁頭旋轉速度為87轉/分鐘、拋光壓力為1.5磅/平方英寸、漿液進料速率為150毫升/分鐘且拋光持續時間為60秒的條件下拋光銅膜。此處，使用IC1010墊（羅德爾公司（Rodel Co., Ltd））作為拋光墊。基於電阻值轉換的拋光前後的厚度差來計算拋光速率。(1) Polishing rate of copper film (unit: Å/20 seconds): use 200 mm MIRRA polishing machine (Applied Materials (AMAT) company), and the table rotation speed is 93 rpm The copper film was polished under the conditions that the head rotation speed was 87 rpm, the polishing pressure was 1.5 psi, the slurry feed rate was 150 ml/min, and the polishing duration was 60 seconds. Here, an IC1010 pad (Rodel Co., Ltd) was used as a polishing pad. The polishing rate is calculated based on the difference in thickness before and after polishing in which the resistance value is converted.
（2）凹陷（單位：奈米）：在與（1）中相同的拋光條件下執行圖案評估。在銅和氧化物膜的寬度為100微米的區域中測量凹陷。(2) Depression (unit: nanometer): Perform pattern evaluation under the same polishing conditions as in (1). The depressions were measured in the area where the width of the copper and oxide films was 100 microns.
表1
根據表1中所顯示的結果，可看出根據本發明的CMP漿液組成物對於銅線具有非常高的拋光速率，同時顯著地抑制凹陷。From the results shown in Table 1, it can be seen that the CMP slurry composition according to the present invention has a very high polishing rate for copper wires while significantly suppressing depressions.
相反，與包含相同量的組氨酸和甘氨酸的實例1的CMP漿液組成物相比，不含咪唑化合物的比較例1的CMP漿液組成物對於銅線具有相當低的拋光速率。另外，與包含相同量的組氨酸和甘氨酸的實例1的CMP漿液組成物相比，包含聚乙烯基咪唑而非咪唑化合物的比較例2的CMP漿液組成物對於銅線也具有相當低的拋光速率。此外，包含聚乙烯吡咯啶酮而非咪唑化合物的比較例3的CMP漿液組成物具有低拋光速率且在抑制凹陷方面展現不良特性。In contrast, the CMP slurry composition of Comparative Example 1, which does not contain an imidazole compound, has a relatively low polishing rate for copper wires compared to the CMP slurry composition of Example 1 containing the same amount of histidine and glycine. In addition, compared to the CMP slurry composition of Example 1 containing the same amount of histidine and glycine, the CMP slurry composition of Comparative Example 2 containing polyvinyl imidazole instead of the imidazole compound also had a relatively low polishing for copper wire rate. In addition, the CMP slurry composition of Comparative Example 3, which contains polyvinylpyrrolidone instead of the imidazole compound, has a low polishing rate and exhibits unfavorable characteristics in suppressing depressions.
應理解，所屬領域的技術人員可在不脫離本發明的精神和範圍的情況下作出各種修改、變化、更改以及等效實施例。It should be understood that those skilled in the art can make various modifications, changes, alterations, and equivalent embodiments without departing from the spirit and scope of the present invention.
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