TW202001142A - Lighting structure - Google Patents
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Abstract
Description
本發明有關於一種發光結構,特別是一種具有發光二極體之發光結構。The invention relates to a light-emitting structure, especially a light-emitting structure with a light-emitting diode.
目前的車用燈泡多為鹵素燈,少部分使用疝氣燈。鹵素燈是在白熾燈中充入鹵族元素或鹵化物,使亮度提高為普通白熾燈的1.5倍,同時使用壽命也是普通白熾燈的2-3倍,其優點是成本低廉,一般考慮價格的經濟車種多使用鹵素燈做為車用大燈。但鹵素燈泡的鎢絲燈芯會隨使用時間逐漸老化,一般來說使用三年以上的鹵素燈泡亮度便有明顯衰竭。且鹵素燈泡所產生的高熱會加速老化燈具內部的反射面,因此使用一段時間之後亮度會明顯地減弱。At present, most car bulbs are halogen lamps, and a small number of hernia lamps are used. The halogen lamp is filled with halogen elements or halides in the incandescent lamp, so that the brightness is increased to 1.5 times that of the ordinary incandescent lamp, and the service life is also 2-3 times that of the ordinary incandescent lamp. Its advantage is low cost, generally considering the price Most economic cars use halogen lamps as headlights. However, the tungsten filament wick of the halogen bulb will gradually age with the use time. Generally speaking, the brightness of the halogen bulb used for more than three years will obviously deteriorate. And the high heat generated by the halogen bulb will accelerate the aging of the reflective surface inside the lamp, so the brightness will be significantly reduced after a period of use.
而氙氣燈是含有氙氣的大燈,又稱高強度放電式氣體燈(HID Intensity Discharge Lamp,是在石英燈管內填充高壓惰性氣體—氙氣(Xenon),以取代傳統的燈絲,在兩段電極上有水銀和碳素化合物,透過安定器以23000伏高壓電流刺激氙氣發光,其氙氣燈發出的光色接近太陽光,且亮度高,但需要額外配備(如啟動控制器、透鏡..等)來做配合,成本較高,一般多裝設於高端車型的車輛之中。但由於氙氣燈亮度太高,如用於遠光燈的投射會影響對向駕駛的視線,造成危險,因此有許多地區國家的法令是禁止遠光燈使用氙氣燈泡的。再者,氙氣燈內部充有高達6個大氣壓的高壓氙氣(是有毒氣體)和一定量的汞與金屬鹵化物,若有破裂情況發生,可能會對人員、車輛和生態造成傷害。The xenon lamp is a headlight containing xenon, also known as a high-intensity discharge gas lamp (HID Intensity Discharge Lamp), which is filled with high-pressure inert gas-Xenon (Xenon) in the quartz lamp tube to replace the traditional filament, in two sections of electrodes There are mercury and carbon compounds on the ballast to stimulate the xenon to emit light with a high voltage of 23000 volts. The light color of the xenon lamp is close to the sun and the brightness is high, but it needs additional equipment (such as start controller, lens...) To match, the cost is higher, and it is generally installed in high-end vehicles. However, because the brightness of the xenon lamp is too high, such as the projection of the high beam lamp will affect the line of sight of the driving and cause danger, so there are many The laws of the countries in the region prohibit the use of xenon bulbs for high beams. Furthermore, the xenon lamp is filled with high-pressure xenon gas (a toxic gas) of up to 6 atmospheres and a certain amount of mercury and metal halides. If a crack occurs, May cause harm to people, vehicles and ecology.
本發明係有關於一種發光結構。透過實施例之設計,可令使用發光二極體之發光結構適用於車輛燈泡之應用。The invention relates to a light-emitting structure. Through the design of the embodiment, the light-emitting structure using the light-emitting diode can be adapted to the application of the vehicle bulb.
本發明係提出一種發光結構,包括一底座(base)、一固定件以及一發光模組(Lighting module)。其中底座(base)包括具有相對之一前表面和一後表面之一座體(base body);一散熱部;和自座體之前表面延伸之一柱體,且柱體具有一承載平台。固定件設置於座體之前表面上,並位於承載平台和前表面之間。發光模組包括位於承載平台上之一基板,和位於基板上方之一LED組件。其中基板包括部分重疊的一第一區域、一第二區域和一第三區域,且第一、第二和第三區域之各中心點係對應位於柱體之中心軸上。而LED組件至少包括複數個LED,其中該些LED之排列係對應地位於第一、第二和第三區域的聯集中,且該些LED至少一個排列係對應地位於第一、第二和第三區域的交集處。The invention provides a light-emitting structure, which includes a base, a fixing member and a lighting module. The base includes a base body having a front surface and a rear surface opposite to each other; a heat dissipation portion; and a column extending from the front surface of the base, and the column has a bearing platform. The fixing member is arranged on the front surface of the seat body and is located between the bearing platform and the front surface. The light emitting module includes a substrate on the carrier platform, and an LED component above the substrate. The substrate includes a first region, a second region, and a third region that partially overlap, and the center points of the first, second, and third regions are correspondingly located on the central axis of the cylinder. The LED assembly includes at least a plurality of LEDs, wherein the arrangement of the LEDs is correspondingly located in the union of the first, second, and third regions, and the at least one arrangement of the LEDs is correspondingly located in the first, second, and third The intersection of the three regions.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下:In order to have a better understanding of the above and other aspects of the present invention, the preferred embodiments are described below in conjunction with the attached drawings, which are described in detail as follows:
本揭露之實施例係提出一種發光結構,特別是一種具有發光二極體(LED)之發光結構,可應用於車用燈泡中。以下係參照所附圖式詳細敘述本揭露之實施態樣。需注意的是,實施例所提出的結構和內容僅為舉例說明之用,本揭露欲保護之範圍並非僅限於所述之態樣。實施例中相同或類似的標號係用以標示相同或類似之部分。需注意的是,本揭露並非顯示出所有可能的實施例。可在不脫離本揭露之精神和範圍內對結構加以變化與修飾,以符合實際應用所需。因此,未於本揭露提出的其他實施態樣也可能可以應用。再者,圖式係已簡化以利清楚說明實施例之內容,圖式上的尺寸比例並非按照實際產品等比例繪製。因此,說明書和圖示內容僅作敘述實施例之用,而非作為限縮本揭露保護範圍之用。The embodiment of the present disclosure proposes a light-emitting structure, particularly a light-emitting structure with a light-emitting diode (LED), which can be applied to a vehicle light bulb. The embodiments of the present disclosure will be described in detail below with reference to the attached drawings. It should be noted that the structure and content proposed in the embodiments are for illustrative purposes only, and the scope of protection disclosed in the present disclosure is not limited to the described state. The same or similar reference numerals in the embodiments are used to indicate the same or similar parts. It should be noted that this disclosure does not show all possible embodiments. The structure can be changed and modified without departing from the spirit and scope of this disclosure to meet the needs of practical applications. Therefore, other implementations not mentioned in this disclosure may also be applicable. Furthermore, the drawings have been simplified to clearly explain the contents of the embodiments, and the size ratios on the drawings are not drawn according to the actual products. Therefore, the description and illustrations are only used to describe the embodiments, not to limit the scope of disclosure of the present disclosure.
第1圖為本揭露一實施例之一發光結構之示意圖。發光結構包括一底座(base)10、一固定件20和一發光模組(Lighting module)。第2圖為第1圖之發光結構中固定件20、發光模組30與底座10完成組合後之示意圖。請同時參照第1、2圖。FIG. 1 is a schematic diagram of a light-emitting structure according to an embodiment of the disclosure. The light-emitting structure includes a
一實施例中,底座10包括一座體(base body)11、一散熱部13和一柱體15,其中座體11具有相對之一前表面112和一後表面114,柱體15則自座體11之前表面112延伸,且柱體15具有一承載平台151。固定件20可設置於座體11之前表面112上,並位於承載平台151和前表面121之間。發光模組30包括一基板31和一發光二極體(簡稱LED)組件32,其中基板31位於柱體15之承載平台151上。一LED組件32位於基板31上方,且LED組件32至少包括複數個LED(如第2圖所示之LED320)。In one embodiment, the
一實施例中,對應座體11之前表面112處設置的固定件20係具有相對之一第一表面201和一第二表面202,其中設置後其第一表面201係朝向發光模組30,第二表面202則設置於座體11之前表面112上。In one embodiment, the
當本揭露之發光結構應用於一車用燈泡時,實施例所提出之固定件20可以是車用燈泡不同接頭規格的多種轉接環其中之一。例如於其中兩種示例中,固定件20可以是一第一轉接環或一第二轉接環,當實施例之LED發光結構和一投射模組組裝後,第一或第二轉接環例如是以其第一表面201與投射模組之殼體抵接,而形成相應規格之車用燈泡,例如形成一H11接頭規格或一H7接頭規格之車用燈泡。第3A、3B圖係分別繪示一H11接頭規格的轉接環和一H7接頭規格的轉接環之示意圖。When the light-emitting structure of the present disclosure is applied to a vehicle bulb, the
因此,實施例所提出之底座10可供不同接頭規格的轉接環(即固定件20/20’)所共用,亦不僅限制於實施例中所示例的H11/H7轉接環。再者,本揭露對於固定件20與底座10的設置方式亦不做限制,可以是使固定件20與底座10(例如是與其座體11)一體成形;也可以是使固定件20以可拆卸式的方式套接於底座10之柱體15上而組裝於座體11之前表面112處。另外,一實施例中,底座10例如是(但不限制是)由壓鑄鋁所形成。Therefore, the
於實際應用時,可以應用具散熱效果的不同設計做為本揭露之發光結構中底座10之散熱部。散熱部和座體11可以是一體成形,或是由不同部件裝配組合而成。In practical applications, different designs with heat dissipation effects can be used as the heat dissipation portion of the
如第1圖所示,一實施例中,底座10之座體11係具有一側表面115分別連接前表面112和後表面114,而側表面115係具有複數個鰭部(fin elements)130以做為如第1圖所示結構之散熱部13,用以協助快速散逸LED發光時所產生的熱能,延長發光結構之使用壽命。第1圖中,散熱部13和座體11係一體成形。第1圖中座體11係為一圓柱狀座體,但也可以是其他形狀之座體。實施例中,座體11與鰭部130之態樣亦可配合實際應用時之設計需求做適應性的修改與變化,本揭露對此並不多做限制。As shown in FIG. 1, in one embodiment, the
第4圖為本揭露另一實施例之發光結構中,底座與散熱部之示意圖。於另一實施例中,散熱部17係包括複數個散熱片170,對應座體11之後表面114處設置。如第4圖所示之另一實施例中,底座10更包括另一柱體16自座體11之後表面114延伸,且散熱部17之複數個散熱片170係套接於柱體16上。當然可設置散熱片的其他方式亦可應用,以形成具有散熱結構之底座10。而座體11之態樣可視實際應用時其他元件例如散熱片170與之配合的方式做相應設計,例如可套設散熱片之另一柱體的長度和形狀可視實際應用時散熱片170的樣態和大小而做修飾與變化。本揭露對此亦不特別限制。FIG. 4 is a schematic diagram of a base and a heat dissipation portion in a light-emitting structure according to another embodiment. In another embodiment, the
當實施例之發光結構應用於一車用燈泡時,其與投射模組(例如罩上內表面具反射層之一殼體)搭配後,所發出之光線亮度與光型需符合車燈規範,例如符合歐規(ECE R112)和美規(FMVSS 108)之近遠燈規範。實施例係對發光模組30之LED排列提出設計。When the light-emitting structure of the embodiment is applied to a light bulb for a vehicle, when it is matched with a projection module (for example, a shell with a reflective layer on the inner surface of the cover), the brightness and light type of the light emitted must conform to the lamp specifications. For example, it conforms to the near and far lamp specifications of European regulations (ECE R112) and American regulations (FMVSS 108). The embodiment proposes a design for the LED arrangement of the
第5圖係為本揭露另一實施例之一發光結構之示意圖。第5圖中,係以如第3B圖所示之固定件20’設置於座體11上做說明,且固定件20’之第一表面201’係平行於一xy平面,而柱體15之一中心軸C0
係沿著z軸方向延伸,發光模組30之基板31係平行於一xz平面。其中,發光模組30之LED組件32(例如包括複數個如第2圖所示之LED320),而該些LED之發光面係平行於xz平面並朝上方(即背離基板31的方向)發光。發光角度一般約為120度。第6圖係繪示如第5圖所示之發光結構中,其發光模組30在yz平面上之示意圖,其中LED320之一發光面例如是與柱體15之中心軸C0
約齊平,或是有大約±5mm之距離。FIG. 5 is a schematic diagram of a light emitting structure according to another embodiment of the disclosure. In FIG. 5, the fixing
再者,一實施例中,發光模組30之基板31例如是一金屬基印刷電路板(Metal Core PCB, MCPCB),而LED組件32更包括一基座32S以排列設置該些LED 320於其上,且基座32S設置於金屬基印刷電路板31上,基座32S例如是選用具有低熱膨脹係數之一陶瓷(ceramic)為材料。實際應用時,發光模組30更包括一驅動電路(未顯示),電性連接於該些LED 320。Furthermore, in one embodiment, the
除了LED向上發光,實施例更對LED排列提出一設計如下。第7圖係繪示本揭露一實施例之發光結構中,一種LED排列區域決定之示意圖。根據一實施例,發光模組30之基板31係包括部分重疊的一第一區域A1、一第二區域A2和一第三區域A3,且第一區域A1、第二區域A2和第三區域A3之各中心點O1、O2、O3係對應位於柱體15之中心軸C0
上。In addition to the LED lighting upward, the embodiment proposes a design for the LED arrangement as follows. FIG. 7 is a schematic diagram of determining an LED arrangement area in the light-emitting structure of an embodiment of the present disclosure. According to an embodiment, the
實施例中,第一區域A1、第二區域A2和第三區域A3之各中心點O1、O2、O3分別與固定件20’之第一表面201’(即線Ls之位置)呈第一垂直距離d1、第二垂直距離d2和第三垂直距離d3。一實施例中,第一垂直距離d1、第二垂直距離d2和第三垂直距離d3 (沿z軸)係分別為約28.4mm±0.2mm。再者,一實施例中,第一區域A1、第二區域A2和第三區域A3之各中心點O1、O2、O3可以(但不限制是)完全重合,如第7圖所示。當固定件與一投射模組卡接時,固定件20’之第一表面201’ (即線Ls之位置)可與投射模組之一殼體40抵接。In the embodiment, the center points O1, O2, and O3 of the first area A1, the second area A2, and the third area A3 are respectively perpendicular to the first surface 201' of the fixing member 20' (that is, the position of the line Ls) The distance d1, the second vertical distance d2, and the third vertical distance d3. In one embodiment, the first vertical distance d1, the second vertical distance d2, and the third vertical distance d3 (along the z-axis) are respectively about 28.4 mm ± 0.2 mm. Furthermore, in an embodiment, the center points O1, O2, and O3 of the first area A1, the second area A2, and the third area A3 may (but are not limited to) completely overlap, as shown in FIG. 7. When the fixing member is engaged with a projection module, the first surface 201' of the fixing member 20' (that is, the position of the line Ls) can abut the
一實施例中,第一區域A1具有長度x1和寬度y1,第二區域A2具有長度x2和寬度y2,第三區域A3具有長度x3和寬度y3,其比例大小例如是:x1<y1,x2=y2,x3>y3。一實施例中,其比例大小例如是:x1=y3 以及 y1=x3。一實施例中,第一區域A1例如是具有長度x1=1.6 mm和寬度y1=14 mm;第二區域A2例如是具有長度x2=4.4 mm和寬度y2=4.4 mm;第三區域A3例如是具有長度x3=14 mm和寬度y3=1.6 mm。當然,如通常知識者可知,該些數據僅為舉例說明之用,本揭露之範圍並非僅限於該些數據,實際尺寸亦可根據應用條件所需做適當修改與變化。In an embodiment, the first area A1 has a length x1 and a width y1, the second area A2 has a length x2 and a width y2, and the third area A3 has a length x3 and a width y3. The ratio is, for example, x1<y1, x2= y2, x3>y3. In an embodiment, the ratios are, for example, x1=y3 and y1=x3. In an embodiment, the first area A1 has a length x1=1.6 mm and a width y1=14 mm; the second area A2 has a length x2=4.4 mm and a width y2=4.4 mm; and the third area A3 has a Length x3=14 mm and width y3=1.6 mm. Of course, as a person of ordinary knowledge knows, these data are for illustrative purposes only. The scope of the present disclosure is not limited to these data, and the actual size can also be appropriately modified and changed according to the application conditions.
根據本揭露之實施例,LED組件32之多個LED的排列係對應地位於第一區域A1、第二區域A2和第三區域A3的聯集中,且該些LED至少其中一個之排列係對應地位於第一區域A1、第二區域A2和第三區域A3的交集處(例如將多個LED放置於如第7圖所示之區域AL
中)。而本揭露之多個LED的排列方式可依此方式做多種不同的排列和變化。According to the embodiment of the present disclosure, the arrangement of the LEDs of the
第8A圖為本揭露一實施例之一種LED排列方式之示意圖,其中多個LED 320(例如是5個LED 320,但不限制是5個)係排列成一直線並與柱體15之中心軸C0
(Z軸方向)垂直。第8B圖為本揭露一實施例之又一種LED排列方式之示意圖,其中多個LED 320(例如是3個LED,但不限制是5個)係排列成一直線並與柱體15之中心軸C0
(Z軸方向)平行。第8C圖為本揭露一實施例之再一種LED排列方式之示意圖,其中多個LED之數目至少3個或3個以上(第8C圖繪示4個LED 320),且該些LED之至少2個LED係沿著柱體15之中心軸C0
(Z軸方向)排列成一直線。當然,本揭露並不僅限制於如第8A~8C圖所示之排列方式,符合限制的其他排列樣態亦可應用。FIG. 8A is a schematic diagram of an LED arrangement in an embodiment of the disclosure, in which a plurality of LEDs 320 (for example, 5
另外,LED 320排列的實際位置和形成之尺寸亦可視實際應用條件所需做適當修改與變化,只要所有LED 320符合排列於第一至第三區域A1-A3的聯集處,且至少其中一個LED 320位於第一至第三區域A1-A3的交集處之條件即可。以第8A圖為例,例如將5個LED 320放置於區域AL
中,則一實施例中,區域AL
之中心點例如是(但不限制是)與固定件20’之第一表面201’(即線Ls之位置)垂直相距(i.e.平行於Z軸方向)約28.4mm,且垂直於柱體15之中心軸C0
(i.e.平行於X軸方向)約1.5mm;而區域AL
之長度L1=5.9mm和寬度W1=1.15mm。In addition, the actual position and size of the arrangement of the
以第8B圖為例,例如將3個LED,包括LED 320-1、LED 320-2、LED 320-3,沿平行於柱體15之中心軸C0
(Z軸方向)方向放置,則一實施例中,三個LED (320-1至320-3)之中心點例如是(但不限制是)皆對應柱體15之中心軸C0
設置(即中心點垂直於柱體15之中心軸C0
為0mm),且三個LED (320-1至320-3)之中心點例如(但不限制是)分別與固定件20’之第一表面201’(即線Ls之位置)的垂直距離(i.e.平行於Z軸方向)約28.4mm、27.2mm、26.0mm;而三個LED(320-1至320-3)之長度和寬度皆分別為(但不限制是)1.14mm。Taking Figure 8B as an example, for example, placing three LEDs, including LED 320-1, LED 320-2, and LED 320-3, in a direction parallel to the central axis C 0 (Z-axis direction) of the
以第8C圖為例,例如將四個LED (320-1至320-4)做排列設置,則一實施例中,LED 320-1之中心點例如是(但不限制是)位於柱體15之中心軸C0 之左側並垂直於中心軸C0 約1.2mm;而LED 320-1和LED 320-2之兩中心點例如(但不限制是)與固定件20’之第一表面201’(即線Ls之位置)皆呈一垂直距離(i.e.平行於Z軸方向)約29.6mm;而LED 320-2和LED 320-3之兩中心點例如(但不限制是)皆對應柱體15之中心軸C0 設置;而LED 320-3和LED 320-4之兩中心點例如(但不限制是)與固定件20’之第一表面201’(即線Ls之位置)皆呈一垂直距離(i.e.平行於Z軸方向)約28.4mm;LED 320-4之中心點例如是(但不限制是)位於柱體15之中心軸C0 之右側並垂直於中心軸C0 約1.2mm;而四個LED(320-1至320-4)之長度和寬度皆分別為(但不限制是)1.14mm。Taking FIG. 8C as an example, for example, four LEDs (320-1 to 320-4) are arranged, then in one embodiment, the center point of the LED 320-1 is (but not limited to) the pillar 15 The left side of the central axis C 0 and perpendicular to the central axis C 0 is about 1.2 mm; and the two central points of the LED 320-1 and the LED 320-2 are (but not limited to) the first surface 201' of the fixing member 20' (That is, the position of the line Ls) are at a vertical distance (ie parallel to the Z-axis direction) of about 29.6mm; and the two center points of the LED 320-2 and the LED 320-3, for example (but not limited to), both correspond to the cylinder 15 The central axis C 0 is set; and the two central points of the LED 320-3 and the LED 320-4, for example (but not limited to), are perpendicular to the first surface 201' of the fixing member 20' (that is, the position of the line Ls) The distance (ie parallel to the Z-axis direction) is about 28.4mm; the center point of the LED 320-4 is, for example (but not limited to), located to the right of the central axis C 0 of the cylinder 15 and perpendicular to the central axis C 0 by about 1.2mm; The length and width of the four LEDs (320-1 to 320-4) are (but not limited to) 1.14mm.
再者,如第8C圖所示之排列方式所產生之光型例如是適合左駕車輛使用;若欲應用本揭露之實施例於右駕車輛時,則將第8C圖所示之LED排列以柱體15之中心軸C0 做鏡向排列即可(即第8C圖之左上1個LED移至右上,而右下1個LED移至左下)。Furthermore, the light pattern generated by the arrangement shown in FIG. 8C is suitable for left-hand drive vehicles, for example. If the embodiment of the present disclosure is to be applied to right-hand drive vehicles, the LED shown in FIG. 8C is arranged to The central axis C 0 of the cylinder 15 can be arranged in a mirror direction (that is, the LED on the upper left in Fig. 8C moves to the upper right, and the LED on the lower right moves to the lower left).
實施例對於LED之亮度部分亦提出其中一種設計。一實施例中,對應地位於第一區域A1、第二區域A2和第三區域A3之交集處的該些LED至少之一係具有一最大亮度。於一示例中,例如該些LED至少一者具有大於等於150 lm/mm2 之亮度,其他該些LED係具有小於150 lm/mm2 之亮度,但大於80 lm/mm2 之亮度。又一示例中,例如該些LED至少一者具有大於等於150 lm/mm2 之亮度,其他該些LED係具有小於150 lm/mm2 之亮度,但大於80 lm/mm2 之亮度。The embodiment also proposes one of the designs for the brightness part of the LED. In one embodiment, at least one of the LEDs correspondingly located at the intersection of the first area A1, the second area A2, and the third area A3 has a maximum brightness. In an example, for example, at least one of the LEDs has a brightness greater than or equal to 150 lm/mm 2 , and the other LEDs have a brightness less than 150 lm/mm 2 but a brightness greater than 80 lm/mm 2 . In yet another example, for example, at least one of the LEDs has a brightness greater than or equal to 150 lm/mm 2 , and the other LEDs have a brightness less than 150 lm/mm 2 but greater than 80 lm/mm 2 .
另外,於實際應用中,亦可依應用需求變化如上述示例之結構,以加強散熱效果。第9A圖為本揭露之又一實施例之加強散熱的一種發光結構之示意圖。第9B圖為第9A圖之發光結構中固定件、發光模組與底座完成組合後之示意圖。與此實施例中,基板31’之一端31a係朝座體11延伸,且至少與座體11接觸,以加強散熱。例如在柱體15中相應地形成一容置空間153,使基板31’之一端31a可置入容置空間153而與座體11接觸,例如接觸到座體11之前表面112,使熱更容易經由散熱部(如第1圖所示之鰭部130或如第4圖所示之散熱片170)散逸。容置空間153的開口可依應用實際條件所需(例如是對應基板31’之尺寸)而作相應調整。In addition, in actual applications, the structure as described above can also be changed according to the application requirements to enhance the heat dissipation effect. FIG. 9A is a schematic diagram of a light-emitting structure that enhances heat dissipation according to another embodiment of the disclosure. FIG. 9B is a schematic diagram of the fixing member, the light-emitting module and the base in the light-emitting structure of FIG. 9A after being combined. In this embodiment, one end 31a of the substrate 31' extends toward the
另外,於實際應用中,亦可依應用需求變化如上述示例之結構,以加強光型。第10圖為本揭露之更一實施例之加強光型的一種發光結構之示意圖。如第10圖所示,發光模組30可更包括一透光遮罩35,覆蓋基板31上方之該些LED 320,以增強側面光,讓LED出光角度更大(於一實施例中,原本出光角度為120度,覆蓋透光遮罩35後之出光角度至少大於140度)。一實施例中,透光遮罩35其材質例如是透明玻璃,並與柱體15之承載平台151接合,其形狀例如是弧狀或半圓形。In addition, in practical applications, the structure as described above can be changed according to the application requirements to enhance the light type. FIG. 10 is a schematic diagram of a light-emitting structure with enhanced light type according to a further embodiment of the disclosure. As shown in FIG. 10, the light-emitting
當然,如通常知識者可知,所有於實施例中所例示之結構樣態與數值僅為舉例說明之用,並非用以限制本揭露之範圍,例如固定件之樣態、散熱部之樣態LED的使用數量、LED放置位置與排列方式、LED的尺寸、各LED的亮度…等等,可根據應用條件所需做適當修改與變化。綜合上述,實施例提出之具有發光二極體(LED)之發光裝置,可應用於車用燈泡中,相較於傳統車用燈泡使用鹵素燈和疝氣燈,實施例之發光裝置可視不同接頭規格選擇相應的固定件20(轉接環)做配合,提高應用的彈性度,且經過適當設計,如實施例之發光結構所述,其發光結構不但所發出之光線亮度與光型確實符合車燈規範,且發光結構之底座具有散熱部,亦可有效率散逸LED發光時所產生之熱能。再者,實施例之使用發光二極體係具有體積小、節能和環保等優點,其使用壽命(一般為幾萬甚至十幾萬小時)更是比鎢絲燈節能一半以上,再者,開啟LED時也無需熱啟動,亮燈反應十分迅速,又具有低成本等多項優點。整體而言,實施例提出之具有發光二極體(LED)之發光裝置十分適合用於車輛燈泡,在實際應用上極具市場價值。Of course, as a person of ordinary knowledge can know, all the structural forms and values exemplified in the embodiments are for illustrative purposes only, and are not intended to limit the scope of the disclosure, such as the form of the fixing member, the form of the heat dissipating section LED The number of LEDs, the placement and arrangement of LEDs, the size of LEDs, the brightness of each LED, etc. can be modified and changed according to the application conditions. In summary, the light-emitting device with light-emitting diode (LED) provided in the embodiment can be applied to a car light bulb. Compared with the traditional car light bulb using halogen lamp and hernia lamp, the light-emitting device of the embodiment can be seen in different connector specifications Select the corresponding fixing member 20 (adapter ring) to cooperate to improve the flexibility of the application, and through appropriate design, as described in the light-emitting structure of the embodiment, the light-emitting structure not only emits light with a light type that really matches the lamp Standard, and the base of the light-emitting structure has a heat dissipation part, which can also efficiently dissipate the heat energy generated when the LED emits light. Furthermore, the use of light-emitting diode system in the embodiment has the advantages of small size, energy saving and environmental protection, and its service life (generally tens of thousands or even hundreds of thousands of hours) is more than half of the energy saving of tungsten filament lamps. Furthermore, turn on the LED There is no need for hot start, the light response is very fast, and it has many advantages such as low cost. Overall, the light-emitting device with light-emitting diode (LED) proposed in the embodiment is very suitable for vehicle bulbs, and has great market value in practical applications.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In summary, although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be deemed as defined by the scope of the attached patent application.
10‧‧‧底座11‧‧‧座體112‧‧‧前表面114‧‧‧後表面115‧‧‧側表面13‧‧‧散熱部130‧‧‧鰭部170‧‧‧散熱片15、16‧‧‧柱體C0‧‧‧柱體之中心軸151‧‧‧承載平台153‧‧‧容置空間20、20’‧‧‧固定件201、201’‧‧‧第一表面202‧‧‧第二表面30‧‧‧發光模組31、31’‧‧‧基板31a‧‧‧基板之一端32‧‧‧發光二極體(LED)組件32S‧‧‧基座320、320-1、320-2、320-3、320-4‧‧‧發光二極體35‧‧‧透光遮罩40‧‧‧殼體A1‧‧‧第一區域A2‧‧‧第二區域A3‧‧‧第三區域AL‧‧‧可放置LED之區域O1、O2、O3‧‧‧中心點Ls‧‧‧線d1‧‧‧第一垂直距離d2‧‧‧第二垂直距離d3‧‧‧第三垂直距離x1、x2、x3、L1‧‧‧長度y1、y2、y3、W1‧‧‧寬度10‧‧‧Base 11‧‧‧Seat body 112‧‧‧Front surface 114‧‧‧Rear surface 115‧‧‧‧Side surface 13‧‧‧radiating part 130‧‧‧fin part 170‧‧‧fins 16, 16 ‧‧‧Cylinder C 0 ‧‧‧Cylinder central axis 151‧‧‧Bearing platform 153‧‧‧Accommodation space 20, 20′‧‧‧ Fixing parts 201, 201′‧‧‧‧First surface 202‧‧ ‧Second surface 30‧‧‧Light emitting module 31, 31′‧‧‧Substrate 31a‧‧‧One end 32‧‧‧Light emitting diode (LED) assembly 32S‧‧‧Base 320, 320-1, 320-2, 320-3, 320-4‧‧‧‧Light-emitting diode 35‧‧‧Translucent mask 40‧‧‧case A1‧‧‧first area A2‧‧‧second area A3‧‧‧ Third area A L ‧‧‧Area where LEDs can be placed O1, O2, O3 ‧‧‧ Center point Ls‧‧‧ Line d1‧‧‧ First vertical distance d2‧‧‧ Second vertical distance d3‧‧‧ Third Vertical distance x1, x2, x3, L1‧‧‧ length y1, y2, y3, W1‧‧‧ width
第1圖為本揭露一實施例之一發光結構之示意圖。 第2圖為第1圖之發光結構中固定件、發光模組與底座完成組合後之示意圖。 第3A、3B圖係分別繪示一H11接頭規格的轉接環和一H7接頭規格的轉接環之示意圖。 第4圖為本揭露另一實施例之發光結構中,底座與散熱部之示意圖。 第5圖係為本揭露另一實施例之一發光結構之示意圖。 第6圖係繪示如第5圖所示之發光結構中,其發光模組在yz平面上之示意圖。 第7圖係繪示本揭露一實施例之發光結構中,一種LED排列區域決定之示意圖。 第8A圖為本揭露一實施例之一種LED排列方式之示意圖。 第8B圖為本揭露一實施例之又一種LED排列方式之示意圖。 第8C圖為本揭露一實施例之再一種LED排列方式之示意圖。 第9A圖為本揭露之又一實施例之加強散熱的一種發光結構之示意圖。 第9B圖為第9A圖之發光結構中固定件、發光模組與底座完成組合後之示意圖。 第10圖為本揭露之更一實施例之加強光型的一種發光結構之示意圖。FIG. 1 is a schematic diagram of a light-emitting structure according to an embodiment of the disclosure. FIG. 2 is a schematic diagram of the fixing member, the light emitting module and the base in the light emitting structure of FIG. 1 after being combined. Figures 3A and 3B are schematic diagrams showing an adapter ring of H11 connector specification and an adapter ring of H7 connector specification, respectively. FIG. 4 is a schematic diagram of a base and a heat dissipation portion in a light-emitting structure according to another embodiment. FIG. 5 is a schematic diagram of a light emitting structure according to another embodiment of the disclosure. FIG. 6 is a schematic diagram of the light emitting module on the yz plane in the light emitting structure shown in FIG. 5. FIG. 7 is a schematic diagram of determining an LED arrangement area in the light-emitting structure of an embodiment of the present disclosure. FIG. 8A is a schematic diagram of an LED arrangement according to an embodiment of the disclosure. FIG. 8B is a schematic diagram of another LED arrangement according to an embodiment. FIG. 8C is a schematic diagram of yet another LED arrangement in an embodiment. FIG. 9A is a schematic diagram of a light-emitting structure that enhances heat dissipation according to another embodiment of the disclosure. FIG. 9B is a schematic diagram of the fixing member, the light-emitting module and the base in the light-emitting structure of FIG. 9A after being combined. FIG. 10 is a schematic diagram of a light-emitting structure with enhanced light type according to a further embodiment of the disclosure.
10‧‧‧底座 10‧‧‧Base
11‧‧‧座體 11‧‧‧Body
112‧‧‧前表面 112‧‧‧Front surface
114‧‧‧後表面 114‧‧‧ Rear surface
115‧‧‧側表面 115‧‧‧Side surface
13‧‧‧散熱部 13‧‧‧Cooling Department
130‧‧‧鰭部 130‧‧‧fin
15‧‧‧柱體 15‧‧‧pillar
151‧‧‧承載平台 151‧‧‧ bearing platform
20‧‧‧固定件 20‧‧‧Fixed parts
201‧‧‧第一表面 201‧‧‧First surface
202‧‧‧第二表面 202‧‧‧Second surface
30‧‧‧發光模組 30‧‧‧Lighting module
31‧‧‧基板 31‧‧‧ substrate
32‧‧‧發光二極體組件 32‧‧‧ LED components
32S‧‧‧基座 32S‧‧‧Dock
320‧‧‧發光二極體 320‧‧‧ LED
Claims (17)
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TW107122161A TW202001142A (en) | 2018-06-27 | 2018-06-27 | Lighting structure |
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TW107122161A TW202001142A (en) | 2018-06-27 | 2018-06-27 | Lighting structure |
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Publication Number | Publication Date |
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TW202001142A true TW202001142A (en) | 2020-01-01 |
Family
ID=69941961
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2018
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