TW201946771A - Low cost dielectric for electrical transmission and antenna using same - Google Patents

Abstract

A transmission conduit for RF signal, comprising: a dielectric plate; a conductive circuit positioned on one surface of the dielectric plate; a conductive ground positioned on opposite surface of the dielectric plate; wherein the dielectric plate comprises a sandwich of at least one high-dielectric constant layer and one foam plate. The dielectric plate can be made of a sandwich of glass and foam plate, such as Rohacell ®. The glass and foam plates have thickness calculated to give the sandwich the required overall dialectic constant.

Description

Low-cost dielectric for electric transmission and antenna using the same

The invention mainly relates to the technical field of dielectric materials applied to provide insulation for electrical conductors. The dielectric disclosed in the present invention is particularly suitable for RF transmission lines, such as wires for conducting RF signals at antennas.

Common methods of conducting electromagnetic energy between different locations are using circuit boards with microstrip printing technology, or using metal waveguides. The advantage of making the waveguide on the circuit board is that it can be produced in a higher yield and can form a flat structure. However, its disadvantage is the loss of electromagnetic energy, which is proportional to the propagation distance of high-frequency electronic signals. The advantage of using a metal waveguide is that its loss is low, but its disadvantage is that it cannot be made as thin as a circuit board and it is not cost-effective.

Some vendors design their circuit board substrates to have low propagation loss characteristics. A typical low-loss substrate material is a mixture of polytetrafluoroethylene and glass. However, these circuits are more expensive because the process of pressing Teflon and glass plates requires significant pressure.

Many low-loss materials, such as polytetrafluoroethylene (commonly known as Teflon®), have encountered difficulties in their applications. The thermal expansion and contraction rates of these materials and the thermal expansion and contraction rates of conductive metals, and the desired The thermal expansion and contraction rates of the conductive metal bonded to the material are very different. For example, if a copper wire is formed on a Teflon material, the rate of expansion of Teflon due to temperature rise will be the same as the rate of expansion of copper due to temperature rise. As a result, the copper layer will be peeled from the Teflon substrate. The current technology used to solve this expansion problem is to use glass-loaded Teflon material to reduce its thermal expansion coefficient, and use a substantially different process to process.

Another problem with many low-loss materials, such as Teflon, is that these materials have low surface energy, making it difficult to adhere to conductive circuits. In many cases glue or other adhesives must be used, and these materials must have a negative RF propagation factor.

Another disadvantage of Teflon is its high cost. In many modern applications, the entire transmission circuit must be able to be manufactured at a very low cost. This requirement makes it impossible to use Teflon as a substrate.

Rohacell® is a structural foam based on polymethacrylimide (PMI), manufactured by Evonik Röhm GmbH, Darmstadt, Germany. Rohacell's dielectric constant εr is relatively low, about 1.046-1.093, depending on the formulation used. For example, foams manufactured by Rohacell have been used as dielectrics in various RF systems. One example is the material illustrated in U.S. Patent Publication 2015/0276459, the invention name of which is Foam Filled Dielectric Rod Antenna.

Therefore, there is a need in the art for an improved electromagnetic energy transmission carrier that can be applied, for example, to antennas used in wireless communications.

The following summary of the invention is provided as a basic understanding of several aspects and technical features of the present invention. The description of the summary is not a comprehensive introduction to the invention, nor is it intended to specifically point out the essential or essential elements of the invention, nor is it intended to define the scope of the invention. Its sole purpose is to present some concepts of the invention in a simplified form and as a prelude to the more detailed description of the invention that follows.

The disclosed embodiments provide a flat and low-cost dielectric material. In the disclosed examples, the embodiments of the present invention are applied to antennas, but the present invention can also be applied to other devices that require high-frequency electronic transmission, providing transmissions such as microwave, radar, and laser radar.

In the disclosed embodiments, the electrical conductors are separated by a dielectric material. The dielectric material disclosed in the present invention can replace Teflon and be used in any application where Teflon is currently used. Although Teflon has the characteristics of high performance, the cost is relatively high. The embodiment disclosed by the present invention can provide performance equivalent to Teflon, but the cost is much lower.

Overall, the dielectric plate of the present invention is composed of at least two flat plates sandwiched, one of which has a high dielectric constant, such as glass, and the other has a dielectric constant as close to air as possible. A suitable example of the glass is Vycor® glass, and a suitable example of the material having a dielectric constant close to air is a foam, such as a structural foam, such as Rohacell®. The foam should have a dielectric constant between 1.0 and 1.1.

The disclosed embodiments include an antenna array having a plurality of radiating elements on a variable dielectric constant (VDC) material. The ability to change the VDC provides the possibility to use software to control the parameters of the antenna, including steering. The dielectric layer that separates the various elements in the antenna is an interlayer using a glass plate and a foam plate during implementation. Calculate the ratio between the thickness of the glass and the thickness of the foam so that the dielectric constant experienced by the site can reach the desired total dielectric constant. Specifically, the total dielectric constant can be increased by increasing the relative thickness of the glass plate relative to the thickness of the foam, or the total dielectric constant can be reduced by reducing the relative thickness of the glass plate relative to the thickness of the foam.

Other embodiments of the present invention provide a non-radiative electrical device having conductive wires separated by a dielectric interlayer formed by a glass plate and a foam plate.

A disclosed embodiment of the present invention provides a transmission channel for an RF signal, including: a dielectric plate; a conductive circuit positioned on one surface of the dielectric plate; and another located on the dielectric plate. A conductive ground on the surface; wherein the dielectric plate includes a sandwich structure including at least a high dielectric constant layer and a foam plate. The high dielectric constant layer is formed to have a dielectric constant of 3.8-4.4. The high dielectric constant layer may be formed of glass, PET, or the like. The foam plate is formed to have a dielectric constant of 1.0 to 1.1. The dielectric board may include a foam board sandwiched between an upper polyethylene terephthalate (PET) layer and a lower PET layer. The conductive circuit may include at least one radiation patch, or a circuit defining a hybrid coupler.

In other embodiments, the present invention provides an antenna including: an insulating spacer; at least one radiating patch disposed above the insulating spacer; at least one delay line disposed below the insulating spacer; a variable A dielectric constant (VDC) layer disposed below the delay line; a dielectric plate; a ground plane disposed below the dielectric plate; a bottom insulating plate disposed below the ground plane; and a feed An electric wire is disposed below the bottom insulating plate; wherein at least one of the insulating spacer, the dielectric plate, and the bottom insulating plate includes at least one high dielectric constant layer and a foamed plate. The high dielectric constant layer may include one of polytetrafluoroethylene, polyethylene terephthalate (PET), glass fiber impregnated polypropylene, or a glass plate. The high dielectric constant layer is formed to have a dielectric constant of 3.8-4.4. The foam plate is formed to have a dielectric constant of 1.0 to 1.1. The antenna may further include a conductive electrode adjacent to the VDC layer. At least one of the insulating gasket, the dielectric plate, and the bottom insulating plate may include two glass plates and a foam plate sandwiched between the two glass plates, or two PET plates and sandwiched A foam board between the two PET boards. The antenna may further include at least one conductive via for connecting each delay line to a corresponding piece of radiation patch. The ground plane may include at least one window, and each window is opened directly below a corresponding radiation patch.

According to another embodiment, the present invention also provides a method for manufacturing an RF transmission channel, the method comprising the steps of: forming a conductive circuit above a top surface of an insulating plate, the insulating plate including a glass plate or polyterephthalate One of glycol ester (PET) boards; attaching a ground plane to the bottom surface of the foam board; and adhering the insulating board to a foam board. The step of attaching the ground plane may include one of the following steps: forming the ground plane directly on the bottom surface of the foam board; or forming the ground plane on a second insulating board, and attaching the second insulating board Adhered to the bottom surface of the foam board. The second insulating plate may be formed of one of a glass plate or polyethylene terephthalate (PET). [Illustrated simple illustration]

Other aspects and features of the present invention will be apparent from the following detailed description and the accompanying drawings. It should be understood that the detailed description and drawings of the invention merely provide various non-limiting examples of the various embodiments of the invention as defined by the scope of the appended patent applications.

The accompanying drawings are included in and constitute a part of this specification. The drawings illustrate embodiments of the present invention, and together with the description of the invention, explain and describe the principles of the present invention. The purpose of these drawings is to describe the main features of the illustrated embodiments in the form of diagrams. These drawings are not used to describe each feature of the actual embodiment or to describe the relative size ratio of the components shown, nor are they drawn to scale.

Figure 1 shows a cross-sectional view of a prior art structure using a dielectric such as Teflon.

FIG. 2 is a schematic diagram showing an embodiment of a dielectric for a transmission device according to the present invention.

FIG. 3 shows a schematic diagram of another embodiment of the transmission device.

4A and 4B are schematic diagrams of an embodiment of a software-controlled antenna using a dielectric interlayer disclosed in the present invention.

FIG. 5 shows a schematic diagram of an embodiment of a non-radiative electronic device using a dielectric interlayer disclosed in the present invention.

FIG. 6 shows a schematic diagram of a modified embodiment of the present invention applied to an RF transmission channel.

Hereinafter, several embodiments of the dielectric interlayer of the present invention will be described with reference to the drawings. Different embodiments or combinations thereof can provide different applications or achieve different advantages. According to the results to be achieved, different technical features disclosed in this specification can be used in whole or in part, or can be used alone or in combination with other technical features, so as to obtain a balanced advantage between requirements and restrictions. Therefore, reference to different embodiments may highlight specific advantages, but the invention is not limited to the disclosed embodiments. That is to say, the technical features disclosed in this specification are not limited to being applied to the described embodiments, but can be "combined and matched" with other technical features and combined in other embodiments.

FIG. 1 is a cross-sectional view showing a structure of a prior art device using Teflon as a dielectric material 100. In this example, Teflon has a dielectric constant εr = 2.2 and its loss factor (loss tangent-ohmic loss) is tgδ = 0.0009. The ground conductor 105 is disposed on the bottom of the dielectric 100, and a conductive and / or radiating electrode 110 such as a microstrip is also provided on the top of the dielectric 100. The thickness of the dielectric is represented by h.

The one-way arrows in Figure 1 represent the fields obtained by this structure. As shown in Figure 1, a portion of the field passes only through the dielectric material, but the rest of the field runs through air and the dielectric material. Therefore, the effective dielectric constant is some average of the dielectric constant of air and the dielectric constant of Teflon (or other dielectric materials used). This effective dielectric constant is related to the square root of the product of the two dielectric constants and is weighted by the effective volume. Since the dielectric constant of the air shown in FIG. 1 is 1, the effective dielectric constant of the structure of FIG. 1 is equal to the dielectric constant of Teflon.

FIG. 2 shows a general embodiment of a dielectric configuration using the present invention. In the embodiment of FIG. 2, the dielectric interlayer 200 is composed of two materials: a flat plate 202 with a high dielectric constant, such as polytetrafluoroethylene, polyethylene terephthalate (PET), and glass fiber Flat sheets made of impregnated polypropylene or glass, and sheets of material with a dielectric constant close to air, such as structural foams that are mostly air, such as Rohacell sheet 204. By regulating the thickness ratio h1 / h2 of the two plates, the desired effective dielectric constant can be achieved. For example, in the embodiment of FIG. 2, Vycor® glass can be used. Vycor glass is a high-silica glass sold by Corning Corporation in the United States and has a very low coefficient of thermal expansion. According to the formula used for manufacturing, the dielectric constant of the Vycor glass can be 3.8-4.4, and its loss factor is 0.0003. The board 204 made of Rohacell exhibits a dielectric constant of about 1.06 and a loss factor of 0.0003. Therefore, in this example, if the thicknesses of the two plates are made the same, that is, h1 / h2 = 1, the effective dielectric constant of the structure εr = 2.159, and the effective loss factor (serial addition) is tgδ = 0.0009.

As can be seen from the example of FIG. 2, the disclosed embodiment of the present invention provides a dielectric composed of multiple adjacent insulating materials, thereby forming a low-loss dielectric; the low-loss dielectric can be regulated It becomes an effective dielectric with similar characteristics to Teflon. In one embodiment, the top layer of the dielectric is made of a glass plate. An array formed by three radiating elements 210 is shown in FIG. 2, but the field lines of only one radiating element 210 are shown for clarity.

FIG. 3 shows a cross-sectional view of another embodiment of the method of the present invention using a multilayer dielectric. The dielectric interlayer 300 of the embodiment of FIG. 3 is composed of three layers of materials: a first glass plate 302, a second glass plate 303, and an air-filled space 306. The glass plates 302 and 303 are separated by a partition 308 and are maintained at a precise distance h2. A ground plate is formed on the bottom surface of the glass 303, and a transmission line or a radiation electrode is formed on the top surface of the glass 302. The thicknesses h1 and h3 of the glass plate 302 and the glass plate 303 are regulated respectively to provide a desired effective dielectric constant. Factors need to be added to the air layer 306 during the calculation. In this case, if h1 + h3 = h2, that is, the thickness of the upper glass plate plus the thickness of the lower glass plate is equal to the interval formed by air, the effective dielectric constant will be 2.09.

Therefore, the embodiment of FIG. 3 provides a dielectric plate structure made of two plates separated by a spacer, forming an air gap between the two plates. Both plates can be made of glass, such as Vycor glass. Alternatively, the spacer may be made of Vycor glass. The ground plate may be formed on one of the glass plates, and the wires of the radiation patch may be formed on the other glass plate.

Therefore, as described above, according to one aspect of the present invention, the present invention provides a radiation device including: a dielectric plate; a conductive ground plane formed on a bottom surface of the dielectric plate; and formed on the dielectric plate A radiating element on a top surface of a dielectric plate; wherein the dielectric plate includes a glass plate and a foam plate.

An example of a radiation device made using the dielectric interlayer of the present invention is shown in Figs. 4A-4B. In US Patent Application No. 15 / 654,643, the applicant discloses a multilayer structure with a software-defined antenna. This antenna uses a radiating device array similar to that of Figs. 4A-4B. In the following description, only a portion related to one of the radiating elements will be described. FIG. 4A shows a top view of the device, and FIG. 4B shows a cross-sectional view of the device shown in FIG. 4A. The two figures show an example when the dielectric sandwich structure disclosed in the present invention is applied to a multilayer software-defined antenna.

The radiation patch is denoted as patch 410, and the delay line is denoted as conductive line 415. A radiation patch is formed over the top dielectric spacer 400. The dielectric spacer 400 is generally formed in the form of a dielectric (insulating) plate or a dielectric sheet, but in this embodiment is a dielectric composed of a glass plate 402 and a foam plate 404 (eg, Rohacell). Made of sandwich. The radiation patch 410 is formed on the top surface of the glass by techniques such as adhesion of a conductive film, sputtering, printing, and the like. At the patch position, a through hole 425 is formed in the glass 402 and the foam 404 layer, and a conductor is passed through the through hole 425 to be connected to the rear surface of the patch 410. The delay line 415 is formed on the bottom surface of the foam board 404 (or on the top surface of the upper splint 442), and forms a physical connection and an electrical connection with the conductor through the through hole 425. That is, through the conductor in the through-hole 425, there is a continuous DC electrical connection from the delay line 415 to the radiation patch 410. As shown in FIG. 4A, the delay line 415 is a meandering wire, and can assume any shape of meandering so as to provide sufficient length to produce a desired delay, thereby causing a desired phase shift in the RF signal.

The delay characteristics produced with the delay line 415 may be regulated using a variable dielectric constant (VDC) plate 440 of a material 444 having a variable dielectric constant. Although any method for constructing the VDC board 440 may be suitable for use with the embodiment of the present invention applied to the antenna, for convenience of description, in the specific embodiment, the VDC board 440 is shown as the following structure: A splint 442 (eg, glass, PET, etc.), a layer of variable dielectric constant material 444 (eg, a twisted nematic liquid crystal layer), and a lower splint 446. In other embodiments of the present invention, one or both of the splints 442 and 444 may be omitted. Alternatively, a splint such as epoxy resin or glass beads may be used instead of the splint 442 and / or 444. In addition, as shown in FIG. 4B, according to the disclosed embodiment, one or both of the splints may be configured as a sandwich structure. In the example shown in FIG. 4B, the lower sandwich plate 446 is shown as a double-layer sandwich structure having a foam plate 448 and a glass plate 449.

In some embodiments of the present invention, for example, when a twisted nematic liquid crystal layer is used, the VDC plate 440 further includes an alignment layer that can be deposited and / or bonded to the bottom of the upper splint 442. The alignment layer may be a thin material layer, such as a polyimide-based PVA, which is transferred or cured by UV radiation to align the molecules of the LC at the edges of the regulated substrate.

The effective dielectric constant of the VDC board 440 can be controlled by applying a DC potential to the VDC board 440. To achieve this, electrodes are formed and connected to a controllable voltage potential. There are various options for the configuration of the electrodes. Several of these examples will be shown in the disclosed embodiments of the invention. In the configuration shown in FIG. 4B, two electrodes 443 and 447 are provided, one of which is on the bottom surface of the upper splint 442 and the other is on the upper surface of the lower splint 446. In this particular example, the electrode 447 is shown connected to a variable voltage potential 441 and the electrode 443 is grounded. The dashed line in the figure shows an alternative way, in which the electrode 443 can also be connected to the variable potential 439.

Therefore, as long as the output voltage of the variable potential 441 and / or the variable potential 439 is changed, the dielectric constant of the VDC material near the electrodes 443 and 447 can be changed, thereby changing the delay of the RF signal running through the delay line 415 characteristic. The controller Ctl may be used to perform changing the output voltage of the variable potential 441 and / or the variable potential 439. The controller Ctl runs a software which causes the controller to output an appropriate control signal for appropriately setting the output voltage of the variable potential 441 and / or the variable potential 439. Similarly, traditional controllers can also be used to provide control signals and common signals to control the characteristics of the antenna. Therefore, you can use software to control the performance and characteristics of the antenna, so it is called an antenna controlled by software.

It should be particularly noted here that the "ground potential" referred to in this specification refers to the generally called ground potential, that is, the ground potential, but it can also be a common potential or a reference potential, which can be a set potential or a floating Potential. For example, a traditional LCD display controller outputs two signals to each pixel, one of which is called a ground or common signal. Similarly, although the ground potential symbol is used in the drawings, this symbol can also be used to indicate ground potential or common potential. Therefore, the ground and ground potentials referred to in this specification include the meanings of a common potential and a reference potential, and the potential may be a set potential or a floating potential.

In the transmission mode, an RF signal is applied to the feeding sheet 460 via a connector 465 (for example, a coaxial cable connector). In the example shown in FIG. 4B, there is no DC electrical connection between the feed sheet 460 and the delay line 415. However, in the disclosed embodiment of the present invention, these material layers may be designed such that an RF short circuit is provided between the feed sheet 460 and the delay line 415. As shown in FIG. 4B, a backplane conductive ground (or common potential) 455 is formed on the upper surface of the backplane insulation layer (or dielectric layer) 450 or the bottom surface of the lower splint 446. The backplane conductive ground 455 is usually a layer of conductor that covers the entire area of ​​the antenna array. At each RF feed position, a window (DC disconnect) 453 is provided in the backplane conductive ground 455. The RF signal travels from the feed sheet 460 via the window 453 and is coupled to the delay line 415. In receive mode, the direction of operation is reversed. Therefore, an open DC circuit and an RF short circuit are formed between the delay line 415 and the feeding sheet 460. The back plate insulating layer 450 may also be configured according to the embodiment disclosed herein, which in this embodiment includes a glass plate 452, a foam plate 454, and a glass plate 456.

Therefore, as described above, according to another aspect of the present invention, the present invention provides a radiation device including: a dielectric plate; a radiating element formed on a top surface of the dielectric plate; a dielectric A backplane; a conductive ground plane formed on the bottom surface of the dielectric backplane; and a variable dielectric constant material sandwiched between the dielectric backplane and the dielectric backplane; and At least one of the dielectric plate and the dielectric back plate includes a glass plate and a foam plate.

As can be seen from the above description, the disclosed embodiments of the present invention can be applied to radiating elements such as antennas and antenna arrays. However, according to other aspects of the invention, the invention also provides an electronic device or electronic component having a variable electrical characteristic or based on a potential applied to a variable dielectric constant member associated with the device or component And perform different operations, and include a low-cost dielectric interlayer. According to aspects of the present invention, the electronic device or electronic component may include a bent wire, a power divider, a filter, a port, a phase shifter, a frequency shifter, an attenuator, a coupler, Capacitors, inductors, duplexers, mixers, and may also include radiating elements other than electronic equipment. It is worth noting that multiple devices can also be formed on the same dielectric interlayer, as in the prior art using Rogers® or PCP.

According to the disclosed aspect of the present invention, the invention contained in the applicant's US Patent Application No. 15 / 654,643 can be further improved using the dielectric sandwich board of the present invention, thereby providing the same performance at a relatively low cost . FIG. 5 shows an embodiment of a four-port hybrid coupler 500. When no VDC is used, the signal input at port 1 is split and transmitted to port 2 and port 3; the output sent to port 2 has no phase change, and the output of port 3 undergoes a 90-degree phase change. Similarly, the signal input to port 4 is split and transmitted to port 2 and port 3; the output sent to port 3 has no phase change, and the output of port 2 undergoes a 90-degree phase change. The above phenomenon can be clearly understood from FIG. 5. However, several ways in which the VDC can be configured have been shown in the embodiment of FIG. 5. Depending on the operational expectations of the hybrid coupler 500, all or part of the VDC can be configured to achieve the desired performance.

For example, VDC 503 can be provided under the wires of input port 1. By applying a voltage potential to the electrodes of the VDC 503, the phase of its input signal can be controlled. Therefore, the phases at the two output ports 2 and 3 will change based on the phase change caused by the voltage potential at the VDC 503, resulting in an overall change. This means that the phase at the output port 2 can be different from the phase of the input signal at the input port. On the other hand, the phase of output port 2 can also be changed independently by the voltage potential at VDC 507. Therefore, the phase of output port 3 will be the same as that of input port 1 by 90 degrees, but the phase of output port 2 depends on the voltage potential applied to VDC 507, which may not be zero degrees. In addition, a voltage potential may be applied to the electrodes of the VDC 527 to change the phase at the output port 3 without making the phase change independent of the output at the port 2. Therefore, the output on output port 2 can maintain the same phase as the input on port 1, but the output on port 3 can be changed by 90 degrees relative to the input on port 1. By applying a voltage potential to VDC 523, 507, and 527, the same effect can be achieved for the input of input port 4. In addition, normally the input signal at port 1 will split with equal energy between output ports 2 and 3. However, by controlling the voltage potential at VDC 508, 528, 515A, and 515B, the energy delivered to each output port will be changed accordingly, so that the strength of each port output can be controlled.

The cross-sectional structure of the device shown in FIG. 5 is shown in an enlarged view of FIG. 5. The element 527 is a variable dielectric constant material, and the element 527 receives a potential from the power source V. The conductive line 520 is formed over the dielectric plate 550 manufactured according to any embodiment disclosed in the present invention. For example, the dielectric plate 550 may be made of a plywood of a glass plate and a foam plate. The same is true for the back plate 555, which can also be manufactured according to any embodiment disclosed in the present invention. For example, yes.

Therefore, it can be understood from the foregoing description that according to one aspect of the present invention, the present invention also provides an electronic device including: a back plate; a dielectric plate; A variable dielectric constant material; an electrode configured to apply a potential to the variable dielectric constant material; and a wire formed on top of the dielectric plate; wherein at least one of the dielectric plate and the back plate includes Glass and foam boards.

Figure 6 shows a variant embodiment of the invention for an RF transmission channel. The structure can be a radiating element, a non-radiating element, or both, such as a non-radiating transmission line to a radiating patch. In the embodiment of FIG. 6, the dielectric interlayer 200 is composed of two materials: a PET (polyethylene terephthalate) top layer 607 having a high dielectric constant, and a material plate having a dielectric constant close to air. For example, the foam material 604 (such as Rohacell) whose structure is mainly air, and the bottom layer of PET 608. Regulate the thickness ratio (h1 + h3) / h2 of the two PET layers and the foam board to achieve the desired effective dielectric constant. For example, in the example of FIG. 6, a PET layer with a dielectric constant of about 4.0 at 3 GHz is used. Depending on the material composition used to make the PET plate, the PET plate may have a slightly different dielectric constant, but all fall within the range of 3.8-4.4.

In the example of FIG. 2, the conductive line or patch 610 is fabricated on the top surface of the PET top layer 607. A conductive ground plane 605 is formed on the bottom surface of the PET underlayer 608. A PET interlayer was then adhered to the foam 604. This design is very easy to manufacture, as various techniques such as printing, sputtering, electroplating can be used. The conductive line 610 and the conductive ground plane 605 are also very easy to manufacture on the PET layer. In addition, conductive lines 610 and 605 can also be easily fabricated on a PET layer using reel-to-reel methods. The present invention provides an extremely fast and economical manufacturing method.

All RF antennas are the same, and reception and transmission are symmetrical. Therefore, the description of one of the two also applies to the other. In this patent specification, the main description content is for transmission, but the same description is also applicable to reception, except that the two directions are opposite.

It should be understood that the procedures and techniques described in this specification are not necessarily related to any particular device and may be implemented by any suitable combination of various elements. In addition, various types of general-purpose devices can be used to achieve the invention in accordance with the teachings of this specification. The present invention has been described as above according to specific embodiments, but the description content is merely an illustration in any case, and is not intended to limit the present invention. Those skilled in the art can understand that many different combinations can be applied to implement the present invention.

In addition, as long as the patent specification is read and the invention described in the specification is practiced, other embodiments of the present invention will be apparent to those skilled in the art and can be inferred. Therefore, the description of this patent specification and its embodiments is for the purpose of illustration only and should not be used to limit the scope of the invention. The true scope of the present invention should be regulated by the following patent application scope.

100‧‧‧ Dielectric

105‧‧‧ ground conductor

110‧‧‧ radiation electrode

200‧‧‧ Dielectric interlayer

202‧‧‧ Tablet

204‧‧‧Rohacell board

210‧‧‧ radiating element

300‧‧‧ Dielectric interlayer

302, 303, 402, 449, 452, 456‧‧‧ glass plates

306‧‧‧air layer

308‧‧‧ partition

400‧‧‧ Dielectric spacer

404, 448, 454‧‧‧ foam board

410‧‧‧Patch

415‧‧‧ Delay Line

425‧‧‧through hole

439‧‧‧Variable potential

440‧‧‧VDC board

441‧‧‧Variable voltage potential

442‧‧‧ upper splint

443‧‧‧electrode

444‧‧‧ Variable Dielectric Constant Material Layer

446‧‧‧ lower splint

447‧‧‧electrode

450‧‧‧Backboard insulation

453‧‧‧window

455‧‧‧ backplane conductive ground

460‧‧‧Feeder

465‧‧‧Connector

500‧‧‧ hybrid coupler

503, 507, 508, 515A, 515B, 523, 528‧‧‧VDC

520‧‧‧Conductive wire

527‧‧‧VDC, components

550‧‧‧ Dielectric board

555‧‧‧Back

604‧‧‧foam (material)

605‧‧‧ conductive ground plane

607‧‧‧PET top layer

610‧‧‧ Conductive wire / SMD

Claims (20)

A transmission channel for an RF signal includes: a dielectric plate; a first conductive circuit positioned on one surface of the dielectric plate; and a second conductive plate positioned on the other surface of the dielectric plate A circuit; wherein the dielectric plate includes a sandwich structure, and the sandwich structure includes at least a high dielectric constant layer and a foam plate. For example, the transmission channel of the first patent application range, wherein the high dielectric constant layer is formed to have a dielectric constant of 3.8-4.4. For example, the transmission channel of the second patent application range, wherein the high dielectric constant layer is formed of glass. For example, the transmission channel of the second patent application range, wherein the high dielectric constant layer is formed of polyethylene terephthalate (PET). For example, the transmission channel of the first patent application range, wherein the foam plate is formed to have a dielectric constant of 1.0 to 1.1. For example, the transmission channel of the first patent application range, wherein the dielectric board includes an upper polyethylene terephthalate (PET) layer and a lower PET layer, and a foam board sandwiched between the Between the upper polyethylene terephthalate (PET) layer and the lower PET layer. For example, the transmission channel of claim 1, wherein the first conductive circuit includes at least one radiation patch. For example, the transmission channel of the first patent application range, wherein the second conductive circuit includes a ground circuit. An antenna includes: an insulating spacer; at least one radiating patch disposed above the insulating spacer; at least one delay line disposed below the insulating spacer; a variable dielectric constant (VDC) layer, Is disposed below the delay line; a dielectric plate; a ground plane is disposed below the dielectric plate; a bottom insulation plate is disposed below the ground plane; and a feeder line is disposed on the bottom insulation plate Below; wherein, at least one of the insulating spacer, the dielectric plate, and the bottom insulating plate includes at least one high dielectric constant layer and a foam plate. For example, the antenna of claim 9 in which the high dielectric constant layer includes one of polytetrafluoroethylene, polyethylene terephthalate (PET), glass fiber impregnated polypropylene, or glass plate. For example, the antenna of claim 9 in which the high dielectric constant layer is formed to have a dielectric constant of 3.8-4.4. The antenna as claimed in claim 10, wherein the foam plate is formed to have a dielectric constant of 1.0 to 1.1. For example, the antenna of claim 9 further includes a conductive electrode adjacent to the VDC layer. For example, the antenna of claim 9 in which at least one of the insulating gasket, the dielectric plate and the bottom insulating plate includes two glass plates and a foam sandwiched between the two glass plates. board. For example, the antenna of claim 9, wherein at least one of the insulating gasket, the dielectric plate and the bottom insulating plate includes two PET plates and a foam sandwiched between the two PET plates. board. For example, the antenna in the ninth scope of the patent application further includes at least one conductive via for connecting each delay line to a corresponding piece of radiation patch. For example, the antenna according to item 9 of the patent application, wherein the ground plane includes at least one window, and each window is opened directly below a corresponding piece of radiation patch. A method for manufacturing an RF transmission channel, the method comprising the steps of: forming a conductive circuit above a top surface of an insulating plate including a glass plate or a polyethylene terephthalate (PET) plate; One; attaching a ground plane to the bottom surface of the foam board; and adhering the insulating board to a foam board. The method of claim 18, wherein the step of attaching the ground plane includes one of the following steps: forming the ground plane directly on the bottom surface of the foam board; or forming the ground plane on a second insulating board A ground plane, and the second insulating plate is adhered to the bottom surface of the foam plate. For example, the method of claim 19, wherein the second insulating plate is formed of one of a glass plate and polyethylene terephthalate (PET).