TW201940544A - Epoxy based composition - Google Patents

Abstract

This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one photo-base generator. The epoxy based composition according to the present invention exhibits fast curing property under UV light and has improved adhesion strength after being stored at room temperature or being further heated.

Description

Epoxide-based composition

The present invention relates to an epoxide-based composition comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one photobase generator. The epoxide-based composition of the present invention exhibits rapid curing properties under UV light and has improved adhesion strength after further storage or further heating at room temperature.

Due to the excellent adhesion strength, chemical stability, and low shrinkage of epoxide-based adhesives to various materials, it is one of the most important and widely used adhesives for structural bonding applications.

Although epoxide-based adhesives have many advantages, traditional epoxide-based adhesives have the disadvantage of slow curing, which limits the application of epoxide-based adhesives. One solution to the problem of slow curing is to incorporate acrylate compounds into the adhesive formulation. However, the inclusion of acrylate compounds will impair the moisture reliability performance of epoxide-based adhesives and degrade low shrinkage properties.

Therefore, there is a need in the industry to develop epoxide-based compositions that can be rapidly cured under UV light and have improved adhesion strength after storage at room temperature or after further heating.

The invention relates to an epoxide-based composition comprising:
(a) at least one epoxidized unsaturated polyolefin;
(b) at least one thiol compound; and
(c) at least one photobase generator.

The epoxide composition of the present invention exhibits rapid curing properties under UV light and has improved adhesion strength after storage or further heating at room temperature.

The invention also relates to the cured products of epoxide-based compositions.

The invention also relates to articles bonded by an epoxide-based composition.

In the following paragraphs, the invention is explained in more detail. Each aspect described may be combined with any other aspect or aspects unless the opposite is expressly indicated. In particular, any feature indicated as being better or advantageous may be combined with any other feature or features indicated as being better or advantageous.

In the context of the present invention, the terms used shall be interpreted according to the following definitions, unless the context indicates otherwise.

Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an" and "the" include singular and plural indicators.

As used herein, "comprising, including, included of" is synonymous with "including, includes" or "containing, contains" and is inclusive or open-ended, and does not exclude additional Unlisted members, elements, or process steps.

The list of numerical endpoints includes all numbers and scores included in the respective ranges and the listed endpoints.

All references cited in this specification are incorporated by reference in their entirety.

Unless otherwise defined, all terms (including technical and scientific terms) used in disclosing the present invention have the meaning commonly understood by those skilled in the art to which the present invention belongs. Use further guidance, including definitions of terms, to better understand the teachings of the present invention.

In the context of this disclosure, several terms will be used.

The term `` alkyl '' (alone or used as part of a larger part) means a compound having 1-20, 1-12, 1-10, 1-8, 1-6, 1-5, 1-4, 1-3 Or optionally substituted linear or branched hydrocarbon groups of 1-2 carbon atoms.

The term "alkenyl" (either alone or as part of a larger part) means having at least one double bond and having 2-20, 2-12, 2-10, 2-8, 2-6, 2-5, 2 -4 or 2-3 carbon atoms, optionally substituted straight or branched hydrocarbon groups.

The term "alkoxy" (either alone or as part of a larger part) refers to an optionally substituted oxygen-containing straight or branched hydrocarbon group having from 1 to 20 carbon atoms.

The term "aryl" (used alone or as part of a larger part, such as "aralkyl", "aralkoxy", or "aryloxyalkyl") refers to a group containing 1 to 3 aromatic rings Optionally substituted C6-14 aromatic hydrocarbon moieties. In at least one embodiment, the aryl is a C6-10 aryl. Aryl includes, but is not limited to, optionally substituted phenyl, naphthyl, or anthracenyl. As used herein, the term "aryl" also includes groups in which an aryl ring is fused to one or more cycloaliphatic rings to form an optionally substituted cyclic structure, such as tetrahydronaphthyl, indenyl, or dihydro Indenyl ring.

The term "aralkyl" refers to an aryl group covalently attached to an alkyl group, any of which is independently substituted as appropriate. In at least one embodiment, the aralkyl group is a C6-10 aryl C1-12 alkyl group, including (but not limited to) benzyl, phenethyl, and naphthylmethyl.

The term "heteroaryl" (used alone or as part of a larger portion, such as "heteroaralkyl" or "heteroaralkoxy") refers to a group having 5 to 14 ring atoms (e.g. 5, 6, 9 Or 10 ring atoms); has 6, 10, or 14 π electrons shared in a cyclic array; and a group having 1 to 5 heteroatoms in addition to the carbon atom. Heteroaryl groups can be monocyclic, bicyclic, tricyclic, or polycyclic, such as monocyclic, bicyclic, or tricyclic, such as monocyclic or bicyclic. The term "heteroatom" refers to nitrogen, oxygen, or sulfur, and includes any oxidized form of nitrogen or sulfur and any quaternized form of basic nitrogen. For example, the nitrogen atom of a heteroaryl group may be a basic nitrogen atom and may optionally be oxidized to the corresponding N-oxide. As used herein, the term "heteroaryl" also includes groups in which a heteroaromatic ring is fused to one or more aryl, cycloaliphatic, or heterocyclic aliphatic rings. Non-limiting examples of heteroaryl include thienyl, furyl, pyrrolyl, imidazolyl, pyrazolyl, triazolyl, tetrazolyl, oxazolyl, isoxazolyl, oxadiazolyl, thiazolyl, Isothiazolyl, thiadiazolyl, pyridyl, pyridazinyl, pyrimidinyl, pyrazinyl, indazinyl, purinyl, naphthyridinyl, pyridinyl, indolyl, isoindolyl, benzothiophene Base, benzofuranyl, dibenzofuranyl, indazolyl, benzimidazolyl, benzothiazolyl, quinolinyl, isoquinolinyl, fluorinyl, phthalazinyl, quinazolinyl, quinol Oxalinyl, 4H-quinazinyl, carbazolyl, acridineyl, phenazinyl, phenothiazinyl, phenoxazinyl, tetrahydroquinolinyl, tetrahydroisoquinolinyl. The term "heteroaralkyl" refers to an alkyl group substituted with a heteroaryl group in which the alkyl group and the heteroaryl portion are independently substituted as appropriate.

Epoxidized unsaturated polyolefin <br/> The epoxidized unsaturated polyolefin of the present invention refers to a polyolefin having at least one non-aromatic double bond and at least one epoxy group per molecule.

In some embodiments of the present invention, the epoxidized unsaturated polyolefin preferably has at least two non-aromatic carbon-carbon double bonds per molecule.

In some embodiments of the present invention, the epoxidized unsaturated polyolefin preferably has at least two epoxy groups per molecule.

In some embodiments of the present invention, the epoxidized unsaturated polyolefin-based epoxidized polydiene is preferably selected from the group consisting of epoxidized polyisoprene, epoxidized polybutadiene, isoprene, and butadiene. Epoxidized copolymers, epoxidized copolymers of butadiene and ethylene, epoxidized copolymers of butadiene and propylene, and epoxidized terpolymers of butadiene, ethylene and propylene.

In some embodiments of the present invention, the epoxidized unsaturated polyolefin may be prepared by copolymerizing at least one epoxidized olefin monomer with at least one unsaturated comonomer. In a preferred embodiment, the epoxidized olefin single system is composed of a linear carbon chain having at least 4 carbon atoms, at least one carbon-carbon double bond, and at least one epoxy group; and an unsaturated copolymerized single system Consists of a straight carbon chain with at least 4 carbon atoms and at least two carbon-carbon double bonds. The 3,4-epoxy-1-butene is preferably an epoxidized olefin monomer. As a comonomer, a diene compound is preferred, such as 1,3-butadiene, 1,7-octadiene, 1,9-decadiene, 1,11-dodecadiene, or any combination thereof . Specific examples of the epoxidized unsaturated polyolefin are shown below.

Where m represents the repeating number of epoxidized olefin monomer units in [] and is an integer greater than or equal to 1, and n represents the repeating number of unsaturated comonomer units in [] and is an integer greater than or equal to 1.

Examples of commercially available epoxidized unsaturated polyolefins are, for example, JP-100, JP-200, and JP-400 from Nippon Soda Co., Ltd .; PB 3600 and PB 4700 from Daicel Corporation; and from Total Gray Valley Poly BD 600E.

In some embodiments of the present invention, the amount of the epoxidized unsaturated polyolefin in the epoxide-based composition of the present invention is 1 to 90% by weight, preferably 3 to 70% by weight based on the total weight of the composition % By weight and more preferably 20% to 65% by weight.

Thiol compound <br/> The thiol compound of the present invention means any mercapto compound having at least one thiol group per molecule. Preferably, the thiol compound has at least two thiol groups per molecule.

The thiol compound may be selected from the group consisting of aliphatic, cycloaliphatic, aromatic thiol, and any combination thereof. Illustrative thiol compounds are methane dithiol, propane dithiol, cyclohexane dithiol, trimethylolpropane ginseng (3-mercaptopropionate), trimethylolpropane ginseng (thioglycolate) , Neopentaerythritol tetra (mercaptoacetate), neopentaerythritol tetra (β-mercaptopropionate), dipentaerythritol poly (β-mercaptopropionate), ethylene glycol bis (β-mercapto Propionate) and alkyl polythiols (such as butane-1,4-dithiol, hexane-1,6-dithiol) and aromatic polythiols (such as p-xylylene mercaptan and 1,3,5-ginsyl (mercaptomethyl) benzene). Specific examples of the thiol compound are shown below.

Examples of commercially available thiol compounds are, for example, TMTP (trimethylolpropane (3-mercaptopropionate)) from Yodo Kagaku Co., Ltd .; PEMP (from SC Organic Chemical Co., Ltd. ( Neopentaerythritol tetra (3-mercaptopropionate)); and Karenz MT PE-1 from Showa Denko KK.

In some embodiments of the present invention, the amount of the thiol compound in the epoxide-based composition of the present invention is 0.5% to 50% by weight, preferably 1% to 40% by weight, based on the total weight of the composition. And more preferably from 30% by weight to 35% by weight.

Photobase generator <br/> The photobase generator of the present invention is not particularly limited as long as it can generate alkali when irradiated under UV light. The photobase generator includes, but is not limited to, a carbamate compound, an o-fluorenyl oxime compound, an ammonium salt, an aminoimine, an α-amino ketone compound, and a derivative thereof. These compounds can be used alone or in combination.

In some embodiments of the present invention, it is preferable to use an ammonium salt containing a phosphonium cation or a guanidinium cation as the photobase generator. In other embodiments, an ammonium salt containing a guanidinium cation represented by the general formula (1) and an ammonium salt containing a sulfonium cation represented by the general formula (2) are more preferably used as the photobase generator. In even other embodiments, an ammonium salt including a guanidinium cation represented by the general formula (1) is even more preferable.

Where R1 to R11 each independently represent hydrogen, halogen, optionally substituted alkyl, optionally substituted alkenyl, optionally substituted alkoxy, optionally substituted aralkyl, optionally substituted Aryl or optionally substituted heteroaryl, and at least one of R1 to R11 represents optionally substituted aralkyl, optionally substituted aryl, or optionally substituted heteroaryl.

Illustrative photobase generators of the present invention are N-cyclohexylaminocarboxylic acid o-nitrobenzyl ester, 2,6-dinitrobenzyloxycarbonyl cyclohexylamine, 2- (9-sideoxy oxygen Heteranthracene-2-yl) propanoic acid 1,5,7-triazabicyclo [4,4,0] dec-5-ene salt, 1,2-diisopropyl-3- [bis (dimethyl (dimethyl) Aminoamino) methylene] guanidinium 2- (3-benzylidenephenyl) propionate, 1,2-dicyclohexyl-4,4,5,5-tetramethylbisguanidinium n-butyl Triphenylborate and (Z)-{[bis (dimethylamino) methylene] amino] -N-cyclohexyl (cyclohexylamino) methylimmonium tetra (3-fluorophenyl) boronic acid salt.

Examples of commercially available photobase generators are, for example, WPBG-266, WPBG-300, and WPBG-345 from Wako Pure Chemical Industries Co., Ltd .; and U-CAT 5002 from San-Apro Ltd.

In some embodiments of the present invention, the amount of the photobase generator in the epoxide-based composition is 0.1% to 20% by weight and preferably 0.1% to 10% by weight based on the total weight of the composition.

Optional additives
Epoxy resin <br/> The epoxy resin of the present invention refers to any ordinary epoxy resin which is different from an epoxidized unsaturated polyolefin and can be cured by a thiol compound. Exemplary epoxy resins include, but are not limited to, bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, naphthalene epoxy resin, diphenyl ether epoxy resin, diphenyl sulfide epoxy Resin, hydroquinone epoxy resin, biphenol novolac epoxy resin, cresol novolac epoxy resin, phenol novolac epoxy resin, bisphenol A novolac epoxy resin, triphenol type epoxy resin, tetrahydroxyphenylethane type Epoxy resin and any combination thereof.

Examples of commercially available epoxy resins are, for example, D.E.R. 331 from Olin Corporation; EPON 828 from Shell Chemical Corporation; and EPICLON N-665 from Dainippon Ink and Chemicals Inc.

In some embodiments of the present invention, the amount of epoxy resin in the epoxide-based composition is 0 to 80% by weight and preferably 40 to 70% by weight based on the total weight of the composition.

Photoinitiator <br/> The photoinitiator of the present invention means any ordinary photoinitiator and preferably includes at least one free radical photoinitiator, such as selected from benzophenone, acetophenone, chlorinated Acetophenone, dialkoxyacetophenone, dialkylhydroxyacetophenone, dialkylhydroxyacetophenone ester, benzoin acetate, benzoin, benzoin alkyl ether, dimethoxybenzoin, dibenzyl Ketones, benzamidine cyclohexanol and other aromatic ketones, fluorenyl oxime esters, fluorenyl phosphine oxides, fluorenyl phosphonates, keto sulfides, benzamidine disulfides, diphenyl diphenyl Thiocarbonates and diphenyl (2,4,6-trimethylbenzyl) phosphine oxide.

Examples of commercially available light initiators include, but are not limited to, Irgacure 184, Irgacure 500, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure 127, Irgacure 1700, Irgacure 651, Irgacure 819, Irgacure 1000, Irgacure 1300, Irgacure1870, Darocur 1173, and Darocur TPO; Esacure KT046, Esacure KIP150, EsacureKT37, and Esacure EDB from LAMBERTI; H-Nu 470 and H-Nu 470X from Spectra Group Ltd .; and Genopol TX-1 from Rahn AG.

In some embodiments of the present invention, the amount of the photoinitiator is 0 to 5% by weight, and preferably 1 to 4% by weight, based on the total weight of the composition.

Others <br/> In some embodiments of the present invention, a filler may be optionally added to the epoxide-based composition. Fillers include, but are not limited to, aluminum oxide, silicon dioxide, and magnesium oxide. Representative examples of fillers include TS720 from Cabot; and Aerosil R202 from Evonik.

In some embodiments of the present invention, an adhesion promoter may be optionally added to the epoxide-based composition. The adhesion promoter may be a silane coupling agent. Suitable silane coupling agents include, but are not limited to, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ- Glycidoxypropyltrimethoxysilane, phenyltrimethoxysilane, and the like. Representative examples of adhesion promoters include Silquest A-186, Silquest A-187, Silquest A-1110, Silquest A-1120, Silquest A-1170, Silquest A-2120 from Momentive.

In a preferred embodiment, the epoxide-based composition comprises:
(a) 1 to 90% by weight of at least one epoxidized unsaturated polyolefin;
(b) 0.5 to 50% by weight of at least one thiol compound;
(c) at least one photobase generator from 0.1% to 20% by weight;
(d) 0 to 80% by weight of at least one epoxy resin; and
(e) at least one photoinitiator from 0 to 5 wt%;
The weight percentages of all the components amount to 100% by weight.

In some embodiments of the invention, the epoxide-based composition is preferably free of acrylates and derivatives thereof. Surprisingly, epoxide-based compositions that do not contain acrylates and their derivatives still exhibit rapid curing properties under UV light and the adhesive strength of the composition is further improved after storage at room temperature or after further heating.

In some embodiments of the invention, the epoxide-based composition is preferably free of photoacid generators to avoid corroding substrates bonded by the epoxide-based composition.

The epoxide-based composition of the present invention can be prepared by mixing all the components of the composition.

The UV curing time of the epoxide-based composition in the present invention can be evaluated by measuring the time for fixing two glass plates adhered by the composition under UV radiation conditions. Apply a force to the glass plate. When there is no relative movement of the two glass plates, this time is measured as the UV curing time of the epoxy-based composition.

After exposure at 100 mW / cm ² under a high-pressure mercury lamp, the UV curing time of the epoxy-based composition of the present invention is preferably less than or equal to 90 seconds, such as less than or equal to 65 seconds, less than or equal to 25 seconds, and less than 10 seconds or less, 5 seconds or less, or 1 second or less.

The adhesive strength of the epoxide-based composition in the present invention can be evaluated by measuring the force that causes the composition applied to adhere to two glass plates to fail according to ASTM D2095.

Test Methods
Of epoxy-based composition UV Curing time

The UV curing time of the epoxy-based composition is measured by measuring the two glasses adhered by the composition under a high-pressure mercury lamp (Technoflux IH 153, Ushio 101 UV Meter, 365 nm) at 100 mW / cm ² The plate is fixed for evaluation. Apply a force to the glass plate. When there is no relative movement of the two glass plates, this time is recorded as the UV curing time of the epoxy-based composition.

Method for measuring the adhesive strength of epoxy-based compositions <br/> Apply a sample of the epoxy-based composition to adhere two glass plates under a high-pressure mercury lamp (Technoflux IH 153, Ushio 101 UV Meter, 365 nm) Cured at 100 mW / cm ² for a predetermined time. The adhesive strength of the epoxy-based composition after UV curing is measured and recorded as T according to ASTM D2095 at a crosshead speed of 2 mm / min.

A sample of another epoxide-based composition having the same composition was applied to adhere two glass plates and cured under a high pressure mercury lamp (Technoflux IH 153, Ushio 101 UV Meter, 365 nm) at a predetermined time of 100 mW / cm ² . Samples of the epoxide-based composition were further stored at room temperature for 7 days. The adhesive strength of the epoxide-based composition after UV curing and subsequent storage at room temperature was measured according to ASTM D2095 at a crosshead speed of 2 mm / min and recorded as T _r .

A sample of another epoxide-based composition having the same composition was applied to adhere two glass plates and cured under a high pressure mercury lamp (Technoflux IH 153, Ushio 101 UV Meter, 365 nm) at a predetermined time of 100 mW / cm ² . A sample of the epoxide-based composition was further heated at 120 ° C for 60 minutes for curing. The adhesive strength of the epoxide-based composition after UV and subsequent thermal curing was measured according to ASTM D2095 at a crosshead speed of 2 mm / min and recorded as T _t .

Example 1-7
Samples of the epoxide-based composition were prepared according to Table 1 by mixing components selected from:
Bisphenol A epoxy resin (DER 331 from Olin Corporation);
Epoxidized polybutadiene (JP 400 from Nippon Soda Co., Ltd.);
Epoxidized polybutadiene (PB 3600 from Daicel Corporation);
Neopentaerythritol tetrakis (3-mercaptopropionate) (PEMP, from SC Organic Chemical Co., Ltd.);
(Z)-{[bis (dimethylamino) methylene] amino]}-N-cyclohexyl (cyclohexylamino) methylimmonium tetra (3-fluorophenyl) borate (WPBG-345, (From Wako Pure Industries Co., ltd.);
DBU-derived tetraphenylborate (U-CAT 5002 from San-Apro Ltd.); and
2-hydroxy-2-methyl-1-phenyl-propan-1-one (Darocure 1173, from BASF).
Table 1. Epoxide-based compositions

In Table 2, the UV curing times of the epoxide-based composition samples are reported. The epoxide-based composition samples of Examples 5, 6, and 7 were not cured after 300 seconds of exposure to UV light.

When an epoxy resin different from the epoxidized unsaturated polyolefin was added to the epoxy-based composition sample as shown in Examples 1 and 2, the UV curing time of the epoxy-based composition sample was the same as in Example 3. Compared to samples of epoxide-based compositions. When a radical photoinitiator was added to the epoxide-based composition sample as shown in Example 4, the UV curing time of the epoxide-based composition sample was significantly reduced.


Table 2. UV curing time of epoxide-based compositions

The adhesive strength of samples of epoxy-based compositions under UV curing is reported in Table 3. Samples of the epoxide-based composition in Examples 1, 2, and 4 were exposed to UV light for 30 seconds; samples of the epoxide-based composition of Example 3 were exposed to UV light for 90 seconds; and Examples 5, 6, and 7 A sample of the epoxy-based composition was exposed to UV light for 300 seconds.

The adhesive strength of the epoxy-based composition samples after UV curing and subsequent storage at room temperature is also reported in Table 3. The epoxide-based composition samples in Examples 1, 2 and 4 were first exposed to UV light for 30 seconds, and then stored at room temperature for 7 days; the epoxide-based composition samples in Example 3 were first exposed to UV Exposure to light for 90 seconds, and then storage at room temperature for 7 days; samples of the epoxy-based composition of Examples 5, 6, and 7 were exposed to UV light for 300 seconds.

The adhesive strength of the epoxy-based composition samples after UV curing and subsequent heat curing is further reported in Table 3. The epoxide-based composition samples in Examples 1, 2 and 4 were first exposed to UV light for 30 seconds, and then further heated at 120 ° C for 60 minutes; the epoxide-based composition samples in Example 3 were first The UV light was exposed for 90 seconds, and then further heated at 120 ° C. for 60 minutes; and the samples of the epoxide-based composition in Examples 5, 6, and 7 were exposed to UV light for 300 seconds.

It has been found that when epoxide-unsaturated polyolefin compounds are missing from the formulations of the epoxide-based composition as shown in Examples 5, 6, and 7, samples of the epoxide-based composition are exposed to 100 mW / cm ² cannot be cured after 300 seconds of exposure. Therefore, the adhesion strength of the epoxy-based composition samples in Examples 5, 6, and 7 after UV curing and subsequent storage at room temperature or subsequent thermal curing cannot be obtained.

The epoxide-based composition samples in Examples 1 to 4 had similar adhesion strengths after UV curing. It has been surprisingly found that when an epoxy resin other than an epoxidized unsaturated polyolefin is added to the epoxide-based composition, after storage at room temperature for 7 days or after further thermal curing, one of Examples 1 and 2 The adhesive strength of the epoxide-based composition samples is better improved than the epoxide-based composition samples in Examples 3 and 4.

It was further observed that when the photobase generator (WPBG-345) containing a guanidinium cation was used instead of other photobase generators as in Example 1, the adhesive strength of the sample of the epoxy-based composition was stored at room temperature or It is even better after further heating.
Table 3. Adhesive strength of epoxide-based compositions

Claims (15)

An epoxide-based composition comprising: (a) at least one epoxidized unsaturated polyolefin; (b) at least one thiol compound; and (c) at least one photo-base generating agent. The epoxide-based composition according to claim 1, wherein the epoxidized unsaturated polyolefin-based epoxidized polydiene is preferably selected from the group consisting of epoxidized polyisoprene, epoxidized polybutadiene, and isoprene Epoxidized copolymers of diene and butadiene, epoxidized copolymers of butadiene and ethylene, epoxidized copolymers of butadiene and propylene, epoxidized terpolymers of butadiene, ethylene and propylene, and Any combination of them. The epoxide-based composition of claim 1 or 2, wherein the epoxidized unsaturated polyolefin has at least two epoxy groups per molecule. The epoxide-based composition of any one of the preceding claims, wherein the epoxidized unsaturated polyolefin has at least two non-aromatic carbon-carbon double bonds per molecule. An epoxide-based composition as in any one of the preceding claims, wherein the thiol compound has at least two thiol groups per molecule. The epoxide-based composition according to any one of the preceding claims, wherein the photobase generator is selected from the group consisting of a carbamate compound, an o-fluorenyl oxime compound, an ammonium salt, an amine imine, α- At least one of an amino ketone compound and a derivative thereof. The epoxide-based composition according to any one of the preceding claims, wherein the photobase generator is preferably an ammonium salt, and more preferably an ammonium salt containing a guanidinium cation or a phosphonium cation, and even more preferably An ammonium salt comprising a guanidinium cation represented by the general formula (1) or a sulfonium cation represented by the general formula (2), Where R1 to R11 each independently represent hydrogen, halogen, optionally substituted alkyl, optionally substituted alkenyl, optionally substituted alkoxy, optionally substituted aralkyl, optionally substituted Aryl or optionally substituted heteroaryl, and at least one of R1 to R11 represents optionally substituted aralkyl, optionally substituted aryl, or optionally substituted heteroaryl. The epoxide-based composition according to any one of the preceding claims, wherein the photobase generator preferably comprises an ammonium salt of a guanidinium cation represented by the general formula (1), Where R1 to R6 each independently represent hydrogen, halogen, optionally substituted alkyl, optionally substituted alkenyl, optionally substituted alkoxy, optionally substituted aralkyl, optionally substituted Aryl or optionally substituted heteroaryl, and at least one of R1 to R6 represents optionally substituted aralkyl, optionally substituted aryl, or optionally substituted heteroaryl. The epoxide-based composition of any one of the preceding claims, further comprising at least one epoxy resin different from the epoxidized unsaturated polyolefin. The epoxide-based composition of any one of the preceding claims, further comprising a photoinitiator, a filler, an adhesion promoter, and optional additives of any combination thereof. An epoxide-based composition as in any of the preceding claims, comprising: (a) 1 to 90% by weight of at least one epoxidized unsaturated polyolefin; (b) 0.5 to 50% by weight of at least one thiol compound; (c) at least one photobase generator from 0.1% to 20% by weight; (d) 0 to 80% by weight of at least one epoxy resin; and (e) at least one photoinitiator from 0 to 5 wt%; The weight percentages of all the components amount to 100% by weight. An epoxide-based composition according to any of the preceding claims, which is UV curable, and / or room temperature curable, and / or thermally curable, and / or dual UV and room temperature curable, and / Or dual UV and thermally curable. An epoxide-based composition as in any one of the preceding claims, which has a UV curing time of less than or equal to 60 seconds. A cured product of an epoxide-based composition as in any one of the preceding claims. An article bonded by an epoxide-based composition as in any of the preceding claims.