TW201936717A - Polyimide precursor, polyimide, polyimide film, varnish and substrate - Google Patents

Polyimide precursor, polyimide, polyimide film, varnish and substrate Download PDF

Info

Publication number
TW201936717A
TW201936717A TW107147626A TW107147626A TW201936717A TW 201936717 A TW201936717 A TW 201936717A TW 107147626 A TW107147626 A TW 107147626A TW 107147626 A TW107147626 A TW 107147626A TW 201936717 A TW201936717 A TW 201936717A
Authority
TW
Taiwan
Prior art keywords
formula
polyimine
represented
tetravalent
tetravalent group
Prior art date
Application number
TW107147626A
Other languages
Chinese (zh)
Other versions
TWI801480B (en
Inventor
岡卓也
小濱幸德
中川美晴
久野信治
Original Assignee
日商宇部興產股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商宇部興產股份有限公司 filed Critical 日商宇部興產股份有限公司
Publication of TW201936717A publication Critical patent/TW201936717A/en
Application granted granted Critical
Publication of TWI801480B publication Critical patent/TWI801480B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08Polyimides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/12Photovoltaic modules
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208Touch screens

Abstract

Provided is a polyimide which contains a repeating unit represented by general formula (5). A2 in general formula (5) includes a tetravalent group represented by formula (A-1), B2 in general formula (5) includes a divalent group represented by formula (B-1), and A2 and/or B2 include a specific proportion of a tetravalent or divalent group containing a specific structure. This polyimide exhibits high transparency, has a low coefficient of linear thermal expansion, and has a low phase difference (retardation) in the thickness direction. (In the formula, A2 is a tetravalent group having an aromatic ring or an alicyclic structure, and B2 is a divalent group having an aromatic ring or an alicyclic structure. However, groups A2 and B2 contained in individual repeating units may be the same as, or different from, each other.).

Description

聚醯亞胺前驅物、聚醯亞胺、聚醯亞胺膜、清漆及基板Polyimine precursor, polyimine, polyimide film, varnish and substrate

本發明係關於具有高透明性與低線熱膨脹係數、厚度方向位相差(retardation)亦小的聚醯亞胺及其前驅物。又,本發明係關於包含聚醯亞胺膜、聚醯亞胺前驅物或聚醯亞胺的清漆及基板。The present invention relates to a polyimide having a high transparency and a low coefficient of thermal expansion and a small retardation in the thickness direction and a precursor thereof. Further, the present invention relates to a varnish and a substrate comprising a polyimide film, a polyimide precursor or a polyimide.

近年伴隨高度資訊化社會的到來,於光通訊領域之光纖或光波導等顯示裝置領域之液晶配向膜或用於彩色濾光片的保護膜等光學材料之開發已有進展。尤其於顯示裝置領域,已有人探討替代玻璃基板之質輕且可撓性優異之塑膠基板,或積極開發可彎、可圓化的顯示器。因此,尋求可用於如此用途中的更高性能的光學材料。In recent years, with the advent of a highly information society, development of optical materials such as liquid crystal alignment films or protective films for color filters in the field of display devices such as optical fibers or optical waveguides in the field of optical communication has progressed. In particular, in the field of display devices, plastic substrates having superior lightness and flexibility in replacing glass substrates have been explored, or development of bendable and roundable displays has been actively pursued. Therefore, optical materials of higher performance that can be used in such applications are sought.

芳香族聚醯亞胺,由於形成分子內共軛或電荷移動錯合物而固有地著色為黃褐色。作為抑制著色之方法,有人提出例如對於分子內導入氟原子、對於主鏈賦予彎曲性、導入體積大的基團作為側鏈等,以妨礙分子內共軛或電荷移動錯合物形成來使其展現透明性之方法。The aromatic polyimine is inherently colored yellowish due to the formation of intramolecular conjugates or charge transport complexes. As a method for suppressing coloring, for example, a fluorine atom is introduced intramolecularly, a bending property is imparted to a main chain, and a group having a large introduction volume is used as a side chain to prevent the formation of an intramolecular conjugate or a charge transport complex. A way to demonstrate transparency.

又,亦有人提出藉由使用理論上不形成電荷移動錯合物的半脂環式或全脂環式聚醯亞胺來展現透明性的方法。特別是,已提出許多使用芳香族四羧酸二酐作為四羧酸成分、使用脂環式二胺作為二胺成分的高透明性半脂環式聚醯亞胺,及使用脂環式四羧酸二酐作為四羧酸成分、使用芳香族二胺作為二胺成分的高透明性半脂環式聚醯亞胺。Further, there has been proposed a method of exhibiting transparency by using a semi-alicyclic or full-alicyclic polyimine which theoretically does not form a charge transporting complex. In particular, many highly transparent semi-alicyclic polyethylenimines using an aromatic tetracarboxylic dianhydride as a tetracarboxylic acid component, an alicyclic diamine as a diamine component, and an alicyclic tetracarboxylic acid have been proposed. The acid dianhydride is a highly transparent semi-alicyclic polyimine which is a tetracarboxylic acid component and an aromatic diamine as a diamine component.

例如,專利文獻1中揭示一種聚醯亞胺,其使用降莰烷-2-螺-α-環戊酮-α’-螺-2’’-降莰烷-5,5’’,6,6’’-四羧酸二酐(簡稱:CpODA)作為四羧酸成分,使用2,2’-雙(三氟甲基)聯苯胺(簡稱:TFMB)或TFMB與其他芳香族二胺(例如,TFMB:4,4’-二胺苯甲醯苯胺:9,9-雙(4-胺基苯基)茀=5:4:1(莫耳比))作為二胺成分。專利文獻2中揭示一種聚醯亞胺,其中使用具有特定立體異構物之比例的CpODA作為四羧酸成分、使用TFMB與其他芳香族二胺(例如,TFMB:4,4’-二胺苯甲醯苯胺=5:5(莫耳比)等)作為二胺成分。For example, Patent Document 1 discloses a polyimine which uses norbornane-2-spiro-α-cyclopentanone-α'-spiro-2''-norbornane-5,5'',6, 6''-tetracarboxylic dianhydride (abbreviation: CpODA) as a tetracarboxylic acid component, using 2,2'-bis(trifluoromethyl)benzidine (abbreviation: TFMB) or TFMB with other aromatic diamines (for example) TFMB: 4,4'-diamine benzanilide: 9,9-bis(4-aminophenyl)anthracene = 5:4:1 (mole ratio)) as a diamine component. Patent Document 2 discloses a polyimine in which CpODA having a specific stereoisomer ratio is used as a tetracarboxylic acid component, and TFMB and other aromatic diamines are used (for example, TFMB: 4,4'-diamine benzene) Formamidine = 5:5 (mole ratio), etc. as a diamine component.

又,專利文獻3中揭示一種聚醯亞胺樹脂,其係包含源自四羧酸二酐之構成單元A,與源自二胺化合物之構成單元B的聚醯亞胺樹脂,其中構成單元A包含源自CpODA之構成單元(A-1)、源自苯均四酸二酐之構成單元(A-2)及源自1,2,4,5-環己烷四羧酸二酐之構成單元(A-3)的至少任1種,構成單元B包含源自9,9-雙(4-胺基苯基)茀之構成單元(B-1),構成單元B中的構成單元(B-1)的比例為60莫耳%以上。更具體而言,專利文獻3的實施例4中,係由CpODA(A-1)與9,9-雙(4-胺基苯基)茀(B-1)製造聚醯亞胺樹脂。專利文獻3的實施例5中,係由CpODA(A-1)、1,2,4,5-環己烷四羧酸二酐(A-3)與9,9-雙(4-胺基苯基)茀(B-1)製造聚醯亞胺樹脂((A-1):(A-3)=1:1(莫耳比))。專利文獻3的實施例6中,係由CpODA(A-1)、9,9-雙(4-胺基苯基)茀(B-1)與2,2’-二甲基聯苯胺(B-2)製造聚醯亞胺樹脂((B-1):(B-2)=4:1(莫耳比))。Further, Patent Document 3 discloses a polyimine resin comprising a constituent unit A derived from a tetracarboxylic dianhydride and a polyimine resin derived from a constituent unit B derived from a diamine compound, wherein the constituent unit A A constituent unit derived from CpODA (A-1), a constituent unit derived from pyromellitic dianhydride (A-2), and a composition derived from 1,2,4,5-cyclohexanetetracarboxylic dianhydride At least one of the units (A-3), the constituent unit B includes a constituent unit (B-1) derived from 9,9-bis(4-aminophenyl)fluorene, and constitutes a constituent unit in the unit B (B) The ratio of -1) is 60 mol% or more. More specifically, in Example 4 of Patent Document 3, a polyimide resin was produced from CpODA (A-1) and 9,9-bis(4-aminophenyl)anthracene (B-1). In Example 5 of Patent Document 3, CpODA (A-1), 1,2,4,5-cyclohexanetetracarboxylic dianhydride (A-3) and 9,9-bis(4-amino group) Phenyl) oxime (B-1) to produce a polyimide resin ((A-1): (A-3) = 1:1 (mole ratio)). In Example 6 of Patent Document 3, CpODA(A-1), 9,9-bis(4-aminophenyl)anthracene (B-1) and 2,2'-dimethylbenzidine (B) -2) Production of a polyimide resin ((B-1): (B-2) = 4:1 (mole ratio)).

再者,專利文獻4的實施例1及比較例1中記載,由CpODA、4,4’-二胺基-2,2’-二甲基聯苯及9,9-雙(4-胺基苯基)茀(莫耳比:1/1)所得之聚醯亞胺以及由CpODA與9,9-雙(4-胺基苯基)茀所得之聚醯亞胺。 [先前技術文獻] [專利文獻]Further, in Example 1 and Comparative Example 1 of Patent Document 4, CpODA, 4,4'-diamino-2,2'-dimethylbiphenyl and 9,9-bis(4-amino group) are described. Polyphenylimine obtained from phenyl)anthracene (mole ratio: 1/1) and polyiminimide obtained from CpODA and 9,9-bis(4-aminophenyl)anthracene. [Prior Technical Literature] [Patent Literature]

[專利文獻1]國際公開第2013/179727號 [專利文獻2]國際公開第2014/046064號 [專利文獻3]國際公開第2017/191822號 [專利文獻4]日本特開2017-133027號公報[Patent Document 1] International Publication No. 2013/ 133 727 [Patent Document 2] International Publication No. 2014/046064 [Patent Document 3] International Publication No. 2017/191822 [Patent Document 4] JP-A-2017-133027

[發明所欲解決之課題][Problems to be solved by the invention]

根據用途,例如顯示器用途等中,除了具有高透明性與低線熱膨脹係數以外,更要求厚度方向位相差(retardation)小的聚醯亞胺及聚醯亞胺膜。若光穿透厚度方向位相差大的膜,則無法正確顯示穿透光的顏色,可能發生滲色、視野變窄這樣的問題。因此,特別是在顯示器用途等中,期望降低厚度方向位相差。Depending on the application, for example, in the use of a display or the like, in addition to having high transparency and a low coefficient of thermal expansion, a polyimide and a polyimide film having a small retardation in the thickness direction are required. If the light penetrates the film having a large difference in the thickness direction, the color of the transmitted light cannot be accurately displayed, and the problem of bleeding and narrowing of the field of view may occur. Therefore, particularly in display applications and the like, it is desirable to reduce the phase difference in the thickness direction.

本發明之目的係提供一種具有高透明性與低線熱膨脹係數、厚度方向位相差(retardation)亦小的聚醯亞胺及其前驅物。 [解決課題之手段]SUMMARY OF THE INVENTION An object of the present invention is to provide a polyimine having a high transparency and a low coefficient of thermal expansion and a small retardation in the thickness direction and a precursor thereof. [Means for solving the problem]

本發明係關於以下的各項。 1.一種聚醯亞胺前驅物,其係包含下述通式(1)所示之重複單元的聚醯亞胺前驅物,其特徵為: 下述通式(1)之A1 包含下式(A-1)所示之4價基團,且下述通式(1)之B1 包含下式(B-1)所示之2價基團, 再者,下述通式(1)之A1 及/或B1 包含具有下式(2)所示之結構的4價或2價基團,或是下述通式(1)之A1 包含下式(3)所示之4價基團及/或下式(4)所示之4價基團, 在通式(1)之A1 100莫耳%中的式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團之總量的含有比例,與在通式(1)之B1 100莫耳%中的式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團之總量的含有比例的和,在120莫耳%以上, 其中,相對於式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量,具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的比例為80莫耳%以下, 且相對於式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量,具有式(2)所示之結構的2價基團的比例為80莫耳%以下。The present invention relates to the following items. A polyimine precursor which is a polyimine precursor comprising a repeating unit represented by the following formula (1), characterized in that: A 1 of the following formula (1) comprises the following formula a tetravalent group represented by (A-1), and B 1 of the following general formula (1) includes a divalent group represented by the following formula (B-1), and further, the following general formula (1) A 1 and/or B 1 includes a tetravalent or divalent group having a structure represented by the following formula (2), or A 1 of the following formula (1) includes 4 represented by the following formula (3) a valence group and/or a tetravalent group represented by the following formula (4), a tetravalent group represented by the formula (A-1) in A 1 100 mol% of the formula (1), having a formula (2) The content ratio of the tetravalent group of the structure shown, the tetravalent group represented by the formula (3), and the tetravalent group represented by the formula (4), and the formula (1) The sum of the ratios of the total amount of the divalent group represented by the formula (B-1) represented by the formula (B-1) and the divalent group having the structure represented by the formula (2) in the B 1 100 mol %, at 120 mol % or more, wherein the tetravalent group represented by the formula (A-1), the tetravalent group having the structure represented by the formula (2), the tetravalent group represented by the formula (3), and the formula ( 4) the total amount of the tetravalent group shown, the tetravalent group having the structure represented by the formula (2), The ratio of the tetravalent group shown in (3) to the tetravalent group represented by the formula (4) is 80 mol% or less, and the divalent group and the formula are represented by the formula (B-1). (2) The total amount of the divalent group in the structure shown, the ratio of the divalent group having the structure represented by the formula (2) is 80 mol% or less.

[化1](式中,A1 為具有芳香族環或脂環結構的4價基團,B1 為具有芳香族環或脂環結構的2價基團,R1 、R2 分別獨立為氫、碳數1~6的烷基或碳數3~9的烷矽基。其中,各重複單元所包含的A1 及B1 可相同亦可不同)。[Chemical 1] (wherein A 1 is a tetravalent group having an aromatic ring or an alicyclic structure, B 1 is a divalent group having an aromatic ring or an alicyclic structure, and R 1 and R 2 are each independently hydrogen and carbon number; An alkyl group of 1 to 6 or an alkanoyl group having 3 to 9 carbon atoms, wherein A 1 and B 1 contained in each repeating unit may be the same or different).

[化2] [Chemical 2]

[化3] [Chemical 3]

[化4] [Chemical 4]

[化5] [Chemical 5]

[化6] [Chemical 6]

2.一種聚醯亞胺,其係包含下述通式(5)所示之重複單元的聚醯亞胺,其特徵為: 下述通式(5)之A2 包含下式(A-1)所示之4價基團,且下述通式(5)之B2 包含下式(B-1)所示之2價基團, 再者,下述通式(5)之A2 及/或B2 包含具有下式(2)所示之結構的4價或2價基團,或下述通式(5)之A2 包含下式(3)所示之4價基團及/或下式(4)所示之4價基團, 通式(5)之A2 100莫耳%中的式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量的含有比例,與通式(5)之B2 100莫耳%中的式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量的含有比例的和,在120莫耳%以上, 其中,相對於式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量,具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的比例為80莫耳%以下,且, 相對於式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量,具有式(2)所示之結構的2價基團的比例為80莫耳%以下。2. Polyimine, which is a polyimine comprising a repeating unit represented by the following formula (5), characterized in that A 2 of the following formula (5) contains the following formula (A-1) a tetravalent group shown, and B 2 of the following formula (5) includes a divalent group represented by the following formula (B-1), and further, A 2 of the following formula (5) and / or B 2 contains a tetravalent or divalent group having a structure represented by the following formula (2), or A 2 of the following formula (5) contains a tetravalent group represented by the following formula (3) and / Or a tetravalent group represented by the following formula (4), a tetravalent group represented by the formula (A-1) in A 2 100 mol% of the formula (5), having the formula (2) The content ratio of the tetravalent group of the structure, the tetravalent group represented by the formula (3), and the tetravalent group represented by the formula (4), and the B 2 100 mol% of the formula (5) And the sum of the content ratios of the total amount of the divalent group represented by the formula (B-1) and the divalent group having the structure represented by the formula (2) in the range of 120 mol% or more, wherein a tetravalent group represented by the formula (A-1), a tetravalent group having a structure represented by the formula (2), a tetravalent group represented by the formula (3), and a tetravalent group represented by the formula (4) a total amount of a group, a tetravalent group having a structure represented by the formula (2), a tetravalent group represented by the formula (3), and (4) The ratio of the tetravalent group shown is 80 mol% or less, and the divalent group represented by the formula (B-1) and the divalent group having the structure represented by the formula (2) The total amount of the group, the ratio of the divalent group having the structure represented by the formula (2) is 80 mol% or less.

[化7](式中,A2 為具有芳香族環或脂環結構的4價基團,B2 為具有芳香族環或脂環結構的2價基團。其中,各重複單元所包含的A2 及B2 可相同亦可不同)。[Chemistry 7] (In the formula, A 2 is a tetravalent group having an aromatic ring or an alicyclic structure, and B 2 is a divalent group having an aromatic ring or an alicyclic structure. Among them, A 2 and B contained in each repeating unit 2 can be the same or different).

[化8] [化8]

[化9] [Chemistry 9]

[化10] [化10]

[化11] [11]

[化12] [化12]

3.一種聚醯亞胺,係由該第1項之聚醯亞胺前驅物而得。 4.一種清漆,包含該第1項之聚醯亞胺前驅物或該第2項之聚醯亞胺。 5.一種聚醯亞胺膜,係使用包含該第1項之聚醯亞胺前驅物或該第2項之聚醯亞胺的清漆而得。 6.一種積層體,其特徵為:於玻璃基材上形成包含該第2或3項之聚醯亞胺的膜或該第5項之聚醯亞胺膜。 7. 一種用於顯示器、用於觸控式螢幕或用於太陽能電池的基板,其特徵為包含該第2或3項之聚醯亞胺、或該第5項之聚醯亞胺膜。 [發明之效果]3. A polyimine which is obtained from the polyimine precursor of the first item. 4. A varnish comprising the polyimine precursor of the first item or the polyimine of the second item. A polyimine film obtained by using a varnish comprising the polyimine precursor of the first item or the polyimine of the second item. A laminate comprising a film comprising the second or third polyimine or a polyimine film of the fifth aspect formed on a glass substrate. 7. A substrate for a display, for a touch screen or for a solar cell, characterized by comprising the polyimine of the second or third item, or the polyimine film of the item 5. [Effects of the Invention]

根據本發明,可提供一種具有高透明性與低線熱膨脹係數且厚度方向位相差(retardation)亦小的聚醯亞胺以及其前驅物。According to the present invention, it is possible to provide a polyimine having a high transparency and a low coefficient of thermal expansion and a small retardation in the thickness direction and a precursor thereof.

由本發明的聚醯亞胺前驅物所得之聚醯亞胺及本發明的聚醯亞胺,具有高透明性與低線熱膨脹係數且厚度方向位相差(retardation)亦小,因此可較佳地用於形成顯示器用途等的基板。又,由本發明的聚醯亞胺前驅物所得之聚醯亞胺及本發明的聚醯亞胺,亦可較佳地使用在形成用於觸控式螢幕、用於太陽能電池的基板。The polyimine obtained from the polyimine precursor of the present invention and the polyimine of the present invention have high transparency and a low coefficient of thermal expansion and a small retardation in the thickness direction, so that it can be preferably used. For forming a substrate for display use or the like. Further, the polyimine obtained from the polyimine precursor of the present invention and the polyimine of the present invention can also be preferably used in forming a substrate for a touch panel for use in a solar cell.

本發明的聚醯亞胺前驅物,係包含該通式(1)所示之重複單元的聚醯亞胺前驅物。該通式(1)所示之重複單元的總含量相對於所有重複單元,較佳為90莫耳%以上,更佳為95莫耳%以上,特佳為100莫耳%。通式(1)中的A1 為具有芳香族環或脂環結構的4價基團,較佳為具有脂環結構的4價基團。通式(1)中的B1 為具有芳香族環或脂環結構的2價基團,較佳為具有芳香族環的2價基團。The polyimine precursor of the present invention is a polyimine precursor comprising a repeating unit represented by the formula (1). The total content of the repeating unit represented by the formula (1) is preferably 90 mol% or more, more preferably 95 mol% or more, and particularly preferably 100 mol%, based on all the repeating units. A 1 in the formula (1) is a tetravalent group having an aromatic ring or an alicyclic structure, and preferably a tetravalent group having an alicyclic structure. B 1 in the formula (1) is a divalent group having an aromatic ring or an alicyclic structure, and preferably a divalent group having an aromatic ring.

接著,本發明的聚醯亞胺前驅物中,該通式(1)中的A1 包含該式(A-1)所示之4價基團,且該通式(1)中的B1 包含該式(B-1)所示之2價基團,再者該通式(1)之A1 及/或B1 包含具有該式(2)所示之結構的4價或2價基團,或是該通式(1)之A1 包含該式(3)所示之4價基團及/或該式(4)所示之4價基團。亦可為A1 及/或B1 包含具有該式(2)所示之結構的4價或2價基團,且A1 包含該式(3)所示之4價基團及/或該式(4)所示之4價基團。Next, in the polyimine precursor of the present invention, A 1 in the formula (1) contains a tetravalent group represented by the formula (A-1), and B 1 in the formula (1) The divalent group represented by the formula (B-1) is further contained, and further, A 1 and/or B 1 of the formula (1) includes a tetravalent or divalent group having the structure represented by the formula (2) The group, or A 1 of the formula (1), includes a tetravalent group represented by the formula (3) and/or a tetravalent group represented by the formula (4). It is also possible that A 1 and/or B 1 include a tetravalent or divalent group having a structure represented by the formula (2), and A 1 includes a tetravalent group represented by the formula (3) and/or a tetravalent group represented by the formula (4).

再者,該等的含量中,通式(1)之A1 100莫耳%中的式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量的含有比例,與通式(1)之B1 100莫耳%中的式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量的含有比例的和,在120莫耳%以上,較佳為160莫耳%以上,更佳為180莫耳%以上。其中,相對於通式(1)之A1 中的式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量,具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的比例在80莫耳%以下,且相對於通式(1)之B1 中的式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量,具有式(2)所示之結構的2價基團的比例為80莫耳%以下。又,該2個比例的和較佳為125莫耳%以下。In addition, among these contents, the tetravalent group represented by the formula (A-1) in the A 1 100 mol% of the general formula (1), and the tetravalent group having the structure represented by the formula (2) The content ratio of the group, the tetravalent group represented by the formula (3), and the total amount of the tetravalent group represented by the formula (4), and the formula (B) in the B 1 100 mol% of the formula (1) -1) The sum of the content ratios of the total amount of the divalent group and the divalent group having the structure represented by the formula (2) is 120 mol% or more, preferably 160 mol% or more. More preferably, it is more than 180% by mole. In the above, the tetravalent group represented by the formula (A-1) in the A 1 of the formula (1), the tetravalent group having the structure represented by the formula (2), and the formula (3) a tetravalent group and a total amount of a tetravalent group represented by the formula (4), a tetravalent group having a structure represented by the formula (2), a tetravalent group represented by the formula (3), and a formula (4) The ratio of the tetravalent group shown is 80 mol% or less, and the divalent group represented by the formula (B-1) in B 1 of the general formula (1) and having the formula (2) The total amount of the divalent group of the structure shown in the formula has a ratio of a divalent group having a structure represented by the formula (2) of 80 mol% or less. Further, the sum of the two ratios is preferably 125 mol% or less.

本發明的聚醯亞胺係包含該通式(5)所示之重複單元的聚醯亞胺。該通式(5)所示之重複單元的總含量相對於所有重複單元,較佳為90莫耳%以上,更佳為95莫耳%以上,特佳為100莫耳%。通式(5)中的A2 為具有芳香族環或脂環結構的4價基團,較佳為具有脂環結構的4價基團。通式(5)中的B2 為具有芳香族環或脂環結構的2價基團,較佳為具有芳香族環的2價基團。The polyimine of the present invention is a polyimine containing a repeating unit represented by the formula (5). The total content of the repeating unit represented by the formula (5) is preferably 90 mol% or more, more preferably 95 mol% or more, and particularly preferably 100 mol%, based on all the repeating units. A 2 in the formula (5) is a tetravalent group having an aromatic ring or an alicyclic structure, and preferably a tetravalent group having an alicyclic structure. B 2 in the formula (5) is a divalent group having an aromatic ring or an alicyclic structure, and preferably a divalent group having an aromatic ring.

接著,本發明的聚醯亞胺中,該通式(5)中的A2 包含該式(A-1)所示之4價基團,且該通式(5)中的B2 包含該式(B-1)所示之2價基團,再者,該通式(5)之A2 及/或B2 包含具有該式(2)所示之結構的4價或2價基團,或該通式(5)之A2 包含該式(3)所示之4價基團及/或該式(4)所示之4價基團。A2 及/或B2 ,包含具有該式(2)所示之結構的4價或2價基團,且A2 亦可包含該式(3)所示之4價基團及/或該式(4)所示之4價基團。Next, in the polyimine of the present invention, A 2 in the formula (5) contains a tetravalent group represented by the formula (A-1), and B 2 in the formula (5) contains the tetravalent group. a divalent group represented by the formula (B-1), further, A 2 and/or B 2 of the formula (5) contains a tetravalent or divalent group having the structure represented by the formula (2) Or A 2 of the formula (5) includes a tetravalent group represented by the formula (3) and/or a tetravalent group represented by the formula (4). A 2 and/or B 2 , a tetravalent or divalent group having a structure represented by the formula (2), and A 2 may further comprise a tetravalent group represented by the formula (3) and/or a tetravalent group represented by the formula (4).

再者,該等的含量中,通式(5)之A2 100莫耳%中的式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量的含有比例,與通式(5)之B2 100莫耳%中的式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量的含有比例的和,在120莫耳%以上,較佳為160莫耳%以上,更佳為180莫耳%以上。其中,相對於通式(5)之A2 中的式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量,具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的比例在80莫耳%以下,且相對於通式(5)之B2 中的式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量,具有式(2)所示之結構的2價基團的比例在80莫耳%以下。又,該2個的比例的和較佳係在125莫耳%以下。Further, among these contents, a tetravalent group represented by the formula (A-1) in the A 2 100 mol% of the formula (5), and a tetravalent group having a structure represented by the formula (2) The content ratio of the group, the tetravalent group represented by the formula (3), and the total amount of the tetravalent group represented by the formula (4), and the formula (B) in the B 2 100 mol% of the formula (5) -1) The sum of the content ratios of the total amount of the divalent group and the divalent group having the structure represented by the formula (2) is 120 mol% or more, preferably 160 mol% or more. More preferably, it is more than 180% by mole. In the above, the tetravalent group represented by the formula (A-1) in the A 2 of the formula (5), the tetravalent group having the structure represented by the formula (2), and the formula (3) a tetravalent group and a total amount of a tetravalent group represented by the formula (4), a tetravalent group having a structure represented by the formula (2), a tetravalent group represented by the formula (3), and a formula (4) The ratio of the tetravalent group shown is 80 mol% or less, and the divalent group represented by the formula (B-1) in B 2 of the general formula (5) and having the formula (2) The total amount of the divalent group of the structure shown is such that the ratio of the divalent group having the structure represented by the formula (2) is 80 mol% or less. Further, the sum of the ratios of the two is preferably 125 mol% or less.

本說明書中,適當使用以下簡稱。In the present specification, the following abbreviations are used as appropriate.

CpODA:降莰烷-2-螺-α-環戊酮-α’-螺-2’’-降莰烷-5,5’’,6,6’’-四羧酸二酐 CpODA等:降莰烷-2-螺-α-環戊酮-α’-螺-2’’-降莰烷-5,5’’,6,6’’-四羧酸類等(四羧酸類等表示四羧酸、以及四羧酸二酐、四羧酸矽酯、四羧酸酯、四羧醯氯等的四羧酸衍生物) TFMB:2,2’-雙(三氟甲基)聯苯胺 提供該式(A-1)所示之4價基團的四羧酸成分為CpODA等,提供該式(B-1)所示之2價基團的二胺成分為TFMB。由CpODA等與TFMB所得之聚醯亞胺,即由A1 為該式(A-1)所示之4價基團、B1 為該式(B-1)所示之2價基團的該通式(1)的重複單元所構成之聚醯亞胺前驅物所得之聚醯亞胺,以及A2 為該式(A-1)所示之4價基團、B2 為該式(B-1)所示之2價基團的該通式(5)的重複單元所構成之聚醯亞胺,其透明性高、線熱膨脹係數低,但具有厚度方向位相差(retardation)較大的傾向。將聚醯亞胺膜用於顯示器用途等的情況,如上所述,厚度方向位相差大,可能引起穿透光的顏色無法正確顯示、滲色、視野變窄這樣的問題。相對於此,以上述的含量(比例),在源自四羧酸成分之結構的通式(1)之A1 、通式(5)之A2 及/或源自二胺成分之結構的通式(1)之B1 、通式(5)之B2 中,導入具有該式(2)所示之結構的基團,或是在源自四羧酸成分之結構的通式(1)之A1 、通式(5)之A2 中,導入該式(3)所示之4價基團及/或該式(4)所示之4價基團,藉此可維持高透明性、低線熱膨脹係數的同時,降低厚度方向位相差(retardation)。結果可得到具有高透明性與低線熱膨脹係數、厚度方向位相差(retardation)亦小的聚醯亞胺。CpODA: norbornane-2-spiro-α-cyclopentanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride CpODA, etc. Cyclohexane-2-spiro-α-cyclopentanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid, etc. (tetracarboxylic acid and the like represent tetracarboxylic acid Acid, and tetracarboxylic acid derivatives such as tetracarboxylic dianhydride, decyl tetracarboxylate, tetracarboxylic acid ester, tetracarboxylic fluorene chloride, etc.) TFMB: 2,2'-bis(trifluoromethyl)benzidine provides the The tetracarboxylic acid component of the tetravalent group represented by the formula (A-1) is CpODA or the like, and the diamine component which provides the divalent group represented by the formula (B-1) is TFMB. Polyimine obtained from CpODA or the like and TFMB, that is, A 1 is a tetravalent group represented by the formula (A-1), and B 1 is a divalent group represented by the formula (B-1). The polyimine obtained from the polyimine precursor of the repeating unit of the formula (1), and A 2 is a tetravalent group represented by the formula (A-1), and B 2 is the formula ( The polyimine composed of the repeating unit of the above formula (5) of the divalent group represented by B-1) has high transparency and a low linear thermal expansion coefficient, but has a large retardation in the thickness direction. Propensity. When the polyimide film is used for a display or the like, as described above, the phase difference in the thickness direction is large, and the color of the transmitted light may not be correctly displayed, the bleeding may be caused, and the field of view may be narrowed. In contrast to the above content (ratio), (1) of the general formula A tetracarboxylic acid component is derived from the structure of a general formula (5) of A 2 and / or structure of the diamine component derived from a group of the structure, or the general formula B B formula (1) of a general formula (5) in the 2, having introduced into the formula (2) derived from a tetracarboxylic acid component in the structure of (1 in A) of A 1, general formula (5) of 2, is introduced into the formula (3) of a tetravalent group, and / or the formula (4) shown in the tetravalent group, whereby a high transparency can be maintained At the same time as the low-line thermal expansion coefficient, the retardation in the thickness direction is reduced. As a result, a polyimine having a high transparency and a low linear thermal expansion coefficient and a small retardation in the thickness direction can be obtained.

此處,該式(2)所示之結構中相鄰的芳香族環可進一步直接鍵結或是以醚鍵連結,亦可為例如下式(2’)所示之結構。Here, the adjacent aromatic rings in the structure represented by the formula (2) may be directly bonded or linked by an ether bond, or may be, for example, a structure represented by the following formula (2').

[化13](式中,R為直接鍵結或醚鍵(-O-))。[Chemistry 13] (wherein R is a direct bond or an ether bond (-O-)).

又,該式(2)所示之結構所包含的芳香族環,亦可以甲基等的烷基、三氟甲基等的氟化烷基、鹵素基團等的取代基進行取代,但通常較佳係不具有取代基。另外,取代位置並未特別限定。Further, the aromatic ring contained in the structure represented by the formula (2) may be substituted with an alkyl group such as a methyl group or a fluorinated alkyl group such as a trifluoromethyl group or a halogen group, but usually It is preferred that it does not have a substituent. In addition, the substitution position is not particularly limited.

提供具有該式(2)所示之結構的4價基團的四羧酸成分為具有該式(2)所示之結構的四羧酸類等,例如可列舉:9,9’-雙(3,4-二羧基苯基)茀二酐或其他衍生物(四羧酸矽酯、四羧酸酯、四羧醯氯等的、四羧酸二酐以外的四羧酸衍生物)等。提供包含該式(2)表示之結構的2價基團的二胺成分,為具有該式(2)所示之結構的二胺,例如可列舉:9,9-雙(4-胺基苯基)茀、9,9-雙(4-胺基-3-氯苯基)茀、9,9-雙(4-胺基-3-氟苯基)茀、9,9-雙(4-胺基-3-甲基苯基)茀、4,4’-(螺[茀-9,9’-呫噸]-3’,6’-二基雙(氧基))二苯胺等。The tetracarboxylic acid component having a tetravalent group having a structure represented by the formula (2) is a tetracarboxylic acid or the like having the structure represented by the formula (2), and examples thereof include 9,9'-bis (3). , 4-dicarboxyphenyl)ruthenic anhydride or other derivative (tetracarboxylic acid derivative such as tetracarboxylic acid decyl ester, tetracarboxylic acid ester or tetracarboxylic cerium chloride, or tetracarboxylic acid dianhydride). A diamine component which provides a divalent group having a structure represented by the formula (2), and a diamine having a structure represented by the formula (2), for example, 9,9-bis(4-aminobenzene) ,9,9-bis(4-amino-3-chlorophenyl)anthracene, 9,9-bis(4-amino-3-fluorophenyl)anthracene, 9,9-bis(4- Amino-3-methylphenyl)anthracene, 4,4'-(spiro[茀-9,9'-呫ton]-3',6'-diylbis(oxy))diphenylamine, and the like.

又,提供該式(3)所示之4價基團的四羧酸成分為1,2,4,5-環己烷四羧酸類等。Further, the tetracarboxylic acid component which provides the tetravalent group represented by the formula (3) is 1,2,4,5-cyclohexanetetracarboxylic acid or the like.

提供該式(4)所示之4價基團的四羧酸成分為2,3,3’,4’-聯苯四羧酸類等。The tetracarboxylic acid component which provides the tetravalent group represented by the formula (4) is 2,3,3',4'-biphenyltetracarboxylic acid or the like.

換言之,本發明的聚醯亞胺前驅物及本發明的聚醯亞胺, 係由包含(a-1)CpODA等、 (a-2)具有該式(2)所示之結構的四羧酸類等、1,2,4,5-環己烷四羧酸類等、2,3,3’,4’-聯苯四羧酸類等的任1種以上的四羧酸成分及 (b)包含TFMB的二胺成分、或包含TFMB與具有該式(2)所示之結構的二胺的二胺成分所得; 或由 (a)包含CpODA等的四羧酸成分與 (b)包含TFMB與具有該式(2)所示之結構的二胺的二胺成分所得。In other words, the polyimide precursor of the present invention and the polyimine of the present invention are tetracarboxylic acids containing (a-1) CpODA or the like, (a-2) having the structure represented by the formula (2). Any one or more kinds of tetracarboxylic acid components such as 1,2,4,5-cyclohexanetetracarboxylic acid, 2,3,3',4'-biphenyltetracarboxylic acid, and (b) TFMB a diamine component or a diamine component comprising TFMB and a diamine having the structure represented by the formula (2); or (a) a tetracarboxylic acid component containing CpODA or the like and (b) comprising TFMB and having the same The diamine component of the diamine of the structure represented by the formula (2) is obtained.

作為此處所使用的四羧酸成分的CpODA等,在6種立體異構物之中,較佳為包含trans-endo-endo-降莰烷-2-螺-α-環戊酮-α’-螺-2’’-降莰烷-5,5’’,6,6’’-四羧酸類等(trans-endo-endo體)及/或cis-endo-endo-降莰烷-2-螺-α-環戊酮-α’-螺-2’’-降莰烷-5,5’’,6,6’’-四羧酸類等(cis-endo-endo體)。在一實施態樣中,CpODA等中的trans-endo-endo體及/或cis-endo-endo體的比例,總計較佳為80莫耳%以上,更佳為90莫耳%以上,再佳為95莫耳%以上,特佳為99莫耳%以上。As the CpODA or the like of the tetracarboxylic acid component used herein, among the six stereoisomers, trans-endo-endo-norbornane-2-spiro-α-cyclopentanone-α'- is preferably contained. Spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid (trans-endo-endo body) and/or cis-endo-endo-norbornane-2-snail -α-cyclopentanone-α'-spiro-2''-norbornane-5,5'', 6,6''-tetracarboxylic acid, etc. (cis-endo-endo body). In one embodiment, the ratio of the trans-endo-endo body and/or the cis-endo-endo body in CpODA or the like is preferably 80 mol% or more, more preferably 90 mol% or more. It is 95% by mole or more, and particularly preferably 99% by mole or more.

作為此處所使用的四羧酸成分的1,2,4,5-環己烷四羧酸類等,在6種立體異構物之中,較佳係包含1R,2S,4S,5R-環己烷四羧酸類等。在一實施態樣中,1,2,4,5-環己烷四羧酸類等中的1R,2S,4S,5R-環己烷四羧酸類的比例較佳為50莫耳%以上,更佳為80莫耳%以上,再佳為90莫耳%以上,特佳為95莫耳%以上。The 1,2,4,5-cyclohexanetetracarboxylic acid or the like which is a tetracarboxylic acid component used herein preferably contains 1R, 2S, 4S, 5R-cyclohexane among the six stereoisomers. Alkane tetracarboxylic acids and the like. In one embodiment, the ratio of 1R, 2S, 4S, 5R-cyclohexane tetracarboxylic acid in 1,2,4,5-cyclohexanetetracarboxylic acid or the like is preferably 50% by mole or more. It is preferably more than 80% by mole, more preferably more than 90% by mole, and particularly preferably more than 95% by mole.

CpODA等可單獨使用1種,亦可組合多種使用。又,具有該式(2)所示之結構的四羧酸類等、1,2,4,5-環己烷四羧酸類等及2,3,3’,4’-聯苯四羧酸類等,亦可單獨使用1種,亦可組合多種使用。具有該式(2)所示之結構的二胺可單獨使用1種,亦可組合多種使用。CpODA or the like may be used alone or in combination. Further, tetracarboxylic acid or the like having the structure represented by the formula (2), 1,2,4,5-cyclohexanetetracarboxylic acid, etc., and 2,3,3',4'-biphenyltetracarboxylic acid, etc. It can also be used alone or in combination. The diamine having the structure represented by the formula (2) may be used singly or in combination of two or more.

作為提供該通式(1)所示之重複單元或該通式(5)所示之重複單元的其他四羧酸成分,可使用其他芳香族或脂環式四羧酸類的任一種。雖並未特別限定,但例如可列舉:2,2-雙(3,4-二羧基苯基)六氟丙烷、4-(2,5-二側氧基四氫呋喃-3-基)-1,2,3,4-四氫萘-1,2-二羧酸、苯均四酸、3,3’,4,4’-二苯甲酮四羧酸、3,3’,4,4’-聯苯四羧酸、4,4’-氧基二鄰苯二甲酸、雙(3,4-二羧基苯基)碸二酐、間聯三苯基-3,4,3’,4’-四羧酸二酐、對聯三苯基-3,4,3’,4’-四羧酸二酐、雙羧基苯基二甲基矽烷、雙二羧基苯氧基二苯硫醚、磺醯基二鄰苯二甲酸、1,2,3,4-環丁烷四羧酸、異亞丙基二苯氧基雙鄰苯二甲酸、[1,1’-聯(環己烷)]-3,3’,4,4’-四羧酸、[1,1’-聯(環己烷)]-2,3,3’,4’-四羧酸、[1,1’-聯(環己烷)]-2,2’,3,3’-四羧酸、4,4’-亞甲基雙(環己烷-1,2-二羧酸)、4,4’-(丙烷-2,2-二基)雙(環己烷-1,2-二羧酸)、4,4’-氧基雙(環己烷-1,2-二羧酸)、4,4’-硫雙(環己烷-1,2-二羧酸)、4,4’-磺醯基雙(環己烷-1,2-二羧酸)、4,4’-(二甲基矽烷二基)雙(環己烷-1,2-二羧酸)、4,4’-(四氟丙烷-2,2-二基)雙(環己烷-1,2-二羧酸)、八氫戊搭烯-1,3,4,6-四羧酸、雙環[2.2.1]庚烷-2,3,5,6-四羧酸、6-(羧基甲基)雙環[2.2.1]庚烷-2,3,5-三羧酸、雙環[2.2.2]辛烷-2,3,5,6-四羧酸、雙環[2.2.2]辛-5-烯-2,3,7,8-四羧酸、三環[4.2.2.02,5]癸烷-3,4,7,8-四羧酸、三環[4.2.2.02,5]癸-7-烯-3,4,9,10-四羧酸、9-氧雜三環[4.2.1.02,5]壬烷-3,4,7,8-四羧酸、(4arH,8acH)-十氫-1t,4t:5c,8c-二甲橋萘-2c,3c,6c,7c-四羧酸、(4arH,8acH)-十氫-1t,4t:5c,8c-二甲橋萘-2t,3t,6c,7c-四羧酸、及該等的四羧酸的衍生物(四羧酸二酐等)等。該等之中,更佳為2,2-雙(3,4-二羧基苯基)六氟丙烷、4,4’-氧基二苯二甲酸、1,2,3,4-環丁烷四羧酸、(4arH,8acH)-十氫-1t,4t:5c,8c-二甲橋萘-2c,3c,6c,7c-四羧酸、(4arH,8acH)-十氫-1t,4t:5c,8c-二甲橋萘-2t,3t,6c,7c-四羧酸等的衍生物及該等的酸二酐。該等的四羧酸成分可單獨使用,又亦可組合多種使用。As the other tetracarboxylic acid component which provides the repeating unit represented by the above formula (1) or the repeating unit represented by the formula (5), any of other aromatic or alicyclic tetracarboxylic acids can be used. Although not particularly limited, for example, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane and 4-(2,5-di-tertiaryoxytetrahydrofuran-3-yl)-1 are exemplified. 2,3,4-tetrahydronaphthalene-1,2-dicarboxylic acid, pyromellitic acid, 3,3',4,4'-benzophenone tetracarboxylic acid, 3,3',4,4' -biphenyltetracarboxylic acid, 4,4'-oxydiphthalic acid, bis(3,4-dicarboxyphenyl)ruthenic anhydride, cross-linked triphenyl-3,4,3',4' -tetracarboxylic dianhydride, conjugated triphenyl-3,4,3',4'-tetracarboxylic dianhydride, biscarboxyphenyldimethyl decane, bisdicarboxyphenoxydiphenyl sulfide, sulfonium oxime Diphthalic acid, 1,2,3,4-cyclobutanetetracarboxylic acid, isopropylidenediphenoxydiphthalic acid, [1,1'-linked (cyclohexane)]- 3,3',4,4'-tetracarboxylic acid, [1,1'-linked (cyclohexane)]-2,3,3',4'-tetracarboxylic acid, [1,1'-linked ( Cyclohexane)]-2,2',3,3'-tetracarboxylic acid, 4,4'-methylenebis(cyclohexane-1,2-dicarboxylic acid), 4,4'-(propane -2,2-diyl)bis(cyclohexane-1,2-dicarboxylic acid), 4,4'-oxybis(cyclohexane-1,2-dicarboxylic acid), 4,4'- Sulfur bis(cyclohexane-1,2-dicarboxylic acid), 4,4'-sulfonyl bis(cyclohexane-1,2-dicarboxylic acid), 4,4'-(dimethyl decane II base Bis(cyclohexane-1,2-dicarboxylic acid), 4,4'-(tetrafluoropropane-2,2-diyl)bis(cyclohexane-1,2-dicarboxylic acid), octahydrogen Pentene-1,3,4,6-tetracarboxylic acid, bicyclo[2.2.1]heptane-2,3,5,6-tetracarboxylic acid, 6-(carboxymethyl)bicyclo[2.2.1] Heptane-2,3,5-tricarboxylic acid, bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic acid, bicyclo[2.2.2]oct-5-ene-2,3, 7,8-tetracarboxylic acid, tricyclo[4.2.2.02,5]decane-3,4,7,8-tetracarboxylic acid, tricyclo[4.2.2.02,5]non-7-ene-3,4 , 9,10-tetracarboxylic acid, 9-oxatricyclo[4.2.1.02,5]decane-3,4,7,8-tetracarboxylic acid, (4arH,8acH)-decahydro-1t, 4t: 5c,8c-dimethyl bridge naphthalene-2c,3c,6c,7c-tetracarboxylic acid, (4arH,8acH)-decahydro-1t,4t:5c,8c-dimethylnaphthalene-2t,3t,6c,7c a tetracarboxylic acid, a derivative of such a tetracarboxylic acid (such as tetracarboxylic dianhydride), or the like. Among these, more preferred are 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane, 4,4'-oxydiphthalic acid, 1,2,3,4-cyclobutane. Tetracarboxylic acid, (4arH, 8acH)-decahydro-1t, 4t: 5c, 8c-dimethylnaphthalene-2c, 3c, 6c, 7c-tetracarboxylic acid, (4arH, 8acH)-decahydro-1t, 4t a derivative of 5c, 8c-dimethylnaphthalene-2t, 3t, 6c, 7c-tetracarboxylic acid or the like and the acid dianhydride. These tetracarboxylic acid components may be used singly or in combination of two or more.

作為提供該通式(1)的重複單元或該通式(5)所示之重複單元的其他二胺成分,可使用其他芳香族或脂環式二胺的任一者。雖並未特別限定,例如可列舉:對苯二胺、間苯二胺、聯苯胺、3,3’-二胺基-聯苯、3,3’-雙(三氟甲基)聯苯胺、間聯甲苯胺、4,4’-二胺基苯醯替苯胺、3,4’-二胺基苯醯替苯胺、N,N’-雙(4-胺基苯基)對苯二甲醯胺、N,N’-對伸苯基雙(對胺基苯甲醯胺)、4-胺基苯氧基-4-二胺基苯甲酸酯、雙(4-胺基苯基)對苯二甲酸酯、聯苯-4,4’-二羧酸雙(4-胺基苯基)酯、雙(對胺基苯甲酸)對伸苯酯、雙(4-胺基苯基)-[1,1’-聯苯]-4,4’-二羧酸酯、[1,1’-聯苯]-4,4’-二基雙(4-胺基苯甲酸酯)、4,4’-氧基二苯胺、3,4’-氧基二苯胺、3,3’-氧基二苯胺、雙(4-胺基苯基)硫、對亞甲基雙(苯二胺)、1,3-雙(4-胺基苯氧基)苯、1,3-雙(3-胺基苯氧基)苯、1,4-雙(4-胺基苯氧基)苯、2,2-雙[4-(4-胺基苯氧基)苯基]六氟丙烷、2,2-雙(4-胺基苯基)六氟丙烷、雙(4-胺基苯基)碸、3,3-雙((胺基苯氧基)苯基)丙烷、2,2-雙(3-胺基-4-羥基苯基)六氟丙烷、雙(4-(4-胺基苯氧基)二苯基)碸、雙(4-(3-胺基苯氧基)二苯基)碸、八氟聯苯胺、3,3’-二甲氧基-4,4’-二胺基聯苯、3,3’-二氯-4,4’-二胺基聯苯、3,3’-二氟-4,4’-二胺基聯苯、4,4’-雙(4-胺基苯氧基)聯苯、4,4’-雙(3-胺基苯氧基)聯苯、1,4-二胺基環己烷、1,4-二胺基-2-甲基環己烷、1,4-二胺基-2-乙基環己烷、1,4-二胺基-2-正丙基環己烷、1,4-二胺基-2-異丙基環己烷、1,4-二胺基-2-正丁基環己烷、1,4-二胺基-2-異丁基環己烷、1,4-二胺基-2-第二丁基環己烷、1,4-二胺基-2-第三丁基環己烷、1,2-二胺基環己烷、1,4-二胺基環己烷等及該等的衍生物。該等之中,更佳為對苯二胺、間聯苯甲胺、4,4’-氧基二苯胺、1,4-雙(4-胺基苯氧基)苯、4,4’-雙(4-胺基苯氧基)聯苯等。該等的二胺成分為可單獨使用,又亦可組合多種使用。As the other diamine component which provides the repeating unit of the above formula (1) or the repeating unit represented by the formula (5), any of other aromatic or alicyclic diamines can be used. Although not particularly limited, for example, p-phenylenediamine, m-phenylenediamine, benzidine, 3,3'-diamino-biphenyl, 3,3'-bis(trifluoromethyl)benzidine, M-toluidine, 4,4'-diaminobenzophenone, 3,4'-diaminobenzophenone, N,N'-bis(4-aminophenyl)-p-benzoquinone Amine, N, N'-p-phenylene bis(p-aminobenzamide), 4-aminophenoxy-4-diaminobenzoate, bis(4-aminophenyl) pair Phthalate, biphenyl (4-aminophenyl)-4,4'-dicarboxylic acid, bis(p-aminobenzoic acid) p-phenylene ester, bis(4-aminophenyl) -[1,1'-biphenyl]-4,4'-dicarboxylate, [1,1'-biphenyl]-4,4'-diylbis(4-aminobenzoate), 4,4'-oxydiphenylamine, 3,4'-oxydiphenylamine, 3,3'-oxydiphenylamine, bis(4-aminophenyl)sulfide, p-methylenebis(phenylenediamine) ), 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 2,2-bis(4-aminophenyl)hexafluoropropane, bis(4-aminophenyl) Bismuth, 3,3-bis((aminophenoxy)phenyl)propane, 2,2-dual ( 3-amino-4-hydroxyphenyl)hexafluoropropane, bis(4-(4-aminophenoxy)diphenyl)anthracene, bis(4-(3-aminophenoxy)diphenyl碸, octafluorobenzidine, 3,3'-dimethoxy-4,4'-diaminobiphenyl, 3,3'-dichloro-4,4'-diaminobiphenyl, 3, 3'-Difluoro-4,4'-diaminobiphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, 4,4'-bis(3-aminophenoxy) Biphenyl, 1,4-diaminocyclohexane, 1,4-diamino-2-methylcyclohexane, 1,4-diamino-2-ethylcyclohexane, 1,4- Diamino-2-n-propylcyclohexane, 1,4-diamino-2-isopropylcyclohexane, 1,4-diamino-2-n-butylcyclohexane, 1,4 -diamino-2-isobutylcyclohexane, 1,4-diamino-2-second butylcyclohexane, 1,4-diamino-2-tert-butylcyclohexane, 1,2-diaminocyclohexane, 1,4-diaminocyclohexane, and the like, and derivatives thereof. Among these, more preferred are p-phenylenediamine, m-dibenzylamine, 4,4'-oxydiphenylamine, 1,4-bis(4-aminophenoxy)benzene, 4,4'- Bis(4-aminophenoxy)biphenyl and the like. These diamine components may be used singly or in combination of two or more.

本發明的聚醯亞胺前驅物及本發明的聚醯亞胺,除了該通式(1)所示之重複單元或該通式(5)所示之重複單元以外,亦可包含其他重複單元的1種以上。作為提供其他重複單元的四羧酸成分及二胺成分並未特別限定,其他習知的四羧酸類、習知的二胺類皆可使用。又,在組合之二胺成分為無法提供該通式(1)所示之重複單元或該通式(5)所示之重複單元的二胺成分的情況中,提供其他重複單元的四羧酸成分亦可例示為提供該通式(1)所示之重複單元或該通式(5)所示之重複單元的四羧酸成分(亦包含CpODA等、具有該式(2)所示之結構的四羧酸類等、1,2,4,5-環己烷四羧酸類等、2,3,3’,4’-聯苯四羧酸類等)。又,在組合之四羧酸成分為無法提供該通式(1)所示之重複單元或該通式(5)所示之重複單元的四羧酸成分的情況,提供其他重複單元的二胺成分亦可例示為提供該通式(1)所示之重複單元或該通式(5)所示之重複單元的二胺成分(亦包含TFMB、具有該式(2)所示之結構的二胺)。The polyimine precursor of the present invention and the polyimine of the present invention may contain other repeating units in addition to the repeating unit represented by the formula (1) or the repeating unit represented by the formula (5). One or more. The tetracarboxylic acid component and the diamine component which provide other repeating means are not specifically limited, and other conventional tetracarboxylic acids and a conventional diamine can be used. Further, in the case where the combined diamine component is a diamine component which cannot provide the repeating unit represented by the formula (1) or the repeating unit represented by the formula (5), the tetracarboxylic acid of another repeating unit is provided. The component may also be exemplified by a tetracarboxylic acid component (also including CpODA or the like having the formula shown in the formula (1) or a repeating unit represented by the formula (5). Examples of tetracarboxylic acids and the like, 1,2,4,5-cyclohexanetetracarboxylic acid, etc., 2,3,3',4'-biphenyltetracarboxylic acid, etc.). Further, in the case where the combined tetracarboxylic acid component is a tetracarboxylic acid component which cannot provide the repeating unit represented by the formula (1) or the repeating unit represented by the formula (5), a diamine of another repeating unit is provided. The component may also be exemplified by a diamine component (also including TFMB or a structure having the formula (2)) of the repeating unit represented by the formula (1) or the repeating unit represented by the formula (5). amine).

本發明的聚醯亞胺前驅物中,該通式(1)中的R1 、R2 分別獨立為氫、碳數1~6、較佳為碳數1~3的烷基(特佳為甲基或乙基)、或碳數3~9的烷矽基(特佳為三甲基矽基或第三丁基二甲基矽基)任一者。R1 、R2 中,可藉由後述的製造方法改變其官能基的種類及官能基的導入率。In the polyimine precursor of the present invention, R 1 and R 2 in the formula (1) are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, preferably 1 to 3 carbon atoms (particularly Any of methyl or ethyl) or an alkanoyl group having 3 to 9 carbon atoms (particularly preferably a trimethylsulfonyl group or a tert-butyldimethylthio group). In R 1 and R 2 , the type of the functional group and the introduction ratio of the functional group can be changed by a production method to be described later.

官能基的導入率並未特別限定,導入烷基或烷矽基的情況,可分別使R1 、R2 的25%以上、較佳為50%以上、更佳為75%以上為烷基或烷矽基。藉由分別使R1 、R2 的25%以上為烷基或烷矽基,可使聚醯亞胺前驅物的保存穩定性優良。The introduction rate of the functional group is not particularly limited, and when an alkyl group or an alkyl fluorenyl group is introduced, 25% or more, preferably 50% or more, more preferably 75% or more of R 1 and R 2 may be an alkyl group or Alkyl fluorenyl. By making 25% or more of R 1 and R 2 into an alkyl group or an alkyl fluorenyl group, respectively, the storage stability of the polyimide precursor can be excellent.

本發明的聚醯亞胺前驅物,分別獨立地根據R1 與R2 所採取的化學結構,可分類為1)聚醯胺酸(R1 與R2 為氫)、2)聚醯胺酸酯(R1 、R2 之至少一部分為烷基)、3)4)聚醯胺酸矽酯(R1 、R2 之至少一部分為烷矽基)。接著,本發明的聚醯亞胺前驅物,針對該各分類可藉由以下的製造方法輕易製造。然而,本發明之聚醯亞胺前驅物的製造方法並不限於以下的製造方法。 1)聚醯胺酸The polyimine precursors of the present invention are independently classified according to the chemical structures employed by R 1 and R 2 , and can be classified into 1) poly-proline (R 1 and R 2 are hydrogen), 2) poly-proline The ester (at least a part of R 1 and R 2 is an alkyl group), 3) 4) polydecyl decylamine (at least a part of R 1 and R 2 is an alkane group). Next, the polyimine precursor of the present invention can be easily produced by the following production method for each of the classifications. However, the method for producing the polyimine precursor of the present invention is not limited to the following production method. 1) Polylysine

本發明的聚醯亞胺前驅物,使作為四羧酸成分的四羧酸二酐與二胺成分約為等莫耳,較佳係以二胺成分相對於四羧酸成分的莫耳比[二胺成分的莫耳數/四羧酸成分的莫耳數]較佳為0.90~1.10、更佳為0.95~1.05的比例,例如在120℃以下的較低溫度下,抑制醯亞胺化的同時在溶劑中反應,藉此可較佳地得到聚醯亞胺前驅物溶液組成物。The polyimine precursor of the present invention has a tetracarboxylic dianhydride and a diamine component as a tetracarboxylic acid component of about the same molar amount, preferably a molar ratio of the diamine component to the tetracarboxylic acid component [ The molar number of the diamine component / the molar number of the tetracarboxylic acid component is preferably from 0.90 to 1.10, more preferably from 0.95 to 1.05, for example, at a lower temperature of 120 ° C or lower, inhibiting the imidization. At the same time, it is reacted in a solvent, whereby a polyimide composition precursor solution composition can be preferably obtained.

本發明的聚醯亞胺前驅物的合成方法並未限定,更具體而言,使二胺溶解於有機溶劑,並在該溶液中攪拌的同時,緩慢添加四羧酸二酐,在0~120℃、較佳為5~80℃的範圍內攪拌1~72小時,藉此得到聚醯亞胺前驅物。為了使聚醯亞胺前驅物的分子量容易增加,如上述製造方法中的二胺與四羧酸二酐的添加順序較佳。又,從減少析出物的觀點來看,亦可使上述製造方法的二胺與四羧酸二酐的添加順序相反較佳。The method for synthesizing the polyimine precursor of the present invention is not limited, and more specifically, the diamine is dissolved in an organic solvent, and while stirring in the solution, the tetracarboxylic dianhydride is slowly added, at 0 to 120. The mixture is stirred at ° C, preferably 5 to 80 ° C for 1 to 72 hours to obtain a polyimide precursor. In order to easily increase the molecular weight of the polyimide precursor, the order of addition of the diamine and the tetracarboxylic dianhydride in the above production method is preferred. Further, from the viewpoint of reducing precipitates, the order of addition of the diamine and the tetracarboxylic dianhydride in the above production method may be preferably reversed.

又,在四羧酸成分與二胺成分的莫耳比中二胺成分會過剩的情況下,可因應需求,添加與二胺成分的過剩莫耳數約等量的羧酸衍生物,而可使四羧酸成分與二胺成分的莫耳比接近約略等量。作為此處的羧酸衍生物,較佳為實質上不使聚醯亞胺前驅物溶液的黏度增加、亦即實質上與分子鏈延長無關的四羧酸,或是發揮封端劑之功能的三羧酸與其酸酐、二羧酸與其酸酐等。 2)聚醯胺酸酯Further, when the diamine component is excessive in the molar ratio of the tetracarboxylic acid component and the diamine component, a carboxylic acid derivative equivalent to an excess number of moles of the diamine component may be added as needed, and The molar ratio of the tetracarboxylic acid component to the diamine component is approximately equal to the same amount. The carboxylic acid derivative herein is preferably a tetracarboxylic acid which does not substantially increase the viscosity of the polyimide precursor solution, that is, substantially irrelevant to the molecular chain extension, or functions as a blocking agent. A tricarboxylic acid and its anhydride, a dicarboxylic acid, an anhydride thereof, and the like. 2) Polyamidomate

使四羧酸二酐與任意的醇反應,得到二酯二羧酸後,與氯化試藥(亞硫醯氯、草醯氯等)反應,得到二酯二羧醯氯。藉由在-20~120℃、較佳為-5~80℃的範圍內將該二酯二羧醯氯與二胺攪拌1~72小時,得到聚醯亞胺前驅物。又,使用磷系縮合劑或碳二亞胺縮合劑等使二酯二羧酸與二胺脫水縮合,亦可簡便地得到聚醯亞胺前驅物。The tetracarboxylic dianhydride is reacted with an arbitrary alcohol to obtain a diester dicarboxylic acid, which is then reacted with a chlorinated reagent (thinylene chloride, grass chloroform, etc.) to obtain a diester dicarboxy ruthenium chloride. The diester dicarboxyfluorene chloride and the diamine are stirred for 1 to 72 hours at a temperature of from -20 to 120 ° C, preferably from -5 to 80 ° C to obtain a polyimine precursor. Further, the polyester imide precursor can be easily obtained by dehydrating and condensing the diester dicarboxylic acid and the diamine using a phosphorus-based condensing agent or a carbodiimide condensing agent.

該方法所得之聚醯亞胺前驅物,因為安定,亦可添加水或醇等的溶劑並進行再沉澱等的精製。 3)聚醯胺酸矽基酯(間接法)The polyimine precursor obtained by this method may be purified by re-precipitation or the like by adding a solvent such as water or alcohol. 3) Polydecyl phthalate (indirect method)

預先使二胺與矽基化劑反應而得到經矽基化之二胺。因應需求以蒸餾等進行經矽基化之二胺的精製。接著,使經矽基化之二胺溶解於經脫水的溶劑中,攪拌的同時緩慢添加四羧酸二酐,在0~120℃、較佳為5~80℃的範圍內攪拌1~72小時,得到聚醯亞胺前驅物。The diamine is reacted with a guanylating agent in advance to obtain a guanidinated diamine. Purification of the thiolated diamine by distillation or the like is required. Next, the thiolated diamine is dissolved in a dehydrated solvent, and tetracarboxylic dianhydride is slowly added while stirring, and stirred at 0 to 120 ° C, preferably 5 to 80 ° C for 1 to 72 hours. , to obtain a polyimide precursor.

作為此處所使用的矽基化劑,若使用不含氯的矽基化劑則不需要對經矽基化之二胺進行精製,因而較佳。作為不含氯原子的矽基化劑,可列舉N,O-雙(三甲基矽基)三氟乙醯胺、N,O-雙(三甲基矽基)乙醯胺、六甲基二矽氮烷。從不含氟原子而降低成本的觀點來看,特佳為N,O-雙(三甲基矽基)乙醯胺、六甲基二矽氮烷。As the thiolating agent to be used herein, it is preferred to use a fluorenylating agent which does not contain chlorine, since it is not necessary to purify the fluorinated diamine. Examples of the thiolating agent containing no chlorine atom include N,O-bis(trimethyldecyl)trifluoroacetamide, N,O-bis(trimethyldecyl)acetamide, hexamethyl group. Dioxane. From the viewpoint of reducing the cost of the fluorine-containing atom, it is particularly preferably N,O-bis(trimethyldecyl)acetamide or hexamethyldioxane.

又,二胺的矽基化反應中,為了促進反應,可使用吡啶、哌啶、三乙胺等的胺系觸媒。此觸媒可直接作為聚醯亞胺前驅物的聚合觸媒使用。 4)聚醯胺酸矽基酯(直接法)Further, in the thiolation reaction of the diamine, an amine-based catalyst such as pyridine, piperidine or triethylamine may be used to promote the reaction. This catalyst can be used directly as a polymerization catalyst for the polyimide precursor. 4) Poly(decyl) methacrylate (direct method)

將1)的方法所得之聚醯胺酸溶液與矽基化劑混合,在0~120℃、較佳為5~80℃的範圍內攪拌1~72小時,得到聚醯亞胺前驅物。The polyamic acid solution obtained by the method of 1) is mixed with a thiolating agent, and stirred at 0 to 120 ° C, preferably 5 to 80 ° C for 1 to 72 hours to obtain a polyimine precursor.

作為此處所使用的矽基化劑,若使用不含氯的矽基化劑,則不需要對經矽基化之聚醯胺酸或所得之聚醯亞胺進行精製,因而較佳。作為不含氯原子的矽基化劑,可列舉:N,O-雙(三甲基矽基)三氟乙醯胺、N,O-雙(三甲基矽基)乙醯胺、六甲基二矽氮烷。從不含氟原子而降低成本的觀點來看,特佳為N,O-雙(三甲基矽基)乙醯胺、六甲基二矽氮烷。As the thiolating agent to be used herein, it is preferred to use a fluorenyl-free thiolating agent, since it is not necessary to purify the thiolated polyamic acid or the obtained polyimine. Examples of the thiolating agent containing no chlorine atom include N,O-bis(trimethyldecyl)trifluoroacetamide, N,O-bis(trimethyldecyl)acetamide, and hexamethyl Dioxazolidine. From the viewpoint of reducing the cost of the fluorine-containing atom, it is particularly preferably N,O-bis(trimethyldecyl)acetamide or hexamethyldioxane.

該製造方法,皆可適合在有機溶劑中進行,結果可輕易得到本發明之聚醯亞胺前驅物的清漆。This production method can be suitably carried out in an organic solvent, and as a result, the varnish of the polyimide precursor of the present invention can be easily obtained.

製備聚醯亞胺前驅物時所使用的溶劑,較佳為例如N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、1,3-二甲基-2-咪唑啶酮、二甲基亞碸等的非質子性溶劑、特佳為N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮;只要可溶解原料單體成分與生成的聚醯亞胺,則可毫無問題地使用各種溶劑,其結構並未特別限定。作為溶劑,較佳為採用N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮等的醯胺溶劑、γ-丁內酯、γ-戊內酯、δ-戊內酯、γ-己內酯、ε-己內酯、α-甲基-γ-丁內酯等的環狀酯溶劑、碳酸伸乙酯、碳酸伸丙酯等的碳酸酯溶劑、三乙二醇等二醇系溶劑、間甲酚、對甲酚、3-氯苯酚、4-氯苯酚等苯酚系溶劑、苯乙酮、1,3-二甲基-2-咪唑啶酮、環丁碸、二甲基亞碸等。再者,亦可使用其他一般的有機溶劑、亦即苯酚、鄰甲酚、乙酸丁酯、乙酸乙酯、乙酸異丁酯、丙二醇甲基乙酸酯、乙基賽珞蘇、丁基賽珞蘇、2-甲基賽珞蘇乙酸酯、乙基賽珞蘇乙酸酯、丁基賽珞蘇乙酸酯、四氫呋喃、二甲氧基乙烷、二乙氧基乙烷、二丁醚、二乙二醇二甲醚、甲基異丁基酮、二異丁基酮、環戊酮、環己酮、甲乙酮、丙酮、丁醇、乙醇、二甲苯、甲苯、氯苯、萜烯、礦精、石油腦系溶劑等。另外,溶劑亦可組合多種使用。The solvent used in the preparation of the polyimide precursor is preferably, for example, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, An aprotic solvent such as 1,3-dimethyl-2-imidazolidinone or dimethylhydrazine, particularly preferably N,N-dimethylacetamide, N-methyl-2-pyrrolidone As long as the raw material monomer component and the produced polyimine are soluble, various solvents can be used without any problem, and the structure thereof is not particularly limited. As the solvent, a decylamine solvent such as N,N-dimethylformamide, N,N-dimethylacetamide or N-methylpyrrolidone, γ-butyrolactone, γ- is preferably used. a cyclic ester solvent such as valerolactone, δ-valerolactone, γ-caprolactone, ε-caprolactone, α-methyl-γ-butyrolactone, ethyl carbonate, propyl carbonate, etc. A glycol solvent such as a carbonate solvent or triethylene glycol, a phenol solvent such as m-cresol, p-cresol, 3-chlorophenol or 4-chlorophenol, acetophenone or 1,3-dimethyl-2- Imidazolidinone, cyclobutyl hydrazine, dimethyl hydrazine and the like. Further, other general organic solvents, that is, phenol, o-cresol, butyl acetate, ethyl acetate, isobutyl acetate, propylene glycol methyl acetate, ethyl cyanidin, butyl oxime may also be used. Sodium, 2-methyl cyproterone acetate, ethyl cyproterone acetate, butyl cyproterone acetate, tetrahydrofuran, dimethoxyethane, diethoxyethane, dibutyl ether , diethylene glycol dimethyl ether, methyl isobutyl ketone, diisobutyl ketone, cyclopentanone, cyclohexanone, methyl ethyl ketone, acetone, butanol, ethanol, xylene, toluene, chlorobenzene, decene, Mineral concentrate, petroleum brain solvent, etc. Further, the solvent may be used in combination of a plurality of types.

本發明中,聚醯亞胺前驅物的對數黏度並未特別限定,在30℃下的濃度0.5g/dL的N,N-二甲基乙醯胺溶液中的對數黏度較佳為0.2dL/g以上、更佳為0.8dL/g以上、特佳為0.9dL/g以上。若對數黏度在0.2dL/g以上,則聚醯亞胺前驅物的分子量高,所得之聚醯亞胺的機械強度及耐熱性優良。In the present invention, the logarithmic viscosity of the polyimide precursor is not particularly limited, and the logarithmic viscosity in the N,N-dimethylacetamide solution having a concentration of 0.5 g/dL at 30 ° C is preferably 0.2 dL / More than g, more preferably 0.8 dL/g or more, and particularly preferably 0.9 dL/g or more. When the logarithmic viscosity is 0.2 dL/g or more, the molecular weight of the polyimide precursor is high, and the obtained polyimine has excellent mechanical strength and heat resistance.

本發明中,聚醯亞胺前驅物的清漆(聚醯亞胺前驅物溶液組成物),至少包含本發明的聚醯亞胺前驅物與溶劑,相對於溶劑、四羧酸成分與二胺成分的總量,四羧酸成分與二胺成分的總量為5質量%以上、較佳為10質量%以上、更佳為15質量%以上的比例。另外,通常為60質量%以下、較佳為50質量%以下。此濃度接近起因於聚醯亞胺前驅物之固體成分濃度,若此濃度過低,例如可能難以控制在製造聚醯亞胺膜時所得之聚醯亞胺膜的膜厚。In the present invention, the varnish of the polyimine precursor (polyimine precursor solution composition) contains at least the polyimine precursor of the present invention and a solvent, and a solvent, a tetracarboxylic acid component and a diamine component. The total amount of the tetracarboxylic acid component and the diamine component is 5% by mass or more, preferably 10% by mass or more, and more preferably 15% by mass or more. Further, it is usually 60% by mass or less, preferably 50% by mass or less. This concentration is close to the solid content concentration of the polyimide precursor. If the concentration is too low, for example, it may be difficult to control the film thickness of the polyimide film obtained when the polyimide film is produced.

作為用於本發明之聚醯亞胺前驅物的清漆的溶劑,只要可溶解聚醯亞胺前驅物即無問題,其結構並未特別限定。作為聚醯亞胺前驅物之清漆的溶劑,可列舉與在製備上述聚醯亞胺前驅物時使用之溶劑相同者,可將製備聚醯亞胺前驅物時所使用之溶劑直接作為聚醯亞胺前驅物之清漆的溶劑使用。又,亦可因應需求,從如上述所製備之聚醯亞胺前驅物溶液去除溶劑或添加溶劑。The solvent used as the varnish for the polyimide precursor of the present invention is not particularly limited as long as it can dissolve the polyimide precursor. The solvent used for the varnish of the polyimide precursor may be the same as the solvent used in the preparation of the above polyimide precursor, and the solvent used in the preparation of the polyimide precursor may be directly used as the polyimide. The solvent of the varnish of the amine precursor is used. Further, the solvent or the solvent may be removed from the polyimine precursor solution prepared as described above, depending on the demand.

本發明中,聚醯亞胺前驅物的清漆的黏度(旋轉黏度)並未特別限定,使用E型旋轉黏度計,以溫度25℃、剪切速度20sec-1 測量的旋轉黏度較佳為0.01~1000Pa・sec、更佳為0.1~100Pa・sec。又,亦可因應需求賦予觸變性。上述範圍的黏度中,在進行塗布及製膜時容易操作,又可抑制眼孔(eye hole)、且塗勻性優良,因此可得到良好的被覆膜。In the present invention, the viscosity (rotational viscosity) of the varnish of the polyimide precursor is not particularly limited, and the rotational viscosity measured at a temperature of 25 ° C and a shear rate of 20 sec -1 is preferably 0.01 using an E-type rotational viscometer. 1000 Pa·sec, more preferably 0.1 to 100 Pa·sec. In addition, thixotropy can be imparted in response to demand. Among the viscosities in the above range, it is easy to handle during coating and film formation, and it is possible to suppress an eye hole and to have excellent coating uniformity, so that a good coating film can be obtained.

本發明的聚醯亞胺前驅物的清漆中,可因應需求含有化學醯亞胺化劑(乙酸酐等的酸酐或吡啶、異喹啉等的胺化合物)、抗氧化劑、填料(二氧化矽等的無機粒子等)、染料、顏料、矽烷偶合劑等的偶合劑、底塗劑、阻燃材、消泡劑、塗勻劑、流變性控制劑(流動輔助劑)、剝離劑等。The varnish of the polyimine precursor of the present invention may contain a chemical quinone imidating agent (an acid anhydride such as acetic anhydride or an amine compound such as pyridine or isoquinoline), an antioxidant, or a filler (cerium oxide, etc.) depending on the demand. A coupling agent such as an inorganic particle or the like, a dye, a pigment, a decane coupling agent, a primer, a flame retardant, an antifoaming agent, a smoothing agent, a rheology control agent (flow aid), a release agent, and the like.

本發明的聚醯亞胺,可藉由如前所述的本發明之聚醯亞胺前驅物進行脫水閉環反應(醯亞胺化反應)而較佳地製造。醯亞胺化的方法並未特別限定,可較佳地應用習知的熱醯亞胺化、或化學醯亞胺化的方法。The polyimine of the present invention can be preferably produced by performing a dehydration ring-closure reaction (oxime imidization reaction) of the polyimine precursor of the present invention as described above. The method for the imidization of hydrazine is not particularly limited, and a conventional method of thermal sulfiliation or chemical hydrazylation can be preferably applied.

所得之聚醯亞胺的形態,較佳可列舉膜、聚醯亞胺膜與其他基材的積層體、塗膜、粉末、珠、成型體、發泡體及清漆等。The form of the obtained polyimine is preferably a film, a laminate of a polyimide film and another substrate, a coating film, a powder, a bead, a molded body, a foam, a varnish, or the like.

以下說明使用本發明之聚醯亞胺前驅物的、聚醯亞胺膜/基材積層體或聚醯亞胺膜的製造方法的一例。然而,不限於以下的方法。An example of a method for producing a polyimine film/substrate laminate or a polyimide film using the polyimide intermediate of the present invention will be described below. However, it is not limited to the following methods.

將本發明的聚醯亞胺前驅物的清漆流延、塗布於基材上,在真空中、氮氣等的惰性氣體中或是空氣中,使用熱風或紅外線,於20~180℃、較佳為20~150℃的溫度範圍內進行乾燥。接著,使所得之聚醯亞胺前驅物膜在基材上,或是在將聚醯亞胺前驅物膜從基材上剝離並將該膜之端部固定的狀態下,於真空中、氮氣等的惰性氣體中或空氣中,使用熱風或紅外線,以200~500℃、更佳為250~450℃左右的溫度進行加熱醯亞胺化,藉此可製造聚醯亞胺膜/基材積層體或聚醯亞胺膜。另外,為了防止所得之聚醯亞胺膜氧化劣化,期望係在真空中或惰性氣體中進行加熱醯亞胺化。若加熱醯亞胺化的溫度不太高,則在空氣中進行亦無妨。The varnish of the polyimine precursor of the present invention is cast and applied onto a substrate, and is heated at 20 to 180 ° C, preferably in an inert gas such as nitrogen or air in a vacuum, at 20 to 180 ° C. Drying is carried out at a temperature ranging from 20 to 150 °C. Next, the obtained polyimine precursor film is placed on the substrate, or in a state where the polyimide film is peeled off from the substrate and the ends of the film are fixed, in a vacuum, nitrogen In an inert gas or air, hot air or infrared rays are used, and heated at a temperature of 200 to 500 ° C, more preferably about 250 to 450 ° C, to produce a polyimide film/substrate laminate. Body or polyimine film. Further, in order to prevent oxidative degradation of the obtained polyimide film, it is desirable to carry out heating oxime imidization in a vacuum or in an inert gas. If the temperature at which the imidization is heated is not too high, it may be carried out in the air.

此處作為基材並未特別限定,可使用例如陶瓷(玻璃、矽、氧化鋁),金屬(銅、鋁、不銹鋼)、耐熱塑膠膜(聚醯亞胺膜)等的基材。在一實施態樣中,作為基材較佳為玻璃,使聚醯亞胺膜形成於玻璃基材上的聚醯亞胺膜/玻璃基材積層體,例如可較佳地使用在製造用於顯示器的基板等。The substrate is not particularly limited, and for example, a substrate such as ceramic (glass, tantalum, alumina), metal (copper, aluminum, stainless steel), or heat-resistant plastic film (polyimine film) can be used. In one embodiment, a polyimide film/glass substrate laminate in which a polyimide film is formed on a glass substrate as a substrate is preferably used in the production. The substrate of the display, etc.

又,聚醯亞胺前驅物的醯亞胺化反應,亦可藉化學處理代替以上述加熱處理進行之加熱醯亞胺化,該化學處理係在吡啶或三乙胺等的3級胺存在下,將聚醯亞胺前驅物浸漬於含有乙酸酐等的脫水環化試藥的溶液等。又,預先將該等的脫水環化試藥投入聚醯亞胺前驅物的清漆中並攪拌,將其流延於基材上並乾燥,藉此可製作部分醯亞胺化的聚醯亞胺前驅物,進一步對其進行上述加熱處理,可得到聚醯亞胺膜/基材積層體或是聚醯亞胺膜。Further, the ruthenium imidization reaction of the polyimide precursor may be carried out by chemical treatment instead of the heat treatment by the above heat treatment in the presence of a tertiary amine such as pyridine or triethylamine. The polyimide precursor is immersed in a solution containing an anhydrocyclization reagent such as acetic anhydride or the like. Further, these dehydrated cyclization reagents are put into a varnish of a polyimide precursor in advance and stirred, cast on a substrate, and dried, whereby a partially ruminated imine imine can be produced. The precursor is further subjected to the above heat treatment to obtain a polyimide film/substrate laminate or a polyimide film.

又,可藉由下述方法較佳地製造本發明的聚醯亞胺:使四羧酸成分與二胺成分在溶劑中反應,製備包含本發明之聚醯亞胺的溶液組成物(清漆),藉由加熱等,從所製備之聚醯亞胺溶液組成物去除溶劑。Further, the polyimine of the present invention can be preferably produced by reacting a tetracarboxylic acid component and a diamine component in a solvent to prepare a solution composition (varnish) comprising the polyimine of the present invention. The solvent is removed from the prepared polyimine solution composition by heating or the like.

以下說明本發明之聚醯亞胺溶液組成物(包含聚醯亞胺之清漆)的製造方法及使用該聚醯亞胺溶液組成物之聚醯亞胺膜/基材積層體或是聚醯亞胺膜之製造方法的一例。然而,並不限於以下方法。Hereinafter, a method for producing a polyimine solution of the present invention (a varnish containing a polyimide) and a polyimine film/substrate laminate using the composition of the polyimide solution or a polyruthenium will be described. An example of a method for producing an amine film. However, it is not limited to the following methods.

使四羧酸二酐等的四羧酸成分與二胺成分約為等莫耳,較佳係以二胺成分相對於四羧酸成分的莫耳比[二胺成分的莫耳數/四羧酸成分的莫耳數]較佳為0.90~1.10、更佳為0.95~1.05的比例在溶劑中反應,而可較佳地得到本發明的聚醯亞胺溶液組成物。The tetracarboxylic acid component such as tetracarboxylic dianhydride and the diamine component are about equimolar, preferably the molar ratio of the diamine component to the tetracarboxylic acid component [molar number of diamine component / tetracarboxylic acid] The molar ratio of the acid component is preferably from 0.90 to 1.10, more preferably from 0.95 to 1.05, and the reaction is carried out in a solvent, and the composition of the polyimine solution of the present invention can be preferably obtained.

更具體而言,使二胺成分溶解於溶劑中,在該溶液中攪拌的同時,緩慢添加四羧酸二酐等的四羧酸成分,因應需求,較佳係在室溫~80℃的範圍內攪拌0.5~30小時後升溫以進行醯亞胺化反應,藉此可得到聚醯亞胺溶液。亦可在添加四羧酸成分後立即升溫而進行醯亞胺化反應。又,亦可使二胺成分與四羧酸成分的添加順序相反,亦可同時將二胺成分與四羧酸成分添加至溶劑中。More specifically, the diamine component is dissolved in a solvent, and while stirring in the solution, a tetracarboxylic acid component such as tetracarboxylic dianhydride is slowly added, and it is preferably in the range of room temperature to 80 ° C depending on the demand. After stirring for 0.5 to 30 hours, the temperature is raised to carry out the hydrazine imidization reaction, whereby a polyimine solution can be obtained. The ruthenium imidization reaction can also be carried out by immediately raising the temperature immediately after the addition of the tetracarboxylic acid component. Further, the order of addition of the diamine component and the tetracarboxylic acid component may be reversed, and the diamine component and the tetracarboxylic acid component may be simultaneously added to the solvent.

醯亞胺化的方法並未特別限定,可較佳地應用習知的熱醯亞胺化,或化學醯亞胺化的方法。例如,在100℃以上、較佳為120℃以上、更佳為150~250℃之範圍的溫度下,將包含四羧酸二酐等的四羧酸成分與二胺成分的溶液攪拌0.5~72小時,使四羧酸成分與二胺成分反應,藉此可進行醯亞胺化反應。化學醯亞胺化的情況,在反應溶液加入化學醯亞胺化劑(乙酸酐等的酸酐或吡啶、異喹啉、三乙胺等的胺化合物)以進行反應。亦可因應需求,將醯亞胺化觸媒等加入反應溶液以進行反應。The method of ruthenium imidization is not particularly limited, and a conventional method of thermal sulfiliation or chemical hydrazylation can be preferably applied. For example, a solution containing a tetracarboxylic acid component such as tetracarboxylic dianhydride and a diamine component is stirred at a temperature of 100 ° C or higher, preferably 120 ° C or higher, more preferably 150 to 250 ° C. The quinone imidization reaction can be carried out by reacting a tetracarboxylic acid component with a diamine component in an hour. In the case of chemical hydrazine imidation, a chemical hydrazine imidating agent (an acid anhydride such as acetic anhydride or an amine compound such as pyridine, isoquinoline or triethylamine) is added to the reaction solution to carry out a reaction. A ruthenium-based catalyst or the like may be added to the reaction solution to carry out the reaction according to the demand.

又,亦可在去除反應時所產生的水的同時進行醯亞胺化反應。Further, the hydrazine imidization reaction can be carried out while removing the water generated during the reaction.

在四羧酸成分與二胺成分的莫耳比中二胺成分過剩的情況,可因應需求,添加與二胺成分的過剩莫耳數約等量的羧酸衍生物,而可使四羧酸成分與二胺成分的莫耳比接近大致相同。作為此處的羧酸衍生物,較佳為實質上不使聚醯亞胺溶液的黏度增加、亦即實質的上與分子鏈延長無關的四羧酸,或發揮作為封端劑之功能的三羧酸與其酸酐、二羧酸與其酸酐等。When the diamine component is excessive in the molar ratio of the tetracarboxylic acid component and the diamine component, a carboxylic acid derivative equivalent to an excess molar amount of the diamine component may be added in accordance with the demand, and the tetracarboxylic acid may be added. The molar ratio of the component to the diamine component is approximately the same. The carboxylic acid derivative herein is preferably a tetracarboxylic acid which does not substantially increase the viscosity of the polyimide reaction solution, that is, substantially does not substantially extend the molecular chain, or functions as a terminal blocking agent. Carboxylic acid and its anhydride, dicarboxylic acid and its anhydride, and the like.

製備聚醯亞胺溶液時所使用的溶劑,例如,較佳為N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、1,3-二甲基-2-咪唑啶酮、二甲基亞碸等的非質子性溶劑、特佳為N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮;只要可溶解原料單體成分與生成的聚醯亞胺,則可毫無問題地使用各種溶劑,其結構並未特別限定。作為溶劑,較佳為採用N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮等的醯胺溶劑、γ-丁內酯、γ-戊內酯、δ-戊內酯、γ-己內酯、ε-己內酯、α-甲基-γ-丁內酯等的環狀酯溶劑、碳酸伸乙酯、碳酸伸丙酯等的碳酸酯溶劑、三乙二醇等二醇系溶劑、間甲酚、對甲酚、3-氯苯酚、4-氯苯酚等苯酚系溶劑、苯乙酮、1,3-二甲基-2-咪唑啶酮、環丁碸、二甲基亞碸等。再者,亦可使用其他一般的有機溶劑、亦即苯酚、鄰甲酚、乙酸丁酯、乙酸乙酯、乙酸異丁酯、丙二醇甲基乙酸酯、乙基賽珞蘇、丁基賽珞蘇、2-甲基賽珞蘇乙酸酯、乙基賽珞蘇乙酸酯、丁基賽珞蘇乙酸酯、四氫呋喃、二甲氧基乙烷、二乙氧基乙烷、二丁醚、二乙二醇二甲醚、甲基異丁基酮、二異丁基酮、環戊酮、環己酮、甲乙酮、丙酮、丁醇、乙醇、二甲苯、甲苯、氯苯、萜烯、礦精、石油腦系溶劑等。另外,溶劑亦可組合多種使用。The solvent used in the preparation of the polyimine solution is, for example, preferably N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, An aprotic solvent such as 1,3-dimethyl-2-imidazolidinone or dimethylhydrazine, particularly preferably N,N-dimethylacetamide, N-methyl-2-pyrrolidone As long as the raw material monomer component and the produced polyimine are soluble, various solvents can be used without any problem, and the structure thereof is not particularly limited. As the solvent, a decylamine solvent such as N,N-dimethylformamide, N,N-dimethylacetamide or N-methylpyrrolidone, γ-butyrolactone, γ- is preferably used. a cyclic ester solvent such as valerolactone, δ-valerolactone, γ-caprolactone, ε-caprolactone, α-methyl-γ-butyrolactone, ethyl carbonate, propyl carbonate, etc. A glycol solvent such as a carbonate solvent or triethylene glycol, a phenol solvent such as m-cresol, p-cresol, 3-chlorophenol or 4-chlorophenol, acetophenone or 1,3-dimethyl-2- Imidazolidinone, cyclobutyl hydrazine, dimethyl hydrazine and the like. Further, other general organic solvents, that is, phenol, o-cresol, butyl acetate, ethyl acetate, isobutyl acetate, propylene glycol methyl acetate, ethyl cyanidin, butyl oxime may also be used. Sodium, 2-methyl cyproterone acetate, ethyl cyproterone acetate, butyl cyproterone acetate, tetrahydrofuran, dimethoxyethane, diethoxyethane, dibutyl ether , diethylene glycol dimethyl ether, methyl isobutyl ketone, diisobutyl ketone, cyclopentanone, cyclohexanone, methyl ethyl ketone, acetone, butanol, ethanol, xylene, toluene, chlorobenzene, decene, Mineral concentrate, petroleum brain solvent, etc. Further, the solvent may be used in combination of a plurality of types.

如上述進行醯亞胺化反應後,可將所得之反應溶液直接,或是將其濃縮或稀釋,甚至是因應需求添加後述添加劑等,來作為本發明的聚醯亞胺溶液組成物使用。又或者,從所得之反應溶液將可溶性的聚醯亞胺單離,再將經單離之聚醯亞胺加入溶劑,亦可得到本發明的聚醯亞胺溶液組成物(清漆)。聚醯亞胺的單離,例如可藉由下述方法進行:將包含所得之可溶性聚醯亞胺的反應溶液滴入水等的不良溶劑或使其混合,使聚醯亞胺析出(再沉澱)。After the ruthenium imidization reaction is carried out as described above, the obtained reaction solution can be used as the composition of the polyimine solution of the present invention, either directly or by concentrating or diluting it, or even adding an additive or the like as required. Alternatively, the polyimine solution of the present invention (varnish) of the present invention can also be obtained by separating the soluble polyimine from the obtained reaction solution and then adding the isolated polyimine to the solvent. The separation of the polyimine can be carried out, for example, by dropping a reaction solution containing the obtained soluble polyimine into a poor solvent such as water or mixing it, and precipitating the polyimine (reprecipitation) ).

本發明的聚醯亞胺溶液組成物(聚醯亞胺的清漆),至少包含本發明的聚醯亞胺與溶劑,相對於溶劑與聚醯亞胺的總量,聚醯亞胺的比例在5質量%以上、較佳為10質量%以上、更佳為15質量%以上、特佳為20質量%以上。若該濃度太低,則例如在製造聚醯亞胺膜時難以控制所得之聚醯亞胺膜的膜厚。另外,通常聚醯亞胺為60質量%以下、較佳為50質量%以下。The polyimine solution composition of the present invention (the varnish of polyimine) contains at least the polyimine of the present invention and a solvent, and the ratio of the polyimine to the total amount of the solvent and the polyimine is 5 mass% or more, preferably 10 mass% or more, more preferably 15 mass% or more, and particularly preferably 20 mass% or more. If the concentration is too low, it is difficult to control the film thickness of the obtained polyimide film, for example, in the production of a polyimide film. Further, the polyimine is usually 60% by mass or less, preferably 50% by mass or less.

作為本發明的聚醯亞胺溶液組成物的溶劑,只要可溶解聚醯亞胺即無問題,其結構並未特別限定。作為聚醯亞胺溶液組成物的溶劑,可列舉與製備上述聚醯亞胺溶液時所使用之溶劑相同者,可直接將製備聚醯亞胺溶液時使用之溶劑作為聚醯亞胺溶液組成物的溶劑使用。又,亦可因應需求,從如上述所製備之聚醯亞胺溶液組成物去除溶劑,或亦可添加溶劑。The solvent of the composition of the polyimine solution of the present invention is not particularly limited as long as it is soluble in the polyimide. The solvent used as the composition of the polyimine solution may be the same as the solvent used in the preparation of the above polyimine solution, and the solvent used in the preparation of the polyimine solution may be directly used as the composition of the polyimide reaction solution. The solvent used. Further, the solvent may be removed from the composition of the polyimine solution prepared as described above, or a solvent may be added as needed.

本發明中,聚醯亞胺的對數黏度並未特別限定,在30℃下的濃度0.5g/dL的N,N-二甲基乙醯胺溶液中的對數黏度較佳為0.2dL/g以上、更佳為0.4dL/g以上、特佳為0.5dL/g以上。對數黏度若在0.2dL/g以上,所得之聚醯亞胺的機械強度及耐熱性優良。In the present invention, the logarithmic viscosity of the polyimine is not particularly limited, and the logarithmic viscosity in the N,N-dimethylacetamide solution having a concentration of 0.5 g/dL at 30 ° C is preferably 0.2 dL/g or more. More preferably, it is 0.4 dL/g or more, and particularly preferably 0.5 dL/g or more. When the logarithmic viscosity is 0.2 dL/g or more, the obtained polyimine has excellent mechanical strength and heat resistance.

本發明中,聚醯亞胺溶液組成物的黏度(旋轉黏度)並未特別限定,使用E型旋轉黏度計,以溫度25℃、剪切速度20sec-1 測量的旋轉黏度較佳為0.01~1000Pa・sec、更佳為0.1~100Pa・sec。又,亦可因應需求賦予觸變性。上述範圍的黏度,在進行塗布及製膜時容易操作且可抑制眼孔(eye hole)、塗勻性優良,可得到良好的被覆膜。In the present invention, the viscosity (rotational viscosity) of the composition of the polyimine solution is not particularly limited, and the rotational viscosity measured at a temperature of 25 ° C and a shear rate of 20 sec -1 is preferably 0.01 to 1000 Pa using an E-type rotational viscometer.・sec, preferably 0.1 to 100 Pa·sec. In addition, thixotropy can be imparted in response to demand. The viscosity in the above range is easy to handle during coating and film formation, and it is possible to suppress the eye hole and the coating property, and to obtain a good coating film.

本發明的聚醯亞胺溶液組成物,亦可因應需求含有抗氧化劑、填料(二氧化矽等的無機粒子等)、染料、顏料、矽烷偶合劑等的偶合劑、底塗劑、阻燃材、消泡劑、塗勻劑、流變性控制劑(流動輔助劑)、剝離劑等。The composition of the polyimine solution of the present invention may contain an antioxidant, a filler (inorganic particles such as cerium oxide, etc.), a coupling agent such as a dye, a pigment, a decane coupling agent, a primer, a flame retardant, etc., depending on the demand. , antifoaming agent, smoothing agent, rheology control agent (flow aid), stripper, etc.

藉由從上述製備之聚醯亞胺溶液組成物去除溶劑,可較佳地得到本發明的聚醯亞胺。例如,將聚醯亞胺溶液組成物流延、塗布於基材上,在基材上加熱聚醯亞胺溶液組成物以去除溶劑,藉此可製造聚醯亞胺膜/基材積層體。加熱處理的溫度並未特別限定,通常為80~500℃、較佳為100~500℃、更佳為150~450℃左右的溫度。加熱處理可在真空中、氮氣等的惰性氣體中,或是空氣中進行,但通常期望係在真空中或惰性氣體中進行。接著,藉由將形成於該基材上的聚醯亞胺膜從基材剝離,可製造聚醯亞胺膜。The polyimine of the present invention can be preferably obtained by removing the solvent from the polyimine solution composition prepared above. For example, the polyimide composition solution is cast and coated on a substrate, and the polyimide composition solution is heated on the substrate to remove the solvent, whereby the polyimide film/substrate laminate can be produced. The temperature of the heat treatment is not particularly limited, but is usually 80 to 500 ° C, preferably 100 to 500 ° C, more preferably about 150 to 450 ° C. The heat treatment can be carried out in a vacuum, an inert gas such as nitrogen, or in air, but it is usually desired to carry out in a vacuum or in an inert gas. Next, a polyimide film can be produced by peeling the polyimide film formed on the substrate from the substrate.

此處,作為基材並未特別限定,可使用例如陶瓷(玻璃、矽、氧化鋁),金屬(銅、鋁、不銹鋼)、耐熱塑膠膜(聚醯亞胺膜)等的基材。在一實施態樣中,作為基材較佳為玻璃,使聚醯亞胺膜形成於玻璃基材上的聚醯亞胺膜/玻璃基材積層體,例如可較佳地使用在製造用於顯示器用的基板等。Here, the substrate is not particularly limited, and for example, a substrate such as ceramic (glass, tantalum, alumina), metal (copper, aluminum, stainless steel), or heat-resistant plastic film (polyimine film) can be used. In one embodiment, a polyimide film/glass substrate laminate in which a polyimide film is formed on a glass substrate as a substrate is preferably used in the production. A substrate for a display or the like.

又,將聚醯亞胺溶液組成物流延、塗布於基材上,將基材上的聚醯亞胺溶液組成物乾燥至具有自體支撐性為止,再將所得之自體支撐性膜從基材上剝離,在將該膜之端部固定的狀態下加熱以去除溶劑,藉此亦可較佳地製造聚醯亞胺膜。自體支撐性膜製造時的乾燥條件可適當決定,例如只要使聚醯亞胺溶液組成物在基材上於50~300℃左右的溫度範圍內進行乾燥即可。自體支撐性膜的加熱處理的溫度並未特別限定,通常為80~500℃、較佳為100~500℃、更佳為150~480℃左右的溫度。該方法中,加熱處理亦可在真空中、氮氣等的惰性氣體中或空氣中進行,但通常期望在真空中或惰性氣體中進行。Further, the composition of the polyimine solution is flow-coated, applied to a substrate, and the composition of the polyimine solution on the substrate is dried to have self-supporting properties, and the obtained auto-supporting film is further provided. The material is peeled off, and the solvent is removed by fixing the end portion of the film to remove the solvent, whereby the polyimide film can also be preferably produced. The drying conditions at the time of producing the self-supporting film can be appropriately determined. For example, the polyimide composition solution may be dried on the substrate at a temperature of about 50 to 300 °C. The temperature of the heat treatment of the self-supporting film is not particularly limited, and is usually 80 to 500 ° C, preferably 100 to 500 ° C, more preferably about 150 to 480 ° C. In this method, the heat treatment may be carried out in a vacuum or in an inert gas such as nitrogen or in air, but it is usually desired to carry out in a vacuum or in an inert gas.

另外,由聚醯亞胺溶液組成物所得之聚醯亞胺的形態,不限於膜、聚醯亞胺膜與其他基材的積層體,較佳亦可列舉塗膜、粉末、珠、成型體、發泡體等。Further, the form of the polyimine obtained from the composition of the polyimide reaction solution is not limited to a laminate of a film, a polyimide film and another substrate, and preferably a coating film, a powder, a bead, or a molded body. , foam, etc.

如此所得之本發明的聚醯亞胺,在以厚度10μm的膜進行測量的情況下,100~250℃之間的線熱膨脹係數並未特別限定,較佳為40ppm/K以下、更佳為35ppm/K以下、更佳為30ppm/K以下、特佳為25ppm/K以下。若線熱膨脹係數大,則與金屬等導體的線熱膨脹係數差變大,可能在形成電路基板時導致翹曲增大等的缺陷。When the polyimine of the present invention thus obtained is measured by a film having a thickness of 10 μm, the coefficient of linear thermal expansion between 100 and 250 ° C is not particularly limited, and is preferably 40 ppm/K or less, more preferably 35 ppm. Below /K, more preferably 30 ppm/K or less, and particularly preferably 25 ppm/K or less. When the linear thermal expansion coefficient is large, the difference in linear thermal expansion coefficient from a conductor such as a metal becomes large, which may cause defects such as an increase in warpage when a circuit board is formed.

本發明的聚醯亞胺,又在以厚度10μm的膜進行測量的情況下,波長400nm的透光率並未特別限定,較佳為80%以上、更佳為83%以上、特佳為85%以上。將聚醯亞胺膜用於顯示器用途等的情況,若透光率低,則需要增強光源,可能產生耗費能量這樣的問題等。When the polyimide of the present invention is measured by a film having a thickness of 10 μm, the light transmittance at a wavelength of 400 nm is not particularly limited, but is preferably 80% or more, more preferably 83% or more, and particularly preferably 85. %the above. When the polyimide film is used for a display or the like, if the light transmittance is low, it is necessary to enhance the light source, and there is a problem that energy is consumed.

本發明的聚醯亞胺,在以厚度10μm的膜進行測量的情況下,霧度並未特別限定,較佳為2%以下、更佳為1.5%以下、特佳為1%以下。將聚醯亞胺膜用於顯示器用途等的情況,若霧度高,則光散射而可能導致影像模糊。In the case where the polyimide of the present invention is measured by a film having a thickness of 10 μm, the haze is not particularly limited, but is preferably 2% or less, more preferably 1.5% or less, and particularly preferably 1% or less. When the polyimide film is used for a display or the like, if the haze is high, light scattering may cause image blurring.

本發明的聚醯亞胺,在以厚度10μm的膜進行測量的情況下,厚度方向位相差(Rth )並未特別限定,較佳為500nm以下、更佳為350nm以下、特佳為400nm以下。將聚醯亞胺膜用於顯示器用途等的情況下,若厚度方向的位相差大,則可能發生穿透光的顏色無法正確顯示、滲色、視野變窄這樣的問題。In the case where the polyimide of the present invention is measured by a film having a thickness of 10 μm, the phase difference (R th ) in the thickness direction is not particularly limited, but is preferably 500 nm or less, more preferably 350 nm or less, and particularly preferably 400 nm or less. . When the polyimide film is used for a display or the like, if the phase difference in the thickness direction is large, there is a possibility that the color of the transmitted light cannot be accurately displayed, bleeding, and the field of view is narrowed.

本發明的聚醯亞胺所構成之膜,雖亦與用途相關,但膜的厚度較佳為1μm~250μm、更佳為1μm~150μm、再佳為1μm~100μm、特佳為1μm~80μm。將聚醯亞胺膜用於使光穿透之用途的情況,若聚醯亞胺膜太厚可能導致透光率變低。The film composed of the polyimine of the present invention is also used depending on the application, but the thickness of the film is preferably from 1 μm to 250 μm, more preferably from 1 μm to 150 μm, still more preferably from 1 μm to 100 μm, particularly preferably from 1 μm to 80 μm. In the case where a polyimide film is used for the purpose of light penetration, if the polyimide film is too thick, the light transmittance may be lowered.

如上述所得之聚醯亞胺膜/基材積層體或聚醯亞胺膜,可在其單面或雙面形成導電性層,藉此可得到撓性的導電性基板。The polyimine film/substrate laminate or the polyimide film obtained as described above can form a conductive layer on one surface or both sides thereof, whereby a flexible conductive substrate can be obtained.

撓性的導電性基板可由例如以下方法而得。亦即,作為第一方法,在聚醯亞胺膜/基材積層體中,不將聚醯亞胺膜從基材剝離,而是在該聚醯亞胺膜表面上,藉由濺鍍、蒸鍍、印刷等,形成導電性物質(金屬或金屬氧化物、導電性有機物、導電性碳等)的導電層,以製造導電性層/聚醯亞胺膜/基材的導電性積層體。之後因應需求,將導電性層/聚醯亞胺膜積層體從基材剝離,而可得到導電性層/聚醯亞胺膜積層體所構成之透明且撓性的導電性基板。The flexible conductive substrate can be obtained, for example, by the following method. That is, as a first method, in the polyimide film/substrate laminate, the polyimide film is not peeled off from the substrate, but is sputtered on the surface of the polyimide film by sputtering, A conductive layer of a conductive material (metal, metal oxide, conductive organic substance, conductive carbon, or the like) is formed by vapor deposition, printing, or the like to produce a conductive layer/polyimine film/substrate conductive laminate. Then, the conductive layer/polyimine film laminate is peeled off from the substrate in accordance with the demand, and a transparent and flexible conductive substrate composed of the conductive layer/polyimine film laminate can be obtained.

作為第二方法,可從聚醯亞胺膜/基材積層體的基材將聚醯亞胺膜剝離,得到聚醯亞胺膜,在該聚醯亞胺膜表面,與第一方法相同地形成導電性物質(金屬或金屬氧化物、導電性有機物、導電性碳等)的導電層,而可得到導電性層/聚醯亞胺膜積層體或是導電性層/聚醯亞胺膜/導電性層積層體所構成之透明且撓性的導電性基板。As a second method, the polyimide film can be peeled off from the base material of the polyimide film/substrate laminate to obtain a polyimide film having the same surface as the first method on the surface of the polyimide film. A conductive layer (a metal, a metal oxide, a conductive organic substance, or a conductive carbon) is formed to obtain a conductive layer/polyimine film laminate or a conductive layer/polyimine film/ A transparent and flexible conductive substrate composed of a conductive layered body.

另外,第一、第二方法中,在聚醯亞胺膜的表面上形成導電層之前,亦可因應需求以濺鍍、蒸鍍或凝膠-溶膠法等,形成水蒸氣、氧等的氣體屏障層、光調整層等的無機層。Further, in the first and second methods, before the conductive layer is formed on the surface of the polyimide film, a gas such as water vapor or oxygen may be formed by sputtering, vapor deposition or gel-sol method. An inorganic layer such as a barrier layer or a light adjustment layer.

又,導電層可藉由光微影及各種印刷法、噴墨法等的方法而較佳地形成電路。Further, the conductive layer can be preferably formed into a circuit by photolithography, various printing methods, an inkjet method, or the like.

如此所得之本發明的基板,在以本發明的聚醯亞胺所構成之聚醯亞胺膜的表面上,因應需求隔著氣體屏障層或無機層而具有導電層的電路。該基板因為撓性、高透明性、彎折性、耐熱性優良,且甚至具有低線熱膨脹係數,因此容易形成精密電路。因此,該基板可較佳地作為用於顯示器、用於觸控式螢幕或用於太陽能電池的基板使用。The substrate of the present invention thus obtained has a circuit having a conductive layer interposed between the gas barrier layer or the inorganic layer on the surface of the polyimide film composed of the polyimide of the present invention. This substrate is excellent in flexibility, high transparency, bendability, heat resistance, and even has a low coefficient of thermal expansion, so that it is easy to form a precision circuit. Therefore, the substrate can be preferably used as a substrate for a display, for a touch screen, or for a solar cell.

亦即,藉由蒸鍍、各種印刷法或噴墨法等,在該基板上進一步形成電晶體(無機電晶體、有機電晶體),可製造撓性薄膜電晶體,而且可較佳地使用為用於顯示器件的液晶元件、EL元件、光電元件。That is, a transistor (inorganic transistor, organic transistor) is further formed on the substrate by vapor deposition, various printing methods, an inkjet method, or the like, and a flexible thin film transistor can be manufactured, and can be preferably used. A liquid crystal element, an EL element, and a photovoltaic element used for a display device.

又,上述第一方法中,不僅可在聚醯亞胺膜/基材積層體的表面上形成導電層,亦可在形成電晶體及/或裝置所需之其他元件或結構之至少一部分後,再將基材剝離。 [實施例]Further, in the first method, not only the conductive layer may be formed on the surface of the polyimide film/substrate laminate, but also after forming at least a part of the other elements or structures required for the transistor and/or the device, The substrate is then peeled off. [Examples]

以下,藉由實施例及比較例進一步說明本發明。另外,本發明不限於以下的實施例。Hereinafter, the present invention will be further described by way of examples and comparative examples. In addition, the invention is not limited to the following embodiments.

以下的各例中,係以下述方法進行評價。In each of the following examples, the evaluation was carried out by the following method.

<聚醯亞胺膜的評價> [400nm透光率] 使用紫外可見光光譜儀/V-650DS(日本分光製),測量膜厚10μm、尺寸5×5cm2 的聚醯亞胺膜在波長400nm中的透光率。<Evaluation of Polyimine Film> [400 nm Transmittance] Using a UV-Vis spectrometer/V-650DS (manufactured by JASCO Corporation), a polyimide film having a film thickness of 10 μm and a size of 5 × 5 cm 2 was measured at a wavelength of 400 nm. Transmittance.

[霧度] 使用濁度計/NDH2000(日本電色工業製),依照JIS K7136的規格,測量膜厚10μm、尺寸5×5cm2的聚醯亞胺膜的霧度。[Haze] The haze of a polyimide film having a film thickness of 10 μm and a size of 5 × 5 cm 2 was measured in accordance with the specifications of JIS K7136 using a turbidimeter/NDH2000 (manufactured by Nippon Denshoku Industries Co., Ltd.).

[線熱膨脹係數(CTE)] 將膜厚10μm的聚醯亞胺膜裁切為寬度4mm的短片狀以作為試片,使用TMA/SS6100(SII NanoTechnology股份有限公司製),以夾頭間距離15mm、拉伸載重2g、升溫速度20℃/分鐘升溫至500℃。從所得之TMA曲線,求得100℃至250℃的線熱膨脹係數。[Line thermal expansion coefficient (CTE)] A polyimide film having a thickness of 10 μm was cut into a short film having a width of 4 mm to obtain a test piece, and TMA/SS6100 (manufactured by SII NanoTechnology Co., Ltd.) was used, and the distance between the chucks was 15 mm. The tensile load was 2 g, and the temperature was raised to a temperature of 20 ° C / min to 500 ° C. From the obtained TMA curve, a linear thermal expansion coefficient of 100 ° C to 250 ° C was obtained.

[膜的厚度方向位相差(Rth )] 以膜厚10μm、尺寸5×5cm2的聚醯亞胺膜作為試片,使用王子計測器公司製 位相差測量裝置(KOBRA-WR),使入射角為40°,測量膜的位相差。從所得之位相差,求得膜厚10μm的膜在厚度方向上的位相差。[Phase phase difference in phase direction (R th )] A polyimide film having a film thickness of 10 μm and a size of 5 × 5 cm 2 was used as a test piece, and an angle of incidence was measured using an eclipse phase difference measuring device (KOBRA-WR). For 40°, the phase difference of the film was measured. From the obtained phase difference, a phase difference in the thickness direction of the film having a film thickness of 10 μm was obtained.

[拉伸彈性係數、斷裂點伸度、斷裂點應力] 將聚醯亞胺膜衝壓為IEC-540(S)規格的啞鈴狀以作為試片(寬:4mm),使用ORIENTEC公司製TENSILON,以夾頭間長度30mm、拉伸速度2mm/分鐘測量初始拉伸彈性係數、斷裂點伸度、斷裂點應力。[Tensile modulus of elasticity, elongation at break point, stress at break point] The polyimide film was punched into a dumbbell shape of IEC-540(S) to be used as a test piece (width: 4 mm), and TENSILON manufactured by ORIENTEC Co., Ltd. was used. The initial tensile modulus, the elongation at break, and the stress at the breaking point were measured for a length of 30 mm between the chucks and a tensile speed of 2 mm/min.

以下各例中使用的原材料的簡稱、純度等如下。The abbreviations, purity, and the like of the raw materials used in the following examples are as follows.

[二胺成分] TFMB:2,2’-雙(三氟甲基)聯苯胺[純度:99.83%(GC分析)] BAFL:9,9-雙(4-胺基苯基)茀 4,4’-ODA:4,4’-氧基二苯胺[純度:99.9%(GC分析)] BAPB:4,4’-雙(4-胺基苯氧基)聯苯 SFXO:4,4’-(螺[茀-9,9’-呫噸]-3’,6’-二基雙(氧基))二苯胺 [四羧酸成分] CpODA:降莰烷-2-螺-α-環戊酮-α’-螺-2’’-降莰烷-5,5’’,6,6’’-四羧酸二酐 PMDA-H:1,2,4,5-環己烷四羧酸二酐[純度:99.9%(GC分析)] a-BPDA:2,3,3’,4’-聯苯四羧酸二酐[Diamine component] TFMB: 2,2'-bis(trifluoromethyl)benzidine [purity: 99.83% (GC analysis)] BAFL: 9,9-bis(4-aminophenyl)anthracene 4,4 '-ODA: 4,4'-oxydiphenylamine [purity: 99.9% (GC analysis)] BAPB: 4,4'-bis(4-aminophenoxy)biphenyl SFXO: 4,4'-( Snail [茀-9,9'-呫吨]-3',6'-diylbis(oxy))diphenylamine [tetracarboxylic acid component] CpODA: norbornane-2-spiro-α-cyclopentanone -α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride PMDA-H: 1,2,4,5-cyclohexanetetracarboxylic acid Anhydride [purity: 99.9% (GC analysis)] a-BPDA: 2,3,3',4'-biphenyltetracarboxylic dianhydride

[溶劑] GBL:γ-丁內酯 DMAc:N,N-二甲基乙醯胺[Solvent] GBL: γ-butyrolactone DMAc: N,N-dimethylacetamide

表1中記載實施例、比較例中使用之四羧酸成分、二胺成分的結構式。Table 1 shows the structural formulae of the tetracarboxylic acid component and the diamine component used in the examples and comparative examples.

[表1][實施例1][Table 1] [Example 1]

在經氮氣取代的反應容器中加入1.70g(5.3毫莫耳)的TFMB與7.40g(21.3毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入94.24g DMAc,在室溫下攪拌1小時。在該溶液中緩慢加入10.20g(26.5毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。1.70 g (5.3 mmol) of TFMB and 7.40 g (21.3 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). 94.24 g of DMAc was added in an amount of 25 mass%, and stirred at room temperature for 1 hour. 10.20 g (26.5 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例2]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Embodiment 2]

在經氮氣取代的反應容器中加入3.00g(9.4毫莫耳)的TFMB與6.06g(17.4毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為17質量%之量加入94.48gDMAc,在室溫下攪拌1小時。在該溶液中緩慢加入10.29g(26.8毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。3.00 g (9.4 mmol) of TFMB and 6.06 g (17.4 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). 94.48 g of DMAc was added in an amount of 17% by mass, and the mixture was stirred at room temperature for 1 hour. 10.29 g (26.8 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例3]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Example 3]

在經氮氣取代的反應容器中加入7.00g(21.9毫莫耳)的TFMB與7.62g(21.9毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入94.26gDMAc,在室溫下攪拌1小時。在該溶液中緩慢加入16.80g(43.7毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。7.00 g (21.9 mmol) of TFMB and 7.62 g (21.9 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). 94.26 g of DMAc was added in an amount of 25 mass%, and the mixture was stirred at room temperature for 1 hour. 16.80 g (43.7 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例4]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Example 4]

在經氮氣取代的反應容器中加入7.00g(21.9毫莫耳)的TFMB與6.23g(17.9毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為23質量%之量加入95.44g(31.81g的DMAc與63.63g的GBL)DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入15.28g(39.7毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。7.00 g (21.9 mmol) of TFMB and 6.23 g (17.9 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). In an amount of 23% by mass, 95.44 g (31.81 g of DMAc and 63.63 g of GBL) of a mixed solvent of DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)) was added, and the mixture was stirred at room temperature for 1 hour. 15.28 g (39.7 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至450℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration: 200 ppm or less) from a room temperature to 450 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例5]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Example 5]

在經氮氣取代的反應容器中加入9.00g(28.1毫莫耳)的TFMB與6.53g(18.7毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為23質量%之量加入112.26g DMAc,在室溫下攪拌1小時。在該溶液中緩慢加入18.00g(46.8毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。9.00 g (28.1 mmol) of TFMB and 6.53 g (18.7 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). 112.26 g of DMAc was added in an amount of 23% by mass, and the mixture was stirred at room temperature for 1 hour. 18.00 g (46.8 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至430℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration: 200 ppm or less) from a room temperature to 430 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例6]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Embodiment 6]

在經氮氣取代的反應容器中加入9.00g(28.1毫莫耳)的TFMB與 4.20g(12.0毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為23質量%之量加入95.85gDMAc,在室溫下攪拌1小時。在該溶液中緩慢加入15.43g(40.2毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。9.00 g (28.1 mmol) of TFMB and 4.20 g (12.0 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). In an amount of 23% by mass, 95.85 g of DMAc was added, and the mixture was stirred at room temperature for 1 hour. 15.43 g (40.2 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例7]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Embodiment 7]

在經氮氣取代的反應容器中加入10.00g(31.2毫莫耳)的TFMB與 2.72g(7.8毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為23質量%之量加入92.82gDMAc,在室溫下攪拌1小時。在該溶液中緩慢加入15.00g(39.0毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。10.00 g (31.2 mmol) of TFMB and 2.72 g (7.8 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). 92.82 g of DMAc was added in an amount of 23% by mass, and the mixture was stirred at room temperature for 1 hour. 15.00 g (39.0 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例8]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Embodiment 8]

在經氮氣取代的反應容器中加入8.00g(25.0毫莫耳)的TFMB、2.90g(8.3毫莫耳)的BAFL與1.67g(8.3毫莫耳)的4,4’-ODA,以進料單體總質量(二胺成分與羧酸成分的總和)成為23質量%之量加入95.66g DMAc,在室溫下攪拌1小時。在該溶液中緩慢加入16.00g(41.6毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。8.00 g (25.0 mmol) of TFMB, 2.90 g (8.3 mmol) of BAFL and 1.67 g (8.3 mmol) of 4,4'-ODA were added to the nitrogen-substituted reaction vessel to feed 95.66 g of DMAc was added to the total mass of the monomer (the total of the diamine component and the carboxylic acid component) in an amount of 23% by mass, and the mixture was stirred at room temperature for 1 hour. 16.00 g (41.6 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例9]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Embodiment 9]

在經氮氣取代的反應容器中加入8.00g(25.0毫莫耳)的TFMB與4.35g(12.5毫莫耳)的BAFL與1.53g(4.2毫莫耳)的BAPB,以進料單體總質量(二胺成分與羧酸成分的總和)成為23質量%之量加入100.07gDMAc,在室溫下攪拌1小時。在該溶液中緩慢加入16.00g(41.6毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。8.00 g (25.0 mmol) of TFMB and 4.35 g (12.5 mmol) of BAFL and 1.53 g (4.2 mmol) of BAPB were added to a nitrogen-substituted reaction vessel to feed the total mass of the monomers ( 100.07 g of DMAc was added in an amount of 23% by mass based on the total of the diamine component and the carboxylic acid component, and the mixture was stirred at room temperature for 1 hour. 16.00 g (41.6 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例10]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Embodiment 10]

在經氮氣取代的反應容器中加入6.00g(18.7毫莫耳)的TFMB與8.38g(15.3毫莫耳)的SFXO,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入82.44g(27.48g的DMAc與54.96g的GBL) DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入13.09g(34.1毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。6.00 g (18.7 mmol) of TFMB and 8.38 g (15.3 mmol) of SFXO were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). To a mass of 25 mass%, 82.44 g (27.48 g of DMAc and 54.96 g of GBL) of a mixed solvent of DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)) was added, and the mixture was stirred at room temperature for 1 hour. 13.09 g (34.1 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-1。 [實施例11]The properties of the polyimide film were measured, and the results are shown in Table 2-1. [Example 11]

在經氮氣取代的反應容器中加入11.00g(34.4毫莫耳)的TFMB與5.13g(14.7毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入87.29g(29.10g的DMAc與58.19g的GBL)DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入4.72g(12.3毫莫耳)的CpODA與8.25g(36.8毫莫耳)的PMDA-H。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。11.00 g (34.4 mmol) of TFMB and 5.13 g (14.7 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). In an amount of 25 mass%, 87.29 g (29.10 g of DMAc and 58.19 g of GBL) of a mixed solvent of DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)) was added, and the mixture was stirred at room temperature for 1 hour. 4.72 g (12.3 mmol) of CpODA and 8.25 g (36.8 mmol) of PMDA-H were slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-2。 [實施例12]The properties of the polyimide film were measured, and the results are shown in Table 2-2. [Embodiment 12]

在經氮氣取代的反應容器中加入10.00g(31.2毫莫耳)的TFMB與4.66g(13.4毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入84.71g(28.24g的DMAc與56.47g的GBL)DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入8.57g(22.3毫莫耳)的CpODA與5.00g(22.3毫莫耳)的PMDA-H。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。10.00 g (31.2 mmol) of TFMB and 4.66 g (13.4 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). In an amount of 25 mass%, 84.71 g (28.24 g of DMAc and 56.47 g of GBL) of a mixed solvent of DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)) was added, and the mixture was stirred at room temperature for 1 hour. 8.57 g (22.3 mmol) of CpODA and 5.00 g (22.3 mmol) of PMDA-H were slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-2。 [實施例13]The properties of the polyimide film were measured, and the results are shown in Table 2-2. [Example 13]

在經氮氣取代的反應容器中加入10.00g(31.2毫莫耳)的TFMB與4.66g(13.4毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入90.06g(30.02g的DMAc與60.04g的GBL)DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入12.86g(33.5毫莫耳)的CpODA與2.50g(11.1毫莫耳)的PMDA-H。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。10.00 g (31.2 mmol) of TFMB and 4.66 g (13.4 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). In an amount of 25 mass%, 90.06 g (30.02 g of DMAc and 60.04 g of GBL) of a mixed solvent of DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)) was added, and the mixture was stirred at room temperature for 1 hour. 12.86 g (33.5 mmol) of CpODA and 2.50 g (11.1 mmol) of PMDA-H were slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-2。 [實施例14]The properties of the polyimide film were measured, and the results are shown in Table 2-2. [Embodiment 14]

在經氮氣取代的反應容器中加入7.50g(23.4毫莫耳)的TFMB與8.16g(23.4毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入95.40g(31.80g的DMAc與63.60g的GBL)DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入13.50g(35.1毫莫耳)的CpODA與2.63g(11.7毫莫耳)的PMDA-H。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。7.50 g (23.4 mmol) of TFMB and 8.16 g (23.4 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). In an amount of 25 mass%, 95.40 g (31.80 g of DMAc and 63.60 g of GBL) of a mixed solvent of DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)) was added, and the mixture was stirred at room temperature for 1 hour. 13.50 g (35.1 mmol) of CpODA and 2.63 g (11.7 mmol) of PMDA-H were slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-2。 [實施例15]The properties of the polyimide film were measured, and the results are shown in Table 2-2. [Example 15]

在經氮氣取代的反應容器中加入8.00g(25.0毫莫耳)的TFMB與8.70g(25.0毫莫耳)的BAFL,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入95.73g(31.91g的DMAc與63.82g的GBL)DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入13.50g(25.0毫莫耳)的CpODA與2.63g(25.0毫莫耳)的PMDA-H。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。8.00 g (25.0 mmol) of TFMB and 8.70 g (25.0 mmol) of BAFL were added to a nitrogen-substituted reaction vessel to obtain the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). In an amount of 25 mass%, 95.73 g (31.91 g of DMAc and 63.82 g of GBL) of a mixed solvent of DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)) was added, and the mixture was stirred at room temperature for 1 hour. 13.50 g (25.0 mmol) of CpODA and 2.63 g (25.0 mmol) of PMDA-H were slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-2。 [實施例16]The properties of the polyimide film were measured, and the results are shown in Table 2-2. [Example 16]

在經氮氣取代的反應容器中加入15.00g(46.8毫莫耳)的TFMB,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入90.00g(30.00g的DMAc與60.00g的GBL)DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入10.80g(28.1毫莫耳)的CpODA與4.20g(18.7毫莫耳)的PMDA-H。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。15.00 g (46.8 mmol) of TFMB was added to a nitrogen-substituted reaction vessel, and 90.00 g (30.00 g) was added in an amount of 25% by mass based on the total mass of the monomer (the sum of the diamine component and the carboxylic acid component). The DMAc was mixed with 60.00 g of GBL) DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)), and stirred at room temperature for 1 hour. 10.80 g (28.1 mmol) of CpODA and 4.20 g (18.7 mmol) of PMDA-H were slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至370℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration: 200 ppm or less) from a room temperature to 370 ° C directly on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-2。 [實施例17]The properties of the polyimide film were measured, and the results are shown in Table 2-2. [Example 17]

在經氮氣取代的反應容器中加入15.00g(46.8毫莫耳)的TFMB,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入93.95g(31.32的DMAc與62.63g的GBL) DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入10.80g(28.1毫莫耳)的CpODA與5.51g(18.7毫莫耳)的A-BPDA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。15.00 g (46.8 mmol) of TFMB was added to a nitrogen-substituted reaction vessel, and 93.95 g (31.32) was added in an amount of 25% by mass based on the total mass of the monomer (diamine component and carboxylic acid component). DMAc and 62.63 g of GBL) a mixed solvent of DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)), and stirred at room temperature for 1 hour. 10.80 g (28.1 mmol) of CpODA and 5.51 g (18.7 mmol) of A-BPDA were slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-2。 [比較例1]The properties of the polyimide film were measured, and the results are shown in Table 2-2. [Comparative Example 1]

在經氮氣取代的反應容器中加入40.00g(124.9毫莫耳)的TFMB,以進料單體總質量(二胺成分與羧酸成分的總和)成為25質量%之量加入264.04g(88.01g的DMAc與176.03g的GBL)DMAc與GBL的混合溶劑(DMAc:GBL=1:2(重量比)),在室溫下攪拌1小時。在該溶液中緩慢加入48.01g(124.9毫莫耳)的CpODA。於70℃下攪拌3小時、160℃下攪拌7小時,得到均勻且黏稠的聚醯亞胺溶液。所得之聚醯亞胺溶液的醯亞胺化率為95%以上。40.00 g (124.9 mmol) of TFMB was added to a nitrogen-substituted reaction vessel, and 264.04 g (88.01 g) was added in an amount of 25% by mass based on the total mass of the monomer (diamine component and carboxylic acid component). DMAc and 176.03 g of GBL) mixed solvent of DMAc and GBL (DMAc: GBL = 1:2 (weight ratio)), and stirred at room temperature for 1 hour. 48.01 g (124.9 mmol) of CpODA was slowly added to the solution. The mixture was stirred at 70 ° C for 3 hours and at 160 ° C for 7 hours to obtain a uniform and viscous polyimine solution. The obtained polyimide reaction solution has a hydrazine imidation ratio of 95% or more.

將聚醯亞胺溶液塗布於玻璃基板,在氮氣環境下(氧濃度200ppm以下),直接在玻璃基板上從室溫加熱至410℃以去除溶劑,得到無色透明的聚醯亞胺膜/玻璃積層體。接著,將所得之聚醯亞胺膜/玻璃積層體浸漬於水中後進行剝離並乾燥,得到膜厚10μm的聚醯亞胺膜。The polyimine solution was applied to a glass substrate, and heated under a nitrogen atmosphere (oxygen concentration of 200 ppm or less) from a room temperature to 410 ° C on a glass substrate to remove a solvent to obtain a colorless transparent polyimide film/glass laminate. body. Next, the obtained polyimine film/glass laminate was immersed in water, peeled off, and dried to obtain a polyimide film having a film thickness of 10 μm.

測量該聚醯亞胺膜的特性,結果顯示於表2-2。The properties of the polyimide film were measured, and the results are shown in Table 2-2.

[表2-1] [table 2-1]

[表2-2] [產業上的可利用性][Table 2-2] [Industrial availability]

根據本發明,可提供一種具有高透明性與低線熱膨脹係數、且厚度方向位相差(retardation)亦小的聚醯亞胺及其前驅物。由本發明的聚醯亞胺前驅物所得之聚醯亞胺及本發明的聚醯亞胺,其透明性高且線熱膨脹係數低,容易形成精密電路,且厚度方向位相差(retardation)亦小,因此特別適合用於形成顯示器用途等的基板。According to the present invention, it is possible to provide a polyimine having a high transparency and a low coefficient of thermal expansion and a small retardation in the thickness direction and a precursor thereof. The polyimine obtained from the polyimine precursor of the present invention and the polyimine of the present invention have high transparency and a low coefficient of linear thermal expansion, are easy to form a precise circuit, and have a small retardation in the thickness direction. Therefore, it is particularly suitable for use in forming a substrate for display use or the like.

no

Claims (7)

一種聚醯亞胺前驅物,其係包含下述通式(1)所示之重複單元的聚醯亞胺前驅物,其特徵為: 下述通式(1)之A1 包含下式(A-1)所示之4價基團,且下述通式(1)之B1 包含下式(B-1)所示之2價基團, 再者,下述通式(1)之A1 及/或B1 包含具有下式(2)所示之結構的4價或2價基團,或是下述通式(1)之A1 包含下式(3)所示之4價基團及/或下式(4)所示之4價基團; 在通式(1)之A1 100莫耳%之中的式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量的含有比例,與在通式(1)之B1 100莫耳%之中的式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量的含有比例的和,在120莫耳%以上, 其中,相對於式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量,具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的比例為80莫耳%以下, 且相對於式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量,具有式(2)所示之結構的2價基團的比例為80莫耳%以下; [化1](式中,A1 為具有芳香族環或脂環結構的4價基團,B1 為具有芳香族環或脂環結構的2價基團,R1 、R2 分別獨立為氫、碳數1~6的烷基或碳數3~9的烷矽基;其中,各重複單元所包含的A1 及B1 可相同亦可不同); [化2][化3][化4][化5][化6]A polyimine precursor which is a polyimine precursor comprising a repeating unit represented by the following formula (1), characterized in that: A 1 of the following formula (1) comprises the following formula (A) -1) a tetravalent group shown, and B 1 of the following formula (1) contains a divalent group represented by the following formula (B-1), and further, A of the following formula (1) 1 and/or B 1 includes a tetravalent or divalent group having a structure represented by the following formula (2), or A 1 of the following formula (1) includes a tetravalent group represented by the following formula (3) And a tetravalent group represented by the following formula (4); a tetravalent group represented by the formula (A-1) among A 1 100 mol% of the general formula (1), having a formula ( 2) the content ratio of the tetravalent group of the structure shown, the tetravalent group represented by the formula (3), and the tetravalent group represented by the formula (4), and the ratio of the total amount of the tetravalent group represented by the formula (4) The sum of the content ratios of the total amount of the divalent group represented by the formula (B-1) represented by the formula (B-1) and the divalent group having the structure represented by the formula (2) in B 1 100 mol%, at 120 mol % or more, wherein the tetravalent group represented by the formula (A-1), the tetravalent group having the structure represented by the formula (2), the tetravalent group represented by the formula (3), and the formula ( 4) the total amount of the tetravalent group shown, a tetravalent group having a structure represented by the formula (2) The ratio of the tetravalent group represented by the formula (3) to the tetravalent group represented by the formula (4) is 80 mol% or less, and has a divalent group represented by the formula (B-1) and The total amount of the divalent group of the structure represented by the formula (2), the ratio of the divalent group having the structure represented by the formula (2) is 80 mol% or less; [Chemical Formula 1] (wherein A 1 is a tetravalent group having an aromatic ring or an alicyclic structure, B 1 is a divalent group having an aromatic ring or an alicyclic structure, and R 1 and R 2 are each independently hydrogen and carbon number; An alkyl group of 1 to 6 or an alkanoyl group having 3 to 9 carbon atoms; wherein A 1 and B 1 contained in each repeating unit may be the same or different); [Chemical 2] [Chemical 3] [Chemical 4] [Chemical 5] [Chemical 6] . 一種聚醯亞胺,其係包含下述通式(5)所示之重複單元之聚醯亞胺,其特徵為: 下述通式(5)之A2 包含下式(A-1)所示之4價基團,且下述通式(5)之B2 包含下式(B-1)所示之2價基團; 再者,下述通式(5)之A2 及/或B2 包含具有下式(2)所示之結構的4價或2價基團,或是下述通式(5)之A2 包含下式(3)所示之4價基團及/或下式(4)所示之4價基團; 在通式(5)之A2 100莫耳%之中的式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量的含有比例,與在通式(5)之B2 100莫耳%之中的式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量的含有比例的和,在120莫耳%以上, 其中,相對於式(A-1)所示之4價基團、具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的總量,具有式(2)所示之結構的4價基團、式(3)所示之4價基團及式(4)所示之4價基團的比例為80莫耳%以下, 且相對於式(B-1)所示之2價基團及具有式(2)所示之結構的2價基團的總量,具有式(2)所示之結構的2價基團的比例為80莫耳%以下; [化7](式中,A2 為具有芳香族環或脂環結構的4價基團,B2 為具有芳香族環或脂環結構的2價基團;其中,各重複單元所包含的A2 及B2 可相同亦可不同); [化8][化9][化10][化11][化12]A polyimine which is a polyimine comprising a repeating unit represented by the following formula (5), wherein: A 2 of the following formula (5) comprises the following formula (A-1) a tetravalent group of the formula (5), wherein the B 2 group of the following formula (5) comprises a divalent group represented by the following formula (B-1); further, A 2 and/or of the following formula (5) B 2 contains a tetravalent or divalent group having a structure represented by the following formula (2), or A 2 of the following formula (5) contains a tetravalent group represented by the following formula (3) and/or a tetravalent group represented by the following formula (4); a tetravalent group represented by the formula (A-1) among A 2 100 mol% of the general formula (5), having the formula (2) The content ratio of the tetravalent group of the structure, the tetravalent group represented by the formula (3), and the tetravalent group represented by the formula (4), and the B 2 100 in the formula (5) The sum of the content ratios of the total amount of the divalent group represented by the formula (B-1) and the divalent group having the structure represented by the formula (2) in the ear % is 120 mol% or more, wherein And a tetravalent group represented by the formula (A-1), a tetravalent group having a structure represented by the formula (2), a tetravalent group represented by the formula (3), and the formula (4) The total amount of the tetravalent group, the tetravalent group having the structure represented by the formula (2), and the formula 4 (4) The ratio of the group and the tetravalent group represented by the formula (4) is 80 mol% or less, and is relative to the divalent group represented by the formula (B-1) and the structure represented by the formula (2) The total amount of the divalent group, the ratio of the divalent group having the structure represented by the formula (2) is 80 mol% or less; [Chemical 7] (wherein A 2 is a tetravalent group having an aromatic ring or an alicyclic structure, and B 2 is a divalent group having an aromatic ring or an alicyclic structure; wherein A 2 and B are contained in each repeating unit; 2 can be the same or different); [Chemistry 8] [Chemistry 9] [化10] [11] [化12] . 一種聚醯亞胺,其係由如申請專利範圍第1項之聚醯亞胺前驅物所得。A polyimine which is obtained from a polyimide precursor as claimed in claim 1 of the patent application. 一種清漆,包含如申請專利範圍第1項之聚醯亞胺前驅物或如申請專利範圍第2項之聚醯亞胺。A varnish comprising the polyimine precursor as claimed in claim 1 or the polyimine as in claim 2 of the patent application. 一種聚醯亞胺膜,其係使用包含如申請專利範圍第1項之聚醯亞胺前驅物,或如申請專利範圍第2項之聚醯亞胺的清漆所得。A polyimine film obtained by using a varnish containing a polyimine precursor as in the first aspect of the patent application or a polyimide of the second aspect of the patent application. 一種積層體,其特徵為:在玻璃基材上形成包含如申請專利範圍第2或3項之聚醯亞胺的膜或如申請專利範圍第5項之聚醯亞胺膜。A laminate comprising a film comprising a polyimine according to claim 2 or 3 of the patent application or a polyimide film according to item 5 of the patent application. 一種用於顯示器、用於觸控式螢幕或用於太陽能電池的基板,其特徵為包含如申請專利範圍第2或3項之聚醯亞胺或如申請專利範圍第5項之聚醯亞胺膜。A substrate for a display, for a touch screen or for a solar cell, characterized by comprising the polyimine of claim 2 or 3 or the polyimine of claim 5 membrane.
TW107147626A 2017-12-28 2018-12-28 Polyimide precursor, polyimide, polyimide film, varnish and substrate TWI801480B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017254392 2017-12-28
JP2017-254392 2017-12-28

Publications (2)

Publication Number Publication Date
TW201936717A true TW201936717A (en) 2019-09-16
TWI801480B TWI801480B (en) 2023-05-11

Family

ID=67067498

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107147626A TWI801480B (en) 2017-12-28 2018-12-28 Polyimide precursor, polyimide, polyimide film, varnish and substrate

Country Status (5)

Country Link
JP (1) JP7047852B2 (en)
KR (1) KR102422464B1 (en)
CN (1) CN111757904B (en)
TW (1) TWI801480B (en)
WO (1) WO2019131894A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021100727A1 (en) * 2019-11-18 2021-05-27 三菱瓦斯化学株式会社 Polyimide resin, polyimide varnish, and polyimide film
JPWO2021193568A1 (en) * 2020-03-27 2021-09-30
CN112409315B (en) * 2020-11-12 2023-03-28 广东工业大学 Diamine monomer containing spirofluorene functional group, preparation method thereof and polyimide with low dielectric constant
CN112646183A (en) * 2020-12-22 2021-04-13 宁波长阳科技股份有限公司 Polyimide material and preparation method and application thereof
WO2022133722A1 (en) * 2020-12-22 2022-06-30 宁波长阳科技股份有限公司 Polyimide material and preparation method therefor and application thereof
CN114669206B (en) * 2022-04-19 2023-10-24 南阳师范学院 Polyketone, gas separation membrane, and preparation method and application thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102125660B1 (en) * 2012-05-28 2020-06-22 우베 고산 가부시키가이샤 Polyimide precursor and polyimide
US9783640B2 (en) 2012-09-18 2017-10-10 Ube Industries, Ltd. Polyimide precursor, polyimide, polyimide film, varnish, and substrate
JP6607193B2 (en) * 2014-10-23 2019-11-20 宇部興産株式会社 Polyimide precursor, polyimide, and polyimide film
JP2016132686A (en) * 2015-01-15 2016-07-25 Jxエネルギー株式会社 Polyimide, method for producing polyimide, polyimide solution and polyimide film
JP2016204569A (en) * 2015-04-27 2016-12-08 宇部興産株式会社 Polyamic acid solution composition and polyimide film
JP6492934B2 (en) * 2015-04-27 2019-04-03 宇部興産株式会社 Polyamic acid solution composition and polyimide film
WO2017191822A1 (en) 2016-05-06 2017-11-09 三菱瓦斯化学株式会社 Polyimide resin
JP2017133027A (en) 2016-09-13 2017-08-03 Jxtgエネルギー株式会社 Polyimide, method for producing polyimide, polyimide solution and polyimide film
WO2018066522A1 (en) * 2016-10-07 2018-04-12 Jxtgエネルギー株式会社 Polyimide, polyimide precursor resin, solution of same, method for manufacturing polyimide, and film using polyimide
JP2018044180A (en) * 2017-12-26 2018-03-22 Jxtgエネルギー株式会社 Polyimide resin composition and polyimide varnish

Also Published As

Publication number Publication date
WO2019131894A1 (en) 2019-07-04
KR102422464B1 (en) 2022-07-20
CN111757904A (en) 2020-10-09
JPWO2019131894A1 (en) 2021-01-14
JP7047852B2 (en) 2022-04-05
TWI801480B (en) 2023-05-11
CN111757904B (en) 2023-07-14
KR20200093685A (en) 2020-08-05

Similar Documents

Publication Publication Date Title
TWI682969B (en) Polyimide film, polyimide precursor, and polyimide
JP6485358B2 (en) Polyimide precursor composition, polyimide production method, polyimide, polyimide film, and substrate
TWI574995B (en) Polyimide precursor, polyimide, polyimide film, varnish, and substrate
JP6283954B2 (en) Polyimide precursor, polyimide, varnish, polyimide film, and substrate
TWI801480B (en) Polyimide precursor, polyimide, polyimide film, varnish and substrate
JP6607193B2 (en) Polyimide precursor, polyimide, and polyimide film
TWI612077B (en) Polyimide precursor, polyimide, varnish, polyimide film, and substrate
TW201522424A (en) Polyimide precursor, polyimide, polyimide film, varnish, and substrate
TW201623373A (en) Polyimide precursor and polyimide
TW201525025A (en) Polyimide precursor composition, method of manufacturing polyimide, polyimide, polyimide film, and substrate
CN111770949B (en) Polyimide, polyimide solution composition, polyimide film, and substrate
TWI834630B (en) Polyimide, polyimide solution composition, polyimide film and base material laminate containing the same, substrate, display, and manufacturing method thereof
TW201529728A (en) Polyimide precursor composition, method of manufacturing polyimide, polyimide, polyimide film, and substrate