TW201935005A - Cassettes with offset vias - Google Patents

Abstract

A cassette may include a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout may include a first row of interconnect pads including at least one interconnect pad. Each interconnect pad of the first row of interconnect pads may be electrically coupled to one of a first set of vias. The electrical interconnection pad layout may also include a second row of interconnection pads including at least one interconnect pad. Each interconnect pad of the second row of interconnect pads being electrically coupled to one of a second set of vias. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to an alignment of the interconnect pads of the first and second rows.

Description

Cassette with offset through hole

The present invention generally relates to a cassette with offset through holes.

An `` assay run '' is an investigation used, for example, in laboratory medicine, pharmacology, analytical chemistry, environmental biology, or molecular biology to qualitatively evaluate or quantitatively measure the presence, quantity, or functional activity of a sample Sexual or analytical activities. The sample can be a drug, a biological sample, a proteomic sample, a biochemical substance, a cell in an organism, an organic sample, or other inorganic and organic chemical samples. A test round can measure the dense nature of the sample and express it in relevant measurement units, such as, for example, Mohr concentration, density, functional unit enzyme activity, some degree of effect compared to a standard, etc. . A test may involve reacting a sample with several reagents and may be classified as an example of a test procedure that complies with a test procedure. A test procedure may involve a set of reagents and / or sample fluids that are dispensed in a specific amount into several test reaction zones, such as wells in a well plate. Furthermore, an assay procedure may include additional processing such as mixing, separating, heating or cooling, culturing, and finally at least one readout. The reproducibility of a test and the comparability between rounds depend on the reproduction of its procedures.

According to an embodiment of the present invention, a cassette is specifically provided, which includes: a base body; a die coupled to the base body; and an electrical interconnection pad layout configuration formed on a first side of the base body, It includes: a first row of interconnect pads including at least one interconnect pad, each interconnect pad in the first row of interconnect pads being electrically coupled to one of a first set of through-holes; and a first A two-row interconnect pad comprising at least one interconnect pad, each interconnect pad in the second row of interconnect pads is electrically coupled to one of a second set of through-holes, wherein the second row of interconnect pads are electrically coupled to the second row The second set of through-holes of the interconnect pads are offset relative to an alignment line of the interconnect pads in the first and second columns.

Some test fluid dispensing systems can automatically dispense test fluids, such as, for example, samples and reagents, into a plurality of reaction zones called wells in a well plate within a short period of time. A carefully formulated mixture of several reagents, including a target species of interest, can be carefully formulated in multiple reaction zones to test a set of test sample reagents at multiple concentrations. This allows many reactions to proceed simultaneously. This automation reduces user labor and user-induced changes, while at the same time shortening the time to complete a complex test.

A test fluid dispensing system simultaneously or continuously dispenses at least one test fluid, such as an analyte or a reagent, into a wellbore, and can utilize a fluid dispenser driver using interchangeable cassettes. These cassettes may contain the verification fluid in several storage tanks and may be controlled to place the verification fluid into the wellbore of the wellbore plate. A wellbore comprising a reaction medium is movable relative to the cassette, so that a test fluid can be ejected from several fluid jet grains at different wellbores of the wellbore. The well plate may be, for example, a microtiter plate in which a reaction well array is defined. Furthermore, in one example, the test fluid dispensing system can dispense at least one test fluid to a tissue sample, a wafer with an integrated microfluidic structure, or a glass slide.

Multi-channel cassettes can be used to allow multiple fluids to be dispensed simultaneously. For example, multiple samples may be placed simultaneously or successively in individual wells of a well plate to reduce the time required to titrate multiple samples in the well. As used in the description of this case and the scope of the attached patent application, the term "cassette" is to be broadly understood as any user-replaceable component of a certified fluid dispenser system, and at least one fluid is Flow through the component through at least one fluid channel before dispensing.

An example of a multi-channel fluid dispenser cassette may be, for example, a T-8 type cassette for use with an HP® D300 digital dispenser. In this example, the channels are nominally the same when appropriate, such as when titrating a set of samples with similar fluid characteristics. However, many verification procedures may require the use of different verification fluids with very different fluid characteristics or processing procedures. For example, some verification fluids are more viscous than others. Furthermore, some test fluids can be dispensed in large quantities in order to be effective. In addition, other test fluids, such as, for example, a powerful sample, can be dispensed in small, precisely controlled quantities for utility to occur. In yet another example, some test fluids can be dispensed in specific situations, such as in the presence of pipe coatings and temperature control, to take effect. In addition, many verification procedures may specify the exact sequence and timing of fluid processing and other non-dispensing steps such as mixing or reading.

As a result, several cartridges can be used within a calibration fluid dispenser system to achieve a variety of different responses. In the case where a user is allowed to replace, the cassette may cause a user error when properly aligning the electrical contacts on the interchangeable cassette with the electrical contacts of the fluid dispenser driver. Moreover, when a user is allowed to replace these cassettes, the electrical contacts on the interchangeable cassettes may be damaged, so that the integrity of the cassette may be compromised.

The example described in this article provides a cassette. The cassette includes a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout configuration may include a first column of interconnection pads including at least one interconnection pad. Each interconnect pad in the first row of interconnect pads may be electrically coupled to one of the first set of vias. The electrical interconnection pad layout configuration may also include a second row of interconnection pads, which includes at least one interconnection pad. Each interconnect pad in this second row of interconnect pads may be electrically coupled to one of the second set of vias. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to the alignment of one of the interconnect pads in the first and second rows.

In the example herein, the cassette may further include several electrical traces formed on the second side of the substrate. The first and second sets of vias electrically couple the electrical interconnect pad layout configuration to the electrical traces. The bias of the second set of vias electrically coupled to the second row of interconnect pads results in a bias of the electrical traces formed on the second side of one of the substrates. And, in the example herein, at least one of the interconnection pads in the first row of interconnection pads may include a contact seat defined therein. This contact seat allows a spring to be pressed against the seat of the connection body. Furthermore, in the example herein, at least one of the interconnect pads in the second row of interconnect pads may include a launch interconnect pad.

The example described herein further provides a system for injecting fluid into a test sample. The system may include a printed circuit assembly (PCA). The PCA may include at least one spring pressing connection member and at least one dispensing head. The at least one dispensing head may include a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout configuration may include a first column of interconnection pads including at least one interconnection pad. Each interconnect pad in the first row of interconnect pads may be electrically coupled to one of the first set of vias. The electrical interconnection pad layout configuration may also include a second row of interconnection pads including at least one interconnection pad. Each interconnect pad in this second row of interconnect pads may be electrically coupled to one of the second set of vias. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to an alignment of one of the interconnect pads in the first and second rows.

In the examples herein, at least one of the interconnect pads in the second row of interconnect pads may include a launch interconnect pad. And, in an example, at least one of the interconnection pads in the first row of interconnection pads may include a contact seat defined therein. The contact seat allows the spring to be pressed against at least one of the connecting members, and the seat is disposed in the at least one dispensing head when it is interfaced with the PCA.

In the example herein, the first row of interconnect pads may include at least one ground interconnect pad, a power supply voltage interconnect pad, and a thermal sensing resistor (TSR) interconnect pad. Moreover, in an example, the second row of interconnect pads may include at least one transmit interconnect pad, a clock interconnect pad, and a data interconnect pad. The PCA is connected to at least one of the at least one spring pad by sliding the at least one spring press connector through the second row of interconnect pads and electrically coupling the at least one spring press connector to the at least one interconnect pad in the first row of interconnect pads. The electrical interconnection pad layout configuration interface of a distribution head. By pressing the at least one spring against the connector in a direction perpendicular to a plane formed by the electrical interconnection pad layout configuration, the connector is dropped onto at least one interconnection pad in the first or second row of interconnection pads. The PCA and the electrical interconnection pad layout configuration of the at least one dispensing head are interfaced.

The example described herein further provides a method for forming a cassette. The method may include forming a monolithic matrix. An electrical interconnect pad layout configuration may be formed on a first side of the monolithic substrate. The electrical interconnect pad layout configuration may be formed by forming a first row of interconnect pads (block 1302). The first row of interconnect pads includes at least one interconnect pad, wherein each interconnect in the first row of interconnect pads The pad is electrically coupled to one of the first set of through holes. Moreover, the electrical interconnection pad layout configuration is formed by forming a second column of interconnection pads, the second column of interconnection pads including at least one interconnection pad, wherein each of the interconnection pads in the second column of interconnection pads is electrically Coupling to one of the second set of vias. Furthermore, the electrical interconnection pad layout configuration is formed by offsetting an alignment line of the interconnection pads in the second column with respect to the interconnection pads in the first and second columns.

In the example herein, the method may further include forming at least one contact pad on at least one interconnection pad in the first row of interconnection pads. Furthermore, the method may further include defining a plurality of electrical traces on a second side of the monolithic substrate, which electrically couples a die to the first and second sets of through holes. In one example, several electrical traces can be defined using a laser direct construction (LDS) procedure.

When used in the specification of the present case and the scope of the attached patent application, "several" or similar terms are broadly understood as any positive number including 1 to infinity; zero is not a quantity, but no quantity.

In the following description, for the purpose of explanation, several specific details are released to provide a thorough understanding of the system and method of this case. However, it will be apparent to those skilled in the art that the devices, systems, and methods of the present case can be implemented without these specific details. The term "an example" or similar in the specification indicates that a particular feature, structure, or characteristic described in conjunction with the example is included as described, but is not necessarily included in other examples.

Referring now to the drawings, FIG. 1 is a front perspective view of a first volume cassette (100) according to an example of the principles described herein. Furthermore, FIG. 2 is a rear perspective view of the first volume cassette (100) of FIG. 1 according to an example of the principles described in this case. The first volume cassette (100) may include a base body (101). In one example, the substrate (101) may be made of a thermoplastic material. A storage tank (102) has a fluid hole (103) defined in the storage tank (102). The fluid hole (103) allows a test fluid to move from one side of the substrate (101) to the other. The base (101) may include a grip (150) to allow a user to touch, pick up, and move the cassette (100) without contaminating the reservoir (102) or the calibration fluid placed therein.

A die (104) may be coupled to the substrate (101) on the opposite side of one of the storage tanks (102) and on the same line as the fluid hole (103). In one example, the die (104) may be, for example, a micro-electromechanical system (MEMs). In another example, the die may be a fluid ejection device.

The reservoir (102) is fluidly coupled to the die (104) through the fluid hole (103), so that a verification fluid can be introduced into the die (104), allowing the die (104) to be directed by a verification fluid dispensing system , Spray the verification fluid into several wells of the well plate.

Several electrical components are included before and after the base body (101). These electrical components may be made of any conductive material to allow electrical signals to be transmitted between the calibration fluid dispensing system and the die (104). For example, several contact pads (105-1, 105-2, 105-3, 105-4, 105-5, 105-6, 105-7, 105-8, 105-9, 105-10, are combined here Designated 105) may be included on the front surface of the substrate (101). The contact pads (105) provide an electrically conductive interface between the verification fluid dispensing system and the cassette (100).

Several through holes (106-1, 106-2, 106-3, 106-4, 106-5, 106-6, 106-7, 106-8, 106-9, 106-10, collectively referred to herein as 106) may be formed in the base body (101) and electrically coupled to the contact pad (105). These through holes (106) can be any electrical connector that passes through the substrate (101) and couples the connection pad (105) to several electrical components on opposite sides of the substrate (101).

As shown in FIG. 2, the through hole (106) is coupled to several traces (107-1, 107-2, 107-3, 107-4, 107-) on the opposite vertical side of the base body (101). 5, 107-6, 107-7, 107-8, 107-9, 107-10, collectively referred to herein as 107). These traces (107) may be coupled to the die (104) using a number of wire bonds (108) coupled between the die pads (109) of the die (104). Although the figure shows a wire bond (108) coupled between a trace (107) and a die pad (109), any number of wire bonds (108) can be used to place the die (104) Electrically coupled to a test fluid dispensing system, allowing control signals to control the die (104) from the test fluid dispensing system, through contact pads (105), through holes (106), traces (107) And the wire bonding body (108), and the grain pad (109) is passed to the grain (104).

FIG. 3 is a front perspective view of a second volume cassette (200) according to an example of the principles described in this case. Furthermore, FIG. 4 is a rear perspective view of the second volume cassette (200) of FIG. 3 according to an example of the principles described in this case. The second volume cassette (200) includes the same elements as the first volume cassette (100), except for the fluid volume that can be introduced into the reservoir (102). The storage tank (102) in the example of FIG. 1 and FIG. 2 is relatively smaller than the storage tank (102) in the example of FIG. 3 and FIG. In one example, the storage tank (102) of FIGS. 1 and 2 can be customized to contain approximately 20 microliters of fluid, and the storage tank (102) of FIGS. 3 and 4 can be customized to contain more than 20 microliters. Litre of a fluid volume.

In one example, the electrical components of the example of the first volume cassette (100) and the second volume cassette (200) include a contact pad (105), a through hole (106), a trace (107), and a wire joint. (108), which can be formed using a laser direct construction (LDS) program. An LDS procedure uses a thermoplastic material that is doped with a non-conductive, metallic, inorganic compound activated by laser. In this example, the substrate (101) can be formed by injection molding. A laser can then delineate several electrical components to be formed on the thermoplastic. In the case where the substrate (101) is exposed to the electromagnetic radiation provided by the laser, the metal additive forms a micro-hard track. The metal particles in this orbit form the core for a subsequent metallization process. The laser-exposed substrate (101) can be placed in an electroplated copper bath, and various conductor path layers of electrical components appear at those portions of the substrate (101) that are exposed to the electromagnetic radiation of the laser. Any number of continuous layers of metal, such as copper, nickel, and gold, can be deposited on the portion of the substrate (101) exposed to the electromagnetic radiation of the laser. The LDS program allows precise, computer-aided formation of electrical components on the surface of the substrate (101).

In another example, the electrical components of the example of the first volume cassette (100) and the second volume cassette (200) include contact pads (105), through holes (106), traces (107), and wires. The body (108) can be formed by an assembly process, wherein a conductive material is deposited on the base body (101). In this example, the conductive material can be built using, for example, a three-dimensional (3D) printing device.

Referring to the examples of the first volume cassette (100) and the second volume cassette (200) in FIGS. 1 to 4, the contact pad (105) can be placed in the base (101) in two rows (115, 116). On the previous surface, the first set of contact pads (105-1, 105-2, 105-3, 105-4, 105-5) were included in the first column (115), and the second set of contact pads (105- 6, 105-7, 105-8, 105-9, 105-10) are included in the second column (116). This configuration of the contact pad (105) allows the cassette to be smaller in size while still providing a large number of interfaces.

The through holes (106) of FIGS. 1 to 4 may be configured to be coupled to the through holes of the contact pads (105-1, 105-2, 105-3, 105-4, 105-5) of the first row (115). (106-1, 106-2, 106-3, 106-4, 106-5) are provided in their individual contact pads (105-1, 105-2, 105-3, 105-4, 105-5) On one side, these contact pads are furthest from the contact pads (105-6, 105-7, 105-8, 105-9, 105-10) included in the second row (116), and are coupled to the second Through holes (106-6, 106-7, 106-8, 106-9, 106-) of the contact pads (105-6, 105-7, 105-8, 105-9, 105-10) in row (116) 10) It is arranged on one side of their individual contact pads (105-6, 105-7, 105-8, 105-9, 105-10). The contact pad distance is included in the first row (115). The contact pads (105-1, 105-2, 105-3, 105-4, 105-5) are the farthest.

Furthermore, the through-holes (106-1, 106-2, 106-3, 106-4, 106-5) use a different offset trace (110-1, 110-2, 110-3, 110-4 , 110-5, collectively referred to as 110) are coupled to the contact pads (105-1, 105-2, 105-3, 105-4, 105-5) of the first column (115). The offset traces (110) of FIGS. 1 to 4 make the through-holes (106-) of the contact pads (105-1, 105-2, 105-3, 105-4, 105-5) of the first column (115) 1.106-2, 106-3, 106-4, 106-5) contact pads (105-6, 105-7, 105-8, 105-9, 105-10) in the second row (116) The through holes (106-6, 106-7, 106-8, 106-9, 106-10) are laterally offset. This offset layout configuration is drawn in Figures 5-8. FIG. 5 is a front plan view of the first volume cassette (100) of FIG. 1 according to an example of the principles described in this case. 6 is a front plan view of the first volume cassette (100) of FIG. 1 viewed from circle A in FIG. 5 according to an example of the principles described in this case. Furthermore, FIG. 7 is a rear plan view of the first volume cassette (100) of FIG. 1 according to an example of the principles described in this case. 8 is a rear plan view of the first volume cassette (100) of FIG. 1 viewed from circle B in FIG. 7 according to an example of the principles described in this case. Even if the first volume cassette (100) is used to describe the offset layout configuration of the through hole (106), the second volume cassette (200) and its electrical component layout configuration can also be described in the same way. In order to easily understand the offset layout configuration of the through holes (106) in the rows (115, 116), some reference numbers have been omitted. However, the reader can easily identify various components in the cassette (100, 200) by referring to other drawings, including FIGS. 1 to 4.

As shown in Figures 5 and 6, the through-holes (106-1, 106-2, 106-3, 106-4, 106-5) use individual offset traces (110-1, 110-2, 110-3, 110-4, 110-5 (collectively referred to as 110) to be coupled to the contact pads (105-1, 105-2, 105-3, 105-4, 105-5) of the first row (115) . The offset traces (110) of Figs. 1 to 4 make the through-holes (106-) of the contact pads (105-1, 105-2, 105-3, 105-4, 105-5) of the first column (115) 1.106-2, 106-3, 106-4, 106-5) contact pads (105-6, 105-7, 105-8, 105-9, 105-10) in the second row (116) The through holes (106-6, 106-7, 106-8, 106-9, 106-10) are laterally offset. As shown in circle A in Figs. 6 and 5, the offset trace (110) is relative to the contact pads (105) and the through holes (106-6, 106-7, 106-) of the second column (116). 8, 106-9, 106-10) are at an angle, and this alignment line is indicated by line 117. Therefore, this offset can be defined by the distance D from the line 117. More about distance D and its effects are described here.

Furthermore, referring to FIGS. 1 to 8, and particularly FIGS. 7 and 8, since the through holes (106-1, 106-2, 106-3, 106-4, 106-5) use their individual offset traces Line (110) is coupled to the contact pads (105-1, 105-2, 105-3, 105-4, 105-5) of the first column (115), so a similar offset layout configuration is on the base (100) One of them is reflected in the layout of the trace (107) on the opposite side. Each through hole (106) in the through hole (106-1, 106-2, 106-3, 106-4, 106-5) of the first row (125) is relative to the through hole of the second row (126) (106-6, 106-7, 106-8, 106-9, 106-10) each through hole (106) is offset. In addition, due to the offset of the vias (106), their individual traces (107) are also offset. In this way, the layout of the contact pads (105), through holes (106), and traces (107) allows space on the substrate (101) for all of these devices.

FIG. 9 is a printed circuit assembly (PCA) of a first volume cassette (100) of FIG. 1 and a cassette interface (901) of a verification fluid dispenser driver (900) according to an example of the principles described in this case. ) (903) Interfacing perspective view. Although the first volume cassette (100) is shown in FIG. 9, the cassette (200) of FIGS. 3 and 4 can also be operated and used in a similar manner. In one example, the cassette (100, 200) can be inserted by inserting the cassette (100, 200) in the direction of the arrow (904) along several alignment surfaces or alignment members of the calibration fluid dispenser driver (900). 200) Interfaces with PCA (903), cassette interface (902), and calibration fluid dispenser driver (900). In another example, the PCA (903) and / or the cassette (100, 200) can be moved in the direction indicated by the arrow (914) to interface the cassette (100, 200) with the PCA (903). In this example, the cassette (100, 200) can be placed on one of the platforms of the calibration fluid dispenser driver (900), and the calibration fluid dispenser driver (900) places the PCA (903) in the direction of the arrow (914). Move to the cassette (100, 200) until the PCA (903) and the contact pads (105) of the cassette (100, 200) reach contact. In yet another example, insert the cassette (100, 200) along the several alignment surfaces of the verification fluid dispenser driver (900) in the direction of the arrow (904) and the PCA (903) and the direction of the arrow (914). A combination of the cassettes (100, 200) can be used to interface the cassettes (100, 200) with the PCA (903).

The PCA (903) may include several spring-loaded connectors (905), which electrically couple the contact pads (105) formed on the cassettes (100, 200) to the PCA (903). These spring pressing connection members (905) can be any device for electronic components to establish a connection between the contact pads (105) formed on the cassettes (100, 200) and the PCA (903), and Can include two nested spring loaded pins. In one example, the PCA (903) may include an equal number of spring-pressed connectors (905) as the contact pads (105) formed on the cassette (100, 200). In another example, the PCA (903) may include more or less spring-pressed connectors (905) than contact pads (105) formed on the cassette (100, 200). In these examples, the spring-loaded connectors (905) may be configured on the PCA (903) such that they are aligned with the contact pads (105) when the cassettes (100, 200) interface with the PCA (903).

In an example, a plurality of detents or contact seats (FIGS. 1, 3, 5, 6, and 9, 111) may be defined in one surface of the contact pad (105). These detents (111) are interfaced with the spring pressing connection (905) when the cassette (100, 200) is interfaced with the PCA (903). Once the spring is pressed against the connector (905) into the detent (111), the cassette (100, 200) is removably coupled to the PCA (903). Removal of the cassette (100, 200) can be performed by overcoming the pressure exerted on the cassette (100, 200) by the spring-loaded spring-loaded connection (905), so that the spring is pressed against the connection (905) Retract and press the spring against the connector (905) out of the detent (111).

Turning again to FIGS. 5 and 6, and in conjunction with FIG. 9, the cassette is inserted by inserting the cassette (100, 200) in the direction of the arrow (904) along several alignment surfaces of the verification fluid dispenser driver (900) In an example of the interface between (100, 200) and PCA (903), the spring pressing connector (905) is pulled through the top of the base body (101) and through the contact pad (105). This is caused, at least in part, by the spring bias of the spring against the connector (905). When the cassettes (100, 200) and the PCA (903) are inserted into a coupled configuration, the frictional force exerted by the spring pressed against the connecting member (905) pulled through the top of the base body (101) may damage the Electrical connection on the cassette (100, 200). The drawing path of the spring pressing connector (905) is identified by the line (117) of FIG. The pull spring presses the connector (905) through the electrical components such as the through hole (106) and the trace (107). Any damage caused by the friction of the spring press the connector (905) may endanger the electrical of these components. Connectivity. Therefore, the bias formed on the contact pads (105-1, 105-2, 105-3, 105-4, 105-5) on the cassette (100, 200) and electrically coupled to the first row (115) The trace (110) eliminates the destruction of the spring pressing connector (905) (for example) through holes (106-1, 106-2, 106-3, 106-) arranged to align with the line (117) in a row 4, 106-5). Assuming, for example, that the through-holes (106) are aligned with the line (117) in a row, the spring-pressed connection (905) will be pulled through those through-holes (106-1, 106) during the insertion of the cassette (100, 200). -2, 106-3, 106-4, 106-5), and such frictional movement may damage the through holes (106-1, 106-2, 106-3, 106-4, 106-5). In this way, the offset trace (110) eliminates the possibility that the spring pressing against the connection (905) may damage the through-holes (106-1, 106-2, 106-3, 106-4, 106-5).

Furthermore, the offset trace (110) extends diagonally from the contact pads (105-1, 105-2, 105-3, 105-4, 105-5) of the first column (115) to the through holes (106- (1, 106-2, 106-3, 106-4, 106-5), so that none of the offset traces are aligned with the spring pressing connection (905) along the line (117) passing by. In this manner, the diagonal layout configuration of the offset trace (110) eliminates damage to the fine offset trace (110).

As shown in the figure, the through holes (106-6, 106-) coupled to the second row (116) of the contact pads (105-6, 105-7, 105-8, 105-9, 105-10) 7, 106-8, 106-9, 106-10) are in a position beyond the contact pads (105-6, 105-7, 105-8, 105-9, 105-10), and in the cassette (100, 200) travel a distance within the verification fluid dispenser driver (900). In this position, since the through-holes (106-6, 106-7, 106-8, 106-9, 106-10) pass through the surface of the cassette (100, 200) beyond the spring pressing connection member (905), As far as the distance is concerned, the through-holes will never be subjected to frictional contact of the spring against the connecting piece (905).

Furthermore, each contact pad (105) may be logically designated by, for example, a verification fluid dispenser driver (900) or some other controller, so that each contact pad (105) is through the contact pad (105), through hole (106), The trace (107) and the wire bond (108) are coupled to individual ones of several die pads (109) of the die (104). For example, contact pad assignments can include the following: Table 1: Contact pad assignments The above contact pad designation is an example, and other contact pad designations can be made. To avoid or eliminate damage to the electrical components of the calibration fluid dispenser driver (900), the PCA (903), cassette (100, 200), die (104), any other electrical or electronic component, or a combination thereof, is in contact with The pad assignment method is arranged to ensure that a high-voltage spring against the connection member (905) is not pulled through the contact pads (105-1, 105-2, 105-3, 105-4) in the first row (115). , 105-5). For example, the launch contact pads (105-4) are provided on the first column (115). In this position, the high voltage of the emission contact pad (105-4) is when the last contact or one of the last contacts is made between the cassette (100, 200) and the spring-pressed connection (905) of the PCA (903). Before coupling to the cassette (100, 200). Therefore, the contact order and specified contents of the contact pad (105) are managed so that the cassette (100, 200), the verification fluid dispenser driver (900) are not performed before, during or after the operation or power supply of the PCA (903). ), PCA (903), any electrical component of die (104), any other electrical or electronic component, or a combination thereof. The contact pad (105) is specified in this manner to ensure that the verification procedure is performed without endangering the verification round and its subsequent reactions, and provides a more economical and reliable system.

FIG. 10 is a front plan view of a cassette (1000) including a plurality of dispensing head assemblies (1001) according to an example of the principles described in this case. The dispensing head assembly (1001) may each include a substrate (101), a storage tank (102), a fluid hole (103), a crystal grain (104), a contact pad (105), a through hole (106), and a trace as described above. Wires (107), wire bonds (108), die pads (109), offset traces (110), detents (111), and other components. In the example shown in FIG. 10, the dispensing head assembly (1001) is mounted to a frame (1005). In one example, the dispensing head assembly (1001) may be mechanically coupled to the frame (1005) through, for example, a welding process, a chemical bonding process, or by several fixtures. In one example, the frame (1005) forms the base body (101) of each of the dispensing head assemblies (1001), so that each of the dispensing head assemblies (1001) is formed into a single monolithic frame (1005).

FIG. 11 is a block diagram of a system (1100) for ejecting fluid into a test sample (1110) according to an example of the principles described in this case. The system may include a printed circuit assembly (PCA) (903). The PCA (903) may include at least one spring pressing connection member (905), and at least one dispensing head (1001). The at least one dispensing head (1001) may include a base body (101), a die (104) coupled to the base body (101), and an electrical interconnection formed on a first side of the base body (101). Pad layout configuration (1101). The electrical interconnection pad layout configuration (1101) may include a first row (116) of interconnection pads (105) including at least one interconnection pad (105). Each of the interconnection pads (105) in the interconnection pads (105) of the first column (116) may be electrically coupled to one of the through holes (106) of the first group (126). The electrical interconnection pad layout configuration (1101) may include a second row (115) of interconnection pads (105) including at least one interconnection pad (105). Each interconnect pad (105) in the interconnect pad (105) of the second column (115) may be electrically coupled to one of the through holes (106) of the second group (125). The through holes (106) of the second group (125) electrically coupled to the interconnect pads of the second column (115) are opposite to the interconnect pads (105) of the first and second columns (115, 116) The alignment is offset.

In an example, at least one of the interconnection pads (105) in the interconnection pads (105) of the second column (115) may include a launch interconnection pad. And, in an example, at least one of the interconnection pads (105) in the interconnection pads (105) of the first column (116) may include a contact seat (111) defined therein. The contact seat (111) allows a seat for the spring to press against at least one of the connecting members (905) when the at least one dispensing head (1001) is interfaced with the PCA (903).

In one example, the interconnection pads (105) of the first column (116) may include at least one ground interconnection pad, a power supply voltage interconnection pad, and a thermal sensing resistor (TSR) interconnection pad. In addition, in one example, the interconnect pads (105) of the second column (115) may include at least one transmit interconnect pad, a clock interconnect pad, and a data interconnect pad.

By sliding at least one spring pressing connection piece (905) through the interconnection pad (105) of the second row (115) and electrically coupling the at least one spring pressing connection piece (905) to the first row (116) At least one of the interconnection pads (105) of the interconnection pads (105) allows the PCA (903) to interface with the electrical interconnection pad layout configuration (1101) of the at least one dispensing head (1001). By pressing at least one spring against the connecting member (905) in a direction perpendicular to a plane formed by the electrical interconnection pad layout configuration (1101), it is dropped to the first or second column (115, 116). At least one of the interconnection pads (105) is connected to the PCA (903) and the electrical interconnection pad layout configuration (1101) of the at least one dispensing head (1001).

FIG. 12 is a block diagram of a system (1200) for injecting fluid into a test sample (1210) according to another example of the principles described in this case. The system (1200) includes a verification control device (1205), a cassette (100, 200) as described above, and a verification board (1210). Although shown in FIG. 11 is the first volume cassette (100), the second volume cassette (200) or the first volume cassette (100) and the second volume cassette (200) have a frame (1005). A combination of) may be included in the system (1200).

The cassette (100, 200) may include at least the above-mentioned substrate (101), storage tank (102), fluid hole (103), die (104), contact pad (105), through hole (106), and trace ( 107), wire bonds (108), die pads (109), offset traces (120), and other components. Although the cassette (100, 200) shown in FIG. 12 includes or excludes certain elements described herein, the elements associated with the cassette (100, 200) may or may not be included therein. To complete these different examples, the physical characteristics of the cassette (100, 200) can be changed. For example, in the case where the cassette (100, 200) does not include the through hole (106) as described above, the trace (107) and the contact pad (105) may be included on a single side of the cassette (100, 200) So that the PCA (903) contacts the cassette (100, 200) through the back side of the cassette (100, 200) instead of the front side.

The verification plate (1210) may be any plate body that receives fluid ejected from the die (104). This verification plate (1210) may include several wells into which fluids can be injected. The verification plate (1210) may further include a structure that enables the verification control device (1205) to interact with the verification plate (1210) to move the verification plate (1210) relative to the die (104) of the cassette (100, 200). . The verification control device (1205) can be used in any data processing situation, including stand-alone hardware, mobile applications, via a computing network, or a combination thereof. Moreover, the verification control device (1205) can be used in a computing network, a public cloud network, a private cloud network, a hybrid cloud network, other forms of networks, or a combination thereof. In order to achieve the desired functionality of the verification control device (1205), the verification control device includes a variety of hardware components. Among these hardware components may be several controllers (1215), several data storage devices (1240), several peripheral device adapters (1225), and several network adapters (1230). These hardware components can be interconnected using several buses (1260) and / or network connections. In one example, the controller (1215), the data storage device (1240), the peripheral device adapter (1225), and the network adapter (1230) can be communicatively coupled through a bus (1260).

The controller (1215) may include a hardware architecture to retrieve executable code from the data storage device (1240) and execute the executable code. According to the method described here in the description of this case, when the executable code is executed by the controller (1215), the controller (1215) can execute at least the signal to the die (104) of the cassette (100, 200) and emit a A quantity of fluid into a verification plate (1210) for functionality. During code execution, the controller (1215) may receive input from and provide input to several remaining hardware units.

The data storage device (1240) can store data, such as executable code executed by the controller (1215) or other processing devices. As will be discussed, the data storage device (1240) may specifically store computer code representing several applications that the controller (1215) executes to perform at least the functionality described herein.

The data storage device (1240) may include various types of memory modules, including electrical and non-electrical memory. For example, the data storage device (1240) of this example includes random access memory (RAM) (1245), read-only memory (ROM) (1250), and hard disk drive (HDD) memory (1255). Many other types of memory can also be used, and in the context of a particular application that can be adapted to the principles described herein, this specification can be extended to the use of various types of memory in the data storage device (1240). In some examples, different types of memory in the data storage device (1240) can be used for different data storage purposes. For example, in some examples, the controller (1215) may boot from read-only memory (ROM) (1250), maintain non-dependent storage in hard disk drive (HDD) memory (1255), and perform storage Code in Random Access Memory (RAM) (1245).

The data storage device (1240) may include a computer-readable medium, a computer-readable storage medium, or a non-transitory computer-readable medium, and so on. For example, the data storage device (1240) may be, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any suitable combination of the foregoing. More specific examples of computer-readable storage media may include, for example, the following: electrical connections with several wires, portable computer diskettes, hard disk drives, random access memory (RAM), read-only memory (ROM), Erase can be programmed with read-only memory (EPROM or flash memory), portable compact disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing. In the content of this document, a computer-readable storage medium may be any physical medium, which may contain or store computer-usable code used or coordinated by an instruction execution system, device, or device. In another example, a computer-readable storage medium may be any non-transitory medium. Such non-transitory media may contain or store programs used by or in conjunction with an instruction execution system, device, or device.

The hardware adapter (1225, 1130) in the verification control device (1205) allows the controller (1215) to interface with various other hardware components outside and inside the verification control device (1205). For example, the peripheral device adapter (1225) may provide an interface to an input / output device such as, for example, a display device, a mouse, or a keyboard. The peripheral device adapter (1225) can also provide access to other external devices such as external storage devices, several network devices such as, for example, servers, switches, and routers, client devices, other types of computing devices, and combinations thereof .

The display device (1235) can be configured to allow a user of the verification control device (1205) to interact with and implement the functionality of the verification control device (1205). The peripheral device adapter (1225) can also establish an interface between the controller (1215) and the display device (1235), a printer or other media output device. The network adapter (1230) can provide an interface to, for example, other computing devices in a network, thereby allowing data transmission between the verification control device (1205) and other devices provided in the network.

When the verification control device (1205) is executed by the controller (1215), the verification control device (1205) can display data on the display device (1235) that represents executable code associated with several applications stored on the data storage device (1240). Graphical User Interface (GUI). Examples of the display device (1235) include a computer screen, a laptop screen, a mobile device screen, a personal digital assistant (PDA) screen, and a desktop computer screen and other display devices (1235). An example of the GUI displayed on the display device (1235) will be described in more detail below.

The verification control device (1205) further includes several modules for implementing the method described herein. Various modules in the verification control device (1205) include executable code that can be executed separately. In this example, these various modules can be stored as separate computer program products. In another example, various modules in the verification control device (1205) may be combined in several computer program products, and each computer program product includes several modules.

FIG. 13 is a flowchart illustrating a method for forming a cassette according to another example of the principles described in this case. The method of FIG. 13 may begin by forming a monolithic substrate (101) (block 1301). An electrical interconnect pad layout configuration (1101) may be formed on a first side of a monolithic substrate (101) (block 1302). The electrical interconnect pad layout configuration (1101) may be formed by forming a first row (116) of interconnect pads (block 1302), the first row of interconnect pads including at least one interconnect pad (105), Each of the interconnecting pads (105) in the first row (116) is electrically coupled to one of the through holes (106) of the first group (126) (block 1303). Furthermore, the electrical interconnect pad layout configuration (1101) may be formed by forming a second row (115) of interconnect pads (105) (block 1302), the second row of interconnect pads including at least one interconnect Pad (105), wherein each interconnect pad (105) in the interconnect pad (105) of the second column (115) is electrically coupled to one of the through holes (106) of the second group (125) ( Block 1304). Moreover, the electrical interconnection pad layout configuration (1101) can be compared with the first and the first through holes (106) of the second group (125) of the interconnection pads (105) of the second row (115) by electrically coupling The alignment lines of the interconnect pads (105) in the two columns (115, 116) are offset (block 1305) to form (block 1302).

The method of FIG. 13 may further include forming at least one contact pad (111) into at least one interconnection pad (105) of the interconnection pads (105) in the first row (116). In addition, the method of FIG. 13 may further include defining a through hole (106) electrically coupling a die (104) to the first and second groups (125, 126) on a second side of the monolithic substrate (101). ) Of several electrical traces (107). In one example, several electrical traces (107) may be defined using a laser direct construction (LDS) procedure.

The aspect of this system and method is described in this article in conjunction with the flowchart illustration and / or block diagram of the method, equipment (system) and computer program product according to the principle examples described in this case. Each block in the flowchart illustration and block diagram, and the combination of the flowchart illustration and the block diagram in the block diagram, can be implemented by a computer using code. The computer-usable code can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing equipment to form a machine, so that the computer-usable code can pass through, for example, the controller (1205) of the control device (1205) 1215) or other programmable data processing equipment, when executed, will implement the functions or actions specified in the block (s) of the flowchart and / or block diagram. In one example, the computer-usable code may be embodied in a computer-readable storage medium, and the computer-readable storage medium is part of a computer program product. In one example, the computer-readable storage medium is a non-transitory computer-readable medium.

The description and drawings of this case describe a cassette and the associated method of forming the cassette. The cassette may include a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout may include a first row of interconnection pads, and the interconnection pads include at least one interconnection pad. Each of the interconnect pads in the first row of interconnect pads may be electrically coupled to one of a first set of through holes. The electrical interconnection pad layout configuration also includes a second row of interconnection pads, and the interconnection pads include at least one interconnection pad. Each interconnecting pad in the second row of interconnecting pads may be electrically coupled to one of a second set of through-holes. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to an alignment line of the interconnect pads in the first and second rows.

The foregoing description has been used to illustrate and describe examples of the principles described. This specification is not intended to be exhaustive or to limit these principles to any particular form disclosed. With the above teaching content, many modifications and changes can still be made.

100‧‧‧ (first volume) cassette

101‧‧‧ Matrix

102‧‧‧ storage tank

103‧‧‧fluid hole

104‧‧‧ Grain

105‧‧‧contact pad; connection pad

105-1 ~ 105-10‧‧‧Contact pad

106, 106-1 ~ 106-10‧‧‧ through hole

107、107-1 ~ 107-10‧‧‧ Trace

108‧‧‧wire junction

109‧‧‧ die pad

110、110-1 ~ 5‧‧‧Offset trace

901‧‧‧Cartridge interface

903‧‧‧Printed Circuit Assembly (PCA)

904‧‧‧arrow direction

905‧‧‧Spring pressure connection

914‧‧‧arrow

1000‧‧‧ Cassette

1001‧‧‧ Distribution head (assembly)

1005‧‧‧ (monolithic) frame

1100, 1200‧‧‧ system

1101‧‧‧Electrical interconnection pad layout configuration

1110‧‧‧test sample

1130‧‧‧hardware adapter

1205‧‧‧Verification control device

111‧‧‧contact seat; detent

115‧‧‧ (first) row; horizontal row; second row

116‧‧‧ (second) row; horizontal row; first row

117‧‧‧line

125‧‧‧ first column; second group

126‧‧‧second column; first group

150‧‧‧ Grip

200‧‧‧ (second volume) cassette

900‧‧‧ calibrated fluid dispenser driver

1210‧‧‧test (board)

1215‧‧‧Controller

1225‧‧‧ Peripheral device adapter; hardware adapter

1230‧‧‧ network adapter

1235‧‧‧Display device

1240‧‧‧Data Storage Device

1245‧‧‧RAM

1250‧‧‧Read Only Memory

1255‧‧‧hard drive memory

1260‧‧‧Bus

1301 ~ 1305‧‧‧‧box

A, B‧‧‧ circles

D‧‧‧distance

The drawings illustrate various examples of the principles described herein and are a part of the specification. The examples drawn are for illustration only and do not limit the scope of patent application.

FIG. 1 is a front perspective view of a first volume cassette according to an example of the principles described in this case.

FIG. 2 is a rear perspective view of the first volume cassette of FIG. 1 according to an example of the principles described in this case.

FIG. 3 is a front perspective view of a second volume cassette according to an example of the principles described in this case.

FIG. 4 is a rear perspective view of the second volume cassette of FIG. 3 according to an example of the principles described in this case.

FIG. 5 is a front plan view of the first volume cassette of FIG. 1 according to an example of the principles described in this case.

FIG. 6 is a front plan view of the first volume cassette of FIG. 1 viewed from circle A in FIG. 5 according to an example of the principles described in this case.

FIG. 7 is a rear plan view of the first volume cassette of FIG. 1 according to an example of the principles described in this case.

FIG. 8 is a rear plan view of the first volume cassette of FIG. 1 viewed from circle B in FIG. 7 according to an example of the principles described in this case.

FIG. 9 is a perspective view of the interface between the first volume cassette of FIG. 1 and a printed circuit assembly (PCA) of a cassette interface of a verification fluid dispenser driver according to an example of the principles described in this case.

FIG. 10 is a front plan view of a cassette including a plurality of dispensing head assemblies according to an example of the principles described herein.

FIG. 11 is a block diagram of a system for injecting fluid into a test sample according to an example of the principles described in this case.

FIG. 12 is a block diagram of a system for ejecting fluid into a test sample according to another example of the principles described in this case.

FIG. 13 is a flowchart illustrating a method for forming a cassette according to another example of the principles described in this case.

In the drawings, the same reference numbers indicate similar but not necessarily identical elements.

Claims (15)

A cassette comprising: a base body; a die coupled to the base body; and an electrical interconnection pad layout configuration formed on a first side of the base body, comprising: a first row of interconnection pads, It includes at least one interconnecting pad, each interconnecting pad in the first row of interconnecting pads is electrically coupled to one of a first set of through holes; and a second row of interconnecting pads comprising at least one interconnecting pad. Interconnected pads, each interconnected pad in the second row of interconnected pads is electrically coupled to one of a second set of vias, wherein the second set of vias electrically coupled to the second row of interconnected pads Offset with respect to an alignment line of the interconnect pads in the first and second columns. For example, the cartridge of claim 1 further includes a plurality of electrical traces formed on a second side of the base, wherein the first group and the second group of through holes electrically couple the electrical interconnection pad layout configuration. To the electrical traces, and the bias of the second set of vias electrically coupled to the second column of interconnect pads, causing a bias of the electrical traces formed on the second side of the substrate . As in the cartridge of claim 1, wherein at least one of the interconnection pads in the first row of interconnection pads includes a contact seat defined therein, the contact seat allows a spring to be pressed against the seat of the connection body. . The cartridge of claim 1, wherein at least one of the interconnection pads in the second row of interconnection pads includes a launch interconnection pad. A system for injecting fluid into a test sample includes: a printed circuit assembly (PCA) including: at least one spring pressed against a connection member; and at least one dispensing head, the at least one dispensing head comprising: A substrate; a die coupled to the substrate; and an electrical interconnection pad layout configuration formed on a first side of the substrate, comprising: a first row of interconnection pads including at least one interconnection pad Each interconnect pad in the first row of interconnect pads is electrically coupled to one of a first set of through holes; and a second row of interconnect pads including at least one interconnect pad, the second row Each of the interconnect pads in the interconnect pads is electrically coupled to one of a second set of vias, wherein the second set of vias electrically coupled to the second row of interconnect pads is relative to the first row and One of the interconnect pads in the second column is offset by an alignment. The system of claim 5, wherein at least one of the interconnect pads in the second row of interconnect pads includes a launch interconnect pad. The system of claim 5, wherein at least one of the interconnection pads in the first row of interconnection pads includes a contact seat defined therein, the contact seat allowing the spring to press the connecting member against the at least one The dispensing head is seated in the contact seat when it interfaces with the PCA. The system of claim 5, wherein the first row of interconnect pads includes at least one ground interconnect pad, a power supply voltage interconnect pad, and a thermal sensing resistor (TSR) interconnect pad. The system of claim 8, wherein the second row of interconnect pads includes at least one transmit interconnect pad, a clock interconnect pad, and a data interconnect pad. The system of claim 5, wherein the PCA slides through the second row of interconnecting pads by causing the at least one spring pressing connector to electrically couple the at least one spring pressing connector to the first row of interconnections. At least one interconnection pad among the pads is used to interface with the electrical interconnection pad layout configuration of the at least one dispensing head. The system of claim 5, wherein the PCA is lowered to the first row of interconnecting pads by pressing the at least one spring against the connecting member in a direction perpendicular to a plane formed by the electrical interconnecting pad layout configuration. Or at least one of the interconnection pads in the second row of interconnection pads, to interface with the electrical interconnection pad layout configuration of the at least one dispensing head. A method for forming a cassette includes: forming a monolithic substrate; forming an electrical interconnection pad layout configuration, which is formed on a first side of the monolithic substrate by the following steps: forming a first A row of interconnect pads including at least one interconnect pad, each interconnect pad in the first row of interconnect pads being electrically coupled to one of a first set of through-holes; and forming a second row of interconnects A pad including at least one interconnect pad, each interconnect pad in the second row of interconnect pads being electrically coupled to one of a second set of vias; and electrically coupled to the second row of interconnect pads The second set of through-holes are offset relative to an alignment line of the interconnect pads in the first column and the second column. The method of claim 12, further comprising forming at least one contact pad into at least one interconnection pad in the first row of interconnection pads. The method of claim 12, further comprising defining electrical traces electrically coupling a die to the first group of vias and the second group of vias on a second side of the monolithic substrate. . The method of claim 12, wherein the plurality of traces are defined using a laser direct construction (LDS) procedure.