TW201924151A - High-table miniature surface mounted spring plate including a mounting section, a high table body section, a pressed part, a pair of surrounding sections and an adsorption section - Google Patents
High-table miniature surface mounted spring plate including a mounting section, a high table body section, a pressed part, a pair of surrounding sections and an adsorption section Download PDFInfo
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Abstract
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一種表面安裝彈片,特別是一種具有高臺式的微型表面安裝彈片。 A surface mount shrapnel, in particular a miniature surface mount shrapnel having a high table top.
電子業界所用之彈片是以例如鈹銅、磷青銅、不鏽鋼等金屬材料經過沖壓、彎折及加熱定型等步驟製成,再以表面安裝(Surface-mount technology,SMT)技術焊接固定於一電路板上,藉由彈片本身的金屬材質經由彎折所具有的彈性回復力,作為電路元件間的導電接觸、傳遞訊號、或以機械彈力提供受壓緩衝之用。由於電子裝置逐漸微型化,電路板上所規劃的焊接墊面積也被要求縮減。如圖1所示,以往彈片9在受壓時,彈性臂90和吸附部92往往一方面會受力向下壓縮,另方面則會如虛線所示,沿著弧形方向朝向圖式左後傾倒,使得電路板上除原本供焊接的長度L外,還需要額外預留一些讓彈性臂90和吸附部92向後倒的行程空間,因此在電路板上實際佔用的前後長度將由原本標示的L伸長為L’。 The shrapnel used in the electronics industry is made by stamping, bending, and heat setting metal materials such as beryllium copper, phosphor bronze, and stainless steel, and then soldered to a circuit board by surface-mount technology (SMT) technology. The elastic restoring force of the metal material of the elastic piece itself is used as a conductive contact between the circuit elements, a signal transmission, or a mechanical elastic force to provide a pressure buffer. As electronic devices become more miniaturized, the planned solder pad area on the board is also required to be reduced. As shown in Fig. 1, in the past, when the elastic piece 9 is pressed, the elastic arm 90 and the adsorption portion 92 tend to be compressed downward on the one hand, and the left side is shown in the arc direction as shown by the broken line. Dumping, in addition to the length L originally for welding, the circuit board needs to reserve some travel space for the elastic arm 90 and the adsorption portion 92 to be backward. Therefore, the front and rear length actually occupied on the circuit board will be originally marked by L. Elongation is L'.
此外,一般彈片為保護彈性臂不被輕易過度施壓而損壞,還有如圖2所示的結構設計,讓焊接段96的左右兩側向上彎折延伸,構成彼此大致平行的兩個側壁94,如果彈性臂90被過度下壓,就由直立的側壁94分擔部分壓力,增加整體的結構強度。然而,由焊接段96向上延伸的側壁94在受壓時,仍有歪倒損壞的問題,而且歪倒後,還會干擾電路板上左右兩 側的其他元件。因此,在該前案中,彈性臂90除原本就有的上下彎折外,還額外設計有左右兩個側彎後向下延伸再彎折的彈腳98,確保彈性臂90受力下壓的結構不易損壞。這種結構雖然降低彈性臂90損壞的機率,但是考量目前常見的彈片規格,一般所謂0402的標準尺寸,就是焊接面積的長度0.04英吋,寬度0.02英吋,換為公制分別為區區1毫米長、0.5毫米寬的範圍。在這樣微小尺寸內進行多個不同角度的彎折,單純模具的設計就相當困難,由此,不僅影響產品的產出效率,產品良率也會隨之降低,成本因而大增。 In addition, the general elastic piece is not damaged by the excessive pressure applied to protect the elastic arm, and the structural design as shown in FIG. 2 is such that the left and right sides of the welded section 96 are bent upwardly to form two side walls 94 substantially parallel to each other. If the resilient arms 90 are excessively depressed, a portion of the pressure is shared by the upstanding sidewalls 94, increasing the overall structural strength. However, when the side wall 94 extending upward from the welding section 96 is under pressure, there is still a problem of tripping damage, and after tripping, it may interfere with the left and right sides of the circuit board. Other components on the side. Therefore, in the previous case, in addition to the original upper and lower bending, the elastic arm 90 is additionally designed with two left and right side bends, and then extended and bent to the elastic foot 98, ensuring that the elastic arm 90 is pressed down. The structure is not easily damaged. Although this structure reduces the probability of damage of the elastic arm 90, it considers the common shrapnel specifications. Generally, the standard size of the so-called 0402 is the length of the welded area of 0.04 inches, the width of 0.02 inches, and the metric system is 1 mm long. , 0.5 mm wide range. In such a small size, bending at a plurality of different angles makes it difficult to design a simple mold, thereby not only affecting the output efficiency of the product, but also reducing the yield of the product, and the cost is greatly increased.
一方面,為因應上述面積縮減的需求,新型專利第M309838號「彈片結構改良」中所揭露之彈片9,如圖3所示,是以一帶狀金屬材料彎折成形出一個位於下方的墊高部91和一個位於上方的彈臂部93讓彈片9被架高且僅有上方彈臂部93被設定用來彈性形變。其中,墊高部91從收折端910、連接段912、抵接端911以及另一連接段913共同圍繞出一個長方形的基座框。而彈臂部93則是從連接段912開始,彎折延伸出第二彎折區935、支撐端934、及第一彎折區933的S狀反覆折曲,並且彎折出頂部的固定端932,最後回彎出阻隔端931的前方遮擋。 On the one hand, in order to cope with the above-mentioned reduction in area, the shrapnel 9 disclosed in the "Modification of the shrapnel structure" of the new patent No. M309838, as shown in Fig. 3, is formed by bending a strip of metal material to form a cushion located below. The upper portion 91 and an upper arm portion 93 allow the elastic piece 9 to be raised and only the upper elastic arm portion 93 is set to be elastically deformed. The height portion 91 surrounds a rectangular base frame from the folding end 910, the connecting portion 912, the abutting end 911 and the other connecting portion 913. The elastic arm portion 93 starts from the connecting portion 912, and bends and extends out of the second bending portion 935, the supporting end 934, and the first bending portion 933, and bends the fixed end of the top portion. 932, finally bending back to block the front end of the blocking end 931.
由於下方的墊高部91僅為單層框架,一旦受上方壓力作用時,支撐保護效果有限,尤其在彈片整體微型化的趨勢下,當彈片的底面尺寸縮小至例如上述0402規格後,底面的長度與寬度僅有約1.0mm和0.5mm,而彈片整體高度則有1.5至3.5mm等不同尺寸,整體機械強度明顯下滑,直立的連接段912與另一連接段913高度比例越高,該產品受壓時,直立的連接段912和另一連接段913永久形變損壞的問題越嚴重,導致彈片9不 能長期維持良好的預期性能。 Since the lower height portion 91 is only a single-layer frame, the support protection effect is limited when subjected to the upper pressure, especially in the trend of miniaturization of the elastic piece, when the bottom surface of the elastic piece is reduced to, for example, the above-mentioned 0402 size, the bottom surface is The length and width are only about 1.0mm and 0.5mm, and the overall height of the shrapnel is 1.5 to 3.5mm, and the overall mechanical strength is obviously degraded. The height ratio of the upright connecting section 912 to the other connecting section 913 is higher. When pressed, the problem of permanent deformation of the upright connecting section 912 and the other connecting section 913 is more serious, resulting in the shrapnel 9 not being Can maintain good expected performance for a long time.
另方面,彈臂部93設置的目的就是利用其彈性回復能力,原本就易於彈性形變而剛性不佳,且其寬度僅有例如0.5mm寬,固定端932與墊高部91間,還要經過第二彎折區935、第一彎折區933等多處彎折,製造公差會在彎折中被逐漸放大,彈片9在放入料帶中收納時還可能再略有置放的些許落差偏頗。因此,在最後要進行表面安裝的吸取過程中,很容易有例如千分之一的彈片,會因為固定端932的位置偏低或偏高,導致吸嘴的吸附不足或下壓過度等因素,而在由料帶中取出的過程中掉落,使得這種彈片在表面安裝工藝流程中,產生必須停機處理的困擾。 On the other hand, the purpose of the elastic arm portion 93 is to utilize its elastic recovery capability, which is easy to be elastically deformed and has poor rigidity, and its width is only 0.5 mm wide, and the fixed end 932 and the height portion 91 pass through. The second bending zone 935, the first bending zone 933 and the like are bent at a plurality of places, the manufacturing tolerance is gradually enlarged in the bending, and the elastic piece 9 may be slightly placed slightly when placed in the feeding belt. Biased. Therefore, in the final suction process for surface mounting, it is easy to have, for example, one thousandth of the elastic piece, because the position of the fixed end 932 is low or high, which causes insufficient suction or excessive pressure of the suction nozzle. And falling in the process of taking out from the tape, so that the shrapnel in the surface mounting process, the trouble that must be stopped processing.
因此,如何讓下方的墊高部份結構穩定,順利減縮彈片於電路板上所佔據的面積;且在吸附過程中可以提供理想的吸附部,降低吸附不良而掉落的機率,提高產出效率以利於自動化表面安裝;又能保持良好的預定結構,以提供良好的導電接觸、訊號傳遞、或以機械彈力提供受壓緩衝及支撐保護之效果,尤其是可依據電路板和相對的電路板或元件的間距而提供各種高度的產品、具備使用彈性,將是本案所要的解決重點。 Therefore, how to make the structure of the lower padding part stable, smoothly reduce the area occupied by the shrapnel on the circuit board; and provide an ideal adsorption part in the adsorption process, reduce the probability of dropping and falling, and improve the output efficiency. To facilitate automated surface mounting; and to maintain a good predetermined structure to provide good conductive contact, signal transmission, or mechanical compression to provide compression buffer and support protection, especially according to the circuit board and the opposite circuit board or The provision of various heights of components and the flexibility of use will be the focus of the solution.
本發明的一目的在於提供一種下方高臺結構穩定的高臺式微型表面安裝彈片,以節約所佔用電路板的安裝面積,符合微型化需求。 It is an object of the present invention to provide a high-profile micro-surface-mounted shrapnel with a stable structure underneath to save the mounting area of the occupied circuit board and meet the miniaturization requirements.
本發明的另一目的在於提供一種吸附段結構穩定的高臺式微型表面安裝彈片,降低吸附時的掉落機率,提升表面安裝的產出效率。 Another object of the present invention is to provide a high-top surface micro surface mount shrapnel with stable adsorption section structure, which reduces the drop probability during adsorption and improves the surface mount production efficiency.
本發明的又一目的在於提供一種具有環抱保護結構的高臺式微型表面安裝彈片,保護彈臂段在承受過度壓力時的結構安全,確保產 品性能,不易變形。 Another object of the present invention is to provide a high-top surface micro-surface mounted shrapnel with an embracing protection structure to protect the structural safety of the elastic arm section under excessive pressure and ensure production. Product performance, not easy to deform.
本發明的再一目的在於提供一種安裝段與環抱段之間存有爬錫間距的高臺式微型表面安裝彈片,保護彈片受到側面受力時的結構安全,確保產品不易從安裝表面脫落。 A further object of the present invention is to provide a high-top surface micro-surface mounting elastic piece with a creepage-to-sand spacing between the mounting section and the surrounding section, which protects the structure of the elastic piece from the side force, and ensures that the product is not easily detached from the mounting surface.
依上述本案揭露的一種高臺式微型表面安裝彈片,是供表面安裝至一電路板,該表面安裝彈片包括:一個供表面安裝至上述電路板的安裝段;一個高臺本體段,具有一個由上述安裝段向上彎折延伸的下邊緣、一個相反於該下邊緣的上邊緣、以及連接前述上邊緣和前述下邊緣且彼此平行的一個左側邊緣及一個右側邊緣;一個彎折延伸自前述高臺本體段前述上邊緣的彈臂段,前述彈臂段遠離前述高臺本體段形成有一個高於上述高臺本體段的受壓部;一對分別由前述左側邊緣及前述右側邊緣彎折且彼此平行延伸的環抱段,每一前述環抱段皆具有一個高端緣及一相反於前述高端緣的焊接端緣;及一吸附段,彎折自前述環抱段之一的前述高端緣,並平行於上述安裝段延伸,且向前述另一環抱段的前述高端緣延伸,以及前述彈臂段受壓部在未受力狀態下是暴露於上述吸附段上方,且當前述彈臂段的受壓部受壓位移至低於前述吸附段時,會受前述吸附段及前述環抱段支撐保護。 A high-desktop micro surface mount shrapnel according to the above disclosure is for surface mounting to a circuit board, the surface mount shrapnel comprising: a mounting section for surface mounting to the circuit board; a high platform body section having a a lower edge extending upwardly from the mounting section, an upper edge opposite to the lower edge, and a left edge and a right edge connecting the upper edge and the lower edge and parallel to each other; a bend extending from the aforementioned platform a spring arm segment of the upper edge of the body segment, wherein the elastic arm segment is formed away from the upper platform body segment with a pressure receiving portion higher than the upper platform body segment; a pair of the left side edge and the right edge edge are respectively bent and mutually Parallelly extending embracing segments each having a high end edge and a welded end edge opposite the high end edge; and an adsorption section bent from the aforementioned high end edge of one of the aforementioned embracing segments and parallel to the above The mounting section extends and extends toward the aforementioned high end edge of the other embracing segment, and the aforementioned compression portion of the spring arm segment is exposed in an unstressed state When above the adsorption section, and the current position of said compression pressure-receiving portion elastic arm section is moved to below the adsorption section, and the section surrounded by the adsorption section will be protected by the support.
透過本案所揭露之高臺式微型表面安裝彈片,藉由上述高臺本體段的不同高度設計,可以依照客戶需求而製造不同高度尺寸的彈片,具有使用彈性;且藉著環抱段及吸附段支撐保護前述彈臂段,使前述彈臂段的受壓部受壓位移至低於前述吸附段時,不至於輕易因受壓而變形;高臺本體段配合環抱段穩定架設,使得微型化的彈片仍然具有穩固基礎,更 佔據較小的安裝面積,達成微型化目的;尤其吸附段由一環抱段簡單彎折延伸,並受另一環抱段支持,讓吸嘴吸取搬移時,沒有大量公差或受壓退縮的問題,降低吸附掉落率,一舉解決上述問題。 Through the high-profile micro-surface-mounted shrapnel disclosed in this case, the different heights of the above-mentioned high-profile main body sections can be used to manufacture shrapnels of different heights according to customer requirements, which are flexible in use and supported by the embracing section and the adsorption section. Protecting the aforementioned elastic arm section so that the pressure receiving portion of the elastic arm section is displaced below the adsorption section, and is not easily deformed by pressure; the high-profile main body section is stably erected with the embracing section, so that the miniaturized elastic piece is made Still have a solid foundation, more It occupies a small installation area and achieves the purpose of miniaturization; in particular, the adsorption section is simply bent and extended by a looping section, and is supported by another looping section, so that when the nozzle is sucked and moved, there is no problem of large tolerance or pressure shrinkage, and the problem is reduced. Adsorption of the drop rate solves the above problems in one fell swoop.
1,1’‧‧‧安裝段 1,1’‧‧‧Installation section
2,2’‧‧‧高臺本體段 2,2’‧‧‧High platform
20‧‧‧下邊緣 20‧‧‧ lower edge
22‧‧‧上邊緣 22‧‧‧ upper edge
24‧‧‧左側邊緣 24‧‧‧left edge
26‧‧‧右側邊緣 26‧‧‧ right edge
3,3’,3”‧‧‧彈臂段 3,3’,3”‧‧‧Bounce section
30,30”‧‧‧受壓部 30,30"‧‧‧ Pressure Department
32‧‧‧接觸端 32‧‧‧Contact end
4,4’,4”‧‧‧環抱段 4,4’,4”‧‧‧ embracing section
40,40’,40”‧‧‧高端緣 40,40’,40”‧‧‧ high-end edge
44’‧‧‧防鉤端 44’‧‧‧Anti-hook end
5,5’,5”‧‧‧吸附段 5,5’,5”‧‧‧Adsorption section
50”‧‧‧輔助段 50”‧‧‧Auxiliary section
42,42’‧‧‧焊接端緣 42,42'‧‧‧welding edge
98‧‧‧彈腳 98‧‧‧foot
9‧‧‧彈片 9‧‧‧Shrap
90‧‧‧彈性臂 90‧‧‧Flexible arm
91‧‧‧墊高部 91‧‧‧High Steps
910‧‧‧收折端 910‧‧‧ folding end
911‧‧‧抵接端 911‧‧‧Abutment
912‧‧‧連接段 912‧‧‧ Connection section
913‧‧‧另一連接段 913‧‧‧Another connection segment
92‧‧‧吸附部 92‧‧‧Adsorption Department
93‧‧‧彈臂部 93‧‧‧Boom arm
931‧‧‧阻隔端 931‧‧‧ blocking end
932‧‧‧固定端 932‧‧‧ fixed end
933‧‧‧第一彎折區 933‧‧‧First bend zone
934‧‧‧支撐端 934‧‧‧Support side
935‧‧‧第二彎折區 935‧‧‧second bend zone
94‧‧‧側壁 94‧‧‧ side wall
96‧‧‧焊接段 96‧‧‧welding section
L、L’‧‧‧長度 L, L’‧‧‧ length
圖1為一種習知技術的立體示意圖。 1 is a perspective view of a conventional technique.
圖2為另一習知技術的立體示意圖。 2 is a perspective view of another prior art.
圖3為又另一習知技術的立體示意圖。 3 is a perspective view of still another prior art.
圖4為本發明高臺式微型表面安裝彈片第一較佳實施例的立體圖。 4 is a perspective view of a first preferred embodiment of a high table surface mount spring shingle of the present invention.
圖5為圖4實施例的右側視圖。 Figure 5 is a right side view of the embodiment of Figure 4.
圖6為圖4實施例的前視圖。 Figure 6 is a front elevational view of the embodiment of Figure 4.
圖7為本發明高臺式微型表面安裝彈片第二較佳實施例的立體圖。 Figure 7 is a perspective view of a second preferred embodiment of the high table mini surface mount dome of the present invention.
圖8為圖7實施例的右側圖。 Figure 8 is a right side view of the embodiment of Figure 7.
圖9為圖7實施例焊接至電路板上後的前視圖。 Figure 9 is a front elevational view of the embodiment of Figure 7 after soldering to a circuit board.
圖10為本發明高臺式微型表面安裝彈片第三較佳實施例的立體示意圖。 Figure 10 is a perspective view of a third preferred embodiment of the high table surface mount spring of the present invention.
有關本案之前術及其他技術內容、特點及功效,於下述搭配參考圖式之較佳實施例的詳細說明,將可清晰呈現,於各實施例中相同的元件以相似之標號標示。 The detailed description of the preferred embodiments of the present invention will be apparent from the following description of the preferred embodiments of the invention.
本案一種高臺式微型表面安裝彈片的第一較佳實施例,如圖4至圖6所示,包括:一個安裝段1、一個高臺本體段2、一個彈臂段3、一對環抱段4及一個吸附段5,為便於理解,於此將該高臺本體段2的四邊緣分別 定義為下邊緣20、相反於前述下邊緣20的上邊緣22、及連結該上邊緣22和該下邊緣20的左側邊緣24與右側邊緣26。 A first preferred embodiment of a high-seat micro surface mount shrapnel, as shown in FIGS. 4-6, includes: a mounting section 1, a platform body section 2, a spring arm section 3, and a pair of embracing sections. 4 and an adsorption section 5, for ease of understanding, the four edges of the upper platform section 2 are respectively Defined as a lower edge 20, an upper edge 22 opposite the aforementioned lower edge 20, and a left edge 24 and a right edge 26 joining the upper edge 22 and the lower edge 20.
其中,位於底部的安裝段1是供焊接固定於電路板上,並且由安裝段1的一邊向上彎出高臺本體段2的下邊緣20,再由相對的上邊緣22處,彎折延伸出彈臂段3,且彈臂段3在遠離前述高臺本體段2的部分,形成有一個向上突出的受壓部30,且該受壓部30高於前述高臺本體段2;由上述左側邊緣24及上述右側邊緣26分別彎折出一對環抱段4,每一個環抱段4的上邊緣定義為高端緣40,底部相反於高端緣40的則稱為焊接端緣42。如圖4左側環抱段4的高端緣40向右彎折形成一吸附段5,由於此吸附段5是平行於上述安裝段1方向延伸,因此可以提供表面安裝吸嘴吸附。 Wherein, the mounting section 1 at the bottom is fixed to the circuit board by soldering, and the lower edge 20 of the upper body section 2 is bent upward from one side of the mounting section 1, and is bent and extended by the opposite upper edge 22. a spring arm section 3, and a portion of the elastic arm section 3 that is away from the upper platform body section 2, is formed with an upwardly protruding pressure receiving portion 30, and the pressure receiving portion 30 is higher than the high platform body section 2; The edge 24 and the right side edge 26 are respectively bent out of a pair of embracing segments 4, the upper edge of each of the embracing segments 4 being defined as a high end edge 40 and the bottom opposite the high end edge 40 being referred to as a welding edge 42. The high-end edge 40 of the left-hand embracing section 4 of FIG. 4 is bent to the right to form an adsorption section 5. Since the adsorption section 5 extends parallel to the direction of the mounting section 1, the surface-mounted nozzle can be provided.
彈臂段3的受壓部30於未受力狀態下,是暴露於上述吸附段5的上方,且該受壓部30遠離彈臂段3的末端部分是隱沒於兩側的環抱段4間,防止該自由端受到其它外物勾拉變形的可能。另方面,由於兩側的環抱段4彼此平行延伸,加上前述高臺本體段2會形成三面環繞的形式,且三者的底部都是被焊接在電路板上,可架構出一個堅實的基礎,藉此提升於受壓狀態下的支撐力,因此當前述受壓部30受壓向下位移至低於前述吸附段5時,前述彈臂段3會受到該吸附段5和兩個環抱段4的高端緣40所支撐,增加對於彈片的支撐保護,藉此使彈片不易變形,能長時間維持功效。 The pressure receiving portion 30 of the elastic arm section 3 is exposed above the adsorption section 5 in an unstressed state, and the end portion of the pressure receiving portion 30 away from the elastic arm section 3 is hidden between the embracing sections 4 on both sides. To prevent the free end from being deformed by other foreign objects. On the other hand, since the embracing sections 4 on both sides extend parallel to each other, and the aforementioned high-profile body section 2 forms a three-sided surrounding form, and the bottoms of the three are soldered on the circuit board, a solid foundation can be constructed. Thereby, the supporting force in the pressed state is raised, so when the pressure receiving portion 30 is pressed downward to be lower than the adsorption section 5, the aforementioned elastic arm section 3 is subjected to the adsorption section 5 and the two embracing sections. Supported by the high-end edge 40 of 4, the support for the shrapnel is increased, so that the shrapnel is not easily deformed and can maintain the effect for a long time.
為使受壓部30和上方下壓的電路接觸良好,受壓部30還凸設有一個弧形上突的接觸端32,而於本例中受壓部30向下退縮過程中,該彈臂段3的弧狀移動行程都不會向後倒而超過高臺本體段2,使得本發明彈片在電路板上,不會因為彈臂段下壓後倒而影響周圍的元件,節約所佔用的 安裝面積,讓電路板上的其他空間可以完全讓其他元件彈性使用,達到符合微型化的目標需求。 In order to make the pressure receiving portion 30 and the upper pressing circuit contact well, the pressure receiving portion 30 also protrudes with an arc-shaped protruding contact end 32, and in this example, the pressure receiving portion 30 is retracted downward, the bomb The arc-shaped moving stroke of the arm segment 3 does not fall backward beyond the high-station body segment 2, so that the shrapnel of the present invention is on the circuit board, and does not affect the surrounding components due to the downward pressing of the elastic arm segment, thereby saving the occupied The mounting area allows the other space on the board to be completely flexible for other components to meet the needs of miniaturization.
如熟悉本技術領域人士所能輕易理解,前一實施例中的環抱段雖為單一側壁平面型態,但該結構僅為本案的單一實施例,並不是必要限制,而該實施例中隱藏於環抱段間的彈臂段部分為雙重反折的S形結構,也不是必要限制。請一併參考圖7至9,本發明第二較佳實施例,其中和前一實施例相同部分在此不再贅述。在本例的每一環抱段4’處,於該高端緣40’和焊接端緣42’之間,分別形成有對應於高臺本體段2’且朝向相對環抱段4’方向彎折相向延伸的防鉤端44’,使得高臺本體段2’的相對側面都沒有任何突出而會被勾拉的位置,尤其防鉤端44’又位於彈臂段3’的下方,可以進一步支撐彈臂段3’,提升整體結構強度。此外,由於本例中的彈片高度較低,因此彈臂段3’在隱藏於環抱段4’間,也僅有單一的反折,形成大致為”ㄈ”形的結構,至於此種反折數量的多寡,則可以依照整體彈片高度需求而改變,均無礙於本發明的實施。 As can be easily understood by those skilled in the art, the embracing segment in the previous embodiment is a single sidewall planar type, but the structure is only a single embodiment of the present invention, and is not necessarily limited, and the embodiment is hidden in The portion of the elastic arm section between the embracing sections is a double-reflexed S-shaped structure and is not necessarily limited. Referring to FIG. 7 to FIG. 9 together, the second preferred embodiment of the present invention, wherein the same portions as the previous embodiment are not described herein again. In each of the embracing sections 4' of the present example, between the high end edge 40' and the welding end edge 42', a corresponding extension is formed corresponding to the upper stage body section 2' and is bent toward the opposite collar section 4'. The anti-hook end 44' is such that the opposite sides of the platform body section 2' do not have any protruding position that can be pulled, and in particular the anti-hook end 44' is located below the elastic arm section 3', which can further support the elastic arm Segment 3', to enhance the overall structural strength. In addition, since the height of the elastic piece in this example is low, the elastic arm section 3' is hidden between the surrounding section 4', and only has a single reverse fold to form a substantially "ㄈ"-shaped structure. The amount of the quantity can be changed according to the overall shrapnel height requirement, and does not hinder the implementation of the present invention.
由於本發明的吸附段,都是從一個環抱段的高端緣簡單彎折延伸,且環抱段也不是受壓撓曲的結構,因此大幅降低誤差發生的機率,使得吸附段極容易保持在預定位置供吸嘴吸附,藉此降低彈片被吸取時的掉落率。並且下方的高臺本體段和兩側的環抱段共同構成一個穩固的基座,讓彈片結構微型化後,仍能保持堅實而不易損壞;而環抱段的焊接端緣和安裝段之間留有空隙,可以容許電路板上預留的銲錫在經過迴焊機熔融後,如圖9虛線所示,侵入焊接端緣42’和安裝段1’間,更進一步確保彈片和電路板間的穩定結合;尤其是下方的基座不會有後倒問題,確保彈片的 焊接段尺寸就是實際佔用面積,符合電子元件微型化的潮流趨勢,完全達成上述目的。 Since the adsorption section of the present invention is simply bent and extended from the high end edge of an embracing section, and the embracing section is not a structure that is flexed and deflected, the probability of occurrence of errors is greatly reduced, so that the adsorption section is extremely easy to maintain at a predetermined position. It is sucked by the suction nozzle, thereby reducing the drop rate when the elastic piece is sucked. And the lower platform body section and the surrounding side sections form a stable base, so that the shrapnel structure can be kept solid and not easily damaged after being miniaturized; and the welding edge of the embracing section and the mounting section are left between The gap can allow the solder reserved on the circuit board to be infused between the soldering edge 42' and the mounting section 1' after being melted by the reflow machine, as shown by the dashed line in Fig. 9, further ensuring a stable combination between the shrapnel and the board. Especially the bottom of the base will not have a back problem, ensuring the shrapnel The size of the welding section is the actual occupied area, which is in line with the trend of miniaturization of electronic components, and fully achieves the above objectives.
當然,為進一步增強吸附段的支撐,本發明第三較佳實施例如圖10所示,該吸附段5”的端緣可以延伸至相對環抱段4”的高端緣40”上方,相對環抱段4”的高端緣40”也相對彎折延伸出一個對應的輔助段50”,讓吸附段5”和輔助段50”同時受到兩側的環抱段4”支撐,在彈臂段3”受壓時,提供更強的支撐。且在本例中,彈臂段3”雖僅具有單純的上凸彎折受壓部30”沒有額外突出的接觸端,也無礙於本案的實施。 Of course, in order to further enhance the support of the adsorption section, the third preferred embodiment of the present invention, as shown in FIG. 10, the end edge of the adsorption section 5" may extend above the high end edge 40" of the opposite collar section 4", and the opposite collar section 4 The "high end edge 40" also extends a corresponding auxiliary section 50" relative to the bend, so that the adsorption section 5" and the auxiliary section 50" are simultaneously supported by the embracing sections 4" on both sides, when the elastic section 3" is pressed To provide stronger support. Moreover, in this example, the elastic arm section 3" has only a simple upper convex bending portion 30" without an additional protruding contact end, and does not hinder the implementation of the present invention.
以上所述,為本案較佳實施例而已,任何依照本案結構所產生之均等效果及其他變化修飾,皆為本案範圍。 The foregoing is a preferred embodiment of the present invention, and any equal effects and other variations that are produced in accordance with the structure of the present invention are within the scope of the present invention.
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