TW201921007A - Systems and methods for high dynamic range microLED backlighting - Google Patents

Abstract

Embodiments are related to systems and methods for lighting, and more particularly to systems and methods for providing light for a display.

Description

System and method for high dynamic range micro LED backlight

Cross-references to related applications

This application claims priority rights to U.S. Provisional Application Serial No. 62/689980 filed on June 26, 2018 and U.S. Provisional Application Serial No. 62/549531 filed on August 24, 2017 in accordance with the Patent Law. The content of each of these U.S. provisional applications is the basis of this case and is incorporated herein by reference in its entirety.

Embodiments relate to systems and methods for lighting, and more particularly, to systems and methods for providing light to a display.

In some cases, the backlight is positioned between a printed circuit board (PCB) with a blue light emitting diode (LED) array and a liquid crystal display (LCD) panel. Quantum dot enhancement film (QDEF) structure. The significant space between the LED array and the QDEF is required for the expansion of light emitted from the LED. This required space limits the thinness of the display that can be manufactured.

Thus, at least for the reasons described above, there is a need in the art for advanced systems and methods for lighting displays.

Embodiments relate to systems and methods for lighting, and more particularly, to systems and methods for providing light to a display.

This invention provides only a general overview of some embodiments of the invention. The phrases "in one embodiment", "in accordance with an embodiment", "in various embodiments", "in one or more embodiments", "in a specific embodiment", etc. generally mean following the The particular feature, structure, or characteristic following the phrase is included in at least one embodiment, and may be included in more than one embodiment. Importantly, such phrases do not necessarily refer to the same embodiment. Many other embodiments of the present invention will become clearer from the following detailed description, the scope of the accompanying patent application, and the accompanying drawings.

Embodiments relate to systems and methods for lighting, and more particularly, to systems and methods for providing light to a display.

Various embodiments provide an LCD display including an LCD panel and a micro LED backlight in a fixed position relative to the LCD panel. The micro LED backlight includes: a reflection formation; a transparent substrate; and at least one micro LED device. The micro LED device is disposed relative to the reflective structure and the transparent substrate such that light emitted from at least one micro LED device is reflected from the reflective structure and passes through the transparent substrate before reaching the LCD panel. In some cases, the heat sink is glued to a reflective construction.

In some cases of the above embodiments, the reflective structure may be, but is not limited to: (a) a quantum dot layer formed over another substrate, and a metal layer formed over the quantum dot layer; (b) a quantum dot enhanced film; (c) a quantum dot enhancement film having a metal layer formed on one surface of the quantum dot enhancement film; (d) a metal layer; (e) a diffuse reflector disposed above the surface of the substrate; or (f) formed on the substrate A quantum dot layer above the surface, and a metal layer formed above the quantum dot layer.

In one or more of the above embodiments, the transparent substrate is formed of glass. In some other cases of the above embodiments, the transparent substrate is formed of translucent alumina. In the specific case of the above embodiment, the micro LED is a white LED. In some such cases, the reflective structure is, but is not limited to: (a) a metal layer; or (b) a diffuse reflector disposed above the surface of the substrate. In other specific cases, the micro LED is a blue LED. In some such cases, the reflective structure is, but is not limited to: (a) a quantum dot layer formed over another substrate, and a metal layer formed over the quantum dot layer; (b) a quantum dot enhancement film; (c) A quantum dot enhancement film having a metal layer formed on one surface of the quantum dot enhancement film; or (d) a quantum dot layer formed above the surface of the substrate, and a metal layer formed above the quantum dot layer. In yet other specific cases, micro LEDs include red LEDs, green LEDs, and blue LEDs. In some such cases, the reflective structure is, but is not limited to: (a) a metal layer; and (b) a diffuse reflector disposed above the surface of the first substrate.

Other embodiments provide a backlight device including a transparent substrate, a reflective structure, and at least one micro LED. The reflective structure is formed on the first side of the transparent substrate, and the micro LED is disposed above the second side of the transparent substrate. The micro LED is oriented so that the light emitted therefrom passes through the transparent substrate and is reflected off the reflective structure to generate reflected light. The reflected light passes through the transparent substrate before being provided as a light output from the backlight device. In some cases, the reflective construction includes a metal layer to which the heat sink is adhered.

In some cases of the above embodiments in which the micro LED includes a blue LED, the reflective structure includes a quantum dot layer operable to perform color conversion of blue light emitted from the blue LED to reflect red, green, and blue components Light. In some such cases, the quantum dot layer is disposed on a transparent substrate, and the quantum dot layer is sealed by a metal layer. In other cases of the above embodiments in which the micro LED includes a blue LED, the reflective structure includes QDEF.

In each of the above embodiments in which at least one micro LED includes a red LED, a green LED, and a blue LED, the reflective structure includes a diffuse reflector disposed on a transparent substrate, or a metal layer disposed on the transparent substrate. In some cases of the above embodiments, the transparent substrate is made of translucent alumina. In other cases of the above embodiments, the transparent substrate is made of glass.

Still other embodiments provide a backlight including the following: a light emitting structure and a reflective structure. The light emitting structure includes: a transparent substrate; and at least one micro LED disposed on a surface of the transparent substrate. The micro LED is oriented so that the light emitted therefrom is directed away from the transparent substrate. The reflective structure includes a reflective layer. The reflective structure is positioned relative to the light emitting structure such that light emitted from the at least one micro LED is reflected as reflected light from the reflective layer, and the reflected light passes through the transparent substrate as a light output from the backlight device. In some cases, the reflective construction includes a metal layer to which the heat sink is adhered.

In some cases of the above embodiments, the transparent substrate is a translucent alumina. In other cases of the above embodiments, the transparent substrate is glass. In each case of the above embodiments, the surface of the transparent substrate on which the micro LEDs are disposed is the first surface of the transparent substrate, and the light emitting structure further includes a glass volume diffuser formed on the second surface of the transparent substrate. In some cases of the above embodiments, the micro LED is a blue LED. In some such cases, the reflective layer includes: a quantum dot enhancement film operable to color convert blue light emitted from a blue LED to reflect red, green, and blue component light; and a metal layer deposited on Quantum dot enhancement film.

In each case of the above embodiments, the transparent substrate is a transparent substrate, and the reflective structure includes a reflective layer disposed on the second transparent substrate, wherein light emitted from at least one micro LED passes through the second before being reflected from the reflective layer. Substrate. In some such cases where the micro LED is a blue LED, the reflective layer includes a quantum dot layer formed on a second transparent substrate, and a metal layer formed over the quantum dot layer. In some cases, the partitioner is formed in the second transparent substrate. The zone divider exhibits a tapered wall extending at least partially between a first surface of the second transparent substrate and a second surface of the second transparent substrate. In some specific cases, the tapered sidewall of the second transparent substrate is covered by a metal layer. In other specific cases, the tapered sidewall of the second transparent substrate is covered by the quantum dot layer and the metal layer.

Turning to Fig. 1a, a micro LED backlight 100 including a zone divider 140 (140a, 140b) between various zones is shown according to some embodiments. The micro LED backlight 100 includes a light emitting structure 121 and a reflective structure 136.

The light emitting structure 121 includes a scattering surface 105 disposed above the transparent layer 110. In some embodiments, the transparent layer 110 is formed of translucent alumina. This type of translucent alumina serves as a circuit board that connects blue micro LEDs 115 (designated 115a, 115b, 115c) to their respective electronic power sources and / or controls. Translucent alumina also provides relatively high thermal conductivity (about 40 W / m-k compared to nearly 1 W / m-k for glass). A material having such a high thermal conductivity is used to provide a mechanism for dissipating the heat generated by the blue micro LED 115 that is laterally oriented toward the edge of the light emitting structure 121, wherein a heat sink (not shown) can be installed outside the observation hole. In addition, the translucency of the translucent alumina helps to achieve greater uniformity of the RGB light reflected back by the reflective structure 136 acting as a volume diffuser. The scattering surface 105 further enhances the diffusion caused by the transparent layer 110, and thus the scattering surface 105 can be any structure or patterning of the surface of the transparent layer 110 and / or the material formed on the surface of the transparent layer 110.

The blue micro LED 115 (ie, 115a, 115b, 115c) is connected to the transparent layer 110 using conductive traces (not shown). In some cases, the conductive trace is a metal trace to which the blue micro LED 115 is soldered. In each case, the conductive traces are not straight, but can be zigzag or herringbone patterns in order to reduce artifacts and unwanted moirè patterns. The blue micro LED 115 may be any type of blue light emitting diode known in the art. Based on the disclosure provided herein, those skilled in the art will recognize multiple blue light emitting diodes that can be used with respect to different embodiments. The blue micro LED 115 is installed such that the light it emits during operation is directed away from the transparent layer 110. In some embodiments, the blue micro LED 115 is a lateral device, and the contact with the p-type material and the n-type material is on the same side of each LED device. In other embodiments, the blue micro LED 115 is a vertical device, wherein the contact with the p-type material is on one side of the device and the contact with the n-type material is on the other side of the device. For the purpose of this discussion, the vertical device described above is used.

Where such a vertical device is used, the side walls of the respective micro LEDs 115 remain open to allow contact with both the top and bottom of the respective device to be formed. In order to avoid a short circuit between each of the blue micro LEDs 115, the planarization layer 120 is formed between the respective blue micro LEDs 115 so that it encapsulates the side of the blue micro LEDs 115 while making the blue The top area of each of the micro LEDs 115 remains exposed. The planarization layer 120 is formed of any non-conductive transparent material suitable for forming a layer surrounding the blue micro LED 115. In some embodiments, the planarization layer 120 is formed of a polymer. A transparent conductive layer 125 is formed over the planarization layer 120 so that a conductive connection is generated between the transparent conductive layer 125 and each of the blue micro LEDs 115. Therefore, it is assumed that the blue micro LED 115 is the above-mentioned vertical device, and the transparent layer 110 is used to form an electrical contact with one side of each of the blue micro LEDs 115 and the transparent conductive layer 125 is used to form the blue micro LED 115. Electrical contact on the other side of each of them. The transparent conductive layer 125 may be made of any material that is substantially transparent and also conductive. In some embodiments, the transparent conductive layer 125 is formed of indium tin oxide (ITO).

The reflective structure 136 includes a reflective layer 151 disposed above the base substrate 135. The reflective layer 151 includes a quantum dot layer 150 disposed above the base substrate 135 and a metal layer 155 disposed above the quantum dot layer 150. The quantum dot layer 150 includes a plurality of quantum dots operated to reflect light emitted from the blue micro LED 115. In some cases, the size and shape of the quantum dots in the quantum dot layer 150 are designed so that when the blue light rays from the blue micro LED 115 shine on the respective quantum dots, the respective quantum dot emission is in a defined Light in the frequency range. In some embodiments, when the rays of blue light from the blue micro LED 115 strike the quantum dots of the quantum dot layer 150, isotropic re-emission of red or green light occurs.

Various methods of manufacturing a color conversion element identified as the quantum dot layer 150 may be used, and thus the quantum dot layer 150 may exhibit different compositions in different embodiments. As one example, multiple quantum dots may be mixed in a polymer suspension (e.g., by spray deposition, or slot die coating) across a large sheet. Next, the base substrate 135 is cut or single cut into pieces matching the size of the dark area of the reflective structure 136. Such a dark area may be, for example, a 50 × 60 mm area in the case of a 65-inch display with 384 areas. Based on the disclosure provided herein, those skilled in the art will recognize a number of dark region sizes that can be used with respect to different embodiments.

As shown in this embodiment, the cutting base substrate includes a bevel cut glass of the base substrate 135, and when attached to the light emitting structure 121, a beveled pyramid is achieved, thereby generating a triangle-shaped division between the respective portions of the base substrate 135器 140。 140. When the blue rays from the blue micro LED shine on the quantum dots of the quantum dot layer 150, the resulting heavy emission is isotropic, however, the reflector redirects the light toward the LCD panel in the desired direction. This means that all light can escape directly back through the light emitting structure 121. In order to avoid significant light leakage into adjacent regions that would cause unwanted crosstalk, the base substrate 135 is formed in the above-mentioned beveled pyramid with the intervening region divider 140. When the re-emitted light traveling at a large angle that is almost parallel to the converter contacts the angled side wall of the truncated pyramid, the light is directed back toward the light emitting structure 121 instead of advancing onto the adjacent area. Since specific light leakage between adjacent regions may be desirable, light may be directed into the adjacent region as it passes through the transparent layer 110, but before traversing an excessive portion of the transparent layer 110, its scattering surface 105 Promote injection.

In the depicted case, after the quantum dot layer 150 is formed on the base substrate 135, the base substrate is cut. In other cases (not shown), the quantum dot layer 150 is cut before the base substrate 135 is formed. Such pre-cutting provides an opportunity to extend the quantum dot layer 150 onto the sidewall of the base substrate exposed by the cutting process (ie, the quantum dot layer 150 separates the base substrate 135 from the intervening region divider 140). The cut sidewalls that extend the quantum dot layer 150 to the base layer 135 may be desirable, where significant blue light emission from the blue micro LED 115 is expected to illuminate the sidewalls of the base substrate 135.

The metal layer 155 functions as a reflective layer and also serves to seal the quantum dots of the quantum dot layer 150. The metal layer 155 is formed after the base substrate 135 is cut, and thus the metal layer 155 extends to cover the cut sidewalls of the base substrate 135. When the base substrate 135 is cut after the quantum dot layer 150 is formed, the metal layer 155 will be directly placed on the sidewall of the base substrate 135. Alternatively, when the base substrate 135 is cut before the quantum dot layer 150 is formed, the metal layer 155 will be disposed above the quantum dot layer extending above the sidewall of the base substrate 135. The metal layer 155 may be formed of any metal that is reflective and also capable of transferring heat. In a specific embodiment, the metal layer 155 is a sputtered aluminum layer. Since the quantum dots of the quantum dot layer 150 are used in the reflection and the blue light rays emitted from the blue micro LED 115 are intended to be reflected back toward the light emitting structure 121, the exposed side of the metal layer 155 is accessible. A heat sink (not shown) may be adhered to the metal layer 155 to cool the quantum dots. This cooling allows the quantum dots to be more difficult to pump than possible situations without cooling capability, and thus an increase in brightness can be achieved.

As suggested above, in some cases, the base substrate 135 is made of glass. Based on the disclosure provided herein, those skilled in the art will recognize a variety of glass compositions for base substrates that can be used with respect to different embodiments.

In some embodiments, the base substrate 135 may have a thickness of less than or equal to about 3 mm, for example, from about 0.1 mm to about 2.5 mm, from about 0.3 mm to about 2 mm, from about 0.5 mm to about 1.5 mm, or from about 0.7. The glass is formed from a thickness ranging from mm to about 1 mm in all ranges and subranges therebetween. Base substrate 135 may include any material known in the art for use in display devices, including aluminosilicate, alkaline aluminosilicate, borosilicate, basic borosilicate, aluminum borosilicate Salt, alkaline aluminoborosilicate, soda lime or other suitable glass. Non-limiting examples of glass suitable for use as a light guide of the glass include, for example, commercially available from Corning Incorporated's EAGLE ^{XG ®, Lotus ™, Willow ®} , Iris TM , and Gorilla ^® glass.

Some non-limiting glass compositions may include SiO ₂ between about 50 mol% and about 90 mol%, Al ₂ O ₃ between 0 mol% and about 20 mol%, between B ₂ O ₃ between 0 mol% and about 20 mol%, P ₂ O ₅ between 0 mol% and about 20 mol%, and between 0 mol% and about 25 mol R _x O between%, where R is Li, Na, K, Rb, Cs and x is 2 or is Zn, Mg, Ca, Sr or Ba and x is any one or more of x. In some embodiments, R _x O-Al ₂ O ₃ >0; 0 <R _x O-Al ₂ O ₃ <15; x = 2 and R ₂ O-Al ₂ O ₃ <15; R ₂ O-Al ₂ O ₃ <2; x = 2 and R ₂ O-Al ₂ O ₃ -MgO>-15; 0 <(R _x O-Al ₂ O ₃ ) <25, -11 <(R ₂ O-Al ₂ O ₃ ) <11 and -15 <(R ₂ O-Al ₂ O ₃ -MgO) <11; and / or -1 <(R ₂ O-Al ₂ O ₃ ) <2 and -6 <(R ₂ O -Al ₂ O ₃ -MgO) <1. In some embodiments, the glass contains less than 1 ppm of each of Co, Ni, and Cr. In some embodiments, the concentration of Fe is <about 50 ppm, <about 20 ppm, or <about 10 ppm. In other embodiments, Fe + 30Cr + 35Ni <about 60 ppm, Fe + 30Cr + 35Ni <about 40 ppm, Fe + 30Cr + 35Ni <about 20 ppm, or Fe + 30Cr + 35Ni <about 10 ppm. In other embodiments, the glass comprises SiO ₂ between about 60 mol% and about 80 mol%, Al ₂ O ₃ between 0 mol and 15 mol%, and 0 mol. % To about 12 mol% of B ₂ O ₃ , and about 0.1 mol% to about 15 mol% R ₂ O and about 0.1 mol% to about 15 mol% RO, where R is Li, Na, K, Rb, Cs, and x is 2, or is Zn, Mg, Ca, Sr, or Ba and x is any one or more of 1.

In other embodiments, the glass composition may include SiO ₂ between about 65.79 mole% to about 78.17 mole%, Al ₂ O ₃ between about 2.94 mole% to about 12.12 mole%. , B between about 0 mole% to about 11.16 mole percent ₂ O _3, between about 0 mole% to about 2.06 mole percent Li ₂ O, between about 3.52 mole% to Na between about 13.25 mole% of the ₂ O, K between about 0 mole% to about 4.83 mole percent ₂ O, ZnO ranging between about 0 mole% to about 3.01% by mole, MgO between about 0 mole% and about 8.72 mole%, CaO between about 0 mole% and about 4.24 mole%, and between about 0 mole% and about 6.17 mole% among SrO, BaO range between about 0 mole% to about 4.3% by mole, and SnO range between about 0.07 to about 0.11 mole% to ₂ mole%.

In an additional embodiment, the base substrate 135 may include glass having an R _x O / Al ₂ O ₃ ratio between 0.95 and 3.23, wherein R is any one or more of Li, Na, K, Rb, and Cs者 和 x 系 2。 And x is 2. In a further embodiment, the glass may include an R _x O / Al ₂ O ₃ ratio between 1.18 and 5.68, where R is Li, Na, K, Rb, Cs and x is 2, or Zn, Mg, Ca, Sr, or Ba and x is any one or more of 1. In still further embodiments, the glass may include R _x O-Al ₂ O ₃ -MgO between -4.25 and 4.0, wherein R is any one or more of Li, Na, K, Rb, Cs and x 系 2. In still further embodiments, the glass may include SiO ₂ between about 66 mol% to about 78 mol%, Al ₂ O ₃ between about 4 mol% to about 11 mol%, B ₂ O ₃ between about 4 mol% and about 11 mol%, Li ₂ O between about 0 mol% and about 2 mol%, between about 4 mol% and about Na ₂ O between 12 mol%, K ₂ O between about 0 mol% to about 2 mol%, ZnO between about 0 mol% to about 2 mol%, mediator MgO between about 0 mole% and about 5 mole%, CaO between about 0 mole% and about 2 mole%, between about 0 mole% and about 5 mole% of SrO, BaO range between about 0 mole% to about 2 mole percent, and SnO range between about 0 mole% to about 2 mole% of _2.

In additional embodiments, the glass substrate may include a glass material including SiO ₂ between about 72 mol% and about 80 mol%, between about 3 mol% and about 7 mol%. Between Al ₂ O ₃ , B ₂ O ₃ between about 0 mol% to about 2 mol%, Li ₂ O between about 0 mol% to about 2 mol%, and at between about 6 mole% to about 15 mole% of Na ₂ O, K range between about 0 mole% to about 2 mole percent ₂ O, between about 0% to about 2 mole Mo Mol of ZnO, MgO of about 2 mol% to about 10 mol%, CaO of about 0 mol% to about 2 mol%, of about 0 mol% between about 2 mole percent SrO, BaO range between about 0 mole% to about 2 mole percent, and SnO range between about 0 mole% to about 2 mole% of _2. In particular embodiments, the glass may include SiO ₂ between about 60 mol% to about 80 mol%, Al ₂ O ₃ between about 0 mol% to about 15 mol%, B ₂ O ₃ between about 0 mol% to about 15 mol%, and R _x O from about 2 mol% to about 50 mol%, where R is Li, Na, K, Rb, Cs and x is 2, or is Zn, Mg, Ca, Sr, or Ba and x is any one or more of 1, and wherein Fe + 30Cr + 35Ni <about 60 ppm.

In some embodiments, the base substrate 135 may include less than 0.05 such as in a range from about -0.005 to about 0.05 or in a range from about 0.005 to about 0.015 (e.g., about -0.005, -0.004, -0.003,- 0.002, -0.001, 0, 0.001, 0.002, 0.003, 0.004, 0.005, 0.006, 0.007, 0.008, 0.009, 0.010, 0.011, 0.012, 0.013, 0.014, 0.015, 0.02, 0.03, 0.04, or 0.05) y. In other embodiments, the glass substrate may include a color shift of less than 0.008. According to some embodiments, the glass substrate may have less than about 4 dB / m for wavelengths in a range from about 420 nm to 750 nm, such as less than about 3 dB / m, less than about 2 dB / m, and less than about 1 dB / m , Less than about 0.5 dB / m, less than about 0.2 dB / m, or even less, for example, light attenuation α _{1 in} the range from about 0.2 dB / m to about 4 dB / m (for example, due to absorption and / or Scattering loss).

Attenuation can be characterized as light transmission through a transparent substrate measuring input source of length L Source spectrum Normalize this transmission. In dB / m, attenuation is determined by Gives, where L is the length in meters and and Measured in radiometric units.

In some embodiments, the base substrate 135 may include glass that is chemically strengthened, such as by ion exchange. During the ion exchange process, ions within or near the surface of the glass sheet within the glass sheet can be exchanged to larger metal ions, such as from a salt bath. The incorporation of larger ions into the glass can strengthen the sheet by generating compressive stress in the near surface area. Corresponding tensile stress can be induced in the central region of the glass sheet to balance compressive stress.

Ion exchange can be performed, for example, by immersing the glass in a molten salt bath for a predetermined period of time. Exemplary salt bath include, without limitation, _{KNO 3, LiNO 3, NaNO 3} , RbNO 3 , and combinations thereof. The temperature and processing time of the molten salt bath can be changed. Those skilled in the art have the ability to determine time and temperature based on the intended application. By way of non-limiting example, the temperature of the molten salt bath may be in a range from about 400 ° C to about 800 ° C, such as from about 400 ° C to about 500 ° C, and the predetermined period of time may be from about 4 to about 24 hours, such as from In the range of about 4 hours to about 10 hours, although other temperature and time combinations are expected. By way of non-limiting example, the glass can be submerged in a KNO ₃ bath at about 450 ° C. for about 6 hours to obtain a K-rich layer that provides surface compressive stress.

The reflective structure 136 is attached to the light emitting structure 121 using an optically transparent adhesive 130 between the surface of the base substrate 135 and the transparent conductive layer 125. The optically transparent adhesive 130 may be made of any adhesive material capable of holding the reflective structure 136 to the light emitting structure 121. In some embodiments, the optically clear adhesive 130 is a UV-cured acrylic liquid.

Turning to FIGS. 1b to 1i, various processing steps that can be used alone or in combination to make a backlight similar to the micro LED backlight 100 according to some embodiments are shown. The processes of FIGS. 1b to 1d are used to manufacture the reflective structure 136, and the processes of FIGS. 1e to 1i are used to manufacture the light emitting structure 121.

Turning to FIG. 1b, a view 160 of the base substrate 135 before cutting to form the intervening zone divider 140 is shown. The quantum dot layer 150 is formed over the surface of the base substrate 135 using any process known in the art for forming a quantum dot layer. Turning to FIG. 1C, the glass material of the base substrate 135 is beveled to produce an inverted pyramid shape having an intervening zone divider 140. Turning to FIG. 1d, a metal or other thermally conductive material is deposited over the remaining portion of the quantum dot layer 150 and the side exposed by cutting the base substrate 135.

Turning to FIG. 1e, a transparent layer 110 is provided, and conductive traces (not shown) are formed on the surface of the transparent layer 110. Turning to FIG. 1f, the blue micro LED 115 is attached to the transparent layer 110 by, for example, soldering to a conductive trace. Turning to Fig. 1g, a planarization layer 120 is formed between the blue micro LEDs 115 so that the surface of each of the micro LEDs 115 remains exposed. Turning to FIG. 1h, a transparent conductive layer 125 is formed over the planarization layer 120. Turning to FIG. 1i, the scattering surface 105 is formed in and / or on the surface of the transparent layer 110. At this time, the reflective structure 136 is adhered to the light emitting structure 121 using a transparent adhesive, thereby manufacturing the micro LED backlight 100.

Turning to FIG. 1j, a display 190 including a micro LED backlight 100 is shown in accordance with one or more embodiments. As shown, the micro LED backlight 100 directs component red, green, and blue light rays 160 toward the liquid crystal display (LCD) panel 180 (ie, represented as lines 160a, 160b, 160c, 160d, 160e, 160f, 160g, 160h, 160i 160j), each of which represents one of red, green, or blue light rays depending on the type of the quantum dot of the reflected light in the quantum dot layer 150). The LCD display panel 180 can be any device known in the art that can selectively gate and / or color filter light received at respective pixel locations. Based on the disclosure provided herein, those skilled in the art will recognize a variety of LCD panels that can be used with respect to different embodiments.

As shown, power is applied to the micro LED backlight 100, causing the blue micro LED 115 to emit blue light rays (represented as lines 165a, 165b, 165c, 166a, 166b, 166c, 167a, 167b, 167c) toward the reflective structure 136, The blue light rays are reflected from the quantum dots in the quantum dot layer 150. Depending on the type of quantum dot in the quantum dot layer 150 that reflects the respective blue light rays, the red or green light rays 160 are reflected or the blue light rays are scattered without color conversion. The continuous blue light rays reflected from the quantum dot layer 150 including a large number of quantum dots for each of the respective red, green, and blue colors generate continuous red, green, and blue light reflected back toward the light emitting structure 121. Ray 160. The red, green, and blue light rays 160 pass through the transparent layers of the light emitting structure 121 and travel on the LCD panel 180. Due to the diffusive ability of the transparent layer 110 and other layers, the shadows caused by the blue micro LED 115 and other opaque elements in the transmission path of the red, green and blue light rays 160 are basically eliminated, thereby producing red, green and The blue component light is distributed substantially uniformly across the surface of the LCD panel 180. The LCD panel 180 may then be operated as is known in the art to pass light of a selected color at each pixel location on the display.

Turning to Figure 2a, another micro LED backlight 200 is shown according to various embodiments. Compared with the micro LED backlight 100 discussed above with respect to FIGS. 1 a to 1 b, a micro LED backlight 200 without a partition is formed. The micro LED backlight 200 includes a light emitting structure 221 and a reflective structure 236.

The light emitting structure 221 includes a scattering surface 205 disposed above the transparent layer 210. In some embodiments, the transparent layer 210 is formed of translucent alumina. This type of translucent alumina serves as a circuit board that connects blue micro LEDs 215 (denoted as 215a, 215b, 215c) to their respective electronic power sources and / or controls. Translucent alumina also provides relatively high thermal conductivity (about 40 W / m-k compared to nearly 1 W / m-k for glass). A material having such a high thermal conductivity is used to provide a mechanism for dissipating the heat generated by the blue micro LED 215 laterally facing the edge of the light emitting structure 221, wherein a heat sink (not shown) can be installed outside the observation hole. In addition, the translucency of the translucent alumina helps to achieve greater uniformity of the RGB light reflected back by the reflective structure 236 acting as a volume diffuser. The scattering surface 205 further enhances the diffusion caused by the transparent layer 210, and thus the scattering surface 205 may be any structured or patterned surface of the transparent layer 210 and / or a material formed on the surface of the transparent layer 210.

The blue micro LED 215 (ie, 215a, 215b, 215c) is connected to the transparent layer 210 using conductive traces (not shown). In some cases, the conductive trace is a metal trace to which the blue micro LED 215 is soldered. In each case, the conductive traces are not straight, but can be zigzag or herringbone patterns in order to reduce artifacts and unwanted moire patterns. The blue micro LED 215 may be any type of blue light emitting diode known in the art. Based on the disclosure provided herein, those skilled in the art will recognize multiple blue light emitting diodes that can be used with respect to different embodiments. The blue micro LED 215 is installed such that the light it emits during operation is directed away from the transparent layer 210. In some embodiments, the blue micro LED 215 is a lateral device, wherein the contact with the p-type material and the n-type material is on the same side of each LED device. In other embodiments, the blue micro LED 215 is a vertical device, wherein the contact with the p-type material is on one side of the device and the contact with the n-type material is on the other side of the device. For the purpose of this discussion, the vertical device described above is used.

Where such a vertical device is used, the side walls of the respective micro LED 215 remain open to allow contact with both the top and bottom of the respective device to be formed. In order to avoid a short circuit between each of the blue micro LEDs 215, a planarization layer 220 is formed between the respective blue micro LEDs 215 so that it encapsulates the sides of the blue micro LEDs 215 while making the blue The top area of each of the micro LEDs 215 remains exposed. The planarization layer 220 is formed of any non-conductive transparent material suitable for forming a layer surrounding the blue micro LED 215. In some embodiments, the planarization layer 220 is formed of a polymer. A transparent conductive layer 225 is formed over the planarization layer 220 so that a conductive connection is created between the transparent conductive layer 225 and each of the blue micro LEDs 215. Therefore, it is assumed that the blue micro LED 215 is the above-mentioned vertical device, and the transparent layer 210 is used to form an electrical contact with one side of each of the blue micro LEDs 215 and the transparent conductive layer 225 is used to form the blue micro LED 215. Electrical contact on the other side of each of them. The transparent conductive layer 225 may be made of any material that is substantially transparent and also conductive. In some embodiments, the transparent conductive layer 225 is formed of ITO.

The reflective structure 236 includes a reflective layer 251 disposed above the base substrate 235. The reflective layer 251 includes a quantum dot layer 250 disposed above the base substrate 235 and a metal layer 255 disposed above the quantum dot layer 250. The quantum dot layer 250 includes a plurality of quantum dots operated to reflect light emitted from the blue micro LED 215. In some cases, the size and shape of the quantum dots in the quantum dot layer 250 are designed so that when the blue light rays from the blue micro LED 215 strike the respective quantum dots, the respective quantum dot emission is at a defined Light in the frequency range. In some embodiments, when the blue light rays from the blue micro LED 215 strike the quantum dots of the quantum dot layer 250, isotropic re-emission of red, green, or blue light occurs. It should be noted that quantum dots do not convert blue light. More precisely, scattering particles such as TiO2 are included in polymers in which quantum dots are suspended. Some of the incoming blue light is scattered and does not undergo color conversion by quantum dots. In this way, RGB is generated.

Various methods of manufacturing a color conversion element identified as the quantum dot layer 250 may be used, and thus the quantum dot layer 250 may exhibit different compositions in different embodiments. As an example, multiple quantum dots may be mixed in a polymer suspension (e.g., by spray deposition, or slot die coating) across a large sheet. In this embodiment, the base substrate 235 is not cut or cut into pieces that match the size of the dark area of the reflective structure 236, but because the base substrate 235 is planar, coating on the lower side is performed to generate dark areas . Such a dark area may be, for example, a 50 × 60 mm area in the case of a 65-inch display with 384 areas. Based on the disclosure provided herein, those skilled in the art will recognize a number of dark region sizes that can be used with respect to different embodiments. The cut sidewalls that extend the quantum dot layer 250 to the base layer 235 may be desirable, where significant blue light emission from the blue micro LED 215 is expected to illuminate the sidewalls of the base substrate 235. As another example, a color conversion element can be formed by coating a metal layer (ie, layer 255) with quantum dots and then sealing the quantum dot metal layer with sputtering glass, oxide, or other films to generate a quantum Point layer 250. Then, the combination of the quantum dot layer 250 and the metal layer 255 can be adhered to the base substrate 235 using a transparent adhesive. As yet another example, the quantum dots are first deposited on the lower side of the base substrate 235, and then a metal dot is sputtered on the same lower side of the base substrate 235 to generate a combination of the quantum dot layer 250 and the metal layer 255, thereby sealing them Quantum dots. This type of process does not require the above-mentioned bonding process.

The metal layer 255 may be formed of any metal that is reflective and also capable of transferring heat. In a specific embodiment, the metal layer 255 is a sputtered aluminum layer. Since the quantum dots of the quantum dot layer 250 are used in the reflection and the blue light rays emitted from the blue micro LED 215 are intended to be reflected back toward the light emitting structure 221, the exposed side of the metal layer 255 is accessible. A heat sink (not shown) may be adhered to the metal layer 255 to cool the quantum dots. This cooling allows the quantum dots to be more difficult to pump than possible situations without cooling capability, and thus an increase in brightness can be achieved.

In some embodiments, the base substrate 235 is made of glass. Based on the disclosure provided herein, those skilled in the art will recognize a variety of glass compositions for base substrates that can be used with respect to different embodiments. Some examples of such glass compositions are discussed above with respect to Figure 1a. The reflective structure 236 is attached to the light emitting structure 221 using an optically transparent adhesive 230 between the surface of the base substrate 235 and the transparent conductive layer 225. The optically transparent adhesive 230 may be made of any adhesive material capable of holding the reflective structure 236 to the light emitting structure 221. In some embodiments, the optically clear adhesive 230 is a UV-cured acrylic liquid.

Turning to FIG. 2b, a display 290 including a micro LED backlight 200 is shown in accordance with one or more embodiments. As shown, the micro LED backlight 200 directs component red, green, and blue light rays 260 toward the liquid crystal display (LCD) panel 280 (that is, represented as lines 260a, 260b, 260c, 260d, 260e, 260f, 260g, 260h, 260i 260j), each of which represents one of red, green, or blue light rays depending on the type of quantum dots of the reflected light in the quantum dot layer 250). The LCD display panel 280 may be any device known in the art that can selectively gate and / or color filter light received at respective pixel locations. Based on the disclosure provided herein, those skilled in the art will recognize a variety of LCD panels that can be used with respect to different embodiments.

As shown, power is applied to the micro LED backlight 200, causing the blue micro LED 215 to emit blue light rays (represented as lines 265a, 265b, 265c, 266a, 266b, 266c, 267a, 267b, 267c) toward the reflective structure 236, The blue light rays are reflected from the quantum dots in the quantum dot layer 250. Depending on the type of quantum dot in the quantum dot layer 250 that reflects respective blue light rays, red, green or blue light rays 260 are reflected. The continuous blue light rays reflected from the quantum dot layer 250 including a large number of quantum dots for each of the respective red, green, and blue colors generate continuous red, green, and blue light reflected back toward the light emitting structure 221 Ray 260. The red, green, and blue light rays 260 pass through the transparent layers of the light emitting structure 221 and travel on the LCD panel 280. Due to the diffusion capability of the transparent layer 210 and other layers, the shadows caused by the blue micro LED 215 and other opaque elements in the transmission path of the red, green, and blue light rays 260 are basically eliminated, thereby producing red, green and The blue component light is distributed substantially uniformly across the surface of the LCD panel 280. The LCD panel 280 may then operate as known in the art to pass light of a selected color at each pixel location on the display.

Turning to FIG. 3a, there is shown another micro LED backlight 300 including a blue micro LED 315, red and green quantum dots incorporated in a quantum dot layer 350, and a volume diffuser 305 according to various embodiments. The micro LED backlight 300 includes a light emitting structure 321 and a reflective structure 336 that are mechanically spaced apart from the gap 320. The gap 320 may be filled with any gas or mixture thereof capable of allowing light to pass through.

The light emitting structure 321 includes a volume diffuser 305 disposed above the transparent layer 310. In some embodiments, the transparent layer 310 is formed of translucent alumina. In other embodiments, the transparent layer is formed of glass. Where translucent alumina is used, the translucent alumina acts as a circuit board that connects the blue micro LED 315 (denoted as 315a, 315b, 315c) to its respective electronic power source and / or control. Translucent alumina also provides relatively high thermal conductivity (about 40 W / m-k compared to nearly 1 W / m-k for glass). A material having such a high thermal conductivity is used to provide a mechanism for dissipating the heat generated by the blue micro LED 315 laterally facing the edge of the light emitting structure 321, wherein a heat sink (not shown) can be installed outside the observation hole. It should be noted that the translucency of translucent alumina helps to achieve greater uniformity of the RGB light reflected back by the reflective structure 336 acting as a volume diffuser, however, such a volume diffuser is not required in this embodiment This is because the volume diffuser 305 performs the diffusion function. The volume diffuser 305 may be formed of any translucent material for diffusing light passing therethrough. In some embodiments, the volume diffuser 305 is made of a polymer, such as PMMA or polycarbonate, having microscopic inclusions of scattered light therein. In some cases, the inclusions are zirconia, alumina, and / or titania. Based on the disclosure provided herein, those skilled in the art will recognize a variety of volume diffusers and materials that can be used with respect to different embodiments.

The blue micro LED 315 (ie, 315a, 315b, 315c) is connected to the transparent layer 310 using conductive traces (not shown). In some cases, the conductive trace is a metal trace to which the blue micro LED 315 is soldered. In each case, the conductive traces are not straight, but can be zigzag or herringbone patterns in order to reduce artifacts and unwanted moire patterns. The blue micro LED 315 may be any type of blue light emitting diode known in the art. Based on the disclosure provided herein, those skilled in the art will recognize multiple blue light emitting diodes that can be used with respect to different embodiments. The blue micro LED 315 is installed such that the light it emits during operation is directed away from the transparent layer 310. In some embodiments, the blue micro LED 315 is a lateral device, wherein the contact with the p-type material and the n-type material is on the same side of each LED device. In other embodiments, the blue micro LED 315 is a vertical device, wherein the contact with the p-type material is on one side of the device and the contact with the n-type material is on the other side of the device. In either case, an electrical connection is made to both the p-type material and the n-type material of the blue micro LED 315.

The reflective structure 336 includes a reflective layer 351 disposed above the base substrate 335. The reflective layer 351 includes a quantum dot layer 350 disposed above the base substrate 335 and a metal layer 355 disposed above the quantum dot layer 350. The quantum dot layer 350 includes a plurality of quantum dots operated to reflect light emitted from the blue micro LED 315. In some cases, the size and shape of the quantum dots in the quantum dot layer 350 are designed so that when the blue light rays from the blue micro LED 315 shine on the respective quantum dots, the respective quantum dot emission is in a defined Light in the frequency range. In some embodiments, when rays of blue light from the blue micro LED 315 strike the quantum dots of the quantum dot layer 350, isotropic re-emission of red, green, or blue light occurs.

Various methods of manufacturing a color conversion element identified as the quantum dot layer 350 may be used, and thus the quantum dot layer 350 may exhibit different compositions in different embodiments. As an example, multiple quantum dots may be mixed in a polymer suspension (e.g., by spray deposition, or slot die coating) across a large sheet. In some cases, the lower side of the base substrate 335 is coated with quantum dots, and then sealed by sputtering metal on the lower side of the base substrate 335 to seal the quantum dots, thereby generating a combination of the metal layer 355 and the quantum dot layer 350. In addition to sealing the quantum dots, the metal layer 355 also functions as a reflective layer. The metal layer 355 may be formed of any metal that is reflective and also capable of transferring heat. In a specific embodiment, the metal layer 355 is a sputtered aluminum layer. Since the quantum dots of the quantum dot layer 350 are used in the reflection and the blue light rays emitted from the blue micro LED 315 are intended to be reflected back toward the light emitting structure 321, the exposed side of the metal layer 355 is accessible. A heat sink (not shown) may be adhered to the metal layer 355 to cool the quantum dots. This cooling allows the quantum dots to be more difficult to pump than possible situations without cooling capability, and thus an increase in brightness can be achieved.

In some embodiments, the base substrate 335 is made of glass. Based on the disclosure provided herein, those skilled in the art will recognize a variety of glass compositions for base substrates that can be used with respect to different embodiments. Some examples of such glass compositions are discussed above with respect to Figure 1a. In addition, the reflective structure 336 is mechanically suspended at a defined distance from the light emitting structure 321. This physical separation between the reflective structure 336 and the light emitting structure 321 can be generated using a structural element (not shown) facing the edge of the micro LED backlight 300 so that it is outside the viewing hole.

Turning to Figure 3b, a display 390 including a micro LED backlight 300 is shown in accordance with one or more embodiments. As shown, the micro LED backlight 300 directs component red, green, and blue light rays 360 toward the liquid crystal display (LCD) panel 380 (ie, represented as lines 360a, 360b, 360c, 360d, 360e, 360f, 360g, 360h, 360i 360j), each of which represents one of red, green, or blue light rays depending on the type of quantum dot of the reflected light in the quantum dot layer 350). In the case of using a blue micro LED, the quantum dot layer 350 will have both red quantum dots and green quantum dots plus scattering particles. The wavelength of the re-emission (or scattering) will depend on what blue light is introduced. The LCD display panel 380 may be any device known in the art that is capable of selectively gating and / or color filtering light received at respective pixel locations. Based on the disclosure provided herein, those skilled in the art will recognize a variety of LCD panels that can be used with respect to different embodiments.

As shown, power is applied to the micro LED backlight 300, causing the blue micro LED 315 to emit blue light rays (represented as lines 365a, 365b, 365c, 366a, 366b, 366c, 367a, 367b, 367c) toward the reflective structure 336, The blue light rays are reflected from the quantum dots in the quantum dot layer 350. Depending on the type of quantum dot in the quantum dot layer 350 that reflects respective blue light rays, red, green or blue light rays 360 are reflected. The continuous blue light rays reflected from the quantum dot layer 350 including a large number of quantum dots for each of the respective red, green, and blue colors generate continuous red, green, and blue light reflected back toward the light emitting structure 321. Ray 360. The red, green, and blue light rays 360 pass through each transparent layer of the light emitting structure 321 and travel on the LCD panel 380. Due to the diffusive capacity of the volume diffuser 305, the shadows caused by the blue micro LED 315 and other opaque elements in the transmission path of the red, green and blue light rays 360 are basically eliminated, thereby producing red, green and blue The color component light is distributed substantially uniformly across the surface of the LCD panel 380. The LCD panel 380 may then operate as known in the art to pass light of a selected color at each pixel location on the display.

Turning to Figure 4a, another micro LED backlight 400 is similar to the micro LED backlight 300 in Figures 3a to 3b above, except that a quantum dot enhanced film (QDEF) 435 is used in the micro LED backlight 400 instead of quantum The dot layer 350 and the base substrate 335 of the micro LED backlight 300. The micro LED backlight 400 includes a previously described light emitting structure 321 and a reflective structure 436 that are mechanically spaced apart by a gap 420. The gap 420 may be filled with any gas or mixture thereof capable of allowing light to pass through.

The reflective structure 436 includes a metal layer 455 disposed over the QDEF 435. As an example, QDEF 435 is commercially available from 3M ^tm and is described by John Van Derlofsek et al. At http://multimedia.3m.com/mws/media/985375O/3mtm-quantum-dot-enhancement-film-qdef- QDEF in "3M ^TM Quantum Dot Enhancement Film (QDEF)" (undated) available at white-paper.pdf. The entire contents of the above references are incorporated herein by reference for all purposes. It should be noted that another material having properties similar to those of the 3M ^tm product described above may be used.

In a particular embodiment, the metal layer 455 is a sputtered aluminum layer. Since QDEF 435 is used in reflecting the blue light rays emitted from the blue micro LED 315 back toward the light emitting structure 321, the exposed side of the metal layer 455 is accessible. A heat sink (not shown) may be adhered to the metal layer 455 to cool the quantum dots. This cooling allows the quantum dots to be more difficult to pump than possible situations without cooling capability, and thus an increase in brightness can be achieved. Similar to that discussed above with respect to Figure 3a, the reflective structure 436 is mechanically suspended at a defined distance from the light emitting structure 321. This physical separation between the reflective structure 436 and the light emitting structure 321 can be generated using a structural element (not shown) facing the edge of the micro LED backlight 400 so that it is outside the viewing hole.

Turning to Figure 4b, a display 490 including a micro LED backlight 400 is shown in accordance with one or more embodiments. As shown, the micro LED backlight 400 directs component red, green, and blue light rays 460 toward the liquid crystal display (LCD) panel 480 (ie, represented as lines 460a, 460b, 460c, 460d, 460e, 460f, 460g, 460h, 460i 460j), each of which represents one of red, green, or blue light rays depending on the type of quantum dots of the reflected light in the quantum dot layer 450). The LCD display panel 480 may be any device known in the art that can selectively gate and / or color filter light received at respective pixel locations. Based on the disclosure provided herein, those skilled in the art will recognize a variety of LCD panels that can be used with respect to different embodiments.

As shown, power is applied to the micro LED backlight 400, causing the blue micro LED 415 to emit blue light rays (represented as lines 465a, 465b, 465c, 466a, 466b, 466c, 467a, 467b, 467c) toward the reflective structure 436, The blue light rays are reflected from the quantum dots in the quantum dot layer 450. Depending on the type of quantum dot in the quantum dot layer 450 that reflects respective blue light rays, red, green or blue light rays 460 are reflected. The continuous blue light rays reflected from the quantum dot layer 450 including a large number of quantum dots for each of the respective red, green, and blue colors generate continuous red, green, and blue light reflected back toward the light emitting structure 421 Ray 460. The red, green, and blue light rays 460 pass through each transparent layer of the light emitting structure 321 and travel on the LCD panel 480. Due to the diffusive ability of the volume diffuser 305, the shadows caused by the blue micro LED 315 and other opaque elements in the transmission path of the red, green and blue light rays 460 are basically eliminated, thereby producing red, green and blue The color component light is distributed substantially uniformly across the surface of the LCD panel 480. The LCD panel 480 may then operate as known in the art to pass light of a selected color at each pixel location on the display.

Turning to Fig. 5a, there is shown another micro LED backlight 500 of white micro LED 515 (denoted as 515a, 515b, 515c) using phosphor conversion according to other embodiments. The micro LED backlight 500 includes a light emitting structure 521 and a reflector layer 555. The reflector layer may be formed of any material capable of reflecting light emitted from the white micro LED 515 converted from the phosphor. In addition, in those embodiments where the reflector layer 555 is a separate layer without other structural support, the material used to form the reflector layer 555 should be strong enough to be self-supporting. In some embodiments, the reflector layer 555 is made of metal. In a particular embodiment, the reflector layer 555 is made of aluminum. The light emitting structure 521 is mechanically spaced from the reflector layer 555 by a gap 520. The gap 520 may be filled with any gas or mixture thereof capable of allowing light to pass through.

The light emitting structure 521 includes a volume diffuser 505 disposed above the transparent layer 510. In some embodiments, the transparent layer 510 is formed of translucent alumina. In other embodiments, the transparent layer is formed of glass. Where translucent alumina is used, it acts as a circuit board that connects the phosphor-converted white micro LED 515 to its respective electronic power source and / or control. Translucent alumina also provides relatively high thermal conductivity (about 40 W / m-k compared to nearly 1 W / m-k for glass). A material having such a high thermal conductivity is used to provide a mechanism for dissipating the heat generated by the blue micro LED 515 laterally facing the edge of the light emitting structure 521, wherein a heat sink (not shown) can be installed outside the observation hole. It should be noted that the translucency of translucent alumina helps to achieve greater uniformity of RGB light reflected back by the reflective structure 536 acting as a volume diffuser, however, such a volume diffuser is not required in this embodiment This is because the volume diffuser 505 performs the diffusion function. The volume diffuser 505 may be formed of any translucent material for diffusing light passing therethrough. In some embodiments, the volume diffuser 505 is made of a polymer such as PMMA or polycarbonate with microscopic inclusions of scattered light therein. In some cases, the inclusions are zirconia, alumina, and / or titania. Based on the disclosure provided herein, those skilled in the art will recognize a variety of volume diffusers and materials that can be used with respect to different embodiments.

The phosphor-converted white micro LED 515 (ie, 515a, 515b, 515c) is connected to the transparent layer 510 using conductive traces (not shown). In some cases, the conductive trace is a metal trace to which the phosphor-converted white micro LED 515 is soldered. In each case, the conductive traces are not straight, but can be zigzag or herringbone patterns in order to reduce artifacts and unwanted moire patterns. The phosphor-converted white micro LED 515 may be any type of white light emitting diode known in the art. Based on the disclosure provided herein, those skilled in the art will recognize multiple white light emitting diodes that can be used with respect to different embodiments. The phosphor-converted white micro LED 515 is installed such that the light it emits during operation is directed away from the transparent layer 510. In some embodiments, the phosphor-converted white micro LED 515 is a lateral device, wherein the contact with the p-type material and the n-type material is on the same side of each LED device. In other embodiments, the phosphor-converted white micro LED 515 is a vertical device, wherein the contact with the p-type material is on one side of the device and the contact with the n-type material is on the other side of the device. In either case, an electrical connection is generated to both the p-type material and the n-type material of the white micro LED 515 converted to the phosphor.

Similar to that discussed above with respect to FIG. 5a, the reflector layer 555 is mechanically suspended at a defined distance from the light emitting structure 521. This physical separation between the reflector layer 555 and the light emitting structure 521 can be generated using a structural element (not shown) facing the edge of the micro LED backlight 500 so that it is outside the viewing hole.

Turning to Figure 5b, a display 590 including a micro LED backlight 500 is shown in accordance with one or more embodiments. As shown, the micro-LED backlight 500 directs the white light rays 560 (that is, represented as lines 560a, 560b, 560c, 560d, 560e, 560f, 560g, 560h) reflected from the reflector layer 555 toward the liquid crystal display (LCD) panel 580. , 560i, 560j). The LCD display panel 580 can be any device known in the art that can selectively gate and / or color filter light received at respective pixel locations. Based on the disclosure provided herein, those skilled in the art will recognize a variety of LCD panels that can be used with respect to different embodiments.

As shown, the power is applied to the micro LED backlight 500, causing the phosphor-converted white micro LED 515 to emit white light rays toward the reflector layer 555 (denoted as lines 565a, 565b, 565c, 566a, 566b, 566c, 567a, 567b, 567c), in which the white light rays are reflected back toward the light emitting structure 521. The white light rays 560 pass through each transparent layer of the light emitting structure 521 and onto the LCD panel 580. Due to the diffusive capacity of the volume diffuser 505, the shadow caused by other opaque elements in the transmission path of the white micro LED 315 and white light ray 560 converted by the phosphor is basically eliminated, thereby generating light across the LCD panel 580. The surface is substantially uniformly distributed. The LCD panel 580 can then operate as known in the art to pass light of a selected color at each pixel location on the display.

Turning to FIG. 6a, there is shown another micro LED backlight 600 using RGB micro LEDs 615 (denoted as 615a, 615b, 615c) according to other embodiments. The micro LED backlight 600 includes a light emitting structure 621 and a reflector layer 655. The reflector layer may be formed of any material capable of reflecting light emitted from the RGB micro LED 615. In addition, in those embodiments where the reflector layer 655 is an independent layer without other structural support, the material used to form the reflector layer 655 should be strong enough to be self-supporting. In some embodiments, the reflector layer 655 is made of metal. In a particular embodiment, the reflector layer 655 is made of aluminum. The light emitting structure 621 is mechanically spaced from the reflector layer 655 by a gap 620. The gap 620 may be filled with any gas or mixture thereof capable of allowing light to pass through.

The light emitting structure 621 includes a volume diffuser 605 disposed above the transparent layer 610. In some embodiments, the transparent layer 610 is formed of translucent alumina. In other embodiments, the transparent layer is formed of glass. Where translucent alumina is used, it acts as a circuit board that connects the RGB microLED 615 to its respective electronic power source and / or control. Translucent alumina also provides relatively high thermal conductivity (about 40 W / m-k compared to nearly 1 W / m-k for glass). A material having such a high thermal conductivity is used to provide a mechanism for dissipating the heat generated by the blue micro LED 615 laterally facing the edge of the light emitting structure 621, wherein a heat sink (not shown) can be installed outside the observation hole. It should be noted that the translucency of translucent alumina helps achieve greater uniformity of RGB light reflected back by the reflective structure 636 acting as a volume diffuser, however, such a volume diffuser is not required in this embodiment This is because the volume diffuser 605 performs the diffusion function. The volume diffuser 605 may be formed of any translucent material for diffusing light passing therethrough. In some embodiments, the volume diffuser 605 is made of a polymer such as PMMA or polycarbonate with microscopic inclusions of scattered light therein. In some cases, the inclusions are zirconia, alumina, and / or titania. Based on the disclosure provided herein, those skilled in the art will recognize a variety of volume diffusers and materials that can be used with respect to different embodiments.

The RGB micro LEDs 615 (ie, 615a, 615b, 615c) are connected to the transparent layer 610 using conductive traces (not shown). In some cases, the conductive traces are metal traces to which the RGB micro LED 615 is soldered. In each case, the conductive traces are not straight, but can be zigzag or herringbone patterns in order to reduce artifacts and unwanted moire patterns. The RGB micro LED 615 may be any type of white light emitting diode known in the art. Based on the disclosure provided herein, those skilled in the art will recognize multiple white light emitting diodes that can be used with respect to different embodiments. The RGB micro LED 615 is installed such that the light it emits during operation is directed away from the transparent layer 610. In some embodiments, the RGB micro LED 615 is a lateral device, wherein the contact with the p-type material and the n-type material is on the same side of each LED device. In other embodiments, the RGB micro LED 615 is a vertical device, wherein the contact with the p-type material is on one side of the device and the contact with the n-type material is on the other side of the device. In either case, an electrical connection is made to both the p-type material and the n-type material of the RGB microLED 615.

Similar to that discussed above with respect to Figure 6a, the reflector layer 655 is mechanically suspended at a defined distance from the light emitting structure 621. This physical separation between the reflector layer 655 and the light emitting structure 621 can be generated using a structural element (not shown) facing the edge of the micro LED backlight 600 so that it is outside the viewing hole.

Turning to FIG. 6b, a display 690 including a micro LED backlight 600 is shown in accordance with one or more embodiments. As shown, the micro-LED backlight 600 guides the component red, green, and blue light rays light rays 660 (ie, denoted as lines 660a, 660b, 660c, 660d, 660e, 660f, 660g, 660h, 660i, 660j). The LCD display panel 680 may be any device known in the art that can selectively gate and / or color filter light received at respective pixel locations. Based on the disclosure provided herein, those skilled in the art will recognize a variety of LCD panels that can be used with respect to different embodiments.

As shown, power is applied to the micro LED backlight 600, causing the RGB micro LED 615 to emit component red, green, or blue light rays toward the reflector layer 655 (denoted as lines 665a, 665b, 665c, 666a, 666b, 666c, 667a, 667b 667c), in which component red, green or blue light rays are reflected back toward the light emitting structure 621. The component red, green, and blue light rays 660 pass through each transparent layer of the light emitting structure 621 and onto the LCD panel 680. Due to the diffusive ability of the volume diffuser 605, the shadows caused by other opaque elements in the transmission path of the RGB micro LED 615 and the white light ray 660 are basically eliminated, thereby generating a substantial amount of light across the surface of the LCD panel 680 Evenly distributed. The LCD panel 680 may then operate as known in the art to pass light of a selected color at each pixel location on the display.

Turning to FIG. 7a, another micro LED backlight 700 using a bottom activated RGB micro LED 715 (denoted as 715a, 715b, 715c) according to various embodiments is shown. The micro LED backlight 700 includes a transparent substrate 720. In some embodiments, the transparent substrate 720 is formed of glass, translucent alumina, or some other transparent material.

The RGB microLED 715 (ie, 715a, 715b, 715c) is connected to the transparent layer 710 using conductive traces (not shown). In some cases, the conductive traces are metal traces to which the RGB micro LED 715 is soldered. In each case, the conductive traces are not straight, but can be zigzag or herringbone patterns in order to reduce artifacts and unwanted moire patterns. RGB microLED 715 may be any type of red, green or blue light emitting diode known in the art. Based on the disclosure provided herein, those skilled in the art will recognize multiple RGB light emitting diodes that can be used with respect to different embodiments. The RGB micro LED 715 is installed such that the light it emits during operation is directed toward a diffuse reflector 755 formed on the opposite surface of the transparent substrate 720. In some embodiments, the RGB micro LED 715 is a lateral device, wherein the contact with the p-type material and the n-type material is on the same side of each LED device. In other embodiments, the RGB micro LED 715 is a vertical device, wherein the contact with the p-type material is on one side of the device and the contact with the n-type material is on the other side of the device.

The use of a translucent alumina transparent substrate 720 provides some advantages due to its conductivity providing operation for connecting RGB micro LEDs 715 (denoted as 715a, 715b, 715c) to their respective electronic power and / or control circuit boards ability. Translucent alumina also provides relatively high thermal conductivity (about 40 W / m-k compared to nearly 1 W / m-k for glass). A material having such a high thermal conductivity is used to provide a mechanism for dissipating the heat generated by the RGB micro LED 715 laterally facing the edge of the micro LED backlight 700, wherein a heat sink (not shown) can be installed outside the observation hole. In addition, the translucency of the translucent alumina helps to achieve greater uniformity of the RGB light reflected back by the diffuse reflector 755. The diffuse reflector 755 may be formed of any material capable of reflecting the light emitted from the RGB micro LED 715 back through the transparent substrate 720. In a specific embodiment, the diffuse reflector 755 is made of sputtered aluminum on a roughened substrate.

Turning to FIG. 7b, a display 790 including a micro LED backlight 700 is shown in accordance with one or more embodiments. As shown, the micro-LED backlight 700 directs the component red, green, and blue light rays 760 (i.e., represented as lines 760a, 760b, 760c, 760d, 760e, 760f, 760g, 760h, 760i, 760j). The LCD display panel 680 may be any device known in the art that can selectively gate and / or color filter light received at respective pixel locations. Based on the disclosure provided herein, those skilled in the art will recognize a variety of LCD panels that can be used with respect to different embodiments.

As shown, the power is applied to the micro LED backlight 700, which causes the RGB micro LED 715 to emit component red, green, and blue light rays toward the diffuse reflector 755 (indicated as lines 765a, 765b, 765c, 766a, 766b, 766c, 767a). , 767b, 767c). This causes continuous red, green, and blue light rays 760 to pass back through the translucent substrate 720 and be reflected toward the LCD panel 780. The LCD panel 780 may then operate as known in the art to pass light of a selected color at each pixel location on the display.

Turning to Fig. 8a, another micro LED backlight 800 using a bottom-activated blue micro LED 815 (denoted as 815a, 815b, 815c) according to various embodiments is shown. The micro LED backlight 800 includes a transparent substrate 820. In some embodiments, the transparent substrate 820 is formed of glass, translucent alumina, or some other transparent material. The reflector structure 836 is disposed on one side of the transparent substrate and includes a quantum dot layer 850 and a metal layer 855.

The blue micro LED 815 (ie, 815a, 815b, 815c) is connected to the transparent layer 810 using conductive traces (not shown). In some cases, the conductive trace is a metal trace to which the blue micro LED 815 is soldered. In each case, the conductive traces are not straight, but can be zigzag or herringbone patterns in order to reduce artifacts and unwanted moire patterns. The blue micro LED 815 may be any type of blue light emitting diode known in the art. Based on the disclosure provided herein, those skilled in the art will recognize multiple blue light emitting diodes that can be used with respect to different embodiments. The blue micro LED 815 is installed such that the light it emits during operation is directed toward a reflector structure 836 disposed on the opposite surface of the transparent substrate 820. In some embodiments, the blue micro LED 815 is a lateral device, wherein the contact with the p-type material and the n-type material is on the same side of each LED device. In other embodiments, the blue micro LED 815 is a vertical device, wherein the contact with the p-type material is on one side of the device and the contact with the n-type material is on the other side of the device.

The use of translucent alumina for the transparent substrate 820 provides some advantages due to its conductivity providing operation to connect the blue micro LED 815 (denoted as 815a, 815b, 815c) to its respective electronic power source and / or control Circuit board capabilities. Translucent alumina also provides relatively high thermal conductivity (about 40 W / m-k compared to nearly 1 W / m-k for glass). A material having such a high thermal conductivity is used to provide a mechanism for dissipating the heat generated by the blue micro LED 815 laterally facing the edge of the micro LED backlight 800, wherein a heat sink (not shown) can be installed outside the observation hole. In addition, the translucency of translucent alumina helps achieve greater uniformity of RGB light reflected back by the quantum dots included in the quantum dot layer 850.

The quantum dot layer 850 includes a plurality of quantum dots that operate to reflect light emitted from the blue micro LED 315. In some cases, the size and shape of the quantum dots in the quantum dot layer 850 are designed so that when the blue light rays from the blue micro LED 815 shine on the respective quantum dots, the respective quantum dot emission is at a defined frequency Light within range. In some embodiments, when the rays of blue light from the blue micro LED 815 strike the quantum dots of the quantum dot layer 850, isotropic re-emission of red, green, or blue light occurs. Various methods of manufacturing a color conversion element identified as the quantum dot layer 850 may be used, and thus the quantum dot layer 850 may exhibit different compositions in different embodiments. As an example, multiple quantum dots may be mixed in a polymer suspension (e.g., by spray deposition, or slot die coating) across a large sheet.

The metal layer 855 acts as a reflective layer and also serves to seal the quantum dots of the quantum dot layer 850. A metal layer 855 is formed after the base substrate 820 is cut, and thus the metal layer 855 extends to cover the cut sidewalls of the base substrate 820. The metal layer 855 may be formed of any metal that is reflective and also capable of transferring heat. In a specific embodiment, the metal layer 855 is a sputtered aluminum layer. Since the quantum dots of the quantum dot layer 850 are used in the reflection and the blue light rays emitted from the blue micro LED 815 are intended to reflect back through the transparent layer 820, the exposed side of the metal layer 855 is accessible. The heat sink 895 may be adhered to the metal layer 855 to cool the quantum dots. This cooling allows the quantum dots to be more difficult to pump than possible situations without cooling capability, and thus an increase in brightness can be achieved.

Turning to FIG. 8b, a display 890 including a micro LED backlight 800 is shown in accordance with one or more embodiments. As shown, the micro-LED backlight 800 directs the component red, green, and blue light rays 860 (ie, represented as lines 860a, 860b, 860c, 860d, 860e) reflected from the reflector structure 836 toward the liquid crystal display (LCD) panel 680. , 860f, 860g, 860h, 860i, 860j). The LCD display panel 680 may be any device known in the art that can selectively gate and / or color filter light received at respective pixel locations. Based on the disclosure provided herein, those skilled in the art will recognize a variety of LCD panels that can be used with respect to different embodiments.

As shown, the power is applied to the micro LED backlight 800, causing the blue micro LED 815 to emit component blue light rays (represented as lines 865a, 865b, 865c, 866a, 866b, 866c, 867a, 867b, 867c), in which blue light rays are reflected from the quantum dots in the quantum dot layer 850. Depending on the type of quantum dot in the quantum dot layer 850 that reflects respective blue light rays, red, green, or blue light rays 860 are reflected. The continuous blue light rays reflected from the quantum dot layer 850 including a large number of quantum dots for each of the respective red, green, and blue colors are generated to reflect back through the transparent substrate 820 and onto the LCD panel 880. Continuous red, green and blue light rays 360. The LCD panel 880 may then be operated as is known in the art to pass light of a selected color at each pixel location on the display.

Turning to FIG. 9, a flowchart 900 illustrates a method for manufacturing a backlit display according to various embodiments. After the flowchart 900, a substrate having a first side and a second side is provided (block 905). The substrate is formed of a transparent material such as glass or translucent alumina.

A reflective material is formed on the substrate (block 910). In some embodiments, the reflective material includes a color converter, such as a quantum dot layer made from a quantum dot suspension in a polymer. In such cases, forming a quantum dot layer includes spray-depositing or slot-coating the suspension on the surface of a substrate. In other embodiments, the reflective material is QDEF bonded to the substrate. In yet other embodiments, the reflective material is a metal that can be sputtered onto the surface of the substrate, for example. Based on the disclosure provided herein, those skilled in the art will recognize a variety of materials that can be applied to the surface of a substrate to form a reflective layer. In some cases, the reflective material includes a combination of material layers such as a quantum dot layer and a metal layer or a QDEF and a metal layer.

A conductive material is formed on a portion of the opposite surface of the substrate (block 915). The conductive material provides a position where the micro LED can be adhered to the substrate. In some embodiments, the electrical material is a metal formed over the substrate using a deposition and lithography process. The plurality of micro LEDs are bonded to the substrate at the location where the electrical material is present, so that some of the electrical materials operate as contacts to the micro LED (block 920). The micro LED is bonded to the substrate in an orientation in which light emitted from the micro LED is directed through the substrate toward the reflective material on the opposite side of the substrate. At this time, a light emitting structure or a light source has been produced. This light emitting structure or light source is assembled with respect to the LCD panel such that light reflected from the self-reflecting material through the substrate irradiates the LCD panel (block 925). Although not shown, in some cases, the heat sink may be adhered to the reflective layer and / or to the side of the substrate outside the aperture of the resulting display.

Turning to FIG. 10, a flowchart 1000 illustrates another method for manufacturing a backlit display according to some embodiments. After the flowchart 1000, a substrate having a first side and a second side is provided (block 1005). The substrate is formed of a transparent material such as glass or translucent alumina.

A light diffuser is formed above one side of the substrate (block 1010), and a conductive material is formed above the opposite side of the substrate (block 1015). The conductive material provides a position where the micro LED can be adhered to the substrate. In some embodiments, the electrical material is a metal formed over the substrate using a deposition and lithography process. The plurality of micro LEDs are bonded to the substrate at the location where the electrical material is present, so that some of the electrical materials operate as contacts to the micro LED (block 1020). The micro LED is bonded to the substrate in an orientation where the light emitted from the micro LED is directed away from the substrate.

In addition, a reflective layer is provided (block 1040). The reflective layer may be, for example, a substrate made of a reflective material such as a metal. Alternatively, the reflective layer may be a glass substrate to which a reflective color converter and / or a metal layer has been bonded. The above-mentioned color converter may be, for example, a quantum dot layer or QDEF. Based on the disclosure provided herein, those skilled in the art will recognize a variety of reflective layers that may be used with respect to different embodiments.

The substrate (including the micro LED) is assembled with respect to the reflective layer such that the micro LED on the substrate emits light toward the reflective layer (block 1050). This assembly may include, for example, bonding a substrate to a reflective layer. As another example, the above-mentioned assembly may include a structural element external to the aperture of the resulting light emitting structure. Based on the disclosure provided herein, those skilled in the art will recognize many ways in which a substrate can be assembled relative to a reflective layer. At this time, a light emitting structure or a light source has been produced. The light emitting structure or light source is assembled with respect to the LCD panel such that light reflected from the self-reflecting material through the substrate is irradiated on the LCD panel (block 1050). Although not shown, in some cases, the heat sink may be adhered to the reflective layer and / or to the side of the substrate outside the aperture of the resulting display.

Turning to FIG. 11, a conventional backlit display 1101 is shown next to a reflective backlit display 1100 according to some embodiments to demonstrate that the embodiment can be used to achieve a reduction in display thickness. It should be noted that the demonstrated reduction in display thickness is applicable to any of the display embodiments discussed herein.

As shown, the conventional backlight display 1101 has a backlight substrate 1121 to which a micro LED 1116 is attached, and an LCD panel 1181. In order to achieve the dispersion width (shown as W) of the light (1106a, 1106b) emitted from the micro LED 1116 at an angle 1130, the LCD panel 1181 must be placed at a distance from the surface of the backlight substrate 1121 to which the micro LED 1116 is attached ( Shown as D3). This results in a total display thickness D1.

The reflective backlight display 1100 has a backlight substrate 1120 to which a micro LED 1115 is attached, and an LCD panel 1180. The micro LED is oriented so that it faces the reflective layer 1150 on the opposite side of the backlight substrate 1120 to emit light through the backlight substrate. In such an orientation, light (1105a, 1105b) emitted from the micro LED 1115 at a certain angle 1130 passes through the substrate 1120 and is reflected as light 1110a, 1110b from the reflective layer 1150. In order to achieve the same dispersion width (shown as W) for the conventional backlight display 1101 for the light (1110a, 1110b) that is re-emitted from the self-reflective layer 1120. The LCD panel 1180 need only be placed a distance (shown as D4) away from the surface of the backlight substrate 1120 to which the micro LED 1116 is attached. It should be noted that D4 is significantly smaller than D3. This results in a total display thickness D2 that is similarly much smaller than D1. Therefore, one of the many advantages that can be achieved by using the embodiments disclosed herein is the ability to produce a thinner LCD display.

In summary, the present invention provides novel systems, devices, methods, and configurations for providing lighting. Although a detailed description of one or more embodiments of the present invention has been given above, various alternatives, modifications, and equivalents without departing from the spirit of the present invention will be apparent to those skilled in the art. For example, the reflective layer is generally described as being implemented in metal, but can also be implemented in other materials including, but not limited to, white paint. Accordingly, the above description should not be construed as limiting the scope of the invention as defined by the scope of the accompanying patent application.

100‧‧‧micro LED backlight

105‧‧‧ scattering surface

110‧‧‧ transparent layer

115a‧‧‧Blue Micro LED

115b‧‧‧Blue Micro LED

115c‧‧‧Blue Micro LED

120‧‧‧Planarization layer

121‧‧‧ Light emitting structure

125‧‧‧ transparent conductive layer

130‧‧‧Optical transparent adhesive

135‧‧‧ base substrate

136‧‧‧Reflective Structure

140a‧‧‧Division

140b‧‧‧Division

150‧‧‧ Quantum Dot Layer

151‧‧‧Reflective layer

155‧‧‧metal layer

160‧‧‧view / component red, green and blue light rays / red or green light rays / continuous red, green and blue light rays

160a‧‧‧line

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165‧‧‧ blue light rays

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180‧‧‧LCD display panel

190‧‧‧Display

200‧‧‧ micro LED backlight

205‧‧‧ scattering surface

210‧‧‧ transparent layer

215a‧‧‧Blue Micro LED

215b‧‧‧Blue Micro LED

215c‧‧‧Blue Micro LED

220‧‧‧Planarization layer

221‧‧‧light emitting structure

225‧‧‧ transparent conductive layer

230‧‧‧Optical transparent adhesive

235‧‧‧ base substrate

236‧‧‧Reflective Structure

250‧‧‧ Quantum Dot Layer

251‧‧‧Reflective layer

255‧‧‧metal layer

260a‧‧‧line

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280‧‧‧LCD panel

290‧‧‧ Display

300‧‧‧Micro LED backlight

305‧‧‧ volume diffuser

310‧‧‧Transparent layer

315a‧‧‧Blue Micro LED

315b‧‧‧Blue Micro LED

315c‧‧‧Blue Micro LED

320‧‧‧ Clearance

321‧‧‧light emitting structure

335‧‧‧ base substrate

336‧‧‧Reflective Structure

350‧‧‧ Quantum Dot Layer

355‧‧‧metal layer

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366b‧‧‧line

366c‧‧‧line

367a‧‧‧line

367b‧‧‧line

367c‧‧‧line

380‧‧‧LCD panel

390‧‧‧Display

400‧‧‧micro LED backlight

420‧‧‧Gap

435‧‧‧ Quantum Dot Enhancement Film

436‧‧‧Reflective Structure

455‧‧‧metal layer

460a‧‧‧line

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480‧‧‧LCD panel

490‧‧‧ Display

500‧‧‧micro LED backlight

505‧‧‧ volume diffuser

510‧‧‧Transparent layer

515a‧‧‧White Micro LED

515b‧‧‧White Micro LED

515c‧‧‧White Micro LED

520‧‧‧Gap

555‧‧‧Reflector layer

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567c‧‧‧line

580‧‧‧LCD panel

590‧‧‧ Display

600‧‧‧Micro LED Backlight

605‧‧‧ volume diffuser

610‧‧‧Transparent layer

615a‧‧‧RGB Micro LED

615b‧‧‧RGB micro LED

615c‧‧‧RGB micro LED

620‧‧‧Gap

655‧‧‧Reflector layer

660a‧‧‧line

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680‧‧‧LCD panel

690‧‧‧ Display

700‧‧‧micro LED backlight

715a‧‧‧Activates RGB micro LED at the bottom

715b‧‧‧Start RGB micro LED at the bottom

715c‧‧‧Activates RGB micro LED at the bottom

720‧‧‧ transparent substrate

755‧‧‧ diffuse reflector

760a‧‧‧line

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780‧‧‧LCD panel

790‧‧‧ Display

800‧‧‧Micro LED backlight

815a‧‧‧Start blue micro LED at the bottom

815b‧‧‧Start blue micro LED at the bottom

815c‧‧‧Start blue micro LED

820‧‧‧Transparent substrate

836‧‧‧Reflector structure

850‧‧‧ Quantum Dot Layer

855‧‧‧metal layer

860a‧‧‧line

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865c‧‧‧line

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867a‧‧‧line

867b‧‧‧line

867c‧‧‧line

880‧‧‧LCD panel

890‧‧‧ Display

895‧‧‧ radiator

900‧‧‧ flow chart

905‧‧‧box

910‧‧‧block

915‧‧‧box

920‧‧‧box

925‧‧‧box

1000‧‧‧flow chart

1005‧‧‧block

1010‧‧‧box

1015‧‧‧box

1020‧‧‧box

1040‧‧‧box

1050‧‧‧box

1055‧‧‧box

1100‧‧‧ reflective backlight display

1101‧‧‧Learn Backlit Display

1105a‧‧‧light

1105b‧‧‧Light

1106a‧‧‧light

1106b‧‧‧light

1110a‧‧‧light

1110b‧‧‧light

1115‧‧‧Micro LED

1116‧‧‧Micro LED

1120‧‧‧Backlight substrate

1121‧‧‧Backlight substrate

1130‧‧‧angle

1180‧‧‧LCD panel

1181‧‧‧LCD Panel

D1‧‧‧Total display thickness

D2‧‧‧Total display thickness

D3‧‧‧distance

D4‧‧‧distance

W‧‧‧Scatter width

Further understanding of the various embodiments can be achieved with reference to the drawings described in the remainder of the description. In the drawings, similar component symbols are used throughout the several figures to indicate similar components. In some cases, a sub-number composed of lowercase letters is associated with an element symbol representing one of a plurality of similar parts. When referring to an element symbol without describing an existing sub-number, it is intended to refer to all such multiple similar components.

FIG. 1a illustrates a micro LED backlight including a zone divider according to some embodiments;

1b to 1i illustrate various processing steps that can be used alone or in combination to manufacture a backlight according to some embodiments;

Figure 1j shows the backlit display of Figure 1a;

FIG. 2a illustrates another micro LED backlight formed without a substrate region divider according to various embodiments;

Figure 2b shows a display including the backlight of Figure 2a;

FIG. 3a illustrates another micro LED backlight using blue micro LEDs, red and green quantum dots, and a volume diffuser according to various embodiments;

Figure 3b shows a display including the backlight of Figure 3a;

Figure 4a illustrates yet another micro LED backlight using a quantum dot enhancement film (QDEF) according to one or more embodiments;

Figure 4b shows a display including the backlight of Figure 4a;

Figure 5a illustrates yet another micro LED backlight using phosphor to convert white micro LEDs according to some embodiments;

Figure 5b shows a display including the backlight of Figure 5a;

Figure 6a illustrates yet another micro LED backlight using Red / Green / Blue (RGB) micro LEDs according to various other embodiments;

Figure 6b shows a display including the backlight of Figure 6a;

Figure 7a illustrates yet another micro LED backlight using bottom firing RGB micro LEDs according to one or more embodiments;

Figure 7b shows a display including the backlight of Figure 7a;

Figure 8a illustrates yet another micro LED backlight using a bottom-activated blue micro LED according to some other embodiments;

Figure 8b shows a display including the backlight of Figure 8a;

FIG. 9 is a flowchart illustrating a method for manufacturing a backlight display according to various embodiments; FIG.

FIG. 10 is a flowchart illustrating another method for manufacturing a backlit display according to some embodiments; and

FIG. 11 shows a conventional backlit display next to a reflective backlit display according to some embodiments to demonstrate that the embodiment can be used to achieve a reduction in display thickness.

Domestic hosting information (please note in order of hosting institution, date, and number) None

Information on foreign deposits (please note in order of deposit country, institution, date, and number) None

Claims (28)

An LCD display device includes: an LCD panel; and a micro-light emitting diode (micro LED) backlight, which is in a fixed position relative to the LCD panel, wherein the micro LED backlight includes: a reflective structure; A transparent substrate; and at least one micro LED device, wherein the at least one micro LED device is disposed relative to the reflective structure and the transparent substrate such that light emitted from the at least one micro LED device is reflected from the LCD before reaching the LCD panel The structure reflects off and passes through the transparent substrate. The device of claim 1, wherein the device further comprises: a heat sink adhered to the reflective structure. The device according to claim 1, wherein the transparent substrate is a first transparent substrate, and wherein the reflective structure is selected from the group consisting of: (a) a quantum dot layer formed over a second substrate, and A metal layer formed over the quantum dot layer; (b) a quantum dot enhanced film; (c) a quantum dot enhanced film having a metal layer formed over a surface of the quantum dot enhanced film; (d) A metal layer; (e) a diffuse reflector disposed over a surface of the first substrate; and (f) a quantum dot layer formed over a surface of the first substrate, and a quantum dot layer formed A metal layer above. The device according to claim 1, wherein the transparent substrate is formed of a material selected from the group consisting of: glass, and translucent alumina. The device according to claim 1, wherein the at least one micro LED is a white LED, and wherein the reflective structure is selected from the group consisting of: (a) a metal layer; (b) disposed on one of the substrates A diffuse reflector above the surface; and (c) white paint. The device according to claim 1, wherein the substrate is a first substrate, wherein the at least one micro LED is a blue LED, and wherein the reflective structure is selected from the group consisting of: (a) formed in a A quantum dot layer above the second substrate, and a metal layer formed above the quantum dot layer; (b) a quantum dot enhancement film; (c) a metal having a surface formed above a surface of the quantum dot enhancement film A quantum dot enhancement film; and (d) a quantum dot layer formed over a surface of the first substrate, and a metal layer formed over the quantum dot layer. The device according to claim 1, wherein the at least one micro LED comprises a red LED, a green LED and a blue LED, and wherein the reflective structure is selected from the group consisting of: (a) a metal layer; (b) a diffuse reflector disposed over one surface of the substrate; and (c) white paint. A backlight device includes: a transparent substrate; a reflective structure formed on a first side of the transparent substrate; at least one micro light emitting diode (micro LED) disposed on one of the transparent substrates; Above two sides, wherein the at least one micro LED is oriented such that light emitted from the at least one micro LED passes through the transparent substrate and is reflected from the reflective structure to generate reflected light, and wherein the reflected light is provided as being from the backlight One of the devices passes through the transparent substrate before the light is output. The device according to claim 8, wherein the reflective structure comprises a metal layer, and wherein the device further comprises: a heat sink, which is adhered to the metal layer. The device of claim 8, wherein the at least one micro LED includes a blue LED, and wherein the reflective structure includes: a quantum dot layer operable to perform color conversion on blue light emitted from the blue LED To reflect red, green and blue component light. The device according to claim 10, wherein the quantum dot layer is disposed on the transparent substrate, and wherein the quantum dot layer is sealed by a metal layer. The device according to claim 8, wherein the at least one micro LED comprises a red LED, a green LED, and a blue LED, and wherein the reflective structure includes: a diffuse reflector disposed on the transparent substrate. The device according to claim 8, wherein the at least one micro LED comprises a blue LED, and wherein the reflective structure comprises: a quantum dot enhancement film operable to color blue light emitted from the blue LED Convert to reflect red, green, and blue component light. The device according to claim 8, wherein the transparent substrate is made of translucent alumina. The device according to claim 8, wherein the transparent substrate is made of glass. A backlight device includes: a light emitting structure, the light emitting structure comprising: a transparent substrate; and at least one micro light emitting diode (micro LED), which is disposed on a surface of the transparent substrate, wherein the at least one micro The LED is oriented to direct light emitted from the at least one microLED away from the transparent substrate; and a reflective structure including a reflective layer, and wherein the reflective structure is positioned relative to the light emitting structure such that Light is reflected from the reflective layer as reflected light, and the reflected light passes through the transparent substrate as a light output from the backlight device. The device according to claim 16, wherein the reflective structure comprises a metal layer, and wherein the device further comprises: a heat sink, which is adhered to the metal layer. The device according to claim 16, wherein the transparent substrate is made of translucent alumina. The device according to claim 16, wherein the transparent substrate is made of glass. The device according to claim 16, wherein a surface of the transparent substrate on which the at least one micro LED is disposed is a first surface of the transparent substrate, and wherein the light emitting structure further includes a second formed on the transparent substrate. A glass volume diffuser on the surface. The device according to claim 16, wherein the at least one micro LED is a blue LED, and wherein the reflective layer comprises: a quantum dot enhancement film operable to color blue light emitted from the blue LED Converted to reflect the red, green, and blue component light; and a metal layer deposited on the quantum dot enhancement film. The device according to claim 16, wherein the transparent substrate is a first transparent substrate, and wherein the reflective structure comprises: the reflective layer, which is disposed on a second transparent substrate, and emits light from the at least one micro LED. Light passes through the second substrate before being reflected from the reflective layer. The device according to claim 22, wherein the at least one micro LED is a blue LED, and wherein the reflective layer includes a quantum dot layer formed on the second transparent substrate, and a quantum dot layer formed above the quantum dot layer. A metal layer. The device according to claim 23, wherein a zone divider is formed in the second transparent substrate, wherein the zone divider is displayed at least partially on a first surface of the second transparent substrate and on the second transparent substrate. A tapered wall extends between a second surface. The device according to claim 24, wherein the tapered side wall of the second transparent substrate is covered by a metal layer. The device according to claim 25, wherein the tapered sidewall of the second transparent substrate is covered by both a quantum dot layer and a metal layer. The device according to claim 16, wherein the at least one micro LED comprises a red LED, a green LED and a blue LED, and wherein the reflective layer is selected from the group consisting of: (a) a metal layer; (b) a diffuse reflector; and (c) white paint. The device according to claim 16, wherein the at least one micro LED is a white LED, and wherein the reflective layer is selected from the group consisting of: (a) a metal layer; (b) disposed on one of the substrates A diffuse reflector above the surface; and (c) white paint.