TW201919464A - Cooling apparatus - Google Patents
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- TW201919464A TW201919464A TW107132028A TW107132028A TW201919464A TW 201919464 A TW201919464 A TW 201919464A TW 107132028 A TW107132028 A TW 107132028A TW 107132028 A TW107132028 A TW 107132028A TW 201919464 A TW201919464 A TW 201919464A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract
Description
本說明書涉及散熱設備技術領域，尤其涉及一種冷卻設備。The present specification relates to the field of heat dissipation equipment, and in particular to a cooling device.
雲端計算技術(也即大規模分散式系統技術)的高速發展，對伺服器計算性能的要求越來越高。伺服器性能提升的同時，功耗呈現急速上升之勢，機櫃功耗成倍數上升，資料顯示，近十年來資料中心機櫃的功率密度提高了近15倍。過去一個機櫃的功耗一般為1.5kW~2kW，現在個別機櫃卻出現局部高達20kW~30kW的情況。
資料中心的伺服器通常採用空調風冷的方式，正在消耗大量的能源、空間和成本，而且消耗量日益膨脹。然而，隨著功率密度的穩定攀升，目前許多資料中心提供的冷卻能力正趨向極限，功率密度快速增長的這種趨勢會產生不利影響。因此，常規的空調風冷的方式已經不能滿足對資料中心的伺服器降溫的需求。The rapid development of cloud computing technology (also known as large-scale distributed system technology) has become more and more demanding on the computing performance of servers. At the same time as the performance of the server is improved, the power consumption is rapidly increasing, and the power consumption of the cabinet is multiplied. The data shows that the power density of the data center cabinet has increased by nearly 15 times in the past decade. In the past, the power consumption of a cabinet was generally 1.5 kW to 2 kW, and now some cabinets have a local maximum of 20 kW to 30 kW.
The servers in the data center are usually air-conditioned and air-cooled, which consumes a lot of energy, space and cost, and the consumption is increasing. However, as the power density has steadily increased, the cooling capacity provided by many data centers is now approaching the limit, and this trend of rapid power density growth has an adverse effect. Therefore, the conventional air-conditioning air-cooling method can no longer meet the demand for server cooling of the data center.
本說明書提出一種冷卻設備，以提高對資料中心的伺服器降溫的冷卻效率。
根據本說明書實施例的第一方面，提供一種冷卻設備，用於冷卻待冷卻裝置，所述冷卻設備包括櫃體和至少兩個換熱裝置；其中，所述櫃體內可盛放用於至少部分浸沒所述待冷卻裝置的冷卻介質，所述至少兩個換熱裝置均與所述櫃體流通連接，所述至少兩個換熱裝置用於驅動冷卻介質在所述櫃體內循環以對所述待冷卻裝置進行冷卻。
進一步地，所述櫃體設有與所述換熱裝置數量對應的多個導流通道，所述至少兩個換熱裝置的一端與所述多個導流通道一一對應地連接，所述至少兩個換熱裝置的另一端均與外部供液裝置連接。
進一步地，所述導流通道包括用於導入冷卻介質的第一導流入口和用於排出冷卻介質的第一導流出口，所述第一導流入口和所述第一導流出口均與對應的所述換熱裝置連通設置。
進一步地，還包括設置於所述櫃體內的導流裝置，所述導流裝置與所述多個導流通道均連通設置；所述導流裝置設有呈離散分佈的多個導流口，所述多個導流口用於將流經所述導流裝置的冷卻介質排至所述櫃體內或用於將流經所述待冷卻裝置的冷卻介質導入所述導流裝置。
進一步地，還包括與所述導流通道數量對應的多個導流裝置，所述多個導流裝置設置於所述櫃體內並與所述多個導流通道一一對應地連通設置；所述導流裝置設有呈離散分佈的多個導流口，所述多個導流口用於將流經所述導流裝置的冷卻介質排至所述櫃體內或用於將流經所述待冷卻裝置的冷卻介質導入所述導流裝置。
進一步地，所述導流裝置包括第一導流組件和第二導流組件，所述第一導流組件和所述第二導流組件位於所述待冷卻裝置的兩側，並均與所述多個導流通道連通設置；
所述導流口包括設於所述第一導流組件的多個第二導流出口和設於所述第二導流組件的多個第二導流入口，所述第二導流出口用於將流經所述第一導流組件的冷卻介質排至所述櫃體內，所述第二導流入口用於將流經所述待冷卻裝置的冷卻介質導入所述第二導流組件。
進一步地，所述換熱裝置和所述導流通道均為兩個，所述冷卻設備還包括控制裝置和檢測裝置，所述控制裝置與所述檢測裝置以及所述兩個換熱裝置均保持通信連接；所述檢測裝置用於檢測所述兩個換熱裝置以及所述兩個導流通道是否發生故障，所述控制裝置用於根據所述檢測裝置的檢測結果控制所述兩個換熱裝置的啟閉，以切換所述冷卻設備的工作模式。
進一步地，所述冷卻設備包括第一正常工作模式和第一應急工作模式；
所述冷卻設備處於所述第一正常工作模式時，所述控制裝置控制所述兩個換熱裝置的其中一個換熱裝置運行，另一個換熱裝置關閉；
當所述檢測裝置檢測到處於運行狀態的換熱裝置發生故障或檢測到與處於運行狀態的換熱裝置對應連接的導流通道發生故障時，所述控制裝置控制處於關閉狀態的換熱裝置開始運行，進而將所述冷卻設備切換至所述第一應急工作模式。
進一步地，所述冷卻設備包括第二正常工作模式和第二應急工作模式；
所述冷卻設備處於所述第二正常工作模式時，所述控制裝置控制所述兩個換熱裝置均以預設速度運行；
當所述檢測裝置檢測到任一所述換熱裝置發生故障或檢測到任一所述導流通道發生故障時，所述控制裝置控制另一個換熱裝置在所述預設速度的基礎上加速運行，進而將所述冷卻設備切換至所述第二應急工作模式。
進一步地，所述換熱裝置包括熱交換器、導流泵、用於與所述櫃體連通設置的第一循環管路、以及用於與外部供液裝置連通設置的第二循環管路，所述第一循環管路和所述第二循環管路均與所述熱交換器連接；
所述導流泵通過所述第一循環管路驅動冷卻介質在所述櫃體內循環並流經所述熱交換器，外部供液裝置提供的冷卻液通過所述第二循環管路流經所述熱交換器，進而對流經所述熱交換器的冷卻介質進行熱交換。
根據本說明書實施例的第二方面，提供一種冷卻設備，用於冷卻待冷卻裝置，所述冷卻設備包括櫃體、第一換熱裝置，第二換熱裝置以及控制系統，所述控制系統與所述第一換熱裝置和第二換熱裝置耦合連接，當所述第一換熱裝置和第二換熱裝置中之一者發生故障時，所述控制系統控制所述第一換熱裝置和第二換熱裝置中之另一者運行，以對所述待冷卻裝置進行冷卻。
由以上技術方案可見，本說明書的冷卻設備，通過換熱裝置驅動冷卻介質在櫃體內循環流動以帶走待冷卻裝置的熱量，進而對待冷卻裝置進行冷卻。設置至少兩個換熱裝置與櫃體相連，當其中有換熱裝置發生故障時，其他的換熱裝置仍能保證冷卻設備正常進行工作，不會影響對資料中心的伺服器進行降溫的冷卻效率。This specification proposes a cooling device to improve the cooling efficiency of the server cooling of the data center.
According to a first aspect of the embodiments of the present specification, there is provided a cooling apparatus for cooling a device to be cooled, the cooling device comprising a cabinet and at least two heat exchange devices; wherein the cabinet body is for at least partially Immersing the cooling medium of the device to be cooled, the at least two heat exchange devices are in fluid connection with the cabinet, and the at least two heat exchange devices are used for driving a cooling medium to circulate in the cabinet to The cooling device is cooled.
Further, the cabinet is provided with a plurality of flow guiding channels corresponding to the number of the heat exchange devices, and one ends of the at least two heat exchange devices are connected in one-to-one correspondence with the plurality of flow guiding channels, The other ends of at least two heat exchange devices are connected to an external liquid supply device.
Further, the flow guiding channel includes a first diversion inlet for introducing a cooling medium and a first diversion outlet for discharging the cooling medium, the first diversion inlet and the first diversion outlet are both Corresponding heat exchange devices are connected to each other.
Further, the method further includes a flow guiding device disposed in the cabinet, the flow guiding device and the plurality of flow guiding channels are disposed in communication; the guiding device is provided with a plurality of air guiding ports distributed in a discrete manner, The plurality of air guiding ports are configured to discharge a cooling medium flowing through the flow guiding device into the cabinet or to introduce a cooling medium flowing through the device to be cooled into the flow guiding device.
Further, the method further includes a plurality of flow guiding devices corresponding to the number of the guiding channels, wherein the plurality of guiding devices are disposed in the cabinet and are connected in one-to-one correspondence with the plurality of guiding channels; The flow guiding device is provided with a plurality of air guiding ports distributed in a discrete manner, the plurality of air guiding ports for discharging cooling medium flowing through the flow guiding device into the cabinet or for flowing through the A cooling medium to be cooled is introduced into the flow guiding device.
Further, the flow guiding device comprises a first guiding component and a second guiding component, wherein the first guiding component and the second guiding component are located on both sides of the device to be cooled, and both are Said a plurality of flow guiding channels connected to each other;
The air guiding port includes a plurality of second air guiding outlets disposed on the first air guiding component and a plurality of second air guiding inlets disposed in the second air guiding component, where the second air guiding outlet is used Discharging a cooling medium flowing through the first flow guiding assembly into the cabinet, the second flow guiding inlet for introducing a cooling medium flowing through the device to be cooled into the second flow guiding assembly.
Further, the heat exchange device and the flow guiding channel are both, the cooling device further includes a control device and a detecting device, and the control device and the detecting device and the two heat exchange devices are maintained a communication connection; the detecting device is configured to detect whether the two heat exchange devices and the two flow guiding channels are faulty, and the control device is configured to control the two heat exchanges according to the detection result of the detecting device Opening and closing of the device to switch the operating mode of the cooling device.
Further, the cooling device includes a first normal working mode and a first emergency working mode;
When the cooling device is in the first normal working mode, the control device controls one of the two heat exchange devices to operate, and the other heat exchange device is turned off;
When the detecting device detects that the heat exchange device in the running state fails or detects that the flow guiding channel corresponding to the heat exchange device in the running state fails, the control device controls the heat exchange device in the closed state to start Operating to switch the cooling device to the first emergency mode of operation.
Further, the cooling device includes a second normal working mode and a second emergency working mode;
When the cooling device is in the second normal working mode, the control device controls the two heat exchange devices to operate at a preset speed;
When the detecting device detects that any of the heat exchange devices fails or detects that any of the flow guiding channels fails, the control device controls another heat exchange device to accelerate on the basis of the preset speed Operating to switch the cooling device to the second emergency mode of operation.
Further, the heat exchange device includes a heat exchanger, a diversion pump, a first circulation line for communicating with the cabinet, and a second circulation line for communicating with the external liquid supply device, The first circulation line and the second circulation line are both connected to the heat exchanger;
The flow guiding pump drives a cooling medium to circulate through the cabinet through the first circulation line and flows through the heat exchanger, and the coolant provided by the external liquid supply device flows through the second circulation line The heat exchanger further heats the cooling medium flowing through the heat exchanger.
According to a second aspect of the embodiments of the present specification, there is provided a cooling apparatus for cooling a device to be cooled, the cooling device comprising a cabinet, a first heat exchange device, a second heat exchange device, and a control system, the control system and The first heat exchange device and the second heat exchange device are coupled to each other, and when one of the first heat exchange device and the second heat exchange device fails, the control system controls the first heat exchange device The other of the second heat exchange devices operates to cool the device to be cooled.
It can be seen from the above technical solution that the cooling device of the present specification drives the cooling medium to circulate in the cabinet through the heat exchange device to take away the heat of the device to be cooled, and then to cool the cooling device. At least two heat exchange devices are arranged to be connected with the cabinet. When there is a failure of the heat exchange device, the other heat exchange devices can still ensure the normal operation of the cooling device without affecting the cooling efficiency of the server in the data center. .
這裡將詳細地對示例性實施例進行說明，其示例表示在附圖中。下面的描述涉及附圖時，除非另有表示，不同附圖中的相同數字表示相同或相似的要素。以下示例性實施例中所描述的實施方式並不代表與本說明書相一致的所有實施方式。相反，它們僅是與如所附申請專利範圍中所詳述的、本說明書的一些方面相一致的裝置和方法的例子。
在本說明書使用的術語是僅僅出於描述特定實施例的目的，而非旨在限制本說明書。在本說明書和所附申請專利範圍中所使用的單數形式的“一種”、“所述”和“該”也旨在包括多數形式，除非上下文清楚地表示其他含義。還應當理解，本文中使用的術語“和/或”是指並包含一個或多個相關聯的列出專案的任何或所有可能組合。
應當理解，儘管在本說明書可能採用術語第一、第二、第三等來描述各種資訊，但這些資訊不應限於這些術語。這些術語僅用來將同一類型的資訊彼此區分開。例如，在不脫離本說明書範圍的情況下，第一資訊也可以被稱為第二資訊，類似地，第二資訊也可以被稱為第一資訊。取決於語境，如在此所使用的詞語“如果”可以被解釋成為“在……時”或“當……時”或“回應於確定”。
本說明書提出一種冷卻設備，以提高對資料中心的伺服器降溫的冷卻效率。下面結合附圖，對本說明書的冷卻設備進行詳細說明。在不衝突的情況下，下述的實施例及實施方式中的特徵可以相互組合。
參見圖1所示，本說明書實施例提供一種採用單相浸沒液冷技術的冷卻設備1，用於冷卻待冷卻裝置90，冷卻待冷卻裝置90可以是資料中心的伺服器，或者可以是其他需冷卻降溫的發熱設備。所述冷卻設備1包括櫃體10和至少兩個換熱裝置20。其中，所述櫃體10內可盛放用於至少部分浸沒所述待冷卻裝置90的不導電的冷卻介質80，所述至少兩個換熱裝置20均與所述櫃體10流通連接。所述至少兩個換熱裝置20用於驅動冷卻介質80在所述櫃體10內循環以對所述待冷卻裝置90進行冷卻。冷卻介質80可以完全浸沒待冷卻裝置90，也可以部分浸沒待冷卻裝置90，可以根據實際需要設置。冷卻介質80可以是氣態介質、液態介質或是固液混合態的介質，同樣可以根據實際需要設置。在圖中所示的例子中，換熱裝置20以兩個為例，冷卻介質80完全浸沒待冷卻裝置90，冷卻介質80採用液態的M的電子氟化液。
由以上技術方案可見，本說明書的冷卻設備1，通過換熱裝置20驅動冷卻介質80在櫃體10內循環流動以帶走待冷卻裝置90的熱量，進而對待冷卻裝置進行冷卻。設置至少兩個換熱裝置20與櫃體10相連，當其中有換熱裝置20發生故障時，其他的換熱裝置20仍能保證冷卻設備1正常進行工作而不至於當機，具有冗餘備份的功能，不會影響對資料中心的伺服器進行降溫的冷卻效率。
在一可選的實施方式中，所述櫃體10還設有與所述換熱裝置20數量對應的多個導流通道。所述至少兩個換熱裝置20的一端與所述多個導流通道一一對應地連接，所述至少兩個換熱裝置20的另一端均與外部供液裝置30連接。需要說明的是，本文中所述的多個均指兩個及兩個以上。
外部供液裝置30用於向所述至少兩個換熱裝置20循環提供冷卻液，冷卻液可以是冷卻水。外部供液裝置30為一個也可以為多個，外部供液裝置30為一個時，所述至少兩個換熱裝置20均與該外部供液裝置30連接。外部供液裝置30為多個時，與所述換熱裝置20的數量對應。所述至少兩個換熱裝置20與多個外部供液裝置30一一對應地連接。可選地，每個供液裝置30可以和對應的換熱裝置20集成為一個組件，節省體積。也就是說，當外部供液裝置30為一個時，可以為全部的換熱裝置20提供冷卻液。當外部供液裝置30的數量與換熱裝置20的數量對應時，每個換熱裝置20均通過對應連接的外部供液裝置30提供冷卻液。通過換熱裝置20驅動冷卻介質80在櫃體10內循環流動以帶走待冷卻裝置90的熱量，並與供液裝置30提供的冷卻液進行熱交換，使冷卻介質80重新達到低溫的狀態，循環進入冷卻設備1後能夠再次對待冷卻裝置90進行冷卻降溫，從而達到循環持續地將待冷卻裝置90的熱量排出的目的。
參見圖1所示，在一可選的實施方式中，以所述換熱裝置20和所述導流通道均為兩個為例，所述冷卻設備1還包括控制裝置和檢測裝置，所述控制裝置與所述檢測裝置以及所述兩個換熱裝置20均保持通信連接。所述檢測裝置用於檢測所述兩個換熱裝置20以及所述兩個導流通道是否發生故障，所述控制裝置用於根據所述檢測裝置的檢測結果控制所述兩個換熱裝置20的啟閉，以切換所述冷卻設備1的工作模式。
在一實施例中，所述冷卻設備1包括第一正常工作模式和第一應急工作模式。所述冷卻設備1處於所述第一正常工作模式時，所述控制裝置控制所述兩個換熱裝置20的其中一個換熱裝置20運行，另一個換熱裝置20關閉。當所述檢測裝置檢測到處於運行狀態的換熱裝置20發生故障或檢測到與處於運行狀態的換熱裝置20對應連接的導流通道發生故障時，所述控制裝置控制處於關閉狀態的換熱裝置20開始運行，進而將所述冷卻設備1切換至所述第一應急工作模式。
在另一實施例中，所述冷卻設備1包括第二正常工作模式和第二應急工作模式。所述冷卻設備1處於所述第二正常工作模式時，所述控制裝置控制所述兩個換熱裝置20均以預設速度運行。當所述檢測裝置檢測到任一所述換熱裝置20發生故障或檢測到任一所述導流通道發生故障時，所述控制裝置控制另一個換熱裝置20在所述預設速度的基礎上加速運行，直到滿足系統要求即可，進而將所述冷卻設備1切換至所述第二應急工作模式。需要說明的是，所述控制裝置控制另一個換熱裝置20加速後最終的運行速度可以根據實際情況而定。在本實施例中，當所述檢測裝置檢測到任一所述換熱裝置20發生故障或檢測到任一所述導流通道發生故障時，所述控制裝置控制另一個換熱裝置20加速到所述預設速度的兩倍速度進行運行，使該換熱裝置20的運行速度能夠滿足冷卻設備1正常工作時所需的額定功率。即相當於所述冷卻設備1處於所述第二正常工作模式時，兩個換熱裝置20均以50%負載運行，當其中一個換熱裝置20發生故障時，另一個換熱裝置20全速運行，以保證冷卻設備1能夠正常工作。
參見圖2所示，在一可選的實施方式中，櫃體10的頂部通過緊固件可拆卸地設有蓋體100。當需要將待冷卻裝置90放入櫃體10時，拆除緊固件打開蓋體100，即可將待冷卻裝置90放入櫃體10。待冷卻裝置90放置完成後，將蓋體100合上可以起到密封櫃體10的作用。
在一可選的實施方式中，所述換熱裝置20包括熱交換器210、導流泵220、用於與所述櫃體10連通設置的第一循環管路230、以及用於與外部供液裝置30連通設置的第二循環管路240，所述第一循環管路230和所述第二循環管路240均與所述熱交換器210連接。所述導流泵220通過所述第一循環管路230驅動冷卻介質80在所述櫃體10內循環並流經所述熱交換器210，以帶走待冷卻裝置90的熱量，外部供液裝置30提供的冷卻液通過所述第二循環管路240流經所述熱交換器210，進而對流經所述熱交換器210的冷卻介質80進行熱交換，將冷卻介質80帶有的熱量排出，使冷卻介質80重新達到低溫的狀態，循環進入櫃體10後能夠再次對待冷卻裝置90進行冷卻降溫，從而達到循環持續地將待冷卻裝置90的熱量排出的目的。
在一可選的實施方式中，所述導流通道包括設於櫃體10的第一導流入口101和第一導流出口102，第一導流入口101用於將冷卻介質80導入櫃體10內，第一導流出口102用於將冷卻介質80排出櫃體10。所述第一導流入口101和所述第一導流出口102均與所述換熱裝置20的第一循環管路230連通設置。進一步地，所述第一循環管路230包括第一管路231和第二管路232，第一管路231與所述導流通道的第一導流入口101連通設置，第二管路232與所述導流通道的第一導流出口102連通設置。所述第二循環管路240包括第三管路241和第四管路242，第三管路241及第四管路242均與供液裝置30連通設置。
在一可選的實施方式中，本說明書的冷卻設備1還包括與所述導流通道數量對應的多個導流裝置，所述多個導流裝置設置於所述櫃體10內並與所述多個導流通道一一對應地連通設置。所述導流裝置設有呈離散分佈的多個導流口，所述多個導流口用於將流經所述導流裝置的冷卻介質80排至所述櫃體10內或用於將流經所述待冷卻裝置90的冷卻介質80導入所述導流裝置。所述導流裝置既可以與所述導流通道的第一導流入口101連通設置，起到將流經所述導流裝置的冷卻介質80排至所述櫃體10內的作用，冷卻介質80流經待冷卻裝置90後可以對待冷卻裝置90進行冷卻降溫。所述導流裝置也可以與所述導流通道的第一導流出口102連通設置，起到將流經所述待冷卻裝置90的冷卻介質80從櫃體10內導入所述導流裝置的作用。但不論是哪種設置方式，呈離散分佈的多個導流口均可以使冷卻介質80從多個不同的方向流入或流出櫃體10，減小冷卻介質80之間的溫度差，進而使冷卻介質80的流量和溫度更加均勻，冷卻效率更高。
在一可選的實施方式中，參見圖3至圖5所示，所述導流裝置包括第一導流組件410和第二導流組件420，所述第一導流組件410和所述第二導流組件420位於所述待冷卻裝置90的兩側，並均與所述多個導流通道連通設置。
進一步地，所述導流口包括設於所述第一導流組件410的多個第二導流出口411和設於所述第二導流組件420的多個第二導流入口421。所述第二導流出口411與所述導流通道的第一導流入口101連通設置，通過第二導流出口411將流經所述第一導流組件410的冷卻介質80排至所述櫃體10內。所述第二導流入口421與所述導流通道的第一導流出口102連通設置，通過第二導流入口421將流經所述待冷卻裝置90的冷卻介質80從櫃體10導入到所述第二導流組件420。當然，在其他實施例中，也可以將所述第一導流組件410的第二導流出口411與所述導流通道的第一導流出口102連通設置，將所述第二導流組件420的第二導流入口421與所述導流通道的第一導流入口101連通設置，即相當於通過第二導流組件420將冷卻介質80排至櫃體10內，通過第一導流組件410將流經待冷卻裝置90的冷卻介質80排出櫃體10。
可選地，所述第一導流組件410和所述第二導流組件420分別位於所述待冷卻裝置90沿豎直方向的兩側，使冷卻介質80的流場為沿豎直方向的直線路徑，可以避免沿橫向移動時由於重力而造成額外的能量消耗，使得冷卻介質80的整個液體流過路徑最短，受到的阻力最小，驅動液體所需要的能耗也相應地大幅降低，進而達到能耗最低的效果。另外，冷卻介質80採用直線形式的流經路徑，並且冷、熱流體完全隔離，可以避免冷、熱流體相互混合，進而達到最優的製冷效果。在圖中所述的例子中，第一導流入口101位於第一導流出口102的上方。相應地，所述第一導流組件410位於所述待冷卻裝置90的頂部，所述第二導流組件420位於所述待冷卻裝置90的底部。當然，在其他實施例中，第一導流入口101也可以位於第一導流出口102的下方。相應地，第一導流組件410位於所述待冷卻裝置90的底部，第二導流組件420位於所述待冷卻裝置90的頂部。
參見圖5所示，在一可選的實施方式中，所述第一導流組件410包括環管部412和與所述環管部412連通設置的第一導流部413，所述第一導流部413與所述第一導流入口101連通設置，所述環管部412和所述第一導流部413中的至少一者設有所述第二導流出口411。在本實施例中，所述環管部412和所述第一導流部413均設有所述第二導流出口411。冷卻介質80從所述導流通道的第一導流入口101進入第一導流組件410後，經設於環管部412和第一導流部413的第二導流出口411排出至櫃體10內，流經待冷卻裝置90為其冷卻降溫。
進一步地，所述環管部412的環路結構可以與所述待冷卻裝置90的截面結構相對應，可以使第一導流組件410流出的冷卻介質80更好的貼合待冷卻裝置90的周圍進行流動，進而達到更高的冷卻效率。例如，所述待冷卻裝置90的截面結構為矩形，所述環管部412為與之對應的矩形環管結構。當然，所述待冷卻裝置90的截面結構也可以是其他形狀，所述環管部412的環路結構與之對應即可。
在一可選的實施方式中，所述待冷卻裝置90的截面結構為矩形，所述環管部412為與之對應的矩形環管結構。所述環管部412包括相互連通並圍合連接的兩個第一管體4121和兩個第二管體4122，所述第一導流部413與任一所述第一管體4121連通設置，所述第一管體4121、所述第二管體4122以及所述第一導流部413中的至少一者的側壁設有所述第二導流出口411。在本實施例中，所述第一管體4121、所述第二管體4122以及所述第一導流部413的內側壁均設有所述第二導流出口411。冷卻介質80從所述導流通道的第一導流入口101進入第一導流組件410後，經設於第一管體4121、第二管體4122以及第一導流部413的第二導流出口411排出至櫃體內，流經待冷卻裝置90為其冷卻降溫。
在一可選的實施方式中，所述第一管體4121的長度小於所述第二管體4122的長度，所述第一管體4121上套設有加強環414，所述第二管體4122上間隔套設有多個加強環414，可以增強第一導流組件410的結構強度。進一步地，所述兩個第一管體4121均與鄰接的至少一個所述第二管體4122為一體成型設置。即兩個第一管體4121可以一一對應地與兩個第二管體4122一體成型設置，或者兩個第一管體4121與兩個第二管體4122均為一體成型設置，可以進一步增強第一導流組件410的結構強度。
參見圖4和圖5所示，在一可選的實施方式中，所述第二導流組件420包括排管部422和與所述排管部422連通設置的第二導流部423，所述第二導流部423與所述第一導流出口102連通設置，所述排管部422設有所述第二導流入口421。流經待冷卻裝置90的冷卻介質80將待冷卻裝置90的熱量帶走後經設於排管部422的第二導流入口421進入第二導流組件420，再從櫃體10的第一導流出口102排出櫃體10，從而達到將待冷卻裝置90的熱量排出的目的。
進一步地，所述排管部422的排管結構可以與所述待冷卻裝置90的截面結構相對應，可以使流經待冷卻裝置90的冷卻介質80能夠盡可能多的流進第二導流組件420內後從櫃體10的第一導流出口102排出，進而提高冷卻介質80的循環速度。例如，所述待冷卻裝置90的截面結構為矩形，所述排管部422的排管結構為與之對應的矩形排管結構。當然，所述待冷卻裝置90的截面結構也可以是其他形狀，所述排管部422的排管結構與之對應即可。
在一可選的實施方式中，所述待冷卻裝置90的截面結構為矩形，所述排管部422為與之對應的矩形排管結構。所述排管部422包括兩個第三管體4221和連接於所述兩個第三管體4221之間的多個第四管體4222，多個第四管體4222與所述兩個第三管體4221均連通設置。所述第二導流部423與任一所述第三管體4221連通設置，所述第四管體4222的頂部設有所述第二導流入口421。流經待冷卻裝置90的冷卻介質80將待冷卻裝置90的熱量帶走後經設於第四管體4222的第二導流入口421進入第二導流組件420，再從櫃體10的第一導流出口102排出櫃體10，從而達到將待冷卻裝置90的熱量排出的目的。
在一可選的實施方式中，所述第三管體4221的長度小於所述第四管體4222的長度，所述第三管體4221上套設有加強環414，可以增強第二導流組件420的結構強度。可選地，所述多個第四管體4222包括兩組，相互呈交錯排列。其中一組第四管體4222與其中一個第三管體4221為一體成型設置，另一組第四管體4222與另一個第三管體4221為一體成型設置，即相當於多個第四管體4222與兩個第三管體4221形成兩個釘耙的一體結構，可以進一步增強第二導流組件420的結構強度。
在一可選的實施方式中，多個第二導流出口411均勻佈設於第一導流組件410的第一管體4121、第二管體4122以及第一導流部413中的至少一者的內側壁。在圖中所示的實施例中，第一導流組件410的第一管體4121、第二管體4122以及第一導流部413的內側壁均設有均勻佈置的多個第二導流出口411。多個第二導流入口421均勻佈設於第二導流組件420的第四管體4222的頂部。這樣，可以使冷卻介質80流經待冷卻裝置90的流量分佈更加均勻，有利於提高冷卻效率。
結合圖4至圖6所示，以第一導流入口101位於第一導流出口102的上方，第一導流組件410位於待冷卻裝置90的頂部，第二導流組件420位於待冷卻裝置90的底部為例，對本說明書的冷卻設備1的工作原理進行說明。所述櫃體10內設有用於裝設待冷卻裝置90的多個插接組件190，待冷卻裝置90可以採用片體式結構，依次插接在這些插接組件190上。冷卻介質80從櫃體10的第一導流入口101進入第一導流組件410後，經第一導流組件410的第二導流出口411排到櫃體10內後向下流經待冷卻裝置90，流經待冷卻裝置90的冷卻介質80將待冷卻裝置90的熱量帶走後經第二導流組件420的第二導流入口421進入第二導流組件420，再從櫃體10的第一導流出口102排出櫃體10，從而達到將待冷卻裝置90的熱量排出的目的。圖中的虛線箭頭表示冷卻介質80處於熱液流體狀態下的流向，實線箭頭表示冷卻介質80處於冷液流體狀態下的流向。通過將第一導流組件410設在待冷卻裝置90的頂部，第二導流組件420設在待冷卻裝置90的底部，使冷卻介質80流經待冷卻裝置90的流場為自上而下的直線路徑，使得冷卻介質的整個液體流過路徑最短，受到的阻力最小，驅動液體所需要的能耗也相應地大幅降低，進而達到能耗最低的效果。另外，冷卻介質採用直線形式的流經路徑，冷、熱流體完全隔離，可以避免冷、熱流體相互混合，進而達到最優的製冷效果。
參見圖7所示，以第一導流入口101位於第一導流出口102的下方，第一導流組件410位於待冷卻裝置90的底部，第二導流組件420位於待冷卻裝置90的頂部為例，對本說明書的冷卻設備1的工作原理進行說明。所述櫃體10內設有用於裝設待冷卻裝置90的多個插接組件190，待冷卻裝置90可以採用片體式結構，依次插接在這些插接組件190上。冷卻介質80從櫃體10的第一導流入口101進入第一導流組件410後，經第一導流組件410的第二導流出口411排到櫃體10內後向上流經待冷卻裝置90，流經待冷卻裝置90的冷卻介質80將待冷卻裝置90的熱量帶走後經第二導流組件420的第二導流入口421進入第二導流組件420，再從櫃體10的第一導流出口102排出櫃體10，從而達到將待冷卻裝置90的熱量排出的目的。圖中的虛線箭頭表示冷卻介質80處於熱液流體狀態下的流向，實線箭頭表示冷卻介質80處於冷液流體狀態下的流向。通過將第一導流組件410設在待冷卻裝置90的底部，第二導流組件420設在待冷卻裝置90的頂部，使冷卻介質80流經待冷卻裝置90的流場為自下而上的直線路徑，使得冷卻介質的整個液體流過路徑最短，受到的阻力最小，驅動液體所需要的能耗也相應地大幅降低，進而達到能耗最低的效果。另外，冷卻介質採用直線形式的流經路徑，冷、熱流體完全隔離，可以避免冷、熱流體相互混合，進而達到最優的製冷效果。
本說明書實施例還提供一種冷卻設備，用於冷卻待冷卻裝置，所述冷卻設備包括櫃體、第一換熱裝置，第二換熱裝置以及控制系統，所述控制系統與所述第一換熱裝置和第二換熱裝置耦合連接，當所述第一換熱裝置和第二換熱裝置中之一者發生故障時，所述控制系統控制所述第一換熱裝置和第二換熱裝置中之另一者運行，以對所述待冷卻裝置進行冷卻。
由以上技術方案可見，本說明書的冷卻設備，設置兩個換熱裝置與櫃體相連，當其中有一個換熱裝置發生故障時，控制系統控制另一個換熱裝置運行，以對所述待冷卻裝置進行冷卻，這樣整個冷卻設備可以正常工作而不至於當機，具有冗餘備份的功能，不會影響對資料中心的伺服器進行降溫的冷卻效率。
在一實施例中，正常運行時，所述控制系統可以控制第一換熱裝置和第二換熱裝置中之一者運行，另一者待機。當控制系統檢測到處於運行狀態的換熱裝置發生故障時，控制待機的換熱裝置開始運行，這樣整個冷卻設備可以正常工作而不至於當機，具有冗餘備份的功能。
在另一實施例中，正常運行時，所述控制系統控制第一換熱裝置和第二換熱裝置均以50%負載運行，當控制系統檢測檢測到其中一個換熱裝置發生故障時，控制另一個換熱裝置全速運行，這樣整個冷卻設備可以正常工作而不至於當機，具有冗餘備份的功能。
本領域技術人員在考慮說明書及實踐這裡公開的發明後，將容易想到本說明書的其它實施方案。本說明書旨在涵蓋本說明書的任何變型、用途或者適應性變化，這些變型、用途或者適應性變化遵循本說明書的一般性原理並包括本說明書未公開的本技術領域中的公知常識或慣用技術手段。說明書和實施例僅被視為示例性的，本說明書的真正範圍和精神由下面的申請專利範圍指出。
還需要說明的是，術語“包括”、“包含”或者其任何其他變體意在涵蓋非排他性的包含，從而使得包括一系列要素的過程、方法、商品或者設備不僅包括那些要素，而且還包括沒有明確列出的其他要素，或者是還包括為這種過程、方法、商品或者設備所固有的要素。在沒有更多限制的情況下，由語句“包括一個……”限定的要素，並不排除在包括所述要素的過程、方法、商品或者設備中還存在另外的相同要素。
以上所述僅為本說明書的較佳實施例而已，並不用以限制本說明書，凡在本說明書的精神和原則之內，所做的任何修改、等同替換、改進等，均應包含在本說明書保護的範圍之內。Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. The following description refers to the same or similar elements in the different figures unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present specification. Instead, they are merely examples of devices and methods consistent with aspects of the specification as detailed in the appended claims.
The terminology used in the description is for the purpose of describing particular embodiments, and is not intended to The singular forms "a", "the" and "the" It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, the first information may also be referred to as the second information without departing from the scope of the present specification. Similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "when" or "when" or "in response to a determination."
This specification proposes a cooling device to improve the cooling efficiency of the server cooling of the data center. The cooling device of the present specification will be described in detail below with reference to the accompanying drawings. The features of the embodiments and embodiments described below may be combined with each other without conflict.
Referring to FIG. 1 , an embodiment of the present specification provides a cooling device 1 using a single-phase immersion liquid cooling technology for cooling a device to be cooled 90. The cooling device to be cooled 90 may be a server of a data center, or may be other needs. A cooling device that cools and cools down. The cooling device 1 comprises a cabinet 10 and at least two heat exchange devices 20. The non-conducting cooling medium 80 for at least partially immersing the device to be cooled 90 can be contained in the cabinet 10 , and the at least two heat exchange devices 20 are in fluid connection with the cabinet 10 . The at least two heat exchange devices 20 are used to drive a cooling medium 80 to circulate within the cabinet 10 to cool the device to be cooled 90. The cooling medium 80 can be completely immersed in the device to be cooled 90, or partially immersed in the device to be cooled 90, and can be set according to actual needs. The cooling medium 80 can be a gaseous medium, a liquid medium or a solid-liquid mixed medium, and can also be set according to actual needs. In the example shown in the figures, the heat exchange device 20 is exemplified by two, the cooling medium 80 is completely immersed in the device to be cooled 90, and the cooling medium 80 is a liquid fluorinated liquid of M.
It can be seen from the above technical solution that the cooling device 1 of the present specification drives the cooling medium 80 to circulate in the cabinet 10 through the heat exchange device 20 to take away the heat of the device to be cooled 90, thereby cooling the device to be cooled. At least two heat exchange devices 20 are disposed to be connected to the cabinet 10. When the heat exchange device 20 fails, the other heat exchange devices 20 can ensure that the cooling device 1 works normally without crashing, and has redundant backup. The function does not affect the cooling efficiency of cooling the data center server.
In an optional embodiment, the cabinet 10 is further provided with a plurality of flow guiding channels corresponding to the number of the heat exchange devices 20. One ends of the at least two heat exchange devices 20 are connected in one-to-one correspondence with the plurality of flow guiding channels, and the other ends of the at least two heat exchange devices 20 are connected to the external liquid supply device 30. It should be noted that the plurality described herein refers to two or more.
The external liquid supply device 30 is configured to provide cooling liquid to the at least two heat exchange devices 20, and the cooling liquid may be cooling water. The external liquid supply device 30 may be one or more, and when the external liquid supply device 30 is one, the at least two heat exchange devices 20 are connected to the external liquid supply device 30. When there are a plurality of external liquid supply devices 30, they correspond to the number of the heat exchange devices 20. The at least two heat exchange devices 20 are connected in one-to-one correspondence with the plurality of external liquid supply devices 30. Alternatively, each liquid supply device 30 can be integrated with the corresponding heat exchange device 20 as one component, saving volume. That is, when the external liquid supply device 30 is one, the cooling liquid can be supplied to all of the heat exchange devices 20. When the number of external liquid supply devices 30 corresponds to the number of heat exchange devices 20, each heat exchange device 20 supplies cooling liquid through a correspondingly connected external liquid supply device 30. The cooling medium 80 is driven by the heat exchange device 20 to circulate in the cabinet 10 to take away the heat of the device to be cooled 90, and exchange heat with the coolant provided by the liquid supply device 30, so that the cooling medium 80 reaches the low temperature state again. After circulating into the cooling device 1, the cooling device 90 can be cooled again to cool down, thereby achieving the purpose of continuously discharging the heat of the device to be cooled 90.
Referring to FIG. 1 , in an optional embodiment, taking the heat exchange device 20 and the flow guiding channel as two examples, the cooling device 1 further includes a control device and a detecting device, The control device maintains a communication connection with the detection device and the two heat exchange devices 20. The detecting device is configured to detect whether the two heat exchange devices 20 and the two flow guiding channels are faulty, and the control device is configured to control the two heat exchange devices 20 according to the detection result of the detecting device Opening and closing to switch the operating mode of the cooling device 1.
In an embodiment, the cooling device 1 includes a first normal operating mode and a first emergency operating mode. When the cooling device 1 is in the first normal operating mode, the control device controls one of the two heat exchange devices 20 to operate, and the other heat exchange device 20 is turned off. When the detecting device detects that the heat exchange device 20 in the running state fails or detects that the flow guiding channel corresponding to the heat exchange device 20 in the running state fails, the control device controls the heat exchange in the closed state. The device 20 begins to operate, thereby switching the cooling device 1 to the first emergency mode of operation.
In another embodiment, the cooling device 1 includes a second normal operating mode and a second emergency operating mode. When the cooling device 1 is in the second normal operating mode, the control device controls the two heat exchange devices 20 to operate at a preset speed. The control device controls the basis of the other heat exchange device 20 at the preset speed when the detecting device detects that any of the heat exchange devices 20 has failed or detects that any of the flow guiding channels has failed. The acceleration operation is performed until the system requirements are met, and the cooling device 1 is switched to the second emergency operation mode. It should be noted that the final operating speed of the control device after controlling the acceleration of the other heat exchange device 20 may be determined according to actual conditions. In this embodiment, when the detecting device detects that any of the heat exchange devices 20 fails or detects that any of the flow guiding channels fails, the control device controls the other heat exchange device 20 to accelerate to The speed of the preset speed is doubled to enable the operating speed of the heat exchange device 20 to meet the rated power required for the cooling device 1 to operate normally. That is, when the cooling device 1 is in the second normal working mode, both heat exchange devices 20 are operated at 50% load, and when one of the heat exchange devices 20 fails, the other heat exchange device 20 is operated at full speed. To ensure that the cooling device 1 can work normally.
Referring to Figure 2, in an alternative embodiment, the top of the cabinet 10 is removably provided with a cover 100 by fasteners. When the device to be cooled 90 needs to be placed in the cabinet 10, the fastener is removed to open the cover 100, and the device to be cooled 90 is placed in the cabinet 10. After the cooling device 90 is placed, the cover 100 can be closed to function as a sealed cabinet 10.
In an alternative embodiment, the heat exchange device 20 includes a heat exchanger 210, a diversion pump 220, a first circulation line 230 for communicating with the cabinet 10, and for external supply. The liquid device 30 communicates with the disposed second circulation line 240, and the first circulation line 230 and the second circulation line 240 are both connected to the heat exchanger 210. The flow guiding pump 220 drives the cooling medium 80 through the first circulation line 230 to circulate in the cabinet 10 and flows through the heat exchanger 210 to take away heat of the device to be cooled 90, and externally supply liquid The coolant provided by the device 30 flows through the heat exchanger 210 through the second circulation line 240, thereby performing heat exchange on the cooling medium 80 flowing through the heat exchanger 210, and discharging the heat carried by the cooling medium 80. After the cooling medium 80 is again brought to a low temperature state, the cooling device 90 can be cooled and cooled again after being circulated into the cabinet 10, thereby achieving the purpose of continuously discharging the heat of the device to be cooled 90.
In an optional embodiment, the flow guiding channel includes a first guiding inlet 101 and a first guiding outlet 102 disposed in the cabinet 10, and the first guiding inlet 101 is used to introduce the cooling medium 80 into the cabinet. Within 10, the first flow outlet 102 is used to discharge the cooling medium 80 out of the cabinet 10. The first diversion inlet 101 and the first diversion outlet 102 are both in communication with the first circulation line 230 of the heat exchange device 20 . Further, the first circulation line 230 includes a first line 231 and a second line 232. The first line 231 is in communication with the first flow inlet 101 of the flow channel, and the second line 232 It is disposed in communication with the first air outlet outlet 102 of the flow guiding channel. The second circulation line 240 includes a third line 241 and a fourth line 242. The third line 241 and the fourth line 242 are both disposed in communication with the liquid supply device 30.
In an optional embodiment, the cooling device 1 of the present specification further includes a plurality of flow guiding devices corresponding to the number of the guiding channels, and the plurality of guiding devices are disposed in the cabinet 10 and The plurality of flow guiding channels are connected in a one-to-one correspondence. The flow guiding device is provided with a plurality of flow guiding ports distributed in a discrete manner, the plurality of air guiding openings for discharging the cooling medium 80 flowing through the flow guiding device into the cabinet 10 or for The cooling medium 80 flowing through the device to be cooled 90 is introduced into the flow guiding device. The flow guiding device may be disposed in communication with the first guiding inlet 101 of the guiding channel to discharge the cooling medium 80 flowing through the guiding device into the cabinet 10, and the cooling medium After flowing through the device to be cooled 90, the cooling device 90 can be cooled and cooled. The flow guiding device may also be disposed in communication with the first air guiding outlet 102 of the flow guiding channel to introduce the cooling medium 80 flowing through the cooling device 90 into the guiding device from the cabinet 10 . effect. However, regardless of the arrangement, the plurality of diversion ports that are discretely distributed can cause the cooling medium 80 to flow into or out of the cabinet 10 from a plurality of different directions, thereby reducing the temperature difference between the cooling mediums 80, thereby cooling. The flow rate and temperature of the medium 80 are more uniform and the cooling efficiency is higher.
In an alternative embodiment, as shown in FIGS. 3 to 5, the flow guiding device includes a first flow guiding component 410 and a second flow guiding component 420, the first guiding component 410 and the first The two flow guiding assemblies 420 are located on both sides of the device to be cooled 90 and are disposed in communication with the plurality of flow guiding channels.
Further, the air guiding port includes a plurality of second air guiding outlets 411 disposed in the first air guiding component 410 and a plurality of second air guiding inlets 421 disposed in the second air guiding component 420. The second air guiding outlet 411 is disposed in communication with the first air guiding inlet 101 of the air guiding channel, and the cooling medium 80 flowing through the first air guiding component 410 is discharged to the Inside the cabinet 10. The second flow guiding inlet 421 is disposed in communication with the first air guiding outlet 102 of the flow guiding channel, and the cooling medium 80 flowing through the device to be cooled 90 is introduced from the cabinet 10 through the second air guiding inlet 421 The second flow guiding component 420. Of course, in other embodiments, the second air guiding outlet 411 of the first guiding component 410 may be connected to the first air guiding outlet 102 of the guiding channel, and the second guiding component may be The second diversion inlet 421 of the 420 is disposed in communication with the first diversion inlet 101 of the diversion channel, that is, the cooling medium 80 is discharged into the cabinet 10 through the second diversion assembly 420, and passes through the first diversion flow. The assembly 410 discharges the cooling medium 80 flowing through the device to be cooled 90 out of the cabinet 10.
Optionally, the first flow guiding component 410 and the second flow guiding component 420 are respectively located on two sides of the device to be cooled 90 in the vertical direction, so that the flow field of the cooling medium 80 is in a vertical direction. The straight path can avoid additional energy consumption due to gravity when moving in the lateral direction, so that the entire liquid flow path of the cooling medium 80 is the shortest, the resistance is minimized, and the energy consumption required to drive the liquid is correspondingly greatly reduced, thereby achieving The lowest energy consumption. In addition, the cooling medium 80 adopts a straight flow path, and the cold and hot fluids are completely isolated, thereby avoiding mixing of cold and hot fluids, thereby achieving an optimal cooling effect. In the example described in the figures, the first diversion inlet 101 is located above the first diversion outlet 102. Correspondingly, the first flow guiding component 410 is located at the top of the device to be cooled 90, and the second flow guiding component 420 is located at the bottom of the device to be cooled 90. Of course, in other embodiments, the first flow guiding inlet 101 may also be located below the first air guiding outlet 102. Correspondingly, the first flow guiding component 410 is located at the bottom of the device to be cooled 90, and the second flow guiding component 420 is located at the top of the device to be cooled 90.
As shown in FIG. 5, in an optional embodiment, the first flow guiding component 410 includes a loop portion 412 and a first flow guiding portion 413 disposed in communication with the loop portion 412, the first The flow guiding portion 413 is provided in communication with the first flow guiding inlet 101, and at least one of the annular pipe portion 412 and the first flow guiding portion 413 is provided with the second flow guiding outlet 411. In this embodiment, the annular tube portion 412 and the first flow guiding portion 413 are both provided with the second flow guiding outlet 411. After the cooling medium 80 enters the first flow guiding assembly 410 from the first guiding inlet 101 of the guiding channel, the cooling medium 80 is discharged to the cabinet through the second guiding outlet 411 of the annular tube portion 412 and the first guiding portion 413. Within 10, it flows through the device to be cooled 90 to cool it down.
Further, the loop structure of the loop portion 412 may correspond to the cross-sectional structure of the device to be cooled 90, so that the cooling medium 80 flowing out of the first flow guiding component 410 can better conform to the device to be cooled 90. Flow around to achieve higher cooling efficiency. For example, the cross-sectional structure of the device to be cooled 90 is rectangular, and the annular tube portion 412 is a rectangular loop structure corresponding thereto. Of course, the cross-sectional structure of the device to be cooled 90 may be other shapes, and the loop structure of the ring portion 412 may correspond thereto.
In an alternative embodiment, the cross-sectional structure of the device to be cooled 90 is rectangular, and the annular tube portion 412 is a rectangular loop structure corresponding thereto. The ring pipe portion 412 includes two first pipe bodies 4121 and two second pipe bodies 4122 that are connected to each other and are connected to each other. The first flow guiding portion 413 is in communication with any of the first pipe bodies 4121. The side wall of at least one of the first pipe body 4121, the second pipe body 4122, and the first flow guiding portion 413 is provided with the second air guiding outlet 411. In the present embodiment, the second inner wall 4412, the second tube 4122, and the inner side wall of the first flow guiding portion 413 are all provided with the second air guiding outlet 411. After the cooling medium 80 enters the first flow guiding component 410 from the first guiding inlet 101 of the guiding channel, the second guiding body is disposed on the first pipe body 4121, the second pipe body 4122 and the first guiding portion 413. The outflow port 411 is discharged into the cabinet body, and flows through the device to be cooled 90 to cool it down.
In an optional embodiment, the length of the first pipe body 4121 is smaller than the length of the second pipe body 4122, and the first pipe body 4121 is sleeved with a reinforcing ring 414, and the second pipe body The upper sleeve of the 4122 is provided with a plurality of reinforcing rings 414, which can enhance the structural strength of the first flow guiding assembly 410. Further, the two first tubes 4121 are integrally formed with the adjacent at least one of the second tubes 4122. That is, the two first tubes 4121 can be integrally formed with the two second tubes 4122 in one-to-one correspondence, or the two first tubes 4121 and the two second tubes 4122 are integrally formed, which can be further enhanced. The structural strength of the first flow guiding assembly 410.
Referring to FIG. 4 and FIG. 5, in an optional embodiment, the second flow guiding component 420 includes a tube portion 422 and a second flow guiding portion 423 disposed in communication with the tube portion 422. The second flow guiding portion 423 is provided in communication with the first air guiding outlet 102, and the second tube guiding portion 422 is provided with the second air guiding inlet 421. The cooling medium 80 flowing through the device to be cooled 90 takes the heat of the device to be cooled 90 and then enters the second flow guiding member 420 through the second guiding inlet 421 provided in the tube portion 422, and then the first from the cabinet 10 The flow outlets 102 are discharged from the cabinet 10 to achieve the purpose of discharging heat from the device to be cooled 90.
Further, the tube structure of the tube portion 422 may correspond to the cross-sectional structure of the device to be cooled 90, so that the cooling medium 80 flowing through the device to be cooled 90 can flow into the second channel as much as possible. The assembly 420 is thereafter discharged from the first flow outlet 102 of the cabinet 10, thereby increasing the circulation speed of the cooling medium 80. For example, the cross-sectional structure of the device to be cooled 90 is rectangular, and the pipe structure of the pipe portion 422 is a rectangular pipe structure corresponding thereto. Of course, the cross-sectional structure of the device to be cooled 90 may be other shapes, and the pipe structure of the pipe portion 422 may correspond thereto.
In an optional embodiment, the cross-sectional structure of the device to be cooled 90 is rectangular, and the pipe portion 422 is a rectangular pipe structure corresponding thereto. The tube portion 422 includes two third tubes 4221 and a plurality of fourth tubes 4222 connected between the two third tubes 4221, and a plurality of fourth tubes 4222 and the two The three tubes 4221 are connected to each other. The second flow guiding portion 423 is disposed in communication with any of the third tubular bodies 4221, and the second guiding inlet 421 is disposed at the top of the fourth tubular body 4222. The cooling medium 80 flowing through the device to be cooled 90 carries away the heat of the device to be cooled 90, and then enters the second flow guiding assembly 420 through the second guiding inlet 421 provided in the fourth pipe body 4222, and then from the second body of the cabinet 10 A flow guiding outlet 102 is discharged from the cabinet 10 to achieve the purpose of discharging heat from the device to be cooled 90.
In an optional embodiment, the length of the third pipe body 4221 is smaller than the length of the fourth pipe body 4222, and the third pipe body 4221 is sleeved with a reinforcing ring 414, which can enhance the second guiding flow. The structural strength of assembly 420. Optionally, the plurality of fourth tubes 4222 comprise two groups arranged in a staggered relationship with each other. One set of the fourth tube body 4222 is integrally formed with one of the third tube bodies 4221, and the other group of the fourth tube body 4222 is integrally formed with the other third tube body 4221, that is, equivalent to a plurality of fourth tubes. The body 4222 and the two third tubes 4221 form an integral structure of two staples, which can further enhance the structural strength of the second flow guiding assembly 420.
In an optional embodiment, the plurality of second air guiding outlets 411 are evenly disposed on at least one of the first tube body 4121, the second tube body 4122, and the first guiding portion 413 of the first flow guiding component 410. The inner side wall. In the embodiment shown in the figures, the first tubular body 4121, the second tubular body 4122 of the first flow guiding component 410, and the inner sidewall of the first guiding portion 413 are each provided with a plurality of second guiding flows uniformly arranged. Exit 411. The plurality of second flow guiding inlets 421 are evenly disposed on the top of the fourth tubular body 4222 of the second flow guiding assembly 420. In this way, the flow distribution of the cooling medium 80 through the device to be cooled 90 can be made more uniform, which is advantageous for improving the cooling efficiency.
As shown in FIG. 4 to FIG. 6 , the first air guiding inlet 101 is located above the first air guiding outlet 102 , the first air guiding component 410 is located at the top of the device to be cooled 90 , and the second air guiding component 420 is located at the device to be cooled. The bottom of the 90 is taken as an example to explain the working principle of the cooling device 1 of the present specification. A plurality of plug-in assemblies 190 for mounting the device to be cooled 90 are disposed in the cabinet 10. The devices to be cooled 90 may be in a sheet-like structure and sequentially inserted into the plug assemblies 190. After entering the first flow guiding component 410 from the first air guiding inlet 101 of the cabinet 10, the cooling medium 80 is discharged into the cabinet 10 through the second air guiding outlet 411 of the first air guiding component 410, and then flows downward through the device to be cooled. 90, the cooling medium 80 flowing through the device to be cooled 90 takes the heat of the device to be cooled 90 and then enters the second flow guiding assembly 420 through the second guiding inlet 421 of the second guiding assembly 420, and then from the cabinet 10 The first air outlet outlet 102 exits the cabinet 10 to achieve the purpose of discharging heat from the device to be cooled 90. The dotted arrows in the figure indicate the flow direction of the cooling medium 80 in the state of the hot liquid fluid, and the solid arrows indicate the flow direction of the cooling medium 80 in the state of the cold liquid fluid. By placing the first flow guiding assembly 410 on top of the device to be cooled 90, the second flow guiding assembly 420 is disposed at the bottom of the device to be cooled 90, and the flow field of the cooling medium 80 flowing through the device to be cooled 90 is top-down. The straight path ensures that the entire liquid flow path of the cooling medium is the shortest, the resistance is minimized, and the energy consumption required to drive the liquid is correspondingly reduced, thereby achieving the lowest energy consumption. In addition, the cooling medium adopts a straight flow path, and the cold and hot fluids are completely isolated, which can avoid mixing of cold and hot fluids, thereby achieving an optimal cooling effect.
Referring to FIG. 7, the first air guiding inlet 101 is located below the first air guiding outlet 102, the first air guiding component 410 is located at the bottom of the device to be cooled 90, and the second air guiding component 420 is located at the top of the device 90 to be cooled. As an example, the working principle of the cooling device 1 of the present specification will be described. A plurality of plug-in assemblies 190 for mounting the device to be cooled 90 are disposed in the cabinet 10. The devices to be cooled 90 may be in a sheet-like structure and sequentially inserted into the plug assemblies 190. After the cooling medium 80 enters the first flow guiding assembly 410 from the first guiding inlet 101 of the cabinet 10, the second guiding outlet 411 of the first guiding assembly 410 is discharged into the cabinet 10 and then flows upward through the device to be cooled. 90, the cooling medium 80 flowing through the device to be cooled 90 takes the heat of the device to be cooled 90 and then enters the second flow guiding assembly 420 through the second guiding inlet 421 of the second guiding assembly 420, and then from the cabinet 10 The first air outlet outlet 102 exits the cabinet 10 to achieve the purpose of discharging heat from the device to be cooled 90. The dotted arrows in the figure indicate the flow direction of the cooling medium 80 in the state of the hot liquid fluid, and the solid arrows indicate the flow direction of the cooling medium 80 in the state of the cold liquid fluid. By providing the first flow guiding assembly 410 at the bottom of the device to be cooled 90, the second flow guiding assembly 420 is disposed at the top of the device to be cooled 90, and the flow field of the cooling medium 80 flowing through the device to be cooled 90 is bottom-up. The straight path ensures that the entire liquid flow path of the cooling medium is the shortest, the resistance is minimized, and the energy consumption required to drive the liquid is correspondingly reduced, thereby achieving the lowest energy consumption. In addition, the cooling medium adopts a straight flow path, and the cold and hot fluids are completely isolated, which can avoid mixing of cold and hot fluids, thereby achieving an optimal cooling effect.
The embodiment of the present specification further provides a cooling device for cooling a device to be cooled, the cooling device comprising a cabinet, a first heat exchange device, a second heat exchange device and a control system, the control system and the first change The heat device and the second heat exchange device are coupled to each other, and when one of the first heat exchange device and the second heat exchange device fails, the control system controls the first heat exchange device and the second heat exchange The other of the devices operates to cool the device to be cooled.
It can be seen from the above technical solution that the cooling device of the present specification is provided with two heat exchange devices connected to the cabinet. When one of the heat exchange devices fails, the control system controls another heat exchange device to operate to cool the device. The device is cooled, so that the entire cooling device can work normally without crashing, and has the function of redundant backup, which does not affect the cooling efficiency of cooling the data center server.
In an embodiment, during normal operation, the control system may control one of the first heat exchange device and the second heat exchange device to operate while the other is on standby. When the control system detects that the heat exchange device in the running state has failed, the heat exchange device that controls the standby starts to operate, so that the entire cooling device can work normally without being down, and has the function of redundant backup.
In another embodiment, in normal operation, the control system controls both the first heat exchange device and the second heat exchange device to operate at a 50% load, and when the control system detects that one of the heat exchange devices fails, the control system controls The other heat exchange device runs at full speed, so that the entire cooling device can work normally without crashing, and has the function of redundant backup.
Other embodiments of the present specification will be readily apparent to those skilled in the <RTIgt; The description is intended to cover any variations, uses, or adaptations of the present specification, which are in accordance with the general principles of the specification and include common general knowledge or common technical means in the art that are not disclosed in this specification. . The specification and examples are to be regarded as illustrative only, and the true scope and spirit of the specification
It is also to be understood that the terms "comprises" or "comprising" or "comprising" or any other variations are intended to encompass a non-exclusive inclusion, such that a process, method, article, Other elements not explicitly listed, or elements that are inherent to such a process, method, commodity, or equipment. An element defined by the phrase "comprising a ..." does not exclude the presence of additional equivalent elements in the process, method, item, or device including the element.
The above description is only the preferred embodiment of the present specification, and is not intended to limit the description. Any modifications, equivalent substitutions, improvements, etc., which are included in the present specification, should be included in the present specification. Within the scope of protection.
1‧‧‧冷卻設備1‧‧‧Cooling equipment
10‧‧‧櫃體 10‧‧‧ cabinet
20‧‧‧換熱裝置 20‧‧‧heat exchanger
30‧‧‧外部供液裝置 30‧‧‧External liquid supply device
80‧‧‧冷卻介質 80‧‧‧ Cooling medium
90‧‧‧待冷卻裝置 90‧‧‧Stop cooling unit
100‧‧‧蓋體 100‧‧‧ cover
101‧‧‧第一導流入口 101‧‧‧First diversion portal
102‧‧‧第一導流出口 102‧‧‧First diversion outlet
190‧‧‧插接組件 190‧‧‧Docking components
210‧‧‧熱交換器 210‧‧‧ heat exchanger
220‧‧‧導流泵 220‧‧‧drain pump
230‧‧‧第一循環管路 230‧‧‧First circulation line
231‧‧‧第一管路 231‧‧‧First line
232‧‧‧第二管路 232‧‧‧Second line
240‧‧‧第二循環管路 240‧‧‧Second circulation line
241‧‧‧第三管路 241‧‧‧ third pipeline
242‧‧‧第四管路 242‧‧‧fourth pipeline
410‧‧‧第一導流組件 410‧‧‧First diversion assembly
411‧‧‧第二導流出口 411‧‧‧Second diversion outlet
412‧‧‧環管部 412‧‧‧Environmental Management Department
413‧‧‧第一導流部 413‧‧‧First Drainage Department
414‧‧‧加強環 414‧‧‧ Strengthening ring
420‧‧‧第二導流組件 420‧‧‧Second diversion assembly
421‧‧‧第二導流入口 421‧‧‧Second diversion portal
422‧‧‧排管部 422‧‧‧Drainage Department
423‧‧‧第二導流部 423‧‧‧Second diversion
4121‧‧‧第一管體 4121‧‧‧First tube
4122‧‧‧第二管體 4122‧‧‧Second body
4221‧‧‧第三管體 4221‧‧‧3rd body
4222‧‧‧第四管體 4222‧‧‧4th body
圖1示出了本說明書一示例性實施例的一種冷卻設備的結構示意圖。FIG. 1 shows a schematic structural view of a cooling apparatus according to an exemplary embodiment of the present specification.
圖2示出了本說明書一示例性實施例的一種冷卻設備的櫃體的立體示意圖。 2 is a perspective view of a cabinet of a cooling apparatus in accordance with an exemplary embodiment of the present specification.
圖3示出了本說明書一示例性實施例的一種冷卻設備的櫃體去除蓋體後的立體示意圖。 FIG. 3 is a perspective view of the cabinet of the cooling device after removing the cover body according to an exemplary embodiment of the present specification.
圖4示出了本說明書一示例性實施例的一種冷卻設備的櫃體的內部結構的立體示意圖。 4 is a perspective view showing the internal structure of a cabinet of a cooling apparatus according to an exemplary embodiment of the present specification.
圖5示出了本說明書一示例性實施例的一種冷卻設備的導流裝置的立體示意圖。 FIG. 5 shows a perspective view of a flow guiding device of a cooling device according to an exemplary embodiment of the present specification.
圖6示出了本說明書一示例性實施例的一種冷卻設備的櫃體內的流場示意圖。 Fig. 6 is a schematic view showing a flow field in a cabinet of a cooling apparatus according to an exemplary embodiment of the present specification.
圖7示出了本說明書一示例性實施例的另一種冷卻設備的櫃體內的流場示意圖。 FIG. 7 is a schematic view showing a flow field in a cabinet of another cooling device according to an exemplary embodiment of the present specification.
Claims (11)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711073060.6A CN109757062B (en) | 2017-11-03 | 2017-11-03 | Cooling device |
| ??201711073060.6 | 2017-11-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201919464A true TW201919464A (en) | 2019-05-16 |
Family
ID=66332840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107132028A TW201919464A (en) | 2017-11-03 | 2018-09-12 | Cooling apparatus |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN109757062B (en) |
| TW (1) | TW201919464A (en) |
| WO (1) | WO2019085812A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4011182A1 (en) * | 2020-01-23 | 2022-06-15 | Ivan Kirillov | Cooling bath for multiprocessor circuit boards |
| CN113347507B (en) * | 2021-07-01 | 2022-12-27 | 北京奕信通科技有限公司 | Liquid submergence cooling formula switch and exchange unit |
| CN114096133A (en) * | 2021-12-22 | 2022-02-25 | 北京字节跳动网络技术有限公司 | Immersed liquid cooling device and liquid cooling system |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4199018B2 (en) * | 2003-02-14 | 2008-12-17 | 株式会社日立製作所 | Rack mount server system |
| CN202076074U (en) * | 2011-04-29 | 2011-12-14 | 程战斌 | Cooling system for forced oil circulation air-cooled oil immersion transformer |
| CN104284536B (en) * | 2014-10-28 | 2017-06-06 | 深圳绿色云图科技有限公司 | Server cabinet and the stack of cabinets with it and liquid-immersed cooling server system |
| EP3229103A4 (en) * | 2014-12-05 | 2018-07-11 | Exascaler Inc. | Electronic apparatus cooling device |
| CN106559968A (en) * | 2015-09-27 | 2017-04-05 | 大冶斯瑞尔换热器有限公司 | For the method and apparatus of close-coupled cooling system |
| CN105611803B (en) * | 2015-12-30 | 2018-04-17 | 南京佳力图机房环境技术股份有限公司 | A kind of new backboard air-conditioning system |
| CN206196242U (en) * | 2016-12-02 | 2017-05-24 | 郑州云海信息技术有限公司 | Cooling device and server with double -cold -source device |
| CN207519035U (en) * | 2017-11-03 | 2018-06-19 | 阿里巴巴集团控股有限公司 | Cool down equipment |
-
2017
- 2017-11-03 CN CN201711073060.6A patent/CN109757062B/en active Active
-
2018
- 2018-09-12 TW TW107132028A patent/TW201919464A/en unknown
- 2018-10-25 WO PCT/CN2018/111820 patent/WO2019085812A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN109757062B (en) | 2021-06-11 |
| WO2019085812A1 (en) | 2019-05-09 |
| CN109757062A (en) | 2019-05-14 |
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