TW201912240A - Method for producing three-dimensional ordered porous microstructure and monolithic column produced thereby - Google Patents

Method for producing three-dimensional ordered porous microstructure and monolithic column produced thereby Download PDF

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TW201912240A
TW201912240A TW107105579A TW107105579A TW201912240A TW 201912240 A TW201912240 A TW 201912240A TW 107105579 A TW107105579 A TW 107105579A TW 107105579 A TW107105579 A TW 107105579A TW 201912240 A TW201912240 A TW 201912240A
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particles
dimensional ordered
microstructure
dimensional
glass transition
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TWI645897B (en
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廖晨宏
郭育丞
成育
楊適弘
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台灣創新材料股份有限公司
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Abstract

The present invention relates to methods for producing a three-dimensional ordered porous microstructure. In the procedure where a three-dimensional ordered microstructure is produced using a colloidal crystal templating process, the particles in the three-dimensional ordered microstructure is subjected to deformation, so as to effectively increase the contact between orderly arranged particles while removing the solvent used to suspend the particles. The invention further relates to a monolithic column produced thereby. Compared to the monolithic columns produced by conventional methods, the monolithic column according to the invention is characterized in having a higher aspect ratio and a higher pore regularity, while the connecting pores in the column are relatively large in pore size.

Description

三維有序多孔微結構的製造方法以及由此方法所製成的整體柱Method for manufacturing three-dimensional ordered porous microstructure and integral column made by the same method

本發明涉及三維有序多孔微結構的製造方法。本發明也涉及藉由所述製造方法所製成的具有高厚度的三維有序多孔微結構,特別是具有高深寬比的整體柱。The present invention relates to a method of fabricating a three-dimensional ordered porous microstructure. The present invention also relates to a three-dimensional ordered porous microstructure having a high thickness produced by the manufacturing method, particularly a monolithic column having a high aspect ratio.

多孔性材料中的孔洞若其孔徑接近光波長且具有高度的排列秩序,則所述多孔性材料可能擁有特殊且高實用性的光學性質,可廣泛應用於光催化、生物載體、吸附、過濾、絕緣、色譜分離、半導體以及微量感應等領域。If the pores in the porous material have a pore diameter close to the wavelength of light and have a high order of arrangement, the porous material may have special and highly practical optical properties, and can be widely applied to photocatalysis, biological carriers, adsorption, filtration, Insulation, chromatographic separation, semiconductors and micro-sensing.

有序多孔微結構的基本架構為在一維、二維、或三維上具有週期性排列的介質所組成,其中一維的架構即是一般所謂的光學多層膜,它被廣泛用在光學鏡片上,由週期排列的多層介質膜造成一維的光子能隙,使某些波段的光子無法穿越,達成高效率的反射。具有二維、三維的週期性排列結構則是目前最受到重視的有序多孔微結構。The basic structure of an ordered porous microstructure consists of a medium having a periodic arrangement in one, two, or three dimensions, wherein the one-dimensional structure is a so-called optical multilayer film, which is widely used on optical lenses. The one-dimensional photonic energy gap is caused by the periodic arrangement of the multilayer dielectric film, so that photons in certain wavelength bands cannot pass through, achieving high-efficiency reflection. It has the two-dimensional and three-dimensional periodic arrangement structure, which is the most important ordered porous microstructure at present.

已知,能夠以自組裝模式製造三維有序多孔微結構,其主要是採用均一粒徑的聚苯乙烯、聚甲基丙烯酸甲酯或是二氧化矽等粒子,利用自然重力沉降、離心、真空抽氣過濾法等方式將粒子在一基板上自組裝形成三維有序微結構,再以其表面具有三維有序微結構的基板為模版,在該模版上添加無機氧烷單體使其進行溶膠凝膠反應以形成反結構(inverse structure),最後利用鍛燒與萃取等方式將模版移除,即可生成具有光子晶體性質的三維有序多孔微結構。所述製程一般稱為膠態晶體模版法(colloidal crystal templating),已經被公開於例如美國專利第6414043號和中華人民共和國專利公開第104976925A1號中。It is known that three-dimensional ordered porous microstructures can be fabricated in a self-assembly mode, mainly using particles of uniform particle size polystyrene, polymethyl methacrylate or cerium oxide, using natural gravity sedimentation, centrifugation, vacuum The particles are self-assembled on a substrate to form a three-dimensional ordered microstructure, and the substrate having a three-dimensional ordered microstructure on the surface thereof is used as a template, and an inorganic oxyalkyl monomer is added to the template to perform sol. The gel reacts to form an inverse structure, and finally the stencil is removed by means of calcination and extraction to form a three-dimensional ordered porous microstructure having photonic crystal properties. The process is generally referred to as colloidal crystal templating, and is disclosed, for example, in U.S. Patent No. 6,144,043 and the Patent Publication No. 104976925A1.

中華民國專利第I558866號揭露了一種用於製作三維有序微結構的方法,其涉及施加塑形電場來驅使粒子進行自組裝製程,從而形成一個呈六方最密堆積的粒子結構。專利合作條約公開號WO2017080496A1中所公開的方法涉及使粒子進行自組裝,於基板上形成呈最密堆積的三維有序微結構,並且在三維有序微結構與基板間建構一個犧牲層,使得三維有序多孔微結構在脫離基板時能夠維持結構的完整性。The Republic of China Patent No. I558866 discloses a method for fabricating a three-dimensional ordered microstructure involving applying a shaped electric field to drive the particles into a self-assembly process to form a hexagonal closest packed particle structure. The method disclosed in Patent Cooperation Publication No. WO2017080496A1 involves self-assembly of particles, forming a three-dimensional ordered microstructure on the substrate, and constructing a sacrificial layer between the three-dimensional ordered microstructure and the substrate, so that three-dimensional The ordered porous microstructure maintains structural integrity when detached from the substrate.

雖然利用上述技術已經能夠成功地製造出大面積的三維有序多孔微結構,但所述微結構的厚度仍然無法令人滿意。在建構三維有序微結構的過程中,至少有一部分的粒子是以最密堆積的形式排列,其中每個粒子都與相鄰的12個粒子相切。當所述粒子是硬質球體時,其與一相鄰粒子間的接觸理論上只有一個點。況且,由於所使用的粒子在粒徑上不可能完全均一,所以有些相鄰粒子間甚至完全沒有接觸。隨著三維有序微結構的厚度增加,粒子間接觸面積的不足容易造成的結構強度低下。尤其是,在使用三維有序微結構做為模版製作反結構之前,通常會進行一個加熱工序以除去溶劑。在此加熱工序中,受熱後快速揮發的溶劑容易破壞原本已經顯得脆弱的模版,使模版產生龜裂,造成反結構的製作良率低下。Although large-area three-dimensional ordered porous microstructures have been successfully fabricated using the above techniques, the thickness of the microstructures is still unsatisfactory. In the process of constructing a three-dimensional ordered microstructure, at least some of the particles are arranged in the closest packed form, wherein each particle is tangent to the adjacent 12 particles. When the particles are hard spheres, their contact with an adjacent particle is theoretically only one point. Moreover, since the particles used are not completely uniform in particle size, some adjacent particles are not even in contact at all. As the thickness of the three-dimensional ordered microstructure increases, the lack of contact area between the particles tends to result in low structural strength. In particular, a heating process is usually performed to remove the solvent before using the three-dimensional ordered microstructure as the stencil to make the inverse structure. In this heating process, the solvent which is rapidly volatilized after being heated is likely to damage the stencil which is already weak, causing cracks in the stencil, resulting in a low yield of the anti-structure.

理論上,具有高深寬比(high aspect ratio)的三維有序多孔微結構基於其規整的內部骨架網路和週期性的孔洞結構,非常適合做為整體柱(monolithic column),用於物質的層析分離。然而,現今的製程不但需耗費數日,難以達到大量生產的規模,且所完成的模版結構普遍出現粒子排列鬆散的現象,導致後續所完成的三維有序多孔微結構產品連續性甚差,其深寬比也受到限制。此外,現今膠態晶體模版製程中都是使用硬質球體,由於模版中相鄰粒子間的接觸面積很小,所以製造出來的反結構中的大孔間的連通孔將會太小,導致整體柱有傳質速率低下且背壓過高的問題。運用膠態晶體模版法來製作整體柱,還必須面對耗費時間且效率低下的範本移除工序。這些問題嚴重地降低了整體柱的製造良率以及其商業應用潛力。Theoretically, a three-dimensional ordered porous microstructure with a high aspect ratio is well suited as a monolithic column for the layer of matter based on its regular internal skeletal network and periodic pore structure. Separation. However, the current process not only takes several days, it is difficult to achieve the scale of mass production, and the finished template structure generally has a loose particle arrangement, resulting in a poor continuity of the subsequently completed three-dimensional ordered porous microstructure product. The aspect ratio is also limited. In addition, in today's colloidal crystal stencil process, hard spheres are used. Since the contact area between adjacent particles in the stencil is small, the interconnected pores between the large pores in the fabricated reverse structure will be too small, resulting in a monolithic column. There is a problem that the mass transfer rate is low and the back pressure is too high. The use of a colloidal crystal stencil to make a monolithic column also requires a time-consuming and inefficient template removal process. These problems severely reduce the manufacturing yield of the monolithic column and its commercial application potential.

因此,業界對於製作高厚度的三維有序微結構並且以其做為模版來製作出的三維有序多孔微結構,仍然有殷切的需求。Therefore, there is still a strong demand in the industry for the fabrication of three-dimensional ordered micro-structures of high-thickness three-dimensional ordered microstructures and using them as templates.

現在,本發明的發明人意外地發現,在運用膠態晶體模版法來製作三維有序微結構的過程中,於粒子完成自組裝後,可以使粒子發生形變,例如對於粒子進行加熱、加壓和溶解使其發生形變。這個使粒子發生形變的工序不但能夠有效地增進有序排列的粒子間的接觸,甚至可以由三維有序微結構去除用於懸浮粒子的溶劑,還使得受熱後快速揮發的溶劑不會實質破壞三維有序微結構。更重要的是,利用所述三維有序微結構做為模版所製成的整體柱,柱內的連通孔相較於運用慣用方法所形成的連通孔具有比較大的孔徑,具有傳質效率高且管柱背壓低的優點。據此,本發明解決了現有技術中存在的上述問題。Now, the inventors of the present invention have unexpectedly discovered that in the process of producing a three-dimensional ordered microstructure by using a colloidal crystal stencil method, after the particles are self-assembled, the particles can be deformed, for example, heating and pressurizing the particles. And dissolve to deform it. The process of deforming the particles not only can effectively improve the contact between the ordered particles, but also can remove the solvent used for the suspended particles by the three-dimensional ordered microstructure, and the solvent which is rapidly volatilized after being heated does not substantially destroy the three-dimensional. Ordered microstructure. More importantly, the three-dimensional ordered microstructure is used as a monolithic column made of a stencil, and the communication hole in the column has a relatively large aperture compared with the communication hole formed by the conventional method, and has high mass transfer efficiency. And the advantage of low back pressure of the column. Accordingly, the present invention solves the above problems in the prior art.

依據本發明的第一方面,其提供一種三維有序多孔微結構的製造方法,其特徵在於所述方法包括下列步驟:A.形成一由多個實質球狀粒子所組成的三維有序微結構,使得所述多個粒子彼此間存在有多個空隙;B.使所述三維有序微結構中的實質球狀粒子發生形變,使得所述粒子形變而具有一最長半徑R和一最短半徑r,其中r/R的比值大於/2但小於1;C.將反結構材料填入所述空隙;以及D.移除所述三維有序微結構,以獲得所述三維有序多孔微結構。According to a first aspect of the present invention, there is provided a method of fabricating a three-dimensional ordered porous microstructure, characterized in that the method comprises the steps of: A. forming a three-dimensional ordered microstructure composed of a plurality of substantially spherical particles Having a plurality of voids between the plurality of particles; B. deforming the substantially spherical particles in the three-dimensional ordered microstructure such that the particles are deformed to have a longest radius R and a shortest radius r Where r/R ratio is greater than /2 but less than 1; C. filling the void structure into the void; and D. removing the three-dimensional ordered microstructure to obtain the three-dimensional ordered porous microstructure.

在一個優選具體實施方案中,步驟B包含將所述三維有序微結構加熱,使所述多個粒子軟化而發生形變。在一 更優選具體實施方案中,所述粒子具有一玻璃轉換溫度,而所述步驟B中,是在一相較於所述玻璃轉換溫度高約0至20o C的溫度下,將所述三維有序微結構加熱。在另一 更優選具體實施方案中,所述粒子具有一玻璃轉換溫度,而所述步驟B中,是在一相較於所述玻璃轉換溫度低約1至15o C的溫度下,將所述三維有序微結構加熱。在一更優選具體實施方案中,於加熱的步驟中,是在一相較於所述玻璃轉換溫度低約3至15o C的溫度下,將所述三維有序微結構加熱。在一更優選具體實施方案中,是在一相較於所述玻璃轉換溫度低約3至10o C的溫度下,將所述三維有序微結構加熱。In a preferred embodiment, step B comprises heating the three-dimensional ordered microstructure to soften the plurality of particles to undergo deformation. In a more preferred embodiment, the particles have a glass transition temperature, and the step B, in comparison to a high temperature of the glass transition temperature of about 0 to 20 o C, and The Three-dimensional ordered microstructure heating. In another more preferred specific embodiment, the particles have a glass transition temperature, and the step B, is compared to a low temperature of the glass transition temperature of about 1 to 15 o C will The three-dimensional ordered microstructure is heated. In a more preferred embodiment, in the step of heating, the three-dimensional ordered microstructure is heated at a temperature that is about 3 to 15 o C lower than the glass transition temperature. In a more preferred embodiment, the three dimensional ordered microstructure is heated at a temperature that is about 3 to 10 o C lower than the glass transition temperature.

在另一個優選具體實施方案中,步驟B包含對於所述三維有序微結構施加壓力,使所述多個粒子相互擠壓而發生形變。In another preferred embodiment, step B includes applying pressure to the three-dimensional ordered microstructure to cause the plurality of particles to deform against one another.

在另一個優選具體實施方案中,步驟B包含將所述三維有序微結構浸泡於一能夠溶解所述多個粒子的溶劑中,使所述多個粒子溶漲而發生形變In another preferred embodiment, step B comprises immersing the three-dimensional ordered microstructure in a solvent capable of dissolving the plurality of particles, causing the plurality of particles to swell and deform

在一優選具體實施方案中,所述粒子是由單一類型高分子均聚物或共聚物所製成的均質球體,而且所述玻璃轉換溫度是粒子的整體玻璃轉換溫度。在另一優選具體實施方案中,所述粒子具有一核殼結構,各粒子具有一核心以及一包覆於核心外的外殼,而所述核心和外殼分別由不同高分子材料所製成,而且所述玻璃轉換溫度是外殼的玻璃轉換溫度。In a preferred embodiment, the particles are homogeneous spheres made from a single type of polymeric homopolymer or copolymer, and the glass transition temperature is the overall glass transition temperature of the particles. In another preferred embodiment, the particles have a core-shell structure, each particle has a core and a shell encased outside the core, and the core and the shell are respectively made of different polymer materials, and The glass transition temperature is the glass transition temperature of the outer casing.

在一優選具體實施方案中,所述形成三維有序微結構的步驟包含使所述多個粒子分散於一溶劑以形成一懸浮液,並且容許所述多個粒子進行自組裝,以形成所述三維有序微結構。In a preferred embodiment, the step of forming a three-dimensional ordered microstructure comprises dispersing the plurality of particles in a solvent to form a suspension, and allowing the plurality of particles to self-assemble to form the Three-dimensional ordered microstructure.

在一優選具體實施方案中,於加熱的步驟中,包含將所述三維有序微結構加熱一段時間,以使得所述多個粒子軟化並且去除所述溶劑。In a preferred embodiment, in the step of heating, the three-dimensional ordered microstructures are heated for a period of time to soften the plurality of particles and remove the solvent.

依據上述技術特徵,所述三維有序微結構中,至少有一部分的粒子是以最密堆積的形式排列。According to the above technical feature, at least a part of the particles in the three-dimensional ordered microstructure are arranged in the most closely packed form.

在一優選具體實施方案中,於移除三維有序微結構的步驟中,包含運用一選自於由索氏萃取法和超臨界流體萃取法所組成的群組的方法來移除所述三維有序微結構。In a preferred embodiment, the step of removing the three-dimensional ordered microstructure includes removing the three-dimensional shape by using a method selected from the group consisting of Soxhlet extraction and supercritical fluid extraction. Ordered microstructure.

上述三維有序多孔微結構的製造方法適用於製作具有高厚度的三維有序多孔微結構,特別適用於製作具有高深寬比的整體柱。而且,相較於運用慣用製程所製成的整體柱,本申請的整體柱具有高深寬比、高孔洞規律性和連通孔孔徑大的結構特點。The above-described three-dimensional ordered porous microstructure manufacturing method is suitable for fabricating a three-dimensional ordered porous microstructure having a high thickness, and is particularly suitable for producing a monolithic column having a high aspect ratio. Moreover, the integral column of the present application has a high aspect ratio, a high hole regularity, and a structural feature of a large aperture of the communicating hole compared to a monolithic column produced by a conventional process.

因此,根據本發明的第二方面,其提供一種整體柱,其藉由上述三維有序多孔微結構的製造方法所製成。Therefore, according to a second aspect of the present invention, there is provided a monolithic column which is produced by the above-described method of manufacturing a three-dimensional ordered porous microstructure.

根據本發明的協力廠商面,其也提供一種整體柱,其包含:數個有序排列的球狀巨孔,具有介於100納米至6微米的均一直徑,以及數個連通巨孔的連通孔,具有介於10納米至3微米的均一直徑,其中所述巨孔中有至少70%是以最密堆積的形式排列,以及所述巨孔具有一最長半徑R和一最短半徑r,其中所述r/R的比值小於或等於0.99。According to the third party of the present invention, it also provides a monolithic column comprising: a plurality of ordered spherical macropores having a uniform diameter of between 100 nm and 6 microns, and a plurality of communicating holes connecting the macropores Having a uniform diameter of between 10 nanometers and 3 micrometers, wherein at least 70% of the macropores are arranged in a densely packed form, and the macropores have a longest radius R and a shortest radius r, wherein The ratio of r/R is less than or equal to 0.99.

在一優選具體實施方案中,所述巨孔中有至少80%是以最密堆積的形式排列。在一更優選具體實施方案中,所述巨孔中有至少90%是以最密堆積的形式排列。在一最優選具體實施方案中,所述巨孔中有至少95%是以最密堆積的形式排列。In a preferred embodiment, at least 80% of the macropores are arranged in the closest packed form. In a more preferred embodiment, at least 90% of the macropores are arranged in the closest packed form. In a most preferred embodiment, at least 95% of the macropores are arranged in the closest packed form.

在一優選具體實施方案中,所述r/R的比值小於或等於0.98。在一更優選具體實施方案中,所述r/R的比值小於或等於0.96。在一最優選具體實施方案中,所述r/R的比值小於或等於0.94。In a preferred embodiment, the ratio of r/R is less than or equal to 0.98. In a more preferred embodiment, the ratio of r/R is less than or equal to 0.96. In a most preferred embodiment, the ratio of r/R is less than or equal to 0.94.

在一優選具體實施方案中,所述整體柱具有至少1公分的高度,並且具有不低於1的深寬比。In a preferred embodiment, the monolithic column has a height of at least 1 cm and has an aspect ratio of no less than one.

本發明的目的、特徵及優點將通過實施例結合附圖進行詳細說明。The objects, features, and advantages of the present invention will be described in detail by the embodiments and the accompanying drawings.

除非另外說明,否則本申請說明書和申請專利範圍中所使用的下列用語具有下文給予的定義。請注意,本申請說明書和申請專利範圍中所使用的單數形用語“一”意欲涵蓋在一個以及一個以上的所載事項,例如至少一個、至少二個或至少三個,而非意味著僅僅具有單一個所載事項。此外,申請專利範圍中使用的“包含”、“具有”等開放式連接詞是表示請求項中所記載的元件或成分的組合中,不排除請求項未載明的其他組件或成分。亦應注意到用語“或”在意義上一般也包括“及/或”,除非內容另有清楚表明。本申請說明書和申請專利範圍中所使用的用語“約”或“實質上”,是用以修飾任何可些微變化的誤差,但這種些微變化並不會改變其本質。Unless otherwise stated, the following terms used in the specification and claims of the present application have the definitions given below. It is to be understood that the singular <RTI ID=0.0>&quot;&quot;&quot;&quot;&quot; A single item. In addition, the open-ended conjunctions such as "including" and "having" used in the claims are intended to mean a combination of elements or components recited in the claims, and do not exclude other components or components not claimed. It should also be noted that the term "or" generally also includes "and/or" in the sense unless the content clearly indicates otherwise. The terms "about" or "substantially" used in the specification and claims of the present application are intended to modify any minor variations, but such minor variations do not alter the nature.

本發明主要提供一種三維有序多孔微結構的製造方法,其適用於製作具有高厚度的三維有序多孔微結構,特別適用於製作具有高深寬比的整體柱。如圖1所示,所述三維有序多孔微結構的製造方法包括:A.形成一由多個實質球狀粒子所組成的三維有序微結構,使得所述多個粒子彼此間存在有多個空隙;B.使所述三維有序微結構中的實質球狀粒子發生形變,使得所述粒子形變而具有一最長半徑R和一最短半徑r,其中r/R的比值大於/2但小於1;C.將反結構材料填入所述空隙;以及D.移除所述三維有序微結構,以獲得所述三維有序多孔微結構。The invention mainly provides a method for manufacturing a three-dimensional ordered porous microstructure, which is suitable for fabricating a three-dimensional ordered porous microstructure having a high thickness, and is particularly suitable for producing a monolithic column having a high aspect ratio. As shown in FIG. 1, the method for fabricating the three-dimensional ordered porous microstructure comprises: A. forming a three-dimensional ordered microstructure composed of a plurality of substantially spherical particles such that the plurality of particles exist between each other. a void; B. deforming the substantially spherical particles in the three-dimensional ordered microstructure such that the particles are deformed to have a longest radius R and a shortest radius r, wherein the ratio of r/R is greater than /2 but less than 1; C. filling the void structure into the void; and D. removing the three-dimensional ordered microstructure to obtain the three-dimensional ordered porous microstructure.

所述三維有序微結構是指使粒子進行三維有序排列所獲得的微結構。所謂“有序”是指粒子間的距離呈現規律,優選為粒子間的距離大致相等。組成這種微結構的粒子通常具有均一的粒徑、形狀、化學組成、內部結構或表面性質,以利於粒子間產生非共價交互作用,從而自發性地排列成類似於晶格的規律結構。在一優選具體實施方案中,這些粒子是粒徑均一的單分散性實質球狀顆粒,更優選為其粒徑介於1納米至1000微米,例如介於100納米至6微米。The three-dimensional ordered microstructure refers to a microstructure obtained by three-dimensionally ordering particles. The term "ordered" means that the distance between particles appears to be regular, and it is preferred that the distance between the particles is substantially equal. The particles constituting such a microstructure generally have a uniform particle size, shape, chemical composition, internal structure or surface properties to facilitate non-covalent interaction between the particles, thereby spontaneously arranging into a regular structure similar to a lattice. In a preferred embodiment, the particles are monodisperse substantially spherical particles of uniform particle size, more preferably having a particle size between 1 nanometer and 1000 microns, such as between 100 nanometers and 6 microns.

所述三維有序微結構中至少有一部分的粒子是以最密堆積的形式排列,亦即相鄰的粒子彼此相切,任三個兩兩相切的粒子的球心構成一個等邊三角形,每個粒子的配位數皆為12,而粒子與粒子間留下了多個近似三角形的空隙。更優選為所述三維有序微結構中至少有一部分顆粒是以三維六方最密堆積(hexagonal closest packing;hcp)、三維面心立方堆積(face centered cubic packing;fcc)或它們的組合的形式來排列。以上述三維有序微結構為模版所製作的反結構(inverse structure)即為所述三維有序有孔微結構。At least a part of the particles in the three-dimensional ordered microstructure are arranged in the most closely packed form, that is, adjacent particles are tangent to each other, and the center of any three two-two tangent particles constitutes an equilateral triangle. Each particle has a coordination number of 12, and the particles leave a plurality of approximately triangular gaps between the particles. More preferably, at least a part of the particles in the three-dimensional ordered microstructure are in the form of a hexagonal closest packing (hcp), a face centered cubic packing (fcc) or a combination thereof. arrangement. The inverse structure produced by using the above three-dimensional ordered microstructure as a template is the three-dimensional ordered porous structure.

所述三維有序微結構可以透過粒子的自組裝而形成。本說明書中所使用的“自組裝”術語是指微米或納米等級的粒子響應外在環境中的狀況而聚集成一個三維有序微結構,特別是指這些粒子間發生凡德瓦力(van der Waals' force)、π-π交互作用、氫鍵等非共價交互作用,從而在近熱力學平衡條件下自發性地形成所述三維有序微結構。The three-dimensional ordered microstructure can be formed by self-assembly of particles. As used in this specification, the term "self-assembly" refers to the aggregation of micro- or nano-scale particles into a three-dimensional ordered microstructure in response to conditions in the external environment, in particular the van der force between these particles. Non-covalent interactions such as Waals ' force), π-π interaction, hydrogen bonding, etc., thereby spontaneously forming the three-dimensional ordered microstructure under near thermodynamic equilibrium conditions.

製作這些粒子的材料的非限制性實例包括高分子材料、無機材料、金屬等。高分子材料優選為熱塑性高分子材料,高分子材料的實例包括但不限於高分子均聚物,例如聚苯乙烯(PS)、聚甲基丙烯酸甲酯(PMMA)、聚甲基丙烯酸丁酯(PBMA)、聚丙烯酸甲酯、聚丙烯酸乙酯(PEA)、聚丙烯酸丁酯(PBA)、聚甲基丙烯酸苯甲酯、聚α-甲基苯乙烯、聚甲基丙烯酸苯酯、聚甲基丙烯酸二苯酯和聚甲基丙烯酸環已烷酯;以及高分子共聚物,例如苯乙烯-丙烯腈共聚物、苯乙烯-甲基丙烯酸甲酯共聚物、苯乙烯-甲基丙烯酸丁酯共聚物和苯乙烯-丙烯酸丁酯共聚物。無機材料的實例包括但不限於氧化鈦、氧化鋅、氧化鈰、氧化錫、氧化鉈、氧化鋇、氧化鋁、氧化釔、氧化鋯、氧化銅、氧化鎳、氧化矽。金屬材料的實例包括但不限於金、銀、銅、鉑、鋁、鋅、鈰、鉈、鋇、釔、鋯、錫、鈦、鎘和鐵,以及它們的合金。Non-limiting examples of materials for making these particles include polymeric materials, inorganic materials, metals, and the like. The polymer material is preferably a thermoplastic polymer material, and examples of the polymer material include, but are not limited to, polymer homopolymers such as polystyrene (PS), polymethyl methacrylate (PMMA), and polybutyl methacrylate ( PBMA), polymethyl acrylate, polyethyl acrylate (PEA), polybutyl acrylate (PBA), polymethyl methacrylate, poly alpha-methyl styrene, polyphenyl methacrylate, polymethyl Diphenyl acrylate and polycycloalkyl methacrylate; and high molecular copolymers such as styrene-acrylonitrile copolymer, styrene-methyl methacrylate copolymer, styrene-butyl methacrylate copolymer And a styrene-butyl acrylate copolymer. Examples of inorganic materials include, but are not limited to, titanium oxide, zinc oxide, cerium oxide, tin oxide, cerium oxide, cerium oxide, aluminum oxide, cerium oxide, zirconium oxide, copper oxide, nickel oxide, cerium oxide. Examples of metallic materials include, but are not limited to, gold, silver, copper, platinum, aluminum, zinc, lanthanum, cerium, lanthanum, cerium, zirconium, tin, titanium, cadmium, and iron, and alloys thereof.

在一優選具體實施方案中,所使用的粒子是由高分子材料所製成,更優選為所使用的粒子是由一選自於苯乙烯單體、甲基丙烯酸酯類單體和丙烯酸酯類單體聚合而成的均聚物或共聚物所製成。在一具體實施方案中,所使用的粒子是由單一類型高分子均聚物或共聚物所製成的均質球體。在另一具體實施方案中,所使用的粒子具有一核殼結構(core-shell architecture)。本申請所稱“核殼結構”意指各粒子具有一核心以及一包覆於核心外的外殼,而所述核心和外殼分別由不同高分子材料所製成。上述微米或納米級粒子的製造方法屬於現有技術。舉例來說,當所使用的粒子是聚苯乙烯顆粒時,可採用無乳化劑的乳化聚合法合成,做出粒徑數百納米的聚苯乙烯球狀顆粒。當希望形成具有核殼結構的粒子時,可以同樣地採用無乳化劑的乳化聚合法,先使第一種單體進行聚合反應一段時間以形成核心,再加入第二種單體形成由第一種和第二種單體的共聚物所構成的外殼。In a preferred embodiment, the particles used are made of a polymeric material, more preferably the particles used are selected from the group consisting of styrene monomers, methacrylate monomers and acrylates. A homopolymer or a copolymer obtained by polymerizing a monomer. In a specific embodiment, the particles used are homogeneous spheres made from a single type of polymeric homopolymer or copolymer. In another specific embodiment, the particles used have a core-shell architecture. As used herein, "core-shell structure" means that each particle has a core and a shell that is coated outside the core, and the core and the shell are respectively made of different polymer materials. The above-described method for producing micro or nano-sized particles belongs to the prior art. For example, when the particles used are polystyrene particles, they can be synthesized by an emulsion polymerization method without an emulsifier to form polystyrene spherical particles having a particle diameter of several hundred nanometers. When it is desired to form particles having a core-shell structure, an emulsion polymerization method without an emulsifier can be similarly employed, in which the first monomer is first subjected to polymerization for a period of time to form a core, and then the second monomer is added to form a first An outer shell of a copolymer of a second monomer.

於形成三維有序微結構的步驟A中,可以首先製備懸浮液,其中含有多個均勻分散的膠體球狀粒子。舉例來說,當所使用的粒子是聚苯乙烯均聚物或共聚物顆粒時,可以使粒子均勻分散在一溶劑中,而形成一懸浮液。適用的溶劑為能夠達成上述均勻分散粒子的目的而且不會與粒子或製造過程中其他成份產生實質化學反應的任何已知溶劑,其可以是有機溶液或水溶液,包括但不限於水和C1-6醇類 ,優選為水以及甲醇、乙醇和它們的水溶液。可以利用自然重力沉降、離心、真空抽氣或電泳等其中一種方式,驅動粒子進行自組裝,形成由多個粒子呈最密堆積的三維有序微結構。在一優選具體實施方案中,所述懸浮液被置入長管狀模具中,以便形成具有高深寬比的三維有序微結構,以便接著使用所述三維有序微結構做模版製成具有高深寬比的三維有序多孔微結構。In the step A of forming a three-dimensional ordered microstructure, a suspension may be first prepared containing a plurality of uniformly dispersed colloidal spherical particles. For example, when the particles used are polystyrene homopolymer or copolymer particles, the particles can be uniformly dispersed in a solvent to form a suspension. Suitable solvents are any known solvents which are capable of achieving the above-described purpose of uniformly dispersing the particles and which do not substantially react with the particles or other components of the manufacturing process, which may be organic solutions or aqueous solutions including, but not limited to, water and C 1- 6 alcohols , preferably water and methanol, ethanol and aqueous solutions thereof. One of the methods of natural gravity sedimentation, centrifugation, vacuum pumping, or electrophoresis can be used to drive the particles to self-assemble to form a three-dimensional ordered microstructure in which a plurality of particles are densely packed. In a preferred embodiment, the suspension is placed in a long tubular mold to form a three-dimensional ordered microstructure having a high aspect ratio for subsequent use of the three-dimensional ordered microstructure for stenciling to have a high depth and width. The three-dimensional ordered porous microstructure.

本申請的發明人發現,當給予所述三維有序微結構一個化學性或物理性處理,使位於其中的粒子發生形變時,三維有序微結構中的相鄰粒子將會因形變而使彼此間的接觸面積增加, 導致三維有序微結構具有比較緊密的結構。本說明書中使用的術語“形變”涵蓋任何能夠使三維有序微結構中的粒子的形狀發生實質變化的化學性或物理性處理。在使用實質球狀粒子的具體實施方案中,這些粒子在未發生形變前的形狀接近真球(true sphere),而於接受化學性或物理性處理後發生形變而與相鄰粒子接觸,因而具有一最長半徑R和一最短半徑r,其中r/R的比值大於/2但小於1。適用的處理工序可以視粒子的材質來選定,其包括但不限於加熱、加壓、溶解等。The inventors of the present application have found that when a chemical or physical treatment is applied to the three-dimensional ordered microstructure to deform the particles located therein, adjacent particles in the three-dimensional ordered microstructure will be deformed by each other. The increased contact area between the three leads to a three-dimensional ordered microstructure with a relatively compact structure. The term "deformation" as used in this specification encompasses any chemical or physical treatment that enables a substantial change in the shape of the particles in a three-dimensional ordered microstructure. In a specific embodiment using substantially spherical particles, the particles are close to a true sphere before being deformed, and deformed to be in contact with adjacent particles after being subjected to chemical or physical treatment, thereby having a longest radius R and a shortest radius r, wherein the ratio of r/R is greater than /2 but less than 1. Suitable processing steps can be selected depending on the material of the particles, including but not limited to heat, pressure, dissolution, and the like.

在一個優選具體實施方案中,步驟B包含將所述三維有序微結構加熱,使所述多個粒子軟化而發生形變。本申請中所使用的用語“軟化”是指使有序排列的粒子在熱的作用下發生形變進而相互黏結。粒子的軟化可以在電子顯微鏡下進行觀察及測量。圖2顯示未經加熱軟化的聚苯乙烯球狀粒子,其形狀接近真球(true sphere)。圖3顯示以最密堆積形式排列的聚苯乙烯粒子經過加熱軟化,開始發生形變。於此時,各個粒子與相鄰粒子間的接觸面積增加。以軟化的球狀粒子為例,其最短半徑r與最長半徑R的比值將會大於/2但小於1, 即。例如,圖3所示粒子的r/R比值約為0.94。三維有序微結構中相鄰粒子間的接觸面積大小,與後續所製成的三維有序多孔微結構中巨孔間的連通孔尺寸相關。換句話說,r/R的比值愈小,本申請所製成的三維有序多孔微結構中連通孔相對於巨孔尺寸的孔徑就愈大,而連通孔的孔徑大約等於2r/。在一個優選具體實施方案中,所述r/R小於或等於0.99,較佳為小於或等於0.98,更佳為小於或等於0.96,例如小於或等於0.94。非球狀粒子,例如橢圓形粒子,其r/R比值也會隨著受熱軟化而傾向於減小。圖4顯示聚苯乙烯球狀粒子長時間受熱變形,致使各個粒子與相鄰的6個粒子完全密合,彼此間沒有孔隙,形成為近似正六邊形的構形,而這個結構無法供用做為反結構的模版。因此,在本申請中,粒子軟化的程度可以藉由調整加熱的溫度和/或時間而受到控制,以使得粒子間保留適當的孔隙。In a preferred embodiment, step B comprises heating the three-dimensional ordered microstructure to soften the plurality of particles to undergo deformation. As used herein, the term "softening" means that the ordered particles are deformed by heat and bonded to each other. The softening of the particles can be observed and measured under an electron microscope. Figure 2 shows polystyrene spherical particles that have not been softened by heat and have a shape close to the true sphere. Figure 3 shows that the polystyrene particles arranged in the closest packed form are softened by heating and begin to deform. At this time, the contact area between each particle and the adjacent particle increases. Taking softened spherical particles as an example, the ratio of the shortest radius r to the longest radius R will be greater than /2 but less than 1, ie . For example, the particles shown in Figure 3 have an r/R ratio of about 0.94. The contact area between adjacent particles in the three-dimensional ordered microstructure is related to the size of the interconnected pores between the macropores in the three-dimensional ordered porous microstructure. In other words, the smaller the ratio of r/R, the larger the pore size of the communicating pores relative to the pore size in the three-dimensional ordered porous microstructure prepared in the present application, and the pore diameter of the communicating pores is approximately equal to 2r/ . In a preferred embodiment, the r/R is less than or equal to 0.99, preferably less than or equal to 0.98, more preferably less than or equal to 0.96, such as less than or equal to 0.94. Non-spherical particles, such as elliptical particles, have an r/R ratio that tends to decrease as they are softened by heat. Figure 4 shows that the polystyrene spherical particles are deformed by heat for a long time, so that the individual particles are completely in close contact with the adjacent six particles, and there is no pore between them, forming an approximately hexagonal configuration, and this structure cannot be used as a structure. Anti-structured template. Thus, in the present application, the degree of softening of the particles can be controlled by adjusting the temperature and/or time of heating to maintain proper porosity between the particles.

如相關技術領域具有通常知識的人員所熟悉,當本申請所使用的微米或納米級粒子是由結晶材料製成時,其將會在熔點以上的溫度開始熔化。當本申請所使用的微米或納米級粒子是由非晶型(amorphous)材料製成時,其可以具有一玻璃轉換溫度。本申請所使用的術語“玻璃轉換溫度”,或是縮寫為“Tg ”,意指構成粒子的材料由其剛性具硬脆特性的玻璃態(glassy state)轉變成柔軟可撓曲的橡膠態(rubbery state)的溫度。玻璃轉換溫度可以根據ASTM-E1356而採用示差掃描量熱法(differential scanning calorimetry)測量出來。已知高分子材料的Tg 可以藉由共聚合其他單體、改變分支程度、調整鏈長、調整交聯程度、添加塑化劑等手段來改變。舉例來說,市面上販賣的苯乙烯均聚物球體粒子的Tg 約為105o C。如下文實施例1至6所示,藉由使不同單體與苯乙烯進行共聚合,可以有效地降低聚苯乙烯球體粒子的Tg As is known to those of ordinary skill in the relevant art, when the micron or nanoscale particles used herein are made of a crystalline material, they will begin to melt at a temperature above the melting point. When the micron or nanoscale particles used in the present application are made of an amorphous material, they may have a glass transition temperature. As used herein, the term "glass transition temperature", or abbreviated as " Tg ", means that the material constituting the particle is converted from a rigid glassy state to a soft, flexible rubbery state. (rubbery state) temperature. The glass transition temperature can be measured by differential scanning calorimetry according to ASTM-E1356. T g polymer material may be known by other copolymerizable monomers, changing the degree of branching, the chain length adjustment, adjustment of the degree of crosslinking, adding a plasticizer or the like means to change. For example, commercially available styrene homopolymer sphere particles have a Tg of about 105 o C. As shown in Example 1-6, by making different monomers copolymerizable with styrene, can effectively reduce the T g of polystyrene spherical particles.

先前技術已知,球體粒子在高於其Tg 的溫度下將會呈現橡膠態而熔融變形,在低於其Tg 的溫度下則會呈現硬質球體的形式。據此,在加熱步驟B的一個優選具體實施方案中,粒子是在一相較於其玻璃轉換溫度高約0至20o C的溫度下,加熱一段時間,以使得粒子軟化。由於粒子在其橡膠態下將會快速地發生形變,加熱時間通常是短暫的,例如在數秒至數分鐘的範圍內。較佳為選用大粒徑的粒子,例如選用粒徑大於1微米的粒子,避免粒子形變過快。加熱後,可以使溫度下降至一相較於粒子的Tg 更低的溫度,使粒子回復其玻璃態,並且在這個溫度下利用揮發、真空抽氣等方式去除在步驟A中用於懸浮粒子的溶劑。Known in the prior art, spherical particles at a temperature above its T g will exhibit rubbery melted deformed, hard sphere form at temperatures below its T g of the presentation will be. Accordingly, the heating step B is a preferred embodiment, the particles are in a higher temperature as compared to its glass transition temperature from about 0 to 20 o C, the heating period of time, so that the particles soften. Since the particles will deform rapidly in their rubbery state, the heating time is usually short-lived, for example in the range of seconds to minutes. It is preferred to use particles having a large particle size, for example, particles having a particle diameter of more than 1 micrometer are used to prevent the particles from deforming too fast. After heating, the temperature can be lowered to a lower temperature T g as compared to the particles, the particles return to its glassy state, and utilizes volatile at this temperature, vacuum exhaust, etc. for removal of suspended particles in step A Solvent.

本申請的發明人意外地發現,將粒子在一相較於其玻璃轉換溫度低約1至15o C的溫度下加熱處理一段時間後,雖然粒子不會被轉換至其橡膠態但卻會呈現出軟化的現象。雖然不希望被理論所束縛,但本申請的發明人相信,構成粒子的材料在接近其Tg 的溫度下,其中的分子會接受到足夠能量而開始流動,導致粒子有些許軟化現象。在所使用的粒子是由單一類型高分子均聚物或共聚物所製成的均質球體的具體實施方案中,所述玻璃轉換溫度是指粒子的整體玻璃轉換溫度(bulkTg )。在所使用的粒子具有核殼結構的具體實施方案中,粒子的核心可以某一單體(例如苯乙烯)的均聚物製成,其外殼則可以由所述單體與另一種單體(例如甲基丙烯酸丁酯)的共聚物製成。在此情形下,所述玻璃轉換溫度是指外殼的Tg ,其可以比核心的Tg 更低,所以在上述溫度範圍內比核心更容易軟化。The inventors of the present application have unexpectedly discovered that after the particles are heat treated for a period of time at a temperature about 1 to 15 o C lower than their glass transition temperature, although the particles are not converted to their rubbery state, they are presented. Softening phenomenon. While not wishing to be bound by theory, the inventors believe the present application, a material constituting the particles at a temperature close to its T g, wherein the molecule will receive enough energy to start to flow, resulting in a slight softening particles. In a particular embodiment where the particles used are homogeneous spheres made from a single type of polymeric homopolymer or copolymer, the glass transition temperature refers to the bulk glass transition temperature (bulk Tg ) of the particles. In a specific embodiment in which the particles used have a core-shell structure, the core of the particles may be made of a homopolymer of a monomer such as styrene, and the outer shell may be from the monomer to another monomer ( For example, a copolymer of butyl methacrylate). In this case, the glass transition temperature T g refers to housing, which may be lower than the core T g, so that the core than in the above temperature range to soften more easily.

據此,在加熱步驟B的另一個優選具體實施方案中,粒子是在一相較於其玻璃轉換溫度低約1至15o C的溫度下,較佳為在一相較於粒子的Tg 低約3至10o C的溫度下,例如在一相較於粒子的Tg 低約3至5o C的溫度下,加熱一段時間,以使得粒子軟化,較佳為同時去除在步驟A中用於懸浮粒子的溶劑。為了避免溶劑受熱流動過快而破壞三維有序微結構,加熱的溫度較佳為被選定成一實質低於溶劑的沸點但可以容許溶劑有效地揮發的溫度。在使用水或C1-6醇類 ,例如水、甲醇、乙醇或它們的水溶液,做為溶劑的具體實施方案中,由於所使用溶劑的沸點低,較佳為用於建構三維有序微結構的粒子是一種具有低Tg 的粒子,以便在步驟B中選定一個能夠同時使粒子軟化並且去除溶劑的加熱溫度。在優選的具體實施方案中,所述粒子的Tg 位於0o C至100o C的範圍內,更優選為位於50o C至95o C的範圍內,最優選為位於60o C至90o C的範圍內,例如位於75o C至85o C的範圍內。加熱的時間並無特別限制,只要達成使粒子軟化並且去除溶劑的目的即可。一般來說,加熱溫度愈低,加熱時間就必須愈長,才能夠達成上述目的。加熱時間可以在數分鐘至數天,優選為在數十分鐘至一天內,以實現大量生產。Accordingly, in another preferred embodiment of the heating step B, the particles are at a temperature which is about 1 to 15 o C lower than the glass transition temperature, preferably in a phase compared to the T g of the particles. At a temperature of about 3 to 10 o C lower, for example, at a temperature of about 3 to 5 o C lower than the T g of the particles, heating is carried out for a period of time to soften the particles, preferably simultaneously in step A. A solvent used to suspend particles. In order to avoid the solvent being heated too fast to destroy the three-dimensional ordered microstructure, the heating temperature is preferably selected to be a temperature substantially lower than the boiling point of the solvent but allowing the solvent to be effectively volatilized. In a specific embodiment using water or a C 1-6 alcohol such as water, methanol, ethanol or an aqueous solution thereof as a solvent, since the solvent used has a low boiling point, it is preferably used for constructing a three-dimensional ordered microstructure. The particles are particles having a low Tg in order to select a heating temperature in step B which simultaneously softens the particles and removes the solvent. In a preferred embodiment, the Tg of the particles is in the range of 0 o C to 100 o C, more preferably in the range of 50 o C to 95 o C, most preferably in the range of 60 o C to 90 Within the range of o C, for example, in the range of 75 o C to 85 o C. The heating time is not particularly limited as long as the purpose of softening the particles and removing the solvent is achieved. In general, the lower the heating temperature, the longer the heating time must be, in order to achieve the above object. The heating time may be from several minutes to several days, preferably from several tens of minutes to one day, to achieve mass production.

在另一個優選具體實施方案中,步驟B包含對於所述三維有序微結構施加壓力,使所述多個粒子相互擠壓而發生形變。施加壓力的工序包括但不限於離心、真空抽氣等,以便在同一方向上對於粒子施加壓力(例如5,000 psi或以上)。隨後利用揮發、真空抽氣等方式去除在步驟A中用於懸浮粒子的溶劑。在這個具體實施方案中,較佳為所述粒子具有核殼結構,其中外殼較軟而核心較硬,使得當粒子因承受壓力而相互擠壓時,軟質的外殼發生形變,致使粒子間的接觸面積增加,且r/R的比值落在/2至1的範圍內。In another preferred embodiment, step B includes applying pressure to the three-dimensional ordered microstructure to cause the plurality of particles to deform against one another. The process of applying pressure includes, but is not limited to, centrifugation, vacuum pumping, etc., to apply pressure (e.g., 5,000 psi or more) to the particles in the same direction. The solvent used to suspend the particles in the step A is then removed by means of volatilization, vacuum evacuation or the like. In this embodiment, it is preferred that the particles have a core-shell structure in which the outer shell is soft and the core is hard so that when the particles are pressed against each other due to pressure, the soft outer shell is deformed, resulting in contact between the particles. The area increases and the ratio of r/R falls /2 to 1 range.

在另一個優選具體實施方案中,步驟B包含將所述三維有序微結構浸泡於一能夠溶解所述多個粒子的溶劑中,使所述多個粒子溶漲而發生形變。較佳為進行步驟B前,預先藉由揮發、真空抽氣等方式去除在步驟A中用於懸浮粒子的溶劑。在所使用的粒子是由高分子材料所製成的具體實施方案中,優選為所述溶劑是有機溶劑,更優選為由有機溶劑與水混合所得到的溶劑系統,以適當降低對於粒子的溶解度。在粒子是由苯乙烯單體聚合而成的均聚物或共聚物所製成的具體實施方案中,所述溶劑包括但不限於苯乙烯、甲苯、氯環己烷以及它們與水的混合物。在粒子是由甲基丙烯酸酯類單體聚合而成的均聚物或共聚物所製成的具體實施方案中,所述溶劑包括但不限於C1-4醇、 1,4-二惡烷、苯、正己烷以及它們與水的混合物。也可使用丙酮、甲乙酮、二甲基甲醯胺、乙酸乙酯等有機溶劑,及它們與水的混合物。當所述三維有序微結構浸泡于溶劑時,粒子表面的分子鏈將會因為接觸到溶劑而開始鬆散,造成粒子有些微溶脹的現象, 致使粒子間的接觸面積增加,且r/R的比值落在/2至1的範圍內。可以藉由調整浸泡時間及/或浸泡溫度來調控粒子間的接觸面積。In another preferred embodiment, step B comprises immersing the three-dimensional ordered microstructure in a solvent capable of dissolving the plurality of particles, causing the plurality of particles to swell and deform. Preferably, the solvent for suspending particles in the step A is removed in advance by volatilization, vacuum evacuation or the like before the step B is carried out. In a specific embodiment in which the particles used are made of a polymer material, it is preferred that the solvent is an organic solvent, more preferably a solvent system obtained by mixing an organic solvent with water to appropriately reduce the solubility to the particles. . In a particular embodiment where the particles are made from a homopolymer or copolymer of a styrene monomer, the solvents include, but are not limited to, styrene, toluene, chlorocyclohexane, and mixtures thereof with water. In a specific embodiment in which the particles are made of a homopolymer or a copolymer obtained by polymerizing a methacrylate monomer, the solvent includes, but is not limited to, a C 1-4 alcohol, 1,4-dioxane. , benzene, n-hexane and their mixture with water. Organic solvents such as acetone, methyl ethyl ketone, dimethylformamide, ethyl acetate, and the like, and mixtures thereof with water can also be used. When the three-dimensional ordered microstructure is immersed in a solvent, the molecular chain on the surface of the particle will start to loose due to contact with the solvent, causing the particles to slightly swell, resulting in an increase in the contact area between the particles and the ratio of r/R. Fall in /2 to 1 range. The contact area between the particles can be adjusted by adjusting the soaking time and/or the soaking temperature.

在填覆空隙的步驟C中,將反結構材料填入三維有序微結構的空隙。反結構材料包括但不限於:金屬,例如金、銀、銅、鎳、鉑、鎳鎢合金等;氧化物,例如氧化鋅、二氧化矽、氧化亞銅等;以及高分子材料,例如聚苯乙烯、聚丙烯酸酯類、聚甲基丙烯酸酯類、丙烯醯胺類、聚吡咯、聚乙烯、聚丙烯、聚氯乙烯、矽膠等。在用於製造整體柱的具體實施方案中,較佳為反結構材料是選自於高分子水凝膠(polymeric hydrogels),其是由丙烯醯胺類、丙烯酸酯類、甲基丙烯酸酯類、矽氧烷類等親水性單體聚合而成。優選的高分子水凝膠包括聚甲基丙烯酸羥乙酯(PHEMA)、聚甲基丙烯酸縮水甘油酯(PGMA)、聚二甲基矽氧烷(PDMS)、聚丙基丙烯醯胺和它們的衍生物。反結構材料的填覆方式可以為離心、真空抽氣、加壓擠入、濺鍍、電鍍、化學氣相沉積、原子層沉積等。在反結構材料是高分子材料的具體實施方案中,可以先將構成所述高分子材料的單體或前驅物填入空隙中,再使其固化定型。In step C of filling the voids, the anti-structural material is filled into the voids of the three-dimensional ordered microstructure. The anti-structural materials include, but are not limited to, metals such as gold, silver, copper, nickel, platinum, nickel tungsten alloys, etc.; oxides such as zinc oxide, cerium oxide, cuprous oxide, etc.; and polymeric materials such as polyphenylene. Ethylene, polyacrylates, polymethacrylates, acrylamides, polypyrroles, polyethylenes, polypropylenes, polyvinyl chlorides, silicones, and the like. In a specific embodiment for producing a monolithic column, preferably the anti-structural material is selected from the group consisting of polymeric hydrogels, which are composed of acrylamides, acrylates, methacrylates, A hydrophilic monomer such as a siloxane is polymerized. Preferred polymeric hydrogels include polyhydroxyethyl methacrylate (PHEMA), polyglycidyl methacrylate (PGMA), polydimethyl methoxy oxane (PDMS), polypropyl acrylamide, and derivatives thereof. Things. The anti-structural material may be filled by centrifugation, vacuum evacuation, pressure extrusion, sputtering, electroplating, chemical vapor deposition, atomic layer deposition, and the like. In a specific embodiment in which the anti-structural material is a polymer material, the monomer or precursor constituting the polymer material may be first filled into a void and then solidified and shaped.

在移除三維有序微結構的步驟中,待反結構材料定型後將三維有序微結構中的粒子移除。移除的方式已屬現有公知,其包括但不限於化學移除法、高溫移除法等。舉例來說,在慣用的化學移除法中,可以使用例如甲苯、丙酮、乙酸乙酯、氫氟酸、氫氧化鈉等能夠溶解粒子的化學試劑來處理薄膜型微結構,使粒子脫離反結構材料。然而,當運用例如浸泡或萃取等慣用製程來處理具有高深寬比的微結構時,將會發生模版不易移除問題。此外,製作整體柱時所使用的反結構材料是不能耐受高溫的高分子材料,所以也不適合經由高溫移除法來移除模版。In the step of removing the three-dimensional ordered microstructure, the particles in the three-dimensional ordered microstructure are removed after the material to be deformed is shaped. The manner of removal is well known in the art and includes, but is not limited to, chemical removal, high temperature removal, and the like. For example, in a conventional chemical removal method, a chemical agent capable of dissolving particles such as toluene, acetone, ethyl acetate, hydrofluoric acid, or sodium hydroxide can be used to treat a film-type microstructure to cause particles to be detached from the anti-structure. material. However, when a conventional process such as immersion or extraction is used to process a microstructure having a high aspect ratio, a problem that the stencil is not easily removed will occur. In addition, the anti-structural material used in the fabrication of the monolithic column is a polymer material that cannot withstand high temperatures, and is therefore not suitable for removing the stencil via high temperature removal.

本申請的發明人意外地發現,使用索氏萃取法(Soxhlet extraction)或超臨界流體萃取法)supercritical fluid extraction)可以克服微結構因為高深寬比所帶來的模版不易移除問題。據此,在本申請的一個優選具體實施方案中,所述三維有序微結構是運用一選自於由索氏萃取法和超臨界流體萃取法所組成的群組的方法來移除。本申請所使用的術語“索氏萃取法”意指在微結構置入一個索氏提取器中,使用於溶解模版的溶劑加熱回流,由微結構中持續提取出模版材料。通常,索氏萃取法所使用的溫度高於所述用於溶解模版的溶劑的沸點,萃取時間持續約3~7天。本申請所使用的術語“超臨界流體萃取法”意指在高於臨界溫度和臨界壓力的條件下,用超臨界流體溶解出模版材料,然後藉由降低壓力或升高溫度,使溶解於超臨界流體中的模版材料析出。在一個優選具體實施方案中,使用CO2 做為超臨界流體,搭配丙酮、甲苯或乙酸乙酯等共溶劑,去除以聚苯乙烯為主的模版材料。The inventors of the present application have unexpectedly discovered that the use of supercritical fluid extraction by Soxhlet extraction or supercritical fluid extraction can overcome the problem of the microstructure being difficult to remove due to the high aspect ratio. Accordingly, in a preferred embodiment of the present application, the three-dimensional ordered microstructure is removed using a method selected from the group consisting of Soxhlet extraction and supercritical fluid extraction. As used herein, the term "Soxhlet extraction" means that the microstructure is placed in a Soxhlet extractor, the solvent used to dissolve the stencil is heated to reflux, and the stencil material is continuously extracted from the microstructure. Generally, the Soxhlet extraction method uses a temperature higher than the boiling point of the solvent used to dissolve the stencil, and the extraction time lasts for about 3 to 7 days. As used herein, the term "supercritical fluid extraction" means dissolving a stencil material with a supercritical fluid at a temperature above a critical temperature and a critical pressure, and then dissolving it in excess by reducing the pressure or increasing the temperature. The stencil material in the critical fluid is precipitated. In a preferred embodiment, CO 2 is used as a supercritical fluid, and a co-solvent such as acetone, toluene or ethyl acetate is used to remove the polystyrene-based stencil material.

可以使依據本申請的方法所製成的三維有序多孔微結構接受額外的加工製程,以製造各種商用產品。在一個優選具體實施方案中,所述三維有序多孔微結構可以經過裁切、封裝等慣用工序,及/或接受化學改性而具有適當的表面官能性,以製成整體柱,供用做為層析分離的固定相材料。本申請所稱“整體柱”包含一由前述反結構材料所構成的連續媒質,其形成有數個有序排列的球狀巨孔,具有介於100納米至6微米的均一直徑,以及數個連通巨孔的連通孔,具有介於10納米至3微米的均一直徑。在一個優選具體實施方案中,所述球狀巨孔是以最密堆積的形式排列,在此情形下,各巨孔可以經由12個連通孔與相鄰的巨孔相連通。所述整體柱中較佳為至少70%的巨孔,更佳為至少80%的巨孔,最佳為至少90%的巨孔,例如至少95%的巨孔,是以最密堆積的形式排列。巨孔的最長半徑R與最短半徑r的比例關係可以用不等式來表示。r/R的比值愈小,就代表三維有序多孔微結構中連通孔相對於巨孔尺寸的孔徑愈大,其中連通孔的孔徑大約等於2r/。在一個優選具體實施方案中,柱內的連通孔具有大孔徑,即所述r/R小於或等於0.99,較佳為小於或等於0.98,更佳為小於或等於0.96,例如小於或等於0.94。所述整體柱可以另包含一個中空管體,其可以由不銹鋼、石英或玻璃等材料製成,並且具有內壁供所述連續媒質黏附。在一個優選具體實施方案中,所述整體柱具有至少1公分的高度,例如至少3公分或至少5公分的高度,並且具有不低於1的深寬比,例如不低於2.5或不低於3的深寬比。此處所稱“深寬比”意指整體柱的柱高相對於直徑的比值。The three-dimensional ordered porous microstructures made in accordance with the methods of the present application can be subjected to additional processing to produce a variety of commercial products. In a preferred embodiment, the three-dimensional ordered porous microstructure can be subjected to conventional processes such as cutting, encapsulation, and/or chemical modification to have appropriate surface functionality to form a monolithic column for use as a Chromatographic separation of stationary phase materials. The term "monolithic column" as used in the present application includes a continuous medium composed of the foregoing anti-structural material, which is formed with a plurality of ordered spherical macropores having a uniform diameter of between 100 nm and 6 μm and a plurality of connections. The communicating pores of the macropores have a uniform diameter of between 10 nm and 3 microns. In a preferred embodiment, the spherical macropores are arranged in the closest packed form, in which case each macropores may be in communication with adjacent macropores via 12 communicating holes. Preferably, at least 70% of the macropores, more preferably at least 80% of the macropores, more preferably at least 90% of the macropores, for example at least 95% of the macropores, are in the most closely packed form. arrangement. The ratio of the longest radius R of the giant hole to the shortest radius r can be inequality To represent. The smaller the ratio of r/R, the larger the pore size of the communicating pores relative to the pore size in the three-dimensional ordered porous microstructure, wherein the pore diameter of the communicating pores is approximately equal to 2r/ . In a preferred embodiment, the interconnected pores within the column have a large pore size, i.e., the r/R is less than or equal to 0.99, preferably less than or equal to 0.98, more preferably less than or equal to 0.96, such as less than or equal to 0.94. The monolithic column may further comprise a hollow tubular body which may be made of a material such as stainless steel, quartz or glass and has an inner wall for the continuous medium to adhere. In a preferred embodiment, the monolithic column has a height of at least 1 cm, such as a height of at least 3 cm or at least 5 cm, and has an aspect ratio of not less than 1, such as not less than 2.5 or not less than 3 aspect ratio. By "aspect ratio" is meant herein the ratio of the column height to the diameter of the monolithic column.

下列實施例僅供用於示例本發明,而非限制本發明的範圍。The following examples are intended to illustrate and not to limit the scope of the invention.

實施例 1 聚苯乙烯 - 甲基丙烯酸丁酯納米球的製備 將甲基丙烯酸丁酯單體溶液加入苯乙烯單體溶液(99.6重量份),並且將系統固體含量配製成10重量%。在350 rpm的速度下將混合物加以攪拌1小時,並且將溫度維持於65℃。接著,將0.25克硫酸鉀加入混合物中,以開始聚合反應。16小時後,單體已被完全消耗。在本實施例中,藉由將甲基丙烯酸丁酯溶液的用量控制在10至30毫升,可以使聚苯乙烯顆粒的玻璃轉移溫度調整在位於82o C至26o C的範圍內。 Example 1 : Preparation of polystyrene - butyl methacrylate nanospheres A butyl methacrylate monomer solution was added to a styrene monomer solution (99.6 parts by weight), and the system solid content was formulated to be 10% by weight. The mixture was stirred at 350 rpm for 1 hour and the temperature was maintained at 65 °C. Next, 0.25 g of potassium sulfate was added to the mixture to start the polymerization. After 16 hours, the monomer was completely consumed. In the present embodiment, the glass transition temperature of the polystyrene particles can be adjusted to be in the range of 82 o C to 26 o C by controlling the amount of the butyl methacrylate solution to 10 to 30 ml.

實施例 2 聚苯乙烯 - 丙烯酸丁酯納米球的製備 將丙烯酸丁酯單體溶液加入苯乙烯單體溶液(99.6重量份),並且將系統固體含量配製成10重量%。在350 rpm的速度下將混合物加以攪拌1小時,並且將溫度維持於65℃。接著,將0.25克硫酸鉀加入混合物中,以開始聚合反應。16小時後,單體已被完全消耗。在本實施例中,藉由將丙烯酸丁酯溶液的用量控制在10至30毫升,可以使聚苯乙烯顆粒的玻璃轉移溫度調整在位於50o C至0o C的範圍內。 Example 2 : Preparation of polystyrene - butyl acrylate nanospheres A butyl acrylate monomer solution was added to a styrene monomer solution (99.6 parts by weight), and the system solid content was formulated to be 10% by weight. The mixture was stirred at 350 rpm for 1 hour and the temperature was maintained at 65 °C. Next, 0.25 g of potassium sulfate was added to the mixture to start the polymerization. After 16 hours, the monomer was completely consumed. In the present embodiment, the glass transition temperature of the polystyrene particles can be adjusted to be in the range of 50 o C to 0 o C by controlling the amount of the butyl acrylate solution to 10 to 30 ml.

實施例 3 ( 苯乙烯 - 甲基丙烯酸丁酯)核殼結構納米球的製備 將苯乙烯單體溶液(99.6重量份)配製成具有10重量%的固體含量。在350 rpm的速度下將混合物加以攪拌1小時,並且將溫度維持於65℃。接著,將0.25克硫酸鉀加入混合物中,以開始聚合反應。反應進行一定時間後,將甲基丙烯酸丁酯單體溶液加入系統內進行殼層建構,以形成由苯乙烯-甲基丙烯酸丁酯共聚物所製成的殼層。在本實施例中,通過將甲基丙烯酸丁酯單體溶液的用量控制在10至30毫升,可以使殼層的玻璃轉移溫度調整在位於40o C至26o C的範圍內。 Example 3 : Preparation of poly ( styrene - butyl methacrylate) core-shell structured nanospheres A styrene monomer solution (99.6 parts by weight) was formulated to have a solid content of 10% by weight. The mixture was stirred at 350 rpm for 1 hour and the temperature was maintained at 65 °C. Next, 0.25 g of potassium sulfate was added to the mixture to start the polymerization. After the reaction has been carried out for a certain period of time, a butyl methacrylate monomer solution is added to the system for shell construction to form a shell layer made of a styrene-butyl methacrylate copolymer. In the present embodiment, by controlling the amount of the butyl methacrylate monomer solution to 10 to 30 ml, the glass transition temperature of the shell layer can be adjusted to be in the range of 40 o C to 26 o C.

實施例 4 ( 苯乙烯 - 丙烯酸丁酯)核殼結構納米球的製備 將苯乙烯單體溶液(99.6重量份)配製成具有10重量%的固體含量。在350 rpm的速度下將混合物加以攪拌1小時,並且將溫度維持於65℃。接著,將0.25克硫酸鉀加入混合物中,以開始聚合反應。反應進行一定時間後,將丙烯酸丁酯單體溶液加入系統內進行殼層建構,以形成由苯乙烯-丙烯酸丁酯共聚物所製成的殼層。在本實施例中,通過將丙烯酸丁酯單體溶液的用量控制在10至30毫升,可以使殼層的玻璃轉移溫度調整在位於10o C至0o C的範圍內。 Example 4 : Preparation of poly ( styrene - butyl acrylate) core-shell structured nanospheres A styrene monomer solution (99.6 parts by weight) was formulated to have a solid content of 10% by weight. The mixture was stirred at 350 rpm for 1 hour and the temperature was maintained at 65 °C. Next, 0.25 g of potassium sulfate was added to the mixture to start the polymerization. After the reaction has been carried out for a certain period of time, a butyl acrylate monomer solution is added to the system for shell construction to form a shell layer made of a styrene-butyl acrylate copolymer. In the present embodiment, by controlling the amount of the butyl acrylate monomer solution to 10 to 30 ml, the glass transition temperature of the shell layer can be adjusted to be in the range of 10 o C to 0 o C.

實施例 5 ( 甲基丙烯酸丁酯 - 苯乙烯 ) 核殼結構納米球 的製備 將甲基丙烯酸丁酯單體溶液(99.6重量份)配製成具有10重量%的固體含量。在350 rpm的速度下將混合物加以攪拌1小時,並且將溫度維持於65℃。接著,將0.25克硫酸鉀加入混合物中,以開始聚合反應。反應進行一定時間後,將苯乙烯單體溶液加入系統內進行殼層建構,以形成由苯乙烯-甲基丙烯酸丁酯共聚物所製成的殼層。在本實施例中,通過將苯乙烯單體溶液的用量控制在10至30毫升,可以使殼層的玻璃轉移溫度調整在位於50o C至80o C的範圍內。 Example 5 : Preparation of poly ( butyl methacrylate - styrene ) core-shell structured nanospheres A solution of butyl methacrylate monomer (99.6 parts by weight) was formulated to have a solid content of 10% by weight. The mixture was stirred at 350 rpm for 1 hour and the temperature was maintained at 65 °C. Next, 0.25 g of potassium sulfate was added to the mixture to start the polymerization. After the reaction has been carried out for a certain period of time, a styrene monomer solution is added to the system for shell construction to form a shell layer made of a styrene-butyl methacrylate copolymer. In the present embodiment, by controlling the amount of the styrene monomer solution to 10 to 30 ml, the glass transition temperature of the shell layer can be adjusted to be in the range of 50 o C to 80 o C.

實施例 6 ( 丙烯酸丁酯 - 苯乙烯 ) 核殼結構納米球 的製備 將丙烯酸丁酯單體溶液(99.6重量份)配製成具有10重量%的固體含量。在350 rpm的速度下將混合物加以攪拌1小時,並且將溫度維持於65℃。接著,將0.25克硫酸鉀加入混合物中,以開始聚合反應。反應進行一定時間後,將苯乙烯單體溶液加入系統內進行殼層建構,以形成由苯乙烯-丙烯酸丁酯共聚物所製成的殼層。在本實施例中,通過將苯乙烯單體溶液的用量控制在10至30毫升,可以使殼層的玻璃轉移溫度調整在位於50o C至80o C的範圍內。 Example 6 : Preparation of poly ( butyl acrylate - styrene ) core-shell structured nanospheres A butyl acrylate monomer solution (99.6 parts by weight) was formulated to have a solid content of 10% by weight. The mixture was stirred at 350 rpm for 1 hour and the temperature was maintained at 65 °C. Next, 0.25 g of potassium sulfate was added to the mixture to start the polymerization. After the reaction has been carried out for a certain period of time, a styrene monomer solution is added to the system for shell construction to form a shell layer made of a styrene-butyl acrylate copolymer. In the present embodiment, by controlling the amount of the styrene monomer solution to 10 to 30 ml, the glass transition temperature of the shell layer can be adjusted to be in the range of 50 o C to 80 o C.

實施例 7 :三維有序微結構的製備 製備30%甲醇水溶液,於實測時水的沸點約為95o C。將實施例1所製得的納米球懸浮於所述甲醇水溶液中,其中所述納米球的玻璃轉移溫度為80o C,粒徑為600納米。將懸浮液置入內徑1.6公分的離心管中,容許納米球進行自組裝,直到納米球充滿離心管為止,形成長度4公分且直徑1.6公分的柱狀三維有序微結構。將離心管置入一個DENG YNG DO60型熱風迴圈式烘箱中,在77o C下(相較於納米球的Tg 低3o C)將三維有序微結構加熱乾燥30分鐘,以去除溶劑。圖5顯示根據本實施例所製成的三維有序微結構,其中呈六方最密堆積排列的納米球稍微發生形變,略呈六邊形,因此相鄰納米球之間有大面積的接觸,適合供用做為模版製作整體柱。 Example 7 : Preparation of three-dimensional ordered microstructure A 30% aqueous methanol solution was prepared, and the boiling point of water was about 95 ° C when measured. Prepared in Example 1 nanospheres are suspended in the aqueous methanol solution in which the nanospheres glass transition temperature of 80 o C, a particle size of 600 nm. The suspension was placed in a centrifuge tube having an inner diameter of 1.6 cm, and the nanospheres were allowed to self-assemble until the nanospheres were filled with the centrifuge tube to form a columnar three-dimensional ordered microstructure having a length of 4 cm and a diameter of 1.6 cm. The tubes were placed in a hot-air DENG YNG DO60 loop oven, (compared to the low T g of nanospheres 3 o C) was heated at 77 o C in a three-dimensionally ordered microstructure dried for 30 minutes to remove the solvent . 5 shows a three-dimensional ordered microstructure prepared according to the present embodiment, in which the nanospheres arranged in the hexagonal closest packing are slightly deformed and slightly hexagonal, so that there is a large area contact between adjacent nanospheres. It is suitable for use as a stencil to make a monolithic column.

實施例 8 :三維有序多孔微結構的製備 將甲基丙烯酸羥乙酯(HEMA)前驅物加入離心管內,利用實施例7所製得的三維有序微結構作為模版。施加離心促使HEMA填入模版孔隙中,再於55o C水浴下進行固化。固化完成後將結構取出,加工裁切成符合於一不銹鋼製HPLC管柱的直徑,並且以封裝膠將結構與所述HPLC管柱的管壁緊密接合。使封裝在管柱中的結構接受索氏萃取法,以甲苯持續回流萃取5天,萃取期間溶劑的黏度被維持在0.2至0.6 psi,藉此移除模版,得到整體柱成品。 圖6顯示本實施例利用索氏萃取法可以使溶劑容易進入微米尺度以下的孔洞,進而將粒子溶解並且帶出微結構,藉此完全地去除模版材料。依據本實施例所製成的三維有序多孔微結構,其中形成有以最密堆積形式排列且直徑為600納米的球狀巨孔,以及連通巨孔且直徑為250納米的連通孔。相對來說,如圖7所示,慣用的浸泡法無法完全去除模版材料。 Example 8 : Preparation of three-dimensional ordered porous microstructure A hydroxyethyl methacrylate (HEMA) precursor was placed in a centrifuge tube, and the three-dimensional ordered microstructure prepared in Example 7 was used as a stencil. Applying centrifugal stencil causes HEMA filled pores, and then cured at 55 o C water bath. After the curing is completed, the structure is taken out, cut to a diameter corresponding to a stainless steel HPLC column, and the structure is tightly bonded to the wall of the HPLC column with an encapsulant. The structure encapsulated in the column was subjected to Soxhlet extraction, and the extract was continuously refluxed for 5 days with toluene, and the viscosity of the solvent was maintained at 0.2 to 0.6 psi during the extraction, thereby removing the stencil to obtain a monolithic finished product. Figure 6 shows that the Soxhlet extraction method of the present embodiment allows the solvent to easily enter pores below the micrometer scale, thereby dissolving the particles and carrying the microstructure, thereby completely removing the stencil material. According to the three-dimensional ordered porous microstructure produced in the present embodiment, spherical macropores having a diameter of 600 nm arranged in the closest packed form and communicating pores having a diameter of 250 nm which are connected to the macropores are formed. Relatively speaking, as shown in Fig. 7, the conventional immersion method cannot completely remove the stencil material.

實施例 9 :三維有序微結構和三維有序多孔微結構的製備 重複實施例7、8的製備工序,但是將三維有序微結構的加熱溫度降低至65o C(相較於納米球的Tg 低15o C),歷時120分鐘。圖8顯示所製成的三維有序多孔微結構,其中形成有以最密堆積形式排列且直徑為600納米的球狀巨孔,以及連通巨孔且直徑為150納米的連通孔。 Example 9 : Preparation of three-dimensional ordered microstructures and three-dimensional ordered porous microstructures The preparation procedures of Examples 7 and 8 were repeated, but the heating temperature of the three-dimensional ordered microstructure was lowered to 65 o C (compared to nanospheres) T g is 15 o C) and lasts 120 minutes. Fig. 8 shows a three-dimensional ordered porous microstructure formed in which spherical macropores arranged in the closest packed form and having a diameter of 600 nm, and communicating pores communicating with macropores and having a diameter of 150 nm were formed.

實施例 10 :三維有序微結構的製備 重複實施例7的製備工序,同樣使用實施例1所製得的納米球,但其粒徑為1微米,而且將三維有序微結構的加熱溫度升高至100o C(相較納納米球的Tg 高20o C),加熱3分鐘。隨後將溫度降低至75o C(相較於納米球的Tg 低5o C),將三維有序微結構加熱乾燥30分鐘,以去除溶劑。圖9顯示根據本實施例所製成的三維有序微結構,其中呈六方最密堆積排列的納米球稍微發生形變,略呈六邊形,因此相鄰納米球之間有大面積的接觸,適合供用做為模版製作整體柱。 Example 10 : Preparation of three-dimensional ordered microstructure The procedure of the preparation of Example 7 was repeated, and the nanospheres prepared in Example 1 were also used, but the particle diameter was 1 μm, and the heating temperature of the three-dimensional ordered microstructure was raised. up to 100 o C (compared to the high T g of Na Nami ball 20 o C), heated for 3 min. The temperature was then lowered to 75 o C (compared to the low T g of nanospheres 5 o C), the three-dimensional ordered microstructure dried by heating for 30 minutes to remove the solvent. 9 shows a three-dimensional ordered microstructure prepared according to the present embodiment, in which the nanospheres arranged in the hexagonal closest packing are slightly deformed and slightly hexagonal, so that there is a large area contact between adjacent nanospheres. It is suitable for use as a stencil to make a monolithic column.

比較例 1 :三維有序微結構的製備 重複實施例7的製備工序,但將三維有序微結構的加熱溫度降低至60o C(相較於納米球的Tg 低20o C)。乾燥30分鐘後,大部分溶劑仍然未被去除。最終乾燥時間為80分鐘。圖10顯示根據本比較例所製成的三維有序微結構,其中納米球呈六方最密堆積排列,各納米球大致上仍呈球狀,彼此間的接觸不明顯。 Comparative Example 1: Preparation of three-dimensional ordered microstructure preparation step was repeated Example 7, but the heating temperature is lowered to a three-dimensional ordered microstructure 60 o C (compared to the low T g of nanosphere 20 o C). After drying for 30 minutes, most of the solvent was still not removed. The final drying time was 80 minutes. Fig. 10 shows a three-dimensional ordered microstructure prepared according to the present comparative example, in which the nanospheres are arranged in the hexagonal closest packing, and the respective nanospheres are still substantially spherical, and the contact between them is not obvious.

比較例 2 :三維有序微結構的製備 重複實施例7的製備工序,但將三維有序微結構的加熱溫度升高至90o C(相較於納米球的Tg 高10o C),乾燥15分鐘。圖11顯示根據本比較例所製成的三維有序微結構,其中納米球呈六方最密堆積排列,大致上呈正六邊形,彼此間已經完全密合,沒有孔隙。這個結構無法供用做為模版。 Comparative Example 2: Preparation of three-dimensional ordered microstructure preparation step was repeated Example 7, but the heating temperature of the three-dimensional ordered microstructure was raised to 90 o C (as compared to the high T g of nanosphere 10 o C), Dry for 15 minutes. Fig. 11 shows a three-dimensional ordered microstructure prepared according to the present comparative example, in which the nanospheres are arranged in the most densely packed hexagonal shape, are substantially hexagonal, and are completely in close contact with each other without voids. This structure cannot be used as a template.

比較例 3 :三維有序微結構的製備 重複實施例7的製備工序,但將三維有序微結構的加熱溫度升高至110o C(相較於納米球的Tg 高30o C),乾燥10分鐘。圖12顯示根據本比較例所製成的三維微結構,其中納米球在高溫下熔融,形狀難以辨識,彼此間已經完全密合,沒有間隙。這個結構無法供用做為模版。 Comparative Example 3: Preparation of three-dimensional ordered microstructure Preparation procedure of Example 7 was repeated, but the three-dimensional ordered microstructure heating temperature was raised to 110 o C (as compared to the high T g of nanosphere 30 o C), Dry for 10 minutes. Fig. 12 shows a three-dimensional microstructure prepared according to the present comparative example, in which the nanospheres are melted at a high temperature, the shape is difficult to recognize, and they are completely in close contact with each other without a gap. This structure cannot be used as a template.

與傳統常規方法相比,本發明所揭露的三維有序多孔微結構製造方法,在一略低於粒子的玻璃轉換溫度的溫度下加熱處理三維有序微結構,以去除用於懸浮粒子的溶劑,並且有效地增進有序排列的粒子間的接觸。相較於運用慣用方法所製成的整體柱,依據所述製造方法所製成的整體柱具有高深寬比和高孔洞規律性的結構特點,柱內的連通孔也具有比較大的孔徑。Compared with the conventional conventional method, the three-dimensional ordered porous microstructure manufacturing method disclosed in the present invention heats a three-dimensional ordered microstructure at a temperature slightly lower than the glass transition temperature of the particles to remove the solvent for the suspended particles. And effectively enhance the contact between the ordered particles. Compared with the monolithic column produced by the conventional method, the monolithic column produced according to the manufacturing method has the structural characteristics of high aspect ratio and high hole regularity, and the communication hole in the column also has a relatively large aperture.

以上諸實施例僅供說明本發明之用,而並非對本發明的限制,相關領域的技術人員,在不脫離本發明的技術範圍做出的各種變換或變化也應屬於本發明的保護範疇。The above embodiments are intended to be illustrative of the present invention, and are not intended to limit the scope of the invention, and various modifications and changes may be made without departing from the scope of the invention.

R‧‧‧最長半徑 R‧‧‧ longest radius

r‧‧‧最短半徑 R‧‧‧ shortest radius

圖1為依據本發明一實施例的流程圖; 圖2為未經加熱軟化的聚苯乙烯粒子的電子顯微鏡照片; 圖3為經過加熱軟化的聚苯乙烯粒子的電子顯微鏡照片,其顯示粒子開始發生形變; 圖4為聚苯乙烯粒子長時間受熱變形的電子顯微鏡照片; 圖5為依據本發明一實施例所製成的三維有序微結構的電子顯微鏡照片; 圖6顯示本發明一實施例利用索氏萃取法移除三維有序微結構所製成的三維有序多孔微結構的截面電顯照片; 圖7顯示利用慣用浸泡法移除三維有序微結構所製成的三維有序多孔微結構的電子顯微鏡照片; 圖8顯示本發明另一實施例所製成的三維有序多孔微結構的截面電顯照片; 圖9顯示本發明另一實施例所製成的三維有序微結構的截面電顯照片; 圖10為依據一比較例所製成的三維有序微結構的截面電顯照片; 圖11為依據另一比較例所製成的三維有序微結構的截面電顯照片;以及 圖12為依據另一比較例所製成的三維有序微結構的截面電顯照片。1 is a flow chart according to an embodiment of the present invention; FIG. 2 is an electron micrograph of polystyrene particles which are not softened by heating; FIG. 3 is an electron micrograph of polystyrene particles which are softened by heating, which shows that particles start FIG. 4 is an electron micrograph of a polystyrene particle which is thermally deformed for a long time; FIG. 5 is an electron micrograph of a three-dimensional ordered microstructure prepared according to an embodiment of the present invention; FIG. 6 shows an embodiment of the present invention. Cross-section electrical photographs of three-dimensional ordered porous microstructures fabricated by Soxhlet extraction to remove three-dimensional ordered microstructures; Figure 7 shows three-dimensional ordered porous pores prepared by conventional soaking methods to remove three-dimensional ordered microstructures Electron micrograph of microstructure; Figure 8 shows a cross-sectional electrical photograph of a three-dimensional ordered porous microstructure made in accordance with another embodiment of the present invention; Figure 9 shows a three-dimensional ordered microstructure made in accordance with another embodiment of the present invention Figure 10 is a cross-sectional electrical photograph of a three-dimensional ordered microstructure made according to a comparative example; Figure 11 is a three-dimensional order made according to another comparative example. Significant electrical configuration of a cross-sectional photograph; and a cross-sectional three-dimensional ordered microstructure electrically FIG. 12 shows another comparative example was fabricated picture.

Claims (22)

一種三維有序多孔微結構的製造方法,其特徵在於所述方法包括下列步驟: A.形成一由多個實質球形粒子所組成的三維有序微結構,使得所述多個粒子彼此間存在有多個空隙; B.使所述三維有序微結構中的實質球形粒子發生形變,使得所述粒子形變而具有一最長半徑R和一最短半徑r,其中r/R的比值大於/2但小於1; C.將反結構材料填入所述空隙;以及 D.移除所述三維有序微結構,以獲得所述三維有序多孔微結構。A method for fabricating a three-dimensional ordered porous microstructure, characterized in that the method comprises the following steps: A. forming a three-dimensional ordered microstructure composed of a plurality of substantially spherical particles such that the plurality of particles exist between each other a plurality of voids; B. deforming the substantially spherical particles in the three-dimensional ordered microstructure such that the particles are deformed to have a longest radius R and a shortest radius r, wherein the ratio of r/R is greater than /2 but less than 1; C. filling the interstitial material into the void; and D. removing the three-dimensional ordered microstructure to obtain the three-dimensional ordered porous microstructure. 如請求項11所述的三維有序多孔微結構的製造方法,其中步驟B包含將所述三維有序微結構加熱,使所述多個粒子軟化而發生形變。The method of fabricating a three-dimensional ordered porous microstructure according to claim 11, wherein the step B comprises heating the three-dimensional ordered microstructure to soften the plurality of particles to undergo deformation. 如請求項2所述的三維有序多孔微結構的製造方法,其中所述粒子具有一玻璃轉換溫度,而所述步驟B中,是在一相較於所述玻璃轉換溫度高約0至20o C的溫度下,將所述三維有序微結構加熱。The method for producing a three-dimensional ordered porous microstructure according to claim 2, wherein the particles have a glass transition temperature, and in the step B, the phase is about 0 to 20 higher than the glass transition temperature. The three-dimensional ordered microstructure is heated at a temperature of o C. 如請求項2所述的三維有序多孔微結構的製造方法,其中所述粒子具有一玻璃轉換溫度,而所述步驟B中,是在一相較於所述玻璃轉換溫度低約1至15o C的溫度下,將所述三維有序微結構加熱。The method of fabricating a three-dimensional ordered porous microstructure according to claim 2, wherein the particles have a glass transition temperature, and in the step B, the phase is about 1 to 15 lower than the glass transition temperature. The three-dimensional ordered microstructure is heated at a temperature of o C. 如請求項4所述的三維有序多孔微結構的製造方法,其中所述步驟B中,是在一相較於所述玻璃轉換溫度低約3至15o C的溫度下,將所述三維有序微結構加熱。The method for fabricating a three-dimensional ordered porous microstructure according to claim 4, wherein in the step B, the three-dimensional is at a temperature lower by about 3 to 15 o C than the glass transition temperature. Ordered microstructure heating. 如請求項5所述的三維有序多孔微結構的製造方法,其中所述步驟B中,是在一相較於所述玻璃轉換溫度低約3至10o C的溫度下,將所述三維有序微結構加熱。The method for fabricating a three-dimensional ordered porous microstructure according to claim 5, wherein in the step B, the three-dimensional is at a temperature lower by about 3 to 10 o C than the glass transition temperature. Ordered microstructure heating. 如請求項2所述的三維有序多孔微結構的製造方法,其中所述步驟B包含將所述三維有序微結構加熱一段時間,以使得所述多個粒子軟化並且去除所述溶劑。The method of fabricating a three-dimensional ordered porous microstructure according to claim 2, wherein said step B comprises heating said three-dimensional ordered microstructure for a period of time such that said plurality of particles soften and remove said solvent. 如請求項1所述的三維有序多孔微結構的製造方法,其中步驟B包含對於所述三維有序微結構施加壓力,使所述多個粒子相互擠壓而發生形變。The method of fabricating a three-dimensional ordered porous microstructure according to claim 1, wherein the step B comprises applying pressure to the three-dimensional ordered microstructure to cause the plurality of particles to be deformed by being pressed against each other. 如請求項1所述的三維有序多孔微結構的製造方法,其中步驟B包含將所述三維有序微結構浸泡於一能夠溶解所述多個粒子的溶劑中,使所述多個粒子溶漲而發生形變。The method for producing a three-dimensional ordered porous microstructure according to claim 1, wherein the step B comprises: immersing the three-dimensional ordered microstructure in a solvent capable of dissolving the plurality of particles, so that the plurality of particles are dissolved It has risen and deformed. 如請求項1所述的三維有序多孔微結構的製造方法,其中所述粒子是由單一類型高分子均聚物或共聚物所製成的均質球體,而且所述玻璃轉換溫度是所述粒子的整體玻璃轉換溫度。The method for producing a three-dimensional ordered porous microstructure according to claim 1, wherein the particles are homogeneous spheres made of a single type of polymer homopolymer or copolymer, and the glass transition temperature is the particles. The overall glass transition temperature. 如請求項1所述的三維有序多孔微結構的製造方法,其中所述粒子具有一核殼結構,各粒子具有一核心以及一包覆於核心外的外殼,而所述核心和外殼分別由不同高分子材料所製成,而且所述玻璃轉換溫度是所述外殼的玻璃轉換溫度。The method of manufacturing a three-dimensional ordered porous microstructure according to claim 1, wherein the particles have a core-shell structure, each particle has a core and a shell coated on the outer core, and the core and the outer shell are respectively Made of different polymer materials, and the glass transition temperature is the glass transition temperature of the outer casing. 如請求項1所述的三維有序多孔微結構的製造方法,其中所述步驟A包含使所述多個粒子分散於一溶劑以形成一懸浮液,並且容許所述多個粒子進行自組裝,以形成所述三維有序微結構。The method for producing a three-dimensional ordered porous microstructure according to claim 1, wherein the step A comprises dispersing the plurality of particles in a solvent to form a suspension, and allowing the plurality of particles to self-assemble, To form the three-dimensional ordered microstructure. 如請求項1所述的三維有序多孔微結構的製造方法,其中所述步驟D包含運用一選自於由索氏萃取法和超臨界流體萃取法所組成的群組的方法來移除所述三維有序微結構。The method for producing a three-dimensional ordered porous microstructure according to claim 1, wherein the step D comprises removing the group by a method selected from the group consisting of a Soxhlet extraction method and a supercritical fluid extraction method. A three-dimensional ordered microstructure. 如請求項1所述的三維有序多孔微結構的製造方法,其中所述三維有序微結構中,至少有一部分的粒子是以最密堆積的形式排列。The method for producing a three-dimensional ordered porous microstructure according to claim 1, wherein at least a part of the particles in the three-dimensional ordered microstructure are arranged in a most closely packed form. 一種整體柱,其藉由請求項1至14任一項所述的三維有序多孔微結構的製造方法所製成。A monolithic column produced by the method of producing a three-dimensional ordered porous microstructure according to any one of claims 1 to 14. 一種整體柱,至少包含: 數個有序排列的球狀巨孔,具有介於100納米至6微米的均一直徑;以及 數個連通巨孔的連通孔,具有介於10納米至3微米的均一直徑; 其中所述巨孔中有至少70%是以最密堆積的形式排列,以及所述巨孔具有一最長半徑R和一最短半徑r,其中所述r/R的比值小於或等於0.99。A monolithic column comprising at least: a plurality of ordered spherical macropores having a uniform diameter of between 100 nanometers and 6 micrometers; and a plurality of interconnecting pores connected to the macropores having a uniformity between 10 nanometers and 3 micrometers Diameter; wherein at least 70% of the macropores are arranged in the closest packed form, and the macropores have a longest radius R and a shortest radius r, wherein the ratio of r/R is less than or equal to 0.99. 如請求項16所述的整體柱,其中所述巨孔中有至少80%是以最密堆積的形式排列。The monolithic column of claim 16, wherein at least 80% of the macropores are arranged in a most closely packed form. 如請求項17所述的整體柱,其中所述巨孔中有至少90%是以最密堆積的形式排列。The monolithic column of claim 17, wherein at least 90% of the macropores are arranged in a most closely packed form. 如請求項18所述的整體柱,其中所述巨孔中有至少95%是以最密堆積的形式排列。The monolithic column of claim 18, wherein at least 95% of the macropores are arranged in a most closely packed form. 如請求項16所述的整體柱,其中所述r/R的比值小於或等於0.98。The monolithic column of claim 16, wherein the ratio of r/R is less than or equal to 0.98. 如請求項20所述的整體柱,其中所述r/R的比值小於或等於0.96。The monolithic column of claim 20, wherein the ratio of r/R is less than or equal to 0.96. 如請求項16至21任一項所述的整體柱,其具有至少1公分的高度,並且具有不低於1的深寬比。The monolithic column according to any one of claims 16 to 21, which has a height of at least 1 cm and has an aspect ratio of not less than 1.
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