TW201904355A - Plasma spraying head, plasma spraying deice, and plasma spraying method capable of arranging intervals among a plurality of spraying guns to be narrower - Google Patents

Abstract

The present invention provides a plasma spraying head capable of arranging the intervals of a plurality of spraying guns to be narrower. An embodiment of the plasma spraying head utilizes plasma to melt the powder of a thermal spraying material and forms a film on the object by the thermal spraying powder, and comprises a spraying gun having a nozzle and a plasma generation unit, wherein the nozzle utilizes the gas generated by plasma to convey the powder of the spraying material and injects the powder from the front opening, and the plasma generation unit decomposes the plasma generated by the nozzle by using electric power output from a DC power source to generate a plasma having the shaft core in communication with the nozzle; and, a main body capable of supporting the plurality of spraying guns as a whole and containing a refrigerant flow path through which the refrigerant flows.

Description

Plasma spray head, plasma spray device and plasma spray method

The invention relates to a plasma spray head, a plasma spray device and a plasma spray method.

A plasma spraying device is known. The powder of the spraying material is melted by the heat of a plasma jet formed by a high-speed gas and sprayed on the surface facing the substrate, thereby forming a coating on the surface of the substrate ( For example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-123663

[Problems to be solved by the invention]

In addition, for example, when a film is formed on a long object or when annealing is performed before and after film formation, it is required to arrange a plurality of spray guns at a narrow pitch.

However, in the above plasma spraying device, because the size of the powder is large and the powder of the spraying material is supplied from the outside of the spraying gun, the size of the spraying gun is relatively large. difficult. In addition, since the electric power is high when the powder is melted, it is difficult to arrange a plurality of melting shot guns at a narrow pitch in terms of heat radiation.

The present invention was made in view of the foregoing, and an object of the present invention is to provide a plasma spray head capable of arranging a narrow interval between a plurality of spray guns. [Technical means to solve the problem]

In order to achieve the above object, a plasma spray head according to one aspect of the present invention uses a plasma to melt powder of a spray material, and forms a film on an object by using the molten powder; and has: a spray gun It includes a nozzle and a plasma generating part. The nozzle uses the gas generated by the plasma to transport the powder of the above-mentioned spray material and sprays the powder from the opening at the front end. The plasma generating part is an electric power output by a DC power supply. The plasma generated by the nozzle is decomposed to generate a plasma common to the shaft core and the nozzle; and a main body unit which integrally supports a plurality of the above-mentioned melting guns, and contains a refrigerant flow through which the refrigerant flows. road. [Effect of the invention]

According to the plasma spray head of the invention, the interval between the plurality of spray guns can be arranged to be narrow.

Hereinafter, embodiments for implementing the present invention will be described with reference to the drawings. In addition, in this specification and the drawings, the same components are denoted by the same reference numerals, and redundant descriptions are omitted.

[Plasma Spraying Apparatus] A plasma spraying apparatus according to an embodiment of the present invention will be described. FIG. 1 is a schematic diagram of a plasma spraying apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing an example of a plasma spray head of the plasma spray device of FIG. 1. FIG. FIG. 3 is a diagram for explaining a main body portion of the plasma spray head of FIG. 2. FIG. 4 is a longitudinal sectional view of the central axis of the nozzle of the plasma spray head of FIG. 2. 5 is a cross-sectional view of the plasma spray head of FIG. 2.

As shown in FIG. 1, the plasma spraying device 1 according to the embodiment of the present invention is a device that sprays powder R1 of the spraying material from the opening 26c of the front end 26b of the nozzle 26, while using a plasma jet formed of a high-speed gas The heat of P melts the powder of the thermal spray material and sprays it toward the surface of the substrate as the object, thereby forming a film containing the thermal spray material on the surface of the substrate. Examples of the substrate include lithium (Li), aluminum (Al), copper (Cu), silver (Ag), gold (Au), nickel (Ni), metal compounds (such as stainless steel), and insulating films (engineering plastics). , Ceramics), etc.

The plasma spraying apparatus 1 includes a feeder 10, a plasma spraying head 20, a gas supply unit 30, a cooler unit 40, and a DC power source 50.

The feeder 10 supplies the powder R1 of the shot material to the nozzle 26. The powder R1 of the shot material is stored in a container 11 in the feeder 10. The powder R1 of the thermal spray material is, for example, a fine powder having a particle diameter of 1 μm to 50 μm. The feeder 10 is provided with an actuator 12.

The plasma spray head 20 includes a main body portion 21 and a plurality of spray guns 25. In this embodiment, as shown in FIGS. 1 and 2, in the plasma spray head 20, four spray guns 25 are integrally supported by the main body portion 21.

The main body portion 21 is an insulating member such as ceramics, which integrally supports the plurality of melting guns 25. As shown in FIG. 3, a plurality of through holes 21 a are formed in the main body portion 21 so as to be capable of being inserted into the plurality of melting guns 25. In this embodiment, four through holes 21 a are formed along the longitudinal direction of the main body portion 21. The length L1 in the longitudinal direction of the main body portion 21 is 155 mm, and the distance L2 between the centers of adjacent through holes 21a is 35 mm.

As shown in FIGS. 1 and 4, a refrigerant flow path 21 b through which a refrigerant flows is formed inside the main body portion 21. The refrigerant flow path 21 b is provided around each of the plurality of melting guns 25. The refrigerant is supplied from the cooler unit 40 to the refrigerant flow path 21b. Thereby, the body portion 21 is cooled, so that the temperature of the body portion 21 due to the heat of the plasma can be prevented from increasing.

The main body portion 21 is formed by using a 3D printer based on 3D data for the main body portion read to a 3D printer, for example. The 3D data of the main body part includes the shape, arrangement, and size data of the swirling flow structure formed inside the main body part 21, the refrigerant flow path 21b, and a plurality of through holes 21a through which the melting gun 25 is inserted. Based on the 3D data for the body part, the 3D printer integrally forms a body part 21 with a swirl flow structure, a refrigerant flow path 21b, and a plurality of through-holes 21a for the melting gun 25 to be inserted. Each shotgun 25 seeks to miniaturize the device and reduce the number of hardware parts (reducing O-rings, etc.).

In addition, the main body portion 21 may be formed by 3D sintering techniques such as ceramic 3D firing. The above-mentioned ceramic 3D firing uses a photoforming 3D printer to produce a molded article containing ceramic raw materials, and sinters the manufactured molded article.

The spray gun 25 is used to generate powder from the plasma supplied from the gas supply unit 30 and transport the powder R1 of the molten shot material supplied from the feeder 10, and use the power supplied from the DC power source 50 to release (dissociate) the plasma generated gas. A plasma jet P is generated. Then, the powder R1 of the spray material is melted while using the heat of the plasma jet P to spray it toward the surface of the substrate. The spray gun 25 includes a nozzle 26, a rotary flow disk 27, and an anode portion 28.

The nozzle 26 is a rod-shaped ring-shaped member, and a flow path 26a for conveying the powder R1 of the spray material is formed in the nozzle 26. The flow path 26 a of the nozzle 26 communicates with the inside of the container 11. The powder R1 of the shot material is caused to vibrate the container 11 by the power of the actuator 12, and the powder is injected into the flow path 26 a in the nozzle 26 from the container 11. The plasma-generating gas is supplied to the nozzle 26 together with the powder R1 of the spray material. The plasma generating gas system is used to generate plasma gas, and also functions as a carrier gas for transporting the powder R1 of the spray material in the flow path 26a.

The nozzle 26 penetrates the main body part 21, and its front end part 26b protrudes to the plasma generation space U. In this embodiment, the nozzle 26 is fixed to the main body portion 21 by a fixing member 29a and a fastening member 29b. The powder R1 of the spray material is transported to the front end portion 26b of the nozzle 26 by the plasma generation gas, and is sprayed into the plasma generation space U together with the plasma generation gas from the opening 26c of the front end portion 26b. The nozzle 26 is formed of a metal material. The nozzle 26 is connected to the DC power source 50 and also functions as an electrode (cathode) that supplies a current from the DC power source 50.

The rotary flow disk 27 is inserted into the through hole 21 a of the main body portion 21. The swirling flow disc 27 is formed of an insulating material. A gas flow path 27 a for supplying a plasma-generating gas to the plasma generating space U is formed inside the rotary flow disk 27. Plasma-generating gas is supplied from the gas supply unit 30 to the gas flow path 27a.

The anode portion 28 is inserted into the through hole 21 a from below the main body portion 21. The anode portion 28 is formed of a metal material. The anode portion 28 is connected to the DC power source 50 and functions as an electrode (anode).

The plasma generation space U is a space mainly defined by the inner peripheral portion 27 b of the swirling flow disc 27 and the upper portion 28 a of the anode portion 28. The front end portion 26b of the nozzle 26 projects to the plasma generation space U.

The gas supply unit 30 includes a gas supply source 31, a valve 32, a mass flow controller 33, a pipe 34, and a pipe 35. The plasma-generating gas is supplied from a gas supply source 31, is opened and closed, and controlled by a valve 32 and a mass flow controller 33, and is supplied to a flow path 26a in the nozzle 26 through a pipe 34. As the plasma-generating gas, argon, helium, nitrogen, hydrogen, and a combination of various gases can be used.

In addition, the plasma-generating gas is supplied from a gas supply source 31, and is opened and closed and the flow rate is controlled by a valve 32 and a mass flow controller 33. The gas flows through a gas flow path 27a inside the rotary flow disc 27 through a pipe 35, and is supplied from the lateral direction To the plasma generation space U. More specifically, as shown in FIGS. 1 and 5, the plasma generation gas introduced into the plasma generation space U is turned into a swirling flow from the gas flow path 27 a of the swirl flow disc 27 in the lateral direction and is supplied to the plasma generation. Space U. Thus, the generated plasma is prevented from being diffused, and the plasma jet P is deflected linearly. That is, the plasma jet P common to the shaft core and the nozzle 26 is generated. In addition, in the present embodiment, the "shaft core common" means that the central axis C of the nozzle 26 and the central axis of the blowing direction of the plasma jet P are coincident or substantially the same.

The cooler unit 40 supplies a refrigerant such as cooling water to the refrigerant flow path 21b. The refrigerant supplied from the cooler unit 40 circulates through the refrigerant pipe 41, the refrigerant flow path 21b, and the refrigerant pipe 42 and returns to the cooler unit 40. In this embodiment, the refrigerant flow paths 21b formed around each of the melting guns 25 are connected in parallel to each other. Moreover, the refrigerant flow paths 21b formed around each of the melting guns 25 may be connected in series with each other.

The DC power supply 50 supplies specific power (for example, 500 W to 20 kW) between the front end portion 26 b of the nozzle 26 and the anode portion 28. As a result, a discharge is generated between the end portion 26b and the anode portion 28 before the nozzle 26, and the plasma-generating gas ejected from the nozzle 26 in the plasma-generating space U is released (decomposed) to generate a plasma.

As described above, the plasma spraying apparatus 1 according to the embodiment of the present invention has a structure in which the body 21 supports the plurality of spray guns 25 integrally. Therefore, the interval between the plurality of spray guns 25 can be arranged to be narrow. Thereby, space saving of the plasma spray head 20 can be achieved.

Moreover, in the plasma spraying apparatus 1 according to the embodiment of the present invention, a refrigerant flow path 21b through which a refrigerant flows is formed inside the main body portion 21, so that the temperature of the main body portion 21 due to the heat of the plasma can be prevented from increasing.

In addition, in the plasma spraying apparatus 1 according to the embodiment of the present invention, for the plurality of spray guns 25, the powder R1 of the spraying material is supplied from one feeder 10, and the plasma is generated from a gas supply unit 30. . The refrigerant is supplied from one cooler unit 40 and power is supplied from one DC power source 50. As a result, the number of parts constituting the plasma spraying apparatus 1 can be reduced. Therefore, space saving of the plasma spraying apparatus 1 can be achieved. Further, a plurality of feeders 10, a plurality of gas supply units 30, a plurality of cooler units 40, and a plurality of DC power sources 50 may be provided corresponding to each of the plurality of melting guns 25. In this case, each of the spray guns 25 can be operated under different conditions.

Next, another example of the plasma spray head of the plasma spray device 1 in FIG. 1 will be described. FIG. 6 is a sectional view showing another example of a plasma spray head of the plasma spray device 1 of FIG. 1.

As shown in FIG. 6, the plasma spray head 120 differs from the plasma spray head 20 in FIG. 2 in that a gas flow path 27 a is formed inside the main body part 21, and the gas flow path 27 a generates plasma gas. A swirling flow (hereinafter referred to as a "swirling gas") is supplied to the plasma generation space U.

In the plasma spray head 120 shown in FIG. 6, a gas flow path 27 a for supplying a swirling gas to the plasma generation space U is formed inside the main body portion 21. Therefore, the number of parts constituting the plasma spray head 120 can be reduced. In addition, the number of steps for assembling the plasma spray head 120 can be reduced.

[Effects] The effects exhibited by the plasma spraying apparatus 1 according to the embodiment of the present invention will be described.

First, the contribution to improving productivity by using the plasma spraying apparatus 1 according to the embodiment of the present invention will be described. FIG. 7 is an explanatory diagram of the operation of a plasma spray head when a film is formed on a long object.

As shown in FIG. 7, when the substrate W is an elongated object, the substrate W is directed toward the short side of the plasma spray head 20 having four spray guns 25 integrally supported on the body portion 21 (in the figure) The direction indicated by the arrow) moves, while using the heat of the plasma jet P to melt the powder R1 of the spray material and spray it toward the surface of the substrate W, thereby forming a film containing the spray material on the surface of the substrate W.

With this method, when a film including a thermal spray material is formed on a long object, a desired film can be formed by moving the substrate W in one direction (or uniaxial reciprocation). Therefore, productivity can be improved. In addition, the mechanism for moving the substrate W can be simplified.

In addition, in the example of FIG. 7, the case where plasma spraying is performed while moving the substrate W is exemplified, but it is not limited to this, and may be used instead of or together with the movement of the substrate W. , While moving the plasma spray head 20 to perform plasma spray.

Next, the influence of the annealing treatment on the adhesion of the film will be described. FIG. 8 is an explanatory diagram of an evaluation system for evaluating the influence of the annealing treatment on the adhesion of the film.

As shown in FIG. 8, an Ar plasma (hereinafter referred to as a “hydrogen-added plasma”) sprayed with 5% hydrogen (H ₂ ) is sprayed from the spray guns 25B of the four spray guns 25A, 25B, 25C, and 25D. ), In the state of 25C from the spray gun 25C, the substrate W along the long side of the plasma spray head 20, under the spray gun 25A, below the spray gun 25B, the 25C The lower part and the lower part of the spray gun 25D are sequentially moved, and a plasma to which hydrogen is added is sprayed on the surface of the substrate W and annealed, and then Cu is sprayed to form a Cu spray film. In FIG. 8, the moving direction of the substrate W is indicated by arrows.

At this time, the distance L2 between the centers of the adjacent shotguns 25 is set to 35 mm, the distance L3 between the surface of the substrate W and the lower surface of the shotgun 25 is set to about 50 mm, and the moving speed of the substrate W It is set to several hundred mm / second. As the base material W, Al, alumina (Al ₂ O ₃ ), and iron (Fe) -based metals are used.

For comparison, in a state where the plasma is not sprayed with hydrogen from the spray gun 25B and Cu is sprayed from the spray gun 25C, the base material W is aligned along the long side of the plasma spray head 20 according to the melting. Moving below the gun 25A, below the melting gun 25B, below the melting gun 25C, and below the melting gun 25D, the plasma is not sprayed with hydrogen added to the surface of the substrate W (without annealing treatment). Cu is sprayed to form a Cu spray film.

FIG. 9 is a graph showing the results obtained by evaluating the influence of the annealing treatment on the adhesion of the film. Fig. 9 shows the test results of evaluating the adhesion of the film to eight kinds of samples. The adhesiveness evaluation test of the film was performed in accordance with JISK5400-8.5 (JISD0202). In Figure 9, the row from the left shows the substrate material, the surface roughness of the substrate, the thickness of the Cu spray film (Cu spray thickness), the presence or absence of hydrogen-added plasma, and the film state when the film is cut. And the state of the film when the tape is peeled.

As shown in FIG. 9, in a sample in which a Cu spray film was formed after plasma treatment with hydrogen addition (plasma with hydrogen addition: yes), regardless of the type of the substrate, " Film peeling. " In addition, in the sample where a Cu spray film was formed after plasma treatment with hydrogen addition, when "Al" or "Fe" metal was used as the base material, "film peeling" was not observed when the tape was peeled off, but Al _{2 was used.} In the case of O ₃ as a substrate, a film was observed to remain in most of the 100 pieces.

In contrast, in a sample in which a Cu spray film was formed without plasma treatment with hydrogen addition (plasma with hydrogen addition: None), regardless of the type of the substrate, it was observed in many pieces when the tape was peeled off. "Membrane peeling." Specifically, in the case of using Al as the substrate, "film peeling" was observed in most of the 100 pieces. When Al ₂ O _{3 was} used as the substrate, "film peeling" was observed in all 100 pieces. In the case of using an Fe-based metal as the base material, "film peeling" and "film curling" were not observed in 88 blocks (indicated by "○" in the figure), but "film rolls" were observed in 8 blocks. Shrinkage "(indicated by" △ "in the figure), and" film peeling "(indicated by" × "in the figure) was observed in 4 pieces.

It is considered that by performing the plasma treatment with hydrogen added before forming the Cu spray film, the oxide film and the like on the surface of the substrate W can be removed (reduced), and the adhesion between the substrate W and the Cu spray film is improved.

Next, the influence of the elapsed time after the annealing treatment on the adhesiveness of the film will be described. FIG. 10 is an explanatory diagram of an evaluation system for evaluating the influence of the elapsed time after the annealing treatment on the adhesion of the film.

As shown in FIG. 10 (a), the hydrogen-added plasma is sprayed from the four spray guns 25A, 25B, 25C, and 25D, and the substrate is sprayed with Cu from the spray gun 25C. The material W moves along the long side direction of the plasma spray head 20 in the order below the spray gun 25A, below the spray gun 25B, below the spray gun 25C, and below the spray gun 25D in order, toward the substrate W. After spraying the plasma with hydrogen added on the surface and performing annealing treatment, Cu is sprayed to form a Cu spray film. Note that, in FIG. 10 (a), the moving direction of the substrate W is indicated by arrows.

The shot conditions are as follows.

＜ Metal Shot Gun 25B ＞ ・ Electricity: about 6 kW · Gas supplied to the flow path 26a: Ar gas with 5% hydrogen added · Swirling gas: Ar gas with 5% hydrogen added · Powder of spray material R1: None Shotgun 25C ＞ ・ Electricity: about 6 kW ・ Gas supplied to the flow path 26a: Ar gas with 5% hydrogen added ・ Slewing gas: Ar gas with 5% hydrogen added ・ Powder of spray material R1: Cu ・ Powder of R1 Ejection amount: several g / min <Substrate W> ・ Material: Al ・ Movement speed: Hundreds of mm / second ・ Distance L3 between the substrate W and the lower surface of the spray gun 25: about 50 mm

In addition, as shown in FIG. 10 (b), in a state where the plasma to which hydrogen is added is sprayed from the spray guns 25B of the four spray guns 25A, 25B, 25C, and 25D, and the Cu is sprayed from the spray gun 25D, The substrate W is sequentially moved along the long side of the plasma spray head 20 below the spray gun 25A, below the spray gun 25B, below the spray gun 25C, and below the spray gun 25D toward the base. After the surface of the material W is sprayed with hydrogen-added plasma and annealed, Cu is sprayed to form a Cu spray film. In FIG. 10 (b), the moving direction of the substrate W is indicated by arrows. In addition, the spraying conditions are the same as the above except that the Cu is sprayed from the spray gun 25D instead of the spray gun 25C. That is, the conditions for the self-injection gun 25D to inject Cu are the same as the conditions for the above-mentioned self-injection gun 25C to inject Cu.

The distance L2 between the centers of the adjacent melting shot guns 25 is set to 35 mm. That is, in the case where the plasma to which hydrogen is added is sprayed from the spray gun 25B and Cu is sprayed from the gun 25C, Cu is sprayed after 0.1 seconds after the plasma to which hydrogen is added is sprayed onto the substrate W. In addition, when the plasma to which hydrogen is added is sprayed from the self-spraying gun 25B and the plasma is to be sputtered from 25D by the self-spraying gun 25D, Cu is sprayed after 0.2 seconds after the plasma to which hydrogen is added is sprayed onto the substrate W.

FIG. 11 is a graph showing the results obtained by evaluating the effect of the time after the annealing treatment on the adhesiveness of the film. FIG. 11 shows the test results of evaluating the adhesion of the film to three types of samples. The film adhesion evaluation test was carried out by observing the peeling state of the film (scratch test) when the Cu heat-sprayed film was scratched with a tweezer with a weight of 25 g. In Fig. 11, the row from the left shows the film state (upper stage) and the scratch test result of the sample forming the Cu spray film after 15 seconds, 0.2 seconds, and 0.1 seconds after the plasma with the addition of hydrogen was sprayed. Lower paragraph).

As shown in the upper part of FIG. 11, among the samples that form a Cu-emission film after 0.2 seconds after spraying the plasma with hydrogen addition, and the samples that form a Cu-spray film after 0.1 seconds after spraying the plasma with hydrogen added, A Cu spray film was observed on the surface of the substrate W. On the other hand, in the sample in which a Cu spray film was formed 15 seconds after the plasma to which hydrogen was added was sprayed, it was observed that a large portion of the Cu spray film was not formed on the surface of the substrate W. That is, from the viewpoint of easily forming a Cu spray film on the surface of the substrate W, it is preferred that Cu be sprayed for 0.2 seconds or less after spraying the plasma to which hydrogen is added, and it is more preferable to spray the plasma to which hydrogen is added. Cu was shot by elapse of 0.1 seconds or less.

As shown in the lower part of FIG. 11, in a sample in which Cu was spray-injected after 0.1 seconds elapsed after the plasma to which hydrogen was added was sprayed, it was observed that the Cu-sprayed film was not easily peeled by a scratch test. In addition, in a sample in which Cu was spray-injected 0.2 seconds after the plasma to which hydrogen was added was sprayed, a part of the Cu-sprayed film was observed to be peeled off as a result of a scratch test. On the other hand, in a sample in which Cu was spray-injected 15 seconds after the plasma to which hydrogen was added was sprayed, as a result of a scratch test, the Cu-sprayed film was easily peeled. That is, from the viewpoint of improving the adhesiveness of Cu with respect to the substrate W, it is preferred that the Cu be sprayed for 0.2 seconds or less after spraying the plasma with hydrogen added, and more preferably 0.1 for the plasma sprayed with hydrogen added. Cu is sprayed below seconds.

As described above, in the plasma spraying apparatus 1 according to the embodiment of the present invention, the interval between the plurality of spray guns 25 can be arranged to be relatively narrow, so that the plasma can be sprayed by the plasma in a short time after spraying the plasma to which hydrogen is added The heat of the jet P melts the powder R1 of the shot material and sprays it toward the surface of the substrate W. Therefore, it is possible to form a Cu spray film having high adhesion to the substrate W.

The effect of the case where the interval between the shotguns 25 is narrow has been described above. Furthermore, there are cases where it is desirable to increase the interval of the spray gun 25 to be used depending on the shot material or the shot conditions. For example, there is a case where thermal drying occurs due to plasma spraying of the adjacent spray gun 25 and the characteristics of the spray film may decrease. In this case, a non-adjacent melting gun 25 may be used.

As mentioned above, the form for implementing this invention was demonstrated, However, the said content does not limit the content of this invention, Various changes and improvements are possible within the scope of this invention.

1‧‧‧ Plasma spraying device

10‧‧‧Feeder

11‧‧‧ container

12‧‧‧Actuator

20‧‧‧ Plasma spray head

21‧‧‧Body

21a‧‧‧through hole

21b‧‧‧Refrigerant flow path

25‧‧‧ Melt Shot Gun

25A‧‧‧ Melt Shot Gun

25B‧‧‧ Melt Shot Gun

25C‧‧‧ Melt Shot Gun

25D‧‧‧ Melt Shot Gun

26‧‧‧Nozzle

26a‧‧‧flow

26b‧‧‧Front end

26c‧‧‧ opening

27‧‧‧ Rotating Stream Disc

27a‧‧‧Gas flow path

27b‧‧‧Inner periphery

28‧‧‧Anode

28a‧‧‧upper

29a‧‧‧Fixed member

29b‧‧‧fastening member

30‧‧‧Gas Supply Department

31‧‧‧Gas supply source

32‧‧‧ Valve

33‧‧‧mass flow controller

34‧‧‧Piping

35‧‧‧Piping

40‧‧‧cooler unit

41‧‧‧Refrigerant tube

42‧‧‧Refrigerant tube

50‧‧‧DC Power

C‧‧‧center axis

L1‧‧‧ length

L2‧‧‧ Center distance

L3‧‧‧ Distance

P‧‧‧ Plasma Jet

R1‧‧‧Powder of spraying material

U‧‧‧ Plasma generation space

W‧‧‧ substrate

FIG. 1 is a schematic diagram of a plasma spraying apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing an example of a plasma spray head of the plasma spray device of FIG. 1. FIG. FIG. 3 is a diagram for explaining a main body portion of the plasma spray head of FIG. 2. FIG. 4 is a longitudinal sectional view of the central axis of the nozzle of the plasma spray head of FIG. 2. 5 is a cross-sectional view of the plasma spray head of FIG. 2. FIG. 6 is a sectional view showing another example of a plasma spray head of the plasma spray device of FIG. 1. FIG. FIG. 7 is an explanatory diagram of the operation of a plasma spray head when a film is formed on a long object. FIG. 8 is an explanatory diagram of an evaluation system for evaluating the influence of the annealing treatment on the adhesion of the film. FIG. 9 is a graph showing the results obtained by evaluating the influence of the annealing treatment on the adhesion of the film. 10 (a) and 10 (b) are explanatory diagrams of an evaluation system for evaluating the influence of the elapsed time after the annealing treatment on the adhesion of the film. FIG. 11 is a graph showing the results obtained by evaluating the effect of the elapsed time after the annealing treatment on the adhesiveness of the film.

Claims (10)

The utility model relates to a plasma spray head, which uses a plasma to melt powder of a spray material, and uses the melted powder to form a film on an object, and has: a plurality of spray guns, each of which includes a nozzle and a In the plasma generating part, the nozzle uses the gas generated by the plasma to transport the powder of the spray material, and sprays the powder from the opening in the front end. The plasma generating part sprays the nozzle through the power output by the DC power supply. The above-mentioned plasma generates gas decomposition to generate a plasma common to the shaft core and the nozzle; and a body part which integrally supports the plurality of melting shot guns, and contains a refrigerant flow path through which the refrigerant flows. For example, the plasma spray head of claim 1, wherein the main body portion has a plurality of through holes configured so that the plurality of spray guns can be inserted. For example, the plasma spray head of claim 2, wherein the distance between the centers of adjacent through holes is 70 mm or less. The plasma spray head according to any one of claims 1 to 3, which has a gas flow path, and the gas flow path supplies a gas forming a swirling flow to a plasma generation space where the plasma generation gas is sprayed. The plasma spray head according to claim 4, wherein the gas flow path is formed inside the body portion. For example, the plasma spray head according to any one of claims 1 to 3, wherein the body portion is formed by using a 3D printer or a 3D sintering technology based on the 3D data read from the body portion of the 3D printer. A plasma spraying device includes: a plasma spraying head according to any one of claims 1 to 6; and a feeder that supplies the powder of the spraying material to the plasma spraying head. A plasma spraying method uses a plasma spraying head to form a film on an object. The plasma spraying head includes: a plurality of spraying guns, each of which includes a nozzle and a plasma generating section; The nozzle uses the gas generated by the plasma to transport the powder of the spray material and sprays the powder from the opening at the front end. The plasma generation unit decomposes the plasma generated gas sprayed by the nozzle by the power output by the DC power supply. To generate a plasma common to the shaft core and the nozzle; and a main body unit that integrally supports the plurality of melting guns and contains a refrigerant flow path through which the refrigerant flows; and the plasma melting method has the following steps: : One of the plurality of spray guns sprays the plasma without spraying the powder of the spray material on the object; and the spray gun is different from the one of the plurality of spray guns The spray gun sprays the powder of the spray material and the plasma. The plasma spraying method according to claim 8, wherein after the step of spraying the plasma, the step of spraying the powder of the spray material and the plasma is performed. The plasma spraying method of claim 8 or 9, wherein the spray gun used in the step of spraying the above-mentioned plasma is arranged adjacent to the spray gun used in the step of spraying the powder of the above-mentioned spray material and the step of the above-mentioned plasma. .