TW201901173A - Chip pick-and-place operation device of press-to-lift chip inspection fixture including a base, a pressing unit, and a fixture sliding stage - Google Patents

Abstract

The invention relates to a chip pick-and-place operation device of a press-to-lift chip inspection fixture, which generates a pressing action on the press-to-lift chip inspection fixture capable of picking and placing chips when pressed, and includes: a base for combining a pair of side plates on a bottom plate; a pressing unit for disposing at least one pair of lifting power on the pair of side plates and combining a pressing plate with a power output end of the pair of lifting power. The pressing plate has at least one chip placement opening; and a fixture sliding stage disposed on the base and sliding inside and the outside of the base, and having a fixture positioning groove with respect to the chip placement opening. The fixture positioning groove is right under the chip placement opening when the fixture sliding stage is located inside the base. In this way, the chip pick-and-place operation device of the press-to-lift chip inspection fixture is provided with the effect of greatly improving the efficiency of chip picking and placing.

Description

Push-pull wafer inspection device

The present invention relates to a pick-and-place wafer handling device for a embossed wafer inspection jig, and more particularly to a designer who produces a pressing action on a embossed wafer inspection fixture that can be used to hold a wafer when pressed.

According to the operation mode of the embossed wafer inspection jig 10 for picking up and dropping the wafer, it is necessary to press the movable frame body 11 located above, and the movable frame body 11 interlocks the pair of claws 12 during the process of being pressed down. The claw is placed (as shown in FIG. 1A), and the wafer can be placed in the positioning frame 13 at this time, and then the pressing force applied to the movable frame 11 is released, and the movable frame 11 can automatically rebound to In the initial position that has not been pressed, the pair of claws 12 are simultaneously restored to the buckled state (as shown in FIG. 1B), and the wafer is pressed and positioned in the positioning frame 13 by the pair of claws 12, and the buckle can be pressed. The locating wafer is inspected; however, the current operation mode of the embossed wafer inspection fixture 10 is to take and place the wafer by manual pressing. In addition to the time-consuming and laborious operation of the wafer, the wafer may be placed in order to avoid the pressed hand. Improper touch during pick and place, causing damage to the wafer of the wafer.

The main object of the present invention is to provide a wafer handling device for a embossed wafer inspection jig, which has the effect of greatly improving the efficiency of wafer pick-and-place.

Another object of the present invention is to prevent the wafer from being damaged during the pick and place process.

In order to achieve the above-mentioned effects, the structural feature of the present invention is that a pressing type wafer detecting fixture capable of picking up and placing a wafer when pressed is pressed, and includes: a base for coupling a pair of side plates to a bottom plate; a unit, wherein at least one pair of lifting power is disposed on the pair of side plates, and a power plate is coupled to the power output end of the pair of lifting power, and the pressure plate has at least one wafer placing port; and a fixture sliding stage is disposed on the unit The pedestal slides inside the pedestal and the outside of the pedestal, and has a fixture positioning slot relative to the wafer placement opening, and the fixture positioning slot is located when the fixture sliding carrier is located inside the pedestal Just below the wafer placement opening.

In addition, a sliding rail assembly is disposed between the fixture sliding table and the pair of side plates or the bottom plate; further, a top roller is further disposed above the bottom plate relative to the bottom surface of the fixture sliding table.

Therefore, when the jig slipping stage is located outside the pedestal, the embossed wafer detecting jig is placed in the jig positioning groove, or the embossed wafer detecting fixture autonomous device positioning groove is taken out, and when the jig is slipped When the transfer stage is located inside the base, the lifting force causes the pressure plate to press down on the elastic wafer inspection fixture, so that the spring-loaded wafer inspection fixture is in a state in which the wafer can be taken and removed, and at this time, the detected wafer is detected from the elastic wafer. The inside of the jig is taken out through the wafer placement opening, or the wafer to be inspected is placed from the wafer placement opening and dropped into the interior of the elastic wafer inspection fixture.

First, referring to [Fig. 1] to [Fig. 6], the present invention generates a pressing action on the elastic type wafer detecting jig 10 which can take and place a wafer when pressed, and includes: a susceptor 20, a pair The side plate 21 is coupled to a bottom plate 22; a pressing unit 30, at least one pair of lifting power 31 is disposed on the pair of side plates 21, and a power plate 32 is coupled to the power output end of the pair of lifting power 31, and the pressing plate 32 has at least a wafer placement opening 33; and a fixture sliding stage 40 disposed on the base 20 and opposite to the pair of side panels 21 or the bottom panel 22 with a slide rail assembly 41 for sliding to the base The inside of the base 20 is external to the base 20 and has a fixture positioning groove 42 opposite to the wafer placement opening 33, and the fixture positioning groove 42 is located when the fixture sliding stage 40 is located inside the base 20 The wafer placement opening 33 is directly below, and the upper tray 23 is disposed above the bottom surface 22 opposite to the bottom surface of the fixture sliding stage 40.

Based on the configuration, when the jig slip stage 40 is located outside the susceptor 20, the embossed wafer detecting jig 10 is placed in the jig locating groove 42, or the embossed wafer detecting jig 10 The fixture positioning groove 42 is taken out; and when the fixture sliding stage 40 is located inside the base 20, the pair of lifting powers 31 causes the pressing plate 32 to press the pressing type wafer detecting fixture 10 downward, so that the pressing force is caused. The wafer inspection fixture 10 is in a state in which the wafer can be taken out. At this time, the detected wafer is taken out from the inside of the elastic wafer inspection fixture 10 through the wafer placement opening 33, or the wafer to be inspected is placed from the wafer. The vent 33 is placed and dropped inside the embossed wafer inspection fixture 10; and when the pair of hoisting power 31 causes the platen 32 to rise, the embossed wafer inspection fixture 10 is to be detected by its own positioning mechanism. Wafer positioning.

Therefore, the jig slip stage 40 of the present invention for accommodating the embossed wafer inspection jig 10 can be slid like a drawer to the outside of the susceptor 20 and the susceptor 20, and when the jig slides the stage 40 When located outside the susceptor 20, the embossed wafer inspection fixture 10 can be placed to position and position the wafer, or the embossed wafer inspection fixture 10 can be removed for wafer inspection; When the inside of the seat 20 is used, the pressing type wafer detecting jig 10 is pressed by the pressing plate 32 of the pressing unit 30. At this time, the detected wafer or the wafer to be inspected can be taken out, and one jig slipping stage 40 can be simultaneously taken. The plurality of embossed wafer inspection fixtures 10 can be used to take a plurality of wafers in one press, which not only replaces the traditional method of manually pressing and then taking the wafers, but also does not manually press the wafer to hinder the wafers; The wafer pick and place efficiency and avoid the damage of the wafer during the pick and place process.

To sum up, the technical means disclosed in the present invention have the invention patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patent to be invented by the bureau. German sense.

The drawings and the descriptions of the present invention are merely preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application.

10‧‧‧Blasting wafer inspection fixture

11‧‧‧ Activity frame

12‧‧‧ claws

13‧‧‧ Positioning frame

20‧‧‧ Pedestal

21‧‧‧ side panels

22‧‧‧floor

23‧‧‧Upper roller

30‧‧‧ Press unit

31‧‧‧ Lifting power

32‧‧‧ pressure plate

33‧‧‧ Wafer placement

40‧‧‧Jig slipping stage

41‧‧‧Slide assembly

42‧‧‧ fixture positioning slot

[Fig. 1A] is a perspective view of a structure of a spring-loaded wafer inspection jig (no external force state). Fig. 1B is a perspective view showing the structure of a spring-loaded wafer inspection jig (pressed state). Fig. 2 is an exploded perspective view showing the structure of the present invention. Fig. 3 is a perspective assembled view of the structure of the present invention. Fig. 4 is a plan view showing the structure of the present invention. [Fig. 5] is a front view (perspective interior) of the structure of the present invention. Fig. 6 is a cross-sectional view taken along line 6-6 of Fig. 4 (pressure plate pressing).

Claims (3)

The utility model relates to a pick-and-place wafer detecting device for a spring-loading wafer detecting fixture, which is capable of pressing a pressing type wafer detecting fixture capable of picking and dropping a wafer when pressed, and includes: a base for coupling a pair of side plates to a bottom plate a pressing unit for arranging at least one pair of lifting powers on the pair of side plates, and combining a pressing plate at the power output end of the pair of lifting powers, the pressing plate having at least one wafer placing opening; and a fixture sliding stage Provided on the base and sliding inside the base and the outside of the base, and having a fixture positioning groove opposite to the wafer placement opening, and the fixture positioning groove is located at the base of the fixture sliding stage The interior of the seat is located just below the wafer placement opening; thereby, when the fixture sliding stage is located outside the base, the elastic wafer inspection fixture is placed in the fixture positioning slot, or the spring is pressed The wafer inspection fixture is taken out from the fixture positioning slot, and when the fixture slide carrier is located inside the base, the pair of lifting powers causes the pressure plate to press down the elastic wafer inspection fixture, thereby causing the spring pressure Wafer inspection fixture In a state in which the wafer can be taken out, the detected wafer is taken out from the inside of the elastic wafer inspection fixture through the wafer placement opening, or the wafer to be inspected is placed from the wafer placement opening and dropped to the wafer. The embossed wafer inspection fixture is internal. The wafer handling device of the embossed wafer inspection tool of claim 1, wherein the fixture sliding table and the pair of side plates or the bottom plate are oppositely disposed with a slide rail assembly. The wafer handling device of the embossed wafer inspection tool according to claim 1 or 2, wherein the upper tray is further disposed above the bottom plate relative to the bottom surface of the fixture sliding table.