TW201900405A - Covering member, manufacturing method of cover member, and display device - Google Patents

Abstract

The present invention relates to a covering member comprising a transparent substrate, wherein the transparent substrate has a first main surface facing the covered member and a second main surface opposite to the first main surface. A compound containing an F atom is attached to the first main surface and has a contact angle with respect to the first main surface being 50 degrees or less.

Description

Cover member, manufacturing method of cover member, and display device

The present invention relates to a cover member, a method for manufacturing the cover member, and a display device.

Conventionally, in order to protect a display panel of a display device, a covering member having a transparent substrate such as a glass plate is used (for example, refer to Patent Document 1). A frame portion may be printed on the edge of the main surface of the display panel side of the transparent substrate to conceal wiring and the like. [Prior Art Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2011/148990

[Problems to be solved by the invention]

The main surface of the cover member is usually bonded to the display surface of the display panel using an adhesive layer such as an optical adhesive film. At this time, there may be a case where a gas such as air enters between the main surface of the cover member (transparent substrate) and the adhesive layer to generate air bubbles. In particular, when a covering member having a frame portion on the main surface of the display panel is bonded to the display surface of the display panel, it is easy for a step between the frame portion and the transparent substrate to be between the covering member and the adhesive layer. Bubbles are generated in between. The air bubbles generated between the cover member and the adhesive layer deteriorate the visibility of the display image when the display surface of the display panel is viewed through the cover member. Therefore, when a large amount of air bubbles are generated between the cover member and the adhesive layer, operations such as disappearance of air bubbles using an autoclave must be performed, which is complicated.

The present invention has been made in view of the above aspects, and an object thereof is to provide a cover member, a method for manufacturing the cover member, and a display device using the cover member. The cover member is disposed on a display surface side of a display panel, and the cover member When bonded to the display surface of the display panel via the adhesive layer, the generation of air bubbles between the cover member and the adhesive layer can be suppressed. [Technical means to solve the problem]

The present inventors have conducted earnest research, and as a result, found that the above-mentioned object can be achieved by employing the following configuration, and have completed the present invention.

That is, the covering member according to an aspect of the present invention includes a transparent substrate having a first main surface facing the member to be covered and a second main surface opposite to the first main surface. A compound containing an F atom is attached to the first main surface, and a contact angle of the first main surface is 50 ° or less. A manufacturing method of a covering member according to an aspect of the present invention is a method of manufacturing a covering member including a transparent substrate, and preparing a first main surface facing the covered member and a second main surface opposite to the first main surface. The transparent substrate on the main surface is prepared with a transfer substrate having a fluorine-containing compound adhered on one side. The first principal surface of the transparent substrate is brought into contact with the fluorine-containing compound on the transfer substrate, and the above The fluorine-containing compound is transferred to the first main surface of the transparent substrate, and the compound containing F atoms is attached to the first main surface by the transfer, and the contact angle of the first main surface is set to 50 ° or less . A display device according to one aspect of the present invention includes the cover member, an adhesive layer, and a display panel, and the cover member faces the first main surface of the transparent substrate and the display panel, and passes through the adhesive layer. It is bonded to the display panel. [Effect of the invention]

According to the present invention, a cover member capable of suppressing the generation of air bubbles between the cover member and the adhesive layer when the cover member and the display surface of the display panel are bonded via the adhesive layer, a method for manufacturing the cover member, and using the cover can be provided. Component display device.

An embodiment of the present invention will be described based on the drawings.

<Configuration of Display Device of the Present Embodiment> FIG. 1 is a cross-sectional view showing a display device 100 of the present embodiment. Examples of the display device 100 include display devices such as a smart phone and a tablet terminal; car navigation devices; and RSE (Rear Seat Entertainment) devices for rear seat occupants to watch images and the like; Display devices for opening and closing the door, which are installed in household appliances such as refrigerators, washing machines, microwave ovens, etc., but are not limited to these.

The display device 100 includes a display panel 104 and a cover member 11, and the display panel 104 and the cover member 11 are bonded together via an adhesive layer 14. The display device 100 includes a frame body 106 accommodating each portion, and an opening portion is formed in the frame body 106. In the housing 106, the display panel 104 and the backlight unit 102 are mounted. As shown in FIG. 1, a backlight unit 102 is placed on a bottom plate of the frame body 106, that is, a bottom plate 107 of the frame body, and a display panel 104 is placed on the backlight unit 102. In this embodiment, the display panel 104 is a liquid crystal panel. A wiring 141 connected to the display panel 104 is arranged inside the casing 106 and outside the display panel 104.

The structures of the backlight unit 102 and the display panel 104 are not particularly limited, and known structures can be adopted. The material of the frame body 106 (including the frame body bottom plate 107) and the like are also not particularly limited.

The display device 100 is not limited to a display device having a liquid crystal panel as the display panel 104. For example, the display device 100 may be an organic EL (Electroluminescence) panel, a PDP (Plasma Display Panel), or an electronic device. Display devices such as ink-based panels. The display device 100 may not include the backlight unit 102 depending on the type of the display panel 104. The display device 100 may include a touch panel and the like. Examples of the touch panel include a capacitive touch panel and a resistive film touch panel.

The cover member 11 constituting a part of the display device 100 has a transparent base 12. The transparent substrate 12 is adhered to the display panel 104 via the adhesive layer 14. In this way, the transparent substrate 12 functions as a covering member covering the display panel 104. In this embodiment, the end of the transparent substrate 12 is adhered to the frame body 106 by the adhesive layer 131.

FIG. 2 is an enlarged cross-sectional view of the cover member 11, the adhesive layer 14 and the display panel 104. The transparent base 12 constituting the covering member 11 has a main surface. That is, the transparent substrate 12 has a first main surface 12a facing the display panel 104 as a covered member, and a second main surface 12b opposite to the first main surface 12a and not facing the display panel 104. In this embodiment, the display panel 104 will be described as a covered member, but the covered member is not limited to the display panel.

In the transparent substrate 12, as described below, a compound containing an F atom is attached to the first main surface 12a, and the contact angle of the first main surface 12a is 50 ° or less.

In this embodiment, a frame portion 132 is formed on the edge of the first main surface 12a in the transparent base 12 to conceal the wiring 141 (see FIG. 1) from the side of the second main surface 12b. The first main surface 12 a of the transparent base 12 having the frame portion 132 formed thereon is bonded to the display surface 104 a of the display panel 104 via the adhesive layer 14.

Preferably, the adhesive layer 14 is transparent like the transparent substrate 12, and the refractive index difference between the transparent substrate 12 and the adhesive layer 14 is small. Examples of the adhesive layer 14 include a layer made of a transparent resin obtained by curing a liquid curable resin composition, and may be an optical adhesive film or an optical adhesive tape. The thickness of the adhesive layer 14 is, for example, 5 to 1000 μm, and preferably 50 to 500 μm.

<Previous Covering Member> FIG. 3 is an enlarged cross-sectional view showing a state where the previous covering member 511 is bonded to the display panel 104 through the adhesive layer 14. The same portions as those in the present embodiment described with reference to FIGS. 1 and 2 are denoted by the same reference numerals, and descriptions thereof are omitted. The transparent substrate 512 constituting the previous cover member 511 is bonded to the display surface 104 a of the display panel 104 using the adhesive layer 14.

At this time, as shown in FIG. 3, a gas such as air may enter between the transparent substrate 512 and the adhesive layer 14 to generate air bubbles 551. In particular, when the frame portion 132 is printed on the first main surface 512a of the transparent substrate 512 on the display panel 104 side, bubbles 551 are easily generated in the step portion 561 formed by the frame portion 132. The air bubbles 551 deteriorate the visibility of the image (display image) displayed on the display surface 104 a when the display panel 104 is viewed through the transparent substrate 512. Therefore, when a large number of bubbles 551 are generated, the operation of using an autoclave to eliminate the bubbles 551 is very complicated.

<Configuration of Covering Member of the Present Embodiment> FIG. 4 is a cross-sectional view showing a covering member 11 of the present embodiment. The cover member 11 includes a transparent base 12 having the first main surface 12a and the second main surface 12b. The cover member 11 has a frame portion 132 on the first main surface 12 a of the transparent base 12 as necessary, and has a functional layer (not shown) on the first main surface 12 a or the second main surface 12 b. Hereinafter, each part which comprises the cover member 11 is demonstrated in more detail.

<< Transparent Substrate >> The first principal surface 12a of the transparent substrate 12 is adhered with a compound containing an F atom, and the contact angle of the first principal surface 12a is 50 ° or less. Thereby, when the first main surface 12 a of the transparent substrate 12 is bonded to the display surface 104 a of the display panel 104 using the adhesive layer 14, bubbles can be prevented from being generated between the transparent substrate 12 and the adhesive layer 14. The compound containing an F atom is preferably an organic compound, so that the contact angle of the first main surface 12a can be controlled in a small amount.

Although the reason why the above-mentioned effect is obtained is not clear, it is estimated as follows. By setting the contact angle of the first main surface 12a of the transparent substrate 12 to 50 ° or less, the first main surface 12a and the adhesive layer 14 are easily wetted, thereby improving the adhesion. Further, a compound containing an F atom is adhered to the first main surface 12 a of the transparent substrate 12 (for example, a glass plate containing Si). Thereby, a minute water repellent portion is formed on the first main surface 12a. In addition, it is considered that the surface energy of the paths formed by the water-repellent portions is reduced, and the gas that becomes a bubble is discharged from the transparent substrate 12 and the adhesive layer 14 through the water-repellent portions. Therefore, it is presumed that the generation of bubbles can be suppressed.

For the reason that the generation of bubbles can be further suppressed, the contact angle of the first main surface 12a of the transparent substrate 12 is preferably 25 to 45 °, more preferably 28 to 40 °, and even more preferably 30 to 38 °.

The contact angle of the first principal surface 12a of the transparent substrate 12 was determined as follows. First, the first main surface 12 a of the transparent substrate 12 (the area where the frame portion 132 is not printed when the frame portion 132 is printed in a frame shape) is divided into 4 × 4 equal parts. Measure the contact angle of water at the intersection (total of 9 points) of the lines (3 + 3) drawn when dividing equally. Specifically, at a measurement temperature of 23 ° C., a contact angle meter (PCA-11, manufactured by Kyowa Interface Science Co., Ltd.) was used to measure the contact angle after 5 seconds of pure water was dropped. The average value of the measured contact angles at a total of 9 points was set as the contact angle of the first principal surface 12 a of the transparent substrate 12. The measurement of the contact angle can be performed by the θ / 2 method (A half angle method).

For the reason that the generation of bubbles can be further suppressed, the ratio of the number of F atoms to the number of Si atoms (F / Si) in the first main surface 12a of the transparent substrate 12 (for example, a glass plate containing Si) (F / Si The "atomic ratio (F / Si)") is preferably 0.005 to 0.13, more preferably 0.015 to 0.1, and even more preferably 0.02 to 0.08. Furthermore, when the atomic ratio (F / Si) is large, the area of the first main surface 12a of the transparent substrate 12 where the surface energy becomes low becomes larger, and the area where the adhesion with the adhesive layer 14 decreases becomes larger. . Therefore, if it exceeds the upper limit of the atomic ratio (F / Si), it is easy to leave air bubbles in the portion where the adhesion between the first main surface 1a and the adhesive layer 14 is low.

As long as the atomic ratio (F / Si) of the first main surface 12a of the transparent substrate 12 exceeds 0, it can be considered that the first main surface 12a of the transparent substrate 12 (for example, a glass plate containing Si) has an F atom containing Compound.

The atomic ratio (F / Si) of the first principal surface 12 a of the transparent substrate 12 is determined as follows. First, an X-ray photoelectron spectroscopy device (manufactured by Japan Electronics Co., Ltd., JPS-9000MC) is used for the first main surface 12a of the transparent substrate 12 (the area where the frame portion 132 is not printed when the frame portion 132 is printed in a frame shape). ) To obtain the F atomic concentration (unit: atomic%) and the Si atomic concentration (unit: atomic%). The atomic ratio (F / Si) of the first principal surface 12 a of the transparent substrate 12 is set as the ratio of the F atomic concentration to the Si atomic concentration obtained. More specifically, the measurement was performed under conditions where the X-ray source was MgKα rays, an acceleration voltage of 12 kV, and 25 mA. The measurement was performed with a spot diameter of 6 mmf. No sample tilt. The measurement was performed with a passing energy of 50 eV, a measurement step of 0.5 eV, a Dwell Time (dwell time) of 100 msec, and a number of scans of 30 times. For the bond energy peak obtained after the measurement, after removing the background by the Shirley method, the atomic concentration ratio of F / Si was calculated based on the peak intensity of F1s and the peak intensity of Si2p3 / 2.

The transparent substrate 12 is not particularly limited as long as it is made of a transparent material. For example, glass or a combination of glass and resin (composite material, laminated material, etc.) can be preferably used. The shape of the transparent substrate 12 is not particularly limited, and examples thereof include a plate shape having rigidity. In addition, the transparent base body 12 does not necessarily have to be a flat plate shape, and may have a shape that is bent as a whole and a shape that includes a bent portion at a part.

Examples of the glass plate used as the transparent substrate 12 include ordinary glass mainly composed of silicon dioxide, such as soda lime silicate glass, aluminosilicate glass, borosilicate glass, alkali-free glass, and quartz glass. A glass plate made of glass.

In the case where a glass plate is used as the transparent substrate 12, the composition of the glass is preferably a composition that can be formed or strengthened by a chemical strengthening treatment, and preferably contains sodium.

The composition of the glass is not particularly limited, and glasses having various compositions can be used. For example, the aluminosilicate glass which has the following composition in Moire% based on an oxide is mentioned. (i) comprises 50 to 80% of SiO _{2, 2} ~ 25% of _{Al 2 O 3, 0 ~ 10} % of Li ₂ O, 0 ~ 18% of Na ₂ O, 0 ~ 10% of K ₂ O, 0 -15% MgO, 0-5% CaO, and 0-5% ZrO ₂ glass. (ii) Contains 50 to 74% of SiO ₂ , 1 to 10% of Al ₂ O ₃ , 6 to 14% of Na ₂ O, 3 to 11% of K ₂ O, 2 to 15% of MgO, and 0 to 6 % CaO and 0 ~ 5% ZrO ₂ , and the total content of SiO ₂ and Al ₂ O ₃ is 75% or less, the total content of Na ₂ O and K ₂ O is 12-25%, and the total content of MgO and CaO It is 7 to 15% of glass. (iii) Contains 68 to 80% of SiO ₂ , 4 to 10% of Al ₂ O ₃ , 5 to 15% of Na ₂ O, 0 to 1% of K ₂ O, 4 to 15% of MgO, and 0 to 1 % Of ZrO ₂ glass. (iv) Contains 67 to 75% SiO ₂ , 0 to 4% Al ₂ O ₃ , 7 to 15% Na ₂ O, 1 to 9% K ₂ O, 6 to 14% MgO, and 0 to 1.5 The total content of ZrO ₂ , SiO ₂ and Al ₂ O ₃ is 71 to 75%, the total content of Na ₂ O and K ₂ O is 12 to 20%, and the content is less than 1% when it contains CaO. glass. (v) contains 60 to 75% of SiO ₂ , 0.5 to 8% of Al ₂ O ₃ , 10 to 18% of Na ₂ O, 0 to 5% of K ₂ O, 6 to 15% of MgO, 0 to 8 % Of CaO glass. (vi) containing 63 to 75% of SiO ₂ , 3 to 12% of Al ₂ O ₃ , 3 to 10% of MgO, 0.5 to 10% of CaO, 0 to 3% of SrO, 0 to 3% of BaO, 10 to 18% of Na ₂ O, 0 ~ 8% of K ₂ O, 0 ~ 3% of ZrO _2, 0.005 ~ 0.25% of Fe ₂ O _3, and _{R 2 O / Al 2 O 3} ( wherein, R _{2 O, Na 2 O + K 2 O)} 2.0 or more and 4.6 or less glass. (vii) Contains 66 to 75% SiO ₂ , 0 to 3% Al ₂ O ₃ , 1 to 9% MgO, 1 to 12% CaO, 10 to 16% Na ₂ O, and 0 to 5%. K ₂ O glass.

The transparent substrate 12 is preferably a glass plate. The manufacturing method of a glass plate is not specifically limited. It can be manufactured by putting a desired glass raw material into a melting furnace, heating and melting at 1500 to 1600 ° C. and clarifying, and then supplying it to a molding device to shape the molten glass into a plate shape and slow cooling. The method for forming the glass plate is not particularly limited, and for example, a down-draw method (for example, an overflow down-draw method, an orifice down-draw method, and a re-draw method), a float method, a rolling method, and a pressing method can be used.

When a glass plate is used as the transparent substrate 12, in order to increase the strength, it is preferable to perform a chemical strengthening treatment or a physical strengthening treatment on the glass plate.

The chemical strengthening treatment method is not particularly limited, and the main surface of the glass plate is ion-exchanged to form a surface layer of residual compressive stress. Specifically, at a temperature below the glass transition point, the alkali metal ions (for example, Li ions, Na ions) having a smaller ionic radius contained in the glass near the main surface of the glass plate are replaced with alkali metals having a larger ionic radius. An ion (for example, Na ion or K ion with respect to Li ion, and K ion with respect to Na ion). As a result, compressive stress remains on the main surface of the glass plate, and the strength of the glass plate is improved.

The glass plate as the transparent substrate 12 preferably satisfies the conditions shown below. By performing the above chemical strengthening treatment, such conditions can be satisfied. The compressive stress (hereinafter referred to as "CS") of the glass plate is preferably 400 MPa or more and 1200 MPa or less, and more preferably 700 MPa or more and 900 MPa or less. If CS is 400 Pa or more, it is sufficient as a practical strength. On the other hand, if CS is 1200 MPa or less, it can withstand its own compressive stress without fear of natural damage. The depth of the stress layer of the glass plate (hereinafter referred to as "DOL") is preferably 15 to 50 μm, and more preferably 20 to 40 μm. If the DOL is 15 μm or more, even if a sharp jig such as a glass cutter is used, there is no fear that scratches may easily occur and damage may occur. On the other hand, if the DOL is 40 μm or less, it can withstand its own compressive stress without fear of natural damage.

The thickness of the transparent substrate 12 can be appropriately selected according to the application. For example, in the case of a glass plate, the thickness is preferably 0.1 to 5 mm, and more preferably 0.2 to 2 mm. When a glass plate is used as the transparent substrate 12 and the above-mentioned chemical strengthening treatment is performed, in order to make it more effective, the thickness of the glass plate is usually preferably 5 mm or less, more preferably 3 mm or less. The size of the transparent substrate 12 can be appropriately selected according to the application.

<< Frame part >> The frame part 132 is formed by printing colored ink on the transparent substrate 12. The frame portion 132 is preferably formed on a peripheral edge portion of the first main surface 12 a of the transparent base 12. Examples of the printing method include a bar coating method, a reverse coating method, a gravure coating method, a die coating method, a roll coating method, a screen printing method, and an inkjet method. For reasons such as being able to print on various transparent substrate frame portions and printing in accordance with the size of the transparent substrate frame portions, the screen printing method is preferred.

The coloring ink is not particularly limited, and examples thereof include an inorganic ink containing a ceramic calcined body and the like; an organic ink containing a colorant such as a dye or a pigment; and an organic resin. The coloring ink used to form the frame portion 132 is mostly black or white, but the color is not particularly limited. It is also possible to use a coloring ink that transmits only the wavelength region of infrared rays.

Examples of ceramics contained in the inorganic ink include oxides such as chromium oxide and iron oxide; carbides such as chromium carbide and tungsten carbide; carbon black; mica and the like.

The organic ink is a composition containing a dye or a pigment and an organic resin. The dye or pigment can be used without particular limitation. Examples of the organic resin include epoxy resin, acrylic resin, polyethylene terephthalate, polyether fluorene, polyarylate, polycarbonate, and transparent ABS (Acrylonitrile Butadiene Styrene, acrylonitrile-butadiene). (Ene-styrene) resin, phenolic resin, acrylonitrile-butadiene-styrene resin, polyurethane, polymethyl methacrylate, polyvinyl, polyvinyl butyral, poly Homopolymer of ether ether ketone, polyethylene, polyester, polypropylene, polyamide, polyimide, etc .; copolymers of monomers of these resins and monomers that can be copolymerized with them.

Regarding the inorganic ink and the organic ink, since the firing temperature is low, it is preferable to use an organic ink, and from the viewpoint of chemical resistance, an organic ink containing a pigment is more preferable.

<< Functional Layer >> The covering member 11 preferably has a functional layer (not shown) on the first main surface 12a or the second main surface 12b of the transparent substrate 12, and more preferably on the second main surface 12b of the transparent substrate 12. With functional layers. The functional layer is a layer exhibiting characteristics not possessed by the transparent substrate 12. Examples of the functional layer include an antiglare layer, an antireflection layer, and an antifouling layer.

(Anti-glare layer) The cover member 11 preferably has an anti-glare layer on the first main surface 12 a or the second main surface 12 b of the transparent base 12. By providing an anti-glare layer, the reflection of surrounding light can be reduced, and the visibility of a displayed image can be prevented from being reduced. In particular, it is more preferable to provide an anti-glare layer on the second main surface 12 b of the transparent substrate 12.

The anti-glare layer can be formed by performing a process of providing a concave-convex shape on the first main surface 12 a or the second main surface 12 b of the transparent substrate 12, a so-called anti-glare process. As the anti-glare treatment, a known method can be applied. For example, when a glass plate is used as the transparent substrate 12, a main surface of the glass plate can be chemically or physically subjected to a surface treatment to form a desired surface roughness. The method of uneven shape or wet coating.

As a method of chemically performing anti-glare treatment, specifically, the method of carrying out a frosting process is mentioned. The frosting treatment is performed, for example, by immersing a glass plate as a treatment object in a mixed solution of hydrogen fluoride and ammonium fluoride.

As a method for physically performing anti-glare treatment, for example, a so-called sandblasting treatment in which crystalline silicon dioxide powder, silicon carbide powder, etc. are blown onto the main surface of a glass plate with pressurized air, or a crystalline substance is attached How to wipe the brushes such as silicon dioxide powder and silicon carbide powder with water.

Among these, the frosting treatment is not easy to cause microcracks in the surface of the object to be treated, and it is not easy to reduce the mechanical strength, so it is preferable as a method for antiglare treatment of the glass plate.

The main surface of the glass plate after the anti-glare treatment is chemically or physically performed in this manner is preferably subjected to an etching treatment to adjust the surface shape. As the etching treatment, for example, a method of chemically etching a glass plate by immersing it in an etching solution which is an aqueous solution of hydrogen fluoride can be used. The etching solution may contain acids such as hydrochloric acid, nitric acid, and citric acid in addition to hydrogen fluoride. By containing these acids, the local generation of precipitates caused by the reaction between cations such as Na ions and K ions contained in the glass plate and hydrogen fluoride can be suppressed, and etching can be performed uniformly in the processing surface.

When the etching process is performed, the amount of etching is adjusted by adjusting the concentration of the etching solution or the immersion time of the glass plate in the etching solution, thereby adjusting the haze value of the anti-glare treatment surface of the glass plate to the desired value. Expected value. When a physical surface treatment such as sandblasting is performed as an anti-glare treatment, cracks may occur, but such cracks can be removed by an etching treatment. The effect of suppressing glare is also obtained by the etching process. Here, the so-called glare means a phenomenon in which, when the transparent substrate 12 is used as a cover member for a display device of a pixel matrix type, a plurality of light particles having a period larger than the pixel matrix are observed on the surface of the cover member. .

The main surface of the glass plate after the anti-glare treatment and the etching treatment preferably has a surface roughness (root mean square roughness, RMS) of 0.01 to 0.5 μm. The surface roughness (RMS) is more preferably 0.01 to 0.3 μm, and still more preferably 0.01 to 0.2 μm. By setting the surface roughness (RMS) to the above range, the haze value of the glass plate after anti-glare treatment can be adjusted to 1 to 30%. The haze value is a value specified in JIS K 7136: (2000).

The surface roughness (RMS) can be measured according to a method specified in JIS B 0601: (2001). Specifically, a laser microscope (trade name: VK-9700, manufactured by KEYENCE Corporation) was used to set a field of view of 300 μm × 200 μm to the measurement surface of the glass plate after anti-glare treatment as a sample, and the glass plate was measured. Height information. The surface roughness (RMS) can be calculated by critically correcting the measured value and finding the root mean square of the obtained height. As the critical value, 0.08 mm is preferably used.

The surface of the glass plate after the anti-glare treatment and the etching treatment has a concave-convex shape. When viewed from above the surface of the glass plate, it looks like a circular hole. The size (diameter) of the circular holes thus observed is preferably 1 μm or more and 10 μm or less. By being in this range, glare prevention and anti-glare properties can be achieved at the same time.

(Anti-reflection layer) If an anti-reflection layer is provided as a functional layer on the main surface of the transparent substrate 12, the reflection of external light can be reduced, and the visibility of the displayed image can be prevented from being lowered. When an anti-glare layer is provided on the main surface of the transparent substrate 12, it is preferable to provide an anti-reflection layer on the anti-glare layer.

The configuration of the anti-reflection layer is not particularly limited as long as it is a configuration capable of suppressing reflection of light within a specific range. For example, it may be a configuration obtained by laminating a high refractive index layer and a low refractive index layer. Here, the high refractive index layer refers to, for example, a layer having a refractive index of light of 550 nm or more, and the low refractive index layer refers to a layer having a refractive index of light of 550 nm or less.

The number of layers of the high-refractive index layer and the low-refractive index layer in the anti-reflection layer may be a state in which each includes one layer, or a configuration in which each includes two or more layers. When the high-refractive index layer and the low-refractive index layer each include one layer, it is preferable that a high-refractive index layer and a low-refractive index layer are sequentially laminated on the main surface of the transparent substrate 12. When the high-refractive index layer and the low-refractive index layer each include two or more layers, it is preferable to alternately laminate the high-refractive index layer and the low-refractive index layer in the order.

In order to improve the anti-reflection performance, the anti-reflection layer is preferably a laminated body formed by laminating a plurality of layers. The laminated body is, for example, preferably a laminated body having 2 or more and 8 layers or less, more preferably a laminated body having 2 or more and 6 layers or less, and further preferably a laminated body having 2 or more and 4 layers or less. As described above, the laminated body is preferably obtained by alternately laminating a high refractive index layer and a low refractive index layer. The total number of layers of the high refractive index layer and the low refractive index layer is preferably within the above range. You may add a layer in the range which does not impair optical characteristics. For example, in order to prevent Na from diffusing from the glass substrate, a SiO ₂ layer may be inserted between the glass and the first layer.

The layer thickness of the high refractive index layer and the layer thickness of the low refractive index layer are appropriately adjusted.

The material constituting the high-refractive index layer and the low-refractive index layer is not particularly limited, and can be selected in consideration of the degree of required antireflection performance, productivity, and the like. Examples of the material constituting the high refractive index layer include niobium oxide (Nb ₂ O ₅ ), titanium oxide (TiO ₂ ), zirconia (ZrO ₂ ), tantalum oxide (Ta ₂ O ₅ ), and alumina (Al ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ), etc. One or more selected from these materials can be preferably used. As the material constituting the low refractive index layer include a silicon oxide (especially silicon dioxide SiO _2), a material containing mixed oxides of Si and Sn, the material comprising the mixed oxides of Si and Zr, Al and Si containing the Mixed oxide materials. One or more selected from these materials can be preferably used.

From the viewpoint of productivity or refractive index, it is preferable that the high refractive index layer is a layer composed of one selected from niobium oxide, tantalum oxide, and silicon nitride, and the low refractive index layer is A layer made of silicon oxide.

The method for forming each layer constituting the anti-reflection layer is not particularly limited, and various methods can be used. For example, a vacuum vapor deposition method, an ion beam assisted vapor deposition method, an ion plating method, a sputtering method, a plasma CVD (Chemical Vapor Deposition) method, or the like can be used. Among these methods, it is preferable to use a sputtering method to form a dense and highly durable layer. Particularly preferred are sputtering methods such as pulse sputtering, AC (Alternating Current) sputtering, and digital sputtering.

For example, in the case of the pulse sputtering method, a transparent substrate 12 such as a glass plate is placed in a chamber of a mixed gas atmosphere of an inert gas and oxygen, and a target is selected so as to have a desired composition. At this time, the type of the inert gas in the chamber is not particularly limited, and various inert gases such as argon or helium can be used.

The pressure in the chamber generated by the mixed gas of the inert gas and oxygen is not particularly limited, but by setting the range to 0.5 Pa or less, it is easy to set the surface roughness of the formed layer to a preferable range. The lower limit value of the pressure in the chamber generated by the mixed gas of the inert gas and oxygen is not particularly limited, and is preferably 0.1 Pa or more, for example.

When the high-refractive-index layer and the low-refractive-index layer are formed by the pulse sputtering method, the adjustment of the layer thickness of each layer can be achieved by, for example, adjusting the discharge power or adjusting the time for forming each layer.

(Antifouling layer) It is preferable to provide an antifouling layer as a functional layer on the main surface of the transparent substrate 12. If an antifouling layer is provided, dirt (human fingerprints, etc.) adhering to the transparent substrate 12 can be easily removed. The antifouling layer is preferably the outermost layer constituting the functional layer in order to fully exert its function. As a method for forming the antifouling layer, a dry method such as a vacuum evaporation method, an ion beam assisted evaporation method, an ion plating method, a sputtering method, a plasma CVD method, a spin coating method, a dip coating method, or casting can be used. Any one of the wet methods such as the coating method, the slit coating method, and the spray method. From the viewpoint of abrasion resistance, a dry method is preferred.

The constituent material of the antifouling layer can be appropriately selected from materials capable of imparting antifouling properties, water repellency, and oil repellency. Specific examples include fluorine-containing organosilicon compounds. The fluorine-containing organosilicon compound can be used without particular limitation as long as it can impart antifouling properties, water repellency, and oil repellency.

As the fluorine-containing organic silicon compound, for example, an organic silicon compound having one or more groups selected from the group consisting of a polyfluoropolyether group, a polyfluoroalkylene group, and a polyfluoroalkyl group can be preferably used. The polyfluoropolyether group refers to a divalent group having a structure in which a polyfluoroalkylene group and an etheric oxygen atom are alternately bonded.

As a commercially available product of a fluorine-containing organosilicon compound having one or more groups selected from the group consisting of a polyfluoropolyether group, a polyfluoroalkylene group, and a perfluoroalkyl group, for example, KP can be preferably used. -801, KY-178, KY-130, KY-185 (all are trade names, manufactured by Shin-Etsu Chemical Co., Ltd.), OPTOOL DSX and OPTOOL AES (both trade names, manufactured by Daikin), S550 (trade name, manufactured by Asahi Glass Co., Ltd.) )Wait.

Fluorine-containing organosilicon compounds are usually stored in a mixture with a fluorine-based solvent to suppress deterioration caused by the reaction with moisture in the atmosphere. However, if used directly in a state containing these solvents, the obtained If the durability of the antifouling layer is adversely affected. Therefore, in the case where the antifouling layer is formed by the vacuum evaporation method in the following order, it is preferable to use a fluorine-containing organosilicon compound that has been subjected to a solvent removal treatment before being heated by a heating container.

Here, examples of the solvent used when storing the fluorine-containing organosilicon compound include polyfluorohexane, m-xylene hexafluoride (C ₆ H ₄ (CF ₃ ) ₂ ), hydrofluoropolyether, and HFE7200 / 7100 (trade name, manufactured by Sumitomo 3M, HFE7200 is represented by the formula: C ₄ F ₉ OC ₂ H ₅ and HFE7100 is represented by the formula: C ₄ F ₉ OCH ₃ ). For example, the concentration of the solvent contained in the solution of the fluorine-containing organosilicon compound is preferably 1 mol% or less, and more preferably 0.2 mol% or less. It is particularly preferable to use a fluorine-containing organosilicon compound containing no solvent.

The removal of the solvent from the above-mentioned solution containing a fluorine-containing organic silicon compound containing a fluorine-based solvent can be performed, for example, by vacuum evacuation of a container containing the solution containing a fluorine-containing organic silicon compound. The evacuation time varies depending on the evacuation capacity of the exhaust line, vacuum pump, etc., the amount of solution, etc., and is therefore not limited. For example, the evacuation time may be more than 10 hours.

When the antifouling layer composed of the fluorine-containing organosilicon compound is formed, a vacuum evaporation method is preferably used. When a vacuum evaporation method is used, the above-mentioned solvent removal treatment can also be performed by introducing a solution containing a fluorine-containing organosilicon compound into a heating container of a film forming apparatus for forming an antifouling layer, and then raising the temperature. Before, the inside of the heating vessel was evacuated at room temperature. The solvent may be removed by an evaporator or the like before being introduced into the heating container.

The fluorine-containing organosilicon compound containing a small amount of the solvent or containing no solvent is more likely to be deteriorated by contact with the atmosphere than those containing a solvent. Therefore, the storage container of fluorine-containing organosilicon compounds with less solvent content (or no solvent) is preferably obtained by replacing and sealing the container with an inert gas such as nitrogen, so that the exposure time in the atmosphere during processing will change. short.

Specifically, it is preferable that the fluorine-containing organosilicon compound is introduced into a heating container of a film forming apparatus immediately after the storage container is opened. Furthermore, it is preferable to remove the atmosphere (air) contained in the heating container by introducing a vacuum in the heating container or replacing with an inert gas such as nitrogen or a rare gas after the introduction. More preferably, for example, the storage container and the heating container are connected by a valved pipe so that they can be introduced from the storage container (storage container) to the heating container of the film forming apparatus without being in contact with the atmosphere. Furthermore, it is preferred that after the fluorine-containing organosilicon compound is introduced into the heating container, the container is replaced with a vacuum or an inert gas, and then heating for film formation is started immediately.

In general, the thickness of the antifouling layer is preferably 2 to 20 nm, more preferably 2 to 15 nm, and even more preferably 2 to 10 nm.

<Manufacturing Method of Covering Member> The manufacturing method of the covering member 11 is not particularly limited, and examples thereof include a method of preparing a transparent substrate 12 having a first main surface 12a and a second main surface 12b, and attaching a transparent substrate 12 to one surface. For a transfer substrate (not shown) of a fluorine compound (not shown), the first main surface 12a of the transparent substrate 12 and the transfer-attached surface (hereinafter also referred to as "transfer surface") ") Contact, transfer the fluorine-containing compound to the first main surface 12a of the transparent substrate 12, and by this transfer, a compound containing F atoms is attached to the first main surface 12a, and the contact angle of the first main surface 12a Set to 50 ° or less. As a manufacturing method of the cover member 11, a method is also cited in which the first main surface 12a of the transparent substrate 12 and the surface of the fluorine-containing compound layer on the transfer substrate are separated from each other by a specific distance (for example, 1 to 10 mm). ) Face each other and let stand for 1 to 48 hours. In terms of adjustment of the value of the contact angle of the first main surface 12a and easy control of the adhesion amount of the fluorine-containing compound, the method for manufacturing the cover member 11 is preferably the above-described method based on transfer.

The frame portion 132 or the functional layer is formed on at least one of the first main surface 12a or the second main surface 12b of the transparent substrate 12 as needed.

When the transparent substrate 12 is a glass plate, it is preferable that the substrate for transfer is also a glass plate. The thickness of the transfer substrate is not particularly limited, and the size of the transfer substrate is preferably the same as or larger than the transparent substrate 12.

The fluorine-containing compound adhering to the transfer surface of the transfer substrate is preferably a layer having a certain thickness. The layered fluorine-containing compound (hereinafter also referred to as a "fluorine-containing compound layer for transfer") is preferably in a state of being formed on the transfer substrate in an amount sufficient to a thickness of a single molecule. The fluorine-containing compound layer for transfer is formed in the same order as the antifouling layer of the cover member 11. However, the thickness of the fluorine-containing compound layer for transfer is preferably thicker than the antifouling layer of the cover member 11, and specifically, for example, 50 to 180 nm, and more preferably 60 to 170 nm. The fluorine-containing compound layer for transfer may not be a continuous layer continuous in the main surface direction of the transfer substrate, or it may be a discontinuous layer (intermittent layer).

Of the fluorine-containing compounds (eg, fluorine-containing organosilicon compounds) constituting the fluorine-containing compound layer for transfer, those that are strongly chemically bonded by reacting with a transparent substrate 12 such as a glass plate (eg, silane coupling reaction) are usually only related to Molecules in contact with the transparent substrate 12 such as a glass plate. Therefore, the molecules (fluorine chains) existing on the molecules that are in contact with the transparent substrate 12 are only physically aggregated, and can be easily released and transferred to other members.

The first main surface 12a of the transparent substrate 12 (the frame portion 132 may be formed) is brought into contact with the transfer surface of the transfer substrate, and after a certain period of time, the two are peeled off. In this way, the fluorine-containing compound (the fluorine-containing compound layer for transfer) attached to the transfer substrate is transferred to the first main surface 12 a of the transparent substrate 12.

At this time, the contact time (also referred to as "transfer time") of the transparent substrate 12 and the transfer substrate is preferably 0.5 minutes or more and less than 60 minutes, more preferably 0.5 minutes or more and 30 minutes or less, and further preferably It is 0.5 minutes or more and 15 minutes or less. [Example]

Hereinafter, embodiments of the present invention will be specifically described using examples and the like. However, the present invention is not limited to the following examples. Examples 1 to 6 are examples, and examples 7 to 8 are comparative examples.

<Example 1> The covering member of Example 1 was produced as explained below.

"Preparation of Transparent Substrate (Glass Plate)" In each example, a glass plate was used as a transparent substrate to be a covering member. More specifically, first, Dragontrail (trade name, manufactured by Asahi Glass Co., Ltd., thickness 1.3 mm) was prepared as a glass plate for chemical strengthening. It was cut to a size of 100 mm × 100 mm, and then chemically strengthened. That is, the glass plate for chemical strengthening was immersed in potassium nitrate (molten salt) melted by heating to 450 ° C. for 2 hours, then pulled from the molten salt, and slowly cooled to room temperature in 1 hour. In this way, a chemically strengthened glass plate having a surface compressive stress (CS) of 730 MPa and a depth of a stress layer (DOL) of 30 μm was obtained.

"Formation of the frame part" An outer frame-shaped frame part is formed by screen printing on the peripheral part of the outer side of the 1st main surface of the glass plate which becomes a cover member. Specifically, in the following procedure, printing was performed on four sides of the peripheral portion outside the first main surface of the glass plate in a black frame shape with a width of 10 mm to form a frame portion. First, black ink was applied to a thickness of 5 μm by a screen printing machine, and then kept at 150 ° C. for 10 minutes to be dried to form a first printing layer. Next, a black ink was applied to a thickness of 5 μm on the first printed layer in the same procedure as above, and then dried at 150 ° C. for 40 minutes to form a second printed layer. In this way, a frame portion formed by laminating the first print layer and the second print layer is formed. As the black ink, HFGV3RX01 (trade name, manufactured by Seiko Corporation) was used.

"Formation of antifouling layer" An antifouling layer was formed on the second main surface of the glass plate to be a cover member in the following order. First, a solution of a fluorine-containing organosilicon compound as a material of an antifouling layer is introduced into a heating container. Thereafter, the inside of the heating container was degassed with a vacuum pump for 10 hours or more to remove the solvent from the solution, and this was used as a composition for forming an antifouling layer. In Example 1, as a material of the antifouling layer, KY185 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was used. Then, the heating container containing the composition for forming an antifouling layer was heated to 270 ° C, and after reaching 270 ° C, the state was maintained for 10 minutes until the temperature became stable. Next, after the glass plate is set in the vacuum chamber, the antifouling layer-forming composition is supplied from a nozzle connected to a heating container containing the composition for forming an antifouling layer toward the second main surface of the glass plate to form an antifouling layer. . The antifouling layer is formed by measuring the thickness of the antifouling layer with a crystal oscillator monitor installed in a vacuum chamber, and is formed until the thickness of the antifouling layer becomes 4 nm. Next, the glass plate taken out from the vacuum chamber was set on the heating plate with the antifouling layer facing upward, and was heated at 150 ° C. for 60 minutes in the atmosphere. In this way, an antifouling layer is formed on the entire surface of the second main surface of the glass plate.

<< Transfer >> Using a transfer substrate, the transfer fluorine-containing compound layer is transferred to the first main surface (the main surface of the side where the frame portion is formed) of a glass plate that is a cover member. Specifically, first, another glass plate having the same size (100 mm × 100 mm) as the glass plate serving as the cover member was prepared, and this was used as a transfer substrate. On one main surface (transfer surface) of the transfer substrate, a fluorine-containing compound layer for transfer is formed in the same procedure as described in the above-mentioned "Formation of an antifouling layer". The thickness of the fluorine-containing compound layer for transfer was set to 70 nm. Next, the first main surface of the glass plate (the main surface on the side where the frame portion is formed) serving as the cover member and the surface of the fluorine-containing compound layer for transfer formed on the substrate for transfer (the side of the substrate for transfer) The surface is the surface on the opposite side). The contact time (transfer time) was set to 10 minutes. After the transfer, both are peeled off.

<Example 2> An anti-reflection layer was formed on the second main surface of the glass plate as a cover member, an antifouling layer was formed on the anti-reflection layer, and the thickness of the fluorine-containing compound layer for transfer was changed from 70 nm to 150 Except for nm, a covering member of Example 2 was produced in the same procedure as in Example 1.

"Formation of anti-reflection layer" An anti-reflection layer having a structure in which a high refractive index layer and a low refractive index layer are alternately laminated is formed on the entire second main surface of a glass plate. More specifically, in Example 2, a high-refractive index layer composed of niobium oxide and a low-refractive index layer composed of silicon oxide were sequentially formed, and an antireflection layer having two layers was formed. Regarding the thickness of each layer, the high refractive index layer of the first layer was set to 13 nm, and the low refractive index layer of the second layer was set to 120 nm. Hereinafter, a method for forming a high refractive index layer and a low refractive index layer will be described.

(Formation of high refractive index layer) in a vacuum chamber, the argon gas introduced into the side to be 10% by volume of a mixed manner obtained from a mixed gas oxygen side pressure 0.3 Pa, frequency 20 kHz, power density of 3.8 W / cm ² With a reverse pulse width of 5 μsec, pulse sputtering was performed using a niobium oxide target (trade name: NBO target, manufactured by AGC CERAMICS Co., Ltd.) on the entire surface of the glass plate where the high refractive index layer should be formed High refractive index layer made of niobium oxide.

(Formation of low-refractive-index layer) In a vacuum chamber, a mixed gas obtained by mixing oxygen in an argon gas at a volume of 40% by volume is introduced while the pressure is 0.3 Pa, the frequency is 20 kHz, and the power density is 3.8 W / cm ² With a reverse pulse width of 5 μsec, pulse sputtering is performed using a silicon target, and a low refractive index layer made of silicon oxide is formed on the entire surface of the surface where the low refractive index layer should be formed.

〈Example 3〉 An anti-reflection layer was formed on the second main surface of the glass plate to be a cover member, and an anti-fouling layer was formed on the anti-reflection layer. The material of the anti-fouling layer and the fluorochemical layer for transfer was changed from KY185 An OPTOOL DSX (trade name, manufactured by Daikin Co., Ltd.) was used, and a transfer member was changed from 10 minutes to 1 minute, and a cover member of Example 3 was produced in the same procedure as in Example 1. The antireflection layer was formed in the same order as in Example 2.

<Example 4> An anti-reflection layer was formed on the second main surface of the glass plate to be a cover member, and an antifouling layer was formed on the antireflection layer. The material of the antifouling layer and the fluorine-containing compound layer for transfer was changed from KY185 Except for S550 (trade name, manufactured by Asahi Glass Co., Ltd.) and changing the transfer time from 10 minutes to 1 minute, a covering member of Example 4 was produced in the same procedure as in Example 1. The antireflection layer was formed in the same order as in Example 2.

<Example 5> A cover member of Example 5 was produced in the same procedure as in Example 1 except that the fluorine-containing compound layer for transfer was not brought into contact with the first main surface of the glass plate as the cover member. Specifically, in Example 5, first, in the same manner as in Example 1, a fluorine-containing compound layer for transfer (thickness: 70 nm) was formed on the transfer surface of the transfer substrate. Next, the first main surface of the glass plate (the main surface on the side where the frame portion is formed) serving as the cover member and the surface of the fluorine-containing compound layer for transfer formed on the substrate for transfer (on the side of the substrate for transfer) The opposite side is the opposite side.) Face each other at a distance of 5 mm and let stand for 24 hours.

<Example 6> In addition to forming an anti-reflection layer on the second main surface of the glass plate to be a covering member, forming an antifouling layer on the anti-reflection layer, and changing the transfer time from 10 minutes to 60 minutes, In the same procedure as in Example 1, a covering member of Example 6 was produced. The antireflection layer was formed in the same order as in Example 2.

<Example 7> Except that the thickness of the fluorine-containing compound layer for transfer was changed from 70 nm to 200 nm, and the transfer time was changed from 10 minutes to 60 minutes, the same procedure as in Example 1 was used to prepare Example 7. The cover member.

<Example 8> The fluorine-containing compound layer for transfer was not transferred to the first main surface of the glass plate as a cover member. Instead, a polyimide tape (Kapton tape 650S, manufactured by Teraoka Manufacturing Co., Ltd.) coated with a silicone-based adhesive was attached to the first main surface of the glass plate as the cover member, and immediately peeled off. Other than this, the covering member of Example 8 was produced in the same procedure as in Example 1.

<Contact angle> The contact angle of the 1st main surface of a glass plate was calculated | required as follows. First, the area of the unprinted frame-shaped frame portion on the first main surface of the glass plate is divided into 4 × 4 equal portions. Measure the contact angle of water at the intersection (total of 9 points) of the lines (3 + 3) drawn on the second main surface of the glass plate when divided into equal parts. Specifically, at a measurement temperature of 23 ° C., a contact angle meter (PCA-11, manufactured by Kyowa Interface Science Co., Ltd.) was used to measure the contact angle after 5 seconds of pure water was dropped. The average value of the measured contact angles at a total of 9 points was defined as the contact angle of the first main surface of the glass plate.

<Atomic ratio (F / Si)> The atomic ratio (F / Si) of the 1st main surface of a glass plate is calculated | required as follows. First, an X-ray photoelectron spectroscopy device (manufactured by Japan Electronics Co., Ltd., JPS-9000MC) was used to determine the area of the frame portion of the first main surface of the glass plate that is not printed with a frame (unit: atomic%) And Si atom concentration (unit: atomic%). The ratio of the obtained F atom concentration to the Si atom concentration was defined as the ratio (F / Si) of the number of F atoms to the number of Si atoms on the first principal surface of the glass plate. More specifically, the measurement was performed under conditions where the X-ray source was MgKα rays, an acceleration voltage of 12 kV, and 25 mA. The measurement was performed with a spot diameter of 6 mmf. No sample tilt. The measurement was performed with a passing energy of 50 eV, a measurement step of 0.5 eV, a Dwell Time of 100 msec, and a number of scans of 30 times. For the bond energy peak obtained from the measurement results, after removing the background by the Shirley method, the atomic concentration ratio of F / Si was calculated from the F1s peak intensity and the Si2p3 / 2 peak intensity.

<Evaluation> The covering members of each case were evaluated as follows.

"Production of test body" Soda-lime glass (plate thickness: 0.7 mm, size: 100 mm × 100 mm) was prepared, and this was used as a substitute for a display panel. The first main surface (including the frame portion) of the glass plate of the cover member in each example was bonded to one of the main surfaces of a display panel substitute using an adhesive layer (MK64, manufactured by Bachuan Paper Co., Ltd.). In this way, a test body was produced. For bonding, a bonding device (CLIMB PRODUCTS) was used. In each case, 300 test bodies were produced.

"Bubble foaming rate" It was confirmed in each test body whether bubbles having a size of 30 μm or more were generated between the glass plate and the adhesive layer. In each example, the ratio (%) of the number of test bodies which generate | occur | produced the bubble of 30 micrometers or more with respect to the number (300) of all test bodies was calculated | required. The smaller the ratio, the more it can be evaluated that the generation of air bubbles between the glass plate and the adhesive layer can be suppressed, and it is preferably 6% or less.

The above results are summarized in Table 1 below. The "material of the antifouling layer" in Table 1 below also refers to the "material of the fluorine-containing compound layer for transfer".

[Table 1]

As shown in Table 1 above, Examples 1 to 6 include compounds containing F atoms (the atomic ratio (F / Si) exceeds 0) and the contact angle of the first main surface to 50 ° or less on the first main surface of the glass plate. Compared with Examples 7 to 8 which do not satisfy these conditions, the generation of bubbles between the glass plate and the adhesive layer is suppressed.

In Examples 1 to 4 in which the atomic ratio (F / Si) is in the range of 0.005 to 0.13, generation of bubbles between the glass plate and the adhesive layer is suppressed compared to Examples 5 to 6 outside the range.

When Examples 1 to 4 are compared, compared with Example 3 in which the atomic ratio (F / Si) of the first main surface of the glass plate is 0.012, Example 1 in which the atomic ratio (F / Si) is 0.023 to 0.075 2 and 4 can more inhibit the generation of bubbles. In addition, it is considered that in Example 7, since the atomic ratio (F / Si) is large and there are many regions with low surface energy, the generation rate of bubbles is rather high.

This application is based on Japanese Patent Application 2017-102481 filed on May 24, 2017, the contents of which are incorporated herein by reference.

11‧‧‧ Covering member

12‧‧‧ transparent substrate

12a‧‧‧1st main face

12b‧‧‧ 2nd main face

14‧‧‧ Adhesive layer

100‧‧‧ display device

102‧‧‧ backlight unit

104‧‧‧display panel (covered member)

104a‧‧‧display surface

106‧‧‧Frame

107‧‧‧Frame floor

131‧‧‧adjacent layer

132‧‧‧Frame section

141‧‧‧Wiring

511‧‧‧ cover member

512‧‧‧ transparent substrate

512a‧‧‧1st main face

551‧‧‧ Bubble

561‧‧‧step difference

FIG. 1 is a sectional view showing a display device according to this embodiment. FIG. 2 is an enlarged cross-sectional view of a cover member, an adhesive layer, and a display panel. FIG. 3 is an enlarged cross-sectional view showing a state in which a conventional covering member is bonded to a display panel through an adhesive layer. FIG. 4 is a cross-sectional view showing a covering member according to this embodiment.

Claims (19)

A covering member comprising a transparent substrate, the transparent substrate having a first main surface facing the member to be covered, and a second main surface opposite to the first main surface, and attached to the first main surface There are compounds containing an F atom, and the contact angle of the first principal surface is 50 ° or less. For example, the covering member of claim 1, wherein the ratio (F / Si) of the number of F atoms to the number of Si atoms in the first main surface is 0.005 to 0.13. Such as the covering member of claim 2, wherein the above-mentioned ratio (F / Si) is 0.015 to 0.1. The covering member according to any one of claims 1 to 3, wherein the contact angle is 25 to 45 °. The covering member of claim 4, wherein the contact angle is 28 to 40 °. The covering member according to any one of claims 1 to 5, wherein the thickness of the transparent substrate is 0.1 mm or more and 5 mm or less. The covering member according to any one of claims 1 to 6, wherein the compound containing an F atom is an organic compound. The covering member according to any one of claims 1 to 7, wherein the transparent substrate is a glass plate. The cover member according to claim 8, wherein the glass plate is a chemically strengthened glass plate. For the covering member of claim 8 or 9, wherein the compressive stress (CS) of any one of the main surfaces of the glass plate is 400 MPa or more and 1200 MPa or less. The cover member according to any one of claims 8 to 10, wherein the depth (DOL) of the stress layer on any one of the main surfaces of the glass plate is 15 μm or more and 50 μm or less. The covering member according to any one of claims 1 to 11, further comprising a frame portion on the first main surface. The covering member according to any one of claims 1 to 12, further comprising a functional layer disposed on the second main surface of the transparent substrate. The covering member according to claim 13, wherein the functional layer includes an antifouling layer. The covering member according to claim 14, wherein the thickness of the antifouling layer is 2 nm or more and 20 nm or less. The covering member according to any one of claims 13 to 15, wherein the functional layer includes an anti-reflection layer. A manufacturing method of a covering member, which is a method of manufacturing a covering member including a transparent substrate, and is prepared to have a first main surface facing the covered member and a second main surface opposite to the first main surface. A substrate is prepared on a transfer substrate with a fluorine-containing compound adhered on one side, and the first main surface of the transparent substrate is brought into contact with the fluorine-containing compound-attached surface of the transfer substrate to transfer the fluorine-containing compound. The first principal surface printed on the transparent substrate is adhered to the first principal surface with a compound containing an F atom by the transfer, and a contact angle of the first principal surface is set to 50 ° or less. For example, the method for manufacturing a covering member according to claim 17, wherein the contact angle of the first main surface is set to 25 to 45 ° by the above transfer, and the number of F atoms in the first main surface is relative to Si atoms. The ratio (F / Si) is set to 0.005 to 0.13. A display device includes a cover member, an adhesive layer, and a display panel according to any one of claims 1 to 16, and the cover member faces the display panel with the first main surface of the transparent substrate facing the display panel. Oriented and bonded to the display panel via the adhesive layer.