TW201831414A - Methods for laser processing transparent workpieces by forming score lines - Google Patents

Abstract

A method for laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece at an impingement location on a first surface of the transparent workpiece such that the pulsed laser beam ablates a portion of material of the transparent workpiece at the impingement location. The laser beam has a pulse energy of from about 5 [mu]J to about 50 [mu]J. The method also includes translating the pulsed laser beam relative to the first surface of the transparent workpiece along a desired separation path, thereby ablating additional material of the transparent workpiece to form a score line along the desired separation path, the score line having a score depth of from about 10 [mu]m to about 60 [mu]m.

Description

Method for laser processing a transparent workpiece by forming a scribe line

The present specification generally relates to apparatus and methods for laser processing of transparent workpieces, and more particularly to separating transparent workpieces by forming a score line in a laser in a transparent workpiece and separating the transparent workpiece along the score line.

The field of laser processing materials encompasses a variety of applications involving cutting, drilling, milling, welding, melting, and the like of different types of materials. Among these processes, one of the particular concerns is the cutting or separation of different types of transparent substrates in processes such as glass, sapphire or fused silica materials that are useful in the production of thin film transistors (TFTs) or display materials for electronic devices. .

From the perspective of process development and cost, there are many opportunities to improve the cutting and separation of glass substrates. A method of separating glass substrates that is faster, cleaner, more repeatable, and more reliable than currently being performed on the market is of great interest. Accordingly, there is a need for an alternative improved method of separating glass substrates.

According to one embodiment, a method for laser processing a transparent workpiece includes directing a pulsed laser beam into a transparent workpiece at an impact location on a first surface of a transparent workpiece such that the pulsed laser beam ablates the impact location Part of the material of the transparent workpiece. The laser beam has a pulse energy of from about 5 μJ to about 50 μJ. The method also includes moving the pulsed laser beam along a desired separation path relative to the first surface of the transparent workpiece, thereby ablating additional material of the transparent workpiece to form a scribe line along the desired separation path, the scribe line having about 10 [mu]m To a scratch depth of about 60 μm.

In other embodiments, the separate transparent workpiece includes a first surface relative to the second surface and a separate edge extending between the first surface and the second surface. The separation edge includes: a scratched surface region extending from the first surface to the scratch depth line; a fracture surface region extending from the scratch depth line to the second surface; and one or more hackle features along The ruptured surface area extends from the scratch depth line toward the second surface. The maximum needle row depth of one or more of the needle row features is 10 μm or less. Further, the separation edge contains an edge deviation distance of 30 μm or less. The edge deviation distance is the distance between the first interface plane of the fracture surface area and the second interface plane of the fracture surface area.

In still another embodiment, a method for laser processing a transparent workpiece includes directing a pulsed laser beam into a transparent workpiece at an impact location on a first surface of the transparent workpiece to ablate the pulsed laser beam A portion of the material of the transparent workpiece at the impact location. The laser beam has a pulse energy of from about 5 μJ to about 50 μJ. The method also includes moving the pulsed laser beam along a desired separation path relative to the first surface of the transparent workpiece, thereby ablating additional material of the transparent workpiece to form a scribe line along the desired separation path; and applying stress to the transparent workpiece The score line separates at least one separate transparent workpiece from the transparent workpiece along the score line. The at least one separate transparent workpiece includes an unpolished separation edge extending between the first surface and the second surface of the at least one separate transparent workpiece. The unpolished separation edge further includes: a scratched surface region extending from the first surface of the at least one separate transparent workpiece to the scratch depth line; the fracture surface region extending from the scratch depth line to the at least one separate transparent workpiece And a second surface; and one or more needle row features extending along the fracture surface region from the scratch depth line toward the second surface. The maximum needle row depth of one or more of the needle row features is 10 μm or less. Further, the unpolished separation edge contains an edge deviation distance of 30 μm or less. The edge deviation distance is the distance between the first interface plane of the fracture surface area and the second interface plane of the fracture surface area.

Additional features and advantages of the processes and systems described herein will be described in detail in the following embodiments, and those of ordinary skill in the art can readily appreciate some additional features and advantages or are described herein. The embodiments, including the embodiments, the claims, and the following figures, are included to understand some additional features and advantages.

It is to be understood that the foregoing description of the invention and the embodiments of the present invention The following figures are included to provide a further understanding of the various embodiments, and are incorporated in this specification. The drawings illustrate the various embodiments described herein and, together with the description, explain the principles and operations.

An embodiment of a method of laser processing a transparent workpiece and then separating the transparent workpiece into a plurality of separate transparent workpieces using lasers will now be described in detail, examples of which are illustrated in the following figures. Wherever possible, the same reference numerals will be used throughout the drawings to the One method embodiment for separating a transparent workpiece using a laser is described in Figure 1A. A laser beam generated by the laser can be directed to the surface of the transparent workpiece and the laser beam is moved relative to the transparent workpiece to ablate the transparent workpiece and create a score line extending into the surface of the transparent workpiece. After the scribe line is formed, stress can be applied to separate the transparent workpiece into two or more separate transparent workpieces, each having a separate edge. The depth of the score line before separating the transparent workpiece is related to the quality of the resulting separated edge. For example, a scribe line having a depth of about 10 micrometers (μm) to about 60 μm is formed and then the transparent workpiece is separated to form two separate transparent workpieces each having a minimum needle depth and a minimum edge deviation. The separation edge of the distance is such that the separation edge is coplanar or nearly coplanar with the fracture diffusion plane and orthogonal to the surface of the transparent workpiece. For example, when a transparent workpiece is used as a TFT or display glass for electronic components, minimizing the depth of the stitch depth from the edge provides a strong separation edge that can be well positioned in the final application. A method of laser processing a transparent workpiece to form a separate transparent workpiece having a minimum stitch depth and a minimum edge deviation distance will be described in detail herein with particular reference to the following figures.

As used herein, "laser processing" includes directing a laser beam, such as a pulsed laser beam, into a transparent workpiece and moving the laser beam relative to the transparent workpiece along a desired separation path. Examples of laser processing include, for example, using a pulsed laser beam to ablate a transparent workpiece surface to form a scribe line extending into the surface of the transparent workpiece and/or, for example, using an infrared laser beam to heat transparent along the scribe line Workpiece. The laser processing can separate the transparent workpiece into a plurality of separate transparent workpieces along one or more desired separation lines. However, in some embodiments, an additional non-laser step can be used to separate the transparent workpiece along one or more desired separation lines.

As used herein, the term "scratch line" means that a crack (eg, a line, curve, etc.) is formed (eg, ablated) in the surface of a transparent workpiece along a desired path, transparent when exposed to appropriate processing conditions. The workpiece can be separated into a plurality of separate transparent workpieces along the score line. The scribe line is typically comprised of a continuous slit that can include a series of overlapping ablated regions that are introduced into the transparent workpiece using various techniques described herein, for example, ablating a transparent workpiece with a pulsed laser beam. To form. Further, for example, an infrared laser or other laser configured to heat the transparent workpiece region along or near the score line can be used and transparent along the scribe line by bending or applying other mechanical stresses to the transparent workpiece The workpiece is separated.

The term "transparent workpiece" as used herein denotes a workpiece formed from transparent glass or glass-ceramic, wherein the term "transparent" as used herein means that the material has an optical depth of less than about 20% per millimeter of material. Absorption, for example, is less than about 10% per millimeter of material depth for a particular pulsed laser, or less than about 1% per millimeter of material depth, for example, for a particular pulsed laser wavelength. The depth (eg, thickness) of the transparent workpiece can be from about 50 [mu]m to about 10 mm (eg, from about 100 [mu]m to about 5 mm, or from about 500 [mu]m to about 3 mm, or from about 300 [mu]m to about 700 [mu]m). For example, the transparent workpiece can have a depth of about 500 μm, 700 μm, 1 mm, and the like. The transparent workpiece may comprise a glass workpiece formed of a glass composition, for example, borosilicate glass, soda lime glass, aluminosilicate glass, alkali aluminosilicate glass, alkaline earth aluminosilicate glass, alkaline earth borosilicate a caustic glass, a fused vermiculite or a crystalline material, for example, sapphire, cerium, gallium arsenide or a combination of the foregoing crystalline materials. By way of non-limiting example, the workpiece may comprise a transparent Niuyuekangning available from Corning, Corning City Gorilla ^® glass (e.g., coding 2318, 2319 encodes the encoding 2320). Other examples of transparent workpieces may include EAGLE XG ^® , CONTEGO and Corning LOTUS ^TM available from Corning Incorporated, Corning, NY.

In some embodiments, the transparent workpiece can be strengthened via thermal tempering or chemical strengthening (eg, via ion exchange) either before or after laser processing of the transparent workpiece. In an ion exchange process, ions in the surface layer of the transparent workpiece are replaced by larger ions having the same valence or oxidation state, for example, by partially or completely immersing the transparent workpiece in the ion exchange bath. Replacing smaller ions with larger ions causes the compressive stress of the layer to extend from one or more surfaces of the transparent workpiece to a certain depth in the transparent workpiece, referred to as the layer depth. The compressive stress is balanced by the tensile stress of the layer (referred to as central stretching) such that the net stress in the glass sheet is zero. The compressive stress on the surface of the glass sheet is formed to strengthen the glass and resist mechanical damage, and thus the crack does not extend through the layer depth to mitigate the sudden failure of the glass sheet. In some embodiments, larger potassium ions can be used to exchange smaller sodium ions in the surface layer of the transparent workpiece. In some embodiments, the ions and larger ions in the surface layer are monovalent alkali metal cations, such as Li ⁺ (when present in the glass), Na ⁺ , K ⁺ , Rb ^+, and Cs ⁺ . Alternatively, a monovalent cation other than an alkali metal cation, for example, Ag ⁺ , Tl ⁺ , Cu ⁺ or the like, may be used to replace the monovalent ion in the surface layer. Moreover, in some embodiments, the transparent workpiece can be thermally annealed to reduce residual stress in the transparent workpiece.

Referring now to Figure 1A, a transparent workpiece 90 placed on a displacement platform 80 is schematically depicted. The transparent workpiece 90 is in substantial contact with the displacement platform 80. However, due to variations in the transparent workpiece 90, the partially transparent workpiece 90 can be separated from the displacement platform 80. The laser 100 is placed above the displacement platform 80 and outputs a pulsed laser beam 102 that is directed into the transparent workpiece 90. The pulsed laser beam 102 traverses the first surface 96 of the transparent workpiece 90 and moves relative to the transparent workpiece 90 in the first direction 82 and/or the second direction 84 to produce one or more scribe lines 92. The score line 92 extends from the first surface 96 of the transparent workpiece 90 into the entirety of the transparent workpiece 90. Although the pulsed laser beam 102 is illustrated as being orthogonal with respect to the first surface 96 of the transparent workpiece 90, embodiments are not limited thereto, and in other embodiments, the pulsed laser beam 102 may be relative to the transparent workpiece 90. A surface 96 is non-orthogonal. Additionally, the transparent workpiece 90 can be securely held in position of the displacement platform 80 using mechanical or vacuum clamping. Vacuum clamping can be achieved by a series of vacuum holes spaced a few distances from the vacuum plate. The transparent workpiece 90 can be coupled to the displacement platform 80 using a graphite clamp and a combination of alignment pins and tape to achieve mechanical clamping.

In operation, a portion of the score line 92 can be formed by introducing the pulsed laser beam 102 along the desired separation path 93 into the transparent workpiece 90 at the impact location 97 on the first surface 96. It is desirable that the separation path 93 be a desired position of the score line 92 prior to the formation of the score line 92, and when the score line 92 is formed, it is desirable that the separation path 93 be co-located with the score line 92. Moreover, the complete scribe line 92 can be formed by moving the pulsed laser beam 102 and the transparent workpiece 90 relative to each other along the desired separation path 93. For example, pulsed laser beam 102 and transparent workpiece 90 can be moved relative to each other to perform a single sweep along desired separation path 93 or multiple sweeps along desired separation path 93, for example, along a desired separation path 93 for one to four sweeps.

In some embodiments, the laser 100 can be coupled to an overhead (not shown) that moves the laser 100 in a first direction 82 and a second direction 84. In other embodiments, the laser 100 can be stationary and the displacement platform 80 supporting the transparent workpiece 90 moves in the first direction 82 and the second direction 84. In still other embodiments, both the laser 100 and the displacement platform 80 are movable relative to each other. The relative displacement movement between the transparent workpiece 90 and the laser 100 can be from about 10 mm/s to about 200 mm/s, for example, 25 mm/s, 50 mm/s, 75 mm/s, 100 mm/s, 125 mm/s, 150 mm/s. , 175mm / s and so on. Furthermore, although the scribe line 92 illustrated in FIG. 1A is a straight line, the scribe line 92 may also be non-linear (ie, having a curvature along the first surface 96). For example, the transparent workpiece 90 or the pulsed laser beam 102 can be generated by moving the transparent workpiece 90 or the pulsed laser beam 102 relative to the other in two dimensions rather than one dimension (eg, in both the first direction 82 and the second direction 84). Curved score line 92. While FIG. 1A depicts the separation of the transparent workpiece 90 into two rectangular transparent workpieces, it should be understood that the separate transparency of any configuration/shape of the transparent workpiece 90 can be fabricated in accordance with the methods disclosed herein based on the desired end user application. Workpiece. For example, the transparent workpiece 90 can be separated into individual glass articles having any shape (eg, curved edges).

Referring now to Figure 1B, pulsed laser beam 102 is exemplarily depicted in more detail. In some embodiments, pulsed laser beam 102 is generated using the aforementioned laser 100, and then pulsed laser beam 102 is focused using focusing optics (eg, focusing lens 101). It should be understood that the focusing optics may include additional lenses or other optical components to focus and condition the pulsed laser beam 102. The pulsed laser beam 102 is focused such that the pulsed laser beam 102 has a convergence region 104 from which the convergence region 104 is determined by the depth of focus of the focused pulsed laser beam 102. The focusing lens 101 can be configured to focus the pulsed laser beam 102 to form a smaller beam waist width BW which is a partial pulsed laser beam 102 having a reduced diameter d. One example of the focus lens 101 includes a focal length of about 100 mm. The beam waist width diameter d is smaller than the unfocused portion diameter D. As a non-limiting example, the unfocused portion diameter D can be about 1 to 10 mm, for example, 3 mm, 5 mm, 7 mm, and the like. As a non-limiting example, the diameter d can be about 5 to 25 μm, for example, 8 μm, 10 μm, 15 μm, 20 μm, and the like. The beam waist width BW has a center C which is a region of the pulsed laser beam 102 having a smaller diameter d. As described below, the pulsed laser beam 102 can be focused such that the center C of the beam waist width BW is at or near (eg, above or below) the first surface 96 or the second surface 98 of the transparent workpiece 90. Moreover, in some embodiments, the beam waist width BW can be located in the entirety of the transparent workpiece 90 proximate to the first surface 96 or the second surface 98 of the transparent workpiece 90. As a non-limiting example, the beam waist width BW can be located in the transparent workpiece 90 at a distance of about 100 [mu]m from the first surface 96.

The laser 100 is operable to emit a pulsed laser beam 102 having a wavelength suitable for transmitting thermal energy to a portion of the transparent workpiece 90. A suitable laser 100 includes a diode driven q-switched solid state Nd ³⁺ :YAG laser, Nd ³⁺ :YVO ₄ laser, and the like. In operation, laser 100 can output a pulsed laser beam 102 having a wavelength of from about 200 nm to about 1200 nm, for example, from about 200 nm to about 600 nm. In some embodiments, the laser 100 can output a pulsed laser beam 102 having a wavelength of, for example, 1064 nm, 1030 nm, 532 nm, 530 nm, 355 nm, 343 nm, or 266 nm or 215 nm. In some embodiments, the laser 100 can output a pulsed laser beam 102 having a wavelength in the visible range (ie, from about 380 nm to about 619 nm), for example, from about 380 nm to about 570 nm, For example, a wavelength of about 532 nm.

In operation, the pulse duration of the laser 100 can range from about 1 nanosecond to about 50 nanoseconds, for example, from about 15 nanoseconds to about 22 nanoseconds. In some embodiments, the pulse duration of individual pulses of pulsed laser beam 102 can range from about 1 picosecond to about 100 picoseconds, for example, from about 5 picoseconds to about 20 picoseconds, for example, about 10 picometers. Seconds, and the repetition frequency of the individual pulses may be in the range of about 1 kHz to 4 MHz, for example, in the range of about 10 kHz to about 3 MHz, about 10 kHz to about 650 kHz, or about 10 kHz to about 250 kHz. In addition to the single pulse operation of the aforementioned individual pulse repetition frequency, a burst of two pulses or multiple pulses may be used (eg, 3 pulses per pulse, 4 pulses, 5 pulses, 10 pulses, These pulses are generated in 15 pulses, 20 pulses or more, for example, 1 to 30 pulses per pulse train or 5 to 20 pulses per pulse train. The pulses in the burst may be separated by a range of from about 1 nanosecond to about 50 nanoseconds, for example, from about 10 nanoseconds to about 30 nanoseconds, such as a duration of 20 nanoseconds. In other embodiments, it can be up to 100 picoseconds (eg, 0.1 picoseconds, 5 picoseconds, 10 picoseconds, 15 picoseconds, 18 picoseconds, 20 picoseconds, 22 picoseconds, 25 picoseconds, 30 picoseconds, A pulse in the burst is separated by a duration of 50 picoseconds, 75 picoseconds or any range between the durations. For a given laser, the time between adjacent pulses in a single pulse train segment T _P may be relatively consistent (e.g., at about 10% of the other).

The pulse repetition frequency can range from about 10 kHz to about 200 kHz, for example, from about 40 kHz to about 100 kHz. Further, the laser 100 having a laser pulse train repetition frequency, the time between the first pulse and the subsequent pulse train in the pulse train about a first pulse T _b (laser pulse train repetition frequency = 1 / T _b) . In some embodiments, the laser burst repetition frequency can range from about 1 kHz to about 4 MHz. In an embodiment, the laser burst repetition frequency may be, for example, in the range of about 10 kHz to 650 kHz, for example, 200 kHz. The precise time, pulse duration and burst repetition frequency can be varied depending on the laser design, while high density short pulses ( _Td < 20 picoseconds, and in some embodiments, _Td ≦ 15 picoseconds) have been shown to be particularly good. Operation. The average laser power of each pulse train measured on the material can be at least about 40 [mu]J per mm material thickness. For example, in an embodiment, the average laser power per burst can range from about 40 μJ/mm to about 2500 μJ/mm or from about 500 μJ/mm to about 2250 μJ/mm. In a specific example, for a thickness of 0.5mm to 0.7mm Corning EAGLE XG ^® transparent workpiece, from about 300μJ burst to about 600μJ cleavable and / or separation of the workpiece, the burst corresponds to about 428μJ / mm to about 1200μJ / mm examples range (i.e., 0.7mm for the EAGLE XG ^® glass 300μJ / 0.7mm to 0.5mm and the EAGLE XG ^® glass 600μJ / 0.5mm).

An improved transparent workpiece can be described in terms of burst energy (ie, energy contained in a burst, where each burst contains a series of pulses) or energy contained in a single laser pulse (many of which can include a pulse train) 90 required pulse energy. The energy of each pulse train can range from about 25 [mu]J to about 750 [mu]J, for example, from about 50 [mu]J to about 500 [mu]J or from about 50 [mu]J to about 250 [mu]J. For some glass compositions, the energy per burst can range from about 100 [mu]J to about 250 [mu]J. However, for a display or TFT glass composition, the energy per pulse train is higher (eg, from about 300 μJ to about 500 μJ or from about 400 μJ to about 600 μJ depending on the particular glass composition of the transparent workpiece 90). For cutting or modifying a transparent material (e.g., glass), it is advantageous to use a pulsed laser beam 102 capable of producing this pulse train. Using a burst order allows for a larger time scale than the single pulse laser can achieve with a high intensity interaction of the material compared to a single pulse that is time separated by a repetition rate of a single pulsed laser. The burst order spreads the laser energy over the fast pulse order in the burst.

When the laser intensity of the pulsed laser beam 102 introduced into the transparent workpiece 90 is above a critical value, the pulsed laser beam 102 may contain absorptive nonlinear optical effects (eg, multiphoton absorption (MPA), bluff free phenomenon, etc.) Wait). For example, the material of the transparent workpiece 90 can be modified at or near the beam waist width BW of the pulsed laser beam 102 via these absorptive nonlinear effects. The MPA depends on the effect of the transparent workpiece material on the high-intensity electromagnetic field generated by the pulsed laser beam 102 that ionizes the electrons and causes photodisintegration and plasma generation. MPA is the simultaneous absorption of two or more photons of the same or different frequencies, exciting a molecule from one aspect (usually the ground state) to a higher energy electronic state (ie, ionization). The energy difference between the lower and higher states involved in the molecule is equal to the sum of the photon energies involved. MPA (also known as induced absorption) can be a secondary or tertiary process (or higher order), for example, several orders of magnitude weaker than linear absorption. For example, unlike linear absorption, the intensity of the secondary induced absorption can be proportional to the square of the light intensity, so the secondary induction is a nonlinear optical process. Since multiphoton absorption is a non-linear process, the optical intensity applied by the laser pulse rapidly changes the magnitude of the effect of multiphoton absorption. This intensity provides the instantaneous energy flux delivered by the optical pulse through the center C of the beam waist width BW. In operation, a portion of the first surface 96 is ablated by laser ablation by moving or scanning the beam waist width BW at or below the first surface 96, resulting in a defect as described in detail below. . As used herein, "ablative" and "laser ablation" refer to the removal of a glass material from a glass article by evaporation, which is attributed, for example, to the use of a pulsed laser beam 102 via absorptive nonlinear optics. The energy introduced by the effect.

Referring now to Figure 2, the transparent workpiece 90 is depicted as being subjected to laser ablation along the desired separation path 93. As described above, the laser 100 can be set such that the pulsed laser beam 102 is orthogonal with respect to the first surface 96 of the transparent workpiece 90. In FIG. 2, the depiction of the laser 100 and the transparent workpiece 90 moving relative to each other in the first direction 82 produces a score line 92 disposed along the first direction 82.

Referring now to Figures 3 and 4, a cross-sectional view of the transparent workpiece 90 and the score line 92 formed in the transparent workpiece 90 is depicted in more detail. Fig. 3 is a cross-sectional view along section A-A of Fig. 2 and Fig. 4 is a cross-sectional view along section B-B of Fig. 2. The score line 92 extends into the transparent workpiece 90 to the bottom line 94 of the score line. In addition, the score line 92 has a score line width W at the first surface 96 of the transparent workpiece 90, as shown in FIG. The scribe line 92 is formed by laser ablation at the first surface 96 of the transparent workpiece 90 and the material below the first surface 96 of the transparent workpiece 90 as the pulsed laser beam 102 moves relative to the transparent workpiece 90. For example, in the illustrative embodiment, the pulsed laser beam 102 is focused and set such that the center C of the beam waist width BW is at or near the first surface 96 of the transparent workpiece 90.

By focusing the pulsed laser beam 102, the center C of the beam waist width BW of the pulsed laser beam 102 is placed at or near the first surface 96 of the transparent workpiece 90, the pulsed laser beam The partially transparent workpiece 90 is ablated at the impact location 97, and the impact location 97 extends from the first surface 96 to the bottom line 94 of the score line. The pulsed laser beam 102 ablates the score line 92 into the transparent workpiece 90 by directing heat to the transparent workpiece 90, which causes the material of the transparent workpiece 90 to ablate along the first surface 96. In other embodiments, the pulsed laser beam 102 can ablate the transparent workpiece 90 at the second surface 98. For example, the pulsed laser beam 102 can be focused in the transparent workpiece 90 such that the beam waist width BW is disposed at or near the second surface 98 of the transparent workpiece 90. Since the transparent workpiece 90 is substantially transparent at the wavelength of the pulsed laser beam 102, it is possible to place the beam waist width BW at the second surface 98 of the transparent workpiece 90 or below the second surface 98 of the transparent workpiece 90 (outer side). No defects are created in the entirety of the transparent workpiece 90 or at the first surface 96.

As depicted in FIGS. 3 and 4, the score line 92 extends the scratch depth 95 into the transparent workpiece 90, which is less than the thickness 91 of the transparent workpiece 90. The scratch depth 95 can generally correspond to the convergence region 104 of the pulsed laser beam 102 (see FIG. 1B). When the laser beam intensity supports nonlinear interaction/absorption, the scratch depth 95 extends to the thickness 91 of the transparent workpiece 90. . The scratch depth 95 is also affected by the traversal speed of the laser 100 relative to the transparent workpiece 90, the composition and thickness of the transparent workpiece 90, the laser properties, and other factors, such as the pulsed laser beam 102 along The number of passes of the score line 92 is repeated with the pulsed laser beam 102. In some embodiments, the scratch depth 95 can be from about 10 [mu]m to about 200 [mu]m, for example, from about 10 [mu]m to about 100 [mu]m, from about 10 [mu]m to about 60 [mu]m, from about 10 [mu]m to about 35 [mu]m, and the like. Moreover, the scratch depth 95 can be substantially constant along the score line 92. For example, the scratch depth 95 can be offset by 20% or less along the score line 92, for example, less than 15% or less, 10% or less, 5% or less, 4% or less, 3%, or Smaller, 2% or less, 1% or less, and so on.

The score line 92 macro indicates the weakened area of the transparent workpiece 90 and establishes a path for expanding the crack to separate the transparent workpiece 90 into separate portions along the score line 92. After the scribe line 92 is formed, the transparent workpiece 90 can be separated by applying mechanical stress, thermal stress, or both mechanical stress and thermal stress. In some embodiments, for example, a bending moment (ie, mechanical stress) can be applied to the transparent workpiece 90 to follow the scratch by placing the scribe line 92 of the transparent workpiece 90 into tension using a four point bending device. Line 92 separates the transparent workpiece 90.

Further, for example, the transparent workpiece 90 can be separated along the scribe line 92 by heating the transparent workpiece 90 (i.e., applying thermal stress) using an infrared laser. Infrared lasers suitable for generating thermal stress in the glass typically have wavelengths that are readily absorbed by the glass (e.g., have a wavelength in the range of from 1.2 μm to 13 μm, for example, a range of from 4 μm to 12 μm). The infrared laser beam can be a laser beam produced by a carbon dioxide laser (CO ₂ laser), a carbon monoxide laser (CO laser), a solid state laser, a laser diode, or a combination of the foregoing. This infrared laser beam can be used as a controlled heat source that rapidly increases the temperature of the transparent workpiece 90 at or near the score line 92. This rapid heating can establish compressive stresses on the score line 92 or in the transparent workpiece 90 of the adjacent score line 92. Since the surface area of the heated glass is relatively small compared to the overall surface area of the transparent workpiece 90, the heated area cools relatively quickly. The resulting temperature gradient induces tensile stress in the transparent workpiece 90 sufficient to propagate the crack along the score line 92 and through the thickness 91 of the transparent workpiece 90, resulting in complete separation of the transparent workpiece 90 along the score line 92. Without being bound by theory, it is believed that the tensile stress can be generated by glass expansion (i.e., varying density) in the portion of the workpiece having a localized high temperature. Alternatively, the transparent workpiece 90 can be immersed in a heating bath to heat the transparent workpiece 90.

Referring now to Figures 5 through 7, once separated, each separate transparent workpiece 190 includes a split edge 160 having an edge surface 162. FIG. 5 depicts a partial front view of the separation edge 160. Figure 6 depicts a partial side view of the separation edge 160. Figure 7 depicts a partial perspective view of the separation edge 160. The separation edge 160 extends between the first surface 196 and the second surface 198 of the separate transparent workpiece 190. Prior to separating the transparent workpiece 90 (Figs. 1 through 4), the first surface 196 of the transparent workpiece 190 forms a portion of the first surface 96 of the transparent workpiece 90 and the second surface 198 of the transparent workpiece 190 forms the second surface of the transparent workpiece 90. Part of 98.

As depicted in FIGS. 5-7, the edge surface 162 of the separation edge 160 includes a scored surface area 164 and a fracture surface area 163. The scratched surface area 164 is formed by laser ablation and corresponds to the scribe line 92 of the aforementioned transparent workpiece 90. The scratched surface region 164 extends from the first surface 196 of the separate transparent workpiece 190 to a scratch depth line 166 that corresponds to the scribe line bottom surface 94 of the aforementioned transparent workpiece 90. Specifically, prior to separating the transparent workpiece 90, the scratch surface area 164 is the wall surface of the score line 92 and the scratch depth line 166 is a portion of the score line bottom surface 94 of the score line 92. Further, the rupture surface region 163 is formed by propagating the crack along the scribe line 92 through the transparent workpiece 90 to separate the transparent workpiece 90. The fracture surface region 163 of the separation edge 160 extends from the scratch depth line 166 to the second surface 198 of the separate transparent workpiece 190. In particular, the rupture surface region 163 corresponds to a portion of the transparent workpiece 90 that is separated along the scribe line 92 by applying stress to the scribe line 92 as described above.

Referring now to Figures 5 and 7, the separation edge 160 can include a needle row region 170 that includes one or more needle row features 172 along the separation depth line 166 along the separation edge 160 toward the separate transparent workpiece 190. The second surface 198 extends. "Needle row feature" as used herein refers to a feature that separates the non-coplanar portions 165 of the edge surface 162 of the separation edge 160 (eg, a line that is continuous in the direction of the fracture location on the surface of the fracture). For example, the non-coplanar portion 165 can be an irregularly oriented portion of the edge surface 162, while the needle row feature 172 connects the irregularly oriented portions. Although not intended to be limited by theory, the needle row feature is caused by local deviations in the direction of the front end of the crack, such as the velocity of the crack front end, the stress field that drives the crack (eg, local variations in the stress field), and material non-uniformity. The result of sex. Typically, the needle row feature includes a component line that runs parallel to the local direction of crack propagation.

As a non-limiting example, one or more of the needle row features 172 can include a twisted needle row, a shear needle row, a hazy needle row, a stress intensity needle row, and the like. While not intending to be bound by theory, the twist pin row includes needle row features that separate the surface portions of the crack, each of which has a side turn or twist in the primary tension axis that is rotated by the original crack plane. For example, when twisting is induced during crack propagation along the scribe line 92 of the transparent workpiece 90, a twist pin row can be formed. The non-coplanar portions 165 of the torsion pin separation edge surface 162, each of which can be formed by rotation in a side or twist in the main tension axis (eg, along the axis of the score line 92). For example, side turns or twists in the primary tension axis can be created by variable stress conditions present in the transparent workpiece 90.

Each needle row feature 172 extends from the scratch depth line 166 toward the second surface 198 of the separate transparent workpiece 190 along the fracture surface region 163. Moreover, the individual needle row features 172 of the needle row region 170 that extend the furthest distance from the scratch depth line 166 toward the second surface 198 define the maximum needle row depth 174 of the needle row region 170. It is advantageous to minimize the maximum needle depth 174 of the separation edge 160. The larger needle row feature 172 will limit the strength of the separation edge 160 and may limit the ability to precisely set the separation edge 160 of the separate transparent workpiece 190. In some embodiments, separating the transparent workpiece 90 by laser ablation of the scratch line 92 having a scratch depth 95 of between about 10 [mu]m and about 60 [mu]m can minimize the maximum needle row depth 174, for example, such that the maximum needle depth is 174 is about 50 μm or less, 30 μm or less, 20 μm or less, 10 μm or less, and the like.

Referring now to Figures 6 and 7, in some embodiments, it is desirable to separate the fracture surface region 163 of the edge 160 (e.g., the portion of the separation edge 160 that extends between the scratch depth line 166 and the second surface 198) orthogonal to the separation. Both the first surface 196 and the second surface 198 of the transparent workpiece 190. For example, it is desirable that the rupture zone of the separation edge 160 be coplanar with the fracture propagation plane 195 (Figs. 1A, 6 and 7). The crack propagation plane 195 is a plane that is orthogonal to both the first surface 196 and the second surface 198 of the separate transparent workpiece 190. As shown in FIG. 1, the crack propagation plane 195 extends generally along the desired separation path 93 of the transparent workpiece 90 prior to separating the transparent workpiece 90 into separate transparent workpieces 190. Moreover, as shown in FIGS. 6 and 7, after separating the transparent workpiece 90 into separate transparent workpieces 190, the crack propagation plane 195 extends orthogonal to the first surface 196 and the second surface 198, passing through the scratch depth line 166. .

The orthogonality of the separation edge 160 relative to the first surface 196 can be confirmed by measuring the edge deviation distance 180 of the fracture surface area 163 of the separated transparent workpiece 190. The edge deviation distance 180 is the distance between the first boundary plane 186 of the fracture surface region 163 and the second boundary plane 188 of the fracture surface region 163. Both the first boundary plane 186 and the second boundary plane 188 are parallel to the crack propagation plane 195 and orthogonal to the first surface 196 and the second surface 198 of the separate transparent workpiece 190. Furthermore, the first boundary plane 186 extends through the first boundary point 182 of the rupture surface region 163 and the second boundary plane extends through the second boundary point 184 of the rupture surface region 163. The first boundary point 182 is the innermost position along the fracture surface region 163 of the separation edge 160 (eg, toward the entirety of the separated transparent workpiece 190), and the second boundary point 184 is a fracture along the separation edge 160. The outermost position of the surface region 163 (eg, outward away from the entirety of the separate transparent workpiece 190). In the example illustrated in FIGS. 6 and 7, the first boundary point 182 is located at the second surface 198 of the separate transparent workpiece 190 and the second boundary point 184 is located between the scratch depth line 166 and the second surface 198. . However, it should be understood that the first boundary point 182 and the second boundary point 184 can be located anywhere along the fracture surface area 163 from the scratch depth line 166 to the second surface 198. Moreover, in embodiments where the edge deviation distance 180 is zero, the first boundary plane 186 and the second boundary plane 188 are coplanar with the crack propagation plane 195.

In some embodiments, the edge deviation distance 180 can be about 100 μm or less, 75 μm or less, 50 μm or less, 40 μm or less, 30 μm or less, 20 μm or less, 10 μm or less, and the like. It is advantageous to minimize the edge deviation distance 180 of the separation edge 160. The larger edge deviation distance 180 will limit the strength of the separation edge 160 and may limit the ability to precisely set the separation edge 160 of the separated transparent workpiece 190. Separating the transparent workpiece 90 by laser ablation of the slash line 92 having a scratch depth 95 of from about 10 [mu]m to about 60 [mu]m may minimize the edge offset distance 180, for example, such that the edge deviation distance 180 is about 30 [mu]m or less, 20 μm or less, 10 μm or less, and the like. Moreover, the maximum stitch depth 174 is related to the edge offset distance 180 such that reducing the maximum stitch depth 174 can reduce the edge offset distance 180. For example, when the maximum needle row depth 174 is about 10 [mu]m or less, the edge deviation distance 180 can be about 20 [mu]m or less. Although not intended to be limited by theory, the needle row feature 172 may be formed by a moment that causes the crack to exit the crack propagation plane 195. Thus, the needle row feature 172 is a good indicator of a large edge deviation away from the crack propagation plane 195 (eg, a larger edge deviation distance 180).

In some embodiments, separating the transparent workpiece 90 by laser ablation of the scratch line 92 having a scratch depth 95 of from about 10 [mu]m to about 60 [mu]m may also minimize cracks that are formed orthogonal to the crack propagation plane. In the direction of 195, for example, a crack extending into the entirety of the separated transparent workpiece 190, and the number of crack initiation points formed when the transparent workpiece 90 is separated can be minimized. Again, the separation edge 160 described herein can be an unpolished separation edge. Thus, the maximum needle row depth 174 and edge deviation distance 180 described herein are properties of the separate edge 160 of the unpolished or untreated separation edge 160.

Referring now to Figure 8, a graph 200 depicts the scratch depth 95 of the score line 92 formed in the first surface 96 of the transparent workpiece 90 prior to separating the transparent workpiece 90 into separate transparent workpieces 190 (Figs. 3 and 4). The relationship between the maximum needle depth 174 of the separation edge 160 of the separate transparent workpiece 190 formed after the separation of the transparent workpiece 90. In particular, Figure 8 depicts this relationship of two transparent workpiece 90 samples (first transparent workpiece sample 202 and second transparent workpiece sample 204). As depicted in FIG. 8, the first transparent workpiece sample 202 minimizes the maximum stitch depth 174 by forming the scratch line 92 from the laser to form the scratch depth 95 of about 10 [mu]m to about 60 [mu]m, while the second transparent workpiece sample 204 The maximum stitch depth 174 is minimized by the laser forming the score line 92 from a scratch depth 95 of from about 10 [mu]m to about 35 [mu]m. Although not intended to be limited by theory, when the scratch depth 95 is too narrow (eg, less than 10 μm), there may not be sufficient damage in the transparent workpiece 90 to sufficiently direct the crack to propagate along the score line 92 (eg, along Crack propagation plane 195). Moreover, when the scratch depth 95 is too deep (eg, greater than 60 μm for the first transparent workpiece sample 202 or greater than 35 μm for the second transparent workpiece sample 204), crack propagation may begin with more along the bottom surface 94 of the score line. In one position, resulting in a larger needle row feature 74. Again, it should be understood that a transparent workpiece 90 comprising other materials may have a different range of scratch depths 95.

In some embodiments, the first transparent workpiece sample 202 can comprise a glass substrate that is substantially free of alkali metal, for example, a total concentration of basic elements Li ₂ O, Na ₂ O, and K ₂ O is less than about 0.1 mole percent (mol) %). Further, the first transparent workpiece sample 202 may include, based on the oxide: 64.0 to 71.0 mol% of SiO ₂ , 9.0 to 12.0 mol% of Al ₂ O ₃ , 7.0 to 12.0 mol% of B ₂ O ₃ , 1.0 to 3.0 mol. % MgO, 6.0 to 11.5 mol% CaO, 0 to 2.3 mol% SrO (for example, 0 to 1.0 mol%), 0 to 2.3 mol% of BaO (for example, 0 to 0.1 mol% or 0 to 0.05 mol%) ), 0 to 0.05 mol% of As ₂ O ₃ (for example, 0 to 0.02 mol%), 0 to 0.05 mol% of Sb ₂ O ₃ (for example, 0 to 0.02 mol%), and 0.010 to 0.033 mol% of Fe ₂ O ₃ (for example, 0.012 to 0.024 mol%) and 0.017 to 0.112 mol% of SnO ₂ (for example, 0.021 to 0.107 mol%). In some embodiments, the first transparent workpiece sample 202 can comprise less than or equal to 0.002 mol% sulfur, less than or equal to 0.4 mol% halogen, such as chlorine, and can include Fe ²⁺ and Fe ³⁺ greater than or equal to 0.5. proportion. The first transparent workpiece sample 202 may also substantially exclude germanium, arsenic and antimony, Y ₂ O ₃ or La ₂ O ₃ . It should be understood that the above-specified range includes the endpoints of the range.

Further, the first transparent workpiece sample 202 may include a density less than or equal to 2.41 g/cm ³ , a strain point greater than or equal to 650 ° C, and a linear thermal expansion coefficient (CTE) in a temperature range of 0 to 300 ° C, the linear thermal expansion coefficient The following relationship is satisfied: 28 × 10 ⁻⁷ / ° C ≦ CTE ≦ 35 × 10 ⁻⁷ / ° C. Further, the first transparent workpiece sample 202 may satisfy one or more of the following relationships: Σ[RO]/[Al ₂ O ₃ ]≧1, Σ[RO]/[Al ₂ O ₃ ]≧1.03, Σ[RO ] / [Al ₂ O ₃ ] ≦ 1.25, and/or Σ [RO] / [Al ₂ O ₃ ] ≦ 1.12, wherein [Al ₂ O ₃ ] is mol% of Al ₂ O ₃ and Σ [RO] is The sum of the molar percentages of MgO, CaO, SrO and BaO. Further, the first transparent workpiece sample 202 can comprise an average gas medium level of less than 0.05 gaseous medium/cm ³ .

In some embodiments, the second transparent workpiece sample 204 can comprise a glass substrate that is substantially free of alkali metals, for example, a total concentration of the basic elements Li ₂ O, Na ₂ O, and K ₂ O is less than about 0.1 mol%. Further, the second transparent workpiece sample 204 may comprise, based on the oxide: 63 to 75 mol% of SiO ₂ (eg, 70.31 to 72.5 mol%, 64 to 71 mol%, 68.5 to 72 mol%, 63 to 71 mol%, 68 to 70.5 mol) %, 69 to 72.5 mol%, 68 to 72 mol%, 63 to 75 mol%, 63 to 71 mol%, etc.), 11 to 14.5 mol% of Al ₂ O ₃ (for example, 11 to 13.5 mol%, 11.5 to 13.5 mol%) , 11 to 14 mol%, 13 to 14 mol%, 13 to 14.5 mol%), 0 to 5 mol% of B ₂ O ₃ (for example, 1 to 5 mol%, 1 to 4.5 mol%, 2 to 4.5 mol%, 0 to 2.5) Mol%, 0 to 3 mol%, 0 to 2.8 mol%, 0 to 2 mol%, etc.), 0.9 to 9 mol% of MgO (1 to 6 mol%, 3 to 5 mol%, 3.5 to 5 mol%), 4 to 11 mol% Ca (for example, 4 to 6.5 mol%, 4 to 8 mol%, 5 to 6.5 mol%, 5.25 to 6.5 mol%, 5.25 to 11 mol%, etc.), 0 to 6.5 mol% of SrO (for example, 0 to 4.5 mol%) , 0 to 2 mol%, 3 to 5 mol%, etc.) and 0 to 9 mol% of BaO (0 to 4.5 mol%, 1 to 9 mol%, 2.5 to 4.5 mol%, 1.5 to 5 mol%, etc.). Further, the second transparent workpiece sample 204 may also contain 0 to 0.1 mol% of Li ₂ O, Na ₂ O, K ₂ O, or a combination of the foregoing. Further, the transparent workpiece may contain 0 to 0.05 mol% of Sb ₂ O ₃ , 0 to 0.005 mol% of As ₂ O ₃ and 0 to 0.005 mol% of Sb ₂ O ₃ . It should be understood that the above-specified range includes the endpoints of the range.

In some embodiments, the second transparent workpiece sample 204 can satisfy the following relationship: 1.05 ≦ ([MgO] + [CaO] + [SrO] + [BaO]) / [Al ₂ O ₃ ] ≦ 1.4, where 0.2 ≦ [ MgO]/([MgO]+[CaO]+[SrO]+[BaO])≦0.35, where 0.65≦([CaO]+[SrO]+[BaO])/[Al ₂ O ₃ ]≦0.95, and Wherein [Al ₂ O ₃ ], [MgO], [CaO], [SrO], [BaO] represents the molar percentage of the individual oxide components. In some embodiments, the second transparent workpiece sample 204 can satisfy one or more of the following relationships: ([MgO]+[CaO]+[SrO]+[BaO])/[Al ₂ O ₃ ]≦1.6 and 1≦([MgO]+[CaO]+[SrO]+[BaO])/[Al ₂ O ₃ ]≦1.6, where [Al ₂ O ₃ ], [MgO], [CaO], [SrO], [ BaO] represents the percentage of moles of individual oxide components. The second transparent workpiece sample 204 may also comprise one or more chemical fining agents at a total concentration of from about 0 to 0.5 mol%, for example, Fe ₂ O ₃ , CeO ₂ , MnO ₂ , SnO ₂ , As ₂ O ₃ , Sb ₂ O ₃ , F, Cl and Br. Further, the second transparent workpiece sample 204 may comprise from about 0.005 to 0.2 mol% of CeO ₂ , any of Fe ₂ O ₃ and MnO ₂ or a combination of CeO ₂ , Fe ₂ O ₃ and MnO ₂ , via CeO _2. The visible light absorption of the final valence of Fe ₂ O ₃ and MnO ₂ in the second transparent workpiece sample 204 imparts color to the second transparent workpiece sample 204.

In some embodiments, the second transparent workpiece sample 204, for example, the second transparent workpiece sample 204, can have a high annealing point and a high Young's modulus, wherein the high annealing point and the high Young's modulus can limit or avoid the second transparency. Deformation of the workpiece sample 204 due to extrusion/contraction during heat treatment (eg, during TFT fabrication) after the second transparent workpiece sample 204 is fabricated. The annealing point can be higher than or equal to about 765 ° C, 775 ° C, 785 ° C, 795 ° C, 800 ° C, and the like. In some embodiments, the Young's modulus can be from about 81 GPa to 88 GPa, for example, from about 81 GPa to 85 GPa, from about 82 GPa to 84.5 GPa. Further, the Young's modulus may be about 81 GPa or higher, about 81.2 GPa or higher, about 81.5 GPa or higher, about 82 GPa or higher, and the like. In some embodiments, the second transparent workpiece sample 204 has a density of less than or equal to about 2.7 g/cm ³ , 2.65 g/cm ³ , 2.63 g/cm ³ , 2.62 g/cm ³ , 2.61 g/cm ³ , 2.57 g. /cm ³ , 2.55g/cm ³ and so on. In some embodiments, the density can range from about 2.57 g/cm ³ to about 2.626 g/cm ³ .

The second transparent workpiece sample 204 can also have a high etch rate, which is a measure of how quickly the material (eg, glass material) of the transparent workpiece 90 is removed from the transparent workpiece 90. The high etch rate allows economical thinning of the transparent workpiece 90, which is useful for embodiments that use the transparent workpiece 90 as a display glass. In addition, the etch rate of the transparent workpiece 90 can be quantified by an etch index that is a glass composition in a commercially relevant etch process (eg, but not limited to, 10 minutes in a 10% HF/5% HCl soak solution at 30 ° C). Estimated etch rate. The etch index can be mathematically defined as follows: Etch index = -54.6147 + (2.50004 [AlO ₃ ]) + (1.3134 [B ₂ O ₃ ]) + (1.84106 [MgO]) + (3.01223 [CaO]) + (3.7248 [SrO ]) + (4.13149 [BaO]), wherein the oxide is mol%. For example, in some embodiments, the etch index is greater than or equal to about 21. In various embodiments, the etch index is greater than or equal to about 21.5, 22, 22.5, 23, 23.5, 24, 24.5, 25, 25.5, 26, 26.5, 27, 27.5, 28, 28.5, 29, 29.5, 30, 30.5 or 31.

Based on the foregoing description, it should be understood that a separate transparent workpiece having discrete edges can be formed by laser ablating a transparent workpiece to form a score line extending into the surface of the transparent workpiece and applying stress to the score line to expose the transparent workpiece Separated into two or more separate transparent workpieces each having a separate edge. In addition, the laser ablation scribe line to a scratch depth of from about 10 [mu]m to about 60 [mu]m forms a separate transparent workpiece with the subsequent discrete transparent workpiece, each comprising a separate edge having a minimum stitch depth and a minimum edge offset distance. Minimizing the depth of the needle row and the edge deviation distance can help strengthen the separation edge and allow the separation edge to be well positioned in the final application of the separate transparent workpiece, for example, when using a separate transparent workpiece as a TFT or display glass for an electronic device.

Ranges may be expressed herein as "about" a particular value, and/or to "about" another particular value. When such a range is indicated, another embodiment encompasses a particular value and/or to another particular value. Similarly, when values are approximated by the use of the antecedent "about", it is understood that the particular value forms another embodiment. It will be further understood that the endpoints of each range are meaningful to the other endpoint and are independent of the other endpoint.

The directional terms used herein, for example, up, down, right, left, front, back, top, bottom, are merely referenced to the drawings and are not meant to be absolute directions.

Unless expressly stated otherwise, any method set forth herein is not intended to be construed as requiring the steps of the method to be performed in a particular order. Accordingly, the method request item does not actually describe the order followed by the method steps, or any device request item does not actually record the order or orientation of the individual components, or is not specifically stated in the scope of the patent application or the specification. When the steps are limited to a particular order, or a particular order or orientation of the device components is not described, the order or orientation is not intended to be inferred in any respect. This applies to any possible basis for ambiguous interpretation, including: logical questions about the scheduling of steps, operational procedures, component order or component orientation, apparent meaning derived from grammar organization or punctuation, and the number of embodiments described in the specification. With kind.

As used herein, the singular forms "a", "the" and "the" Thus, for example, reference to "a" or "an"

It should be noted that the term "substantial" may be used herein to mean the inherent degree of uncertainty attributed to any quantitative comparison, numerical, measurement or other characterization. This term is also used herein to mean a quantitative representation of the extent to which the reference value can be varied without causing a change in the basic function of the subject matter in question.

While the specific embodiments have been illustrated and described, it is understood that Furthermore, although various aspects of the claimed subject matter have been described herein, it is not necessary to combine such aspects. Therefore, it is intended that the scope of the appended claims should cover all such variations and modifications as fall within the scope of the claims.

80‧‧‧ Displacement platform

82‧‧‧First direction

84‧‧‧second direction

90‧‧‧Transparent workpiece

91‧‧‧ thickness

92‧‧‧Scratch line

93‧‧‧ Expected separation path

94‧‧‧Scratch line bottom

95‧‧‧Scratch depth

96‧‧‧ first surface

97‧‧‧ impact location

98‧‧‧ second surface

100‧‧‧Laser

101‧‧‧focus lens

102‧‧‧pulse laser beam

104‧‧‧Convergence area

160‧‧‧Separation edge

162‧‧‧Edge surface

163‧‧‧Fracture surface area

164‧‧‧Scratch surface area

165‧‧‧ non-coplanar parts

166‧‧‧Scratch depth line

170‧‧・Needle area

172‧‧‧ needle row features

174‧‧‧Maximum needle depth

180‧‧‧Maximum needle depth

182‧‧‧ first boundary point

184‧‧‧ second boundary point

186‧‧‧ first boundary plane

188‧‧‧second boundary plane

190‧‧‧Separated transparent workpiece

195‧‧‧ crack propagation plane

196‧‧‧ first surface

198‧‧‧ second surface

200‧‧‧ chart

202‧‧‧First transparent workpiece sample

204‧‧‧Second transparent workpiece sample

D‧‧‧Unfocused part diameter

BW‧‧‧ beam waist width

W‧‧‧Scratch line width

C‧‧‧ Center

D‧‧‧beam waist width

The embodiments illustrated in the drawings are illustrative and exemplary in nature and are not intended to limit the scope of the invention. Embodiments of the following illustrative embodiments may be understood when referring to the following figures, wherein like structures are indicated by like reference numerals, and wherein:

FIG. 1A schematically depicts a perspective view of a laser and a transparent workpiece in accordance with one or more embodiments shown and described herein.

FIG. 1B schematically depicts a laser beam in accordance with one or more embodiments shown and described herein.

Figure 2 is a top plan view of the laser and transparent workpiece of Figure 1A, schematically depicted in accordance with one or more embodiments shown and described herein.

Figure 3 is a cross-sectional view along line A-A of Figure 2, schematically depicted in accordance with one or more embodiments shown and described herein.

Figure 4 is a cross-sectional view along line B-B of Figure 2, schematically depicted in accordance with one or more embodiments shown and described herein.

Figure 5 is a partial front elevational view of the edge surface of a separate edge of a transparent workpiece that is schematically depicted in accordance with one or more embodiments described herein.

Figure 6 is a partial side elevational view of the edge surface of the separated edge of the separate transparent workpiece of Figure 5, schematically depicted in accordance with one or more embodiments illustrated herein and illustrated.

Figure 7 is a partial perspective view of a separate transparent workpiece of Figures 5 and 6 in accordance with one or more embodiments shown and described herein.

Figure 8 is a schematic depiction of the scratch depth of the scratch line in the first transparent workpiece sample and the second transparent workpiece sample and in the first separation according to one or more embodiments shown and described herein. The relationship between the maximum needle depth of the separated edge of the separated transparent workpiece formed after the transparent workpiece sample and the second transparent workpiece sample.

Domestic deposit information (please note according to the order of the depository, date, number)

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Claims (20)

A method of laser processing a transparent workpiece, the method comprising: directing a pulsed laser beam into the transparent workpiece at an impact location on a first surface of the transparent workpiece to ablate the pulsed laser beam a portion of the material of the transparent workpiece at the impact location, wherein the pulsed laser beam has a pulse energy of between about 5 μJ and about 50 μJ; and the first surface of the transparent workpiece moves the pulsed Ray along a desired separation path The beam of light, thus ablating additional material of the transparent workpiece, forms a scribe line along the desired separation path, the scribe line comprising a scratch depth of from about 10 [mu]m to about 60 [mu]m. The method of claim 1, further comprising: applying a stress to the scribe line of the transparent workpiece to separate at least one separate transparent workpiece from the transparent workpiece along the scribe line, wherein the at least one separate transparent workpiece Contains a separate edge. The method of claim 2, wherein the separation edge of the at least one separate transparent workpiece extends between a first surface and a second surface of the at least one separate transparent workpiece, and the separation edge further comprises: a scratched surface region extending from the first surface of the at least one separate transparent workpiece to a scratch depth line; a rupture surface region extending from the scratch depth line to the at least one separate transparent workpiece Two surfaces; one or more needle row features extending along the fracture surface area from the scratch depth line toward the second surface, wherein the one or more needle row features have a maximum needle depth of 10 μm or less And an edge deviation distance of 30 μm or less, wherein the edge deviation distance is a distance between a first interface plane of the fracture surface area and a second interface plane of the fracture surface area. The method of claim 2, wherein the stress applied to the scribe line of the transparent workpiece comprises: mechanical stress, thermal stress, or a combination of mechanical stress and thermal stress. The method of claim 1, wherein the transparent workpiece comprises a glass substrate substantially free of an alkali metal and comprising, based on the oxide: 64.0 to 71.0 mol% of SiO ₂ and 9.0 to 12.0 mol% of Al ₂ O ₃ , 7.0 to 12.0 mol% of B ₂ O ₃ , 1.0 to 3.0 mol% of MgO, 6.0 to 11.5 mol% of CaO, 0 to 2.3 mol% of SrO, and 0 to 2.3 mol% of BaO. The method of claim 5, wherein the glass substrate of the transparent workpiece further comprises, based on the oxide: 0 to 0.05 mol% of As ₂ O ₃ , 0 to 0.05 mol% of Sb ₂ O ₃ , 0.010 to 0.033 mol % Fe ₂ O ₃ and 0.017 to 0.112 mol% of SnO ₂ . The method of claim 5, wherein the glass substrate of the transparent workpiece comprises, based on an oxide: 1 ≦Σ [RO] / [Al ₂ O ₃ ] ≦ 1.25, wherein [Al ₂ O ₃ ] is Al ₂ O The mol% of ₃ , and Σ[RO] is the sum of the molar percentages of MgO, CaO, SrO and BaO. The method of claim 1, wherein the transparent workpiece comprises a glass substrate substantially free of alkali metal and comprising, based on the oxide: 63.0 to 71.0 mol% of SiO ₂ , and 13.0 to 14.0 mol% of Al ₂ O ₃ , 0 to 3.0 mol% of B ₂ O ₃ , 0.9 to 9.0 mol% of MgO, 5.25 to 11.0 mol% of CaO, 0 to 6.0 mol% of SrO, and 1 to 9.0 mol% of BaO. The method of claim 8, wherein the glass substrate of the transparent workpiece comprises, based on an oxide: Σ[RO]/[Al ₂ O ₃ ]≦1.6, wherein [Al ₂ O ₃ ] is Al ₂ O ₃ Mol%, and Σ[RO] is the sum of the molar percentages of MgO, CaO, SrO and BaO. The method of claim 8, wherein the glass substrate of the transparent workpiece comprises an etch index greater than or equal to 21, an annealing point greater than or equal to 765 ° C, and a Young's modulus from 81 GPa to 88 GPa. The method of claim 8, wherein the scratch line has a depth of the scratch of from about 10 μm to about 35 μm. The method of claim 1, wherein the pulsed laser beam has a wavelength of from about 200 nm to about 600 nm and a pulse duration of from 1 picosecond to about 100 picoseconds. A separate transparent workpiece comprising: a first surface opposite a second surface; and a separation edge extending between the first surface and the second surface, wherein the separation edge comprises: a scratched surface region Extending from the first surface to a scratch depth line; a fracture surface region extending from the scratch depth line to the second surface; one or more needle row features along which the scratch is caused by the scratch a depth line extending toward the second surface, wherein a maximum needle row depth of the one or more needle row features is 10 μm or less; and an edge deviation distance of 30 μm or less, wherein the edge deviation distance is the fracture surface a distance between a first interface plane of the region and a second interface plane of the rupture surface region. The separate transparent workpiece of claim 13 further comprising a thickness extending between the first surface and the second surface, wherein the thickness is from about 300 μm to about 700 μm. The separate transparent workpiece of claim 13, wherein the scratch depth line is a distance of from about 10 [mu]m to about 60 [mu]m from the first surface. The separate transparent workpiece of claim 13 further comprising a glass substrate substantially free of alkali metal and comprising, based on the oxide: 64.0 to 71.0 mol% of SiO ₂ and 9.0 to 12.0 mol% of Al ₂ O ₃ , 7.0 to 12.0 mol% of B ₂ O ₃ , 1.0 to 3.0 mol% of MgO, 6.0 to 11.5 mol% of CaO, 0 to 2.3 mol% of SrO, and 0 to 2.3 mol% of BaO. The separate transparent workpiece of claim 13, further comprising a glass substrate substantially free of alkali metal and comprising, based on the oxide: 63.0 to 71.0 mol% of SiO ₂ , and 13.0 to 14.0 mol% of Al ₂ O ₃ , 0 to 3.0 mol% of B ₂ O ₃ , 0.9 to 9.0 mol% of MgO, 5.25 to 11.0 mol% of CaO, 0 to 6.0 mol% of SrO, and 1 to 9.0 mol% of BaO. A method of laser processing a transparent workpiece, the method comprising: directing a pulsed laser beam into the transparent workpiece at an impact location on a first surface of the transparent workpiece to ablate the pulsed laser beam a portion of the material of the transparent workpiece at the impact location, wherein the pulsed laser beam comprises a pulse energy of between about 5 [mu]J and about 50 [mu]J; the first surface relative to the transparent workpiece moves the pulsed laser along a desired separation path a beam of light, thereby ablating additional material of the transparent workpiece to form a scribe line along the desired separation path; and applying a stress to the scribe line of the transparent workpiece to be separated from the transparent workpiece along the scribe line at least a separate transparent workpiece, wherein the at least one separate transparent workpiece comprises an unpolished separation edge extending between a first surface and a second surface of the at least one separate transparent workpiece, and further The method includes: a scratched surface region extending from the first surface of the at least one separate transparent workpiece to a scratch depth a rupture surface region extending from the scratch depth line to the second surface of the at least one separate transparent workpiece; one or more needle row features along which the slash depth line faces a second surface extension, wherein a maximum needle row depth of the one or more needle row features is 10 μm or less; and an edge deviation distance of 30 μm or less, wherein the edge deviation distance is a portion of the fracture surface area a distance between an interface plane and a second interface plane of the rupture surface region. The method of claim 18, wherein the score line has a scratch depth of from about 10 [mu]m to about 60 [mu]m. The method of claim 18, wherein: the transparent workpiece comprises a glass substrate substantially free of alkali metal and comprising, based on the oxide: 63.0 to 71.0 mol% of SiO ₂ , and 13.0 to 14.0 mol% of Al ₂ O ₃ , 0 to 3.0 mol% of B ₂ O ₃ , 0.9 to 9.0 mol% of MgO, 5.25 to 11.0 mol% of CaO, 0 to 6.0 mol% of SrO, and 1 to 9.0 mol% of BaO; The trace has a scratch depth of from about 10 [mu]m to about 35 [mu]m.