TW201831055A - ICP etching machine and its insulation window thin film heater device and temperature control method capable of facilitating disassembly and assembly of the thin film heater, simplifying maintenance process of the thin film heater and the insulation window, saving manpower and time cost - Google Patents

Abstract

The present invention discloses an insulation window thin film heater device. The device includes an electrical insulation board disposed at a top portion of an insulation window; an adhesive layer disposed on the electrical insulation board; and a thin film heater disposed on the adhesive layer. The thin film heater is fixed to the electrical insulation board by the adhesive layer to form a heating module. The heating module is fixed to the top portion of the insulation window by the electrical insulation board. The thin film heater of the present invention is fixed on the electrical insulation board by the adhesive layer to be formed as a whole, and is fixedly connected to the insulation window through the electrical insulation board, thereby facilitating disassembly and assembly of the thin film heater, simplifying maintenance process of the thin film heater and the insulation window, saving manpower and time cost.

Description

ICP etching machine, insulating window film heater device and temperature control method thereof

The invention relates to a heating technology in semiconductor preparation, and particularly relates to an ICP etching machine, an insulating window film heater device and a temperature control method thereof.

As shown in FIG. 1, the upper structure of an ICP etching machine generally includes a reaction chamber 170 and a chamber lid provided on the top of the reaction chamber 170. 160, an insulation window 150 provided on the top 160 of the reaction chamber, a kapton heater 140 provided on the top surface of the insulation window 150, and an RF coil kit (RF coil kit) provided above the film heater 140 ) 130, a housing structure 120 provided on the top of the reaction chamber 170, and a plurality of cooling fans 110 provided on the top of the housing structure 120, wherein the reaction chamber top cover 160, an insulated window 150, a thin film heater 140, and an RF coil 130 is set in the cover structure 120. Wherein, the thin film heater 140 is directly adhered to the insulating window 150 to become a whole.

As shown in FIG. 2, it is a thin film heater device. The thin film heater 140 is disposed on the insulating window 150. An adhesive layer 141 is provided between the thin film heater 140 and the insulating window 150. The thin film heater 140 is adhered to the adhesive layer. One side of 141 and the other side of the adhesive layer 141 are stuck on the insulating window 150, so that the thin film heater 140 is directly integrated with the insulating window 150.

In the conventional technology, the thin film heater 140 is directly adhered to the insulating window 150, and the insulating window 150 as a good thermal conductor will quickly transfer the heat generated by the plasma inside the reaction chamber to the upper cooling fan 110. The wind is taken away, and under a certain temperature control, the thin film heater 140 is required to provide higher power to make up for the plasma heat loss to achieve a certain temperature control. At the same time, the thin film heater 140 is directly placed on the insulation window 150, which also makes the temperature uniformity of the insulation window 150 directly affected by the film heater 140, which is not adjustable or controllable. The thinner the insulation window 150, the more the temperature uniformity is affected by the film. The greater the influence of the heater 140.

The machine performs an etching process for a long time, and a process by-product generated by the etching process is deposited on the surface of the insulating window 150. Therefore, the insulating window 150 needs to be cleaned regularly. Since the thin film heater 140 is an electrical component during cleaning, additional The protection cannot be submerged, which causes an additional burden on the cleaning work of the insulated window 150, and in addition, there is a risk that the film heater 140 will fail due to the cleaning.

Another potential problem of directly attaching the thin film heater 140 to the insulated window 150 is that the thin film heater 140 as an electrical component has a certain service life, but the insulated window 150 is generally not damaged, so in the thin film heater When the 140 is damaged, it is necessary to remove the insulating window 150 together with the thin film heater 140, and then remove the thin film heater 140. The manufacturing process is very troublesome. The process may cause the expensive insulating window 150 to be damaged and fail. Time-consuming and labor-intensive engineering causes unnecessary labor and time cost waste.

In addition, the thin film heater 140 uses high power. When heating up, the resistance of the heating element of the thin film heater 140 is large, and a lot of heat is generated at the heating element in an instant. The generated heat can burn out the heating element and cause the thin film heater 140 to fail.

The invention provides an ICP etching machine, an insulating window film heater device and a temperature control method thereof, which have good heat conduction characteristics, and the film heater is easy to disassemble and assemble.

In order to achieve the above object, an insulated window film heater device is characterized in that the device includes: an electrically insulating plate provided on the top of the insulated window, an adhesive layer provided on the electrically insulating plate, and a thin film heater provided on the adhesive layer ;

The film heater is fixed with an electrically insulating plate by an adhesive layer to form a heating module, and the heating module is fixed at the top of an insulating window by an electrically insulating plate.

The thickness of the electrical insulation plate is in the range of 1 to 50 mm.

The insulated window film heater device further includes a mechanical clamping device to fix the heating module to the insulated window.

The above-mentioned electrical insulation plate also includes an electrode connected to a high-voltage DC power source, so that the heating module is electrostatically adsorbed on the insulation window.

A thermal pad is also provided between the electrically insulating plate and the insulating window, and the thermal conductivity of the thermal pad is lower than that of the insulating window and the electrically insulating plate.

The thermal pad is made of silicone and / or ceramic.

The insulated window thin film heater device further includes a temperature control module electrically connected to the thin film heater, and the temperature control module controls the output power to the thin film heater according to the temperature information of the insulated window.

A temperature control method of the above-mentioned insulated window film heater device, which is characterized in that the temperature control method includes:

The temperature control module receives the temperature information of the insulation window, and controls the output power of the film heater according to the temperature information of the insulation window;

When the temperature of the insulation window decreases, the output power of the film heater is increased;

When the temperature of the insulation window rises, the output power of the thin film heater is reduced.

An ICP etching machine is characterized in that the machine includes:

Reaction chamber for plasma processing;

A reaction chamber cover, which is arranged on the top of the reaction chamber;

The outer cover structure is arranged above the top of the reaction chamber, and an accommodation space is formed between the reaction chamber top cover and the outer cover structure;

A cooling fan, which is arranged on the top of the cover structure;

An insulated window, which is arranged on the top cover of the reaction chamber;

The RF coil is disposed in an accommodation space formed by the top cover of the reaction chamber and the outer cover structure;

The above-mentioned machine also includes the above-mentioned insulated window film heater device. The window film heater device is disposed on the insulated window and is located in an accommodation space formed by the reaction chamber top cover and the outer cover structure.

The ICP etching machine of the present invention, its insulating window thin film heater device, temperature control method, and heating device of conventional technology have the advantages that the thin film heater of the present invention is fixed on an electrically insulating plate by an adhesive layer to form a whole. The fixed connection of the electrical insulation plate and the insulation window facilitates the disassembly and assembly of the film heater, simplifies the maintenance process of the film heater and the insulation window, and saves labor and time costs;

The invention is provided with an electric insulation plate. The electric insulation plate with good thermal conductivity can play a role in adjusting the temperature uniformity of the insulation window. Its lateral heat transfer effect can eliminate or reduce local cold spots or hot spots generated by the thin film heater. Changing the thickness of the electrical insulation plate can significantly improve the thermal uniformity of the insulation window;

The present invention provides an electrical insulation plate and a thermally conductive gasket between the thin film heater and the insulation window, which increases the heat conduction path, which is equivalent to making a thermal insulation layer above the insulation window to limit the heat loss of the plasma, thereby limiting Under temperature control, the thin film heater only needs to provide less power to compensate for the change in the temperature of the insulation window caused by the heat loss of the plasma, so as to control the constant temperature of the insulation window, thereby achieving a constant etching temperature in the reaction chamber, reducing the The requirement of the maximum output power of the thin film heater, which is very helpful to extend the service life of the thin film heater;

The invention is provided with a thermally conductive gasket, which is equivalent to adding a thermal insulation layer between the insulating window and the electrically insulating plate, which enlarges the lateral heat transfer effect of the electrically insulating plate and further improves the thermal uniformity of the insulating window.

The specific embodiments of the present invention are further described below with reference to the drawings.

As shown in FIG. 3, it is a schematic structural diagram of Embodiment 1 of an insulated window film heater device. The insulated window film heater device includes: an electrically insulating plate 330 provided on the top of the insulated window 340, and an electrically insulating plate 330. And a thin film heater 310 disposed on the adhesive layer 320.

The two sides of the adhesive layer 320 are respectively adhered to the thin film heater 310 and the electrically insulating plate 330, so that the thin film heater 310 is fixed by the adhesive layer 320 and the electrically insulating plate 330 to form a heating module, and the heating module is fixed by the electrically insulating plate 330 On top of insulated window 340.

The electrical insulation plate 330 is fixed on the insulation window 340 by mechanical clamping or electrostatic attraction. Specifically, the insulated window film heater device further includes a mechanical clamping device to fix the heating module to the insulated window. Alternatively, the electrical insulation plate includes an electrode, which is connected to a high-voltage DC power source, so that the heating module is electrostatically adsorbed on the insulation window 340. In the present invention, the electrical insulation plate 330 is fixedly connected to the insulation window 340, which facilitates the disassembly and assembly of the thin film heater 310, thereby facilitating the maintenance process of the thin film heater 310 and the insulation window 340, saving labor and time costs.

The area of the electrically insulating plate 330 is larger than that of the thin film heater 310 and the adhesive layer 320. Preferably, the electrically insulating plate 330 completely covers the top surface of the insulating window 340.

The thickness of the electrically insulating plate 330 is adjustable. The electrical insulation plate 330 with good thermal conductivity can play a role in adjusting the temperature uniformity of the insulation window 340. Its lateral heat transfer effect can eliminate or reduce local cold spots or hot spots generated by the thin film heater 310, and further by changing the electrical insulation plate 330 The thickness can significantly improve the thermal uniformity of the insulating window 340. Here, the larger the thickness of the electrically insulating plate 330 and the higher the thermal conductivity of the electrically insulating plate 330, the better the thermal uniformity of the insulating window 340 can be. The thickness of the electrically insulating plate 330 can be adjusted from 1 to 50 mm.

As shown in FIG. 4, it is a schematic structural diagram of a second embodiment of an insulated window film heater device. The insulated window film heater device includes an electrically insulating plate 430 provided on the top of the insulated window 440 and an electrically insulating plate 430. And a thin film heater 410 disposed on the adhesive layer 420.

The two sides of the adhesive layer 420 are respectively adhered to the thin film heater 410 and the electrically insulating plate 430, so that the thin film heater 410 is fixed by the adhesive layer 420 and the electrically insulating plate 430 to form a heating module, and the heating module is fixed by the electrically insulating plate 430 On top of insulated window 440.

The electrical insulation plate 430 is fixed on the insulation window 440 by means of mechanical clamping or electrostatic attraction. Specifically, the insulated window film heater device further includes a mechanical clamping device to fix the heating module to the insulated window. Alternatively, the electrical insulation plate 430 includes an electrode, which is connected to a high-voltage DC power source, so that the heating module is electrostatically adsorbed on the insulation window 440. In the present invention, the electrical insulation plate 430 is fixedly connected to the insulation window 440, which facilitates the disassembly and assembly of the thin film heater 410, thereby facilitating the maintenance process of the thin film heater 410 and the insulation window 440, saving labor and time costs.

The area of the electrically insulating plate 430 is larger than that of the thin film heater 410 and the adhesive layer 420. Preferably, the electrically insulating plate 430 completely covers the top surface of the insulating window 440.

The thickness of the electrically insulating plate 430 is adjustable. By changing the thickness of the electrically insulating plate 330, the thermal uniformity of the insulating window 440 can be significantly improved. Here, the larger the thickness of the electrically insulating plate 330 and the higher the thermal conductivity of the electrically insulating plate 330, the better the thermal uniformity of the insulating window 340 can be. The thickness of the electrically insulating plate 330 can be adjusted from 1 to 50 mm.

In the second embodiment, a thermal pad 450 is further interposed between the electrically insulating plate 430 and the insulating window 440. The thermal conductive pad 450 is made of silicon rubber and / or ceramic, and specifically, is made of a ceramic material doped in silicon rubber.

The thermal conductivity of the thermally conductive pad 450 is lower than that of the insulating window 440 and the electrically insulating plate 430.

Here, a thermally conductive gasket 450 is provided, which is equivalent to adding a thermal insulation layer between the insulating window 440 and the electrically insulating plate 430, which enlarges the lateral heat transfer effect of the electrically insulating plate 430, and further improves the thermal uniformity of the insulating window 440.

The area of the thermal conductive pad 450 is larger than that of the thin film heater 410 and the adhesive layer 420. Preferably, the area of the thermal conductive pad 450 completely covers the top surface of the insulating window 440.

Optionally, the areas of the thermal conductive pad 450 and the electrically insulating plate 430 are equal to the area of the top surface of the insulating window 440.

The thin film heater 440 uses high power. When heating up, the resistance of the heating element of the thin film heater 440 is large, and a lot of heat is generated at the heating element in an instant. It is easy to burn the glue inside the thin film heater 440, even the instantaneous Heat can burn out the heating element and cause the thin film heater 440 to fail. In the second embodiment, an electrically insulating plate 430 and a thermally conductive gasket 450 are provided between the thin film heater 410 and the insulating window 440, which increases the heat conduction path, which is equivalent to forming a thermal insulation layer above the insulating window 440 to limit the plasma. Heat loss, so under a certain temperature control, the thin film heater 410 only needs to provide less power to compensate for the thermal damage of the plasma to achieve a certain temperature control, reducing the demand for the maximum output power of the thin film heater 410, which is beneficial to The life of the thin film heater 410 is extended.

The invention also discloses an ICP etching machine. The upper structure of the machine includes a reaction chamber for performing a plasma processing process, a reaction chamber top cover disposed on the top of the reaction chamber, a reaction chamber top cover and a reaction chamber. A cover structure above the top, a cooling fan provided on the top of the cover structure, an insulated window provided on the top cover of the reaction chamber, and an RF coil provided above the insulated window.

An accommodating space is formed between the reaction chamber top cover and the outer cover structure, and an insulating window and an RF coil are disposed in the accommodating space.

The difference from the conventional technology is that the ICP etching machine also includes the insulated window film heater device disclosed in the first or second embodiment. The insulated window film heater device is disposed on the insulated window and is located on the top of the reaction chamber. The accommodating space formed by the cover and the cover structure.

The ICP etching machine also includes a temperature control module that is electrically connected to the film heater. Due to the loss of plasma heat in the reaction chamber, the temperature of the insulating window will change. The temperature change of the insulating window will cause the temperature of the etching environment in the reaction chamber to change. Temperature control to keep the insulation window temperature constant.

Further, the present invention also discloses a method for controlling the temperature of the insulated window film heater device. The method includes:

The temperature control module receives the temperature information of the insulation window, and controls the output power of the thin film heater according to the temperature information of the insulation window. When the temperature of the insulation window decreases, the output power of the film heater is increased, and when the temperature of the insulation window increases, it decreases. Output power of film heater.

Although the content of the present invention has been described in detail through the above-mentioned preferred embodiments, it should be recognized that the above description should not be considered as limiting the present invention. Various modifications and alternatives to the present invention will be apparent to those skilled in the art after reading the foregoing. Therefore, the protection scope of the present invention should be defined by the scope of the attached patent application.

110‧‧‧cooling fan

120‧‧‧ Outer cover structure

130‧‧‧RF coil

140, 310, 410‧‧‧ film heater

141, 320, 420‧‧‧ Adhesive layer

150, 340, 440‧‧‧ insulated windows

160‧‧‧ reaction chamber top cover

170‧‧‧ reaction chamber

330, 430‧‧‧electric insulation board

450‧‧‧Conductive gasket

FIG. 1 is a schematic structural diagram of an upper structure of a conventional ICP etching machine.

FIG. 2 is a schematic structural diagram of a conventional insulating window film heater device.

FIG. 3 is a schematic structural diagram of a first embodiment of an insulated window film heater device according to the present invention.

FIG. 4 is a schematic structural diagram of a second embodiment of an insulated window film heater device according to the present invention.

Claims (9)

An insulating window film heater device includes: an electrically insulating plate provided on the top of an insulating window; an adhesive layer provided on the electrically insulating plate; and a thin film heater provided on an adhesive layer; wherein, The film heater is fixed to the electrical insulation plate by the adhesive layer to form a heating module, and the heating module is fixed to the top of the insulation window by the electrical insulation plate. The insulated window film heater device according to item 1 of the scope of patent application, wherein the thickness of the electrically insulating plate ranges from 1 to 50 mm. The insulated window film heater device according to item 1 or 2 of the patent application scope, wherein the film heater device with a thin insulating window further includes a mechanical clamping device to fix the heating module to the insulated window. The insulated window film heater device according to item 1 or 2 of the scope of patent application, wherein the electrically insulating plate further includes an electrode connected to a high-voltage DC power source, so that the heating module is electrostatically adsorbed to the insulated window. . The insulated window film heater device according to item 1 or 2 of the scope of patent application, wherein a thermal pad is further provided between the electrically insulating plate and the insulated window, and the thermal conductivity of the thermal pad is lower than that of the insulated window And the electrically insulating plate. The insulated window film heater device according to item 5 of the patent application scope, wherein the thermal conductive pad is made of silicon rubber and / or ceramic. The insulated window thin film heater device according to item 1 of the patent application scope, wherein the thin film heater device of the insulated window further comprises a temperature control module electrically connected to the thin film heater, and the temperature control module is based on the The temperature information of the insulated window controls the output power of the film heater. A temperature control method using an insulated window film heater device described in item 7 of the scope of patent application, the temperature control method includes: receiving, by the temperature control module, a temperature information of the insulated window, and according to the temperature of the insulated window The information controls the output power of the thin film heater; wherein, when the temperature of the insulating window decreases, the output power of the thin film heater is increased; when the temperature of the insulating window increases, the output power of the thin film heater is reduced. An ICP etching machine includes: a reaction chamber for performing a plasma processing process; a reaction chamber top cover disposed on the top of the reaction chamber; an outer cover structure disposed above the top of the reaction chamber; the reaction An accommodating space is formed between the chamber top cover and the outer cover structure; a cooling fan is provided on the top of the outer cover structure; an insulated window is provided on the reaction chamber top cover; and an RF coil is provided on In the accommodation space formed by the reaction chamber top cover and the outer cover structure; the machine further includes the insulated window film heater device according to any one of claims 1 to 7 in the scope of patent application, which heats the insulated window film The device is disposed on the insulating window and is located in the accommodating space formed by the reaction chamber top cover and the outer cover structure.