TW201827630A - Sputtering targets used in DC sputtering and perpendicular magnetic recording media having coating film using same comprising a formula (1) of Mg1-xAxO1-yDy - Google Patents

Abstract

Disclosed is a sputtering target, used in DC sputtering, comprising a formula (1) of Mg1-xAxO1-yDy, wherein A is a metallic element selected from the group consisting of Ti, Al, Ta, V, Sc, Y and a combination thereof; D is N or a combination of N and a nonmetallic element selected from the group consisting of C, B and a combination thereof; 0.3 ≤ x < 0.8 and 0.1 ≤ y ≤ 0.51; the formula (1) is a rock salt structure in which A replaces a portion of lattice site of Mg and D replaces a portion of lattice site of O. Also disclosed is a perpendicular magnetic recording media having a coating film formed by DC sputtering the sputtering target, and the coating has a texture of (200).

Description

Sputtering target for DC sputtering and perpendicular magnetic recording medium having the same

The present invention relates to a sputtering target, and more particularly to a sputtering target for DC sputtering and a perpendicular magnetic recording (PMR) medium having a coating thereof.

In recent decades, the speed of information update has been so rapid that the demand for PMR media has increased. The technology to increase the storage density of PMR media is a topic of constant concern for the relevant technical personnel in this technical field. Among the existing magnetic materials, iron-platinum (hereinafter referred to as FePt) alloy having a face-centered tetragonal phase (FCT phase) has a high degree of magnetocrystalline anisotropy. The FePt alloy using this FCT phase as the magnetic recording layer of the PMR medium can improve the thermal stability of the PMR medium.

However, the FePt alloy is transformed from a face-centered cubic (FCC) structure to a disordered phase (L1 ₁ phase) into an ordered phase (L1 ₀ phase, ie, the aforementioned The ordering temperature of the FCT phase is generally up to 500 ̊C, and the FePt alloy in the L1 ₀ phase needs to have a texture with a (001) crystal plane to simultaneously exhibit vertical (out-of- Plane) The coercive field (Hc) is high and the in-plane coercive field is low in nature for use in perpendicular recording techniques. Therefore, the FePt alloy is transformed into the L1 ₀ phase at a lower ordering temperature to be integrated into the ICs process and the FePt alloy in the L1 ₀ phase has a (001) texture, which is widely accepted. Issues that the industry values. Regarding the improvement of the texture of the FePt alloy in the (001) orientation of the L1 ₀ phase, some scholars have reached the introduction of an intermediate layer under the FePt alloy.

BSD Ch. S. Varaprasad et al., J. Appl. Phys. 113 , 203907 (2013) discloses Electroically conductive (Mg _0.2 Ti _0.8 )O underlayer to grow FePt-based perpendicular recording media on glass substrates (hereinafter referred to as Case 1). The first case is to deposit an amorphous NiTa layer having a thickness of about 60 nm on a glass substrate by DC magnetron sputtering; and then 170 ̊C on the amorphous NiTa layer. Temperature depositing a buffer layer having a thickness of about 10 nm; then depositing a conductive MTO underlayer having a thickness of about 10 nm on the Cr buffer layer at room temperature; and finally, 600 on the conductive MTO underlayer. a temperature of ̊C deposits a FePt-C magnetic recording layer having a thickness of about 6 nm; wherein the conductive MTO underlayer is deposited by sputtering a Mg _0.2 Ti _0.8 O target, and the FePt-C magnetic recording layer is Co-sputtering a Fe target, a Pt target and a C target, and the C content in the FePt-C magnetic recording layer is determined by the plating rate of each target. Control so that the amount of C contained is between 0 and 40 vol.%.

The first case 1 mainly uses the conductive MTO underlayer to replace a MgO underlayer which also has a rock salt structure, the purpose of which is because of the lattice mismatch between the conductive MTO and the FePt alloy (lattice mismatch) Relatively less than the lattice mismatch between the MgO underlayer and the FePt alloy, which is beneficial to reduce the strain between the conductive MTO underlayer and the FePt alloy interface and reduce the strain energy between the interfaces, thereby enhancing the FePt alloy crystal The texture of the (001) crystal plane of the grain.

Although the first case 1 can improve the (001) texture of the FePt alloy grains through the conductive MTO underlayer. However, the film formation temperature of the FePt-C magnetic recording layer of the first case is as high as 600 ̊C, so that it is difficult to be integrated into the integrated circuit process.

According to the above description, the material of the sputtering target for DC sputtering is improved so that the magnetic recording layer has L1 ₀ corresponding (001) woven at a lower film forming temperature after being bonded to the PMR medium. The problem of solving the PMR integration into the integrated circuit process is a problem to be solved by the relevant technical personnel in this technical field.

Accordingly, it is an object of the present invention to provide a sputtering target for DC sputtering which solves the above problems.

Another object of the present invention is to provide a perpendicular magnetic recording medium having a plating film of the above-described sputtering target.

Accordingly, the sputtering target for direct current sputtering of the present invention contains the chemical formula (1), Mg _1-x A _x O _1-y D _y (hereinafter), which is described below. In the present invention, A is a metal element selected from the group consisting of Ti, Al, Ta, V, Sc, Y, and a combination of the foregoing metal elements; D is N, or N and one is selected from the following a combination of non-metallic elements of the group: C, B, and a combination of the foregoing non-metal elements; 0.3 ≤ x < 0.8, and 0.1 ≤ y ≤ 0.51; the chemical formula (1) is a rock salt structure, and A The rock salt structure is a partial lattice site that replaces Mg, and D is a partial lattice position in place of O in the rock salt structure.

In addition, the perpendicular magnetic recording medium having the coating of the sputtering target comprises a substrate, a seed layer formed on the substrate, a first intermediate layer formed on the seed layer, and a A magnetic recording layer formed over the first intermediate layer. In the present invention, the first intermediate layer is a plating film obtained by DC sputtering the sputtering target, and the first intermediate layer has a texture of (200).

The effect of the present invention is that the N in the sputter target allows the magnetic recording layer above it to have a (001) texture of L1 ₀ phase only under relatively low temperature film forming conditions, which is advantageous for integration into an integrated circuit process.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

An embodiment of the sputtering target for DC sputtering of the present invention comprises the chemical formula (1) described below.

Mg _1-x A _x O _1-y D _y ....................................... Formula (1).

In the present invention, A is a metal element selected from the group consisting of Ti, Al, Ta, V, Sc, Y, and a combination of the foregoing metal elements; D is N, or N and one is selected from the following a combination of non-metallic elements of the group: C, B, and a combination of the foregoing non-metal elements; 0.3 ≤ x < 0.8, and 0.1 ≤ y ≤ 0.51; the chemical formula (1) is a rock salt structure, and A The rock salt structure is a partial lattice position in which Mg is substituted, and D is a partial lattice position in place of O in the rock salt structure. In detail, the rock salt structure belongs to the FCC structure, and the lattice positions of Mg and O in the FCC structure are located at the gap positions of the octahedral site and the octahedron, respectively. In other words, A and D are the gap positions of the octahedral position and the partial octahedron respectively occupying part of the FCC structure.

It should be added here that the metal elements such as Ti, Al, Ta, V, Sc, Y mentioned above are used to make the sputtering target of this embodiment of the invention have electrical conductivity to meet the DC splash. The need for plating equipment. Therefore, preferably, 0.35 ≤ x < 0.8; more preferably, 0.45 ≤ x < 0.8; still more preferably, 0.5 ≤ x < 0.8. The purpose of the non-metallic elements mentioned above will be explained later.

In a specific example of the sputtering target, A is Ti, D is N, x = 0.5, and y = 0.1.

Referring to FIG. 1, a first embodiment of a perpendicular magnetic recording (PMR) medium having a coating of the above-described sputtering target comprises a substrate 2, a seed layer 3 formed on the substrate 2, and a formation. A first intermediate layer 4 on the seed layer 3, and a magnetic recording layer 5 formed on the first intermediate layer 4. In the first embodiment of the present invention, the first intermediate layer 4 is a plating film obtained by DC sputtering the sputtering target, and the first intermediate layer 4 has a texture of (200).

Preferably, the seed layer 3 is composed of a CrRu alloy having a (200) texture and having a thickness of between 10 nm and 100 nm. In the first embodiment of the invention, the Ru content in the CrRu alloy is less than 20 at%.

Preferably, the first intermediate layer 4 has a thickness of between 5 nm and 40 nm.

The material suitable for the magnetic recording layer 5 of the present invention is selected from the group consisting of FePt alloy, CoPt alloy, FePd alloy, or CoPd alloy. Preferably, the magnetic recording layer 5 has a thickness of between 4 nm and 20 nm. It should be noted here that the basic composition ratio of the ferromagnetic metal element (for example, Fe or Co) to the noble metal element (for example, Pt or Pd) in the magnetic recording layer 5 based on the L1 ₀ phase is generally Approaching 1 to 1. Therefore, in order for the magnetic recording layer 5 to exhibit an L1 ₀ phase, the ratio of the ferroelectric metal element to the precious metal element is between 45:55 and 55:45. In the first embodiment of the invention, the magnetic recording layer 5 is selected from the group consisting of FePt alloys.

Referring to FIG. 2, a second embodiment of a perpendicular magnetic recording medium having a coating of the above-described sputtering target is substantially the same as the first embodiment, and the difference lies in the PMR of the second embodiment. The media also includes a second intermediate layer 6. The second intermediate layer 6 is sandwiched between the first intermediate layer 4 and the magnetic recording layer 5, and is composed of a MoC having a (200) texture. In order to allow the C in the second intermediate layer 6 to segregate between the FePt alloy grains of the magnetic recording layer 5 during the deposition of the magnetic recording layer 5, to assist the FePt alloy grains to have an island-like crystal structure (island- Like structure) or columnar grain. Therefore, preferably, the second intermediate layer 6 has a thickness of between 0.5 nm and 40 nm.

It should be further noted herein that the present invention is used to sputter the N of the non-metallic elements mentioned in the chemical formula (1) of the target, and the purpose thereof is to cause the sputtering target of the embodiment of the present invention to pass through The DC-sputtered coating has a texture of (200) such that the FePt alloy of the magnetic recording layer 5 in the PMR medium of the embodiments has a (001) texture and enhances the perpendicular magnetic field of the magnetic recording layer 5. Perpendicular anisotropic. Therefore, when D in the chemical formula (1) of the sputtering target of the present invention is N, and when the N content is insufficient (that is, when y < 0.1) or too high (that is, when y > 0.51), The (200) texture of the coating obtained by the DC sputtering after the sputtering target is weakened, thereby affecting the texture of the FePt alloy (001).

In addition, the purpose of the non-metal element such as C and B mentioned in the chemical formula (1) of the sputtering target is that the coating film after the DC sputtering of the sputtering target is bonded to After the PMR medium of the embodiments is used as the first intermediate layer 4, the C or B in the first intermediate layer 4 can be segregated upward in the magnetic recording layer 5 during the deposition of the magnetic recording layer 5. FePt alloy grains between the grains to promote the island structure or columnar crystal structure of FePt alloy, and increase the separation of FePt alloy grains. When D in the chemical formula (1) of the sputtering target of the present invention is a combination of N and C, a combination of N and B, or a combination of N, C and B, then y is further defined as y ₁ + y ₂ , and y ₁ represents the atomic percentage of N, and y ₂ represents C, B, or the atomic percentage of the combination C and B.

It should be further added here that when the N content (ie, y ₁ ) is insufficient or too high, the (200) texture change of the coating obtained by the sputtering target after DC sputtering is also caused. Weak and affect the texture of the FePt alloy in the (001) orientation. In addition, when the content of C, B, or the combination of C and B (i.e., y ₂ ) is insufficient, the FePt alloy crystal grains are less likely to grow as island crystals (or columnar crystals), and the partitioning property thereof is insufficient; When y _{2 is} too large, it is easy to deposit a non-sequential FePt alloy layer on C, B, or a combination of C and B, so that the unordered FePt alloy layer and the magnetic recording layer 5 form a double layer. Structure and destroy the structure of island crystals (or columnar crystals). Thus, _{preferably, 0.21≤ y 1 ≤0.28,0.30≤ y 2 ≤0.05} ; more _{preferably, 0.22≤ y 1 ≤0.26,0.25≤ y 2 ≤0.10} ; and more preferably, 0.24≤ y ₁ ≤0.25, 0.23 ≤ y ₂ ≤ 0.17.

In addition, it should be additionally noted here that when D of the chemical formula (1) of the sputtering target of the present invention is a combination of N and C, a combination of N and B, or a combination of N, C and B The combination of C, B, or C and B may be segregated upward between the FePt alloy crystal grains of the magnetic recording layer 5. Therefore, when the value of y ₂ is relatively high, the thickness of the second intermediate layer 6 in the second embodiment of the present invention may be relatively reduced or even omitted to utilize C in the first intermediate layer 4. B, or a combination of C and B, replaces C in the MoC of the second intermediate layer 6. <Specific example 1 (Example 1; E1)>

The chemical formula (1) of a specific example 1 (E1) of the sputtering target for direct current sputtering of the present invention is Mg _1-x A _x O _1-y D _y , A is Ti, D is N, x = 0.5, And y=0.1. In addition, the film structure of the PMR medium having the coated film of the present invention is substantially the same as that of the first embodiment, and is completed by a magnetron DC sputtering method, and the manufacturing method thereof is simply described below.

First, a Cr ₈₃ Ru ₁₇ alloy target in a vacuum chamber is sputtered under a working pressure of about 1 × 10 ^-3 Torr to a condition of 161 ̊C. A CrRu seed layer having a thickness of about 80 nm is deposited on a blank glass substrate. Next, the working pressure of the vacuum chamber was controlled to 10 mTorr and the Mg _0.5 Ti _0.5 O _0.9 N _0.1 sputtering target inside the sputtering chamber was sputtered to deposit a thickness on the CrRu seed layer at 395 ̊C. A first intermediate layer of MgTiON of about 30 nm. Finally, a Fe ₅₄ Pt ₄₆ alloy target in the vacuum chamber was sputtered to deposit a FePt alloy magnetic recording layer having a thickness of about 10 nm on the first intermediate layer of the MgTiON at 450 ̊C. <Specific Example 2-1 (E2-1)>

One of the PMR media of the present invention has a film layer structure substantially the same as that of the second embodiment and the specific example 1 (E1), and the difference is that the specific example is A MoC second intermediate layer having a thickness of about 3 nm is interposed between a first intermediate layer of MgTiON and a FePt alloy magnetic recording layer of 2-1 (E2-1), and the specific example 2-1 (E2-1) The FePt alloy magnetic recording layer has a thickness of 4 nm. Specifically, the second intermediate layer of MoC of this specific example 2-1 (E2-1) is a sputtering of a Mo ₄₀ C ₆₀ target to deposit the second intermediate layer of MoC on the first intermediate layer of the MgTiON. <Specific Example 2-2 (E2-2)>

One example 2-2 (E2-2) of the PMR medium of the present invention is substantially the same as the specific example 2-1 (E2-1), and the difference is that the specific example 2-2 (E2-2) A FePt alloy magnetic recording layer has a thickness of 6 nm. <Specific Example 2-3 (E2-3)>

One of the PMR media of the present invention, 2-3 (E2-3) is substantially the same as the specific example 2-1 (E2-1), and the difference is that the specific example 2-3 (E2-3) A FePt alloy magnetic recording layer has a thickness of 8 nm. <Specific Example 2-4 (E2-4)>

One of the PMR media of the present invention, 2-4 (E2-4) is substantially the same as the specific example 2-1 (E2-1), and the difference is that the specific example 2-4 (E2-4) A FePt alloy magnetic recording layer has a thickness of 10 nm.

As can be seen from the XRD pattern shown in FIG. 3, the specific example 1 (E1) of the present invention shows MgTiON (200) in addition to the diffraction signal peak of Cr (200) adjacent to 63 ̊. The diffracted signal peaks, and the (001) and (002) diffracted signal peaks of the L1 ₀ phase of the FePt alloy magnetic recording layer are respectively shown at 24 ̊ and 49 ,, respectively, and the specific example 1 (E1) of the present invention is confirmed. The CrRu seed layer and the first intermediate layer of MgTiON have a texture of (200), and the L1 ₀ phase of the FePt alloy magnetic recording layer has (001) more than the (200) texture of the first intermediate layer of the MgTiON. The texture of the present invention can be preliminarily derived from the specific example 1 (E1).

As can be seen from the hysteresis loop diagram shown in FIG. 4, the specific example 1 (E1) of the present invention has a vertical coercive field (Hc) which is close to 3.75 kOe, and the vertical hysteresis curve and the horizontal hysteresis curve are not mutually exclusive. The overlap confirmed that the perpendicular magnetic anisotropy of the specific example 1 (E1) of the present invention was good.

As can be seen from the XRD pattern shown in FIG. 5, the specific examples of the present invention [(E2-1, (E2-2, (E2-3, (E2-4)]) are shown with Cr(200) in the vicinity of 63 ̊. The diffracted signal peak also shows the diffraction signal of MgTiON (200) near the 43 ̊, and the extremely weak MoC (200) signal at the signal position very close to 43 ,, and approaches 24 ̊ and 49 The (001) and (002) diffracted signal peaks of the L1 ₀ phase of the FePt alloy magnetic recording layer are respectively shown in the crucible; wherein, as the thickness of the FePt alloy magnetic recording layer increases, the L1 ₀ phase of (001) and 002) The diffraction signal peak is also improved. According to the analysis data of Fig. 5, it is confirmed that the specific examples of the present invention [(E2-1, (E2-2, (E2-3, (E2-4)]) The seed layer and the first intermediate layer of each MgTiON have a texture of (200), and the L1 ₀ phase of each FePt alloy magnetic recording layer has a (200) texture of the corresponding first MgMnN intermediate layer (001). The texture, and as the thickness of the FePt alloy magnetic recording layer increases, the (001) texture of the L1 ₀ phase is more obvious, and the specific examples of the invention can be preliminarily derived [(E2-1, (E2- 2. The perpendicular magnetic anisotropy of (E2-3, (E2-4)] is good.

Referring further to the hysteresis loop diagram shown in FIG. 6, the vertical coercive field (Hc) of the specific examples [(E2-1, (E2-2, (E2-3, (E2-4)]) of the present invention has been Approaching 12.5 kOe~15 kOe, it is confirmed that the second intermediate layers of the MoCs introduced in the specific examples [(E2-1, (E2-2, (E2-3, (E2-4)]) are It is beneficial to increase the (001) texture of the L1 ₀ phase of each FePt alloy magnetic recording layer, so that its vertical coercive field (Hc) is raised from about 3.75 kOe of the specific example 1 (E1) to 12.5 kOe~15 kOe. In addition, the vertical hysteresis curves of the specific examples [(E2-1, (E2-2, (E2-3, (E2-4)]) and their respective horizontal hysteresis curves do not overlap each other. It is also confirmed that the specific examples [(E2-1), (E2-2), (E2-3), (E2-4)] of the present invention have good perpendicular magnetic anisotropy.

The coating film in the sputtering target of the specific example 1 (E1) of the present invention may have a texture of (200) after the direct current sputtering (ie, the first intermediate layer of MgTiON) to make the FePt thereon. The alloy magnetic recording layer can have the L1 ₀ phase (001) texture only under the film forming condition of 450 ̊C, which is beneficial to be integrated into the integrated circuit process. Furthermore, the specific examples of the present invention [(E2-1, (E2-2, (E2-3, (E2-4)]) have their vertical coercive field (Hc) after introduction of the second intermediate layer of MoC. ) Increase to about 12.5 kOe~15 kOe.

Finally, it can be seen from the TEM cross-sectional image shown in FIG. 7 that the FePt alloy magnetic recording layer of the specific example 1 (E1) exhibits a continuous film, and the specific example 2-4 (E2-4), the FePt thereof. The alloy magnetic recording layer exhibits an island-like alloy crystal grain by introducing the MoC second intermediate layer between the first intermediate layer of the MgTiON, and it is preliminarily confirmed that the portion C of the second intermediate layer of the MoC is segregated upward in the FePt. Between the alloy grains. Moreover, it should be further added here that, if the specific example 2-4 (E2-4) of the present invention is used to increase the thickness of the second intermediate layer of the MoC, or simultaneously with the second intermediate layer of the MoC When SiO ₂ is mixed in, the C (or the mixed SiO ₂ ) in the second intermediate layer of the MoC can be used to make the island-shaped structural alloy crystal grains in the FePt alloy magnetic recording layer of the specific example 2-4 (E2-4). A columnar crystal structure is formed inside.

In summary, the sputtering target for DC sputtering of the present invention and the perpendicular magnetic recording medium having the coating thereof have a N in the sputtering target such that the FePt alloy magnetic recording layer above it is only 450 ̊C. Under the film forming condition, it has the (001) texture of L1 ₀ phase, which is beneficial to the integration to the integrated circuit process, and the vertical coercive field strength (Hc) is increased to 12.5 kOe after the introduction of the second intermediate layer of MoC. It is about 15 kOe, so the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the simple equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still Within the scope of the invention patent.

2‧‧‧Substrate

5‧‧‧ magnetic recording layer

3‧‧‧ seed layer

6‧‧‧Second intermediate layer

4‧‧‧First intermediate layer

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a front elevational view showing a first embodiment of a perpendicular magnetic recording medium having a coating of the above-described sputtering target. 2 is a front view showing a second embodiment of a PMR medium having a coating of the above-described sputtering target; FIG. 3 is an X-ray diffraction (hereinafter referred to as XRD). The figure shows the epitaxial relationship between a seed layer of a specific example 1 (E1), a first intermediate layer and a magnetic recording layer of the PMR medium; FIG. 4 is a magnetic hysteresis loop diagram. The magnetic substance of the specific example 1 (E1) of the present invention will be described. FIG. 5 is an XRD diagram illustrating one specific example 2-1 (E2-1) and one specific example 2-2 (E2-2) of the PMR medium of the present invention. , an epitaxial layer between each of the seed crystal layers of a specific example 2-3 (E2-3) and a specific example 2-4 (E2-4), each of the first intermediate layers, each of the second intermediate layers, and each of the magnetic recording layers Figure 6 is a hysteresis loop diagram illustrating the magnetic properties of the specific examples (E2-1, E2-2, E2-3, E2-4) of the present invention; 7 is a transmission electron microscope (transmission electron microscope; hereinafter referred to as TEM) cross-sectional images, described film structure of the present invention, this particular cross section of Example 1 (E1) and the specific examples 2-4 (E2-4) of.

Claims (7)

A sputtering target for DC sputtering, comprising a chemical formula (1) described below: Mg _1-x A _x O _1-y D _y ... (1); wherein A is a selection The metal elements of the group consisting of: Ti, Al, Ta, V, Sc, Y, and a combination of the foregoing metal elements; wherein D is N, or N and a non-selected from the group consisting of a combination of metal elements: C, B, and a combination of the foregoing non-metal elements; wherein, 0.3 ≤ x < 0.8, and 0.1 ≤ y ≤ 0.51; wherein the chemical formula (1) is a rock salt structure, and A is in the rock salt structure Is a partial lattice position that replaces Mg, and D is a partial lattice position in place of O in the rock salt structure. A sputtering target for direct current sputtering according to claim 1, wherein A is Ti, D is N, x = 0.5, and y = 0.1. A perpendicular magnetic recording medium having a coating of a sputtering target according to claim 1 or 2, comprising: a substrate; a seed layer formed on the substrate; a first intermediate layer formed on the crystal And a magnetic recording layer formed on the first intermediate layer; wherein the first intermediate layer is a coating film obtained by sputtering a sputtering target contained in claim 1 or 2 by DC sputtering, and The first intermediate layer has a texture of (200). The perpendicular magnetic recording medium of claim 3, wherein the first intermediate layer has a thickness of between 5 nm and 40 nm. The perpendicular magnetic recording medium of claim 3, wherein the seed layer is composed of a (200) textured CrRu alloy and has a thickness of between 10 nm and 100 nm. The perpendicular magnetic recording medium according to claim 3, wherein the magnetic recording layer is selected from the group consisting of FePt alloy, CoPt alloy, FePd alloy, or CoPd alloy, and the magnetic recording layer has a thickness of between 4 nm and 20 nm. . The perpendicular magnetic recording medium of claim 3, further comprising a second intermediate layer sandwiched between the first intermediate layer and the magnetic recording layer and having a (200) texture The MoC is composed of a second intermediate layer having a thickness of between 0.5 nm and 40 nm.