[0009] ＜樹脂組成物＞ 本發明之密封用樹脂組成物，其係包含（A）熱硬化性樹脂、（B）半燒成水滑石及（C）硬化劑之樹脂組成物，其特徵為樹脂組成物之硬化物的折射率為1.48～1.54。硬化物之折射率較佳為1.49～1.54，更佳為1.50～1.54，再更佳為與半燒成水滑石之折射率為相同程度即1.50～1.53。 [0010] ＜（A）熱硬化性樹脂＞ 於本發明，係使用樹脂組成物之硬化物的折射率如成為1.48～1.54般之熱硬化性樹脂。較佳為前述折射率如成為1.49～1.54般之熱硬化性樹脂，更佳為前述折射率如成為1.50～1.54般之熱硬化性樹脂，再更佳為前述折射率成為如與半燒成水滑石的折射率為相同程度之1.50～1.53般之熱硬化性樹脂。 [0011] 樹脂組成物之硬化物的折射率可藉由熱硬化性樹脂或其他成分（例如熱塑性樹脂等）調整。為使硬化物之折射率的調整容易進行，（A）熱硬化性樹脂較佳為包含折射率為1.48～1.54之熱硬化性樹脂。前述熱硬化性樹脂之折射率更佳為1.49～1.54，再更佳為1.50～1.54。 [0012] 折射率為1.48～1.54之熱硬化性樹脂的含量，若樹脂組成物之硬化物的折射率成為1.48～1.54的範圍，雖並未特別限定，但相對於（A）熱硬化性樹脂全體，較佳為50～100質量%，更佳為60～100質量%，再更佳為70～100質量%。 [0013] 於本發明使用之（A）熱硬化性樹脂全體的折射率較佳為1.48～1.54，更佳為1.49～1.54，再更佳為1.50～1.54。使用複數個熱硬化性樹脂的情況下，較佳為該等之混合物全體的折射率為上述範圍內。 [0014] 作為熱硬化性樹脂，若樹脂組成物之硬化物的折射率如成為1.48～1.54般之熱硬化性樹脂，雖並未特別限定，但例如可列舉環氧樹脂、氰酸酯樹脂、酚樹脂、雙馬來醯亞胺-三嗪樹脂、聚醯亞胺樹脂、丙烯酸樹脂、乙烯基苄基樹脂等，其中，從低溫硬化性等之觀點來看，較佳為環氧樹脂。 [0015] 環氧樹脂若為樹脂組成物之硬化物的折射率如成為1.48～1.54般之環氧樹脂，則並未特別限定。作為如此之環氧樹脂，可使用平均每1分子具有2個以上環氧基，且透過率高者。例如可列舉氫化環氧樹脂（氫化雙酚A型環氧樹脂、氫化雙酚F型環氧樹脂等）、含有氟之環氧樹脂、鏈狀脂肪族型環氧樹脂、環狀脂肪族型環氧樹脂、雙酚A型環氧樹脂、聯苯型環氧樹脂、聯苯芳烷基型環氧樹脂、茀型環氧樹脂、萘酚型環氧樹脂、萘型環氧樹脂、雙酚F型環氧樹脂、含磷之環氧樹脂、雙酚S型環氧樹脂、芳香族環氧丙基胺型環氧樹脂（例如四環氧丙基二胺基二苯基甲烷、三環氧丙基-p-胺基酚、二環氧丙基甲苯胺（Toluidine）、二環氧丙基苯胺等）、脂環式環氧樹脂、酚酚醛清漆型環氧樹脂、烷基酚型環氧樹脂、甲酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、具有丁二烯構造之環氧樹脂、雙酚之二環氧丙基醚化物、萘二醇之二環氧丙基醚化物、酚類之二環氧丙基醚化物及醇類之二環氧丙基醚化物以及此等之環氧樹脂之烷基取代體等。 [0016] 環氧樹脂可僅使用1種，亦可併用2種以上。環氧樹脂之環氧當量從反應性等之觀點來看，較佳為50～5,000，更佳為50～3,000，再更佳為80～2,000，特佳為100～1,500。尚，所謂「環氧當量」，係包含1克當量之環氧基的樹脂之克數（g/eq），依照JIS K 7236所規定之方法測定。環氧樹脂之重量平均分子量較佳為5,000以下。 [0017] 環氧樹脂可為液狀或固形之任一種，可併用液狀環氧樹脂與固形環氧樹脂。於此，所謂「液狀」及「固形」，係於常溫（25℃）及常壓（1atm）之環氧樹脂的狀態。從塗佈性、加工性、接著性的觀點來看，較佳為使用之環氧樹脂全體的10質量%以上為液狀環氧樹脂。從與水滑石之混練性及清漆黏度的觀點來看，特佳為併用液狀環氧樹脂與固形環氧樹脂。液狀環氧樹脂與固形環氧樹脂之質量比（液狀環氧樹脂：固形環氧樹脂）較佳為1：2～1：0，更佳為1：1.5～1：0。 [0018] 在本發明之一態樣，（A）熱硬化性樹脂除了將其折射率定為1.48～1.54之外，較佳為選自氫化環氧樹脂、含有氟之環氧樹脂、鏈狀脂肪族型環氧樹脂、環狀脂肪族型環氧樹脂及烷基酚型環氧樹脂中之1種以上，更佳為選自氫化環氧樹脂、含有氟之環氧樹脂、鏈狀脂肪族型環氧樹脂及環狀脂肪族型環氧樹脂中之1種以上。藉由使用前述樹脂，可得到透明性高之硬化物。 [0019] 所謂「氫化環氧樹脂」，係意指氫化含有芳香環之環氧樹脂所得之環氧樹脂。氫化環氧樹脂之氫化率較佳為50%以上，更佳為70%以上。所謂「鏈狀脂肪族型環氧樹脂」，係意指具有直鏈狀或分支狀之烷基鏈，或烷基醚鏈之環氧樹脂，所謂「環狀脂肪族型環氧樹脂」，係意指於分子內具有環狀脂肪族骨架，例如具有環烷烴骨架之環氧樹脂。所謂「烷基酚型環氧樹脂」，係意指具有1個以上之烷基及1個以上之羥基之苯環骨架作為作為取代基，前述羥基變換成環氧丙基醚基之環氧樹脂。 [0020] 作為氫化環氧樹脂，較佳為氫化雙酚A型環氧樹脂、氫化雙酚F型環氧樹脂。尚，只要樹脂組成物之硬化物的折射率滿足上述特定之數值範圍，或作為熱硬化性樹脂全體之折射率滿足上述特定之數值範圍，上述適合之環氧樹脂以外的環氧樹脂可包含在熱硬化性樹脂中。 [0021] 作為氫化雙酚A型環氧樹脂，例如可列舉液狀氫化雙酚A型環氧樹脂（例如「YX8000」（三菱化學公司製、環氧當量：約205）、「Denacol EX-252」（Nagase ChemteX公司製、環氧當量：約213））、固形氫化雙酚A型環氧樹脂（例如「YX8040」（三菱化學公司製、環氧當量：約1000））。 [0022] 含有氟之環氧樹脂，例如可使用WO2011/089947所記載之含有氟之環氧樹脂。 [0023] 作為 鏈狀脂肪族型環氧樹脂，例如可列舉聚甘油聚環氧丙基醚（例如「Denacol EX-512」、「Denacol EX-521」，Nagase ChemteX公司製）、季戊四醇聚環氧丙基醚（例如「Denacol EX-411」，Nagase ChemteX公司製）、二甘油聚環氧丙基醚（例如「Denacol EX-421」，Nagase ChemteX公司製）、甘油聚環氧丙基醚（例如「Denacol EX-313」、「Denacol EX-314」，Nagase ChemteX公司製）、三羥甲基丙烷聚環氧丙基醚（例如，「Denacol EX-321」、Nagase ChemteX公司製）、新戊二醇二環氧丙基醚（例如「Denacol EX-211」，Nagase ChemteX公司製）、1,6-己烷二醇二環氧丙基醚（例如「Denacol EX-212」，Nagase ChemteX公司製）、乙二醇二環氧丙基醚（例如「Denacol EX-810」、「Denacol EX-811」，Nagase ChemteX公司製）、二乙二醇二環氧丙基醚（例如「Denacol EX-850」、「Denacol EX-851」，Nagase ChemteX公司製）、聚乙二醇二環氧丙基醚（例如「Denacol EX-821」、「Denacol EX-830」、「Denacol EX-832」、「Denacol EX-841」、「Denacol EX-861」，Nagase ChemteX公司製）、丙二醇二環氧丙基醚（例如「Denacol EX-911」，Nagase ChemteX公司製）、聚丙二醇二環氧丙基醚（例如「Denacol EX-941」、「Denacol EX-920」、「Denacol EX-931」，Nagase ChemteX公司製）等。 [0024] 作為環狀脂肪族型環氧樹脂，例如可列舉Daicel化學工業公司製「EHPE-3150」等。 [0025] 作為烷基酚型環氧樹脂，例如可列舉DIC公司製「HP-820」；新日鐵住金化學工業公司製「YDC-1312」；Nagase ChemteX公司製「EX-146」等。 [0026] 在本發明之一態樣，以（A）熱硬化性樹脂包含折射率為1.48～1.54，且於分子內含有芳香環之環氧樹脂（含有芳香環之環氧樹脂）較佳。使用於分子內包含芳香環構造之環氧樹脂時，由於成為有提昇樹脂組成物之反應性、硬化物之玻璃轉移溫度、密著性之任一種或全部的傾向故較佳。作為如此之熱硬化性樹脂，例如可列舉烷基酚型環氧樹脂、含有氟之芳香族型環氧樹脂等。 [0027] 又，於本發明之另一態樣，（A）熱硬化性樹脂較佳為包含折射率為1.48～1.54之環氧樹脂（a1）（以下有時簡稱為「樹脂（a1）」）及含有芳香環之環氧樹脂（a2）（以下有時簡稱為「樹脂（a2）」）。樹脂（a1）可為僅1種，亦可為2種以上。同樣，樹脂（a2）可為僅1種，亦可為2種以上。 [0028] 藉由使用含有芳香環之環氧樹脂，成為有提昇樹脂組成物之反應性，以及硬化物之玻璃轉移溫度及密著性之任一種或全部的傾向。惟，環氧樹脂包含芳香環時，有提高折射率的傾向。因此，一般而言，滿足1.48～1.54之折射率之含有芳香環之環氧樹脂較少。據此，藉由組合樹脂（a1）與樹脂（a2）使用，可兼顧期望之折射率、與樹脂組成物之反應性以及硬化物之玻璃轉移溫度及密著性的提昇。 [0029] 樹脂（a1）及樹脂（a2）之合計的含量若為達成上述效果的範圍，雖並未特別限定，但相對於（A）熱硬化性樹脂全體，較佳為60～100質量%，更佳為70～100質量%，再更佳為80～100質量%，特佳為90～100質量%，最佳為100質量%。 [0030] 作為樹脂（a1），若折射率為1.48～1.54之環氧樹脂則並未特別限定。具有上述折射率之環氧樹脂，一般而言未包含芳香環構造者較多。樹脂（a1）較佳為選自氫化環氧樹脂、含有氟之環氧樹脂、鏈狀脂肪族型環氧樹脂、環狀脂肪族型環氧樹脂及烷基酚型環氧樹脂中之1種以上。 [0031] 作為樹脂（a2），若為包含芳香環之環氧樹脂則並未特別限定。從樹脂組成物之反應性、硬化物之玻璃轉移溫度及或密著性的提昇的觀點來看，樹脂（a2）較佳為選自雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚酚醛清漆型環氧樹脂、聯苯芳烷基型環氧樹脂、茀型環氧樹脂及含有氟之芳香族型環氧樹脂中之1種以上。含有芳香環之環氧樹脂的折射率一般雖並非為1.48～1.54，但折射率為1.48～1.54之含有芳香環之環氧樹脂亦可作為樹脂（a2）使用。 [0032] 於此，所謂「聯苯芳烷基型環氧樹脂」，係意指具有鍵結酚醛清漆構造及2價聯苯構造之主鏈的環氧樹脂。所謂「茀型環氧樹脂」，係意指具有茀骨架之環氧樹脂。所謂「含有氟之芳香族型環氧樹脂」，係意指具有芳香環之含有氟之環氧樹脂。例如可使用WO2011/089947所記載之含有氟之芳香族型環氧樹脂。 [0033] 在併用樹脂（a1）及樹脂（a2）之態樣，樹脂（a1）更佳為氫化環氧樹脂、含有氟之環氧樹脂、環狀脂肪族型環氧樹脂及烷基酚型環氧樹脂，再更佳為選自氫化雙酚A型環氧樹脂、氫化雙酚F型環氧樹脂及含有氟之環氧樹脂中之1種以上，特佳為選自氫化雙酚A型環氧樹脂及氫化雙酚F型環氧樹脂中之1種以上，最佳為氫化雙酚A型環氧樹脂。又，在前述態樣，樹脂（a2）更佳為選自雙酚型環氧樹脂及含有氟之芳香族型環氧樹脂中之1種以上，再更佳為雙酚型環氧樹脂，再更佳為選自雙酚A型環氧樹脂及雙酚F型環氧樹脂中之1種以上。 [0034] 在併用樹脂（a1）及樹脂（a2）之態樣，樹脂（a2）的量相對於樹脂（a1）及樹脂（a2）的合計，較佳為0.5～40質量%，更佳為1～35質量%，再更佳為2～30質量%。 [0035] 作為雙酚A型環氧樹脂，例如可列舉三菱化學公司製「828EL」、「1001」及「1004AF」；DIC公司製「840」及「850-S」；新日鐵住金化學工業公司製「YD-128」等。又，作為液狀雙酚A型環氧樹脂及液狀雙酚F型環氧樹脂之混合物，例如可列舉新日鐵化學工業公司製「ZX-1059」（環氧當量：約165）。 [0036] 作為雙酚F型環氧樹脂，例如可列舉三菱化學公司製「807」；DIC公司製「830」；新日鐵住金化學工業公司製「YDF-170」等。 [0037] 作為酚酚醛清漆型環氧樹脂，例如可列舉DIC公司製「N-730A」、「N-740」、「N-770」及「N-775」；三菱化學公司製「152」及「154」等。 [0038] 作為聯苯芳烷基型環氧樹脂，例如可列舉日本化藥公司製「NC-3000」、「NC-3000L」及「NC-3100」等。 [0039] 作為茀型環氧樹，例如可列舉大阪燃氣化工公司製「OGSOL PG-100」、「CG-500EG-200」及「EG-280」等。 [0040] 熱硬化性樹脂的量相對於樹脂組成物的不揮發分全體，較佳為10～95質量%，更佳為20～90質量%，再更佳為30～85質量%。 [0041] 環氧樹脂的量相對於樹脂組成物的不揮發分全體，較佳為10～95質量%，更佳為20～90質量%，再更佳為30～85質量%。 [0042] ＜（B）半燒成水滑石＞ 水滑石可分類成未燒成水滑石、半燒成水滑石及燒成水滑石。 [0043] 未燒成水滑石例如如天然水滑石 （Mg6
Al2
(OH)16
CO3
･4H2
O）所代表之具有層狀結晶構造的金屬氫氧化物，例如由成為基本骨架之層［Mg1-X
AlX
(OH)2
］X+
與中間層［(CO3
)X/2
･mH2
O］X-
所構成。在本發明之未燒成水滑石係包含成水滑石等之水滑石樣化合物之概念。作為水滑石樣化合物，例如可列舉下述式（I）及下述式（II）表示者。 [0044]（式中，M2+
表示Mg2+
、Zn2+
等之2價金屬離子，M3+
表示Al3+
、Fe3+
等之3價金屬離子，An-
表示CO3 2-
、Cl-
、NO3 -
等之n價陰離子，且0＜x＜1，0≦m＜1，n為正數）。 式（I）中，M2+
較佳為Mg2+
，M3+
較佳為Al3+
，An-
較佳為CO3 2-
。 [0045]（式中，M2+
表示Mg2+
、Zn2+
等之2價金屬離子，An-
表示CO3 2-
、Cl-
、NO3-
等之n價陰離子，x為2以上之正數，z為2以下之正數，m為正數，n為正數）。 式（II）中，M2+
較佳為Mg2+
，An-
較佳為CO3 2-
。 [0046] 半燒成水滑石係指燒成未燒成水滑石所得之減少或消失層間水的量之具有層狀結晶構造的金屬氫氧化物。所謂「層間水」，若使用組成式進行說明，係指上述之未燒成的天然水滑石及水滑石樣化合物的組成式所記載之「H2
O」。本發明使用此半燒成水滑石成為特徵之一。 [0047] 另一方面，燒成水滑石係指燒成未燒成水滑石或半燒成水滑石所得，不僅層間水，羥基亦藉由縮合脫水而消失之具有非晶構造的金屬氧化物。 [0048] 未燒成水滑石、半燒成水滑石及燒成水滑石可藉由飽和吸水率區別。半燒成水滑石之飽和吸水率為1質量%以上且未滿20質量%。另一方面，未燒成水滑石之飽和吸水率為未滿1質量%，燒成水滑石之飽和吸水率為20質量%以上。 [0049] 所謂在本發明之「飽和吸水率」，係指在天秤量取1.5g之未燒成水滑石、半燒成水滑石或燒成水滑石，測定初期質量後，於設定在大氣壓下、60℃、90%RH（相對濕度）之小型環境試驗器（Espec公司製SH-222）靜置200小時的情況下之相對於初期質量之質量增加率，可用下述式（i）求得。 飽和吸水率（質量%） =100×（吸濕後之質量-初期質量）/初期質量 （i） [0050] 半燒成水滑石之飽和吸水率較佳為3質量%以上且未滿20質量%，更佳為5質量%以上且未滿20質量%。 [0051] 又，未燒成水滑石、半燒成水滑石及燒成水滑石可藉由於熱重量分析測定之熱重量減少率區別。半燒成水滑石在280℃之熱重量減少率為未滿15質量%，且在其380℃之熱重量減少率為12質量%以上。另一方面，未燒成水滑石在280℃之熱重量減少率為15質量%以上，燒成水滑石在380℃之熱重量減少率為未滿12質量%。 [0052] 熱重量分析可使用日立高科技公司製TG/DTA EXSTAR6300，於鋁製之樣品盤秤量5mg之水滑石，以未覆蓋之開放的狀態，於氮流量200mL/分鐘的環境下，從30℃至550℃以昇溫速度10℃/分鐘的條件進行。熱重量減少率可用下述式（ii）求得。 熱重量減少率（質量%） =100×（加熱前之質量-到達預定溫度時之質量）/加熱前之質量 （ii） [0053] 又，未燒成水滑石、半燒成水滑石及燒成水滑石可藉由以粉末X光繞射測定之峰值及相對強度比區別。半燒成水滑石係表示藉由粉末X光繞射於2θ為8～18˚附近有二個經分裂之峰值，或藉由二個峰值之合成而具有肩部之峰值，低角側所出現之峰值或肩部之繞射強度（=低角側繞射強度）、與高角側所出現之峰值或肩部之繞射強度（=高角側繞射強度）的相對強度比（低角側繞射強度/高角側繞射強度）為0.001～1,000。另一方面，未燒成水滑石僅於8～18˚附近具有一個峰值，或低角側所出現之峰值或肩部與高角側所出現之峰值或肩部之繞射強度的相對強度比成為前述的範圍外。燒成水滑石於8˚～18˚的區域不具有特徵性峰值，於43˚具有特徵性峰值。粉末X光繞射測定係藉由粉末X光繞射裝置（PANalytical公司製、Empyrean），以對陰極CuKα（1.5405Å）、電壓：45V、電流：40mA、取樣寬度：0.0260˚、掃描速度：0.0657˚/s、測定繞射角範圍（2θ）：5.0131～79.9711˚的條件進行。峰值搜尋係利用繞射裝置附屬之軟體的峰值搜尋功能，可用「最小顯著度：0.50、最小峰值晶片：0.01˚、最大峰值晶片：1.00˚、峰值基底寬度：2.00˚、方法：2次微分之最小值」的條件進行。 [0054] 半燒成水滑石之BET比表面積較佳為1～250m2
/g，更佳為5～200m2
/g。半燒成水滑石之BET比表面積係依照BET法，可使用比表面積測定裝置（Macsorb HM Model 1210、Mountech公司製），使氮氣體吸附在試料表面，使用BET多點法算出。 [0055] 半燒成水滑石之平均粒子徑較佳為1～1,000nm，更佳為10～800nm。半燒成水滑石之平均粒子徑係藉由雷射繞射散射式粒度分布測定（JIS Z 8825），將粒度分布以體積基準作成時之該粒度分布的中位徑。 [0056] 半燒成水滑石可使用以表面處理劑進行表面處理者。作為表面處理所使用之表面處理劑，例如可使用高級脂肪酸、烷基矽烷類、矽烷偶合劑等，其中，適合高級脂肪酸、烷基矽烷類。表面處理劑可使用1種或2種以上。 [0057] 作為高級脂肪酸，例如可列舉硬脂酸、褐煤酸、肉荳蔻酸、棕櫚酸等之碳數18以上之高級脂肪酸，其中，較佳為硬脂酸。此等可使用1種或2種以上。 [0058] 作為烷基矽烷類，例如可列舉甲基三甲氧基矽烷、乙基三甲氧基矽烷、己基三甲氧基矽烷、辛基三甲氧基矽烷、癸基三甲氧基矽烷、十八烷基三甲氧基矽烷、二甲基二甲氧基矽烷、辛基三乙氧基矽烷、n-十八烷基二甲基（3-（三甲氧基矽烷基）丙基）氯化銨等。此等可使用1種或2種以上。 [0059] 作為矽烷偶合劑，例如可列舉3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基（二甲氧基）甲基矽烷及2-（3,4-環氧環己基）乙基三甲氧基矽烷等之環氧系矽烷偶合劑；3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、3-巰基丙基甲基二甲氧基矽烷及11-巰基十一烷基三甲氧基矽烷等之巰基系矽烷偶合劑；3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-胺基丙基二甲氧基甲基矽烷、N-苯基-3-胺基丙基三甲氧基矽烷、N-甲基胺基丙基三甲氧基矽烷、N-（2-胺基乙基）-3-胺基丙基三甲氧基矽烷及N-（2-胺基乙基）-3-胺基丙基二甲氧基甲基矽烷等之胺基系矽烷偶合劑；3-脲基丙基三乙氧基矽烷等之脲基系矽烷偶合劑、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷及乙烯基甲基二乙氧基矽烷等之乙烯基系矽烷偶合劑；p-苯乙烯基三甲氧基矽烷等之苯乙烯基系矽烷偶合劑；3-丙烯醯氧基丙基三甲氧基矽烷及3-甲基丙烯醯氧基丙基三甲氧基矽烷等之丙烯酸酯系矽烷偶合劑；3-異氰酸酯丙基三甲氧基矽烷等之異氰酸酯系矽烷偶合劑、雙（三乙氧基矽烷基丙基）二硫化物、雙（三乙氧基矽烷基丙基）四硫化物等之硫化物系矽烷偶合劑；苯基三甲氧基矽烷、甲基丙烯醯氧基（Methacryloxy）丙基三甲氧基矽烷、咪唑矽烷、三嗪矽烷等。此等可使用1種或2種以上。 [0060] 半燒成水滑石的表面處理，例如可藉由邊將未處理之半燒成水滑石以混合機在常溫使其攪拌分散，邊添加表面處理劑進行噴霧再攪拌5～60分鐘來進行。作為混合機，可使用周知之混合機，例如可列舉V摻合機、絲帶攪拌機、氣泡錐形攪拌機等之摻合機、亨舍爾混合機及混凝土攪拌機等之混合機、球磨機、絞磨機等。又，以球磨機等粉碎半燒成水滑石時，亦可添加前述之高級脂肪酸、烷基矽烷類或矽烷偶合劑，進行表面處理。表面處理劑的使用量雖因半燒成水滑石的種類或表面處理劑的種類等而有所不同，但相對於未被表面處理之半燒成水滑石100質量份，較佳為1～10質量份。在本發明，經表面處理之半燒成水滑石亦包含在本發明之「半燒成水滑石」。 [0061] 在本發明之樹脂組成物之半燒成水滑石的量，只要能發揮本發明的效果，雖並未被特別限定，但相對於樹脂組成物之不揮發分全體較佳為5～60質量%，更佳為10～55質量%。由於半燒成水滑石係吸濕性能優異，只要增加該量，則提昇所得之硬化物的水分遮斷性。惟，該量超過60質量%時，變成有產生樹脂組成物的黏度上昇、因潤濕性的降低導致密封對象之基板等與樹脂組成物的密著性降低、硬化物的強度降低變脆等之問題的傾向。又，由於因半燒成水滑石之層間水，導致密封層（即硬化物）中之水分量增多，例如在有機EL裝置之製造，有因密封層中之水分導致對發光材料（發光層）或電極層的不良影響顯在化，初期階段的暗點發生增多的疑慮。 [0062] 本發明之樹脂組成物若為發揮本發明的效果的範圍，可包含燒成水滑石。該量相對於樹脂組成物的不揮發分全體，較佳為0～20質量%，更佳為0～15質量%，再更佳為0～10質量%，最佳為0。即，本發明之樹脂組成物最佳為不包含燒成水滑石。增加燒成水滑石的量時，變成有樹脂組成物之硬化物的折射率上昇，透過率降低的傾向。半燒成水滑石：燒成水滑石的質量比較佳為50：50～100：0，更佳為55：45～100：0，再更佳為60：40～100：0。 [0063] 本發明之樹脂組成物若為發揮本發明的效果的範圍，可包含未燒成水滑石。該量相對於樹脂組成物的不揮發分全體，較佳為0～20質量%，更佳為0～10質量%，再更佳為0～5質量%，最佳為0。即，本發明之樹脂組成物最佳為未包含未燒成水滑石。未燒成水滑石雖未對樹脂組成物之硬化物的透過率帶來影響，但由於水分含量大，恐有因增量導致水分遮蔽性的降低之虞，例如，該量超過20質量%時，與半燒成水滑石相同有初期階段之暗點發生增多的懸念。半燒成水滑石：未燒成水滑石的質量比較佳為50：50～100：0，更佳為55：45～100：0，再更佳為60：40～100：0，又再更佳為65：35～100：0，特佳為70：30～100：0。 [0064] 作為半燒成水滑石，例如可列舉「DHT-4C」（協和化學工業公司製、平均粒子徑：400nm）、「DHT-4A-2」（協和化學工業公司製、平均粒子徑：400nm）等。另一方面，作為燒成水滑石，例如可列舉「KW-2200」（協和化學工業公司製、平均粒子徑：400nm）等，作為未燒成水滑石，例如可列舉「DHT-4A」（協和化學工業公司製、平均粒子徑：400nm）等。 [0065] ＜（C）硬化劑及（D）硬化促進劑＞ 本發明之樹脂組成物係含有硬化劑。亦即，密封層係使樹脂組成物硬化所得之硬化物。硬化劑若為具有硬化熱硬化性樹脂之功能者，則並未特別限定。從抑制在樹脂組成物之硬化處理時之有機EL元件等之發光元件之熱劣化的觀點來看，作為硬化劑，較佳為可於140℃以下（較佳為120℃以下）的溫度下，硬化熱硬化性樹脂。硬化劑可僅使用1種，亦可併用2種以上。 [0066] 作為硬化劑，對作為熱硬化性樹脂特佳之環氧樹脂的硬化劑進行例示。例如可列舉離子液體、酸酐化合物、咪唑化合物、3級胺系化合物、二甲基脲化合物、胺加成物化合物、有機酸二肼化合物、有機膦化合物、雙氰胺化合物、1級･2級胺系化合物等。 [0067] 硬化劑較佳為選自離子液體、酸酐化合物、咪唑化合物、3級胺系化合物、二甲基脲化合物及胺加成物化合物中之1種以上，更佳為選自離子液體、酸酐化合物、咪唑化合物、3級胺系化合物及二甲基脲化合物中之1種以上。 [0068] 尤其是作為在本發明之硬化劑，其係可於140℃以下（較佳為120℃以下）的溫度下硬化熱硬化性樹脂（尤其是環氧樹脂）之離子液體，亦即，為可於140℃以下（較佳為120℃以下）的溫度區域融解之鹽，較佳為具有熱硬化性樹脂（尤其是環氧樹脂）之硬化作用的鹽。離子液體期望以均勻溶解在熱硬化性樹脂（尤其是環氧樹脂）的狀態使用，又，離子液體有利於作用在樹脂組成物之硬化物的水分遮斷性的提昇。 [0069] 本發明之樹脂組成物除了硬化劑，以調整硬化時間等為目的亦可含有硬化促進劑。硬化促進劑可僅使用1種，亦可併用2種以上。作為硬化促進劑，對作為熱硬化性樹脂特佳之環氧樹脂的硬化促進劑進行例示。例如可列舉咪唑化合物、3級胺系化合物、二甲基脲化合物及胺加成物化合物等。硬化促進劑較佳為選自咪唑化合物、3級胺系化合物及二甲基脲化合物中之1種以上。 [0070] 作為構成作為在本發明之硬化劑的離子液體之陽離子，可列舉咪唑鎓離子、哌啶鎓離子、吡咯烷鎓離子、吡唑鎓（Pyrazolium）離子、胍鹽（Guanidinium）離子、吡啶鎓離子等之銨系陽離子；四烷基鏻陽離子（例如四丁基鏻離子、三丁基己基鏻離子等）等之鏻系陽離子；三乙基鋶離子等之鋶系陽離子等。 [0071] 作為構成作為在本發明之硬化劑的離子液體之陰離子，可列舉氟化物離子、氯化物離子、溴化物離子、碘化物離子等之鹵素化物系陰離子；甲烷磺酸離子等之烷基硫酸系陰離子；三氟甲烷磺酸離子、六氟膦酸離子、三氟參（五氟乙基）膦酸離子、雙（三氟甲烷磺醯基）醯亞胺離子、三氟乙酸離子、四氟硼酸離子等之含氟化合物系陰離子；酚離子、2-甲氧基酚離子、2,6-二-tert-丁基酚離子等之酚系陰離子；天冬胺酸離子、麩胺酸離子等之酸性胺基酸離子；甘胺酸離子、丙胺酸離子、苯基丙胺酸離子等之中性胺基酸離子；N-苯甲醯基丙胺酸離子、N-乙醯基苯基丙胺酸離子、N-乙醯甘胺酸離子等之下述一般式（1）表示之N-醯基胺基酸離子；甲酸離子、乙酸離子、癸酸離子、2-吡咯烷酮-5-羧酸離子、α-硫辛酸離子、乳酸離子、酒石酸離子、海馬酸離子、N-甲基海馬酸離子、苯甲酸離子等之羧酸系陰離子。 [0072][0073] （惟，R為碳數1～5之直鏈或分支鏈之烷基，或取代或無取代之苯基，X表示胺基酸之側鏈）。 [0074] 作為在該式（1）之胺基酸，例如可列舉天冬胺酸、麩胺酸、甘胺酸、丙胺酸、苯基丙胺酸等，其中，較佳為甘胺酸。 [0075] 上述當中，陽離子較佳為銨系陽離子、鏻系陽離子，更佳為咪唑鎓離子、鏻離子。咪唑鎓離子更詳細而言，為1-乙基-3-甲基咪唑鎓離子、1-丁基-3-甲基咪唑鎓離子、1-丙基-3-甲基咪唑鎓離子等。 [0076] 又，陰離子較佳為酚系陰離子、一般式（1）表示之N-醯基胺基酸離子或羧酸系陰離子，更佳為N-醯基胺基酸離子或羧酸系陰離子。 [0077] 作為酚系陰離子之具體例，可列舉2,6-二-tert-丁基酚離子。又，作為羧酸系陰離子之具體例，可列舉乙酸離子、癸酸離子、2-吡咯烷酮-5-羧酸離子、甲酸離子、α-硫辛酸離子、乳酸離子、酒石酸離子、海馬酸離子、N-甲基海馬酸離子等，其中，較佳為乙酸離子、2-吡咯烷酮-5-羧酸離子、甲酸離子、乳酸離子、酒石酸離子、海馬酸離子、N-甲基海馬酸離子，特別佳為乙酸離子、癸酸離子、N-甲基海馬酸離子、甲酸離子。又，作為一般式（1）表示之N-醯基胺基酸離子之具體例，可列舉N-苯甲醯基丙胺酸離子、N-乙醯基苯基丙胺酸離子、天冬胺酸離子、甘胺酸離子、N-乙醯甘胺酸離子等，其中，較佳為N-苯甲醯基丙胺酸離子、N-乙醯基苯基丙胺酸離子、N-乙醯甘胺酸離子，特別佳為N-乙醯甘胺酸離子。 [0078] 作為具體之離子液體，例如較佳為1-丁基-3-甲基咪唑鎓乳酸酯、四丁基鏻-2-吡咯烷酮-5-羧酸酯、四丁基鏻乙酸鹽、四丁基鏻癸酸鹽、四丁基鏻三氟乙酸鹽、四丁基鏻α-硫辛酸酯、甲酸四丁基鏻鹽、四丁基鏻乳酸酯、酒石酸雙（四丁基鏻）鹽、海馬酸四丁酯鏻鹽、N-甲基海馬酸四丁酯鏻鹽、苯甲醯基-DL-丙胺酸四丁酯鏻鹽、N-乙醯基苯基丙胺酸四丁酯鏻鹽、2,6-二-tert-丁基酚四丁酯鏻鹽、L-天冬胺酸單四丁酯鏻鹽、甘胺酸四丁酯鏻鹽、N-乙醯甘胺酸四丁酯鏻鹽、1-乙基-3-甲基咪唑鎓乳酸酯、1-乙基-3-甲基咪唑鎓乙酸鹽、甲酸1-乙基-3-甲基咪唑鎓鹽、海馬酸1-乙基-3-甲基咪唑鎓鹽、N-甲基海馬酸1-乙基-3-甲基咪唑鎓鹽、酒石酸雙（1-乙基-3-甲基咪唑鎓）鹽、N-乙醯甘胺酸1-乙基-3-甲基咪唑鎓鹽，特別佳為四丁基鏻癸酸鹽、N-乙醯甘胺酸四丁基鏻鹽、1-乙基-3-甲基咪唑鎓乙酸鹽、甲酸1-乙基-3-甲基咪唑鎓鹽、海馬酸1-乙基-3-甲基咪唑鎓鹽、N-甲基海馬酸1-乙基-3-甲基咪唑鎓鹽。 [0079] 作為上述離子液體之合成法，雖有於由烷基咪唑鎓、烷基吡啶鎓、烷基銨及烷基鋶離子等之陽離子部位、與包含鹵素之陰離子部位所構成之前驅物，使NaBF4
、NaPF6
、CF3
SO3
Na或LiN(SO2
CF3
)2
等進行反應之陰離子交換法、使胺系物質與酸酯進行反應而導入烷基，並且有機酸殘基成為對陰離子般之酸酯法及將胺類以有機酸中和而得到鹽之中和法等，但並非被限定於此等。藉由陰離子與陽離子與溶劑之中和法，可等量使用陰離子與陽離子，餾除所得之反應液中之溶劑，亦可直接使用，進而倒入有機溶劑（甲醇、甲苯、乙酸乙酯、丙酮等）進行液濃縮亦無妨。 [0080] 作為在本發明之硬化劑的酸酐化合物，例如可列舉四苯二甲酸酐酐、甲基四苯二甲酸酐酐、六苯二甲酸酐酐、甲基六苯二甲酸酐酐、甲基納迪克酸酐、十二碳烯基琥珀酸酐等。作為酸酐化合物之具體例，可列舉RIKACID TH、TH-1A、HH、MH、MH-700、MH-700G（皆為新日本理化公司製）等。 [0081] 作為在本發明之硬化劑及硬化促進劑的咪唑化合物，例如可列舉1H-咪唑、2-甲基-咪唑、2-苯基-4-甲基咪唑、2-乙基-4-甲基咪唑、1-氰乙基-2-乙基-4-甲基-咪唑、2-十一烷基咪唑、1-氰乙基-2-十一烷基咪唑、1-氰乙基-2-十一烷基咪唑鎓偏苯三酸酯（Trimellitate）、2,4-二胺基-6-（2’-十一烷基咪唑基-（1’））-乙基-s-三嗪、2-苯基-4,5-雙（羥基甲基）-咪唑、1-苄基-2-甲基咪唑、1-苄基-2-苯基咪唑、2-苯基-咪唑、2-十二烷基-咪唑、2-十七烷基咪唑、1,2-二甲基-咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、2,4-二胺基-6-（2’-甲基咪唑基-（1’）-乙基-s-三嗪、2,4-二胺基-6-（2’-甲基咪唑基-（1’））-乙基-s-三嗪異氰脲酸加成物等。作為咪唑化合物之具體例，可列舉Curezol 2MZ、2P4MZ、2E4MZ、2E4MZ-CN、C11Z、C11Z-CN、C11Z-CNS、C11Z-A、2PHZ、1B2MZ、1B2PZ、2PZ、C17Z、1.2DMZ、2P4MHZ-PW、2MZ-A、2MA-OK（皆為四國化成工業公司製）等。 [0082] 作為在本發明之硬化劑及硬化促進劑的3級胺系化合物之具體例，可列舉DBN（1,5-diazabicyclo[4.3.0]non-5-ene）、DBU（1,8-diazabicyclo[5.4.0]undec-7-ene）、DBU之2-乙基己烷酸鹽、DBU之酚鹽、DBU之p-甲苯磺酸鹽、U-CAT SA 102（San-Apro公司製：DBU之辛基酸鹽）、DBU之甲酸鹽等之DBU-有機酸鹽、參（二甲基胺基甲基）酚（TAP）等。 [0083] 作為在本發明之硬化劑及硬化促進劑的二甲基脲化合物之具體例，可列舉DCMU（3-（3,4-二氯苯基）-1,1-二甲基脲）、U-CAT3512T（San-Apro公司製）等之芳香族二甲基脲、U-CAT3503N（San-Apro公司製）等之脂肪族二甲基脲等。其中從硬化性的點來看，較佳為使用芳香族二甲基脲。 [0084] 作為在本發明之硬化劑及硬化促進劑的胺加成物化合物，例如可列舉藉由於中途停止對環氧樹脂之3級胺的加成反應所得之環氧加成物化合物等。作為胺加成物系化合物之具體例，可列舉Amicure PN-23、Amicure MY-24、Amicure PN-D、Amicure MY-D、Amicure PN-H、Amicure MY-H、Amicure PN-31、Amicure PN-40、Amicure PN-40J（皆為Ajinomoto Fine Techno公司製）等。 [0085] 作為在本發明之硬化劑的有機酸二肼化合物之具體例，可列舉Amicure VDH-J、Amicure UDH、Amicure LDH（皆為Ajinomoto Fine Techno公司製）等。 [0086] 作為在本發明之硬化劑及硬化促進劑的有機膦化合物，例如可列舉三苯基膦、四苯基鏻四-p-甲苯基硼酸鹽、四苯基鏻四苯基硼酸鹽、三-tert-丁基鏻四苯基硼酸鹽、（4-甲基苯基）三苯基鏻硫氰酸鹽、四苯基鏻硫氰酸鹽、丁基三苯基鏻硫氰酸鹽、三苯基膦三苯基硼烷等。作為有機膦化合物之具體例，可列舉TPP、TPP-MK、TPP-K、TTBuP-K、TPP-SCN、TPP-S（北興化學工業公司製）等。 [0087] 作為在本發明之硬化劑的雙氰胺化合物，例如可列舉雙氰胺。作為雙氰胺化合物之具體例，可列舉雙氰胺微粉碎品之DICY7、DICY15（皆為三菱化學公司製）等。 [0088] 作為在本發明之硬化劑的1級･2級胺系化合物，例如可列舉脂肪族胺之二乙烯三胺、三乙烯四胺、四乙烯五胺、三甲基六亞甲基二胺、2-甲基五亞甲基二胺、1,3-雙胺基甲基環己烷、二丙烯二胺、二乙基胺基丙基胺、雙（4-胺基環己基）甲烷、降莰烯二胺、1,2-二胺基環己烷等、脂環式胺之N-胺基乙基哌嗪、1,4-雙（3-胺基丙基）哌嗪等、芳香族胺之二胺基二苯基甲烷、m-伸苯基二胺、m-二甲苯二胺、間伸苯基二胺、二胺基二苯基甲烷、二胺基二苯基碸、二乙基甲苯二胺等。作為1級･2級胺系化合物之具體例，可列舉Kayahard A-A（日本化藥公司製：4,4’-二胺基-3,3’-二甲基二苯基甲烷）等。 [0089] 在本發明之樹脂組成物，硬化劑的量相對於樹脂組成物的不揮發分全體，較佳為0.1～40質量%，更佳為0.5～38質量份，再更佳為1～35質量份。該量較0.1質量%更少時，有得不到充分之硬化性之虞，該量較40質量%更多時，有損害樹脂組成物之保存安定性之虞。尚，使用離子液體作為硬化劑時，從樹脂組成物之硬化物的水分遮斷性等之點來看，離子液體的量相對於樹脂組成物不揮發分全體，較佳為0.1～20質量%，更佳為0.5～18質量%，再更佳為1～15質量%。 [0090] 本發明之樹脂組成物包含硬化促進劑時，該量相對於樹脂組成物的不揮發分全體，較佳為0.05～10質量%，更佳為0.1～8質量%，再更佳為0.5～5質量%。該量未滿0.05質量%時，有硬化變遲緩增長熱硬化時間的傾向，超過10質量%時，變成有降低樹脂組成物之保存安定性的傾向。 [0091] 在本發明之熱硬化性樹脂組成物，較佳為組合硬化劑與硬化促進劑使用。作為硬化劑及硬化促進劑的組合，較佳為選自離子液體、酸酐化合物、咪唑化合物、3級胺系化合物、二甲基脲化合物及胺加成物化合物中之2種以上。 [0092] ＜（E）熱塑性樹脂＞ 從對密封層（即，樹脂組成物之硬化物）之可撓性的賦予、調製密封用薄片時之樹脂組成物清漆的塗佈性（防止皸裂）等的觀點來看，於本發明之樹脂組成物可含有熱塑性樹脂。作為熱塑性樹脂，例如可列舉苯氧基樹脂、聚乙烯基縮醛樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚醚碸樹脂、聚碸樹脂、聚酯樹脂、（甲基）丙烯酸系聚合物等。此等之熱塑性樹脂可僅使用1種，亦可併用2種以上。 [0093] 從對硬化樹脂組成物所得之密封層之可撓性的賦予、調製密封用薄片時之樹脂組成物清漆的塗佈性（防止皸裂）等的觀點來看，熱塑性樹脂之重量平均分子量較佳為15,000以上，更佳為20,000以上。惟，此重量平均分子量過大時，由於有降低熱塑性樹脂與熱硬化性樹脂（尤其是環氧樹脂）的相溶性等之傾向。因此，此重量平均分子量較佳為1,000,000以下，更佳為800,000以下。 [0094] 在本發明之重量平均分子量係以凝膠滲透層析（GPC）法（聚苯乙烯換算）測定。藉由GPC法之重量平均分子量，具體而言，使用島津製作所公司製LC-9A/RID-6A作為測定裝置，使用昭和電工公司製Shodex K-800P/K-804L/K-804L作為管柱，使用氯仿等作為移動等，在管柱溫度40℃測定，可使用標準聚苯乙烯之檢量線算出。 [0095] 熱塑性樹脂若樹脂組成物之硬化物的折射率如成為1.48～1.54般之熱塑性樹脂，則並未特別限定。熱硬化性樹脂之折射率低時，可為較上述樹脂組成物之硬化物的折射率更高之樹脂組成物之硬化物的折射率之熱塑性樹脂。熱塑性樹脂的折射率較佳為1.40～1.70，更佳為1.40～1.65。使用複數個熱塑性樹脂時，較佳為熱塑性樹脂之混合物全體的折射率為上述範圍內。 [0096] 作為熱塑性樹脂，較佳為與熱硬化性樹脂（尤其是環氧樹脂）的相溶性良好，可有利於作用在樹脂組成物之硬化物的水分遮斷性的提昇之苯氧基樹脂。 [0097] 苯氧基樹脂亦與環氧樹脂相同可具有環氧基。苯氧基樹脂之重量平均分子量較佳為10,000～500,000，更佳為20,000～300,000。 [0098] 作為適合之苯氧基樹脂，可列舉具有選自雙酚A骨架、雙酚F骨架、雙酚S骨架、雙酚苯乙酮骨架、酚醛清漆骨架、聯苯骨架、茀骨架、二環戊二烯骨架及降莰烯骨架中之1種以上的骨架者。苯氧基樹脂可使用1種或2種以上。 [0099] 作為苯氧基樹脂之市售品，例如可列舉YX7200B35（三菱化學公司製：含有聯苯骨架之苯氧基樹脂）、1256（三菱化學公司製：含有雙酚A骨架之苯氧基樹脂）、YX6954BH35（三菱化學公司製：含有雙酚苯乙酮骨架之苯氧基樹脂）等。 [0100] 含有本發明之樹脂組成物為熱塑性樹脂時，該量相對於樹脂組成物不揮發分全體，為0.1～60質量%，較佳為3～60質量%，更佳為5～50質量%。 [0101] ＜偶合劑＞ 本發明之樹脂組成物可含有偶合劑。作為偶合劑，可列舉矽烷偶合劑、鋁酸鹽偶合劑、鈦酸酯偶合劑。作為矽烷偶合劑，例如可列舉3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基（二甲氧基）甲基矽烷及2-（3,4-環氧環己基）乙基三甲氧基矽烷等之環氧系矽烷偶合劑；3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、3-巰基丙基甲基二甲氧基矽烷及11-巰基十一烷基三甲氧基矽烷等之巰基系矽烷偶合劑；3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-胺基丙基二甲氧基甲基矽烷、N-苯基-3-胺基丙基三甲氧基矽烷、N-甲基胺基丙基三甲氧基矽烷、N-（2-胺基乙基）-3-胺基丙基三甲氧基矽烷及N-（2-胺基乙基）-3-胺基丙基二甲氧基甲基矽烷等之胺基系矽烷偶合劑；3-脲基丙基三乙氧基矽烷等之脲基系矽烷偶合劑；乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷及乙烯基甲基二乙氧基矽烷等之乙烯基系矽烷偶合劑；p-苯乙烯基三甲氧基矽烷等之苯乙烯基系矽烷偶合劑；3-丙烯醯氧基丙基三甲氧基矽烷及3-甲基丙烯醯氧基丙基三甲氧基矽烷等之丙烯酸酯系矽烷偶合劑；3-異氰酸酯丙基三甲氧基矽烷等之異氰酸酯系矽烷偶合劑；雙（三乙氧基矽烷基丙基）二硫化物、雙（三乙氧基矽烷基丙基）四硫化物等之硫化物系矽烷偶合劑；苯基三甲氧基矽烷、甲基丙烯醯氧基（Methacryloxy）丙基三甲氧基矽烷、咪唑矽烷、三嗪矽烷等。此等當中，較佳為乙烯基系矽烷偶合劑、環氧系矽烷偶合劑，特佳為環氧系矽烷偶合劑。作為鋁酸鹽偶合劑，例如可列舉烷基乙醯乙酸鹽二異丙酸鋁（例如「PLENACT AL-M」Ajinomoto Fine Techno公司製）。作為鈦酸酯系偶合劑之具體例，可列舉PLENACT TTS、PLENACT 46B、PLENACT 55、PLENACT 41B、PLENACT 38S、PLENACT 138S、PLENACT 238S、PLENACT 338X、PLENACT 44、PLENACT 9SA（皆為Ajinomoto Fine Techno公司製）等。偶合劑可使用1種或2種以上。 [0102] 在本發明之樹脂組成物之偶合劑的量相對於樹脂組成物的不揮發分全體，較佳為0～15質量%，更佳為0.5～10質量%。 [0103] ＜無機填充材＞ 本發明之樹脂組成物中，從樹脂組成物之硬化物的水分遮斷性、調製封裝薄片時之樹脂組成物清漆的塗佈性（防止皸裂）等的觀點來看，於發揮本發明的效果的範圍，可進一步含有半燒成水滑石以外之無機填充材。作為如此之無機填充材，除了上述之未燒成水滑石及燒成水滑石之外，例如可列舉滑石、二氧化矽、氧化鋁、硫酸鋇、黏土、雲母、氫氧化鋁、氫氧化鎂、碳酸鈣、碳酸鎂、氮化硼、硼酸鋁、鈦酸鋇、鈦酸鍶、鈦酸鈣、鈦酸鎂、鈦酸鉍、氧化鈦、氧化鋯、鋯酸鋇、鋯酸鈣、矽酸鹽等。無機填充材可使用1種或2種以上。尚，無機填充材之一次粒子之粒徑較佳為5μm以下，更佳為3μm以下。例如，可使用一次粒子之粒徑為0.001～3μm者，更佳為0.005～2μm者。 [0104] 無機填充材的粒子形態並未特別限定，可使用略球狀、直方體狀、板狀、如纖維之直線形狀、分枝之分支形狀。無機填充材較佳為滑石、二氧化矽、沸石、氧化鈦、氧化鋁、氧化鋯、矽酸鹽、雲母、氫氧化鎂、氫氧化鋁等，更佳為滑石、二氧化矽，特佳為滑石。作為二氧化矽，較佳為無定形二氧化矽、熔融二氧化矽、結晶二氧化矽、合成二氧化矽濕式二氧化矽、乾式二氧化矽、膠態二氧化矽（水分散型、有機溶劑分散型、氣相二氧化矽等），從難以沉澱、沉降、與樹脂之複合化容易的觀點來看，特佳為有機溶劑分散型膠態二氧化矽（有機二氧化矽溶膠）。 [0105] 無機填充材可使用市售品。作為滑石之例，可列舉日本滑石公司製「FG-15」（平均粒徑1.4μm）、「D-1000」（平均粒徑1.0μm）、「D-600」（平均粒徑0.6μm）等。作為被市售之球狀熔融二氧化矽之例，可列舉Admatechs公司製之真球二氧化矽「Adma fine系列」（「SO-C2；平均粒徑0.5μm」、「SC2500-SQ；平均粒子徑0.5μm、矽烷偶合處理」等）等。作為發煙二氧化矽之例，可列舉日本Aerosil（股）製之「Aerosil系列」（「A-200：一次粒子徑5～40nm」等）等。作為有機溶劑分散型膠態二氧化矽之例，可列舉日產化學工業公司製「MEK-EC-2130Y」（非晶二氧化矽粒徑10～15nm、不揮發分30質量%、MEK溶劑）、日產化學工業公司製「PGM-AC-2140Y」（二氧化矽粒徑10～15nm、不揮發分40質量%、PGM（丙二醇單甲基醚）溶劑）、日產化學工業公司製「MIBK-ST」（二氧化矽粒徑10～15nm、不揮發分30質量%、MIBK（甲基異丁基酮）溶劑）、扶桑化學工業公司製膠體狀二氧化矽溶膠「PL-2L-MEK」（二氧化矽粒徑15～20nm、不揮發分20質量%、MEK（甲基乙基酮）溶劑）等。 [0106] 半燒成水滑石以外之無機填充材的量，從樹脂組成物之硬化物的水分遮蔽性等的觀點來看，相對於樹脂組成物之不揮發分全體，較佳為0～30質量%，更佳為0～25質量%。 [0107] 為了提昇樹脂組成物之硬化物的水分遮蔽性及透過率等，可於本發明之樹脂組成物摻合二氧化矽。摻合二氧化矽時，該量相對於樹脂組成物之不揮發分全體，較佳為0.1～10質量%。二氧化矽的量過多時，成為有降低密著性的傾向。 [0108] 為了提昇樹脂組成物之硬化物的耐濕性及密著性等，可於本發明之樹脂組成物摻合滑石。摻合滑石時，該量相對於樹脂組成物的不揮發分全體，較佳為0.01～30質量%，更佳為0.1～20質量%，再更佳為0.5～10質量%。滑石的量過少時，有難以發揮藉由滑石之耐濕性及密著性提昇的效果的傾向，滑石的量過多時，成為有透明性惡化的傾向。 [0109] ＜其他添加劑＞ 本發明之樹脂組成物若為發揮本發明的效果的範圍，可進一步含有與上述之成分不同之其他添加劑。作為如此之添加劑，例如可列舉橡膠粒子、矽氧粉末、尼龍粉末、氟樹脂粉末等之有機填充材；Orben、Penton等之增黏劑；矽氧系、氟系、高分子系之消泡劑或整平劑；三唑化合物、噻唑化合物、三嗪化合物、卟啉化合物等之密著性賦予劑；等。 [0110] ＜折射率＞ 在本發明，固形樹脂（例如固形環氧樹脂、苯氧基樹脂等）之折射率及樹脂組成物之硬化物的折射率，皆為於25℃之波長594nm的光之折射率，根據棱鏡耦合器法之測定值。詳細而言，可藉由棱鏡耦合器法，藉由測定折射率已知之棱鏡、與在和該棱鏡接觸之試料的界面之臨界角，測定試料之折射率。作為棱鏡耦合器法之測定裝置，例如可使用Metricon公司製棱鏡耦合器（模型2010/M）。測定包含溶劑之溶液狀的固形樹脂或苯氧基樹脂等之折射率時，將於玻璃支持體之上以均勻之膜厚塗佈，在熱循環式烤箱等使足夠溶劑量揮發者用在測定。液狀樹脂（例如液狀環氧樹脂等）之折射率係根據使用於25℃之多波長阿貝折射率計的測定法之測定值。作為多波長阿貝折射率計，例如可使用Atago公司製DR-M2。 [0111] ＜硬化物層之平行線透過率＞ 在本發明，較佳為厚度為20μm之樹脂組成物的硬化物層於D65光之平行線透過率為80～100%。如此之硬化物層在目視可認定為透明。 [0112] 本發明之樹脂組成物藉由適當採用上述之較佳的條件，可輕易地形成平行線透過率優異之樹脂組成物的硬化物（密封層）。厚度為20μm之樹脂組成物的硬化物層（密封層）於D65光之平行線透過率較佳為80～100%，更佳為85～100%。硬化物於D65光之平行線透過率如後述之實施例所記載的方式進行，形成於玻璃板之間挾持樹脂組成物之硬化物的層合體，藉由將空氣作為參考算出。尚，上述之於D65光之平行線透過率的值，雖為厚度為20μm之樹脂組成物的硬化物層之測定值，但硬化物層的厚度一般為3～200μm。 [0113] ＜樹脂組成物之製造方法＞ 硬化物之折射率為1.48～1.54之本發明之樹脂組成物，可藉由使用具有與前述折射率為相同程度折射率之成分，或摻合更低折射率之樹脂與高折射率之樹脂而將樹脂全體之折射率調整在上述範圍，而製得。可藉由將如此之成分及視必要之有機溶劑等使用混練輥或回轉混合機等進行混合，製造本發明之樹脂組成物。 [0114] ＜用途＞ 本發明之樹脂組成物及後述之密封用薄片，例如係被使用在半導體、太陽能電池、高亮度LED、LCD、EL元件等之電子零件，較佳為有機EL元件、太陽能電池等之光學半導體的密封。本發明之樹脂組成物及密封用薄片，尤其是適合被使用在有機EL元件的密封。具體而言，為了適用在有機EL元件之發光部的上部及/或周圍（側部），且將有機EL元件之發光部從外部保護，可使用本發明之樹脂組成物及密封用薄片。 [0115] 可藉由將本發明之樹脂組成物接塗佈在密封對象物，硬化其塗膜，來形成密封層。又，可藉由於支持體上製作形成本發明之樹脂組成物的層之密封用薄片，將密封用薄片層壓在密封對象物的必要地點，將樹脂組成物層轉印在被覆對象物，進行硬化，來形成密封層。 [0116] ＜密封用薄片＞ 本發明之樹脂組成物的層形成在支持體上而成之密封用薄片，可藉由本發明領域具有通常知識者所周知之方法，例如調製樹脂組成物溶解在有機溶劑之樹脂組成物清漆，將該清漆塗佈在支持體上，進而藉由加熱、或熱風吹附等乾燥所塗佈之該清漆，來形成樹脂組成物層而製得。 [0117] 作為密封用薄片所使用之支持體，可列舉聚乙烯、聚丙烯、聚氯化乙烯基等之聚烯烴、環烯烴聚合物、聚對苯二甲酸乙二酯（以下有時稱為「PET」）、聚萘二甲酸乙二酯等之聚酯、聚碳酸酯、聚醯亞胺等之塑膠薄膜。作為塑膠薄膜，尤其是以PET較佳。又支持體可為鋁箔、不銹鋼箔、銅箔等之金屬箔。支持體除了消光處理、電暈處理之外，亦可實施脫模處理。作為脫模處理，例如可列舉藉由矽氧樹脂系脫模劑、醇酸樹脂系脫模劑、氟樹脂系脫模劑等之脫模劑的脫模處理。 [0118] 為了提昇密封用薄片之防濕性，可將具有阻隔層之塑膠薄膜作為支持體使用。作為此阻隔層，例如可列舉氮化矽等之氮化物、氧化鋁等之氧化物、不銹鋼箔、鋁箔之金屬箔等。作為塑膠薄膜，可列舉上述之塑膠薄膜。具有阻隔層之塑膠薄膜可使用市售品。又，可為複合層壓金屬箔與塑膠薄膜之薄膜。例如作為附鋁箔之聚對苯二甲酸乙二酯薄膜之市售品，可列舉東海東洋鋁業銷售公司製「附PET之AL1N30」、福田金屬公司製「附PET之AL3025」、PANAC公司製「Alpet」等。 [0119] 支持體中，可實施藉由矽氧樹脂系脫模劑、醇酸樹脂系脫模劑、氟樹脂系脫模劑等之脫模處理、消光處理、電暈處理等。在本發明，支持體具有脫模層時，該脫模層亦可看作支持體的一部分。支持體的厚度雖並未特別限定，但從操作性等的觀點來看，較佳為20～200μm，更佳為20～125μm。 [0120] 作為有機溶劑，例如可列舉丙酮、甲基乙基酮（以下亦簡稱為「MEK」）、環己酮等之酮類、乙酸乙酯、乙酸丁酯、溶纖劑乙酸鹽、丙二醇單甲基醚乙酸鹽、卡必醇乙酸鹽等之乙酸酯類、溶纖劑、丁基卡必醇等之卡必醇類、甲苯、二甲苯等之芳香族烴類、二甲基甲醯胺、二甲基乙醯醯胺、N-甲基吡咯烷酮等。有機溶劑可單獨使用任一種，亦可組合2種以上使用。 [0121] 乾燥條件雖並未特別限制，但通常適合於50～100℃左右為3～15分鐘左右。 [0122] 乾燥後之樹脂組成物層的厚度通常為3μm～200μm，較佳為5μm～100μm，再更佳為5μm～50μm的範圍。 [0123] 樹脂組成物層可用保護薄膜保護。藉由以保護薄膜保護，可防止對樹脂組成物層表面之塵埃等之附著或傷痕。保護薄膜較佳為使用與支持體相同之塑膠薄膜。又，保護薄膜除了消光處理、電暈處理之外，亦可實施脫模處理。保護薄膜的厚度雖並未特別限制，但通常為1～150μm，較佳為10～100μm的範圍。 [0124] 密封用薄片若於支持體使用具有防濕性，且透過率高之支持體，可藉由將密封用薄片層壓在密封對象物之必要地點，直接硬化樹脂組成物層形成密封層，形成具備高耐濕性之密封構造。作為具有如此之防濕性，且透過率高之支持體，可列舉於表面蒸鍍氧化矽（二氧化矽）、氮化矽、SiCN、非晶矽等之無機物之塑膠薄膜等。作為塑膠薄膜，例如可列舉聚乙烯、聚丙烯、聚氯化乙烯基等之聚烯烴、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯等之聚酯、聚碳酸酯、聚醯亞胺等。作為塑膠薄膜，尤其是以PET較佳。作為被市售之具有防濕性的塑膠薄膜之例，可列舉TECHBARRIER HX、AX、LX、L系列（三菱樹脂公司製）或進而提高防濕效果之X-BARRIER（三菱樹脂公司製）等。作為支持體，可使用具有2層以上之複層構造者。 [0125] ＜有機EL裝置＞ 以本發明之樹脂組成物的硬化物製造密封有機EL元件之有機EL裝置等時，適合使用上述密封用薄片進行密封。亦即，密封用薄片係樹脂組成物層以保護薄膜保護時，將此剝離後，將密封用薄片該樹脂組成物層直接與密封對象物（例如有機EL元件形成基板上之有機EL元件等）接觸的方式進行層壓。層壓之方法可為批量式亦可為以輥之連續式。層壓後，剝離支持體，進行後述之樹脂組成物層的熱硬化作業。密封用薄片之支持體為具有防濕性之支持體時，層壓密封用薄片後，未剝離支持體直接進行後述之樹脂組成物層的熱硬化作業。 [0126] 樹脂組成物層之硬化通常藉由熱硬化進行。作為該手段，例如可列舉藉由熱風循環式烤箱、紅外線加熱器、熱槍、高頻感應加熱裝置、加熱工具之壓著的加熱等。從可將硬化之樹脂組成物層（密封層）以充分滿足之接著強度接著在密封對象物的觀點來看，硬化溫度較佳為50℃以上，更佳為55℃以上，硬化時間較佳為10分鐘以上，更佳為20分鐘以上。 ［實施例］ [0127] 以下，雖將本發明藉由實施例具體說明，但本發明並非被限定於此等之實施例者。尚，在以下之記載，除非另有說明，透過率以外之濃度、吸水率等之單位即「%」及摻合量之單位即「份」分別係意指「質量%」及「質量份」。尚，作為水滑石，全部使用市售之水滑石。 [0128] ＜合成例1＞離子液體硬化劑之合成 將離子液體硬化劑之N-乙醯甘胺酸四丁基鏻鹽在以下之順序合成。對於41.4%之四丁基鏻氫氧化物水溶液（北興化學工業公司製）20.0g，在0℃加入N-乙醯甘胺酸（東京化成工業公司製）3.54g攪拌10分鐘。攪拌後，使用蒸發器以40～50mmHg的壓力在60～80℃2小時，在90℃5小時濃縮反應溶液。將所得之濃縮物在室溫溶解在乙酸乙酯（純正化學公司製）14.2ml來調製溶液，將所得之溶液使用蒸發器以40～50mmHg的壓力，在70～90℃濃縮3小時，而得到作為油狀化合物之N-乙醯甘胺酸四丁基鏻鹽11.7g（純度：96.9%）。 [0129] ＜實施例1＞ 混練液狀氫化雙酚A型環氧樹脂（三菱化學公司製「YX8000」、環氧當量：約205）60份、與市售之水滑石A（半燒成水滑石、BET比表面積：13m2
/g、平均粒子徑：400nm）40份後，在3輥磨機進行分散，而得到混合物。於將硬化促進劑（San-Apro公司製「U-CAT3512T」）1.5份溶解在苯氧基樹脂溶液（三菱化學公司製「YX7200B35」、溶劑：MEK、不揮發分：35%）114.3份（樹脂40份）之混合物，摻合先已調製之混合物、與離子液體硬化劑（N-乙醯甘胺酸四丁基鏻鹽）3份，以高速回轉混合機進行均勻分散，而得到樹脂組成物清漆。 [0130] 其次，將樹脂組成物清漆於支持體（以矽氧系脫模劑處理之聚對苯二甲酸乙二酯薄膜、厚度38μm、以下簡稱為「脫模PET薄膜」）上，以乾燥後之樹脂組成物層的厚度成為20μm的方式在模塗機進行均勻塗佈，以80℃乾燥5分鐘後，於樹脂組成物層的表面載上脫模PET薄膜作為保護薄膜，而得到密封用薄片。 [0131] ＜實施例2＞ 除了取代水滑石A改使用市售之水滑石B（半燒成水滑石、BET比表面積：15m2
/g、平均粒子徑：400nm）之外，其他與實施例1同樣進行，製造樹脂組成物清漆，而得到密封用薄片。 [0132] ＜實施例3＞ 除了取代苯氧基樹脂溶液（114.3份） 改使用固形氫化雙酚A型環氧樹脂（三菱化學公司製「YX8040」、環氧當量：約1000）之溶液（溶劑：MEK、不揮發分：40%）100份（樹脂40份）之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0133] ＜實施例4＞ 除了取代硬化促進劑（San-Apro公司製「U-CAT3512T」）1.5份改使用咪唑硬化劑（四國化成公司製「1B2MZ」）2份之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0134] ＜實施例5＞ 混練液狀氫化雙酚A型環氧樹脂（三菱化學公司製「YX8000」、環氧當量：約205）30份、與酸酐硬化劑（新日本理化公司製「MH-700」）30份、市售之水滑石B（BET比表面積：13m2
/g、平均粒子徑：400nm）40份後，在3輥磨機進行分散，而得到混合物。於固形氫化雙酚A型環氧樹脂（三菱化學公司製「YX8040」、環氧當量：約1000）之溶液（溶劑：MEK、不揮發分：40%）100份（樹脂40份）中，將藉由先已調製之3輥磨機分散之混合物、與DBU-辛基酸鹽硬化促進劑（San-Apro公司製「U-CAT SA102」）2份以高速回轉混合機進行均勻分散，而得到樹脂組成物清漆。 除了使用所得之樹脂組成物清漆之外，其他與實施例1同樣進行，而得到密封用薄片。 [0135] ＜實施例6＞ 除了將苯氧基樹脂溶液（三菱化學公司製「YX7200B35」、溶劑：MEK、不揮發分：35%）的使用量改為57.2份（樹脂20份），進而使用固形氫化雙酚A型環氧樹脂（三菱化學公司製「YX8040」）之溶液（溶劑：MEK、不揮發分：40%）50份（樹脂20份）之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0136] ＜實施例7＞ 除了將苯氧基樹脂溶液（三菱化學公司製「YX7200B35」、溶劑：MEK、不揮發分：35%）的使用量改為85.7份（樹脂30份），進而使用液狀雙酚A型環氧樹脂及液狀雙酚F型環氧樹脂之混合物（新日鐵化學工業公司製「ZX-1059」、環氧當量：約165）10份之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0137] ＜比較例1＞ 除了取代液狀氫化雙酚A型環氧樹脂改使用液狀雙酚A型環氧樹脂及液狀雙酚F型環氧樹脂之混合物（新日鐵化學工業公司製「ZX-1059」）60份之外，其他與實施例2同樣進行，製造樹脂組成物清漆，與實施例1同樣進行，而得到密封用薄片。 [0138] ＜比較例2＞ 除了取代水滑石A改使用市售之水滑石C（燒成水滑石、平均粒子徑：400nm）40份之外，其他與實施例1同樣進行，製造樹脂組成物清漆，而得到密封用薄片。 [0139] ＜比較例3＞ 除了取代水滑石A改使用市售之水滑石D（未燒成水滑石、平均粒子徑：400nm）40份之外，其他與實施例1同樣進行，製造樹脂組成物清漆，而得到密封用薄片。 [0140] ＜水滑石之吸水率＞ 將各水滑石在天秤量取1.5g，測定初期質量。大氣壓下於設定在60℃、90%RH（相對濕度）之小型環境試驗器（Espec公司製 SH-222）靜置200小時，測定吸濕後之質量，使用上述式（i）求得飽和吸水率。將結果示於表1。 [0141] ＜水滑石之熱重量減少率＞ 使用日立高科技公司製TG/DTA EXSTAR6300，進行各水滑石之熱重量分析。於鋁製之樣品盤秤量10mg之水滑石，以未覆蓋之開放的狀態，於氮流量200mL/分鐘的環境下，從30℃至550℃以昇溫速度10℃/分鐘昇溫。使用上述式（ii），求得在280℃及380℃之熱重量減少率。將結果示於表1。 [0142] ＜粉末X光繞射＞ 粉末X光繞射之測定係藉由粉末X光繞射裝置（PANalytical公司製,Empyrean），以對陰極CuKα（1.5405Å）、電壓：45V、電流：40mA、取樣寬度：0.0260˚、掃描速度：0.0657˚/s、測定繞射角範圍（2θ）：5.0131～79.9711˚的條件進行。峰值搜尋係利用繞射裝置附屬之軟體的峰值搜尋功能，以「最小顯著度：0.50、最小峰值晶片：0.01˚、最大峰值晶片：1.00˚、峰值基底寬度：2.00˚、方法：2次微分之最小值」的條件進行。檢出於2θ為8～18˚的範圍內出現之分裂的二個峰值，或藉由二個峰值之合成而具有肩部之峰值，測定低角側所出現之峰值或肩部之繞射強度（=低角側繞射強度）、與高角側所出現之峰值或肩部之繞射強度（=高角側繞射強度），算出相對強度比（=低角側繞射強度/高角側繞射強度）。將結果示於表1。 [0143][0144] 由飽和吸水率、熱重量減少率及粉末X光繞射的結果，水滑石A、水滑石B、水滑石E及水滑石F為「半燒成水滑石」，水滑石C為「燒成水滑石」，水滑石D為「未燒成水滑石」。 [0145] ＜樹脂組成物之硬化物的折射率＞ 將於實施例及比較例製得之密封用薄片切成長度70mm及寬度25mm，從經切斷之密封用薄片剝離保護薄膜（脫模PET薄膜），將該密封用薄片於玻璃板（長度76mm、寬度26mm及厚度1.2mm之顯微鏡載玻片、松浪玻璃工業公司製白載玻片S1112 緣磨No.2）使用批式真空層壓機（Nichigo-Morton公司製、V-160）層壓。層壓條件為溫度80℃、減壓時間30秒之後，在壓力0.3MPa加壓30秒。然後，剝離密封用薄片之支持體（脫模PET薄膜），以熱循環式烤箱130℃熱硬化60分鐘，而得到樹脂組成物之硬化物層與玻璃的層合體即評估用樣品。 [0146] 使用Metricon公司製棱鏡耦合器（模型2010/M），使用波長594nm之雷射光，進行折射率測定。由空氣壓傳動 式偶合頭於裝置內之棱鏡，與前述評估用樣品之硬化物層的表面接觸，設置評估用樣品。邊照射雷射邊使棱鏡與樣品的角度變更，進行全反射，光檢出器所導入之雷射光在被稱為模式角度之值，從空氣相對樣品內部進行傳播，到達檢出器之雷射光的光強度最初急遽下降，確認進行光傳搬模式之位置（dip），藉此決定折射率。將結果示於表2。 [0147] ＜樹脂組成物之硬化物的平行線透過率＞ 將於實施例及比較例製得之密封用薄片切成長度70mm及寬度25mm，從經切斷之密封用薄片剝離保護薄膜（脫模PET薄膜），將該密封用薄片於玻璃板（長度76mm、寬度26mm及厚度1.2mm之顯微鏡載玻片、松浪玻璃工業公司製白載玻片S1112 緣磨No.2）使用批式真空層壓機（Nichigo-Morton公司製、V-160）層壓。層壓條件為溫度80℃、減壓時間30秒之後，在壓力0.3MPa加壓30秒。然後，剝離密封用薄片之支持體（脫模PET薄膜），於經曝露之樹脂組成物層上，進而與上述相同層壓玻璃板，製作層合體。將所得之層合體以熱循環式烤箱130℃加熱60分鐘，於玻璃板之間得到具有樹脂組成物之硬化物的層合體（評估用樣品、硬化物之厚度：20μm）。 [0148] 使用Suga試驗機公司製霧度計 HZ-V3（鹵素燈），將空氣作為參考，在D65光測定評估用樣品之平行線透過率Tp（%），用以下之基準評估。將結果示於表2。 （平行線透過率之基準） 佳（○）：85%以上 可（△）：未滿85%、80%以上 不佳（×）：未滿80% [0149] ＜發光面積減少開始時間＞ 除了使用鋁箔/PET複合薄膜「附PET之AL1N30」（鋁箔：30μm、PET：25μm、：東海東洋鋁業銷售公司製）作為支持體之外，其他與各實施例及比較例同樣進行，而得到具有與各實施例及比較例相同之樹脂組成物層之密封用薄片。 [0150] 將無鹼玻璃50mm×50mm平方以經煮沸之異丙醇洗淨5分鐘，在150℃乾燥30分鐘以上。使用該玻璃，使用將來自端部之距離定為3mm之遮罩，蒸鍍鈣膜（純度99.8%）（厚度300nm）。於手套盒內，將蒸鍍鈣膜之無鹼玻璃、與具有和各實施例及比較例相同之樹脂組成物層之密封用薄片以熱層壓機（Fujipura公司製 Rami Packer DAiSY A4（LPD2325））貼合，來調製層合體。將所得之層合體以溫度130℃加熱60分鐘，硬化樹脂組成物層，而得到評估用樣品。 [0151] 鈣與水接觸成為氧化鈣時變成透明。因此，對評估用樣品之水分侵入，可藉由測定從評估用樣品之端部至鈣膜為止的距離（mm）進行評估。因此，將包含鈣膜之評估用樣品作為包含有機EL元件之有機EL裝置的模型使用。 [0152] 首先，將從評估用樣品之端部至鈣膜為止的距離藉由三豐公司製 Measuring Microscope MF-U測定，將此值定為X2。 [0153] 其次，於設定在溫度85℃及濕度85%RH之恆溫恆濕槽投入評估用樣品。對恆溫恆濕槽之投入後之從評估用樣品之端部至鈣膜為止的密封距離X1（mm），以較對恆溫恆濕槽之投入前之從評估用樣品之端部至鈣膜為止的密封距離X2（mm）增加0.1mm的時間，將評估用樣品從恆溫恆濕槽取出，將該時間作為減少開始時間t（時間）。 [0154] 根據以下之菲克（Fick）的擴散式，算出定數K。 X1=K√t （式中，X1為對恆溫恆濕槽之投入後之從評估用樣品之端部至鈣膜為止的密封距離（mm），t為成為X1=X2+0.1之減少開始時間（時間），X2為對恆溫恆濕槽之投入前之從評估用樣品之端部至鈣膜為止的密封距離（mm））。 [0155] 使用所得之K，將X1成為5mm之值的時間作為發光面積減少開始時間算出，以下述基準評估。水分遮斷性越高越能遲緩水分之侵入速度，此發光面積減少開始時間增長。將結果示於表2。尚，表2所記載之單位之「h」係意指「小時」。 （發光面積減少開始時間之基準） 佳（○）：300小時以上 可（△）：未滿300小時、200小時以上 不佳（×）：未滿200小時 [0156] 於表2，除了於實施例及比較例所得之硬化物的折射率等之結果之外，亦記載使用之成分的種類及量。 [0157]［產業上之可利用性］ [0158] 根據本發明之密封用樹脂組成物，可形成水分遮斷性及透明性雙方優異之密封層。因此，本發明之密封用樹脂組成物及密封用薄片可適合使用在有機EL元件等之對水分較弱之元件的密封。 [0159] 本案係以日本申請之日本特願2016-196395號作為基礎，其內容全部包含在本案說明書。<Resin Composition> The resin composition for sealing according to the present invention is a resin composition comprising (A) a thermosetting resin, (B) a semi-baked hydrotalcite, and (C) a curing agent, which is characterized by The cured product of the resin composition has a refractive index of 1.48 to 1.54. The refractive index of the cured product is preferably from 1.49 to 1.54, more preferably from 1.50 to 1.54, still more preferably from 1.50 to 1.53, which is the same as the refractive index of the semi-fired hydrotalcite. <(A) Thermosetting Resin> In the present invention, the cured product of the resin composition has a refractive index of 1.48 to 1.54 as a thermosetting resin. It is preferable that the refractive index is a thermosetting resin such as 1.49 to 1.54, more preferably a thermosetting resin having a refractive index of 1.50 to 1.54, and even more preferably the refractive index is as a semi-baked water. The refractive index of the talc is a thermosetting resin of the same degree as 1.50 to 1.53. [0011] The refractive index of the cured product of the resin composition can be adjusted by a thermosetting resin or other components such as a thermoplastic resin or the like. In order to facilitate the adjustment of the refractive index of the cured product, the (A) thermosetting resin preferably contains a thermosetting resin having a refractive index of 1.48 to 1.54. The refractive index of the thermosetting resin is more preferably from 1.49 to 1.54, still more preferably from 1.50 to 1.54. [0012] The content of the thermosetting resin having a refractive index of 1.48 to 1.54 is not particularly limited as long as the refractive index of the cured product of the resin composition is in the range of 1.48 to 1.54, but is relative to (A) the thermosetting resin. The whole is preferably 50 to 100% by mass, more preferably 60 to 100% by mass, still more preferably 70 to 100% by mass. The refractive index of the entire thermosetting resin (A) used in the present invention is preferably from 1.48 to 1.54, more preferably from 1.49 to 1.54, still more preferably from 1.50 to 1.54. When a plurality of thermosetting resins are used, it is preferred that the refractive index of the entire mixture is within the above range. [0014] The thermosetting resin is not particularly limited as long as the refractive index of the cured product of the resin composition is 1.48 to 1.54, and examples thereof include an epoxy resin and a cyanate resin. The phenol resin, the bismaleimide-triazine resin, the polyimine resin, the acrylic resin, the vinyl benzyl resin, etc., from the viewpoint of low-temperature curability and the like, an epoxy resin is preferable. [0015] The epoxy resin is not particularly limited as long as the refractive index of the cured product of the resin composition is from 1.48 to 1.54. As such an epoxy resin, an average of two or more epoxy groups per molecule and a high transmittance can be used. Examples thereof include hydrogenated epoxy resins (hydrogenated bisphenol A type epoxy resins, hydrogenated bisphenol F type epoxy resins, etc.), fluorine-containing epoxy resins, chain aliphatic epoxy resins, and cyclic aliphatic rings. Oxygen resin, bisphenol A type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, bisphenol F Epoxy resin, phosphorus-containing epoxy resin, bisphenol S-type epoxy resin, aromatic epoxy propylamine epoxy resin (for example, tetra-epoxypropyldiaminediphenylmethane, triepoxypropane) Base-p-aminophenol, toluidine, diepoxypropyl aniline, etc., alicyclic epoxy resin, phenol novolac epoxy resin, alkylphenol epoxy resin , cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, epoxy resin with butadiene structure, diepoxypropyl etherate of bisphenol, diepoxypropyl group of naphthalenediol An ether compound, a diglycidyl propyl ether compound of a phenol, a diepoxypropyl ether compound of an alcohol, an alkyl substituent of the epoxy resin, etc.[0016] The epoxy resin may be used alone or in combination of two or more. The epoxy equivalent of the epoxy resin is preferably from 50 to 5,000, more preferably from 50 to 3,000, still more preferably from 80 to 2,000, even more preferably from 100 to 1,500, from the viewpoint of reactivity and the like. Further, the "epoxy equivalent" is a gram (g/eq) of a resin containing 1 gram equivalent of an epoxy group, and is measured in accordance with the method specified in JIS K 7236. The weight average molecular weight of the epoxy resin is preferably 5,000 or less. [0017] The epoxy resin may be either liquid or solid, and a liquid epoxy resin and a solid epoxy resin may be used in combination. Here, the "liquid" and "solid" are in the state of an epoxy resin at normal temperature (25 ° C) and normal pressure (1 atm). From the viewpoints of coatability, workability, and adhesion, it is preferred that 10% by mass or more of the entire epoxy resin to be used is a liquid epoxy resin. From the viewpoint of the kneading property with the hydrotalcite and the viscosity of the varnish, it is particularly preferable to use a liquid epoxy resin and a solid epoxy resin. The mass ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin: solid epoxy resin) is preferably from 1:2 to 1:0, more preferably from 1:1.5 to 1:0. [0018] In one aspect of the invention, the (A) thermosetting resin is preferably selected from the group consisting of hydrogenated epoxy resins, fluorine-containing epoxy resins, and chain chains, in addition to the refractive index of 1.48 to 1.54. One or more of an aliphatic epoxy resin, a cyclic aliphatic epoxy resin, and an alkylphenol epoxy resin, more preferably selected from hydrogenated epoxy resins, fluorine-containing epoxy resins, and chain aliphatic groups One or more of the epoxy resin and the cyclic aliphatic epoxy resin. By using the above resin, a cured product having high transparency can be obtained. [0019] The term "hydrogenated epoxy resin" means an epoxy resin obtained by hydrogenating an epoxy resin containing an aromatic ring. The hydrogenation ratio of the hydrogenated epoxy resin is preferably 50% or more, more preferably 70% or more. The "chain aliphatic epoxy resin" means an epoxy resin having a linear or branched alkyl chain or an alkyl ether chain, and is a "cyclic aliphatic epoxy resin". It means a cyclic aliphatic skeleton in the molecule, such as an epoxy resin having a cycloalkane skeleton. The "alkylphenol type epoxy resin" means a benzene ring skeleton having one or more alkyl groups and one or more hydroxyl groups as a substituent, and the epoxy group is converted into a epoxy propyl ether group. . [0020] The hydrogenated epoxy resin is preferably a hydrogenated bisphenol A type epoxy resin or a hydrogenated bisphenol F type epoxy resin. Further, as long as the refractive index of the cured product of the resin composition satisfies the above specific numerical range, or the refractive index of the entire thermosetting resin satisfies the above specific numerical range, the epoxy resin other than the above-mentioned suitable epoxy resin may be contained in In thermosetting resin. [0021] The hydrogenated bisphenol A type epoxy resin is, for example, a liquid hydrogenated bisphenol A type epoxy resin (for example, "YX8000" (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205), "Denacol EX-252" (Nagase ChemteX, epoxy equivalent: about 213)), a solid hydrogenated bisphenol A type epoxy resin (for example, "YX8040" (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 1000)). [0022] As the epoxy resin containing fluorine, for example, a fluorine-containing epoxy resin described in WO2011/089947 can be used. [0023] Examples of the chain-like aliphatic epoxy resin include polyglycerol polyepoxypropyl ether (for example, "Denacol EX-512", "Denacol EX-521", manufactured by Nagase ChemteX Co., Ltd.), and pentaerythritol polyepoxy A propyl ether (for example, "Denacol EX-411", manufactured by Nagase ChemteX Co., Ltd.), diglycerol polyepoxypropyl ether (for example, "Denacol EX-421", manufactured by Nagase ChemteX Co., Ltd.), glycerol polyepoxypropyl ether (for example) "Denacol EX-313", "Denacol EX-314", manufactured by Nagase ChemteX Co., Ltd.), trimethylolpropane polyepoxypropyl ether (for example, "Denacol EX-321", Nagase ChemteX), Nisshin Alcohol diglycidyl ether (for example, "Denacol EX-211", manufactured by Nagase ChemteX Co., Ltd.), 1,6-hexanediol diepoxypropyl ether (for example, "Denacol EX-212", manufactured by Nagase ChemteX Co., Ltd.) Ethylene glycol diglycidyl ether (for example, "Denacol EX-810", "Denacol EX-811", manufactured by Nagase ChemteX), diethylene glycol diglycidyl ether (for example, "Denacol EX-850" "Denacol EX-851", manufactured by Nagase ChemteX), polyethylene glycol epoxide Ether (eg "Denacol EX-821", "Denacol EX-830", "Denacol EX-832", "Denacol EX-841", "Denacol EX-861", manufactured by Nagase ChemteX), propylene glycol diepoxypropyl Alkyl ether (for example, "Denacol EX-911", manufactured by Nagase ChemteX Co., Ltd.), polypropylene glycol diglycidyl ether (for example, "Denacol EX-941", "Denacol EX-920", "Denacol EX-931", Nagase ChemteX Company system) and so on. [0024] Examples of the cyclic aliphatic epoxy resin include "EHPE-3150" manufactured by Daicel Chemical Industry Co., Ltd., and the like. [0025] Examples of the alkylphenol-based epoxy resin include "HP-820" manufactured by DIC Corporation; "YDC-1312" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.; "EX-146" manufactured by Nagase ChemteX Co., Ltd., and the like. In one aspect of the invention, the (A) thermosetting resin preferably contains an epoxy resin (an epoxy resin containing an aromatic ring) having a refractive index of 1.48 to 1.54 and containing an aromatic ring in the molecule. When it is used for an epoxy resin having an aromatic ring structure in the molecule, it is preferred because it has a tendency to enhance the reactivity of the resin composition, the glass transition temperature and the adhesion of the cured product. Examples of such a thermosetting resin include an alkylphenol type epoxy resin and a fluorine-containing aromatic epoxy resin. Further, in another aspect of the invention, the (A) thermosetting resin preferably contains an epoxy resin (a1) having a refractive index of 1.48 to 1.54 (hereinafter sometimes referred to simply as "resin (a1)". And an epoxy resin (a2) containing an aromatic ring (hereinafter sometimes referred to simply as "resin (a2)"). The resin (a1) may be used alone or in combination of two or more. Similarly, the resin (a2) may be used alone or in combination of two or more. [0028] By using an epoxy resin containing an aromatic ring, there is a tendency to improve the reactivity of the resin composition and the glass transition temperature and the adhesion of the cured product. However, when the epoxy resin contains an aromatic ring, there is a tendency to increase the refractive index. Therefore, in general, an epoxy resin containing an aromatic ring satisfying a refractive index of 1.48 to 1.54 is less. According to this, by using the combination resin (a1) and the resin (a2), the desired refractive index, reactivity with the resin composition, and glass transition temperature and adhesion of the cured product can be improved. [0029] The total content of the resin (a1) and the resin (a2) is not particularly limited as long as it is in the range in which the above effects are achieved, but is preferably 60 to 100% by mass based on the entire (A) thermosetting resin. More preferably, it is 70 to 100% by mass, still more preferably 80 to 100% by mass, particularly preferably 90 to 100% by mass, most preferably 100% by mass. [0030] The epoxy resin having a refractive index of 1.48 to 1.54 is not particularly limited as the resin (a1). The epoxy resin having the above refractive index generally has a large number of aromatic ring structures. The resin (a1) is preferably one selected from the group consisting of hydrogenated epoxy resins, fluorine-containing epoxy resins, chain aliphatic epoxy resins, cyclic aliphatic epoxy resins, and alkylphenol epoxy resins. the above. The resin (a2) is not particularly limited as long as it is an epoxy resin containing an aromatic ring. The resin (a2) is preferably selected from the group consisting of bisphenol A type epoxy resin and bisphenol F type epoxy resin from the viewpoints of reactivity of the resin composition, glass transition temperature of the cured product, and adhesion improvement. One or more of a phenol novolak type epoxy resin, a biphenyl aralkyl type epoxy resin, a fluorene type epoxy resin, and a fluorine-containing aromatic type epoxy resin. The refractive index of the epoxy resin containing an aromatic ring is generally not 1.48 to 1.54, but an epoxy resin containing an aromatic ring having a refractive index of 1.48 to 1.54 can also be used as the resin (a2). Here, the "biphenyl aralkyl type epoxy resin" means an epoxy resin having a main chain in which a novolac structure and a divalent biphenyl structure are bonded. The term "antimony type epoxy resin" means an epoxy resin having an anthracene skeleton. The "fluorine-containing aromatic epoxy resin" means an epoxy resin containing fluorine having an aromatic ring. For example, a fluorine-containing aromatic epoxy resin described in WO2011/089947 can be used. [0033] In the combination of the resin (a1) and the resin (a2), the resin (a1) is more preferably a hydrogenated epoxy resin, a fluorine-containing epoxy resin, a cyclic aliphatic epoxy resin, and an alkylphenol type. The epoxy resin is more preferably one or more selected from the group consisting of hydrogenated bisphenol A type epoxy resins, hydrogenated bisphenol F type epoxy resins, and fluorine-containing epoxy resins, and is particularly preferably selected from hydrogenated bisphenol A type. One or more of the epoxy resin and the hydrogenated bisphenol F-type epoxy resin are preferably hydrogenated bisphenol A type epoxy resins. Further, in the above aspect, the resin (a2) is more preferably one or more selected from the group consisting of a bisphenol type epoxy resin and a fluorine-containing aromatic type epoxy resin, and more preferably a bisphenol type epoxy resin. More preferably, it is one or more selected from the group consisting of a bisphenol A type epoxy resin and a bisphenol F type epoxy resin. [0034] The amount of the resin (a2) is preferably 0.5 to 40% by mass, more preferably 0.5 to 40% by mass, based on the total of the resin (a1) and the resin (a2), in combination with the resin (a1) and the resin (a2). 1 to 35 mass%, more preferably 2 to 30 mass%. [0035] Examples of the bisphenol A type epoxy resin include "828EL", "1001" and "1004AF" manufactured by Mitsubishi Chemical Corporation; "840" and "850-S" manufactured by DIC Corporation; Nippon Steel & Sumitomo Chemical Industry Company-made "YD-128" and so on. In addition, as a mixture of the liquid bisphenol A type epoxy resin and the liquid bisphenol F type epoxy resin, "ZX-1059" (epoxy equivalent: about 165) by Nippon Steel Chemical Industry Co., Ltd. is mentioned, for example. [0036] Examples of the bisphenol F-type epoxy resin include "807" manufactured by Mitsubishi Chemical Corporation, "830" manufactured by DIC Corporation, and "YDF-170" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. [0037] Examples of the phenol novolac type epoxy resin include "N-730A", "N-740", "N-770" and "N-775" manufactured by DIC Corporation; "152" manufactured by Mitsubishi Chemical Corporation and "154" and so on. [0038] Examples of the biphenyl aralkyl type epoxy resin include "NC-3000", "NC-3000L", and "NC-3100" manufactured by Nippon Kayaku Co., Ltd. [0039] Examples of the oxime type epoxy tree include "OGSOL PG-100", "CG-500EG-200", and "EG-280" manufactured by Osaka Gas Chemical Co., Ltd. The amount of the thermosetting resin is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, even more preferably from 30 to 85% by mass, based on the total nonvolatile content of the resin composition. The amount of the epoxy resin is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, even more preferably from 30 to 85% by mass, based on the total nonvolatile content of the resin composition. <(B) Semi-fired hydrotalcite> Hydrotalcite can be classified into unfired hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite. [0043] Unburned hydrotalcite such as, for example, natural hydrotalcite (Mg)6
Al2
(OH)16
CO3
・4H2
O) a metal hydroxide having a layered crystal structure, for example, a layer which becomes a basic skeleton [Mg1-X
AlX
(OH)2
]X+
With the middle layer [(CO3
)X/2
・mH2
O]X-
Composition. The unfired hydrotalcite of the present invention contains the concept of a hydrotalcite-like compound such as hydrotalcite. Examples of the hydrotalcite-like compound include those represented by the following formula (I) and the following formula (II). [0044](in the formula, M2+
Mean Mg2+
Zn2+
Wait for a divalent metal ion, M3+
Express Al3+
, Fe3+
Waiting for a trivalent metal ion, AN-
Indicates CO3 2-
Cl-
NO3 -
An n-valent anion, and 0 < x < 1, 0 ≦ m < 1, n is a positive number). In formula (I), M2+
Preferred as Mg2+
, M3+
Preferred as Al3+
, AN-
Preferred as CO3 2-
. [0045](in the formula, M2+
Mean Mg2+
Zn2+
Waiting for a divalent metal ion, AN-
Indicates CO3 2-
Cl-
NO3-
For n-valent anions, x is a positive number of 2 or more, z is a positive number of 2 or less, m is a positive number, and n is a positive number). In formula (II), M2+
Preferred as Mg2+
, AN-
Preferred as CO3 2-
. [0046] The semi-fired hydrotalcite is a metal hydroxide having a layered crystal structure in which the amount of inter-layer water obtained by firing the uncalcined hydrotalcite is reduced or disappeared. The term "interlayer water" as used in the composition formula refers to "H" in the composition formula of the unfired natural hydrotalcite and hydrotalcite-like compound.2
O". The present invention uses this semi-fired hydrotalcite as one of the features. On the other hand, the calcined hydrotalcite is a metal oxide having an amorphous structure which is obtained by firing uncalcined hydrotalcite or semi-baked hydrotalcite, and not only inter-layer water but also hydroxyl groups are dehydrated by condensation. [0048] Unfired hydrotalcite, semi-fired hydrotalcite, and calcined hydrotalcite can be distinguished by saturated water absorption. The saturated water absorption of the semi-baked hydrotalcite is 1% by mass or more and less than 20% by mass. On the other hand, the saturated water absorption of the unfired hydrotalcite is less than 1% by mass, and the saturated water absorption of the calcined hydrotalcite is 20% by mass or more. The "saturated water absorption rate" in the present invention means that 1.5 g of unfired hydrotalcite, semi-baked hydrotalcite or calcined hydrotalcite is weighed in Libra, and after the initial mass is measured, it is set at atmospheric pressure. The mass increase rate with respect to the initial mass in the case of a small environmental tester (SH-222 manufactured by Espec Co., Ltd.) at 60 ° C and 90% RH (relative humidity) for 200 hours can be obtained by the following formula (i). . Saturated water absorption (% by mass) = 100 × (mass after moisture absorption - initial mass) / initial mass (i) [0050] The saturated water absorption of the semi-fired hydrotalcite is preferably 3% by mass or more and less than 20% by mass. % is more preferably 5% by mass or more and less than 20% by mass. Further, the unfired hydrotalcite, the semi-calcined hydrotalcite, and the calcined hydrotalcite can be distinguished by the thermal weight reduction rate measured by thermogravimetric analysis. The semi-calcined hydrotalcite has a thermal weight reduction rate of less than 15% by mass at 280 ° C and a thermal weight reduction rate of 1200 ° C or more at 12% by mass or more. On the other hand, the thermogravimetric reduction rate of the unfired hydrotalcite at 280 ° C was 15% by mass or more, and the thermal weight reduction rate of the calcined hydrotalcite at 380 ° C was less than 12% by mass. [0052] Thermogravimetric analysis can be carried out using a TG/DTA EXSTAR6300 manufactured by Hitachi High-Technologies Co., Ltd., and weigh 5 mg of hydrotalcite in a sample tray made of aluminum, in an uncovered open state, in an environment with a nitrogen flow rate of 200 mL/min, from 30 The temperature was raised from °C to 550 ° C at a temperature increase rate of 10 ° C / min. The heat weight reduction rate can be obtained by the following formula (ii). Thermal weight reduction rate (% by mass) = 100 × (mass before heating - mass at the time of reaching the predetermined temperature) / mass before heating (ii) [0053] Further, unburned hydrotalcite, semi-fired hydrotalcite and burnt The hydrotalcite can be distinguished by the peak and relative intensity ratios measured by powder X-ray diffraction. The semi-calcined hydrotalcite system means that there are two split peaks in the vicinity of 8 to 18 2 by the powder X-ray diffraction, or a peak of the shoulder by the synthesis of the two peaks, and the low-angle side appears. The relative intensity ratio of the peak or shoulder diffraction intensity (= low angle side diffraction intensity), the peak appearing at the high angle side or the diffraction intensity of the shoulder (= high angle side diffraction intensity) (low angle side winding) The radiation intensity/high-angle side diffraction intensity is 0.001 to 1,000. On the other hand, the unfired hydrotalcite has a peak only in the vicinity of 8 to 18 ,, or the peak value appearing on the low angle side or the relative intensity ratio of the peak appearing at the shoulder and the high angle side or the diffraction intensity of the shoulder becomes Outside the scope of the foregoing. The calcined hydrotalcite has no characteristic peaks in the 8 ̊ to 18 ̊ region and a characteristic peak at 43 ̊. The powder X-ray diffraction measurement was performed by a powder X-ray diffraction apparatus (manufactured by PANalytical Co., Ltd., Empyrean), a cathode CuKα (1.5405 Å), a voltage of 45 V, a current of 40 mA, a sampling width of 0.0260 Torr, and a scanning speed of 0.0657. ̊ / s, measurement of the diffraction angle range (2θ): 5.0131 ~ 79.9711 ̊ conditions. The peak search system uses the peak search function of the software attached to the diffraction device. It can be used with "minimum saliency: 0.50, minimum peak wafer: 0.01 ̊, maximum peak wafer: 1.00 ̊, peak base width: 2.00 ̊, method: 2 differentials. The condition of the minimum value is carried out. [0054] The semi-fired hydrotalcite preferably has a BET specific surface area of from 1 to 250 m.2
/g, more preferably 5 to 200m2
/g. The BET specific surface area of the semi-baked hydrotalcite is measured by a BET method using a specific surface area measuring device (Macsorb HM Model 1210, manufactured by Mountech Co., Ltd.) to adsorb the nitrogen gas on the surface of the sample. The average particle diameter of the semi-baked hydrotalcite is preferably from 1 to 1,000 nm, more preferably from 10 to 800 nm. The average particle diameter of the semi-fired hydrotalcite is measured by a laser diffraction scattering particle size distribution (JIS Z 8825), and the median diameter of the particle size distribution when the particle size distribution is prepared on a volume basis. [0056] The semi-fired hydrotalcite may be subjected to surface treatment with a surface treatment agent. As the surface treatment agent used for the surface treatment, for example, a higher fatty acid, a alkyl decane, a decane coupling agent, or the like can be used, and among them, a higher fatty acid or a alkyl decane is suitable. One type or two or more types of surface treatment agents can be used. [0057] Examples of the higher fatty acid include higher fatty acids having 18 or more carbon atoms such as stearic acid, montanic acid, myristic acid, and palmitic acid. Among them, stearic acid is preferred. These may be used alone or in combination of two or more. [0058] Examples of the alkyl decanes include methyltrimethoxydecane, ethyltrimethoxydecane, hexyltrimethoxydecane, octyltrimethoxydecane, decyltrimethoxydecane, and octadecyl groups. Trimethoxy decane, dimethyl dimethoxy decane, octyl triethoxy decane, n-octadecyl dimethyl (3-(trimethoxydecyl) propyl) ammonium chloride, and the like. These may be used alone or in combination of two or more. [0059] Examples of the decane coupling agent include 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropyltriethoxydecane, and 3-glycidoxypropyl ( Epoxy decane coupling agent such as dimethoxy)methyl decane and 2-(3,4-epoxycyclohexyl)ethyltrimethoxy decane; 3-mercaptopropyltrimethoxydecane, 3-mercaptopropylpropane a mercapto decane coupling agent such as triethoxy decane, 3-mercaptopropylmethyldimethoxy decane or 11-decylundecyltrimethoxydecane; 3-aminopropyltrimethoxydecane, 3-Aminopropyltriethoxydecane, 3-aminopropyldimethoxymethylnonane, N-phenyl-3-aminopropyltrimethoxydecane, N-methylaminopropyl Trimethoxydecane, N-(2-aminoethyl)-3-aminopropyltrimethoxydecane and N-(2-aminoethyl)-3-aminopropyldimethoxymethyl Amino decane coupling agent such as decane; urea-based decane coupling agent such as 3-ureidopropyltriethoxy decane, vinyl trimethoxy decane, vinyl triethoxy decane and vinyl methyl hydride Vinyl decane coupling such as ethoxy decane a styryl decane coupling agent such as p-styryltrimethoxydecane; an acrylic acid such as 3-acryloxypropyltrimethoxydecane or 3-methylpropenyloxypropyltrimethoxydecane; Ester decane coupling agent; isocyanate decane coupling agent such as 3-isocyanate propyl trimethoxy decane, bis(triethoxydecylpropyl) disulfide, bis(triethoxydecylpropyl) tetra A sulfide-based decane coupling agent such as sulfide; phenyltrimethoxydecane, methacryloxypropyltrimethoxydecane, imidazolium, triazine decane, and the like. These may be used alone or in combination of two or more. [0060] The surface treatment of the semi-baked hydrotalcite can be carried out, for example, by mixing the untreated half of the hydrotalcite with a mixer at a normal temperature to stir and disperse, and adding a surface treatment agent for spraying and stirring for 5 to 60 minutes. get on. As the mixer, a well-known mixer can be used, and examples thereof include a blender of a V blender, a ribbon blender, a bubble cone mixer, a mixer such as a Henschel mixer and a concrete mixer, a ball mill, and a grinder. Wait. Further, when the semi-fired hydrotalcite is pulverized by a ball mill or the like, the above-mentioned higher fatty acid, alkyldecane or decane coupling agent may be added and surface-treated. Although the amount of the surface treatment agent used varies depending on the type of the semi-fired hydrotalcite or the type of the surface treatment agent, it is preferably 1 to 10 with respect to 100 parts by mass of the semi-fired hydrotalcite which is not surface-treated. Parts by mass. In the present invention, the surface-treated semi-fired hydrotalcite is also included in the "semi-fired hydrotalcite" of the present invention. The amount of the semi-fired hydrotalcite of the resin composition of the present invention is not particularly limited as long as the effect of the present invention can be exerted, but the total nonvolatile content of the resin composition is preferably 5 to 5 60% by mass, more preferably 10 to 55% by mass. Since the semi-fired hydrotalcite is excellent in moisture absorption performance, as long as the amount is increased, the moisture blocking property of the obtained cured product is improved. However, when the amount is more than 60% by mass, the viscosity of the resin composition is increased, and the wettability is lowered, and the adhesion between the substrate to be sealed and the resin composition is lowered, and the strength of the cured product is lowered and become brittle. The tendency of the problem. Further, since the amount of water in the sealing layer (that is, the cured product) is increased due to the semi-fired inter-layer water of the hydrotalcite, for example, in the production of the organic EL device, the luminescent material (light-emitting layer) is caused by the moisture in the sealing layer. Or the adverse effect of the electrode layer is conspicuous, and the dark spot at the initial stage is increased. The resin composition of the present invention may contain a calcined hydrotalcite if it exhibits the effects of the present invention. The amount is preferably 0 to 20% by mass, more preferably 0 to 15% by mass, still more preferably 0 to 10% by mass, most preferably 0, based on the total nonvolatile content of the resin composition. That is, the resin composition of the present invention preferably does not contain calcined hydrotalcite. When the amount of the hydrotalcite is increased, the refractive index of the cured product having the resin composition increases, and the transmittance tends to decrease. Semi-fired hydrotalcite: The quality of the calcined hydrotalcite is preferably 50:50 to 100:0, more preferably 55:45 to 100:0, still more preferably 60:40 to 100:0. The resin composition of the present invention may contain unfired hydrotalcite if it exhibits the effects of the present invention. The amount is preferably 0 to 20% by mass, more preferably 0 to 10% by mass, still more preferably 0 to 5% by mass, and most preferably 0, based on the total nonvolatile content of the resin composition. That is, it is preferable that the resin composition of the present invention does not contain unfired hydrotalcite. The unfired hydrotalcite does not affect the transmittance of the cured product of the resin composition. However, since the moisture content is large, there is a fear that the moisture shielding property is lowered due to the increase, for example, when the amount exceeds 20% by mass. As with semi-baked hydrotalcite, there is a suspense that increases in dark spots at the initial stage. Semi-fired hydrotalcite: The quality of unfired hydrotalcite is preferably 50:50 to 100:0, more preferably 55:45 to 100:0, and even more preferably 60:40 to 100:0, and again Good for 65:35~100:0, especially good for 70:30~100:0. [0064] Examples of the semi-baked hydrotalcite include "DHT-4C" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle diameter: 400 nm), and "DHT-4A-2" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle diameter: 400nm) and so on. On the other hand, examples of the calcined hydrotalcite include "KW-2200" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle diameter: 400 nm), and examples of the unfired hydrotalcite include "DHT-4A" (Concord). Chemical industry company, average particle diameter: 400 nm). <(C) Hardener and (D) Hardening Accelerator> The resin composition of the present invention contains a curing agent. That is, the sealing layer is a cured product obtained by hardening the resin composition. The curing agent is not particularly limited as long as it has a function of curing the thermosetting resin. From the viewpoint of suppressing thermal deterioration of the light-emitting element such as the organic EL element during the curing treatment of the resin composition, the curing agent is preferably at a temperature of 140 ° C or lower (preferably 120 ° C or lower). Hardening thermosetting resin. The curing agent may be used alone or in combination of two or more. [0066] As the curing agent, a curing agent which is an epoxy resin which is particularly excellent as a thermosetting resin is exemplified. Examples thereof include an ionic liquid, an acid anhydride compound, an imidazole compound, a tertiary amine compound, a dimethyl urea compound, an amine adduct compound, an organic acid diterpene compound, an organic phosphine compound, a dicyandiamide compound, and a grade 1 and 2 An amine compound or the like. The curing agent is preferably one or more selected from the group consisting of an ionic liquid, an acid anhydride compound, an imidazole compound, a tertiary amine compound, a dimethyl urea compound, and an amine adduct compound, and more preferably an ionic liquid. One or more of an acid anhydride compound, an imidazole compound, a tertiary amine compound, and a dimethylurea compound. [0068] In particular, as the hardener of the present invention, the ionic liquid of the thermosetting resin (especially epoxy resin) can be cured at a temperature of 140 ° C or lower (preferably 120 ° C or lower), that is, The salt which is meltable in a temperature range of 140 ° C or lower (preferably 120 ° C or lower) is preferably a salt having a hardening action of a thermosetting resin (particularly an epoxy resin). The ionic liquid is desirably used in a state of being uniformly dissolved in a thermosetting resin (especially an epoxy resin), and the ionic liquid is advantageous in enhancing the moisture rupture property of the cured product of the resin composition. The resin composition of the present invention may contain a curing accelerator for the purpose of adjusting the curing time or the like in addition to the curing agent. The curing accelerator may be used alone or in combination of two or more. As a hardening accelerator, the hardening accelerator which is a thermosetting resin especially the epoxy resin is illustrated. For example, an imidazole compound, a tertiary amine compound, a dimethyl urea compound, an amine addition compound, etc. are mentioned. The hardening accelerator is preferably one or more selected from the group consisting of an imidazole compound, a tertiary amine compound, and a dimethyl urea compound. [0070] Examples of the cation constituting the ionic liquid as the curing agent of the present invention include an imidazolium ion, a piperidinium ion, a pyrrolidinium ion, a pyrazolium ion, a guanidine salt, and a pyridine. An ammonium-based cation such as a ruthenium ion; a ruthenium-based cation such as a tetraalkylphosphonium cation (for example, a tetrabutylphosphonium ion or a tributylhexylphosphonium ion); a lanthanoid cation such as a triethylsulfonium ion; [0071] Examples of the anion of the ionic liquid to be used as the curing agent of the present invention include a halide ion, a chloride ion, a bromide ion, an iodide ion, or the like, and an alkyl group such as a methanesulfonate ion. Sulfate anion; trifluoromethanesulfonate ion, hexafluorophosphonic acid ion, trifluoromethane (pentafluoroethyl) phosphonate ion, bis(trifluoromethanesulfonyl) quinone imine ion, trifluoroacetate ion, four A fluorine-containing compound such as a fluoroboric acid ion is an anion; a phenolic anion such as a phenol ion, a 2-methoxyphenol ion, or a 2,6-di-tert-butylphenol ion; an aspartic acid ion, a glutamic acid ion Acidic amino acid ion; neutral amino acid ion such as glycine ion, alanine ion, phenylalanine ion; N-benzhydryl propylamine ion, N-acetyl phenylalanine An N-mercaptoamino acid ion represented by the following general formula (1) such as an ion or an N-acetylglycine ion; a formic acid ion, an acetic acid ion, a citric acid ion, a 2-pyrrolidone-5-carboxylic acid ion, Alpha-lipoic acid ion, lactate ion, tartaric acid ion, hippocampus acid ion Anion carboxylic acid N- Ji Haima acid ion, benzoic acid ion, etc.. [0072](R, R is a linear or branched alkyl group having 1 to 5 carbon atoms, or a substituted or unsubstituted phenyl group, and X represents a side chain of an amino acid). Examples of the amino acid of the formula (1) include aspartic acid, glutamic acid, glycine, alanine, and phenylalanine. Among them, glycine is preferred. Among the above, the cation is preferably an ammonium cation or a lanthanoid cation, more preferably an imidazolium ion or a cerium ion. More specifically, the imidazolium ion is 1-ethyl-3-methylimidazolium ion, 1-butyl-3-methylimidazolium ion, 1-propyl-3-methylimidazolium ion, or the like. Further, the anion is preferably a phenol anion, an N-decylamino acid ion represented by the general formula (1) or a carboxylic acid anion, more preferably an N-decylamino acid ion or a carboxylic acid anion. . Specific examples of the phenol-based anion include 2,6-di-tert-butylphenol ion. Further, specific examples of the carboxylic acid anion include acetate ion, citric acid ion, 2-pyrrolidone-5-carboxylic acid ion, formic acid ion, α-lipoic acid ion, lactate ion, tartaric acid ion, hippocampus ion, N - a methyl hippocampus ion or the like, among which, an acetate ion, a 2-pyrrolidone-5-carboxylic acid ion, a formic acid ion, a lactate ion, a tartaric acid ion, a hippocampus ion, and an N-methyl hippocampus ion are preferable. Acetic acid ion, citric acid ion, N-methyl hippocampus ion, formic acid ion. Further, specific examples of the N-mercaptoamino acid ion represented by the general formula (1) include N-benzylidene propylamine ion, N-ethyl phenylphenylalanine ion, and aspartate ion. , glycine ion, N-acetylglycine ion, etc., among which, preferably N-benzhydryl propylamine ion, N-acetyl phenylalanine ion, N-acetylglycine ion Particularly preferred is N-acetylglycine ion. [0078] As a specific ionic liquid, for example, 1-butyl-3-methylimidazolium lactate, tetrabutylphosphonium-2-pyrrolidone-5-carboxylate, tetrabutylphosphonium acetate, Tetrabutyl decanoate, tetrabutylphosphonium trifluoroacetate, tetrabutylphosphonium a-lipoic acid ester, tetrabutylphosphonium formate, tetrabutylphosphonium lactate, tartaric acid bis(tetrabutylphosphonium) Salt, tetrabutyl sulphate sulphate, N-methyl tetramethylene sulphate, benzhydryl-DL-tetrabutyl sulphate, tetrabutyl N-ethyl phenyl phenyl methacrylate Bismuth salt, 2,6-di-tert-butylphenol tetrabutyl ester sulfonium salt, L-aspartic acid monotetrabutyl sulfonium salt, tetrabutylammonium glycinate, N-acetylglycine IV Butyrate sulfonium salt, 1-ethyl-3-methylimidazolium lactate, 1-ethyl-3-methylimidazolium acetate, 1-ethyl-3-methylimidazolium formate, hippocampus 1-ethyl-3-methylimidazolium salt, 1-ethyl-3-methylimidazolium salt of N-methylheptaic acid, bis(1-ethyl-3-methylimidazolium) tartaric acid, N - Ethyl glycidyl 1-ethyl-3-methylimidazolium salt, particularly preferably tetrabutyl phosphonate, N-acetylglycine tetrabutyl phosphonium salt, 1-ethyl-3 -methylimidazolium acetate, 1-ethyl-3-methylimidazolium formate, 1-ethyl-3-methylimidazolium salt, N-methylheptamate 1-ethyl-3- Methyl imidazolium salt. [0079] The method for synthesizing the ionic liquid is a precursor formed of a cationic moiety such as an alkylimidazolium, an alkylpyridinium, an alkylammonium or an alkylphosphonium ion, and an anion site containing a halogen. Make NaBF4
NaPF6
, CF3
SO3
Na or LiN (SO2
CF3
)2
An anion exchange method in which a reaction is carried out, an amine-based substance is reacted with an acid ester to introduce an alkyl group, and an organic acid residue is an anion-like acid ester method, and an amine is neutralized with an organic acid to obtain a salt. Law, etc., but is not limited to this. By anion and cation and solvent neutralization method, anions and cations can be used in equal amounts, and the solvent in the obtained reaction liquid can be distilled off, or can be directly used, and then poured into an organic solvent (methanol, toluene, ethyl acetate, acetone). Etc.) It is also possible to carry out liquid concentration. Examples of the acid anhydride compound of the curing agent of the present invention include tetraphthalic anhydride, methyltetraphthalic anhydride, hexaphthalic anhydride, methyl hexaphthalic anhydride, and A. Kinadic anhydride, dodecenyl succinic anhydride, and the like. Specific examples of the acid anhydride compound include RIKACID TH, TH-1A, HH, MH, MH-700, and MH-700G (all manufactured by Shin-Nippon Chemical Co., Ltd.). Examples of the imidazole compound of the hardener and the hardening accelerator of the present invention include 1H-imidazole, 2-methyl-imidazole, 2-phenyl-4-methylimidazole, and 2-ethyl-4-. Methylimidazole, 1-cyanoethyl-2-ethyl-4-methyl-imidazole, 2-undecylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl- 2-undecyl imidazolium trimellitate (Trimellitate), 2,4-diamino-6-(2'-undecylimidazolyl-(1'))-ethyl-s-three Pyrazine, 2-phenyl-4,5-bis(hydroxymethyl)-imidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-phenyl-imidazole, 2 - dodecyl-imidazole, 2-heptadecylimidazole, 1,2-dimethyl-imidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino -6-(2'-methylimidazolyl-(1')-ethyl-s-triazine, 2,4-diamino-6-(2'-methylimidazolyl-(1'))- Ethyl-s-triazine isocyanuric acid adduct, etc. Specific examples of the imidazole compound include Curezol 2MZ, 2P4MZ, 2E4MZ, 2E4MZ-CN, C11Z, C11Z-CN, C11Z-CNS, C11Z-A, 2PHZ, 1B2MZ, 1B2PZ, 2PZ, C17Z, 1.2DMZ, 2P4MHZ-PW, 2MZ-A 2MA-OK (all manufactured by Shikoku Chemicals Co., Ltd.), etc. [0082] Specific examples of the tertiary amine compound of the curing agent and the curing accelerator of the present invention include DBN (1,5-diazabicyclo[ 4.3.0]non-5-ene), DBU (1,8-diazabicyclo[5.4.0]undec-7-ene), 2-ethylhexanoate of DBU, phenate of DBU, p- of DBU Toluenesulfonate, U-CAT SA 102 (manufactured by San-Apro Co., Ltd.: octyl acid salt of DBU), DBU-organic acid salt of DBU orthoformate, ginseng (dimethylaminomethyl) phenol ( TAP), etc. [0083] Specific examples of the dimethylurea compound in the hardener and the hardening accelerator of the present invention include DCMU (3-(3,4-dichlorophenyl)-1,1-di An aliphatic dimethyl urea such as methyl urea), U-CAT3512T (manufactured by San-Apro Co., Ltd.), or an aliphatic dimethyl urea such as U-CAT3503N (manufactured by San-Apro Co., Ltd.), etc. In view of the above, it is preferred to use an aromatic dimethyl urea. [0084] As the amine adduct compound of the hardener and the hardening accelerator of the present invention, for example, a tertiary amine which stops the epoxy resin in the middle may be mentioned. Addition reaction Examples of the compound of the amine adduct compound include Amicure PN-23, Amicure MY-24, Amicure PN-D, Amicure MY-D, Amicure PN-H, and Amicure MY. -H, Amicure PN-31, Amicure PN-40, Amicure PN-40J (all manufactured by Ajinomoto Fine Techno Co., Ltd.). Specific examples of the organic acid diterpene compound in the curing agent of the present invention include Amicure VDH-J, Amicure UDH, and Amicure LDH (all manufactured by Ajinomoto Fine Techno Co., Ltd.). Examples of the organic phosphine compound of the curing agent and the curing accelerator of the present invention include triphenylphosphine, tetraphenylphosphonium tetra-p-tolylborate, and tetraphenylphosphonium tetraphenylborate. Tri-tert-butylindole tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, Triphenylphosphine triphenylborane and the like. Specific examples of the organic phosphine compound include TPP, TPP-MK, TPP-K, TTBuP-K, TPP-SCN, and TPP-S (manufactured by Kitai Chemical Industry Co., Ltd.). [0087] Examples of the dicyandiamide compound in the curing agent of the present invention include dicyandiamide. Specific examples of the dicyandiamide compound include DICY7 and DICY15 (all manufactured by Mitsubishi Chemical Corporation) of dicyandiamide finely pulverized product. [0088] Examples of the first- and second-order amine-based compounds of the curing agent of the present invention include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and trimethylhexamethylenediamine of an aliphatic amine. Amine, 2-methylpentamethylenediamine, 1,3-diaminomethylcyclohexane, dipropylenediamine, diethylaminopropylamine, bis(4-aminocyclohexyl)methane , norbornene diamine, 1,2-diaminocyclohexane, etc., alicyclic amine N-aminoethylpiperazine, 1,4-bis(3-aminopropyl)piperazine, etc. Aminodiamine diphenylmethane, m-phenylenediamine, m-xylenediamine, meta-phenylenediamine, diaminodiphenylmethane, diaminodiphenylphosphonium, Diethyl toluenediamine and the like. Specific examples of the first- and second-order amine-based compounds include Kayahard A-A (manufactured by Nippon Kayaku Co., Ltd.: 4,4'-diamino-3,3'-dimethyldiphenylmethane). In the resin composition of the present invention, the amount of the curing agent is preferably from 0.1 to 40% by mass, more preferably from 0.5 to 38 parts by mass, even more preferably from 1 to 40% by mass, based on the total nonvolatile content of the resin composition. 35 parts by mass. When the amount is less than 0.1% by mass, sufficient curability is not obtained, and when the amount is more than 40% by mass, the storage stability of the resin composition is impaired. When the ionic liquid is used as the curing agent, the amount of the ionic liquid is preferably 0.1 to 20% by mass based on the total amount of the non-volatile matter of the resin composition, from the viewpoint of the moisture blocking property of the cured product of the resin composition. More preferably, it is 0.5 to 18% by mass, and more preferably 1 to 15% by mass. When the resin composition of the present invention contains a curing accelerator, the amount is preferably 0.05 to 10% by mass, more preferably 0.1 to 8% by mass, even more preferably less than the total nonvolatile content of the resin composition. 0.5 to 5% by mass. When the amount is less than 0.05% by mass, the curing tends to gradually increase the thermal curing time. When the amount is more than 10% by mass, the storage stability of the resin composition tends to be lowered. The thermosetting resin composition of the present invention is preferably used in combination with a curing agent and a curing accelerator. The combination of the curing agent and the curing accelerator is preferably two or more selected from the group consisting of an ionic liquid, an acid anhydride compound, an imidazole compound, a tertiary amine compound, a dimethyl urea compound, and an amine adduct compound. <(E) Thermoplastic Resin> The coating property (preventing cracking) of the resin composition varnish when imparting flexibility to the sealing layer (that is, the cured product of the resin composition) and preparing the sheet for sealing From the viewpoint, the resin composition of the present invention may contain a thermoplastic resin. Examples of the thermoplastic resin include a phenoxy resin, a polyvinyl acetal resin, a polyimide resin, a polyamide amide resin, a polyether oxime resin, a polyfluorene resin, a polyester resin, and (meth) Acrylic polymer or the like. These thermoplastic resins may be used alone or in combination of two or more. The weight average molecular weight of the thermoplastic resin from the viewpoint of imparting flexibility to the sealing layer obtained by curing the resin composition, and coating property (preventing cracking) of the resin composition varnish when preparing the sheet for sealing It is preferably 15,000 or more, more preferably 20,000 or more. However, when the weight average molecular weight is too large, the compatibility between the thermoplastic resin and the thermosetting resin (especially an epoxy resin) tends to be lowered. Therefore, the weight average molecular weight is preferably 1,000,000 or less, more preferably 800,000 or less. The weight average molecular weight in the present invention is measured by a gel permeation chromatography (GPC) method (in terms of polystyrene). In the weight average molecular weight of the GPC method, specifically, LC-9A/RID-6A manufactured by Shimadzu Corporation is used as a measuring device, and Shodex K-800P/K-804L/K-804L manufactured by Showa Denko Co., Ltd. is used as a column. Using chloroform or the like as a movement or the like, it is measured at a column temperature of 40 ° C, and can be calculated using a calibration curve of standard polystyrene. [0095] The thermoplastic resin is not particularly limited as long as the refractive index of the cured product of the resin composition is from 1.48 to 1.54. When the refractive index of the thermosetting resin is low, the thermoplastic resin may be a refractive index of a cured product of a resin composition having a higher refractive index than the cured product of the resin composition. The refractive index of the thermoplastic resin is preferably from 1.40 to 1.70, more preferably from 1.40 to 1.65. When a plurality of thermoplastic resins are used, it is preferred that the refractive index of the entire mixture of thermoplastic resins is within the above range. [0096] The thermoplastic resin is preferably a phenoxy resin which is excellent in compatibility with a thermosetting resin (especially an epoxy resin) and which is advantageous in the moisture rupture property of the cured product of the resin composition. . The phenoxy resin may also have an epoxy group similarly to the epoxy resin. The weight average molecular weight of the phenoxy resin is preferably from 10,000 to 500,000, more preferably from 20,000 to 300,000. [0098] Examples of suitable phenoxy resins include a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a bisphenol acetophenone skeleton, a novolac skeleton, a biphenyl skeleton, an anthracene skeleton, and One or more kinds of skeletons of a cyclopentadiene skeleton and a norbornene skeleton. One type or two or more types may be used for the phenoxy resin. [0099] As a commercial product of the phenoxy resin, for example, YX7200B35 (manufactured by Mitsubishi Chemical Corporation: a phenoxy resin containing a biphenyl skeleton) and 1256 (manufactured by Mitsubishi Chemical Corporation: a phenoxy group containing a bisphenol A skeleton) Resin), YX6954BH35 (manufactured by Mitsubishi Chemical Corporation: phenoxy resin containing bisphenol acetophenone skeleton), and the like. When the resin composition of the present invention is a thermoplastic resin, the amount is 0.1 to 60% by mass, preferably 3 to 60% by mass, more preferably 5 to 50% by mass based on the total nonvolatile content of the resin composition. %. <Coupling Agent> The resin composition of the present invention may contain a coupling agent. Examples of the coupling agent include a decane coupling agent, an aluminate coupling agent, and a titanate coupling agent. Examples of the decane coupling agent include 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropyltriethoxydecane, and 3-glycidoxypropyl (dimethoxy). Epoxy decane coupling agent such as methyl decane and 2-(3,4-epoxycyclohexyl)ethyltrimethoxy decane; 3-mercaptopropyltrimethoxydecane, 3-mercaptopropyltriethyl a mercapto decane coupling agent such as oxydecane, 3-mercaptopropylmethyldimethoxydecane and 11-decylundecyltrimethoxydecane; 3-aminopropyltrimethoxydecane, 3-amine Propyltriethoxydecane, 3-aminopropyldimethoxymethylnonane, N-phenyl-3-aminopropyltrimethoxydecane, N-methylaminopropyltrimethoxy Decane, N-(2-aminoethyl)-3-aminopropyltrimethoxydecane, and N-(2-aminoethyl)-3-aminopropyldimethoxymethyldecane Amino decane coupling agent; urea-based decane coupling agent such as 3-ureidopropyltriethoxy decane; vinyl trimethoxy decane, vinyl triethoxy decane and vinyl methyl diethoxy Vinyl decane coupling agent such as decane; p-phenyl Acrylate-based decane coupling agent such as alkenyltrimethoxydecane; acrylate-based decane coupling such as 3-propenyloxypropyltrimethoxydecane and 3-methylpropoxypropyltrimethoxydecane Mixture; isocyanate-based decane coupling agent such as 3-isocyanate propyl trimethoxy decane; bis(triethoxydecylpropyl) disulfide, bis(triethoxydecylpropyl) tetrasulfide, etc. Sulfide-based decane coupling agent; phenyltrimethoxydecane, methacryloxypropyltrimethoxydecane, imidazolium, triazine decane, and the like. Among these, a vinyl decane coupling agent and an epoxy decane coupling agent are preferable, and an epoxy decane coupling agent is especially preferable. Examples of the aluminate coupling agent include alkyl acetoacetate aluminum diisopropylate (for example, "PLENACT AL-M" manufactured by Ajinomoto Fine Techno Co., Ltd.). Specific examples of the titanate coupling agent include PLENACT TTS, PLENACT 46B, PLENACT 55, PLENACT 41B, PLENACT 38S, PLENACT 138S, PLENACT 238S, PLENACT 338X, PLENACT 44, and PLENACT 9SA (all manufactured by Ajinomoto Fine Techno Co., Ltd.). )Wait. One or two or more kinds of the coupling agents can be used. The amount of the coupling agent of the resin composition of the present invention is preferably from 0 to 15% by mass, and more preferably from 0.5 to 10% by mass based on the total nonvolatile content of the resin composition. <Inorganic filler material> The resin composition of the present invention is derived from the viewpoint of moisture blocking property of the cured product of the resin composition, coating property (preventing cracking) of the resin composition varnish when preparing the package sheet, and the like. It is to be noted that the inorganic filler other than the semi-baked hydrotalcite may be further contained in the range in which the effects of the present invention are exerted. Examples of such an inorganic filler include, in addition to the above-described unfired hydrotalcite and calcined hydrotalcite, examples thereof include talc, ceria, alumina, barium sulfate, clay, mica, aluminum hydroxide, and magnesium hydroxide. Calcium carbonate, magnesium carbonate, boron nitride, aluminum borate, barium titanate, barium titanate, calcium titanate, magnesium titanate, barium titanate, titanium oxide, zirconium oxide, barium zirconate, calcium zirconate, strontium silicate Wait. One type or two or more types can be used as the inorganic filler. Further, the particle diameter of the primary particles of the inorganic filler is preferably 5 μm or less, more preferably 3 μm or less. For example, those having a primary particle diameter of 0.001 to 3 μm, more preferably 0.005 to 2 μm, can be used. The particle form of the inorganic filler is not particularly limited, and a slightly spherical shape, a rectangular parallelepiped shape, a plate shape, a linear shape such as a fiber, and a branched branch shape can be used. The inorganic filler is preferably talc, cerium oxide, zeolite, titanium oxide, aluminum oxide, zirconium oxide, cerium salt, mica, magnesium hydroxide, aluminum hydroxide, etc., more preferably talc or cerium oxide, particularly preferably talc. As the cerium oxide, preferably amorphous cerium oxide, molten cerium oxide, crystalline cerium oxide, synthetic cerium oxide wet cerium oxide, dry cerium oxide, colloidal cerium oxide (water dispersed type, organic The solvent-dispersible type, the gas-phase cerium oxide or the like is particularly preferably an organic solvent-dispersed colloidal cerium oxide (organic cerium oxide sol) from the viewpoint of being difficult to precipitate, sedimentation, and easy compounding with a resin. [0105] A commercially available product can be used as the inorganic filler. Examples of the talc include "FG-15" (average particle diameter: 1.4 μm), "D-1000" (average particle diameter: 1.0 μm), and "D-600" (average particle diameter: 0.6 μm) manufactured by Nippon Talc Co., Ltd., and the like. . As an example of the commercially available spherical molten cerium oxide, a true spherical cerium dioxide "Adma fine series" manufactured by Admatechs Co., Ltd. ("SO-C2; average particle diameter 0.5 μm", "SC2500-SQ; average particle" 0.5 μm in diameter, decane coupling treatment, etc.). Examples of the fumed cerium oxide include the "Aerosil series" ("A-200: primary particle diameter 5 to 40 nm") manufactured by Japan Aerosil Co., Ltd., and the like. As an example of the organic solvent-dispersed colloidal cerium oxide, "MEK-EC-2130Y" (amorphous cerium oxide particle size: 10 to 15 nm, nonvolatile content: 30% by mass, MEK solvent), manufactured by Nissan Chemical Industries, Ltd., "PGM-AC-2140Y" manufactured by Nissan Chemical Industries Co., Ltd. (cerium dioxide particle size: 10 to 15 nm, nonvolatile content: 40% by mass, PGM (propylene glycol monomethyl ether) solvent), "MIBK-ST" manufactured by Nissan Chemical Industries, Ltd. (cerium dioxide particle size: 10 to 15 nm, nonvolatile content: 30% by mass, MIBK (methyl isobutyl ketone) solvent), and colloidal cerium oxide sol "PL-2L-MEK" manufactured by Fuso Chemical Industry Co., Ltd. The ruthenium has a particle diameter of 15 to 20 nm, a nonvolatile content of 20% by mass, a MEK (methyl ethyl ketone) solvent, and the like. The amount of the inorganic filler other than the semi-fired hydrotalcite is preferably 0 to 30 from the viewpoint of the moisture shielding property of the cured product of the resin composition, etc., with respect to the total nonvolatile content of the resin composition. The mass % is more preferably 0 to 25% by mass. [0107] In order to enhance the moisture shielding property, the transmittance, and the like of the cured product of the resin composition, the resin composition of the present invention may be blended with cerium oxide. When the cerium oxide is blended, the amount is preferably 0.1 to 10% by mass based on the total nonvolatile content of the resin composition. When the amount of cerium oxide is too large, the adhesion tends to be lowered. In order to improve the moisture resistance, the adhesion, and the like of the cured product of the resin composition, the resin composition of the present invention may be blended with talc. When the talc is blended, the amount is preferably 0.01 to 30% by mass, more preferably 0.1 to 20% by mass, still more preferably 0.5 to 10% by mass based on the total nonvolatile content of the resin composition. When the amount of the talc is too small, the effect of improving the moisture resistance and the adhesion of the talc tends to be insufficient. When the amount of the talc is too large, the transparency tends to be deteriorated. <Other Additives> The resin composition of the present invention may further contain other additives different from the above components in order to exhibit the effects of the present invention. Examples of such an additive include organic fillers such as rubber particles, xenon oxide powders, nylon powders, and fluororesin powders; tackifiers such as Orben and Penton; and deuterium oxygen, fluorine, and polymer defoamers. Or a leveling agent; an adhesion imparting agent such as a triazole compound, a thiazole compound, a triazine compound, or a porphyrin compound; <Refractive Index> In the present invention, the refractive index of the solid resin (for example, a solid epoxy resin or a phenoxy resin) and the refractive index of the cured product of the resin composition are all light having a wavelength of 594 nm at 25 ° C. The refractive index is based on the measured value of the prism coupler method. Specifically, the refractive index of the sample can be measured by a prism coupler method by measuring a critical angle of a prism having a known refractive index and an interface with a sample in contact with the prism. As the measuring device of the prism coupler method, for example, a prism coupler (model 2010/M) manufactured by Metricon Co., Ltd. can be used. When the refractive index of a solid resin or a phenoxy resin containing a solvent is measured, it is applied to a uniform thickness on a glass support, and a sufficient amount of solvent is volatilized in a heat cycle oven or the like. . The refractive index of the liquid resin (for example, a liquid epoxy resin) is a measured value based on a measurement method using a multi-wavelength Abbe refractometer at 25 °C. As the multi-wavelength Abbe refractometer, for example, DR-M2 manufactured by Atago Co., Ltd. can be used. <Parallel Line Transmittance of the Hardened Layer> In the present invention, it is preferable that the cured layer of the resin composition having a thickness of 20 μm has a parallel line transmittance of 80 to 100% in D65 light. Such a hardened layer can be visually recognized as transparent. The resin composition of the present invention can easily form a cured product (sealing layer) of a resin composition having excellent parallel line transmittance by appropriately adopting the above-described preferable conditions. The transmittance of the cured layer (sealing layer) of the resin composition having a thickness of 20 μm on the parallel line of D65 light is preferably from 80 to 100%, more preferably from 85 to 100%. The parallel line transmittance of the cured product in D65 light was carried out in the manner described in the examples below, and a laminate in which a cured product of the resin composition was sandwiched between glass plates was formed, and air was used as a reference. Further, the value of the parallel line transmittance of the above-mentioned D65 light is a measured value of the cured layer of the resin composition having a thickness of 20 μm, but the thickness of the cured layer is generally 3 to 200 μm. <Method for Producing Resin Composition> The resin composition of the present invention having a refractive index of 1.48 to 1.54 of a cured product can be used by using a component having a refractive index equal to the refractive index as described above, or a blending lower The refractive index resin and the high refractive index resin are obtained by adjusting the refractive index of the entire resin to the above range. The resin composition of the present invention can be produced by mixing such a component and, if necessary, an organic solvent, using a kneading roll or a rotary mixer. [Applications] The resin composition of the present invention and the sealing sheet to be described later are used, for example, in electronic components such as semiconductors, solar cells, high-brightness LEDs, LCDs, and EL elements, and are preferably organic EL elements and solar energy. Sealing of optical semiconductors such as batteries. The resin composition and the sheet for sealing of the present invention are particularly preferably used for sealing of an organic EL element. Specifically, in order to apply to the upper portion and/or the periphery (side portion) of the light-emitting portion of the organic EL element, and to protect the light-emitting portion of the organic EL element from the outside, the resin composition of the present invention and the sheet for sealing can be used. The sealing layer can be formed by applying the resin composition of the present invention to a sealing object and curing the coating film. In addition, a sealing sheet which forms a layer of the resin composition of the present invention is formed on the support, and the sealing sheet is laminated on a necessary position of the object to be sealed, and the resin composition layer is transferred onto the object to be coated. Hardened to form a sealing layer. <Sheet for sealing> The layer for sealing of the resin composition of the present invention is formed on a support, and can be obtained by a method known to those skilled in the art, for example, a resin composition is dissolved in an organic solvent. The resin composition varnish of the solvent is obtained by applying the varnish to a support, and drying the applied varnish by heating or hot air blowing to form a resin composition layer. [0117] Examples of the support used for the sheet for sealing include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, and cycloolefin polymers and polyethylene terephthalate (hereinafter sometimes referred to as A plastic film such as "PET"), polyethylene naphthalate or the like, polycarbonate, or polyimide. As a plastic film, especially PET is preferred. Further, the support body may be a metal foil such as aluminum foil, stainless steel foil or copper foil. In addition to the matting treatment and the corona treatment, the support may be subjected to a mold release treatment. The mold release treatment is, for example, a release treatment of a release agent such as a silicone resin release agent, an alkyd resin release agent, or a fluororesin release agent. [0118] In order to improve the moisture resistance of the sheet for sealing, a plastic film having a barrier layer may be used as a support. Examples of the barrier layer include nitrides such as tantalum nitride, oxides such as alumina, stainless steel foils, and metal foils of aluminum foil. As the plastic film, the above-mentioned plastic film can be cited. A commercially available product can be used as the plastic film having a barrier layer. Moreover, it can be a film of a composite laminated metal foil and a plastic film. For example, as a commercial product of a polyethylene terephthalate film with an aluminum foil, "AL1N30 with PET" manufactured by Tokai Atsuhiro Aluminum Co., Ltd., "AL3025 with PET" manufactured by Fukuda Metal Co., Ltd., and PANAC Corporation" Alpet" and so on. In the support, a release treatment such as a silicone resin release agent, an alkyd resin release agent, or a fluororesin release agent, a matte treatment, a corona treatment, or the like can be performed. In the present invention, when the support has a release layer, the release layer can also be regarded as a part of the support. The thickness of the support is not particularly limited, but is preferably 20 to 200 μm, more preferably 20 to 125 μm from the viewpoint of workability and the like. Examples of the organic solvent include acetone, methyl ethyl ketone (hereinafter also referred to as "MEK"), ketones such as cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, and propylene glycol. Acetate such as monomethyl ether acetate or carbitol acetate, cellosolve, carbitol such as butyl carbitol, aromatic hydrocarbon such as toluene or xylene, dimethylformamidine Amine, dimethylacetamide, N-methylpyrrolidone, and the like. The organic solvent may be used singly or in combination of two or more. Although the drying conditions are not particularly limited, they are usually suitably about 50 to 100 ° C for about 3 to 15 minutes. The thickness of the resin composition layer after drying is usually from 3 μm to 200 μm, preferably from 5 μm to 100 μm, and more preferably from 5 μm to 50 μm. [0123] The resin composition layer can be protected with a protective film. By being protected by the protective film, adhesion or scratches to dust or the like on the surface of the resin composition layer can be prevented. The protective film is preferably a plastic film which is the same as the support. Further, the protective film may be subjected to a mold release treatment in addition to the matte treatment or the corona treatment. The thickness of the protective film is not particularly limited, but is usually in the range of 1 to 150 μm, preferably 10 to 100 μm. [0124] When the support sheet is a support having a moisture-proof property and a high transmittance, the sealing sheet can be directly cured by forming a sealing layer by laminating the sheet for sealing to a necessary position of the object to be sealed. A sealing structure having high moisture resistance is formed. The support having such a moisture-proof property and having a high transmittance can be exemplified by a plastic film having an inorganic material such as cerium oxide (cerium oxide), tantalum nitride, SiCN or amorphous enamel deposited on the surface. Examples of the plastic film include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, polyesters such as polyethylene terephthalate and polyethylene naphthalate, and polycarbonates. Imine and the like. As a plastic film, especially PET is preferred. Examples of the commercially available moisture-proof plastic film include TECHBARRIER HX, AX, LX, L series (manufactured by Mitsubishi Plastics Co., Ltd.) or X-BARRIER (manufactured by Mitsubishi Plastics Co., Ltd.) which further improves the moisture-proof effect. As the support, a multilayer structure having two or more layers can be used. <Organic EL device> When the organic EL device or the like for sealing the organic EL device is produced from the cured product of the resin composition of the present invention, it is suitable to use the above-mentioned sealing sheet for sealing. In the case where the sealing sheet-like resin composition layer is protected by a protective film, the resin sheet layer for sealing is directly bonded to the sealing target (for example, an organic EL element on the substrate formed of the organic EL element). Lamination is carried out in a contact manner. The lamination method may be a batch type or a continuous type of rolls. After lamination, the support is peeled off, and a heat hardening operation of the resin composition layer described later is performed. When the support for the sheet for sealing is a support having moisture resistance, after laminating the sheet for sealing, the non-peeling support directly performs a heat hardening operation of the resin composition layer to be described later. [0126] The hardening of the resin composition layer is usually performed by heat hardening. As such means, for example, heating by a hot air circulating oven, an infrared heater, a heat gun, a high frequency induction heating device, or a heating tool may be mentioned. The hardening temperature is preferably 50 ° C or higher, more preferably 55 ° C or higher, from the viewpoint of sufficiently satisfying the bonding strength of the hardened resin composition layer (sealing layer), and the curing time is preferably More than 10 minutes, more preferably more than 20 minutes. [Examples] Hereinafter, the present invention is specifically described by examples, but the present invention is not limited to the examples. In the following, unless otherwise stated, the unit of the "%" and the blending amount, which is the unit of the concentration, the water absorption rate, etc., that is, the "parts", means "% by mass" and "parts by mass" respectively. . As a hydrotalcite, all commercially available hydrotalcites are used. <Synthesis Example 1> Synthesis of ionic liquid hardener The N-acetylglycine tetrabutylphosphonium salt of the ionic liquid hardener was synthesized in the following order. 20.0 g of a 41.4% tetrabutylphosphonium hydroxide aqueous solution (manufactured by Kitagawa Chemical Co., Ltd.) was added, and 3.54 g of N-acetylglycine (manufactured by Tokyo Chemical Industry Co., Ltd.) was added at 0 ° C for 10 minutes. After stirring, the reaction solution was concentrated at 60 to 80 ° C for 2 hours using an evaporator at a pressure of 40 to 50 mmHg for 5 hours. The obtained concentrate was dissolved in 14.2 ml of ethyl acetate (manufactured by Junsei Chemical Co., Ltd.) at room temperature to prepare a solution, and the resulting solution was concentrated at 70 to 90 ° C for 3 hours using an evaporator at a pressure of 40 to 50 mmHg. 11.7 g (purity: 96.9%) of N-acetylglycine tetrabutylphosphonium salt as an oily compound. <Example 1> 60 parts of a liquid hydrogenated bisphenol A type epoxy resin ("YX8000" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205), and commercially available hydrotalcite A (semi-burned water) were kneaded. Talc, BET specific surface area: 13m2
After 40 parts of /g, average particle diameter: 400 nm), dispersion was carried out in a 3-roll mill to obtain a mixture. 1.5 parts of a hardening accelerator ("U-CAT3512T" manufactured by San-Apro Co., Ltd.) was dissolved in a phenoxy resin solution ("YX7200B35" manufactured by Mitsubishi Chemical Corporation, solvent: MEK, nonvolatile matter: 35%), 114.3 parts (resin a mixture of 40 parts), blended with a previously prepared mixture, and an ionic liquid hardener (N-acetylglycine tetrabutylphosphonium salt) 3 parts, uniformly dispersed in a high-speed rotary mixer to obtain a resin composition Varnish. [0130] Next, the resin composition is varnished on a support (polyethylene terephthalate film treated with a rhodium-based mold release agent, thickness: 38 μm, hereinafter abbreviated as "release PET film"), and dried. After the thickness of the resin composition layer was 20 μm, it was uniformly applied in a die coater, and after drying at 80 ° C for 5 minutes, a release PET film was placed on the surface of the resin composition layer as a protective film to obtain a seal. Sheet. <Example 2> Commercially available hydrotalcite B was used instead of hydrotalcite A (semi-fired hydrotalcite, BET specific surface area: 15 m)2
A resin composition varnish was produced in the same manner as in Example 1 except that /g and an average particle diameter: 400 nm), and a sheet for sealing was obtained. <Example 3> A solution of a solid hydrogenated bisphenol A type epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 1000) was used instead of the substituted phenoxy resin solution (114.3 parts). In the same manner as in Example 2, a resin composition varnish was produced in the same manner as in Example 2 except that 100 parts of the resin (40%) was used in the same manner as in Example 2, and a sheet for sealing was obtained. <Example 4> Except for 1.5 parts of a substitute hardening accelerator ("U-CAT3512T" manufactured by San-Apro Co., Ltd.), two parts of an imidazole curing agent ("1B2MZ" manufactured by Shikoku Kasei Co., Ltd.) were used. In the same manner as in Example 1, except that the resin composition varnish was produced in the same manner as in Example 2, a sheet for sealing was obtained. <Example 5> 30 parts of a liquid hydrogenated bisphenol A type epoxy resin ("YX8000" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205), and an acid anhydride curing agent ("MH manufactured by Nippon Chemical and Chemical Co., Ltd.") -700") 30 parts, commercially available hydrotalcite B (BET specific surface area: 13m2
After 40 parts of /g, average particle diameter: 400 nm), dispersion was carried out in a 3-roll mill to obtain a mixture. In a solution of a solid hydrogenated bisphenol A epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 1000) (solvent: MEK, nonvolatile matter: 40%), 100 parts (40 parts of resin), By dispersing a mixture of the previously prepared 3-roll mill and 2 parts of DBU-octyl acid salt hardening accelerator ("U-CAT SA102" manufactured by San-Apro Co., Ltd.) in a high-speed rotary mixer to obtain a uniform dispersion. Resin composition varnish. A sealing sheet was obtained in the same manner as in Example 1 except that the obtained resin composition varnish was used. [Example 6] The amount of use of the phenoxy resin solution (YX7200B35, manufactured by Mitsubishi Chemical Corporation, solvent: MEK, nonvolatile matter: 35%) was changed to 57.2 parts (20 parts of resin), and further used. In the same manner as in Example 2, except that 50 parts (solvent: 20 parts) of a solution (solvent: MEK, nonvolatile matter: 40%) of a solid hydrogenated bisphenol A type epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was used. A resin composition varnish was produced, and the same procedure as in Example 1 was carried out to obtain a sheet for sealing. [Example 7] In addition, the amount of use of the phenoxy resin solution ("YX7200B35" manufactured by Mitsubishi Chemical Corporation, solvent: MEK, nonvolatile matter: 35%) was changed to 85.7 parts (30 parts of resin), and further used. A mixture of a liquid bisphenol A type epoxy resin and a liquid bisphenol F type epoxy resin ("ZX-1059" manufactured by Nippon Steel Chemical Co., Ltd., epoxy equivalent: about 165), 10 parts, and other implementations In the same manner as in Example 1, except that the resin composition varnish was produced in the same manner as in Example 2, a sheet for sealing was obtained. <Comparative Example 1> In addition to replacing the liquid hydrogenated bisphenol A type epoxy resin, a mixture of a liquid bisphenol A type epoxy resin and a liquid bisphenol F type epoxy resin was used (Nippon Steel Chemical Industry Co., Ltd. A resin composition varnish was produced in the same manner as in Example 2 except that 60 parts of "ZX-1059" was used, and a sealing sheet was obtained in the same manner as in Example 1. <Comparative Example 2> A resin composition was produced in the same manner as in Example 1 except that 40 parts of the commercially available hydrotalcite C (calcined hydrotalcite, average particle diameter: 400 nm) was used instead of the hydrotalcite A. Varnish to obtain a sheet for sealing. <Comparative Example 3> A resin composition was produced in the same manner as in Example 1 except that 40 parts of commercially available hydrotalcite D (unfired hydrotalcite, average particle diameter: 400 nm) was used instead of hydrotalcite A. The varnish was obtained to obtain a sheet for sealing. <Water absorption rate of hydrotalcite> Each hydrotalcite was weighed to 1.5 g on a scale, and the initial mass was measured. The mixture was allowed to stand at atmospheric pressure at a temperature of 60 ° C and 90% RH (relative humidity) at room temperature for 200 hours, and the mass after moisture absorption was measured. The saturated water absorption was obtained by the above formula (i). rate. The results are shown in Table 1. <Thermal weight reduction rate of hydrotalcite> The thermogravimetric analysis of each hydrotalcite was performed using TG/DTA EXSTAR6300 manufactured by Hitachi High-Technologies Corporation. A 10 mg hydrotalcite was weighed in a sample tray made of aluminum, and the temperature was raised from 30 ° C to 550 ° C at a temperature increase rate of 10 ° C / min in an unopened open state in an environment of a nitrogen flow rate of 200 mL / min. Using the above formula (ii), the thermal weight reduction rate at 280 ° C and 380 ° C was determined. The results are shown in Table 1. <Powder X-ray diffraction> The measurement of powder X-ray diffraction was performed by a powder X-ray diffraction apparatus (Empyrean, manufactured by PANalytical Co., Ltd.), a cathode CuKα (1.5405 Å), a voltage: 45 V, and a current: 40 mA. The sampling width is 0.0260 ̊, the scanning speed is 0.0657 ̊/s, and the measurement of the diffraction angle range (2θ): 5.0131 to 79.9711 ̊ is performed. The peak search system uses the peak search function of the software attached to the diffraction device to "minimum saliency: 0.50, minimum peak wafer: 0.01 ̊, maximum peak wafer: 1.00 ̊, peak base width: 2.00 ̊, method: 2 differentials The condition of the minimum value is carried out. Detecting the peaks of the split occurring in the range of 8 to 18 2 2θ, or having the peak of the shoulder by the synthesis of the two peaks, measuring the peak appearing at the low angle side or the diffraction intensity of the shoulder (= low-angle side diffraction intensity), peak with high-angle side or diffraction intensity of shoulder (= high-angle side diffraction intensity), calculate relative intensity ratio (= low-angle side diffraction intensity / high-angle side diffraction strength). The results are shown in Table 1. [0143][0144] From the results of saturated water absorption, thermal weight reduction, and powder X-ray diffraction, hydrotalcite A, hydrotalcite B, hydrotalcite E, and hydrotalcite F are "semi-fired hydrotalcite" and hydrotalcite C is " Boiled hydrotalcite", hydrotalcite D is "unfired hydrotalcite". <Refractive Index of Hardened Material of Resin Composition> The sealing sheets obtained in the examples and the comparative examples were cut into a length of 70 mm and a width of 25 mm, and the protective film was peeled off from the cut sealing sheet (release PET) Film), the sealing sheet was applied to a glass plate (microscope slide having a length of 76 mm, a width of 26 mm, and a thickness of 1.2 mm, and a white glass slide S1112 manufactured by Songlang Glass Industry Co., Ltd.) using a batch vacuum laminator. (Nichigo-Morton Co., Ltd., V-160) laminated. The lamination conditions were a temperature of 80 ° C, a depressurization time of 30 seconds, and a pressure of 0.3 MPa for 30 seconds. Then, the support for the sealing sheet (release PET film) was peeled off, and heat-cured at 130 ° C for 60 minutes in a heat cycle oven to obtain a laminate for evaluation of the cured layer of the resin composition and the glass. [0146] The refractive index measurement was performed using a prism coupler (model 2010/M) manufactured by Metricon Co., Ltd., using laser light having a wavelength of 594 nm. The prism for the evaluation is placed by the prism of the air pressure transmission coupling head in the apparatus in contact with the surface of the cured layer of the evaluation sample. While the laser is irradiated, the angle between the prism and the sample is changed, and total reflection is performed. The laser light introduced by the photodetector is called the mode angle value, and is propagated from the air to the inside of the sample to reach the laser light of the detector. The light intensity is initially lowered sharply, and the position (dip) of the light transmission mode is confirmed, thereby determining the refractive index. The results are shown in Table 2. <Parallel line transmittance of the cured product of the resin composition> The sealing sheets obtained in the examples and the comparative examples were cut into a length of 70 mm and a width of 25 mm, and the protective film was peeled off from the cut sealing sheet. A molded PET film), the sealing sheet was applied to a glass plate (microscope slide having a length of 76 mm, a width of 26 mm, and a thickness of 1.2 mm, and a white glass slide S1112 manufactured by Songlang Glass Industry Co., Ltd.) using a batch vacuum layer. A press (manufactured by Nichigo-Morton Co., Ltd., V-160) was laminated. The lamination conditions were a temperature of 80 ° C, a depressurization time of 30 seconds, and a pressure of 0.3 MPa for 30 seconds. Then, the support for the sealing sheet (release PET film) was peeled off, and the laminate was laminated on the exposed resin composition layer in the same manner as described above to prepare a laminate. The obtained laminate was heated at 130 ° C for 60 minutes in a heat cycle oven to obtain a laminate having a cured product of a resin composition between the glass plates (the thickness of the sample for evaluation and the cured product: 20 μm). [0148] Using a haze meter HZ-V3 (halogen lamp) manufactured by Suga Test Instruments Co., Ltd., air was used as a reference, and the parallel line transmittance Tp (%) of the sample for evaluation of D65 light was evaluated by the following criteria. The results are shown in Table 2. (Base of parallel line transmittance) Good (○): 85% or more (△): Less than 85%, 80% or more is not good (×): Less than 80% [0149] <Lighting area reduction start time> Except An aluminum foil/PET composite film "AL1N30 with PET" (aluminum foil: 30 μm, PET: 25 μm, manufactured by Tokai Toyo Aluminum Co., Ltd.) was used as a support, and other examples were carried out in the same manner as in the respective examples and comparative examples. The sheet for sealing of the resin composition layer similar to each of the examples and the comparative examples. [0150] The alkali-free glass was washed with boiling isopropyl alcohol for 5 minutes at 50 mm × 50 mm square, and dried at 150 ° C for 30 minutes or more. Using this glass, a calcium film (purity: 99.8%) (thickness: 300 nm) was vapor-deposited using a mask having a distance of 3 mm from the end. In the glove box, the alkali-free glass of the calcium-deposited film and the sealing sheet having the same resin composition layer as those of the respective examples and comparative examples were subjected to a heat laminator (Rami Packer DAiSY A4 (LPD2325) manufactured by Fujipura Co., Ltd.). ) Fit to modulate the laminate. The obtained laminate was heated at a temperature of 130 ° C for 60 minutes to harden the resin composition layer, thereby obtaining a sample for evaluation. [0151] When calcium contacts water to become calcium oxide, it becomes transparent. Therefore, the moisture intrusion into the sample for evaluation can be evaluated by measuring the distance (mm) from the end of the sample for evaluation to the calcium film. Therefore, the sample for evaluation containing the calcium film was used as a model of the organic EL device including the organic EL element. First, the distance from the end of the sample for evaluation to the calcium film was measured by a Measuring Microscope MF-U manufactured by Mitutoyo Corporation, and the value was set to X2. Next, a sample for evaluation was placed in a constant temperature and humidity chamber set at a temperature of 85 ° C and a humidity of 85% RH. The sealing distance X1 (mm) from the end of the evaluation sample to the calcium film after the input of the constant temperature and humidity chamber is from the end of the evaluation sample to the calcium film before the input of the constant temperature and humidity chamber The sealing distance X2 (mm) was increased by 0.1 mm, and the sample for evaluation was taken out from the constant temperature and humidity chamber, and this time was taken as the reduction start time t (time). The fixed number K was calculated from the following Fick diffusion equation. X1=K√t (wherein X1 is the sealing distance (mm) from the end of the evaluation sample to the calcium film after the input to the constant temperature and humidity chamber, and t is the decrease start time of X1=X2+0.1 (Time), X2 is a sealing distance (mm) from the end of the evaluation sample to the calcium film before the input to the constant temperature and humidity chamber. Using the obtained K, the time when X1 became a value of 5 mm was calculated as the light-emitting area reduction start time, and was evaluated based on the following criteria. The higher the moisture repellency, the slower the rate of moisture intrusion, and the decrease in the start time of the luminescent area. The results are shown in Table 2. In addition, the "h" of the unit described in Table 2 means "hour". (Base of the light-emitting area reduction start time) Good (○): 300 hours or more (△): less than 300 hours, 200 hours or more is not good (×): less than 200 hours [0156] In Table 2, except for implementation In addition to the results of the refractive index and the like of the cured product obtained in the examples and the comparative examples, the types and amounts of the components to be used are also described. [0157][Industrial Applicability] The sealing resin composition of the present invention can form a sealing layer which is excellent in both moisture barrier properties and transparency. Therefore, the sealing resin composition and the sealing sheet of the present invention can be suitably used for sealing an element having a weak moisture such as an organic EL element. [0159] The present application is based on Japanese Patent Application No. 2016-196395, the entire contents of which are incorporated herein by reference.