TW201827328A - Micromechanical component and production method for a micromechanical component - Google Patents

Abstract

The invention relates to a micromechanical component having a repositionable part (12) which is held to be repositionable about at least one axis of rotation (18) on a holder (10) between the first spring (16a) and a second spring (16b), at least one first piezoelectric actuator (14a) which is formed on at least one first actuator carrier (20a) that is directly or indirectly bound on the first spring (16a); and at least one second piezoelectric actuator (14b) which is formed on at least one second actuator carrier (20b) that is directly or indirectly bound on the second spring (16b), wherein the repositionable part (12) is at least partly structured out of a substrate, and at least the first spring (16a), the at least one first actuator carrier (20a), the second spring (16b) and the at least one second actuator carrier (20b) are structured out of the functional layer. Likewise, the invention relates to a production method for a micromechanical component.

Description

 Micromechanical component and manufacturing method of micromechanical component  

This invention relates to micromechanical components. Also, the present invention relates to a method of manufacturing a micromechanical component.

No. 8 508 826 B2 has described a micromirror device using a piezoelectric actuator for repositioning a repositionable mirror panel around at least one axis of rotation. In one embodiment, the repositionable mirror panel is retained on the holder between the first spring and the second spring, wherein the specific example additionally has two actuator carriers coupled to the first spring and coupled to the second Two additional actuator carriers of the spring. Piezoelectric actuators formed on four actuator carriers should be capable of repositioning the repositionable mirror panel about the axis of rotation. The repositionable mirror panel, the first spring, the second spring, and a total of four actuator carriers are structured from a single semiconductor layer.

The present invention develops a micromechanical component having the features of claim 1 and a method of manufacturing a micromechanical component having the features of claim 8 of the patent application.

Advantages of the invention

The micromechanical assembly created by the present invention can be fabricated in a relatively simple manner but having a first layer thickness of the repositionable part and a first spring, at least one first actuator carrier, a second spring, and at least one second actuator carrier The thickness of the second layer, the thickness of the second layer is significantly less than the thickness of the first layer. The repositionable part thus has a relatively thick concrete example such that it is not necessary/almost unnecessary to worry about (dynamic) deformation of the relocatable part during its repositioning movement around the axis of rotation. In contrast, the first spring, the at least one first actuator carrier, the second spring, and the at least one second actuator carrier have relatively thin specific examples such that they have low rigidity (or high flexibility/deformability) Sex). Furthermore, a bimetallic effect can be advantageously used which is amplified by a relatively thin specific example of at least one first actuator carrier and at least one second actuator carrier.

The invention also improves the usability of piezoelectric actuators as drivers for micromechanical components. A prominent feature of piezoelectric actuators is the relatively short travel with high actuator force at the same time. Therefore, a large amount of energy can be transmitted per cycle (although the path is short). Furthermore, piezoelectric actuators require relatively little power, and thus power supply of micromechanical components equipped with such piezoelectric actuators can be easily ensured. Accordingly, the present invention contributes to an improved use of piezoelectric actuators as an ideal driver for the desired repositioning motion of a repositionable component, in particular for relocatable The part performs a high frequency resonance repositioning motion around the axis of rotation.

In an advantageous embodiment of the micromechanical component, at least one first additional mass is bonded to the at least one first actuator carrier and/or the at least one second additional mass is coupled to the at least one second actuator carrier on. By incorporating at least one first additional mass onto at least one first actuator carrier and/or bonding at least one second additional mass to at least one second actuator carrier, Triggering of the transfer of the repositionable part around the desired repositioning movement of the rotating shaft to the repositionable part. In particular, at least one first additional mass and/or at least one second additional mass may be structured from the substrate. Thus, it is easy to manufacture and the specific examples of the micromechanical components described herein can be advantageously used.

In another advantageous embodiment of the micromechanical assembly, the at least one first actuator carrier is coupled to the at least one second actuator carrier by means of at least one actuator coupling spring. In-phase vibration and anti-phase vibration of the actuator carriers connected to each other can be more reliably maintained by adding at least one actuator coupling spring. Preferably, at least one actuator is coupled to the spring by a functional layer. It is thus easy to manufacture at least one actuator coupling spring that can be advantageously used.

By way of example, the at least one actuator coupling spring can be U-shaped, O-shaped, meander-shaped and/or web-shaped. Thus, a spring type that can be easily structured by it can be used for at least one actuator coupling spring.

As an alternative or in addition to forming at least one actuator coupling spring on the micromechanical assembly, at least one first actuator carrier and/or at least one second may also be coupled by means of at least one holder coupling spring The actuator carrier is coupled to the holder. By means of the at least one holder coupling the spring, it is possible to limit the deflection of the at least one first actuator carrier and/or the at least one second actuator carrier such that the friction force (which must be overcome for at least one first The energy lost by the actuator carrier and/or the deflection of the at least one second actuator carrier is less. The at least one retainer can be coupled to the spring by a functional layer. Therefore, at least one holder coupling spring can also be formed with relatively little work expenditure.

Likewise, the first spring and/or the second spring can be coupled to the holder by means of at least one coupling spring. By forming at least one coupling spring (instead of or in addition to at least one actuator coupling spring and/or at least one holder coupling spring), it is also possible to ensure the use of pulse transmission for revolving parts around rotation The target excitation of the axis is to reposition the motion, the pulse transmission being triggered by the at least partially deformed first piezoelectric actuator and/or the at least partially deformed second piezoelectric actuator. At least one coupling spring can be structured by the functional layer. Therefore, the at least one coupling spring can also be made highly flexible in a simple manner.

Preferably, the micromechanical component is a micromirror having a repositionable mirror panel as a repositionable part. However, reference is made to the fact that the use possibilities of the present invention are not limited to micromirrors.

The advantages described above are also achieved by performing corresponding manufacturing methods for the micromechanical components. With explicit reference to this fact: The manufacturing method can be developed in accordance with the specific examples of the micromechanical components described above.

10‧‧‧Retainer

12‧‧‧Relocatable parts

12a‧‧‧Reflective surface

14a‧‧‧First Piezoelectric Actuator

14b‧‧‧Second Piezoelectric Actuator

16a‧‧‧First spring

16b‧‧‧Second spring

18‧‧‧Rotary axis

20a‧‧‧First actuator carrier

20b‧‧‧Second actuator carrier

22‧‧‧Substrate/carrier layer

24‧‧‧ functional layer

26a‧‧‧First extra block

26b‧‧‧second extra block

28‧‧‧Actuator coupling spring

30a‧‧‧First web components

30b‧‧‧second web components

32‧‧‧Internal framework

34a‧‧‧First extra block

34b‧‧‧second extra mass

36a‧‧‧first mass carrier

36b‧‧‧Second mass carrier

38‧‧‧Retainer coupling spring

40‧‧‧coupled spring

42‧‧‧External or intermediate frame

Further features and advantages of the present invention are explained below based on the drawings. In the drawings: Figures 1a to 1c show schematic illustrations of a first specific example of a micromechanical component; Figures 2a to 2c show schematic illustrations of a second specific example of a micromechanical component; Figures 3a to 3c show micro Schematic illustration of a third specific example of a mechanical assembly; Figures 4a to 4c show schematic illustrations of a fourth specific example of a micromechanical assembly; Figures 5a to 5c show schematic illustrations of a fifth specific example of a micromechanical assembly; Figures 6a to 6c show schematic illustrations of a sixth embodiment of a micromechanical assembly; Figures 7a and 7b show schematic illustrations of a seventh embodiment of a micromechanical assembly; Figures 8a and 8b show an eighth embodiment of a micromechanical assembly Schematic illustration of a specific example; Figures 9a and 9b show schematic illustrations of a ninth embodiment of a micromechanical assembly; Figures 10a and 10b show a schematic illustration of a tenth embodiment of a micromechanical assembly; and Figure 11 shows A flow chart explaining a specific example of a manufacturing method of a micromechanical component.

Figures 1a to 1c show schematic illustrations of a first specific example of a micromechanical assembly, wherein Figure 1a shows a plan view, Figure 1b shows a cross section along line AA' in Figure 1a, and Figure 1c shows along Figure 1a The cross section of the line B-B'.

The micromechanical assembly schematically reproduced by means of Figures 1a to 1c comprises a holder 10, a repositionable part 12, at least one first piezoelectric actuator 14a and at least one second piezoelectric actuator 14b.

The repositionable part 12 is retained on the holder 10 between the first spring 16a and the second spring 16b such that the repositionable part 12 can be repositioned relative to the holder 10 about the at least one axis of rotation 18. In the specific example described herein, the micromechanical assembly is implemented in an illustrative manner with a repositionable mirror panel 12 (specifically having a reflective surface 12a formed on the repositionable part 12) as a relocatable part 12 micromirrors. However, reference is made to the fact that instead of the repositionable mirror panel 12, the micromechanical assembly can also have repositionable parts 12 that are implemented in different ways.

At least one first piezoelectric actuator 14a is formed on or formed at least on the first actuator carrier 20a directly or indirectly on the first spring 16a (see figure) 1c). Correspondingly, at least one second piezoelectric actuator 14b is formed on or formed at least on the second actuator carrier 20b directly or indirectly on the second spring 16b. . The at least one first piezoelectric actuator 14a and the at least one second piezoelectric actuator 14b each comprise at least one piezoelectric layer. Preferably, the at least one piezoelectric layer is at least partially (in detail) completely covered by the sides of the actuator carriers 20a and 20b that are directed away from the reflective surface 12a. By way of example, the at least one piezoelectric layer may comprise a lead zirconate titanate and/or a bimetallic layer construction. However, instead of or in addition to the lead zirconate titanate and/or bimetallic layer, at least one other piezoelectric material may be present in at least one of the piezoelectric layers, the form of which may be modified by means of an electric field. Furthermore, the at least one first piezoelectric actuator 14a and the at least one second piezoelectric actuator 14b are each implemented such that at least one voltage can be applied to the at least one first piezoelectric actuator 14a and the at least one second pressure At least one piezoelectric layer of the electric actuator 14b. However, for reasons of improved clarity, the plotted electrodes of at least one first piezoelectric actuator 14a and at least one second piezoelectric actuator 14b have been omitted in FIGS. 1a to 1c (eg by Made of platinum). At least one first piezoelectric actuator 14a and / is applied by applying at least one voltage to at least one piezoelectric layer of at least one first piezoelectric actuator 14a and/or at least one second piezoelectric actuator 14b Or at least one second piezoelectric actuator 14b is at least partially deformable, and thus can be caused by/by at least partially deforming the first piezoelectric actuator 14a and/or at least partially deforming the second piezoelectric The pulsed transmission triggered by the actuator 14b causes the repositionable part 12 to reposition the motion about the axis of rotation 18.

Therefore, the repositionable part 12 can be subjected to a desired repositioning motion about the rotating shaft 18 by the in-phase bending movement or the reverse bending movement of the piezoelectric actuators 14a and 14b. In particular, the repositionable part 12 can be resonantly vibrated about the axis of rotation 18 by virtue of a change in the natural frequency of the at least one applied voltage with respect to the repositioning motion of the repositionable part 12 relative to the holder 10. Positioning movement). In this way, it is possible to cause deflection of the repositionable part 12 which is significantly larger than the bending movement of the piezoelectric actuators 14a and 14b. Therefore, the power lost by the friction is relatively small, and the friction is overcome when the bending movement of the piezoelectric actuators 14a and 14b is performed.

Furthermore, the relocatable part 12 is at least partially structured by the substrate/carrier layer 22 in the micromechanical assembly of Figure 1, while the at least first spring 16a, at least one first actuator carrier 20a, is structured by the functional layer 24. The second spring 16b and the at least one second actuator carrier 20b. The structuring of the repositionable part 12 by the substrate 22 facilitates a specific example of the repositionable part 12 having a first layer thickness d1 (aligned perpendicular to the axis of rotation 18, possibly aligned perpendicular to the reflective surface 12a) ) which is significantly larger than the second layer thickness d2 of the first spring 16a, the second spring 16b, the at least one first actuator carrier 20a and the at least one second actuator carrier 20b (aligned perpendicular to the axis of rotation 18, It is possible to align perpendicular to the reflective surface 12a). Thus, during the repositioning motion of the repositionable part 12 about the axis of rotation 18, it is not necessary/almost unnecessary to worry about the bending/arching of the repositionable part 12, in particular the reflective surface that may be implemented on the repositionable part 12. In contrast, the at least one first piezoelectric carrier 20a and the at least one second piezoelectric carrier 20b have a relatively high flexibility (or low rigidity) and thus ensure respective pressures formed thereon or formed therein Good deformability of the electric actuator 14a or 14b. The first spring 16a and the second spring 16b also have high flexibility (or low rigidity) and thus reliably satisfy their spring function.

As an advantageous development, at least one first additional mass 26a in the micromechanical assembly of Figures 1a to 1c is bonded to at least one first actuator carrier 20a and at least one second additional mass 26b is bonded to at least one On the second actuator carrier 20b. The additional masses 26a and 26b may cause local stiffening of the assigned actuator carrier 20a or 20b, respectively, and/or (as a balance) (only) target excitation of the repositionable part 12 about the repositioning of the rotating shaft 18. The additional masses 26a and 26b can also advantageously affect the amplitude of the actuator carriers 20a and 20b, and thus optimize the ratio of the input coupling force to the deflection of the repositionable part 12 (around the axis of rotation 18). In addition, the extra blocks 26a and 26b have a positive impact on the mode spectrum, that is to say in detail to facilitate the optimization of the mode spectrum. In addition, the additional blocks 26a and 26b are suitable for use as a docking structure. Preferably, the additional blocks 26a and 26b are also structured from the substrate 22. The development of the micromechanical components described herein can thus be achieved with relatively little effort.

In the specific example of FIGS. 1a to 1c, the first spring 16a and the second spring 16b have a specific example of a web shape/rod shape and extend along the rotation shaft 18. Therefore, the first spring 16a and the second spring 16b may each be referred to as a torsion spring. The anchoring regions of the first spring 16a and the second spring 16b on the repositionable part 12 are on the rotating shaft 18.

Each of the springs 16a and 16b has an integral specific example having two assigned first actuator carriers 20a or second actuator carriers 20b (having a mirror-symmetric specific example with respect to the axis of rotation 18) . The actuator carriers 20a and 20b have a twisted/angular form such that in each of the actuator carriers 20a and 20b, a first web/rod portion extending along the first longitudinal axis, respectively, The intermediate section is coupled to a second web/rod portion that extends along a second longitudinal axis that is aligned perpendicular to the first longitudinal axis, respectively. The first longitudinal direction of the first web/rod portion may be aligned parallel to the axis of rotation 18, while the second longitudinal direction of the second web/rod portion is aligned perpendicular to the axis of rotation 18. In each case, the first additional block 26a or the second additional block 26b is bonded to the first web/rod portion of the respective first actuator carrier 20a or second actuator carrier 20b. The first end (guided away from the intermediate section) and the second end of the second web/rod portion of the same first actuator carrier 20a or second actuator carrier 20b To be away from the intermediate section) is coupled to the associated first spring 16a or second spring 16b.

Furthermore, in the embodiment of FIGS. 1a to 1c, the first actuator carrier 20a and the second actuator carrier 20b disposed on the same side of the rotating shaft 18 are connected to each other via an actuator coupling spring 28, respectively. . In an exemplary manner, the respective actuator coupling springs 28 are anchored to the first ends of the actuator carriers 20a and 20b such that the actuator carriers 20a and 20b and the two actuator coupling springs 28 form a surrounding weight Position the frame of the part 12. The respective actuator coupling springs 28 are U-shaped in an exemplary manner. The at least one actuator coupling spring 28 can likewise be structured by the functional layer 24. The at least one actuator coupling spring 28 preferably has a width (in the image plane) that is less than half the width (in the image plane) of the actuator carriers 20a and 20b.

Figures 2a to 2c show schematic illustrations of a second specific example of a micromechanical assembly, wherein Figure 2a shows a plan view, Figure 2b shows a cross section along line AA' in Figure 2a, and Figure 2c shows along Figure 2a The cross section of the line B-B'.

The micromechanical assembly schematically reproduced by means of Figures 2a to 2c differs from the previous specific example only in that the repositionable part 12 is inserted into the first web element 30a and the second web element 30b of the inner frame 32. The inner frame 32 is coupled to the holder 10 between the first spring 16a and the second spring 16b. Preferably, the web members 30a and 30b extend perpendicular to the axis of rotation 18. Thus, the anchoring regions of the web members 30a and 30b (and the anchoring regions of the indirect springs 16a and 16b) are in the region of maximum retractable or orthogonal to the axis of rotation 18 on the region of the repositionable part 12.

Figures 3a to 3c show schematic illustrations of a third embodiment of a micromechanical assembly, wherein Figure 3a shows a plan view, Figure 3b shows a cross section along line AA' in Figure 3a, and Figure 3c shows along Figure 3a The cross section of the line B-B'.

In the particular example of FIGS. 3a-3c, the actuator coupling spring 28 is anchored to the first web/rod portion of the assigned actuator carrier 20a and 20b that is oriented away from the axis of rotation 18. On the side surface, wherein the anchoring region of the actuator coupling spring 28 is preferably adjacent the side of the additional mass 26a or 26b that is directed away from the first end. With regard to other properties of the specific examples in Figures 3a to 3c, reference is made to the description of the foregoing specific examples.

Figures 4a to 4c show schematic illustrations of a fourth specific example of a micromechanical assembly, wherein Figure 4a shows a plan view, Figure 4b shows a cross section along line AA' in Figure 4a, and Figure 4c shows along Figure 4a The cross section of the line B-B'.

The micromechanical assembly schematically reproduced by means of Figures 4a to 4c differs from the embodiment of Figures 1a to 1c only in the specific example in which the actuator coupling spring 28 has an O-shape. This can be understood to mean that each of the actuator coupling springs 28 has an O-shaped intermediate section between the two web-shaped end sections.

As an alternative to the O-shaped embodiment of the actuator coupling spring 28, such actuator coupling springs 28 may also have specific examples of meandering and/or web shapes.

Figures 5a to 5c show schematic illustrations of a fifth specific example of a micromechanical assembly, wherein Figure 5a shows a plan view, Figure 5b shows a cross section along line AA' in Figure 5a, and Figure 5c shows along Figure 5a The cross section of the line B-B'.

In addition to the specific example in Fig. 1, the micromechanical assembly schematically reproduced by means of Figs. 5a to 5c still has an additional first extra mass 34a and a second additional mass 34b, in each case The lower portion is coupled to the intermediate section of the twisted/angled actuator carriers 20a and 20b. Additional first additional chunks 34a and second additional chunks 34b may also be structured from substrate 22.

Figures 6a to 6c show schematic illustrations of a sixth embodiment of a micromechanical assembly, wherein Figure 6a shows a plan view, Figure 6b shows a cross section along line AA' in Figure 6a, and Figure 6c shows along Figure 6a The cross section of the line B-B'.

In addition to the micromechanical assembly of Figure 1, the specific examples of Figures 6a through 6c also have additional first additional mass 34a and second additional mass 34b. However, for the purpose of combining the respective first additional mass 34a or second additional mass 34b, the first bulk carrier 36a or the second mass carrier 36b is combined in each case with the assigned one. The respective intermediate sections of the first actuator carrier 20a or the second actuator carrier 20b are guided on a side remote from the first end.

Figures 7a and 7b show schematic illustrations of a seventh embodiment of a micromechanical assembly, wherein Figure 7a shows a plan view and Figure 7b shows a cross section along line AA' in Figure 7a.

The micromechanical assembly schematically reproduced by means of Figures 7a and 7b differs from the specific examples described above in that the actuator carriers 20a and 20b have a rod shape and are remote from the assigned one in a manner perpendicular to the axis of rotation 18. The first spring 16a or the second spring 16b extends. The additional masses 26a and 26b continue to be bonded to the first end of the assigned first actuator carrier 20a or second actuator carrier 20b (guided away from the assigned first spring 16a or second spring 16b) ). Therefore, the extra blocks 26a and 26b are placed closer to the springs 16a and 16b. Thus, the additional blocks 26a and 26b are joined to the anchoring region of the repositionable part 12 that is closer to the springs 16a and 16b. An actuator coupling spring 28 is anchored to the side surfaces of the actuator carriers 20a and 20b that extend from the first end to the second end, wherein each actuator coupling spring 28 is anchored thereto The actuator carriers 20a and 20b are on the side surfaces aligned with each other.

Figures 8a and 8b show schematic illustrations of an eighth embodiment of a micromechanical assembly, wherein Figure 8a shows a plan view and Figure 8b shows a cross section along line AA' in Figure 8a.

In addition to the specific example described above (and in lieu of the actuator coupling spring 28), the micromechanical assembly illustrated in Figures 8a and 8b has a holder coupling spring 38, one of which is coupled The springs 38 respectively connect the assigned first actuator carrier 20a or second actuator carrier 20b to the holder 10. Preferably, the holder coupling spring 38 is coupled to the assigned first actuator carrier 20a or second actuator carrier 20b aligned with respect to the holder 10 from the first end to the second end. On the side surface.

Figures 9a and 9b show schematic illustrations of a ninth embodiment of a micromechanical assembly, wherein Figure 9a shows a plan view and Figure 9b shows a cross section along line AA' in Figure 9a.

The specific embodiment of Figures 9a and 9b differs from the micromechanical assembly of Figures 7a and 7b in that it is anchored to the holder 10 at the first end of the actuator carriers 20a and 20b. Guided (away from the assigned first spring 16a or second spring 16b). Furthermore, a first additional block 26a or a second additional block 26b is respectively bonded to the two second ends of the first actuator carrier 20a or the second actuator carrier 20b, the second end anchors It is assigned to the assigned first spring 16a or second spring 16b.

Figures 10a and 10b show schematic illustrations of a tenth embodiment of a micromechanical assembly, wherein Figure 10a shows a plan view and Figure 10b shows a cross section along line AA' in Figure 10a.

The micromechanical assembly schematically reproduced by means of Figures 10a and 10b differs from the specific examples described above by virtue of its specific example of coupling spring 40 (instead of actuator coupling spring 28). Here, the first spring 16a and the second spring 16b are connected to the holder 10 by means of at least one coupling spring 40. Preferably, two coupling springs 40 are anchored to each of the first springs 16a or the second springs 16b that extend from the side of the assigned first spring 16a or second spring 16b that faces away from each other. To the holder 10. In detail, the coupling spring 40 may have a mirror-symmetric specific example with respect to the rotating shaft 18.

In the specific examples described above, the substrate/carrier layer 22 (or at least one component structured therefrom) can have a first layer thickness d1 of, for example, between 50 pm and 500 pm (micrometers). Functional layer 24 (or at least one component structured therefrom) can have a second layer thickness d2 of, for example, between 5 pm and 50 pm (micrometers). However, the numerical values mentioned herein should be construed as merely illustrative.

In the particular example described above, the first spring 16a and the second spring 16b are anchored to the outer frame or intermediate frame 42 in an illustrative manner. The outer frame or intermediate frame 42 preferably includes a first partial frame that has been structured by the substrate 22 and a second partial frame that has been structured by the functional layer 24. In particular, the outer frame or intermediate frame 42 can be a portion of the holder 10 or the holder 10 as the outer frame 42. However, reference is also made to the fact that the outer frame or intermediate frame 42 can be repositioned relative to the holder 10 as the intermediate frame 42. By way of example, the intermediate frame 42 can be repositioned relative to the holder 10 about another axis of rotation that is aligned with respect to one of the axes of rotation 18, in particular perpendicular to the axis of rotation 18.

This fact is explicitly referred to: the substrate 22 (or carrier layer) and the functional layer 24 are two different layers 22 and 24 in all of the above specific examples. Thus, neither the substrate/carrier layer 22 nor the substrate/carrier layer 22 should be understood as the functional layer 24. Preferably, at least the remainder of the structured substrate/structured carrier layer 22 has a first layer thickness d1 that is (significantly) greater than a second layer thickness d2 of at least the remainder of the functional layer 24. Substrate/carrier layer 22 and/or functional layer 24 are preferably made of at least one semiconductor material such as germanium. However, reference is made to the fact that the substrate/carrier layer 22 and the functional layer 24 are not limited to a particular material/semiconductor material. Further, the substrate 22 (or carrier layer) and the functional layer 24 may also be composed of different materials.

Substrate 22 (or carrier layer) and functional layer 24 can be an assembly of SOI wafers (twisted on insulator). Locally, at least one residue of the structured substrate/structured carrier layer 22 and at least one residue of the functional layer 24 may continue to be connected to each other by an oxide (not shown here).

All of the above micromechanical components are implemented as a "three layer system" in which a first layer is structured from a substrate 22 (or carrier layer) and a second layer is structured by a functional layer 24. The third layer is realized by forming the piezoelectric actuators 14a and 14b, for example, by depositing the material of the electrode and the at least one piezoelectric layer.

In particular, the micromechanical assembly described above can be advantageously used in projection or LIDAR systems.

Figure 11 shows a flow chart for explaining a specific example of a method of manufacturing a micromechanical component.

The manufacturing methods described below can be used (in detail) to make one of the specific examples of the micromechanical components explained above. However, reference is made to the fact that the achievability of the manufacturing method described below is not limited to the manufacture of a specific type of micromechanical component.

The manufacturing method comprises method steps S1 and S2 by means of which the relocatable part is suspended on the holder between the first spring and the second spring such that the repositionable part can rotate around at least one of the holder Axis repositioning. As method step S1, the relocatable part is structured, at least in part, from a substrate (or carrier layer). In method step S2, at least a first spring, a second spring, at least one first actuator carrier that is directly or indirectly coupled to the first spring, and directly or indirectly coupled to the second At least one second actuator carrier on the spring. This fact is explicitly referred to: the substrate (or carrier layer) and the functional layer should be understood to mean different materials.

Furthermore, the manufacturing method has a method step S3, wherein at least one first piezoelectric actuator is formed on at least one first actuator carrier and at least one second piezoelectric actuator is formed on at least one second actuator carrier Above, each piezoelectric actuator has at least one piezoelectric layer. The at least one first piezoelectric actuator and the at least one second piezoelectric actuator are each implemented to apply at least one voltage to the at least one first piezoelectric actuator and the at least one second piezoelectric in each case At least one piezoelectric layer of the actuator. Performing this operation ensures that at least one voltage is applied to at least one piezoelectric layer of at least one first piezoelectric actuator and/or at least one second piezoelectric actuator during operation of the micromechanical component, at least one A piezoelectric actuator and/or at least one second piezoelectric actuator is at least partially deformed by means of at least one first piezoelectric actuator that is at least partially deformed and/or at least partially deformed by at least one second Piezoelectric actuator-triggered pulse transmission causes the repositionable part to reposition motion about the axis of rotation.

Performing the manufacturing methods described herein also provides the advantages explained above.

Method steps S1 to S3 can be performed in any time series. At least two of the method steps S1 to S3 may also be performed simultaneously or overlap in time.

The materials already described above can be used in method steps S1 to S3.

In particular, for method steps S1 and S2, a side having at least one insulating layer that at least partially covers the substrate and a functional layer that is at least partially formed on the side that is oriented away from the at least one insulating layer of the substrate can be used. The upper substrate is used as a starting material.

As a development of method step S1, it is still possible (in addition) to be structurally bonded by the substrate to (subsequently) at least one first additional mass on the at least one first actuator carrier and/or to (subsequently) at least one At least one second additional mass on the second actuator carrier.

The method step S2 can also be expanded: by means of the example, at least one actuator coupling can be coupled to the at least one actuator carrier of the at least one second actuator carrier by the functional layer. As an alternative or in addition thereto, it is also possible for the functional layer to structure the at least one first actuator carrier and/or the at least one second actuator carrier to the at least one holder coupling spring of the holder. Likewise, it is also possible for the functional layer to be structured in the method step S2 to connect the first spring and/or the second spring to the at least one coupling spring of the holder.

Claims (13)

 A micromechanical assembly having: a holder (10); a repositionable component (12) held by the holder (10) in a first spring (16a) and a second spring (16b) The repositionable part (12) is repositionable relative to the holder (10) about at least one axis of rotation (18); at least one first piezoelectric actuator (14a) formed directly or indirectly Bonded to at least one first actuator carrier (20a) on the first spring (16a); and at least one second piezoelectric actuator (14b) formed to be directly or indirectly bonded thereto At least one second actuator carrier (20b) on the second spring (16b); wherein the at least one first piezoelectric actuator (14a) and the at least one second piezoelectric actuator (14b) are each Including at least one piezoelectric layer and each being implemented such that at least one voltage can be applied to the at least one of the at least one first piezoelectric actuator (14a) and the at least one second piezoelectric actuator (14b) a piezoelectric layer, such that the at least one first piezoelectric actuator (14a) and/or the at least one second piezoelectric actuator (14b) is at least partially deformable And can be triggered by a pulse transmission triggered by the at least one first piezoelectric actuator (14a) and/or the at least one second piezoelectric actuator (14b) that is at least partially deformed Repositionable part (12) is repositioned about the axis of rotation (18), wherein the repositionable part (12) is at least partially structured by a substrate (22); and structured by a functional layer (24) At least the first spring (16a), the at least one first actuator carrier (20a), the second spring (16b), and the at least one second actuator carrier (20b).    A micromechanical assembly according to claim 1, wherein at least one first additional mass (26a, 34a) is bonded to the at least one first actuator carrier (20a) and/or at least one second additional block The objects (26b, 34b) are bonded to the at least one second actuator carrier (20b).    The micromechanical assembly of claim 1 or 2, wherein the at least one first actuator carrier (20a) is coupled to the at least one second actuation by means of at least one actuator coupling spring (28) Carrier (20b).    The micromechanical assembly of claim 3, wherein the at least one actuator coupling spring (28) is U-shaped, O-shaped, meander-shaped, and/or web-shaped.    The micromechanical assembly of any one of claims 1 to 4, wherein the at least one first actuator carrier (20a) and/or the at least one portion is coupled by means of at least one holder coupling spring (38) A second actuator carrier (20b) is coupled to the holder (10).    The micromechanical assembly of any one of claims 1 to 5, wherein the first spring (16a) and/or the second spring (16b) are connected to the holding by means of at least one coupling spring (40) (10).    The micromechanical assembly of any one of claims 1 to 6, wherein the micromechanical assembly is a micromirror having a repositionable mirror panel (12) as the repositionable part (12).    A method of manufacturing a micromechanical component having the steps of suspending a repositionable component (12) on a holder (10) on a first spring (16a) and a second spring (16b) Between the repositionable parts (12) being repositionable relative to the holder (10) about at least one axis of rotation (18); and at least one directly or indirectly coupled to the first spring (16a) Forming at least one first piezoelectric actuator (14a) on the first actuator carrier (20a) and bonding at least one second actuator carrier directly or indirectly to the second spring (16b) At least one second piezoelectric actuator (14b) is formed on 20b), the actuators in each case having at least one piezoelectric layer (S3), wherein the at least one first piezoelectric actuator (14a) And the at least one second piezoelectric actuator (14b) are each implemented to apply at least one voltage to the at least one first piezoelectric actuator (14a) and the at least one second pressure in each case The at least one piezoelectric layer of the electric actuator (14b), and wherein the at least one voltage is applied to an operation of the micromechanical component to The at least one piezoelectric layer of the at least one first piezoelectric actuator (14a) and/or the at least one second piezoelectric actuator (14b), the at least one first piezoelectric actuator (14a) And/or the at least one second piezoelectric actuator (14b) is at least partially deformed and at least modified by at least one of the first piezoelectric actuators (14a) and/or at least partially deformed by the at least partial deformation A pulsed transmission triggered by a second piezoelectric actuator (14b) causes the repositionable part (12) to reposition motion about the axis of rotation (18), wherein the substrate is at least partially structured by the substrate (22) Repositionable part (12) (S1); and structured by at least one functional layer (24) at least the first spring (16a), the at least one first actuator carrier (20a), the second spring (16b) And the at least one second actuator carrier (20b) (S2).    The manufacturing method of claim 8, wherein the substrate (22) is used as a starting material, the substrate having at least one insulating layer at least partially covering a surface of the substrate of the substrate (22) and at least partially formed The functional layer (24) on one side of the at least one insulating layer that is directed away from the substrate (22).    The manufacturing method of claim 8 or 9, wherein at least one first additional mass (26a, 34a) structured by the substrate (22) to be bonded to the at least one first actuator carrier (20a) And/or at least one second additional mass (26b, 34b) bonded to the at least one second actuator carrier (20b).    The manufacturing method of any one of claims 8 to 10, wherein the at least one first actuator carrier (20a) is coupled to the at least one second actuator by the functional layer (24) At least one actuator of the carrier (20b) is coupled to the spring (28).    The manufacturing method of any one of clauses 8 to 11, wherein the at least one first actuator carrier (20a) and/or the at least one second actuation is structured by the functional layer (24) The carrier carrier (20b) is coupled to at least one holder coupling spring (38) of the holder (10).    The manufacturing method of any one of claims 8 to 12, wherein the first spring (16a) and/or the second spring (16b) are structured by the functional layer (24) to the holder At least one coupling spring (40) of (10).