TW201827312A - Tape and reel packaging material - Google Patents

Abstract

A tape and reel packaging material is provided for packaging a plurality of chips. The tape and reel packaging material includes a carrier tape and a cover tape. The carrier tape includes a plurality of recesses configured to receive the chips respectively. The cover tape is attached to the carrier tape. The cover tape includes a plurality of restriction structures. The restriction structures insert into the recesses to restrict freedom of the chips.

Description

 Tape and reel packaging  

The present invention relates to a tape and reel packaging material, and more particularly to a tape and reel packaging material which can improve reliability.

Conventional tape and reel packaging materials include a carrier tape and a cover tape on which a plurality of grooves are formed, and the wafers are each received in the grooves. The cover tape is a transparent plastic material without a concave-convex structure attached to the carrier tape to prevent the wafer from falling out of the carrier tape. In the prior art, since the space in the groove is too large, the wafer is easily damaged by the collision during transportation, and particularly the side surface of the wafer is liable to be damaged. In addition, since the cover tape does not completely conform to the carrier tape, the wafer take-out groove may also occur and is caught between the carrier tape and the cover tape.

The present invention is a tape and reel package for solving the problems of the prior art for packaging a plurality of wafers, including a carrier tape and a cover tape. The carrier tape includes a plurality of grooves, each groove being configured to receive each wafer. A cover tape is attached to the carrier tape, wherein the cover tape includes a plurality of confinement structures that extend into the grooves to limit the degrees of freedom of the wafers.

In one embodiment, the confinement structure includes a central confinement structure and a perimeter confinement structure corresponding to a top surface of the wafer to limit the degree of freedom of the wafer in a first direction, the perimeter confinement structure One side surface of the wafer is corresponding to limit the degree of freedom of the wafer in a second direction and a third direction, the first direction being perpendicular to the second direction and the third direction.

In one embodiment, the central confinement structure includes a first opening that corresponds to a geometric center of the wafer.

In one embodiment, the recess includes a second opening that corresponds to the geometric center of the wafer.

In one embodiment, the perimeter confinement structure has an annular projection structure that surrounds the perimeter of the wafer.

In one embodiment, the perimeter confinement structure includes a plurality of columnar structures, the wafer including a first side, a second side, a third side, and a fourth side, each of the columnar structures respectively corresponding to the first a side surface, the second side surface, the third side surface, and the fourth side surface.

In one embodiment, the perimeter confinement structure includes a guiding bevel and an end surface, the guiding bevel being located between the end surface and the central confinement structure, the guiding oblique surface facing a side surface of the wafer, the guiding bevel and a horizontal line The angle between 65 degrees and 85 degrees.

In an embodiment, the perimeter limiting structure further includes a rounded corner between the guiding bevel and the end surface.

In an embodiment, the cover tape includes a first attachment zone, a second attachment zone, and a restriction zone, the first attachment zone being parallel to the second attachment zone, the restriction zone being located at the first attachment zone and the Between the second attachment regions, the restriction structures are formed in the restriction zone, and the cover tape is attached to the carrier tapes through the first attachment zone and the second attachment zone.

In an embodiment, the cover tape has a base layer, a bonding layer and an adhesive layer on the first attachment region and the second attachment region, and the adhesive layer is sandwiched between the base layer and the adhesive layer. The adhesive layer is adapted to attach the carrier tape, and the cover tape has only the base layer in the confinement zone.

Applying the tape and reel packaging material of the embodiment of the present invention, since the cover tape has a limiting structure, and the restricting structures extend into the grooves to limit the degree of freedom of the wafers, thereby limiting the space of the wafer and avoiding The wafer is damaged during collision due to collision. In addition, the situation in which the wafer is taken out of the groove is also avoided.

P‧‧‧Reel tape packaging

C‧‧‧ wafer

C1‧‧‧ first side

C2‧‧‧ second side

C3‧‧‧ third side

C4‧‧‧ fourth side

C5‧‧‧ top surface

C6‧‧‧ side surface

1‧‧‧ Carrying belt

11‧‧‧ Groove

111‧‧‧ second opening

2‧‧‧ Covering tape

21‧‧‧Restricted structure

21’‧‧‧Restricted structure

23‧‧‧Central restricted structure

231‧‧‧ first opening

24‧‧‧ perimeter restriction structure

24’‧‧‧ perimeter restraint structure

241‧‧‧Guiding slope

242‧‧‧ end face

243‧‧‧ fillet

251‧‧‧First attachment area

252‧‧‧Second attachment area

253‧‧‧Restricted area

261‧‧‧ grassroots

262‧‧‧bonded layer

263‧‧ ‧ adhesive layer

H‧‧‧ horizontal line

Z‧‧‧First direction

X‧‧‧second direction

Y‧‧‧ third direction

Θ‧‧‧ angle

Fig. 1 is a view showing a tape and reel packaging material according to an embodiment of the present invention.

Fig. 2A is a cross-sectional view showing a restriction structure of an embodiment of the present invention.

Fig. 2B is a plan view showing a restriction structure of an embodiment of the present invention.

Fig. 3 is a view showing a peripheral restricting structure of another embodiment of the present invention.

Fig. 4 is a view showing the entire construction of a cover tape according to an embodiment of the present invention.

Fig. 5 is a cross-sectional view showing a first attachment region and a second attachment region of a cover tape according to an embodiment of the present invention.

Fig. 6 is a plan view showing a restricting structure of another embodiment of the present invention.

Referring to Fig. 1, there is shown a tape and reel packaging material P according to an embodiment of the present invention for packaging a plurality of wafers C, including a carrier tape 1 and a cover tape 2. The carrier tape 1 and the cover tape 2 may be constructed of a flexible material. A plurality of grooves 11 are formed in the carrier tape 1, and the wafers C are each accommodated in the grooves 11. The cover tape 2 is attached to the carrier tape 1, wherein the cover tape 2 includes a plurality of confinement structures 21 that extend into the grooves 11 to limit the degrees of freedom of the wafers C.

Fig. 2A is a cross-sectional view showing a restriction structure 21 according to an embodiment of the present invention, and Fig. 2B is a plan view showing a restriction structure 21 according to an embodiment of the present invention. Referring to FIGS. 2A and 2B, in an embodiment, the confinement structure 21 includes a central confinement structure 23 and a perimeter confinement structure 24 corresponding to a top surface C5 of the wafer C to limit the wafer C. The degree of freedom in a first direction Z corresponding to the side surface C6 of the wafer C to limit the degree of freedom of the wafer C in a second direction X and a third direction Y, the first The direction Z is perpendicular to the second direction X and the third direction Y.

Applying the tape and reel packaging material of the embodiment of the present invention, since the cover tape has a limiting structure, and the restricting structures extend into the grooves to limit the degree of freedom of the wafers, thereby limiting the space of the wafer and avoiding The wafer is damaged during collision due to collision. In addition, the situation in which the wafer is taken out of the groove is also avoided.

Referring to FIGS. 2A and 2B, in an embodiment, the central confinement 23 structure includes a first opening 231 that corresponds to a geometric center of the wafer C. In one embodiment, the recess 11 includes a second opening 111 that corresponds to the geometric center of the wafer C. The first opening 231 prevents the wafer C from being attached to the cover tape 2. The second opening 111 prevents the wafer C from being attached to the carrier tape 1.

Referring to FIGS. 2A and 2B, in this embodiment, the perimeter restriction 24 structure includes a plurality of columnar structures, and the side surface C6 of the wafer C includes a first side surface C1, a second side surface C2, and a third side surface C3. And a fourth side surface C4, each of the columnar structures respectively corresponding to the first side surface C1, the second side surface C2, the third side surface C3 and the fourth side surface C4 to limit the wafer C in the second direction X and The degree of freedom in the third direction Y.

In this embodiment, the columnar structures are cylindrical. However, the above disclosure does not limit the invention. The shape of the columnar structures may vary moderately as needed. For example, in one embodiment, the columnar structures can be rectangular cylinders.

Referring to FIG. 2A, in an embodiment, the perimeter limiting structure 24 includes a guiding bevel 241 and an end surface 242. The guiding bevel 241 is located between the end surface 242 and the central confinement structure 23. The guiding bevel 241 corresponds to the wafer. The side surface C6 of C, the angle θ between the guiding slope 241 and a horizontal line H is between 65 degrees and 85 degrees. The guiding bevel 241 can appropriately adjust the position of the wafer C, and the wafer C is not directly sandwiched between the peripheral confinement structure 24 and the bottom of the groove 11.

Referring to FIG. 3, in an embodiment, the perimeter confinement structure 24 further includes a fillet 243 between the guide bevel 241 and the end face 242. The fillet 243 can appropriately adjust the position of the wafer C, and the wafer C is not directly sandwiched between the peripheral restraining structure 24 and the bottom of the recess 11. The fillet 243 also avoids collision damage to the wafer C.

Referring to FIG. 4, in an embodiment, the cover tape 2 includes a first attachment area 251, a second attachment area 252, and a restriction area 253. The first attachment area 251 is parallel to the second attachment area 252. The restriction area 253 is located between the first attachment area 251 and the second attachment area 252. The restriction structure 21 is formed in the restriction area 253. The cover tape 2 passes through the first attachment area 251 and the second attachment area 252. Attached to the carrier tape 1.

Referring to Fig. 5, the cross-sectional structure of the first attachment region 251 and the second attachment region 252 of the cover tape 2 is shown. In one embodiment, the cover tape 2 has a base layer 261, a tie-layer 262, and an adhesive layer 263 in the first attachment region 251 and the second attachment region 252. The adhesive layer 262 is interposed. Between the base layer 261 and the adhesive layer 263, the adhesive layer 263 is adapted to be attached to the carrier tape 1. In an embodiment, the cover tape 2 has only a base layer 261 (not shown) in the confinement region 253. In an embodiment, the material of the base layer 261 may be plastic.

Referring to Figure 6, there is shown a plan view of a confinement structure 21' of another embodiment of the present invention. In an embodiment, the perimeter confinement structure 24' has an annular projection structure surrounding the annular projection structure. The periphery of the wafer C.

In the above embodiment, although the columnar and annular peripheral restricting structures are disclosed, the above disclosure does not limit the present invention. The shape of the perimeter confinement structure may vary as desired, for example, it may also be a hemispherical bump, or other shape limiting structure.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and may be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (10)

 A tape and reel packaging material for packaging a plurality of wafers, comprising: a carrier tape comprising a plurality of grooves, each of the grooves being configured to receive each of the wafers; a cover tape attached to the carrier tape, wherein The cover tape includes a plurality of confinement structures that extend into the grooves to limit the degrees of freedom of the wafers.    The tape-and-reel packaging material according to claim 1, wherein the limiting structure comprises a central limiting structure and a peripheral limiting structure, the central limiting structure corresponding to a top surface of the wafer to limit the wafer to a a degree of freedom in the first direction, the peripheral confinement structure corresponding to a side surface of the wafer to limit the degree of freedom of the wafer in a second direction and a third direction, the first direction being perpendicular to the second direction and the The third direction.    The tape-and-reel package of claim 2, wherein the central confinement structure comprises a first opening corresponding to a geometric center of the wafer.    The tape-and-reel package of claim 3, wherein the groove comprises a second opening corresponding to the geometric center of the wafer.    The tape-and-reel package according to claim 2, wherein the peripheral confinement structure has an annular projection structure surrounding a periphery of the wafer.    The tape-retaining packaging material of claim 2, wherein the peripheral limiting structure comprises a plurality of columnar structures, the side surface of the wafer comprising a first side, a second side, and a third side And a fourth side, each of the columnar structures corresponding to the first side, the second side, the third side, and the fourth side.    The tape-retaining packaging material of claim 2, wherein the peripheral limiting structure comprises a guiding bevel and an end surface, the guiding bevel being located between the end surface and the central confinement structure, the guiding oblique facing surface wafer The side surface, the angle between the guiding slope and a horizontal line is between 65 degrees and 85 degrees.    The tape-type packaging material of claim 7, wherein the peripheral limiting structure further comprises a rounded corner between the guiding bevel and the end surface.    The tape-type packaging material of claim 2, wherein the covering tape comprises a first attachment zone, a second attachment zone and a restriction zone, the first attachment zone being parallel to the second attachment zone The restriction zone is located between the first attachment zone and the second attachment zone, and the restriction structures are formed in the restriction zone, and the cover tape is attached to the bearer through the first attachment zone and the second attachment zone band.    The tape-receiving packaging material according to claim 9, wherein the covering tape has a base layer, a bonding layer and an adhesive layer in the first attachment region and the second attachment region, and the adhesive layer clip Provided between the base layer and the adhesive layer, the adhesive layer is adapted to be attached to the carrier tape, and the cover tape has only the base layer in the restriction zone.